JP6761271B2 - Processing equipment and manufacturing method of articles - Google Patents

Description

The present invention relates to a processing apparatus and a method for manufacturing an article.

The exposure apparatus used for manufacturing a semiconductor device includes a substrate stage and a transfer hand that supplies and collects the substrate to the substrate stage. The substrate stage vacuum-sucks and holds the substrate via the substrate chuck.

With the increasing integration of semiconductor devices, wiring miniaturization and multi-layering are progressing. When the wiring layer is multi-layered, a phenomenon is observed in which the entire substrate is warped due to the accumulation of film strain during film formation as the process proceeds to the subsequent process of the semiconductor device manufacturing process. For example, in the TSV (Through Silicon Via) process, which is a technique for laminating semiconductor chips, the through electrode and silicon are separated by the difference in the coefficient of thermal expansion between the metal (for example, copper) that is the through electrode and the silicon around it. Distortion occurs between. A substrate with such a warp cannot be held by vacuum adsorption.

Therefore, regarding the holding of the substrate, a technique for correcting the warp of the substrate has been conventionally proposed (see Patent Documents 1 and 2). For example, Patent Document 1 discloses a transfer device having an outer peripheral holding member for correcting the warp of a substrate. Further, Patent Document 2 discloses a transport device that corrects the warp of a substrate by injecting air from the upper surface of the substrate.

Japanese Unexamined Patent Publication No. 2001-284434 Japanese Unexamined Patent Publication No. 2006-54388

In recent years, in addition to the tendency for the amount of warpage of the substrate to increase, the thickness of the substrate has also increased, so that processing of a substrate having high bending rigidity is required. In order to correct such warpage of the substrate, it is indispensable to increase the straightening force. Therefore, in the technique disclosed in Patent Document 1, it is necessary to increase the thrust when pressing the outer peripheral holding member against the substrate and to increase the pushing force of the substrate stage to resist the thrust. However, in order to realize this, the weight of the substrate stage must be increased, which leads to an expansion of the footprint and a decrease in stage accuracy. Such a problem also occurs in the technique disclosed in Patent Document 2.

The present invention has been made in view of such problems of the prior art, and an exemplary object is to provide a processing apparatus that is advantageous for correcting the warp of a substrate and holding the substrate.

In order to achieve the above object, the processing apparatus as one aspect of the present invention is a processing apparatus for processing a substrate, which is a chuck that attracts the back surface of the substrate to hold the substrate and is held by the chuck. A facing surface facing the surface of the substrate and a convex portion provided on the facing surface facing the outer peripheral region of the surface including the outer edge of the substrate and protruding from the facing surface toward the surface side are included. The straightening member in which the convex portion is in contact with the outer peripheral region and defines a first space between the facing surface and the central region inside the outer peripheral region of the surface, and the straightening member communicating with the first space. A first decompression unit that decompresses the first space through a communication path formed in the member, and a second space between the surface of the chuck and the back surface of the chuck in which a plurality of pins supporting the substrate are arranged. The substrate has a second decompression unit that decompresses the second space through a communication passage formed in the chuck, and a control unit, and the substrate is held by the chuck and has an outer edge. The control unit is warped in the direction away from the chuck, and the control unit is decompressed by the first decompression unit in a state where the straightening member is pressed against the substrate held by the chuck . The first decompression unit and the second decompression unit are controlled so that the force generated in the space is equal to or smaller than the force generated in the second space by being decompressed by the second decompression unit. It is characterized in that the substrate is subjected to a process of imitating the chuck so that the warp of the outer edge is corrected.

Further objects or other aspects of the invention will be manifested in the preferred embodiments described below with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide a processing device that is advantageous for correcting the warp of the substrate and holding the substrate.

It is the schematic which shows the structure of the exposure apparatus as one aspect of this invention. It is a figure which shows by modeling the warp of a substrate and the straightening force by a chuck. It is the schematic which shows the structure of the chuck, the substrate stage and the straightening member in this embodiment. It is a figure which shows the structure of the chuck shown in FIG. 3 in detail. It is a figure which shows the structure of the straightening member shown in FIG. 3 in detail. It is a figure for demonstrating the process of correcting the warp of a substrate in this embodiment. It is a figure which shows the correction member arranged in the transfer hand in the exposure apparatus shown in FIG. It is the schematic which shows the structure of the chuck, the substrate stage and the straightening member in this embodiment. It is a figure which shows in detail the structure of the modification of the straightening member shown in FIG. It is a figure for demonstrating the process of correcting the warp of a substrate in this embodiment. It is the schematic which shows the structure of the support member on which a straightening member is placed.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In each figure, the same member is given the same reference number, and duplicate description is omitted.

FIG. 1 is a schematic view showing a configuration of an exposure apparatus 1 as one aspect of the present invention. The exposure apparatus 1 is a lithography apparatus that exposes a substrate to form a pattern. As shown in FIG. 1, the exposure apparatus 1 attracts the illumination optical system 11, the reticle stage 13 holding the reticle (mask) 12, the reticle measuring unit 14, the projection optical system 15, and the back surface of the substrate 19. It has a chuck 16 for holding the substrate 19. Further, the exposure apparatus 1 includes a substrate stage 17 on which the chuck 16 is placed and held, a substrate measurement unit 18, a focus measurement unit 20, and a control unit 21.

The illumination optical system 11 includes a lens, a mirror, an optical integrator, a phase plate, a diffractive optical element, a diaphragm, and the like, and illuminates the reticle 12 with light from a light source. A pattern (circuit pattern) to be transferred to the substrate 19 is formed on the reticle 12. The reticle stage 13 is a stage that can hold and move the reticle 12. The reticle measuring unit 14 includes, for example, a laser interferometer and measures the position of the reticle 12 held by the reticle stage 13. The chuck 16 includes, for example, a Z drive mechanism, and is configured so that the substrate 19 can be moved in the Z-axis direction. The substrate stage 17 is a stage that can move in two directions in the X-axis direction and the Y-axis direction in the XY plane. The substrate measuring unit 18 includes, for example, a laser interferometer and the like, and measures the position of the substrate stage 17. The focus measuring unit 20 measures the position of the substrate 19 held by the chuck 16 on the substrate stage in the height direction (Z-axis direction). The control unit 21 includes a CPU, a memory, and the like, and controls the entire exposure apparatus 1 (operation).

Here, it is assumed that the substrate 19 is warped, and a case where the substrate 19 is attracted and held by the chuck 16 mounted on the substrate stage 17 will be described. For example, when the substrate 19 has a warp such that the outer edge hangs down, the straightening force (force for correcting the warp of the substrate 19) by the chuck 16 is modeled, and as shown in FIG. 2A, the outer edge It can be represented by a distributed load model of the support. Therefore, if the substrate 19 is supported at both ends, the center of gravity of the straightening force and the support point are separated from each other, so that the substrate 19 can be easily deformed to correct the warp.

On the other hand, when the substrate 19 has a warp such that the outer edge jumps up, the straightening force by the chuck 16 can be modeled by a distributed load model of central support as shown in FIG. 2 (b). When such a substrate 19 is held by the chuck 16, the warp is corrected from the central portion of the substrate 19 as shown in FIG. 2C. At this time, since the straightening portion and the center of gravity of the resultant force of the straightening force are close to each other on the outer edge of the substrate 19, if the bending moment required for straightening is constant, the required straightening force increases. Further, in such a substrate 19, the degree of vacuum does not increase due to air leakage from the outer edge, so that the straightening force by the chuck 16 becomes weak.

Therefore, in the present embodiment, unlike the prior art, we propose a technique of correcting the warp of the substrate and holding the substrate with a chuck without increasing the thrust when pressing the pressing member or the like against the substrate or the weight of the substrate stage. To do.

3 (a) and 3 (b) are schematic views showing the configurations of the chuck 16, the substrate stage 17, and the straightening member 30 in this embodiment. Note that in FIGS. 3A and 3B, illustration of a frame, actuator, sensor, piping, etc. for supporting and driving them is omitted. Further, here, it is assumed that the substrate 19 is warped so that the outer edge jumps up, but the amount and shape of the warp of the substrate 19 are not limited.

As described above, the substrate stage 17 mounts and holds the chuck 16, and the chuck 16 attracts the back surface of the substrate 19 to hold the substrate 19. The straightening member 30 is configured to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction, and is pressed against the substrate 19 held by the chuck 16 to correct the warp of the substrate 19.

FIG. 4 is a diagram showing the configuration of the chuck 16 in detail. The chuck 16 includes a base 161, a plurality of pins 162 arranged on the base 161 to support the substrate 19, and a rim embankment portion 163 arranged all around the base 161 so as to surround the plurality of pins 162. And include. The edge bank portion 163 has a function of supporting the substrate 19 and blocking the space SP2 and the atmospheric environment (outside). Further, the chuck 16 has a base 161 (the surface of the chuck 16) arranged on the plurality of pins 162 and the back surface of the substrate 19 in a state where the substrate 19 is supported via the plurality of pins 162 and the edge bank portion 163. A connected passage 164 that communicates with the space (second space) SP2 between the spaces is formed. A second decompression unit 62 including a vacuum source and the like is connected to the communication passage 164. The second decompression unit 62 decompresses the space SP2 via the communication passage 164, so that the substrate 19 on the plurality of pins 162 and the rim embankment 163 is attracted to the substrate by the plurality of pins 162 and the rim embankment 163. The flatness of 19 can be secured.

FIG. 5 is a diagram showing in detail the configuration of the straightening member 30. The straightening member 30 includes, as the base member 301, a facing surface 302 held by the chuck 16 facing the surface of the substrate 19, and a convex portion 303 protruding from the facing surface 302 toward the surface side of the substrate 19. The convex portion 303 is provided on the facing surface 302 so as to face the outer peripheral region of the surface including the outer edge of the substrate 19. The straightening member 30 is inside the facing surface 302 and the outer peripheral region of the surface of the substrate 19 in a state where the convex portion 303 is in contact with the outer peripheral region of the substrate 19, that is, pressed against the substrate 19 held by the chuck 16. A space (first space) SP1 is defined between the space and the central area. The convex portion 303 has a function of blocking the space SP1 and the atmospheric environment (outside). Further, the straightening member 30 is formed with a communication passage 304 communicating with the space SP1, and the first pressure reducing portion 61 is connected to the communication passage 304. The first decompression unit 61 includes a vacuum source and the like, and decompresses the space SP1 via the communication passage 304.

A process for correcting the warp of the substrate 19 and a process for making the substrate 19 imitate the chuck 16 will be described with reference to FIGS. 6 (a) to 6 (d). Such processing is performed by the control unit 21 comprehensively controlling each unit of the exposure apparatus 1. As shown in FIG. 6A, when the substrate 19 is warped so that the outer edge jumps up, even if the space SP2 is depressurized by the second decompression unit 62, the substrate 19 is caused by an air leak from the outer edge of the substrate 19. It cannot be sufficiently adsorbed, and the warp of the substrate 19 cannot be corrected.

First, in the present embodiment, as shown in FIG. 6A, when the straightening member 30 and the substrate 19 are separated from each other, the second decompression unit 62 starts depressurizing the space SP2 and the straightening member 30. The straightening member 30 starts moving in a direction in which the chuck 16 and the chuck 16 are relatively close to each other. In addition, instead of moving the straightening member 30, the chuck 16 may be moved, or at least one of the straightening member 30 and the chuck 16 may be moved.

Next, as shown in FIG. 6B, when the convex portion 303 of the straightening member 30 comes into contact with the outer peripheral region of the surface of the substrate 19, the space SP1 by the first decompression portion 61 continues to move while the straightening member 30 continues to move. Start depressurization. The space SP1 between the facing surface 302 of the straightening member 30 and the central region of the surface of the substrate 19 is depressurized, so that the straightening member 30 is forced to be pressed downward (the substrate 19) and the chuck 16 is A force that is pressed upward is generated on the (board 19). As a result, the warp of the substrate 19 is corrected.

Next, as shown in FIG. 6C, when the substrate 19 follows the chuck 16, the decompression of the space SP1 by the first decompression unit 61 is stopped. However, the decompression of the space SP2 by the second decompression unit 62 is maintained. When the region of the back surface corresponding to the outer peripheral region of the front surface of the substrate 19 contacts the chuck 16, that is, when the substrate 19 is completely adsorbed by the chuck 16, the pressure difference on the back surface of the substrate 19 disappears, so that the substrate 19 is corrected. It is held by the chuck 16 in the state of being held. Whether or not the region on the back surface corresponding to the outer peripheral region on the front surface of the substrate 19 is in contact with the chuck 16 is determined by the pressure in the space SP1 (communication passage 164) decompressed by the first decompression unit 61, the straightening member 30, and the substrate 19. It is possible to judge by measuring the position of. The straightening member 30 may be fixed to the support member, or may be placed on the support members 307 and 308 that can move relative to each other as shown in FIGS. 11 (a) and 11 (b). It may have been. The support member 307 is integrally formed with the straightening member 30. In FIG. 11A, the support member 308 supports the support member 307. When the straightening member 30 pushes the surface of the substrate 19, as shown in FIG. 11B, the support member 308 and the support member 307 are separated from each other so that the upward force is not transmitted to the support member 308. There is.

During the transition from the state shown in FIG. 6 (b) to the state shown in FIG. 6 (c), the first decompression unit 61 and the second decompression unit 61 and the second decompression unit so that the pressure in the space SP1 is equal to or smaller than the pressure in the space SP2. The unit 62 is controlled. In other words, the first depressurization is such that the force generated in the space SP1 by being decompressed by the first decompression unit 61 is equal to or smaller than the force generated in the space SP2 by being decompressed by the second decompression unit 62. The unit 61 and the second decompression unit 62 are controlled. As a result, it is possible to prevent the substrate 19 from being separated from the chuck 16 and being attracted to the straightening member 30.

Next, as shown in FIG. 6D, when the warp of the substrate 19 is corrected and the substrate 19 is held by the chuck 16, the space SP1 is released to the atmospheric environment via the communication passage 304, and the straightening member 30 is released. The straightening member 30 starts moving in a direction in which the chuck 16 and the chuck 16 are relatively separated from each other.

As described above, in the present embodiment, with the straightening member 30 pressed against the substrate 19, the space SP1 is depressurized by the first decompression unit 61 to correct the warp of the substrate 19 and imitate the substrate 19 as the chuck 16. I can make you. At this time, it is not necessary to increase the thrust when pressing the straightening member 30 against the substrate 19 or the weight of the substrate stage 17.

Further, in the present embodiment, the straightening member 30 is arranged in the vicinity of the chuck 16 and the substrate stage 17 so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction, but the present invention is limited to this. It's not a thing. Generally, since the exposure apparatus 1 has a transport hand 70 for transporting the substrate 19, the straightening member 30 may be arranged on the transport hand 70 as shown in FIG. 7. In the transport hand 70, the space SP1 is decompressed by the first decompression unit 61 in a state where the convex portion 303 of the straightening member 30 is in contact with the outer peripheral region of the surface of the substrate 19, so that the substrate 19 is held and conveyed by the straightening member 30. To do.

When the straightening member 30 is arranged on the transport hand 70, the distance measuring unit 72 for measuring the distance between the facing surface 302 and the central region of the surface of the substrate 19 may be arranged on the facing surface 302, for example. Then, when the transport hand 70 holds the substrate 19, the distance measured by the distance measuring unit 72 is determined so that the facing surface 302 and the substrate 19 do not come into contact with each other based on the measurement result of the distance measuring unit 72. The first decompression unit 61 is controlled so as to maintain a constant distance).

Further, when the straightening member 30 is arranged in the transport hand 70, the pressure measuring unit 74 for measuring the pressure in the space SP1 may be arranged in, for example, the communication passage 304. Then, when the transport hand 70 holds the substrate 19, the pressure measured by the pressure measuring unit 74 is measured so that the facing surface 302 and the substrate 19 do not come into contact with each other based on the measurement result of the pressure measuring unit 74. The first decompression unit 61 is controlled so as to maintain a constant value). Further, both the distance measuring unit 72 and the pressure measuring unit 74 are arranged so that the facing surface 302 and the substrate 19 do not come into contact with each other based on the measurement results of the distance measuring unit 72 and the pressure measuring unit 74. The decompression unit 61 may be controlled.

When the substrate 19 is warped so that a part of the outer edge jumps up, the convex portion 303 of the straightening member 30 cannot come into contact with the entire outer peripheral region of the surface of the substrate 19, and the space SP1 is depressurized ( Negative pressure) can be difficult. Therefore, as shown in FIG. 8, it is preferable to arrange the elastic member 306 on the surface of the convex portion 303 of the straightening member 30 on the substrate side (the surface on the outer peripheral region side of the surface of the substrate 19). As a result, even when the substrate 19 is warped so that a part of the outer edge is flipped up, the convex portion 303 of the straightening member 30 is covered with the entire outer peripheral region of the surface of the substrate 19 via the elastic member 306. Since it is possible to make contact, the space SP1 can be defined. Therefore, by decompressing the space SP1 by the first decompression unit 61, it is possible to exert a straightening force even on the substrate 19 in which a part of the outer edge is warped so as to jump up. In FIG. 8, the elastic member 306 has a shape including a bent portion in a cross section perpendicular to the facing surface 302, but the elastic member 306 is not limited to this, and has, for example, a rectangular shape. May be good.

Hereinafter, the straightening member 30A, which is a modified example of the straightening member 30, will be described with reference to FIGS. 9 (a), 9 (b) and 9 (c). The straightening member 30A includes, as the base member 301A, a facing surface 302A held by the chuck 16 facing the surface of the substrate 19, and a plurality of convex portions 303A protruding from the facing surface 302A toward the surface side of the substrate 19. The plurality of convex portions 303A are provided on the facing surface 302A facing each of the plurality of different portions in the outer peripheral region of the surface including the outer edge of the substrate 19 (that is, partially provided on the facing surface 302A). ing).

An elastic member 309A is arranged on the side surface of the straightening member 30A so as to surround the chuck 16. The elastic member 309A has an inner diameter larger than the outer diameter of the chuck 16 (board 19), and is configured to be in contact with the board stage 17. The elastic member 309A is in contact with the substrate stage 17 in a state where the plurality of convex portions 303A are in contact with the outer peripheral region of the substrate 19, that is, the straightening member 30A is pressed against the substrate 19, and the facing surfaces 302A and the substrate stage 17 are in contact with each other. A space (first space) SP3 is defined between them. The space SP3 between the facing surface 302A of the straightening member 30A and the substrate stage 17 is between the facing surface 302A of the straightening member 30A and the central region of the substrate 19 due to the warp of the outer peripheral region of the substrate 19 held by the chuck 16. It communicates with the space SP1 specified in.

The straightening member 30A is formed with a connecting passage 304A that connects the space SP1 and the atmospheric environment (outside). In the straightening member 30A, it is not necessary to connect the first decompression unit 61 to the communication passage 304A, and as will be described later, a valve 308A capable of opening and closing the communication passage 304A is provided.

With reference to FIGS. 10A to 10E, a process of correcting the warp of the substrate 19 using the straightening member 30A (a process of making the substrate 19 imitate the chuck 16) will be described. Such processing is performed by the control unit 21 comprehensively controlling each unit of the exposure apparatus 1. As shown in FIG. 10A, when the substrate 19 is warped so that the outer edge jumps up, even if the space SP2 is depressurized by the second decompression unit 62, the substrate 19 is caused by air leakage from the outer edge of the substrate 19. It cannot be sufficiently adsorbed, and the warp of the substrate 19 cannot be corrected.

First, as shown in FIG. 10A, in a state where the straightening member 30A and the substrate 19 are separated from each other, the valve 308A is closed to shut off the communication passage 304A formed in the straightening member 30A (atmospheric environment (atmospheric environment). Block the connection with the outside). Then, the decompression of the space SP2 by the second decompression unit 62 is started, and the straightening member 30A is started to move in the direction in which the straightening member 30A and the chuck 16 are relatively close to each other. Instead of moving the straightening member 30A, the chuck 16 may be moved, or at least one of the straightening member 30A and the chuck 16 may be moved. In addition, in order to shorten the decompression time of the space SP1, the communication passage 304A may communicate with the atmospheric environment or the vacuum source.

FIG. 10B shows a state in which each of the plurality of convex portions 303A of the straightening member 30A is in contact with a plurality of different portions in the outer peripheral region of the surface of the substrate 19. FIG. 10C shows a state in which the region of the back surface corresponding to the outer peripheral region of the front surface of the substrate 19 is in contact with the chuck 16. From the state shown in FIG. 10 (b) to the state shown in FIG. 10 (c), the depressurization of the space SP2 by the second decompression unit 62 is continued with the valve 308A closed. During this time, since the space SP2 and the space SP3 are communicated with each other due to the warp of the outer peripheral region of the substrate 19, the space SP2 is also decompressed by the decompression. As a result, the straightening member 30A generates a force that is pressed downward (the substrate 19), and the chuck 16 (the substrate 19) generates a force that is pressed upward, so that the warp of the substrate 19 is corrected. It will be.

Next, when the region on the back surface corresponding to the outer peripheral region on the front surface of the substrate 19 comes into contact with the chuck 16, the valve 308A is opened while continuing the depressurization of the space SP2 by the second decompression unit 62 as shown in FIG. 10 (d). .. As a result, the communication passage 304A is released to the atmospheric environment (open to the atmosphere), and the atmosphere flows into the space SP1 between the facing surface 302A of the straightening member 30A and the central region of the surface of the substrate 19. However, since the space SP2 is sealed by the substrate 19 whose warpage is corrected, the substrate 19 is held by the chuck 16 in the corrected state.

Next, as shown in FIG. 10E, when the warp of the substrate 19 is corrected and the substrate 19 is held by the chuck 16, the straightening member 30A moves in a direction in which the straightening member 30A and the chuck 16 are relatively separated from each other. To start. At this time, the valve 308A is maintained in the open state.

In this way, with the straightening member 30A pressed against the substrate 19, the space SP2 is decompressed by the second decompression unit 62, so that the space SP3 communicating with the outer peripheral region of the substrate 19 is depressurized and the substrate 19 is decompressed. Can be made to imitate the chuck 16. The straightening member 30A can reduce the area in contact with the substrate 19 as compared with the straightening member 30. Further, the straightening member 30A does not need to connect the first decompression unit 61 to the communication passage 304A, so that the number of pipes thereof can be reduced.

According to the exposure apparatus 1 of the present embodiment, for example, even when the substrate 19 has a warp such that the outer edge jumps up, the warp can be corrected and the substrate 19 can be held by the chuck 16. Therefore, the exposure apparatus 1 can transfer the pattern of the reticle 12 to the substrate 19 held by the chuck 16 with high accuracy.

The method for manufacturing an article according to the embodiment of the present invention is suitable for producing an article such as a device (semiconductor element, magnetic storage medium, liquid crystal display element, etc.). Such a manufacturing method includes a step of exposing a substrate coated with a photosensitizer and a step of developing the exposed substrate using the exposure apparatus 1. In addition, such a manufacturing method may include other well-known steps (oxidation, film formation, vapor deposition, doping, flattening, etching, resist peeling, dicing, bonding, packaging, etc.). The method for producing an article in the present embodiment is advantageous in at least one of the performance, quality, productivity and production cost of the article as compared with the conventional method.

Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof. For example, in the present embodiment, the exposure apparatus has been described as an example of the processing apparatus for processing the substrate, but the present invention is applied to the processing apparatus for processing the substrate sucked (held) by the chuck mounted on the stage. It is possible. Such a processing device includes, for example, a polishing device for polishing a substrate, a spin coater for forming a film on the substrate, and the like.

1: Exposure device 16: Chuck 21: Control unit 30: Straightening member 302: Facing surface 303: Convex portion 304: Communication passage 61: First decompression unit

Claims (11)

A processing device that processes substrates
A chuck that attracts the back surface of the substrate and holds the substrate,
A convex surface held by the chuck that faces the surface of the substrate and a protrusion that is provided on the facing surface facing the outer peripheral region of the surface including the outer edge of the substrate and projects from the facing surface toward the surface side. A straightening member including a portion, wherein the convex portion contacts the outer peripheral region and defines a first space between the facing surface and the central region inside the outer peripheral region of the surface.
A first decompression unit that decompresses the first space through a communication passage formed in the straightening member that communicates with the first space.
A second space for depressurizing the second space through a communication passage formed in the chuck, which communicates with the second space between the surface of the chuck on which a plurality of pins supporting the substrate are arranged and the back surface of the chuck. Decompression part and
Control unit and
Have,
When the substrate is held by the chuck, the outer edge of the substrate is warped in a direction away from the chuck.
In the control unit, the force generated in the first space is reduced by the second decompression unit when the straightening member is pressed against the substrate held by the chuck and the pressure is reduced by the first decompression unit. The first decompression section and the second decompression section are controlled so that the force generated in the second space is equal to or smaller than the force generated in the second space, and the substrate is moved so that the warp of the outer edge is corrected. A processing device characterized by performing processing that imitates a chuck. Before SL control unit, in the process,
In a state where the straightening member and the substrate are separated from each other, the second pressure reducing portion starts depressurizing the second space, and the straightening member and the chuck are relatively close to each other. Start moving at least one of the chucks and
When the convex portion comes into contact with the outer peripheral region, the decompression of the first space by the first decompression portion is started.
The processing apparatus according to claim 1, wherein when the substrate imitates the chuck, the decompression of the first space by the first decompression unit is stopped. Further having a transport hand for transporting the substrate,
The straightening member is placed on the transport hand and
The transfer hand is characterized in that the substrate is held by the straightening member by decompressing the first space by the first decompression portion in a state where the convex portion is in contact with the outer peripheral region. Or the processing apparatus according to 2 . It further has a distance measuring unit that measures the distance between the facing surface and the central region.
The control unit controls the first decompression unit so that the facing surface and the central region do not come into contact with each other based on the measurement result of the distance measurement unit when the transfer hand holds the substrate. The processing apparatus according to claim 3 . Further having a pressure measuring unit for measuring the pressure in the first space,
When the transport hand holds the substrate, the control unit controls the first decompression unit so that the facing surface and the central region do not come into contact with each other based on the measurement result of the pressure measurement unit. The processing apparatus according to claim 3 or 4 . The processing apparatus according to any one of claims 1 to 5 , wherein the convex portion includes an elastic member arranged on a surface on the outer peripheral region side. A processing device that processes substrates
A chuck that attracts the back surface of the substrate and holds the substrate,
A stage on which the chuck is placed and held, and
The facing surface held by the chuck facing the surface of the substrate and a plurality of different portions in the outer peripheral region of the surface including the outer edge of the substrate are provided on the facing surface so as to face each other. A straightening member including a plurality of convex portions protruding from the surface toward the surface side,
It is arranged on the side surface of the straightening member so as to surround the chuck, and in a state where each of the plurality of convex portions is in contact with each of the plurality of portions, the portion is in contact with the stage and between the facing surface and the stage. An elastic member that defines one space,
A decompression unit that reduces the pressure in the second space through a communication passage formed in the chuck, which communicates with the second space between the surface of the chuck on which a plurality of pins supporting the substrate are arranged and the back surface of the chuck. When,
In a state where the straightening member is pressed against the substrate, the second space is decompressed by the decompression portion, so that the first space communicated by the warp of the outer peripheral region of the substrate held by the chuck is provided. A control unit that performs processing to reduce the pressure and make the substrate imitate the chuck.
A processing device characterized by having. The straightening member includes a communication passage that communicates the first space with the atmospheric environment, and a valve that can open and close the communication passage.
In the process, the control unit
In a state where the straightening member and the substrate are separated from each other, the valve is closed to start depressurization of the second space by the decompression unit, and the straightening member and the chuck are relatively close to each other. Start moving at least one of the straightening member and the chuck,
From the contact of each of the plurality of convex portions with each of the plurality of portions until the region of the back surface corresponding to the outer peripheral region contacts the chuck, the pressure reducing portion of the second space with the valve closed. Continue decompression,
The processing apparatus according to claim 7 , wherein when the area on the back surface corresponding to the outer peripheral region comes into contact with the chuck, the valve is opened while continuing the decompression of the second space by the decompression unit. A processing device that processes substrates
A chuck that attracts the back surface of the substrate and holds the substrate,
A convex surface held by the chuck that faces the surface of the substrate and a protrusion that is provided on the facing surface facing the outer peripheral region of the surface including the outer edge of the substrate and projects from the facing surface toward the surface side. A straightening member including a portion, wherein the convex portion contacts the outer peripheral region and defines a first space between the facing surface and the central region inside the outer peripheral region of the surface.
A first decompression unit that decompresses the first space through a communication passage formed in the straightening member that communicates with the first space.
A second space for depressurizing the second space through a communication passage formed in the chuck, which communicates with the second space between the surface of the chuck on which a plurality of pins supporting the substrate are arranged and the back surface of the chuck. Decompression part and
A control unit that performs a process of imitating the substrate by decompressing the first space by the first decompression unit while the straightening member is pressed against the substrate.
Have,
In the process, the control unit
In a state where the straightening member and the substrate are separated from each other, the second pressure reducing portion starts depressurizing the second space, and the straightening member and the chuck are relatively close to each other. Start moving at least one of the chucks and
When the convex portion comes into contact with the outer peripheral region, the decompression of the first space by the first decompression portion is started.
When the substrate imitates the chuck, the decompression of the first space by the first decompression unit is stopped.
The first decompression unit causes the force generated in the first space to be equal to or smaller than the force generated by the second decompression unit in the second space. A processing apparatus characterized by controlling a decompression unit and the second decompression unit. It further has a projection optical system that projects a mask pattern onto the substrate held by the chuck.
The processing apparatus according to any one of claims 1 to 9 , wherein the substrate is exposed via the projection optical system. A step of exposing a substrate using the processing apparatus according to claim 10 .
The process of developing the exposed substrate and
A method for producing an article, which comprises producing the article from the developed substrate.

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