CN107275269A - The manufacture method of processing unit and article - Google Patents
The manufacture method of processing unit and article Download PDFInfo
- Publication number
- CN107275269A CN107275269A CN201710204474.1A CN201710204474A CN107275269A CN 107275269 A CN107275269 A CN 107275269A CN 201710204474 A CN201710204474 A CN 201710204474A CN 107275269 A CN107275269 A CN 107275269A
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- substrate
- fixture
- space
- correcting unit
- relief portion
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70083—Non-homogeneous intensity distribution in the mask plane
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The present invention provides a kind of processing unit handled substrate, it has fixture, correcting unit, 1st relief portion and control unit, the back side of fixture sorbing substrate simultaneously keeps substrate, correcting unit is arranged on forward surface and from the convex portion for facing face side protrusion in opposite directions opposite to each other including the opposite forward surface in the surface of the substrate with being kept by fixture and with the outer region on the surface including outer rim of substrate, convex portion connects with outer region, the 1st space is limited between the ratio outer region middle section in the inner part on forward surface and surface, 1st relief portion is depressurized via the access for being formed on correcting unit connected with the 1st space to the 1st space, control unit carries out making substrate profiling in the processing of fixture by depressurizing the 1st space by the 1st relief portion in the state of correcting unit is pressed against on substrate.
Description
Technical field
The present invention relates to processing unit and the manufacture method of article.
Background technology
The exposure device used in the manufacture of semiconductor equipment has substrate-placing platform and carried out relative to substrate-placing platform
The conveying robot of supply and the recovery of substrate.Substrate-placing platform is through substrate fixture vacuum suction and keeps substrate.
Along with the highly integrated of semiconductor equipment, the granular of distribution, multiple stratification development.If wiring layer multiple stratification,
With the subsequent handling for the manufacturing process for entering semiconductor equipment, it is found that whole in substrate due to the membrane strain accumulation in film forming
Body produces the phenomenon of warpage.For example, in TSV (Through Silicon Via) work of the lamination techniques as semiconductor chip
In sequence, due in the difference as the thermal coefficient of expansion between the metal of through electrode (for example, copper) and the silicon around it, passing through
Strain is produced between energization pole and silicon.For such substrate for generating warpage, it is impossible to carry out the guarantor carried out by vacuum suction
Hold.
Therefore, for the holding of substrate, Japanese Unexamined Patent Publication 2001-284434 publications, Japanese Unexamined Patent Publication 2006-54388 public affairs
Report proposes the technology of the warpage for correction substrate.For example, Japanese Unexamined Patent Publication 2001-284434 publications are disclosed with correction
The shifting apparatus of the periphery pressing component of the warpage of substrate.In addition, Japanese Unexamined Patent Publication 2006-54388 publications disclose by from
The handling device that air carrys out the warpage of correction substrate is sprayed above substrate.
In recent years, because on the basis of the big tendency of the warpage quantitative change of substrate, the thickness of substrate also increases, so,
The substrate high to flexural rigidity is asked to handle.In order to correct the warpage of such substrate, increase calibrated force is essential.Cause
This, it is necessary to increase when periphery pressing component is pushed to substrate in technology disclosed in Japanese Unexamined Patent Publication 2001-284434 publications
Thrust, and increase the lifting force of the substrate-placing platform for resisting the thrust.However, in order to realize such case, it is necessary to increase
The weight of large substrates mounting table, therefore, causes expansion, reduction of mounting table precision of space-consuming etc..So the problem of, is in day
Similarly produced in technology disclosed in this JP 2006-54388 publications.
The content of the invention
The present invention provides a kind of processing unit for being conducive to the warpage of correction substrate and keeping substrate.
To achieve these goals, it is the processing handled substrate as the processing unit in terms of the 1st of the present invention
Device, it is characterised in that with fixture, correcting unit, the 1st relief portion and control unit, the fixture adsorbs the back of the body of the substrate
Face simultaneously keeps substrate；The correcting unit includes forward surface and convex portion, the forward surface and the base kept by the fixture
The surface of plate is opposite, and the outer region of the convex portion and the surface including outer rim of the substrate is set opposite to each other
Protruded in the forward surface and from the forward surface towards the face side, the convex portion connects with the outer region, described
The 1st space is limited between the middle section of outer region in the inner part described in forward surface and the ratio on the surface；1st decompression
The 1st space is depressurized via the access for being formed on the correcting unit connected with the 1st space in portion；Institute
State control unit and carry out following handle：In the state of the correcting unit is pushed on the substrate, by being subtracted by the described 1st
Splenium depressurizes to make the substrate profiling in the fixture to the 1st space.
It is the processing unit handled substrate as the processing unit of the 2nd aspect of the present invention, it is characterised in that
With fixture, mounting table, correcting unit, elastomeric element, relief portion and control unit, the fixture adsorbs the back side of the substrate simultaneously
Keep the substrate；The mounting table loads and keeps the fixture；The correcting unit includes forward surface and multiple convex portions, institute
The surface for the substrate stated forward surface and kept by the fixture is opposite, and the multiple convex portion includes outer rim with the substrate
Each of mutually different some in the outer region on the surface inside is arranged on described opposite opposite to each other
Face is simultaneously protruded from the forward surface towards the face side；The elastomeric element is configured in the side of the correcting unit, so as to
The fixture is surrounded, the multiple convex portion each connect with each of the multiple part in the state of, it is described
Elastomeric element connects with the mounting table, and the 1st space is limited between the forward surface and the mounting table；The relief portion
It is empty via the 2nd between the face and the back side of the fixture for being configured with the multiple pins supported to the substrate
Between the access being formed on the fixture that connects, the 2nd space is depressurized；The control unit carries out following locate
Reason：In the state of the correcting unit is pushed on the substrate, by being carried out by the relief portion to the 2nd space
Decompression, the 1st space connected to the warpage of the outer region of the substrate because being kept by the fixture is carried out
Decompression, makes the substrate profiling in the fixture.
It is used as the manufacture method of the article of the 3rd aspect of the present invention, it is characterised in that have：Using processing unit to base
The process of plate exposure；And to the process that the substrate exposed is developed, the processing unit has fixture, correction unit
Part, the 1st relief portion and control unit, the fixture adsorb the back side of the substrate and keep substrate；The correcting unit includes phase
To face and convex portion, the surface of the forward surface and the substrate kept by the fixture is opposite, the convex portion and the substrate
The outer region on the surface including outer rim be arranged on the forward surface opposite to each other and from the forward surface towards institute
Face side protrusion is stated, the convex portion connects with the outer region, perimeter region described in the ratio on the forward surface and the surface
The 1st space is limited between the middle section of domain in the inner part；1st relief portion with the 1st space via connecting by shape
The 1st space is depressurized into the access on the correcting unit；The control unit carries out following handle：By institute
State correcting unit push on the substrate in the state of, by being depressurized by the 1st relief portion to the 1st space,
Make the substrate profiling in the fixture.
It is used as the manufacture method of the article of the 4th aspect of the present invention, it is characterised in that have：Using processing unit to base
The process that plate is exposed；And to the process that the substrate exposed is developed, the processing unit has fixture, load
Platform, correcting unit, elastomeric element, relief portion and control unit are put, the fixture adsorbs the back side of the substrate and keeps the base
Plate；The mounting table loads and keeps the fixture；The correcting unit include forward surface and multiple convex portions, the forward surface with
The surface of the substrate kept by the fixture is opposite, and the multiple convex portion is described including outer rim with the substrate
Each of mutually different some in the outer region on surface is arranged on the forward surface and from described opposite to each other
Forward surface is protruded towards the face side；The elastomeric element is configured in the side of the correcting unit, so as to by the fixture
Surround, the multiple convex portion each connect with each of the multiple part in the state of, the elastomeric element with
The mounting table connects, and the 1st space is limited between the forward surface and the mounting table；The relief portion via with positioned at
The quilt for the 2nd space connection being configured between the face of the fixture of the multiple pins supported to the substrate and the back side
The access on the fixture is formed, the 2nd space is depressurized；The control unit carries out following handle：By institute
State correcting unit push on the substrate in the state of, by being depressurized by the relief portion to the 2nd space, to because
The warpage of the outer region of the substrate kept by the fixture and the 1st space that connects are depressurized, and make institute
Substrate profiling is stated in the fixture.
The further purpose or other side of the present invention should be because of the preferred embodiment illustrated with reference to the accompanying drawings
And become clear and definite.
Brief description of the drawings
Fig. 1 is the schematic diagram of the structure for the exposure device for being denoted as an aspect of of the present present invention.
Fig. 2A to Fig. 2 C is the figure that the calibrated force produced by the warpage of substrate and by fixture models to represent.
Fig. 3 A and Fig. 3 B are that the structure for representing fixture in present embodiment, substrate-placing platform and correcting unit is shown
It is intended to.
Fig. 4 is the figure for the structure for being shown in detail in the fixture shown in Fig. 3 A and Fig. 3 B.
Fig. 5 is the figure for the structure for being shown in detail in the correcting unit shown in Fig. 3 A and Fig. 3 B.
Fig. 6 A to Fig. 6 D are the figures for illustrating the processing of the warpage of the correction substrate in present embodiment.
Fig. 7 is the figure for representing to be configured in the correcting unit of handling machinery on hand in the exposure device shown in Fig. 1.
Fig. 8 is the schematic diagram for the structure for representing fixture in present embodiment, substrate-placing platform and correcting unit.
Fig. 9 A to Fig. 9 C are the figures of the structure for the variation for being shown in detail in the correcting unit shown in Fig. 3 A and Fig. 3 B.
Figure 10 A to Figure 10 E are the figures for illustrating the processing of the warpage of the correction substrate in present embodiment.
Figure 11 A and Figure 11 B are the schematic diagrames for representing to load the structure of the supporting member of correcting unit.
Embodiment
Below, the preferred embodiment of the present invention is illustrated referring to the drawings.In addition, in the various figures, to identical portion
Part marks identical reference, and the repetitive description thereof will be omitted.
Fig. 1 is the schematic diagram of the structure for the exposure device 1 for being denoted as an aspect of of the present present invention.Exposure device 1 is to base
Plate is exposed and forms the lithographic equipment of pattern.Exposure device 1 is as shown in figure 1, with lamp optical system 11, keep light shield
The light shield mounting table 13 of (mask) 12, light shield measurement portion 14, the back side of projection optical system 15 and sorbing substrate 19 simultaneously keep base
The fixture 16 of plate 19.In addition, exposure device 1 has the mounting simultaneously substrate-placing platform 17 of retaining jig 16, substrate measurement portion 18, Jiao
Point measurement portion 20 and control unit 21.
Lamp optical system 11 includes lens, speculum, light integrator, phase-plate, diffraction optical element, aperture etc.,
Light shield 12 is illuminated by the light from light source.The pattern (circuit pattern) that should be transferred in the formation of light shield 12 to substrate 19.Light
Cover mounting table 13 is can to keep and move the mounting table of light shield 12.Light shield measurement portion 14 is such as including laser interferometer, measurement
The position of the light shield 12 kept by light shield mounting table 13.Fixture 16 is for example including Z drive mechanisms, and being configured to can be in Z-direction
Moving substrate 19.Substrate-placing platform 17 is the mounting that can be moved in X/Y plane in X-direction and the two directions of Y direction
Platform.Substrate measurement portion 18 measures the position of substrate-placing platform 17 such as including laser interferometer.Focus measurement portion 20 is measured
The position of the short transverse (Z-direction) of the substrate 19 kept on substrate-placing platform by fixture 16.Control unit 21 includes CPU, deposited
Reservoir etc., controls the entirety (action) of exposure device 1.
Here, pair hypothesis produces warpage and by being adsorbed and being protected by the fixture 16 being positioned on substrate-placing platform 17 in substrate 19
The situation for holding the substrate 19 is illustrated.For example, in the case where the sagging such warpage of outer rim is produced on substrate 19, if will
Calibrated force (power for being used for the warpage of the correction substrate 19) modelling produced by fixture 16, then as shown in Figure 2 A, can be outside
The distributed load model of edge supporting is represented.Therefore, if by two supports substrate 19, make a concerted effort center of gravity and the supporting-point of calibrated force
Leave, so, it can deform easily substrate 19, correct warpage.
On the other hand, in the case where warpage as outer rim is upspring is produced on substrate 19, if will be produced by fixture 16
Calibrated force modelling, then as shown in Figure 2 B, can be represented using the distributed load model of centre bearing.If being protected by fixture 16
Hold such substrate 19, then as shown in Figure 2 C, the correction warpage from the central part of substrate 19.Now, due in the outer of substrate 19
The center of gravity of making a concerted effort of edge, correction portion and calibrated force is approached, so, if constant, the required correction of the required bending moment of correction
Power can increase.Further, for such substrate 19, because with the gas leakage from outer rim, vacuum will not be uprised, so, by
The calibrated force that fixture 16 is produced dies down.
Therefore, in the present embodiment, it is proposed that make unlike conventional art by pressing component etc. to substrate push when
Thrust or substrate-placing platform weight increase ground correction substrate warpage and by fixture keep substrate technology.
Fig. 3 A and Fig. 3 B are the knots for representing fixture 16 in present embodiment, substrate-placing platform 17 and correcting unit 30
The schematic diagram of structure.In addition, in Fig. 3 A and Fig. 3 B, eliminate for support and drive them framework and actuator,
The diagram of sensor, pipe arrangement etc..In addition, here, it is contemplated to which warpage as outer rim is upspring produces the situation on substrate 19, but
It is amount of warpage, the shape for not limiting substrate 19.
As described above, the mounting of substrate-placing platform 17 and retaining jig 16, the back side of the sorbing substrate 19 of fixture 16, keep substrate
19.Correcting unit 30 is configured to move in X-direction, Y direction and Z-direction, is pushed in and is kept by fixture 16
Substrate 19 on, the warpage of correction substrate 19.
Fig. 4 is the figure for the structure for being shown in detail in fixture 16.Fixture 16 includes base station 161, is configured in base station 161 and props up
Hold multiple pins 162 of substrate 19, configured by complete cycle on base station 161 so as to the edge dyke 163 for surrounding multiple pins 162.Edge
Dyke 163 has supporting substrates 19 and the function of separating space S P2 and atmospheric environment (outside).In addition, on fixture 16,
In the state of supporting substrate 19 through multiple pins 162 and edge dyke 163, the base station on multiple pins 162 is formed and is configured in
The access 164 of space (2nd space) SP2 connection of 161 (faces of fixture 16) between the back side of substrate 19.In access
164 are connected to include the 2nd relief portion 62 of vacuum source etc..2nd relief portion 62 is depressurized through access 164 to space S P2, accordingly,
The substrate 19 on multiple pins 162 and edge dyke 163 can be simultaneously adsorbed, it is simultaneously true by multiple pins 162 and edge dyke 163
Protect the flatness of substrate 19.
Fig. 5 is the figure for the structure for being shown in detail in correcting unit 30.Correcting unit 30 includes as base component 301：With
The opposite forward surface 302 in the surface of the substrate 19 kept by fixture 16；Prominent convex of face side from from forward surface 302 to substrate 19
Portion 303.The outer region of convex portion 303 and the surface including outer rim of substrate 19 is arranged on forward surface by complete cycle opposite to each other
On 302.Correcting unit 30 connects in convex portion 303 with the outer region of substrate 19, that is, is pushed in the substrate kept by fixture 16
In the state of 19, between the ratio outer region middle section in the inner part on the surface of forward surface 302 and substrate 19, sky is limited
Between (the 1st space) SP1.Convex portion 303 has the function of separating space S P1 and atmospheric environment (outside).In addition, in correcting unit
30 form the access 304 connected with space S P1, and the 1st relief portion 61 is connected in access 304.1st relief portion 61 includes true
Empty source etc., is depressurized through access 304 to space S P1.
Reference picture 6A to Fig. 6 D, processing to the warpage of correction substrate 19, is to make the profiling of substrate 19 in the present embodiment
Illustrated in the processing of fixture 16.The processing is carried out by each several part by the overall control exposure device 1 of control unit 21.Such as
Shown in Fig. 6 A, in the case where outer rim upsprings such warpage generation on substrate 19, even if by the 2nd relief portion 62 to space
SP2 is depressurized, due to the gas leakage of the outer rim from substrate 19, can not abundant sorbing substrate 19, it is impossible to correction substrate 19
Warpage.
First, in the present embodiment, as shown in Figure 6A, in the state of correcting unit 30 and substrate 19 are separated, start
The decompression that 2nd relief portion 62 is carried out to space S P2, and start correcting unit 30 correcting unit 30 and fixture 16 relatively close to
Direction movement.Alternatively, it is also possible to not be to move correcting unit 30, but move fixture 16, can also be makes correction
At least one party's movement of part 30 and fixture 16.
Then, as shown in Figure 6B, if the convex portion 303 of correcting unit 30 connects with the outer region on the surface of substrate 19,
Simultaneously make the mobile continuation of correcting unit 30, simultaneously start the decompression that the 1st relief portion 61 is carried out to space S P1.Due to correction unit
Space S P1 between the forward surface 302 of part 30 and the middle section on the surface of substrate 19 is depressurized, so, in correcting unit 30
The power that (substrate 19) is pushed downward is produced, and the power being pushed upward is produced in fixture 16 (substrate 19).Accordingly, substrate
19 warpage is corrected.
Then, as shown in Figure 6 C, in the profiling of substrate 19 after fixture 16, stop the 1st relief portion 61 and space S P1 is carried out
Decompression.But, the decompression for maintaining the 2nd relief portion 62 to carry out space S P2.If substrate 19 is corresponding with periphery region
The region at the back side connects with fixture 16, i.e., substrate 19 is adsorbed completely by fixture 16, then the pressure difference ends at the back side of substrate 19, institute
So that substrate 19 is kept with the state being corrected by by fixture 16.In addition, the back side corresponding with periphery region of substrate 19
Whether region connects with fixture 16, can be by measuring the space S P1 (access 164) depressurized by the 1st relief portion 61 pressure
Power, correcting unit 30, the position of substrate 19 are judged.Correcting unit 30 can be fixed in the structure of supporting member,
It can also be positioned in as shown in Figure 11 A and Figure 11 B on the supporting member 307 and 308 that can mutually relatively move.
Supporting member 307 is integrally formed with correcting unit 30.In Figure 11 A, supporting member 308 carries supporting member 307.In school
Positive part 30 is by the state of the surface that press against substrate 19, as shown in Figure 11 B, as supporting member 308 and supporting member 307 from
The structure opened without making power upward be transmitted to supporting member 308.
During from the State Transferring shown in the state shown in Fig. 6 B to Fig. 6 C, the 1st relief portion 61 and the 2nd of control subtracts
Splenium 62, to make space S P1 pressure equal or less than that with space S P2 pressure.In other words, the 1st relief portion 61 is controlled
And the 2nd relief portion 62, so as to depressurize the relief portion 61 of reason the 1st and in the space S P1 power produced and the relief portion 62 of reason the 2nd
Decompression and space S P2 produce power it is equal or less than that.Hereby it is possible to prevent substrate 19 from being inhaled by being pulled open from fixture 16
It is attached to the situation on correcting unit 30.
Then, as shown in Figure 6 D, if the warpage of substrate 19 is corrected, substrate 19 is kept by fixture 16, then by space S P1
Discharged through access 304 to atmospheric environment, and start the side that correcting unit 30 relatively leaves to correcting unit 30 and fixture 16
To movement.
So, in the present embodiment, in the state of correcting unit 30 to be pressed against to substrate 19, by by the 1st decompression
Portion 61 is depressurized to space S P1, is capable of the warpage of correction substrate 19, makes the profiling of substrate 19 in fixture 16.Now, without increase
By correcting unit 30 to substrate 19 push when thrust and substrate-placing platform 17 weight.
In addition, in the present embodiment, correcting unit 30 is configured near fixture 16, substrate-placing platform 17, constitute
For that can be moved in X-direction, Y direction and Z-direction, but it is not limited to this.Typically, since exposure device 1
Conveying robot 70 with carrying substrate 19, so, correcting unit 30 can also be configured and carried as shown in FIG. 7
Manipulator 70.The state that conveying robot 70 connects in the convex portion 303 of correcting unit 30 with the outer region on the surface of substrate 19
Under, by being depressurized by the 1st relief portion 61 to space S P1, kept by correcting unit 30 and carrying substrate 19.
Configured by correcting unit 30 in the case of conveying robot 70, preferably will measurement forward surface 302 and substrate 19
The distance measuring portion 72 of the distance between the middle section on surface configure in such as forward surface 302.Moreover, in conveying robot
In the case that 70 keep substrate 19, according to the measurement result of distance measuring portion 72, the 1st relief portion 61 is controlled, to make forward surface
302 and substrate 19 do not contact (that is, to maintain the distance measured by distance measuring portion 72 to be constant distance).
In addition, configured by correcting unit 30 in the case of conveying robot 70, can also be by measurement space SP1 pressure
The pressure measxurement portion 74 of power is configured in such as access 304.Moreover, in the case where conveying robot 70 keeps substrate 19, root
According to the measurement result in pressure measxurement portion 74, control the 1st relief portion 61, so as to make forward surface 302 and substrate 19 do not contact (that is, with
Just it is constant value to maintain the pressure measured by pressure measxurement portion 74).Further, distance measuring portion 72 and pressure can also be configured
Both measurement portions 74, according to distance measuring portion 72 and the measurement result in pressure measxurement portion 74, control the 1st relief portion 61, with
Just forward surface 302 and substrate 19 is made not to contact.
Such warpage generation is upspring in the case of substrate 19 in a part for outer rim, the convex portion 303 of correcting unit 30
It can not connect with the entire surface of the outer region on the surface of substrate 19, exist and be difficult to depressurize space S P1 and (turn into negative pressure)
Possibility.Therefore, as shown in figure 8, preferably the convex portion 303 of correcting unit 30 substrate-side face (surface of substrate 19
The face of outer region side) configuration elastomeric element 306.Accordingly, such warpage generation is upspring in base even in a part for outer rim
In the case of on plate 19, the outer region that the convex portion 303 of correcting unit 30 can also be through elastomeric element 306 Yu the surface of substrate 19
Entire surface connect, therefore, it is possible to limit space S P1.Therefore, by being depressurized by the 1st relief portion 61 to space S P1,
The substrate 19 for such warpage that can be upspring relative to the part for generating outer rim plays calibrated force.In fig. 8, elastomeric element
306 have and include the shape of warpage part in the section vertical with forward surface 302, but are not limited to this, for example, also may be used
With with rectangular shape.
Below, reference picture 9A, Fig. 9 B and Fig. 9 C, is carried out to the correcting unit 30A of the variation as correcting unit 30
Explanation.Correcting unit 30A includes as base component 301A：The opposite forward surface in the surface of substrate 19 with being kept by fixture 16
302A；The prominent multiple convex portion 303A of face side from from forward surface 302A to substrate 19.Multiple convex portion 303A and substrate 19 bag
Each for including the mutually different some in the outer region on the surface including outer rim is arranged on forward surface opposite to each other
302A (that is, is locally disposed forward surface 302A).
Elastomeric element 309A is configured in correcting unit 30A side, so as to which fixture 16 is surrounded.Elastomeric element 309A has
There is the internal diameter bigger than the external diameter of fixture 16 (substrate 19), can be contiguously configured with substrate-placing platform 17.Elastomeric element 309A
Connect in multiple convex portion 303A with the outer region of substrate 19, i.e., correcting unit 30A is pushed in the state of substrate 19, with base
Plate mounting table 17 connects, and space (the 1st space) SP3 is limited between forward surface 302A and substrate-placing platform 17.Correcting unit 30A
Forward surface 302A and substrate-placing platform 17 between space S P3 sticking up because of the outer region of substrate 19 that is kept by fixture 16
Song, and connect with the space S P1 that is defined out between correcting unit 30A forward surface 302A and the middle section of substrate 19
It is logical.
The access 304A for connecting space S P1 with atmospheric environment (outside) in correcting unit 30A formation.For correction unit
Part 30A, without in the relief portion 61 of access 304A connections the 1st, but sets can be opened and closed access 304A as aftermentioned
Valve 308A.
Reference picture 10A to Figure 10 E, the processing of the warpage to carrying out correction substrate 19 using correcting unit 30A (imitates substrate 19
Shape is in the processing of fixture 16) illustrate.The processing is entered by each several part by the overall control exposure device 1 of control unit 21
OK.As shown in Figure 10 A, upspring in outer rim in the case that such warpage produced on substrate 19, even if by 62 pairs of the 2nd relief portion
Space S P2 is depressurized, due to the gas leakage of the outer rim from substrate 19, can not abundant sorbing substrate 19, it is impossible to correction substrate
19 warpage.
First, as shown in Figure 10 A, in the state of correcting unit 30A and substrate 19 are separated, shutoff valve 308A will be formed
Access 304A cut-offs (cut-off and the connection of atmospheric environment (outside)) on correcting unit 30A.Then, start the 2nd to depressurize
The decompression that portion 62 is carried out to space S P2, and start correcting unit 30A correcting unit 30A and fixture 16 relatively close to side
To movement.Alternatively, it is also possible to move correcting unit 30A, but fixture 16 is moved, correcting unit 30A can also be made
And at least one party's movement of fixture 16.In addition, the decompression time in order to shorten space S P1, access 304A can also with it is big
Compression ring border or vacuum source connection.
Figure 10 B are multiple convex portion 303A for representing correcting unit 30A each outer region with the surface of substrate 19
The state that interior mutually different some connects.Figure 10 C are the back side corresponding with periphery region for representing substrate 19
The state that connects with fixture 16 of region.Untill the state shown in Figure 10 C, kept from the state shown in Figure 10 B by valve
The state that 308A is closed, continues the decompression that the 2nd relief portion 62 is carried out to space S P2.During this period, due to space S P2 and sky
Between SP3 connected because of the warpage of the outer region of substrate 19, so, because space S P2 is depressurized, space S P3 is also depressurized.According to
This, due to producing the power that (substrate 19) is pushed downwards in correcting unit 30A, and produces upward in fixture 16 (substrate 19)
The power being pushed, so, the warpage of substrate 19 is corrected.
Then, after connecting in the region at the back side corresponding with periphery region of substrate 19 with fixture 16, such as Figure 10 D institutes
Show, simultaneously continue the decompression that the 2nd relief portion 62 is carried out to space S P2, simultaneously open valve 308A.Accordingly, access 304A
Discharged (air release) to atmospheric environment, the center on air entrance correction part 30A forward surface 302A and the surface of substrate 19
Space S P1 between region.But, because the space S P2 substrates 19 for being corrected by warpage are closed, so, substrate 19 is with by school
State just is kept by fixture 16.
Then, as shown in figure 10e, if the warpage of substrate 19 is corrected, substrate 19 is kept by fixture 16, then starts correction
Part 30A correcting unit 30A and fixture 16 relative to the direction left movement.Now, valve 308A maintains the state of opening.
So, in the state of correcting unit 30A to be pressed against to substrate 19, by being subtracted by the 2nd relief portion 62 to space S P2
Pressure, can depressurize to the space S P3 connected by the warpage of the outer region of substrate 19, make the profiling of substrate 19 in fixture
16.Correcting unit 30A can reduce the area connected with substrate 19 compared with correcting unit 30.Further, since correcting unit 30A
It is not necessary in the relief portion 61 of access 304A connections the 1st, so, its pipe arrangement can be cut down.
According to the exposure device 1 of present embodiment, for example, upspringing such warpage generation on substrate 19 even in outer rim
In the case of, the warpage can be also corrected, substrate 19 is kept by fixture 16.Therefore, exposure device 1 can be accurately by light shield
12 pattern is transferred to the substrate 19 kept by fixture 16.
The manufacture method of article in embodiments of the present invention is suitable for manufacture such as equipment, and (semiconductor element, magnetic are deposited
Storage media, liquid crystal display cells etc.) and other items.The manufacture method is coated with the substrate of emulsion including the use of 1 pair of exposure device
The process being exposed and the process developed to the substrate being exposed.In addition, the manufacture method can include it is other well known
Process (oxidation, film forming, evaporation, doping, planarization, etching, resist stripping, scribing, bonding, encapsulation etc.).This embodiment party
The manufacture method of article in formula is compared with the past, at least one of the performance of article, quality, productivity and production cost
Aspect is favourable.
The preferred embodiment of the present invention is illustrated above, still, the present invention is not limited to these realities certainly
Mode is applied, various modifications and change can be carried out in the range of its purport.For example, in the present embodiment, as to substrate
One of the processing unit handled illustrates exposure device, still, and the present invention is readily applicable to by being positioned in
Put the processing unit that the substrate of the absorption of the fixture on platform (holding) is handled.The processing unit includes for example grinding substrate
The lapping device of mill, coating machine of formation film etc. on substrate.
Claims (13)
1. a kind of processing unit, is the processing unit handled substrate, it is characterised in that with fixture, correcting unit,
1 relief portion and control unit,
The fixture adsorbs the back side of the substrate and keeps substrate；
The correcting unit includes forward surface and convex portion, the forward surface and the surface phase of the substrate kept by the fixture
To the outer region of, the convex portion and the surface including outer rim including of the substrate be arranged on opposite to each other it is described in opposite directions
Face is simultaneously protruded from the forward surface towards the face side, and the convex portion connects with the outer region, in the forward surface and institute
State and limit the 1st space between the middle section of outer region in the inner part described in the ratio on surface；
1st relief portion is via the access for being formed on the correcting unit connected with the 1st space to the described 1st
Depressurized in space；
The control unit carries out following handle：In the state of the correcting unit is pushed on the substrate, by by institute
The 1st relief portion is stated the 1st space is depressurized to make the substrate profiling in the fixture.
2. processing unit as claimed in claim 1, it is characterised in that also with the 2nd relief portion, the 2nd relief portion via
What the 2nd space between the face and the back side of the fixture that is configured with the multiple pins supported to the substrate was connected
The access of the fixture is formed on, the 2nd space is depressurized,
The control unit in the processing,
In the state of the correcting unit and substrate separation, start what the 2nd relief portion was carried out to the 2nd space
Decompression, and start at least one party of the correcting unit and the fixture in the correcting unit and the fixture relatively
The movement in close direction,
After connecting in the convex portion with the outer region, start the decompression that the 1st relief portion is carried out to the 1st space,
In the substrate profiling in after the fixture, stop the decompression that the 1st relief portion is carried out to the 1st space.
3. processing unit as claimed in claim 2, it is characterised in that the control unit controls the 1st relief portion and institute
The 2nd relief portion is stated, the 2nd subtracts described in the power and reason produced to depressurize the 1st relief portion described in reason in the 1st space
Splenium depressurize and the 2nd space produce power it is equal or than described in reason the 2nd relief portion decompression and in the 2nd space
The power of generation is small.
4. processing unit as claimed in claim 1, it is characterised in that also with the conveying robot for carrying the substrate,
The correcting unit is configured in the conveying robot,
In the state of the conveying robot connects in the convex portion with the outer region, by by the 1st relief portion pair
Depressurized and the substrate is kept by the correcting unit in 1st space.
5. processing unit as claimed in claim 4, it is characterised in that also with the measurement forward surface and the middle section
The distance between distance measuring portion,
The control unit is in the case where the conveying robot keeps the substrate, according to the measurement knot of the distance measuring portion
Really, the 1st relief portion is controlled, to make the forward surface and the middle section not contact.
6. processing unit as claimed in claim 4, it is characterised in that the pressure also with the pressure for measuring the 1st space
Measurement portion,
The control unit is in the case where the conveying robot keeps the substrate, according to the measurement knot in the pressure measxurement portion
Really, the 1st relief portion is controlled, to make the forward surface and the middle section not contact.
7. processing unit as claimed in claim 1, it is characterised in that the convex portion includes being configured in the outer region side
Face elastomeric element.
8. processing unit as claimed in claim 1, it is characterised in that also with being thrown to the substrate kept by the fixture
The projection optical system of the pattern of shadow mask,
The substrate is exposed via the projection optical system.
9. a kind of processing unit, is the processing unit handled substrate, it is characterised in that with fixture, mounting table, correction
Part, elastomeric element, relief portion and control unit,
The fixture adsorbs the back side of the substrate and keeps the substrate；
The mounting table loads and keeps the fixture；
The correcting unit includes the table of forward surface and multiple convex portions, the forward surface and the substrate kept by the fixture
Face is opposite, and the multiple convex portion is with the substrate including mutually different in the outer region on the surface including outer rim
Each of some is arranged on the forward surface and protruded from the forward surface towards the face side opposite to each other；
The elastomeric element is configured in the side of the correcting unit, so as to which the fixture is surrounded, in the multiple convex portion
Each connect with each of the multiple part in the state of, the elastomeric element connects with the mounting table, in institute
State and the 1st space is limited between forward surface and the mounting table；
The relief portion via with positioned at the face for the fixture for being configured with the multiple pins supported to the substrate and described
The access being formed on the fixture of the 2nd space connection between the back side, is depressurized to the 2nd space；
The control unit carries out following handle：In the state of the correcting unit is pushed on the substrate, by by institute
State relief portion to depressurize the 2nd space, to sticking up for the outer region of the substrate because being kept by the fixture
The 1st space that is bent and connecting is depressurized, and makes the substrate profiling in the fixture.
10. processing unit as claimed in claim 9, it is characterised in that the correcting unit is including by the 1st space and greatly
The access of gas environmental communication and the valve that the access can be opened and closed,
The control unit in the processing,
In the state of the correcting unit and substrate separation, the valve is closed, is started by the relief portion to the described 2nd
The decompression that space is carried out, and start at least one party of the correcting unit and the fixture in the correcting unit and described
Fixture relatively close to direction movement,
Each from the multiple convex portion connects with each of the multiple part and plays corresponding with the outer region
Untill the region at the back side connects with the fixture, the state for closing the valve is kept, makes the relief portion to the described 2nd
The decompression that space is carried out continues,
After connecting in the region at the back side corresponding with the outer region with the fixture, simultaneously make the relief portion to institute
The decompression for stating the progress of the 2nd space continues, and simultaneously opens the valve.
11. processing unit as claimed in claim 9, it is characterised in that also with to the substrate kept by the fixture
The projection optical system of the pattern of projection mask,
The substrate is exposed via the projection optical system.
12. a kind of manufacture method of article, it is characterised in that have：
Use process of the processing unit to base plate exposure；And
The process developed to the substrate exposed,
The processing unit has fixture, correcting unit, the 1st relief portion and control unit,
The fixture adsorbs the back side of the substrate and keeps substrate；
The correcting unit includes forward surface and convex portion, the forward surface and the surface phase of the substrate kept by the fixture
To the outer region of, the convex portion and the surface including outer rim including of the substrate be arranged on opposite to each other it is described in opposite directions
Face is simultaneously protruded from the forward surface towards the face side, and the convex portion connects with the outer region, in the forward surface and institute
State and limit the 1st space between the middle section of outer region in the inner part described in the ratio on surface；
1st relief portion is via the access being formed on the correcting unit connected with the 1st space to described
Depressurized in 1st space；
The control unit carries out following handle：In the state of the correcting unit is pushed on the substrate, by by institute
State the 1st relief portion to depressurize the 1st space, make the substrate profiling in the fixture.
13. a kind of manufacture method of article, it is characterised in that have：
The process being exposed using processing unit to substrate；And
The process developed to the substrate exposed,
The processing unit has fixture, mounting table, correcting unit, elastomeric element, relief portion and control unit,
The fixture adsorbs the back side of the substrate and keeps the substrate；
The mounting table loads and keeps the fixture；
The correcting unit includes the table of forward surface and multiple convex portions, the forward surface and the substrate kept by the fixture
Face is opposite, and the multiple convex portion is with the substrate including mutually different in the outer region on the surface including outer rim
Each of some is arranged on the forward surface and protruded from the forward surface towards the face side opposite to each other；
The elastomeric element is configured in the side of the correcting unit, so as to which the fixture is surrounded, in the multiple convex portion
Each connect with each of the multiple part in the state of, the elastomeric element connects with the mounting table, in institute
State and the 1st space is limited between forward surface and the mounting table；
The relief portion via with positioned at the face for the fixture for being configured with the multiple pins supported to the substrate and described
The access being formed on the fixture of the 2nd space connection between the back side, is depressurized to the 2nd space；
The control unit carries out following handle：In the state of the correcting unit is pushed on the substrate, by by institute
State relief portion to depressurize the 2nd space, to sticking up for the outer region of the substrate because being kept by the fixture
The 1st space that is bent and connecting is depressurized, and makes the substrate profiling in the fixture.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016076118A JP6761271B2 (en) | 2016-04-05 | 2016-04-05 | Processing equipment and manufacturing method of articles |
| JP2016-076118 | 2016-04-05 |
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| Publication Number | Publication Date |
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| CN107275269A true CN107275269A (en) | 2017-10-20 |
| CN107275269B CN107275269B (en) | 2021-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710204474.1A Active CN107275269B (en) | 2016-04-05 | 2017-03-31 | Processing apparatus and method for manufacturing article |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6761271B2 (en) |
| KR (1) | KR102183431B1 (en) |
| CN (1) | CN107275269B (en) |
| TW (1) | TWI633396B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379757A (en) * | 2018-04-12 | 2019-10-25 | 东京毅力科创株式会社 | Electrostatic chuck, substrate board treatment and substrate keeping method |
| CN113387132A (en) * | 2021-05-12 | 2021-09-14 | 合肥欣奕华智能机器有限公司 | Substrate operation platform and control method thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6866115B2 (en) * | 2016-11-04 | 2021-04-28 | 株式会社東京精密 | Wafer transfer holding device |
| TWI647782B (en) * | 2018-05-16 | 2019-01-11 | 力成科技股份有限公司 | Vacuum positioning device for fan-out wafer- panel level packaging |
| JP7412824B1 (en) | 2023-06-02 | 2024-01-15 | 株式会社 天谷製作所 | Semiconductor manufacturing equipment and method |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201805725A (en) | 2018-02-16 |
| TWI633396B (en) | 2018-08-21 |
| CN107275269B (en) | 2021-07-30 |
| KR20170114933A (en) | 2017-10-16 |
| KR102183431B1 (en) | 2020-11-26 |
| JP2017187610A (en) | 2017-10-12 |
| JP6761271B2 (en) | 2020-09-23 |
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