CN113387132A - Substrate operation platform and control method thereof - Google Patents

Substrate operation platform and control method thereof Download PDF

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Publication number
CN113387132A
CN113387132A CN202110517204.2A CN202110517204A CN113387132A CN 113387132 A CN113387132 A CN 113387132A CN 202110517204 A CN202110517204 A CN 202110517204A CN 113387132 A CN113387132 A CN 113387132A
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substrate
opening
area
bearing
airflow
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CN202110517204.2A
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CN113387132B (en
Inventor
沈洪星
刘晏
石斌
熊海军
赵叶军
宋晓波
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Hefei Sineva Intelligent Machine Co Ltd
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Hefei Sineva Intelligent Machine Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G35/00—Mechanical conveyors not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Abstract

The invention relates to the field of semiconductors, and discloses a substrate operation platform and a control method thereof, wherein the substrate operation platform comprises: the bearing platform is used for bearing the substrate and is provided with a plurality of opening areas, and the opening areas are combined randomly to form a bearing area for bearing the substrate with at least two specifications; and the airflow adjusting component corresponds to the opening area and can independently control the airflow condition of the opening area corresponding to the airflow adjusting component. The method is used for realizing the transportation of the substrates with different specifications and solving the problem of warping of the substrates in the transportation process.

Description

Substrate operation platform and control method thereof
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a substrate work platform and a method for controlling the substrate work platform.
Background
A substrate 01 'conveying device is used when the substrate 01' is conveyed in the existing liquid crystal industry and semiconductor industry; the substrate 01 'conveying device can only correspond to the substrate 01' with one size, and the speed of updating and iterating the substrate 01 'is increased along with the adjustment of the industrial structure of the semiconductor industry, so that the substrates 01' with different sizes need to be produced, and most of the conventional substrate 01 'conveying devices cannot be used for conveying the substrates 01' with various sizes.
And with the development of the technology, the requirement for the flatness of the substrate 01 ' is higher and higher, the substrate 01 ' cannot be corrected in the prior art, and the problem of warpage of the substrate 01 ' is solved, because of the particularity of the warped substrate 01 ', when the substrate 01 ' is transported by using a single air path, referring to fig. 1, when the periphery of the substrate 01 ' is in a warped state, and when negative pressure adsorption is performed, the substrate 01 ' cannot be adsorbed to the carrying table 100 ' carrying the substrate 01 ' because an effective vacuum environment cannot be formed, and the substrate 01 ' will be in the warped state all the time, and further the quality of the substrate 01 ' will be affected.
Disclosure of Invention
The invention discloses a substrate operation platform and a control method thereof, which are used for realizing the bearing, adsorption and fixation of substrates with different specifications and solving the problem of warping of the substrates in the conveying process.
In order to achieve the purpose, the invention provides the following technical scheme:
in a first aspect, the present invention provides a substrate work platform, comprising:
the bearing platform is used for bearing the substrate and is provided with a plurality of opening areas, and the opening areas are combined randomly to form a bearing area for bearing the substrate with at least two specifications;
and the airflow adjusting component corresponds to the opening area and can independently control the airflow condition of the opening area corresponding to the airflow adjusting component.
Divide into a plurality of opening district on the plummer of bearing substrate, arbitrary combination forms the bearing area that is used for bearing two kinds of specifications of at least base plates in a plurality of opening district, realize that different specifications of base plates bear and adsorb fixedly through the bearing area, the air current situation of opening district is controlled through air current adjusting part, and air current adjusting part and opening district correspond the setting, a set of air current adjusting part corresponds an opening district promptly, or a set of air current adjusting part corresponds two opening districts, specific setting mode as long as have two sets of air current adjusting part control in a plurality of opening districts in the bearing area, different opening district work in this moment bearing area has the time difference, thereby when the base plate takes place the warpage, through different air current adjusting part control different opening district work. When the problem of warping of the substrate is solved, firstly, the opening area of the middle area corresponding to the substrate is controlled, after the air flow condition of the opening area of the middle area is stable, according to the Bernoulli equation, the pressure of the side, facing the bearing table, of the substrate is smaller than the pressure of the side, away from the bearing table, of the substrate, so that the warping substrate is flattened, and then other opening areas adjacent to the middle area are controlled to work through the air flow adjusting assembly according to needs, so that air leakage of other opening areas adjacent to the middle area is avoided, therefore, the air flow condition in the bearing area formed in the mode is more stable, the air flow condition of the opening area adjacent to the middle area can be controlled according to the warping degree of the substrate, and the warping problem of the substrate is effectively solved.
Optionally, each of the opening regions has a plurality of opening portions therein.
Alternatively, the opening portion shape of each of the opening regions is the same.
Optionally, at least two of the opening areas of the plurality of opening areas have different opening shapes.
Optionally, the carrier has a first supporting surface for supporting the substrate and a second supporting surface opposite to the first supporting surface;
wherein the airflow regulating assembly comprises: and each air path in the plurality of air paths corresponds to a plurality of opening parts of the same opening area, and each air path is communicated with the corresponding opening part.
Optionally, the airflow adjusting assembly further includes an adjusting valve set, each set of air passages and opening portions of the same opening area correspond to each other, and the adjusting valve set is used for controlling on-off of different air passages.
Optionally, the gas flow regulating assembly further comprises a gas source.
Optionally, the opening portion includes: a vent groove arranged on the first supporting surface; and the through hole penetrates from the first supporting surface to the air path, one end of the through hole is communicated with the vent groove, and the other end of the through hole is communicated with the air path.
Optionally, the vent groove comprises a first vent groove and a second vent groove which are arranged in a crossed manner, and the through hole is positioned at the crossed point of the first vent groove and the second vent groove.
In a second aspect, the present invention provides a method for controlling a substrate work platform, comprising: the specification for bearing the substrate is obtained, the number of the opening areas needing to work is determined according to the specification of the substrate, the opening areas correspond to different airflow adjusting assemblies, and the airflow conditions of the opening areas corresponding to the airflow adjusting assemblies are independently controlled through the airflow adjusting assemblies so as to select any opening area to work and be used for bearing the substrate with at least two specifications.
Drawings
FIG. 1 is a schematic diagram illustrating a state of a substrate being adsorbed in the prior art;
FIG. 2 is a schematic illustration of a distribution of regions of a substrate processing platform according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a substrate adsorbing state of a substrate processing platform according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of substrates of different specifications corresponding to a substrate processing platform according to an embodiment of the present invention;
FIG. 5 is a schematic illustration of a regional distribution of another substrate processing platform in accordance with an embodiment of the present invention;
fig. 6 is a schematic structural diagram of different air paths in different regions of another substrate processing platform according to an embodiment of the present invention;
fig. 7-9 are schematic structural diagrams of different specifications of substrates corresponding to another substrate processing platform according to an embodiment of the present invention;
FIG. 10 is a partial cross-sectional view of FIG. 2;
FIG. 11 is a schematic structural diagram of an airflow adjustment assembly provided by an embodiment of the invention;
FIG. 12 is a schematic view of an opening according to an embodiment of the present invention;
fig. 13 is another schematic structural diagram of the opening portion according to the embodiment of the present invention.
In the figure: 01-a substrate; 01' -a substrate; 011-a first substrate; 012-a second substrate; 013 — a third substrate; 014-fourth substrate; 015-a fifth substrate; 016-sixth substrate; 017-a seventh substrate; 018-an eighth substrate; 019-a ninth substrate; 100-a carrier table; 100' -a susceptor; 110-an open area; 111-opening part; 111 a-a first vent channel; 111 b-a second vent slot; 111 c-a third vent slot; 111 d-through hole; 120-a first support surface; 130-a second support surface; 210-a gas path; 220-a manifold block; 230-a regulating valve group; 240-pressure gauge; 250-a flow meter; 260-gas source.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 2, an embodiment of the present invention provides a substrate processing platform, including:
the carrier 100 is used for carrying the substrate 01, the carrier 100 has several opening areas 110, the opening areas 110 are combined arbitrarily to form a carrying area for carrying at least two specifications of substrates 01;
an airflow regulating assembly corresponding to the open area 110, the airflow regulating assembly being capable of individually controlling the airflow conditions of the open area 110 corresponding thereto.
A bearing table 100 for bearing a substrate 01 is divided into a plurality of opening areas 110, a bearing area for bearing the substrate 01 with at least two specifications is formed in any combination of the plurality of opening areas 110, the airflow condition of the opening areas 110 is controlled through airflow adjusting components, and the airflow adjusting components are arranged corresponding to the opening areas 110, namely, one group of airflow adjusting components corresponds to one opening area 110, or one group of airflow adjusting components corresponds to two opening areas 110, the specific arrangement mode is that only two groups of airflow adjusting components are controlled in the plurality of opening areas 110 in the bearing area, at this time, different opening areas 110 in the bearing area work with time difference, so that when the substrate 01 warps, different opening areas 110 are controlled to work through different airflow adjusting components. When the problem of warping the substrate 01 is solved, firstly, the opening area 110 of the middle area corresponding to the substrate 01 is controlled, after the air flow condition of the opening area 110 of the middle area is stable, according to the bernoulli equation, the pressure on the side, facing the bearing table 100, of the substrate 01 is lower than the pressure on the side, away from the bearing table 100, of the substrate 01, so that the warped substrate 01 is flattened, and then other opening areas 110 adjacent to the middle area are controlled to work through the air flow adjusting assembly according to needs, so that air leakage of other opening areas 110 adjacent to the middle area is avoided, therefore, the air flow condition in the bearing area formed in the mode is more stable, and the air flow condition of the opening area 110 adjacent to the middle area can be controlled according to the warping degree of the substrate 01, and the warping problem of the substrate 01 is effectively solved.
Of course, when the airflow adjusting assembly is specifically arranged, the airflow adjusting assembly may provide vacuum to perform negative pressure adsorption on the substrate 01, for example, the airflow adjusting assembly further includes a vacuum pump and other devices to form a vacuum environment, or may provide air to perform positive pressure floating on the substrate 01, for example, a blower or a compressed air source and other devices are used to perform positive pressure floating on the substrate 01; specifically, the air source 260 provides air flow for the vacuum pump and the blower, or the air source 260 includes a positive air source and a negative air source, and the positive air source and the negative air source are switched by the electromagnetic valve (the positive and negative air sources are switched according to requirements).
As shown in FIG. 3, the substrate 01 is adsorbed by the airflow adjusting assembly under negative pressureFor example, when the substrate 01 is warped, the stress conditions of the points a and B are analyzed, the point a is located on one side of the substrate 01 facing the carrier 100, the point B is located on the other side of the substrate 01 away from the carrier 100, and the pressure at the point a is assumed to be P1The airflow rate provided by the airflow adjustment assembly is v1Height is h1(ii) a Pressure at point B is P2The flow velocity of the gas stream is v2Height is h2. From Bernoulli equation P +1/2 ρ v2And + ρ gh ═ C (in the formula, P is the pressure at a certain point in the fluid, v is the flow velocity at the point of the fluid, ρ is the density of the fluid, g is the gravitational acceleration, h is the height of the point, and C is a constant), and the leveling action of the substrate 01 can be realized by changing the adsorption flow rate according to the difference of the glass warp degree. According to the Bernoulli equation: p1+1/2ρv1 2+ρ gh1＝P2+1/2ρv2 2+ρgh2(ii) a Since the positions of the A point and the B point are different by the thickness of the substrate 01, h is approximated1＝h2The air density at the point A and the point B is the same, then P1+1/2ρv1 2＝P2+1/2ρv2 2. Under normal conditions v1＝v2When the vacuum adsorption is started in the point A area, v is 01>v20, P can be obtained from the equation1<P2Therefore, the substrate 01 is attached to the susceptor 100 under the atmospheric pressure, and the warped substrate 01 is flattened. If the air flow adjusting assembly supplies air to perform positive pressure air flotation on the substrate 01, the positive pressure air flotation can generate an upward acting force on the glass according to the related mechanics common knowledge and float the glass, and the details are not repeated herein.
In an embodiment of the present invention, the carrier 100 is divided into different opening areas 110 as follows, and the airflow conditions of the different opening areas 110 are controlled by the airflow adjusting assembly, so as to control the substrates 01 with different specifications. As shown in fig. 4, fig. 4 is a schematic view of when a substrate 01 with different specifications is placed on the carrier 100, and fig. 2 is a schematic view of different opening regions 110 on the carrier 100. For example, taking a way that the airflow adjusting assembly performs negative pressure adsorption on the substrate 01 as an example, when the first substrate 011 with fixed specification 1 is loaded, the airflow adjusting assembly controlling the area a is firstly opened until the adsorption of the opening area 110 of the area a is stable, then the opening areas 110 surrounding the area B and the area C around the area a are sequentially operated, then the areas B, C, D and E are sequentially operated, the airflow adjusting assembly controls the timing of the different opening areas 110 to be gradually adsorbed from the middle to the periphery, so that an adsorption environment is formed in the middle area, namely the opening area 110 of the area a, the substrate 01 in the opening area 110 of the area a is adsorbed to the surface of the carrying platform, meanwhile, the substrate 01 with the near warping area a is also attached to the carrying platform surface of the substrate 01, and then the control area B, the area C and the area E are controlled to be adjacent to the carrying platform surface of the substrate 01, The airflow adjusting members for the airflow state of the opening area 110 in the areas C, D, and E are opened to perform the suction operation, and the negative pressure values of the opening area 110 in each area need to be kept consistent in order to ensure the stability and flatness of the suction of the substrate 01. Similarly, if the air flow adjusting assembly supplies air to positively blow the substrate 01, the positive pressure blowing effect is the same as the above working process, and the description is omitted here. The above description is about the work flow corresponding to the transportation of the first substrate 011 of the specification 1, and specifically, the second substrate 012 of the specification 2, the third substrate 013 of the specification 3, the fourth substrate 014 of the specification 4, and the fifth substrate 015 of the specification 5 correspond to different work flows, and specifically, the work flow of the substrate 01 of different specifications is shown in table 1.
TABLE 1 working condition table of substrate specification and corresponding region
Figure BDA0003062054630000071
In another embodiment of the present invention, the carrier 100 is divided into different opening areas 110 as follows, and the airflow conditions of the different opening areas 110 are controlled by the airflow adjusting assembly, so as to control the substrates 01 with different specifications. Dividing the carrier table 100 into different opening areas 110 according to requirements, as shown in fig. 5, fig. 5 is a schematic view of the different opening areas 110 on the carrier table 100, and referring to fig. 6, fig. 6 is a schematic view of different gas paths corresponding to the different opening areas 110; the method is described by taking a negative pressure adsorption mode of the airflow adjusting component on the substrate 01 as an example, the AA area is controlled by a single path of air, the BB1 area can be divided into air path areas such as a BB11 area, a BB12 area and a BB13 area … …, the BB2 area can be divided into air path areas such as a BB21 area, a BB22 area and a BB23 area … …, the CC … … area can be divided into air path areas such as a CC … … area, a CC … … area and a CC … … area, the EE … … area can realize independent control of each air hole or unified control of a plurality of air holes according to requirements, the EE … … area and the like, and the EE … … area can be also divided into air path areas such as an EE … … area, an EE area … … and the like; the EE3 area can be divided into an EE31 area, an EE32 area, an EE33 area … … and other air path areas; the EE4 area can be divided into an EE41 area, an EE42 area, an EE43 area … … and other air path areas; the air passages symmetrically arranged on two sides of the AA area can be controlled by the same air flow adjusting component, for example, bb11 and bb21 can be controlled by the same air flow adjusting component, cc11 and cc21 can be controlled by the same air flow adjusting component, ee11, ee21, ee31 and ee41 can be controlled by the same air flow adjusting component, and the air passages can also be controlled by one air flow adjusting component independently.
Specifically, the work flow corresponding to the substrates 01 of different specifications is described, referring to table 2, referring to the specification of the substrate 01 and the corresponding adsorption gas path region, the airflow adjusting component of the opening region 110 in the AA region is first opened until the airflow condition of the opening region 110 in the AA region is stabilized, and then the BB1 region, BB2 region, CC1 region, CC2 region, EE1 region, and EE2 region surrounding the AA region are sequentially started to work. For example, in fig. 7, when the ninth substrate 019 of the adsorption specification 9 is loaded, the airflow adjusting member in the opening area 110 of the AA area is first opened, and after the adsorption of the opening area 110 of the AA area is stabilized, the BB11 gas path in the BB1 area, the BB21 gas path in the BB2 area, the CC11 gas path in the CC1 area, the CC21 gas path in the CC2 area, the EE11 gas path in the EE1 area, the EE21 gas path in the EE2 area, the EE 35 31 gas path in the EE3 area, and the EE41 gas path in the EE4 area are opened; for example, in fig. 8, when the eighth substrate 018 of fixed size 8 is loaded, the AA area opening 111 is fully opened, the BB11 air passage in the BB1 area and the BB21 air passage in the BB2 area are opened, and the remaining air passage areas are all in a closed state; when the seventh substrate 017 with the fixed specification 7 is carried, the AA area opening 111 is fully opened, the CC11 gas path in the CC1 area and the CC21 gas path in the CC2 area are opened, and the rest gas path areas are all in a closed state; for example, in fig. 9, when the sixth substrate 016 of the fixed standard 6 is mounted, all of the AA region openings 111 are opened, and the remaining air passage regions are closed.
In order to ensure the stability and flatness of the suction of the substrate 01, the negative pressure value of the opening area 110 in each area needs to be kept uniform. Similarly, if the airflow adjusting assembly supplies air to perform positive pressure floating on the substrate 01, the positive pressure floating effect is the same as the above working process, and is not described herein again. Specifically, the sixth substrate 016 in the specification 6, the seventh substrate 017 in the specification 7, the eighth substrate 018 in the specification 8, and the ninth substrate 019 in the specification 9 correspond to different work flows, and specifically, the work flow of the substrate 01 in the different specifications is shown in table 2.
TABLE 2 working condition table of substrate specification and corresponding region
Figure BDA0003062054630000081
With continued reference to fig. 2 and 5, each open area 110 has a plurality of open portions 111 therein. The shape of the openings 111 in each opening zone 110 may be distributed in a variety of ways:
in the first embodiment, the openings 111 of each opening area 110 have the same shape. The shape of the opening 111 in each opening area 110 is the same, which is more convenient and saves the process when making the opening 111 on the carrier 100, thereby effectively reducing the cost.
In the second embodiment, the shape of the opening 111 is different in at least two opening regions 110 among the plurality of opening regions 110. Because the substrate 01 is divided into different specifications, when the substrate 01 is partially positioned at the periphery of the middle opening area 110 except the middle opening area 110, in order to make the substrate 01 better adsorb or blow, the air leakage in the peripheral opening area 110 can not form an effective vacuum environment or a blowing and floating environment, and the conveying action of the substrate 01 can not be completed; therefore, the size and shape of the opening 111 of the peripheral opening region 110 are adjusted according to actual needs, and for example, the shape of the opening 111 of the peripheral opening region 110 is appropriately made smaller than the shape of the opening 111 of the middle opening region 110, or the opening is directly designed as a circular hole.
As shown in fig. 10, when the air flow adjustment assembly is specifically provided, the air flow adjustment assembly includes: a plurality of air paths 210 located between the first supporting surface 120 and the second supporting surface 130, where the first supporting surface 120 and the second supporting surface 130 are two opposite surfaces of the carrier 100, that is, the first supporting surface 120 is used for supporting the substrate 01, and the second supporting surface 130 is opposite to the first supporting surface 120; each air path 210 of the plurality of air paths 210 corresponds to a plurality of opening portions 111 of the same opening area 110, and each air path 210 is communicated with the corresponding opening portion 111. Specifically, for example, one air path 210 may correspond to all the openings 111 in one opening area 110, that is, one air path 210 is communicated with all the openings 111 in one opening area 110; for example, one air path 210 may also correspond to a part of the opening 111 in one opening area 110, that is, one air path 210 is communicated with a part of the opening 111 in one opening area 110.
In addition, as shown in fig. 11, fig. 11 is a structural schematic diagram of the airflow adjustment assembly according to the embodiment of the present invention, the airflow adjustment assembly further includes an adjustment valve set, in the air path 210 and the opening 111 corresponding to each other in the same opening area 110, the adjustment valve set 230 is used to control the on-off of different air paths 210, and a pressure gauge 240 and a flow meter 250 are installed on the air path 210 corresponding to different opening areas 110, so that the flow meter 250 and the pressure gauge 240 can monitor the fluid flow and the pressure in the air path 210 at any time, and the gas flow and the pressure in the air path 210 can be conveniently adjusted.
The plurality of air passages 210 between the first support surface 120 and the second support surface 130 converge to the manifold block 220, and the plurality of manifold blocks 220 converge through the manifold block 220.
For better sucking the substrate 01, a larger sucking area is needed, but if the size of the opening 111 is too large, the substrate 01 will be deformed, which affects the flatness of the substrate 01 and thus the working precision of the substrate 01, and to solve this problem, the specific shape of the opening 111 can be selected in the following way:
in the first embodiment, the vent groove is disposed on the first supporting surface 120 of the supporting platform 100; the through hole 111d extends from the first support surface 120 to the air path 210, and one end of the through hole 111d communicates with the vent groove and the other end communicates with the air path 210. For example, the vent groove of the opening 111 may be a groove having a diameter slightly larger than the diameter of the through-hole 111d, or the vent groove of the opening 111 may have a diameter equal to the diameter of the through-hole 111 d.
In the second embodiment, the vent groove is formed on the first supporting surface 120 of the platform 100; the through hole 111d extends from the first support surface 120 to the air path 210, and one end of the through hole 111d communicates with the vent groove and the other end communicates with the air path 210. As shown in fig. 12, the vent groove includes a first vent groove 111a and a second vent groove 111b that are arranged to intersect each other, and the through hole 111d is located at the intersection of the first vent groove 111a and the second vent groove 111 b. For example, the shape of the opening 111 may be "X", the first vent groove 111a and the second vent groove 111b may intersect with each other to form "X", and the through hole 111d may be located at the intersection of the "X". The shape of the opening 111 may be a cross shape, the first ventilation groove 111a and the second ventilation groove 111b may intersect with each other to form a cross shape, and the through hole 111d may be located at the intersection of the cross shapes.
Third, as shown in fig. 13, a vent groove provided on the first support surface 120 of the susceptor 100; the through hole 111d extends from the first support surface 120 to the air path 210, and one end of the through hole 111d communicates with the vent groove and the other end communicates with the air path 210. The vent grooves include a third vent groove 111c, and the third vent groove 111c is shaped like an elongated strip, and specifically, the extending direction of the elongated third vent groove 111c may be set along the width direction or the length direction of the substrate 01.
In a second aspect, an embodiment of the present invention provides a method for controlling a substrate processing platform, including: the specification for bearing the substrate 01 is obtained, the number of the opening areas 110 needing to work is determined according to the specification of the substrate 01, the opening areas 110 correspond to different air flow adjusting assemblies, and the air flow conditions of the opening areas 110 corresponding to the opening areas are independently controlled through the air flow adjusting assemblies so as to select any opening area 110 to work for bearing the substrate 01 with at least two specifications.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

Claims (10)

1. A substrate work platform, comprising:
the bearing platform is used for bearing the substrate and is provided with a plurality of opening areas, and the opening areas are combined randomly to form a bearing area for bearing the substrate with at least two specifications;
and the airflow adjusting component corresponds to the opening area and can independently control the airflow condition of the opening area corresponding to the airflow adjusting component.
2. A substrate handling platform according to claim 1, wherein each of the open areas has a plurality of open portions therein.
3. A substrate work platform according to claim 2, wherein the open portion of each open area is of the same shape.
4. The substrate work platform of claim 2, wherein at least two of the plurality of open areas have different opening shapes.
5. The substrate work platform of claim 1, wherein the carrier has a first support surface to support a substrate and a second support surface disposed opposite the first support surface;
wherein the airflow regulating assembly comprises: and each air path in the plurality of air paths corresponds to a plurality of opening parts of the same opening area, and each air path is communicated with the corresponding opening part.
6. The substrate processing platform of claim 5, wherein the gas flow regulating assembly further comprises a regulating valve set, each set of gas paths and each set of opening portions corresponding to each other in the same opening area are used for controlling the on-off of different gas paths.
7. The substrate handling platform of claim 6, wherein the gas flow conditioning assembly further comprises a gas source.
8. A substrate work platform according to claim 5, wherein the opening comprises: a vent groove arranged on the first supporting surface; and the through hole penetrates from the first supporting surface to the air path, one end of the through hole is communicated with the vent groove, and the other end of the through hole is communicated with the air path.
9. The substrate handling platform of claim 8, wherein the vent channel comprises a first vent channel and a second vent channel disposed in an intersection, the through hole being located at an intersection of the first vent channel and the second vent channel.
10. A method of controlling a substrate work platform, comprising: the specification for bearing the substrate is obtained, the number of the opening areas needing to work is determined according to the specification of the substrate, the opening areas correspond to different airflow adjusting assemblies, and the airflow conditions of the opening areas corresponding to the airflow adjusting assemblies are independently controlled through the airflow adjusting assemblies so as to select any opening area to work for bearing the substrate with at least two specifications.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114799505A (en) * 2022-04-02 2022-07-29 安徽同兴科技发展有限责任公司 Laser cutting machine with panel fixing device

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006068592A (en) * 2004-08-31 2006-03-16 Tokyo Ohka Kogyo Co Ltd Substrate-mounting stage and method for adsorbing or detaching substrate
CN101178543A (en) * 2006-11-08 2008-05-14 大日本网目版制造株式会社 Absorption workbench and base plate treating apparatus
CN102026560A (en) * 2008-03-11 2011-04-20 科福罗有限公司 Method and system for locally controlling support of a flat object
CN104010781A (en) * 2011-11-18 2014-08-27 耐克国际有限公司 Zoned activation manufacturing vacuum tool
CN104570419A (en) * 2014-12-26 2015-04-29 深圳市华星光电技术有限公司 Sucking type carrier and sucking method thereof
CN204391053U (en) * 2014-11-10 2015-06-10 宸圆科技股份有限公司 Flexible vacuum alignment and lamination equipment
CN204868890U (en) * 2015-07-02 2015-12-16 联策科技股份有限公司 High efficiency suction means
CN106711064A (en) * 2015-11-12 2017-05-24 株式会社东芝 Semiconductor manufacturing device
CN107148667A (en) * 2014-10-29 2017-09-08 旭硝子株式会社 The manufacture method of the adsorbent equipment of substrate, the laminating apparatus of substrate and applying method and electronic device
CN107154368A (en) * 2016-03-03 2017-09-12 Ap系统股份有限公司 Quasi-molecule laser annealing device substrate supporting module
JP2017187610A (en) * 2016-04-05 2017-10-12 キヤノン株式会社 Processing apparatus and producing method for product
CN107533965A (en) * 2015-07-10 2018-01-02 东和株式会社 Adsorbing mechanism, adsorption method, manufacture device and manufacture method
CN206927264U (en) * 2017-09-29 2018-01-26 富准精密电子（鹤壁）有限公司 Vacuum cup
CN108364904A (en) * 2018-02-11 2018-08-03 武汉华星光电半导体显示技术有限公司 Vacuum discrete absorption platform
JP2019041002A (en) * 2017-08-25 2019-03-14 株式会社日本製鋼所 Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device
US20190228371A1 (en) * 2018-01-24 2019-07-25 Amazon Technologies, Inc. Robotic item handling using a variable area manipulator
CN209367315U (en) * 2018-10-08 2019-09-10 大族激光科技产业集团股份有限公司 A kind of adsorbing mechanism, adsorbent equipment and carrying apparatus
CN111300467A (en) * 2018-12-11 2020-06-19 耐克创新有限合伙公司 Apparatus and method for picking and positioning items
CN211449358U (en) * 2019-12-18 2020-09-08 山东华滋自动化技术股份有限公司 Combined type sucker structure
CN111993448A (en) * 2019-08-21 2020-11-27 牧今科技 Robotic multi-gripper assembly and method for gripping and holding objects

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006068592A (en) * 2004-08-31 2006-03-16 Tokyo Ohka Kogyo Co Ltd Substrate-mounting stage and method for adsorbing or detaching substrate
CN101178543A (en) * 2006-11-08 2008-05-14 大日本网目版制造株式会社 Absorption workbench and base plate treating apparatus
CN102026560A (en) * 2008-03-11 2011-04-20 科福罗有限公司 Method and system for locally controlling support of a flat object
CN104010781A (en) * 2011-11-18 2014-08-27 耐克国际有限公司 Zoned activation manufacturing vacuum tool
CN107148667A (en) * 2014-10-29 2017-09-08 旭硝子株式会社 The manufacture method of the adsorbent equipment of substrate, the laminating apparatus of substrate and applying method and electronic device
US20170266943A1 (en) * 2014-10-29 2017-09-21 Asahi Glass Company, Limited Substrate suction device, substrate bonding device, substrate bonding method, and electronic device manufacturing method
CN204391053U (en) * 2014-11-10 2015-06-10 宸圆科技股份有限公司 Flexible vacuum alignment and lamination equipment
CN104570419A (en) * 2014-12-26 2015-04-29 深圳市华星光电技术有限公司 Sucking type carrier and sucking method thereof
CN204868890U (en) * 2015-07-02 2015-12-16 联策科技股份有限公司 High efficiency suction means
CN107533965A (en) * 2015-07-10 2018-01-02 东和株式会社 Adsorbing mechanism, adsorption method, manufacture device and manufacture method
CN106711064A (en) * 2015-11-12 2017-05-24 株式会社东芝 Semiconductor manufacturing device
CN107154368A (en) * 2016-03-03 2017-09-12 Ap系统股份有限公司 Quasi-molecule laser annealing device substrate supporting module
JP2017187610A (en) * 2016-04-05 2017-10-12 キヤノン株式会社 Processing apparatus and producing method for product
CN107275269A (en) * 2016-04-05 2017-10-20 佳能株式会社 The manufacture method of processing unit and article
US20200219724A1 (en) * 2017-08-25 2020-07-09 The Japan Steel Works, Ltd. Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
JP2019041002A (en) * 2017-08-25 2019-03-14 株式会社日本製鋼所 Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device
CN206927264U (en) * 2017-09-29 2018-01-26 富准精密电子（鹤壁）有限公司 Vacuum cup
US20190228371A1 (en) * 2018-01-24 2019-07-25 Amazon Technologies, Inc. Robotic item handling using a variable area manipulator
CN108364904A (en) * 2018-02-11 2018-08-03 武汉华星光电半导体显示技术有限公司 Vacuum discrete absorption platform
CN209367315U (en) * 2018-10-08 2019-09-10 大族激光科技产业集团股份有限公司 A kind of adsorbing mechanism, adsorbent equipment and carrying apparatus
CN111300467A (en) * 2018-12-11 2020-06-19 耐克创新有限合伙公司 Apparatus and method for picking and positioning items
CN111993448A (en) * 2019-08-21 2020-11-27 牧今科技 Robotic multi-gripper assembly and method for gripping and holding objects
CN211449358U (en) * 2019-12-18 2020-09-08 山东华滋自动化技术股份有限公司 Combined type sucker structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114799505A (en) * 2022-04-02 2022-07-29 安徽同兴科技发展有限责任公司 Laser cutting machine with panel fixing device

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