KR20100055820A - Apparatus for drying a photoresist layer on a substrate - Google Patents

Abstract

PURPOSE: A device for drying a photoresist film on a substrate is provided to uniformly dry the photoresist film on the substrate by uniformizing a pressure drop rate on the upper space of the substrate. CONSTITUTION: A chamber receives a substrate with a photoresist film and provides a space for a dry process of the photoresist film. A support unit(110) is arranged inside the chamber and supports the substrate in a horizontal direction. A vacuum module(104) forms a vacuum atmosphere inside the chamber to dry the photoresist film. Vacuum pipes are respectively connected to the upper and lower sides of the chamber for connecting the chamber to the vacuum module.

Description

Apparatus for drying a photoresist layer on a substrate

The present invention relates to an apparatus for drying a photoresist film on a substrate. More specifically, the present invention relates to an apparatus for drying a photoresist film formed on a substrate by a coating process using vacuum pressure.

Electrical circuit patterns may be formed on a substrate made of silicon or glass in the manufacture of a flat panel display device or a semiconductor device. The circuit patterns may be formed by performing a series of unit processes such as a deposition process, a photolithography process, an etching process, and a cleaning process.

In particular, the photolithography process includes a coating process for forming a photoresist film on a substrate, a soft bake process for curing the photoresist film, an exposure process for transferring desired patterns on the photoresist film, and developing the photoresist film. The method may include a developing process for forming a photoresist pattern and a hard bake process for curing the photoresist pattern.

Before performing the soft bake process, the solvent included in the photoresist film on the substrate may be partially removed through a vacuum drying process. That is, the photoresist film can be dried to some extent by partially removing the solvent from the photoresist film. This is to make the thickness of the photoresist film uniform in the soft bake process, and to shorten the time required for the soft bake process.

In order to perform the vacuum drying process as described above, a vacuum drying apparatus including a chamber accommodating a substrate and a vacuum module for forming a vacuum atmosphere in the chamber may be used. Here, the vacuum chamber may have holes connected to the vacuum module, and the holes may be mainly provided through the lower panel of the vacuum chamber. That is, the holes may be located below the substrate loaded into the vacuum chamber.

When the vacuum drying process is performed using the vacuum drying apparatus as described above, the airflow may be unstable in the upper space of the substrate because the vacuum holes are positioned below the substrate. Specifically, in the process of evacuating the inside of the vacuum chamber by the vacuum module, the air flow formed in the upper space of the substrate may become unstable. That is, the air flow toward the edge side from the center portion of the substrate may be formed in the upper portion of the substrate, and thus the drying speed between the center portion and the edge portion of the photoresist film on the substrate may vary. This is because the airflow flows from the upper space of the substrate through the edge spaces in the vacuum chamber adjacent to the edge portion of the substrate, and as a result, a wave pattern may be generated in the photoresist film. In addition, since the amount of the solvent removed from the photoresist film may be gradually changed from the center portion of the substrate toward the edge portion, the degree of curing and / or thickness of the substrate may become uneven in a subsequent soft bake process.

An object of the present invention for solving the above problems is to provide an apparatus for drying a photoresist film in which the solvent contained in the photoresist film can be uniformly removed in the process of drying the photoresist film on the substrate.

According to an aspect of the present invention for achieving the above object, the apparatus for drying the photoresist film is a chamber for receiving a substrate on which the photoresist film is formed and providing a space in which a drying process for the photoresist film is performed, and the chamber A support member disposed within and supporting the substrate in a horizontal direction, a vacuum module for forming a vacuum atmosphere inside the chamber for drying the photoresist film, an upper portion of the chamber for connecting the chamber and the vacuum module, and It may include a vacuum pipe respectively connected to the bottom.

According to embodiments of the present invention, the chamber may include a lower chamber and an upper chamber, and the upper chamber may be configured to be movable in a vertical direction for loading and unloading of the substrate.

According to the embodiments of the present invention, at least one lower vacuum hole and at least one upper vacuum hole connected to the vacuum pipes may be formed in each of the lower panel and the upper panel of the chamber. Flow rates exhausted through the upper vacuum holes may be equally adjusted to each other.

According to embodiments of the present disclosure, the drying apparatus may further include a plate disposed to be spaced downward from the upper vacuum hole in the chamber and partially blocking the exhaust flow in the upper space of the substrate.

According to embodiments of the present invention, the drying apparatus may further include a porous plate disposed in a horizontal direction between the upper portion of the chamber and the substrate and having a plurality of holes.

According to embodiments of the present invention, the diameter of the holes formed in the porous plate may gradually increase from the edge portion of the porous plate toward the center portion.

According to embodiments of the present invention, the spacing between the holes formed in the porous plate may gradually decrease from the edge portion of the porous plate toward the center portion.

According to embodiments of the present invention, a plurality of lower vacuum holes may be formed at an edge portion of the lower panel of the chamber, the lower vacuum hole being connected to the vacuum module, and at least a central portion of the upper panel of the chamber connected to the vacuum module. One upper vacuum hole may be formed.

According to embodiments of the present invention, the drying apparatus may further include a purge gas supply unit connected to the chamber and supplying a purge gas for purging the inside of the chamber.

According to another aspect of the present invention for achieving the above object, an apparatus for drying a photoresist film on a substrate includes a chamber for receiving a substrate on which the photoresist film is formed and providing a space in which a drying process for the photoresist film is performed; A support member disposed in the chamber and supporting the substrate in a horizontal direction; a vacuum module connected to an upper portion of the chamber and configured to form a vacuum atmosphere in the chamber to dry the photoresist film; At least one plate disposed between the substrate and partially blocking the air flow formed in the vacuum chamber upwardly.

According to embodiments of the present invention, a plurality of vacuum holes may be formed in the upper panel of the chamber and connected to the vacuum module, and the plurality of plates may be downward from the vacuum holes to partially block the air flow. It may be arranged to be spaced apart.

According to embodiments of the present invention, one plate having the same size as or larger than the substrate may be disposed in the chamber, and a plurality of holes may be formed through the plate.

According to the embodiments of the present invention as described above, a plurality of vacuum holes connected to the vacuum module may be formed in the lower panel and the upper panel of the vacuum chamber, and formed in the upper space of the substrate inside the vacuum chamber One or a number of plates may be disposed below the upper vacuum hole (s) to partially block the exhaust flow being made.

Therefore, the pressure drop speed in the upper space of the substrate can be realized as a whole, and as a result, the photoresist film on the substrate can be dried uniformly as a whole.

The invention is now described in more detail with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.

When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Similar reference numerals will be used throughout for similar elements, and the term “and / or” includes any one or more combinations of related items.

Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not. These terms are only used to distinguish one element from another. Accordingly, the first element, composition, region, layer or portion described below may be represented by the second element, composition, region, layer or portion without departing from the scope of the invention.

Spatially relative terms such as "bottom" or "bottom" and "top" or "top" may be used to describe the relationship of one element to other elements as described in the figures. Can be. Relative terms may include other orientations of the device in addition to the orientation shown in the figures. For example, if the device is reversed in one of the figures, the elements described as being on the lower side of the other elements will be tailored to being on the upper side of the other elements. Thus, the typical term "bottom" may include both "bottom" and "top" orientations for a particular orientation in the figures. Similarly, if the device is reversed in one of the figures, the elements described as "below" or "below" of the other elements will be fitted "above" of the other elements. Thus, a typical term "below" or "below" may encompass both orientations of "below" and "above."

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used below, what is shown in the singular also includes the plural unless specifically indicated otherwise. In addition, where the terms “comprises” and / or “comprising” are used, they are characterized by the presence of the forms, regions, integrals, steps, actions, elements and / or components mentioned. It is not intended to exclude the addition of one or more other forms, regions, integrals, steps, actions, elements, components, and / or groups.

Unless defined otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and description of the invention, and ideally or excessively intuitional unless otherwise specified. It will not be interpreted.

Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not to be described as limited to the particular shapes of the areas described as the illustrations but to include deviations in the shapes. For example, a region described as flat may generally have roughness and / or nonlinear shapes. Also, the sharp edges described as illustrations may be rounded. Accordingly, the regions described in the figures are entirely schematic and their shapes are not intended to describe the precise shape of the regions nor are they intended to limit the scope of the invention.

1 is a schematic diagram illustrating a drying apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the drying apparatus 100 according to an embodiment of the present invention may be used to dry the photoresist film 20 on the substrate 10. In particular, a photoresist film 20 may be formed on a glass or silicon substrate 10 used for manufacturing a flat panel display device or a semiconductor device through a coating process, and the photoresist film 20 may be soft baked. It may be partially dried before passing through. That is, a vacuum drying process using vacuum pressure may be performed to remove a part of the solvent included in the photoresist film 20.

The drying apparatus 100 may include a vacuum chamber 102 and a vacuum module 104. The vacuum chamber 102 may provide a space in which the vacuum drying process is performed, and a support member 110 for supporting the substrate 10 in a horizontal direction may be disposed inside the vacuum chamber 102. Can be. As an example, multiple pins may be used as the support member 110. The support member 110 may be configured to be movable in a vertical direction for loading and unloading of the substrate 10.

The vacuum chamber 102 may include a lower chamber 112 and an upper chamber 114, and the upper chamber 114 may be configured to be movable in a vertical direction for loading and unloading of the substrate 10. Can be.

For example, the upper chamber 114 may include an upper panel 114a and an upper sidewall 114b extending downward from an edge portion of the upper panel 114a, and vertical of the upper chamber 114. The vertical driver 116 for directional movement may be connected to the upper chamber 114. The vertical driving unit 116 may be a driving device including a hydraulic or pneumatic cylinder or a linear motion guide and a motor and a ball screw mechanism.

As shown, although the hydraulic or pneumatic cylinder as the vertical drive unit 116 is connected to the upper panel 114a, the connection relationship between the vertical drive unit 116 and the upper chamber 114 and the vertical drive unit 116 The scope of the present invention will not be limited by the configuration and the like.

The lower chamber 112 may include a lower panel 112a. As shown, one panel is used as the lower chamber 112, but the lower chamber 112 may further include a lower sidewall similar to the upper chamber 114.

In addition, a sealing member 118 may be disposed between the lower chamber 112 and the upper chamber 114 to isolate the vacuum chamber 102 from the outside during the vacuum drying process. As the sealing member 118, an o-ring or various types of sealing members may be used.

The vacuum module 104 may form a vacuum atmosphere in the vacuum chamber 102 to volatilize the solvent from the photoresist film 20. The vacuum module 104 may be connected to the vacuum chamber 102 through vacuum pipes, and although not shown, may include a vacuum pump, a pressure sensor, a pressure control valve, and the like.

The vacuum pipes may include a lower vacuum pipe 106 connected to the lower chamber 112 and an upper vacuum pipe 108 connected to the upper chamber 114, and the lower panel of the vacuum chamber 102. It may be connected to 112a and top panel 114a, respectively.

Lower vacuum holes 112b connected to the upper and lower vacuum pipes 106 and 108 in the lower panel 112a of the lower chamber 112 and the upper panel 114a of the upper chamber 114, respectively. And upper vacuum holes 114c may be formed. Alternatively, one lower vacuum hole and one upper vacuum hole may be formed in the lower panel 112a of the lower chamber 112 and the upper panel 114a of the upper chamber 114, respectively.

When a vacuum atmosphere is formed in the vacuum chamber 102 by the vacuum module 104, air flow such as arrows shown in the vacuum chamber 102 may be generated. At this time, it is preferable that the flow rates exhausted through the lower vacuum pipe 106 and the upper vacuum pipe 108 are substantially the same as each other.

When the displacement through the lower vacuum pipe 106 and the displacement through the upper vacuum pipe 108 are different from each other, a wave pattern may be generated in the photoresist film 20 on the substrate 10. Specifically, the pressure drop speed in the space adjacent to the edge portion of the substrate 10 and the pressure drop speed in the space adjacent to the central portion of the substrate 10 may be different from each other, and thus, on the substrate 10 A wave pattern may be generated in the photoresist film 20. That is, the amount of solvent removed from the photoresist film 20 may be gradually changed from the central portion of the photoresist film 20 toward the edge portion.

In particular, when the discharge amount through the upper vacuum pipe 108 is larger than the discharge amount through the lower vacuum pipe 106, the substrate 10 may be supported by an airflow formed in the chamber 102. In this case, the photoresist film 20 on the substrate 10 may be largely damaged.

The purge gas supply unit 120 may be connected to the lower panel 112a of the lower chamber 112 to supply the purge gas into the vacuum chamber 102. In particular, the purge gas supply unit 120 may be connected to the vacuum chamber 102 through the gas supply holes 112c and the gas supply pipe 122 formed in the lower panel 112a.

As the purge gas, an inert gas such as nitrogen, argon, or purified air may be used. The purge gas may be supplied to control the pressure inside the vacuum chamber 102 and remove the volatilized solvent remaining in the vacuum chamber 102 after the vacuum drying process is completed. As shown, although a plurality of purge gas supply holes 112c are formed in the lower chamber 112, the present invention is not limited by the quantity and positional relationship of the purge gas supply holes 112c. will be.

Meanwhile, the vacuum module 104 may be connected only to the upper panel 114a of the upper chamber 114. That is, the drying quality of the photoresist film 20 on the substrate 10 may be improved by blocking vacuum exhaust through the lower panel 112a of the lower chamber 112. In this case, during the vacuum evacuation by the vacuum module 104, it is preferable to adjust the vacuum atmosphere formation time so that the substrate 10 is not supported by the pressure change or the airflow formation inside the vacuum chamber 102. desirable. Further, by disposing the plates 230 shown in FIG. 2, the plate 330 shown in FIG. 3, and the porous plate 430 shown in FIG. 4 between the upper panel 114a and the substrate 10. It is also possible to implement a constant pressure drop or airflow formation throughout the vacuum chamber 102.

2 is a schematic diagram illustrating a drying apparatus according to another embodiment of the present invention.

Referring to FIG. 2, a drying apparatus 200 according to another embodiment of the present invention may be used to dry the photoresist film 20 on the substrate 10.

The drying apparatus 200 may include a vacuum chamber 202 and a vacuum module 204. The vacuum chamber 202 may include a lower chamber 212 and an upper chamber 214, and the vacuum module 204 may be connected to the vacuum chamber (202) through the lower vacuum pipe 206 and the upper vacuum pipe 208. 202 may be connected. The lower chamber 212 and the upper chamber 214 may have a plurality of lower vacuum holes 212a and a plurality of upper vacuum holes 214a, respectively. Since the vacuum chamber 202 and the vacuum module 204 are the same as or similar to those described above with reference to FIG. 1, further detailed description thereof will be omitted.

In the vacuum chamber 202, plates 230 for adjusting the air flow in the vacuum chamber 202 may be disposed while the vacuum drying process by the vacuum module 204 is performed. The plates 230 may control the air flow in the vacuum chamber 202 so that the pressure drop speed may be uniform in the space in the vacuum chamber 202.

The plates 230 may be spaced downward from the upper vacuum holes 214a and partially block the exhaust flow through the upper vacuum holes 214. That is, the pressure drop speed can be made constant in the upper space of the substrate 10 by not forming a direct upward air flow toward the upper vacuum holes 214, and thus the photoresist film on the substrate 10. It is possible to allow the 20 to be dried uniformly. At this time, it is preferable that the flow rates exhausted through the lower vacuum pipe 206 and the upper vacuum pipe 208 are substantially the same.

According to another embodiment of the present invention, although not shown, a plurality of holes may be formed in the plates 230. By the holes, air flow through the upper vacuum holes 214a may be more stably formed.

3 is a schematic diagram illustrating a drying apparatus according to another embodiment of the present invention.

Referring to FIG. 3, a drying apparatus 300 according to another embodiment of the present invention may be used to dry the photoresist film 20 on the substrate 10.

The drying apparatus 300 may include a vacuum chamber 302 and a vacuum module 304. The vacuum chamber 302 may include a lower chamber 312 and an upper chamber 314, and the vacuum module 304 may include the vacuum chamber (308) through the lower vacuum pipe 306 and the upper vacuum pipe 308. 302 may be connected.

A plurality of lower vacuum holes 312b may be formed in the lower panel 312a of the lower chamber 312 so as to correspond to edge portions of the substrate 10, and the upper panel 314a of the upper chamber 314. ), One upper vacuum hole 314b may be formed to correspond to the central portion of the substrate 10. Alternatively, a plurality of vacuum holes may be formed in the central portion of the upper panel 314a of the upper chamber 314.

The arrangement of the lower vacuum holes 312b and the upper vacuum hole 314b as described above is for forming an air flow such that the pressure drop speed is constant in the upper space of the substrate 10. That is, since the downstream airflow may be formed in the space adjacent to the edge portion of the substrate 10, in the space adjacent to the central portion of the substrate 10, the upstream airflow is formed to be opposite to the downward airflow. The velocity of the pressure drop in the upper space of) can be made constant throughout.

In the vacuum chamber 302, the upper air stream is partially blocked so that the upper air stream is not directly formed toward the upper vacuum hole 314b during the vacuum drying process by the vacuum module 304. The plate 330 may be disposed.

According to another embodiment of the present invention, although not shown, a plurality of holes may be formed in the plate 330. By the holes, the air flow through the upper vacuum hole 314b may be more stably formed.

4 is a schematic diagram illustrating a drying apparatus according to another embodiment of the present invention.

Referring to FIG. 4, a drying apparatus 400 according to another embodiment of the present invention may be used to dry the photoresist film 20 on the substrate 10.

The drying apparatus 400 may include a vacuum chamber 402 and a vacuum module 404. The vacuum chamber 402 may include a lower chamber 412 and an upper chamber 414, and the vacuum module 404 may be connected to the vacuum chamber through the lower vacuum pipe 406 and the upper vacuum pipe 408. 402 may be connected. The lower chamber 412 and the upper chamber 414 may have a plurality of lower vacuum holes 412a and a plurality of upper vacuum holes 414a, respectively. Since the vacuum chamber 402 and the vacuum module 404 are the same as or similar to those described above with reference to FIG. 1, further detailed description thereof will be omitted.

In the vacuum chamber 402, a porous plate 430 having a plurality of holes 432 for regulating air flow in the vacuum chamber 402 during the vacuum drying process by the vacuum module 404. Can be arranged. In particular, the porous plate 430 may be disposed between the upper panel 414b of the upper chamber 414 and the substrate 10, the same size as or larger than the substrate 10. It can have That is, the airflow in the upper space of the substrate 10 may be formed through the holes 432 of the porous plate 430, so that the pressure drop speed in the upper space of the substrate 10 is uniform throughout. Can be formed. As a result, the drying speed of the photoresist film 20 on the substrate 10 may be uniform throughout.

On the other hand, as shown in the upper panel 414b of the upper chamber 414, a plurality of upper vacuum holes 414a are shown. However, one upper vacuum hole may be formed in the central portion of the upper panel 414b of the upper chamber 414. In addition, a plurality of upper vacuum holes may be centrally formed at a central portion of the upper panel 414b of the upper chamber 414.

5 and 6 are cross-sectional views for describing other examples of the porous plate illustrated in FIG. 4.

Referring to FIG. 5, the holes 532 formed in the porous plate 530 may have a diameter that gradually increases from the edge portion of the porous plate 530 toward the center portion. This is to allow a relatively larger upward air flow to be formed through the central portion of the porous plate 530. In other words, since a downward air flow toward the lower vacuum pipe 406 is formed at the edge portion of the substrate 10, the upper space of the substrate 10 is increased by increasing the upward air flow through the central portion of the porous plate 530. It is possible to keep the pressure drop speed constant throughout.

The perforated plate 630 shown in FIG. 6 may have a plurality of holes 632 having a constant diameter, and the spacing between the holes 632 gradually increases from the edge portion of the perforated plate 630 toward the center portion. Can be reduced. This is to allow the upward air flow through the central portion of the porous plate 630 to be relatively larger in order to maintain a constant pressure drop speed in the upper space of the substrate 10.

According to the embodiments of the present invention as described above, a plurality of vacuum holes for evacuating the inside of the vacuum chamber may be formed in the lower panel and the upper panel of the vacuum chamber, the upper portion of the substrate in the vacuum chamber One or more plates may be arranged to partially block the upward airflow formed in the space.

Therefore, the pressure drop speed of the upper space of the substrate in the vacuum chamber can be realized as a whole as a whole, and as a result, the photoresist film on the substrate can be dried uniformly as a whole.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

1 is a schematic diagram illustrating a drying apparatus according to an embodiment of the present invention.

2 is a schematic diagram illustrating a drying apparatus according to another embodiment of the present invention.

3 is a schematic diagram illustrating a drying apparatus according to another embodiment of the present invention.

4 is a schematic diagram illustrating a drying apparatus according to another embodiment of the present invention.

5 and 6 are cross-sectional views for describing other examples of the porous plate illustrated in FIG. 4.

Explanation of symbols on the main parts of the drawings

10 substrate 20 photoresist film

100: vacuum drying device 102: vacuum chamber

104: vacuum module 106: lower vacuum pipe

108: upper vacuum pipe 110: support member

112: lower chamber 114: upper chamber

116 vertical drive portion 118 sealing member

120: gas provider

Claims (12)

A chamber accommodating a substrate on which a photoresist film is formed and providing a space in which a drying process for the photoresist film is performed; A support member disposed in the chamber and supporting the substrate in a horizontal direction; A vacuum module for forming a vacuum atmosphere in the chamber to dry the photoresist film; And Drying apparatus of the photoresist film, characterized in that it comprises a vacuum pipe connected to the upper and lower portions of the chamber to connect the chamber and the vacuum module, respectively. The drying apparatus of claim 1, wherein the chamber comprises a lower chamber and an upper chamber, and the upper chamber is configured to be movable in a vertical direction for loading and unloading of the substrate. According to claim 1, wherein the lower panel and the upper panel of each of the chamber is formed with at least one lower vacuum hole and at least one upper vacuum hole connected to the vacuum pipes, the lower vacuum hole and the upper vacuum hole Drying apparatus, characterized in that the flow rate is exhausted through each other. The drying apparatus of claim 3, further comprising a plate disposed downwardly from the upper vacuum hole in the chamber and partially blocking the exhaust flow in the upper space of the substrate. The drying apparatus according to claim 1, further comprising a porous plate disposed in a horizontal direction between the upper portion of the chamber and the substrate and having a plurality of holes. The drying apparatus according to claim 5, wherein a diameter of the holes formed in the porous plate gradually increases from the edge portion of the porous plate toward the center portion. The drying apparatus according to claim 5, wherein the distance between the holes formed in the porous plate gradually decreases from the edge portion of the porous plate toward the center portion. The vacuum cleaner of claim 1, wherein a plurality of lower vacuum holes are formed at edges of the lower panel of the chamber and connected to the vacuum module, and at least one upper vacuum connected to the vacuum module is formed at a central portion of the upper panel of the chamber. Drying apparatus characterized in that the hole is formed. The drying apparatus of claim 1, further comprising a purge gas supply unit connected to the chamber and supplying a purge gas for purging the inside of the chamber. A chamber accommodating a substrate on which a photoresist film is formed and providing a space in which a drying process for the photoresist film is performed; A support member disposed in the chamber and supporting the substrate in a horizontal direction; A vacuum module connected to an upper portion of the chamber and configured to form a vacuum atmosphere inside the chamber to dry the photoresist film; And And at least one plate disposed between the upper portion of the chamber and the substrate and partially blocking the air flow upwardly formed in the vacuum chamber. The method of claim 10, wherein a plurality of vacuum holes are formed in the upper panel of the chamber connected to the vacuum module, the plurality of plates are arranged to be spaced downward from the vacuum holes to partially block the air flow. Drying apparatus characterized by the above-mentioned. The drying apparatus according to claim 10, wherein one plate having a size equal to or larger than the substrate is disposed in the chamber, and a plurality of holes are formed through the plate.

Images