CN113387132B - Substrate operation platform and control method thereof - Google Patents
Substrate operation platform and control method thereof Download PDFInfo
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- CN113387132B CN113387132B CN202110517204.2A CN202110517204A CN113387132B CN 113387132 B CN113387132 B CN 113387132B CN 202110517204 A CN202110517204 A CN 202110517204A CN 113387132 B CN113387132 B CN 113387132B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G35/00—Mechanical conveyors not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Abstract
The invention relates to the field of semiconductors, and discloses a substrate operation platform and a control method of the substrate operation platform, wherein the substrate operation platform comprises the following components: the bearing table is used for bearing the substrate and is provided with a plurality of opening areas, and the opening areas are arbitrarily combined to form bearing areas for bearing at least two specifications of substrates; and the airflow adjusting assembly is corresponding to the opening area and can independently control the airflow condition of the opening area corresponding to the airflow adjusting assembly. The substrate conveying device is used for conveying substrates of different specifications and solving the problem that the substrates are warped in the conveying process.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a substrate working platform and a control method for the substrate working platform.
Background
When the existing liquid crystal industry and the semiconductor industry carry the substrate 01', a substrate 01' carrying device is used; the substrate 01 'carrying device can only correspond to substrates 01' with one size, and along with the adjustment of industrial structures in the semiconductor industry, the update iteration speed of the substrates 01 'is increased, so that substrates 01' with different sizes need to be produced, and most of the conventional substrate 01 'carrying devices cannot correspond to carrying of substrates 01' with various sizes.
And with the development of technology, the flatness requirement on the substrate 01' is higher and higher, the substrate 01' cannot be corrected in the prior art, and the problem of warping of the substrate 01' is solved, because of the particularity of the warped substrate 01', when the substrate 01' is transported by using a single air path, referring to fig. 1, when the periphery of the substrate 01' is in a warped state, and when negative pressure adsorption is performed, the substrate 01' cannot be adsorbed to the bearing table 100' bearing the substrate 01', and the substrate 01' is always in a warped state, so that the quality of the substrate 01' is affected.
Disclosure of Invention
The invention discloses a substrate operation platform and a control method of the substrate operation platform, which are used for realizing bearing and adsorption fixation of substrates with different specifications and solving the problem of warping of the substrates in the conveying process.
In order to achieve the above purpose, the present invention provides the following technical solutions:
in a first aspect, the present invention provides a substrate work platform, comprising:
the bearing table is used for bearing the substrate and is provided with a plurality of opening areas, and the opening areas are arbitrarily combined to form bearing areas for bearing at least two specifications of substrates;
and the airflow adjusting assembly is corresponding to the opening area and can independently control the airflow condition of the opening area corresponding to the airflow adjusting assembly.
The bearing table for bearing the substrate is divided into a plurality of opening areas, the bearing areas for bearing at least two types of substrates are formed in any combination in the plurality of opening areas, the bearing areas are used for bearing and adsorbing and fixing the substrates with different specifications, the airflow conditions of the opening areas are controlled through airflow adjusting assemblies, the airflow adjusting assemblies are arranged corresponding to the opening areas, namely one group of airflow adjusting assemblies corresponds to one opening area, or one group of airflow adjusting assemblies corresponds to two opening areas, the specific arrangement mode is that only two groups of airflow adjusting assemblies are arranged in the plurality of opening areas in the bearing area to control, and at the moment, different opening areas in the bearing area work with time difference, so that when the substrates warp, the different opening areas are controlled to work through different airflow adjusting assemblies. When the problem of the warp substrate is solved, firstly, the opening area of the middle area corresponding to the substrate is controlled, after the air flow condition of the opening area of the middle area is stabilized, according to the Bernoulli equation, the pressure of the substrate on the side facing the bearing table is smaller than the pressure of the substrate on the side away from the bearing table, so that the warp substrate is flattened, then, according to the requirement, other opening areas adjacent to the middle area are controlled to work through the air flow adjusting component, so that the air leakage of other opening areas adjacent to the middle area is avoided, the air flow condition in the bearing area formed in the mode is more stable, and the air flow condition of the opening area adjacent to the middle area can be controlled according to the warp degree of the substrate, so that the warp problem of the substrate is effectively solved.
Optionally, each of the opening areas has a plurality of opening portions therein.
Optionally, the shape of the opening of each opening area is the same.
Optionally, the shape of the opening of at least two of the plurality of opening areas is different.
Optionally, the bearing table is provided with a first supporting surface for supporting the substrate and a second supporting surface opposite to the first supporting surface;
wherein the airflow adjustment assembly comprises: and each air passage is positioned between the first supporting surface and the second supporting surface, corresponds to a plurality of opening parts of the same opening area, and is communicated with the corresponding opening part.
Optionally, the air flow adjusting assembly further comprises an adjusting valve group, and the adjusting valve group is used for controlling on-off of different air paths in each group of air paths and opening parts which correspond to each other in the same opening area.
Optionally, the air flow regulating assembly further comprises an air source.
Optionally, the opening portion includes: a vent groove provided in the first support surface; and one end of the through hole is communicated with the ventilation groove, and the other end of the through hole is communicated with the air channel.
Optionally, the vent grooves include a first vent groove and a second vent groove that are disposed in a crossing manner, and the through hole is located at a crossing point of the first vent groove and the second vent groove.
In a second aspect, the present invention provides a method for controlling a substrate working platform, including: the method comprises the steps of obtaining a specification for carrying a substrate, determining the number of required work in an opening area according to the specification of the substrate, wherein the opening area corresponds to different airflow adjusting assemblies, and independently controlling the airflow condition of the opening area corresponding to the opening area through the airflow adjusting assemblies so as to select any opening area to work for carrying the substrate with at least two specifications.
Drawings
FIG. 1 is a schematic diagram showing a state of a substrate being adsorbed in the prior art;
FIG. 2 is a schematic view of a region distribution of a substrate processing platform according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a state of a substrate operation platform according to an embodiment of the present invention when the substrate is adsorbed;
fig. 4 is a schematic structural diagram of a substrate with different specifications corresponding to a substrate operation platform according to an embodiment of the present invention;
FIG. 5 is a schematic view of a region distribution of another substrate processing platform according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of different gas paths in different areas of another substrate processing platform according to an embodiment of the present invention;
fig. 7 to fig. 9 are schematic structural diagrams of different specifications of substrates corresponding to another substrate operation platform according to an embodiment of the present invention;
FIG. 10 is a partial cross-sectional view of FIG. 2;
FIG. 11 is a schematic view of an airflow adjusting assembly according to an embodiment of the present invention;
FIG. 12 is a schematic view of an opening according to an embodiment of the present invention;
fig. 13 is a schematic view of another structure of an opening portion according to an embodiment of the present invention.
In the figure: 01-a substrate; 01' -substrate; 011-a first substrate; 012-a second substrate; 013-a third substrate; 014—a fourth substrate; 015-a fifth substrate; 016-a sixth substrate; 017-a seventh substrate; 018-eighth substrate; 019-a ninth substrate; 100-bearing table; a 100' -loading table; 110-an opening region; 111-opening portions; 111 a-a first vent slot; 111 b-a second venting slot; 111 c-a third vent groove; 111 d-through holes; 120-a first support surface; 130-a second support surface; 210-gas circuit; 220-manifold block; 230-adjusting a valve group; 240-manometer; 250-flowmeter; 260-gas source.
Detailed Description
The following description of the embodiments of the present invention will be made with reference to the accompanying drawings, in which it is evident that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 2, an embodiment of the present invention provides a substrate working platform, including:
a carrying platform 100 for carrying the substrate 01, wherein the carrying platform 100 is provided with a plurality of opening areas 110, and the opening areas 110 are arbitrarily combined to form a carrying area for carrying at least two specifications of substrates 01;
an air flow regulating assembly corresponding to the open area 110, the air flow regulating assembly can individually control the air flow condition of the open area 110 corresponding thereto.
The bearing platform 100 for bearing the substrate 01 is divided into a plurality of opening areas 110, the bearing areas for bearing at least two specifications of substrates 01 are formed in any combination in the plurality of opening areas 110, the airflow conditions of the opening areas 110 are controlled by airflow adjusting components, the airflow adjusting components are arranged corresponding to the opening areas 110, namely one group of airflow adjusting components corresponds to one opening area 110, or one group of airflow adjusting components corresponds to two opening areas 110, the specific arrangement mode is that only two groups of airflow adjusting components are controlled in a plurality of opening areas 110 in the bearing area, and at the moment, different opening areas 110 in the bearing area work with time difference, so that when the substrate 01 warps, the different opening areas 110 are controlled to work by different airflow adjusting components. When the problem of warping the substrate 01 is solved, firstly, the opening area 110 of the middle area corresponding to the substrate 01 is controlled until the air flow condition of the opening area 110 of the middle area is stable, according to the Bernoulli equation, the pressure on the side of the substrate 01 facing the bearing table 100 is smaller than the pressure on the side of the substrate 01 facing away from the bearing table 100, so that the warp substrate 01 is flattened, then, other opening areas 110 adjacent to the middle area are controlled to work according to requirements through the air flow adjusting assembly, so that air leakage of other opening areas 110 adjacent to the middle area is avoided, and therefore, the air flow condition in the bearing area formed in the mode is more stable, and the air flow condition of the opening area 110 adjacent to the middle area can be controlled according to the warp degree of the substrate 01, so that the problem of warping of the substrate 01 is effectively solved.
Of course, when the airflow adjusting assembly is specifically arranged, the airflow adjusting assembly can provide vacuum to perform negative pressure adsorption on the substrate 01, for example, the airflow adjusting assembly also comprises a vacuum pump and other devices to form a vacuum environment, or can supply air to perform positive pressure blowing and floating on the substrate 01, for example, a blower or a compressed air source and other devices are used to perform positive pressure blowing and floating on the substrate 01; specifically, the air source 260 is used for providing air flow for the vacuum pump and the blower, or the air source 260 comprises a positive air source and a negative air source, and the positive air source and the negative air source are switched through an electromagnetic valve (positive and negative switching actions are performed according to the requirement).
As shown in fig. 3, the mode of negative pressure adsorption is taken as an example for the substrate 01 by the airflow adjusting assembly, when the substrate 01 is warped, the stress conditions of the point a and the point B are analyzed, the point a is located at one side of the substrate 01 facing the bearing table 100, the point B is located at the other side of the substrate 01 facing away from the bearing table 100, and the pressure of the point a is assumed to be P 1 The airflow rate provided by the airflow adjusting assembly is v 1 The height is h 1 The method comprises the steps of carrying out a first treatment on the surface of the The pressure at point B is P 2 The flow velocity of the air flow is v 2 The height is h 2 . From Bernoulli equation P+1/2ρv 2 +ρgh=c (where P is the pressure at a certain point in the fluid, v is the flow rate at that point of the fluid, ρ is the fluid density, g is the gravitational acceleration, h is the height at which that point is located, and C is a constant), and the sucking-up action on the substrate 01 can be achieved by changing the adsorption flow rate according to the difference of the glass warpage. According to the bernoulli equation: p (P) 1 +1/2ρv 1 2 +ρ gh 1 ＝P 2 +1/2ρv 2 2 +ρgh 2 The method comprises the steps of carrying out a first treatment on the surface of the Because the A point and the B point are only different by the thickness of the substrate 01, the method approximates h 1 ＝h 2 The air density of the points A and B is the same, then P 1 +1/2ρv 1 2 ＝P 2 +1/2ρv 2 2 . V under normal conditions 1 ＝v 2 When the vacuum adsorption is started in the A point area, v is 1 >v 2 =0, from equation, P can be obtained 1 <P 2 Therefore, the substrate 01 is attached to the stage 100 by the atmospheric pressure, and the warped substrate 01 is flattened. If the air flow adjusting assembly is used for supplying air to perform positive pressure blowing floating on the substrate 01, the positive pressure blowing floating can generate an upward acting force on the glass according to the common knowledge of relevant mechanics, and the glass is floated, and the description is omitted here.
In one embodiment of the present invention, the susceptor 100 is divided into different opening areas 110 in the following manner, and the airflow conditions of the different opening areas 110 are controlled by the airflow adjusting assembly, so as to control the substrates 01 with different specifications. As shown in fig. 4, fig. 4 is a schematic view of a substrate 01 with different specifications placed on the stage 100, and referring to fig. 2, fig. 2 is a schematic view of different opening areas 110 on the stage 100. For example, in the case of carrying the first substrate 011 with the fixed specification 1, the air flow adjusting assembly is first opened to control the air flow adjusting assembly in the a region, after the adsorption of the opening region 110 in the a region is stabilized, then the opening regions 110 around the B region and the C region around the a region are sequentially operated, then the air flow adjusting assemblies around the B region, the C region, the D region and the E region are sequentially operated, the air flow adjusting assemblies are controlled to control the different opening regions 110 in a manner of gradually adsorbing from the middle to the periphery, so that an adsorption environment is formed in the middle region, namely the opening region 110 in the a region, the substrate 01 in the opening region 110 in the a region is adsorbed to the surface of the carrying platform, and meanwhile, the substrate 01 close to the warpage in the a region is attached to the carrying platform surface of the substrate 01, and then the air flow adjusting assemblies around the opening regions 110 in the B region, the C region, the D region and the E region are sequentially opened to perform adsorption actions, so that the adsorption stability and the flatness of the substrate 01 are ensured, and the negative pressure values of the opening regions 110 in the regions need to be kept consistent. Similarly, if the airflow adjusting assembly is used for supplying air to perform positive pressure air-blowing on the substrate 01, the positive pressure air-blowing effect is the same as that of the working process, and the description is omitted here. The above description is directed to the first substrate 011 of the specification 1 carrying the corresponding workflow, and specifically, the second substrate 012 of the specification 2, the third substrate 013 of the specification 3, the fourth substrate 014 of the specification 4 and the fifth substrate 015 of the specification 5 correspond to different workflows, and the workflows of the different specification substrates 01 are shown in table 1.
TABLE 1 operating State Table for substrate Specifications and corresponding regions
In another embodiment of the present invention, the susceptor 100 is divided into different opening areas 110 in the following manner, and the airflow conditions of the different opening areas 110 are controlled by the airflow adjusting assembly, so as to control the substrates 01 with different specifications. According to the requirements, the carrying platform 100 is divided into different opening areas 110, as shown in fig. 5, fig. 5 is a schematic diagram of the different opening areas 110 on the carrying platform 100, and referring to fig. 6, fig. 6 is a schematic diagram of different air paths corresponding to the different opening areas 110; taking an air flow adjusting component to describe a negative pressure adsorption mode of the substrate 01 as an example, an AA area is used for controlling an independent air channel, a BB1 area can be divided into an air channel area such as an BB11 area, an BB12 area, an BB13 area … … area and the like, a BB2 area can be divided into an air channel area such as an BB21 area, an BB22 area, an BB23 area … … and the like, a CC1 area can be divided into an air channel area such as a CC11 area, a CC12 area, a CC13 area … … and the like, a CC2 area can be divided into an air channel area such as a CC21 area, a CC22 area, a CC23 area … … and the like, an EE1 area can realize independent control of each air hole or unified control of a plurality of air holes according to requirements, and can be divided into an EE11 area, an EE12 area, an EE13 area … … and the like, and an EE2 area can be equally divided into an EE21 area, an EE22 area … … and the like; the EE3 zone can be divided into an EE31 zone, an EE32 zone, an EE33 zone … … and other gas circuit zones; the EE4 zone can be divided into an EE41 zone, an EE42 zone, an EE43 zone … … zone and other gas circuit zones; the air paths symmetrically arranged at two sides of the AA area can be controlled by the same air flow regulating component, for example, bb11 and bb21 can be controlled by the same air flow regulating component, cc11 and cc21 can be controlled by the same air flow regulating component, ee11, ee21, ee31 and ee41 can be controlled by the same air flow regulating component, and the air paths can be independently controlled by the same air flow regulating component.
Specifically, describing the working flow corresponding to the substrate 01 with different specifications, referring to the substrate 01 specification and the corresponding adsorption gas path region in table 2, firstly, the gas flow adjusting component of the opening area 110 of the AA area is opened, after the gas flow condition of the opening area 110 of the AA area is stabilized, then the BB1 area, BB2 area, CC1 area, CC2 area, EE1 area and EE2 area surrounding the AA area are sequentially started to work. For example, in fig. 7, when carrying the ninth substrate 019 of the adsorption specification 9, firstly, the airflow adjusting component of the opening area 110 of the AA area is opened, and after the adsorption of the opening area 110 of the AA area is stabilized, the BB11 air channel in the BB1 area, the BB21 air channel in the BB2 area, the CC11 air channel in the CC1 area, the CC21 air channel in the CC2 area, the EE11 air channel in the EE1 area, the EE21 air channel in the EE2 area, the EE31 air channel in the EE3 area and the EE41 air channel in the EE4 area are opened; for example, in fig. 8, when the eighth substrate 018 of fixed size 8 is carried, the AA area opening 111 is fully opened, the BB11 air path in the BB1 area and the BB21 air path in the BB2 area are opened, and the rest air path areas are all required to be closed; when the seventh substrate 017 with the fixed specification 7 is carried, all the opening 111 of the AA area is opened, the CC11 air passage in the CC1 area and the CC21 air passage in the CC2 area are opened, and the rest air passage areas are all required to be in a closed state; for example, in fig. 9, when the sixth substrate 016 of fixed standard 6 is carried, all the AA area openings 111 are opened, and the rest of the air passage area is required to be closed.
In order to ensure the stability and flatness of the adsorption of the substrate 01, the negative pressure value of the opening region 110 in each region needs to be kept uniform. Similarly, if the air flow adjusting assembly is used for supplying air to perform positive pressure air-floating on the substrate 01, the positive pressure air-floating effect is the same as that of the working process, and the description is omitted here. Specifically, the sixth substrate 016 of the specification 6, the seventh substrate 017 of the specification 7, the eighth substrate 018 of the specification 8, and the ninth substrate 019 of the specification 9 correspond to different workflows, respectively, and the workflows of the substrates 01 of different specifications are shown in table 2.
TABLE 2 operating State Table for substrate Specifications and corresponding regions
With continued reference to fig. 2 and 5, each of the open areas 110 has a plurality of openings 111 therein. The shape of the opening 111 in each opening region 110 may be distributed in a variety of ways:
in the first embodiment, the opening 111 of each opening 110 has the same shape. The shape of the opening 111 in each opening area 110 is the same, so that the opening 111 is more convenient and the process is saved when the opening 111 is manufactured on the carrier 100, thereby effectively reducing the cost.
In the second embodiment, the shape of the opening 111 of at least two opening regions 110 in the plurality of opening regions 110 is different. Because the substrate 01 is divided into different specifications, when the substrate 01 is located at the periphery of the middle opening area 110 except the middle opening area 110, in order to make the substrate 01 better adsorbed or blown, the leakage in the peripheral opening area 110 is prevented from failing to form an effective vacuum environment or blowing environment, and the conveying action of the substrate 01 cannot be completed; therefore, the size and shape of the opening 111 of the peripheral opening area 110 are adjusted according to actual needs, for example, the shape of the opening 111 of the peripheral opening area 110 is appropriately made smaller than the shape of the opening 111 of the intermediate opening area 110, or is directly designed as a round hole or the like.
As shown in fig. 10, in the case where the airflow adjusting assembly is specifically provided, the airflow adjusting assembly includes: a plurality of air channels 210 located between the first supporting surface 120 and the second supporting surface 130, where the first supporting surface 120 and the second supporting surface 130 are two opposite surfaces of the carrier 100, that is, the first supporting surface 120 is used for supporting the substrate 01, and the second supporting surface 130 is opposite to the first supporting surface 120; each of the plurality of air passages 210 corresponds to the plurality of openings 111 of the same opening area 110, and each air passage 210 communicates with the corresponding opening 111. Specifically, for example, one air path 210 may correspond to all the openings 111 in one opening area 110, that is, one air path 210 communicates with all the openings 111 in one opening area 110; for example, one air path 210 may also correspond to a portion of the opening 111 in one opening area 110, that is, one air path 210 communicates with a portion of the opening 111 in one opening area 110.
In addition, as shown in fig. 11, fig. 11 is a schematic structural diagram of an airflow adjusting assembly provided in the embodiment of the present invention, the airflow adjusting assembly further includes an adjusting valve group, in each group of air passages 210 and opening 111 corresponding to each other in the same opening area 110, the adjusting valve group 230 is used for controlling on-off of different air passages 210, and a pressure gauge 240 and a flow meter 250 are installed on the air passages 210 corresponding to different opening areas 110, and fluid flow and pressure in the air passages 210 can be monitored at any time through the flow meter 250 and the pressure gauge 240, so that the air flow and pressure in the air passages 210 can be conveniently adjusted.
The plurality of air passages 210 between the first support surface 120 and the second support surface 130 are collected at a manifold block 220, and the plurality of manifold blocks 220 are collected by the manifold block 220.
In order to better adsorb the substrate 01, a larger adsorption area is required, but if the size of the opening 111 is too large, the substrate 01 will deform, which affects the flatness of the substrate 01 and further affects the working accuracy of the substrate 01, and in order to solve this problem, the specific shape of the opening 111 may be selected as follows:
mode one, a vent groove provided on a first support surface 120 of a carrier 100; the first support surface 120 is connected to the through hole 111d of the gas path 210, and one end of the through hole 111d is connected to the ventilation groove and the other end is connected to the gas path 210. For example, the vent groove of the opening 111 may be a groove having a diameter slightly larger than the diameter of the through hole 111d, or the vent groove of the opening 111 may have a diameter equal to the diameter of the through hole 111 d.
A second mode, an air vent groove provided on the first support surface 120 of the carrying platform 100; the first support surface 120 is connected to the through hole 111d of the gas path 210, and one end of the through hole 111d is connected to the ventilation groove and the other end is connected to the gas path 210. As shown in fig. 12, the vent grooves include a first vent groove 111a and a second vent groove 111b that are disposed to intersect, and the through hole 111d is located at the intersection of the first vent groove 111a and the second vent groove 111 b. For example, the shape of the opening 111 may be an "X" shape, the first ventilation groove 111a and the second ventilation groove 111b intersect in an "X" shape, and the through hole 111d is located at the intersection of the "X" shape. The opening 111 may have a cross shape, and the first ventilation groove 111a and the second ventilation groove 111b intersect in a cross shape, with the through hole 111d being located at the intersection of the cross shape.
Third, as shown in fig. 13, an air vent groove provided in the first support surface 120 of the susceptor 100; the first support surface 120 is connected to the through hole 111d of the gas path 210, and one end of the through hole 111d is connected to the ventilation groove and the other end is connected to the gas path 210. The vent grooves include a third vent groove 111c, and the third vent groove 111c is in a long shape, and specifically, the extending direction of the long third vent groove 111c may be along the width direction or the length direction of the substrate 01.
In a second aspect, an embodiment of the present invention provides a method for controlling a substrate working platform, including: the specification for bearing the substrate 01 is obtained, the number of the opening areas 110 to be operated is determined according to the specification of the substrate 01, the opening areas 110 correspond to different air flow adjusting assemblies, and the air flow conditions of the opening areas 110 corresponding to the opening areas are independently controlled through the air flow adjusting assemblies, so that any opening area 110 is selected to be operated for bearing the substrate 01 with at least two specifications.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A substrate work platform, comprising:
the bearing table is used for bearing the substrate and is provided with a plurality of opening areas, and the opening areas are arbitrarily combined to form bearing areas for bearing at least two specifications of substrates;
the airflow adjusting component corresponds to the opening area and can independently control the airflow condition of the opening area corresponding to the airflow adjusting component; the airflow adjusting assembly is used for providing positive-pressure blowing floating for the substrate;
at least two groups of the air flow regulating assemblies are used for controlling the work of different opening areas in the bearing area, the time difference is reserved for the work of different opening areas, and the work of different opening areas is controlled by different air flow regulating assemblies.
2. The substrate processing platform of claim 1, wherein each of the open areas has a plurality of openings therein.
3. The substrate processing platform of claim 2, wherein the opening of each of the opening areas has the same shape.
4. The substrate work platform of claim 2, wherein an opening shape of at least two of the plurality of opening areas is different.
5. The substrate processing platform of claim 1, wherein the carrier has a first support surface for supporting a substrate and a second support surface disposed opposite the first support surface;
wherein the airflow adjustment assembly comprises: and each air passage is communicated with the corresponding opening part.
6. The substrate processing platform of claim 5, wherein the air flow adjusting assembly further comprises an adjusting valve group, and each group of air passages and opening parts corresponding to each other in the same opening area are arranged in the adjusting valve group, and the adjusting valve group is used for controlling on-off of different air passages.
7. The substrate processing platform of claim 6, wherein the air flow conditioning assembly further comprises an air source.
8. The substrate work platform of claim 5, wherein the opening comprises: a vent groove provided in the first support surface; and one end of the through hole is communicated with the ventilation groove, and the other end of the through hole is communicated with the air channel.
9. The substrate work platform of claim 8, wherein the vent slots comprise a first vent slot and a second vent slot disposed in a cross, the through hole being located at an intersection of the first vent slot and the second vent slot.
10. A control method of the substrate work platform according to any one of claims 1 to 9, comprising: the method comprises the steps of obtaining a specification for bearing a substrate, determining the number of required operations in an opening area according to the specification of the substrate, wherein the opening area corresponds to different air flow adjusting assemblies, the air flow adjusting assemblies are used for providing positive pressure blowing floating for the substrate, and independently controlling the air flow conditions of the opening area corresponding to the air flow adjusting assemblies through the air flow adjusting assemblies so as to select any opening area to operate for bearing the substrate with at least two specifications.
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