CN107533965A - Adsorbing mechanism, adsorption method, manufacture device and manufacture method - Google Patents

Adsorbing mechanism, adsorption method, manufacture device and manufacture method Download PDF

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Publication number
CN107533965A
CN107533965A CN201680025715.XA CN201680025715A CN107533965A CN 107533965 A CN107533965 A CN 107533965A CN 201680025715 A CN201680025715 A CN 201680025715A CN 107533965 A CN107533965 A CN 107533965A
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China
Prior art keywords
cut
adsorption
thing
cutting
fixture
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Granted
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CN201680025715.XA
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CN107533965B (en
Inventor
傅藤胜则
今井�郎
今井一郎
石桥干司
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Towa Corp
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Towa Corp
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Publication of CN107533965B publication Critical patent/CN107533965B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

By being arranged at cutting fixture and there is the 1st adsorption orifice of the 1st adsorption area, the encapsulation metacoxal plate formed with multiple unit areas is adsorbed in cutting fixture.On at least a portion cutting line of the encapsulation metacoxal plate adsorbed, cutting slot is formed using the 1st rotating knife.By being arranged at multiple 2nd adsorption orifices of cut-out fixture, encapsulation metacoxal plate is adsorbed in cut-out fixture.One the 2nd adsorption orifice adsorbs a unit area using the 2nd adsorption area.On the cutting line of encapsulation metacoxal plate of cut-out fixture is adsorbed in, encapsulation metacoxal plate is cut off using the 2nd rotating knife.It is more than the 2nd adsorption area due to being contained in the 1st adsorption area and adsorbing the unit adsorption area of a unit area, therefore the encapsulation metacoxal plate with warpage can be effectively adsorbed in cutting fixture.Pass through formed cutting slot to reduce the warpage of encapsulation metacoxal plate.

Description

Adsorbing mechanism, adsorption method, manufacture device and manufacture method
Technical field
The present invention relates to a kind of the absorption used during multiple products through singualtion is manufactured by the way that cut-off thing is cut off Mechanism, adsorption method, manufacture device and manufacture method.
Background technology
The substrate being made as follows is referred to as to encapsulate metacoxal plate：That is, will be by structures such as printed base plate or lead frames Into substrate be hypothetically divided into multiple regions of clathrate, and the element (for example, semiconductor chip) of shaped like chips is installed on Resin-encapsulated is integrally carried out to substrate after regional.Metacoxal plate cut-out will be encapsulated by using the shut-off mechanism of rotating knife etc. And the result that monolithic turns to regional unit turns into product.In resin-encapsulated process, by make liquid resin hardening and Form the potting resin being made up of hardening resin.
All the time, the predetermined region for encapsulating metacoxal plate is cut using shearing device and using shut-off mechanisms such as rotating knifes It is disconnected.First, encapsulation metacoxal plate is placed on cut-out platform (cut-out fixture).Secondly, encapsulation metacoxal plate is made to be directed at (position Alignment).The position of the imaginary cutting line for the multiple regions of zoning is set by alignment.Secondly, make to be placed with base after encapsulation The cut-out platform of plate relatively moves with shut-off mechanism.Cutting water is sprayed to the place of incision of encapsulation metacoxal plate, and passed through Shut-off mechanism will encapsulate metacoxal plate cut-out along the cutting line for being set in encapsulation metacoxal plate.Warp is manufactured by cutting off encapsulation metacoxal plate The product of singualtion.
In cut-out with being provided with cut-out fixture on platform.Cut-out be provided with fixture for aspirate encapsulation metacoxal plate Or multiple suction paths of the product through singualtion.In the space that cut-out is connected with being provided with platform with multiple suction paths. Multiple suction paths are connected to the aspirating mechanism of outside, such as vavuum pump via the space.Base after being encapsulated using vacuum pumping Plate or multiple products, encapsulation metacoxal plate or multiple products are thus adsorbed in cut-out fixture.
In recent years, with multifunction, miniaturization and the high speed of electronic equipment, semiconductor article is also increasingly to high property Energyization, multifunction and miniaturization.In order to improve the production efficiency of semiconductor, in make encapsulation metacoxal plate maximize and it is thin The tendency of type.Due to making encapsulation metacoxal plate maximize, the product amounts taken out from a piece of encapsulation metacoxal plate increase.Due to encapsulation The slimming of metacoxal plate, the product slimming through singualtion.Therefore, the installation effectiveness of electronic equipment is improved.On the other hand, by Envelope after resin-encapsulated caused by the maximization and slimming of encapsulation metacoxal plate, compression stress when liquid resin hardens The warpage for filling metacoxal plate is larger.If the warpage for encapsulating metacoxal plate is larger, it is likely that is difficult to encapsulation metacoxal plate being adsorbed in cut-out Use fixture.If encapsulation metacoxal plate can not be adsorbed in into suction jig, the problem of metacoxal plate is cut off can not will be encapsulated by producing.Cause This, when making encapsulation metacoxal plate singualtion, it is important that the encapsulation metacoxal plate with warpage is effectively adsorbed in suction jig.
Dividing method as package substrate, there is provided the dividing method of following package substrate：" (summary) its be package substrate Dividing method, this method includes：Step is loaded, package substrate is placed on stationary fixture, the stationary fixture includes using In remaining potted the retaining surface of substrate, and possess：(summary)；Multiple snake belly type absorption layers, (summary) adsorption section are dashed forward from the retaining surface Go out；(summary), the retaining surface are formed by rubber；And segmentation step, (summary) will be held in the envelope of the stationary fixture using cutting tip Dress substrate cuts and is divided into each encapsulation ([0012] section, Fig. 5~Fig. 8 for example, referring to patent document 1) ".
Patent document 1：Japanese Patent Laid-Open 2011-40542 publications
However, according to the stationary fixture 20 disclosed in patent document 1, following problem is produced.Such as Fig. 5 institutes of patent document 1 Show, on the holding plate 50 of stationary fixture 20 formed with multiple circular holes 52 with the 1st diameter, continuous with circular hole 52 respectively and shape Into multiple circular holes 54 with the 2nd diameter more than the 1st diameter and the larger recess 56 that is connected with each circular hole 54.Each Suction pieces 58 with aspiration path 59 are installed in circular hole 52, and the snake abdomen formed by resin is installed in each suction pieces 58 Type absorption layer 24.Formed with the multiple circular holes 64 connected with each circular hole 54 in holding member 62.Pass through the circular hole being formed continuously 54 with circular hole 64 and divide recess, and snake belly type absorption layer 24 is equipped with the recess.
In this stationary fixture 20, in order to adsorb each chip, it is processed into the different circular hole 52,54,64 of diameter and distinguishes Connection.In addition, suction pieces 58 are installed in circular hole 52, and snake belly type absorption layer 24 is installed on suction pieces 58.In order to adsorb One chip, it is necessary to prepare multiple working processes or structural elements.Therefore, the structure of stationary fixture 20 is extremely complex, it is difficult to makes Make stationary fixture 20, and manufacturing cost is higher.
The content of the invention
The present invention is used to solve the above problems, and its object is to provide a kind of encapsulation metacoxal plate that can be adsorbed with warpage Adsorbing mechanism, adsorption method, manufacture device and manufacture method.
In order to solve the above problems, adsorbing mechanism of the invention uses during following：That is, have by absorption by more The cut-off thing of multiple unit areas of bar cutting line zoning simultaneously cuts off the cut-off thing, so as to manufacture and multiple lists Multiple products corresponding to the difference of position region,
The adsorbing mechanism is characterised by possessing：
1st platform, for loading the cut-off thing；
1st fixture, it is installed on the 1st platform；And
One or more 1st adsorption orifices, are arranged on the 1st fixture, respectively by the 1st adsorption area to adsorb Cut-off thing is stated,
Unit adsorption area is more than the 2nd adsorption area, wherein, the unit adsorption area is the 1st adsorption area institute Comprising area, i.e., described unit adsorption area for absorption one unit area area, the 2nd adsorption area be Respectively correspondingly zoning is set with multiple unit areas in the 2nd fixture that will be used in the process of the cut-off thing cut-out Multiple 2nd adsorption orifices in each the 2nd adsorption orifice adsorb a unit area area.
In order to solve the above problems, adsorption method of the invention uses during following：That is, have by absorption by more The cut-off thing of multiple unit areas of bar cutting line zoning simultaneously cuts off the cut-off thing, so as to manufacture and multiple lists Multiple products corresponding to the difference of position region,
The adsorption method is characterised by, including following process：
Prepare the 1st platform for loading the cut-off thing；
Prepare the 1st fixture being arranged on the 1st platform；
Prepare one or more 1st adsorption orifices, the 1st adsorption orifice is arranged on the 1st fixture, respectively by the 1 adsorption area adsorbs the cut-off thing；And
Using one or more 1st adsorption orifices and the cut-off thing is adsorbed by unit adsorption area, wherein, The area that the unit adsorption area is included by the 1st adsorption area, i.e., described unit adsorption area are one institute of absorption The area of unit area is stated,
The unit adsorption area is more than the 2nd adsorption area, wherein, the 2nd adsorption area is to be cut off by described In the process of thing cut-out in the 2nd fixture that uses with multiple unit areas respectively correspondingly multiple 2 inhaling of setting of zoning Each the 2nd adsorption orifice in attached mouth adsorbs the area of a unit area.
In order to solve the above problems, manufacture device of the invention possesses：Shut-off mechanism, for by a plurality of cutting line The cut-off thing of multiple unit areas of zoning is cut；And rotating knife, it is arranged at the shut-off mechanism, the manufacture dress Put during by the way that the cut-off thing cut-out is manufactured with multiple unit areas respectively corresponding multiple products Use,
The manufacture device is characterised by,
Possesses the adsorbing mechanism.
In order to solve the above problems, manufacture device of the invention possesses：Shut-off mechanism, for by a plurality of cutting line The cut-off thing of multiple unit areas of zoning is cut；And rotating knife, it is arranged at the shut-off mechanism, the manufacture dress Put during by the way that the cut-off thing cut-out is manufactured with multiple unit areas respectively corresponding multiple products Use,
The manufacture device is characterised by possessing：
1st platform, for loading the cut-off thing；
2nd platform, for loading the cut-off thing；
Travel mechanism, for making the 1st platform and the 2nd platform be relatively moved with the shut-off mechanism；
1st fixture, it is installed on the 1st platform；
One or more 1st adsorption orifices, are arranged on the 1st fixture, adsorb quilt by the 1st adsorption area respectively Cut off thing；
2nd fixture, it is installed on the 2nd platform；And
Multiple 2nd adsorption orifices, respectively correspondingly set with multiple unit areas in the 2nd fixture, and respectively One unit area is adsorbed by the 2nd adsorption area,
Unit adsorption area is more than the 2nd adsorption area, wherein, the unit adsorption area is the 1st adsorption plane The included area of product, i.e., described unit adsorption area are the area for adsorbing multiple unit areas respectively,
In the 1st fixture, by the rotating knife along at least one cutting line in a plurality of cutting line And a part of thickness in the full depth of the cut-off thing is cut, so as to form at least one cutting slot,
In the 1st fixture, the semi-finished product with multiple intermediate regions by the cutting slot zoning are formed,
In the 2nd fixture, the semi-finished product are cut off along a plurality of cutting line by using the rotating knife, from And manufacture the multiple products adsorbed respectively by multiple 2nd adsorption orifices.
The manufacture device of the present invention has following manner, that is, possesses：
1st shut-off mechanism possessed by the shut-off mechanism；And
2nd shut-off mechanism possessed by the shut-off mechanism,
In the 1st fixture, the cutting slot is formed by being arranged at the 1st rotating knife of the 1st shut-off mechanism,
In the 2nd fixture, the semi-finished product are cut off by being arranged at the 2nd rotating knife of the 2nd shut-off mechanism.
The manufacture device of the present invention has following manner：
1st fixture can adsorb the 1st cut-off thing comprising multiple 1st unit areas with the 1st size respectively, and And the 2nd cut-off thing comprising multiple 2nd unit areas with 2nd size different from the 1st size respectively can be adsorbed.
The manufacture device of the present invention has following manner：
The cutting slot is formed along all cutting lines in a plurality of cutting line.
The manufacture device of the present invention has following manner：
The cut-off thing is the tabular component that function element is respectively formed with multiple unit areas.
The manufacture device of the present invention has following manner：
The cut-off thing at least has by base material the 1st component formed and the 2nd component being formed on the base material,
The cutting slot is formed at least on full depth of the 1st component, or is formed at the 2nd component extremely On few full depth.
The manufacture device of the present invention has following manner：
The cut-off thing at least has by base material the 1st component formed and the 2nd component being formed on the base material,
The cutting slot is formed on a part of thickness in the full depth of the 1st component, or is formed at described On a part of thickness in the full depth of 2nd component.
The manufacture device of the present invention has following manner：
1st component is the substrate formed with circuit,
2nd component is insulating component.
In order to solve the above problems, manufacture method of the invention includes following process：Make to have by a plurality of cutting line zoning Cut-off thing and the shut-off mechanism of multiple unit areas relatively move；And use rotating knife possessed by the shut-off mechanism To cut the cut-off thing, the manufacture method is by the way that the cut-off thing cut-out through cutting is manufactured and multiple institutes State unit area respectively corresponding to use during multiple products,
The manufacture method is characterised by,
Possesses the adsorption method.
In order to solve the above problems, manufacture method of the invention includes following process：Make to have by a plurality of cutting line zoning Cut-off thing and the shut-off mechanism of multiple unit areas relatively move；Cut using rotating knife possessed by the shut-off mechanism Cut the cut-off thing；And cut off the cut-off thing through cutting using the rotating knife, the manufacture method is logical Cross the cut-off thing cut-out and manufacture and used with during multiple unit areas respectively corresponding multiple products,
The manufacture method is characterised by, including following process：
Prepare the 1st platform for loading the cut-off thing；
Prepare the 2nd platform for loading the cut-off thing；
Prepare the 1st fixture, the 1st fixture is installed on the 1st platform, is had and is included the 1st adsorption area respectively The adsorption orifice of one or more the 1st；
Prepare the 2nd fixture, the 2nd fixture is installed on the 2nd platform, is had and multiple unit areas point Multiple 2nd adsorption orifices of the 2nd adsorption area and Dui Ying not be included respectively；
In the 1st fixture, adsorbed using each the 1st adsorption orifice in one or more 1st adsorption orifices The cut-off thing；
As the cutting process, in the 1st fixture, by using the rotating knife along a plurality of cutting line At least one cutting line and cut a part of thickness in the full depth of the cut-off thing, so as to form at least one Bar cutting slot；
In the 1st fixture, the semi-finished product with multiple intermediate regions by the cutting slot zoning are formed；
The semi-finished product are loaded on the 2nd fixture；
In the 2nd fixture, by using each the 2nd adsorption orifice in multiple 2nd adsorption orifices to adsorb Each in multiple unit areas possessed by semi-finished product is stated, so as to adsorb the semi-finished product；And
As the cut off operation, in the 2nd fixture, institute is cut off along a plurality of cutting line using the rotating knife State semi-finished product,
Unit adsorption area is more than the 2nd adsorption area, wherein, the unit adsorption area is the 1st adsorption plane The included area of product, i.e., described unit adsorption area are the area for adsorbing multiple unit areas respectively,
Adsorbed by the way that the semi-finished product are cut off to manufacture by each the 2nd adsorption orifice in multiple 2nd adsorption orifices Multiple products.
The manufacture method of the present invention has following manner, i.e., including following process：
Prepare the 1st shut-off mechanism with the 1st rotating knife to be used as the shut-off mechanism；
Prepare the 2nd shut-off mechanism with the 2nd rotating knife to be used as the shut-off mechanism；
As the process for relatively moving the cut-off thing and the shut-off mechanism, make the cut-off thing and described the 1 shut-off mechanism relatively moves；And
As the process for making the cut-off thing be relatively moved with the shut-off mechanism, make the semi-finished product and the described 2nd Shut-off mechanism relatively moves,
In the process for forming the cutting slot, the cutting slot is formed by the 1st rotating knife,
In the process for cutting off the semi-finished product, the semi-finished product are cut off by the 2nd rotating knife.
The manufacture method of the present invention has following manner：
In the process for adsorbing the cut-off thing, the 1st fixture can be used, has the 1st respectively to adsorb to include The 1st of multiple 1st unit areas of size is cut off thing, and can adsorb different from the 1st size comprising having respectively The 2nd of multiple 2nd unit areas of 2nd size is cut off thing.
The manufacture method of the present invention has following manner：
In the process for forming the cutting slot, the cutting is formed along all cutting lines in a plurality of cutting line Groove.
The manufacture method of the present invention has following manner：
The cut-off thing is the tabular component that function element is respectively formed with multiple unit areas.
The manufacture method of the present invention has following manner：
The cut-off thing at least has by base material the 1st component formed and the 2nd component being formed on the base material,
In the process for forming the cutting slot, the cutting slot is formed on the full depth of the 1st component, or The cutting slot is formed on the full depth of the 2nd component.
The manufacture method of the present invention has following manner：
The cut-off thing at least has by base material the 1st component formed and the 2nd component being formed on the base material,
In the process for forming the cutting slot, formed on a part of thickness in the full depth of the 1st component The cutting slot is formed on the cutting slot, or a part of thickness in the full depth of the 2nd component.
The manufacture method of the present invention has following manner：
1st component is the substrate formed with circuit,
2nd component is insulating component.
According to the present invention, first, unit adsorption area is more than the 2nd adsorption area, wherein, the unit adsorption area is the The area that 1st adsorption area possessed by 1 adsorption orifice is included, i.e., described unit adsorption area are one unit area of absorption Area, the 2nd adsorption area are area possessed by the 2nd adsorption orifice corresponding with a unit area difference.Therefore, with leading to Cross the 2nd adsorption area that the 2nd adsorption orifice is included to compare to adsorb the power of a unit area, pass through one the 1st suction The unit adsorption area that attached mouth is included is larger to adsorb the power of a unit area.
Second, in the 1st fixture, along at least one cut-out in a plurality of cutting line possessed by the cut-off thing adsorbed Line, cut a part of thickness being cut off in the full depth of thing.It is consequently formed at least one cutting slot.Cut by being formed Groove, the warpage can be reduced when cut-off thing has warpage.Cut-off thing after reduction warpage is placed in the 2nd fixture.Pass through Be arranged at the 2nd fixture, corresponding multiple 2nd adsorption holes are cut-off stably to adsorb respectively with multiple unit areas Thing.In the 2nd fixture, multiple products are manufactured by the way that cut-off thing is cut off.Therefore, by being divided into cutting with cutting off the two Step processes cut-off thing, can manufacture multiple products.
Brief description of the drawings
Figure 1A is the top view of the cut-off thing cut off by the manufacture device of the present invention.
Figure 1B is the front view of the cut-off thing with warpage in Figure 1A.
Fig. 2A is the top view of the cutting fixture used in the manufacture device of embodiments of the invention 1.
Fig. 2 B are the Fig. 2A for the state that the cut-off thing with warpage is placed in cutting fixture by shown in phantom A-A Line sectional view.
Fig. 3 A are the top views of the cut-out fixture used in the manufacture device of embodiments of the invention 1.
Fig. 3 B are Fig. 3 A for the state that the cut-off thing with warpage is placed in cut-out fixture by shown in phantom B-B Line sectional view.
Fig. 4 A are the states for representing to be cut with the cut-off thing of fixture being adsorbed in the cutting shown in Fig. 2A and Fig. 2 B Top view.
Fig. 4 B are Fig. 4 A line C-C sectional views.
Fig. 5 A are the states for representing to be cut off with the cut-off thing of fixture to being adsorbed in the cut-out shown in Fig. 3 A and Fig. 3 B Top view.
Fig. 5 B are Fig. 5 A line D-D sectional views.
Fig. 6 A are the top views of the cutting fixture used in the manufacture device of the variation of embodiments of the invention 1.
Fig. 6 B are Fig. 6 A for the state that the cut-off thing with warpage is placed in cutting fixture by shown in phantom A-A Line sectional view.
Fig. 6 C are the top views for representing a unit area by cutting fixture absorption.
Fig. 6 D are the top views of a unit area for representing to be adsorbed with fixture as the cut-out shown in Fig. 3 A and Fig. 3 B.
Fig. 7 is the top view of the general configuration for the manufacture device for representing embodiments of the invention 2.
Fig. 8 is a part for the cut-off thing in the manufacture device for represent embodiments of the invention 3 and cutting fixture Top view.
Embodiment
It is provided with shearing device 28：Fixture 9 is used in cutting, in the encapsulation metacoxal plate 1 with multiple unit areas 7 Upper formation cutting slot；And fixture 15 is used in cut-out, for by cutting off encapsulation metacoxal plate 1 and singualtion.Set in cutting with fixture 9 It is equipped with the 1st adsorption orifice 12 with the 1st adsorption area.The unit adsorption area that is included by the 1st adsorption area adsorbs one Individual unit area 7.Respectively correspondingly set with multiple unit areas 7 with being provided with fixture 15 in cut-out and adsorbed with the 2nd Multiple 2nd adsorption orifice 19A of area.Unit adsorption area is more than the 2nd adsorption area.By with including unit adsorption area 1st adsorption orifice 12 of the 1st adsorption area, stably to adsorb the encapsulation metacoxal plate 1 with warpage.Metacoxal plate is encapsulated by cutting A part of thickness in full depth possessed by 1 and form cutting slot 24.Base after encapsulation is reduced by forming cutting slot 24 The warpage of plate 1.Encapsulation metacoxal plate 1 after reduction warpage is placed in cut-out fixture 15.It is stable by each 2nd adsorption orifice 19A Ground absorption reduces the encapsulation metacoxal plate 1 after warpage.In cut-out with fixture 15, it is multiple to manufacture that metacoxal plate 1 is encapsulated by cut-out Product 27.In present specification, encapsulation that the encapsulation metacoxal plate (semi-finished product) formed with cutting slot is included as product Metacoxal plate is handled.
Embodiment 1
Reference picture 1A~Fig. 6 D illustrate to the embodiment 1 of the shearing device of the present invention.For ease of understanding, to this Shen Any figure that please be in file is suitably omitted or exaggerated to be drawn in a schematic way.For same structure key element, identical accompanying drawing is marked Mark and suitably omit the description.
As illustrated in figures 1A and ib, it is to be eventually cut and monolithic turns to the cut-off thing of product to encapsulate metacoxal plate 1.Change speech It, encapsulation metacoxal plate 1 is semi-finished product when manufacturing multiple products.Encapsulating metacoxal plate 1 has by structures such as printed base plate or lead frames Into substrate 2, be respectively arranged in shaped like chips element 3 possessed by substrate 2 on multiple regions (aftermentioned) and more to cover in the lump The potting resin 4 that the mode in individual region is formed.For example, shaped like chips element 3 is semiconductor chip.Substrate 2 is equivalent to formed with electricity The substrate on road.Potting resin 4 is equivalent to insulating component.Figure 1B represents the encapsulation metacoxal plate 1 with warpage.
As shown in Figure 1A, hypothetically it is set with a plurality of 1st cut-out along long side direction extension on substrate 1 respectively after packaging Line 5 and a plurality of 2nd cutting line 6 extended along short side direction.After packaging in substrate 1, by a plurality of 1st cutting line 5 and a plurality of 2nd (zoning) multiple unit areas 7 that cutting line 6 surrounds respectively become product by singualtion.In figure ia, for example, by edge Five article of the 1st cutting line 5 of long side direction extension is set in encapsulation metacoxal plate 1.Nine article of the 2nd cutting line that will extend along short side direction 6 are set in encapsulation metacoxal plate 1.Therefore, along long side direction formed with eight unit areas 7, along short side direction formed with four lists Position region 7, adds up to clathrate formed with 32 unit areas 7.Each unit area 7 is equivalent to product.After being formed at encapsulation The unit area 7 of substrate 1 is arbitrarily set according to the size or quantity of the product of singualtion.Unit area 7 shown in Figure 1A Be shaped as square.The shape of unit area 7 can also be rectangle in addition to square.
Reference picture 2A and Fig. 2 B, the cutting used in the shearing device of the present invention is illustrated with fixture.Such as Fig. 2A and Shown in Fig. 2 B, in cutting with being provided with cutting fixture 9 on platform 8A.Cutting fixture 9 is to be used for shape on substrate 1 after packaging Into the fixture of cutting slot.The resin sheet 11 that cutting fixture 9 possesses metallic plate 10 and is fixed on metallic plate 10.Preferred resin Sheet material 11 is formed such as by the silicone resinoid or fluorine-type resin of the flexibility with appropriateness.
As shown in Figure 2 A and 2 B, it is provided with resin sheet 11 of the cutting with fixture 9 with independent of product 1st adsorption orifice 12 of the size and shape of size and shape.1st adsorption area possessed by one the 1st adsorption orifice 12 includes logical Cross area (hereinafter referred to as " the unit adsorption plane that the 1st adsorption orifice 12 adsorbs a unit area 7 in a unit area 7 Product ").1st adsorption area is more than the 2nd adsorption plane possessed by the 2nd adsorption orifice (aftermentioned) of one unit area 7 of absorption Product.Unit adsorption area is more than the 2nd adsorption area.Thus, the 1st adsorption orifice 12 has the 2nd absorption affinity than the 2nd adsorption orifice The 1st bigger absorption affinity, a unit area 7 is adsorbed by unit adsorption area.Therefore, cutting fixture 9 can adsorb And keep the encapsulation metacoxal plate 1 with warpage.
In order to increase absorption affinity with fixture 9 in cutting, any amount N (unit areas all N ＜ are set with arbitrary size The quantity in domain 7) the 1st adsorption orifice 12.1st adsorption area can also be the area of the scope comprising all unit areas 7. In this case, the quantity of the 1st adsorption orifice 12 is one.
In order to adsorb and remain potted metacoxal plate 1, the inner bottom surface insertion from the 1st adsorption orifice 12 of cutting fixture 9 is set The absorption path 13 of resin sheet 11 and metallic plate 10.Absorption path 13 is connected with being arranged at cutting platform 8A space 14. Cutting platform 8A space 14 is connected with being arranged at the aspirating mechanism (not shown) of outside.Metacoxal plate 1 is encapsulated by adsorbing road The adsorption orifice 12 of footpath 13 and the 1st and be adsorbed in cutting fixture 9.
Size and shape of the size and shape of 1st adsorption orifice 12 independent of product.In other words, the 1st adsorption orifice 12 Size and shape of the size and shape independent of a unit area 7.Therefore, it is possible to lead to the product of polytype (type) With cutting platform 8A and cutting fixture 9.
A part of thickness in full depth possessed by encapsulation metacoxal plate 1 after rotating knife cutting absorption (not shown). The cutting slot warpage (not shown) for reducing encapsulation metacoxal plate 1 being thusly-formed.For example, in the case of figure 2b, preferably exist The full depth of substrate 2 is at least cut in full depth possessed by encapsulation metacoxal plate 1.Make possessed by encapsulation metacoxal plate 1 The side of potting resin 4 by encapsulation metacoxal plate 1 upward and in the case of being adsorbed in cutting fixture 9, and preferably substrate 1 is had after packaging The full depth of potting resin 4 is at least cut in some full depths.This cutting reduces the warpage of encapsulation metacoxal plate 1.
In the case where cutting slot is too deep, in the process of encapsulation metacoxal plate 1 of conveyance formed with cutting slot etc., it is possible to Produce the undesirable condition that the encapsulation metacoxal plate 1 is bent etc. at cutting slot.It is preferred that bending of encapsulation metacoxal plate 1 etc. will not produced Make cutting slot deep as much as possible in the range of undesirable condition.
Along a plurality of 1st cutting line 5 possessed by the encapsulation metacoxal plate 1 shown in Figure 1A and one in a plurality of 2nd cutting line 6 Cutting broken string, cutting encapsulation metacoxal plate 1.Being formed at multiple cutting slots of encapsulation metacoxal plate 1 reduces the warpage of encapsulation metacoxal plate 1. When using cutting with fixture 9, the operation of the full depth of cutting (cut-out) encapsulation metacoxal plate 1 is not performed.Thus, without will be with Cutting groove corresponding to the profile (outer rim) of product is arranged at resin sheet 11 (reference picture 2B).Therefore, compared with cut-out fixture Cutting fixture 9 can easily be made.In addition, the manufacturing cost of cutting fixture 9 can be controlled.Cutting with fixture 9 independent of The size (specifically, the size and shape of each product) of product.Therefore, in the case where being satisfied by following two conditions, Can be to polytype encapsulation general-cutting fixture 9 of metacoxal plate 1.1st condition is that the size of encapsulation metacoxal plate 1 is contained in Cutting is with the range of the size of fixture 9.2nd condition is that the size of encapsulation metacoxal plate 1, which includes cutting fixture 9, to inhale The situation of attached size (region).
Reference picture 3A and Fig. 3 B, the cut-out used in the shearing device of the present invention is illustrated with fixture.Such as Fig. 3 A and Shown in Fig. 3 B, in cut-out with being provided with cut-out fixture 15 corresponding with particular product on platform 8B.Cut-out fixture 15 is to use In in shearing device by cut off encapsulation metacoxal plate 1 and the fixture of singualtion.Cut-out fixture 15 possesses metallic plate 16 and consolidated Due to the resin sheet 17 on metallic plate 16.In order to relax mechanical shock, appropriate flexibility is required to resin sheet 17.It is preferred that Resin sheet 17 is formed such as by silicone resinoid or fluorine-type resin.
As shown in Fig. 3 A and Fig. 3 B, it is provided with resin sheet 17 of the cut-out with fixture 15 and adsorbs and remain potted respectively The jut 18 of multiple tableland shapes of multiple unit areas 7 in metacoxal plate 1.It is corresponding with the constituent parts region 7 for encapsulating metacoxal plate 1 Ground, along long side direction formed with eight juts 18, along short side direction formed with four juts 18, add up to prominent formed with 32 Play portion 18.In cut-out with fixture 15, the upper end of multiple juts 18 is provided with multiple 2nd adsorption orifice 19A.One the 2nd Adsorption orifice 19A corresponds respectively to a unit area 7.It is provided with from each 2nd adsorption orifice 19A inner bottom surface and penetrates resin sheet 17 With the absorption path 19B of metallic plate 16.
Multiple 2nd adsorption orifice 19A distinguish via each absorption path 19B with being arranged at cut-out platform 8B space 14 respectively It is connected.Cut-out platform 8B space 14 is connected with being arranged at the aspirating mechanism (not shown) of outside.Encapsulate more in metacoxal plate 1 Individual (32) unit area 7 is adsorbed in cut-out fixture 15 by corresponding 2nd adsorption orifice 19A respectively.
As shown in Figure 3 B, in the case where the encapsulation metacoxal plate 1 with warpage is placed in into cut-out fixture 15, encapsulating The both ends of metacoxal plate 1, the unit area 7 of the 2nd adsorption orifice 19A absorption left ends of left end, the 2nd adsorption orifice 19A absorption of right-hand member The unit area 7 of right-hand member.The order of 2nd adsorption orifice 19A absorption unit areas 7 is from the both ends of encapsulation metacoxal plate 1 successively direction Inner side (central portion).
On the other hand, the central portion of substrate 1 after packaging, in the lower surface of potting resin 4 and the upper table of resin sheet 17 Gap is produced between face.Further, since a 2nd adsorption orifice 19A corresponds to a unit area 7 and set, therefore one the 2nd Adsorption orifice 19A adsorption area (the 2nd adsorption area) is less than the area of plane of a unit area 7.Thus, in use and each list In the case of adsorption orifice (the 2nd adsorption orifice) 19A corresponding to the difference of position region 7, it is possible to after the encapsulation with warpage can not be adsorbed Substrate 1, it can not especially adsorb the central portion of the encapsulation metacoxal plate 1.
As shown in Figure 3A, multiple the extended in cut-out with the long side direction being provided with fixture 15 along cut-out fixture 15 1 cutting groove 20.Multiple 1st cutting grooves 20 correspond in encapsulation metacoxal plate 1 along a plurality of 1st cutting line 5 (ginseng of long side direction extension According to Figure 1A and Figure 1B).In multiple 2nd cut-outs that cut-out is extended with the short side direction being provided with fixture 15 along cut-out fixture 15 Groove 21.Multiple 2nd cutting grooves 21 correspond in encapsulation metacoxal plate 1 a plurality of (the reference picture of 2nd cutting line 6 extended along short side direction 1A and Figure 1B).
The depth of multiple 1st cutting grooves 20 and multiple 2nd cutting grooves 21 is (from the upper surface of jut 18 to the interior bottom of each groove The distance in face) it is set to 0.5mm~1.0mm or so.It is general to multiple products to cut in order to reduce the running cost of shearing device It is disconnected use platform 8B, and correspond to product size or quantity and only change cut-out fixture 15.
As shown in Fig. 3 A and Fig. 3 B, wall portion and each cutting groove 20,21 between the 2nd adsorption orifice 19A be present.By wall portion It is collectively referred to as " lattice " with each cutting groove 20,21.The 2nd adsorption area as the 2nd adsorption orifice 19A area of plane is from one The area of plane for the lattice that the unit area 7 is included is subtracted in the area of plane of unit area 7, and is absorption path 19B The area of section (=area of plane) more than area.
Reference picture 4A~Fig. 5 B, to being said by the way that the encapsulation metacoxal plate 1 with warpage is cut off and the process of singualtion It is bright.Fig. 4 A and Fig. 4 B represent by using the rotating knife 22 for being installed on shut-off mechanism (not shown) cut encapsulation metacoxal plate 1 and The process for forming cutting slot 23,24.Coordinate system based on shearing device (reference picture 7) is represented with X, Y in figure below and Z-direction Direction.
Reference picture 3A~Fig. 4 B, after effectively adsorbing the encapsulation with warpage with fixture 9 using the cutting shown in Fig. 4 B The situation of substrate 1 (reference picture 3B) illustrates.Fig. 4 A and Fig. 4 B are to effectively adsorb in the shearing device of the present invention Encapsulation metacoxal plate 1 with warpage and the adsorbing mechanism used.First, it is being installed on cutting platform 8A cutting fixture 9 Mounting encapsulation metacoxal plate 1 on possessed resin sheet 11.
As shown in Figure 4 B, in cutting with being provided with two the 1st adsorption orifices 12 on fixture 9.One the 1st adsorption orifice 12 corresponds to Four row unit areas 7 shown in Fig. 4 B.1st adsorption area possessed by one the 1st adsorption orifice 12 is included as by the 1st absorption Mouth 12 adsorbs the unit adsorption area of the area of a unit area 7 in a unit area 7.Unit adsorption area is more than The 2nd adsorption area of a unit area 7 is adsorbed as a 2nd adsorption orifice 19A shown in Fig. 3 B.On this, as long as by Fig. 4 B Just it is apparent compared with Fig. 3 B.Thus, the 1st adsorption orifice 12 is inhaled with the 1st of the 2nd absorption affinity more than the 2nd adsorption orifice 19A the Attached power adsorbs a unit area 7 by unit adsorption area.
Consider the state (state before absorption) that resin sheet 11 is placed in metacoxal plate 1 is encapsulated shown in Fig. 4 B.At this Under state, with encapsulate metacoxal plate 1 central portion compared with, encapsulate metacoxal plate 1 both ends in potting resin 4 lower surface with Interval between the upper surface (upper surface of the 1st adsorption orifice 12) of resin sheet 11 is smaller (reference picture 3B).Therefore, after packaging The both ends of substrate 1, the left end of the 1st adsorption orifice 12 in left side effectively adsorb the unit area 7 of left end, the 1st absorption on right side The right-hand member of mouth 12 effectively adsorbs the unit area 7 of right-hand member.
Then, first, from outside (from left side) sequentially correction and be located at respectively on the inside of the left side of encapsulation metacoxal plate 1 three The warpage of encapsulation metacoxal plate 1 corresponding to constituent parts region 7 on row.Difference is adsorbed by using the 1st adsorption orifice 12 in left side Positioned at encapsulation metacoxal plate 1 left side on the inside of three row on constituent parts regions 7 substantially entire surface and increase the effect.The Two, from outside (from right side) sequentially correction and the constituent parts area on three row on the inside of the right side of encapsulation metacoxal plate 1 respectively The warpage of encapsulation metacoxal plate 1 corresponding to domain 7.Adsorbed respectively positioned at encapsulation metacoxal plate 1 by using the 1st adsorption orifice 12 on right side Right side on the inside of three row on constituent parts regions 7 substantially entire surface and increase the effect.Therefore, the 1st adsorption orifice 12 is inhaled The order of attached unit area 7 is successively towards inner side from the both ends of encapsulation metacoxal plate 1 (to central portion).Thus, there will be warpage Encapsulation metacoxal plate 1 (reference picture 3B) be effectively adsorbed in possessed by cutting fixture 9 on resin sheet 11.
Hereinafter, specific process is illustrated.As shown in fig. 4 a and fig. 4b, first, it is being installed on cutting platform 8A's Cutting mounting encapsulation metacoxal plate 1 on fixture 9.For example, replace Fig. 4 A and Fig. 4 the B institutes of the side of substrate 2 of encapsulation metacoxal plate 1 upward The state shown, so that the side along a plurality of 1st cutting line 5 (reference picture 4A) of long side direction extension along Y-direction of encapsulation metacoxal plate 1 Formula configuration packages metacoxal plate 1.In other words, by making the encapsulation metacoxal plate 1 shown in Fig. 4 A rotate+90 degree, encapsulation metacoxal plate 1 is matched somebody with somebody It is placed on cutting fixture 9.
It is placed in by encapsulation metacoxal plate 1 in the process of cutting fixture 9, be adsorbed in the encapsulation of cutting fixture 9 The position alignment of metacoxal plate 1 and rotating knife 22.Specifically, marked relative to the position alignment being previously formed on substrate 2 (no icon) and carry out the position alignment of rotating knife 22.In the process, it is not carried out cutting the whole of (cut-out) encapsulation metacoxal plate 1 The operation of thickness, therefore without forming cutting groove with fixture 9 (resin sheet 11) in cutting.Therefore, metacoxal plate 1 will encapsulated In the case of being placed in cutting fixture 9, without the position alignment for carrying out cutting fixture 9 with encapsulating metacoxal plate 1.
Secondly, it is previously formed in the position alignment mark on substrate 2 with camera (not shown), shooting using position alignment Note.Control unit possessed by shearing device (not shown) according to the image photographed come set encapsulation metacoxal plate 1 along long side side A plurality of 1st cutting line 5 to extension and a plurality of 2nd cutting line 6 along short side direction extension.
Secondly, for example, making to be installed on the rotating knife 22 of shut-off mechanism (not shown) with 30,000~40,000rpm's or so Speed rotates at a high speed.The outside of substrate 1 after packaging, decline the rotating knife 22 for being installed on shut-off mechanism.For example, make rotating knife The defined depth location that 22 lower end is dropped in potting resin 4 possessed by encapsulation metacoxal plate 1.Make cutting platform 8A with Rotating knife 22 relatively moves in X direction.Thus, it is rotated by 90 ° the encapsulation metacoxal plate 1 of configuration in the state shown in replacement Fig. 4 A In, rotating knife 22 is directed at the position of specific 1st cutting line 5 along long side direction extension.
Secondly, using travel mechanism (not shown), make to be placed in base after the encapsulation of cutting platform 8A (cutting fixture 9) Plate 1 moves along Y-direction.It is rotated by 90 ° in the state shown in replacement Fig. 4 A in the encapsulation metacoxal plate 1 of configuration, passes through rotating knife 22 A part of thickness along in the 1st cutting line 5 cutting full depth extended along long side direction.For example, the whole of cutting substrate 2 Defined caliper portion in the full depth of thickness and potting resin 4.Thus, along encapsulation metacoxal plate 1 along long side direction 1st cutting line 5 of extension forms cutting slot 23.In order to reduce the warpage of encapsulation metacoxal plate 1, preferably by declining rotating knife 22 Cutting slot 23 is formed to the appropriate depth location encapsulated in metacoxal plate 1.
Along cutting line 5 in a plurality of 1st cutting line 5 along long side direction extension of encapsulation metacoxal plate 1, specified quantity Cutting encapsulation metacoxal plate 1.It is rotated by 90 ° in the state shown in replacement Fig. 4 A in the encapsulation metacoxal plate 1 of configuration, for example, forming edge Cutting slot 23b, 23d for extending along two cutting lines 5 in five cutting lines 5 of long side direction extension (with thinner in Fig. 4 A Solid line represent part).
Secondly, encapsulation metacoxal plate 1 is made to rotate -90 degree.Thus, as shown in Figure 4 A, so that encapsulation metacoxal plate 1 along short side side To mode configuration packages metacoxal plate 1 of the 2nd cutting line 6 along Y-direction of extension.Secondly, for example, making to be installed on shut-off mechanism (not Diagram) rotating knife 22 rotated at a high speed with 30,000~40,000rpm or so speed.The outside of substrate 1 after packaging, makes peace Rotating knife 22 loaded on shut-off mechanism declines.The lower end of rotating knife 22 is set to drop to potting resin 4 possessed by encapsulation metacoxal plate 1 Set depth location.Cutting is set to be relatively moved in X direction with platform 8A and rotating knife 22.Thus, it is directed at rotating knife 22 Encapsulate the position of specific 2nd cutting line 6 along short side direction extension of metacoxal plate 1.
Secondly, using travel mechanism (not shown), make to be placed in base after the encapsulation of cutting platform 8A (cutting fixture 9) Plate 1 moves along Y-direction.Pass through 2nd cut-out that along short side direction extends of the rotating knife 22 of high speed rotation along encapsulation metacoxal plate 1 Line 6 and cut such as full depth of the full depth of substrate 2 and potting resin 4 in defined caliper portion.Thus, along The 2nd cutting line 6 along short side direction extension for encapsulating metacoxal plate 1 forms cutting slot 24.In order to reduce sticking up for encapsulation metacoxal plate 1 Song, preferably form cutting slot 24 by making rotating knife 22 drop to the appropriate depth location of encapsulation metacoxal plate 1.
Along the cutting line 6 of the specified quantity in a plurality of 2nd cutting line 6 along short side direction extension of encapsulation metacoxal plate 1 Cutting encapsulation metacoxal plate 1.In Figure 4 A, for example, along encapsulation metacoxal plate 1 along short side direction extension nine cutting lines 6 in Three cutting lines 6 and cutting slot 24c, 24e, 24g (portions represented in figure with thinner solid line are formed on substrate 1 after packaging Point).
Cutting slot 23,24 is formed on substrate 1 after packaging.Thus, first, it is believed that can de-encapsulation resin 4 harden when Shrinkage stress at least a portion.Therefore, because the warpage of encapsulation metacoxal plate 1 can be reduced, encapsulation metacoxal plate 1 effectively adsorbs In cutting fixture 9.Second, due to that can reduce the rigidity of encapsulation metacoxal plate 1, encapsulation metacoxal plate 1 is effectively adsorbed in cutting and used Fixture 9.Due to encapsulate metacoxal plate 1 warpage reduce or rigidity reduce in it is at least one and encapsulate metacoxal plate 1 and effectively adsorb In cutting fixture 9.
Be formed at encapsulation metacoxal plate 1 on cutting slot 23,24 quantity and position can according to the form and degree of warpage and Appropriate selection.In the case where the warpage of the encapsulation metacoxal plate 1 shown in Fig. 4 A is simultaneously little, formed in central portion along short side direction One cutting slot 24.In that case, it is possible to have a case that to not necessarily form the cutting slot 23 along long side direction.According to The form and degree of warpage, it is possible to as long as having a case that to be formed at least one just enough in cutting slot 23,24.
By forming multiple cutting slots 23,24 on substrate 1 after packaging 12 are hypothetically divided into by metacoxal plate 1 is encapsulated Individual intermediate region.Intermediate region (total eight) in uppermost and lowermost shown in Fig. 4 A has two unit areas respectively 7.Intermediate region (total four) in stage casing has four unit areas 7 respectively.Encapsulation formed with multiple cutting slots 23,24 Metacoxal plate 1 is the semi-finished product during the multiple products of manufacture.
Secondly, as shown in Fig. 5 A and Fig. 5 B, be installed on cut-out platform 8B cut-out with mounting on fixture 15 formed with The encapsulation metacoxal plate 1 of cutting slot 23,24 (reference picture 4A).For example, instead of making Fig. 5 A of the side of substrate 2 of encapsulation metacoxal plate 1 upward Shown state, so that the 1st cutting line 5 and the 1st cutting slot 23 (reference picture 4A) that extend along long side direction of encapsulation metacoxal plate 1 Along the mode configuration packages metacoxal plate 1 of Y-direction.In other words, by making the encapsulation metacoxal plate 1 shown in Fig. 5 A rotate+90 degree, will seal Dress metacoxal plate 1 is configured on cut-out fixture 15.
In the process of encapsulation metacoxal plate 1 of the mounting formed with cutting slot 23,24, it is packaged metacoxal plate 1 and is used with cut-out The position alignment of fixture 15.The position alignment is so that the 1st cutting line 5 and the 1st cutting slot 23 and the (reference picture of the 1st cutting groove 20 It is 3A) overlapping, and the 2nd cutting line 6 and the 2nd cutting slot 24 mode overlapping with the 2nd cutting groove 21 (reference picture 3A) perform.
Matching somebody with somebody along the 1st cutting line 5 and the 1st cutting slot 23 (reference picture 4A) of long side direction extension in metacoxal plate 1 will be encapsulated It is placed on the cutting groove 20 (reference picture 3A) along long side direction extension in cut-out fixture 15.The edge in metacoxal plate 1 will be encapsulated The 2nd cutting line 6 and the 2nd cutting slot 24 of short side direction extension are configured at the cutting along short side direction extension in cut-out fixture 15 On fault trough 21 (reference picture 3A).Encapsulate warpage possessed by metacoxal plate 1 by formed the 1st cutting slot 23 and the 2nd cutting slot 24 and Reduce.Encapsulate rigidly is reduced possessed by metacoxal plate 1 by forming the 1st cutting slot 23 and the 2nd cutting slot 24.Therefore, with envelope Multiple unit areas 7 possessed by dress metacoxal plate 1 are respectively correspondingly formed at multiple 2nd adsorption orifices on cut-out fixture 15 19A can stably adsorb constituent parts region 7.
Secondly, it is previously formed in the position alignment mark on substrate 2 with camera (not shown), shooting using position alignment Note.Control unit possessed by shearing device it is (not shown) according to the image that photographs set again encapsulation metacoxal plate 1 along length A plurality of 1st cutting line 5 (reference picture 4A) and multiple 1st cutting slots 23 and extend along short side direction more that edge direction extends Article the 2nd cutting line 6 and multiple 2nd cutting slots 24.By the way that the 1st cutting slot 23 and the 2nd cutting slot 24 are formed on substrate 1 after packaging And reduce the warpage of encapsulation metacoxal plate 1.Therefore, because the position relationship in encapsulation metacoxal plate 1 is possible to produce micro-variations, it is excellent Gated and carry out position alignment again and set the position of the cutting line and cutting slot on encapsulation metacoxal plate 1.
Secondly, for example, making to be installed on the rotating knife 22 of shut-off mechanism (not shown) with 30,000~40,000rpm's or so Speed rotates at a high speed.The outside of substrate 1 after packaging, decline the rotating knife 22 for being installed on shut-off mechanism.Make rotating knife 22 Lower end is dropped to than possessed by encapsulation metacoxal plate 1 on the lower surface defined position somewhat on the lower of potting resin 4.Make cut-out Relatively moved in X direction with platform 8B and rotating knife 22.Thus, it is rotated by 90 ° the envelope of configuration in the state shown in replacement Fig. 5 A Fill in metacoxal plate 1, rotating knife 22 is directed at specific 1st cutting line 5 or specific 1st cutting slot 23 along long side direction extension The position of (reference picture 4A).
Secondly, using travel mechanism (not shown), make to replace the state shown in Fig. 5 A and spend rear bearing from state rotation+90 Cut-out is placed in be moved along Y-direction with platform 8B (cutting off with fixture 15) encapsulation metacoxal plate 1.Using rotating knife 22, after packaging Along the 1st cutting line 5 (reference picture 4A) extended along long side direction in substrate 1, substrate 2 and potting resin 4 are cut off in the lump.By This, forms the 1st cut-out trace 25 (25a) shown in Fig. 5 A.Using rotating knife 22, after packaging along long side direction in substrate 1 1st cutting slot 23 (reference picture 4A) of extension, the remainder (residual thickness part) formed with potting resin 4 is all cut It is disconnected.Thus, the 1st cut-out trace 25 (25b) shown in Fig. 5 A is formed.1st cut-out trace 25 (25a, 25b) uses heavy line table in fig. 5 Show.In this condition, end material portion 1a, 1b for being formed along long side direction for encapsulating metacoxal plate 1 (are used in Fig. 5 A upside and downside The part that double dot dash line represents) remove.
Secondly, encapsulation metacoxal plate 1 is made to rotate -90 degree.Thus, as shown in Figure 5A, so that encapsulation metacoxal plate 1 along short side side Mode configuration packages metacoxal plate 1 to the 2nd cutting line 6 of extension and the 2nd cutting slot 24 along Y-direction.
Secondly, for example, making to be installed on the rotating knife 22 of shut-off mechanism (not shown) with 30,000~40,000rpm's or so Speed rotates at a high speed.The outside of substrate 1 after packaging, decline the rotating knife 22 for being installed on shut-off mechanism.Make rotating knife 22 Lower end drops to the lower surface defined position somewhat on the lower than potting resin 4 possessed by encapsulation metacoxal plate 1.Use cut-out Platform 8B is relatively moved in X direction with rotating knife 22.Thus, prolonging along short side direction for the alignment package metacoxal plate 1 of rotating knife 22 is made Specific 2nd cutting line 6 stretched or the position of specific 2nd cutting slot 24.
Secondly, using travel mechanism (not shown), make after being placed in the encapsulation of cut-out platform 8B (cut-out fixture 15) Substrate 1 moves along Y-direction., will along the 2nd cutting line 6 extended along short side direction of encapsulation metacoxal plate 1 using rotating knife 22 Substrate 2 and potting resin 4 are cut off in the lump possessed by encapsulation metacoxal plate 1.Thus, the 2nd cut-out trace 26 (26a) is formed.Use rotation Rotor 22, along the 2nd cutting slot 24 extended along short side direction of encapsulation metacoxal plate 1, by the remainder formed with potting resin 4 (residual thickness part) is divided all to cut off.Thus, the 2nd cut-out trace 26 (26b) is formed.2nd cut-out trace 26 (26a, 26b) is in Fig. 5 A It is middle to be represented with thicker solid line.In this condition, the end material portion formed along short side direction of metacoxal plate 1 will be encapsulated (in Fig. 5 A Left end and right end portion) remove.In fig. 5, only removal end material portion 1c (part represented in figure with double dot dash line) shape is represented State.
As shown in Figure 5A, after packaging in substrate 1, by the 1st cut-out trace 25 formed along long side direction and along short side direction The unit area 7 that the 2nd cut-out trace 26 formed surrounds is equivalent to the product 27 through singualtion.Will be by after packaging on substrate 1 Form the 1st cutting slot 23 and the 2nd cutting slot 24 and reduce warpage or it is rigid encapsulation metacoxal plate 1 be effectively adsorbed in cut-out press from both sides Tool 15.In the state of cut-out is adsorbed in after the encapsulation metacoxal plate 1 of cut-out fixture 15, by each 2nd adsorption orifice 19A stably Adsorb each product 27 equivalent to constituent parts region 7.Therefore, in the state of substrate 1 is singulated after packaging, by being formed at Each product 27 is stably adsorbed in cut-out fixture 15 by cut-out with each 2nd adsorption orifice 19A of fixture 15.
According to the present embodiment, first, it is separately provided for forming cutting slot on substrate 1 after packaging in shearing device Cutting with fixture 9 and for by cut off encapsulation metacoxal plate 1 and the cut-out of singualtion fixture 15.Cut-out fixture 15 2nd adsorption orifice 19A has with encapsulating corresponding 2nd adsorption area respectively of multiple unit areas 7 possessed by metacoxal plate 1.Cutting There is the 1st adsorption area more than the 2nd adsorption area with the 1st adsorption orifice 12 of fixture 9.Unit adsorption area is more than the 2nd absorption Area, wherein, the area that the unit adsorption area is included by the 1st adsorption area, i.e. the unit adsorption area are to adsorb respectively The area of multiple unit areas 7.Therefore, by the 1st adsorption orifice 12 of the unit adsorption area comprising more than the 2nd adsorption area, Encapsulation metacoxal plate 1 with warpage is adsorbed in cutting fixture 9.
Second, first, in the state of the encapsulation metacoxal plate 1 with warpage is adsorbed in into cutting fixture 9, cutting encapsulation A part of thickness in full depth possessed by metacoxal plate 1.Thus, the warpage of encapsulation metacoxal plate 1 is reduced, and after reduction encapsulation The rigidity of substrate 1.Secondly, the encapsulation metacoxal plate 1 after reduction warpage or the encapsulation metacoxal plate 1 after reduction rigidity are placed in cut-out With fixture 15.Cut-out be provided with fixture 15 with encapsulation metacoxal plate 1 possessed by multiple unit areas 7 it is corresponding more respectively Individual 2nd adsorption orifice 19A.By multiple 2nd adsorption orifice 19As corresponding with multiple unit areas 7 difference, stably to adsorb reduction The encapsulation metacoxal plate 1 after encapsulation metacoxal plate 1 or reduction rigidity after warpage.In cut-out with fixture 15, by after cutting off and encapsulating Substrate 1 and manufacture multiple products 27.Therefore, it is possible to cut off the encapsulation metacoxal plate 1 with warpage by being divided into two steps.
3rd, in the size and shape that cutting has the size and shape independent of product with being provided with fixture 9 1st adsorption orifice 12.Due to being not carried out cutting the operation for the full depth that (cut-out) encapsulates metacoxal plate 1, therefore without being used in cutting Cutting groove corresponding with the size of product is set on fixture 9.Therefore, it can easily make and cut compared with fixture with common cut-out Cut and use fixture 9, and the manufacturing cost of cutting fixture 9 can be controlled.In addition, cutting with fixture 9 independent of the size of product and Shape.Therefore, then can be to cutting platform as long as the size of encapsulation metacoxal plate 1 is in the range of cutting is with the size of fixture 9 8A and the cutting general polytype (species) of fixture 9 product.
In addition, by the encapsulation metacoxal plate 1 shown in Fig. 4 A and Fig. 4 B, forming two cuttings extended along long side direction Groove 23b, 23d and three cutting slots 24c, 24e, the 24g extended along short side direction, reduce the warpage of encapsulation metacoxal plate 1.But not It is limited to this, the cutting slot extended along all cutting lines 5 of long side direction extension along encapsulation metacoxal plate 1 can also be formed 23.The cutting slot 24 extended along all cutting lines 6 of short side direction extension along encapsulation metacoxal plate 1 can also be formed.Shape Into in encapsulation metacoxal plate 1 on cutting slot quantity can according to encapsulation metacoxal plate 1 size, encapsulate metacoxal plate 1 thickness, substrate 2 thickness, the thickness of potting resin 4, product 27 (reference picture 5A and Fig. 5 B) size etc. and arbitrarily determine.
In figs. 4 a and 4b, the full depth and potting resin 4 of substrate 2 possessed by metacoxal plate 1 are encapsulated by cutting Full depth in defined caliper portion and form cutting slot.But be not limited to this, can also be by only cutting encapsulation after Defined caliper portion in the full depth of substrate 2 possessed by substrate 1 and form cutting slot.This method is for example set in encapsulation It is effective in the case of full depth of the full depth of fat 4 less than substrate 2.
The resin sheet 11 shown in Fig. 4 A and Fig. 4 B can also be replaced, uses the cut-out of the central portion of substrate 1 after packaging The lower section of line 6 has the resin sheet 11 of the 1st adsorption orifice 12.In such a case it is possible to cut in a cutting line 6 of central portion Disconnected encapsulation metacoxal plate 1.Thus, two semi-finished product are produced from encapsulation metacoxal plate 1.One semi-finished product has 16 (=4 × 4) individual units Region 7.Warpage is reduced in each semi-finished product.Two semi-finished product after reduction warpage are adsorbed in the cut-out shown in Fig. 5 B respectively With on fixture 15.Using the rotating knife 22 shown in Fig. 5 B, each semi-finished product being adsorbed on cut-out fixture 15 are cut off.Except in , can also be after packaging on the cutting line 5,6 of substrate 1 to encapsulation in one cutting line 6 in centre portion outside cut-out encapsulation metacoxal plate 1 Metacoxal plate 1 forms cutting slot 23,24.
Hereinafter, the variation shown in reference picture 6A~Fig. 6 D, to adsorbing a unit area by the 1st adsorption orifice 12 7 area is area i.e. 2nd adsorption plane of the unit adsorption area with adsorbing a unit area 7 by a 2nd adsorption orifice 19A Relation between product illustrates.In the following description, length is represented by abstract number (dimensionless number).
As has been described, unit adsorption area is more than the 2nd adsorption area.However, in unit adsorption area than the 2nd absorption In the case that area is slightly larger, a list can be adsorbed with the absorption affinity slightly larger than the 2nd adsorption orifice 19A by being only limitted to the 1st adsorption orifice 12 Position region 7.
As shown in Fig. 6 A and Fig. 6 B, arrange along the vertical direction the four of the 1st adsorption orifice 12 and Fig. 6 A of this variation Individual unit area 7 accordingly covers the part in addition to those at both ends in constituent parts region 7.One the 1st adsorption orifice 12 is configured as prolonging Extend the outside of the unit area 7 of the upper end and lower end shown in Fig. 6 A.
As shown in Fig. 6 C and Fig. 6 D, as the example of unit area 7 possessed by encapsulation metacoxal plate 1, to the one of unit area 7 The square unit area 7 that edge lengths L1 is 10 illustrates.It is assumed that adsorb unit area using the cut-out fixture 15 shown in Fig. 5 The situation in domain 7.As shown in Figure 6 D, the width L2 for the cutting groove being formed on one side of unit area 7 is 0.5.Therefore, cutting groove Overall width is L2 × 2=1.Separate the wall (being illustrated in figure 6d with hatching) between cutting groove and the 2nd adsorption orifice 19A Thickness is L3=1.
Fig. 6 D are will to be adsorbed in the process of the encapsulation metacoxal plate 1 shown in cut-out Fig. 5 A and Fig. 5 B by the 2nd adsorption orifice 19A Unit area 7 represented as top view.It is an edge lengths L4 with 7 corresponding 2nd adsorption orifice 19A of a unit area For 7 square.Therefore, it is that the 2nd adsorption area S2 is by the area of the 2nd adsorption orifice 19A one unit area 7 of absorption 49 (=L4 × L4=7 × 7).
Reference picture 6D, study in the process for forming cutting slot, pass through the unit adsorption area more than the 2nd adsorption area S2 To adsorb the mode of a unit area 7.Cutting groove (reference picture is not needed in the resin sheet 11 with the 1st adsorption orifice 12 5B cutting groove 21).Thus, cutting groove is removed from Fig. 6 D state, expands adsorption orifice.Adsorption orifice (the 2nd absorption after expansion Mouthful) it is the square that an edge lengths L4 is 8.Therefore, it is by the area of the 2nd adsorption orifice 19A one unit area 7 of absorption 2nd adsorption area S2 is 64 (=L4 × L4=8 × 8).
The unit adsorption area that 1st adsorption area is included is compared with the 2nd adsorption area S2.Unit adsorption area S1 is the 2nd adsorption area S2 64/49 times of (≒ 1.31) times.In this case, inhaled with a unit area 7 for the 1st of object 1st absorption affinity of attached mouth 12 is 1.3 times or so with a unit area 7 for the 2nd adsorption orifice 19A of object the 2nd absorption affinity. According to the multiplying power, preferred unit adsorption area S1 is more than 1.3 times of the 2nd adsorption area S2.Thus, it is placed in resin in absorption In the process of encapsulation metacoxal plate 1 on sheet material 11, produce and base after the encapsulation with warpage is effectively adsorbed by the 1st absorption affinity The effect of plate 1.
Reference picture 6C, study in the process for forming cutting slot, pass through the unit adsorption area more than the 2nd adsorption area S2 To adsorb the another way of a unit area 7.Which is that realization is more than the 2nd adsorption area S2 unit adsorption area again One mode.Fig. 6 C are to make the another mode of the unit area 7 adsorbed in the process for forming cutting slot by the 1st adsorption orifice 12 Represented for top view.The 1st adsorption orifice 12 shown in Fig. 6 C is along the 2nd absorption shown in the above-below direction connected diagram 6D in Fig. 6 A The adsorption orifice that mouth 19A is formed.Therefore, it is unit adsorption area S1 by the area of the 1st adsorption orifice 12 one unit area 7 of absorption For 70 (=(L1-2 × (L2+L3)) × L1=7 × 10).
Another unit adsorption area S1 of the another way of unit area 7 is the 1st adsorption area S1 70/49 times of (≒ 1.43) times.In this case, using a unit area 7 for the 1st adsorption orifice 12 of object the 1st absorption affinity as with a unit Region 7 is 1.4 times or so of the 2nd adsorption orifice 19A of object the 2nd absorption affinity.Based on the multiplying power, preferred unit adsorption area S1 For more than 1.4 times of the 2nd adsorption area S2.Thus, the process for being placed in the encapsulation metacoxal plate 1 on resin sheet 11 in absorption In, produce by the 1st absorption affinity and the effect of encapsulation metacoxal plate 1 of the more effectively absorption with warpage.
Hereinafter, to by setting the time difference to adsorb the variation of encapsulation metacoxal plate 1 using multiple 1st adsorption orifices 12 successively Illustrate.Switch valve is set on the absorption path 13 being respectively connected with multiple 1st adsorption orifices 12.Adsorb path 13 and switch Valve forms a pipe-line system.
As shown in Figure 1B, shrinkage stress when being hardened due to potting resin 4 and encapsulate metacoxal plate 1 typically with both ends to envelope The mode that dress resin 4 side protrudes deforms.In other words, the deformation for encapsulating the both ends of metacoxal plate 1 is maximum.Reference picture 6C and Fig. 6 D, Describe situations below.It is preferred that it is that unit adsorption area S1 is by the area of the 1st adsorption orifice 12 one unit area 7 of absorption Area by the 2nd adsorption orifice 19A one unit area 7 of absorption is more than 1.3 times of the 2nd adsorption area S2.More preferably 1st adsorption area S1 is more than 1.4 times of the 2nd adsorption area S2.
For example, as the 1st variation, instead of two (two row) adsorption orifices (the 1st adsorption orifice) 12 shown in Fig. 2 B, Fig. 4 B Four (four row) the 1st adsorption orifices 12 arranged along the left and right directions in figure are set.A difference in 1st adsorption orifice 12 is suitable The 1st adsorption orifice 12 is arranged (equivalent to shown in Fig. 1 from adjacent two each extended in front to depth direction in the edge shown in Fig. 6 B 2 × 4=8 unit area 7).The absorption path 13 being respectively connected with four the 1st adsorption orifices 12 and switch valve are set.In the feelings Under condition, four pipe-line systems are set.
As shown in Figure 6B, make the side of substrate 2 upward and will encapsulation metacoxal plate 1 be configured at cutting fixture 9 in the case of, The central portion of metacoxal plate 1 is encapsulated, gap is produced between the lower surface of potting resin 4 and the upper surface of resin sheet 11.At this In the case of, first, use (one, the left end of right-hand member of the 1st adsorption orifice 12 accordingly configured with encapsulating the both ends of metacoxal plate 1 One) come adsorb encapsulation metacoxal plate 1.Secondly, after adsorbing encapsulation using remaining 1st adsorption orifice 12 (two of central portion) Substrate 1.Thereby, it is possible to the encapsulation metacoxal plate 1 for adsorbing and keeping to have warpage.
Make the side of substrate 2 possessed by encapsulation metacoxal plate 1 upward and by encapsulation metacoxal plate 1 be adsorbed in cutting fixture 9 In the case of, the full depth of substrate 2 and a part of caliper portion of potting resin 4 preferably possessed by cutting encapsulation metacoxal plate 1 (reference picture 4B).Thus the warpage of encapsulation metacoxal plate 1 is further reduced, and further reduces the rigidity of encapsulation metacoxal plate 1.
Make the side of potting resin 4 upward and will encapsulation metacoxal plate 1 be configured at cutting fixture 9 in the case of, after packaging The both ends of substrate 1, gap is produced between the lower surface of substrate 2 and the upper surface of resin sheet 11.In this case, it is first First, using with encapsulating the 1st adsorption orifice 12 (two of central portion) that accordingly configures of central portion of metacoxal plate 1 come after adsorbing encapsulation Substrate 1.Secondly, base after encapsulation is adsorbed using the 1st adsorption orifice 12 (one of right-hand member, one of left end) at remaining both ends Plate 1.
Make the side of potting resin 4 possessed by encapsulation metacoxal plate 1 upward and by encapsulation metacoxal plate 1 be adsorbed in cutting fixture In the case of 9, the full depth of potting resin 4 and a part of thickness portion of substrate 2 preferably possessed by cutting encapsulation metacoxal plate 1 Point.Thus the warpage of encapsulation metacoxal plate 1 is further reduced, and further reduces the rigidity of encapsulation metacoxal plate 1.
As the 2nd variation, for example, setting and scheming instead of two (two row) the 1st adsorption orifices 12 shown in Fig. 2 B and Fig. 4 B Eight (eight row) the 1st adsorption orifices 12 shown in 6A and Fig. 6 B.The both ends of substrate 1 after packaging, in the lower surface of substrate 2 and tree Between the upper surface of fat sheet material 11 produce gap in the case of, first, using from both ends positioned at second and the 3rd pars intermedia The 1st adsorption orifice 12 (total four) adsorb encapsulation metacoxal plate 1.Secondly, using remaining 1st adsorption orifice 12 (central portion Two and two of both ends) come adsorb encapsulation metacoxal plate 1.Thereby, it is possible to the encapsulation metacoxal plate 1 for adsorbing and keeping to have warpage.
On the 2nd variation, (the quilt especially as shown in Figure 1A in the case of thing is cut off as rectangle in addition to square In the case of thing (encapsulation metacoxal plate 1) is cut off like that for the rectangle with larger aspect ratio) effectively.As a mode, with edge Corresponding one the elongated the 1st set shown in Fig. 6 A of the unit area 7 of multiple (being four in Figure 1A) column-shaped of short side direction Adsorption orifice 12.The 1st elongated adsorption orifice 12 of eight row one is set in a manner of being arranged along long side direction.1st adsorption orifice of eight row 12 are connected to different pipe-line system (eight).Another way possessed by 1st adsorption orifice 12 of eight row is along long side side The mode of two to three the first adsorption orifices 12 to the row of arrangement eight along short side direction arrangement.In these modes, one the 1st suction The area for the encapsulation metacoxal plate 1 that attached mouth 12 is adsorbed is more than the area of a unit area 7.
Alternatively, it is corresponding respectively with the unit area 7 of multiple (being four in Figure 1A) column-shaped along short side direction And the adsorption orifice 12 of four column-shaped is set.Eight row are set to be arranged in four the 1st suctions of a row in a manner of being arranged along long side direction Attached mouth 12.
In either type, the 1st adsorption orifice 12 of eight row is respectively connected to different pipe-line system (eight).Either one Formula uses multiple 1st adsorption orifices successively all in accordance with deformation (including warpage, fluctuating) mode of cut-off thing to set the time difference 12.Thereby, it is possible to effectively adsorb the cut-off thing with warpage.
As the example using these eight the 1st adsorption orifices 12 arranged, following example can be enumerated.From central portion to both ends successively Use the 1st adsorption orifice 12 of eight row.From both ends to central portion successively using the 1st adsorption orifice 12 of eight row.The 1st of eight row is inhaled After attached mouth 12 is from the pars intermedia between centrally located portion and both ends to central portion successively use, from pars intermedia to both ends according to Secondary use.After the 1st adsorption orifice 12 that eight are arranged is from pars intermedia to both ends successively use, make successively from pars intermedia to central portion With.From a short side, laterally another short brink uses eight the 1st adsorption orifices 12 arranged successively.
Jointing tape of the one side formed with bonding agent can also be used, the grade of encapsulation metacoxal plate 1 for being pasted on adhesive tape is cut Disconnected thing is together adsorbed in resin sheet 11 (reference picture 4B) possessed by cutting fixture 9 with the adhesive tape.Having shown in Fig. 4 B The resin sheet 11 of 1st adsorption orifice 12 adsorbs the adhesive tape for being pasted with cut-off thing.Thus, being cut off with warpage will be pasted with The adhesive tape of thing is effectively adsorbed on the resin sheet 11 of cutting fixture 9.
As shown in fig. 4 a and fig. 4b, using cutoff tool 22, cutting is formed on the cut-off thing for be adsorbed in resin sheet 11 Groove 23,24.In the case of using adhesive tape, the cut-off thing for being adsorbed in resin sheet 11 can also be cut using cutoff tool 22 It is disconnected.In this case, untill the assigned position for the thickness that the lower end of cutoff tool 22 reaches adhesive tape, decline cutoff tool 22. Afterwards, cutoff tool 22 is relatively moved with cutting fixture 9, cut-off thing is cut off.In this case, the cutting shown in Fig. 4 By the use of fixture 9 as cut-out function is played with fixture.
It is separated from adhesive tape by adsorbing each product 27 (reference picture 5A and Fig. 5 B) after cutting off, and transfer and store In pallet.As bonding agent possessed by adhesive tape, ultraviolet ray hardening type bonding agent is used.Product 27 after by cut-out is adhered to In the state of adhesive tape, ultraviolet is irradiated to adhesive tape, thus reduces the bonding force of bonding agent.Therefore, it is possible to pass through absorbent articles 27 And it is set easily to be separated from adhesive tape.
Will encapsulation metacoxal plate 1 be placed in possessed by cutting fixture 9 on resin sheet 11 when, preferred conveyance fixture (not shown) processing encapsulates metacoxal plate 1 as follows.First, the encapsulation metacoxal plate 1 shown in Fig. 3 B is adsorbed with fixture in conveyance In the state of possessed substrate 2, encapsulation metacoxal plate 1 is placed on the upper surface of the resin sheet 11 shown in Fig. 4 B.Secondly, Somewhat moved in the -Z direction shown in Fig. 4 B with fixture by conveyance and encapsulation metacoxal plate 1 is pressed into the upper of resin sheet 11 On surface.Thus, the warpage (reference picture 3B) of correction encapsulation metacoxal plate 1.Secondly, will using the 1st adsorption orifice 12 shown in Fig. 4 B Encapsulation metacoxal plate 1 is adsorbed on the upper surface of resin sheet 11.By process so far, encapsulation metacoxal plate 1 is had The major part of lower surface of potting resin 4 be adsorbed on the upper surface (reference picture 4B) of resin sheet 11.Secondly, conveyance is used Fixture releases the absorption to encapsulating metacoxal plate 1.Secondly, after conveyance fixture rises, such as by making the conveyance fixture Moved in the X-direction or Y-direction shown in Fig. 4 B and leave the top of cutting fixture 9.
Embodiment 2
Reference picture 7 illustrates to the embodiment 2 of the shearing device of the present invention.As shown in fig. 7, shearing device 28 is by quilt Cut-out thing monolithic turns to the device of multiple products.Shearing device 28 possesses substrate supplying module A, the base respectively as structural element Plate cuts off module B and checks module C.Each structural element (each modules A~C) be respectively relative to other structures key element can load and unload and It can change.
Substrate feed mechanism 29 is provided with substrate supplying module A.Will be equivalent to be cut off thing encapsulation metacoxal plate 1 from Substrate feed mechanism 29 takes out of, and is transferred to substrate cutting module B by transfer mechanism (not shown).
Shearing device 28 shown in Fig. 7 is double shearing devices for cutting (twin-cut) platform mode.Therefore, in substrate cutting mould A cutting platform 8A and a cut-out platform 8B are provided with block B.Pressed from both sides in cutting with cutting is provided with platform 8A Have 9 (reference picture 2A and Fig. 2 B).In cut-out with being provided with cut-out fixture 15 (reference picture 3A and Fig. 3 B) on platform 8B.Cutting is used Platform 8A can be moved by travel mechanism 30A along the Y-direction in figure, and can be turned by rotating mechanism 31A along θ directions It is dynamic.Cut-out can be moved with platform 8B by travel mechanism 30B along the Y-direction in figure, and by rotating mechanism 31B and can Rotated along θ directions.
Position alignment camera (not shown) is provided with substrate cutting module B.Position alignment camera can be independent Move in X direction on ground.Two mandrels 32A, 32B as shut-off mechanism are provided with substrate cutting module B.Shearing device 28 It is provided with the shearing device of the diplocardia axle construction of two mandrels 32A, 32B.Mandrel 32A, 32B can be independently along X-direction and Z Move in direction.Cutting water nozzle (not shown) is provided with mandrel 32A, 32B, the cutting water nozzle is in order to suppress because of height Speed rotation rotating knife 22A, 22B caused by frictional heat and spray cutting water.By making cutting platform 8A relative with mandrel 32A Movement forms cutting slot to cut encapsulation metacoxal plate 1.Envelope is cut off by making cut-out be relatively moved with platform 8B and mandrel 32B Fill metacoxal plate 1 and make its singualtion.Rotating knife 22A passes through the base after the face inward turning comprising Y-direction and Z-direction transfers cutting encapsulation Plate 1.Rotating knife 22B in the face inward turning comprising Y-direction and Z-direction by transferring cut-out encapsulation metacoxal plate 1.
Inspection platform 33 is provided with module C is checked.Inspection be placed with platform 33 by will encapsulate metacoxal plate 1 Cut off and the aggregate of multiple products 27 (reference picture 5A and Fig. 5 B) of singualtion composition i.e. cut-out metacoxal plate 34.Used by checking Camera is (not shown) to be checked multiple products 27 and is screened as certified products and substandard products.Certified products are accommodated in pallet 35.
In addition, in the present embodiment, by for carry out shearing device 28 operation, encapsulate metacoxal plate 1 conveyance, after encapsulation The control unit CTL of all operations such as the cutting and cut-out of substrate 1 and the inspection of product 27 or control is arranged at substrate supply mould In block A.But this is not limited to, control unit CTL can also be arranged in other modules.
In substrate cutting module B, first, loaded and adsorbed with fixture 9 with platform 8A cutting being installed on cutting Encapsulate metacoxal plate 1.Secondly, by being installed on mandrel 32A rotating knife 22A and the base after the encapsulation of cutting fixture 9 is adsorbed in Cutting slot is formed on plate 1.For example, cut complete along a part of cutting line being set in a plurality of cutting line of encapsulation metacoxal plate 1 A part of thickness in portion's thickness.By forming cutting slot on substrate 1 after packaging to reduce the warpage of encapsulation metacoxal plate 1.
Secondly, the encapsulation metacoxal plate 1 after reduction warpage is placed in cut-out fixture 15.Due to reducing encapsulation metacoxal plate 1 warpage, therefore stably adsorbed equivalent to product 27 by being formed at cut-out with each 2nd adsorption orifice 19A of fixture 15 Constituent parts region 7 (reference picture 3A and Fig. 3 B).By being installed on mandrel 32B rotating knife 22B cut-out use is adsorbed in cut off The encapsulation metacoxal plate 1 of fixture 15.The full depth of encapsulation metacoxal plate 1 is cut off along the cutting line for being set in encapsulation metacoxal plate 1, and And cut off the residual thickness in the full depth equivalent to encapsulation metacoxal plate 1 along the cutting slot for being formed at encapsulation metacoxal plate 1 Part.Thus, by the way that the singualtion of metacoxal plate 1 will be encapsulated and article of manufacture 27 (reference picture 5A and Fig. 5 B).
In the present embodiment, double shearing devices 28 for cutting platform mode and diplocardia axle construction are illustrated.It is but and unlimited In this, the present invention can also be applied to double shearing devices for cutting platform mode and holocentric axle construction.
In the present embodiment, in as double shearing devices 28 for cutting platform mode, cutting fixture 9 is installed on cutting and used Platform 8A, and cut-out fixture 15 is installed on cut-out platform 8B.But this is not limited to, to singly cutting flat-bed format using two Shearing device situation can also apply the present invention.In this case, cutting fixture 9 is installed on a shearing device, and Special purpose device using a shearing device as the warpage for reducing encapsulation metacoxal plate 1.Cut-out fixture 15 is installed on another Shearing device, and using another shearing device as by cutting off encapsulation metacoxal plate 1 and the special purpose device of singualtion.
Embodiment 3
Reference picture 8 illustrates to the embodiment 3 of the shearing device of the present invention.As shown in figure 8, the present embodiment is cut off Thing has the flat shape of circular.It is, for example, crystalline substance after the encapsulation being made up of the semiconductor crystal wafer after resin-encapsulated to be cut off thing Circle 36.Wafer 36 has multiple (being 52 in Fig. 8) unit area 7, groove NT and potting resins (not shown) after encapsulation.Each Formed with circuit in unit area 7.Wafer after encapsulation 36 is used by making semiconductor crystal wafer main body W be placed in cutting in a manner of upward On the resin sheet 11 of fixture 9 (reference picture 2A and Fig. 2 B).Cut-off thing can also be that semiconductor chip is installed on circle Circular encapsulation metacoxal plate on the constituent parts region 7 of the printed base plate of shape flat shape.
As shown in figure 8, it is provided with resin sheet 11 with the 2nd adsorption area corresponding with a unit area 7 2nd adsorption orifice 37 (equivalent to the 2nd adsorption orifice 19A shown in Fig. 3 A and Fig. 3 B, Fig. 5 B).It is provided with and all unit areas 7 Quantity be N number of (for example, in the case of fig. 8 be 52) equal quantity the 2nd adsorption orifice 37.For ease of observing Fig. 8, In the 2nd adsorption orifice 37 possessed by resin sheet 11 only in first adsorption orifice 37 positioned at bottom right, the thinner void of use Line is represented for the wall between the adsorption orifice 37 of zoning the 2nd.
One group of (52) the 2nd adsorption orifice 37 is connected to aspirating mechanism and (not schemed via each absorption path 38 and switch valve Show).Each 2nd adsorption orifice 37 and each absorption path 38 for being arranged at resin sheet 11 have with being arranged at resin sheet shown in Fig. 5 B Each 2nd adsorption orifice 19A of material 17 and each absorption path 19B identical structures.
In the present embodiment, by corresponding 52 the 2nd adsorption orifices 37 divide for shown in Fig. 8 respectively with 52 unit areas 7 Three groups.Centered on three groups organize SA1, the middle groups SA2 on the outside of it and positioned at outermost outer rim group SA3 this three Individual group.Each equivalent to one the 1st adsorption orifice (the 1st adsorption orifice 12 shown in reference picture 2A and Fig. 2 B) in three groups.
Central. set SA1 has four the 2nd adsorption orifices 37.Therefore, adsorption orifice possessed by central. set SA1 (the 1st adsorption orifice) For the aggregate of four the 2nd adsorption orifices 37.Adsorption area possessed by the aggregate (the 1st adsorption area) is one the 2nd absorption The summation of adsorption area (is in this case four of adsorption area possessed by the 2nd adsorption orifice 37 possessed by mouth 37 Times).Equally, adsorption orifice possessed by middle groups SA2 (the 1st adsorption orifice) is the aggregate of 32 the 2nd adsorption orifices 37.The aggregate Possessed adsorption area (the 1st adsorption area) is 32 times of adsorption area possessed by the 2nd adsorption orifice 37.Outer rim group Adsorption orifice possessed by SA3 (the 1st adsorption orifice) is the aggregate of 16 the 2nd adsorption orifices 37.Adsorption plane possessed by the aggregate Product (the 1st adsorption area) is 16 times of adsorption area possessed by the 2nd adsorption orifice 37.
In the metallic plate (metallic plate 10 shown in reference picture 2) of the lower section of resin sheet of cutting fixture is arranged at, Multiple 2nd adsorption orifices 37 all connections possessed by central. set SA1, multiple 2nd adsorption orifices 37 possessed by middle groups SA2 are all Connection, and multiple 2nd adsorption orifices 37 all connections possessed by outer rim group SA3.Each 2nd adsorption orifice possessed by central. set SA1 37 are connected with being arranged at the aspirating mechanism (not shown) of outside via each absorption path 38 and the 1st switch valve (not shown).In Between organize the 2nd adsorption orifice 37 possessed by SA2 and connect with aspirating mechanism via each absorption path 38 and the 2nd switch valve (not shown) Connect.2nd adsorption orifice 37 possessed by outer rim group SA3 is with aspirating mechanism via each absorption switch valve (not shown) of path 38 and the 3rd And connect.An aspirating mechanism being used in conjunction with is provided with each group.
In the present embodiment, while each 2nd adsorption orifice 37 possessed by central. set SA1 is used, possessed by middle groups SA2 2nd each adsorption orifice 37 possessed by each 2nd adsorption orifice 37 and outer rim group SA3 come adsorb encapsulation after wafer 36.In addition, in this reality Apply in example, following variation can also be used：That is, inhaled successively using multiple 2nd adsorption orifices 37 by setting the time difference Wafer 36 after attached encapsulation.
The central portion of wafer 36 after packaging, produced between the lower surface of potting resin and the upper surface of resin sheet 11 In the case of gap, preferably wafer 36 after encapsulation is adsorbed by outer rim group SA3, middle groups SA2 and central. set SA1 order.Root According to the warpage mode of wafer after encapsulation 36, after absorption encapsulation the order of wafer 36 can also be middle groups SA2, it is central. set SA1, outer Edge group SA3 order, it can also be middle groups SA2, outer rim group SA3, central. set SA1 order.
The outer edge of wafer 36 after packaging, produced between the lower surface of semiconductor crystal wafer and the upper surface of resin sheet In the case of gap, preferably wafer 36 after encapsulation is adsorbed by central. set SA1, middle groups SA2 and outer rim group SA3 order.Root According to the warpage mode of wafer after encapsulation 36, after absorption encapsulation the order of wafer 36 can also be middle groups SA2, it is central. set SA1, outer Edge group SA3 order, it can also be middle groups SA2, outer rim group SA3, central. set SA1 order.
According to the present embodiment, it is provided with resin sheet 11 and 7 corresponding adsorption orifices 37 of a unit area.It is right The whole region of wafer 36 sets the group that multiple (being three in Fig. 8) are made up of multiple 2nd adsorption orifices 37 after encapsulation.Set and three The pipe-line system of 3 systems corresponding to individual group of difference.In addition, according to this variation, according to the warpage mode of wafer after encapsulation 36, according to It is secondary to adsorb wafer 36 after encapsulation using multiple groups.Thus, first, can be according to the warpage mode of wafer after encapsulation 36, suitably Wafer 36 after absorption encapsulation.Second, in the case of using jointing tape, it can lead in cutting fixture and cut-out fixture With resin sheet 11.
Multiple 2nd adsorption orifices 37 can also be divided for more groups.For example, it is also possible to the middle groups SA2 shown in Fig. 8 is divided To have eight groups of the square shape of four the 2nd adsorption orifices 37 respectively.Can also be point by SA3 points of outer rim group shown in Fig. 8 Not Ju You four the 2nd adsorption orifices 37 column-shaped four groups.Thus, can be stuck up according to wafer 36 after the encapsulation as cut-off thing The modes of texturing such as bent, fluctuating, bending, wafer 36 after encapsulation is adsorbed by the best approach.
For summary, according to from distance of the upper surface of resin sheet 11 untill the lower surface of cut-off thing (hereinafter referred to as For " isolation distance ") cut-off thing is adsorbed as follows.First, accordingly configured in use and isolation distance the best part Multiple 2nd adsorption orifices 37 after adsorbing cut-off thing, accordingly configured (with the part phase using the periphery with the part It is adjacent) multiple 2nd adsorption orifices 37 adsorb cut-out thing.Second, using with the periphery of isolation distance the best part accordingly Multiple 2nd adsorption orifices 37 of configuration are come after adsorbing cut-off thing, using positioned at the periphery of multiple 2nd adsorption orifices 37 used Multiple 2nd adsorption orifices 37 adsorb cut-off thing.3rd, using the part (quilt minimum with isolation distance in cut-off thing Cutting off the lower surface and the part of the upper surface of resin sheet 11 of thing) multiple 2nd adsorption orifices 37 for accordingly configuring inhale After attached cut-off thing, quilt is adsorbed using multiple 2nd adsorption orifices 37 positioned at the periphery of multiple 2nd adsorption orifices 37 used Cut off thing.
As shown in figure 8, an adsorption orifice group being made up of multiple 2nd adsorption orifices 37 is configured to substantially concentric circles successively (or frame-shaped with identical central).Cut-off thing is adsorbed by setting the time difference using multiple adsorption orifice groups successively.Can According to deformation (including warpage, fluctuating, bending) mode of cut-off thing, multiple adsorption orifices are used successively by setting the time difference Group adsorbs cut-off thing.
It is rectangle (encapsulation metacoxal plate 1 especially as shown in Figure 1A in addition to square in the flat shape for being cut off thing There is the rectangle of larger aspect ratio like that) in the case of, as follows using above-mentioned multiple adsorption orifice groups.Can be from center Portion uses multiple adsorption orifice groups successively to both ends (left end and right-hand member in Figure 1A).Can also be from both ends to central portion successively Use multiple adsorption orifice groups.Can also from the pars intermedia between centrally located portion and both ends to central portion successively using multiple After adsorption orifice group, used successively from pars intermedia to both ends.Can also by multiple adsorption orifice groups from pars intermedia to both ends according to After the multiple adsorption orifice groups of secondary use, used successively from pars intermedia to central portion.Can also be from the cut-off thing shown in Figure 1A One end (left or right in Figure 1A) uses multiple adsorption orifice groups successively to the other end (right-hand member or left end).
(included in the case where the flat shape for being cut off thing is square or circle as the rectangle close to square Situation or encapsulation as shown in Figure 8 after the situation about being substantially round like that of wafer 36), as follows using above-mentioned more Individual adsorption orifice group.Multiple adsorption orifice groups can be used successively from central portion to periphery.Can also from periphery to central portion according to It is secondary to use multiple adsorption orifice groups.Can also be by multiple adsorption orifice groups from the pars intermedia between centrally located portion and periphery to center Portion after use, uses successively from pars intermedia to periphery successively.Can also be by multiple adsorption orifice groups from pars intermedia to periphery Successively after use, used successively from pars intermedia to central portion.Can also be from one end of the cut-off thing shown in Fig. 8 to the other end Multiple adsorption orifice groups are used successively.
It can also replace setting multiple equivalent to one absorption by the adsorption orifice group that multiple 2nd adsorption orifices 37 are formed One adsorption orifice of mouth group.For example, set gradually from the right-hand member of the cut-off thing shown in Fig. 8 and vertically extending four An adsorption orifice (equivalent to four the 2nd adsorption orifices 37 of the right-hand member shown in Fig. 8) and six units corresponding to individual unit area 7 It is an adsorption orifice corresponding to region 7, four row and an adsorption orifice corresponding to eight unit areas 7, corresponding with six unit areas 7 An adsorption orifice and with four unit areas, 7 corresponding adsorption orifices.
A variety of setting time differences can also be ready to pass through and use the mode of multiple adsorption orifice groups successively.It will realize that these are more The various software of kind mode is stored in the control unit CTL shown in Fig. 7.Control unit CTL selects optimal software from various software, And perform the optimal software.Untill absorption is cut off thing control unit CTL can also be made to perform various software successively.Also The metrological service of the deformation of cut-off thing can be provided for measuring in the shearing device shown in Fig. 7.According to passing through dosing machine The mode (turning into size specified, deformed of concavo-convex part etc.) of the deformation of structure measurement, control unit CTL selects from various software Select optimal software and perform the optimal software.
In addition, illustrated with the flat shape comprising long side direction and the rectangle of short side direction in embodiment 1,2 Encapsulation metacoxal plate 1 as being cut off thing and situation about cutting off.Illustrating in embodiment 3 substantially will have circular flat shape Wafer 36 is as the situation for being cut off thing and cutting off after the encapsulation of shape.But this is not limited to, there is rectangle (comprising pros in cut-out Shape) beyond and circle beyond irregular flat shape cut-off thing in the case of can also apply the present invention.
Illustrate in embodiments using the encapsulation metacoxal plate 1 formed with potting resin 4 on a substrate 2 as cut-off thing And situation about cutting off.Not limited to this, as the substrate in cut-off thing, lead frame, glass epoxide laminate, printing cloth can be used Line plate, ceramic substrate, metallic substrates substrate or film basal substrate etc., the encapsulation formed for forming potting resin on the substrate Metacoxal plate, the present invention can also be applied.
As function element, except semiconductors such as IC (Integrated Circuit, integrated circuit), transistor or diodes Beyond element, sensor, wave filter, actuator or oscillator etc. can also be included.It can also be equipped with a unit area 7 more Individual function element.
As has been described, cut-out such as by using potting resin partly leading silicone semiconductor or compound semiconductor , can in the case that the body wafer wafer-level packaging that resin-encapsulated forms in the lump substantially has round-shaped cut-off thing like that Using the present invention.In this case, potting resin is equivalent to insulating component.In the cut-off thing that will be made up of semiconductor crystal wafer In the case of cut-out, the present invention can be applied.In this case, for protecting the passivating film for the circuit for being formed at semiconductor crystal wafer suitable In insulating component.In above-mentioned two situations, semiconductor crystal wafer is equivalent to the substrate formed with circuit.
Can be not only as active component as the shaped like chips element 3 on the constituent parts region 7 being equipped in substrate 2 A shaped like chips element 3 or multiple shaped like chips elements (including passive element).Shaped like chips element 3 is only to illustrate, The mechanism parts such as connector, oscillator, sensor, wave filter etc. can be equipped on constituent parts region 7.
For the warpage of tabular component to be suppressed in making as the process of the synthetic resin singualtion of tabular component In the case of, the present invention can be applied.For example, by making to manufacture lens, micro- as the synthetic resin singualtion of tabular component In the case of the optics such as lens array, optical module, light guide plate, the present invention can be applied.In this case, lens, micro- Lens array, optical module, light guide plate etc. are equivalent to function element.In addition, by making synthetic resin singualtion and the company of manufacture In the case of connecing the common moulded products such as device, the present invention can be applied.In this case, moulded products are equivalent to function element. In the case of various comprising these situations, the content of this explanation can be applicable to.
The present invention is not limited to the various embodiments described above, without departing from the spirit and scope of the invention, can be as needed It is any and appropriately combined and changed or optionally used.
Description of reference numerals
1 encapsulation metacoxal plate (cut-off thing)
1a, 1b, 1c end material portion
2 substrates (the 1st component)
3 shaped like chips elements
4 potting resins (the 2nd component)
5 the 1st cutting lines (cutting line)
6 the 2nd cutting lines (cutting line)
7 unit areas
Platform (the 1st platform) is used in 8A cuttings
Platform (the 2nd platform) is used in 8B cut-outs
Fixture (the 1st fixture) is used in 9 cuttings
10th, 16 metallic plate
11st, 17 resin sheet
12 the 1st adsorption orifices
13rd, 19B, 38 absorption paths
14 spaces
Fixture (the 2nd fixture) is used in 15 cut-outs
18 juts
19A, 37 the 2nd adsorption orifices
20 the 1st cutting grooves
21 the 2nd cutting grooves
22 rotating knifes (the 1st rotating knife, the 2nd rotating knife)
22A rotating knifes (the 1st rotating knife)
22B rotating knifes (the 2nd rotating knife)
23rd, the cutting slot (cutting slot) of 23b, 23d the 1st
24th, the cutting slot (cutting slot) of 24c, 24e, 24g the 2nd
25th, 25a, 25b the 1st cuts off trace
26th, 26a, 26b the 2nd cuts off trace
27 products
28 shearing devices (manufacture device)
29 substrate feed mechanisms
30A, 30B travel mechanism
31A, 31B rotating mechanism
32A mandrels (shut-off mechanism, the 1st shut-off mechanism)
32B mandrels (shut-off mechanism, the 2nd shut-off mechanism)
33 inspection platforms
34 cut-out metacoxal plates
35 pallets
Wafer (cut-off thing) after 36 encapsulation
A substrate supplying modules
B substrate cutting modules
C checks module
CTL control units
The length on one side of L1 unit areas
L2 is formed at the width of the cutting slot on one side of unit area
L3 separates the thickness of the wall between cutting slot and adsorption orifice
The length on one side of the adsorption orifices of L4 the 1st
NT grooves
S1 unit adsorption areas
The adsorption areas of S2 the 2nd
SA1 central. sets
SA2 middle groups
SA3 outer rim groups
W semiconductor crystal wafer main bodys

Claims (20)

1. a kind of adsorbing mechanism, used during following：That is, by adsorbing with multiple units by a plurality of cutting line zoning The cut-off thing in region simultaneously cuts off the cut-off thing, distinguishes corresponding multiple systems with multiple unit areas so as to manufacture Product,
The adsorbing mechanism is characterised by possessing：
1st platform, for loading the cut-off thing；
1st fixture, it is installed on the 1st platform；And
One or more 1st adsorption orifices, are arranged on the 1st fixture, adsorb the quilt by the 1st adsorption area respectively Cut off thing,
Unit adsorption area is more than the 2nd adsorption area, wherein, the unit adsorption area is included by the 1st adsorption area Area, i.e., described unit adsorption area is the area of one unit area of absorption, and the 2nd adsorption area is by institute State in the 2nd fixture used in the process of cut-off thing cut-out with multiple unit areas respectively correspondingly zoning set it is more Each the 2nd adsorption orifice in individual 2nd adsorption orifice adsorbs the area of a unit area.
2. a kind of adsorption method, used during following：That is, by adsorbing with multiple units by a plurality of cutting line zoning The cut-off thing in region simultaneously cuts off the cut-off thing, distinguishes corresponding multiple systems with multiple unit areas so as to manufacture Product,
The adsorption method is characterised by, including following process：
Prepare the 1st platform for loading the cut-off thing；
Prepare the 1st fixture being arranged on the 1st platform；
Prepare one or more 1st adsorption orifices, the 1st adsorption orifice is arranged on the 1st fixture, is inhaled respectively by the 1st Attached area adsorbs the cut-off thing；And
Using one or more 1st adsorption orifices and the cut-off thing is adsorbed by unit adsorption area, wherein, it is described The area that unit adsorption area is included by the 1st adsorption area, i.e., described unit adsorption area are one list of absorption The area in position region,
The unit adsorption area is more than the 2nd adsorption area, wherein, the 2nd adsorption area is to be cut by the cut-off thing In the 2nd fixture used in disconnected process with multiple unit areas respectively correspondingly zoning set multiple 2nd adsorption orifices In each the 2nd adsorption orifice adsorb a unit area area.
3. a kind of manufacture device, possesses：Shut-off mechanism, for the quilt with multiple unit areas by a plurality of cutting line zoning Cut-out thing is cut；And rotating knife, it is arranged at the shut-off mechanism, the manufacture device is by by the cut-off thing Cut off and manufacture and used with during multiple unit areas respectively corresponding multiple products,
The manufacture device is characterised by,
Possesses the adsorbing mechanism described in claim 1.
4. a kind of manufacture device, possesses：Shut-off mechanism, for the quilt with multiple unit areas by a plurality of cutting line zoning Cut-out thing is cut；And rotating knife, it is arranged at the shut-off mechanism, the manufacture device is by by the cut-off thing Cut off and manufacture and used with during multiple unit areas respectively corresponding multiple products,
The manufacture device is characterised by possessing：
1st platform, for loading the cut-off thing；
2nd platform, for loading the cut-off thing；
Travel mechanism, for making the 1st platform and the 2nd platform be relatively moved with the shut-off mechanism；
1st fixture, it is installed on the 1st platform；
One or more 1st adsorption orifices, are arranged on the 1st fixture, adsorb the quilt by the 1st adsorption area respectively Cut off thing；
2nd fixture, it is installed on the 2nd platform；And
Multiple 2nd adsorption orifices, respectively correspondingly set with multiple unit areas in the 2nd fixture, and pass through respectively 2nd adsorption area adsorbs a unit area,
Unit adsorption area is more than the 2nd adsorption area, wherein, the unit adsorption area is the 1st adsorption area institute Comprising area, i.e., described unit adsorption area is to adsorb the areas of multiple unit areas respectively,
In the 1st fixture, cut by the rotating knife along at least one cutting line in a plurality of cutting line A part of thickness in the full depth of the cut-off thing is cut, so as to form at least one cutting slot,
In the 1st fixture, the semi-finished product with multiple intermediate regions by the cutting slot zoning are formed,
In the 2nd fixture, the semi-finished product are cut off along a plurality of cutting line by using the rotating knife, so as to make Make the multiple products adsorbed respectively by multiple 2nd adsorption orifices.
5. manufacture device according to claim 4, it is characterised in that possess：
1st shut-off mechanism possessed by the shut-off mechanism；And
2nd shut-off mechanism possessed by the shut-off mechanism,
In the 1st fixture, the cutting slot is formed by being arranged at the 1st rotating knife of the 1st shut-off mechanism,
In the 2nd fixture, the semi-finished product are cut off by being arranged at the 2nd rotating knife of the 2nd shut-off mechanism.
6. manufacture device according to claim 4, it is characterised in that
1st fixture can adsorb the 1st cut-off thing comprising multiple 1st unit areas with the 1st size respectively, and energy 2nd cut-off thing of the absorption comprising multiple 2nd unit areas with 2nd size different from the 1st size respectively.
7. manufacture device according to claim 4, it is characterised in that
The cutting slot is formed along all cutting lines in a plurality of cutting line.
8. manufacture device according to claim 4, it is characterised in that
The cut-off thing is the tabular component that function element is respectively formed with multiple unit areas.
9. the manufacture device according to any one of claim 4~8, it is characterised in that
The cut-off thing at least has by base material the 1st component formed and the 2nd component being formed on the base material,
The cutting slot is formed at least on full depth of the 1st component, or is formed at least complete of the 2nd component On portion's thickness.
10. the manufacture device according to any one of claim 4~8, it is characterised in that
The cut-off thing at least has by base material the 1st component formed and the 2nd component being formed on the base material,
The cutting slot is formed on a part of thickness in the full depth of the 1st component, or is formed at the 2nd structure On a part of thickness in the full depth of part.
11. the manufacture device according to claim 9 or 10, it is characterised in that
1st component is the substrate formed with circuit,
2nd component is insulating component.
12. a kind of manufacture method, including following process：Make being cut off with multiple unit areas by a plurality of cutting line zoning Thing relatively moves with shut-off mechanism；And the cut-off thing, institute are cut using rotating knife possessed by the shut-off mechanism Manufacture method is stated by the way that the cut-off thing cut-out through cutting is corresponding respectively with multiple unit areas to manufacture Used during multiple products,
The manufacture method is characterised by,
Possesses the adsorption method described in claim 2.
13. a kind of manufacture method, including following process：Make being cut off with multiple unit areas by a plurality of cutting line zoning Thing relatively moves with shut-off mechanism；The cut-off thing is cut using rotating knife possessed by the shut-off mechanism；And make The cut-off thing through cutting is cut off with the rotating knife, the manufacture method by will the cut-off thing cut off and Manufacture uses with during multiple unit areas respectively corresponding multiple products,
The manufacture method is characterised by, including following process：
Prepare the 1st platform for loading the cut-off thing；
Prepare the 2nd platform for loading the cut-off thing；
Prepare the 1st fixture, the 1st fixture is installed on the 1st platform, is had and is included the one of the 1st adsorption area respectively Individual or multiple 1st adsorption orifices；
Prepare the 2nd fixture, the 2nd fixture is installed on the 2nd platform, and it is right respectively with multiple unit areas to have Multiple 2nd adsorption orifices of the 2nd adsorption area and should be included respectively；
In the 1st fixture, adsorbed using each the 1st adsorption orifice in one or more 1st adsorption orifices described It is cut off thing；
As the cutting process, in the 1st fixture, by using the rotating knife along a plurality of cutting line extremely Lack a cutting line and cut a part of thickness in the full depth of the cut-off thing, cut so as to form at least one Cut groove；
In the 1st fixture, the semi-finished product with multiple intermediate regions by the cutting slot zoning are formed；
The semi-finished product are loaded on the 2nd fixture；
In the 2nd fixture, described half is adsorbed by using each the 2nd adsorption orifice in multiple 2nd adsorption orifices Each in multiple unit areas possessed by finished product, so as to adsorb the semi-finished product；And
It is described partly along a plurality of cutting line cut-out using the rotating knife in the 2nd fixture as the cut off operation Finished product,
Unit adsorption area is more than the 2nd adsorption area, wherein, the unit adsorption area is the 1st adsorption area institute Comprising area, i.e., described unit adsorption area is to adsorb the areas of multiple unit areas respectively,
Manufactured by the way that the semi-finished product are cut off by the more of each the 2nd adsorption orifice absorption in multiple 2nd adsorption orifices The individual product.
14. manufacture method according to claim 13, it is characterised in that including following process：
Prepare the 1st shut-off mechanism with the 1st rotating knife to be used as the shut-off mechanism；
Prepare the 2nd shut-off mechanism with the 2nd rotating knife to be used as the shut-off mechanism；
As the process for making the cut-off thing be relatively moved with the shut-off mechanism, the cut-off thing is set to be cut with the described 1st Breaking mechanism relatively moves；And
As the process for making the cut-off thing be relatively moved with the shut-off mechanism, the semi-finished product are made to be cut off with the described 2nd Mechanism relatively moves,
In the process for forming the cutting slot, the cutting slot is formed by the 1st rotating knife,
In the process for cutting off the semi-finished product, the semi-finished product are cut off by the 2nd rotating knife.
15. manufacture method according to claim 13, it is characterised in that
In the process for adsorbing the cut-off thing, the 1st fixture can be used, there is the 1st size respectively to adsorb to include Multiple 1st unit areas the 1st be cut off thing, and can adsorb include there is 2nd chi different from the 1st size respectively The 2nd of very little multiple 2nd unit areas is cut off thing.
16. manufacture method according to claim 13, it is characterised in that
In the process for forming the cutting slot, the cutting slot is formed along all cutting lines in a plurality of cutting line.
17. manufacture method according to claim 13, it is characterised in that
The cut-off thing is the tabular component that function element is respectively formed with multiple unit areas.
18. the manufacture method according to any one of claim 13~17, it is characterised in that
The cut-off thing at least has by base material the 1st component formed and the 2nd component being formed on the base material,
In the process for forming the cutting slot, the cutting slot is formed on the full depth of the 1st component, or in institute State and form the cutting slot on the full depth of the 2nd component.
19. the manufacture method according to any one of claim 13~17, it is characterised in that
The cut-off thing at least has by base material the 1st component formed and the 2nd component being formed on the base material,
Described in being formed in the process for forming the cutting slot, on a part of thickness in the full depth of the 1st component The cutting slot is formed on cutting slot, or a part of thickness in the full depth of the 2nd component.
20. the manufacture method according to claim 18 or 19, it is characterised in that
1st component is the substrate formed with circuit,
2nd component is insulating component.
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JP6338555B2 (en) 2018-06-06

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