CN107533965B - Adsorption mechanism, adsorption method, manufacturing device and manufacturing method - Google Patents

Adsorption mechanism, adsorption method, manufacturing device and manufacturing method Download PDF

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Publication number
CN107533965B
CN107533965B CN201680025715.XA CN201680025715A CN107533965B CN 107533965 B CN107533965 B CN 107533965B CN 201680025715 A CN201680025715 A CN 201680025715A CN 107533965 B CN107533965 B CN 107533965B
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cutting
cut
area
jig
suction
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CN107533965A (en
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傅藤胜则
今井一郎
石桥干司
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Towa Corp
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The packaged substrate formed with the plurality of unit regions is sucked to the cutting jig through a1 st suction port provided in the cutting jig and having a1 st suction area. On at least a part of the cutting line of the absorbed packaged substrate, a cutting groove is formed by using a1 st rotary knife. The packaged substrate is sucked to the cutting jig through a plurality of 2 nd suction ports provided in the cutting jig. One 2 nd adsorption port adsorbs one unit region by the 2 nd adsorption area. The packaged substrate is cut by a2 nd rotary knife on a cutting line of the packaged substrate sucked by the cutting jig. Since the unit suction area included in the 1 st suction area and sucking one unit region is larger than the 2 nd suction area, the packaged substrate having warpage can be reliably sucked to the cutting jig. The warpage of the substrate after packaging is reduced by the formed cutting groove.

Description

Adsorption mechanism, adsorption method, manufacturing device and manufacturing method
Technical Field
The present invention relates to an adsorption mechanism, an adsorption method, a manufacturing apparatus, and a manufacturing method used when manufacturing a plurality of singulated products by cutting a cut object.
Background
A substrate manufactured in the following manner is referred to as a post-package substrate: that is, a substrate including a printed circuit board, a lead frame, or the like is virtually divided into a plurality of regions in a lattice shape, chip-like elements (e.g., semiconductor chips) are mounted in the respective regions, and then the entire substrate is resin-packaged. The packaged substrate is cut by a cutting mechanism such as a rotary knife to be singulated into individual unit regions, thereby forming a product. In the resin sealing step, the flowable resin is cured to form a sealing resin made of a cured resin.
Conventionally, a cutting device is used to cut a predetermined region of a substrate after packaging by a cutting mechanism such as a rotary knife. First, the packaged substrate is placed on a cutting stage (cutting jig). Next, the substrate after packaging is aligned (position alignment). The positions of virtual cutting lines for dividing a plurality of regions are set by alignment. Next, the cutting stage on which the packaged substrate is placed and the cutting mechanism are relatively moved. The cutting water is sprayed to the cutting position of the packaged substrate, and the packaged substrate is cut along a cutting line set on the packaged substrate by a cutting mechanism. The packaged substrate is cut to produce a singulated product.
A cutting jig is attached to the cutting table. The cutting jig is provided with a plurality of suction passages for sucking the packaged substrate or the singulated product. The cutting platform is provided with a space connected to the plurality of suction passages. The plurality of suction passages are connected to an external suction mechanism, such as a vacuum pump, via the space. The packaged substrate or the plurality of products are sucked by a vacuum pump, and thereby the packaged substrate or the plurality of products are sucked to the cutting jig.
In recent years, with the advancement of functions, miniaturization, and high speed of electronic devices, semiconductor products have been increasingly developed to have higher performance, higher functionality, and smaller size. In order to improve the production efficiency of semiconductors, the size and thickness of the substrate after packaging tend to be increased. Since the post-package substrate is enlarged, the number of products taken out from one post-package substrate increases. Due to the thinning of the substrate after packaging, the product formed by single chip is thinned. Therefore, the mounting efficiency of the electronic apparatus is improved. On the other hand, due to the large size and the thin thickness of the substrate after encapsulation, the warpage of the substrate after resin encapsulation due to the compressive stress at the time of curing the flowable resin is large. If the warpage of the packaged substrate is large, it may be difficult to attach the packaged substrate to the cutting jig. If the substrate after the package cannot be attached to the suction jig, the substrate after the package cannot be cut. Therefore, when the post-package substrate is singulated, it is important to reliably attract the post-package substrate having warpage to the suction jig.
As a method for dividing a package substrate, there is provided a method for dividing a package substrate, comprising: "(not shown) is a method for dividing a package substrate, the method comprising: a mounting step of mounting a package substrate on a fixing jig, the fixing jig including a holding surface for holding the package substrate and including: (not shown); a plurality of snake belly type adsorption pads, wherein (a) adsorption parts protrude from the holding surface; (not shown), the holding surface is formed of rubber; and a dividing step of cutting the package substrate held by the fixing jig by a cutting blade to divide the package substrate into individual packages (see, for example, paragraph [0012] and fig. 5 to 8 "of patent document 1).
Patent document 1: japanese patent laid-open publication No. 2011-
However, according to the fixing jig 20 disclosed in patent document 1, the following problems arise. As shown in fig. 5 of patent document 1, a plurality of circular holes 52 having a1 st diameter, a plurality of circular holes 54 having a2 nd diameter larger than the 1 st diameter, which are formed continuously with the circular holes 52, respectively, and a large recess 56 communicating with the circular holes 54 are formed in the holding plate 50 of the fixing jig 20. A suction tool 58 having a suction path 59 is attached to each circular hole 52, and a bellows-shaped suction pad 24 made of resin is attached to each suction tool 58. A plurality of circular holes 64 communicating with the respective circular holes 54 are formed in the holding member 62. The recess is defined by the circular hole 54 and the circular hole 64 formed continuously, and the bellows-type suction pad 24 is disposed in the recess.
In the fixing jig 20, circular holes 52, 54, 64 having different diameters are formed so as to communicate with each other for sucking the respective chips. Further, the suction tool 58 is attached to the circular hole 52, and the bellows type suction pad 24 is attached to the suction tool 58. In order to attach a chip, a plurality of processing or structural members must be prepared. Therefore, the structure of the fixing jig 20 is very complicated, and it is difficult to manufacture the fixing jig 20 and the manufacturing cost is high.
Disclosure of Invention
The present invention has been made to solve the above problems, and an object of the present invention is to provide a suction mechanism, a suction method, a manufacturing apparatus, and a manufacturing method capable of sucking a packaged substrate having warpage.
In order to solve the above problem, the adsorption mechanism of the present invention is used in the following process: that is, a plurality of products corresponding to a plurality of unit regions are manufactured by sucking a cut object having a plurality of unit regions sectioned by a plurality of cutting lines and cutting the cut object,
the adsorption mechanism is characterized by comprising:
a first stage 1 for placing the object to be cut;
a1 st jig mounted on the 1 st stage; and
one or more 1 st suction ports provided in the 1 st jig for sucking the cut object by a1 st suction area,
a unit suction area larger than a2 nd suction area, the unit suction area being an area included in the 1 st suction area, that is, an area to which one of the unit regions is sucked, and the 2 nd suction area being an area to which one of the unit regions is sucked by each of a plurality of 2 nd suction ports partitioned in the 2 nd jig used in the step of cutting the cut object so as to correspond to the plurality of unit regions.
In order to solve the above problems, the adsorption method of the present invention is used in the following processes: that is, a plurality of products corresponding to a plurality of unit regions are manufactured by sucking a cut object having a plurality of unit regions sectioned by a plurality of cutting lines and cutting the cut object,
the adsorption method is characterized by comprising the following steps:
preparing a1 st stage for placing the object to be cut;
preparing a1 st jig to be mounted on the 1 st stage;
preparing one or more 1 st suction ports, the 1 st suction ports being provided in the 1 st jig and sucking the cut object by a1 st suction area, respectively; and
adsorbing the cut object by using one or more of the 1 st adsorption ports and a unit adsorption area, wherein the unit adsorption area is an area included in the 1 st adsorption area, that is, an area where one unit region is adsorbed,
the unit suction area is larger than a2 nd suction area, and the 2 nd suction area is an area in which the 2 nd suction port of the 2 nd jig used in the step of cutting the cut object is divided into a plurality of 2 nd suction ports corresponding to the plurality of unit regions, respectively, and sucks one unit region.
In order to solve the above problem, a manufacturing apparatus according to the present invention includes: a cutting mechanism for cutting an object to be cut having a plurality of unit areas divided by a plurality of cutting lines; and a rotary knife provided in the cutting mechanism, the manufacturing apparatus being used in a process of manufacturing a plurality of products corresponding to the plurality of unit regions by cutting the object to be cut,
the manufacturing apparatus is characterized in that the manufacturing apparatus,
the suction mechanism is provided.
In order to solve the above problem, a manufacturing apparatus according to the present invention includes: a cutting mechanism for cutting an object to be cut having a plurality of unit areas divided by a plurality of cutting lines; and a rotary knife provided in the cutting mechanism, the manufacturing apparatus being used in a process of manufacturing a plurality of products corresponding to the plurality of unit regions by cutting the object to be cut,
the manufacturing apparatus is characterized by comprising:
a first stage 1 for placing the object to be cut;
a2 nd stage for placing the object to be cut;
a moving mechanism for relatively moving the 1 st stage and the 2 nd stage and the cutting mechanism;
a1 st jig mounted on the 1 st stage;
one or more 1 st suction ports provided in the 1 st jig, for sucking the cut object by a1 st suction area, respectively;
a2 nd jig mounted on the 2 nd stage; and
a plurality of 2 nd suction ports provided in the 2 nd jig so as to correspond to the plurality of unit regions, respectively, and sucking one unit region by a2 nd suction area, respectively,
a unit adsorption area larger than the 2 nd adsorption area, wherein the unit adsorption area is an area included in the 1 st adsorption area, that is, the unit adsorption area is an area where a plurality of unit regions are respectively adsorbed,
in the 1 st jig, cutting a part of the entire thickness of the object to be cut along at least one of the cutting lines by the rotary cutter to form at least one cutting groove,
forming a semi-finished product having a plurality of intermediate regions partitioned by the cutting grooves in the 1 st jig,
in the 2 nd jig, the semifinished product is cut along the plurality of cutting lines by the rotary knife, thereby manufacturing a plurality of the products respectively sucked by the 2 nd suction ports.
The manufacturing apparatus of the present invention includes:
a1 st cutting mechanism provided in the cutting mechanism; and
a2 nd cutting mechanism provided in the cutting mechanism,
in the 1 st jig, the cutting groove is formed by a1 st rotary knife provided in the 1 st cutting mechanism,
in the 2 nd jig, the 2 nd rotary knife provided in the 2 nd cutting mechanism cuts the semi-finished product.
The manufacturing apparatus of the present invention has the following modes:
the 1 st jig can suck a1 st cut object including a plurality of 1 st unit regions each having a1 st size, and can suck a2 nd cut object including a plurality of 2 nd unit regions each having a2 nd size different from the 1 st size.
The manufacturing apparatus of the present invention has the following modes:
the cutting groove is formed along all of the plurality of cutting lines.
The manufacturing apparatus of the present invention has the following modes:
the object to be cut is a plate-like member having functional elements formed in each of the plurality of unit regions.
The manufacturing apparatus of the present invention has the following modes:
the object to be cut has at least a1 st member composed of a base material and a2 nd member formed on the base material,
the cutting groove is formed over at least the entire thickness of the 1 st member or over at least the entire thickness of the 2 nd member.
The manufacturing apparatus of the present invention has the following modes:
the object to be cut has at least a1 st member composed of a base material and a2 nd member formed on the base material,
the cutting groove is formed in a part of the entire thickness of the 1 st member or in a part of the entire thickness of the 2 nd member.
The manufacturing apparatus of the present invention has the following modes:
the 1 st member is a substrate formed with an electric circuit,
the 2 nd member is an insulating member.
In order to solve the above problems, the manufacturing method of the present invention includes the steps of: relatively moving a cut object having a plurality of unit areas sectioned by a plurality of cutting lines and a cutting mechanism; and cutting the cut object by using a rotary knife provided in the cutting mechanism, the manufacturing method being used in a process of manufacturing a plurality of products corresponding to the plurality of unit regions by cutting the cut object,
the manufacturing method is characterized in that the manufacturing method comprises the following steps,
the adsorption method is provided.
In order to solve the above problems, the manufacturing method of the present invention includes the steps of: relatively moving a cut object having a plurality of unit areas sectioned by a plurality of cutting lines and a cutting mechanism; cutting the object to be cut with a rotary knife provided in the cutting mechanism; and cutting the cut object by using the rotary knife, the manufacturing method is used in a process of manufacturing a plurality of products corresponding to the unit areas by cutting the cut object,
the manufacturing method is characterized by comprising the following steps:
preparing a1 st stage for placing the object to be cut;
preparing a2 nd stage for placing the cut object;
preparing a1 st clamp, wherein the 1 st clamp is arranged on the 1 st platform and is provided with one or more 1 st adsorption ports respectively comprising a1 st adsorption area;
preparing a2 nd chuck, the 2 nd chuck being mounted on the 2 nd stage and having a plurality of 2 nd suction ports corresponding to the plurality of unit regions, respectively, and including a2 nd suction area, respectively;
in the 1 st chuck, using each 1 st suction port of the one or more 1 st suction ports to suck the cut object;
in the cutting step, the first jig is configured to cut a part of the entire thickness of the object to be cut along at least one of the cutting lines by using the rotary cutter to form at least one cutting groove;
forming a semi-finished product having a plurality of intermediate regions partitioned by the cutting grooves in the 1 st jig;
placing the semi-finished product on the 2 nd clamp;
in the 2 nd jig, adsorbing each of the plurality of unit regions that the semi-finished product has by using each of the 2 nd adsorption ports, thereby adsorbing the semi-finished product; and
in the cutting step, the 2 nd jig cuts the semi-finished product along the plurality of cutting lines using the rotary cutter,
a unit adsorption area larger than the 2 nd adsorption area, wherein the unit adsorption area is an area included in the 1 st adsorption area, that is, the unit adsorption area is an area where a plurality of unit regions are respectively adsorbed,
manufacturing a plurality of the products adsorbed by each of the 2 nd adsorption ports by cutting the semi-finished product.
The manufacturing method of the present invention includes the following steps:
preparing a1 st cutting mechanism having a1 st rotary knife as the cutting mechanism;
preparing a2 nd cutting mechanism having a2 nd rotary knife as the cutting mechanism;
moving the object to be cut and the 1 st cutting mechanism relatively to each other as a step of moving the object to be cut and the cutting mechanism relatively to each other; and
moving the work piece and the cutting mechanism relatively to each other, moving the work piece and the 2 nd cutting mechanism relatively to each other,
in the step of forming the cut groove, the cut groove is formed by the 1 st rotary blade,
in the step of cutting the semi-finished product, the semi-finished product is cut by the 2 nd rotary knife.
The manufacturing method of the present invention has the following modes:
in the step of sucking the cut object, the 1 st cut object including a plurality of 1 st unit regions each having a1 st size can be sucked by using the 1 st jig, and the 2 nd cut object including a plurality of 2 nd unit regions each having a2 nd size different from the 1 st size can be sucked.
The manufacturing method of the present invention has the following modes:
in the step of forming the cut groove, the cut groove is formed along all of the plurality of cut lines.
The manufacturing method of the present invention has the following modes:
the object to be cut is a plate-like member having functional elements formed in each of the plurality of unit regions.
The manufacturing method of the present invention has the following modes:
the object to be cut has at least a1 st member composed of a base material and a2 nd member formed on the base material,
in the step of forming the cut groove, the cut groove is formed over the entire thickness of the 1 st member or the cut groove is formed over the entire thickness of the 2 nd member.
The manufacturing method of the present invention has the following modes:
the object to be cut has at least a1 st member composed of a base material and a2 nd member formed on the base material,
in the step of forming the cut groove, the cut groove is formed in a part of the entire thickness of the 1 st member or the cut groove is formed in a part of the entire thickness of the 2 nd member.
The manufacturing method of the present invention has the following modes:
the 1 st member is a substrate formed with an electric circuit,
the 2 nd member is an insulating member.
According to the present invention, first, the unit adsorption area is larger than the 2 nd adsorption area, wherein the unit adsorption area is an area included in the 1 st adsorption area of the 1 st adsorption port, that is, the unit adsorption area is an area for adsorbing one unit region, and the 2 nd adsorption area is an area of the 2 nd adsorption port corresponding to each unit region. Therefore, the force of sucking one unit region by the unit sucking area included in one 1 st suction port is larger than the force of sucking one unit region by the 2 nd suction area included in one 2 nd suction port.
Secondly, in the 1 st jig, a part of the entire thickness of the cut object is cut along at least one of the plurality of cutting lines of the sucked cut object. Thereby forming at least one cutting flute. By forming the cutting groove, when the object to be cut has a warp, the warp can be reduced. The cut object with reduced warpage is placed on the 2 nd jig. The object to be cut is stably sucked through a plurality of 2 nd sucking holes provided in the 2 nd jig and corresponding to the plurality of unit regions, respectively. In the 2 nd jig, a plurality of products are manufactured by cutting the object to be cut. Therefore, a plurality of products can be manufactured by dividing the cutting into two steps of cutting and cutting to process the cut object.
Drawings
Fig. 1A is a plan view of a cut object cut by the manufacturing apparatus of the present invention.
Fig. 1B is a front view of the cut object having warpage in fig. 1A.
Fig. 2A is a plan view of a cutting jig used in the manufacturing apparatus of example 1 of the present invention.
Fig. 2B is a cross-sectional view taken along line a-a of fig. 2A, which virtually shows a state in which a cut object having warpage is placed on the cutting jig.
Fig. 3A is a plan view of a cutting jig used in the manufacturing apparatus of example 1 of the present invention.
Fig. 3B is a cross-sectional view taken along line B-B of fig. 3A, which virtually shows a state in which a cut object having warpage is placed on the cutting jig.
Fig. 4A is a plan view showing a state of cutting the object to be cut attached to the cutting jig shown in fig. 2A and 2B.
Fig. 4B is a cross-sectional view taken along line C-C of fig. 4A.
Fig. 5A is a plan view showing a state of cutting the object to be cut which is attached to the cutting jig shown in fig. 3A and 3B.
Fig. 5B is a cross-sectional view taken along line D-D of fig. 5A.
Fig. 6A is a plan view of a cutting jig used in a manufacturing apparatus according to a modification example of embodiment 1 of the present invention.
Fig. 6B is a cross-sectional view taken along line a-a of fig. 6A, which virtually shows a state in which a cut object having warpage is placed on the cutting jig.
Fig. 6C is a plan view showing one unit region sucked by the cutting jig.
Fig. 6D is a plan view showing one unit region sucked by the cutting jig shown in fig. 3A and 3B.
Fig. 7 is a plan view showing a schematic configuration of a manufacturing apparatus according to example 2 of the present invention.
Fig. 8 is a plan view showing a part of the object to be cut and the cutting jig in the manufacturing apparatus according to example 3 of the present invention.
Detailed Description
The cutting device 28 is provided with: a cutting jig 9 for forming a cut groove in the packaged substrate 1 having the plurality of unit regions 7; and a cutting jig 15 for cutting the packaged substrate 1 to separate the packaged substrate into individual pieces. The cutting jig 9 is provided with a1 st suction port 12 having a1 st suction area. One unit region 7 is adsorbed by a unit adsorption area included in the 1 st adsorption area. The cutting jig 15 is provided with a plurality of 2 nd suction ports 19A having a2 nd suction area and provided corresponding to each of the plurality of unit regions 7. The unit adsorption area is larger than the 2 nd adsorption area. The package rear substrate 1 having warpage is stably sucked through the 1 st suction port 12 having the 1 st suction area including the unit suction area. The cutting groove 24 is formed by cutting a part of the entire thickness of the packaged substrate 1. The warpage of the substrate 1 after packaging is reduced by forming the cut groove 24. The packaged substrate 1 with reduced warpage is placed on a cutting jig 15. The packaged substrate 1 with reduced warpage is stably sucked through each 2 nd suction port 19A. The cutting jig 15 cuts the post-package substrate 1 to produce a plurality of products 27. In this document, the post-package substrate (semi-finished product) on which the cut groove is formed is treated as a post-package substrate included in a product.
Example 1
Example 1 of the cutting device of the present invention will be described with reference to fig. 1A to 6D. For ease of understanding, any of the figures in this document are drawn in schematic form with appropriate omissions or exaggerations. The same components are denoted by the same reference numerals, and description thereof is omitted as appropriate.
As shown in fig. 1A and 1B, the substrate 1 after packaging is a cut object that is cut and singulated into a product. In other words, the package rear substrate 1 is a semi-finished product when a plurality of products are manufactured. The post-package substrate 1 includes a substrate 2 including a printed circuit board, a lead frame, and the like, chip elements 3 mounted on a plurality of regions (described later) of the substrate 2, and a package resin 4 formed to collectively cover the plurality of regions. The chip-like element 3 is, for example, a semiconductor chip. The substrate 2 corresponds to a substrate on which a circuit is formed. The sealing resin 4 corresponds to an insulating member. Fig. 1B shows a packaged rear substrate 1 having warpage.
As shown in fig. 1A, a plurality of 1 st cutting lines 5 extending in the longitudinal direction and a plurality of 2 nd cutting lines 6 extending in the short direction are virtually set on the package rear substrate 1. In the packaged substrate 1, a plurality of unit regions 7 (partitioned) surrounded by the plurality of 1 st cutting lines 5 and the plurality of 2 nd cutting lines 6 are each formed as a product by singulation. In fig. 1A, for example, five 1 st cutting lines 5 extending in the longitudinal direction are set on the rear package substrate 1. Nine 2 nd cutting lines 6 extending in the short side direction are set on the substrate 1 after packaging. Therefore, eight unit regions 7 are formed in the longitudinal direction, four unit regions 7 are formed in the short direction, and 32 unit regions 7 are formed in a grid shape in total. Each unit area 7 corresponds to a product. The unit region 7 formed on the substrate 1 after the package is arbitrarily set according to the size or number of the singulated products. The unit area 7 shown in fig. 1A has a square shape. The unit area 7 may have a rectangular shape other than a square shape.
A cutting jig used in the cutting apparatus of the present invention will be described with reference to fig. 2A and 2B. As shown in fig. 2A and 2B, a cutting jig 9 is attached to the cutting table 8A. The cutting jig 9 is a jig for forming a cut groove in the packaged substrate 1. The cutting jig 9 includes a metal plate 10 and a resin sheet 11 fixed to the metal plate 10. The resin sheet 11 is preferably formed of, for example, a silicone resin or a fluorine resin having appropriate flexibility.
As shown in fig. 2A and 2B, the resin sheet 11 of the cutting jig 9 is provided with a1 st suction port 12 having a size and a shape independent of the size and the shape of the product. The 1 st adsorption area of one 1 st adsorption port 12 includes an area (hereinafter referred to as "unit adsorption area") where one unit region 7 is adsorbed by one unit region 7 through the 1 st adsorption port 12. The 1 st suction area is larger than the 2 nd suction area of one 2 nd suction port (described later) for sucking one unit region 7. The unit adsorption area is larger than the 2 nd adsorption area. Thus, the 1 st suction port 12 has the 1 st suction force larger than the 2 nd suction force of one 2 nd suction port, and sucks one unit region 7 by the unit suction area. Therefore, the cutting jig 9 can suck and hold the packaged substrate 1 having warpage.
In order to increase the suction force in the cutting jig 9, the 1 st suction ports 12 of an arbitrary number N (N < the number of all the unit regions 7) are provided in an arbitrary size. The 1 st adsorption area may be an area including all the unit regions 7. In this case, the number of the 1 st adsorption port 12 is one.
In order to suck and hold the packaged substrate 1, a suction path 13 is provided which penetrates the resin sheet 11 and the metal plate 10 from the inner bottom surface of the 1 st suction port 12 of the cutting jig 9. The suction path 13 is connected to a space 14 provided in the cutting table 8A. The space 14 of the cutting table 8A is connected to a suction mechanism (not shown) provided outside. The packaged substrate 1 is sucked to the cutting jig 9 through the suction path 13 and the 1 st suction port 12.
The size and shape of the 1 st suction port 12 are independent of the size and shape of the product. In other words, the size and shape of the 1 st suction port 12 are independent of the size and shape of one unit region 7. Therefore, the cutting table 8A and the cutting jig 9 can be used in common for a plurality of types (types) of products.
A rotary knife (not shown) cuts a part of the entire thickness of the post-package substrate 1 after the suction. The thus formed cut groove (not shown) reduces warpage of the substrate 1 after packaging. For example, in the case shown in fig. 2B, it is preferable to cut at least the entire thickness of the substrate 2 out of the entire thickness of the substrate 1 after packaging. When the sealing resin 4 side of the sealing substrate 1 is directed upward and the sealing substrate 1 is sucked to the cutting jig 9, it is preferable to cut at least the entire thickness of the sealing resin 4 out of the entire thickness of the sealing substrate 1. Such cutting reduces warpage of the substrate 1 after packaging.
If the cutting groove is too deep, there is a possibility that the packaged substrate 1 may be bent at the cutting groove in a step of carrying the packaged substrate 1 on which the cutting groove is formed. It is preferable to make the cutting groove as deep as possible within a range in which troubles such as bending of the substrate 1 after the package do not occur.
The packaged substrate 1 shown in fig. 1A is cut along a part of the plurality of 1 st cutting lines 5 and the plurality of 2 nd cutting lines 6 of the packaged substrate 1. The plurality of cutting grooves formed in the packaged substrate 1 reduce warpage of the packaged substrate 1. When the cutting jig 9 is used, the operation of cutting (cutting) the entire thickness of the packaged substrate 1 is not performed. Thus, it is not necessary to provide a cutting groove corresponding to the outer shape (outer edge) of the product in the resin sheet 11 (see fig. 2B). Therefore, the cutting jig 9 can be easily manufactured compared to a cutting jig. In addition, the manufacturing cost of the cutting jig 9 can be controlled. The cutting jig 9 does not depend on the size of the product (in detail, the size and shape of each product). Therefore, the cutting jig 9 can be used in common for a plurality of types of package rear substrates 1, both of which satisfy the following two conditions. The condition 1 is that the size of the substrate 1 after packaging is within the range of the size of the cutting jig 9. The condition 2 is that the size of the substrate 1 after packaging includes a size (area) that can be sucked by the cutting jig 9.
A cutting jig used in the cutting apparatus of the present invention will be described with reference to fig. 3A and 3B. As shown in fig. 3A and 3B, a cutting jig 15 corresponding to a specific product is attached to the cutting table 8B. The cutting jig 15 is a jig for cutting the packaged substrate 1 into individual pieces in a cutting device. The cutting jig 15 includes a metal plate 16 and a resin sheet 17 fixed to the metal plate 16. In order to alleviate the mechanical impact, the resin sheet 17 is required to have appropriate flexibility. The resin sheet 17 is preferably formed of, for example, a silicone resin or a fluorine resin.
As shown in fig. 3A and 3B, the resin sheet 17 of the cutting jig 15 is provided with a plurality of mesa-shaped protrusions 18 that respectively attract and hold the plurality of unit regions 7 in the post-package substrate 1. Eight protrusions 18 are formed in the longitudinal direction, four protrusions 18 are formed in the lateral direction, and 32 protrusions 18 are formed in total, corresponding to each unit region 7 of the rear package substrate 1. In the cutting jig 15, a plurality of 2 nd suction ports 19A are provided at the upper end portions of the plurality of projections 18. One 2 nd adsorption port 19A corresponds to one unit region 7, respectively. Suction paths 19B are provided which penetrate the resin sheet 17 and the metal plate 16 from the inner bottom surfaces of the respective 2 nd suction ports 19A.
The plurality of 2 nd suction ports 19A are connected to the space 14 provided in the cutting deck 8B via the suction paths 19B, respectively. The space 14 of the cutting table 8B is connected to a suction mechanism (not shown) provided outside. The plurality of (32) unit regions 7 in the substrate 1 after the sealing are sucked to the cutting jig 15 through the corresponding 2 nd suction ports 19A.
As shown in fig. 3B, when the packaged substrate 1 having warpage is placed on the cutting jig 15, the left-end unit region 7 is sucked into the left-end 2 nd suction port 19A and the right-end unit region 7 is sucked into the right-end 2 nd suction port 19A at both ends of the packaged substrate 1. The 2 nd suction port 19A sucks the unit region 7 in the order of going inward (central portion) in the order from both ends of the substrate 1 after packaging.
On the other hand, in the central portion of the post-package substrate 1, a gap is formed between the lower surface of the package resin 4 and the upper surface of the resin sheet 17. Further, since one 2 nd suction port 19A is provided corresponding to one unit region 7, the suction area (2 nd suction area) of one 2 nd suction port 19A is smaller than the planar area of one unit region 7. Accordingly, when the suction ports (2 nd suction ports) 19A corresponding to the respective unit regions 7 are used, the warped packaged substrate 1 may not be sucked, and particularly, the central portion of the packaged substrate 1 may not be sucked.
As shown in fig. 3A, the cutting jig 15 is provided with a plurality of 1 st cutting grooves 20 extending in the longitudinal direction of the cutting jig 15. The plurality of 1 st cutting grooves 20 correspond to the plurality of 1 st cutting lines 5 extending in the longitudinal direction in the substrate 1 after packaging (see fig. 1A and 1B). The cutting jig 15 is provided with a plurality of 2 nd cutting grooves 21 extending in the short side direction of the cutting jig 15. The plurality of 2 nd cutting grooves 21 correspond to the plurality of 2 nd cutting lines 6 extending in the short direction in the substrate 1 after the package (see fig. 1A and 1B).
The depth (distance from the upper surface of the protrusion 18 to the inner bottom surface of each groove) of the 1 st cutting groove 20 and the 2 nd cutting groove 21 is set to about 0.5mm to 1.0 mm. In order to reduce the operation cost of the cutting apparatus, the cutting table 8B is used for a plurality of products, and only the cutting jig 15 is replaced according to the size or the number of the products.
As shown in fig. 3A and 3B, wall portions and cutting grooves 20 and 21 are present between the 2 nd suction ports 19A. The wall portion and the cutting grooves 20 and 21 are collectively referred to as a "partition portion". The 2 nd suction area, which is the planar area of the 2 nd suction port 19A, is an area obtained by subtracting the planar area of the partition included in one unit region 7 from the planar area of the unit region 7 and is equal to or larger than the cross-sectional area (planar area) of the suction path 19B.
A process of cutting and singulating packaged substrate 1 having warpage will be described with reference to fig. 4A to 5B. Fig. 4A and 4B show a process of cutting the packaged substrate 1 by using a rotary blade 22 attached to a cutting mechanism (not shown) to form cut grooves 23 and 24. The directions X, Y and Z in the following drawings indicate directions of a coordinate system based on the cutting device (see fig. 7).
With reference to fig. 3A to 4B, a case where the packaged substrate 1 having warpage (see fig. 3B) is reliably sucked by using the cutting jig 9 shown in fig. 4B will be described. Fig. 4A and 4B show an adsorption mechanism used in the cutting apparatus of the present invention to reliably adsorb the packaged substrate 1 having warpage. First, the rear package substrate 1 is placed on the resin sheet 11 of the cutting jig 9 attached to the cutting table 8A.
As shown in fig. 4B, the cutting jig 9 is provided with two 1 st suction ports 12. One 1 st adsorption port 12 corresponds to four columns of the unit areas 7 shown in fig. 4B. The 1 st suction port 12 has a1 st suction area including a unit suction area which is an area where one unit region 7 is sucked through the 1 st suction port 12 in the one unit region 7. The unit suction area is larger than the 2 nd suction area where one unit region 7 is sucked by one 2 nd suction port 19A shown in fig. 3B. This is obvious by comparing fig. 4B with fig. 3B. Thereby, the 1 st suction port 12 sucks one unit region 7 by a1 st suction force larger than the 2 nd suction force of the 2 nd suction port 19A by a unit suction area.
A state in which the post-package substrate 1 is mounted on the resin sheet 11 (a state before suction) shown in fig. 4B is considered. In this state, the interval between the lower surface of the sealing resin 4 and the upper surface of the resin sheet 11 (the upper end surface of the 1 st suction port 12) at both ends of the sealed substrate 1 is smaller than that at the center of the sealed substrate 1 (see fig. 3B). Therefore, at both ends of the packaged substrate 1, the left end of the left-side 1 st suction port 12 surely sucks the left-end unit region 7, and the right end of the right-side 1 st suction port 12 surely sucks the right-end unit region 7.
Next, first, the warpage of the rear package substrate 1 corresponding to the unit regions 7 located in three rows respectively inside the left half of the rear package substrate 1 is corrected in order from the outside (from the left side). This effect is increased by sucking substantially the entire surfaces of the unit regions 7 in three rows located inside the left half of the rear substrate 1 by the first suction port 12 on the left side. Second, the warpage of the rear package substrate 1 corresponding to the unit regions 7 in three rows respectively located inside the right half of the rear package substrate 1 is corrected in order from the outside (from the right side). This effect is increased by sucking substantially the entire surfaces of the unit regions 7 in three rows located inside the right half of the rear substrate 1 by the right 1 st suction port 12. Therefore, the unit regions 7 are sequentially sucked from the 1 st suction port 12 toward the inner side (toward the center) from both ends of the substrate 1 after the package. This reliably causes the packaged substrate 1 (see fig. 3B) having warpage to be attracted to the resin sheet 11 of the cutting jig 9.
Hereinafter, specific steps will be described. As shown in fig. 4A and 4B, first, the rear package substrate 1 is placed on the cutting jig 9 attached to the cutting table 8A. For example, instead of the state shown in fig. 4A and 4B in which the substrate 2 side of the post-package substrate 1 faces upward, the post-package substrate 1 is disposed so that a plurality of 1 st cutting lines 5 (see fig. 4A) extending in the longitudinal direction of the post-package substrate 1 extend in the Y direction. In other words, the packaged substrate 1 shown in fig. 4A is rotated by +90 degrees, and the packaged substrate 1 is placed on the cutting jig 9.
In the step of placing the packaged substrate 1 on the cutting jig 9, the packaged substrate 1 sucked to the cutting jig 9 is aligned with the rotary blade 22. Specifically, the rotary blade 22 is aligned with respect to a position alignment mark (not shown) formed in advance on the substrate 2. In this step, since the operation of cutting (cutting) the entire thickness of the packaged substrate 1 is not performed, it is not necessary to form a cutting groove in the cutting jig 9 (resin sheet 11). Therefore, when the packaged substrate 1 is placed on the cutting jig 9, it is not necessary to align the cutting jig 9 with the packaged substrate 1.
Next, the alignment mark formed in advance on the substrate 2 is imaged by using a camera (not shown) for alignment. A control unit (not shown) included in the cutting device sets a plurality of 1 st cutting lines 5 extending in the longitudinal direction and a plurality of 2 nd cutting lines 6 extending in the short direction of the packaged substrate 1 based on the captured image.
Then, for example, the rotary blade 22 attached to the cutting mechanism (not shown) is rotated at a high speed of about 30,000 to 40,000 rpm. A rotary knife 22 attached to a cutting mechanism is lowered outside the sealed substrate 1. For example, the lower end of the rotary blade 22 is lowered to a predetermined depth position in the sealing resin 4 of the substrate 1 after sealing. The cutting table 8A and the rotary knife 22 are moved relatively in the X direction. Thus, in the packaged substrate 1 disposed by being rotated by 90 degrees instead of the state shown in fig. 4A, the rotary knife 22 is aligned with the position of the specific 1 st cutting line 5 extending in the longitudinal direction.
Next, the packaged substrate 1 placed on the cutting table 8A (cutting jig 9) is moved in the Y direction by a moving mechanism (not shown). In the packaged substrate 1 disposed by being rotated by 90 degrees instead of the state shown in fig. 4A, a part of the entire thickness is cut by the rotary blade 22 along the 1 st cutting line 5 extending in the longitudinal direction. For example, a predetermined thickness portion of the entire thickness of the substrate 2 and the entire thickness of the sealing resin 4 is cut. Thus, the cut groove 23 is formed along the 1 st cutting line 5 extending in the longitudinal direction of the packaged substrate 1. In order to reduce the warpage of the packaged substrate 1, it is preferable to form the cutting groove 23 by lowering the rotary blade 22 to an appropriate depth position in the packaged substrate 1.
The packaged substrate 1 is cut along a predetermined number of the 1 st cutting lines 5 extending in the longitudinal direction of the packaged substrate 1. In the rear package substrate 1 disposed by being rotated by 90 degrees instead of the state shown in fig. 4A, for example, cut grooves 23b and 23d (portions shown by thin solid lines in fig. 4A) extending along two of five cutting lines 5 extending in the longitudinal direction are formed.
Next, the substrate 1 after packaging is rotated by-90 degrees. Thus, as shown in fig. 4A, the rear package substrate 1 is disposed such that the 2 nd cutting line 6 extending in the short side direction of the rear package substrate 1 extends in the Y direction. Then, for example, the rotary blade 22 attached to the cutting mechanism (not shown) is rotated at a high speed of about 30,000 to 40,000 rpm. A rotary knife 22 attached to a cutting mechanism is lowered outside the sealed substrate 1. The lower end of the rotary blade 22 is lowered to a predetermined depth position of the sealing resin 4 of the sealed substrate 1. The cutting table 8A and the rotary knife 22 are moved relatively in the X direction. Thereby, the rotary knife 22 is aligned with the position of the specific 2 nd cutting line 6 extending in the short side direction of the packaged substrate 1.
Next, the packaged substrate 1 placed on the cutting table 8A (cutting jig 9) is moved in the Y direction by a moving mechanism (not shown). A predetermined thickness portion of the entire thickness of the substrate 2 and the entire thickness of the sealing resin 4, for example, is cut along the 2 nd cutting line 6 extending in the short side direction of the sealed substrate 1 by the rotary knife 22 rotating at a high speed. Thereby, the cut groove 24 is formed along the 2 nd cutting line 6 extending in the short side direction of the package rear substrate 1. In order to reduce the warpage of the packaged substrate 1, it is preferable to form the cutting groove 24 by lowering the rotary blade 22 to an appropriate depth position of the packaged substrate 1.
The packaged substrate 1 is cut along a predetermined number of the 2 nd cutting lines 6 extending in the short side direction of the packaged substrate 1. In fig. 4A, for example, cut grooves 24c, 24e, and 24g (portions indicated by thin solid lines in the drawing) are formed in the package rear substrate 1 along three of the nine cut lines 6 extending in the short side direction of the package rear substrate 1.
Cut grooves 23, 24 are formed in the package rear substrate 1. First, it is considered that at least a part of the shrinkage stress at the time of curing the encapsulating resin 4 can be released. Therefore, since the warpage of the packaged substrate 1 can be reduced, the packaged substrate 1 is reliably attracted to the cutting jig 9. Secondly, since the rigidity of the packaged substrate 1 can be reduced, the packaged substrate 1 is reliably attracted to the cutting jig 9. The packaged substrate 1 is reliably attracted to the cutting jig 9 due to at least one of a decrease in warpage and a decrease in rigidity of the packaged substrate 1.
The number and position of the cut grooves 23, 24 formed on the package rear substrate 1 can be appropriately selected according to the form and degree of the warpage. In the case where the warpage of the substrate 1 after the package shown in fig. 4A is not large, one cut groove 24 may be formed in the center portion in the short direction. In this case, there may be a case where it is not necessary to form the cutting groove 23 in the longitudinal direction. Depending on the form and degree of the warpage, it may be sufficient to form at least one of the cutting grooves 23, 24.
The rear package substrate 1 is virtually divided into 12 intermediate regions by the plurality of cut grooves 23 and 24 formed in the rear package substrate 1. The intermediate regions (eight in total) in the uppermost and lowermost stages shown in fig. 4A each have two unit regions 7. The middle regions (four in total) in the middle stage each have four unit regions 7. The packaged substrate 1 formed with the plurality of cut grooves 23, 24 is a semi-finished product in a process of manufacturing a plurality of products.
Next, as shown in fig. 5A and 5B, the post-package substrate 1 having the cut grooves 23 and 24 (see fig. 4A) formed therein is placed on the cutting jig 15 attached to the cutting table 8B. For example, instead of the state shown in fig. 5A in which the substrate 2 side of the rear package substrate 1 is directed upward, the rear package substrate 1 is disposed so that the 1 st cutting line 5 and the 1 st cut groove 23 (see fig. 4A) of the rear package substrate 1 extending in the longitudinal direction are directed in the Y direction. In other words, the post-package substrate 1 shown in fig. 5A is rotated by +90 degrees, and the post-package substrate 1 is placed on the cutting jig 15.
In the step of placing the packaged substrate 1 on which the cut grooves 23 and 24 are formed, the packaged substrate 1 and the cutting jig 15 are aligned. This positional alignment is performed so that the 1 st cutting line 5 and the 1 st cut groove 23 overlap the 1 st cut groove 20 (see fig. 3A), and the 2 nd cutting line 6 and the 2 nd cut groove 24 overlap the 2 nd cut groove 21 (see fig. 3A).
The 1 st cutting line 5 and the 1 st cut groove 23 (see fig. 4A) extending in the longitudinal direction in the substrate 1 after the package are disposed in the cutting groove 20 (see fig. 3A) extending in the longitudinal direction in the cutting jig 15. The 2 nd cutting line 6 and the 2 nd cut groove 24 extending in the short direction in the substrate 1 after the package are arranged on the cutting groove 21 (see fig. 3A) extending in the short direction in the cutting jig 15. The warpage of the substrate 1 after packaging is reduced by forming the 1 st cut groove 23 and the 2 nd cut groove 24. The rigidity of the substrate 1 after packaging is reduced by forming the 1 st cut groove 23 and the 2 nd cut groove 24. Therefore, the plurality of 2 nd suction ports 19A formed in the cutting jig 15 so as to correspond to the plurality of unit regions 7 of the post-package substrate 1 can stably suck the unit regions 7.
Next, the alignment mark formed in advance on the substrate 2 is imaged by using a camera (not shown) for alignment. The control unit (not shown) of the cutting device resets the 1 st cutting lines 5 (see fig. 4A) and the 1 st cutting grooves 23 extending in the longitudinal direction of the packaged substrate 1, and the 2 nd cutting lines 6 and the 2 nd cutting grooves 24 extending in the short direction, based on the captured image. The warpage of the packaged substrate 1 is reduced by forming the 1 st cut groove 23 and the 2 nd cut groove 24 on the packaged substrate 1. Therefore, since the positional relationship in the substrate 1 after sealing may be microscopically changed, it is preferable to set the positions of the cutting line and the cut groove on the substrate 1 after sealing by performing the positional alignment again.
Then, for example, the rotary blade 22 attached to the cutting mechanism (not shown) is rotated at a high speed of about 30,000 to 40,000 rpm. A rotary knife 22 attached to a cutting mechanism is lowered outside the sealed substrate 1. The lower end of the rotary blade 22 is lowered to a predetermined position slightly below the lower surface of the sealing resin 4 of the sealed substrate 1. The cutting table 8B and the rotary knife 22 are moved relatively in the X direction. Thus, in the packaged substrate 1 disposed by being rotated by 90 degrees in place of the state shown in fig. 5A, the rotary blade 22 is aligned with the specific 1 st cutting line 5 extending in the longitudinal direction or the specific 1 st cut groove 23 (see fig. 4A).
Next, the post-package substrate 1 placed on the cutting stage 8B (cutting jig 15) after being rotated by +90 degrees from the state shown in fig. 5A is moved in the Y direction by a moving mechanism (not shown). The substrate 2 and the sealing resin 4 are collectively cut along a1 st cutting line 5 (see fig. 4A) extending in the longitudinal direction in the substrate 1 after sealing by using a rotary knife 22. Thereby, the 1 st cut line 25(25A) shown in fig. 5A is formed. The remaining portion (remaining thickness portion) of the substrate 1 with the sealing resin 4 formed thereon is cut entirely along the 1 st cut groove 23 (see fig. 4A) extending in the longitudinal direction by the rotary blade 22. Thereby, the 1 st cut line 25(25b) shown in fig. 5A is formed. The 1 st cut line 25(25A, 25b) is indicated by a thick solid line in fig. 5A. In this state, the end material portions 1a and 1b (portions indicated by two-dot chain lines on the upper side and the lower side in fig. 5A) formed in the longitudinal direction of the substrate 1 after packaging are removed.
Next, the substrate 1 after packaging is rotated by-90 degrees. Thus, as shown in fig. 5A, the packaged substrate 1 is disposed such that the 2 nd cutting line 6 and the 2 nd cut groove 24 extending in the short side direction of the packaged substrate 1 are along the Y direction.
Then, for example, the rotary blade 22 attached to the cutting mechanism (not shown) is rotated at a high speed of about 30,000 to 40,000 rpm. A rotary knife 22 attached to a cutting mechanism is lowered outside the sealed substrate 1. The lower end of the rotary blade 22 is lowered to a predetermined position slightly below the lower surface of the sealing resin 4 of the sealed substrate 1. The cutting table 8B and the rotary knife 22 are moved relatively in the X direction. Thereby, the rotary knife 22 is aligned with the specific 2 nd cutting line 6 or the specific 2 nd cutting groove 24 extending in the short side direction of the packaged substrate 1.
Next, the packaged substrate 1 placed on the cutting stage 8B (cutting jig 15) is moved in the Y direction by a moving mechanism (not shown). The substrate 2 and the sealing resin 4 included in the substrate 1 after sealing are collectively cut along the 2 nd cutting line 6 extending in the short side direction of the substrate 1 after sealing by using the rotary knife 22. Thereby, the 2 nd cut line 26(26a) is formed. The remaining portion (remaining thickness portion) where the sealing resin 4 is formed is cut entirely along the 2 nd cut groove 24 extending in the short side direction of the substrate 1 after sealing by using the rotary blade 22. Thereby, the 2 nd cut line 26(26b) is formed. The 2 nd cut line 26(26a, 26b) is indicated by a thick solid line in fig. 5A. In this state, the end portions (left and right end portions in fig. 5A) of the substrate 1 formed in the short side direction after the package are removed. Fig. 5A shows a state in which only the end portion 1c (a portion indicated by a two-dot chain line in the figure) is removed.
As shown in fig. 5A, in the post-package substrate 1, the unit region 7 surrounded by the 1 st cut 25 formed in the longitudinal direction and the 2 nd cut 26 formed in the short direction corresponds to a singulated product 27. The packaged substrate 1, which has been reduced in warpage or rigidity by forming the 1 st cut groove 23 and the 2 nd cut groove 24 in the packaged substrate 1, is reliably sucked to the cutting jig 15. In a state where the sealed substrate 1 sucked to the cutting jig 15 is cut, the products 27 corresponding to the unit regions 7 are stably sucked through the 2 nd suction ports 19A. Therefore, in a state where the substrate 1 is singulated after the packaging, the products 27 are stably sucked to the cutting jig 15 through the 2 nd suction ports 19A formed in the cutting jig 15.
According to the first embodiment, the cutting device is provided with the cutting jig 9 for forming the cut groove in the post-package substrate 1 and the cutting jig 15 for singulation by cutting the post-package substrate 1. The 2 nd suction port 19A of the cutting jig 15 has the 2 nd suction area corresponding to each of the plurality of unit regions 7 of the post-package substrate 1. The 1 st suction port 12 of the cutting jig 9 has a1 st suction area larger than a2 nd suction area. The unit adsorption area is larger than the 2 nd adsorption area, wherein the unit adsorption area is an area included in the 1 st adsorption area, that is, the unit adsorption area is an area for respectively adsorbing the plurality of unit regions 7. Therefore, the packaged substrate 1 having warpage is sucked to the cutting jig 9 through the 1 st suction port 12 having a unit suction area larger than the 2 nd suction area.
Second, first, in a state where the packaged substrate 1 having warpage is attached to the cutting jig 9, a part of the entire thickness of the packaged substrate 1 is cut. This reduces warpage of the substrate 1 after packaging, and reduces the rigidity of the substrate 1 after packaging. Next, the packaged substrate 1 with reduced warpage or the packaged substrate 1 with reduced rigidity is placed on a cutting jig 15. The cutting jig 15 is provided with a plurality of 2 nd suction ports 19A corresponding to the plurality of unit regions 7 of the post-package substrate 1. The warpage-reduced packaged substrate 1 or the rigidity-reduced packaged substrate 1 is stably sucked through the plurality of 2 nd suction ports 19A corresponding to the plurality of unit regions 7. The cutting jig 15 cuts the post-package substrate 1 to produce a plurality of products 27. Therefore, the package rear substrate 1 having warpage can be cut in two steps.
Third, the cutting jig 9 is provided with a1 st suction port 12 having a size and a shape independent of the size and the shape of the product. Since the operation of cutting (cutting) the entire thickness of the packaged substrate 1 is not performed, it is not necessary to provide a cutting groove corresponding to the size of the product in the cutting jig 9. Therefore, the cutting jig 9 can be easily manufactured as compared with a normal cutting jig, and the manufacturing cost of the cutting jig 9 can be controlled. The cutting jig 9 is independent of the size and shape of the product. Therefore, if the size of the packaged substrate 1 is within the size range of the cutting jig 9, various types of products can be used in common for the cutting table 8A and the cutting jig 9.
In the package rear substrate 1 shown in fig. 4A and 4B, two cut grooves 23B and 23d extending in the longitudinal direction and three cut grooves 24c, 24e, and 24g extending in the short direction are formed, whereby the warpage of the package rear substrate 1 is reduced. However, the present invention is not limited to this, and the cut groove 23 may be formed to extend along all the cutting lines 5 extending in the longitudinal direction of the packaged substrate 1. The cut groove 24 may be formed to extend along all the cutting lines 6 extending in the short side direction of the package rear substrate 1. The number of the cut grooves formed in the post-package substrate 1 may be arbitrarily determined depending on the size of the post-package substrate 1, the thickness of the substrate 2, the thickness of the package resin 4, the size of the product 27 (see fig. 5A and 5B), and the like.
In fig. 4A and 4B, a cut groove is formed by cutting a predetermined thickness portion of the entire thickness of the substrate 2 and the entire thickness of the sealing resin 4 of the substrate 1 after sealing. However, the present invention is not limited to this, and the cut groove may be formed by cutting only a predetermined thickness portion of the entire thickness of the substrate 2 included in the packaged substrate 1. This method is effective, for example, in the case where the entire thickness of the encapsulation resin 4 is smaller than the entire thickness of the substrate 2.
Instead of the resin sheet 11 shown in fig. 4A and 4B, a resin sheet 11 having the 1 st suction port 12 below the cutting line 6 in the center portion of the sealed substrate 1 may be used. In this case, the post-package substrate 1 may be cut at one cutting line 6 in the central portion. Thereby, two semi-finished products are produced from the packaged substrate 1. One semifinished product has 16 (4 × 4) unit regions 7. Warpage is reduced in each semi-finished product. The two semi-finished products with reduced warpage are respectively adsorbed on the cutting jigs 15 shown in fig. 5B. Each of the semifinished products adsorbed on the cutting jig 15 is cut by using a rotary cutter 22 shown in fig. 5B. In addition to cutting the packaged substrate 1 at one cutting line 6 in the center portion, cut grooves 23, 24 may be formed in the packaged substrate 1 at the cutting lines 5, 6 of the packaged substrate 1.
Next, a description will be given of a relationship between a unit suction area, which is an area where one unit region 7 is sucked through one 1 st suction port 12, and a2 nd suction area, which is an area where one unit region 7 is sucked through one 2 nd suction port 19A, with reference to modifications shown in fig. 6A to 6D. In the following description, the length is expressed by a nameless number (dimensionless number).
As already described, the unit adsorption area is larger than the 2 nd adsorption area. However, in the case where the unit suction area is slightly larger than the 2 nd suction area, only the 1 st suction port 12 can suck one unit region 7 with a suction force slightly larger than the 2 nd suction port 19A.
As shown in fig. 6A and 6B, the one first suction port 12 of the present modification covers the unit regions 7 except for both ends thereof corresponding to the four unit regions 7 arranged in the vertical direction in fig. 6A. One 1 st adsorption port 12 is arranged to extend to the outside of the unit region 7 at the upper and lower ends shown in fig. 6A.
As shown in fig. 6C and 6D, a square unit region 7 having a length L1 of one side of the unit region 7 of 10 will be described as an example of the unit region 7 included in the substrate 1 after sealing. Assume a case where the unit region 7 is sucked by using the cutting jig 15 shown in fig. 5. As shown in fig. 6D, the width L2 of the cutting groove formed on one side of the unit region 7 was 0.5. Therefore, the width of the entire cutting groove is L2 × 2 equal to 1. The thickness of a wall (shown by hatching in fig. 6D) separating the cutting groove from the 2 nd adsorption port 19A was 1 as L3.
Fig. 6D is a plan view of the unit region 7 sucked through the second suction port 19A in the step of cutting the post-package substrate 1 shown in fig. 5A and 5B. One of the 2 nd adsorption ports 19A corresponding to one unit region 7 is a square having a side length L4 of 7. Therefore, the 2 nd suction area S2, which is the area of one unit region 7 sucked through one 2 nd suction port 19A, is 49 (L4 × L4 is 7 × 7).
Referring to fig. 6D, a method of sucking one unit region 7 by a unit sucking area larger than the 2 nd sucking area S2 in the step of forming the cutting groove is studied. The resin sheet 11 having the 1 st suction port 12 does not require a cutting groove (see the cutting groove 21 in fig. 5B). Thereby, the cutting groove is removed from the state of fig. 6D, and the suction port is enlarged. The expanded adsorption port (2 nd adsorption port) was a square having a side length L4 of 8. Therefore, the 2 nd suction area S2, which is the area in which one unit region 7 is sucked by one 2 nd suction port 19A, is 64 (L4 × L4 is 8 × 8).
The unit adsorption area included in the 1 st adsorption area is compared with the 2 nd adsorption area S2. The unit adsorption area S1 is 64/49 times (≈ 1.31) the 2 nd adsorption area S2. In this case, the 1 st suction force of the 1 st suction port 12 targeting the one unit region 7 is about 1.3 times the 2 nd suction force of the 2 nd suction port 19A targeting the one unit region 7. According to this magnification, the unit suction area S1 is preferably 1.3 times or more the 2 nd suction area S2. Thus, in the step of sucking the packaged substrate 1 placed on the resin sheet 11, there is an effect that the packaged substrate 1 having warpage is reliably sucked by the 1 st suction force.
Referring to fig. 6C, another mode of sucking one unit region 7 by a unit sucking area larger than the 2 nd sucking area S2 in the step of forming the cutting groove is studied. This embodiment is still another embodiment for realizing a unit suction area larger than the 2 nd suction area S2. Fig. 6C is a plan view showing still another embodiment of the unit region 7 sucked through the 1 st suction port 12 in the step of forming the cutting groove. The 1 st adsorption port 12 shown in FIG. 6C is an adsorption port in which the 2 nd adsorption port 19A shown in FIG. 6D is connected in the vertical direction in FIG. 6A. Therefore, the unit suction area S1, which is the area through which one unit region 7 is sucked by the first suction port 12, is 70 (L1-2 × (L2+ L3)) × L1 is 7 × 10).
The other unit adsorption area S1 of the other mode of the unit region 7 is 70/49 times (≈ 1.43) the 1 st adsorption area S1. In this case, the 1 st suction force of the 1 st suction port 12 targeting the one unit region 7 is about 1.4 times the 2 nd suction force of the 2 nd suction port 19A targeting the one unit region 7. Based on this magnification, the unit suction area S1 is preferably 1.4 times or more the 2 nd suction area S2. Thus, in the step of sucking the packaged substrate 1 placed on the resin sheet 11, there is an effect that the packaged substrate 1 having warpage is more reliably sucked by the 1 st suction force.
A modified example in which the packaged substrate 1 is sucked by sequentially using the plurality of 1 st suction ports 12 with a time difference will be described below. On/off valves are provided in the adsorption paths 13 connected to the 1 st adsorption ports 12, respectively. The adsorption path 13 and the switching valve constitute a piping system.
As shown in fig. 1B, the substrate 1 after sealing is deformed so that both end portions thereof protrude toward the sealing resin 4 side due to the shrinkage stress when the sealing resin 4 is cured. In other words, the deformation is largest at both ends of the substrate 1 after the encapsulation. The following will be described with reference to fig. 6C and 6D. The unit suction area S1, which is the area through which one unit region 7 is sucked by one 1 st suction port 12, is preferably 1.3 times or more the 2 nd suction area S2, which is the area through which one unit region 7 is sucked by one 2 nd suction port 19A. More preferably, the 1 st suction area S1 is 1.4 times or more the 2 nd suction area S2.
For example, as a modification 1, four (four) rows of the 1 st suction ports 12 arranged in the left-right direction in the drawing are provided instead of the two (two rows) of the suction ports (the 1 st suction ports) 12 shown in fig. 2B and 4B. One of the 1 st suction ports 12 corresponds to two adjacent rows of the 1 st suction ports 12 (corresponding to 8 unit regions 7, 2 × 4 shown in fig. 1) extending in the depth direction from the front as shown in fig. 6B. An adsorption path 13 and an on-off valve connected to the four 1 st adsorption ports 12 are provided. In this case, four piping systems are provided.
As shown in fig. 6B, when the post-package substrate 1 is placed in the cutting jig 9 with the substrate 2 side facing upward, a gap is formed between the lower surface of the package resin 4 and the upper surface of the resin sheet 11 in the center portion of the post-package substrate 1. In this case, first, the post-package substrate 1 is sucked through the 1 st suction ports 12 (one of the right ends and one of the left ends) disposed corresponding to both ends of the post-package substrate 1. Next, the packaged substrate 1 is sucked through the remaining 1 st suction ports 12 (two in the center). This allows the packaged substrate 1 having warpage to be sucked and held.
When the substrate 2 side of the post-package substrate 1 is directed upward and the post-package substrate 1 is attached to the cutting jig 9, it is preferable to cut the entire thickness of the substrate 2 of the post-package substrate 1 and a part of the thickness of the package resin 4 (see fig. 4B). Thereby further reducing the warpage of the substrate 1 after packaging, and further reducing the rigidity of the substrate 1 after packaging.
When the post-package substrate 1 is placed in the cutting jig 9 with the package resin 4 side facing upward, a gap is formed between the lower surface of the substrate 2 and the upper surface of the resin sheet 11 at both ends of the post-package substrate 1. In this case, first, the package substrate 1 is sucked through the 1 st suction port 12 (two in the central portion) disposed corresponding to the central portion of the package substrate 1. Next, the packaged substrate 1 is sucked through the 1 st suction ports 12 (one on the right end and one on the left end) at the remaining both ends.
When the sealing resin 4 side of the sealed substrate 1 is directed upward and the sealed substrate 1 is sucked to the cutting jig 9, it is preferable to cut the entire thickness of the sealing resin 4 of the sealed substrate 1 and a part of the thickness of the substrate 2. Thereby further reducing the warpage of the substrate 1 after packaging, and further reducing the rigidity of the substrate 1 after packaging.
As a modification 2, for example, instead of the two (two rows) 1 st adsorption ports 12 shown in fig. 2B and 4B, eight (eight rows) 1 st adsorption ports 12 shown in fig. 6A and 6B are provided. When a gap is formed between the lower surface of the substrate 2 and the upper surface of the resin sheet 11 at both ends of the post-package substrate 1, first, the post-package substrate 1 is sucked through the 1 st suction port 12 (four in total) located at the intermediate portion between the second and third ends. Next, the packaged substrate 1 is sucked through the remaining 1 st suction ports 12 (two in the center and two at both ends). This allows the packaged substrate 1 having warpage to be sucked and held.
The modification 2 is effective when the object to be cut is a rectangle other than a square (particularly, when the object to be cut is a rectangle having a large aspect ratio as in the case of the object to be cut (the packaged substrate 1) shown in fig. 1A). As one mode, one elongated 1 st suction port 12 shown in fig. 6A is provided corresponding to a plurality of (four in fig. 1A) row-like unit regions 7 in the short side direction. Eight rows of one elongated 1 st suction port 12 are provided so as to be aligned in the longitudinal direction. The eight rows of the 1 st adsorption ports 12 are connected to different piping systems (eight), respectively. Another mode of the eight rows of the 1 st suction ports 12 is a mode in which eight rows of two to three first suction ports 12 aligned in the short side direction are aligned in the longitudinal direction. In these embodiments, the area of the packaged substrate 1 sucked by one 1 st suction port 12 is larger than the area of one unit region 7.
In another embodiment, four line-shaped suction ports 12 are provided corresponding to a plurality of (four in fig. 1A) line-shaped unit regions 7 in the short side direction. Four 1 st suction ports 12 in eight rows arranged in one row are provided so as to be arranged in the longitudinal direction.
In either mode, the eight rows of the 1 st adsorption ports 12 are each connected to a different piping system (eight). In either method, a plurality of the 1 st suction ports 12 are sequentially used with a time difference provided according to the method of deformation (including warpage and undulation) of the object to be cut. This enables the cut object having warpage to be reliably sucked.
Examples of using the eight rows of the 1 st adsorption ports 12 include the following. Eight rows of the 1 st suction ports 12 are used in this order from the center portion to both end portions. Eight rows of the 1 st suction ports 12 are used in order from both end portions to the center portion. The eight rows of the 1 st suction ports 12 are used in order from the middle portion between the middle portion and both end portions to the middle portion, and then used in order from the middle portion to both end portions. The eight rows of the 1 st adsorption ports 12 were used in order from the middle portion to both end portions, and then in order from the middle portion to the middle portion. Eight rows of the 1 st suction ports 12 are used in order from one short side to the other short side.
An adhesive tape having an adhesive formed on one surface thereof may be used, and the object to be cut such as the sealed substrate 1 attached to the adhesive tape may be adsorbed to the resin sheet 11 of the cutting jig 9 together with the adhesive tape (see fig. 4B). The resin sheet 11 having the 1 st suction port 12 shown in fig. 4B sucks the tape to which the object to be cut is attached. Thereby, the adhesive tape to which the cut object having a warp is attached is reliably adsorbed to the resin sheet 11 of the cutting jig 9.
As shown in fig. 4A and 4B, cutting grooves 23 and 24 are formed in the object to be cut adsorbed on the resin sheet 11 by using a cutting blade 22. When using a tape, the object to be cut adsorbed on the resin sheet 11 may be cut by the cutting blade 22. In this case, the cutting blade 22 is lowered until the lower end of the cutting blade 22 reaches a predetermined position of the thickness of the adhesive tape. Thereafter, the cutting blade 22 and the cutting jig 9 are moved relatively to cut the object. In this case, the cutting jig 9 shown in fig. 4 functions as a cutting jig.
The cut products 27 (see fig. 5A and 5B) are separated from the tape by suction, transferred, and stored in a tray. As the adhesive included in the tape, an ultraviolet-curable adhesive is used. In a state where the cut product 27 is bonded to a tape, ultraviolet rays are irradiated to the tape, thereby reducing the adhesive force of the adhesive. Therefore, the absorbent article 27 can be easily separated from the adhesive tape.
When mounting the packaged substrate 1 on the resin sheet 11 of the cutting jig 9, the packaged substrate 1 is preferably processed by a conveyance jig (not shown) as follows. First, in a state where the substrate 2 included in the post-package substrate 1 shown in fig. 3B is sucked by the conveyance jig, the post-package substrate 1 is placed on the upper surface of the resin sheet 11 shown in fig. 4B. Next, the substrate 1 after sealing is pressed against the upper surface of the resin sheet 11 by slightly moving the conveyance jig in the-Z direction shown in fig. 4B. Thereby, the warpage of the substrate 1 after packaging is corrected (see fig. 3B). Next, the substrate 1 after the package is adsorbed on the upper surface of the resin sheet 11 using the 1 st adsorption port 12 shown in fig. 4B. Through the steps described so far, most of the lower surface of the sealing resin 4 of the substrate 1 after sealing is adsorbed to the upper surface of the resin sheet 11 (see fig. 4B). Next, the conveyance jig releases the suction of the packaged substrate 1. Next, after the conveying jig is raised, the conveying jig is moved away from above the cutting jig 9, for example, in the X direction or the Y direction shown in fig. 4B.
Example 2
Example 2 of the cutting apparatus of the present invention will be described with reference to fig. 7. As shown in fig. 7, the cutting device 28 is a device for singulating the cut object into a plurality of products. The cutting device 28 includes a substrate supply module a, a substrate cutting module B, and an inspection module C as components. Each of the components (modules a to C) is detachable and replaceable with respect to the other components.
The substrate supply module a is provided with a substrate supply mechanism 29. The packaged substrate 1 corresponding to the object to be cut is carried out of the substrate supply mechanism 29 and transferred to the substrate cutting module B by a transfer mechanism (not shown).
The cutting device 28 shown in fig. 7 is a double-cut (twin-cut) table type cutting device. Therefore, the substrate cutting module B is provided with one cutting table 8A and one cutting table 8B. A cutting jig 9 is attached to the cutting table 8A (see fig. 2A and 2B). A cutting jig 15 (see fig. 3A and 3B) is attached to the cutting table 8B. The cutting table 8A is movable in the Y direction in the figure by a moving mechanism 30A, and is rotatable in the θ direction by a rotating mechanism 31A. The cutting table 8B is movable in the Y direction in the figure by a moving mechanism 30B, and is rotatable in the θ direction by a rotating mechanism 31B.
The substrate cutting module B is provided with a position alignment camera (not shown). The alignment cameras can independently move in the X direction. The substrate cutting module B is provided with two spindles 32A and 32B as cutting mechanisms. The cutting device 28 is a cutting device of a double spindle structure provided with two spindles 32A, 32B. Spindles 32A, 32B are independently movable in the X and Z directions. The spindles 32A and 32B are provided with cutting water nozzles (not shown) that eject cutting water to suppress frictional heat generated by the rotating blades 22A and 22B rotating at high speed. The cutting table 8A and the mandrel 32A are moved relative to each other to cut the package substrate 1, thereby forming a cut groove. The post-package substrate 1 is cut and singulated by moving the cutting table 8B and the mandrel 32B relative to each other. The rotary blade 22A cuts the packaged substrate 1 by rotating in a plane including the Y direction and the Z direction. The rotary blade 22B cuts the post-package substrate 1 by rotating in a plane including the Y direction and the Z direction.
The inspection module C is provided with an inspection stage 33. A cut substrate 34, which is an assembly of a plurality of products 27 (see fig. 5A and 5B) obtained by cutting and singulating the packaged substrate 1, is placed on the inspection stage 33. The plurality of products 27 are inspected by an inspection camera (not shown) and sorted into good products and bad products. The non-defective products are accommodated in the tray 35.
In the present embodiment, a control unit CTL for performing all operations or controls such as the operation of the cutting device 28, the conveyance of the packaged substrate 1, the cutting and cutting of the packaged substrate 1, and the inspection of the product 27 is provided in the substrate supply module a. However, the present invention is not limited to this, and the control unit CTL may be provided in another module.
In the substrate cutting module B, first, the packaged substrate 1 is placed on and sucked by the cutting jig 9 attached to the cutting table 8A. Next, a cutting groove is formed in the sealed substrate 1 sucked to the cutting jig 9 by the rotary blade 22A attached to the arbor 32A. For example, a part of the entire thickness is cut along a part of a plurality of cutting lines set in the packaged substrate 1. The warpage of the packaged substrate 1 is reduced by forming a cut groove on the packaged substrate 1.
Next, the packaged substrate 1 with reduced warpage is placed on a cutting jig 15. Since the warpage of the substrate 1 after the package is reduced, the unit regions 7 corresponding to the products 27 are stably sucked through the 2 nd suction ports 19A formed in the cutting jig 15 (see fig. 3A and 3B). The sealed substrate 1 sucked by the cutting jig 15 is cut by the rotary blade 22B attached to the mandrel 32B. The entire thickness of the packaged substrate 1 is cut along a cutting line set in the packaged substrate 1, and a portion corresponding to the remaining thickness of the entire thickness of the packaged substrate 1 is cut along a cutting groove formed in the packaged substrate 1. Thus, the packaged substrate 1 is singulated to produce a product 27 (see fig. 5A and 5B).
In the present embodiment, the cutting device 28 of the double deck type and the double spindle structure is explained. However, the present invention is not limited to this, and may be applied to a cutting apparatus of a double table type and a single spindle structure.
In the present embodiment, in the cutting device 28 as the double table cutting method, the cutting jig 9 is attached to the cutting table 8A, and the cutting jig 15 is attached to the cutting table 8B. However, the present invention is not limited to this, and may be applied to a case where two single-stage cutting devices are used. In this case, the cutting jig 9 is attached to a cutting device, and the cutting device is used as a dedicated device for reducing warpage of the packaged substrate 1. The cutting jig 15 is attached to another cutting device, and the other cutting device is used as a dedicated device for singulation by cutting the packaged substrate 1.
Example 3
Embodiment 3 of the cutting apparatus of the present invention will be explained with reference to fig. 8. As shown in fig. 8, the object to be cut of the present embodiment has a substantially circular planar shape. The object to be cut is, for example, a packaged wafer 36 formed of a semiconductor wafer packaged with resin. The packaged wafer 36 has a plurality of (52 in fig. 8) unit regions 7, a groove NT, and a packaging resin (not shown). A circuit is formed in each unit region 7. The packaged wafer 36 is placed on the resin sheet 11 of the cutting jig 9 (see fig. 2A and 2B) so that the semiconductor wafer body W faces upward. The object to be cut may be a circular packaged substrate in which a semiconductor chip is mounted on each unit region 7 of a printed circuit board having a circular planar shape.
As shown in fig. 8, the resin sheet 11 is provided with a2 nd suction port 37 (corresponding to the 2 nd suction port 19A shown in fig. 3A, 3B, and 5B) having a2 nd suction area corresponding to one unit region 7. The number of the 2 nd adsorption ports 37 equal to the number of all the unit regions 7, that is, N (for example, 52 in the case of fig. 8) are provided. In order to make it easy to see fig. 8, a wall for partitioning the 2 nd suction port 37 is indicated by a thin broken line only in one first suction port 37 located at the lower right among the 2 nd suction ports 37 included in the resin sheet 11.
A set (52) of the 2 nd adsorption ports 37 is connected to a suction mechanism (not shown) via each adsorption path 38 and an on-off valve. The 2 nd suction ports 37 and the suction paths 38 provided in the resin sheet 11 have the same configuration as the 2 nd suction ports 19A and the suction paths 19B provided in the resin sheet 17 shown in fig. 5B.
In the present embodiment, the 52 nd adsorption ports 37 corresponding to the 52 unit regions 7 are divided into three groups shown in fig. 8. The three groups are three groups, namely a central group SA1, a middle group SA2 positioned at the outer side of the central group, and an outer edge group SA3 positioned at the outermost side of the central group. Each of the three groups corresponds to one 1 st suction port (see the 1 st suction port 12 shown in fig. 2A and 2B).
The center group SA1 has four 2 nd adsorption ports 37. Therefore, the suction port (1 st suction port) of the center group SA1 is an aggregate of the four 2 nd suction ports 37. The adsorption area (1 st adsorption area) of the aggregate is the sum of the adsorption areas of the single 2 nd adsorption ports 37 (in this case, four times the adsorption area of the single 2 nd adsorption port 37). Similarly, the suction port (1 st suction port) of the middle group SA2 is an aggregate of 32 2 nd suction ports 37. The adsorption area (1 st adsorption area) of the aggregate is 32 times the adsorption area of one 2 nd adsorption port 37. The suction port (1 st suction port) of the outer edge group SA3 is an aggregate of 16 2 nd suction ports 37. The adsorption area (1 st adsorption area) of the assembly is 16 times the adsorption area of one 2 nd adsorption port 37.
In the metal plate (see the metal plate 10 shown in fig. 2) provided below the resin sheet of the cutting jig, all of the plurality of 2 nd suction ports 37 of the center group SA1 communicate with each other, all of the plurality of 2 nd suction ports 37 of the middle group SA2 communicate with each other, and all of the plurality of 2 nd suction ports 37 of the outer edge group SA3 communicate with each other. Each of the 2 nd suction ports 37 of the center group SA1 and a suction mechanism (not shown) provided outside are connected to the 1 st on-off valve (not shown) via each of the suction paths 38. The 2 nd suction port 37 and the suction mechanism of the intermediate group SA2 are connected to a2 nd on-off valve (not shown) via the suction paths 38. The 2 nd suction port 37 and the suction mechanism of the outer edge group SA3 are connected to a3 rd on-off valve (not shown) via the suction paths 38. One suction mechanism is provided in common in each group.
In the present embodiment, the 2 nd suction ports 37 of the center group SA1, the 2 nd suction ports 37 of the middle group SA2, and the 2 nd suction ports 37 of the outer edge group SA3 are used simultaneously to suck the packaged wafer 36. In addition, in the present embodiment, the following modifications may be adopted: that is, the packaged wafer 36 is sucked by setting the time difference and using the plurality of 2 nd suction ports 37 in order.
In the case where a gap is formed between the lower surface of the sealing resin and the upper surface of the resin sheet 11 in the central portion of the wafer 36 after sealing, it is preferable that the wafer 36 after sealing is sucked in the order of the outer edge group SA3, the middle group SA2, and the center group SA 1. Depending on the warpage of the packaged wafer 36, the sequence of sucking the packaged wafer 36 may be the sequence of the middle group SA2, the center group SA1, and the outer edge group SA3, or the sequence of the middle group SA2, the outer edge group SA3, and the center group SA 1.
When a gap is formed between the lower surface of the semiconductor wafer and the upper surface of the resin sheet in the outer edge portion of the packaged wafer 36, the packaged wafer 36 is preferably sucked in the order of the center group SA1, the middle group SA2, and the outer edge group SA 3. Depending on the warpage of the packaged wafer 36, the sequence of sucking the packaged wafer 36 may be the sequence of the middle group SA2, the center group SA1, and the outer edge group SA3, or the sequence of the middle group SA2, the outer edge group SA3, and the center group SA 1.
According to the present embodiment, one suction port 37 corresponding to one unit region 7 is provided on the resin sheet 11. A plurality of (three in fig. 8) groups of the 2 nd suction ports 37 are provided over the entire area of the wafer 36 after packaging. 3-system pipeline systems corresponding to the three groups are arranged. Further, according to the present modification, the packaged wafer 36 is sucked by using a plurality of groups in order according to the warpage of the packaged wafer 36. First, the packaged wafer 36 can be appropriately sucked in accordance with the warpage of the packaged wafer 36. Second, when the adhesive tape is used, the resin sheet 11 can be used in both the cutting jig and the cutting jig.
The plurality of 2 nd adsorption ports 37 may be divided into more groups. For example, the intermediate group SA2 shown in fig. 8 may be divided into eight groups each having a square shape and four second suction ports 37. The outer edge group SA3 shown in fig. 8 may be divided into four groups in a row having four second suction ports 37. Thus, the packaged wafer 36 can be sucked by an optimum method according to the deformation mode such as warpage, undulation, or warpage of the packaged wafer 36 as the object to be cut.
In summary, the cut object is sucked in the following manner according to the distance from the upper surface of the resin sheet 11 to the lower surface of the cut object (hereinafter referred to as "separation distance"). First, after the object to be cut is sucked through the plurality of 2 nd suction ports 37 disposed corresponding to the portion having the largest separation distance, the object to be cut is sucked through the plurality of 2 nd suction ports 37 disposed corresponding to the periphery of the portion (adjacent to the portion). Second, after the object to be cut is sucked through the plurality of 2 nd suction ports 37 arranged corresponding to the periphery of the portion having the largest separation distance, the object to be cut is sucked through the plurality of 2 nd suction ports 37 located in the periphery of the plurality of 2 nd suction ports 37 used. Third, after the cut object is sucked by using the plurality of 2 nd suction ports 37 arranged corresponding to the portion of the cut object having the smallest distance (the portion where the lower surface of the cut object contacts the upper surface of the resin sheet 11), the cut object is sucked by using the plurality of 2 nd suction ports 37 located in the periphery of the plurality of 2 nd suction ports 37 that have been used.
As shown in fig. 8, one suction port group including the plurality of 2 nd suction ports 37 is arranged in a substantially concentric circle shape (or a frame shape having the same center). The cut object is sucked by sequentially using the plurality of suction port groups by providing a time difference. The object to be cut can be sucked by sequentially using the plurality of suction port groups by providing a time difference according to the deformation (including warpage, undulation, and bending) of the object to be cut.
When the planar shape of the object to be cut is a rectangle other than a square (in particular, a rectangle having a large aspect ratio such as the packaged substrate 1 shown in fig. 1A), the plurality of suction port groups are used as follows. A plurality of suction port groups may be used in order from the center portion to both end portions (left and right ends in fig. 1A). A plurality of suction port groups may be used in order from both end portions to the central portion. The plurality of suction port groups may be used in order from the middle portion to the both end portions, and then in order from the middle portion to the both end portions. The plurality of suction port groups may be used in order from the middle portion toward both end portions, and then may be used in order from the middle portion toward the middle portion. It is also possible to use a plurality of suction port groups in order from one end (left end or right end in fig. 1A) to the other end (right end or left end) of the object to be cut shown in fig. 1A.
When the planar shape of the object to be cut is a square or a circle (including a case of a rectangle close to a square or a case of a substantially circle like the wafer 36 after packaging shown in fig. 8), the plurality of suction port groups are used as follows. A plurality of suction port groups may be used in order from the central portion to the peripheral portion. A plurality of suction port groups may be used in order from the peripheral portion to the central portion. The plurality of adsorption port groups may be used in order from the intermediate portion located between the central portion and the peripheral portion to the central portion, and then in order from the intermediate portion to the peripheral portion. The plurality of adsorption port groups may be used in order from the intermediate portion to the peripheral portion and then in order from the intermediate portion to the central portion. It is also possible to use a plurality of suction port groups in order from one end to the other end of the object to be cut as shown in fig. 8.
Instead of one suction port group consisting of a plurality of the 2 nd suction ports 37, a plurality of one suction ports corresponding to one suction port group may be provided. For example, one suction port corresponding to four unit regions 7 extending in the vertical direction (corresponding to the four 2 nd suction ports 37 at the right end shown in fig. 8), one suction port corresponding to six unit regions 7, four rows of one suction port corresponding to eight unit regions 7, one suction port corresponding to six unit regions 7, and one suction port corresponding to four unit regions 7 are provided in this order from the right end of the object to be cut shown in fig. 8.
A plurality of modes of sequentially using the plurality of adsorption port groups by a plurality of setting time differences may be prepared. Various kinds of software for realizing these various modes are stored in the control section CTL shown in fig. 7. The control unit CTL selects the optimum software from the plurality of types of software, and executes the optimum software. The control unit CTL may sequentially execute a plurality of types of software until the object to be cut is sucked. The cutting device shown in fig. 7 may be provided with a measuring mechanism for measuring the deformation of the object to be cut. The control unit CTL selects an optimum software from among the plurality of types of software and executes the optimum software according to the form of deformation (specification of a portion to be concave and convex, size of deformation, and the like) measured by the measuring means.
In examples 1 and 2, the case where the post-package substrate 1 having a rectangular planar shape including the longitudinal direction and the short side direction is cut as a workpiece is shown. In example 3, a case is shown in which the packaged wafer 36 having a substantially circular planar shape is cut as a cut object. However, the present invention is not limited to this, and may be applied to a case where a cut object having an irregular planar shape other than a rectangle (including a square) and a circle is cut.
In each of the examples, the case where the post-package substrate 1 having the package resin 4 formed on the substrate 2 is cut as a cut object is shown. Not limited to this, as the substrate in the object to be cut, a lead frame, a glass epoxy laminate, a printed wiring board, a ceramic substrate, a metal base substrate, a film base substrate, or the like can be used, and the present invention can be applied to a post-package substrate in which a package resin is formed on the substrate.
The functional element may include a sensor, a filter, an actuator, a vibrator, and the like, in addition to a semiconductor element such as an IC (Integrated Circuit), a transistor, or a diode. A plurality of functional elements may be mounted on one unit area 7.
As described above, the present invention can be applied to a case where a cut object having a substantially circular shape such as a wafer-level package in which a semiconductor wafer of a silicone semiconductor or a compound semiconductor is resin-packaged together with a packaging resin is cut. In this case, the sealing resin corresponds to the insulating member. The present invention is applicable to a case where a cut object made of a semiconductor wafer is cut. In this case, a passivation film for protecting a circuit formed on the semiconductor wafer corresponds to the insulating member. In both cases, the semiconductor wafer corresponds to a substrate on which a circuit is formed.
The chip-like element 3 mounted on each unit region 7 of the substrate 2 may be not only one chip-like element 3 as an active element but also a plurality of chip-like elements (including passive elements). The chip-like element 3 is merely an example, and mechanical components such as a connector, a vibrator, a sensor, a filter, and the like may be mounted on each unit region 7.
The present invention is applicable to a case where the warpage of a plate-like member is to be suppressed in a step of singulating a resin molded product as the plate-like member. For example, the present invention is applicable to the case where an optical device such as a lens, a microlens array, an optical module, or a light guide plate is manufactured by singulating a resin molded product as a plate-shaped member. In this case, the lens, the microlens array, the optical module, the light guide plate, and the like correspond to the functional element. The present invention can be applied to the case of manufacturing a general molded product such as a connector by unitizing a resin molded product. In this case, the molded article corresponds to a functional element. In various cases including these cases, the contents described herein can be applied.
The present invention is not limited to the above-described embodiments, and may be modified and selectively employed in any and appropriate combination as necessary within the scope not departing from the gist of the present invention.
Description of the reference numerals
1 rear substrate of package (cut object)
1a, 1b, 1c end material part
2 base plate (1 st member)
3 chip-like element
4 encapsulating resin (2 nd member)
5 the 1 st cut line (cut line)
6 nd 2 nd cutting line (cutting line)
7 unit area
8A cutting platform (No. 1 platform)
8B cutting platform (No. 2 platform)
9 cutting clamp (1 st clamp)
10. 16 metal plate
11. 17 resin sheet
12 st adsorption port
13. 19B, 38 adsorption route
14 space (a)
15 cutting clamp (No. 2 clamp)
18 projection
19A, 37 nd adsorption port 2
20 st cutting groove
21 nd 2 cutting groove
22 rotating knife (1 st rotating knife, 2 nd rotating knife)
22A rotating knife (the 1 st rotating knife)
22B rotating knife (No. 2 rotating knife)
23. 23b, 23d the 1 st cut groove (cut groove)
24. 24c, 24e, 24g the 2 nd cutting groove (cutting groove)
25. 25a, 25b 1 st cut line
26. 26a, 26b 2 nd cutting mark
27 articles of manufacture
28 cutting device (manufacturing device)
29 substrate supply mechanism
30A, 30B moving mechanism
31A, 31B rotation mechanism
32A mandrel (cutting mechanism, 1 st cutting mechanism)
32B mandrel (cutting mechanism, 2 nd cutting mechanism)
33 platform for inspection
34 cutting off the rear substrate
35 tray
36 wafer after packaging (cut object)
A substrate supply module
B substrate cutting module
C checking module
CTL control part
Length of one side of L1 unit area
L2 width of cutting groove formed on one side of unit region
L3 thickness of wall separating cutting groove and adsorption port
L4 Length of side of the 1 st suction opening
NT groove
S1 Unit adsorption area
S2 adsorption area 2
SA1 center group
SA2 intermediate group
SA3 outer edge set
W semiconductor wafer body

Claims (20)

1. An adsorption mechanism for use in a process comprising: that is, a plurality of products corresponding to a plurality of unit regions are manufactured by sucking a cut object having a plurality of unit regions sectioned by a plurality of cutting lines and cutting the cut object,
the adsorption mechanism is characterized by comprising:
a first stage 1 for placing the object to be cut;
a1 st jig attached to the 1 st stage, the 1 st jig being used in the step of forming a cut groove in the work piece; and
one or more 1 st suction ports provided in the 1 st jig for sucking the cut object by a1 st suction area,
a unit suction area larger than a2 nd suction area, the unit suction area being an area included in the 1 st suction area, that is, an area to which one of the unit regions is sucked, and the 2 nd suction area being an area to which one of the unit regions is sucked by each of a plurality of 2 nd suction ports partitioned in the 2 nd jig used in the step of cutting the cut object so as to correspond to the plurality of unit regions.
2. An adsorption process for use in the following process: that is, a plurality of products corresponding to a plurality of unit regions are manufactured by sucking a cut object having a plurality of unit regions sectioned by a plurality of cutting lines and cutting the cut object,
the adsorption method is characterized by comprising the following steps:
preparing a1 st stage for placing the object to be cut;
preparing a1 st jig which is attached to the 1 st stage and used in a step of forming a cutting groove in the work piece;
preparing one or more 1 st suction ports, the 1 st suction ports being provided in the 1 st jig and sucking the cut object by a1 st suction area, respectively; and
adsorbing the cut object by using one or more of the 1 st adsorption ports and a unit adsorption area, wherein the unit adsorption area is an area included in the 1 st adsorption area, that is, an area where one unit region is adsorbed,
the unit suction area is larger than a2 nd suction area, and the 2 nd suction area is an area in which the 2 nd suction port of the 2 nd jig used in the step of cutting the cut object is divided into a plurality of 2 nd suction ports corresponding to the plurality of unit regions, respectively, and sucks one unit region.
3. A manufacturing device is provided with: a cutting mechanism for cutting an object to be cut having a plurality of unit areas divided by a plurality of cutting lines; and a rotary knife provided in the cutting mechanism, the manufacturing apparatus being used in a process of manufacturing a plurality of products corresponding to the plurality of unit regions by cutting the object to be cut,
the manufacturing apparatus is characterized in that the manufacturing apparatus,
the suction mechanism according to claim 1 is provided.
4. A manufacturing device is provided with: a cutting mechanism for cutting an object to be cut having a plurality of unit areas divided by a plurality of cutting lines; and a rotary knife provided in the cutting mechanism, the manufacturing apparatus being used in a process of manufacturing a plurality of products corresponding to the plurality of unit regions by cutting the object to be cut,
the manufacturing apparatus is characterized by comprising:
a first stage 1 for placing the object to be cut;
a2 nd stage for placing the object to be cut;
a moving mechanism for relatively moving the 1 st stage and the 2 nd stage and the cutting mechanism;
a1 st jig mounted on the 1 st stage;
one or more 1 st suction ports provided in the 1 st jig, for sucking the cut object by a1 st suction area, respectively;
a2 nd jig mounted on the 2 nd stage; and
a plurality of 2 nd suction ports provided in the 2 nd jig so as to correspond to the plurality of unit regions, respectively, and sucking one unit region by a2 nd suction area, respectively,
a unit adsorption area larger than the 2 nd adsorption area, wherein the unit adsorption area is an area included in the 1 st adsorption area, that is, the unit adsorption area is an area where a plurality of unit regions are respectively adsorbed,
in the 1 st jig, cutting a part of the entire thickness of the object to be cut along at least one of the cutting lines by the rotary cutter to form at least one cutting groove,
forming a semi-finished product having a plurality of intermediate regions partitioned by the cutting grooves in the 1 st jig,
in the 2 nd jig, the semifinished product is cut along the plurality of cutting lines by the rotary knife, thereby manufacturing a plurality of the products respectively sucked by the 2 nd suction ports.
5. The manufacturing apparatus according to claim 4, comprising:
a1 st cutting mechanism provided in the cutting mechanism; and
a2 nd cutting mechanism provided in the cutting mechanism,
in the 1 st jig, the cutting groove is formed by a1 st rotary knife provided in the 1 st cutting mechanism,
in the 2 nd jig, the 2 nd rotary knife provided in the 2 nd cutting mechanism cuts the semi-finished product.
6. The manufacturing apparatus according to claim 4,
the 1 st jig can suck a1 st cut object including a plurality of 1 st unit regions each having a1 st size, and can suck a2 nd cut object including a plurality of 2 nd unit regions each having a2 nd size different from the 1 st size.
7. The manufacturing apparatus according to claim 4,
the cutting groove is formed along all of the plurality of cutting lines.
8. The manufacturing apparatus according to claim 4,
the object to be cut is a plate-like member having functional elements formed in each of the plurality of unit regions.
9. The manufacturing apparatus according to any one of claims 4 to 8,
the object to be cut has at least a1 st member composed of a base material and a2 nd member formed on the base material,
the cutting groove is formed over at least the entire thickness of the 1 st member or over at least the entire thickness of the 2 nd member.
10. The manufacturing apparatus according to any one of claims 4 to 8,
the object to be cut has at least a1 st member composed of a base material and a2 nd member formed on the base material,
the cutting groove is formed in a part of the entire thickness of the 1 st member or in a part of the entire thickness of the 2 nd member.
11. The manufacturing apparatus according to any one of claims 4 to 8,
the object to be cut has at least a1 st member composed of a base material and a2 nd member formed on the base material,
the 1 st member is a substrate formed with an electric circuit,
the 2 nd member is an insulating member.
12. A method of manufacture comprising the steps of: relatively moving a cut object having a plurality of unit areas sectioned by a plurality of cutting lines and a cutting mechanism; and cutting the cut object by using a rotary knife provided in the cutting mechanism, the manufacturing method being used in a process of manufacturing a plurality of products corresponding to the plurality of unit regions by cutting the cut object,
the manufacturing method is characterized in that the manufacturing method comprises the following steps,
the adsorption method according to claim 2.
13. A method of manufacture comprising the steps of: relatively moving a cut object having a plurality of unit areas sectioned by a plurality of cutting lines and a cutting mechanism; cutting the object to be cut with a rotary knife provided in the cutting mechanism; and cutting the cut object by using the rotary knife, the manufacturing method is used in a process of manufacturing a plurality of products corresponding to the unit areas by cutting the cut object,
the manufacturing method is characterized by comprising the following steps:
preparing a1 st stage for placing the object to be cut;
preparing a2 nd stage for placing the cut object;
preparing a1 st clamp, wherein the 1 st clamp is arranged on the 1 st platform and is provided with one or more 1 st adsorption ports respectively comprising a1 st adsorption area;
preparing a2 nd chuck, the 2 nd chuck being mounted on the 2 nd stage and having a plurality of 2 nd suction ports corresponding to the plurality of unit regions, respectively, and including a2 nd suction area, respectively;
in the 1 st chuck, using each 1 st suction port of the one or more 1 st suction ports to suck the cut object;
in the cutting step, the first jig is configured to cut a part of the entire thickness of the object to be cut along at least one of the cutting lines by using the rotary cutter to form at least one cutting groove;
forming a semi-finished product having a plurality of intermediate regions partitioned by the cutting grooves in the 1 st jig;
placing the semi-finished product on the 2 nd clamp;
in the 2 nd jig, adsorbing each of the plurality of unit regions that the semi-finished product has by using each of the 2 nd adsorption ports, thereby adsorbing the semi-finished product; and
in the cutting step, the 2 nd jig cuts the semi-finished product along the plurality of cutting lines using the rotary cutter,
a unit adsorption area larger than the 2 nd adsorption area, wherein the unit adsorption area is an area included in the 1 st adsorption area, that is, the unit adsorption area is an area where a plurality of unit regions are respectively adsorbed,
manufacturing a plurality of the products adsorbed by each of the 2 nd adsorption ports by cutting the semi-finished product.
14. The manufacturing method according to claim 13, comprising the steps of:
preparing a1 st cutting mechanism having a1 st rotary knife as the cutting mechanism;
preparing a2 nd cutting mechanism having a2 nd rotary knife as the cutting mechanism;
moving the object to be cut and the 1 st cutting mechanism relatively to each other as a step of moving the object to be cut and the cutting mechanism relatively to each other; and
moving the work piece and the cutting mechanism relatively to each other, moving the work piece and the 2 nd cutting mechanism relatively to each other,
in the step of forming the cut groove, the cut groove is formed by the 1 st rotary blade,
in the step of cutting the semi-finished product, the semi-finished product is cut by the 2 nd rotary knife.
15. The manufacturing method according to claim 13,
in the step of sucking the cut object, the 1 st cut object including a plurality of 1 st unit regions each having a1 st size can be sucked by using the 1 st jig, and the 2 nd cut object including a plurality of 2 nd unit regions each having a2 nd size different from the 1 st size can be sucked.
16. The manufacturing method according to claim 13,
in the step of forming the cut groove, the cut groove is formed along all of the plurality of cut lines.
17. The manufacturing method according to claim 13,
the object to be cut is a plate-like member having functional elements formed in each of the plurality of unit regions.
18. The production method according to any one of claims 13 to 17,
the object to be cut has at least a1 st member composed of a base material and a2 nd member formed on the base material,
in the step of forming the cut groove, the cut groove is formed over the entire thickness of the 1 st member or the cut groove is formed over the entire thickness of the 2 nd member.
19. The production method according to any one of claims 13 to 17,
the object to be cut has at least a1 st member composed of a base material and a2 nd member formed on the base material,
in the step of forming the cut groove, the cut groove is formed in a part of the entire thickness of the 1 st member or the cut groove is formed in a part of the entire thickness of the 2 nd member.
20. The production method according to any one of claims 13 to 17,
the object to be cut has at least a1 st member composed of a base material and a2 nd member formed on the base material,
the 1 st member is a substrate formed with an electric circuit,
the 2 nd member is an insulating member.
CN201680025715.XA 2015-07-10 2016-06-13 Adsorption mechanism, adsorption method, manufacturing device and manufacturing method Active CN107533965B (en)

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