CN104103568A - Chuck Workbench - Google Patents
Chuck Workbench Download PDFInfo
- Publication number
- CN104103568A CN104103568A CN201410125835.XA CN201410125835A CN104103568A CN 104103568 A CN104103568 A CN 104103568A CN 201410125835 A CN201410125835 A CN 201410125835A CN 104103568 A CN104103568 A CN 104103568A
- Authority
- CN
- China
- Prior art keywords
- wafer
- chuck table
- main body
- auxiliary body
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
A chuck workbench provided by the present invention is suitable for a wafer which sucks to keep warpage. The chuck workbench keeps the wafer, and is characterized by comprising a workbench main body possessing a keeping surface for sucking to keep the wafer, and an absorption auxiliary body possessing an inverted skirt-shaped skirt part, installed at the workbench main body in a manner of surrounding the workbench main body, and is formed by an elastic part. The skirt length of the skirt part protrudes upwards than the keeping surface, and the diameter of the skirt length is less than the diameter of the wafer.
Description
Technical field
The present invention relates to chuck table, be particularly suitable for the chuck table that suction keeps the wafer of warpage.
Background technology
In fabrication of semiconductor device, front at semiconductor wafers such as the silicon wafer of circular plate shape roughly, gallium arsenide wafers, the preset lines of cutting apart that utilization is that clathrate forms is called as spacing track is divided and is had a plurality of regions, in each region marking off, forms IC(integrated circuit), LSI(large scale integrated circuit) etc. device.
And, utilize grinding attachment to carry out grinding to the rear side that is not formed with device of wafer and wafer be thinned to the thickness of regulation, then, utilize topping machanism or laser processing device that wafer is divided into device one by one, the device being partitioned into is widely used in the various electric equipments such as portable phone, personal computer.
About wafer, in front, form in the process of device, sometimes owing to being layered in the impact of positive material or hot working etc., produce warpage or deformation.And, when utilizing grinding attachment to carry out grinding to the back side, also easily because the residual fine crack of the grinding face at wafer produces warpage or deformation (for example,, with reference to Japanese kokai publication hei 10-092776 communique).
Wafer is conventionally sucked and is held in the chuck table with the maintenance face larger than the diameter of wafer and implements processing, but when carrying out the location confirmation of wafer or cleaning etc., sometimes utilizes the chuck table with the maintenance face less than the diameter of wafer to keep.(for example,, with reference to No. 4303041 communique of Japan Patent)
Prior art document
Patent documentation 1: Japanese kokai publication hei 10-092776 communique
Patent documentation 2: No. 4303041 communique of Japan Patent
For example, when the deburring of carrying out the chamfered section that is formed at the periphery of wafer to remove (edge trimming), wafer is not to take the frame unit that is supported on ring-shaped frame through cutting belt to process as unit, but operates with wafer monomer.
In this case, the wafer taking out from take in the box of wafer is positioned on the chuck table that location confirmation uses, and utilizes image unit to make a video recording to detect eccentric direction and the offset from chuck table center on this chuck table.
This chuck table has the diameter less than the diameter of wafer, when utilizing this chuck table to keep the wafer of warpage, even the maintenance face of utilization suction wafer, also can be between maintenance face and wafer Existential Space, therefore there is such problem: likely cause negative pressure reveal and cannot aspirate maintenance wafer.
Summary of the invention
The present invention completes in view of such aspect just, and its object is to provide a kind of chuck table that suction keeps the wafer of warpage that is suitable for.
According to the present invention, a kind of chuck table is provided, it keeps wafer, and described chuck table is characterised in that, and it possesses: workbench main body, it has the maintenance face that suction keeps wafer; And absorption auxiliary body, it has the skirt section of the shape of falling skirt, described absorption auxiliary body is installed on this workbench main body in the mode around this workbench main body, this absorption auxiliary body is formed by elastomeric element, the train of dress in this skirt section keeps outstanding towards top than this, and the diameter of this train of dress forms littlely than the diameter of wafer.
Invention effect
According to chuck table of the present invention, in the surrounding of chuck table main body, be equipped with the absorption auxiliary body in the skirt section with the shape of falling skirt, the terminal part (train of dress in skirt section) of absorption auxiliary body is outstanding from maintenance face, therefore, can utilize in advance absorption auxiliary body seamlessly to support the wafer of warpage, afterwards from keeping face effect suction force, thereby wafer is aspirated and remained on chuck table reliably.Can aspirate maintenance in the situation that not limited by the direction (no matter being bowl type or chevron) of warpage.
And, due to certainly for not having the wafer of warpage also can use, so not only when the wafer of processing warpage, the chuck table of the present application is installed, but is installed with always, thereby can be in the situation that tackle without the time and labor of changing chuck table.
Accompanying drawing explanation
Fig. 1 is the stereogram of the chuck table of the 1st execution mode.
The stereogram of Tu2Shi wafer transfer robot.
Fig. 3 is the cutaway view that utilizes wafer transfer robot state above the chuck table of the 1st execution mode by the wafer orientation that is bowl type.
Fig. 4 is positioned in wafer the cutaway view of the state on absorption auxiliary body.
Fig. 5 utilizes chuck table suction to keep the cutaway view of the state of wafer.
Fig. 6 is the cutaway view that utilizes wafer transfer robot state above the chuck table of the 1st execution mode by the wafer orientation that is chevron.
Fig. 7 is positioned in wafer the cutaway view of the state on absorption auxiliary body.
Fig. 8 utilizes chuck table suction to keep the cutaway view of the state of wafer.
Fig. 9 is the stereogram of the chuck table of the 2nd execution mode.
Label declaration
2,2A: chuck table;
4: chuck table main body;
8: maintenance face;
10: suction socket;
11: wafer;
18: absorption auxiliary body;
22: skirt section;
30: vacuum suction source;
32: conveying machine people;
36: arm.
Embodiment
Below, with reference to accompanying drawing, working of an invention mode is elaborated.With reference to Fig. 1, show the stereogram of the chuck table 2 of the present invention's the 1st execution mode.With reference to Fig. 3, chuck table 2 consists of chuck table main body (workbench main body) 4 and absorption auxiliary body 18 in the lump, and this absorption auxiliary body 18 is installed on chuck table main body 4 in the mode around chuck table main body 4.
Chuck table main body 4 has the support 6 of maintenance face 8 and ring-type.As shown in Figure 1, be formed with a plurality of suction sockets 10 of concentric circles at maintenance face 8, these suction sockets 10 connect by the suction path 12 of cross shape.Suction path 12 center at cross shape is formed with suction path 14, and this suction path 14 connects chuck table main body 14 along the vertical direction.
Suction path 14 is connected with vacuum suction source 30 via electromagnetic switching valve 28.Therefore, by electromagnetic switching valve 28 is switched to, be communicated with position, negative pressure can act on via the suction path 12 of suction path 14 and cross shape the suction socket 10 in 8 upper sheds of maintenance face.
Maintenance face 8 in chuck table main body 4 is formed with pair of screws patchhole 16, utilizes the screw 26 being inserted in this screw insertion hole 16 that chuck table main body 4 is fixed on to Workbench base 24.Chuck table main body 4 and Workbench base 24 are such as being formed by metals such as SUS.
Absorption auxiliary body 18 forms by having flexible resin, absorption auxiliary body 18 consists of the installation portion 20 of ring-type and the skirt section 22 of the shape of falling skirt, this installation portion 20 is coated at chuck table main body 4 and by 6 supportings of annular support portion, this skirt section 22 forms with installation portion 20.The end in skirt section 22 (train of dress) 22a gives prominence to approximately 0.5～2mm upward from the maintenance face 8 of chuck table main body 4.
With reference to Fig. 2, show the stereogram for the conveying machine people 32 of conveyance wafer 11.Conveying machine people 32 comprises linkage 34 and arm 36, and this linkage 34 can move up and can be crooked at upper and lower, and this arm 36 is installed on the terminal part of linkage 34 in the mode that can rotate.Upper surface at arm 36 is equipped with a plurality of pump orifices 38 that wafer 11 carried out to negative pressure suction.
Below, the effect of above-mentioned execution mode is described.Utilize the conveying machine people 32 shown in Fig. 2 for example by being a bowl wafer for type warpage 11, from box, to take out, this wafer 11 is also positioned in the top of chuck table 2 as shown in Figure 3 by conveying machine people 32 conveyances.
From this state, utilize conveying machine people 32 that wafer 11 is declined, thereby wafer 11 is adsorbed auxiliary body 18 supportings as shown in Figure 4.At this moment, the end 22a in the skirt section 22 of absorption auxiliary body 18 is close to wafer 11 in its complete cycle scope.
Thus, when electromagnetic switching valve 28 being switched to connection position from this state, utilize vacuum suction source 30 to produce negative pressure at pump orifice 10, the wafer 11 that is bowl-shape warpage is close to the end 22a in the skirt section 22 of adsorbing auxiliary body 18, therefore, in the space being marked off by chuck table main part 4, absorption auxiliary body 18 and wafer 11, effect has negative pressure, thereby wafer 11 as shown in Figure 5, in skirt section 22 deflections that make to adsorb auxiliary body 18, aspirate reliably the maintenance face 8 that is held in chuck table 2.
Next, with reference to Fig. 6 to Fig. 8, to utilizing chuck table 2 suction to keep to be the effect in the situation of wafer 11 of chevron warpage to describe.First, as shown in Figure 6, utilize conveying machine people 32 wafer 11 that is chevron warpage to be positioned to the top of chuck table 2.
When utilizing conveying machine people 32 that wafer 11 is declined from this state, as shown in Figure 7, the end 22a that wafer 11 is adsorbed the skirt section 22 of auxiliary body 18 seamlessly supports in complete cycle scope.
Under this state, when electromagnetic switching valve 28 being switched to connection position, in the space being marked off by chuck table main body 4, absorption auxiliary body 18 and wafer 11, effect has negative pressure, thereby wafer 11 is aspirated reliably maintenance by the maintenance face 8 of chuck table 2 as shown in Figure 8 in skirt section 22 deflections that make to adsorb auxiliary body 18.
With reference to Fig. 9, show the stereogram of the chuck table 2A of the present invention's the 2nd execution mode.Chuck table 2A is by aspirating maintaining part 40 and framework 42 forms, this suction maintaining part 40 is formed by porous ceramic etc., this framework 42 is formed by the metals such as SUS around suction maintaining part 40, in the periphery of framework 42, the absorption auxiliary body 18 same with the absorption auxiliary body 18 of chuck table 2 that is installed on the 1st execution mode is installed.
Suction maintaining part 40 is optionally connected with vacuum suction source 30 with electromagnetic switching valve 28 via suction path 14.Absorption auxiliary body 18 has the installation portion 20 of ring-type and the skirt section 22 of the shape of falling skirt, and the end in skirt section 22 (train of dress) 22a gives prominence to approximately 0.5～2mm from the maintenance of suction maintaining part 40 towards top.
The suction to wafer 11 being realized by the chuck table 2A of present embodiment keeps, identical with the chuck table 2 of the 1st execution mode being illustrated with reference to Fig. 3 to Fig. 8, so the description thereof will be omitted.
Claims (1)
1. a chuck table, it keeps wafer, and described chuck table is characterised in that, and it possesses:
Workbench main body, it has the maintenance face that suction keeps wafer; And
Absorption auxiliary body, it has the skirt section of the shape of falling skirt, and described absorption auxiliary body is installed on this workbench main body in the mode around this workbench main body,
This absorption auxiliary body is formed by elastomeric element, and the train of dress in this skirt section keeps outstanding towards top than this, and the diameter of this train of dress forms littlely than the diameter of wafer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013078880A JP2014203967A (en) | 2013-04-04 | 2013-04-04 | Chuck table |
| JP2013-078880 | 2013-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104103568A true CN104103568A (en) | 2014-10-15 |
Family
ID=51671595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410125835.XA Pending CN104103568A (en) | 2013-04-04 | 2014-03-31 | Chuck Workbench |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014203967A (en) |
| KR (1) | KR20140120822A (en) |
| CN (1) | CN104103568A (en) |
| TW (1) | TW201448105A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107533965A (en) * | 2015-07-10 | 2018-01-02 | 东和株式会社 | Adsorbing mechanism, adsorption method, manufacture device and manufacture method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6725326B2 (en) * | 2016-06-03 | 2020-07-15 | 日本特殊陶業株式会社 | Vacuum chuck and method of manufacturing vacuum chuck |
| JP6978840B2 (en) * | 2017-02-28 | 2021-12-08 | 株式会社Ｓｃｒｅｅｎホールディングス | Board processing equipment and board holding equipment |
| CN114102216B (en) * | 2021-12-14 | 2023-10-03 | 安徽光智科技有限公司 | Connecting tool for clamping optical lens |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03289154A (en) * | 1990-04-05 | 1991-12-19 | Toshiba Corp | Chucking device of semiconductor wafer |
| JP4808111B2 (en) * | 2006-09-06 | 2011-11-02 | スピードファム株式会社 | Work chuck device |
| CN102270596A (en) * | 2010-06-02 | 2011-12-07 | 上海微电子装备有限公司 | Sucking disc and sheet-holding table |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02164034A (en) * | 1988-12-19 | 1990-06-25 | Fujitsu Ltd | Wafer attraction stage |
| JP2768867B2 (en) * | 1991-03-29 | 1998-06-25 | 株式会社日立製作所 | Vacuum chuck device |
| JPH11309638A (en) * | 1998-04-28 | 1999-11-09 | Kyocera Corp | Vacuum suction pad |
| JP2010153419A (en) * | 2008-12-24 | 2010-07-08 | Ushio Inc | Workpiece stage and exposure apparatus using the workpiece stage |
-
2013
- 2013-04-04 JP JP2013078880A patent/JP2014203967A/en active Pending
-
2014
- 2014-03-03 TW TW103107009A patent/TW201448105A/en unknown
- 2014-03-21 KR KR20140033196A patent/KR20140120822A/en not_active Application Discontinuation
- 2014-03-31 CN CN201410125835.XA patent/CN104103568A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03289154A (en) * | 1990-04-05 | 1991-12-19 | Toshiba Corp | Chucking device of semiconductor wafer |
| JP4808111B2 (en) * | 2006-09-06 | 2011-11-02 | スピードファム株式会社 | Work chuck device |
| CN102270596A (en) * | 2010-06-02 | 2011-12-07 | 上海微电子装备有限公司 | Sucking disc and sheet-holding table |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107533965A (en) * | 2015-07-10 | 2018-01-02 | 东和株式会社 | Adsorbing mechanism, adsorption method, manufacture device and manufacture method |
| CN107533965B (en) * | 2015-07-10 | 2020-11-03 | 东和株式会社 | Adsorption mechanism, adsorption method, manufacturing device and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201448105A (en) | 2014-12-16 |
| KR20140120822A (en) | 2014-10-14 |
| JP2014203967A (en) | 2014-10-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141015 |
|
| WD01 | Invention patent application deemed withdrawn after publication |