TWI702109B - Hold stand - Google Patents

Abstract

The subject of the present invention is to suppress the floating of the workpiece.

The solution of the present invention is that a holding platform (20) is a rectangular workpiece (W) that maintains flexibility; the workpiece (W) is provided with a quadrangular wiring area (W1) in the center and a surrounding area The remaining area of the wiring area (W2). The holding table is equipped with a suction plate (21) that sucks and holds the wiring area of the processed object, and narrowly holds the outer periphery of the remaining area of the processed object sucked and held by the suction plate, and pushes down further than the holding surface Part, the boundary between the outer circumference of the suction plate in the direction of the holding surface and the push-down part, attracts the base (22) of the remaining area.

Description

Hold stand

The present invention relates to a holding table, and particularly relates to a holding table applicable to a turning device.

Conventionally, there has been known a turning device that uses a cutting tool having an arc-shaped cutting edge to turn the upper surface of a workpiece (see Patent Document 1). In the turning device described in Patent Document 1, a part of the outer peripheral portion of the holder of the spindle that rotates around a vertical axis fixes the cutting tool. Then, while the chuck table (holding means) holding the workpiece is processed and fed at a low speed, the cutting tool is rotated around the vertical axis of the spindle to rotate the workpiece held on the chuck table. As a result, the workpiece is thinned to a uniform height (thickness).

In addition, along with the thinning of circuit boards yesterday and today, the workpiece to be turned is also required to be further thinned. As an example, a coreless substrate that does not have a core substrate can be cited. The coreless substrate is a laminate formed of a plurality of layers such as a wiring layer and a resin layer, and is formed in a flexible sheet shape.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2013-056397 A

In other words, when processing a rectangular coreless substrate in a plan view with a turning device, the coreless substrate is placed on a holding table and sucked and held. At this time, consider pressing and holding the four sides of the coreless substrate so that the coreless substrate will not be rolled up from the holding table. However, since the coreless substrate has flexibility, the vicinity of the outer edge of the coreless substrate may float from the holding surface. Therefore, there is a problem that the floating part is caught in the cutting tool when the turning is performed, and the processing cannot be performed properly.

The present invention was made in view of such problems, and its object is to provide a holding table that can suppress the floating of the workpiece from the holding surface.

The holding stand of the present invention is a rectangular to-be-processed object that maintains flexibility; the to-be-processed object is provided with a quadrangular wiring area in the center and a remaining area surrounding the wiring area on the outer periphery; the holding stand system has: first suction The holding part has a quadrangular holding surface that sucks and holds the wiring area of the processed object; the push-down part clamps the outer periphery of the remaining area of the processed object sucked and held by the first suction and holding part, and pushes down to The holding surface is further below; and the second suction holding portion is the first in the direction of the holding surface The boundary between the outer circumference of the suction holding portion and the push-down portion is sucked to the remaining area.

According to this structure, the wiring area of the workpiece is sucked and held by the first suction and holding portion. On the other hand, the remaining area of the workpiece is pushed down below the holding surface, and is in the first suction and holding portion. The workpiece at the boundary (outer peripheral side) between the outer periphery and the push-down portion is bent and swells. At this time, by the second suction and holding part, the workpiece (remaining area) is sucked at the boundary between the outer periphery of the first suction and holding part and the push-down part, and the expansion is pulled to the push-down part side. Thereby, it is possible to suppress the situation in which the object to be processed floats from the holding surface.

According to the present invention, it is possible to suppress the floating of the workpiece from the holding surface by attracting the expansion of the workpiece due to bending.

11‧‧‧Mobile Board

12‧‧‧Waterproof cover

15‧‧‧Pillars

20‧‧‧Holding station

21‧‧‧Suction plate (1st suction and holding part)

21a‧‧‧Keep the surface

21b‧‧‧through opening

22‧‧‧Base (Second suction and holding part)

22a‧‧‧Rectangular recess

22b‧‧‧Connecting path

22c‧‧‧Connecting path

23‧‧‧First Attraction Source

24‧‧‧The second source of attraction

25‧‧‧Tilt section (support section: push down section)

25a‧‧‧inclined surface

26‧‧‧Pushing part (Pushing down)

26a‧‧‧inclined surface

30‧‧‧Feeding means

31‧‧‧Guide track

32‧‧‧Z axis table

33‧‧‧Ball screw

40‧‧‧Rotating method

41‧‧‧Shell

42‧‧‧Rotating spindle

43‧‧‧Frame seat

44‧‧‧Flange

45‧‧‧Cutting Tool Installation Department

46‧‧‧Cutting Tools

B‧‧‧Expansion

W‧‧‧Processed object

W1‧‧‧Wiring area

W2‧‧‧Remaining area

[Fig. 1] A perspective view of a turning device to which the holding table of this embodiment is applied.

[Fig. 2] A schematic top view of the holding table of this embodiment.

[Fig. 3] A schematic cross-sectional view of the holding table of this embodiment.

[Fig. 4] A diagram showing the suction and holding operation of the holding table of this embodiment.

[Fig. 5] A partial enlarged view of the suction and holding operation of the holding table in this embodiment.

Hereinafter, with reference to the attached drawings, the turning device to which the holding table of this embodiment is applied will be described. Fig. 1 is a perspective view of a turning device to which a holding table of this embodiment is applied. Furthermore, the holding table of this embodiment is limited to a turning device as shown in FIG. 1, and may be applied to other types of processing devices such as a polishing device. In addition, for the holding stand shown in FIG. 1, a part of the structure is omitted for convenience of description.

As shown in FIG. 1, the turning device 1 uses a single cutting tool 46 while processing and feeding the holding table 20 holding the workpiece W in the X-axis direction at a low speed, while deepening the upper surface of the workpiece W It is composed of the (Creep feed) method for turning.

The workpiece W is composed of a sheet-like coreless substrate formed by laminating multiple layers of wiring layers, resin layers, and silicon layers. The workpiece W is formed in a rectangular shape in plan view, and has flexibility. In the center of the workpiece W, a quadrangular wiring region W1 is formed. In addition, on the outer periphery of the workpiece W, a ring-shaped residual area W2 is formed so as to surround the wiring area W. The remaining area W2 becomes an end material that is not used as a product. In addition, the to-be-processed object W is not limited to a coreless board|substrate, As long as it has a flexible thin-surface shape, it may have any structure.

On the upper surface of the base 10 of the turning device 1, a rectangular opening extending in the X-axis direction is formed, and the opening is covered by a movable plate 11 that can move together with the holding table 20 and a bellows-shaped waterproof cover 12. Below the waterproof cover 12, there is provided a ball for moving the holding table 20 in the X-axis direction Screw-type advance and retreat means (not shown). On the surface of the holding table 20, a holding surface 21a (refer to FIG. 3) that sucks and holds the workpiece W is formed. The holding surface 21a is connected to a suction source (not shown) through the flow path in the holding table 20, and the workpiece W to be processed is sucked and held by the negative pressure generated by the holding surface 21a. The detailed structure of the holding table 20 will be described later.

The support 15 on the base 10 is provided with a feeding means 30 for moving the turning means 40 closer to and away from the holding table 20 in the Z-axis direction. The feeding means 30 has a pair of guide rails 31 arranged on the support 15 parallel to the Z-axis direction, and a motor-driven Z-axis table 32 slidable on the pair of guide rails 31. A nut part (not shown) is formed on the back side of the Z-axis base 32, and the ball screw 33 is screwed to these nut parts. The ball screw 33 is rotationally driven by the drive motor 34 connected to one end of the ball screw 33, whereby the turning means 40 moves in the Z-axis direction along the guide rail 31.

The turning means 40 is mounted on the front surface of the Z-axis base 32 through a housing 41, and a bracket 43 is provided at the lower end of the cylindrical rotating spindle 42. A flange 44 is provided on the rotating main shaft 42, and the turning means 40 is supported by the housing 41 through the flange 44. A cutting tool mounting portion 45 is provided on a part of the outer peripheral side of the lower surface of the holder 43, and a cutting tool 46 is mounted on the cutting tool mounting portion 45. For the cutting tool 46, a superhard cutting tool or a diamond cutting tool can be used.

In the turning device 1 configured in this way, the turning means 40 approaches the holding table 20 while the cutting tool 46 is reciprocally moved around the Z axis by rotating the spindle 42. Then, use one side to supply the workpiece W Processing water or air cools the tip of the cutting tool 46, and while the cutting tool 46 rotates in contact with the upper surface of the workpiece W, the tip of the cutting tool 46 slides relative to the workpiece W, and the workpiece W is turned. While rotating the cutting tool 46, the holding table 20 is horizontally moved in the X-axis direction at a low speed, and the whole surface of the workpiece W is turned.

Next, referring to FIG. 2 and FIG. 3, the holding table of this embodiment will be described. Fig. 2 is a schematic top view of the holding table of this embodiment. Fig. 3 is a schematic cross-sectional view of the holding table of this embodiment. Furthermore, the holding table shown in FIGS. 2 and 3 are only schematic diagrams, exaggerating the size and shape of each part.

As shown in FIGS. 2 and 3, the holding table 20 of the present embodiment is configured to suck and hold a sheet-shaped workpiece W, and includes a first suction and holding portion ( The suction plate 21) and the second suction and holding portion (base 22) that sucks and holds the remaining area W2 of the workpiece W. Specifically, the holding stand 20 is formed as a base 22 having a rectangular recess 22a formed in the center of the surface, and a rectangular suction disk 21 is attached to it in a rectangular shape in plan view.

The upper surface of the suction disk 21 serves as a holding surface 21a for sucking and holding the wiring area W1 of the workpiece W. The holding surface 21a has approximately the same size (area) as the wiring area W1 of the workpiece W. In addition, the suction disk 21 is formed with a plurality of through openings 21b from the top to the bottom. The through opening 21b is connected to the first suction source 23 through a communication path 22b (first communication path) formed on the bottom surface of the rectangular recess 22a. The suction plate 21 is sucked by the first suction source 23 to generate negative pressure on the holding surface 21a, and can suck and hold the processed 物W.

In addition, a slight gap is formed between the outer surface of the suction disk 21 and the inner surface of the rectangular recess 22a. The gap is connected to the second suction source 24 through a communication path 22 c (second communication path) formed in the base 22. In addition, the first suction source 23 and the second suction source 24 are valves not shown, and the individual suction timings can be adjusted freely.

On the outer periphery of the rectangular recess 22a, an inclined portion 25 that is inclined downward as it goes to the outer periphery is formed. The inclined portion 25 is formed in a quadrangular ring shape in plan view so as to surround the rectangular recess 22a. Although described in detail later, the inclined portion 25 has a role as a support portion supporting the remaining area of the workpiece W.

In addition, above the four sides of the base 22, there are provided a plurality of pressing portions 26 (in this embodiment, on the base 22) that press the outer periphery (remaining area W2) of the workpiece W toward the base 22 There is one on each side, 4 in total). The pressing portion 26 is formed of a long plate along each side of the base 22, and has an inclined surface 26a facing the inclined surface 25a of the inclined portion 25 (see FIG. 5). The remaining area W2 of the workpiece W is held by being pinched by the inclined portion 25 and the pressing portion 26 of the base 22. In addition, although it will be described in detail later, the inclined portion 25 and the pressing portion 26 constitute a pressing portion that pushes down the remaining area W2 of the workpiece W below the holding surface 21a.

In other words, the workpiece W, which is flexible like a coreless substrate, may warp on the outer peripheral side. Therefore, only when the workpiece W is sucked and held on the holding surface 21a, the outer edge of the workpiece W may bounce off the holding surface 21a. Turning in this state In this case, it is conceivable that the cutting tool 46 (refer to FIG. 1) is stuck on the raised workpiece W, and the workpiece W cannot be processed appropriately.

As a countermeasure, it is considered to correct the warpage of the workpiece W by pressing the outer edge portion (the remaining area W2) of the workpiece W. However, if the outer edge portion of the workpiece W is pushed down to a position lower than the holding surface 21a, the pushed workpiece W will bend and the workpiece W will float from the holding surface 21a (for example, Refer to Figure 5A). Therefore, when the turning processing is performed, the cutting tool 46 is caught on the workpiece W floating from the holding surface 21a, and the workpiece W cannot be processed appropriately. Assuming that even if the cutting tool 46 is not stuck to the workpiece W, the floating part is often turned on the workpiece W. It is conceivable that the workpiece W cannot be machined to the desired thickness.

Therefore, in this embodiment, the wiring area W1 of the workpiece W is sucked and held by the suction plate 21 (first suction and holding portion), and the workpiece is held between the inclined portion 25 and the pressing portion 26 of the base 22 The remaining area of W is W2. At this time, because the remaining area W2 is pushed down below the holding surface 21a, the workpiece W at the boundary portion between the suction disk 21 and the base 22 (rectangular recess 22a) is bent and swells. However, by attracting the gap between the suction disk 21 and the rectangular recess 22a, the expansion can be pulled downward. As a result, it is possible to suppress the situation in which the workpiece W floats upward from the holding surface 21a.

Next, referring to FIGS. 4 and 5, the operation when the workpiece is sucked and held using the holding table of this embodiment will be described. Fig. 4 is a diagram showing the suction and holding operation of the holding table of the present embodiment. Figure 5 Series An enlarged view of a part of the suction and holding operation of the holding table of the embodiment. 4A to 4C are diagrams showing the movement transition of suction and hold. FIG. 5A is a partially enlarged view of the X portion in FIG. 4B, and FIG. 5B is a partially enlarged view of the Y portion in FIG. 4C.

As shown in FIG. 4A, in the state where the pressing portion 26 is retracted from the base 22 (inclined portion 25), first, the workpiece W is placed on the suction plate 21. At this time, the wiring area W1 of the workpiece W is positioned on the moving holding surface 21a. Then, when the suction disk 21 is sucked by the first suction source 23, the wiring area W1 of the workpiece W is sucked and held on the holding surface 21a. Furthermore, at this time, the suction by the second suction source 24 is not performed.

Next, as shown in FIGS. 4B and 5A, the outer edge portion (remaining area W2) of the workpiece W is pushed downward by the pressing portion 26, and the workpiece W (remaining area W2) is clamped in an inclined position. Between the inclined surface 25a of the portion 25 and the inclined surface 26a of the pressing portion 26. At this time, the outer edge of the workpiece W is pushed down below the holding surface 21a. As a result, at the boundary between the wiring area W1 and the remaining area W2, that is, on the outer surface of the suction plate 21 and the rectangular recess 22a Between the inner surfaces of, the workpiece W forms a bend.

As a result, swelling B occurs in the workpiece W. In particular, as shown in FIG. 5A, due to the expansion B, a gap is slightly generated between the holding surface 21a and the workpiece W. At this time, the apex of the expansion B is located above the surface of the workpiece W sucked and held on the holding surface 21a without a gap.

Next, the suction by the second suction source 24 is implemented, and the gap between the outer surface of the suction plate 21 and the inner surface of the rectangular recess 22a produces a negative effect. Pressure. As a result, as shown in FIGS. 4C and 5B, the boundary portion between the wiring area W1 and the remaining area W2 is attracted downward. At this time, the gap between the holding surface 21a and the workpiece W (wiring region W1) disappears, and the apex of the expansion B moves to the inclined portion 25 side. In particular, as shown in FIG. 5B, the vertex of the expansion B is located below the holding surface 21a. As a result, it is possible to suppress the situation where the wiring area W1 of the workpiece W floats from the holding surface 21a.

In this way, even if bending occurs when the outer peripheral edge of the workpiece W is clamped, the bent portion (expansion B) can be attracted from between the suction plate 21 and the rectangular recess 22a, so that the apex of the expansion B does not exceed the holding surface 21a In this way, the position of expansion B is shifted to the outer peripheral side. This suppresses the floating of the workpiece W, prevents the cutting tool 46 (refer to FIG. 1) from getting stuck on the workpiece W during turning, and the workpiece W can be turned to a desired thickness .

As described above, according to this embodiment, the wiring area W1 of the workpiece W is sucked and held by the first suction and holding portion (suction plate 21), while the remaining area W2 of the workpiece W is pushed down Below the holding surface 21a, at the boundary (outer peripheral side) between the outer periphery of the suction disk 21 and the push-down portion (inclined portion 25), the workpiece W is bent and swelling B occurs. At this time, by sucking the workpiece W (remaining area W2) in the boundary between the outer periphery of the suction plate 21 and the rectangular recess 22a, the aforementioned expansion B will be pulled to the side of the downward pushing portion (inclined portion 25 and pushing portion 26) . Thereby, it is possible to suppress the situation in which the workpiece W floats from the holding surface 21a.

In addition, the present invention is not limited to the aforementioned embodiment, and can be implemented with various modifications. In the foregoing embodiment, regarding the additional drawings The size and shape shown in the figure are not limited to these, and can be appropriately changed within the range where the effects of the present invention can be exhibited. Moreover, as long as it does not deviate from the objective range of this invention, it can change suitably and implement.

In addition, in the foregoing embodiment, the structure in which the first suction source 23 and the second suction source 24 are separately provided, but it is not limited to this structure. The first suction source 23 and the second suction source 24 may be shared.

In addition, in the aforementioned embodiment, the structure is configured to suck and hold the workpiece W having a rectangular shape in plan view, but it is not limited to this structure. The workpiece W may be formed in a circular shape, for example. At this time, the shape of the holding table 20 should also be appropriately changed according to the shape of the workpiece W. In addition, when sucking and holding the rectangular workpiece W, the remaining area W2 of the four corners of the workpiece W is cut in advance. When the remaining area W2 is pinched, the four corners can be prevented from wrinkles (lifting from the holding surface 21a). situation.

[Possibility of industrial use]

As described above, the present invention has the effect of suppressing the floating of the workpiece, and in particular, contributes to a holding table applicable to a turning device.

21‧‧‧Attract disk

21a‧‧‧Keep the surface

21b‧‧‧through opening

22‧‧‧Pedestal

22a‧‧‧Rectangular recess

25‧‧‧Sloping part

25a‧‧‧inclined surface

26‧‧‧Pushing part

26a‧‧‧inclined surface

B‧‧‧Expansion

W‧‧‧Processed object

W1‧‧‧Wiring area

W2‧‧‧Remaining area

Claims (1)

A holding stand is a holding stand for holding a sheet-like and flexible rectangular workpiece; the workpiece is provided with a quadrangular wiring area in the center and a remaining area surrounding the wiring area on the outer periphery; the holding stand It is equipped with: a first suction and holding part, which has a quadrangular holding surface that sucks and holds the wiring area of the workpiece; a push-down part, which holds the remaining area of the workpiece sucked and held by the first suction and holding part The outer periphery is pushed down to be lower than the holding surface; and a second attracting and holding portion is the boundary between the outer periphery of the first attracting and holding portion and the push-down portion in the direction of the holding surface to attract the remaining area; the The second suction and holding portion has a recess for mounting the first suction and holding portion, and a first inclined surface that slopes downward as it goes to the outer peripheral side. With the recess, the first suction and hold portion and the A rectangular gap is formed between the inner walls of the concave portion; the push-down portion has a second inclined surface facing the first inclined surface; the remaining area is between the first inclined surface and the second inclined surface The second suction and holding portion is pushed down by the push-down portion by the outer periphery of the workpiece, and is formed in the boundary portion between the wiring area and the remaining area. The apex of the expansion of the workpiece above the holding surface, by It is sucked by the gap formed on the outer side of the first sucking and holding, and moved to a lower side than the holding surface.

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