JP5755979B2 - Processing equipment equipped with a bite tool - Google Patents

Description

  The present invention relates to a machining apparatus provided with a bite tool for turning a workpiece.

A semiconductor wafer in which a plurality of semiconductor chips are formed is divided into individual semiconductor chips by a dicing apparatus or the like, and the divided semiconductor chips are widely used in electric devices such as mobile phones and personal computers.
In recent years, in order to reduce the weight and size of electrical equipment, a bump having a protrusion of 50 to 100 μm is formed on an electrode of a semiconductor chip, and this bump is directly bonded to an electrode formed on a mounting substrate. A semiconductor chip called a flip chip has been developed and put into practical use. In addition, a technique for reducing the size by mounting a plurality of semiconductor chips on a substrate called an interposer or stacking them has been developed and put into practical use.

  However, each of the above-described technologies forms a plurality of protruding bumps (electrodes) on the surface of a substrate such as a semiconductor chip and bonds the substrates to each other via the protruding electrodes. ) Must be the same height. In order to make the height of the bumps (electrodes) in a protruding shape, grinding is generally used. However, when the bump (electrode) is ground, if the bump (electrode) is formed of a sticky metal such as gold, a burr is generated, and this burr is short-circuited to the adjacent bump (electrode). is there.

  Also, as a technique for forming a plurality of bumps (electrodes) on the surface of a substrate such as a semiconductor chip, the tip of a metal wire such as gold is heated and melted to form a ball, which is then applied to the electrode of the semiconductor chip. There is a stud bump forming method in which a ball is thermocompression bonded with ultrasonic waves to break the head of the ball. Bumps (electrodes) formed by this stud bump formation method are difficult to polish because needle-shaped wrinkles are generated when the head of a thermocompressed ball is broken, and a heated plate is used as a bump. The bumps (electrodes) are made to have the same height by being pressed. (For example, refer to Patent Document 1.)

  However, when the heated plate is pressed against the bumps (electrodes) and the bumps are made to have the same height, there is a problem that when the heads of the bumps are crushed, they are short-circuited with the adjacent bumps. In order to solve this problem, in the invention described in the above publication, an extra step of removing the tip of the bump (electrode) is provided.

  In order to solve the problems described above, a workpiece holding means having a holding surface for holding a workpiece such as a plate-like object, and a workpiece held on the holding surface of the workpiece holding means are turned. And a turning device having a cutting tool for cutting, and a machining apparatus having a cutting tool that turns and removes the tip portions of a plurality of electrodes protruding from the surface of the plate-like object with a cutting tool. Proposed. (For example, see Patent Document 2.)

JP 2001-53097 A JP 2004-319697 A

  Thus, in the machining apparatus provided with the above-described bite tool, when the workpiece holding means for holding the workpiece is thermally expanded, the height of the plate-like object held on the holding surface of the workpiece holding means is increased. Since the position becomes high, there is a problem that the tip portions of the plurality of electrodes formed to protrude from the surface of the plate-like object are turned more than the set value.

  This invention is made | formed in view of the said fact, The main technical subject provides the processing apparatus provided with the bite tool which can suppress the thermal expansion of the workpiece holding means holding a workpiece. There is.

In order to solve the above-mentioned main technical problem, according to the present invention, a workpiece holding mechanism for holding a workpiece and a bite tool for turning the workpiece held by the workpiece holding mechanism are provided. In a processing apparatus provided with a cutting tool having a turning means,
The workpiece holding mechanism includes a holding table that holds the workpiece by suction, a cooling member that supports the holding table, a base that supports the cooling member, and cooling water that supplies cooling water to the cooling member. A supply means, and a shower nozzle that injects cooling water supplied to the cooling member toward the chuck table.
There is provided a machining apparatus provided with a cutting tool characterized by the above.

  The shower nozzle is composed of an annular nozzle member provided so as to surround the holding table, and a plurality of jet nozzles are provided on the inner peripheral wall of the annular nozzle member.

  A processing apparatus having a cutting tool according to the present invention includes a holding table that holds a workpiece by a workpiece holding mechanism that holds the workpiece, a cooling member that supports the holding table, and supports the cooling member. A cooling water supply means for supplying cooling water to the cooling member, and a shower nozzle for injecting the cooling water supplied to the cooling member toward the holding table. While the cooling member is cooled by the cooling water supplied to the cooling member and the holding table supported by the cooling member is cooled, the thermal expansion of the holding table is suppressed. Then, the cooling water that has flowed into the cooling member and has cooled the holding table via the cooling member flows into the shower nozzle and is sprayed from the shower nozzle toward the holding table. Since the workpiece is cooled, thermal expansion of the holding table and the workpiece held on the holding table is suppressed.

The perspective view of the processing apparatus provided with the bite tool comprised according to this invention. The perspective view of the turning unit with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. The perspective view which shows the workpiece holding mechanism and workpiece holding mechanism moving means with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. Explanatory drawing which fractures | ruptures and shows the principal part of the chuck table which comprises the workpiece holding mechanism with which the processing apparatus provided with the bite tool shown in FIG. 1 is equipped. The top view of the semiconductor wafer as a to-be-processed object. Sectional drawing which expands and shows the principal part of the semiconductor wafer shown in FIG. Explanatory drawing of the turning process by the processing apparatus provided with the cutting tool shown in FIG. Sectional drawing which expands and shows the principal part of the semiconductor wafer turned by the processing apparatus provided with the cutting tool shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a machining apparatus provided with a bite tool constructed according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a machining apparatus having a bite tool constructed according to the present invention.
The processing apparatus provided with the bite tool in the illustrated embodiment includes an apparatus housing denoted as a whole by 2. The apparatus housing 2 includes a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at a rear end portion (upper right end in FIG. 1) of the main portion 21 and extends substantially vertically upward. Yes. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. A turning unit 3 as a turning means is mounted on the pair of guide rails 221 and 221 so as to be movable in the vertical direction.

  The turning unit 3 includes a support base 31 and a spindle unit 32 attached to the support base 31. The support base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. A support member 313 is mounted on the front surface of the support base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22 in this manner, and the spindle unit 32 is attached to the support member 313. It is done.

  The spindle unit 32 includes a spindle housing 321 mounted on a support member 313, a rotating spindle 322 rotatably disposed on the spindle housing 321, and a servo motor as a drive source for rotationally driving the rotating spindle 322. 323. The lower end of the rotary spindle 322 protrudes downward beyond the lower end of the spindle housing 321, and a disk-shaped tool tool mounting member 324 is provided at the lower end. The tool tool 33 is detachably mounted on the tool tool mounting member 324.

Here, the attachment / detachment structure of the cutting tool 33 to the cutting tool mounting member 324 will be described with reference to FIG.
The tool tool mounting member 324 is provided with a tool mounting hole 324a penetrating in a vertical direction in a part of the outer peripheral portion, and a female screw hole 324b reaching the tool mounting hole 324a from an outer peripheral surface corresponding to the tool mounting hole 324a. Is provided. The bite tool 33 is inserted into the bite tool attachment member 324 by inserting the bite tool 33 into the bite attachment hole 324a of the bite tool attachment member 324 thus configured, and screwing and tightening the tightening bolt 330 into the female screw hole 324b. Removably mounted. In the illustrated embodiment, the cutting tool 33 is composed of a cutting tool body 331 formed in a rod shape with tool steel such as super steel alloy, and a cutting blade formed of diamond or the like provided at the tip of the cutting tool body 331. 332 is used. The bite tool 33 configured as described above and mounted on the bite tool mounting member 324 holds the workpiece of the chuck table that constitutes a workpiece holding means, which will be described later, as the rotary spindle 322 rotates. It can be rotated in a plane parallel to the plane.

  Returning to FIG. 1, the description will be continued. In the machining apparatus provided with the bite tool in the illustrated embodiment, the turning unit 3 is moved in the vertical direction along the pair of guide rails 221 and 221 (workpiece holding means described later). A turning unit feed mechanism 4 which is moved in a direction perpendicular to the holding surface of the chuck table constituting the. The turning unit feed mechanism 4 includes a male screw rod 41 disposed on the front side of the upright wall 22 and extending substantially vertically. The male screw rod 41 is rotatably supported by bearing members 42 and 43 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and the output shaft of the pulse motor 44 is connected to the male screw rod 41 by transmission. On the rear surface of the support base 31 is also formed a connecting portion (not shown) that protrudes rearward from the central portion in the width direction, and this connecting portion has a through female screw hole extending in the vertical direction, The male screw rod 41 is screwed into the female screw hole. Therefore, when the pulse motor 44 rotates forward, the support base 31, that is, the turning unit 3, is lowered or moved forward, and when the pulse motor 44 reversely moves, the support base 31, that is, the turning unit 3, is raised or moved backward.

  1 and 3, a substantially rectangular machining work portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the machining work portion 211 includes a workpiece. A holding mechanism 5 is provided. The workpiece holding mechanism 5 includes a moving base 51 and a chuck table 52 disposed on the moving base 51 and holding a plate-like workpiece. The movable base 51 slides on a pair of guide rails 23 and 23 extending in the direction indicated by the arrows 23a and 23b in the front-rear direction (direction perpendicular to the front surface of the upright wall 22) on the processing work unit 211. A workpiece loading / unloading area 24 shown in FIG. 1 (position indicated by a solid line in FIG. 3) and a tool for constituting the spindle unit 32 by a workpiece holding mechanism moving means 56 to be described later. 33 and the machining area 25 (position indicated by a two-dot chain line in FIG. 3) opposite to each other.

Next, the chuck table 52 will be described with reference to FIG.
The chuck table 52 in the illustrated embodiment includes a holding table 521 formed in a disc shape by a metal material such as aluminum, a disc-shaped cooling member 522 that supports the holding table 521, and a circle that supports the cooling member 522. A columnar base 523 is disposed on the movable base 51. The holding table 521 is provided with a fitting convex portion 521 a that fits into a fitting concave portion 522 a formed on the upper surface of the cooling member 522 on the lower surface. The holding surface, which is the upper surface of the holding table 521 formed in this way, is provided with a suction groove 521b composed of a plurality of concentric annular grooves, and the suction groove 521b is axially formed at the center. The suction passage 521c is provided.

  On the lower surface of the cooling member 522 constituting the chuck table 52, a fitting convex portion 522b that fits into a fitting concave portion 523a formed on the upper surface of the base 523 is provided. The cooling member 522 formed in this way is provided in a central portion in the axial direction and communicates with the suction passage 521c and communicates with the suction passage 521c, and a cooling water flow passage 522d formed in a spiral shape for cooling the holding table 521. A cooling water introduction passage 522e communicating with the central portion of the cooling water flow passage 522d, and a cooling water discharge passage 522f communicating with the outer peripheral end of the cooling water flow passage 522d.

  The communication path 522 c of the cooling member 522 configured as described above is connected to the suction unit 524 through the communication path 523 b provided in the base 523. The suction means 524 includes a suction source 524a, a pipe 524b connecting the suction source 524a and the communication path 523b, and an electromagnetic opening / closing valve 524c disposed in the pipe 524b. The electromagnetic opening / closing valve 524c is closed when de-energized (OFF), and is opened when energized (ON). Therefore, when the electromagnetic on-off valve 524c is energized (ON), negative pressure acts on the suction groove 521b via the pipe 524b, the communication path 523b, the communication path 522c, and the suction path 521c, and the upper surface of the holding table 521 is detected. The workpiece placed on the holding surface is sucked and held.

  A cooling water introduction passage 522e communicating with the cooling water flow passage 522d provided in the cooling member 522 is connected to the cooling water supply means 525 via a communication passage 523c provided in the base 523. The cooling water supply means 525 includes a cooling water supply source 525a, a supply pipe 525b connecting the cooling water supply source 525a and the communication path 523c, and an electromagnetic opening / closing valve 525c disposed in the supply pipe 525b. Yes. The electromagnetic on-off valve 525c is closed when de-energized (OFF) and opened when energized (ON). Therefore, when the electromagnetic on-off valve 525c is energized (ON), the cooling water flows from the cooling water supply source 525a into the cooling water flow passage 522d through the supply pipe 525b, the communication passage 523c, and the cooling water introduction passage 522e, and is cooled. It is discharged through the water discharge passage 522f. As a result, the cooling member 522 is cooled and the holding table 521 supported by the cooling member 522 is cooled, so that the thermal expansion of the holding table 521 is suppressed. As described above, the cooling water that has flowed into the cooling water flow passage 522d and has cooled the cooling member 522 is sent to a shower nozzle described later via the cooling water discharge passage 522f.

  3 and 4, the workpiece holding mechanism 5 in the illustrated embodiment has a shower nozzle 53 that injects the cooling water supplied to the cooling member 522 toward the holding table 521. It has. The shower nozzle 53 includes an annular nozzle member 531 in the illustrated embodiment, and has a hole through which the chuck table 52 is inserted, and is disposed so as to be movable together with the movable base 51 and the chuck table 52. A holding table 521 is disposed on the top. The annular nozzle member 531 is formed in an annular shape by a pipe material, and a plurality of injection ports 531a opening toward the holding table 521 are provided on the inner peripheral wall, and a cooling water inflow port 531b is provided on the bottom wall. . The annular nozzle member 531 configured as described above has a cooling water inflow passage 522f provided in the cooling member 522 via a communication passage 541 provided with a cooling water inlet 531b in the cover member 54 and a cooling water inflow pipe 532. It is communicated to. Accordingly, the cooling water that flows into the cooling water flow passage 522d provided in the cooling member 522 and cools the cooling member 522 passes through the cooling water discharge pipe 522f, the cooling water inflow pipe 532, the communication passage 541, and the cooling water inlet 531b. 53, and is injected toward the holding table 521 from a plurality of injection ports 531a provided in the annular nozzle member 531 constituting the shower nozzle 53. As a result, since the holding table 521 is cooled, thermal expansion of the holding table 521 and the workpiece held on the holding table 521 is suppressed.

  When the description continues with reference to FIG. 3, the machining apparatus provided with the bite tool in the illustrated embodiment shows the workpiece holding mechanism 5 in the direction indicated by the arrows 23 a and 23 b along the pair of guide rails 23, 23. The workpiece holding mechanism moving means 56 is provided. The workpiece holding mechanism moving means 56 includes a male screw rod 561 disposed between the pair of guide rails 23, 23 and extending in parallel with the pair of guide rails 23, 23, and a pulse motor 562 that rotationally drives the male screw rod 561. It has. The male screw rod 561 is screwed into a screw hole 511 provided in the moving base 51, and its tip is rotatably supported by a bearing member 563 attached by connecting a pair of guide rails 23, 23. ing. The drive shaft of the pulse motor 562 is connected to the base end of the male screw rod 561 by transmission. Therefore, when the pulse motor 562 rotates forward, the moving base of the workpiece holding mechanism moving means 56 moves in the direction indicated by the arrow 23a, and when the pulse motor 562 reverses, the moving base 51 moves in the direction indicated by the arrow 23b. It is done. The workpiece holding mechanism 5 thus moved in the direction indicated by the arrows 23a and 23b is selectively positioned in the workpiece loading / unloading area indicated by the solid line and the machining area indicated by the two-dot chain line in FIG. . In addition, the workpiece holding mechanism 5 is reciprocated in the direction indicated by the arrows 23a and 23b over a predetermined range in the machining area.

  Returning to FIG. 1, the description will be continued. On the both sides in the moving direction of the moving base 51 constituting the workpiece holding mechanism 5, the cross-sectional shape is a reverse channel shape, and the pair of guide rails 23, 23 And bellows means 61 and 62 covering the male screw rod 561, the pulse motor 562 and the like. The bellows means 61 and 62 can be formed from any suitable material such as campus cloth. The front end of the bellows means 61 is fixed to the front wall of the processing unit 211, and the rear end is fixed to the front end surface of the cover member 54 of the workpiece holding mechanism 5. The front end of the bellows means 62 is fixed to the rear end surface of the cover member 54 of the workpiece holding mechanism 5, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the workpiece holding mechanism 5 is moved in the direction indicated by the arrow 23a, the bellows means 61 is expanded and the bellows means 62 is contracted, and when the workpiece holding mechanism 5 is moved in the direction indicated by the arrow 23b. Then, the bellows means 61 is contracted and the bellows means 62 is extended.

  The description will be continued based on FIG. 1. On the front half of the main portion 21 of the apparatus housing 2, a first cassette mounting portion 11 a, a second cassette mounting portion 12 a, and a workpiece temporary storage portion are provided. 13a and a cleaning unit 14a are provided. A first cassette 11 that accommodates a workpiece before processing is placed on the first cassette mounting portion 11a, and a workpiece after processing is accommodated on the second cassette mounting portion 12a. The second cassette 12 is placed. In the workpiece temporary placement portion 13a, the workpiece temporary placement means 13 for temporarily placing the workpiece before being unloaded from the first cassette 11 placed on the first cassette placement portion 11a. Is arranged. The cleaning unit 14a is provided with cleaning means 14 for cleaning the processed workpiece.

  A workpiece transfer means 15 is disposed between the first cassette mounting portion 11a and the second cassette mounting portion 12a. The workpiece conveying means 15 carries the workpiece before processing stored in the first cassette 11 placed on the first cassette placing portion 11 a to the workpiece temporary placing means 13. At the same time, the processed workpiece cleaned by the cleaning means 14 is transported to the second cassette 12 mounted on the second cassette mounting portion 12a. A workpiece carry-in means 16 is disposed between the workpiece temporary placement portion 13a and the workpiece carry-in / carry-out area 24. The workpiece carry-in means 16 is a chuck table 52 of the workpiece holding mechanism 5 in which the workpiece before processing placed on the workpiece temporary placing means 13 is positioned in the workpiece carry-in / out area 24. Carry up. A workpiece unloading means 17 is disposed between the workpiece loading / unloading area 24 and the cleaning unit 14a. The workpiece unloading means 17 conveys the processed workpiece placed on the chuck table 52 positioned in the workpiece loading / unloading area 24 to the cleaning means 14.

  The workpiece before processing accommodated in the first cassette 11 includes a semiconductor wafer 10 in which a plurality of devices 110 are formed in a lattice shape on the surface as shown in FIG. A plurality of stud bumps (electrodes) 120 are formed on the surfaces of the plurality of devices 110 formed on the semiconductor wafer 10. In this way, the stud bump (electrode) 120 on the surface of each device 110 is formed, and the surface of the semiconductor wafer 10 is covered with an underfill material 130 made of a synthetic resin as shown in FIG. Is buried.

  The first cassette 11 containing the semiconductor wafer 10 as the workpiece is mounted on the first cassette mounting portion 11 a of the apparatus housing 2. When all the unprocessed semiconductor wafers 10 accommodated in the first cassette 11 placed on the first cassette placement portion 11a are carried out, a plurality of empty wafers 11 are replaced. A new cassette 11 containing the unprocessed semiconductor wafer 10 is manually mounted on the first cassette mounting portion 11a. On the other hand, when a predetermined number of processed semiconductor wafers 10 are loaded into the second cassette 12 mounted on the second cassette mounting portion 12a of the apparatus housing 2, the second cassette 12 is manually unloaded. Then, a new empty second cassette 12 is placed.

The machining apparatus provided with the cutting tool in the illustrated embodiment is configured as described above, and the operation thereof will be described below mainly with reference to FIG.
The unprocessed semiconductor wafer 10 as a workpiece accommodated in the first cassette 11 is conveyed by the vertical movement and advancing / retreating operation of the workpiece conveyance means 15 and placed on the workpiece temporary placement means 13. The semiconductor wafer 10 placed on the workpiece temporary placing means 13 is positioned in the workpiece loading / unloading area 24 by the turning operation of the workpiece loading means 16 after being centered here. It is placed on a holding table 521 constituting the chuck table 52 of the workpiece holding mechanism 5. When the semiconductor wafer 10 is placed on the holding table 521, the electromagnetic on-off valve 524c of the suction means 524 shown in FIG. 4 is energized (ON) to open the circuit. As a result, as described above, negative pressure acts on the suction groove 521b from the suction source 524a via the pipe 524b, the communication path 523b, the communication path 522c, and the suction path 521c, and the suction table 521 is placed on the holding surface. The semiconductor wafer 10 is sucked and held.

  When the semiconductor wafer 10 is sucked and held on the holding table 521, the workpiece holding mechanism moving means 56 (see FIG. 3) is operated to move the workpiece holding mechanism 5 in the direction indicated by the arrow 23a. The chuck table 52 holding 10 is positioned in the machining area 25. When the chuck table 52 holding the semiconductor wafer 10 is positioned in the processing region 25 in this way, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned to form a plurality of devices formed on the surface of the device 110. A turning process for exposing the stud bumps (electrodes) 120 on the surface of the underfill material 130 is performed.

The turning process will be described with reference to FIG.
In the turning process, the rotary spindle 322 is driven to rotate, and the tool tool mounting member 324 to which the tool tool 33 is attached rotates in the direction indicated by the arrow A in FIG. Then, the turning unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position. Next, when the turning width of the cutting edge 332 of the cutting tool 33 is, for example, 20 μm, the chuck table 52 holding the semiconductor wafer 10 is moved in the direction indicated by the arrow B from the position indicated by the solid line in FIG. Move at a feed rate of seconds. As a result, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned by the cutting edge 332 of the cutting tool 33 that rotates with the rotation of the cutting tool mounting member 324, and a plurality of pieces formed on the surface of the device 110 are formed. The individual stud bumps (electrodes) 120 are turned, and the stud bumps (electrodes) 120 are exposed on the surface of the underfill material 130 coated on the surface of the semiconductor wafer 10 as shown in FIG.

  In the turning process, the electromagnetic on-off valve 525c of the cooling water supply means 525 shown in FIG. 4 is energized (ON) to open the circuit. When the electromagnetic opening / closing valve 525c is opened, as described above, the cooling water flows from the cooling water supply source 525a into the cooling water flow passage 522d via the supply pipe 525b, the communication passage 523c, and the cooling water introduction passage 522e, and the cooling water discharge passage 522f. It is discharged through. As a result, the cooling member 522 is cooled and the holding table 521 supported by the cooling member 522 is cooled, so that the thermal expansion of the holding table 521 is suppressed. The cooling water that has flowed into the cooling member 522 and cooled the cooling member 522 in this way flows into the shower nozzle 53 from the cooling water inlet 531b through the cooling water inflow pipe 532 and the communication path 541 from the cooling water discharge passage 522f. A plurality of ejection ports 531 a provided in an annular nozzle member 531 constituting the nozzle 53 are ejected toward the holding table 521. As a result, since the holding table 521 is cooled, thermal expansion of the holding table 521 and the semiconductor wafer 10 held on the holding table 521 is suppressed.

  As described above, the turning process of turning the underfill material 130 coated on the surface of the semiconductor wafer 10 and exposing the plurality of stud bumps (electrodes) 120 formed on the surface of the device 110 to the surface of the underfill material 130. When is finished, the turning unit 3 is raised. Next, the chuck table 52 is moved in the direction indicated by the arrow 23 b in FIG. 1 to be positioned in the workpiece loading / unloading area 24, and the semiconductor wafer 10 that has been turned on the holding table 521 constituting the chuck table 52 is sucked. Release the hold. Then, the semiconductor wafer 10 released from the suction and holding by the holding table 521 is unloaded by the workpiece unloading means 17 and transferred to the cleaning means 14. The semiconductor wafer 10 conveyed to the cleaning means 14 is cleaned here. The semiconductor wafer 10 cleaned by the cleaning unit 14 is stored in a predetermined position of the second cassette 12 by the workpiece transfer unit 15.

2: Device housing 3: Turning unit 31: Moving base 32: Spindle unit 321: Spindle housing 322: Rotating spindle 323: Servo motor 324: Tool tool mounting member 33: Tool tool 331: Tool body 332: Cutting blade 4: Turning Unit feed mechanism 5: Workpiece holding mechanism 51: Support base 52: Chuck table 521: Holding table 522: Cooling member 523: Base 524: Suction means 525: Cooling water supply means 53: Shower nozzle 56: Workpiece Holding mechanism moving means 11: First cassette 12: Second cassette 13: Temporary workpiece placing means 14: Cleaning means 15: Workpiece conveying means 16: Workpiece carrying means 17: Workpiece carrying means 10 : Semiconductor wafer 110: Device 120: Stud bump (electrode)
130: Underfill material

Claims (2)

A processing apparatus provided with a bite tool comprising: a workpiece holding mechanism for holding a workpiece; and a turning means provided with a bite tool for turning the workpiece held by the workpiece holding mechanism. In
The workpiece holding mechanism includes a holding table that holds the workpiece by suction, a cooling member that supports the holding table, a base that supports the cooling member, and cooling water that supplies cooling water to the cooling member. A supply means, and a shower nozzle for injecting the cooling water supplied to the cooling member toward the holding table,
A processing apparatus having a bite tool characterized by the above.   The bite tool according to claim 1, wherein the shower nozzle includes an annular nozzle member provided so as to surround the holding table, and a plurality of jet nozzles are provided on an inner peripheral wall of the annular nozzle member. Processing equipment.

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