JP2005333067A - Processing apparatus for plate-like article - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing apparatus for a plate-like article provided with a chuck table capable of sucking and holding a plate-like article without warping the outer peripheral part of the plate-like article. <P>SOLUTION: The processing apparatus comprises the chuck table provided with a mounting surface for mounting the plate-like article, and a cutting unit provided with a cutting tool for cutting a plurality of electrodes extrusively formed on the surface of the plate-like article held on the chuck table and aligning the height of the electrodes. Further, the apparatus is provided with an outer peripheral annular holder formed on the outer periphery, a sucking recess connected to a sucking means formed on the inside of the outer peripheral annular holder, and an inside holder formed on the inside of the outer peripheral annular holder are formed on the holding surface of the chuck table. The upper surface of the outer peripheral annular holder is set slightly lower than the upper surface of the inner peripheral side holder. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a processing apparatus for aligning the heights of a plurality of electrodes formed to protrude from a surface of a plate-like object such as a semiconductor chip.

A semiconductor wafer in which a plurality of semiconductor chips are formed is divided into individual semiconductor chips by a dicing apparatus or the like, and the divided semiconductor chips are widely used in electric devices such as mobile phones and personal computers.
In recent years, in order to reduce the weight and size of electrical equipment, a bump having a protrusion of 50 to 100 μm is formed on an electrode of a semiconductor chip, and this bump is directly bonded to an electrode formed on a mounting substrate. A semiconductor chip called a flip chip has been developed and put into practical use. In addition, a technique for reducing the size by mounting a plurality of semiconductor chips on a substrate called an interposer or stacking them has been developed and put into practical use.

  However, each of the above-described technologies forms a plurality of protruding bumps (electrodes) on the surface of a substrate such as a semiconductor chip and bonds the substrates to each other via the protruding electrodes. ) Must be the same height. In order to make the height of the bumps (electrodes) in a protruding shape, grinding is generally used. However, when the bump (electrode) is ground, if the bump (electrode) is formed of a sticky metal such as gold, a burr is generated, and this burr is short-circuited to the adjacent bump (electrode). is there.

As a technique for forming a plurality of bumps (electrodes) on the surface of a substrate such as a semiconductor chip, a ball is formed by heating and melting the tip of a wire such as gold, and the ball is then applied to the electrode of the semiconductor chip. There is a method of forming a stud bump in which the head of the ball is broken by thermocompression bonding with ultrasonic waves. Bumps (electrodes) formed by this stud bump formation method are difficult to polish because needle-shaped wrinkles are generated when the head of a thermocompressed ball is broken, and a heated plate is used as a bump. The bumps are pressed to align the height of the bumps. (For example, refer to Patent Document 1.)
JP 2001-53097 A

  However, when the heated plate is pressed against the bumps so that the bumps have the same height, there is a problem that the bumps are short-circuited with adjacent bumps when the bump heads are crushed. In order to solve this problem, in the invention described in the above publication, an extra step of removing the tip of the bump is provided.

  In order to solve the above-mentioned problem, the applicant of the present application has applied for a machining apparatus that removes the tip portions of a plurality of electrodes formed by protruding on the surface of a plate-like object sucked and held on a chuck table by cutting. -110536.

  Thus, when a plate-like object such as a semiconductor wafer is sucked and held on the chuck table, the outer periphery of the plate-like object is warped, the tip of the cutting tool comes into contact with the warped outer periphery, and the cutting tool is There is a problem of falling off or damaging the plate-like object. That is, as shown in FIGS. 18 and 19, a plurality of annular suction grooves G are formed concentrically on the holding surface for holding the workpiece of the chuck table CT, and these suction grooves G serve as suction passages S. Is communicated with a suction means (not shown). Therefore, by operating a suction means (not shown), negative pressure acts on the plurality of suction grooves G via the suction passage S, and the workpiece W placed on the holding surface is sucked and held. However, the outer peripheral portion of the workpiece W held on the outermost annular holding surface is deformed so as to warp with the inner peripheral edge of the outermost annular holding surface as a fulcrum as shown in FIG.

  The present invention has been made in view of the above-mentioned facts, and its main technical problem is to provide a processing apparatus for a plate-like object provided with a chuck table that can suck and hold the outer periphery of the plate-like object without warping. There is to do.

In order to solve the main technical problem, according to the present invention, a chuck table configured to be movable between a workpiece loading / unloading zone and a machining zone and having a holding surface for holding a plate-like object, A chuck table moving mechanism for moving the chuck table to the workpiece loading / unloading zone and the machining zone, and a plurality of electrodes disposed in the machining zone and protruding from the surface of the plate-like object held by the chuck table In a processing apparatus comprising: a cutting unit provided with a cutting tool that cuts the height and aligning the height; and a cutting unit feed mechanism that advances and retracts the cutting unit in a direction perpendicular to the holding surface of the chuck table.
On the holding surface of the chuck table, an outer peripheral annular holding portion formed on the outer peripheral portion, a suction recess formed on the inner side of the outer peripheral annular holding portion and communicating with the suction means, and formed on the inner side of the outer peripheral annular holding portion. Provided with an inner holding part,
The upper surface of the outer peripheral holding portion is set slightly lower than the upper surface of the inner peripheral holding portion,
An apparatus for processing a plate-like object is provided.

The suction recess is composed of a plurality of annular grooves formed concentrically with the outer peripheral annular holding part, and the inner peripheral holding part is composed of a plurality of annular partitions partitioned by the plurality of annular grooves. The inner holding part is composed of a plurality of holding protrusions disposed in the suction recess.

  In the chuck table constituting the processing apparatus according to the present invention, the upper surface of the outer annular holding portion formed on the holding surface holding the plate-like object is set slightly lower than the upper surface of the inner peripheral holding portion. A slight gap is formed between the upper surface of the holding portion and the lower surface of the outer peripheral portion of the plate-like object. Accordingly, since the outside air is sucked through the gap, a negative pressure is generated between the upper surface of the outer peripheral annular holding portion and the plate-like object according to the Bernoulli principle, so that the outer peripheral portion of the plate-like object is sucked downward. . As a result, the cutting tool does not come into contact with the outer periphery of the plate-like object, and the cutting tool comes into contact with the outer periphery of the plate-like object sucked and held by the chuck table, causing damage to the plate-like object. Can be prevented.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment of a plate-like material processing apparatus according to the invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a processing apparatus for a plate-like object constructed according to the present invention.
The processing apparatus in the illustrated embodiment includes an apparatus housing denoted as a whole by the number 2. The apparatus housing 2 includes a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at a rear end portion (upper right end in FIG. 1) of the main portion 21 and extends substantially vertically upward. Yes. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. The cutting unit 3 is mounted on the pair of guide rails 221 and 221 so as to be movable in the vertical direction.

  The cutting unit 3 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. A support member 313 is mounted on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22, and the spindle unit 32 is attached to the support member 313. It is done.

  The spindle unit 32 includes a spindle housing 321 mounted on the support portion 313, a rotating spindle 322 rotatably disposed on the spindle housing 321, and a servo motor as a drive source for rotationally driving the rotating spindle 322. 323. The lower end of the rotary spindle 322 protrudes downward beyond the lower end of the spindle housing 321, and a disk-shaped tool mounting member 324 is provided at the lower end. A cutting tool 33 as a cutting tool is detachably mounted on the tool mounting member 324.

Here, the attachment / detachment structure of the cutting tool 33 to the tool mounting member 324 will be described with reference to FIG.
The tool mounting member 324 is provided with a cutting tool mounting hole 324a penetrating in a vertical direction in a part of the outer peripheral portion, and a female reaching the cutting tool mounting hole 324a from an outer peripheral surface corresponding to the cutting tool mounting hole 324a. A screw hole 324b is provided. The cutting tool 33 is inserted into the tool mounting member 324 by inserting the cutting tool 33 into the cutting tool mounting hole 324a of the tool mounting member 324 thus configured and screwing the tightening bolt 330 into the female screw hole 324b. Removably mounted. In the illustrated embodiment, the cutting tool 33 is formed by forming a cutting blade 332 made of diamond or the like at the tip of a cutting tool body 331 made of a tool steel such as a super steel alloy. Yes. The cutting tool 33 mounted on the tool mounting member 324 thus configured rotates in a plane parallel to the holding surface for holding the workpiece of the chuck table, which will be described later, as the rotary spindle 322 rotates. I'm damned.

Next, another embodiment of the tool mounting member on which the cutting tool 33 is mounted will be described with reference to FIG.
The tool mounting member 325 shown in FIG. 3 is directly attached to the moving base 31 constituting the cutting unit. The tool mounting member 325 is provided with a cutting tool mounting hole 325a penetrating in the vertical direction, and a female screw hole 325b reaching the cutting tool mounting hole 325a from the front end surface corresponding to the cutting tool mounting hole 325a. It has been. The cutting tool 33 is inserted into the tool mounting member 325 by inserting the cutting tool 33 into the cutting tool mounting hole 325a of the tool mounting member 325 thus configured and screwing the tightening bolt 330 into the female screw hole 325b. Removably mounted.

  Returning to FIG. 1, the description of the processing apparatus in the illustrated embodiment moves the cutting unit 3 in the vertical direction along the pair of guide rails 221 and 221 (in a direction perpendicular to the holding surface of the chuck table described later). A cutting unit feed mechanism 4 is provided. The cutting unit feed mechanism 4 includes a male screw rod 41 disposed on the front side of the upright wall 22 and extending substantially vertically. The male screw rod 41 is rotatably supported by bearing members 42 and 43 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and the output shaft of the pulse motor 44 is connected to the male screw rod 41 by transmission. A connecting portion (not shown) that protrudes rearward from the center portion in the width direction is also formed on the rear surface of the movable base 31, and a through female screw hole that extends in the vertical direction is formed in the connecting portion, The male screw rod 41 is screwed into the female screw hole. Accordingly, when the pulse motor 44 is rotated forward, the moving base 31, that is, the cutting unit 3 is lowered or moved forward, and when the pulse motor 44 is rotated reversely, the moving base 31, that is, the cutting unit 3 is raised or moved backward.

  Continuing with reference to FIG. 1 and FIG. 4, a substantially rectangular machining work portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the machining work portion 211 includes a chuck table mechanism. 5 is disposed. The chuck table mechanism 5 includes a support base 51 and a disk-shaped chuck table 52 disposed on the support base 51 so as to be rotatable about a rotation center axis extending substantially vertically. The support base 51 slides on a pair of guide rails 23 and 23 extending in the direction indicated by the arrows 23a and 23b in the front-rear direction (the direction perpendicular to the front surface of the upright wall 22) on the processing work unit 211. The workpiece loading / unloading area 24 shown in FIG. 1 (position indicated by a solid line in FIG. 4) and the cutting tool 33 constituting the spindle unit 32 are opposed to each other by a chuck table moving mechanism 56 described later. And the machining area 25 to be moved (a position indicated by a two-dot chain line in FIG. 4).

  The chuck table 52 will be described with reference to FIGS. The chuck table 52 shown in FIGS. 5 and 6 is formed in a disk shape from an aluminum alloy, and includes a plurality of annular suction recesses 521 formed concentrically on a holding surface which is an upper surface thereof. Therefore, on the holding surface of the chuck table 52, as shown in FIG. 6, an outer peripheral annular holding portion 522 that is partitioned outside the outermost annular suction recess 521 in the plurality of annular suction recesses 521, and the outer peripheral annular holding portion. An annular partition wall 523 serving as an internal holding portion defined by each annular suction recess 521 is formed inside 522. Note that the width A of the annular suction recess 521 is desirably 2 mm or less, and the width B of the annular partition wall 523 as the inner holding portion is desirably 1 mm or less. The upper surface of the outer peripheral annular holding portion 522 is set slightly lower than the upper surface of the annular partition wall 523, and the step C thereof is set to 2 to 7 μm.

  A plurality of annular suction recesses 521 formed in the chuck table 52 are communicated with suction means (not shown) via a suction passage 524. Therefore, by operating a suction means (not shown), negative pressure acts on the plurality of annular suction recesses 521 via the suction passage 524, and the plate-like workpiece placed on the holding surface as shown in FIG. The object W is sucked and held. At this time, the upper surface of the outer peripheral annular holding portion 522 is set slightly lower than the upper surface of the annular partition wall 523 as the inner holding portion, and therefore, between the upper surface of the outer peripheral annular holding portion 522 and the lower surface of the outer peripheral portion of the workpiece W. A slight gap is formed. Accordingly, since the outside air is sucked through the gap, a negative pressure is generated between the upper surface of the outer peripheral annular holding portion 522 and the workpiece W according to the Bernoulli principle, so that the outer peripheral portion of the workpiece W is moved downward. Sucked. Note that the width D of the workpiece holding region of the outer peripheral annular holding portion 522 is preferably set to about 2 mm.

  As shown in FIG. 4, the chuck table 52 configured as described above has a rotating shaft (not shown) attached to the lower surface thereof connected to a servo motor 53 and is rotated by the servo motor 53. The illustrated chuck table mechanism 5 includes a cover member 54 that has a hole through which the chuck table 52 is inserted, covers the support base 51 and the like, and is movably disposed together with the support base 51.

Next, another embodiment of the chuck table 52 will be described with reference to FIGS.
The chuck table 52 shown in FIGS. 8 and 9 is also formed in a disk shape from an aluminum alloy, and an outer peripheral annular holding portion 522a is formed on the outer peripheral portion of the holding surface which is the upper surface thereof. A suction recess 525 is formed inside the outer peripheral annular holding portion 522a, and a plurality of holding projections 526 as internal holding portions are provided in the suction recess 525. The holding protrusion 526 is formed in a columnar shape having a diameter of about 1 mm in the illustrated embodiment. The upper surface of the outer peripheral annular holding portion 522a is set slightly lower than the upper surfaces of the plurality of holding protrusions 526 as inner holding portions, and the step C is set to 2 to 7 μm.

  The suction recess 525 formed in the chuck table 52 is communicated with a suction means (not shown) via a suction passage 527. Accordingly, by operating a suction means (not shown), a negative pressure is applied to the suction recess 525 via the suction passage 527, and the workpiece W placed on the holding surface is sucked and held as shown in FIG. . At this time, since the upper surface of the outer peripheral annular holding portion 522 is set slightly lower than the upper surfaces of the plurality of holding projections 526 as inner holding portions, the upper surface of the outer peripheral annular holding portion 522 and the lower surface of the outer peripheral portion of the workpiece W A slight gap is formed between the two. Accordingly, since the outside air is sucked through the gap, a negative pressure is generated between the upper surface of the outer peripheral annular holding portion 522 and the workpiece W according to the Bernoulli principle, so that the outer peripheral portion of the workpiece W is moved downward. Sucked.

  4, the machining apparatus in the illustrated embodiment includes a chuck table moving mechanism 56 that moves the chuck table mechanism 5 along the pair of guide rails 23 in the directions indicated by the arrows 23a and 23b. It has. The chuck table moving mechanism 56 includes a male screw rod 561 disposed between the pair of guide rails 23 and 23 and extending in parallel with the guide rails 23 and 23, and a servo motor 562 that rotationally drives the male screw rod 561. The male screw rod 561 is screwed into a screw hole 511 provided in the support base 51, and the tip end portion thereof is rotatably supported by a bearing member 563 attached by connecting a pair of guide rails 23 and 23. ing. The servo motor 562 has a drive shaft connected to the base end of the male screw rod 561 by transmission. Accordingly, when the servo motor 562 rotates in the forward direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23a. When the servo motor 562 rotates in the reverse direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23b. It can be moved. The chuck table mechanism 5 that is moved in the directions indicated by the arrows 23a and 23b is selectively positioned in a workpiece loading / unloading area indicated by a solid line and a machining area indicated by a two-dot chain line in FIG. Further, the chuck table mechanism 5 is reciprocated in the direction indicated by the arrows 23 a and 23 b over the predetermined range in the machining area, that is, in parallel with the holding surface which is the upper surface of the chuck table 52.

  Returning to FIG. 1, the explanation will be continued. On both sides of the support base 51 constituting the chuck table mechanism 5 in the moving direction, as shown in FIG. Bellows means 57 and 58 covering the rails 23 and 23, the male screw rod 561, the servo motor 562 and the like are attached. The bellows means 57 and 58 can be formed from any suitable material such as campus cloth. The front end of the bellows means 57 is fixed to the front wall of the processing unit 211, and the rear end is fixed to the front end surface of the cover member 54 of the chuck table mechanism 5. The front end of the bellows means 58 is fixed to the rear end surface of the cover member 54 of the chuck table mechanism 5, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the chuck table mechanism 5 is moved in the direction indicated by the arrow 23a, the bellows means 57 is expanded and the bellows means 58 is contracted, and when the chuck table mechanism 5 is moved in the direction indicated by the arrow 23b, the bellows means. 57 is contracted and the bellows means 58 is extended.

  On the front half of the main portion 21 of the apparatus housing 2, a first cassette mounting portion 6a, a second cassette mounting portion 7a, a workpiece temporary storage portion 8a, and a cleaning portion 9a are provided. ing. A first cassette 6 that accommodates a workpiece before processing is placed on the first cassette placement portion 6a, and a second cassette that accommodates a workpiece after processing is placed on the second cassette placement portion 7a. The cassette 7 is placed. In the workpiece temporary placement portion 8a, the workpiece temporary placement means for temporarily placing the workpiece before processing carried out from the first cassette 6 placed on the first cassette placement portion 6a. 8 is disposed. The cleaning unit 9a is provided with cleaning means 9 for cleaning the processed workpiece.

  A workpiece conveying means 11 is disposed between the first cassette placing portion 6a and the second cassette placing portion 7a. The workpiece conveying means 11 is a first cassette placing portion. The unprocessed workpiece housed in the first cassette 6 placed on the part 6a is carried out to the workpiece temporary storage means 8 and the processed workpiece cleaned by the cleaning means 9 is used as the first workpiece. It is transported to the second cassette 7 placed on the second cassette placement section 7a. A workpiece loading means 12 is disposed between the workpiece temporary placing portion 8a and the workpiece loading / unloading area 24, and the workpiece loading means 12 is the workpiece loading means 12. The workpiece before processing placed on the temporary placing means 8 is transported onto the chuck table 52 of the chuck table mechanism 5 positioned in the workpiece loading / unloading area 24. A workpiece unloading means 13 is disposed between the workpiece loading / unloading area 24 and the cleaning unit 9a. The workpiece unloading means 13 is a workpiece loading / unloading area. The processed workpiece placed on the chuck table 52 positioned at 24 is conveyed to the cleaning means 9.

  The workpiece before processing accommodated in the first cassette 6 comprises a semiconductor wafer 10 having a plurality of semiconductor chips 110 formed in a lattice shape on the surface as shown in FIG. A plurality of stud bumps (electrodes) 120 are formed on the surfaces of the plurality of semiconductor chips 110 formed on the semiconductor wafer 10. The stud bump (electrode) 120 is formed by, for example, a stud bump forming method. That is, as shown in FIG. 12 (a), the tip of a gold wire 121 inserted through the cavity 15 is heated and melted by electric torch discharge to form a ball 122. As shown in b), the electrode plate 111 made of, for example, aluminum or the like formed on the semiconductor chip 110 is thermocompression-bonded with ultrasonic waves and is broken at the head of the ball 122. The plurality of stud bumps (electrodes) 120 formed in this way are in a state in which the needle-like ridges 123 remain as shown in FIG.

Next, another embodiment of the workpiece will be described with reference to FIGS. 13 and 14.
The workpiece in the embodiment shown in FIGS. 13 and 14 is a semiconductor chip 110 in which the above-described semiconductor wafer 10 is individually divided. FIG. 13 shows a plurality of semiconductors on a protective tape 17 mounted on an annular frame 16. Chips 110 are attached, and in FIG. 14, a plurality of semiconductor chips 110 are attached on a support substrate (substrate) 18 by, for example, a double-sided adhesive tape. Note that the plurality of stud bumps (electrodes) 120 described above are formed on the surface of the semiconductor chip 110.

  The first cassette 6 containing the workpiece as described above is placed on the first cassette placement portion 6 a of the apparatus housing 2. And when all the workpieces before processing which were accommodated in the 1st cassette 6 mounted in the 1st cassette mounting part 6a are carried out, it will replace with the cassette 6 which became empty, and a plurality of will be carried out. A new cassette 6 containing the workpiece before processing is manually placed on the first cassette placing portion 6a. On the other hand, when a predetermined number of processed objects are loaded into the second cassette 7 mounted on the second cassette mounting portion 7a of the apparatus housing 2, the second cassette 7 is manually unloaded. Then, a new empty second cassette 7 is placed.

The processing apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described mainly with reference to FIG. The workpiece will be described as the semiconductor wafer 10 shown in FIGS.
The semiconductor wafer 10 as the workpiece before processing accommodated in the first cassette 6 is transported by the vertical movement and forward / backward movement of the workpiece transport means 11 and placed on the workpiece temporary placement means 8. The semiconductor wafer 10 placed on the workpiece temporary placing means 8 is positioned in the workpiece loading / unloading area 24 by the turning operation of the workpiece loading means 12 after being centered here. It is placed on the chuck table 52 of the chuck table mechanism 5. The semiconductor wafer 10 placed on the chuck table 52 is sucked and held on the chuck table 52 by suction means (not shown). At this time, since the upper surface of the outer peripheral annular holding portion 522 (522a) of the chuck table 52 is set slightly lower than the upper surface of the annular partition wall 523 (or holding projection 526) as the inner holding portion, the outer peripheral annular holding portion 522 ( A slight gap is formed between the upper surface of 522 a) and the lower surface of the outer peripheral portion of the semiconductor wafer 10. Therefore, the outer peripheral portion of the semiconductor wafer 10 is sucked downward similarly to the workpiece W shown in FIG. 7 and FIG.

  When the semiconductor wafer 10 is sucked and held on the chuck table 52, the chuck table moving mechanism 56 (see FIG. 4) is operated to move the chuck table mechanism 5 in the direction indicated by the arrow 23a, and the chuck holding the semiconductor wafer 10 is held. The table 52 is positioned in the machining area 25. When the chuck table 52 holding the semiconductor wafer 10 is positioned in the processing region 25 in this way, a plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 are provided. A cutting process for cutting is performed.

First, the cutting process in the embodiment shown in FIGS. 1 and 2 will be described with reference to FIG.
In the embodiment shown in FIGS. 1 and 2, the rotary spindle 322 is driven to rotate, and the tool mounting member 324 to which the cutting tool 33 is attached is rotated in the direction indicated by the arrow in FIG. 15 at a rotational speed of, for example, 6000 rpm. . Then, the cutting unit 3 is lowered and the cutting tool 33 is positioned at a predetermined cutting position. Next, for example, when the cutting width of the cutting blade 332 of the cutting bit 33 is 20 or more μm, the chuck table 52 holding the semiconductor wafer 10 is fed to the right from the position indicated by the solid line in FIG. Move at speed. As a result, the upper ends of a plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 by the cutting blade 332 of the cutting tool 33 that rotates as the rotary spindle 322 rotates. Scraped off. 15, the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 is moved by moving the center of the semiconductor wafer 10 held on the chuck table 52 to the center position of the tool mounting member 324 as indicated by a two-dot chain line in FIG. All of the plurality of stud bumps (electrodes) 120 formed on the tip are removed by cutting as shown in FIG. At this time, since the outer peripheral portion of the semiconductor wafer 10 is sucked downward as described above, the cutting blade 332 of the cutting tool 33 does not come into contact. Accordingly, it is possible to prevent the wafer from being damaged by the cutting tool coming into contact with the outer peripheral portion of the semiconductor wafer 10 sucked and held by the chuck table 52.

Next, the cutting process in the embodiment shown in FIG. 3 will be described with reference to FIG.
In the case of the embodiment shown in FIG. 3, first, the moving base 31 constituting the cutting unit is lowered, and the cutting tool 33 mounted on the tool mounting member 325 mounted on the moving base 31 is cut into a predetermined notch. Position to position. Next, when the chuck table 52 holding the semiconductor wafer 10 is rotated in the direction indicated by the arrow A in FIG. 16 at a rotational speed of 2000 rpm, for example, the cutting width of the cutting blade 332 of the cutting tool 33 is 20 μm or more. Moves to the right from the position indicated by the solid line in FIG. 16, for example, at a feed rate of 0.6 mm / second. As a result, the upper ends of the plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 are cut off by the cutting blade 332 of the cutting tool 33. Then, as shown by a two-dot chain line in FIG. 16, the center of the semiconductor wafer 10 held on the chuck table 52 moves to a position reaching the cutting tool 33, so that the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 is moved. As shown in FIG. 17, all the formed stud bumps (electrodes) 120 have their tips removed by cutting, and their heights are made uniform. At this time, since the outer peripheral portion of the semiconductor wafer 10 is sucked downward as described above, the cutting blade 332 of the cutting tool 33 does not come into contact.

  As described above, when the cutting process of the plurality of bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 is completed, the cutting unit 3 is raised and the rotation of the chuck table 52 is stopped. . Next, the chuck table 52 is moved in the direction indicated by the arrow 23b in FIG. 1 to be positioned in the workpiece loading / unloading area 24, and the suction holding of the cut semiconductor wafer 10 on the chuck table 52 is released. Then, the semiconductor wafer 10 whose suction holding is released is carried out by the workpiece carrying-out means 13 and conveyed to the cleaning means 9. The semiconductor wafer 10 conveyed to the cleaning means 9 is cleaned here. The semiconductor wafer 10 cleaned by the cleaning unit 9 is stored in a predetermined position of the second cassette 7 by the workpiece transfer unit 11.

The perspective view which shows one Embodiment of the processing apparatus of the plate-shaped object comprised according to this invention. The perspective view which shows one Embodiment of the cutting unit with which the processing apparatus shown in FIG. 1 is equipped. The perspective view which shows other embodiment of the cutting unit with which the processing apparatus shown in FIG. 1 is equipped. The perspective view which shows the chuck table mechanism and chuck table moving mechanism with which the processing apparatus shown in FIG. 1 is equipped. The perspective view which shows one Embodiment of the chuck table with which the processing apparatus shown in FIG. 1 is equipped. The expanded sectional view of the chuck table shown in FIG. FIG. 6 is an explanatory view showing a state in which a plate-like workpiece is sucked and held on the holding surface of the chuck table shown in FIG. 5. The perspective view which shows other embodiment of a chuck table. The expanded sectional view of the chuck table shown in FIG. FIG. 9 is an explanatory view showing a state in which a plate-like workpiece is sucked and held on the holding surface of the chuck table shown in FIG. 8. The top view of the semiconductor wafer as a to-be-processed object which consists of a plate-shaped object. FIG. 12 is an explanatory diagram of a stud bump forming method for forming bumps (electrodes) on a plurality of semiconductor chips provided on the semiconductor wafer shown in FIG. 11. The perspective view which shows the state which supported the semiconductor chip as a to-be-processed object which consists of a plate-shaped object in the cyclic | annular flame | frame. The perspective view which shows the state which supported the semiconductor chip as a to-be-processed object which consists of a plate-shaped object on the support substrate (substrate). Explanatory drawing of the cutting process implemented using the cutting unit shown in FIG. Explanatory drawing of the cutting process implemented using the cutting unit shown in FIG. Explanatory drawing which shows the state which cut the bump (electrode) formed in the semiconductor chip with the processing apparatus shown in FIG. The perspective view of the chuck table used conventionally. FIG. 19 is an explanatory view showing a state in which a plate-like workpiece is sucked and held on the holding surface of the chuck table shown in FIG. 18.

Explanation of symbols

2: Device housing 3: Grinding unit 31: Moving base 32: Spindle unit 321: Spindle housing 322: Rotary spindle 323: Servo motor 324, 325: Tool mounting member 33: Grinding tool 4: Grinding unit feed mechanism 44: Pulse motor 5: chuck table mechanism 51: support base 52: chuck table 521: annular suction recess 522: outer peripheral annular holding portion 523: annular partition (internal holding portion)
525: Suction recess 526: Holding protrusion (internal holding portion)
53: Servo motor 54: Cover member 56: Chuck table moving mechanism 57, 58: Bellows means 6: First cassette 7: Second cassette 9: Temporary placing means 9: Cleaning means 11: Conveying work piece Means 12: Workpiece carry-in means 13: Workpiece carry-out means 10: Semiconductor wafer 110: Semiconductor chip 111: Electrode plate 120: Bump (electrode)

Claims (3)

A chuck table configured to be movable between a workpiece loading / unloading zone and a machining zone and having a holding surface for holding a plate-like object, and the chuck table is moved to a workpiece loading / unloading zone and a machining zone A chuck table moving mechanism, and a cutting unit provided with a cutting tool arranged in the processing area and cutting a plurality of electrodes formed on the surface of the plate-like object held by the chuck table so as to align the height. A cutting unit feed mechanism for moving the cutting unit back and forth in a direction perpendicular to the holding surface of the chuck table,
On the holding surface of the chuck table, an outer peripheral annular holding portion formed on the outer peripheral portion, a suction recess formed on the inner side of the outer peripheral annular holding portion and communicating with the suction means, and formed on the inner side of the outer peripheral annular holding portion. Provided with an inner holding part,
The upper surface of the outer peripheral holding portion is set slightly lower than the upper surface of the inner peripheral holding portion,
An apparatus for processing a plate-like object.   The suction recess is composed of a plurality of annular grooves formed concentrically with the outer peripheral annular holding part, and the inner peripheral holding part is composed of a plurality of annular partitions partitioned by the plurality of annular grooves. 2. The plate-like material processing apparatus according to claim 1.   2. The plate-like material processing apparatus according to claim 1, wherein the inner holding part is composed of a plurality of holding protrusions arranged in the suction recess.

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