JP5378727B2 - Processing equipment equipped with a bite tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing device including a cutting tool provided with a function to remove turning chips adhered to a cutting blade. <P>SOLUTION: This processing device includes a chuck table provided with a holding surface for holding a workpiece, a turning means provided with the cutting tool to turn the workpiece held by the chuck table, a processing feed mechanism for relatively moving the chuck table and the turning means in a processing feed direction, a cutting feed mechanism for moving the turning means in a direction perpendicular to the holding surface, a cutting tool mounting member mounted with the turning means on a rotating spindle and a lower end of the rotating spindle, the cutting tool mounted on the cutting tool mounting member at a position deviated from a rotary axial center. The processing device further includes a turning chip removal means applied to the cutting blade of the cutting tool to remove turning chips adhered to the cutting blade. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a processing apparatus including a bite tool for turning a workpiece held on a chuck table having a holding surface for holding the workpiece.

A semiconductor wafer in which a plurality of semiconductor devices are formed in a lattice shape is divided into individual semiconductor devices by a dicing apparatus or the like, and the divided semiconductor devices are widely used in electric devices such as mobile phones and personal computers.
2. Description of the Related Art In recent years, in order to reduce the weight and size of electrical equipment, a stacked device configured so that semiconductor devices can be stacked has been developed. In this laminated device, bumps (electrodes) of 50 to 100 μm are formed on the surface of a semiconductor device, and the bumps are embedded with an underfill material made of a synthetic resin such as epoxy resin or benzocyclobutene (BCB). Thereafter, the bumps of the stacked devices are configured to be connectable by exposing the bumps to the surface of the underfill material.

A method of exposing the bumps to the surface of the underfill material in which the bumps formed on the surface of the semiconductor device are embedded is disclosed in Patent Document 1 below. The method disclosed in Patent Document 1 is a method in which a bump is exposed to the surface of the underfill material by turning the underfill material in which the bump formed on the surface of the semiconductor device is embedded with a bite tool.
Japanese Patent Application Laid-Open No. 2000-173954

  Therefore, if the underfill material with embedded bumps formed on the surface of the semiconductor device is turned with a bite tool, the underfill material made of synthetic resin will become viscous at high temperatures, so turning at the tip of the cutting edge of the bite tool. There is a problem that scraps adhere, the turning resistance increases, and the wear of the cutting tool is promoted.

  This invention is made | formed in view of the said fact, The main technical subject is to provide the processing apparatus provided with the cutting tool provided with the function which removes the turning waste adhering to a cutting blade.

In order to solve the above main technical problem, according to the present invention, a chuck table having a holding surface for holding a workpiece and a bite tool for turning the workpiece held on the chuck table are provided. Turning means, a machining feed mechanism for moving the chuck table and the turning means in a machining feed direction in a horizontal plane parallel to the holding surface, and moving the turning means in a direction perpendicular to the holding surface A cutting feed mechanism, and the turning means includes a rotating spindle, a cutting tool mounting member mounted on the lower end of the rotating spindle, and a cutting tool mounted on the cutting tool mounting member at a position eccentric from the rotational axis. In a processing device equipped with a cutting tool,
Comprising turning turning removal means for acting on the cutting edge of the cutting tool and removing the turning scrap attached to the cutting edge of the cutting tool ;
The turning scrap removing means is provided adjacent to the chuck table, and provided with a turning board that moves in the machining feed direction together with the chuck table, and the cutting edge of the cutting tool turns the turning board. By removing turning scraps adhering to the cutting edge of the bite tool,
There is provided a machining apparatus provided with a cutting tool characterized by the above.

The turning scrap removing means positions the board holding base for holding the turning board, the working position where the cutting edge of the cutting tool turns the turning board, and the retracted position below the working position. It is desirable to have board positioning means.
The turning scrap removing means preferably includes a turning means for turning the board holding base in a horizontal plane.

The processing apparatus according to the present invention includes turning scrap removing means that acts on the cutting edge of the cutting tool and removes turning scrap attached to the cutting edge of the cutting tool, and the turning scrap removing means is disposed adjacent to the chuck table. In addition, a turning board that moves together with the chuck table in the machining feed direction is provided. Since the turning scrap attached to the cutting edge of the cutting tool is removed by the removing means, it is possible to suppress an increase in turning resistance caused by the attachment of the turning scrap to the cutting edge of the cutting tool. Wear is suppressed.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a processing apparatus having a cutting tool constructed according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a machining apparatus having a bite tool constructed according to the present invention.
The processing apparatus in the illustrated embodiment includes an apparatus housing denoted as a whole by the number 2. The apparatus housing 2 includes a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at a rear end portion (upper right end in FIG. 1) of the main portion 21 and extends substantially vertically upward. Yes. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. A turning unit 3 as a turning means is mounted on the pair of guide rails 221 and 221 so as to be movable in the vertical direction.

  The turning unit 3 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. A support member 313 is mounted on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22, and the spindle unit 32 is attached to the support member 313. It is done.

  The spindle unit 32 includes a spindle housing 321 mounted on a support member 313, a rotating spindle 322 rotatably disposed on the spindle housing 321, and a servo motor as a drive source for rotationally driving the rotating spindle 322. 323. The lower end of the rotary spindle 322 protrudes downward beyond the lower end of the spindle housing 321, and a disk-shaped tool tool mounting member 324 is provided at the lower end. The tool tool 33 is detachably mounted on the tool tool mounting member 324.

Here, the attachment / detachment structure of the cutting tool 33 to the cutting tool mounting member 324 will be described with reference to FIG.
The tool tool mounting member 324 is provided with a tool mounting hole 324a penetrating in a vertical direction in a part of the outer peripheral portion eccentric from the rotation axis, and the tool mounting is performed from the outer peripheral surface corresponding to the tool mounting hole 324a. A female screw hole 324b reaching the hole 324a is provided. The bite tool 33 is inserted into the bite mounting hole 324a of the bite tool mounting member 324 having the above-described configuration, and the tightening bolt 330 is screwed into the female screw hole 324b to be tightened. Removably attached to the. In the illustrated embodiment, the cutting tool 33 is composed of a cutting tool body 331 formed in a rod shape with tool steel such as super steel alloy, and a cutting blade formed of diamond or the like provided at the tip of the cutting tool body 331. 332 is used. The tool tool 33 configured as described above and mounted on the tool tool mounting member 324 is rotated in a horizontal plane parallel to a holding surface for holding a workpiece of a chuck table, which will be described later, by rotating the rotary spindle 322. I'm damned.

  Referring back to FIG. 1, the machining apparatus in the illustrated embodiment moves the turning unit 3 up and down along the pair of guide rails 221 and 221 (in a direction perpendicular to a holding surface of a chuck table described later). A cutting feed mechanism 4 is provided. The cutting feed mechanism 4 includes a male screw rod 41 disposed on the front side of the upright wall 22 and extending substantially vertically. The male screw rod 41 is rotatably supported by bearing members 42 and 43 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and the output shaft of the pulse motor 44 is connected to the male screw rod 41 by transmission. A connecting portion (not shown) that protrudes rearward from the center portion in the width direction is also formed on the rear surface of the movable base 31, and a through female screw hole that extends in the vertical direction is formed in the connecting portion, The male screw rod 41 is screwed into the female screw hole. Therefore, when the pulse motor 44 rotates forward, the moving base 31, that is, the turning unit 3 is lowered or advanced, and when the pulse motor 44 reversely moves, the moving base 31, that is, the turning unit 3 is raised or retracted.

  1 and FIG. 3, a substantially rectangular machining work portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the machining work portion 211 includes a chuck table mechanism. 5 is disposed. The chuck table mechanism 5 includes a support base 51 and a disk-shaped chuck table 52 disposed on the support base 51 so as to be rotatable about a rotation center axis extending substantially vertically. The support base 51 slides on a pair of guide rails 23 and 23 extending in the direction indicated by the arrows 23a and 23b in the front-rear direction (the direction perpendicular to the front surface of the upright wall 22) on the processing work unit 211. The workpiece loading / unloading area 24 shown in FIG. 1 (position indicated by a solid line in FIG. 3) and the bite tool 33 constituting the spindle unit 32 are opposed to each other by a machining feed mechanism 56 described later. It is moved between the machining area 25 (position indicated by a two-dot chain line in FIG. 3).

Next, the chuck table 52 will be described.
The chuck table 52 in the illustrated embodiment is formed in a columnar shape by a metal material such as stainless steel, and is disposed on the support base 51. The holding surface, which is the upper surface of the chuck table 52, is provided with suction grooves 521 composed of a plurality of annular grooves formed concentrically. The suction groove 521 communicates with suction means (not shown). Accordingly, when a suction means (not shown) is operated, a negative pressure is applied to the suction groove 521, and the workpiece placed on the holding surface which is the upper surface of the chuck table 52 is sucked and held.

  3, the illustrated chuck table mechanism 5 includes a cover member 54 that has a hole through which the chuck table 52 is inserted and is movably disposed together with the support base 51 and the chuck table 52. I have.

  The chuck table mechanism 5 described above is disposed on the polishing area 25 side of the chuck table 52 adjacent to the chuck table 52 and acts on the cutting edge 332 of the cutting tool 33 and adheres to the cutting edge 332 of the cutting tool 33. A turning scrap removing means 6 is provided. Hereinafter, the scraped turning removal means 6 will be described with reference to FIG.

  The turning scrap removing means 6 in the illustrated embodiment includes a turned board 61 that is turned by the cutting edge 332 of the cutting tool 33, a board holding base 62 that holds the turned board 61, and the board holding base. 62 is provided with an action position where the cutting edge 332 of the cutting tool 33 turns the work board 61 and a board positioning means 63 located at a retracted position below the action position.

  The turning board 61 is formed in a rectangular shape in the embodiment shown in FIG. The turned board 61 is formed of, for example, a carbon plate or a copper plate having a length of 50 mm, a width of 30 mm, and a thickness of about 10 mm. The turning board 61 formed in this way is formed in a rectangular shape and sucked and held on the upper surface of the board holding base 62. That is, a plurality of suction holes (not shown) are provided on the upper surface of the board holding base 62 so as to communicate with suction means (not shown). Therefore, when a suction means (not shown) is operated, negative pressure acts on the plurality of suction holes, and the turned board 61 placed on the upper surface of the board holding base 62 is sucked and held. The turned board 61 may be adhered to the upper surface of the board holding base 62 with a bonding agent such as wax that melts at a temperature of 70 ° C., for example.

  The board positioning means 63 for positioning the board holding base 62 at the operation position and the retracted position described above includes a moving board 631 that supports the board holding base 62 and four guides that guide the movement of the moving board 631 in the vertical direction. Guide rods 632 (three are shown in FIG. 4) and lifting / lowering means 633 for moving the moving substrate 631 along the guide rods 632 are provided. The moving substrate 631 is formed in a rectangular shape, and four guided holes 631a (three are shown in FIG. 4) penetrating in the vertical direction are provided at the four corners. The movable substrate 631 is configured to be movable in the vertical direction along the guide rod 632 by inserting the four guided holes 631a through the four guide rods 632 provided on the support base 51. The The board holding base 62 is fixed to the upper surface of the movable substrate 631 configured in this manner by appropriate fixing means. The lifting / lowering means 633 for moving the moving substrate 631 along the guide rod 632 includes a pulse motor 633a disposed on the support base 51 and capable of normal / reverse rotation, and a screw mechanism 633b driven by the pulse motor 633a. When the pulse motor 633a is driven forward, the moving substrate 631 is raised, and when the pulse motor 633a is driven reversely, the moving substrate 631 is lowered. And the raising / lowering means 633 has the operation position above the upper surface of the workpiece W held on the chuck table 52 as shown in FIG. ), The upper surface of the to-be-turned board 61 is positioned at a retracted position near the upper surface of the chuck table 52 which is below the operation position.

  The turning board 61 and the board positioning means 63 configured as described above are disposed on the rear side of the chuck table 52, that is, on the polishing area 25 side. Then, the turned board 61 and the board holding base 62 are arranged so as to be positioned in a rectangular cutout 541 formed at the rear end of the cover member 54 as shown in FIG.

  Continuing the description with reference to FIG. 3, the machining apparatus in the illustrated embodiment moves the chuck table mechanism 5 along the pair of guide rails 23, 23 in the horizontal plane parallel to the holding surface of the chuck table 52. A machining feed mechanism 56 for moving in the machining feed direction indicated by 23a and 23b is provided. The processing feed mechanism 56 includes a male screw rod 561 that is disposed between the pair of guide rails 23, 23 and extends in parallel with the pair of guide rails 23, 23, and a servo motor 562 that rotationally drives the male screw rod 561. . The male screw rod 561 is screwed into a screw hole 511 provided in the support base 51, and the tip end portion thereof is rotatably supported by a bearing member 563 attached by connecting a pair of guide rails 23 and 23. ing. The servo motor 562 has a drive shaft connected to the base end of the male screw rod 561 by transmission. Accordingly, when the servo motor 562 rotates in the forward direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23a. When the servo motor 562 rotates in the reverse direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23b. It can be moved. The chuck table mechanism 5 that is moved in the direction indicated by the arrows 23a and 23b in this manner is selectively positioned in the workpiece loading / unloading area indicated by the solid line and the machining area indicated by the two-dot chain line in FIG. Further, the chuck table mechanism 5 is reciprocated in a machining feed direction indicated by arrows 23a and 23b over a predetermined range in the machining area.

  Returning to FIG. 1, the description will be continued. On the both sides in the moving direction of the support base 51 constituting the chuck table mechanism 5, the cross-sectional shape is a reverse channel shape, and the pair of guide rails 23, 23 and male screws Bellows means 71 and 72 covering the rod 561 and the servomotor 562 are attached. The bellows means 71 and 72 can be formed from any suitable material such as campus cloth. The front end of the bellows means 71 is fixed to the front wall of the processing unit 211, and the rear end is fixed to the front end surface of the cover member 54 of the chuck table mechanism 5. The front end of the bellows means 72 is fixed to the rear end surface of the cover member 54 of the chuck table mechanism 5, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the chuck table mechanism 5 is moved in the direction indicated by the arrow 23a, the bellows means 71 is expanded and the bellows means 72 is contracted, and when the chuck table mechanism 5 is moved in the direction indicated by the arrow 23b, the bellows means. 71 is contracted and the bellows means 72 is extended.

  The description will be continued based on FIG. 1. On the front half of the main portion 21 of the apparatus housing 2, a first cassette mounting portion 11 a, a second cassette mounting portion 12 a, and a workpiece temporary storage portion are provided. 13a and a cleaning unit 14a are provided. A first cassette 11 that accommodates a workpiece before processing is placed on the first cassette mounting portion 11a, and a workpiece after processing is accommodated on the second cassette mounting portion 12a. The second cassette 12 is placed. The workpiece temporary placement section 13a temporarily places a workpiece temporary placement means for temporarily placing the workpiece before being carried out from the first cassette 11 placed on the first cassette placement portion 11a. 13 is disposed. The cleaning unit 14a is provided with cleaning means 14 for cleaning the processed workpiece.

  A workpiece transfer means 15 is disposed between the first cassette mounting portion 11a and the second cassette mounting portion 12a. The workpiece conveying means 15 carries the workpiece before processing stored in the first cassette 11 placed on the first cassette placing portion 11 a to the workpiece temporary placing means 13. At the same time, the processed workpiece cleaned by the cleaning means 14 is transported to the second cassette 12 mounted on the second cassette mounting portion 12a. A workpiece carrying means 16 is disposed between the workpiece temporary placing portion 13a and the workpiece loading / unloading area 24. The workpiece carrying-in means 16 places the workpiece before processing placed on the workpiece temporary placing means 13 on the chuck table 52 of the chuck table mechanism 5 positioned in the workpiece carrying-in / out area 24. Transport. A workpiece unloading means 17 is disposed between the workpiece loading / unloading area 24 and the cleaning unit 14a. The workpiece unloading means 17 conveys the processed workpiece placed on the chuck table 52 positioned in the workpiece loading / unloading area 24 to the cleaning means 14.

  The workpiece before processing accommodated in the first cassette 11 includes a semiconductor wafer 10 having a plurality of devices 110 formed in a lattice shape on the surface as shown in FIG. A plurality of stud bumps (electrodes) 120 are formed on the surfaces of the plurality of devices 110 formed on the semiconductor wafer 10. The stud bumps (electrodes) 120 on the surface of each device 110 are thus formed, and the surface of the semiconductor wafer 10 is covered with an underfill material 130 made of a synthetic resin as shown in FIG. Is buried.

  The first cassette 11 containing the semiconductor wafer 10 as the workpiece is mounted on the first cassette mounting portion 11 a of the apparatus housing 2. When all the unprocessed semiconductor wafers 10 accommodated in the first cassette 11 placed on the first cassette placement portion 11a are carried out, a plurality of empty wafers 11 are replaced. A new cassette 11 containing the unprocessed semiconductor wafer 10 is manually mounted on the first cassette mounting portion 11a. On the other hand, when a predetermined number of processed semiconductor wafers 10 are loaded into the second cassette 12 mounted on the second cassette mounting portion 12a of the apparatus housing 2, the second cassette 12 is manually unloaded. Then, a new empty second cassette 12 is placed.

The processing apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described mainly with reference to FIG.
The unprocessed semiconductor wafer 10 as a workpiece accommodated in the first cassette 11 is conveyed by the vertical movement and advancing / retreating operation of the workpiece conveyance means 15 and placed on the workpiece temporary placement means 13. The semiconductor wafer 10 placed on the workpiece temporary placement means 13 is positioned in the workpiece loading / unloading area 24 by the turning operation of the workpiece loading means 16 after being centered here. It is placed on the chuck table 52 of the table mechanism 5. When the semiconductor wafer 10 is placed on the chuck table 52, the semiconductor wafer 10 placed on the holding surface which is the upper surface of the chuck table 52 is sucked and held by operating a suction means (not shown).

  When the semiconductor wafer 10 is sucked and held on the chuck table 52, the machining feed mechanism 56 (see FIG. 3) is operated to move the chuck table mechanism 5 in the direction indicated by the arrow 23a, and the chuck table holding the semiconductor wafer 10 is held. 52 is positioned in the machining area 25. When the chuck table 52 holding the semiconductor wafer 10 is positioned in the processing region 25 in this way, the underfill material 130 covered on the surface of the semiconductor wafer 10 is turned and formed on the surface of the semiconductor chip 110. A turning process of exposing a plurality of stud bumps (electrodes) 120 to the surface of the underfill material 130 is performed. At this time, the lifting / lowering means 633 positions the upper surface of the turned board 61 at a retracted position near the upper surface of the chuck table 52 as shown in FIG.

The turning process will be described with reference to FIG.
In the turning process, the rotary spindle 322 is driven to rotate, and the tool tool mounting member 324 to which the tool tool 33 is attached rotates in the direction indicated by the arrow in FIG. Then, the turning unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position. Next, when the turning width of the cutting edge 332 of the cutting tool 33 is 20 μm, for example, the chuck table 52 holding the semiconductor wafer 10 is fed to the right from the position indicated by the solid line in FIG. It moves to the position indicated by the two-dot chain line in FIG. As a result, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned by the cutting edge 332 of the cutting tool 33 rotating with the rotation of the cutting tool mounting member 324, and formed on the surface of the semiconductor device 110. A plurality of stud bumps (electrodes) 120 are turned, and the stud bumps (electrodes) 120 are exposed on the surface of the underfill material 130 coated on the surface of the semiconductor wafer 10 as shown in FIG.

  In the above turning process, if the underfill material 130 embedded with the (electrode) 120 formed on the surface of the semiconductor device 110 is turned by the bite tool 33, the underfill material 130 made of synthetic resin becomes viscous at a high temperature. When the turning process is continued, turning scraps adhere to the tip of the cutting edge 332 of the cutting tool 33. Thus, when turning scraps adhere to the tip of the cutting edge 332 of the cutting tool 33, there is a problem that the turning resistance increases and the wear of the cutting tool is promoted. In order to solve such a problem, in the above-described embodiment, for example, if one semiconductor wafer 10 is processed, the grinding dust adhering to the cutting edge 332 of the cutting tool 33 is removed.

  In order to remove the grinding waste adhering to the cutting edge 332 of the cutting tool 33, the turning waste removal means 6 disposed in the chuck table mechanism 5 by operating the machining feed mechanism 56 (see FIG. 3) is shown in FIG. Position it in the machining area. Then, the turning scrap removing means 6 drives the pulse motor 633a of the elevating means 633 in the normal direction so as to position the upper surface of the board to be turned 61 at the operation position shown in FIG. Next, the turning unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position. Then, the rotary spindle 322 is driven to rotate, and the tool tool mounting member 324 to which the tool tool 33 is attached is rotated at a rotational speed of, for example, 6000 rpm in the direction indicated by the arrow in FIG. From the position shown to the right, it moves to the position shown by the two-dot chain line in FIG. As a result, the cutting edge 332 of the cutting tool 33 that rotates with the rotation of the cutting tool mounting member 324 acts on the turning board 61, and the cutting board 61 is cut to cut the cutting tool 33 in the turning process. Grinding waste adhering to the blade 332 is removed. Thus, by removing the grinding waste adhering to the cutting edge 332 of the cutting tool 33, the grinding scrap is attached to the cutting edge 332 of the cutting tool 33 when the next semiconductor wafer 10 is processed. There is no increase in turning resistance, and wear of the bite tool is suppressed.

  As described above, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned, and a plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 are exposed to the surface of the underfill material 130. When the process is finished and the turning scrap removing process for removing the turning scrap attached to the cutting edge 332 of the cutting tool 33 is finished, the turning unit 3 is raised. Next, the chuck table 52 is moved in the direction indicated by the arrow 23b in FIG. 1 to be positioned in the workpiece loading / unloading area 24, and the suction holding of the turned semiconductor wafer 10 on the chuck table 52 is released. Then, the semiconductor wafer 10 whose suction and holding by the chuck table 52 is released is carried out by the workpiece carrying-out means 17 and conveyed to the cleaning means 14. The semiconductor wafer 10 conveyed to the cleaning means 14 is cleaned here. The semiconductor wafer 10 cleaned by the cleaning unit 14 is stored in a predetermined position of the second cassette 12 by the workpiece transfer unit 15.

Next, another embodiment of the turning scrap removing means 6 will be described with reference to FIG.
The turning scrap removing means 6a shown in FIG. 11 includes a turned board 61a turned by the cutting edge 332 of the cutting tool 33, a board holding base 62a for holding the turned board 61a, and the board holding base 62a. A pulse motor 64a serving as a rotating means for rotating the workpiece in a horizontal plane, and an operating position where the cutting edge 332 of the cutting tool 33 turns the workpiece board 61 and a board positioning means 63 positioned at a retracted position below the operating position. It has.

  The turned board 61a is formed in a circular shape in the embodiment shown in FIG. The turned board 61a is formed of, for example, a carbon plate or a copper plate having a diameter of about 50 mm and a thickness of about 10 mm. The turning board 61a formed in this way is formed in a circular shape and sucked and held on the upper surface of the board holding base 62a. That is, a plurality of suction holes (not shown) are provided on the upper surface of the board holding base 62a so as to communicate with suction means (not shown). Accordingly, when a suction means (not shown) is operated, negative pressure acts on the plurality of suction holes, and the turned board 61a placed on the upper surface of the board holding base 62a is sucked and held. The turned board 61a may be attached to the upper surface of the board holding base 62a with a bonding agent such as wax that melts at a temperature of 70 ° C., for example. The pulse motor 64a is disposed on the upper surface of the moving substrate 631 of the board positioning means 63, and rotates the circular board holding base 62a in a horizontal plane. Since the board positioning means 63 has the same configuration as the board positioning means 63 in the turning scrap removing means 6 shown in FIG. 4, the same members are denoted by the same reference numerals and description thereof is omitted.

The turning scrap removing means 6a configured as described above can be arranged at the same position as the turning scrap removing means 6 shown in FIG. Hereinafter, a turning scrap removing process performed using the turning scrap removing means 6a shown in FIG. 11 will be described with reference to FIG.
First, the machining feed mechanism 56 (see FIG. 3) is operated to move the turning scrap removing means 6 disposed in the chuck table mechanism 5 to the machining area, and as shown in FIG. The center P of the turned board 61a of 6a is positioned on the rotation locus of the cutting edge 332 of the cutting tool 33. Then, the turning scrap removing means 6 drives the pulse motor 633a of the elevating means 633 to rotate forward, and positions the upper surface of the board to be turned 61 at the operating position shown in FIG. Next, the turning unit 3 is lowered while rotating the rotating spindle 322 to rotate the cutting tool mounting member 324 to which the cutting tool 33 is attached in the direction indicated by the arrow in FIG. The cutting tool 33 is positioned at a predetermined cutting position. As a result, the cutting edge 332 of the cutting tool 33 rotating with the rotation of the cutting tool mounting member 324 acts on the turned board 61 to turn the turned board 61. In this turning process, the pulse motor 64a as the turning means is operated at a predetermined timing to rotate the turned board 61a intermittently at a predetermined angle. As a result, as shown in the enlarged view of FIG. 12B, the turning position 610 of the turned board 61a moves and the same portion is not turned. Therefore, the entire surface of the turning board 61a can be turned sequentially with the operation of the machining feed mechanism 56 (see FIG. 3) stopped at the position shown in FIG. Grinding debris adhering to the cutting edge 332 is removed.

Next, still another embodiment of the turning scrap removing means 6 will be described with reference to FIG.
The turning scrap removing means 6b in the embodiment shown in FIG. 13 has a turning board 61b corresponding to the turning board 61 of the turning scrap removal means 6 in the embodiment shown in FIG. Is formed by a carbon plate or a copper plate of about 10 mm. The turning board 61b is formed in a rectangular shape formed at the front end of the cover member 54 on the front side of the chuck table 52, that is, on the workpiece loading / unloading area 24 side (left side in FIGS. 13A and 13B). It arrange | positions so that it may be located in the notch part 541b.

As described above, by using the turning scrap removing means 6b, the turning scrap removing step can be performed alternately while performing the turning step.
That is, if the semiconductor wafer 10 is sucked and held on the chuck table 52 of the chuck table mechanism 5 positioned in the workpiece loading / unloading area 24 as described above, the processing feeding mechanism 56 (see FIG. 3) is operated. Then, the chuck table mechanism 5 is moved in the direction indicated by the arrow 23a, and the chuck table 52 holding the semiconductor wafer 10 is positioned in the processing area indicated by the solid line in FIG. Next, the rotary spindle 322 is driven to rotate, and the cutting tool mounting member 324 to which the cutting tool 33 is attached is rotated in the direction indicated by the arrow in FIG. Then, the turning unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position. Next, the chuck table mechanism 5 is moved rightward from the position shown in FIG. 13 (a) to the position shown in FIG. 13 (b) in the direction indicated by the arrow at a feed rate of 2 mm / second, for example. As a result, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned by the cutting edge 332 of the cutting tool 33 rotating with the rotation of the cutting tool mounting member 324, and formed on the surface of the semiconductor device 110. A plurality of stud bumps (electrodes) 120 are turned, and the stud bumps (electrodes) 120 are exposed on the surface of the underfill material 130 coated on the surface of the semiconductor wafer 10 as shown in FIG.

  When carrying out this turning process, the turning scrap removing means 6b drives the pulse motor 633a of the elevating means 633 shown in FIG. 4 to rotate forward so that the upper surface of the board 61 to be turned is the action shown in FIG. Position to position. As a result, the turned board 61b is turned each time the tool 33 is rotated once. As described above, in the embodiment shown in FIG. 13, the cutting tool 33 includes a turning process for turning the underfill material 130 coated on the surface of the semiconductor wafer 10, and turning the workpiece board 61 b. The turning scrap removing process for removing the grinding scrap adhering to the cutting edge 332 is alternately performed every time the cutting tool 33 rotates once. Accordingly, since the grinding waste adhering to the cutting edge 332 of the bite tool 33 is immediately removed, there is no increase in turning resistance due to the adhering of grinding debris to the cutting edge 332 of the bite tool 33, and wear of the bite tool is reduced. It is suppressed.

The perspective view of the processing apparatus provided with the bite tool comprised according to this invention. The perspective view of the turning unit with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. The perspective view which shows the chuck | zipper table mechanism with which the processing apparatus provided with the cutting tool shown in FIG. The perspective view of the turning waste removal means with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. Explanatory drawing which shows the state which positioned the to-be-turned board which comprises the turning waste removal means shown in FIG. 4 in the action position and the retracted position. The top view of the semiconductor wafer as a to-be-processed object. Sectional drawing which expands and shows the principal part of the semiconductor wafer shown in FIG. Explanatory drawing of the turning process by the processing apparatus provided with the cutting tool shown in FIG. Sectional drawing which expands and shows the principal part of the semiconductor wafer turned by the processing apparatus provided with the cutting tool shown in FIG. Explanatory drawing of the turning waste removal process implemented by the processing apparatus provided with the cutting tool shown in FIG. The perspective view which shows other embodiment of the turning scrap removal means with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. Explanatory drawing of the turning waste removal process implemented by the turning waste removal means shown in FIG. Explanatory drawing which shows other embodiment of the turning scrap removal means with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped.

Explanation of symbols

2: Device housing 3: Grinding unit 31: Moving base 32: Spindle unit 321: Spindle housing 322: Rotary spindle 323: Servo motor 324, 325: Tool mounting member 33: Tool tool 331: Tool body 332: Cutting blade 4: Turning unit feeding mechanism 5: Chuck table mechanism 51: Support base 52: Chuck table 56: Work feeding mechanism 6, 6a, 6b: Turning scrap removing means 61, 61a, 61b: Turning board 62, 62a: Board holding base 63: Board positioning means 64a: Pulse motor 11: First cassette 12: Second cassette 13: Workpiece temporary placing means 14: Cleaning means 15: Workpiece conveying means 16: Workpiece carrying means 17: Workpiece Workpiece unloading means 10: Semiconductor wafer 110: Semiconductor chip 111: Electrode plate 120: Bump (electrode)
130: Underfill material

Claims (3)

A chuck table having a holding surface for holding a workpiece, a turning means having a bite tool for turning the workpiece held on the chuck table, and holding the chuck table and the turning means A machining feed mechanism that relatively moves in a machining feed direction in a horizontal plane parallel to the surface, and a cutting feed mechanism that moves the turning means in a direction perpendicular to the holding surface, and the turning means includes a rotating spindle and In a machining apparatus provided with a bite tool, comprising a bite tool mounting member mounted on the lower end of the rotary spindle and a bite tool mounted on the bite tool mounting member at a position eccentric from the rotation axis.
Comprising turning turning removal means for acting on the cutting edge of the cutting tool and removing the turning scrap attached to the cutting edge of the cutting tool;
The turning scrap removing means is provided adjacent to the chuck table, and provided with a turning board that moves in the machining feed direction together with the chuck table, and the cutting edge of the cutting tool turns the turning board. By removing turning scraps adhering to the cutting edge of the bite tool,
A processing apparatus having a bite tool characterized by the above.   The turning scrap removing means includes a board holding base for holding the turned board, an operating position where the cutting edge of the bite tool turns the turned board, and a retracted position below the operating position. The processing apparatus with a bite tool according to claim 1, further comprising board positioning means for positioning. The processing apparatus with a bite tool according to claim 2 , wherein the turning scrap removing means includes a turning means for turning the board holding base in a horizontal plane.

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