JP2010005721A - Machining device with bite tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a machining device including a bite tool capable of preventing lathe-turning chips from attaching to a cutting edge. <P>SOLUTION: The machining device with the bite tool includes a chuck table having a holding surface for holding a workpiece, and a lathe-turning means with a bite tool for lathe-turning the workpiece carried on the chuck table. It includes a workpiece cooling means for cooling the workpiece carried on the holding surface of the chuck table. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a processing apparatus including a bite tool for turning a workpiece held on a chuck table having a holding surface for holding the workpiece.

A semiconductor wafer in which a plurality of semiconductor devices are formed in a lattice shape is divided into individual semiconductor devices by a dicing apparatus or the like, and the divided semiconductor devices are widely used in electric devices such as mobile phones and personal computers.
2. Description of the Related Art In recent years, in order to reduce the weight and size of electrical equipment, a stacked device configured so that semiconductor devices can be stacked has been developed. In this laminated device, bumps (electrodes) of 50 to 100 μm are formed on the surface of a semiconductor device, and the bumps are embedded with an underfill material made of a synthetic resin such as epoxy resin or benzocyclobutene (BCB). Thereafter, the bumps of the stacked devices are configured to be connectable by exposing the bumps to the surface of the underfill material.

A method of exposing the bumps to the surface of the underfill material in which the bumps formed on the surface of the semiconductor device are embedded is disclosed in Patent Document 1 below. The method disclosed in Patent Document 1 is a method in which a bump is exposed to the surface of the underfill material by turning the underfill material in which the bump formed on the surface of the semiconductor device is embedded with a bite tool.
JP 2001-53097 A

  Therefore, if the underfill material with embedded bumps formed on the surface of the semiconductor device is turned with a bite tool, the underfill material made of synthetic resin will increase in viscosity at high temperatures. There is a problem that turning scraps adhere, turning resistance increases, and wear of the bite tool is promoted.

  This invention is made | formed in view of the said fact, The main technical subject is to provide the processing apparatus provided with the cutting tool which can prevent that turning waste adheres to a cutting blade.

In order to solve the above main technical problem, according to the present invention, a chuck table having a holding surface for holding a workpiece and a bite tool for turning the workpiece held on the chuck table are provided. In a processing apparatus provided with a turning tool,
A workpiece cooling means for cooling the workpiece held on the holding surface of the chuck table;
There is provided a machining apparatus provided with a cutting tool characterized by the above.

The workpiece cooling means includes a cooling medium flow path provided along the holding surface below the holding surface of the chuck table, and a cooling medium supply means for supplying the cooling medium to the cooling medium flow path. Yes.
The workpiece cooling means includes an annular water tank provided so as to surround the holding surface of the chuck table, and a water supply means for supplying water to the water tank.
In addition, it is desirable to provide a tool cutting tool for cooling the tool.

  Since the processing apparatus according to the present invention includes the workpiece cooling means for cooling the workpiece held on the holding surface of the chuck table, the bite tool for turning the workpiece is effectively cooled. Therefore, adhesion of turning scraps to the cutting edge of the cutting tool is suppressed. Accordingly, an increase in the turning resistance caused by turning scraps adhering to the cutting edge of the cutting tool can be suppressed, so that wear of the cutting edge of the cutting tool is suppressed.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a processing apparatus having a cutting tool constructed according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a machining apparatus having a bite tool constructed according to the present invention.
The processing apparatus in the illustrated embodiment includes an apparatus housing denoted as a whole by the number 2. The apparatus housing 2 includes a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at a rear end portion (upper right end in FIG. 1) of the main portion 21 and extends substantially vertically upward. Yes. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. A turning unit 3 as a turning means is mounted on the pair of guide rails 221 and 221 so as to be movable in the vertical direction.

  The turning unit 3 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. A support member 313 is mounted on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22 as described above, and the spindle unit 32 is attached to the support member 313. It is done.

  The spindle unit 32 includes a spindle housing 321 mounted on a support member 313, a rotating spindle 322 rotatably disposed on the spindle housing 321, and a servo motor as a drive source for rotationally driving the rotating spindle 322. 323. The lower end of the rotary spindle 322 protrudes downward beyond the lower end of the spindle housing 321, and a disk-shaped tool tool mounting member 324 is provided at the lower end. The tool tool 33 is detachably mounted on the tool tool mounting member 324.

Here, the attachment / detachment structure of the cutting tool 33 to the cutting tool mounting member 324 will be described with reference to FIG.
The tool tool mounting member 324 is provided with a tool mounting hole 324a penetrating in a vertical direction in a part of the outer peripheral portion, and a female screw hole reaching the tool mounting hole 324a from an outer peripheral surface corresponding to the tool mounting hole 324a. 324b is provided. The bite tool 33 is inserted into the bite mounting hole 324a of the bite tool mounting member 324 having the above-described configuration, and the tightening bolt 330 is screwed into the female screw hole 324b to be tightened. Removably attached to the. In the illustrated embodiment, the cutting tool 33 is composed of a cutting tool body 331 formed in a rod shape with tool steel such as super steel alloy, and a cutting blade formed of diamond or the like provided at the tip of the cutting tool body 331. 332 is used. The tool tool 33 configured as described above and mounted on the tool tool mounting member 324 rotates in a plane parallel to a holding surface for holding a workpiece of a chuck table, which will be described later, by rotating the rotary spindle 322. I'm damned.

  Referring back to FIG. 1, the machining apparatus in the illustrated embodiment moves the turning unit 3 up and down along the pair of guide rails 221 and 221 (in a direction perpendicular to a holding surface of a chuck table described later). A turning unit feed mechanism 4 is provided. The turning unit feed mechanism 4 includes a male screw rod 41 disposed on the front side of the upright wall 22 and extending substantially vertically. The male screw rod 41 is rotatably supported by bearing members 42 and 43 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and the output shaft of the pulse motor 44 is connected to the male screw rod 41 by transmission. A connecting portion (not shown) that protrudes rearward from the center portion in the width direction is also formed on the rear surface of the movable base 31, and a through female screw hole that extends in the vertical direction is formed in the connecting portion, The male screw rod 41 is screwed into the female screw hole. Accordingly, when the pulse motor 44 is rotated forward, the moving base 31, that is, the turning unit 3 is lowered or moved forward, and when the pulse motor 44 is rotated reversely, the moving base 31, that is, the turning unit 3 is raised or moved backward.

  1 and FIG. 3, a substantially rectangular machining work portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the machining work portion 211 includes a chuck table mechanism. 7 is disposed. The chuck table mechanism 5 includes a support base 51 and a disk-shaped chuck table 52 disposed on the support base 51 so as to be rotatable about a rotation center axis extending substantially vertically. The support base 51 slides on a pair of guide rails 23 and 23 extending in the direction indicated by the arrows 23a and 23b in the front-rear direction (the direction perpendicular to the front surface of the upright wall 22) on the processing work unit 211. The workpiece loading / unloading area 24 shown in FIG. 1 (position indicated by a solid line in FIG. 3) and the tool tool 33 constituting the spindle unit 32 are opposed to each other by a chuck table moving mechanism 56 described later. And the machining area 25 to be moved (position indicated by a two-dot chain line in FIG. 3).

Next, the chuck table 52 will be described with reference to FIG.
The chuck table 52 in the illustrated embodiment is formed in a columnar shape by a metal material such as stainless steel, and is disposed on the support base 51. The holding surface, which is the upper surface of the chuck table 52, is provided with suction grooves 521 composed of a plurality of annular grooves formed concentrically. The suction groove 521 is connected to the suction means 523 through the suction passage 522. The suction means 523 includes a suction source 523a, a pipe 523b connecting the suction source 523a and the suction passage 522, and an electromagnetic opening / closing valve 523c disposed in the pipe 523b. The electromagnetic opening / closing valve 523c is closed when de-energized (OFF), and is opened when energized (ON). Therefore, when the electromagnetic opening / closing valve 523c is energized (ON), negative pressure is applied to the suction groove 521 via the pipe 523b and the suction passage 522, and the object mounted on the holding surface, which is the upper surface of the chuck table 52, is applied. The workpiece is sucked and held.

  Continuing with reference to FIG. 4, the chuck table 52 in the illustrated embodiment is configured with a workpiece cooling means for cooling the workpiece held on the holding surface which is the upper surface of the chuck table 52. A cooling medium flow passage 524 is formed. The cooling medium flow passage 524 is provided along the holding surface below the suction groove 521 and is formed in a spiral shape. The cooling medium flow passage 524 thus formed in a spiral shape has a central portion communicating with the introduction passage 525 and an outer peripheral end communicating with the discharge passage 526. The introduction passage 525 and the discharge passage 526 are connected to the cooling medium supply means 527. The cooling medium supply means 527 includes a cooling medium supply source 527a, a supply pipe 527b connecting the cooling medium supply source 527a and the introduction passage 525, an electromagnetic on-off valve 527c disposed in the supply pipe 527b, and a cooling medium. The return pipe 527d connects the supply source 527a and the discharge passage 526. The electromagnetic on-off valve 527c is closed when de-energized (OFF), and is opened when energized (ON). Therefore, when the electromagnetic opening / closing valve 527c is energized (ON), the cooling medium is supplied from the cooling medium supply source 527a via the supply pipe 527b, the introduction passage 525, the cooling medium flow passage 524, and the discharge passage 526. It is circulated in. As a result, the chuck table 52 is cooled, so that the workpiece held on the holding surface which is the upper surface of the chuck table 52 is cooled. The temperature of the cooling medium supplied from the cooling medium supply source 527a is preferably 5 ° C. or lower.

  Referring back to FIG. 3, the illustrated chuck table mechanism 5 includes a cover member 54 having a hole through which the chuck table 52 is inserted and movably disposed together with the support base 51 and the chuck table 52. ing.

  The machining apparatus in the illustrated embodiment includes a chuck table moving mechanism 56 that moves the chuck table mechanism 5 along the pair of guide rails 23 and 23 in the directions indicated by the arrows 23a and 23b. The chuck table moving mechanism 56 includes a male screw rod 561 disposed between the pair of guide rails 23, 23 and extending in parallel with the pair of guide rails 23, 23, and a servo motor 562 that rotationally drives the male screw rod 561. Yes. The male screw rod 561 is screwed into a screw hole 511 provided in the support base 51, and the tip end portion thereof is rotatably supported by a bearing member 563 attached by connecting a pair of guide rails 23 and 23. ing. The servo motor 562 has a drive shaft connected to the base end of the male screw rod 561 by transmission. Accordingly, when the servo motor 562 rotates in the forward direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23a. When the servo motor 562 rotates in the reverse direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23b. It can be moved. The chuck table mechanism 5 that is moved in the direction indicated by the arrows 23a and 23b in this manner is selectively positioned in the workpiece loading / unloading area indicated by the solid line and the machining area indicated by the two-dot chain line in FIG. Further, the chuck table mechanism 5 is reciprocated in a direction indicated by arrows 23a and 23b over a predetermined range in the machining area.

  Returning to FIG. 1, the description will be continued. On the both sides in the moving direction of the support base 51 constituting the chuck table mechanism 5, the cross-sectional shape is a reverse channel shape, and the pair of guide rails 23, 23 and male screws Bellows means 61 and 62 are attached to cover the rod 561, the servo motor 562, and the like. The bellows means 61 and 62 can be formed from any suitable material such as campus cloth. The front end of the bellows means 61 is fixed to the front wall of the processing unit 211, and the rear end is fixed to the front end surface of the cover member 54 of the chuck table mechanism 5. The front end of the bellows means 62 is fixed to the rear end surface of the cover member 54 of the chuck table mechanism 5, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the chuck table mechanism 5 is moved in the direction indicated by the arrow 23a, the bellows means 61 is expanded and the bellows means 62 is contracted, and when the chuck table mechanism 5 is moved in the direction indicated by the arrow 23b, the bellows means. 61 is contracted and the bellows means 62 is extended.

  The machining apparatus in the illustrated embodiment includes a bite cooling means 7 disposed on the side of the machining area in the main portion 21 of the apparatus housing 2 for cooling the bite tool 33. The cutting tool cooling means 7 includes a nozzle 71 that ejects a cooling fluid such as cooling air or cooling water toward the cutting tool 33 and a cooling fluid supply means (not shown) connected to the nozzle 71. The temperature of the cooling fluid supplied by a cooling fluid supply means (not shown) is preferably 5 ° C. or lower.

  The description will be continued based on FIG. 1. On the front half of the main portion 21 of the apparatus housing 2, a first cassette mounting portion 11 a, a second cassette mounting portion 12 a, and a workpiece temporary storage portion are provided. 13a and a cleaning unit 14a are provided. A first cassette 11 that accommodates a workpiece before processing is placed on the first cassette mounting portion 11a, and a workpiece after processing is accommodated on the second cassette mounting portion 12a. The second cassette 12 is placed. The workpiece temporary placement section 13a temporarily places a workpiece temporary placement means for temporarily placing the workpiece before being carried out from the first cassette 11 placed on the first cassette placement portion 11a. 13 is disposed. The cleaning unit 14a is provided with cleaning means 14 for cleaning the processed workpiece.

  A workpiece transfer means 15 is disposed between the first cassette mounting portion 11a and the second cassette mounting portion 12a. The workpiece conveying means 15 carries the workpiece before processing stored in the first cassette 11 placed on the first cassette placing portion 11 a to the workpiece temporary placing means 13. At the same time, the processed workpiece cleaned by the cleaning means 14 is transported to the second cassette 12 mounted on the second cassette mounting portion 12a. A workpiece carrying means 16 is disposed between the workpiece temporary placing portion 13a and the workpiece loading / unloading area 24. The workpiece carrying-in means 16 places the workpiece before processing placed on the workpiece temporary placing means 13 on the chuck table 72 of the chuck table mechanism 7 positioned in the workpiece carrying-in / out area 24. Transport. A workpiece unloading means 17 is disposed between the workpiece loading / unloading area 24 and the cleaning unit 14a. The workpiece unloading means 17 conveys the processed workpiece placed on the chuck table 52 positioned in the workpiece loading / unloading area 24 to the cleaning means 14.

  The workpiece before processing accommodated in the first cassette 11 includes a semiconductor wafer 10 in which a plurality of devices 110 are formed in a lattice shape on the surface as shown in FIG. A plurality of stud bumps (electrodes) 120 are formed on the surfaces of the plurality of devices 110 formed on the semiconductor wafer 10. In this way, the stud bump (electrode) 120 on the surface of each device 110 is formed, and the surface of the semiconductor wafer 10 is covered with an underfill material 130 made of a synthetic resin as shown in FIG. Is buried.

  The first cassette 11 containing the semiconductor wafer 10 as the workpiece is mounted on the first cassette mounting portion 11 a of the apparatus housing 2. When all the unprocessed semiconductor wafers 10 accommodated in the first cassette 11 placed on the first cassette placement portion 11a are carried out, a plurality of empty wafers 11 are replaced. A new cassette 11 containing the unprocessed semiconductor wafer 10 is manually mounted on the first cassette mounting portion 11a. On the other hand, when a predetermined number of processed semiconductor wafers 10 are loaded into the second cassette 12 mounted on the second cassette mounting portion 12a of the apparatus housing 2, the second cassette 12 is manually unloaded. Then, a new empty second cassette 12 is placed.

The processing apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described mainly with reference to FIG.
The unprocessed semiconductor wafer 10 as a workpiece accommodated in the first cassette 11 is conveyed by the vertical movement and advancing / retreating operation of the workpiece conveyance means 15 and placed on the workpiece temporary placement means 13. The semiconductor wafer 10 placed on the workpiece temporary placement means 13 is positioned in the workpiece loading / unloading area 24 by the turning operation of the workpiece loading means 16 after being centered here. It is placed on the chuck table 52 of the table mechanism 5. When the semiconductor wafer 10 is placed on the chuck table 52, the electromagnetic on-off valve 523c of the suction means 523 shown in FIG. 4 is energized (ON) to open the circuit. As a result, as described above, negative pressure acts on the suction groove 521 from the suction source 523a via the pipe 523b and the suction passage 522, and the semiconductor wafer 10 placed on the holding surface which is the upper surface of the chuck table 52 is sucked and held. Is done.

  If the semiconductor wafer 10 is sucked and held on the chuck table 52, the chuck table moving mechanism 56 (see FIG. 3) is operated to move the chuck table mechanism 5 in the direction indicated by the arrow 23a, and the chuck holding the semiconductor wafer 10 is held. The table 52 is positioned in the machining area 25. When the chuck table 72 holding the semiconductor wafer 10 is positioned in the processing region 25 in this way, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned and formed on the surface of the semiconductor chip 110. A turning process of exposing a plurality of stud bumps (electrodes) 120 to the surface of the underfill material 130 is performed.

The turning process will be described with reference to FIG.
In the turning process, the rotary spindle 322 is driven to rotate, and the tool tool mounting member 324 to which the tool tool 33 is attached rotates in the direction indicated by the arrow in FIG. Then, the turning unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position. Next, when the turning width of the cutting edge 332 of the cutting tool 33 is 20 μm, for example, the chuck table 52 holding the semiconductor wafer 10 is fed to the right from the position indicated by the solid line in FIG. Move at speed. As a result, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned by the cutting edge 332 of the cutting tool 33 that rotates with the rotation of the cutting tool mounting member 324 and formed on the surface of the semiconductor chip 110. A plurality of stud bumps (electrodes) 120 are turned, and the stud bumps (electrodes) 120 are exposed on the surface of the underfill material 130 coated on the surface of the semiconductor wafer 10 as shown in FIG.

  In the turning process, the electromagnetic on-off valve 527c of the cooling medium supply means 527 constituting the workpiece cooling means shown in FIG. 4 is energized (ON) to open the circuit. When the electromagnetic on-off valve 527c is opened, the cooling medium is circulated from the cooling medium source 527a to the cooling medium source 527a through the supply pipe 527b, the introduction passage 525, the cooling medium flow passage 524, and the discharge passage 526 as described above. The chuck table 52 is cooled, and the semiconductor wafer 10 held on the holding surface which is the upper surface of the chuck table 52 is cooled. As a result, since the cutting tool 33 for turning the underfill material 130 coated on the surface of the semiconductor wafer 10 is effectively cooled, adhesion of turning scraps to the cutting edge 332 of the cutting tool 33 is suppressed. Therefore, since the increase in turning resistance caused by turning scraps adhering to the cutting edge 332 of the cutting tool 33 can be suppressed, wear of the cutting edge 332 of the cutting tool 33 is suppressed. In addition, since the underfill material 130 made of a synthetic resin that is turned by the cutting tool 33 is also cooled, the viscosity is lowered and the adhesion to the cutting edge 332 of the cutting tool 33 is further suppressed.

  Further, in the turning process described above, the cutting tool cooling means 7 is operated to discharge a cooling fluid such as cooling air or cooling water from the nozzle 71 toward the cutting tool 33. As a result, the cutting tool 33 is further cooled, and the underfill material 130 coated on the surface of the semiconductor wafer 10 is also cooled, so that the attachment of turning scraps to the cutting edge 332 of the cutting tool 33 is further suppressed. . Therefore, since the increase in turning resistance caused by turning scraps adhering to the cutting edge 332 of the cutting tool 33 can be further suppressed, wear of the cutting edge 332 of the cutting tool 33 is further suppressed.

  As described above, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned, and a plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 are exposed to the surface of the underfill material 130. When the process is finished, the turning unit 3 is raised. Next, the chuck table 52 is moved in the direction indicated by the arrow 23b in FIG. 1 to be positioned in the workpiece loading / unloading area 24, and the suction holding of the turned semiconductor wafer 10 on the chuck table 52 is released. Then, the semiconductor wafer 10 whose suction and holding by the chuck table 52 is released is carried out by the workpiece carrying-out means 17 and conveyed to the cleaning means 14. The semiconductor wafer 10 conveyed to the cleaning means 14 is cleaned here. The semiconductor wafer 10 cleaned by the cleaning unit 14 is stored in a predetermined position of the second cassette 12 by the workpiece transfer unit 15.

Next, another embodiment of the workpiece cooling means for cooling the workpiece held on the holding surface of the chuck table will be described with reference to FIG.
The chuck table 52 shown in FIG. 9 is formed in a columnar shape by a metal material such as stainless steel like the chuck table 52 shown in FIG. 4, and the chuck table 52 shown in FIG. Similarly, a suction groove 521 comprising a plurality of annular grooves formed concentrically is provided. The suction groove 521 is connected to the suction means 523 through the suction passage 522. The suction means 523 includes a suction source 523a, a pipe 523b connecting the suction source 523a and the suction passage 522, and an electromagnetic opening / closing valve 523c disposed in the pipe 523b, similarly to the suction means 523 shown in FIG. It has become. The electromagnetic opening / closing valve 523c is closed when de-energized (OFF), and is opened when energized (ON). Therefore, when the electromagnetic opening / closing valve 523c is energized (ON), negative pressure is applied to the suction groove 521 via the pipe 523b and the suction passage 522, and the object mounted on the holding surface, which is the upper surface of the chuck table 52, is applied. The semiconductor wafer 10 as a workpiece is sucked and held.

  The chuck table 52 shown in FIG. 9 includes an annular water tank 528 provided surrounding a holding surface on which the suction grooves 521 including the plurality of annular grooves are formed. The upper surface of the outer peripheral portion 52a of the chuck table that forms the outer peripheral wall of the annular water tank 528 is formed higher than the holding surface on which the suction groove 521 is formed so that the cutting edge 332 of the cutting tool 33 does not interfere. Yes. The water tank 528 is connected to the water supply means 520 through the water supply passage 529. The water supply means 520 includes a water supply source 520a, a pipe 520b connecting the water supply source 520a and the water supply passage 529, and an electromagnetic opening / closing valve 520c disposed in the pipe 520b. The electromagnetic open / close valve 520c is closed when de-energized (OFF), and is opened when energized (ON). Therefore, when the electromagnetic on-off valve 520c is energized (ON), water is supplied from the water supply source 520a to the water tank 528 via the pipe 520b and the water supply passage 529. The water supplied to the water tank 528 forms a water layer on the surface of the semiconductor wafer 10 as a workpiece held by the chuck table 52 by surface tension as indicated by a two-dotted line in FIG. Therefore, the semiconductor wafer 10 as a workpiece can be effectively cooled. When the semiconductor wafer 10 as a workpiece is held on the chuck table 52 configured as described above and the turning process described above is performed, the cutting edge 332 of the cutting tool 33 forms a layer of water formed on the surface of the semiconductor wafer 10. Therefore, the cutting tool 33 is cooled more effectively. The temperature of the water supplied by the water supply means 520 is preferably 5 ° C. or lower.

The perspective view of the processing apparatus provided with the bite tool comprised according to this invention. The perspective view of the turning unit with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. The perspective view which shows the chuck table mechanism and chuck table moving mechanism with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. Explanatory drawing which fractures | ruptures and shows the principal part of the workpiece cooling means with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. The top view of the semiconductor wafer as a to-be-processed object. Sectional drawing which expands and shows the principal part of the semiconductor wafer shown in FIG. Explanatory drawing of the turning process by the processing apparatus provided with the cutting tool shown in FIG. Sectional drawing which expands and shows the principal part of the semiconductor wafer turned by the processing apparatus provided with the cutting tool shown in FIG. Explanatory drawing which fractures | ruptures and shows the principal part of other embodiment of the workpiece cooling means with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped.

Explanation of symbols

2: Device housing 3: Grinding unit 31: Moving base 32: Spindle unit 321: Spindle housing 322: Rotary spindle 323: Servo motor 324, 325: Tool mounting member 33: Tool tool 331: Tool body 332: Cutting blade 4: Turning unit feed mechanism 5: chuck table mechanism 51: support base 52: chuck table 521: suction groove 523: suction means 524: cooling medium flow path 527: cooling medium supply means 528: annular water tank 520: water supply means 56: chuck Table moving mechanism 7: Tool cooling means 71: Nozzle 11: First cassette 12: Second cassette 13: Temporary workpiece placing means 14: Cleaning means 15: Workpiece conveying means 16: Workpiece carrying means 17 : Workpiece unloading means 10: Semiconductor wafer 110: Conductor chip 111: Electrode plate 120: bump (electrode)
130: Underfill material

Claims (4)

In a processing apparatus provided with a biting tool, comprising a chuck table having a holding surface for holding a workpiece, and a turning means having a biting tool for turning the workpiece held on the chuck table. ,
A workpiece cooling means for cooling the workpiece held on the holding surface of the chuck table;
A processing apparatus having a bite tool characterized by the above.   The workpiece cooling means includes a cooling medium flow path provided along the holding surface below the holding surface of the chuck table, and a cooling medium supply means for supplying a cooling medium to the cooling medium flow path. A processing apparatus comprising the cutting tool according to claim 1, comprising:   The bite tool according to claim 1, wherein the workpiece cooling means includes an annular water tank provided to surround the holding surface of the chuck table, and a water supply means for supplying water to the water tank. Processing equipment provided.   The processing apparatus provided with the cutting tool according to any one of claims 1 to 3, further comprising a cutting tool cooling means for cooling the cutting tool.

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