JP2005340324A - Method of processing chuck table in processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of processing a chuck table in a processing apparatus wherein a distance between the holding surface of the chuck table and a cutting tool can be unified over the entire region of the holding surface. <P>SOLUTION: The processing apparatus comprises the chuck table having the holding surface for holding a plate-like object, a chuck table moving mechanism for moving the chuck table, a cutting unit containing the cutting tool for cutting and truing up heights of a plurality of electrodes formed in a projecting state on the surface of a plate-like object held by the chuck table, and a cutting unit feeding mechanism for making back and forth the movement of the cutting unit in a direction perpendicular to the holding surface of the chuck table. In processing the chuck table in the processing apparatus, the chuck table is moved to a processing area, and then the holding surface of the chuck table is cut by the cutting unit. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a processing method for a chuck table that holds a plate-like object in a processing apparatus that aligns the heights of a plurality of electrodes formed to protrude from the surface of the plate-like object such as a semiconductor chip.

A semiconductor wafer in which a plurality of semiconductor chips are formed is divided into individual semiconductor chips by a dicing apparatus or the like, and the divided semiconductor chips are widely used in electric devices such as mobile phones and personal computers.
In recent years, in order to reduce the weight and size of electrical equipment, a bump having a protrusion of 50 to 100 μm is formed on an electrode of a semiconductor chip, and this bump is directly bonded to an electrode formed on a mounting substrate. A semiconductor chip called a flip chip has been developed and put into practical use. In addition, a technique for reducing the size by mounting a plurality of semiconductor chips on a substrate called an interposer or stacking them has been developed and put into practical use.

  However, each of the above-described technologies forms a plurality of protruding bumps (electrodes) on the surface of a substrate such as a semiconductor chip and bonds the substrates to each other via the protruding electrodes. ) Must be the same height. In order to make the height of the bumps (electrodes) in a protruding shape, grinding is generally used. However, when the bump (electrode) is ground, if the bump (electrode) is formed of a sticky metal such as gold, a burr is generated, and this burr is short-circuited to the adjacent bump (electrode). is there.

As a technique for forming a plurality of bumps (electrodes) on the surface of a substrate such as a semiconductor chip, a ball is formed by heating and melting the tip of a wire such as gold, and the ball is then applied to the electrode of the semiconductor chip. There is a method of forming a stud bump in which the head of the ball is broken by thermocompression bonding with ultrasonic waves. Bumps (electrodes) formed by this stud bump formation method are difficult to polish because needle-shaped wrinkles are generated when the head of a thermocompressed ball is broken, and a heated plate is used as a bump. The bumps are pressed to align the height of the bumps. (For example, refer to Patent Document 1.)
JP 2001-53097 A

  However, when the heated plate is pressed against the bumps so that the bumps have the same height, there is a problem that the bumps are short-circuited with adjacent bumps when the bump heads are crushed. In order to solve this problem, in the invention described in the above publication, an extra step of removing the tip of the bump is provided.

  In order to solve the above-described problems, the present applicant has proposed as a Japanese Patent Application No. 2003-110536 a processing apparatus that removes the tip portions of a plurality of electrodes formed on the surface of a plate-like object by cutting.

  Thus, if the holding surface of the chuck table has waviness and the distance between the holding surface and the cutting tool is not uniform over the entire area of the mounting surface, the surface of the plate-like object held by the chuck table Even if a plurality of electrodes formed so as to protrude are cut, a step is generated in the height of the electrodes, and it cannot be made uniform.

  The present invention has been made in view of the above-mentioned fact, and the main technical problem thereof is a chuck table in a processing apparatus that can make the distance between the holding surface of the chuck table and the cutting tool uniform over the entire area of the holding surface. It is in providing the processing method of.

In order to solve the main technical problem, according to the present invention, a chuck table configured to be movable between a workpiece loading / unloading zone and a machining zone and having a holding surface for holding a plate-like object, A chuck table moving mechanism for moving the chuck table to the workpiece loading / unloading zone and the machining zone, and a plurality of electrodes disposed in the machining zone and protruding from the surface of the plate-like object held by the chuck table Machining of a chuck table in a machining apparatus comprising: a cutting unit provided with a cutting tool that cuts the height of the chuck table and a cutting unit feed mechanism that advances and retracts the cutting unit in a direction perpendicular to the holding surface of the chuck table A method,
Moving the chuck table to the processing area, and cutting the holding surface of the chuck table with the cutting tool of the cutting unit;
There is provided a method for processing a chuck table in a processing apparatus.

  The cutting unit includes a spindle unit having a tool mounting member on which a cutting tool is mounted and rotated, and the chuck table is moved relative to the tool mounting member while rotating the tool mounting member on which the cutting tool is mounted. By doing so, the holding surface of the chuck table is cut with a cutting tool. The cutting unit includes tilt adjusting means for adjusting the tilt of the spindle unit, and the tool mounting member is configured to be detachably mounted with a distance detecting means for detecting a distance from the holding surface of the chuck table. The interval detection means is mounted on the tool mounting member, and the parallelism between the rotation trajectory of the cutting edge of the cutting tool mounted on the tool mounting member and the holding surface is detected by detecting the distance from a plurality of locations on the holding surface of the chuck table. The step of adjusting the tilt adjusting means so that the rotation trajectory of the cutting edge of the cutting tool and the holding surface are parallel based on the calculated parallelism is obtained by cutting the holding surface of the chuck table with the cutting tool of the cutting unit. Before you do it.

  The chuck table is configured to be rotatable, and the holding surface of the chuck table is cut by the cutting tool by rotating relative to the cutting tool mounted on the tool mounting member while rotating the chuck table.

  In the processing method of the chuck table in the processing apparatus according to the present invention, since the holding surface of the chuck table is cut by the cutting tool of the cutting unit, the distance between the holding surface of the chuck table and the cutting tool is extended over the entire area of the holding surface. Can be uniform.

  Hereinafter, a preferred embodiment of a chuck table processing method in a processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a processing apparatus for carrying out the chuck table processing method according to the present invention.
The processing apparatus in the illustrated embodiment includes an apparatus housing denoted as a whole by the number 2. The apparatus housing 2 includes a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at a rear end portion (upper right end in FIG. 1) of the main portion 21 and extends substantially vertically upward. Yes. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. The cutting unit 3 is mounted on the pair of guide rails 221 and 221 so as to be movable in the vertical direction.

  The cutting unit 3 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. A support member 313 is mounted on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22, and the spindle unit 32 is attached to the support member 313. It is done.

  The spindle unit 32 includes a spindle housing 321 mounted on a support member 313, a rotating spindle 322 rotatably disposed on the spindle housing 321, and a servo motor as a drive source for rotationally driving the rotating spindle 322. 323. The lower end of the rotary spindle 322 protrudes downward beyond the lower end of the spindle housing 321, and a disk-shaped tool mounting member 324 is provided at the lower end. A cutting tool 33 as a cutting tool is detachably mounted on the tool mounting member 324.

Here, the attachment / detachment structure of the cutting tool 33 to the tool mounting member 324 will be described with reference to FIG.
The tool mounting member 324 is provided with a cutting tool mounting hole 324a penetrating in a vertical direction in a part of the outer peripheral portion, and a female reaching the cutting tool mounting hole 324a from an outer peripheral surface corresponding to the cutting tool mounting hole 324a. A screw hole 324b is provided. The cutting tool 33 is inserted into the tool mounting member 324 by inserting the cutting tool 33 into the cutting tool mounting hole 324a of the tool mounting member 324 thus configured and screwing the tightening bolt 330 into the female screw hole 324b. Removably mounted. In the illustrated embodiment, the cutting tool 33 is formed by forming a cutting blade 332 made of diamond or the like at the tip of a cutting tool body 331 made of a tool steel such as a super steel alloy. Yes. The cutting tool 33 mounted on the tool mounting member 324 thus configured rotates in a plane parallel to the holding surface for holding the workpiece of the chuck table, which will be described later, as the rotary spindle 322 rotates. I'm damned.

Next, another embodiment of the tool mounting member on which the cutting tool 33 is mounted will be described with reference to FIG.
The tool mounting member 325 shown in FIG. 3 is directly attached to the moving base 31 constituting the cutting unit. The tool mounting member 325 is provided with a cutting tool mounting hole 325a penetrating in the vertical direction, and a female screw hole 325b reaching the cutting tool mounting hole 325a from the front end surface corresponding to the cutting tool mounting hole 325a. It has been. The cutting tool 33 is inserted into the tool mounting member 325 by inserting the cutting tool 33 into the cutting tool mounting hole 325a of the tool mounting member 325 thus configured and screwing the tightening bolt 330 into the female screw hole 325b. Removably mounted.

  Returning to FIG. 1, the description of the processing apparatus in the illustrated embodiment moves the cutting unit 3 in the vertical direction along the pair of guide rails 221 and 221 (in a direction perpendicular to the holding surface of the chuck table described later). A cutting unit feed mechanism 4 is provided. The cutting unit feed mechanism 4 includes a male screw rod 41 disposed on the front side of the upright wall 22 and extending substantially vertically. The male screw rod 41 is rotatably supported by bearing members 42 and 43 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and the output shaft of the pulse motor 44 is connected to the male screw rod 41 by transmission. A connecting portion (not shown) that protrudes rearward from the center portion in the width direction is also formed on the rear surface of the movable base 31, and a through female screw hole that extends in the vertical direction is formed in the connecting portion, The male screw rod 41 is screwed into the female screw hole. Accordingly, when the pulse motor 44 is rotated forward, the moving base 31, that is, the cutting unit 3 is lowered or moved forward, and when the pulse motor 44 is rotated reversely, the moving base 31, that is, the cutting unit 3 is raised or moved backward.

  Continuing with reference to FIG. 1 and FIG. 4, a substantially rectangular machining work portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the machining work portion 211 includes a chuck table mechanism. 5 is disposed. The chuck table mechanism 5 includes a support base 51 and a disk-shaped chuck table 52 disposed on the support base 51 so as to be rotatable about a rotation center axis extending substantially vertically. The support base 51 slides on a pair of guide rails 23 and 23 extending in the direction indicated by the arrows 23a and 23b in the front-rear direction (the direction perpendicular to the front surface of the upright wall 22) on the processing work unit 211. The workpiece loading / unloading area 24 shown in FIG. 1 (position indicated by a solid line in FIG. 4) and the cutting tool 33 constituting the spindle unit 32 are opposed to each other by a chuck table moving mechanism 56 described later. And the machining area 25 to be moved (a position indicated by a two-dot chain line in FIG. 4).

  The chuck table 52 will be described with reference to FIGS. The chuck table 52 shown in FIG. 5 and FIG. 6 is formed in a disc shape from an aluminum alloy, and a plurality of concentric annular suction recesses 521 are provided on a holding surface 52a which is an upper surface thereof. A plurality of annular suction recesses 521 formed in the chuck table 52 are communicated with suction means (not shown) via a suction passage 522. Therefore, by operating a suction means (not shown), negative pressure acts on the plurality of annular suction recesses 521 via the suction passage 522, and the plate-like workpiece W placed on the holding surface 52a is sucked and held. To do.

  As shown in FIG. 4, the chuck table 52 configured as described above has a rotating shaft (not shown) attached to the lower surface thereof connected to a servo motor 53 and is rotated by the servo motor 53. The illustrated chuck table mechanism 5 includes a cover member 54 that has a hole through which the chuck table 52 is inserted, covers the support base 51 and the like, and is movably disposed together with the support base 51.

  4, the machining apparatus in the illustrated embodiment includes a chuck table moving mechanism 56 that moves the chuck table mechanism 5 along the pair of guide rails 23 in the directions indicated by the arrows 23a and 23b. It has. The chuck table moving mechanism 56 includes a male screw rod 561 disposed between the pair of guide rails 23 and 23 and extending in parallel with the guide rails 23 and 23, and a servo motor 562 that rotationally drives the male screw rod 561. The male screw rod 561 is screwed into a screw hole 511 provided in the support base 51, and the tip end portion thereof is rotatably supported by a bearing member 563 attached by connecting a pair of guide rails 23 and 23. ing. The servo motor 562 has a drive shaft connected to the base end of the male screw rod 561 by transmission. Accordingly, when the servo motor 562 rotates in the forward direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23a. When the servo motor 562 rotates in the reverse direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23b. It can be moved. The chuck table mechanism 5 that is moved in the directions indicated by the arrows 23a and 23b is selectively positioned in a workpiece loading / unloading area indicated by a solid line and a machining area indicated by a two-dot chain line in FIG. Further, the chuck table mechanism 5 is reciprocated in the direction indicated by the arrows 23a and 23b over the predetermined range, that is, in parallel with the holding surface 52a in the machining area.

  Returning to FIG. 1, the explanation will be continued. On both sides of the support base 51 constituting the chuck table mechanism 5 in the moving direction, as shown in FIG. Bellows means 57 and 58 covering the rails 23 and 23, the male screw rod 561, the servo motor 562 and the like are attached. The bellows means 57 and 58 can be formed from any suitable material such as campus cloth. The front end of the bellows means 57 is fixed to the front wall of the processing unit 211, and the rear end is fixed to the front end surface of the cover member 54 of the chuck table mechanism 5. The front end of the bellows means 58 is fixed to the rear end surface of the cover member 54 of the chuck table mechanism 5, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the chuck table mechanism 5 is moved in the direction indicated by the arrow 23a, the bellows means 57 is expanded and the bellows means 58 is contracted, and when the chuck table mechanism 5 is moved in the direction indicated by the arrow 23b, the bellows means. 57 is contracted and the bellows means 58 is extended.

  On the front half of the main portion 21 of the apparatus housing 2, a first cassette mounting portion 6a, a second cassette mounting portion 7a, a workpiece temporary storage portion 8a, and a cleaning portion 9a are provided. ing. A first cassette 6 that accommodates a workpiece before processing is placed on the first cassette placement portion 6a, and a second cassette that accommodates a workpiece after processing is placed on the second cassette placement portion 7a. The cassette 7 is placed. In the workpiece temporary placement portion 8a, the workpiece temporary placement means for temporarily placing the workpiece before processing carried out from the first cassette 6 placed on the first cassette placement portion 6a. 8 is disposed. The cleaning unit 9a is provided with cleaning means 9 for cleaning the processed workpiece.

  A workpiece conveying means 11 is disposed between the first cassette placing portion 6a and the second cassette placing portion 7a. The workpiece conveying means 11 is a first cassette placing portion. The unprocessed workpiece housed in the first cassette 6 placed on the part 6a is carried out to the workpiece temporary storage means 8 and the processed workpiece cleaned by the cleaning means 9 is used as the first workpiece. It is transported to the second cassette 7 placed on the second cassette placement section 7a. A workpiece loading means 12 is disposed between the workpiece temporary placing portion 8a and the workpiece loading / unloading area 24, and the workpiece loading means 12 is the workpiece loading means 12. The workpiece before processing placed on the temporary placing means 8 is transported onto the chuck table 52 of the chuck table mechanism 5 positioned in the workpiece loading / unloading area 24. A workpiece unloading means 13 is disposed between the workpiece loading / unloading area 24 and the cleaning unit 9a. The workpiece unloading means 13 is a workpiece loading / unloading area. The processed workpiece placed on the chuck table 52 positioned at 24 is conveyed to the cleaning means 9.

  The workpiece before processing accommodated in the first cassette 6 comprises a semiconductor wafer 10 having a plurality of semiconductor chips 110 formed in a lattice shape on the surface as shown in FIG. A plurality of stud bumps (electrodes) 120 are formed on the surfaces of the plurality of semiconductor chips 110 formed on the semiconductor wafer 10. The stud bump (electrode) 120 is formed by, for example, a stud bump forming method. That is, as shown in FIG. 8 (a), the tip of the gold wire 121 inserted through the cavity 15 is heated and melted by discharge with an electric torch to form a ball 122. As shown in b), the electrode plate 111 made of, for example, aluminum or the like formed on the semiconductor chip 110 is thermocompression bonded together with ultrasonic waves, and is broken at the head of the ball 122. The plurality of stud bumps (electrodes) 120 formed in this way are in a state where the needle-like ridges 123 remain as shown in FIG. 8C, and the heights thereof vary.

Next, another embodiment of the workpiece will be described with reference to FIGS. 9 and 10.
The workpiece in the embodiment shown in FIGS. 9 and 10 is a semiconductor chip 110 in which the above-described semiconductor wafer 10 is individually divided. FIG. 9 shows a plurality of semiconductors on a protective tape 17 mounted on an annular frame 16. Chips 110 are attached, and in FIG. 10, a plurality of semiconductor chips 110 are attached on a support substrate (substrate) 18 by, for example, a double-sided adhesive tape. Note that the plurality of stud bumps (electrodes) 120 described above are formed on the surface of the semiconductor chip 110.

  The first cassette 6 containing the workpiece as described above is placed on the first cassette placement portion 6 a of the apparatus housing 2. And when all the workpieces before processing which were accommodated in the 1st cassette 6 mounted in the 1st cassette mounting part 6a are carried out, it will replace with the cassette 6 which became empty, and a plurality of will be carried out. A new cassette 6 containing the workpiece before processing is manually placed on the first cassette placing portion 6a. On the other hand, when a predetermined number of processed objects are loaded into the second cassette 7 mounted on the second cassette mounting portion 7a of the apparatus housing 2, the second cassette 7 is manually unloaded. Then, a new empty second cassette 7 is placed.

The processing apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described mainly with reference to FIG. The workpiece is described as the semiconductor wafer 10 shown in FIGS.
By cutting the plurality of stud bumps (electrodes) 120 formed on the semiconductor wafer 10 held on the holding surface 52a of the chuck table 52 with the cutting tool 33, the height of the stud bumps (electrodes) 120 is made uniform. In order to align, it is necessary to make the distance between the holding surface 52a and the cutting tool 33 uniform over the entire area of the holding surface 52a. However, the distance between the holding surface 52a and the cutting bit 33 may not be uniform over the entire area of the holding surface 52a due to the flatness of the holding surface 52a or the mounting error of the chuck table 52 and the cutting bit 33. Therefore, in the present invention, the holding surface 52 a is cut by the cutting bit 33 when the chuck table 52 is mounted and when the cutting bit 33 is replaced.

Here, cutting of the holding surface 52a in the case of the embodiment shown in FIGS. 1 and 2 will be described with reference to FIG.
That is, the chuck table 52 is moved to the processing region 25 without holding the semiconductor wafer 10 on the holding surface 52 a of the chuck table 52. Then, the cutting unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position (a position slightly below the set height position of the holding surface 52a), and the rotary spindle 322 is driven to rotate to attach the cutting tool 33. The tool mounting member 324 is rotated in the direction indicated by the arrow in FIG. 11 at a rotational speed of, for example, 6000 rpm. Next, the chuck table 52 is moved rightward from the position indicated by the solid line in FIG. 11 at a predetermined feed rate. The feed rate may be about 2 mm / second when the cutting width of the cutting blade 332 of the cutting tool 33 is 20 μm or more, for example. Then, when the center of the chuck table 52 moves to the center position of the tool mounting member 324 as shown by a two-dot chain line in FIG. 11, the cutting unit 3 is raised. As a result, the holding surface 52 a of the chuck table 52 is cut by the cutting blade 332 of the cutting tool 33 that rotates as the rotary spindle 322 rotates. The cutting conditions may be the same as the cutting conditions for the workpiece.

Next, cutting of the holding surface 52a in the case of the embodiment shown in FIG. 3 will be described with reference to FIG.
Also in the embodiment shown in FIG. 3, first, the chuck table 52 is moved to the processing region 25 without holding the semiconductor wafer 10 on the holding surface 52 a of the chuck table 52. Then, the moving base 31 constituting the cutting unit 3 is lowered, and the cutting tool 33 mounted on the tool mounting member 325 mounted on the moving base 31 is set to a predetermined cutting position (the mounting surface 52a is set). Position it slightly below the height). Next, the chuck table 52 is moved to the right from the position indicated by the solid line in FIG. 12 at a predetermined feed speed while rotating the chuck table 52 in the direction indicated by the arrow in FIG. The feed rate may be about 0.6 mm / second when the cutting width of the cutting blade 332 of the cutting tool 33 is 20 μm or more, for example. Then, when the center of the chuck table 52 moves to a position where it reaches the cutting tool 33 as shown by a two-dot chain line in FIG. 12, the cutting unit 3 is raised. As a result, the holding surface 52 a of the chuck table 52 is cut by the cutting blade 332 of the cutting tool 33. The cutting conditions may be the same as the cutting conditions of the workpiece.

  As described above, the holding surface 52a of the chuck table 52 is cut by the cutting tool 33 before holding the semiconductor wafer 10 as the workpiece on the holding surface 52a. Thus, since the holding surface 52a of the chuck table 52 is cut by the cutting tool 33 that cuts the workpiece, even if the holding surface 52a is wavy, the distance from the cutting tool 33 is uniform over the entire region. Become.

As described above, by cutting the holding surface 52a of the chuck table 52 with the cutting tool 33 when the chuck table 52 is mounted and when the cutting tool 33 is replaced, processing preparation by the processing device is completed.
When the preparation for processing is completed, the semiconductor wafer 10 as the workpiece before processing accommodated in the first cassette 6 shown in FIG. 1 is transported by the vertical movement and forward / backward movement of the workpiece transport means 11, The workpiece is placed on the temporary placement means 8. The semiconductor wafer 10 placed on the workpiece temporary placing means 8 is positioned in the workpiece loading / unloading area 24 by the turning operation of the workpiece loading means 12 after being centered here. It is placed on the chuck table 52 of the chuck table mechanism 5. The semiconductor wafer 10 placed on the chuck table 52 is sucked and held on the chuck table 52 by suction means (not shown).

  When the semiconductor wafer 10 is sucked and held on the chuck table 52, the chuck table moving mechanism 56 (see FIG. 4) is operated to move the chuck table mechanism 5 in the direction indicated by the arrow 23a, and the chuck holding the semiconductor wafer 10 is held. The table 52 is positioned in the machining area 25. When the chuck table 52 holding the semiconductor wafer 10 is positioned in the processing region 25 in this way, a plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 are provided. A cutting process for cutting is performed.

First, the cutting process in the embodiment shown in FIGS. 1 and 2 will be described with reference to FIG.
In the case of the embodiment shown in FIGS. 1 and 2, the rotary spindle 322 is driven to rotate, and the tool mounting member 324 to which the cutting tool 33 is attached is rotated in the direction indicated by the arrow in FIG. . Then, the cutting unit 3 is lowered and the cutting tool 33 is positioned at a predetermined cutting position. Next, the chuck table 52 holding the semiconductor wafer 10 is moved to the right from the position indicated by the solid line in FIG. 13 at a predetermined feed speed. The feed rate may be about 2 mm / second when the cutting width of the cutting blade 332 of the cutting tool 33 is 20 μm or more, for example. When the center of the semiconductor wafer 10 held on the chuck table 52 moves to the center position of the tool mounting member 324 as shown by a two-dot chain line in FIG. 13, the cutting unit 3 is raised. As a result, the upper ends of a plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 by the cutting blade 332 of the cutting tool 33 that rotates as the rotary spindle 322 rotates. It is scraped off and its height is aligned as shown in FIG.

Next, the cutting process in the embodiment shown in FIG. 3 will be described with reference to FIG.
In the case of the embodiment shown in FIG. 3, first, the moving base 31 constituting the cutting unit 3 is lowered, and the cutting tool 33 mounted on the tool mounting member 325 mounted on the moving base 31 is set in a predetermined manner. Position it at the cutting position. Next, while the chuck table 52 holding the semiconductor wafer 10 is rotated at a rotational speed of, for example, 2000 rpm in the direction indicated by an arrow in FIG. 14, the chuck table 52 is moved rightward from the position indicated by the solid line in FIG. The feed rate may be about 0.6 mm / second when the cutting width of the cutting blade 332 of the cutting tool 33 is 20 μm or more, for example. Then, when the center of the chuck table 52 moves to a position where it reaches the cutting tool 33 as shown by a two-dot chain line in FIG. 14, the cutting unit 3 is raised. As a result, the upper end portions of the plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 are scraped off by the cutting blade 332 of the cutting tool 33, as shown in FIG. Height is aligned.

  As described above, when the cutting process for aligning the heights of the plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 is performed, the holding surface of the chuck table 52 by the cutting tool 33 as described above. 52a is cut, and the distance between the holding surface 52a and the cutting bit 33 is uniform over the entire area of the holding surface 52a. Therefore, the above-described cutting is performed by the cutting bit 33 held on the holding surface 52a. The plurality of stud bumps (electrodes) 120 have a uniform height.

  As described above, when the cutting process of the plurality of bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 is completed, the cutting unit 3 is raised and the rotation of the chuck table 52 is stopped. . Next, the chuck table 52 is moved in the direction indicated by the arrow 23b in FIG. 1 to be positioned in the workpiece loading / unloading area 24, and the suction holding of the cut semiconductor wafer 10 on the chuck table 52 is released. Then, the semiconductor wafer 10 whose suction holding is released is carried out by the workpiece carrying-out means 13 and conveyed to the cleaning means 9. The semiconductor wafer 10 conveyed to the cleaning means 9 is cleaned here. The semiconductor wafer 10 cleaned by the cleaning unit 9 is stored in a predetermined position of the second cassette 7 by the workpiece transfer unit 11.

Next, another embodiment of the chuck table processing method in the processing apparatus according to the present invention will be described with reference to FIGS. In the embodiment shown in FIGS. 16 to 19, the same members as those in the embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted.
The cutting unit 3 shown in FIGS. 16 to 19 includes tilt adjusting means for adjusting the tilt of the spindle unit 32 mounted on the moving base 31. That is, as shown in FIG. 16, the support member 313 on which the spindle housing 321 of the spindle unit 32 is mounted is formed in a rectangular shape, and its four corners are fixed to the front surface of the moving base 31 by four bolts 35. . In the four bolt fixing portions, as shown in FIG. 17, adjustment shims 36 are respectively disposed between the movable base 31 and the support member 313. The inclination of the spindle unit 32 can be adjusted by adjusting the number or thickness of the shims 36 disposed at the four corners.

  Further, the cutting unit 3 shown in FIGS. 16 to 19 includes an interval detecting means for detecting an interval between the rotation locus of the cutting edge of the cutting tool 33 mounted on the tool mounting member 324 and the holding surface 52 a of the chuck table 52. I have. The interval detecting means in the illustrated embodiment includes a capacitance type sensor 37 mounted on the tool mounting member 324. That is, the tool mounting member 324 is provided with a sensor mounting hole 324c penetrating in a vertical direction in a part of the outer peripheral portion. The sensor mounting hole 324c is fitted from the upper side of the tool mounting member 324 and is detachably mounted. .

A chuck table processing method in the processing apparatus including the cutting unit 3 configured as described above will be described.
First, the capacitive sensor 37 is mounted in the sensor mounting hole 324c of the tool mounting member 324. Then, as shown in FIG. 18, the chuck table 52 is moved below the machining area, that is, the tool mounting member 324. Next, the tool mounting member 324 is rotated to position the capacitive sensor 37 on the outer peripheral portion x of the chuck table 52. Based on the signal from the capacitive sensor 37, the distance between the holding surface 52 a of the chuck table 52 and the capacitive sensor 37 at the point x is detected. When the interval at the point x is detected, the tool mounting member 324 is rotated to position the capacitive sensor 37 at the center portion y of the chuck table 52, and based on the signal from the capacitive sensor 37, at the point y. The distance between the holding surface 52a of the chuck table 52 and the capacitive sensor 37 is detected. When the interval at the point y is detected, the tool mounting member 324 is rotated to position the capacitive sensor 37 on the outer peripheral portion z of the chuck table 52, and based on the signal from the capacitive sensor 37, The distance between the holding surface 52a of the chuck table 52 and the capacitive sensor 37 is detected. As a result, as shown in FIG. 19, the distance h between the z point, the y point, and the x point of the chuck table 52 on the rotation locus of the capacitive sensor 37 can be detected (interval detection step).

  In this way, by detecting the distance from the three points (x point, y point, z point) of the chuck table 52 on the rotation trajectory of the capacitance type sensor 37, the static mounted on the tool mounting member 324 is detected. The parallelism between the rotation locus of the capacitive sensor 37 and the holding surface 52a of the chuck table 52 can be obtained. The parallelism between the capacitance type sensor 37 mounted on the tool mounting member 324 and the holding surface 52a of the chuck table 52 is determined by the rotation locus of the cutting edge of the cutting tool 33 mounted on the tool mounting member 324 and the chuck table 52. It can be considered that the parallelism with the holding surface 52a is the same.

  As described above, when the parallelism between the rotation trajectory of the cutting tool 33 mounted on the tool mounting member 324 and the holding surface 52a of the chuck table 52 is obtained, the rotation trajectory and holding of the cutting tool 33 are held. The inclination of the spindle unit 32 mounted on the moving base 31 of the cutting unit 3 is adjusted so that the surface 52a is parallel to the surface 52a. The adjustment of the inclination of the spindle unit 32 is performed by changing the number or thickness of the adjustment shims 36 respectively disposed at the four corners of the support base 313 on which the moving base 31 and the spindle unit 32 are mounted. Thus, if the rotation locus of the cutting edge of the cutting tool 33 attached to the tool attachment member 324 and the holding surface 52a of the chuck table 52 are adjusted to be parallel, the electrostatic attachment attached to the tool attachment member 324 will be described. The capacitive sensor 37 is removed. Then, the holding surface 52a of the chuck table 52 described with reference to FIGS. 11 and 12 is cut. As described above, before cutting the holding surface 52 a of the chuck table 52, the parallelism between the rotation locus of the cutting edge of the cutting tool 33 mounted on the tool mounting member 324 and the holding surface 52 a of the chuck table 52 is obtained. By adjusting the inclination of the spindle unit 32 mounted on the moving base 31 of the cutting unit 3 so that the rotation trajectory of the cutting edge of the cutting tool 33 and the holding surface 52a are substantially parallel, the cutting of the holding surface 52a is performed. Cutting cost can be reduced.

The perspective view which shows one Embodiment of the processing apparatus which implements the processing method of the chuck table by this invention. The perspective view which shows one Embodiment of the cutting unit with which the processing apparatus shown in FIG. 1 is equipped. The perspective view which shows other embodiment of the cutting unit with which the processing apparatus shown in FIG. 1 is equipped. The perspective view which shows the chuck table mechanism and chuck table moving mechanism with which the processing apparatus shown in FIG. 1 is equipped. The perspective view of the chuck table with which the processing apparatus shown in FIG. 1 is equipped. FIG. 6 is an enlarged cross-sectional view of the chuck table shown in FIG. The top view of the semiconductor wafer as a to-be-processed object which consists of a plate-shaped object. FIG. 6 is an explanatory diagram of a stud bump forming method for forming bumps (electrodes) on a plurality of semiconductor chips provided on the semiconductor wafer shown in FIG. 5. The perspective view which shows the state which supported the semiconductor chip as a to-be-processed object which consists of a plate-shaped object in the cyclic | annular flame | frame. The perspective view which shows the state which supported the semiconductor chip as a to-be-processed object which consists of a plate-shaped object on the support substrate (substrate). Explanatory drawing which shows the state which cuts the holding surface of a chuck table using the cutting tool of the cutting unit shown in FIG. Explanatory drawing which shows the state which cuts the holding surface of a chuck table using the cutting tool of the cutting unit shown in FIG. Explanatory drawing of the cutting process implemented using the cutting unit shown in FIG. Explanatory drawing of the cutting process implemented using the cutting unit shown in FIG. Explanatory drawing which shows the state which cut the bump (electrode) formed in the semiconductor chip with the processing apparatus shown in FIG. The front view which shows other embodiment of the cutting unit shown in FIG. The side view of the cutting unit shown in FIG. Explanatory drawing of the space | interval detection process which detects the space | interval with the holding surface of a chuck | zipper table by the electrostatic capacitance type sensor with which the tool attachment member of the cutting unit shown in FIG. 16 was mounted | worn. Explanatory drawing which shows the example of a position which shows the space | interval of several positions detected in the space | interval detection process shown in FIG.

Explanation of symbols

2: Device housing 3: Grinding unit 31: Moving base 32: Spindle unit 324, 325: Tool mounting member 33: Grinding tool 37: Capacitive sensor
4: Grinding unit feed mechanism 5: Chuck table mechanism 52: Chuck table 56: Chuck table moving mechanism 6: First cassette 7: Second cassette 9: Workpiece temporary placement means 9: Cleaning means 11: Workpiece Conveying means 12: Workpiece carrying-in means 13: Workpiece carrying-out means 10: Semiconductor wafer 110: Semiconductor chip 111: Electrode plate 120: Bump (electrode)

Claims (4)

A chuck table configured to be movable between a workpiece loading / unloading zone and a machining zone and having a holding surface for holding a plate-like object, and the chuck table is moved to a workpiece loading / unloading zone and a machining zone A chuck table moving mechanism, and a cutting unit provided with a cutting tool arranged in the processing area and cutting a plurality of electrodes formed on the surface of the plate-like object held by the chuck table so as to align the height. A machining method of the chuck table in a machining apparatus comprising a cutting unit feed mechanism for moving the cutting unit forward and backward in a direction perpendicular to the holding surface of the chuck table,
Moving the chuck table to the processing area, and cutting the holding surface of the chuck table with the cutting tool of the cutting unit;
A processing method for a chuck table in a processing apparatus. The cutting unit includes a spindle unit including a tool mounting member on which the cutting tool is mounted and rotated, and the chuck table is moved to the tool mounting member while rotating the tool mounting member on which the cutting tool is mounted. 2. The chuck table processing method in the processing apparatus according to claim 1, wherein the holding surface of the chuck table is cut by the cutting tool by moving relative to the chuck table. The cutting unit includes tilt adjusting means for adjusting the tilt of the spindle unit, and the tool mounting member is configured to be detachably mounted with a distance detecting means for detecting a distance between the chuck table and the holding surface. Has been
The spacing detecting means is mounted on the tool mounting member, and the rotation trajectory of the cutting edge of the cutting tool mounted on the tool mounting member and the holding are detected by detecting the spacing between the chuck table and a plurality of locations on the holding surface of the chuck table. Determining the parallelism with the surface, and adjusting the inclination adjusting means so that the rotation trajectory of the cutting edge of the cutting tool and the holding surface are parallel based on the calculated parallelism, 3. The processing method of the chuck table in the processing apparatus according to claim 2, which is performed before the holding surface is cut by the cutting tool of the cutting unit. The chuck table is configured to be rotatable, and the chuck table is rotated by the cutting tool mounted on the tool mounting member while rotating the chuck table, whereby the holding surface of the chuck table is moved by the cutting tool. 2. The processing method of the chuck table in the processing apparatus according to claim 1, wherein the processing is performed.

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