JPH09155747A - Flattening grinding wheel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform flattening of a chuck table using a rotary grinder for a grinding wheel to grind the surface, etc., of the porous chuck table by forming an annular grinding part on the end face of a base and a lug like protruded grinding part on the outside. SOLUTION: A grinding wheel 3 has an annular grinding part 3b formed on the end face of a base 3a and a lug like protruded grinding part 3c opposed thereto on the outside. The grinding part 3c is supported on a supporting part 3d formed on the side face of the base 3a. The grinding wheel 3 is mounted at the end of the shaft 4a of a rotary grinder 4 to be used for flattening on the surface of a chuck table 1. In this case, the grinding wheel 3 is positioned for the grinding part 3c to pass through the center of the porous member of the chuck table 1 for polishing while supplying grinding liquid so that flattening on the surface of the chuck table 1 can be performed without causing roughness at the center.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding wheel capable of flattening with a rotary grinding machine.

[0002]

2. Description of the Related Art As shown in FIG. 2, a porous member 2 is provided on the surface.
The chuck table 1 provided with is installed as a table for holding a workpiece in a dicing device for cutting a semiconductor wafer in a dice pattern, a polishing device for polishing a wafer surface, and the like. Since a semiconductor wafer or the like is highly accurately cut or polished by such an apparatus, the surface of the chuck table (workpiece holding surface) must be highly accurately flat. Therefore, conventionally, the surface of the chuck table 1 is flattened using a rotary grinder equipped with a grinding wheel K as shown in FIG.

[0003]

However, according to the grinding wheel K, there is a problem that the central portion of the surface of the chuck table is roughened, which has been a problem to be solved. It is considered that such a problem is that the polishing surface N of the grinding portion (grinding stone) M is constantly in contact with the center of the chuck table, and that polishing debris is likely to collect in the center portion, and as shown in FIG. The rotation center Q of the grinding part M is eccentric to the polishing surface N so that the polishing surface N does not always come in contact with the center O of the chuck table, or as shown in FIG.
Although it was tried to divide it into three parts (three teeth) so that the polishing surface N contacted intermittently, this time there was a problem that the portion other than the center was roughened. In some cases, the surface of the chuck table is flattened by using a surface grinder in order to prevent roughness, but it takes a lot of time for the work and requires considerable skill in terms of technology. The present invention has been made in order to solve such a conventional problem, and provides a flat surface grinding wheel capable of performing a flat finish of a chuck table using a rotary grinding machine without causing roughness in a central portion. The challenge is to provide.

[0004]

As a means for technically solving the above-mentioned problems, the present invention relates to a grinding wheel that grinds a surface or the like of a porous chuck table to form a flat surface. The grinding wheel is a base. The gist of the present invention is a flat-face grinding wheel in which an annular grinding portion is formed on the end surface of and the grinding portion protruding in an ear shape is formed on the outside thereof.

[0005]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 3 denotes a grinding wheel, which has an annular grinding portion 3b formed on an end surface of a base 3a, and a grinding portion 3c protruding outwardly from the grinding portion 3c.
Are opposed to each other. The ear-shaped grinding portion 3c is the base 3a.
It is supported by a supporting portion 3d formed in a columnar shape on the side surface thereof so as not to be easily damaged.

The grinding wheel 3 thus formed is
As shown in FIG. 3, it is attached to the end of the rotary shaft 4a of the rotary grinder 4 and is used to finish the surface of the chuck table 1 flat. At this time, as shown in FIG. 4, the grinding wheel 3 is positioned so that the ear-shaped grinding portion 3c passes through the central portion of the porous member 2 of the chuck table 1. For example, the chuck table 1 is rotated at 30 to 50 rpm by a rotary grinder. When the rotary shaft 4a of No. 4 was rotated at 1000 to 1500 rpm and polishing was performed while supplying cutting water at 90 liters / minute, the surface of the chuck table 1 could be finished flat without roughening at the central portion. .

FIG. 5 shows a polishing apparatus 5 for polishing the surface of a semiconductor wafer or the like, and a chuck table 1 is incorporated as a table for holding a workpiece W. The surface of the chuck table 1 must be flat-finished. In this case, the surface of the chuck table 1 can be flat-finished by using the grinding wheel 3 by its own grinding function without using a rotary grinder. it can. That is, the grinding wheel 5b attached to the lower end of the polishing means 5a is removed, the grinding wheel 3 is mounted, the ear-shaped grinding portion 3c is set so as to pass through the central portion of the chuck table 1, and the surface is flat. Just finish it.

In this case, the polishing means 5a is moved in the vertical direction by the Z-axis drive mechanism 5c to control the cutting depth as shown in FIG.
The rotation speed is controlled via d.

FIG. 7 shows a dicing device 6 for cutting a semiconductor wafer or the like, which incorporates a chuck table 1 having a porous member on its surface. Even when the surface of the chuck table 1 is finished to be flat, the grinding wheel is used. 3 can be carried out on a rotary grinder 4.

The chuck table is not limited to the one having the above-mentioned structure. For example, as shown in FIGS. 8 and 9, the central portion of the porous member 12 is circular, and a plurality of annular members are concentrically arranged around the central portion. There is also a chuck table 11 having the above structure, but in this case as well, the surface can be finished flat by the rotary grinding machine 4 using the grinding wheel 3 in the same manner as described above. Incidentally, in the present invention, the ear-shaped grinding portion 3
Although c is formed in two places, it can be formed in three places and four places depending on the type and hardness of the chuck table.

[0011]

As described above, according to the present invention,
Using the rotary grinder, the chuck table can be flat-finished without causing the center portion to be rough, and the work can be completed in a short time.

[Brief description of the drawings]

FIG. 1 is a perspective view of a grinding wheel according to the present invention.

FIG. 2 is an upper perspective view of a chuck table.

FIG. 3 is an explanatory diagram showing a state in which flat finishing is performed by a rotary grinder.

FIG. 4 is an explanatory diagram showing a positional relationship between a grinding wheel and a chuck table.

FIG. 5 is a perspective view of a main part of the polishing apparatus.

FIG. 6 is an elevation view of the main part of the same.

FIG. 7 is a perspective view of a dicing device.

FIG. 8 is a partially cutaway perspective view showing another example of the chuck table.

FIG. 9 is an exploded perspective view of the main part of the same.

FIG. 10 is a perspective view showing a conventional grinding wheel.

11 (a) and 11 (b) are explanatory views showing a positional relationship between a conventional grinding wheel and a chuck table, respectively.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Chuck table 2 ... Porous member 3 ... Grinding wheel 3a ... Base 3b ... Grinding part 3c ... Ear grinding part 4 ... Rotary grinder 4a ... Rotating shaft 5 ... Polishing device 5a ... Polishing means 5b ... Grinding stone 5c ... Z-axis drive mechanism 5d ... Servo driver 6 ... Dicing device

Claims (1)

[Claims] 1. A grinding wheel for grinding a surface of a porous chuck table or the like to form a flat surface, wherein the grinding wheel has an annular grinding portion formed on an end surface of a base and has an ear-like shape on the outer side thereof. A flat surface grinding wheel with a protruding grinding part.