JP2007021586A - Truing method for chamfering grinding wheel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an efficient truing method for a chamfering grinding wheel, allowing the same truing grinding wheel to perform truing for the chamfering groove shape of a wafer outer peripheral part, an orientation flat part, or a notch part, and not requiring the change of the truing grinding wheel even if wafers are different in diameter. <P>SOLUTION: In a plane parallel to the wafer W, a truer 41 turning on the axis of rotation parallel to the rotation axis of the wafer W is approached toward the outer peripheral precise grinding wheel 55 whose rotation axis is inclined in the tangential direction of the wafer W outer periphery, and in a plane parallel to the wafer W, the outer peripheral precise grinding wheel 55 is moved to reciprocate by a predetermined amount in the direction intersecting the approaching direction to the outer peripheral precise grinding wheel 55 of the truer 41 to thereby form a groove shaped corresponding to the chamfering shape of the orientation flat part of the waver W in the outer peripheral precise grinding wheel 55. Thus, the groove shaped suitable for chamfering the orientation flat part is formed in the outer peripheral precise grinding wheel 55. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a truing method of a chamfering grindstone for chamfering a wafer such as a semiconductor device or an electronic component.

  A wafer such as silicon, which is a material for semiconductor devices and electronic components, is sliced from the ingot state with a slicing device such as an inner peripheral blade or a wire saw, and then the outer peripheral portion is prevented to prevent cracking or chipping of the peripheral edge. Chamfering is applied to

  Conventionally, in chamfering of the peripheral edge of a wafer, it has been proposed to chamfer the chamfering grindstone by tilting the rotation axis of the chamfering grindstone by a predetermined angle in the tangential direction of the outer periphery of the wafer. (For example, refer to Patent Document 1).

According to this technique, the movement direction of the abrasive grains of the grindstone is oblique with respect to the rotation direction of the wafer, and the surface roughness of the processed surface is improved.
JP-A-5-152259

  The processing groove shape of the chamfering grindstone described in Patent Document 1 is formed by bringing a rotating circular truing grindstone processed into a desired chamfering shape into contact with the chamfering grindstone. However, in order to facilitate determination of crystal orientation and alignment of the wafer in addition to the circular portion, the wafer has an orientation flat in which a part of the circular wafer is notched linearly as shown in FIG. (Abbreviation of orientation flat) or a notch formed by cutting a part of the wafer into a V shape as shown in FIG.

  At this time, in the chamfering method described in Patent Document 1, the contact area of the wafer outer peripheral portion with the processing groove is different from the contact area of the orientation flat portion or the notch portion with the processing groove, and therefore the chamfer width in each portion is different. There was a problem that the cross-sectional shape changed. Therefore, the orientation flat portion or notch portion of the wafer needs to be chamfered with a processing groove trued with a truing grindstone suitable for each portion.

  Also, if the wafer outer diameter is different, the curvature of the contact area will change and the contact area will change, so when chamfering a wafer with a different outer diameter, replace it with a truing grindstone that matches the outer diameter, Since it was necessary to perform the work, it took time for truing, which caused a reduction in machining efficiency.

  The present invention has been made in view of such circumstances, and in the truing method of a chamfering grindstone having a rotation axis inclined with respect to the rotation axis of the wafer, the wafer outer peripheral portion, orientation flat portion, or notch portion by the same truing grindstone. It is an object of the present invention to provide an efficient truing method for chamfering grindstones, which is capable of chamfering groove-shaped truing, and does not require changing the truing grindstone even if the wafer diameter is different.

In order to achieve the above object, a truing of a chamfering grindstone in which a groove having a shape corresponding to a desired chamfering shape is formed on a chamfering grindstone having a rotation axis inclined with respect to the rotation axis of the wafer. In the method, a truing grindstone supported in parallel to the wafer and rotating on a rotation axis parallel to the rotation axis of the wafer is brought close to the chamfering grindstone in a plane parallel to the wafer, In a plane parallel to the wafer, the truing grindstone is reciprocated by a predetermined amount in a direction perpendicular to the approaching direction of the truing grindstone to the chamfering grindstone, and the chamfering shape of the orientation flat portion of the wafer is chamfered on the chamfering grindstone. It is characterized by forming a groove having a corresponding shape.

  According to the first aspect of the present invention, the truing grindstone that is processed into a desired chamfered shape and is placed in parallel with the wafer with the orientation flat and rotates forms a groove corresponding to the desired chamfered shape in the chamfering grindstone. . When forming the groove, the truing grindstone reciprocates in a direction perpendicular to the approaching direction of the truing grindstone with respect to the chamfering grindstone in a plane parallel to the wafer.

  Thereby, since the periphery of the truing grindstone in contact with the chamfering grindstone moves linearly, the groove formed on the chamfering grindstone has a groove shape suitable for chamfering of the linear orientation flat portion.

  According to a second aspect of the present invention, there is provided a truing method for a chamfering grindstone in which a groove having a shape corresponding to a desired chamfering shape is formed on a chamfering grindstone having a rotation axis inclined with respect to the rotation axis of the wafer. A truing grindstone is supported in parallel to the wafer, and is rotated by a rotation axis parallel to the rotation axis of the wafer and is brought close to the chamfering grindstone in a plane parallel to the wafer. A groove having a shape corresponding to the chamfered shape of the circumferential portion of the wafer is formed on the grindstone.

  According to the second aspect, a groove having a desired chamfered shape suitable for the outer diameter of the wafer is formed in the chamfering grindstone by the truing grindstone having the same outer diameter as that of the wafer mounted and rotated in parallel with the wafer.

  According to a third aspect of the present invention, there is provided a truing method for a chamfering grindstone in which a groove having a shape corresponding to a desired chamfering shape is formed on a chamfering grindstone having a rotation axis inclined with respect to the rotation axis of the wafer, in parallel with the wafer. A truing grindstone that is supported and rotates on a rotation axis parallel to the rotation axis of the wafer is made to approach the chamfering grindstone in a plane parallel to the wafer, and in a plane parallel to the wafer, The peripheral edge of the truing grindstone is reciprocated by a predetermined amount on the locus corresponding to the arc of the outer periphery of the wafer, and a groove having a shape corresponding to the chamfering shape of the circumferential portion of the wafer is formed in the chamfering grindstone. Yes.

  According to the third aspect, the peripheral edge of the truing grindstone reciprocates along an arc equivalent to the shape of the peripheral edge of the wafer having an outer diameter different from that of the truing grindstone to form a processing groove on the chamfering grindstone.

  As a result, the shape of the groove formed in the chamfering grindstone is equivalent to that formed with a truing grindstone having the same outer diameter as the desired wafer outer diameter, and the truing grindstone is exchanged to match the outer diameter of the wafer. There is no need to do it.

  According to a fourth aspect of the present invention, there is provided a truing method for a chamfering grindstone in which a groove having a shape corresponding to a desired chamfering shape is formed on a chamfering grindstone having a rotation axis inclined with respect to the rotation axis of the wafer, in parallel with the wafer. A truing grindstone that is supported and rotates on a rotation axis parallel to the rotation axis of the wafer is made to approach the chamfering grindstone in a plane parallel to the wafer, and in a plane parallel to the wafer, The truing grindstone is reciprocated by a predetermined amount in a direction parallel to the straight portion of the notch when the center of the notch of the wafer faces the chamfering grindstone, and the chamfered shape of the notch of the wafer is chamfered to the chamfering grindstone. It is characterized by forming a groove having a corresponding shape.

  According to the fourth aspect of the present invention, the truing grindstone that is processed into a desired chamfered shape and is placed in parallel with the notched wafer forms a groove corresponding to the desired chamfered shape in the notched chamfering grindstone. When forming the groove, the truing grindstone reciprocates a predetermined amount in a direction parallel to the straight portion of the notch portion of the wafer in a plane parallel to the wafer.

  As a result, the peripheral edge of the truing grindstone that contacts the notch chamfering grindstone moves linearly in accordance with the direction and angle of the straight portion of the notch portion, so that the groove formed in the chamfering grindstone of the notch portion straight portion The groove shape is suitable for chamfering.

  According to a fifth aspect of the present invention, in the first and second aspects, or the first and third aspects, the chamfering grindstone includes a groove having a shape corresponding to a chamfered shape of a circumferential portion of the wafer, and an orientation of the wafer. A groove having a shape corresponding to the chamfered shape of the flat portion is formed separately.

  According to the fifth aspect, the circumferential portion and the orientation flat portion exchange the chamfering grinding stone by one chamfering grindstone in which the groove shape for processing the wafer circumferential portion and the groove shape for the orientation flat portion processing are formed. Chamfered without any problems.

  As described above, according to the truing method of the chamfering grindstone of the present invention, the chamfering grindstone inclined at a predetermined angle with respect to the rotation axis of the wafer can be formed on the outer peripheral portion of the wafer without changing the truing grindstone. A chamfering groove having a shape suitable for chamfering and a chamfering groove having a shape suitable for chamfering of the orientation flat portion can be formed.

  Moreover, the chamfering groove | channel of the shape suitable for the chamfering process of a notch part can be formed with the same truing grindstone also with respect to the chamfering grindstone for notches. Furthermore, since it is not necessary to change the truing grindstone even if the wafer diameters are different, truing of the chamfering grindstone can be performed efficiently.

  The preferred embodiments of the truing method for a chamfering grindstone according to the present invention will be described below in detail with reference to the accompanying drawings. First, a wafer chamfering apparatus used in the truing method according to the present invention will be described. FIG. 1 is a front view showing a main part of the chamfering apparatus. The chamfering apparatus 10 includes a wafer feeding unit 20, a grindstone rotating unit 50, a wafer supply / storage unit (not shown), a wafer cleaning / drying unit, a wafer transfer unit, and a controller that controls operations of each part of the chamfering device.

  The wafer feeding unit 20 includes an X-axis base 21, two X-axis guide rails 22, 22, four X-axis linear guides 23, 23,..., A ball screw and a stepping motor mounted on the main body base 11. It has an X table 24 that is moved in the X direction in the figure by the X axis driving means 25.

  The X table 24 is moved in the Y direction in the figure by Y axis driving means comprising two Y axis guide rails 26, 26, four Y axis linear guides 27, 27,..., A ball screw and a stepping motor (not shown). A Y table 28 is incorporated.

  The Y table 28 is guided by two Z-axis guide rails 29 and 29 and four Z-axis linear guides (not shown), and is moved in the Z direction in the figure by a Z-axis driving means 30 comprising a ball screw and a stepping motor. Z table 31 is incorporated.

  The Z table 31 incorporates a θ-axis motor 32 and a θ spindle 33, and a wafer table (mounting table) 34 on which the wafer W is sucked and mounted is attached to the θ spindle 33, and the wafer table 34 rotates the wafer table. It is rotated around the axis CW in the θ direction in the figure.

  A truing grindstone 41 (hereinafter referred to as a truer 41) used for truing a grindstone for chamfering the peripheral edge of the wafer W is attached to the lower portion of the wafer table 34 concentrically with the wafer table rotation axis CW.

  By the wafer feeding unit 20, the wafer W and the truer 41 are rotated in the θ direction in the figure and are moved in the X, Y, and Z directions.

  The grindstone rotating unit 50 is mounted with an outer peripheral grindstone 52, and is mounted on an outer grindstone spindle 51 that is driven to rotate about an axis CH by an outer grindstone motor (not shown), and a turntable 53 disposed above the outer peripheral grindstone 52. The outer peripheral fine spindle 54 and the outer peripheral fine spindle motor 56, the notch rough spindle 60 and the notch coarse motor 62, the notch fine spindle 57 and the notch fine motor 59 are provided.

  The outer peripheral fine spindle 54 is inclined (8 degrees in this embodiment) with the rotation axis in the tangential direction of the wafer W (X-axis direction shown in FIG. 1). A peripheral grinding wheel 55 which is a chamfering grindstone for finish grinding the outer circumference of the wafer W is attached to the peripheral grinding spindle 54.

  A notch rough grinding wheel 61 is attached to the notch rough spindle 60, and a notch fine grinding wheel 58, which is a chamfering grind for grinding the notch portion, is attached to the notch fine spindle 57. The notch precision grinding wheel 58 is held so as to be inclined by a predetermined amount in an arbitrary direction.

  2A and 2B show an inclination driving mechanism of the notch fine grinding spindle 57 to which the notch fine grinding wheel 58 is attached. FIG. 2A is a plan view and FIG. 2B is a front sectional view.

  A notch precision spindle 57 in which a notch precision motor 59 is incorporated is attached to a spindle holder 63. The spindle holder 63 has a stepped shaft 63A. A ball 63B of a universal joint 64 attached to the turntable 53 is fixed below the stepped shaft 63A, and a universal joint is placed above the stepped shaft 63A. 66 balls 63C are fixed.

  The universal joint 66 is attached to one end of the arm 65, the other end of the arm 65 is rotatably connected to one end of the arm 67 by a pin 68, and the other end of the arm 67 is attached to the turntable 53. The shaft 69A is fixed.

  Since the notch precision grinding wheel 58 is held by such a mechanism, by rotating the shaft 69A of the motor 69, the notch fine grinding wheel 58 performs a grinding motion around the swing fulcrum CN in the figure. Therefore, by controlling the rotation angle of the motor 69, the axis of the notch precision grinding wheel 58 can be inclined by a predetermined angle in an arbitrary direction. Further, the inclination angle α of the axis of the notch fine grinding wheel 58 can be arbitrarily set by changing the lengths of the arm 67 and the arm 65.

  The outer peripheral fine grinding wheel 55, the notch fine grinding wheel 58, and the notch coarse grinding wheel 61 are positioned at the processing positions by the rotation of the turntable 53.

  FIG. 3 shows a truer 41 attached to the wafer table 34. As shown in FIG. 3, the truer 41 is attached to the lower part of the wafer table 34 concentrically with the wafer table rotation axis CW and is rotated θ by the θ-axis motor 32. Further, the upper surface of the wafer table 34 is a suction surface that communicates with a vacuum source (not shown), and a wafer W to be chamfered is placed and fixed by suction.

  FIG. 4 shows the configuration of the outer peripheral processing grindstone 52. The outer peripheral processing grindstone 52 has a two-stage configuration, the lower stage is a master grindstone 52A having a master groove 52a that forms the outer peripheral shape of the truer 41, and the upper stage is an outer peripheral rough grind groove 52b for forming a wafer W. It is a grinding wheel 52B.

  In FIG. 4, one groove is described for each grindstone in order to simplify the description. However, in order to cope with the deformation of the groove shape due to wear, a plurality of grindstones are actually provided for each grindstone. Grooves are formed.

  In the present embodiment, the truer 41 has a disk-shaped GC (Green silicon carbide) grindstone or WA (White fused aluminum) grindstone having the same or smaller outer diameter as the wafer W to be processed. The particle size of the grindstone is # 320.

  The master grindstone 52A was a diamond bonded metal bond grindstone with a diameter of 202 mm and had a particle size of # 600. The outer peripheral rough grinding wheel 52B is a diamond bonded metal bond grindstone having a diameter of 202 mm and a particle size of # 800.

  The peripheral grinding wheel 55 is a resin bond grindstone of diamond abrasive grains having a diameter of 50 mm, and has a particle size of # 3000. Further, the notch rough grinding wheel 61 has a small diameter of 1.8 mm to 2.4 mm, a diamond bond metal bond grindstone, grain size # 800, and the notch fine grinding wheel 58 has a diameter of 1.8 mm to 2.4 mm. A resin bond grindstone of diamond abrasive grains, grain size # 4000 is used.

  The outer peripheral grinding wheel spindle 51 is a built-in motor driven spindle using a ball bearing and is rotated at a rotational speed of 8,000 rpm. Further, the outer peripheral precision spindle 54 is a built-in motor driven spindle using an air bearing and is rotated at a rotational speed of 35,000 rpm.

  The notch rough spindle 60 is an air turbine driven spindle using an air bearing and is rotated at a rotational speed of 80,000 rpm. The notch precision spindle 57 is a built-in motor driven spindle using an air bearing and has a rotational speed of 150, Rotated at 000 rpm.

  Since the other components of the chamfering device 10 are generally well-known mechanisms, a detailed description is omitted.

  Next, the truing method according to the present invention will be described. First, chamfering is performed on the outer periphery of the truer 41 with the master grindstone 52A. In this processing, the master grindstone 52A is rotated at a rotational speed of 8,000 rpm. In this state, the Z table 31 is moved by the Z-axis drive means 30 and positioned so that the height of the truer 41 coincides with the master groove 52a of the master grindstone 52A.

  Next, the Y table 28 is moved toward the master grindstone 52A. FIG. 5A represents this state. By the movement of the Y table 28 in the Y direction, the outer peripheral portion of the truer 41 is cut into the master groove 52a of the master grindstone 52A, and the wafer table 34 is slowly rotated once by the θ-axis motor 32. The portion is chamfered, and the shape of the master groove 52 a is transferred to the outer peripheral portion of the truer 41. FIG. 5B shows this state.

  Next, as shown in FIG. 5C, the truer 41 is moved away from the master grindstone 52A, and the transfer from the cross-sectional shape of the master groove 52a of the master grindstone 52A to the cross-sectional shape of the outer peripheral portion of the truer 41 is completed. To do.

  Next, by using the truer 41 in which the cross-sectional shape of the master groove 52a is transferred to the outer peripheral portion, the chamfering grooves for the outer peripheral portion of the wafer W and the orientation flat portion are as shown in FIG. The rotating shaft is formed on the outer peripheral grinding wheel 55 inclined 8 degrees in the tangential direction of the wafer W. In this step, first, the Z table 31 is moved by the Z-axis driving means 30, and the height of the truer 41 is positioned at the outer peripheral groove forming position of the outer peripheral grinding wheel 55 as shown in FIG. .

  Next, the truer 41 is rotated at a high speed and moved in the Y direction, and as shown in FIG. 7A, the outer peripheral precision grinding wheel 55 is slowly moved into the outer peripheral groove forming position of the outer peripheral precision grinding stone 55. By rotating, an outer peripheral groove 55a is formed.

  At this time, if the outer diameter D of the wafer W to be processed is different from the outer diameter d of the truer 41, the two tables are moved simultaneously while controlling the movement amounts of the X table 24 and the Y table 28, thereby obtaining the truer. The truer 41 is reciprocated by a predetermined amount so that the periphery of 41 is along the arrow R shown in FIG.

  Thus, the outer peripheral groove 55a formed in the outer peripheral grinding wheel 55 is equivalent to that formed by a truing grindstone having an outer diameter equivalent to the outer diameter D of the wafer W to be processed. Therefore, it is not necessary to replace the truer 41 according to the outer diameter D of the wafer W.

  When the outer peripheral groove 55a is formed, the truer 41 is returned to the Y direction, and the Z table 31 moves to position the truer 41 at the orientation flat groove forming position of the outer peripheral grinding wheel 55. After positioning, the truer 41 is rotated at a high speed and moved in the Y direction. As shown in FIG. 8A, the orientation flat portion groove 55b is formed at the orientation flat portion groove forming position of the outer peripheral grinding wheel 55. .

  At this time, the truer 41 is reciprocated by a predetermined amount in the X direction by the X table 24, and the peripheral edge of the truer 41 in contact with the outer peripheral grinding wheel 55 moves linearly. As a result, the orientation flat portion groove 55b formed on the outer peripheral precision grinding wheel 55 has a groove shape suitable for chamfering of the orientation flat portion formed linearly on the wafer W.

  When the forming process of the orientation flat groove 55b is finished, the truer 41 is returned to the Y direction, and the truing of the outer peripheral grinding wheel 55 is finished.

  When the truing of the outer peripheral grinding wheel 55 is completed, the turntable 53 is rotated, the notch precision grinding wheel 58 is moved to the processing position, and the truing of the notch precision grinding wheel 58 is performed. Note that the rotation axis of the notch precision grinding wheel 58 is inclined in the Y direction, which is a direction connecting the center of the wafer W and the center of the notch portion.

  When the Z table 31 moves and the height of the truer 41 moves to the processing position of the notch fine grinding wheel 58 as shown in FIG. 9A, the truer 41 is rotated at a high speed and is moved in the Y direction so as to move the notch fine. The truing of the grinding wheel 58 is started.

  As shown in FIGS. 10A and 10B, the truer 41 cut into the notch fine grinding wheel 58 inclined toward the truer 41 (α = 20 degrees in this embodiment) is directed downward in the Z direction. The notch upper surface processing groove 58a is processed by moving.

  At this time, as shown in FIG. 9B, the truer 41 moves the two tables at the same time while controlling the movement amounts of the X table 24 and the Y table 28, so that the notch center of the wafer W is centered on the notch. Reciprocating is performed in the direction of arrow N (for example, 45 degrees with respect to the X direction in the present embodiment), which is parallel to the straight portion of the notch when facing the rotational axis of the grinding wheel 58. .

  As a result, the peripheral edge of the truer 41 in contact with the notch precision grinding wheel 58 moves linearly in a direction parallel to the notch portion straight portion, so that the notch upper surface processing groove 58a is formed on the wafer W upper surface side in the notch portion straight portion. The groove shape is suitable for chamfering.

  After the notch upper surface processing groove 58a is formed, the notch fine grinding wheel 58 is tilted in the direction opposite to the truer 41 (α = 20 degrees in this embodiment). As shown in FIG. 10C, the notch precision grinding wheel 58 tilted in the opposite direction Z is moved in the direction of the arrow N while reciprocating as shown in FIG. The notch lower surface machining groove 58b is formed by moving upward in the direction. Thus, the notch lower surface processing groove 58b has a groove shape suitable for chamfering on the lower surface side of the wafer W in the straight portion of the notch portion.

  When the truing of the notch lower surface machining groove 58b is finished, the truer 41 is returned to the Y direction, and the truing of the notch fine grinding wheel 58 is finished.

  By these methods, in the truing method of the chamfering grindstone according to the present invention, in the chamfering method in which the rotation axis of the chamfering grindstone is inclined by a predetermined angle with respect to the rotation axis of the wafer, one truing grindstone is not changed. A chamfering groove shape between the wafer outer peripheral portion and the orientation flat portion is formed on the chamfering grindstone.

  In addition, the chamfering of the notch part in which the rotation axis of the chamfering grindstone is inclined at a predetermined angle in the direction connecting the center of the wafer and the center of the notch part of the wafer is equivalent to that obtained by machining the groove for the outer peripheral part or orientation flat part. A truing grindstone can be trued to a chamfering grindstone for notches. Furthermore, since it is not necessary to change the truing grindstone even if the wafer diameters are different, truing of the chamfering grindstone can be performed efficiently.

  In the present embodiment, the truing of the chamfering grindstone in which the rotation axis is inclined by a predetermined angle in the tangential direction of the outer periphery of the wafer W has been described. However, the present invention is not limited to this, and the rotation axis is tangential to the outer periphery of the wafer W. In addition, it can be suitably used for truing a chamfering grindstone that is inclined at a predetermined angle.

  Further, when the notch upper surface processing groove 58a and the notch lower surface processing groove 58b are processed, the direction in which the truer 41 is reciprocated is not only the direction of the arrow N but also the direction of the arrow N ′ shown in FIG. 9B. Good. Further, the groove formed by reciprocating the truer 41 in the direction of the arrow N and the groove formed by reciprocating in the direction of the arrow N ′ can be suitably used even if they are separately formed on the notch precision grinding wheel 58. Is possible.

  In addition, although the description has been made in the form of specifying the position of the truer 41, such as the material, dimensions, particle size, and rotation speed of the truer 41 and each grindstone, the present invention is not limited to this, and the truer 41 is not limited thereto. As long as the shape can be transferred from the grinding wheel to the chamfering grindstone, it is possible to adapt to various materials, dimensions, particle sizes, rotation speeds, etc., or a truing dedicated device, a truing dedicated mechanism, and the like.

The front view which shows the principal part of the chamfering apparatus concerning this invention. The top view and front view showing the inclination mechanism of the chamfering grindstone for notches. The enlarged view around a wafer table. The side view which showed the outer periphery processing grindstone. The front view which showed the chamfering shape transcription | transfer to a truing grindstone. The front view and side perspective view which showed the truing operation | movement to an outer periphery fine grinding wheel. The front view and side perspective view which showed formation of the groove | channel shape for outer peripheral parts to the outer periphery fine grinding wheel. The front view and side perspective view which showed formation of the groove | channel shape for orientation flat parts to the outer periphery fine grinding wheel. The front view and side perspective view which showed the truing operation | movement to the notch precision grinding wheel. The front view which expanded and showed the truing operation | movement to the notch precision grinding wheel. The top view which showed the wafer with an orientation flat and the wafer with a notch.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Chamfering device, 24 ... X table, 28 ... Y table, 33 ... θ spindle, 34 ... Wafer table, 41 ... Truer (truing grindstone), 52 ... Peripheral processing grindstone, 54 ... Peripheral precision spindle, 55 ... Peripheral precision Grinding wheel (chamfer for chamfering), 55a ... groove for outer periphery, 55b ... groove for orientation flat part, 58 ... groove for notch precision grinding (grinding wheel for chamfering), 58a ... groove for notch upper surface, 58b ... groove for notch lower surface, W ... wafer

Claims (5)

In a truing method of a chamfering grindstone for forming a groove having a shape corresponding to a desired chamfering shape on a chamfering grindstone having a rotation axis inclined with respect to the rotation axis of the wafer,
A truing grindstone supported in parallel to the wafer and rotating on a rotation axis parallel to the rotation axis of the wafer is brought closer to the chamfering grindstone in a plane parallel to the wafer,
In a plane parallel to the wafer, the truing grindstone is reciprocated by a predetermined amount in a direction orthogonal to the approaching direction of the truing grindstone to the chamfering grindstone,
A truing method for a chamfering grindstone, wherein a groove having a shape corresponding to a chamfering shape of an orientation flat portion of the wafer is formed in the chamfering grindstone. In a truing method of a chamfering grindstone for forming a groove having a shape corresponding to a desired chamfering shape on a chamfering grindstone having a rotation axis inclined with respect to the rotation axis of the wafer,
A truing grindstone having the same outer diameter as that of the wafer is supported in parallel to the wafer, and is rotated on a rotation axis parallel to the rotation axis of the wafer and is directed to the chamfering grindstone in a plane parallel to the wafer. And approach
A truing method for a chamfering grindstone, wherein grooves having a shape corresponding to a chamfering shape of an outer peripheral portion of the wafer are formed in the chamfering grindstone. In a truing method of a chamfering grindstone for forming a groove having a shape corresponding to a desired chamfering shape on a chamfering grindstone having a rotation axis inclined with respect to the rotation axis of the wafer,
A truing grindstone that is supported in parallel to the wafer and rotates on a rotation axis parallel to the rotation axis of the wafer is brought closer to the chamfering grindstone in a plane parallel to the wafer,
In a plane parallel to the wafer, the peripheral edge of the truing grindstone is reciprocated by a predetermined amount on a locus corresponding to the arc of the outer periphery of the wafer,
A truing method for a chamfering grindstone, wherein grooves having a shape corresponding to a chamfering shape of an outer peripheral portion of the wafer are formed in the chamfering grindstone. In a truing method of a chamfering grindstone for forming a groove having a shape corresponding to a desired chamfering shape on a chamfering grindstone having a rotation axis inclined with respect to the rotation axis of the wafer,
A truing grindstone that is supported in parallel to the wafer and rotates on a rotation axis parallel to the rotation axis of the wafer is brought closer to the chamfering grindstone in a plane parallel to the wafer,
In a plane parallel to the wafer, the truing grindstone is reciprocated by a predetermined amount in a direction parallel to the linear portion of the notch when the notch portion center of the wafer is directed to the chamfering grindstone,
A truing method for a chamfering grindstone, wherein a groove having a shape corresponding to a chamfered shape of a notch portion of the wafer is formed in the chamfering grindstone.   The groove having a shape corresponding to the chamfering shape of the outer peripheral portion of the wafer and the groove having a shape corresponding to the chamfering shape of the orientation flat portion of the wafer are separately formed in the chamfering grindstone. A truing method for a chamfering grindstone according to claim 1 and claim 2 or claim 1 and claim 3.

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