JP2012024885A - Working device with cutting tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a working device with a cutting tool capable of suppressing the thermal expansion of a chuck table without causing tearing at a turning surface of a material to be worked and preventing the adhesion of cutting chips to the material to be worked.SOLUTION: The working device with the cutting tool includes: the chuck table 52 with a holding surface for holding the material to be worked; a turning means with the cutting tool 33 for cutting the material to be worked held at the chuck table 52; and a cooling water supply means 6 with a jet nozzle 61 for jetting cooling water to the turning surface of the material to be worked held at the chuck table 52 moving in a working area where the material to be worked is cut by a turning means. The jet nozzle 61 jets the cooling water from the rotational-direction upstream side of the cutting tool 33 to the rotational-direction downstream side thereof in the working area.

Description

  The present invention relates to a machining apparatus provided with a bite tool for turning a workpiece.

A semiconductor wafer in which a plurality of semiconductor chips are formed is divided into individual semiconductor chips by a dicing apparatus or the like, and the divided semiconductor chips are widely used in electric devices such as mobile phones and personal computers.
In recent years, in order to reduce the weight and size of electrical equipment, a bump having a protrusion of 50 to 100 μm is formed on an electrode of a semiconductor chip, and this bump is directly bonded to an electrode formed on a mounting substrate. A semiconductor chip called a flip chip has been developed and put into practical use. In addition, a technique for reducing the size by mounting a plurality of semiconductor chips on a substrate called an interposer or stacking them has been developed and put into practical use.

  However, each of the above-described technologies forms a plurality of protruding bumps (electrodes) on the surface of a substrate such as a semiconductor chip and bonds the substrates to each other via the protruding electrodes. ) Must be the same height. In order to make the height of the bumps (electrodes) in a protruding shape, grinding is generally used. However, when the bump (electrode) is ground, if the bump (electrode) is formed of a sticky metal such as gold, a burr is generated, and this burr is short-circuited to the adjacent bump (electrode). is there.

  As a technique for forming a plurality of bumps (electrodes) on the surface of a substrate such as a semiconductor chip, a ball is formed by heating and melting the tip of a wire such as gold, and the ball is then applied to the electrode of the semiconductor chip. There is a method of forming a stud bump in which the head of the ball is broken by thermocompression bonding with ultrasonic waves. Bumps (electrodes) formed by this stud bump formation method are difficult to polish because needle-shaped wrinkles are generated when the head of a thermocompressed ball is broken, and a heated plate is used as a bump. The bumps are pressed to align the height of the bumps.

  However, when the heated plate is pressed against the bumps so that the bumps have the same height, there is a problem that the bumps are short-circuited with adjacent bumps when the bump heads are crushed. Therefore, an extra process for removing the tip of the bump is provided to solve the above problem.

  In order to solve the above-described problem, there has been proposed a processing apparatus that turns and removes the tip portions of a plurality of electrodes formed to protrude from the surface of a plate-like object with a bite tool. A machining apparatus provided with this cutting tool includes a chuck table having a holding surface for holding a workpiece, a turning means having a cutting tool for turning the workpiece held on the chuck table, A machining feed mechanism for moving the chuck table and the turning means relative to each other in a machining feed direction in a horizontal plane parallel to the holding surface, and a cutting feed mechanism for moving the turning means in a cutting feed direction perpendicular to the holding surface. The turning means includes a rotary spindle, a bite tool mounting member attached to the lower end of the rotary spindle, and a bite tool attached to the bite tool mounting member at a position eccentric from the rotational axis. (For example, refer to Patent Document 1.)

JP 2005-327838 A

Thus, the processing apparatus disclosed in Patent Document 1 has a problem that the cutting tool surface is not sufficiently cooled during processing, and the turning surface of the workpiece is crumpled to reduce the quality of the workpiece. There is.
In addition, there is a problem that the machining accuracy of the workpiece is lowered due to slight thermal expansion of the chuck table due to frictional heat between the bite tool and the workpiece during machining.
Furthermore, there is a problem in that fine turning scraps generated by turning of the workpiece adhere to the workpiece due to static electricity generated by friction between the bite tool and the workpiece and deteriorate the quality.

  The present invention has been made in view of the above-described facts, and the main technical problem thereof is that the thermal expansion of the chuck table can be suppressed without causing musiness on the turning surface of the workpiece, and the workpiece can be processed. An object of the present invention is to provide a machining apparatus provided with a bite tool capable of preventing adhesion of turning scraps.

In order to solve the above main technical problem, according to the present invention, a chuck table having a holding surface for holding a workpiece and a bite tool for turning the workpiece held on the chuck table are provided. A turning means, and a chuck table moving mechanism for moving the chuck table in a machining feed direction in a horizontal plane parallel to the holding surface in a machining area where the workpiece is turned by the turning means, and the turning means rotates. In a processing apparatus equipped with a bite tool, comprising a spindle, a bite tool mounting member attached to the lower end of the rotary spindle, and a bite tool attached to the bite tool mounting member at a position eccentric from the rotational axis.
Comprising cooling water supply means provided with a jet nozzle for jetting cooling water to the turning surface of the workpiece held by the chuck table moving in the machining area;
The ejection nozzle ejects cooling water from the upstream side to the downstream side in the rotation direction of the cutting tool in the machining area.
There is provided a machining apparatus provided with a cutting tool characterized by the above.

  A processing apparatus according to the present invention includes a cooling water supply means including an ejection nozzle that ejects cooling water onto a turning surface of a workpiece held by a chuck table that moves in a machining area, and the ejection nozzle is disposed in the machining area. Since the cooling water is jetted from the upstream side to the downstream side in the rotation direction of the cutting tool, cooling water is supplied to the grinding surface of the workpiece and the cutting tool, so the cutting tool is sufficiently cooled. As a result, there is no stuffiness on the turning surface of the workpiece. Further, since the turning surface of the workpiece is also cooled, the chuck table is not heated, and a reduction in machining accuracy caused by thermal expansion of the chuck table is prevented. Furthermore, since the cooling water is ejected from the upstream side to the downstream side in the direction of rotation of the bite tool in the machining area by the bite tool, fine turning scraps can be washed away from the turning surface of the workpiece and adhere to the turning surface. Absent. In addition, since cooling water is ejected from the upstream side to the downstream side in the direction of rotation of the cutting tool in the machining area of the cutting tool, the resistance of water applied to the cutting tool is reduced, so that the cutting tool generates slight vibrations. There is nothing. Furthermore, since cooling water is supplied to the machining area by the bite tool and wet machining is performed, static electricity is less likely to be generated, and adhesion of turning scraps to the workpiece can be prevented.

The perspective view of the processing apparatus provided with the bite tool comprised according to this invention. The perspective view of the turning unit with which the processing apparatus shown in FIG. 1 is equipped. The perspective view which shows the chuck table mechanism and chuck table moving mechanism with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. Explanatory drawing which shows the relationship between the cooling water jetted from the jet nozzle of the cooling water supply means with which the processing apparatus shown in FIG. 1 is equipped, and the bite tool for turning the workpiece hold | maintained at the chuck table. The top view and principal part enlarged view of the semiconductor wafer as a to-be-processed object. Explanatory drawing of the turning process by the processing apparatus provided with the cutting tool shown in FIG. Explanatory drawing which shows the state which turned the bump (electrode) formed in the semiconductor chip with the processing apparatus provided with the bite tool shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a processing apparatus having a cutting tool constructed according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a machining apparatus having a bite tool constructed according to the present invention.
The processing apparatus in the illustrated embodiment includes an apparatus housing denoted as a whole by the number 2. The apparatus housing 2 has a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at the rear end portion (upper right end in FIG. 1) of the main portion 21 and extends upward. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. A turning unit 3 as a turning means is mounted on the pair of guide rails 221 and 221 so as to be movable in the vertical direction.

  The turning unit 3 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. A support member 313 is mounted on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22, and the spindle unit 32 is attached to the support member 313. It is done.

  The spindle unit 32 includes a spindle housing 321 mounted on a support member 313, a rotary spindle 322 rotatably disposed on the spindle housing 321, and a servo motor as a drive source for rotationally driving the rotary spindle 322. 323. The lower end of the rotary spindle 322 protrudes downward beyond the lower end of the spindle housing 321, and a disk-shaped tool tool mounting member 324 is provided at the lower end. The tool tool 33 is detachably mounted on the tool tool mounting member 324.

Here, the attachment / detachment structure of the cutting tool 33 to the cutting tool mounting member 324 will be described with reference to FIG.
The tool tool mounting member 324 is provided with a tool mounting hole 324a penetrating in a vertical direction in a part of the outer peripheral portion eccentric from the rotation axis, and the tool mounting is performed from the outer peripheral surface corresponding to the tool mounting hole 324a. A female screw hole 324b reaching the hole 324a is provided. The bite tool 33 is inserted into the bite mounting hole 324a of the bite tool mounting member 324 thus configured, and the tightening bolt 35 is screwed into the female screw hole 324b to be tightened. Removably attached to the. In the illustrated embodiment, the cutting tool 33 is formed of a cutting tool body 331 having a rectangular cross section formed of tool steel such as cemented carbide, and diamond or the like provided at the tip of the cutting tool body 331. What was comprised with the made cutting blade 332 is used. The tool tool 33 configured as described above and mounted on the tool tool mounting member 324 rotates in a plane parallel to a holding surface for holding a workpiece of a chuck table, which will be described later, by rotating the rotary spindle 322. I'm damned.

  Referring back to FIG. 1, the machining apparatus in the illustrated embodiment moves the turning unit 3 up and down along the pair of guide rails 221 and 221 (in a direction perpendicular to a holding surface of a chuck table described later). A turning unit feed mechanism 4 is provided. The turning unit feed mechanism 4 includes a male screw rod 41 disposed on the front side of the upright wall 22 and extending in the vertical direction. The male screw rod 41 is rotatably supported by bearing members 42 and 43 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and an output shaft of the pulse motor 44 is connected to the male screw rod 41 by transmission. A connecting portion (not shown) that protrudes rearward from the central portion in the width direction is also formed on the rear surface of the movable base 31, and a through female screw hole extending in the vertical direction is formed in the connecting portion. The male screw rod 41 is screwed into the female screw hole. Accordingly, when the pulse motor 44 is rotated forward, the moving base 31 and the turning unit 3 mounted on the moving base 31 are lowered or advanced, and when the pulse motor 44 is rotated reversely, the moving base 31 and the moving base 31 are mounted. The turned unit 3 is raised or retracted.

  1 and FIG. 3, a substantially rectangular machining work portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the machining work portion 211 includes a chuck table mechanism. 5 is disposed. As shown in FIG. 3, the chuck table mechanism 5 includes a support base 51 and a chuck table 52 disposed on the support base 51. The support base 51 slides on a pair of guide rails 23 and 23 extending in the direction indicated by the arrows 23a and 23b in the front-rear direction (the direction perpendicular to the front surface of the upright wall 22) on the processing work unit 211. The workpiece loading / unloading area 24 shown in FIG. 1 (position indicated by a solid line in FIG. 3) and the bite tool 33 constituting the spindle unit 32 are opposed to each other by a chuck table moving mechanism 56 described later. And the machining area 25 to be moved (position indicated by a two-dot chain line in FIG. 3).

  The chuck table 52 includes a chuck table main body 521 formed in a cylindrical shape by a metal material such as stainless steel, and an adsorption chuck 52 disposed on the upper surface of the chuck table main body 521. The suction chuck 52 is made of an appropriate porous material such as porous ceramics and communicates with a suction means (not shown). Therefore, by selectively communicating the suction chuck 52 with a suction means (not shown), the workpiece placed on the holding surface which is the upper surface is sucked and held. The illustrated chuck table mechanism 5 includes a cover member 54 that has a hole through which the chuck table 52 is inserted, covers the support base 51 and the like, and is movably disposed together with the support base 51.

  Continuing with reference to FIG. 3, the machining apparatus in the illustrated embodiment includes a chuck table moving mechanism 56 that moves the chuck table mechanism 5 along the pair of guide rails 23 in the directions indicated by the arrows 23 a and 23 b. It has. The chuck table moving mechanism 56 includes a male screw rod 561 disposed between the pair of guide rails 23 and 23 and extending in parallel with the guide rails 23 and 23, and a servo motor 562 that rotationally drives the male screw rod 561. The male screw rod 561 is screwed into a screw hole 511 provided in the support base 51, and its tip is rotatably supported by a bearing member 563 attached by connecting a pair of guide rails 23, 23. ing. The servo motor 562 has a drive shaft connected to the base end of the male screw rod 561 by transmission. Accordingly, when the servo motor 562 rotates in the forward direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23a. When the servo motor 562 rotates in the reverse direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23b. It can be moved. Thus, the chuck table mechanism 5 moved in the directions indicated by the arrows 23a and 23b is selectively positioned in the workpiece loading / unloading area indicated by the solid line and the machining area indicated by the two-dot chain line in FIG. Further, the chuck table moving mechanism 56 is reciprocated in the direction indicated by the arrows 23 a and 23 b over a predetermined range in the processing region, that is, in parallel with the holding surface which is the upper surface of the suction chuck 52.

  Returning to FIG. 1, the description will be continued. On the both sides of the moving direction of the cover member 54 constituting the chuck table mechanism 5, the cross-sectional shape is a reverse channel shape, and the pair of guide rails 23, 23 and the male screw rod Bellows means 57 and 58 are attached to cover 561, servo motor 562 and the like. The bellows means 57 and 58 can be formed from any suitable material such as campus cloth. The front end of the bellows means 57 is fixed to the front wall of the processing unit 211, and the rear end is fixed to the front end surface of the cover member 54 of the chuck table mechanism 5. The front end of the bellows means 58 is fixed to the rear end surface of the cover member 54 of the chuck table mechanism 5, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the chuck table mechanism 5 is moved in the direction indicated by the arrow 23a, the bellows means 57 is expanded and the bellows means 58 is contracted, and when the chuck table mechanism 5 is moved in the direction indicated by the arrow 23b, the bellows means. 57 is contracted and the bellows means 58 is extended.

  1, the machining apparatus provided with the bite tool in the illustrated embodiment injects cooling water onto the turning surface of the workpiece held by the chuck table 52 that moves in the machining area 25. Cooling water supply means 6 is provided. This cooling water supply means 6 is disposed on the side of the moving path of the chuck table 52 that moves in the machining area 25, and is thin on the turning surface of the workpiece held by the chuck table 52 that moves in the machining area 25. There is provided an ejection nozzle 61 having an ejection port (for example, an opening having a width of 50 mm and a length of 1 mm) for ejecting the cooling water. As shown in FIG. 4, it is important that the ejection nozzle 61 is disposed so as to eject cooling water from the upstream side toward the downstream side in the rotational direction indicated by the arrow 33a of the cutting tool 33 in the machining region. The cooling water supply means 6 supplies pure water as cooling water.

  The description will be continued based on FIG. 1. On the front half of the main portion 21 of the apparatus housing 2, a first cassette placement area 11 a, a second cassette placement area 12 a, and a workpiece temporary placement area 13a and a cleaning region 14a are provided. A first cassette 11 for accommodating a workpiece before processing is placed in the first cassette placement area 11a, and a second cassette for accommodating the workpiece after machining is placed in the second cassette placement area 12a. The cassette 12 is placed. In the workpiece temporary placement area 13a, the workpiece temporary placing means for temporarily placing the workpiece before being unloaded from the first cassette 11 placed in the first cassette placement area 11a. 13 is disposed. The cleaning area 14a is provided with cleaning means 14 for cleaning the processed workpiece.

  A workpiece transfer means 15 is disposed between the first cassette placement area 11a and the second cassette placement area 12a. The workpiece transfer means 15 is a first cassette placement area. The unprocessed workpiece housed in the first cassette 11 placed in the region 11a is transferred to the workpiece temporary storage means 13 and the processed workpiece cleaned by the cleaning means 14 is removed. It is transported to the second cassette 12 placed in the second cassette placement area 12a. A workpiece loading means 16 is disposed between the workpiece temporary storage area 13a and the workpiece loading / unloading area 24. The workpiece loading means 16 is a workpiece loading means 16. The unprocessed workpiece placed on the temporary placing means 13 is transferred onto the chuck table 52 of the chuck table mechanism 5 positioned in the workpiece loading / unloading area 24. A workpiece unloading means 17 is disposed between the workpiece loading / unloading area 24 and the cleaning unit 14a, and the workpiece unloading means 17 is a workpiece loading / unloading area. The processed workpiece placed on the chuck table 52 positioned at 24 is conveyed to the cleaning means 14.

  The workpiece before processing accommodated in the first cassette 11 includes a semiconductor wafer 10 having a plurality of semiconductor chips 110 formed in a lattice shape on the surface as shown in FIG. A plurality of stud bumps (electrodes) 120 are formed on the surfaces of the plurality of semiconductor chips 110 formed on the semiconductor wafer 10. For example, as shown in FIG. 5B, the stud bump (electrode) 120 is attached by heating and melting a gold wire to an electrode plate 130 made of, for example, aluminum formed on the semiconductor chip 110. The plurality of stud bumps (electrodes) 120 formed in this way are in a state in which the needle-like ridges 121 remain as shown in FIG. 5B, and the heights thereof vary.

  The first cassette 11 containing the workpiece as described above is placed on the first cassette placement region 11 a of the apparatus housing 2. And when all the workpieces before processing which were stored in the 1st cassette 11 mounted in the 1st cassette mounting field 11a are carried out, it will replace with the cassette 11 which became empty, and a plurality of A new cassette 11 containing a workpiece to be processed is manually placed on the first cassette placement area 11a. On the other hand, when a predetermined number of processed workpieces are loaded into the second cassette 12 placed in the second cassette placement area 12a of the apparatus housing 2, the second cassette 12 is manually carried out. Then, a new empty second cassette 12 is placed.

The machining apparatus provided with the cutting tool in the illustrated embodiment is configured as described above, and the operation thereof will be described below mainly with reference to FIG.
The semiconductor wafer 10 as a workpiece before processing accommodated in the first cassette 11 is conveyed by the vertical movement and advancing / retreating operation of the workpiece conveying means 15 and placed on the workpiece temporary placing means 13. The semiconductor wafer 10 placed on the workpiece temporary placement means 13 is positioned in the workpiece loading / unloading region 24 by the turning operation of the workpiece loading means 16 after being centered here. It is placed on the chuck table 52 of the table mechanism 5. The semiconductor wafer 10 placed on the chuck table 52 is sucked and held on the chuck table 52 by suction means (not shown).

  If the semiconductor wafer 10 is sucked and held on the chuck table 52, the chuck table moving mechanism 56 (see FIG. 3) is operated to move the chuck table mechanism 5 in the direction indicated by the arrow 23a, and the chuck holding the semiconductor wafer 10 is held. The table 52 is positioned in the processing area 25. When the chuck table 52 holding the semiconductor wafer 10 is positioned in the processing region 25 in this way, a plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 are provided. Perform a turning process to turn and align the height.

  First, the rotary spindle 322 is driven to rotate, and the tool tool mounting member 324 to which the tool tool 33 is attached is rotated in the direction indicated by the arrow 33a in FIG. 6 at a rotational speed of, for example, 6000 rpm. Then, the turning unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position. Next, for example, when the turning width of the cutting edge 332 of the cutting tool 33 is about 20 μm, the chuck table 52 holding the semiconductor wafer 10 is moved to the right as shown by the arrow 23a from the position shown by the solid line in FIG. For example, it moves at a feed rate of 2 mm / sec. As a result, the upper ends of the plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 by the cutting edge 332 of the cutting tool 33 that rotates as the rotary spindle 322 rotates. Scraped off. Then, as shown by a two-dot chain line in FIG. 6, the center of the semiconductor wafer 10 held on the chuck table 52 moves to the center position of the bite tool mounting member 324, whereby the semiconductor chip 110 provided on the semiconductor wafer 10. All of the plurality of stud bumps (electrodes) 120 formed on the surface are removed by turning as shown in FIG. 7, and their heights are aligned (turning process).

  In the turning process described above, the cooling water supply means 6 is actuated to eject the nozzle 61 from the upstream side to the downstream side in the rotational direction indicated by the arrow 33a of the cutting tool 33 in the machining area by the cutting tool 33 as shown in FIG. To blow out cooling water. The supply amount of the cooling water is set to 2 liters per minute in the illustrated embodiment. As a result, the cooling water is supplied to the turning surface of the semiconductor wafer 10 and the cutting tool 33, so that the cutting tool 33 is sufficiently cooled, and the turning surface of the semiconductor wafer 10 is not muted. Further, since the turning surface of the semiconductor wafer 10 is also cooled, the chuck table 52 is not heated, and a reduction in processing accuracy caused by the thermal expansion of the chuck table 52 is prevented. Further, since the cooling water is ejected from the upstream side to the downstream side in the rotation direction indicated by the arrow 33a of the cutting tool 33 in the machining area by the cutting tool 33, fine turning scraps are washed away from the turning surface of the semiconductor wafer 10 and turned. It does not adhere to the surface. In the illustrated embodiment, since the cooling water is ejected from the upstream side to the downstream side in the rotational direction indicated by the arrow 33a of the cutting tool 33 in the machining area of the cutting tool 33, the resistance of the water applied to the cutting tool 33 As a result, the tool tool 33 is not vibrated slightly.

  As described above, when the turning process of the plurality of bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 is completed, the turning unit 3 is raised and the rotation of the chuck table 52 is stopped. . Next, the chuck table 52 is moved in the direction indicated by the arrow 23b in FIG. 1 to be positioned in the workpiece loading / unloading area 24, and the suction holding of the turned semiconductor wafer 10 on the chuck table 52 is released. Then, the semiconductor wafer 10 whose suction holding is released is carried out by the workpiece carrying-out means 17 and conveyed to the cleaning means 14. The semiconductor wafer 10 conveyed to the cleaning means 14 is cleaned here. The semiconductor wafer 10 cleaned by the cleaning unit 14 is stored in a predetermined position of the second cassette 12 by the workpiece transfer unit 15.

2: Device housing 3: Grinding unit 31: Moving base 32: Spindle unit 321: Spindle housing 322: Rotating spindle 323: Servo motor 324: Tool mounting member 33: Tool tool 331: Tool body 332: Cutting blade 4: Turning unit Feed mechanism 44: Pulse motor 5: Chuck table mechanism 51: Support base 52: Chuck table 53: Servo motor 54: Cover member 56: Chuck table moving mechanism 57, 58: Bellows means 6: Cooling water supply means 61: Jet nozzle 11: First cassette 12: Second cassette 13: Workpiece temporary placement means 14: Cleaning means 15: Workpiece transport means 16: Workpiece carry-in means 17: Workpiece carry-out means 10: Semiconductor wafer 110 : Semiconductor chip 120: Bump (electrode)
130: Electrode plate

Claims (1)

A chuck table having a holding surface for holding a workpiece, a turning means having a bite tool for turning the workpiece held on the chuck table, and a machining for turning the workpiece by the turning means A chuck table moving mechanism for moving the chuck table in a machining feed direction in a horizontal plane parallel to the holding surface in the region, wherein the turning means is a rotating spindle and a tool tool mounting member mounted on the lower end of the rotating spindle; In a processing apparatus equipped with a bite tool, comprising a bite tool mounted on the bite tool mounting member at a position eccentric from the rotational axis,
Comprising cooling water supply means provided with a jet nozzle for jetting cooling water to the turning surface of the workpiece held by the chuck table moving in the machining area;
The ejection nozzle ejects cooling water from the upstream side to the downstream side in the rotation direction of the cutting tool in the machining area.
A processing apparatus having a bite tool characterized by the above.

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