JP5816060B2 - Processing equipment - Google Patents

Description

  The present invention relates to a machining apparatus provided with a bite tool for turning a workpiece.

A semiconductor wafer in which a plurality of semiconductor chips are formed is divided into individual semiconductor chips by a dicing apparatus or the like, and the divided semiconductor chips are widely used in electric devices such as mobile phones and personal computers.
In recent years, in order to reduce the weight and size of electrical equipment, a bump having a protrusion of 50 to 100 μm is formed on an electrode of a semiconductor chip, and this bump is directly bonded to an electrode formed on a mounting substrate. A semiconductor chip called a flip chip has been developed and put into practical use. In addition, a technique for reducing the size by mounting a plurality of semiconductor chips on a substrate called an interposer or stacking them has been developed and put into practical use.

  However, each of the above-described technologies forms a plurality of protruding bumps (electrodes) on the surface of a substrate such as a semiconductor chip and bonds the substrates to each other via the protruding electrodes. ) Must be the same height. In order to make the height of the bumps (electrodes) in a protruding shape, grinding is generally used. However, when the bump (electrode) is ground, if the bump (electrode) is formed of a sticky metal such as gold, a burr is generated, and this burr is short-circuited to the adjacent bump (electrode). is there.

  As a technique for forming a plurality of bumps (electrodes) on the surface of a substrate such as a semiconductor chip, a ball is formed by heating and melting the tip of a wire such as gold, and the ball is then applied to the electrode of the semiconductor chip. There is a method of forming a stud bump in which the head of the ball is broken by thermocompression bonding with ultrasonic waves. Bumps (electrodes) formed by this stud bump formation method are difficult to polish because needle-shaped wrinkles are generated when the head of a thermocompressed ball is broken, and a heated plate is used as a bump. The bumps are pressed to align the height of the bumps. (For example, refer to Patent Document 1.)

  However, when the heated plate is pressed against the bumps so that the bumps have the same height, there is a problem that the bumps are short-circuited with adjacent bumps when the bump heads are crushed. In order to solve this problem, in the invention described in the above publication, an extra step of removing the tip of the bump is provided.

  In order to solve the above-described problem, there has been proposed a processing apparatus that turns and removes the tip portions of a plurality of electrodes formed to protrude from the surface of a plate-like object with a bite tool. (For example, see Patent Document 2.)

JP 2001-53097 A JP 2004-319697 A

  The above-mentioned processing apparatus equipped with a bite tool for turning a workpiece requires about 4 to 5 minutes to process one wafer, and is not necessarily satisfactory in terms of productivity. Absent. In addition, since this type of processing apparatus is installed in a room with a relatively high unit price called a clean room, downsizing is required.

  This invention is made | formed in view of the said fact, The main technical subject is to provide the processing apparatus which can improve productivity, without enlarging the whole apparatus.

In order to solve the above main technical problem, according to the present invention, a chuck table having a holding surface for holding a workpiece and a bite tool for turning the workpiece held on the chuck table are provided. Turning means, workpiece loading / unloading area for loading / unloading a workpiece to / from the chuck table, chuck table moving means for moving the chuck table to a machining area processed by the turning means, and a workpiece before machining A first cassette placement area for placing the first cassette in which the first cassette is stored, and a workpiece to be processed unloaded from the first cassette placed in the first cassette placement area. Temporarily placing the workpiece temporarily placing means and the workpiece temporarily placed on the workpiece temporarily placing means before loading into the chuck table positioned in the workpiece loading / unloading area Workpiece transport Means, cleaning means for cleaning the processed workpiece, a second cassette placement area for placing a second cassette containing the processed workpiece, and loading and unloading of the workpiece A workpiece unloading means for unloading the processed workpiece placed on the chuck table positioned in the region to an unloading and cleaning means; and the workpiece unloading means placed on the first cassette placement region A workpiece to be processed before being stored in the first cassette is transported to the workpiece temporary storage means, and the workpiece to be processed which has been cleaned by the cleaning means is transferred to the second cassette mounting area. A workpiece conveying means for conveying the workpiece to the second cassette placed on the machine,
The chuck table includes a first chuck table and a second chuck table,
The turning means turns the first workpiece having a cutting tool for turning the workpiece held on the first chuck table and the workpiece held on the second chuck table. Comprising a second turning means with a tool for
The chuck table moving means includes a first workpiece loading / unloading area for loading / unloading a workpiece onto / from the first chuck table and a first machining area for machining by the first turning means. The first chuck table moving means for moving the chuck table, the second workpiece loading / unloading area for loading / unloading the workpiece onto / from the second chuck table, and the second turning means for machining. A second chuck table moving means for moving the second chuck table to the machining area of
The workpiece carry-in means includes the first chuck table positioned in the first workpiece carry-in / carry-out area, and the workpiece before being temporarily placed on the workpiece temporary placing means, and the first chuck table, Carry in to the second chuck table positioned in the second workpiece carry-in / out region;
The workpiece unloading means includes the first chuck table positioned in the first workpiece loading / unloading area and the second chuck positioned in the second workpiece loading / unloading area. Unloading the processed workpiece placed on the table and transporting it to the cleaning means;
The processing apparatus characterized by this is provided.

The workpiece carrying-in means includes a suction holding pad for holding a workpiece, an operating arm having the suction holding pad attached to one end, a pivot shaft attached to the other end of the working arm, and the pivot shaft. The first chuck table and the second chuck table are positioned in the workpiece temporary placement means and the first workpiece loading / unloading region with the suction holding pad pivoted around the working arm and attached to one end of the working arm. Positioning means positioned on the second chuck table positioned in the workpiece loading / unloading area, and the workpiece unloading means includes a suction holding pad for sucking and holding the workpiece, An operation arm having a suction holding pad attached to one end thereof, a turning shaft attached to the other end of the operation arm, and a suction holding attached to one end of the operation arm by turning the operation arm around the turning axis. On the first chuck table positioned in the first workpiece loading / unloading area and on the second chuck table positioned in the second workpiece loading / unloading area and on the cleaning means And positioning means for positioning.
Further, the first turning means and the second turning means are attached to the lower ends of the first rotating spindle and the second rotating spindle, respectively, and a first cutting tool to which a first cutting tool and a second cutting tool are respectively attached. A tool mounting member and a second tool tool mounting member are provided, and the first tool tool mounting member and the second tool tool mounting member are set so that the rotation directions are opposite to each other.

  The processing apparatus according to the present invention includes a first chuck table and a second chuck table having a holding surface for holding a workpiece, and a workpiece held on the first chuck table and the second chuck table. First turning means and second turning means provided with a bite tool for turning, a first workpiece loading / unloading area for loading / unloading a workpiece onto / from the first chuck table, and first turning A first chuck table moving means for moving the first chuck table to a first processing area to be processed by the means, and a second workpiece loading / unloading area for loading / unloading the workpiece onto / from the second chuck table; Workpiece before processing mounted on workpiece to be temporarily placed, provided with second chuck table moving means for moving the second chuck table to the second machining area to be machined by the second turning means Is carried into the first chuck table positioned in the first workpiece loading / unloading area and the second chuck table positioned in the second workpiece loading / unloading area by the workpiece loading means. The first chuck table positioned in the first workpiece carry-in / out region and the second chuck table positioned in the second workpiece carry-in / out region after processing Since the workpiece is transported to the unloading and cleaning means by the workpiece unloading means, it has twice the processing capacity and productivity even though the size of the processing equipment is approximately one unit. Will improve. Further, the first cassette placing section and the second cassette placing section, the workpiece temporary placing means, the cleaning means, the workpiece conveying means, the workpiece carrying means, and the workpiece unloading means are the first chuck. Since it is shared by the table and the second chuck table, the cost can be suppressed and it is economical and the apparatus can be downsized.

The perspective view of the processing apparatus comprised according to this invention. The 1st turning unit with which the processing apparatus shown in FIG. 1 is equipped, and the 2nd turning unit perspective view. The perspective view which shows the 1st chuck table mechanism and 2nd chuck table mechanism, 2nd chuck table moving means, and 2nd chuck table moving means with which the processing apparatus shown in FIG. 1 is equipped. The perspective view of the workpiece carrying-in means with which the processing apparatus shown in FIG. 1 is equipped. The perspective view of the workpiece carrying-out means with which the processing apparatus shown in FIG. 1 is equipped. The top view and principal part enlarged view of the semiconductor wafer as a to-be-processed object. Explanatory drawing of the turning process by the processing apparatus shown in FIG. Explanatory drawing which shows the state which turned the bump (electrode) formed in the semiconductor chip with the processing apparatus shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a perspective view of a processing apparatus constructed in accordance with the present invention.
The processing apparatus in the illustrated embodiment includes an apparatus housing denoted as a whole by the number 2. The apparatus housing 2 has a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at the rear end portion (upper right end in FIG. 1) of the main portion 21 and extends upward. A pair of first guide rails 221 a and 221 a and a pair of second guide rails 221 b and 221 b extending in the vertical direction are provided on the front surface of the upright wall 22. The first and second guide rails 221a and 221a and the second guide rails 221b and 221b are respectively provided with a first turning unit 3a as a first turning means and a second turning unit 3b as a second turning means. It is mounted so as to be movable. Note that the first turning unit 3a and the second turning unit 3b have substantially the same configuration.

  The first turning unit 3a and the second turning unit 3b are respectively connected to the first moving base 31a and the second moving base 31b, and the first moving base 31a and the second moving base 31b. A first spindle unit 32a and a second spindle unit 32b are mounted. The first moving base 31a and the second moving base 31b are provided with a pair of first legs 311a, 311a and second legs 311b, 311b extending in the vertical direction on both sides of the rear surface, respectively. The pair of first leg portions 311a, 311a and second leg portions 311b, 311b are slidably engaged with the first guide rails 221a, 221a and the second guide rails 221b, 221b. Guided grooves 312a and 312a and second guided grooves 312b and 312b are formed. In this way, the first moving base 31a and the second moving base that are slidably mounted on the first guide rails 221a and 221a and the second guide rails 221b and 221b provided on the upright wall 22, respectively. A first support member 313a and a second support member 313b are mounted on the front surface of 31b, and the first spindle unit 32a and the second spindle unit 32b are attached to the first support member 313a and the second support member 313b. Are attached respectively.

  The first spindle unit 32a and the second spindle unit 32b include a first spindle housing 321a and a second spindle housing 321b mounted on the first support member 313a and the second support member 313b, respectively. A first rotating spindle 322a and a second rotating spindle 322b, which are rotatably disposed in one spindle housing 321a and a second spindle housing 321b, and the first rotating spindle 322a and the second rotating spindle 322b. A first servo motor 323a and a second servo motor 323b are provided as drive sources for rotational driving. The lower ends of the first rotating spindle 322a and the second rotating spindle 322b are projected downward beyond the lower ends of the first spindle housing 321a and the second spindle housing 321b, respectively, and the lower ends thereof are discs. A first tool tool mounting member 324a and a second tool tool mounting member 324b having a shape are provided. The first tool tool 33a and the second tool tool 33b are detachably mounted on the first tool tool mounting member 324a and the second tool tool mounting member 324b, respectively.

Here, a structure for attaching and detaching the first tool tool 33a and the second tool tool 33b to the first tool tool mounting member 324a and the second tool tool mounting member 324b will be described with reference to FIG.
The first tool tool mounting member 324a and the second tool tool mounting member 324b are provided with a first tool mounting hole 325a and a second tool mounting hole 325b penetrating in a vertical direction in a part of the outer peripheral portion. And a first female screw hole 326a reaching the first bite mounting hole 325a and the second bite mounting hole 325b from the outer peripheral surface corresponding to the first bite mounting hole 325a and the second bite mounting hole 325b, and A second female screw hole 326b is provided. The first tool tool 33a and the second tool tool mounting member 324a and the second tool tool mounting member 324b configured as described above are inserted into the first tool tool mounting hole 325a and the second tool tool mounting hole 325b, respectively. The first bite tool 33b is inserted, and the first biting tool 35b and the second biting bolt 35b are screwed into the first female screw hole 326a and the second female screw hole 326b, and then tightened. 33a and the second tool tool mounting member 33b are detachably mounted on the first tool tool mounting member 324a and the first tool tool mounting member 324b. In the illustrated embodiment, the first bite tool 33a and the second bite tool 33b include a bite body 331a and 331b formed in a rod shape from tool steel such as super steel alloy, and the bite body 331a and the bite body. What was comprised by the cutting blade 332a and the cutting blade 332b which were formed with the diamond etc. which were each provided in the front-end | tip part of 331b is used. The first tool tool 33a and the second tool tool 33b, which are configured in this way and are mounted on the first tool tool mounting member 324a and the second tool tool mounting member 324b, have the first rotary spindle 322a and As the second rotating spindle 322b rotates, the second rotating spindle 322b is rotated in a plane parallel to a holding surface for holding workpieces of a first chuck table and a second chuck table, which will be described later.

  Returning to FIG. 1, the description of the machining apparatus in the illustrated embodiment is such that the first turning unit 3 a and the second turning unit 3 b are respectively connected to the first guide rails 221 a, 221 a and the second guide rail. A first turning unit feed mechanism 4a and a second turning unit feed mechanism 4b that move in the vertical direction (direction perpendicular to the holding surfaces of the first chuck table and the second chuck table described later) along 221b and 221b. It has. The first turning unit feed mechanism 4a and the second turning unit feed mechanism 4b each include a first male screw rod 41a and a second male screw rod 41b that are disposed on the front side of the upright wall 22 and extend in the vertical direction. ing. The first male screw rod 41a and the second male screw rod 41b have a first upper bearing member 42a and a second upper bearing member 42b whose upper and lower ends are attached to the upright wall 22, and a first lower part. The bearing member 42a and the second lower bearing member 42b are rotatably supported. The first upper bearing member 42a and the second upper bearing member 42b include a first pulse motor 44a and a second pulse motor 44a as driving sources for rotationally driving the first male screw rod 41a and the second male screw rod 41b. A pulse motor 44b is provided, and the output shafts of the first pulse motor 44a and the second pulse motor 44b are connected to the first male screw rod 41a and the second male screw rod 41b, respectively. A connecting portion (not shown) that protrudes rearward from the center in the width direction is also formed on the rear surfaces of the first moving base 31a and the second moving base 31b. The first male screw rod 41a and the second male screw rod 41b are screwed into the female screw hole. Accordingly, when the first pulse motor 44a and the second pulse motor 44b rotate forward, the first moving base 31a and the second moving base 31b, that is, the first turning unit 3a and the second turning unit 3b are respectively turned on. When the first pulse motor 44a and the second pulse motor 44b are reversed, the moving base 31, that is, the first turning unit 3a and the second turning unit 3b are raised or retracted, respectively.

  The description will be continued with reference to FIG. 1. A substantially rectangular machining portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the machining portion 211 includes a first chuck table mechanism. 5a and the second chuck table mechanism 5b are arranged in parallel. Hereinafter, the first chuck table mechanism 5a and the second chuck table mechanism 5b will be described with reference to FIG. Since the first chuck table mechanism 5a and the second chuck table mechanism 5b have substantially the same configuration, FIG. 3 will be described with the components having the same reference numerals.

  The first chuck table mechanism 5a and the second chuck table mechanism 5b shown in FIG. 3 respectively include a first support base 51a and a second support base 51b, and the first support base 51a and the second support base 51b. The first chuck table 52a and the second chuck table 52b disposed on the support base 51b. The first support base 51a and the second 51b are each paired to extend in the direction indicated by the arrows 23a and 23b in the front-rear direction (direction perpendicular to the front surface of the upright wall 22) on the processing work part 211. The first and second guide rails 23a and 23a and the pair of second guide rails 23b and 23b are slidably mounted. First chuck table moving means 56a and second chuck table moving means, which will be described later, respectively. 56b, the first workpiece loading / unloading area 24a and the second workpiece loading / unloading area 24b (positions shown by solid lines in FIG. 3), the first spindle unit 32a and the second spindle The first machining area 25a and the second machining area 25b (the two-dot chain line in FIG. 3) facing the first and second tool tools 33a and 33b constituting the spindle unit 32b. Position).

  The first chuck table 52a and the second chuck table 52b include a first chuck table main body 521a and a second chuck table main body 521b formed in a cylindrical shape by a metal material such as stainless steel, and the first chuck table main body 521b. The chuck table body 521a and the second chuck table body 521b are composed of a first suction chuck 522a and a second suction chuck 522b disposed on the upper surface of the chuck table body 521a. The first suction chuck 522a and the second suction chuck 522b are made of an appropriate porous material such as porous ceramics, and communicate with suction means (not shown). Accordingly, by selectively communicating the first suction chuck 522a and the second suction chuck 522b to a suction means (not shown), the workpiece placed on the holding surface which is the upper surface is sucked and held. The first chuck table mechanism 5a and the second chuck table mechanism 5b shown in the figure have holes through which the first chuck table 52a and the second chuck table 52b are inserted, and the first support base 51a and A first cover member 54a and a second cover member 54b are provided so as to cover the second 51b and the like and to be movable together with the first support base 51a and the second 51b.

  Continuing the description with reference to FIG. 3, the machining apparatus in the illustrated embodiment uses the first chuck table 52a and the second chuck table 52b as a pair of first guide rails 23a and 23a and a pair of second guides. Are provided with first chuck table moving means 56a and second chuck table moving means 56b which are moved in the directions indicated by arrows A and B along the guide rails 23b and 23b. The first chuck table moving means 56a and the second chuck table moving means 56b are respectively disposed between the pair of first guide rails 23a, 23a and the pair of second guide rails 23b, 23b, respectively. The first male screw rod 561a and the second male screw rod 561b extending in parallel with the guide rails 23a and 23a and the second guide rails 23b and 23b, and the first male screw rod 561a and the second male screw rod 561b are driven to rotate. The first servo motor 562a and the second servo motor 562b are provided. The first male screw rod 561a and the second male screw rod 561b are screwed into the first screw hole 511a and the first screw hole 511b provided in the first support base 51a and the second 51b, respectively. The tip portion is rotatably supported by a first bearing member 563a and a second bearing member 563b disposed between the pair of first guide rails 23a and 23a and the pair of second guide rails 23b and 23b. Has been. The first servo motor 562a and the second servo motor 562b are connected in transmission to the base ends of the male screw rod 561a and the second male screw rod 561b whose drive shafts are one. Therefore, when the first servo motor 562a and the second servo motor 562b rotate forward, the first support base 51a and the second support base 51b, that is, the first chuck table mechanism 5a and the second chuck table mechanism 5b. Moves in the direction indicated by the arrow A, and the first servo motor 562a and the second servo motor 562b are reversed, the first support base 51a and the second support base 51b, that is, the first chuck table mechanism 5a and The second chuck table mechanism 5b is moved in the direction indicated by the arrow B. The first chuck table mechanism 5a and the second chuck table mechanism 5b that are moved in the directions indicated by the arrows A and B in this way are the first workpiece loading / unloading area 24a and the first chuck table mechanism 5b indicated by solid lines in FIG. 2 workpiece loading / unloading areas 24b (workpiece loading / unloading areas 24a and 24b in FIG. 1) and first machining area 25a and second machining area 25b (two machining areas in FIG. 1). 25a, 25b). The first chuck table moving means 56a and the second chuck table moving means 56b are respectively arranged in directions indicated by arrows A and B over a predetermined range in the first processing area 25a and the second processing area 25b, respectively. In other words, the first suction chuck 522a and the second suction chuck 522b are reciprocated in parallel with the holding surface which is the upper surface of the first suction chuck 522a and the second suction chuck 522b.

  Returning to FIG. 1, the description will be continued. On the both sides in the moving direction of the cover members 54a and 54b constituting the first chuck table mechanism 5a and the second chuck table mechanism 5b, the cross-sectional shape is an inverted channel shape. The pair of first guide rails 23a, 23a, the pair of second guide rails 23b, 23b, the first male screw rod 561a, the second male screw rod 561b, the first servo motor 562a, and the second servo. First front bellows means 57a and second front bellows means 57b, first rear bellows means 58a and second rear bellows means 58b covering motor 562b and the like are provided. The first front bellows means 57a, the second front bellows means 57b, the first rear bellows means 58a, and the second rear bellows means 58b can be formed of an appropriate material such as a campus cloth. The front ends of the first front bellows means 57a and the second front bellows means 57b are fixed to the front wall of the working portion 211, and the rear ends are the first chuck table mechanism 5a and the first chuck table mechanism 5b. The cover member 54a and the second cover member 54b are fixed to the front end surfaces. The front ends of the first rear bellows means 58a and the second rear bellows means 58b are connected to the first cover member 54a and the second cover member 54b of the first chuck table mechanism 5a and the second chuck table mechanism 5b. The rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the first chuck table mechanism 5a and the second chuck table mechanism 5b are moved in the direction indicated by the arrow A, the first front bellows means 57a and the second front bellows means 57b are extended and the first chuck table mechanism 5a and the second chuck table mechanism 5b are extended. When the rear accordion means 58a and the second rear accordion means 58b are contracted and the first chuck table mechanism 5a and the second chuck table mechanism 5b are moved in the direction indicated by the arrow B, the first front side The bellows means 57a and the second front bellow means 57b are contracted, and the first rear bellow means 58a and the second rear bellow means 58b are extended.

  The description will be continued based on FIG. 1. On the front half of the main portion 21 of the apparatus housing 2, a first cassette mounting portion 11 a, a second cassette mounting portion 12 a, and a workpiece temporary storage portion are provided. 13a and a cleaning unit 14a are provided. A first cassette 11 that accommodates a workpiece before processing is placed on the first cassette mounting portion 11a, and a workpiece after processing is accommodated on the second cassette mounting portion 12a. The second cassette 12 is placed. The workpiece temporary placement section 13a temporarily places a workpiece temporary placement means for temporarily placing the workpiece before being carried out from the first cassette 11 placed on the first cassette placement portion 11a. 13 is disposed. The cleaning unit 14a is provided with cleaning means 14 for cleaning the processed workpiece.

  A workpiece transfer means 15 is disposed between the first cassette mounting portion 11a and the second cassette mounting portion 12a. The workpiece conveying means 15 carries the workpiece before processing stored in the first cassette 11 placed on the first cassette placing portion 11 a to the workpiece temporary placing means 13. At the same time, the processed workpiece cleaned by the cleaning means 14 is transported to the second cassette 12 mounted on the second cassette mounting portion 12a. A workpiece carrying means 16 is disposed between the workpiece temporary placing portion 13a and the workpiece loading / unloading regions 24a and 24b. As shown in FIG. 4, the workpiece carrying means 16 includes a suction holding pad 161 for sucking and holding the workpiece, an operating arm 162 having the suction holding pad 161 attached to one end, and the other end of the operating arm 162. A pivot shaft 163 that is attached to the workpiece and is movable in the vertical direction, and a suction holding pad 161 that is pivoted about the pivot shaft 163 and attached to one end of the actuation arm 162 is attached to the workpiece temporary placement means 13 and the workpiece. The first chuck table 52a and the second chuck table 52b are positioned on the workpiece loading / unloading areas 24a and 24b, and positioning means (not shown) is positioned on the second chuck table 52b. The working arm 162 constituting the workpiece carrying-in means 16 includes a first arm member 162a and a second arm member 162b configured to be slidable with respect to each other, and can be expanded and contracted by expansion / contraction means (not shown). It is configured. The workpiece carry-in means 16 configured as described above carries the workpiece onto the first chuck table 52a and the second chuck table 52b positioned in the workpiece carry-in / out regions 24a and 24b. A workpiece unloading means 17 is disposed between the workpiece loading / unloading regions 24a and 24b and the cleaning unit 14a. The workpiece carry-out means 17 has the same configuration as the workpiece carry-in means 16, and as shown in FIG. 5, a suction holding pad 171 for sucking and holding the workpiece, and the suction holding pad 171 at one end. The mounted operating arm 172, the turning shaft 173 attached to the other end of the operating arm 172 and movable in the vertical direction, and the operating arm 172 turned around the turning shaft 173 are attached to one end of the operating arm 172. The suction holding pad 171 includes a first chuck table 52a positioned on the workpiece loading / unloading areas 24a, 24b, positioning means (not shown) positioned on the second chuck table 52b, and the cleaning means 14. The working arm 172 constituting the workpiece unloading means 17 includes a first arm member 172a and a second arm member 172b configured to be slidable with respect to each other, and can be expanded and contracted by an expansion / contraction means (not shown). It is configured. The workpiece unloading means 17 configured in this way is the post-processing mounted on the first chuck table 52a and the second chuck table 52b positioned in the workpiece loading / unloading regions 24a and 24b. The workpiece is conveyed to the cleaning means 14.

  The workpiece before processing accommodated in the first cassette 11 includes a semiconductor wafer 10 having a plurality of devices 110 formed in a lattice shape on the surface as shown in FIG. A plurality of stud bumps (electrodes) 120 are formed on the surfaces of the plurality of devices 110 formed on the semiconductor wafer 10. For example, as shown in FIG. 6B, the stud bump (electrode) 120 is attached by heating and melting a gold wire to an electrode plate 111 made of, for example, aluminum or the like formed on the device 110. The plurality of stud bumps (electrodes) 120 formed in this way are in a state where the needle-like ridges 121 remain as shown in FIG. 6B, and the heights thereof vary.

  The first cassette 11 containing the semiconductor wafer 10 as the workpiece is mounted on the first cassette mounting portion 11 a of the apparatus housing 2. When all the unprocessed semiconductor wafers 10 accommodated in the first cassette 11 placed on the first cassette placement portion 11a are carried out, a plurality of empty wafers 11 are replaced. A new cassette 11 containing the unprocessed semiconductor wafer 10 is manually mounted on the first cassette mounting portion 11a. On the other hand, when a predetermined number of processed semiconductor wafers 10 are loaded into the second cassette 12 mounted on the second cassette mounting portion 12a of the apparatus housing 2, the second cassette 12 is manually unloaded. Then, a new empty second cassette 12 is placed.

The processing apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described mainly with reference to FIG.
The unprocessed semiconductor wafer 10 as a workpiece accommodated in the first cassette 11 is conveyed by the vertical movement and advancing / retreating operation of the workpiece conveyance means 15 and placed on the workpiece temporary placement means 13. The semiconductor wafer 10 placed on the workpiece temporary placing means 13 is positioned in the workpiece loading / unloading area 24a by the turning operation of the workpiece loading means 16 after being centered here. Placed on the chuck table 52a. When the semiconductor wafer 10 is placed on the first chuck table 52a, the semiconductor wafer 10 placed on the holding surface which is the upper surface of the first chuck table 52a is operated by operating a suction means (not shown). Suction hold. When the semiconductor wafer 10 is sucked and held on the first chuck table 52a, the first chuck table moving means 56a (see FIG. 3) is operated to move the first chuck table mechanism 5a in the direction indicated by the arrow A. Then, the first chuck table 52a holding the semiconductor wafer 10 is positioned in the processing area 25a. When the first chuck table 52a holding the semiconductor wafer 10 is positioned in the processing region 25a in this way, a plurality of stud bumps (electrodes) formed on the surface of the device 110 provided on the semiconductor wafer 10 are provided. A turning process of turning 120 to make the height uniform is performed.

The turning process will be described with reference to FIG.
In the turning process, the first rotating spindle 322a of the first turning unit 3a is rotationally driven, and the first tool tool mounting member 324a to which the first tool tool 33a is attached is moved in the direction indicated by the arrow C in FIG. For example, it rotates at a rotational speed of 6000 rpm. Then, the first turning unit 3a is lowered to position the first cutting tool 33a at a predetermined cutting position. Next, for example, when the turning width of the cutting edge 332a of the first cutting tool 33a is about 25 μm, the first chuck table 52a holding the semiconductor wafer 10 is indicated by an arrow A from the position indicated by the solid line in FIG. It moves to the position shown by the two-dot chain line in FIG. As a result, a plurality of stud bumps (formed on the surface of the device 110 provided on the semiconductor wafer 10 by the cutting edge 332a of the first tool tool 33a that rotates as the first tool tool mounting member 324a rotates. The upper end of the electrode 120 is scraped off. 7, the center of the semiconductor wafer 10 held on the chuck table 72 moves to the center position of the tool tool mounting member 324 as indicated by a two-dot chain line, whereby the surface of the device 110 provided on the semiconductor wafer 10 is obtained. As shown in FIG. 8, all of the plurality of stud bumps (electrodes) 120 formed on the tip are removed by turning, and the heights are made uniform.

  During this time, the unprocessed semiconductor wafer 10 as the workpiece accommodated in the first cassette 11 is conveyed by the workpiece conveying means 15 and placed on the workpiece temporary placing means 13. The semiconductor wafer 10 placed on the workpiece temporary placing means 13 is centered here. Then, the semiconductor wafer 10 centered by the workpiece temporary placing means 13 is placed on the second chuck table 52b positioned in the workpiece loading / unloading area 24b by the workpiece loading means 16. Is done. When the semiconductor wafer 10 is placed on the second chuck table 52b, the semiconductor wafer 10 placed on the holding surface which is the upper surface of the second chuck table 52b is operated by operating a suction means (not shown). Suction hold. When the semiconductor wafer 10 is sucked and held on the second chuck table 52a, the second chuck table moving means 56b (see FIG. 3) is operated to move the second chuck table mechanism 5b in the direction indicated by the arrow A. Then, the second chuck table 52b holding the semiconductor wafer 10 is positioned in the processing area 25b. When the second chuck table 52b holding the semiconductor wafer 10 is positioned in the processing region 25b in this way, a plurality of stud bumps (electrodes) formed on the surface of the device 110 provided on the semiconductor wafer 10 are provided. A turning process for turning 120 is performed. This grinding step is performed by the second turning unit 3b in the same manner as the grinding step performed by the first turning unit 3a on the semiconductor wafer 10 held on the first chuck table 52a. In the turning process performed by the second turning unit 3b, the second tool tool mounting member 324b to which the second tool tool 33b is attached is rotated in the direction indicated by the arrow D as shown in FIG. That is, the rotation direction of the second tool tool mounting member 324b to which the second tool tool 33b of the second turning unit 3b is attached is determined by the first tool tool in the turning process performed by the first turning unit 3a. It is desirable that the first tool tool mounting member 324a to which 33a is attached is set so as to be in the direction opposite to the rotation direction indicated by the arrow C. Thus, the rotation direction of the first tool tool mounting member 324a to which the first tool tool 33a of the first turning unit 3a is attached and the second tool tool 33b to which the second tool tool 33b of the second turning unit 3b is attached. By setting the rotation direction of the second tool tool mounting member 324b to be the opposite direction, the cutting waste is discharged to a symmetrical position so that maintenance is easy and the first tool tool 33a is attached. The rotational inertial force of the first tool tool mounting member 324a and the rotational inertial force of the second tool tool mounting member 324b to which the second tool tool mounting member 324b is offset cancel each other, and vibration is suppressed. The direction of the cutting edge 332b of the second tool tool 33b is directed in the rotational direction indicated by the arrow D of the second tool tool mounting member 324b.

  As described above, when the turning process of turning the plurality of stud bumps (electrodes) 120 formed on the surface of the device 110 provided on the semiconductor wafer 10 held on the first chuck table 52a is completed, Raise the turning unit 3a. Next, the first chuck table 52a is moved in the direction indicated by the arrow B in FIG. 1 to be positioned in the workpiece loading / unloading area 24a, and the semiconductor wafer 10 which has been turned on the first chuck table 52a is sucked. Release the hold. Then, the semiconductor wafer 10 released from the suction and holding by the first chuck table 52a is unloaded by the workpiece unloading means 17 and conveyed to the cleaning means 14. The semiconductor wafer 10 conveyed to the cleaning means 14 is cleaned here. The semiconductor wafer 10 cleaned by the cleaning unit 14 is stored in a predetermined position of the second cassette 12 by the workpiece transfer unit 15.

  On the other hand, a turning process in which a plurality of stud bumps (electrodes) 120 formed on the surface of the device 110 provided on the semiconductor wafer 10 held on the second chuck table 52b are turned by the second turning unit 3b. Ends. When the turning process for the semiconductor wafer 10 held on the second chuck table 52b is completed in this manner, the second turning unit 3b is raised. Next, the second chuck table 52b is moved in the direction indicated by the arrow B in FIG. 1 to be positioned in the workpiece loading / unloading area 24a, and the semiconductor wafer 10 that has been turned on the second chuck table 52b is sucked. Release the hold. Then, the semiconductor wafer 10 released from the suction and holding by the second chuck table 52b is unloaded by the workpiece unloading means 17 and conveyed to the cleaning means 14. The semiconductor wafer 10 conveyed to the cleaning means 14 is cleaned here. The semiconductor wafer 10 cleaned by the cleaning unit 14 is stored in a predetermined position of the second cassette 12 by the workpiece transfer unit 15.

  As described above, the machining apparatus in the illustrated embodiment includes the first chuck table 52a and the second chuck table 52b having the holding surface for holding the workpiece, and the first chuck table 52a and the second chuck table 52b. A first turning unit 3a having a first cutting tool for turning a workpiece held on the chuck table 52b, a second turning unit 3b having a second cutting tool, and a first chuck; A first chuck table moving means 56a and a second chuck table moving means 56a for moving the table 52a to a first workpiece loading / unloading region for loading and unloading the workpiece and a first machining region for machining by the first turning unit 3a. A second workpiece loading / unloading area for loading / unloading the workpiece onto / from the chuck table 52b and a second chucking area moving to the second machining area for machining by the second turning unit 3b. A first moving workpiece 56b is placed in the first workpiece loading / unloading area 16 by the workpiece loading means 16. The chuck table 52a and the second chuck table 52b positioned in the second workpiece loading / unloading area and the first chuck table 52a positioned in the first workpiece loading / unloading area and The processed workpiece placed on the second chuck table 52b positioned in the second workpiece loading / unloading area is conveyed to the unloading and cleaning means 14 by the workpiece unloading means 17. Therefore, even though the size of the processing device is about one, the processing capacity is doubled and the productivity is improved. Further, the first cassette mounting portion 11a and the second cassette mounting portion 12b, the workpiece temporary placing means 13, the cleaning means 14, the workpiece conveying means 15, the workpiece loading means 16, and the workpiece unloading. Since the means 17 is shared by the first chuck table 52a and the second chuck table 52b, the cost can be suppressed and the apparatus can be reduced in size and can be downsized.

  Although the present invention has been described based on the illustrated embodiment, the present invention is not limited to the embodiment, and various modifications are possible within the scope of the gist of the present invention. For example, in the illustrated embodiment, the example in which the first turning unit 3a and the second turning unit 3b are configured substantially the same is shown. However, the first turning unit 3a is attached to the first turning tool 3a. By using the tool 33a as a rough turning tool and the second turning tool 33b mounted on the second turning unit 3b as a finishing turning tool, the first turning unit 3a functions as a rough turning unit. The second turning unit 3b can function as a finishing turning unit. In this case, first, the semiconductor wafer 10 as a workpiece is held on the first chuck table 52a, and rough turning is performed by the first turning unit 3a, and the semiconductor wafer 10 subjected to the rough turning is subjected to the first turning. Finished turning is performed by the second turning unit 3b on the semiconductor wafer 10 which has been conveyed from the chuck table 52a to the second chuck table 52b and held on the second chuck table 52b after rough turning. In this way, the life of an expensive finishing tool is divided into rough turning and finishing turning, and, for example, 90% is turned with an inexpensive rough turning tool and 10% is turned with an expensive finishing tool. Can be extended to save money. In the illustrated embodiment, an example in which a plurality of stud bumps (electrodes) 120 formed on the surface of the device 110 provided on the semiconductor wafer 10 is turned is shown. However, the processing apparatus according to the present invention is made of resin. It is also possible to turn the upper surface or the upper surface of a metal plate.

1: processing device 2: device housing 3a: first turning unit 3b: second turning unit 32a: first spindle unit 32b: second spindle unit 322a: first rotating spindle 322b: second rotating spindle 324a: first Tool tool mounting member 324b: Second tool tool mounting member 33a: First tool tool 33b: Second tool tool 4a: First turning unit feed mechanism 4b: Second turning unit feed mechanism 5a: First chuck table mechanism 5b: First 2 chuck table mechanism 56a: first chuck table moving mechanism 56b: second chuck table moving mechanism 10: semiconductor wafer 11a: first cassette mounting unit 11b: second cassette mounting unit 13: workpiece temporary storage means 14: Cleaning means 15: Workpiece conveying means 16: Workpiece carrying means 17: Addition Things out means

Claims (3)

A chuck table having a holding surface for holding a workpiece, a turning means having a bite tool for turning the workpiece held on the chuck table, and a workpiece is carried into and out of the chuck table. A workpiece loading / unloading area, a chuck table moving means for moving the chuck table to a machining area to be machined by the turning means, and a first cassette in which a first cassette housing a workpiece before machining is placed. A cassette placement region, a workpiece temporary placement means for temporarily placing a workpiece unprocessed from the first cassette placed in the first cassette placement region, and the workpiece The workpiece loading means for loading the workpiece, which has been temporarily placed on the workpiece temporary placing means, into the chuck table positioned in the workpiece loading / unloading area, and the workpiece after washing are washed. Cleaning means and processing A second cassette placement area for placing a second cassette in which a subsequent work piece is accommodated, and a post-work placed on the chuck table positioned in the work carry-in / out area A workpiece unloading means for unloading and conveying the workpiece to the cleaning means, and an unprocessed workpiece housed in the first cassette placed in the first cassette placement area. Workpiece conveyance that conveys the processed workpiece cleaned by the cleaning means to the second cassette placed in the second cassette placement area while being conveyed to the workpiece temporary placement means A processing apparatus comprising:
The chuck table includes a first chuck table and a second chuck table,
The turning means includes a first turning means having a first bite tool for turning a work piece held on the first chuck table, and a work piece held on the second chuck table. Comprising a second turning means with a second tool for turning
The chuck table moving means includes a first workpiece loading / unloading area for loading / unloading a workpiece onto / from the first chuck table and a first machining area for machining by the first turning means. The first chuck table moving means for moving the chuck table, the second workpiece loading / unloading area for loading / unloading the workpiece onto / from the second chuck table, and the second turning means for machining. A second chuck table moving means for moving the second chuck table to the machining area of
The workpiece carry-in means includes the first chuck table positioned in the first workpiece carry-in / carry-out area, and the workpiece before being temporarily placed on the workpiece temporary placing means, and the first chuck table, Carry in to the second chuck table positioned in the second workpiece carry-in / out region;
The workpiece unloading means includes the first chuck table positioned in the first workpiece loading / unloading area and the second chuck positioned in the second workpiece loading / unloading area. Unloading the processed workpiece placed on the table and transporting it to the cleaning means;
A processing apparatus characterized by that. The workpiece carrying means includes a suction holding pad for holding the workpiece, an operating arm having the suction holding pad attached to one end thereof, a swiveling shaft attached to the other end of the working arm, and a center of the swiveling shaft The suction holding pad mounted on one end of the operating arm by turning the operating arm as the first workpiece table and the first chuck table and the second workpiece table positioned in the first workpiece loading / unloading area. And positioning means positioned on the second chuck table positioned in the work-in / out area.
The workpiece unloading means includes a suction holding pad for sucking and holding the workpiece, an operating arm having the suction holding pad attached to one end, a swiveling shaft attached to the other end of the working arm, and the swiveling shaft The first chuck table and the second workpiece loading / unloading, in which the suction holding pad mounted on one end of the working arm is pivoted around the working arm and positioned at the first workpiece loading / unloading area. 2. The processing apparatus according to claim 1, comprising a second chuck table positioned in a region and positioning means positioned on the cleaning means.   The first turning means and the second turning means are attached to the lower ends of the first rotating spindle and the second rotating spindle, and the first turning tool and the second turning tool are respectively attached to the first turning means and the second turning means. A tool tool mounting member and a second tool tool mounting member are provided, and the rotation directions of the first tool tool mounting member and the second tool tool mounting member are set to be opposite to each other. Item 3. The processing apparatus according to Item 1 or 2.

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