JP2010023163A - Processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing device which easily corresponds to a different processing treatment by selectively changeably using different kinds of processing devices. <P>SOLUTION: The processing device has a pressure measuring means 170 arranged at a spindle 131 and measuring pressure between a workpiece W held at a chuck table 4 and a processing tool mounted to the spindle 131 and a thickness measuring means 180 arranged to be moved forward/backward relative to a measurement site and measuring the thickness of the workpiece W held at the chuck table 4. When processing is executed while carrying out processing control based on the measurement result of the pressure measuring means 170, the thickness measuring means 180 is evacuated relative to the measurement site, and when processing is executed while carrying out processing control based on the measurement result of the thickness measuring means 180, the thickness measuring means 180 is moved forward to be positioned at the measurement site. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a processing apparatus capable of performing different types of processing after, for example, grinding a processing surface of a workpiece.

  The semiconductor chip is particularly required to be thinned, and in order to make it thinner, the semiconductor wafer before being cut into the semiconductor chip can be made thinner (for example, 100 μm or less, further 50 μm or less). A semiconductor wafer is obtained by slicing a single crystal rod of a material such as silicon, but before chipping, the back surface side opposite to the surface, which is an element formation surface, is ground to a predetermined thickness. Thinned.

  In order to thin the semiconductor wafer, machining such as grinding with a grindstone is generally employed. However, the processed surface of the semiconductor wafer thinned by machining in this way has a thickness of about 1 μm due to fine scratches. A mechanical damage layer (strain layer) is formed. If such a damage layer is still formed, the bending strength is lowered, which causes cracking and chipping. Therefore, the damage layer is removed by a dry polishing method to maintain the strength. A dry polishing method (dry polishing) is described in Patent Document 1, for example.

  On the other hand, a damage layer that lowers the strength may be effectively used as a gettering effect. The gettering effect is an element in which impurities mainly composed of heavy metals contained in a semiconductor wafer in the manufacturing process of a semiconductor chip are collected in a strain field outside the formation region of an element such as an electronic circuit formed on the semiconductor chip. This is to clean the formation region, and a portion where mechanical damage is formed is used as a strain field.

  Such gettering effect makes it difficult for impurities to be present in the element formation region, thereby suppressing problems such as generation of crystal defects and deterioration of electrical characteristics, and stabilization of semiconductor chip characteristics and improvement of performance can be achieved. Methods for obtaining such a gettering effect are described in Patent Documents 2 and 3, for example.

JP 2003-53662 A JP-A-2005-277116 JP 2005-317846 A

  Therefore, as the surface treatment after grinding of the semiconductor wafer, there is a case where it is desired to apply a dry polishing method to remove the damaged layer and maintain strength, and a case where it is desired to apply a grinding method with fine abrasive grains aiming at the gettering effect. There are two patterns. The former dry polishing method is performed by constant pressure processing, and the latter grinding method is performed by constant sizing by a non-contact measuring device, so that the processing tool control method during processing is also different. Moreover, the processing position by a processing tool and a to-be-processed object also differs. For this reason, when it is desired to selectively perform such two-pattern processing, it is possible to prepare two models in advance or replace a measuring instrument or the like used during control. However, the former response is not economical, and the latter response has many problems such as troublesome switching of the processing process and time, which is not efficient.

  The present invention has been made in view of the above, and an object of the present invention is to provide a machining apparatus that can easily cope with a different type of machining process by selectively exchanging and using different types of machining tools. To do.

  In order to solve the above-described problems and achieve the object, a processing apparatus according to the present invention includes a chuck table that is rotatably provided around a central axis extending vertically, and a chuck table for rotating the chuck table. Rotating means, a spindle that is positioned above the chuck table and that is rotatable about a central axis that extends vertically, and spindle rotating means for rotating the spindle are provided to hold the workpiece. A processing apparatus that rotates the chuck table and rotates the spindle on which a processing tool is mounted to cause the processing tool to act on a processing surface of the workpiece, and horizontally above the chuck table. Horizontally moving block provided so as to be movable in the direction, and horizontal transfer for reciprocating the horizontally moving block in the horizontal direction A block reciprocating means; a vertical movement block mounted on the horizontal movement block so as to be movable in the vertical direction; and the spindle is rotatably mounted; and a vertical movement block for moving the vertical movement block in the vertical direction. Elevating means; pressure measuring means disposed on the chuck table or the spindle, and measuring pressure between the workpiece held on the chuck table and the machining tool mounted on the spindle; And a thickness measuring means which is provided so as to be movable back and forth with respect to the measurement site and which measures the thickness of the workpiece held on the chuck table.

  The processing apparatus according to the present invention is characterized in that, in the above-mentioned invention, the thickness measuring means comprises a non-contact type thickness detector.

  Further, the processing apparatus according to the present invention is characterized in that, in the above invention, the thickness measuring means is mounted on the horizontal movement block, and is movable forward and backward with respect to the measurement site as the horizontal movement block moves. To do.

  In the processing device according to the present invention, in the above invention, a polishing tool and a grinding tool are selectively mounted on the spindle as the processing tool, and the workpiece is processed by mounting the polishing tool. When polishing the surface, the horizontal moving block is positioned at the polishing position, and the lowering of the vertical moving block is controlled based on the pressure measured by the pressure measuring means, and the workpiece is mounted by attaching the grinding tool. When the workpiece surface is ground, the horizontal moving block is positioned at a grinding position and the lowering of the vertical moving block is controlled based on the thickness of the workpiece measured by the thickness measuring means. It is characterized by.

  The processing apparatus according to the present invention is characterized in that, in the above invention, when the grinding tool is mounted and the processing surface of the workpiece is ground, the horizontal movement block is stationary. .

  According to the processing apparatus of the present invention, a pressure measuring unit that is disposed on the chuck table or the spindle and that measures the pressure between the workpiece held on the chuck table and the processing tool mounted on the spindle; A thickness measuring means that is provided so as to be movable back and forth with respect to the measurement site and that measures the thickness of the workpiece held on the chuck table. It is possible to cope by moving the horizontal movement block, and when performing processing while controlling processing based on the measurement result of the pressure measuring means, while the thickness measuring means is retracted from the measurement site, When performing machining while controlling machining based on the measurement results of the thickness measurement means, the thickness measurement means may be positioned at the measurement site, and different types of machining tools can be used selectively. To the effect that it is possible to provide a correspondence is easy processing apparatus when performing processing of a different type.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS A processing apparatus that is the best mode for carrying out the present invention will be described below with reference to the drawings. Note that the overall configuration of the processing apparatus of the present embodiment conforms to, for example, the processing apparatus disclosed in Japanese Patent Application Laid-Open No. 2005-153090 proposed by the present applicant, and detailed detailed description thereof will be omitted as appropriate. .

  FIG. 1 is a perspective view showing the overall configuration of the processing apparatus according to the present embodiment. The processing apparatus 1 according to the present embodiment includes an apparatus housing 2. The device housing 2 includes a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at a rear end portion of the main portion 21 and extends vertically upward. The apparatus housing 2 formed in this way includes a carry-in / carry-out area 2a for carrying in / out a workpiece such as a wafer, which will be described later, a rough grinding area 2b, a finish grinding area 2c, and a finish machining area 2d.

  The turntable 3 is rotatably disposed in the main portion 21 of the device housing 2. The turntable 3 is rotated along a carry-in / carry-out region 2a, a rough grinding region 2b, a finish grinding region 2c, and a finishing region 2d, and includes four chuck tables 4a, 4b, 4c, 4d (hereinafter, An appropriate “chuck table 4” is provided. These four chuck tables 4 are arranged with an equal phase angle of 90 degrees.

  Here, the turntable 3 and the chuck table 4 will be described with reference to FIG. 2 is a cross-sectional view taken along line AA in FIG. The turntable 3 includes a rotating shaft 31 that protrudes from the lower surface. The rotating shaft 31 and the lower surface of the turntable 3 are attached to a support member 23 disposed in the apparatus housing 2 via a plurality of bearings 5. It is supported rotatably. Thus, the turntable 3 rotatably supported by the support member 23 is appropriately rotated by the table rotating means 6 including the pulse motor 61 and the like. The turntable 3 accommodates four chuck table rotating means 7 (two chuck tables 4a and 4d are shown in FIG. 2) for rotationally driving the four chuck tables 4, respectively. A storage chamber 32 is provided. The chuck table rotating means 7 is composed of, for example, a servo motor, and its drive shaft 71 is connected to the rotating shaft of the chuck table 4. Thereby, the chuck table 4 is provided so as to be rotatable about a central axis extending vertically.

  Here, the chuck table 4 is made of a porous material such as porous ceramics, and is connected to suction means (not shown). Accordingly, the workpiece placed on the holding surface is sucked and held by selectively communicating the chuck table 4 with the suction means via a suction hose (not shown).

  Moreover, in the processing apparatus 1 of this Embodiment, the rough grinding unit 8 is arrange | positioned in the rough grinding area | region 2b. The rough grinding unit 8 includes a unit housing 81, a rough grinding wheel 82 rotatably attached to the lower end of the unit housing 81, and a rough grinding wheel 82 attached to the upper end of the unit housing 81 in a direction indicated by an arrow. A servo motor 83 and a moving base 84 on which a unit housing 81 is mounted are provided. The moving base 84 is configured to be movable up and down in the vertical direction by a grinding feed means 86 including a pulse motor 88 and a male screw rod 87 or the like. Thereby, the cutting depth of the grinding wheel 82 can be adjusted.

  A finish grinding unit 80 is disposed in the finish grinding region 2c. The finish grinding unit 80 has substantially the same configuration as that of the rough grinding unit 8 except that the finish grinding wheel 820 is different from the rough grinding wheel 82 of the rough grinding unit 8. The same members are denoted by the same reference numerals, and the description thereof is omitted.

  Further, the processing means 10 is disposed in the finishing region 2d (in FIG. 1, a part of the outline is indicated by a two-dot chain line). The processing means 10 will be described with reference to FIG. FIG. 3 is a perspective view showing a configuration example of the processing means 10. The processing means 10 includes a mount 120 for detachably mounting the processing tool 110, a spindle unit 130 including a spindle 131 for rotating the mount 120, a vertical movement block 143, and a horizontal movement block 142. A spindle that movably supports a vertical direction (Z-axis direction) perpendicular to the holding surface of the chuck table 4 and a horizontal direction (Y-axis direction) parallel to the holding surface of the chuck table 4. Unit support means 140, vertical movement block elevating means 150 for elevating and lowering the spindle unit 130 in the vertical direction (Z-axis direction) with respect to the holding surface of the chuck table, and the spindle unit 130 as the holding surface of the chuck table Reciprocating in the horizontal direction parallel to (Y-axis direction) And comprising a horizontally moving blocks reciprocating means 160 for. The spindle unit 130 includes spindle rotating means 132 such as a servo motor for rotating the spindle 131.

  The spindle unit support means 140 includes a fixed support base 141, a horizontal movement block 142 and a vertical movement block 143. On one side surface of the support base 141, a pair of first guide rails 141a extending in the horizontal direction indicated by an arrow Y parallel to the holding surface of the chuck table 4 is provided. A pair of first guided rails 142b that are fitted to a pair of first guide rails 141a provided on the support base 141 are provided on one side surface of the horizontal movement block 142. A pair of second guide rails 142 a extending in the vertical direction indicated by an arrow Z perpendicular to the holding surface of the chuck table 4 is provided on the side surface. The horizontal movement block 142 configured in this manner is configured such that the first guided rail 142b is fitted to the first guide rail 141a provided on the support base 141, thereby the first upper portion of the chuck table 4 is moved upward. It is supported by the support base 141 so as to be movable in the horizontal direction along the guide rail 141a.

  In addition, a pair of second guided rails 143 b that are fitted to a pair of second guide rails 142 a provided in the horizontal movement block 142 are provided on one side surface of the vertical movement block 143. As a result, the vertical movement block 143 engages the second guided rail 143 b with the second guide rail 142 a provided in the horizontal movement block 142, so that the vertical movement block 143 is second to the horizontal movement block 142. The guide rail 142a is supported so as to be movable in the vertical direction. The spindle unit 130 is mounted on the other side surface of the vertically moving block 143 configured as described above.

  The vertical moving block lifting / lowering means 150 has the same configuration as the grinding feed means 86. That is, the vertical moving block lifting / lowering means 150 is provided between the pulse motor 151 and the second guide rail 142a in parallel with the second guide rail 142a, and is a male screw rod (not shown) that is driven to rotate by the pulse motor 151. ), And a female screw block (not shown) that is mounted on the vertical movement block 143 and screwed with the male screw rod, and the male screw rod (not shown) is driven forward and reverse by a pulse motor 151, thereby the vertical movement block 143, The spindle unit 130 is moved in the vertical direction indicated by the arrow Z perpendicular to the holding surface of the chuck table 4.

  Similarly, the horizontal moving block reciprocating means 160 is arranged between the pulse motor 161 and the first guide rail 141a in parallel with the first guide rail 141a, and is driven by the pulse motor 161 and rotated by the male screw rod 162 (see FIG. 5) and a female screw block (not shown) that is mounted on the horizontal moving block 142 and screwed with the male screw rod 162, and the male screw rod 162 is driven to rotate forward and backward by a pulse motor 161, thereby moving the horizontal moving block. 142, that is, the vertical movement block 143 and the spindle unit 130 are moved in the horizontal direction indicated by the arrow Y parallel to the holding surface of the chuck table 4. In addition, the kind of the processing tool 110 of the processing means 10, a processing content, etc. are mentioned later.

  Moreover, the processing apparatus 1 of this Embodiment accommodates the 1st cassette 211 in which the to-be-processed workpiece was accommodated in the front-end part of the main part 21 of the apparatus housing 2, and the to-be-processed workpiece. A second cassette 221 is provided for this purpose. In addition, a centering means 231 for performing center alignment of the workpiece before being unloaded from the first cassette 211 is cleaned at one side front portion of the main portion 21 of the apparatus housing 2, and the workpiece after machining is washed. Spinner cleaning means 241 is disposed in order. The spinner cleaning means 241 cleans the workpiece after being processed by the rough grinding unit 8, the finish grinding unit 80, and the processing means 10, and spinner-drys the cleaning water from the cleaning surface of the workpiece.

  Further, behind the first and second cassettes 211 and 221, a well-known multi-axis joint robot 252 equipped with a hand 251 and a moving unit 253 that moves the multi-axis joint robot 252 in the width direction of the apparatus housing 2. Conveying means 250 comprising: The conveying means 250 operates the moving means 253 and the multi-axis joint robot 252 to carry out the unprocessed workpieces stored in the first cassette 211 and convey them to the centering means 231 and spinner cleaning. The processed workpiece cleaned and dried by means 241 is carried into the second cassette 221.

  In addition, the processing apparatus 1 of the present embodiment includes a suction pad 261 that transports the unprocessed workpiece that has been transported and centered by the centering means 231 to the chuck table 4a positioned in the loading / unloading region 2a. Loading means 260 and unloading means 270 having suction pads 271 for unloading the processed workpiece held on the chuck table 4 a positioned in the loading / unloading area 2 a and conveying it to the spinner cleaning means 241. . These carry-in means 260 and carry-out means 270 are configured to be movable in the vertical direction and the front-rear direction.

  Next, the outline | summary of operation | movement of the processing apparatus 1 of this Embodiment comprised in this way is demonstrated. First, in order to process a workpiece by the processing apparatus 1, the first cassette 211 in which the workpiece before processing is accommodated is set, and an empty second for accommodating the workpiece after processing. Cassette 221 is set. When a machining start switch (not shown) is turned on, the conveying means 250 is operated to carry out the workpiece before machining from the first cassette 211 and convey it to the centering means 231. The centering means 231 performs centering of the conveyed workpiece before processing. Next, the carrying-in means 260 is operated, and the workpiece before processing centered by the centering means 231 is transported onto the chuck table 4a positioned in the carry-in / out area 2a.

  At the start of machining, the turntable 3 is positioned at the origin position shown in FIG. 1, the chuck table 4a disposed on the turntable 3 is in the carry-in / out area 2a, and the chuck table 4b is in the rough grinding area. 2b, the chuck table 4c is positioned in the finish grinding area 2c, and the chuck table 4d is positioned in the finishing area 2d. An unprocessed workpiece placed on the chuck table 4a positioned in the loading / unloading area 2a by the loading means 260 is sucked and held on the chuck table 4a by a suction means (not shown).

  When the workpiece before processing is sucked and held on the chuck table 4a positioned in the loading / unloading area 2a, the table rotating means 6 is operated to rotate the turntable 3 by 90 degrees clockwise in FIG. To do. As a result, the chuck table 4a that sucks and holds the workpiece before processing is positioned in the rough grinding region 2b, the chuck table 4b is brought into the finish grinding region 2c, the chuck table 4c is brought into the finishing region 2d, and the chuck table 4d is carried in. Each is positioned in the carry-out area 2a. When the chuck tables 4a to 4d are positioned in the respective areas in this way, the rough grinding unit 8 performs rough grinding on the workpiece held on the chuck table 4a positioned in the rough grinding area 2b. Is done. During this time, the workpiece before processing is transported to the chuck table 4d positioned in the loading / unloading area 2a and sucked and held.

  Next, the table rotating means 6 is operated to rotate the turntable 3 further 90 degrees clockwise in FIG. As a result, the chuck table 4a holding the workpiece subjected to the rough grinding in the rough grinding region 2b is positioned in the finish grinding region 2c, and the chuck table holding the workpiece before processing in the carry-in / out region 2a by suction. 4d is positioned in the rough grinding region 2b. The chuck table 4b is positioned in the finishing region 2d, and the chuck table 4c is positioned in the loading / unloading region 2a. In this state, the finish grinding unit 80 performs finish grinding on the workpiece that has been subjected to rough grinding and is held by the chuck table 4a located in the finish grinding region 2c, and is positioned in the rough grinding region 2b. The rough grinding unit 8 performs rough grinding on the workpiece held on the chuck table 4d. During this time, the workpiece before processing is conveyed and sucked and held on the chuck table 4c positioned in the loading / unloading area 2a.

  Next, the table rotating means 6 is operated to rotate the turntable 3 further 90 degrees clockwise in FIG. As a result, the chuck table 4a holding the workpiece subjected to finish grinding in the finish grinding region 2c is positioned in the finish processing region 2d, and the chuck table 4d holding the workpiece subjected to rough grinding in the rough grinding region 2b. Is positioned in the finish grinding region 2c, and the chuck table 4c that sucks and holds the workpiece before processing in the loading / unloading region 2a is positioned in the rough grinding region 2b. Then, the chuck table 4b is positioned in the loading / unloading area 2a. As described above, the finish grinding unit 80 performs finish grinding on the rough ground workpiece held on the chuck table 4d positioned in the finish grinding region 2c by turning the turntable 3. At the same time, the rough grinding unit 8 performs rough grinding on the workpiece held on the chuck table 4c positioned in the rough grinding region 2b.

  Also, the finishing work set in advance by the processing means 10 is applied to the finished work piece held on the chuck table 4a positioned in the finishing work area 2d. Note that when the processing of the workpiece is started by the processing apparatus 1 according to the present embodiment, the type of the processing tool 110 and the finishing method by the processing means 10 are determined in consideration of the purpose of processing. On the other hand, the workpiece before processing is conveyed and sucked and held on the chuck table 4b positioned in the loading / unloading area 2a.

  As described above, the chuck table 4a that is first positioned in the loading / unloading region 2a and holds the workpiece before processing is sequentially positioned in the rough grinding region 2b, the finish grinding region 2c, and the finishing region 2d. When each processing is performed, the table rotating means 6 is operated to rotate the turntable 3 270 degrees counterclockwise in FIG. As a result, the turntable 3 is returned to the origin position shown in FIG. 1, and the chuck table 4a holding the workpiece processed in the finishing region 2d as described above is positioned in the loading / unloading region 2a. As described above, the chuck table 4b holding the workpiece before processing in the loading / unloading region 2a is held in the rough grinding region 2b, and the chuck table 4c holding the workpiece subjected to rough grinding in the rough grinding region 2b. Are positioned in the finish grinding region 2c, and the chuck table 4d holding the workpiece that has been finish ground in the finish grinding region 2c is positioned in the finish grinding region 2d. As described above, the workpieces held on the chuck tables respectively positioned in the rough grinding region 2b, the finish grinding region 2c, and the finishing region 2d are subjected to the above-described rough grinding processing, finish grinding processing, and finishing processing. Is done.

  On the other hand, the workpiece held on the chuck table 4a returned to the loading / unloading area 2a is released from the suction holding by the chuck table 4a. Next, the unloading means 270 is operated to hold the workpiece on the chuck table 4 a on the suction pad 271, unload from the chuck table 4 a, and transport to the spinner cleaning means 241. The processed workpiece conveyed to the spinner cleaning means 241 is cleaned and spinner dried. The processed workpiece thus cleaned and dried is carried into a predetermined position of the second cassette 221 by the conveying means 250. As described above, during the unloading of the workpiece held on the chuck table 4a returned to the loading / unloading region 2a and the transfer of the workpiece before processing to the chuck table 4a, The above-described processing is performed on the workpieces held on the chuck tables 4b to 4d respectively positioned in the grinding region 2b, the finish grinding region 2c, and the finishing region 2d.

  When the workpiece before processing is held again on the chuck table 4a returned to the loading / unloading area 2a as described above, the table rotating means 6 is activated to turn the turntable 3 90 in the clockwise direction in FIG. The chuck table 4a that rotates and rotates and holds the workpiece before processing is positioned in the rough grinding region 2b, the chuck table 4b in the finish grinding region 2c, the chuck table 4c in the finishing region 2d, and the chuck table 4d. Are positioned in the loading / unloading area 2a. Thereafter, the above-described operation is repeated, and all the workpieces before processing stored in the first cassette 211 are processed.

  Next, the type of the machining tool 110 of the machining means 10, the machining content, etc. will be described. The processing means 10 rotates the chuck table 4 and the spindle 131 with respect to the workpiece that has been subjected to the finish grinding on the chuck table 4 positioned in the finishing region 2d, and rotates the spindle 131 to move the processing tool 110 to the workpiece. It is for acting on the to-be-processed surface (upper surface) and finishing. Here, as the surface treatment after finish grinding, when you want to apply a dry polishing method to remove the damaged layer and maintain strength, and when you want to apply a grinding method with fine abrasive grains aiming at the gettering effect There are two patterns.

  Although the processing tool 110 of the processing means 10 in the present embodiment shows an example in which a polishing tool for performing a dry polishing method is mounted, the processing means 10 is for applying a grinding method with fine abrasive grains. A processing tool 116 as a grinding tool is also configured to be selectively mountable.

  First, the processing tool 110 (polishing tool) will be described with reference to FIGS. FIG. 4 shows a configuration example of the processing tool 110 (abrasive tool), (a) is a front perspective view, (b) is an inverted perspective view, and FIG. 5 shows a state during processing by a dry polishing method. It is a front view which shows the structural example of the process means 10, and FIG. 6 is a top view of FIG. The processing tool 110 (abrasive tool) includes a disk-shaped support member 111 and a disk-shaped polishing member 112 attached to the support member 111. The support member 111 is formed with a plurality of blind screw holes 111a extending downward from the upper surface thereof at intervals in the circumferential direction. The lower surface of the support member 111 forms a circular support surface, and the polishing member 112 is bonded to the support surface with an adhesive such as an epoxy resin adhesive. In this embodiment, for example, a felt grindstone in which abrasive grains are dispersed in felt and fixed with an appropriate bonding agent is used as the polishing member 112. The processing tool 110 (polishing tool) configured in this way is positioned on the lower surface of the mount 120 as shown in FIG. 5, and is attached to the support member 111 of the processing tool 110 (polishing tool) through a through hole formed in the mount 120. By screwing the fastening bolt 113 into the formed blind screw hole 111a, the mount 120 is detachably mounted.

  Next, the processing tool 116 (grinding tool) will be described with reference to FIGS. FIG. 7 is a perspective view showing a configuration example of the processing tool 116 (grinding tool), FIG. 8 is a front view showing a configuration example of the processing means 10 during processing by the fine abrasive grain method, and FIG. It is a top view of FIG. The processing tool 116 (grinding tool) includes an annular support member 117 and a grinding wheel 118 mounted on the lower surface of the support member 117. The annular support member 117 is formed with a plurality of blind screw holes 117a extending downward from the upper surface thereof at intervals in the circumferential direction. The polishing grindstone 118 is composed of fine abrasive grains in which diamond abrasive grains having an abrasive grain diameter of 1 μm or less are hardened with resin bonds, for example. The processing tool 116 (grinding tool) configured as described above is detachably attached to the mount 120 in the manner described above.

  Further, the processing means 10 of the present embodiment includes a pressure measuring means 170 and a thickness measuring means 180. The pressure measuring means 170 measures the pressure acting between the workpiece held on the chuck table 4 positioned in the finishing region 2d and the processing tool 110 (polishing tool) mounted on the spindle 131. belongs to. The pressure measuring means 170 uses, for example, a piezoelectric sensor or the like, and is provided in a spindle unit 130 around the spindle 131 as shown in FIG. The pressure measuring means 170 may be provided on each chuck table 4 side.

  The thickness measuring means 180 is for measuring the thickness of the workpiece held on the chuck table 4 positioned in the finishing region 2d. In the present embodiment, the thickness measuring unit 180 is opposed to the measurement part of the workpiece on the chuck table 4 from above and measures the thickness of the workpiece in a non-contact manner using a laser beam. It consists of a non-contact type thickness measuring instrument. That is, a laser beam having a predetermined frequency is irradiated substantially vertically toward the surface (upper surface) of the workpiece, and the reflected light of the laser beam from the surface of the workpiece and the reflected light from the back surface of the workpiece are The interference wave is received, and the thickness of the workpiece is measured based on the waveform of the interference wave (see, for example, JP-A-9-36093).

  As shown in FIGS. 5, 6, 8, and 9, the thickness measuring unit 180 configured as described above is mounted so as to be positioned beside the mount 120 on the wall surface in the moving direction of the horizontal moving block 142. As a result, the horizontal movement block 142 is provided so as to be capable of moving forward and backward with respect to the measurement site. More specifically, the thickness measuring unit 180 is supported by the support arm 181 so as to be positioned on a line passing through the center of the chuck table 4 positioned in the finishing region 2d. Further, an upper end side of the support arm 181 is provided with a female screw block 183 that is screwed with a male screw rod 182 disposed in a vertical direction, and the male screw rod 182 is driven to rotate forward or reverse by a pulse motor 184, thereby supporting arm. The thickness measuring means 180 supported by 181 is configured to move up and down.

  In such a configuration, a case will be described in which a dry polishing method is performed using a processing tool 110 (abrasive tool) as a surface treatment of a workpiece after finish grinding. In this case, the processing tool 110 (polishing tool) is mounted on the spindle 131 of the processing means 10 as described above. Then, the spindle 131, that is, the processing tool 110 (polishing tool) is rotated by the spindle rotating means 132, and the chuck table 4 is rotated by the chuck table rotating means 7. In this state, as shown in FIGS. 5 and 6, the horizontal movement block 142 is moved in the horizontal direction (Y direction) by the horizontal movement block reciprocating means 160, so that the machining tool 110 (polishing tool) is in the finishing machining area. It is positioned at a polishing position that covers the entire surface of the workpiece W on the chuck table 4 positioned at 2d. On the other hand, the vertical movement block elevating / lowering means 150 moves the vertical movement block 143, that is, the processing tool 110 (polishing tool) downward, and presses and contacts the surface of the workpiece W to perform dry polishing. In such dry polishing, the position of the processing tool 110 (polishing tool) may be moved by appropriately moving the horizontal moving block 142 in the horizontal direction (Y direction) by the horizontal moving block reciprocating means 160. .

  Further, in such dry polishing processing, it is necessary to make the pressure acting between the workpiece W and the processing tool 110 (polishing tool) constant, but the pressure between the two is: It is always measured by the pressure measuring means 170 attached to the spindle unit 130, and the descending amount of the vertical movement block 143, that is, the processing tool 110 (polishing tool) becomes appropriate based on the pressure measured by the pressure measuring means 170. Thus, the vertically moving block lifting / lowering means 150 is controlled.

  Further, when the horizontal moving block 142, that is, the processing tool 110 (polishing tool) is positioned at the polishing position by the horizontal moving block reciprocating means 160, the thickness measuring means 180 not used in this processing is shown in FIGS. As shown, it is located at a position retracted from the vicinity of the workpiece W, so that it does not interfere with the processing and the thickness measuring means 180 is not damaged. In particular, as in the present embodiment, the thickness measuring unit 180 is displaced upward and positioned at a position retracted upward from the vicinity of the workpiece W, thereby ensuring the protection of the thickness measuring unit 180. can do.

  On the other hand, as a surface treatment of the workpiece after finish grinding, a case where fine abrasive grain processing is performed using a processing tool 116 (grinding tool) will be described. In this case, as described above, the processing tool 116 (grinding tool) is attached to the spindle 131 of the processing means 10 instead of the processing tool 110 (polishing tool). Then, the spindle rotating means 132 rotates the spindle 131, that is, the processing tool 116 (grinding tool), and the chuck table rotating means 7 rotates the chuck table 4. In this state, as shown in FIGS. 8 and 9, one end of the processing tool 116 (grinding tool) is finished by moving the horizontal movement block 142 in the horizontal direction (Y direction) by the horizontal movement block reciprocating means 160. It is positioned at a grinding position that coincides with the center of the workpiece W on the chuck table 4 positioned in the processing region 2d. On the other hand, the vertical moving block 143, that is, the processing tool 116 (grinding tool) is moved downward by the vertical moving block lifting / lowering means 150 and is brought into press contact with the surface of the workpiece W, thereby performing fine abrasive processing. In such fine abrasive grain processing, the horizontal movement block 142 is in a stationary state at the grinding position positioned as described above.

  Further, in such dry polishing, it is necessary to manage the thickness of the workpiece W and perform the sizing process so that the thickness of the workpiece W becomes a desired thickness. Here, in the present embodiment, the thickness measuring means 180 using the non-contact type thickness measuring device is mounted on the horizontal movement block 142, and one end of the horizontal movement block 142, that is, the processing tool 116 (grinding tool) is covered. When positioned at a grinding position coinciding with the center of the workpiece W, the thickness measuring means 180 also advances to the measurement site on the workpiece W so as to be able to measure the thickness, as shown in FIGS. Here, the thickness measuring unit 180 is displaced downward so as to have a predetermined height with respect to the workpiece W. Thereby, the thickness of the workpiece W is always measured by the thickness measuring unit 180 attached to the horizontal movement block 142, and the thickness W is measured based on the thickness of the workpiece W measured by the thickness measuring unit 180. The vertical moving block lifting / lowering means 150 is controlled so that the moving block 143, that is, the lowering amount of the processing tool 116 (grinding tool) is appropriate.

  As described above, according to this embodiment, when it is desired to change between the dry polishing method and the grinding method using fine abrasive grains, the processing tools 110 and 116 to be mounted on the spindle 131 of the processing means 10 may be changed. Thus, it is possible to provide the machining apparatus 1 that can easily cope with the case where different types of machining tools are selectively exchanged and used to perform different types of machining.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, the thickness measuring unit 180 may be supported by a part of a fixing member such as the support base 141 so as to be movable forward and backward with respect to the measurement site.

  In the present embodiment, a non-contact type thickness measuring device using laser light is used as the thickness measuring means 180, but in addition, an ultrasonic wave having a predetermined frequency is emitted toward the surface of the workpiece. Further, an ultrasonic non-contact type thickness measuring device that measures the thickness from the waveform of the interference wave between the reflected wave from the surface of the workpiece and the reflected wave from the back surface of the ultrasonic wave may be used.

It is a perspective view showing the whole processing device composition concerning an embodiment of the invention. It is the sectional view on the AA line in FIG. It is a perspective view which shows the structural example of a process means. It is a perspective view which shows the structural example of a processing tool (polishing tool). It is a front view which shows the structural example of the process means at the time of the process by a dry-polishing system. FIG. 6 is a plan view of FIG. 5. It is a perspective view which shows the structural example of a processing tool (grinding tool). It is a front view which shows the structural example of the process means at the time of the process by a fine abrasive grain system. It is a top view of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Processing apparatus 4 Chuck table 7 Chuck table rotation means 110 Processing tool (polishing tool)
116 Processing tools (grinding tools)
131 Spindle 132 Spindle rotating means 142 Horizontal moving block 143 Vertical moving block 150 Vertical moving block lifting / lowering means 160 Horizontal moving block reciprocating means 170 Pressure measuring means 180 Thickness measuring means W Workpiece

Claims (5)

A chuck table rotatably provided around a vertically extending central axis, a chuck table rotating means for rotating the chuck table, and a central axis extending vertically above the chuck table. A spindle provided freely, and a spindle rotating means for rotating the spindle, rotating the chuck table holding a workpiece and rotating the spindle on which a machining tool is mounted; Is a processing device for processing by acting on the processing surface of the workpiece,
A horizontal movement block provided so as to be movable in the horizontal direction above the chuck table;
Horizontal moving block reciprocating means for reciprocating the horizontal moving block in the horizontal direction;
A vertical movement block that is mounted on the horizontal movement block so as to be movable in the vertical direction, and the spindle is rotatably mounted;
A vertically moving block lifting and lowering means for vertically moving the vertically moving block;
Pressure measuring means disposed on the chuck table or the spindle and measuring a pressure between the workpiece held on the chuck table and the machining tool mounted on the spindle;
A thickness measuring means which is provided so as to be movable back and forth with respect to the measurement site, and which measures the thickness of the workpiece held on the chuck table;
A processing apparatus comprising:   The processing apparatus according to claim 1, wherein the thickness measuring unit includes a non-contact type thickness detector.   3. The processing apparatus according to claim 1, wherein the thickness measuring unit is mounted on the horizontal movement block and is capable of moving forward and backward with respect to a measurement site as the horizontal movement block moves. A polishing tool and a grinding tool are selectively mounted on the spindle as the processing tool,
When polishing the workpiece surface of the workpiece with the polishing tool attached, the horizontal moving block is positioned at the polishing position and the vertical moving block is lowered based on the pressure measured by the pressure measuring means. Controlled,
When grinding the workpiece surface of the workpiece with the grinding tool mounted, the horizontal movement block is positioned at a grinding position and based on the thickness of the workpiece measured by the thickness measuring means. The processing apparatus according to claim 1, wherein the descent of the vertical movement block is controlled.   The processing apparatus according to claim 4, wherein the horizontal movement block is stationary when the grinding tool is mounted to grind the work surface of the work piece.

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