JP5922381B2 - Processing equipment equipped with a bite tool - Google Patents

Description

  The present invention relates to a processing apparatus including a bite tool for turning a workpiece held on a chuck table having a holding surface for holding the workpiece.

A semiconductor wafer in which a plurality of semiconductor chips are formed is divided into individual semiconductor chips by a dicing apparatus or the like, and the divided semiconductor chips are widely used in electric devices such as mobile phones and personal computers.
In recent years, in order to reduce the weight and size of electrical equipment, a bump having a protrusion of 50 to 100 μm is formed on an electrode of a semiconductor chip, and this bump is directly bonded to an electrode formed on a mounting substrate. A semiconductor chip called a flip chip has been developed and put into practical use. In addition, a technique for reducing the size by mounting a plurality of semiconductor chips on a substrate called an interposer or stacking them has been developed and put into practical use.

  However, each of the above-described technologies forms a plurality of protruding bumps (electrodes) on the surface of a substrate such as a semiconductor chip and bonds the substrates to each other via the protruding electrodes. ) Must be the same height. In order to make the height of the bumps (electrodes) in a protruding shape, grinding is generally used. However, when the bump (electrode) is ground, if the bump (electrode) is formed of a sticky metal such as gold, a burr is generated, and this burr is short-circuited to the adjacent bump (electrode). is there.

  As a technique for forming a plurality of bumps (electrodes) on the surface of a substrate such as a semiconductor chip, a ball is formed by heating and melting the tip of a wire such as gold, and the ball is then applied to the electrode of the semiconductor chip. There is a method of forming a stud bump in which the head of the ball is broken by thermocompression bonding with ultrasonic waves. Bumps (electrodes) formed by this stud bump formation method are difficult to polish because needle-shaped wrinkles are generated when the head of a thermocompressed ball is broken, and a heated plate is used as a bump. The bumps are pressed to align the height of the bumps. (For example, refer to Patent Document 1.)

  However, when the heated plate is pressed against the bumps so that the bumps have the same height, there is a problem that the bumps are short-circuited with adjacent bumps when the bump heads are crushed. In order to solve this problem, in the invention described in the above publication, an extra step of removing the tip of the bump is provided.

  In order to solve the above-described problem, there has been proposed a processing apparatus that turns and removes the tip portions of a plurality of electrodes formed to protrude from the surface of a plate-like object with a bite tool. (For example, see Patent Document 2.)

JP 2001-53097 A JP 2004-319697 A

The processing apparatus described above is installed in a clean room so that dust floating in the air does not adhere to the surface of the wafer.
Even if the processing apparatus is installed in a clean room, there is a problem that dust is scattered from each movable part of the processing apparatus to contaminate the wafer or contaminate the clean room.

  The present invention has been made in view of the above-mentioned facts, and its main technical problem is to provide a machining apparatus provided with a bite tool that can remove dust even if dust scatters from each movable part of the machining apparatus. There is to do.

In order to solve the above main technical problem, according to the present invention, a chuck table having a holding surface for holding a workpiece, a workpiece loading / unloading area for loading and unloading the workpiece, and a workpiece A chuck table mechanism having a chuck table moving means for moving to a machining area for machining a workpiece, and a turning means having a bite tool for turning a workpiece held on the chuck table positioned in the machining area And a first cassette placement area for placing the first cassette containing the workpiece before machining and a second cassette placement for placing the second cassette containing the workpiece after machining. The unprocessed workpiece unloaded from the first cassette placed between the placement area, the workpiece loading / unloading area and the first cassette placement area and placed in the first cassette placement area. Temporary placement of workpiece Temporary work placement means, cleaning means disposed between the work carry-in / carry-out area and the second cassette placement area, for washing the processed work, and work temporary placement means A workpiece loading means for loading a workpiece temporarily placed on the workpiece before loading into the chuck table positioned in the workpiece loading / unloading area, and the chuck table positioned in the workpiece loading / unloading area A workpiece unloading means for unloading the processed workpiece placed thereon and transporting it to the cleaning means, and stored in the first cassette placed in the first cassette placement area The workpiece to be processed is carried out to the second cassette placed in the second cassette placement area, while the workpiece to be processed is carried out to the workpiece temporary placement means and the processed workpiece cleaned by the cleaning means is transferred to the second cassette placement area. And a processing device provided with a tool tool including a workpiece conveying means. Oite,
It is arranged between the workpiece loading / unloading area and the first cassette loading area and the second cassette loading area, and allows the workpiece to move at the lower part , and always to the outside of the machining apparatus. One air is provided by a partition wall having an open gap, a top wall disposed above the partition wall and covering the chuck table mechanism and the turning means, and a side wall covering the lower periphery of the top wall together with the partition wall. A flow passage is formed, an air introduction opening is provided in the ceiling wall, and a suction means provided with a suction port is disposed in the vicinity of the processing region.
There is provided a machining apparatus provided with a cutting tool characterized by the above.

  A processing apparatus equipped with a bite tool according to the present invention is disposed between a workpiece loading / unloading region and a first cassette mounting region and a second cassette mounting region, and moves the workpiece in a lower portion. A partition having an allowable gap, a chuck table mechanism provided with a chuck table disposed above the partition and holding the workpiece, and a tool for turning the workpiece held on the chuck table are provided. An air circulation chamber is formed by a ceiling wall that covers the turning means and a side wall that covers the lower periphery of the ceiling wall together with the partition wall, an air introduction opening is provided in the ceiling wall, and a suction port is provided in the vicinity of the machining area. Since the air outflow means is provided, by operating the air outflow means, air flows in from the air introduction opening provided in the top wall and flows out through the suction port. No flow The Accordingly, dust scattered from the movable parts such as the chuck table mechanism, the turning unit, the workpiece conveying means, and the workpiece unloading means is carried out through the suction port on the air flow generated in the air circulation chamber. Therefore, it does not contaminate the workpiece or the clean room.

The perspective view of the processing apparatus provided with the bite tool comprised according to this invention. The perspective view of the turning unit with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. The perspective view which shows the chuck | zipper table mechanism with which the processing apparatus provided with the cutting tool shown in FIG. The top view and principal part enlarged view of the semiconductor wafer as a to-be-processed object. Explanatory drawing of the turning process implemented using the turning unit shown in FIG. Explanatory drawing which shows the state which turned the bump (electrode) formed in the semiconductor chip with the processing apparatus shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a processing apparatus having a cutting tool constructed according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a machining apparatus having a bite tool constructed according to the present invention.
The processing apparatus provided with the bite tool in the illustrated embodiment includes an apparatus housing denoted as a whole by 2. The apparatus housing 2 has a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at the rear end portion (upper right end in FIG. 1) of the main portion 21 and extends upward. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. A turning unit 3 as a turning means is mounted on the pair of guide rails 221 and 221 so as to be movable in the vertical direction.

  The turning unit 3 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. A support member 313 is mounted on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22, and the spindle unit 32 is attached to the support member 313. It is done.

  The spindle unit 32 includes a spindle housing 321 mounted on a support member 313, a rotating spindle 322 rotatably disposed on the spindle housing 321, and a servo motor as a drive source for rotationally driving the rotating spindle 322. 323. The lower end of the rotary spindle 322 protrudes downward beyond the lower end of the spindle housing 321, and a disk-shaped tool tool mounting member 324 is provided at the lower end. The tool tool 33 is detachably mounted on the tool tool mounting member 324.

Here, the attachment / detachment structure of the cutting tool 33 to the cutting tool mounting member 324 will be described with reference to FIG.
The tool tool mounting member 324 is provided with a tool mounting hole 324a penetrating in a vertical direction in a part of the outer peripheral portion eccentric from the rotation axis, and the tool mounting is performed from the outer peripheral surface corresponding to the tool mounting hole 324a. A female screw hole 324b reaching the hole 324a is provided. The bite tool 33 is inserted into the bite mounting hole 324a of the bite tool mounting member 324 having the above-described configuration, and the tightening bolt 330 is screwed into the female screw hole 324b to be tightened. Removably attached to the. In the illustrated embodiment, the cutting tool 33 is composed of a cutting tool body 331 formed in a rod shape with tool steel such as super steel alloy, and a cutting blade formed of diamond or the like provided at the tip of the cutting tool body 331. 332 is used. The tool tool 33 configured as described above and mounted on the tool tool mounting member 324 is rotated in a horizontal plane parallel to a holding surface for holding a workpiece of a chuck table, which will be described later, by rotating the rotary spindle 322. I'm damned.

  Returning to FIG. 1, the description will be continued. In the machining apparatus having the bite tool in the illustrated embodiment, the turning unit 3 is moved along the pair of guide rails 221 and 221 in the vertical direction (the holding surface of the chuck table described later). And a cutting feed mechanism 4 that moves in a direction perpendicular to the vertical direction. The cutting feed mechanism 4 includes a male screw rod 41 that is disposed on the front side of the upright wall 22 and extends in the vertical direction. The male screw rod 41 is rotatably supported by bearing members 42 and 43 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and an output shaft of the pulse motor 44 is connected to the male screw rod 41 by transmission. A connecting portion (not shown) protruding rearward from the center in the width direction is also formed on the rear surface of the movable base 31, and a through female screw hole extending in the vertical direction is formed in the connecting portion. The male screw rod 41 is screwed into the female screw hole. Therefore, when the pulse motor 44 rotates forward, the moving base 31, that is, the turning unit 3 is lowered or advanced, and when the pulse motor 44 reversely moves, the moving base 31, that is, the turning unit 3 is raised or retracted.

  1 and FIG. 3, a substantially rectangular machining work portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the machining work portion 211 includes a chuck table mechanism. 5 is disposed. As shown in FIG. 3, the chuck table mechanism 5 includes a support base 51 and a chuck table 52 disposed on the support base 51. The support base 51 slides on a pair of guide rails 23 and 23 extending in the direction indicated by the arrows 23a and 23b in the front-rear direction (the direction perpendicular to the front surface of the upright wall 22) on the processing work unit 211. The workpiece loading / unloading area 24 shown in FIG. 1 (position indicated by a solid line in FIG. 3) and the bite tool 33 constituting the spindle unit 32 are opposed to each other by a chuck table moving mechanism 56 described later. And the machining area 25 to be moved (position indicated by a two-dot chain line in FIG. 3).

  The chuck table 52 includes a chuck table main body 521 formed in a cylindrical shape by a metal material such as stainless steel, and an adsorption chuck 522 disposed on the upper surface of the chuck table main body 521. The suction chuck 522 is made of an appropriate porous material such as porous ceramics, and communicates with suction means (not shown). Therefore, by selectively communicating the suction chuck 522 to a suction means (not shown), the workpiece placed on the holding surface which is the upper surface is sucked and held. The illustrated chuck table mechanism 5 includes a cover member 54 that has a hole through which the chuck table 52 is inserted, covers the support base 51 and the like, and is movably disposed together with the support base 51.

  Continuing the description with reference to FIG. 3, the machining apparatus provided with the cutting tool in the illustrated embodiment moves the chuck table mechanism 5 along the pair of guide rails 23 in the directions indicated by the arrows 23 a and 23 b. A table moving mechanism 56 is provided. The chuck table moving mechanism 56 includes a male screw rod 561 disposed between the pair of guide rails 23 and 23 and extending in parallel with the guide rails 23 and 23, and a servo motor 562 that rotationally drives the male screw rod 561. The male screw rod 561 is screwed into a screw hole 511 provided in the support base 51, and its tip is rotatably supported by a bearing member 563 attached by connecting a pair of guide rails 23, 23. ing. The servo motor 562 has a drive shaft connected to the base end of the male screw rod 561 by transmission. Accordingly, when the servo motor 562 rotates in the forward direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23a. When the servo motor 562 rotates in the reverse direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23b. It can be moved. Thus, the chuck table mechanism 5 moved in the directions indicated by the arrows 23a and 23b is selectively positioned in the workpiece loading / unloading area indicated by the solid line and the machining area indicated by the two-dot chain line in FIG. Further, the chuck table moving mechanism 56 is reciprocated in the direction indicated by the arrows 23a and 23b over a predetermined range in the processing region, that is, in parallel with the holding surface which is the upper surface of the suction chuck 522.

  Returning to FIG. 1, the description will be continued. On the both sides of the moving direction of the cover member 54 constituting the chuck table mechanism 5, the cross-sectional shape is a reverse channel shape, and the pair of guide rails 23, 23 and the male screw rod Bellows means 57 and 58 are attached to cover 561, servo motor 562 and the like. The bellows means 57 and 58 can be formed from any suitable material such as campus cloth. The front end of the bellows means 57 is fixed to the front wall of the processing unit 211, and the rear end is fixed to the front end surface of the cover member 54 of the chuck table mechanism 5. The front end of the bellows means 58 is fixed to the rear end surface of the cover member 54 of the chuck table mechanism 5, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the chuck table mechanism 5 is moved in the direction indicated by the arrow 23a, the bellows means 57 is expanded and the bellows means 58 is contracted, and when the chuck table mechanism 5 is moved in the direction indicated by the arrow 23b, the bellows means. 57 is contracted and the bellows means 58 is extended.

  The description will be continued based on FIG. 1. On the front half of the main portion 21 of the apparatus housing 2, a first cassette mounting portion 11 a, a second cassette mounting portion 12 a, and a workpiece temporary storage portion are provided. 13a and a cleaning unit 14a are provided. A first cassette 11 that accommodates a workpiece before processing is placed on the first cassette mounting portion 11a, and a workpiece after processing is accommodated on the second cassette mounting portion 12a. The second cassette 12 is placed. In the workpiece temporary placement portion 13a, the workpiece temporary placement means 13 for temporarily placing the workpiece before being unloaded from the first cassette 11 placed on the first cassette placement portion 11a. Is arranged. The cleaning unit 14a is provided with cleaning means 14 for cleaning the processed workpiece.

  A workpiece transfer means 15 is disposed between the first cassette mounting portion 11a and the second cassette mounting portion 12a. The workpiece conveying means 15 carries the workpiece before processing stored in the first cassette 11 placed on the first cassette placing portion 11 a to the workpiece temporary placing means 13. At the same time, the processed workpiece cleaned by the cleaning means 14 is transported to the second cassette 12 mounted on the second cassette mounting portion 12a. A workpiece carrying means 16 is disposed between the workpiece temporary placing portion 13a and the workpiece loading / unloading area 24. The workpiece carrying-in means 16 places the workpiece before processing placed on the workpiece temporary placing means 13 on the chuck table 52 of the chuck table mechanism 5 positioned in the workpiece carrying-in / out area 24. Transport. A workpiece unloading means 17 is disposed between the workpiece loading / unloading area 24 and the cleaning unit 14a. The workpiece unloading means 17 conveys the processed workpiece placed on the chuck table 52 positioned in the workpiece loading / unloading area 24 to the cleaning means 14.

  The workpiece before processing accommodated in the first cassette 11 comprises a semiconductor wafer 10 having a plurality of semiconductor chips 110 formed in a lattice shape on the surface as shown in FIG. . A plurality of stud bumps (electrodes) 120 are formed on the surfaces of the plurality of semiconductor chips 110 formed on the semiconductor wafer 10. For example, as shown in FIG. 4B, the stud bump (electrode) 120 is mounted by heating and melting a gold wire on an electrode plate 111 made of, for example, aluminum or the like formed on the semiconductor chip 110. The plurality of stud bumps (electrodes) 120 formed in this way are in a state in which the needle-like ridges 121 remain as shown in FIG. 4B and the heights thereof vary.

  The first cassette 11 containing the workpiece as described above is placed on the first cassette placement portion 11 a of the apparatus housing 2. And when all the workpieces before processing which were accommodated in the 1st cassette 11 mounted in the 1st cassette mounting part 11a are carried out, it will replace with the cassette 11 which became empty, and a plurality of will be carried out. A new cassette 11 containing the workpiece before processing is manually mounted on the first cassette mounting portion 11a. On the other hand, when a predetermined number of processed workpieces are loaded into the second cassette 12 mounted on the second cassette mounting portion 12a of the apparatus housing 2, the second cassette 12 is manually transferred out. A new empty second cassette 12 is placed.

  In the illustrated embodiment, the machining apparatus provided with the bite tool includes an air circulation chamber 6 that covers and accommodates the turning unit 3, the chuck table mechanism 5, and the like disposed in the machining work section 211 in the main portion 21 of the apparatus housing 2. Is provided. In the illustrated embodiment, the air circulation chamber 6 is disposed between the first cassette placement unit 11a and the second cassette placement unit 12a, the workpiece temporary placement unit 13a, and the cleaning unit 14a. The ceiling wall 62 includes a partition wall 61, a ceiling wall 62 disposed above the partition wall 61 and covering the chuck table mechanism and the turning unit 3, and the partition wall 61, the ceiling wall 62, and the front surface of the upright wall 22 constituting the apparatus housing 2. It is formed by side walls 63 and 64 covering the lower outer periphery of 62. In this way, the partition wall 61 forming the air circulation chamber 6 is covered with a workpiece before processing stored in the first cassette 11 mounted on the first cassette mounting portion 11a at the lower portion. Workpiece conveyance for carrying out the processed workpiece cleaned by the cleaning means 14 to the second cassette 12 mounted on the second cassette mounting portion 12a while being carried out to the workpiece temporary placement means 13 A gap 611 is provided for allowing movement of the means 15. An air introduction opening 621 is provided in the top wall 62 that forms the air circulation chamber 6. Further, the processing apparatus provided with the bite tool in the illustrated embodiment includes an air outflow means 65 for outflowing air in the air circulation chamber 6. The air outflow means 65 includes a suction port 651 provided in the vicinity of the processing region 25 of the processing section 211 in the main portion 21 of the apparatus housing 2, a suction duct 652 having one end connected to the suction port 651, and the suction The suction means 653 is connected to the other end of the duct 652. Therefore, when the suction means 653 is operated, the air in the air circulation chamber 6 is sucked through the suction duct 652 and the suction port 651. As described above, the air in the air circulation chamber 6 flows out through the suction port 651, whereby the air in the clean room flows in from the air introduction opening 621 provided in the top wall 62 and flows out through the suction port 651. The In addition, the partition wall 61, the top wall 62, and the side walls 63 and 64 that constitute the air circulation chamber 6 described above are made of transparent members so that the processing status in the processing work unit 211 can be visually confirmed. It is desirable.

The machining apparatus provided with the cutting tool in the illustrated embodiment is configured as described above, and the operation thereof will be described below mainly with reference to FIG.
The semiconductor wafer 10 as a workpiece before processing housed in the first cassette 11 is held and transported by the hand 151 of the workpiece transporting means 15 and placed on the workpiece temporary placing means 13. At this time, the semiconductor wafer 10 held by the hand 151 of the workpiece conveying means 15 is conveyed through a gap 611 provided at the lower part of the partition wall 61 forming the air circulation chamber 6. The semiconductor wafer 10 placed on the workpiece temporary placement means 13 is positioned in the workpiece loading / unloading region 24 by the turning operation of the workpiece loading means 16 after being centered here. It is placed on the chuck table 52 of the table mechanism 5. The semiconductor wafer 10 placed on the chuck table 52 is sucked and held on the chuck table 52 by suction means (not shown).

  If the semiconductor wafer 10 is sucked and held on the chuck table 52, the chuck table moving mechanism 56 (see FIG. 3) is operated to move the chuck table mechanism 5 in the direction indicated by the arrow 23a, and the chuck holding the semiconductor wafer 10 is held. The table 52 is positioned in the processing area 25. When the chuck table 52 holding the semiconductor wafer 10 is positioned in the processing region 25 in this way, a plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 are provided. Perform a turning process to turn and align the height.

  In the turning process, the rotary spindle 322 is driven to rotate, and the tool tool mounting member 324 to which the tool tool 33 is attached rotates in the direction indicated by the arrow 300 in FIG. Then, the turning unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position. Next, for example, when the turning width of the cutting edge 332 of the cutting tool 33 is about 25 μm, the chuck table 52 holding the semiconductor wafer 10 is moved to the right as shown by the arrow 23a from the position shown by the solid line in FIG. Move at a feed rate of 2 mm / sec. As a result, the upper ends of the plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 by the cutting edge 332 of the cutting tool 33 that rotates as the rotary spindle 322 rotates. Scraped off. Then, as shown by a two-dot chain line in FIG. 5, the center of the semiconductor wafer 10 held on the chuck table 52 moves to the center position of the bite tool mounting member 324, whereby the semiconductor chip 110 provided on the semiconductor wafer 10. All of the plurality of stud bumps (electrodes) 120 formed on the surface are removed by turning their ends as shown in FIG.

  As described above, when the turning process of the plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 is completed, the turning unit 3 is raised. Next, the chuck table 52 is moved in the direction indicated by the arrow 23b in FIG. 1 to be positioned in the workpiece loading / unloading area 24, and the suction holding of the turned semiconductor wafer 10 on the chuck table 52 is released. Then, the semiconductor wafer 10 whose suction holding is released is carried out by the workpiece carrying-out means 17 and conveyed to the cleaning means 14. The semiconductor wafer 10 conveyed to the cleaning means 14 is cleaned here. The semiconductor wafer 10 cleaned by the cleaning unit 14 is stored in a predetermined position of the second cassette 12 by the workpiece transfer unit 15. At this time, the semiconductor wafer 10 held by the hand 151 of the workpiece conveying means 15 is conveyed through a gap 611 provided at the lower part of the partition wall 61 forming the air circulation chamber 6.

  When carrying out the turning process and the semiconductor wafer carrying-in and carrying-out work as workpieces described above, the turning unit 3, the cutting feed mechanism 4, the chuck table mechanism 5 constituting the machining apparatus provided with the bite tool, There is a problem that dust is scattered from each movable part such as the workpiece transport means 15 and the workpiece unloading means 17 to contaminate the semiconductor wafer or to contaminate the clean room. However, in the machining apparatus provided with the bite tool in the illustrated embodiment, the air that covers and accommodates the turning unit 3, the chuck table mechanism 5, and the like disposed in the machining work section 211 in the main portion 21 of the apparatus housing 2. Since the circulation chamber 6 is provided, the top wall 62 constituting the air circulation chamber 6 is provided with an air introduction opening 621 and air outflow means 65 for flowing out the air in the air circulation chamber 6 is provided. By operating the suction means 653 constituting the outflow means 65, the air in the clean room flows in from the air introduction opening 621 provided in the ceiling wall 62, and flows out of the clean room through the suction port 651 and the suction duct 652. Therefore, an air flow is generated in the air circulation chamber 6. Therefore, as described above, the dust scattered from the movable parts such as the turning unit 3, the cutting feed mechanism 4, the chuck table mechanism 5, the workpiece conveying means 15, the workpiece unloading means 17 and the like enters the air circulation chamber 6. Since the air flows on the generated air and flows out through the suction port 651 and the suction duct 652, the semiconductor wafer is not contaminated and the clean room is not contaminated.

  Although the present invention has been described based on the illustrated embodiment, the present invention is not limited to the illustrated embodiment, and various modifications can be made within the scope of the gist of the present invention. For example, in the above-described embodiment, the partition 61 constituting the air circulation chamber 6 is made up of the first cassette placement unit 11a and the second cassette placement unit 12a, the workpiece temporary placement unit 13a, and the cleaning unit 14a. Although the example which arrange | positioned between was shown, the partition 61 which comprises the air circulation chamber 6 may be arrange | positioned between the workpiece carrying-in / out area 24, the workpiece temporary storage part 13a, and the washing | cleaning part 14a. Good. Further, an air filter communicating with the air introduction opening 621 provided in the top wall 62 constituting the air circulation chamber 6 may be provided.

2: Equipment housing 3: Turning unit 31: Moving base 32: Spindle unit 321: Spindle housing 322: Rotary spindle 323: Servo motor 324: Tool tool mounting member 33: Tool tool 331: Tool body 332: Cutting blade 4: Cutting Feed mechanism 5: Chuck table mechanism 51: Support base 52: Chuck table 54: Cover member 56: Chuck table moving mechanism 6: Air circulation chamber 61: Partition 611: Clearance 62: Top wall 621: Air introduction opening 63, 64: Side wall 65: Air outlet means 651: Suction port 652: Suction duct 653: Suction means 11: First cassette 12: Second cassette 13: Temporary workpiece placing means 14: Cleaning means 15: Workpiece conveying means 16 : Workpiece carry-in means 17: Workpiece carry-out means 10: Semiconductor Body wafer

Claims (1)

A chuck table having a holding surface for holding a workpiece, a workpiece loading / unloading area for loading and unloading the workpiece, and a chuck table moving means for moving the workpiece to a machining area for machining the workpiece. A chuck table mechanism, a turning means having a cutting tool for turning a workpiece held on the chuck table positioned in the machining area, and a first workpiece in which a workpiece before machining is accommodated. A first cassette placement area for placing a cassette, a second cassette placement area for placing a second cassette that accommodates a processed workpiece, a workpiece loading / unloading area, and a first cassette loading area; A workpiece temporary placement means for temporarily placing a workpiece before being unloaded from the first cassette placed between the cassette placement region and placed in the first cassette placement region; Work-in / out area A cleaning unit disposed between the two cassette mounting areas and cleaning the processed workpiece; and a workpiece to be temporarily placed on the workpiece temporary placing unit being loaded and unloaded. Workpiece carrying-in means for carrying in the chuck table positioned in the area, and carrying-out washing means for carrying out the processed work placed on the chuck table located in the work-piece carrying-in / out area The workpiece unloading means for transporting to the workpiece and the unprocessed workpiece stored in the first cassette placed in the first cassette placement area are unloaded to the workpiece temporary placement means and washed. In a processing apparatus comprising a bite tool comprising: a workpiece transfer means for transferring a processed workpiece cleaned by a means to a second cassette placed in a second cassette placement region;
It is arranged between the workpiece loading / unloading area and the first cassette loading area and the second cassette loading area, and allows the workpiece to move at the lower part , and always to the outside of the machining apparatus. One air is provided by a partition wall having an open gap, a top wall disposed above the partition wall and covering the chuck table mechanism and the turning means, and a side wall covering the lower periphery of the top wall together with the partition wall. A flow passage is formed, an air introduction opening is provided in the ceiling wall, and a suction means provided with a suction port is disposed in the vicinity of the processing region.
Machining device with a bite tool characterized by that

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