JP2004001118A - Dust disposer and machine tool equipped with dust disposer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dust disposer which safely disposes of dust particles without scattering the same, and to provide a machine tool equipped with the dust disposer. <P>SOLUTION: The dust disposer is comprised of a cyclone separating means 83, a shower means 84, a liquid waste storage means 85, a drain means, a filter means 86, and an air-exhausting means. The cyclone separating means 83 is formed of an outer cylinder and an inner cylinder arranged in the outer cylinder, and includes a separation chamber defined by both the outer and the inner cylinders. The shower means 84 sprays water toward the inner peripheral surface of the outer cylinder of the cyclone separating means 83 and the outer peripheral surface of the inner cylinder of the same. The liquid waste storage means 85 stores liquid waste containing dust particles separated by the cyclone separating means 83 and dust particles washed away by the spraying means. The drain means drains the liquid waste stored in the liquid waste storage means 85. The filter means 86 is arranged in the inner cylinder of the cyclone separating means 83 to filter out air separated from the dust particles by the cyclone separating means 83. The air-exhausting means exhausts the air filtered by the filter means 86. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a dust processing device for processing dust generated from a processing machine such as a dry polishing machine, and a processing machine provided with the dust processing device.
[0002]
[Prior art]
In a semiconductor device manufacturing process, a large number of rectangular regions are partitioned by cutting lines called streets arranged in a grid on the surface of a substantially disk-shaped semiconductor wafer, and a semiconductor circuit is formed in each of the rectangular regions. By separating the semiconductor wafer on which a large number of semiconductor circuits are formed along the streets, individual semiconductor chips are formed. In order to reduce the size and weight of the semiconductor chip, the semiconductor wafer is usually ground to a predetermined thickness by cutting the semiconductor wafer along streets to separate individual rectangular regions. Has formed. The grinding of the back surface of the semiconductor wafer is usually performed by pressing a grinding tool formed by fixing diamond abrasive grains with an appropriate bond such as a resin bond against the back surface of the semiconductor wafer while rotating at a high speed. When the back surface of the semiconductor wafer is ground by such a grinding method, a so-called processing strain is generated on the back surface of the semiconductor wafer, thereby considerably reducing the bending strength of the individually divided semiconductor chips. As a measure for removing processing strain generated on the back surface of the ground semiconductor wafer, a wet etching method of chemically etching the back surface of the ground semiconductor wafer using an etching solution containing nitric acid and hydrofluoric acid, A dry etching method using an etching gas is used. In addition, a polishing method for polishing the back surface of a polished semiconductor wafer using free abrasive grains has also been put to practical use.
[0003]
However, the above-described wet etching method, dry etching method, and polishing method have low productivity, and the waste liquid causes environmental pollution. In order to solve such a problem, the present applicant has polished the back surface of the ground semiconductor wafer using a polishing tool made of a felt whetstone in which abrasive grains are dispersed in a felt and fixed with an appropriate bonding agent. A technique for removing distortion has been proposed as Japanese Patent Application No. 2001-93397. A polishing machine using this polishing technique includes a chuck table for holding a workpiece, and polishing means provided with a polishing tool for polishing the workpiece held on the chuck table. The workpiece is polished dry. As described above, when the workpiece is polished in a dry manner, polishing powder is generated. Therefore, a measure for preventing the scattering of the polishing powder is required. Therefore, a dustproof cover that covers the polishing area for polishing the workpiece by the polishing tool of the polishing means is provided, and the discharge port provided in the dustproof cover is connected to the dust treatment device, and the dustproof cover is scattered into the dustproof cover by polishing. Abrasive powder is processed by a dust treatment device. As a dust treatment device for treating the abrasive powder, a configuration in which dust and air are separated by a cyclone dust collector, and the separated air is filtered and discharged by a filter is effective.
[0004]
[Problems to be solved by the invention]
Thus, when the dust collected by the cyclone dust collecting device is disposed of, there is a problem that the dust soars and contaminates an environment such as a clean room in which the processing machine is disposed, and may cause a dust explosion. .
[0005]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned facts, and a main technical problem thereof is to prevent dust from being scattered when processing dust, and to provide a dust processing device capable of safely processing the dust and a process equipped with the dust processing device. The machine.
[0006]
[Means for Solving the Problems]
In order to solve the main technical problem, according to the present invention, an outer cylinder provided with a dust-containing air intake port at an upper portion and an inner cylinder disposed in the outer cylinder and forming a separation chamber between the outer cylinder and the outer cylinder Cyclone-type separation means for turning the dust-containing air flowing into the separation chamber from the dust-containing air intake port to separate the dust and air into dust and air,
Shower means for injecting water toward the inner peripheral surface of the outer cylinder and the outer peripheral surface of the inner cylinder of the cyclone-type separation means to wash away dust adhering to the inner peripheral surface of the outer cylinder and the outer peripheral surface of the inner cylinder; ,
Waste liquid storage means for storing a waste liquid composed of dust separated by the cyclone-type separation means and dust washed away by the spray means;
Drain means for discharging waste liquid stored in the waste liquid storage means,
Filter means disposed in the inner cylinder of the cyclone-type separation means and filtering air separated from dust by the cyclone-type separation means;
Exhaust means for exhausting the air filtered by the filter means,
A dust treatment device is provided.
[0007]
Further, according to the present invention, a chuck table configured to hold a workpiece and to be movable between a workpiece loading / unloading area and a polishing area, and to be held by the chuck table positioned in the polishing area. A polishing means having a polishing tool for dry-polishing the processed workpiece, and a dustproof cover covering the chuck table and the polishing tool positioned in the polishing area, a polishing machine comprising:
An outer cylinder having a dust-containing air intake port connected to an exhaust duct of the dust-proof cover at an upper portion thereof; and an inner cylinder disposed in the outer cylinder and forming a separation chamber between the outer cylinder and the outer cylinder. A cyclone-type separating means for rotating dust-containing air flowing into the separation chamber from the dust-containing air inlet to separate the dust and air, an inner peripheral surface of the outer cylinder and the inner cylinder of the cyclone-type separating means Shower means for injecting water toward the outer peripheral surface of the outer cylinder to wash out dust adhering to the inner peripheral surface of the outer cylinder and the outer peripheral surface of the inner cylinder; and washing the dust separated by the cyclone-type separation means and the spraying means. Waste liquid storage means for storing waste liquid composed of collected dust, drain means for discharging waste liquid stored in the waste liquid storage means, and the cyclone separation means disposed in the inner cylinder of the cyclone separation means Separated from dust by A filter means for filtering the air, equipped with dust processing apparatus comprising, an exhaust means for exhausting the filtered air by the filter means,
A processing machine characterized by the above is provided.
Other features of the present invention will become apparent from the following description.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of a dust processing apparatus and a processing machine equipped with the dust processing apparatus configured according to the present invention will be described in detail with reference to the accompanying drawings.
[0009]
FIG. 1 is a perspective view of a polishing machine as a processing machine to which the dust treatment apparatus according to the present invention is applied.
The polisher includes a machine housing, generally designated by the numeral 2. The fuselage housing 2 has an elongated rectangular parallelepiped main portion 21 and an upright wall 22 provided at a rear end (upper right end in FIG. 1) of the main portion 21 and extending substantially vertically upward. I have. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. A polishing unit 3 as a polishing means is mounted on the pair of guide rails 221 and 221 so as to be vertically movable.
[0010]
The polishing unit 3 includes a moving base 31 and a spindle unit 32 mounted on the moving base 31. The movable base 31 is provided with a pair of legs 311, 311 vertically extending on both sides of the rear surface, and slidably engages the pair of guide rails 221, 221 with the pair of legs 311, 311. Guide grooves 312 and 312 are formed. As described above, a support portion 313 protruding forward is provided on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22. The spindle unit 32 is attached to the support portion 313.
[0011]
The spindle unit 32 includes a spindle housing 321 mounted on the support 313, a rotary spindle 322 rotatably disposed on the spindle housing 321, and a servomotor as a drive source for driving the rotary spindle 322 to rotate. 323. The lower end of the rotary spindle 322 projects downward beyond the lower end of the spindle housing 321, and a disk-shaped tool mounting member 324 is provided at the lower end. A plurality of bolt insertion holes (not shown) are formed in the tool mounting member 324 at intervals in the circumferential direction. A polishing tool 325 is mounted on the lower surface of the tool mounting member 324. As shown in FIGS. 2 and 3, the polishing tool 325 includes a disk-shaped support member 326 and a disk-shaped polishing member 327. The support member 326 has a plurality of blind screw holes 326a extending downward from the upper surface thereof at intervals in the circumferential direction. The lower surface of the support member 326 forms a circular support surface, and the polishing member 327 is joined to the circular support surface of the support member 326 by an appropriate adhesive such as an epoxy resin adhesive. As the polishing member 327, in the illustrated embodiment, a felt grindstone in which abrasive grains are dispersed in felt and fixed with an appropriate bonding agent is used. The detailed description of the configuration of the polishing member 327 itself made of the felt whetstone has been described in detail in the specification and drawings of Japanese Patent Application No. 2001-93397 already proposed by the present applicant, so that the description will be left to this description. The description is omitted in this document. The polishing tool 325 is positioned on the lower surface of the tool mounting member 324 fixed to the lower end of the rotary spindle 322, and a blind screw formed on the support member 326 of the polishing tool 325 through a through hole formed in the tool mounting member 324. By screwing the fastening bolt 328 into the hole 326a, the polishing tool 325 is mounted on the tool mounting member 324.
[0012]
Returning to FIG. 1, the polishing machine in the illustrated embodiment moves the polishing unit 3 vertically along the pair of guide rails 221 and 221 (in a direction perpendicular to a mounting surface of a chuck table described later). ) Is provided. The polishing unit feed mechanism 4 includes a male screw rod 41 disposed on the front side of the upright wall 22 and extending substantially vertically. The male screw rod 41 is rotatably supported at its upper end and lower end by bearing members 42 and 43 attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and the output shaft of the pulse motor 44 is operatively connected to the male screw rod 41. A connecting portion (not shown) projecting rearward from the center portion in the width direction is also formed on the rear surface of the movable base 31, and a penetrating female screw hole extending in the vertical direction is formed in this connecting portion. The male screw rod 41 is screwed into the female screw hole. Therefore, when the pulse motor 44 rotates forward, the moving base 31, ie, the polishing unit 3, is lowered or moved forward, and when the pulse motor 44 rotates reversely, the moving base 31, ie, the polishing unit 3 is raised, ie, moved backward.
[0013]
1 and 4, a substantially rectangular immersion portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the chuck table mechanism 5 is provided in the immersion portion 211. It is arranged. The chuck table mechanism 5 includes a support base 51 and a disk-shaped chuck table 52 that is rotatably disposed about a rotation center axis extending substantially vertically on the support base 51. The support base 51 is slidable on a pair of guide rails 23, 23 extending in the front-rear direction (direction perpendicular to the front surface of the upright wall 22) indicated by arrows 23 a and 23 b on the immersed portion 211. 1 and a polishing member of a polishing tool 325 which constitutes the spindle unit 32 by a chuck table moving mechanism 56 which will be described later. 327 and the opposing polishing area 25 (the position shown by the two-dot chain line in FIG. 4).
[0014]
The chuck table 52 has a mounting surface on which a workpiece is mounted on an upper surface, and is rotatably supported by the support base 51. The chuck table 52 is rotated by a servomotor 53 connected to a rotating shaft (not shown) mounted on the lower surface thereof. The chuck table 52 is made of an appropriate porous material such as porous ceramics, and is connected to a suction unit (not shown). Therefore, by selectively communicating the chuck table 52 with suction means (not shown), the workpiece placed on the placement surface is suction-held. The illustrated chuck table mechanism 5 includes a cover member 54 (see FIG. 1) having a hole for inserting the chuck table 52 and covering the support base 51 and the like and movably disposed together with the support base 51. ing.
[0015]
4, the polishing machine according to the illustrated embodiment includes a chuck table moving mechanism 56 that moves the chuck table mechanism 5 along the pair of guide rails 23 in the directions indicated by arrows 23a and 23b. I have it. The chuck table moving mechanism 56 includes a male screw rod 561 disposed between the pair of guide rails 23 and extending in parallel with the guide rails 23, and a servo motor 562 for driving the male screw rod 561 to rotate. The male screw rod 561 is screwed into a screw hole 511 provided in the support base 51, and its tip is rotatably supported by a bearing member 563 attached by connecting the pair of guide rails 23. ing. The servomotor 562 has a drive shaft that is drivingly connected to the base end of the male screw rod 561. Therefore, when the servo motor 562 rotates forward, the support base 53, ie, the chuck table mechanism 5 moves in the direction shown by the arrow 23a, and when the servo motor 562 rotates in the reverse direction, the support base 53, ie, the chuck table mechanism 5 moves in the direction shown by the arrow 23b. Moved. The chuck table mechanism 5 that is moved in the directions indicated by the arrows 23a and 23b is selectively positioned in a workpiece loading / unloading area indicated by a solid line and a polishing area indicated by a two-dot chain line in FIG. Further, the chuck table mechanism 5 is reciprocated in a direction indicated by arrows 23a and 23b over a predetermined range in the polishing area.
[0016]
Returning to FIG. 1, the description will be continued. On both sides of the support base 51 constituting the chuck table mechanism 5 in the moving direction, as shown in FIG. Bellows means 61 and 62 for covering the rails 23, the male screw rod 561, the servomotor 562, and the like are provided. Bellows means 61 and 62 can be formed from any suitable material such as campus cloth. The front end of the bellows means 61 is fixed to the front wall of the immersion part 211, and the rear end is fixed to the front end face of the cover member 54 of the chuck table mechanism 5. The front end of the bellows means 62 is fixed to the rear end surface of the cover member 54 of the chuck table mechanism 5, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the chuck table mechanism 5 is moved in the direction shown by the arrow 23a, the bellows means 61 is extended and the bellows means 62 is contracted. When the chuck table mechanism 5 is moved in the direction shown by the arrow 23b, the bellows means is moved. 61 is contracted, and the bellows means 62 is extended.
[0017]
The polishing machine in the illustrated embodiment includes a dustproof cover 7 surrounding a polishing tool 325 pressed against a workpiece held on the chuck table 52 together with a chuck table mechanism 5 positioned in a polishing area 52. Is provided. The dustproof cover 7 has a box shape as a whole, and has an upper wall 71, a front wall 72, and both side walls 73, 73. The side walls 73, 73 of the dustproof cover 7 have shoulder surfaces 73a, 73a facing downward at the middle in the vertical direction, and the lower halves of the side walls 73, 73 are brought into close contact with both side surfaces of the immersion part 211, The surfaces 73 a, 73 a are placed on the upper surfaces of both side edges of the main portion 21 of the housing 2. A rectangular opening 72a for allowing the chuck table mechanism 5 to pass therethrough is formed in the front wall 72 of the dustproof cover 7. A circular opening 71a for allowing the polishing tool 325 to pass is formed in the upper wall 71 of the dustproof cover 7. The upper wall 71 of the dust cover 7 is provided with a cylindrical member 74 extending upward from the periphery of the circular opening 71a. A part of the upper wall 71 of the dustproof cover 7 is provided with a maintenance and inspection door 75 that can be freely opened and closed. Further, an exhaust duct 76 for exhausting the inside of the dustproof cover 7 is provided on the upper wall 71 of the dustproof cover 7. The exhaust duct 76 is connected to a dust processing device described later.
[0018]
Continuing the description with reference to FIG. 1, a first cassette 11, a second cassette 12, a workpiece temporary mounting unit 13, and a cleaning unit 14, a workpiece transporting means 15, a workpiece loading means 16 and a workpiece unloading means 17 are provided. The first cassette 11 stores a workpiece before polishing, and is placed in a cassette loading area in the main part 21 of the apparatus housing 2. The second cassette 12 is placed in a cassette unloading area in the main portion 21 of the apparatus housing 2 and stores a workpiece after polishing. The workpiece temporary mounting means 13 is disposed between the first cassette 11 and the workpiece loading / unloading area 24, and temporarily places the workpiece before polishing. The cleaning means 14 is disposed between the workpiece loading / unloading area 24 and the second cassette 12, and cleans the workpiece after polishing. Workpiece transfer means 15 Disposed between the first cassette 11 and the second cassette 12 and carried out of the workpiece stored in the first cassette 11 to the work piece temporary mounting means 13. At the same time, the workpiece cleaned by the cleaning means 14 is transported to the second cassette 12. The workpiece loading means 16 is disposed between the workpiece temporary mounting means 13 and the workpiece loading / unloading area 24, and is placed on the workpiece temporary loading means 13 before polishing. The workpiece is transported onto the chuck table 52 of the chuck table mechanism 5 positioned in the workpiece loading / unloading area 24. The workpiece carrying-out means 17 is disposed between the workpiece carrying-in / out area 24 and the cleaning means 14, and is polished on the chuck table 52 positioned in the workpiece carrying-in / out area 24. The processed workpiece is transported to the cleaning means 14. Further, the polishing apparatus in the illustrated embodiment has a cleaning water injection nozzle 18 for cleaning the chuck table 52 at the center of the main part 21 of the apparatus housing 2. The cleaning water jet nozzle 18 jets the cleaning water toward the chuck table 52 in a state where the chuck table mechanism 5 is positioned in the workpiece loading / unloading area 24.
[0019]
The workpiece accommodated in the first cassette 11 is a semiconductor wafer having a front surface mounted on an annular frame via a protective tape (accordingly, the semiconductor wafer has a rear surface located on the upper side), or a support substrate (sub). The semiconductor wafer may be a semiconductor wafer having a front side mounted on a straight) (therefore, the back side of the semiconductor wafer is positioned on the upper side). The first cassette 11 containing such a semiconductor wafer as a workpiece is placed in a predetermined cassette loading area in the main portion 21 of the apparatus housing 2. When all of the unpolished semiconductor wafers stored in the first cassette 11 placed in the cassette loading area are unloaded, a new cassette containing a plurality of semiconductor wafers is used instead of the empty cassette 11. 11 is manually placed in the cassette loading area. On the other hand, when a predetermined number of polished semiconductor wafers are loaded into the second cassette 12 placed in a predetermined cassette unloading area in the main portion 21 of the apparatus housing 2, the second cassette 12 is manually moved. It is carried out and a new empty second cassette 12 is placed.
[0020]
Next, the processing operation of the above-described polishing machine will be briefly described with reference to FIG.
The semiconductor wafer as a workpiece before polishing stored in the first cassette 11 is transported by the vertical movement and the forward / backward movement of the workpiece transporting means 15 and is placed on the workpiece temporary mounting means 13. . The semiconductor wafer placed on the workpiece temporary mounting means 13 is positioned in the workpiece loading / unloading area 24 by the turning operation of the workpiece loading means 16 after centering is performed here. It is mounted on the chuck table 52 of the chuck table mechanism 5. The semiconductor wafer placed on the chuck table 52 is suction-held on the chuck table 52 by suction means (not shown).
[0021]
When the semiconductor wafer is sucked and held on the chuck table 52, the servo motor 562 of the chuck table moving mechanism 56 is driven to rotate in the normal direction, and the chuck table mechanism 5 is moved in the direction indicated by the arrow 23a to the polishing start position of the polishing area 25. Be positioned. At the polishing start position of the polishing area 25, the servo motor 53 is driven to rotate the chuck table 52 holding the semiconductor wafer, and the servo motor 323 is driven to rotate the polishing tool 325. The pulse motor 44 of the feed mechanism 4 is driven to rotate forward to lower or advance the polishing unit 3, and the polishing member 327 of the polishing tool 325 presses the back surface of the semiconductor wafer on the chuck table 52 with a predetermined load. Next, the servo motor 562 of the chuck table moving mechanism 56 is driven to rotate forward to move the chuck table mechanism 5 in the direction indicated by the arrow 23a so that the polishing member 327 of the polishing tool 325 is held at the center position of the semiconductor wafer held by the chuck table 62. Is moved to the polishing end position which slightly exceeds. Then, when the chuck table 52 has moved to the polishing end position, the servo motor 562 is driven in the reverse direction to move the chuck table mechanism 5 in the direction shown by the arrow 23b to return to the polishing start position, and the above-mentioned polishing operation is repeatedly executed. By performing this polishing operation for a preset time or performing the reciprocating movement of the chuck table mechanism 5 a predetermined number of times, the back surface of the semiconductor wafer is dry-polished by a predetermined amount by the action of the polishing member 327 to remove residual processing distortion. Is done. Although the abrasive powder is generated by the above-mentioned dry polishing action and scatters in the dustproof cover 7, the abrasive powder is discharged through an exhaust duct 76 to a dust processing device described later.
[0022]
When the polishing is completed as described above, the polishing tool 325 is separated upward from the back surface of the semiconductor wafer, and the chuck table mechanism 5 is moved to the workpiece loading / unloading area 24 in the direction indicated by the arrow 23b. Thereafter, the suction holding of the polished semiconductor wafer on the chuck table 52 is released, and the semiconductor wafer released from the suction holding is carried out by the work carrying-out means 17 and conveyed to the cleaning means 14. The semiconductor wafer conveyed to the cleaning means 14 is cleaned here, and then stored in a predetermined position of the second cassette 12 by the workpiece conveying means 15.
[0023]
Next, a dust processing apparatus for processing abrasive powder generated by the above-described dry polishing operation will be described with reference to FIGS.
The dust treatment device 8 in the illustrated embodiment is disposed on the side of the machine housing 2 of the above-described polishing machine. The dust treatment device 8 includes a rectangular parallelepiped device housing 81 as shown in FIGS. 5 and 6, and a caster 82 for facilitating movement is mounted on a lower surface of the device housing 81. It is configured to be movable as a unit. On the upper wall 811 of the device housing 81, a cyclone-type separating means 83 for taking in dust-containing air and separating it into dust and air is provided. As shown in FIG. 6, the cyclone-type separation means 83 includes an outer cylinder 831 formed of a metal material such as stainless steel and an inner cylinder 832 provided in the outer cylinder 831. A separation chamber 830 is formed. A closing plate 833 is attached to upper ends of the outer cylinder 831 and the inner cylinder 832. A dust-containing air intake 831a is formed in an upper part of the outer cylinder 831, and an intake pipe 834 is attached to the dust-containing air intake 831a. Note that the intake pipe 834 is attached to the separation chamber 830 in a tangential direction as shown in FIG. The exhaust duct 76 attached to the dust cover 7 of the polishing machine described above is connected to the intake pipe 834. At the lower end of the outer cylinder 831, a funnel-shaped waste liquid receiving portion 831b whose diameter is reduced downward is provided, and a drop port 831c is provided at the center of the waste liquid receiving portion 831b. The cyclone-type separating means 83 configured as described above causes the dust-containing air flowing from the dust-containing air intake 831a through the exhaust duct 76 and the intake pipe 834 to swirl in the separation chamber 830, and generates dust and dust by the action of centrifugal force due to the swirl. The air is separated from the air, the dust falls to the waste liquid receiving portion 831b, and the air flows into the inner cylinder 832.
[0024]
As described above, the dust separated by the action of the centrifugal force in the separation chamber 830 of the cyclone type separation means 83 is subjected to the inner peripheral surface of the outer cylinder 831 and the outer peripheral surface of the inner cylinder 832 forming the separation chamber 830, particularly the outer cylinder 831. It adheres to the inner peripheral surface. In the illustrated embodiment, in order to wash away dust adhering to the inner peripheral surface of the outer cylinder 831 and the outer peripheral surface of the inner cylinder 832, a shower for spraying water to the inner peripheral surface of the outer cylinder 831 and the outer peripheral surface of the inner cylinder 832 is used. Means 84 are provided. The shower means 84 is provided at the upper end of the separation chamber 830 of the cyclone-type separation means 83 and has a nozzle which injects water obliquely downward toward the inner peripheral surface of the outer cylinder 831 and the outer peripheral surface of the inner cylinder 832. An annular nozzle 841 is provided. As shown in FIG. 8, two water inflow pipes 842, 842 are attached to the annular nozzle 841 with a phase difference of 180 degrees, and the two water supply pipes 842, 842 connect the outer cylinder 831 in the radial direction. It is arranged to pass through. As shown in FIG. 5, hoses 843 (only one is shown in FIG. 5) are connected to the pipes 842, 842, and the hoses 843 are connected to water supply means (not shown). Therefore, the water supplied by the water supply means (not shown) flows into the annular nozzle 841 via the hose 843 and the pipe 842, and is injected from the injection port toward the inner surface of the outer cylinder 831 and the inner cylinder 832. As a result, the dust adhering to the inner surface of the outer cylinder 831 and the inner cylinder 832 is washed away by the water jetted from the nozzle 841, becomes a waste liquid, and is discharged from the dropping port 831c of the waste liquid receiving portion 831b to the waste liquid storage means described later. .
[0025]
Below the centrifugal separating means 83, a waste liquid storing means 85 for storing dust and waste liquid separated by the cyclone type separating means 83 and discharged from the dropping port 831c of the waste liquid receiving part 831b is provided as shown in FIG. ing. The waste liquid storage means 85 includes a drop conduit 851 having an upper end connected to the drop outlet 831c of the waste liquid receiving portion 831b of the cyclone type separation means 83, and a waste liquid tank 852 for storing the waste liquid discharged through the drop conduit 851. The waste liquid tank 852 is formed of a transparent synthetic resin, and has a discharge port 852a at a position above the bottom surface by a predetermined amount. A drain pipe 852b is formed integrally with the outlet 852a. A drain hose 853 as drain means is connected to the drain pipe 852b, and the drain hose 853 is led out of the apparatus housing 81 as shown in FIG. As described above, in the illustrated dust treatment apparatus 8, the dust separated by the cyclone-type separation means 83 is mixed with the water jetted by the shower means 84, becomes a waste liquid, is stored in the waste liquid tank 852, and is illustrated by the drain means. Since the waste liquid is discharged to the waste liquid treatment apparatus, the dust is not scattered, and there is no danger of dust explosion.
[0026]
Here, the relationship between the discharge port 852a provided in the waste liquid tank 852 and the falling conduit 851 will be described. That is, the lower end of the falling conduit 851 is located below the outlet 852a and is open. Therefore, since the liquid level of the waste liquid accommodated in the waste liquid tank 852 is at least at the position of the discharge port 852a, the lower end of the falling pipe 851 is always immersed below the liquid level of the waste liquid, that is, in the waste liquid. . As a result, backflow of air from the discharge port 852a through the drop conduit 851 is prevented. As described above, the configuration in which the lower end of the drop conduit 851 is positioned below the position of the discharge port 852a provided in the waste liquid tank 852 functions as backflow prevention means for preventing air from flowing back through the fall conduit 851. In addition, since the waste liquid tank 852 in the illustrated embodiment is formed of a transparent synthetic resin, the state of the waste liquid in the waste liquid tank 852 can be visually checked from the outside. In view of the fact that the waste liquid tank 852 is formed of a transparent synthetic resin, a viewing window 813 is provided on the side wall 812 of the apparatus housing 81 at a position facing the waste liquid tank 852. Therefore, the state of the waste liquid in the waste liquid tank 852 can be confirmed from the outside of the apparatus housing 81 through the viewing window 813.
[0027]
The dust treatment device 8 in the illustrated embodiment, as shown in FIGS. 6 and 9, is disposed in the inner cylinder 832 of the cyclone-type separation unit 83 and separates the air separated from the dust by the cyclone-type separation unit 83. A filter means 86 for filtering is provided. The illustrated filter means 86 is provided with three cylindrical filters 861, and the three cylindrical filters 861 are closed at the lower end surfaces. Each of the filters 861 is disposed so as to pass through a mounting hole 833a (see FIG. 6) provided in the closing plate 833 mounted on the upper end of the inner cylinder 832, and the mounting flange 861a provided on the upper end is provided with a closing plate 833. It is attached to the device by fixing means such as screws. Therefore, the air that has flowed in from the lower end of the inner cylinder 832 is filtered out of fine dust from the outer periphery of the filter 861 to the center hole 861b, and flows out from the upper end of the center hole 861b as clean air.
[0028]
As shown in FIG. 6, a lid 87 having a chamber 870 through which clean air flows out through the three filters 861 is mounted on the upper end of the cyclone type separation means 83 so as to be openable and closable. The lid 87 is formed of a metal material such as stainless steel, and an exhaust port 871 is provided on a side wall of the lid 87, and an exhaust pipe 872 is attached to the exhaust port 871. An exhaust duct 875 is connected to the exhaust pipe 872, and the suction side of an air pump 876 as a forced exhaust means disposed in the apparatus housing 81 is connected to the exhaust duct 875. An exhaust duct 877 is connected to the discharge side of the air pump 876, and the air purified as described above is exhausted to the outside of the apparatus housing 81 by the exhaust duct 877. Therefore, the chamber 870, the exhaust duct 875, the air pump 876, and the exhaust duct 877 formed in the lid 87 function as an exhaust unit that exhausts the air filtered by the filter unit 86.
[0029]
The dust processing apparatus 8 in the illustrated embodiment includes a filter regenerating unit 88 for removing fine dust collected by the three filters 861 as shown in FIGS. 5, 6, and 9. I have. The filter regeneration means 88 includes three injection nozzles 881 disposed inside the upper wall of the lid 87 and injecting high-pressure air toward the center holes 861 b of the three filters 861, respectively, and the three injection nozzles 881. An air tank 882 for storing high-pressure air supplied to the air tank, an air hose 883 connecting the air tank 882 and the injection nozzle 881, and three controls for controlling air supplied from the air hose 883 to the injection nozzle 881 respectively. It comprises a valve 884 and three air pipes 885 for supplying control air for operating the three control valves 884, respectively. When the control air is applied to the control valve 884 via the air pipe 885 by the control air supply means (not shown), the filter regeneration means 88 thus configured opens the control valve 884 to open the high pressure in the air tank 882. Air is injected from the injection nozzle 881 through the air hose 883 and the control valve 884 toward the center hole 861b of the filter 861. As a result, high-pressure air flows from the center hole 861b side of the filter 861 toward the outer periphery in the opposite direction to that during filtration, so that fine dust collected by the filter 861 is blown off from the outer periphery, and the filter 861 is washed. The filter regenerating means 88 may be operated periodically when it is operated for a predetermined time. In addition, during operation of the dust treatment device 8, three control valves 884 are sequentially operated to sequentially operate the three control valves 884. It is effective to sequentially wash the filters 861 one by one.
[0030]
Next, a description will be given of an attachment mechanism for attaching the lid 87 to the upper end of the cyclone type separation means 83 so as to be openable and closable, with reference to FIGS.
The illustrated attachment mechanism comprises a pair of hinge mechanisms 89, 89 as shown in FIG. Since the pair of hinge mechanisms 89 have substantially the same configuration, only one of them will be described below with reference to FIGS. The hinge mechanism 89 includes a first hinge member 891 having one end attached by welding to an upper outer peripheral surface of an outer cylinder 831 constituting the cyclone-type separating means 83 and an L having one end attached to the outer peripheral surface of the lid 87 by welding. It comprises a second hinge member 892 having a U-shape, and a support shaft 893 for rotatably connecting the other end of the first hinge member 891 and the other end of the second hinge member 892 to each other. Therefore, by gripping and lifting the handle 877 attached to the outer peripheral surface of the lid 87 on the side opposite to the hinge mechanism 89, the lid 87 can be pivotally opened about the support shaft 893 and opened. By opening the lid 87 in this way, the filter 861 can be replaced.
[0031]
After the lid 87 is opened as described above, when the lid 87 is closed, there is a risk that a finger may be pinched between the lid 87 and the outer cylinder 831 because the lid 87 is very heavy. Therefore, one of the hinge mechanisms 89 shown is provided with stopper means 895 for stopping the operation of the lid 87 in the closing direction at the position shown in FIGS. 12 and 13 before the lid 87 is closed. The stopper means 895 includes a bracket 896 attached to the second hinge member 892, a stopper lever 898 having an upper end supported by a support pin 897 disposed in a direction perpendicular to the support shaft 893 on the bracket 896. Consists of A stopper 898a extending at a right angle is provided at the lower end of the stopper lever 898, and a handle 898b is attached to the middle. Since the upper end of the stopper lever 898 thus configured is rotatably supported by the support pin 897, when the lid 87 is rotated from the open position to the closed position, the lower end of the stopper lever 898 is engaged by its own weight. The stop 898a is configured to be located above the first hinge member 891. If necessary, a spring means for urging the stopper lever 898 counterclockwise in FIGS. 11 and 13 around the support pin 897 may be provided. Therefore, when the lid 87 is rotated from the open position to the closed position by a predetermined angle, the locking portion 898a of the stopper lever 898 comes into contact with the upper surface of the first hinge member 891 as shown in FIGS. The rotation of the cover 87 is regulated. For this reason, the danger of pinching a finger between the lid 87 and the outer cylinder 831 by vigorously rotating the lid 87 from the open position to the closed position can be prevented. When the lid 87 is once stopped at a predetermined angular position in this manner, while holding the lid 87 in this state, the user pushes the stopper lever 898 with the handle 898b and pivots the support pin 897 clockwise in FIG. The engagement between the stopper 898a and the first hinge member 891 is released. Then, by rotating the lid 87 toward the closed position, the lid 87 can be positioned at the closed position as shown in FIGS.
[0032]
Next, another embodiment of the dust treatment apparatus will be described with reference to FIG. In the dust treatment device 9 shown in FIG. 14, the same members as those of the dust treatment device 8 are denoted by the same reference numerals, and description thereof will be omitted.
In the dust treatment apparatus 9 shown in FIG. 14, an outer cylinder 931 constituting a cyclone type separation means 93 is formed to extend downward, and a bottom portion thereof constitutes a waste liquid tank 94 as a waste liquid storage means. The waste liquid tank 94 is provided with a discharge port 941 at a position above the bottom surface by a predetermined amount. A drain pipe 942 serving as a drain means is inserted through the outlet 941. The inlet side end of the drain pipe 942 is opened in the waste liquid tank 94 near the bottom. Since the liquid level of the waste liquid accommodated in the waste liquid tank 94 is at least at the position of the discharge port 941, the end of the drain pipe 942 on the inlet side is always below the liquid level of the waste liquid, that is, immersed in the waste liquid. . As a result, backflow of air from the outlet 941 side through the inner cylinder 932 is prevented. The inner cylinder 932 constituting the cyclone type separation means 93 is also formed to extend downward, and the lower end thereof is located below the discharge port 941 and is opened. Therefore, since the liquid level of the waste liquid accommodated in the waste liquid tank 94 is at least at the position of the discharge port 941, the lower end of the inner cylinder 932 is always immersed below the liquid level of the waste liquid, that is, in the waste liquid. . As a result, the air is prevented from flowing backward from the discharge port 941 side through the inner cylinder 932, and the dust is surely mixed into the waste liquid. In the dust treatment apparatus 9 configured as described above, the dust and air flowing from the dust intake port 931a through the dust intake pipe 934 are swirled in the separation chamber 930, and the dust and air are separated by the action of the centrifugal force due to the swirl. Then, dust is dropped into the waste liquid tank 94 by the water jetted from the shower means 84, and the air pushes down the liquid level of the waste liquid in the waste liquid tank 94 and flows into the inner cylinder 932. The discharge of the waste liquid and the air thereafter is the same as in the above-described dust treatment device 8.
[0033]
【The invention's effect】
Since the dust treatment apparatus according to the present invention is configured as described above, the dust separated by the cyclone-type separation means is mixed with water jetted by the shower means to become a waste liquid, is stored in the waste liquid storage means, and is discharged by the drain means. Since it is discharged, there is no need to perform dust discharge work. Therefore, the problem of dust soaring during the dust disposal process and contaminating the environment can be eliminated, and the dust can be safely treated without fear of explosion.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a polishing machine as a processing machine equipped with a dust treatment device according to the present invention.
FIG. 2 is a perspective view showing a polishing tool constituting a polishing unit provided in the polishing machine shown in FIG. 1;
FIG. 3 is a perspective view showing a state of the polishing tool shown in FIG. 2 viewed from a lower surface side;
FIG. 4 is a perspective view showing a chuck table mechanism and a chuck table moving mechanism provided in the polishing machine shown in FIG. 1;
FIG. 5 is a perspective view showing one embodiment of a dust treatment apparatus according to the present invention.
FIG. 6 is a sectional view of the dust treatment apparatus shown in FIG.
FIG. 7 is a sectional view taken along the line AA in FIG. 6;
FIG. 8 is a perspective view showing a nozzle of a shower unit included in the dust processing apparatus shown in FIG.
FIG. 9 is a perspective view showing a state in which a lid attached to a cyclone-type separation unit constituting the dust treatment apparatus shown in FIG. 5 is opened.
FIG. 10 is a side view of a main part of a hinge mechanism for opening and closing a lid on a cyclone-type separating means constituting the dust treatment apparatus shown in FIG. 5;
11 is a front view of a main part of the hinge mechanism shown in FIG. 10;
FIG. 12 is a side view showing an operation state of the hinge mechanism shown in FIG. 10;
FIG. 13 is a front view showing an operation state of the hinge mechanism shown in FIG. 10;
FIG. 14 is a perspective view showing another embodiment of the dust treatment apparatus according to the present invention.
[Explanation of symbols]
2: Device housing
3: Polishing unit
32: Spindle unit
4: Polishing unit feed mechanism
5: Chuck table mechanism
61, 62: bellows means
7: dust cover
8: Dust treatment device
81: Device housing
82: Caster
83: cyclone type separation means
831: outer cylinder of cyclone type separation means
832: inner cylinder of cyclone type separation means
84: shower means
841: Nozzle
85: Waste liquid storage means
851: Falling conduit
852: Waste liquid tank
853: Drain hose
86: Filter means
861: Filter
87: Lid
872: Exhaust pipe
875: Exhaust duct
876: Air pump
877: Exhaust duct
88: Filter regeneration means
881: Injection nozzle
882: Air tank
884: Control valve
89: Hinge mechanism
9: Dust treatment device
93: cyclone type separation means
931: outer cylinder of cyclone type separation means
932: Inner cylinder of cyclone type separation means
94: waste liquid tank
942: Drain pipe
11: first cassette
12: second cassette
13: Workpiece temporary placement means
14: Cleaning means
15: Workpiece transfer means
16: Workpiece loading means
17: Workpiece unloading means
18: Cleaning water injection nozzle

Claims (10)

An outer cylinder having a dust-containing air intake port at an upper portion thereof, and an inner cylinder disposed in the outer cylinder and forming a separation chamber between the outer cylinder and the outer cylinder, and from the dust-containing air intake port to the separation chamber. Cyclone-type separation means for turning the dust-containing air that has flowed in and separating it into dust and air;
Shower means for injecting water toward the inner peripheral surface of the outer cylinder and the outer peripheral surface of the inner cylinder of the cyclone-type separation means to wash away dust adhering to the inner peripheral surface of the outer cylinder and the outer peripheral surface of the inner cylinder; ,
Waste liquid storage means for storing a waste liquid composed of dust separated by the cyclone-type separation means and dust washed away by the spray means;
Drain means for discharging waste liquid stored in the waste liquid storage means,
Filter means disposed in the inner cylinder of the cyclone-type separation means and filtering air separated from dust by the cyclone-type separation means;
Exhaust means for exhausting the air filtered by the filter means,
A dust treatment device characterized by the above-mentioned. The dust treatment apparatus according to claim 1, wherein the waste liquid storage means includes a backflow prevention means for preventing a backflow of air from the drain means side to the inner cylinder of the cyclone type separation means. The waste liquid storage means is disposed below the cyclone-type separation means and has a discharge port connected to the drain means at a position above the bottom surface, and is connected to a lower end of the outer cylinder of the cyclone-type separation means. 2. The dust treatment apparatus according to claim 1, further comprising a falling pipe having a lower end opening to the waste liquid tank, and a lower end of the falling pipe being located below the discharge port. The waste liquid storage means is connected to the lower end of the outer cylinder and is formed of a waste liquid tank having a discharge port connected to the drain means at a position above the bottom surface, and prevents backflow of air from the drain means side to the inner cylinder. The dust treatment apparatus according to claim 1, further comprising a backflow prevention unit that performs backflow prevention. The waste liquid storage means comprises a waste liquid tank formed at the lower end of the outer cylinder of the cyclone type separation means and having a discharge port connected to the drain means at a position above the bottom surface, and the drain means is provided at the discharge port. The dust treatment apparatus according to claim 1, further comprising a drain pipe connected thereto, wherein an end of the drain pipe on an inlet side is located below the outlet. The waste liquid storage means is formed of a waste liquid tank connected to the lower end of the outer cylinder of the cyclone type separation means and having a discharge port connected to the drain means at a position higher than the bottom surface, and the waste liquid storage means is provided inside the cyclone type separation means. The dust treatment device according to claim 1, wherein a lower end of the cylinder is located slightly below the outlet. 2. The dust processing apparatus according to claim 1, wherein the filter unit includes a plurality of filters and a filter regenerating unit for ejecting high-pressure air to each of the filters to remove collected dust. 8. The filter regeneration means according to claim 7, further comprising a plurality of injection nozzles respectively arranged to correspond to the plurality of filters and injecting high-pressure air, and sequentially operating the plurality of injection nozzles. Dust treatment equipment. The dust processing apparatus according to claim 1, wherein the exhaust means is provided with a forced exhaust means. A chuck table configured to hold a workpiece and to be movable between a workpiece loading / unloading area and a polishing area, and dry-grind the workpiece held by the chuck table positioned in the polishing area; Polishing means provided with a polishing tool for performing, and a dustproof cover that covers the chuck table and the polishing tool positioned in the polishing area, a polishing machine comprising:
An outer cylinder having a dust-containing air intake port connected to an exhaust duct of the dust-proof cover at an upper portion thereof; and an inner cylinder disposed in the outer cylinder and forming a separation chamber between the outer cylinder and the outer cylinder. A cyclone-type separating means for rotating dust-containing air flowing into the separation chamber from the dust-containing air inlet to separate the dust and air, an inner peripheral surface of the outer cylinder and the inner cylinder of the cyclone-type separating means Shower means for injecting water toward the outer peripheral surface of the outer cylinder to wash out dust adhering to the inner peripheral surface of the outer cylinder and the outer peripheral surface of the inner cylinder; and washing the dust separated by the cyclone-type separation means and the spraying means. Waste liquid storage means for storing waste liquid composed of collected dust, drain means for discharging waste liquid stored in the waste liquid storage means, and the cyclone separation means disposed in the inner cylinder of the cyclone separation means Separated from dust by A filter means for filtering the air, equipped with dust processing apparatus comprising, an exhaust means for exhausting the filtered air by the filter means,
A processing machine characterized by the following.

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