JP2018086692A - Grinder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a grinder which is capable of cleaning a suction surface of a carrier pad better and can be downsized.SOLUTION: A grinder has cleaning means including: a first cleaning part (85) cleaning a suction surface (38b) of a carrier pad (38); a second cleaning part (86) cleaning a protective tape (T) to be a held surface held by a chuck table (42) of a wafer (W) held by the carrier pad; and switching means (88) performing switching between a cleaning position higher than an upper surface of the other cleaning part and a retreat position lower than the upper surface of the other cleaning part. The first cleaning part includes: a grinding member (851) grinding attachments attached to the suction surface; and a brush (852) for removing the attachments from the suction surface. The second cleaning part configures a member in contact with the protective tape of the wafer with a sponge (862), performs switching of the first cleaning part and the second cleaning part according to operation of the switching means, and cleans the suction surface of the carrier pad and the protective tape of the wafer.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a grinding apparatus for cleaning a surface to be held of a wafer that has been sucked and held by a chuck table and a suction surface of a conveyance pad.

  For example, in a grinding apparatus used for semiconductor manufacturing, a rotating grinding wheel is brought into contact with a wafer sucked and held by a chuck table for grinding. The ground wafer is sucked and held on the suction surface of the transport pad, and then transported to the spinner table and cleaned. During transport, the upper surface of the wafer held on the suction surface of the transport pad becomes a surface to be ground, and grinding dust may adhere to the suction surface of the transport pad that contacts the surface to be ground. If the wafer is sucked and held by the transport pad with the grinding dust adhered, the wafer may be damaged such as cracking by the suction force of the transport pad. Therefore, it is necessary to clean the suction surface of the transport pad before transporting the ground wafer and transporting the next wafer.

  In the wafer, the upper surface is ground as described above, while the lower surface is formed with a device, and thus a protective tape is attached to protect the device during the grinding process. Grinding debris may adhere to the surface (lower surface) of such a protective tape. If the debris is not removed, the debris will be brought into the tape mounter where the protective tape will be peeled off in the next process. It may interfere with the change. For this reason, after finishing grinding, it is necessary to clean the protective tape side of the lower surface of the wafer sucked and held by the transport pad.

  In accordance with the necessity of such cleaning, grinding is performed by cleaning the suction surface of the transport pad in the transport path by the transport pad, and by providing a cleaning mechanism for cleaning the protective tape side of the lower surface of the wafer sucked and held by the suction pad. An apparatus is proposed in Patent Document 1. The grinding device of Patent Document 1 has a first cleaning means having a grinding wheel and a second cleaning means having a sponge material, and the suction surface of the transport pad is cleaned with the grinding wheel, The protective tape on the lower surface of the wafer is washed with a material.

JP 2010-94785 A

  However, in the cleaning mechanism disclosed in Patent Document 1, although the protective tape on the lower surface of the wafer can be cleaned with a sponge material, the adhering material is not cleaned with a brush because the suction surface of the transport pad is cleaned only with a grinding wheel. There is a problem in terms of removal. Here, in the cleaning mechanism of Patent Document 2, the suction surface of the transport pad is cleaned with the cleaning brush and the grinding plate, but there is no apparatus or configuration for cleaning the lower surface side of the wafer held by suction. . Therefore, in order to clean both the wafer lower surface side and the suction surface of the transport pad, it is necessary to install two cleaning mechanisms in accordance with each, and a large installation space is required, and a device equipped with the cleaning mechanism. There is a problem that the whole is enlarged.

  This invention is made | formed in view of this point, and makes it one of the objectives to provide the grinding device which can wash | clean the adsorption | suction surface of a conveyance pad better, and can achieve size reduction.

  A grinding apparatus according to an aspect of the present invention includes a chuck table that sucks and holds a wafer, a grinding unit that grinds the wafer sucked and held by the chuck table with a grinding wheel, and a wafer that is chucked and held by the chuck table and ground by the grinding unit. A conveyance pad having a suction surface for sucking and holding the grinding surface and carrying out the wafer from the chuck table, and a wafer holding surface which is disposed in the conveyance path of the conveyance pad and sucked and held by the chuck table. And a cleaning device for cleaning the suction surface of the pad. The cleaning device includes a first rotation shaft extending in a direction perpendicular to the suction surface of the transport pad, and a first rotation shaft. A second rotating shaft that surrounds the rotating shaft, a rotating means that rotates both the first rotating shaft and the second rotating shaft, and either the first rotating shaft or the second rotating shaft of Which of the first rotating shaft and the second rotating shaft that are arranged to extend in the radial direction at the end and clean the suction surface, and the first rotating shaft and the second rotating shaft that are not provided with the first cleaning portion A second cleaning unit which is disposed at the upper end of the first cleaning unit so as to intersect the first cleaning unit and extend in the radial direction, and which cleans the held surface held by the chuck table of the wafer held by the transport pad; Switching means for moving either the first rotating shaft or the second rotating shaft back and forth in the axial direction and switching between a cleaning position higher than the upper surface of the other cleaning unit and a retreat position lower than the upper surface of the other cleaning unit; A nozzle that extends in the radial direction at the upper end of the rotating shaft and that ejects cleaning water toward the transport pad, and the first cleaning unit grinds the deposits adhering to the adsorption surface A grinding member and a brush for removing deposits from the suction surface, and the second cleaning unit is configured to cover the wafer. The member in contact with the lifting surface is constituted by a sponge, characterized by washing the first cleaning portion and the suction surface and the holding surface of the wafer of the second conveying pad and a cleaning unit is switched by switching means.

  According to this configuration, since the first cleaning unit includes both the grinding member and the brush, the suction surface can be ground while removing the deposit on the suction surface of the transport pad, and the grinding dust on the suction surface can be ground. The certainty of removing such deposits can be increased. In addition, since the height position of the two cleaning units is switched by the switching unit, in a single cleaning unit, the held surface of the wafer held by the chuck table and the suction surface of the transport pad are separated by a separate cleaning unit. Can be washed. As a result, it is possible to save the installation space for the cleaning means compared to a device having a dedicated cleaning mechanism for cleaning the held surface of the wafer and a dedicated cleaning mechanism for cleaning the suction surface of the transport pad. And miniaturization of the entire apparatus can be achieved.

  According to the present invention, the first cleaning unit includes both the grinding member and the brush, and the height position of the two cleaning units is switched by the switching unit, so that the suction surface of the transport pad can be cleaned better and the size can be reduced. Can be achieved.

It is a perspective view of the grinding device concerning this embodiment. It is a schematic perspective view of a carrying-out means and a washing | cleaning means. It is explanatory drawing which shows the washing | cleaning aspect of a washing | cleaning means. It is explanatory drawing which shows the other washing | cleaning aspect of a washing | cleaning means. It is a schematic perspective view of the washing | cleaning means which concerns on a modification. It is a schematic plan view of the washing | cleaning part of the washing | cleaning means which concerns on another modification.

  Hereinafter, the grinding apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a grinding apparatus according to the present embodiment. Note that the present embodiment is not limited to the configuration shown in FIG. The grinding apparatus may be configured in any way as long as it can be cleaned by the cleaning means as described later.

  As shown in FIG. 1, the grinding apparatus 1 is configured to fully automatically perform a series of operations including a carry-in process, a rough grinding process, a finish grinding process, a cleaning process, and a carry-out process on the wafer W. . The wafer W is formed in a substantially disk shape and is carried into the grinding apparatus 1 while being accommodated in the cassette C. The wafer W may be a plate-like workpiece to be ground, and may be a semiconductor substrate such as silicon or gallium arsenide, an inorganic material substrate such as ceramic, glass, or sapphire, and a package for semiconductor products. A substrate or the like may be used. The wafer W is a surface to be ground whose back surface (upper surface in FIG. 1) is ground, and a protective tape T is attached to the front surface (lower surface in FIG. 1).

  A pair of cassettes C in which a plurality of wafers W are accommodated are placed on the front side of the base 11 of the grinding apparatus 1. Behind the pair of cassettes C, a cassette robot 16 for taking wafers W in and out of the cassettes C is provided. A positioning mechanism 21 for positioning the unprocessed wafer W and a spinner cleaning mechanism 26 for cleaning the processed wafer W are provided on both diagonally rear sides of the cassette robot 16. Between the positioning mechanism 21 and the spinner cleaning mechanism 26, a loading means 31 for loading the unprocessed wafer W into the chuck table 42 and a loading means 36 for unloading the processed wafer W from the chuck table 42 are provided. Yes.

  The cassette robot 16 is configured by providing a hand portion 18 at the tip of a robot arm 17 composed of a multi-node link. In the cassette robot 16, the unprocessed wafer W is transferred from the cassette C to the positioning mechanism 21, and the processed wafer W is transferred from the spinner cleaning mechanism 26 to the cassette C. The positioning mechanism 21 is configured by arranging a plurality of positioning pins 23 that can move forward and backward with respect to the center of the temporary table 22 around the temporary table 22. In the positioning mechanism 21, the center of the wafer W is positioned at the center of the temporary placement table 22 by a plurality of positioning pins 23 being abutted against the outer peripheral edge of the wafer W placed on the temporary placement table 22.

  The carry-in means 31 is configured by providing a carry-in pad 33 at the tip of a carry-in arm 32 that can turn on the base 11. In the carry-in means 31, the wafer W is lifted from the temporary placement table 22 by the carry-in pad 33, and the carry-in pad 33 is turned by the carry-in arm 32, so that the wafer W is carried into the chuck table 42. The carry-out means 36 is configured by providing a transfer pad 38 at the tip of a carry-out arm 37 that can turn on the base 11. In the unloading means 36, the wafer W is sucked and held by the conveyance pad 38 and lifted from the chuck table 42, and the conveyance pad 38 is turned by the unloading arm 37, whereby the wafer W is unloaded from the chuck table 42. A suction surface 38b that sucks and holds the wafer W is formed by a porous porous plate 38a on the lower surface of the transport pad 38 (see FIG. 2), and the suction surface 38b is connected to a suction source (not shown). A cleaning unit 80 is disposed on the carry-out path of the transport pad 38, and details of the cleaning unit 80 will be described later.

  The spinner cleaning mechanism 26 is configured by providing various nozzles (not shown) that spray cleaning water and dry air toward the spinner table 27. In the spinner cleaning mechanism 26, the spinner table 27 holding the wafer W is lowered into the base 11, the cleaning water is sprayed in the base 11 and the wafer W is spinner cleaned, and then dry air is blown to the wafer. W is dried. Behind the carry-in means 31 and the carry-out means 36 is provided a turntable 41 in which three chuck tables 42 are rotatably arranged at equal intervals in the circumferential direction. On the upper surface of each chuck table 42, a holding surface 43 that sucks and holds the wafer W via the protective tape T is formed.

  The turntable 41 rotates intermittently at intervals of 120 degrees, so that the loading / unloading position where the wafer W is carried in and out, the rough grinding position facing the rough grinding means (grinding means) 46, and the finish grinding means (grinding means) 51 Positioned in order at the facing finish grinding positions. At the rough grinding position, the wafer W is roughly ground to a predetermined thickness by the rough grinding means 46. At the finish grinding position, the finish grinding means 51 finish-grinds the wafer W to the finish thickness. Around the turntable 41, columns 12 and 13 are erected.

  The column 12 is provided with a drive mechanism 61 that moves the rough grinding means 46 up and down. The drive mechanism 61 has a pair of guide rails 62 arranged in front of the column 12 and parallel to the Z-axis direction, and a motor-driven Z-axis table 63 slidably installed on the pair of guide rails 62. Yes. A rough grinding means 46 is supported on the front surface of the Z-axis table 63 via a housing 64. A ball screw 65 is screwed to the back side of the Z-axis table 63, and a drive motor 66 is connected to one end of the ball screw 65. The ball screw 65 is rotationally driven by the drive motor 66, and the rough grinding means 46 is moved along the guide rail 62 in the Z-axis direction.

  Similarly, the column 13 is provided with a drive mechanism 71 for moving the finish grinding means 51 up and down. The drive mechanism 71 includes a pair of guide rails 72 arranged in front of the column 13 and parallel to the Z-axis direction, and a motor-driven Z-axis table 73 slidably installed on the pair of guide rails 72. Yes. A finish grinding means 51 is supported on the front surface of the Z-axis table 73 via a housing 74. A ball screw 75 is screwed to the back side of the Z-axis table 73, and a drive motor 76 is connected to one end of the ball screw 75. The ball screw 75 is rotationally driven by the drive motor 76, and the finish grinding means 51 is moved along the guide rail 72 in the Z-axis direction.

  A mount 48 is provided at the lower end of the spindle 47 of the rough grinding means 46, and a rough grinding wheel 49 in which a plurality of rough grinding wheels (grinding wheels) 50 are annularly arranged is mounted on the lower surface of the mount 48. . The rough grinding wheel 50 is composed of, for example, a diamond grinding stone in which diamond abrasive grains are hardened with a binder such as a metal bond or a resin bond. Further, a mount 53 is provided at the lower end of the spindle 52 of the finish grinding means 51, and a finish grinding grinding wheel 54 in which a plurality of finish grinding wheels (grinding wheels) 55 are annularly arranged on the lower surface of the mount 53 is mounted. Is done. The finish grinding wheel 55 is composed of abrasive grains having a smaller particle diameter than the coarse grinding wheel 50.

  When grinding the wafer W with such a grinding apparatus 1, first, the wafer W is transported from the cassette C to the positioning mechanism 21, and the wafer W is centered by the positioning mechanism 21. Next, the wafer W is carried onto the chuck table 42 with the surface to be ground serving as the back surface of the wafer W facing upward and the protective tape T attached to the front surface facing downward, and the wafer W is sucked and held. The wafer W is positioned in the order of the rough grinding position and the finish grinding position by the rotation of the turntable 41.

  In the rough grinding of the wafer W at the rough grinding position, the surface of the protective tape T attached to the wafer W is suction-held by the chuck table 42 with the surface to be held being held. In this state, the rough grinding wheel 50 that rotates while rotating the chuck table 42 around the Z-axis is brought into contact with the upper surface of the wafer W, and the upper surface of the wafer W is coarsely ground as a surface to be ground. Then, in the finish grinding of the wafer W at the finish grinding position after the turntable 41 is rotated, the finish grinding wheel 55 that rotates while rotating the chuck table 42 around the Z axis is the surface to be ground (upper surface) of the wafer W. It is touched to finish grinding.

  After the finish grinding, the surface to be ground of the wafer W is sucked and held by the transport pad 38 of the unloading means 36, and the wafer W is unloaded to the spinner cleaning mechanism 26. The wafer W is cleaned by the spinner cleaning mechanism 26, and the wafer W is carried out from the spinner cleaning mechanism 26 to the cassette C. Here, in the carry-out path of the transport pad 38, the surface of the protective tape T (the lower surface) adhered to the lower surface of the wafer W sucked and held by the transport pad 38 at the time of unloading is cleaned by the cleaning means 80. Further, after the wafer W is carried out to the spinner cleaning mechanism 26, the suction surface 38b (see FIG. 2) of the conveyance pad 38 when the conveyance pad 38 moves to carry out the next wafer W is also cleaned by the cleaning means 80. The Hereinafter, a specific configuration of the cleaning unit 80 will be described.

  FIG. 2 is a schematic perspective view of the carry-out means and the cleaning means, and FIG. 3 is an explanatory view showing a cleaning mode of the cleaning means (partial sectional side view when FIG. 2 is viewed from the right direction). As shown in FIG. 2, the cleaning unit 80 includes a first rotating shaft 81, a second rotating shaft 82, a rotating unit 83, a first cleaning unit 85, a second cleaning unit 86, a nozzle 87, and a switching unit 88. It has.

  As shown in FIG. 3, the first rotating shaft 81 extends in a direction perpendicular to the suction surface 38 b of the transport pad 38, that is, in the vertical direction, and a lower end portion is supported by the switching unit 88. A cup-shaped hub member 90 is provided at the upper end of the first rotating shaft 81. The hub member 90 includes a top wall portion 90a positioned horizontally on the upper end of the first rotating shaft 81, and a peripheral wall portion 90b hanging from the outer periphery of the top wall portion 90a, and is provided in a shape that opens downward. Yes.

  The second rotating shaft 82 is formed in a cylindrical shape that is disposed so as to surround the first rotating shaft 81. The second rotating shaft 82 passes through the through hole 91 a of the horizontal partition wall 91, and is rotatably supported by the partition wall 91 via a bearing portion 92. A flange portion 82a is formed on the second rotating shaft 82 above the through hole 91a, and the through hole 91a is covered from above by the flange portion 82a. The outer periphery of the flange portion 82a is bent downward. On the upper surface of the flange portion 82a, brackets 93 are disposed with a phase angle of 180 degrees so as to protrude outward. The upper end portion of the second rotary shaft 82 is inserted into the hub member 90 from below, and is provided in non-contact with the lower surface of the top wall portion 90a.

  The rotation means 83 includes a motor 831 provided in the vicinity of the second rotation shaft 82, a drive gear 832 attached to the drive shaft of the motor 831, and a drive gear provided on the outer periphery of the lower end of the second rotation shaft 82. 832 and a driven gear 833 that meshes with 832. In the rotating means 83, the second rotating shaft 82 is rotated via the drive gear 832 and the driven gear 833 by driving the motor 831.

  The rotating means 83 includes a pin 834 that protrudes radially outward on the upper end side of the second rotating shaft 82, and a long hole 835 that is formed in the peripheral wall portion 90 b of the hub member 90 and receives the pin 834. Yes. The long hole 835 extends in the vertical direction, and allows the internal pin 834 to move in the vertical direction. The width dimension of the long hole 835 is set slightly larger than the width of the pin 834, and restricts the relative rotation in the circumferential direction between the second rotating shaft 82 provided with the pin 834 and the peripheral wall portion 90b. Therefore, when the second rotation shaft 82 rotates, the hub member 90 and the first rotation shaft 81 are rotated via the pin 834 and the long hole 835, and the first rotation shaft 81 and the second rotation shaft 82 are rotated. Rotate together.

  The first cleaning unit 85 is disposed at the upper end of the second rotating shaft 82 and is supported via a bracket 93. The first cleaning unit 85 includes a grinding member 851 and a brush 852. The grinding member 851 and the brush 852 are respectively supported by the bracket 93 from below and can be driven to rotate by the rotation of the second rotation shaft 82. The grinding member 851 and the brush 852 extend in the radial direction from the vicinity of the rotation center of the second rotation shaft 82 and are arranged in the same straight line. The grinding member 851 and the brush 852 are arranged so that the height positions of the upper surfaces are roughly aligned. The grinding member 851 is formed in a rectangular parallelepiped shape from a ceramic material, an oil stone, or the like, and a plurality of grooves serving as escape paths for grinding waste are formed on the upper surface. An elastic body 95 made of a leaf spring is provided between the lower portion of the grinding member 851 and the brush 852 and the bracket 93, and absorption and buffer action are exhibited by deformation of the elastic body 95.

  The second cleaning unit 86 is disposed on the hub member 90 at the upper end portion of the first rotating shaft 81 where the first cleaning unit 85 is not disposed, and is driven to rotate by the rotation of the first rotating shaft 81. It is possible. As shown in FIG. 2, the second cleaning unit 86 includes a sponge 862 formed in a rectangular parallelepiped shape on the substrate 861, and between the grinding member 851 and the brush 852, in other words, the first rotating shaft 81. The grinding member 851 and the brush 852 are arranged so as to pass through the rotation center. Accordingly, the second cleaning unit 86 is disposed so as to extend in the radial direction of the first rotating shaft 81.

  Two nozzles 87 are provided along the sponge 862 of the second cleaning unit 86, and are supported on the base side on the hub member 90 at the upper end of the first rotating shaft 81. Accordingly, the two nozzles 87 are also provided so as to extend in the radial direction of the first rotating shaft 81. The nozzle 87 includes a plurality of jet outlets 871 that open upward, and jets cleaning water upward from the jet outlet. Such cleaning water is supplied to each nozzle 87 from a cleaning water supply source 98 through a flow path 97 (not shown in FIG. 2) formed in the hub member 90, the first rotating shaft 81, and the switching means 88.

  The switching means 88 includes an elevating cylinder 882 that is an air cylinder that displaces the elevating body 881 in the vertical direction, and a rotary joint 883 that supports the first rotary shaft 81 so as to be relatively rotatable. The switching means 88 moves the first rotating shaft 81 forward and backward in the axial direction (vertical direction) by the vertical movement of the lifting body 881 by the lifting cylinder 882. By this advance and retreat, the height position of the second cleaning unit 86 disposed at the upper end of the first rotating shaft 81 can be switched. 3, the upper end of the second cleaning unit 86 is lower than the upper end of the first cleaning unit 85, and the upper end of the second cleaning unit 86 is the first cleaning unit at the position illustrated in FIG. 4. It is higher than the upper end of the part 85, and these positions can be switched. The rotary joint 883 includes a supply port 883a for connection to the cleaning water supply source 98, and ensures a flow toward the nozzle 87 for the cleaning water supplied from the supply port 883a regardless of the presence or absence of the first rotating shaft 81. Configuration is adopted.

  Next, a method for cleaning the suction surface 38b of the transport pad 38 by the cleaning means 80 will be described with reference to FIG.

  In cleaning the suction surface 38 b of the transport pad 38, first, the transport pad 38 is positioned directly above the cleaning unit 80 with the wafer W not held. Next, the motor 831 of the rotating unit 83 is operated to rotate the second rotating shaft 82, and the lifting cylinder 882 of the switching unit 88 is operated, so that the relative relationship between the second cleaning unit 86 and the first cleaning unit 85 is increased. The position is positioned at the position shown in FIG. In the position shown in FIG. 3, the upper surface of the first cleaning unit 85 is higher than the upper surface of the second cleaning unit 86, and the transport pad 38 is lowered while maintaining this position, and the first cleaning unit 85 is ground. The member 851 and the brush 852 are brought into contact with the suction surface 38b. At this time, the cleaning water is supplied from the cleaning water supply source 98 to the nozzles 87 and 87, and the cleaning water is ejected from the ejection port 871 toward the transport pad 38. In addition, when the 1st washing | cleaning part 85 becomes a washing | cleaning position, the 2nd washing | cleaning part 86 will be in a stand-by position lower than the 1st washing | cleaning part 85, and the sponge 861 and the conveyance pad 38 of the 2nd washing | cleaning part 86 are not. Contact.

  The grinding member 851 and the brush 852 of the first cleaning unit 85 attached to the second rotating shaft 82 are rotated by the rotation of the second rotating shaft 82. By this rotation, the deposit adhered to the suction surface 38b by the grinding member 851 is ground together with the porous plate 38a, and the deposit is removed from the suction surface 38b by rubbing with the brush 852. As a result, the grinding member 851 and the brush 852 remove and clean the deposits such as grinding scraps adhered to the suction surface 38b of the transport pad 38.

  During the cleaning, the grinding member 851 and the brush 852 are supported from below through the elastic body 95, so that the impact when the grinding member 851 and the brush 852 come into contact with the suction surface 38b can be reduced. Even if the suction surface 38b is inclined with respect to the grinding member 851 and the brush 852, the elastic body 95 is deformed in accordance with the inclination, and these can be corrected to a parallel positional relationship.

  Next, a cleaning method by the cleaning means 80 of the held surface held by the chuck table 42 of the wafer W held by the transport pad 38, that is, the lower surface (front surface) of the protective tape T attached to the wafer W will be described with reference to FIG. Will be described with reference to FIG.

  In cleaning the lower surface of the protective tape T, first, the transport pad 38 is positioned directly above the cleaning means 80 in a state where the wafer W is sucked and held by the suction surface 38 b of the transport pad 38. Next, the motor 831 of the rotating unit 83 is operated to rotate the first rotating shaft 81 together with the second rotating shaft 82, and the lift cylinder 882 of the switching unit 88 is operated to operate the second cleaning unit 86 and the first cleaning unit 86. The relative position with respect to the cleaning section 85 is positioned at the position shown in FIG. In the position shown in FIG. 4, the upper surface of the second cleaning unit 86 is higher than the upper surface of the first cleaning unit 85, and the transport pad 38 is lowered while maintaining this position, and the sponge of the second cleaning unit 86. 862 is brought into contact with the lower surface of the protective tape T. At this time, the cleaning water is supplied from the cleaning water supply source 98 to the nozzles 87 and 87, and the cleaning water is ejected from the ejection port 871 toward the lower surface of the protective tape T. In addition, when the 2nd washing | cleaning part 86 becomes a washing | cleaning position, the 1st washing | cleaning part 85 will be in a stand-by position lower than the 2nd washing | cleaning part 86, and the grinding member 851 of the 1st washing | cleaning part 85, the brush 852, and a protective tape T is not in contact.

  By the rotation of the first rotation shaft 81, the sponge 862 of the second cleaning unit 86 attached to the first rotation shaft 81 rotates. By this rotation, the adhering matter adhering to the lower surface of the protective tape T is removed by the sponge 862, and the lower surface of the protective tape T is cleaned.

  As described above, according to the above-described embodiment, the suction surface 38b of the transport pad 38 and the transport pad 38 are held by switching the first cleaning unit 85 and the second cleaning unit 86 with the switching unit 88. Both the protective tape T of the wafer W can be cleaned. That is, they can be cleaned by the single cleaning means 80, and space saving can be achieved as compared with the case where the cleaning mechanisms are arranged side by side, and as a result, the entire grinding apparatus 1 can be downsized. In the cleaning of the suction surface 38b, the adhering material on the suction surface 38b is removed by scraping the porous surface by grinding the suction surface 38b while removing the adhered material on the suction surface 38b. It is possible to improve the reliability of cleaning the suction surface 38b.

  In addition, the arrangement | positioning position of the grinding member 851, the brush 852, and the sponge 862 in the said embodiment can be variously changed as long as both the adsorption | suction surface 38b and the protective tape T of the wafer W can be wash | cleaned. For example, as shown in FIG. 5, in the first cleaning unit 85, two grinding members 851 and two brushes 852 each in the above embodiment may be provided. In the configuration of FIG. 5, both the grinding member 851 and the brush 852 are disposed with a phase angle of 180 degrees so as to protrude outward from the rotation center of the second rotation shaft 82.

  In addition, as shown in FIG. 6, two sponges 862 of the second cleaning unit 86 are arranged so as to protrude outward from the rotation center of the first rotation shaft 81 with a phase angle of 180 degrees. May be. In this case, the ends of the grinding member 851, the brush 852, and the sponge 862 on the respective rotation shafts 81 and 82 side are tapered in a plan view, and the sharp ends are formed on the centers on the respective rotation shafts 81 and 82 side. It ’s best to get as close to the position as possible. Thereby, it can wash | clean with all of the grinding member 851, the brush 852, and sponge 862 in the center vicinity of each rotating shaft 81 and 82 side, and can improve the reliability of washing | cleaning.

  In addition, the installation positions of the first cleaning unit 85 and the second cleaning unit may be changed. The first cleaning unit 85 is provided at the upper end of the first rotating shaft 81, and the second rotating shaft 82 You may provide the 2nd washing | cleaning part 86 in an upper end part.

  In the above embodiment, the first rotating shaft 81 is moved back and forth in the axial direction by the switching means 88 to switch the height positions of the cleaning units 85 and 86. However, the second rotating shaft 82 is moved in the axial direction. You may make it advance / retreat or both the rotating shafts 81 and 82 advance / retreat.

  Moreover, although each embodiment of the present invention has been described, as the other embodiment of the present invention, the above embodiment and modifications may be combined in whole or in part.

  The embodiments of the present invention are not limited to the above-described embodiments and modifications, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological advancement or another derived technique, the method may be used. Accordingly, the claims cover all embodiments that can be included within the scope of the technical idea of the present invention.

  As described above, the present invention has an effect that the suction surface of the transport pad can be cleaned better and can be reduced in size, and is useful when switching between two cleaning units for cleaning.

DESCRIPTION OF SYMBOLS 1 Grinding device 36 Unloading means 38 Conveying pad 38b Adsorption surface 42 Chuck table 46 Rough grinding means (grinding means)
50 Coarse grinding wheel (grinding wheel)
51 Finish grinding means (grinding means)
55 Finish grinding wheel (grinding wheel)
80 cleaning means 81 first rotating shaft 82 second rotating shaft 83 rotating means 85 first cleaning section 851 grinding member 852 brush 86 second cleaning section 862 sponge 87 nozzle 88 switching means T protective tape W wafer

Claims (1)

A chuck table for sucking and holding the wafer, a grinding means for grinding the wafer sucked and held by the chuck table with a grinding wheel, and an adsorption for sucking and holding the surface to be ground of the wafer held by the chuck table and ground by the grinding means. An unloading means for unloading the wafer from the chuck table with a transfer pad having a surface; a held surface of the wafer which is disposed in the unloading path of the transfer pad and sucked and held by the chuck table; and the transfer pad A grinding device comprising a cleaning means for cleaning the suction surface,
The cleaning means includes a first rotating shaft extending in a direction perpendicular to the suction surface of the transport pad, a second rotating shaft disposed so as to surround the first rotating shaft, Rotating means for rotating both the first rotating shaft and the second rotating shaft, and extending radially in the upper end portion of either the first rotating shaft or the second rotating shaft. A first cleaning unit that cleans the suction surface, and the upper end of either the first rotating shaft or the second rotating shaft that is not provided with the first cleaning unit. A second cleaning section which is arranged to extend in the radial direction so as to intersect with the first cleaning section, and which cleans the held surface held by the chuck table of the wafer held by the transport pad; Either one of the rotating shaft 1 or the second rotating shaft is moved forward and backward in the axial direction, and a cleaning position higher than the upper surface of the other cleaning unit and a retracted position lower than the upper surface of the other cleaning unit Comprising a switching means for switching to a nozzle for ejecting the rotating shaft upper portion extends being disposed radially conveying the wash water toward the pad, and
The first cleaning unit includes a grinding member that grinds the deposit attached to the suction surface, and a brush that removes the deposit from the suction surface.
The second cleaning unit is composed of a sponge that is a member in contact with the held surface of the wafer.
A grinding apparatus for cleaning the suction surface of the transport pad and the held surface of the wafer by switching the first cleaning unit and the second cleaning unit by the switching means.

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