JP2017001164A - Polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device enhanced in cleaning workability.SOLUTION: A polishing device includes: cover means (52) which covers a chuck table (20) and polishing means (32) and prevents scattering of powder dust generated in polishing; suction means which includes an exhaust duct (64) connected to an exhaust port (62) provided in the cover means from the outside of the cover means and a suction source (66) connected to the exhaust port via the exhaust duct, sucks air containing powder dust in the cover means during the polishing and discharges the air to the outside of the cover means; and a suction cleaning unit (70) which is detachably connected to the suction means and removes powder dust deposited in the cover means while the polishing is stopped. The suction cleaning unit includes: a flexible hose (72); a connection section (74) which is provided at one end of the flexible hose and is detachably connected to the exhaust port from the inside of the cover means; and a suction section (76) which is provided at the other end of the flexible hose and has an opening (76a) smaller than the exhaust port.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a polishing apparatus for dry polishing a plate-like workpiece.

  In order to manufacture small and light device chips, there are increasing opportunities to process a wafer made of a semiconductor material such as silicon to a thickness of 100 μm or less. For example, a wafer can be ground and thinned by rotating a disk-shaped grinding wheel to which a grinding wheel is fixed and bringing it into contact with the work surface of the wafer.

  By the way, when the wafer is thinned by grinding as described above, grinding distortion and microcracks are formed on the work surface, and the bending strength of the device chip is lowered. Therefore, after grinding the wafer, the work surface is polished to remove grinding distortion and microcracks, thereby increasing the bending strength of the device chip.

  In addition to wet polishing using a polishing liquid such as slurry, dry polishing without using a polishing liquid may be employed for polishing the wafer. In dry polishing, generated dust is likely to be scattered, and therefore a polishing apparatus in which a chuck table, a polishing unit, and the like for holding a wafer are covered with a cover is used (see, for example, Patent Document 1).

JP 2004-1118 A

  The above-described cover is connected to a suction source through, for example, an exhaust duct, and most of the dust generated by polishing is discharged together with air to the outside of the cover. However, this polishing apparatus cannot completely discharge all the generated dust, and the remaining dust gradually accumulates inside the cover.

  Therefore, it is necessary to periodically clean the inside of the cover. However, with this polishing apparatus, the workability of the cleaning performed by the operator's manual work is not necessarily good. The present invention has been made in view of such problems, and an object of the present invention is to provide a polishing apparatus with improved cleaning workability.

  According to the present invention, there is provided a polishing apparatus comprising: a chuck table for holding a workpiece; and a polishing means having a polishing pad for dry polishing the workpiece held on the chuck table, the chuck table and Cover means for covering the polishing means and preventing scattering of dust generated in the polishing process, an exhaust duct connected from the outside of the cover means to an exhaust port provided in the cover means, and the exhaust port through the exhaust duct A suction source that is connected to the suction means, sucks air containing dust inside the cover means during polishing, and discharges the air to the outside of the cover means, and is detachably connected to the suction means A suction cleaning unit that removes dust accumulated inside the cover means when the polishing process is stopped, and the suction cleaning unit includes a flexible hose and one of the flexible hoses. A connecting portion that is detachably connected to the exhaust port from the inside of the cover means, and a suction portion that is provided at the other end of the flexible hose and has an opening smaller than the exhaust port. A featured polishing apparatus is provided.

  A polishing apparatus according to the present invention includes a flexible hose, a connection portion provided at one end of the flexible hose and detachably connected to the exhaust port from the inside of the cover means, and a suction portion provided at the other end of the flexible hose. , The inside of the cover means can be cleaned without using an external cleaner or the like.

  Further, in the polishing apparatus according to the present invention, since an opening smaller than the exhaust port is provided in the suction portion of the suction cleaning unit, a strong suction force can be obtained by increasing the air flow rate in the vicinity of the opening. Therefore, the dust accumulated inside the cover means can be removed strongly. Thus, according to the present invention, it is possible to provide a polishing apparatus with improved cleaning workability.

It is a perspective view which shows the structural example of a grinding | polishing apparatus typically. It is sectional drawing which shows the structure etc. of a cover typically. It is a perspective view which shows typically a mode that a suction cleaning unit is mounted | worn with an exhaust pipe from the inside of a cover. It is a perspective view which shows typically a mode that the inside of a cover is cleaned with a suction cleaning unit. It is a perspective view which shows typically the structural example of the suction cleaning unit which concerns on a modification.

  Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a configuration example of a polishing apparatus according to the present embodiment. As shown in FIG. 1, the polishing apparatus 2 according to this embodiment includes a rectangular parallelepiped base 4 on which each component is mounted. A wall-like support structure 6 that extends upward is provided at the rear end of the base 4.

  An opening 4 a is formed on the front side of the upper surface of the base 4, and a transport unit 8 for transporting the plate-shaped workpiece 11 is provided in the opening 4 a. The workpiece 11 is, for example, a disk-shaped semiconductor wafer, a resin substrate, a ceramic substrate, or the like. However, another substrate may be used as the workpiece 11.

  Cassettes 10a and 10b for accommodating the workpiece 11 are placed in a region on the side of the opening 4a. An alignment mechanism 12 is provided behind the area where the cassette 10a is placed. The alignment mechanism 12 adjusts the center position of the workpiece 11 conveyed by the conveyance unit 8 from the cassette 10a, for example.

  A carry-in unit 14 that holds and holds the workpiece 11 is provided behind the alignment mechanism 12. An opening 4 b is formed behind the carry-in unit 14. In this opening 4b, an X-axis moving table 16, an X-axis moving unit (not shown) for moving the X-axis moving table 16 in the X-axis direction (front-rear direction), and a dustproof and drip-proof cover 18 that covers the X-axis moving unit. Is arranged.

  The X-axis movement unit includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and an X-axis movement table 16 is slidably attached to the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 16, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut portion.

  An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 16 moves in the X-axis direction along the X-axis guide rail. A chuck table 20 for sucking and holding the workpiece 11 is provided on the upper surface of the X-axis moving table 16.

  The chuck table 20 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction). Further, the chuck table 20 is moved between a front loading / unloading area where the workpiece 11 is loaded and unloaded and a rear polishing area where the workpiece 11 is polished by the X-axis moving unit. .

  The upper surface of the chuck table 20 is a holding surface that sucks and holds the workpiece 11. This holding surface is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 20. The workpiece 11 carried into the chuck table 20 by the carry-in unit 14 is sucked and held by the negative pressure of the suction source acting on the holding surface.

  A Z-axis moving unit 22 is provided on the front surface of the support structure 6. The Z-axis moving unit 22 includes a pair of Z-axis guide rails 24 parallel to the Z-axis direction, and a Z-axis moving plate 26 is slidably attached to the Z-axis guide rails 24. A nut portion (not shown) is provided on the rear surface side (back surface side) of the Z-axis moving plate 26, and a Z-axis ball screw 28 parallel to the Z-axis guide rail 24 is screwed into the nut portion. Yes.

  A Z-axis pulse motor 30 is connected to one end of the Z-axis ball screw 28. By rotating the Z-axis ball screw 28 by the Z-axis pulse motor 30, the Z-axis moving plate 26 moves in the Z-axis direction along the Z-axis guide rail 24.

  On the front surface (surface) of the Z-axis moving plate 26, a polishing unit (polishing means) 32 for polishing the workpiece 11 is provided. The polishing unit 32 includes a cylindrical spindle housing 34 fixed to the Z-axis moving plate 26. A spindle 36 serving as a rotation shaft is accommodated in the spindle housing 34.

  A disc-shaped mount 38 is fixed to the lower end portion of the spindle 36 exposed from the spindle housing 34, and a polishing pad 40 having substantially the same diameter as the mount 38 is attached to the lower surface of the mount 38. In the polishing apparatus 2 according to the present embodiment, a polishing pad 40 for dry polishing that does not use a polishing liquid such as slurry is used.

  A rotary drive source (not shown) such as a motor is connected to the upper end side of the spindle 36, and the polishing pad 40 rotates with a rotational force transmitted from the rotary drive source. The polishing pad 40 is pressed against the upper surface (surface to be polished) of the workpiece 11 held on the chuck table 20 by the Z-axis moving unit 22 described above.

  At a position adjacent to the carry-in unit 14, a carry-out unit 42 that holds and turns the workpiece 11 is provided. A cleaning unit 44 for cleaning the workpiece 11 after polishing is disposed in front of the carry-out unit 42 and behind the area where the cassette 10b is placed.

  The workpiece 11 cleaned by the cleaning unit 44 is transported by the transport unit 8 and is accommodated in, for example, the cassette 10b. An operation panel 46 for inputting polishing conditions and the like is installed in front of the opening 4a.

  When the workpiece 11 is polished by the polishing apparatus 2, the chuck table 20 and the polishing pad 40 are rotated with each other while the workpiece 11 is sucked and held by the chuck table 20. The polishing pad 40 is pressed against the upper surface of the object 11. Thereby, the workpiece 11 can be polished (dry polishing). In the polishing apparatus 2 according to this embodiment, a polishing liquid such as slurry is not used.

  As described above, when the workpiece 11 is polished (dry polishing) with the polishing pad 40, dust is likely to be scattered around the chuck table 20 and the polishing pad 40. Therefore, a cover (cover means) 52 that covers the chuck table 20 and the polishing unit 32 (polishing pad 40) is provided in the polishing region of the polishing apparatus 2 according to the present embodiment.

  FIG. 2 is a cross-sectional view schematically showing the structure of the cover 52 and the like. As shown in FIG. 2, the cover 52 includes a main body 54 that covers the polishing region and a lid 56 that closes an opening 54 a formed in the upper portion of the main body 54. The lid 56 is connected to the main body 54 via a hinge 60 and rotates with respect to the main body 54 within a predetermined angle range.

  A cylindrical exhaust pipe (exhaust port) 62 that penetrates the main body 54 inward and outward is provided on the side of the main body 54. One end of an exhaust duct (suction means) 64 is connected to the exhaust pipe 62 from the outside of the cover 52. On the other hand, a suction source (suction means) 66 (FIG. 1) is connected to the other end of the exhaust duct 64. That is, the suction source 66 is connected to the portion of the exhaust pipe 62 outside the cover 52 via the exhaust duct 64.

  The suction source 66 has a control switch 68 that controls generation of suction force. By operating this control switch 68, the suction force generated by the suction source 66 can be applied to the exhaust pipe 62. During polishing of the workpiece 11, for example, a portion inside the cover 52 of the exhaust pipe 62 is exposed inside the cover 52. If the suction force of the suction source 66 is applied in this state, air containing dust inside the cover 52 can be sucked by the exhaust duct 64 and the suction source 66 and discharged to the outside of the cover 52.

  On the other hand, when the polishing process is stopped, the suction cleaning unit 70 can be attached to a portion inside the cover 52 of the exhaust pipe 62. FIG. 3 is a perspective view schematically showing how the suction cleaning unit 70 is attached to the exhaust pipe 62. In FIG. 3, for convenience of explanation, some or all of the constituent elements constituting the cover 52 are omitted.

  As shown in FIG.2 and FIG.3, the suction cleaning unit 70 has the flexible hose 72 formed with materials, such as resin. One end of the flexible hose 72 is provided with a connection member (connection portion) 74 connected to the exhaust pipe 62 from the inside of the cover 52 (main body 54). The connecting member 74 is configured to be detachable with respect to a portion inside the cover 52 of the exhaust pipe 62.

  A cylindrical suction member (suction part) 76 is fixed to the other end of the flexible hose 72. An elliptical opening 76 a smaller than the inner diameter of the exhaust pipe 62 is provided on the distal end surface of the suction member 76. The opening 76 a functions as a suction port for sucking foreign matter such as dust accumulated in the cover 52.

  When the suction cleaning unit 70 is attached to the exhaust pipe 62, the cover 56 of the cover 52 is opened, and the connection member 74 of the suction cleaning unit 70 is connected to the exhaust pipe 62 from the inside of the cover 52. By operating the suction source 66 in this state, a suction force for sucking foreign matters such as dust can be applied to the opening 76a.

  As described above, the opening 76 a is formed smaller than the inner diameter of the exhaust pipe 62. More specifically, the area (cross-sectional area) of the opening 76 a is smaller than the area (cross-sectional area) of the exhaust pipe 62. Therefore, for example, compared with the case where an opening having the same size as the inner diameter of the exhaust pipe 62 is provided, a strong suction force can be obtained by increasing the air flow rate near the opening 76a. Therefore, foreign matters such as dust accumulated inside the cover 52 can be strongly removed.

  Moreover, since the opening 76a is formed in an elliptical shape, a larger foreign object can be sucked compared to the case where a perfect circular opening is provided. Thus, in the suction cleaning unit 70 according to the present embodiment, by providing the elliptical opening 76a smaller than the inner diameter of the exhaust pipe 62, both the suction force and the size of the foreign matter that can be sucked are made compatible.

  FIG. 4 is a perspective view schematically showing how the inside of the cover 52 is cleaned by the suction cleaning unit 70. As shown in FIG. 4, the inside of the cover 52 can be cleaned by sucking foreign matter 78 such as dust accumulated on the X-axis moving table 16 and the chuck table 20 with the suction cleaning unit 70. In this cleaning, the accumulated foreign matter 78 may be removed using a scraper, a brush, or the like.

  As described above, the polishing apparatus 2 according to this embodiment is provided at one end of the flexible hose 72 and the flexible hose 72 and is detachably connected to the exhaust pipe (exhaust port) 62 from the inside of the cover (cover means) 52. Provided with a suction cleaning unit 70 having a connecting member (connecting portion) 74 to be connected and a suction member (suction portion) 76 provided at the other end of the flexible hose 72, so that a cover can be provided without using an external cleaner or the like. The inside of 52 can be cleaned.

  Further, in the polishing apparatus 2 according to this embodiment, since the opening 76a smaller than the inner diameter of the exhaust pipe 62 is provided in the suction member 76 of the suction cleaning unit 70, the air flow velocity is increased in the vicinity of the opening 76a to increase the suction force. Can be obtained. Therefore, the foreign matter 78 such as dust accumulated inside the cover 52 can be strongly removed. Thus, according to the present embodiment, it is possible to provide the polishing apparatus 2 with improved cleaning workability.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, the cylindrical suction member (suction part) 76 is fixed to the other end of the flexible hose 72 constituting the suction cleaning unit 70, but the shape, structure, etc. of this suction member can be arbitrarily set. Can be changed.

  FIG. 5 is a perspective view schematically showing a configuration example of a suction cleaning unit according to a modification. As shown in FIG. 5, the suction cleaning unit 80 according to the modification has a flexible hose 82 formed of a material such as resin. One end of the flexible hose 82 is provided with a connecting member (connecting portion) 84 connected to the exhaust pipe 62 from the inside of the cover 52 (main body 54).

  At the other end of the flexible hose 82, a suction member (suction part) 86 configured to be extendable and retractable is fixed. The expandable member 86 includes a cylindrical first member 88, a cylindrical second member 90 inserted into the first member 88, and a cylindrical third member 92 inserted into the second member 90. Has been.

  The other end of the flexible hose 82 is connected to the proximal end side of the first member 88. On the other hand, an elliptical opening 92 a smaller than the inner diameter of the exhaust pipe 62 is provided on the tip surface of the third member 92. The opening 92 a functions as a suction port for sucking foreign matter such as dust accumulated in the cover 52.

  By using a suction member (suction unit) 86 configured to be extendable and contractable like the suction cleaning unit 80 according to the modification, foreign matter 78 such as dust accumulated on a portion that is difficult for an operator to reach can be easily removed. .

  Further, a cleaning tool such as a scraper or a brush may be used as the suction member. In this case, for example, the proximal end side of the cleaning tool is connected to the other end of the flexible hose, and an opening that functions as a suction port is provided in an arbitrary portion (for example, the distal end side) of the cleaning tool. Thereby, foreign matter 78, such as dust, can be attracted | sucked, cleaning with a suction member (cleaning tool). Further, since it is not necessary to use a separate cleaning tool such as a scraper or a brush, the cleaning workability is further enhanced.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

DESCRIPTION OF SYMBOLS 2 Polishing apparatus 4 Base 4a, 4b Opening 6 Support structure 8 Transport unit 10a, 10b Cassette 12 Alignment mechanism 14 Carry-in unit 16 X-axis moving table 18 Dust-proof drip-proof cover 20 Chuck table 22 Z-axis moving unit 24 Z-axis guide rail 26 Z-axis moving plate 28 Z-axis ball screw 30 Z-axis pulse motor 32 Polishing unit (polishing means)
34 Spindle housing 36 Spindle 38 Mount 40 Polishing pad 42 Unloading unit 44 Cleaning unit 46 Operation panel 52 Cover (cover means)
54 Body 54a Opening 56 Lid 60 Hinge 62 Exhaust pipe (exhaust port)
64 Exhaust duct (suction means)
66 Suction source (suction means)
68 Control switch 70 Suction cleaning unit 72 Flexible hose 74 Connection member (connection part)
76 Suction member (suction part)
76a Opening 80 Suction cleaning unit 82 Flexible hose 84 Connection member (connection part)
86 Suction member (suction part)
88 1st member 90 2nd member 92 3rd member 92a Opening 11 Workpiece

Claims (1)

A polishing apparatus comprising: a chuck table for holding a workpiece; and a polishing means having a polishing pad for dry polishing the workpiece held on the chuck table,
Cover means for covering the chuck table and the polishing means and preventing scattering of dust generated in the polishing process;
The exhaust port provided in the cover means has an exhaust duct connected from the outside of the cover means and a suction source connected to the exhaust port via the exhaust duct, and dust inside the cover means during polishing processing Suction means for sucking air containing air and discharging it to the outside of the cover means;
A suction cleaning unit that is detachably connected to the suction means and removes dust accumulated inside the cover means when the polishing process is stopped,
The suction cleaning unit comprises:
A flexible hose,
A connecting portion provided at one end of the flexible hose and detachably connected to the exhaust port from the inside of the cover means;
And a suction part provided at the other end of the flexible hose and having an opening smaller than the exhaust port.

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