WO2008004365A1

WO2008004365A1 - Dicing apparatus and dicing method

Info

Publication number: WO2008004365A1
Application number: PCT/JP2007/057900
Authority: WO
Inventors: Tsutomu Nakajima
Original assignee: Tokyo Seimitsu Co., Ltd.
Priority date: 2006-07-07
Filing date: 2007-04-10
Publication date: 2008-01-10

Abstract

A dicing apparatus and a dicing method ensuring high quality dicing by efficiently removing contamination generated during dicing, thereby eliminating readhesion to a work. Since a vacuum unit (12) opposing the rotational direction of a blade (10) and provided with a suction port toward a machining point is provided in the vicinity of the machining point, cutting fluid scattering toward the rotational direction is discharged forcibly to the outside of the apparatus, resulting in high quality dicing where the contamination does not readhere to the work W.

Description

Specification

Dicing apparatus and dicing method

Technical field

TECHNICAL FIELD [0001] The present invention relates to a dicing apparatus and a dicing method for dividing a work such as a wafer on which a semiconductor device or an electronic component is formed into individual chips.

Background art

A dicing apparatus that performs cutting and grooving processing on a workpiece such as a wafer on which a semiconductor device or an electronic component is formed includes at least a blade that is rotated at high speed by a spindle, a work table that holds the work, X, Υ, Ζ, and Θ movement axes that change the relative position of the worktable and blade are provided. When cleaning the workpiece, the cutting fluid for cooling and lubrication is supplied from the nozzle to the rotating blade or the processing point where the workpiece and the blade are in contact with each other. Is applied to the workpiece. In this processing, contaminants such as grinding scraps (referred to as contamination or contamination) are generated from the workpiece, and contamination remaining on the workpiece becomes a major problem of degrading the quality of semiconductor devices and electronic components.

[0003] Normally, a dicing apparatus is provided with various cleaning liquid jet nozzles or cleaning apparatuses in order to remove contamination adhered to a workpiece. However, a part of the generated contamination is scattered with the cutting fluid by the rotation of the blade and becomes a mist and floats in the device, or the cutting fluid containing contamination moves with the blade and comes into contact with the workpiece again. It was a cause of contamination of the cake.

[0004] In response to such problems, exhaust dust that efficiently exhausts atomized contaminants by increasing the suction power by sending used high-pressure air to the exhaust duct that removes atomized contaminants. (For example, refer to Patent Document 1.) ο Patent Document 1: Japanese Patent Laid-Open No. 10-308366

Disclosure of the invention

Problems to be solved by the invention

[0005] However, in the dicing apparatus described in Patent Document 1, the suction port of the exhaust duct has a dicing mechanism. The front blades of the machining unit where dicing is performed as viewed from the front side of the dicing machine. The blades rotate even if the suction force is increased and the amount of mist-like contaminants is increased. It was difficult to suck the cutting fluid containing contaminants scattered from the surface. For this reason, there was a problem that contamination that hit the wall or the like and did not form a mist and bounced directly attached to the work and contaminated the work again.

[0006] In addition, mist-like contaminants that are not in the vicinity of the suction port take time to be sucked, and there is a problem that they fall on the workpiece before suction and contaminate the workpiece again. In addition, since the blades rotate at high speed, there is a problem that the cutting fluid containing contaminants scattered in the direction of rotation that spatters in the direction of rotation rotates with the blades and strikes the blades again and contaminates the workpiece.

[0007] The present invention has been made for such a problem. A dicing apparatus and a dicing apparatus that efficiently removes contamination generated during dicing and performs high-quality dicing that does not reattach to the workpiece. Speak for the purpose of providing a method.

Means for solving the problem

In order to achieve the above object, the first aspect of the present invention includes a disk-shaped blade, a spindle for rotating the blade, a cover provided on the spindle and covering the blade, A work table for holding a work to be cut by a blade, a moving shaft for relatively moving the work table and the blade, and a nozzle for injecting a cutting fluid near a working point where the work and the blade are in contact with each other And a suction means provided in the vicinity of the processing point. The suction port is opposed to the rotation direction of the blade and opens toward the processing point.

According to the first aspect of the present invention, a workpiece such as a wafer on which a semiconductor device or an electronic component held on a work table is formed and a blade that rotates at high speed by a spindle are connected to X, X, Ζ, Θ. These are moved relative to each other, and the cutting or grooving process is performed while supplying the cutting fluid through the nozzle. At this time, the blade is covered with a cover provided on the wheel cover, and a suction means is provided in the vicinity of the machining point where the workpiece and the blade are in contact with each other, facing the rotation direction of the blade and having a suction port toward the machining point. Is provided. [0010] Thereby, the cutting fluid containing contaminants scattered in the rotation direction by the blade is removed.

Then, it flies with force toward the suction port of the suction means and is forcibly discharged out of the apparatus by the suction means. Therefore, there is no contamination scattered in the device, and high-quality dicing can be performed without reattachment of the contamination to the workpiece.

[0011] In a second aspect of the present invention, in the first aspect of the present invention, the dicing apparatus includes a plate-shaped shielding plate in which a slit wider than the thickness of the blade is formed. The blade is provided so that it can pass through.

[0012] According to the second aspect of the present invention, in the dicing apparatus, a slit slightly wider than the thickness of the blade is formed near the front side in the rotational direction of the blade from the additional point where the workpiece and the blade are in contact with each other. The shield plate is provided so that the blade passes through the slit.

[0013] Thereby, it becomes possible to remove the cutting fluid including contamination that rotates together with the blade from the blade before coming into contact with the workpiece again, thereby preventing contamination from adhering to the workpiece.

[0014] A third aspect of the present invention is characterized in that, in the first or second aspect of the present invention, the suction means is an ejector that generates a suction force by flowing compressed air. Yes.

[0015] According to the third aspect of the present invention, as suction means, compressed air is introduced from one port and discharged from the other port, thereby generating a negative pressure in the remaining other port. Install the ejector that sucks the fluid.

[0016] Thereby, it becomes possible to suck the cutting fluid containing contaminants from the suction port only by flowing in the compressed air normally used in the dicing machine, and a new large vacuum generating device, a fan, etc. are provided. There is no need.

[0017] In a fourth aspect of the present invention, the cover according to any one of the first, second, or third aspects of the present invention, wherein the cover includes the blades obliquely upward with respect to the workpiece. There is provided a nozzle for ejecting a fluid in which a liquid in which the workpiece is washed in the rotation direction and a gas are mixed.

[0018] According to the fourth aspect of the present invention, the two-fluid injection nozzle that injects a liquid at a high pressure by mixing a gas such as compressed air with a liquid such as pure water used for cleaning a workpiece or the like. Is provided. During machining of the workpiece, the workpiece moves from diagonally above the workpiece. The cleaning liquid is sprayed in a wide range by force in the direction of rotation of the card.

[0019] Thereby, the cutting fluid containing the contamination on the workpiece flows to the suction port side, and the cutting fluid remaining on the workpiece without being sucked is also removed from the workpiece to prevent the contamination from adhering to the workpiece. .

[0020] According to a fifth aspect of the present invention, in any one of the first, second, third, and fourth aspects of the present invention, the cover includes a surface on which the cover is attached to the spindle. A plate is provided in parallel with the blade on the opposite surface.

[0021] According to the fifth aspect, the cutting fluid containing contamination wound up by the rotation of the blade stays on the workpiece near the contact point between the blade being worked and the workpiece without splashing around the cover force. .

[0022] Thereby, the cutting water containing the contamination stays in the vicinity of the cutting point without being scattered around the cover force, so that it becomes easy to be sucked into the suction port and is removed by the two-fluid jet nozzle, and is supplied to the cake. Contamination is prevented.

[0023] In a sixth aspect of the present invention, a suction port is provided in the vicinity of an additional point of a workpiece to be machined by a rotating disk-shaped blade, facing the rotational direction of the blade and directed to the machining point. The suction means is provided, and the workpiece is cut while suctioning the cutting water containing the cutting powder scattered during the workpiece cutting by the suction means.

[0024] Thereby, the cutting fluid force containing contaminants fly toward the suction port of the suction means and the suctioned cutting fluid is forcibly discharged out of the apparatus. Therefore, there is no contamination scattered in the apparatus, and high-quality dicing can be performed without reattachment of the contamination to the workpiece.

[0025] A seventh aspect of the present invention is the ejector according to the sixth aspect of the present invention, wherein the suction means is an ejector in which a sucking bow I force is generated by flowing compressed air, and is used in a dicing apparatus. The cutting water is sucked from the suction port by flowing in the air to be discharged.

[0026] According to the seventh aspect of the present invention, it becomes possible to suck cutting fluid containing contaminants with a small and simple structure using compressed air used in the dicing apparatus, and a new large-sized apparatus can be obtained. There is no need to prepare.

[0027] An eighth aspect of the present invention is the sixth or seventh aspect of the present invention, wherein the blade is rotated. A cover for covering the blade is provided at the tip of the spindle to be driven, and the cover is provided with a plate in parallel with the blade with respect to the surface opposite to the surface where the cover is attached to the spindle. In addition, the cutting water is cut off by providing a nozzle that injects a fluid in which the liquid that cleans the workpiece and the gas are mixed in the direction of rotation of the blade from above and obliquely above the workpiece. It is characterized in that it is kept near the contact point between the blade being worked and the workpiece, and the cutting fluid is caused to flow into the suction port by the fluid ejected from the nozzle.

[0028] According to the eighth aspect of the present invention, the cutting water containing contamination does not scatter around the cover force, and flows into the suction port by the two-fluid nozzle, and is removed from the workpiece and contaminated to the workpiece. Adhesion is prevented.

The invention's effect

[0029] As described above, according to the dicing apparatus and the dicing method of the present invention, it is possible to efficiently remove the contamination generated during dicing and perform high-quality dicing that does not reattach to the workpiece. It becomes.

Brief Description of Drawings

FIG. 1 is a perspective view showing the appearance of a dicing apparatus according to the present invention.

FIG. 2 is a front view showing the configuration of the wheel cover.

[Figure 3] Bottom view of the wheel cover.

Explanation of symbols

[0031] 1… Dicing device, 10 ··· Blade, 11 ·············· Recano unit, 12 ··· Vacuum unit (suction means), 13 ··· Duct cover, 14 ··· Duct hose, 15 ··· · Bracket, 16 ··· Shielding plate, 2

0 ···································· 22 Nos, Nore, 36 ··· Flange, 37 · "Rotating shaft,

38 ················································;

52 ... Spinner, 53 ... Conveying means, 54 ... Suction part, 81 ... Imaging means, 90 ... Controller, W ... Work Best mode for carrying out the invention [0032] Preferred embodiments of the dicing apparatus and dicing method according to the present invention will now be described in detail with reference to the accompanying drawings.

First, the dicing apparatus according to the present invention will be described. FIG. 1 is a perspective view showing the appearance of the dicing apparatus, FIG. 2 is a front view showing the configuration of the wheel cover, and FIG. 3 is a bottom view of the wheel cover in FIG. It is.

The dicing apparatus 1 includes a load port 51 that transfers a cassette in which a plurality of workpieces W are stored with an external device, a transport unit 53 that has a suction portion 54 and transports the workpiece W to each part of the device, A work table 23 on which the workpiece W is placed, a machining unit 20 where the workpiece W is machined, and a spinner 52 that cleans and dries the workpiece W after machining are provided. The operation of each part of the dicing apparatus 1 is controlled by a controller 90 as control means.

[0035] The processing unit 20 is provided with an imaging means 81 that images the surface of the workpiece W in the vicinity, and is disposed so as to be opposed to each other inside. A high frequency motor built-in type spindle 22, 22 with a wheel cover 11 is provided.

[0036] Both the spindles 22 are rotated at a high speed of 30000 rpm to 80, OOOrpm, and an index feed in the Y direction and a cut feed in the Z direction are made independent of each other by a moving shaft (not shown). Furthermore, the work table 23 on which the work W is sucked and mounted is configured to be ground and fed in the X direction of the figure by a moving shaft (not shown). B force Touching workpiece W, workpiece W is diced in the X and Y directions.

[0037] The blade 10 may be an electrodeposition blade obtained by electrodepositing diamond or CBN particles with nickel, or a metal resin bond blade obtained by bonding with a resin mixed with metal powder. The dimensions of blade 10 are variously selected depending on the processing content. When dicing a normal semiconductor wafer as a workpiece, a blade with a diameter of about 50 mm and a thickness of about 30 μm is used.

As shown in FIG. 2, the wheel cover 11 is attached to the spindle 22 so as to cover the blade 10 sandwiched between the flanges 36 and fixed to the rotating shaft 37 of the spindle 22 together with the flanges 36. [0039] The wheel cover 11 includes a cover main body 38 and a cover block 31, and the cover block 31 is provided with a block 32, a block 33, a nozzle 40 and a shielding plate 16, and the cover main body 38 has a vacuum serving as suction means. Unit 12 and plate 44 are installed to prevent scattering of cutting water.

[0040] A cut nozzle 34 is attached to the block 32, and cutting water mainly supplied for cleaning is supplied. As shown in FIG. 3, a pair of injection members composed of a blade nozzle 35 and a blade nozzle 39 are attached to the block 33, and cutting water mainly for cooling the blade is supplied to the block 33. Yes. Cutting water is supplied to the blade 10 by the cutting nozzle 34, the blade nozzle 35, and the blade nozzle 39.

[0041] In the blade nozzle 35 and the blade nozzle 39, the cutting water injection ports 35A, 35,. · There are multiple cutting water injection ports 39Α and 39Α. Usually, the number of injection ports is about 3 or 4, and many more may be provided. In this embodiment, the number is three.

[0042] The tip of the cut nozzle 34 is slanted so as to be aligned with the tangential direction C of the blade 10 (the direction of arrow C in FIG. 2), and within the plane including the blade 10, the outer periphery of the blade 10 It is provided close to the machining point Β.

[0043] Further, the block 32 to which the cut nozzle 34 is attached is provided with a position adjusting fixing screw 32Α and a long hole 32Β. Similarly, the block 33 to which the blade nozzle 35 and the blade nozzle 39 are attached is provided with a position adjusting fixing screw 33A and a long hole 33B.

From this, the cut nozzle 34, the blade nozzle 35, and the blade nozzle 39 can be adjusted in the vertical direction, and can be adjusted according to the size of the blade 10, the flange 36, or the workpiece W, etc. it can.

Furthermore, a nozzle 40 is attached to the block 32 by a bracket 41. The nozzle 40 mixes the compressed clean air sent from the tube 43 and the cleaning water for cleaning the workpiece W supplied from the tube 42, and the cleaning water is fed at high pressure in the direction of rotation of the blade 10. Inject toward workpiece A from diagonally above workpiece W. Attached to the tip of nozzle 40 The nozzle tip 45 spreads the cleaning water to be sprayed in a fan shape and enables the cleaning water to be sprayed at a high pressure over a wide area on the upper surface of the workpiece W.

[0046] The shielding plate 16 is a plate member made of metal or resin, and as shown in FIG.

A slit S wider than 0 is provided. As shown in FIG. 2, the shielding plate 16 is attached to the cover block 31 in a horizontal direction or inclined in a direction opposite to the rotation direction A of the blade 10 and the blade 10 passes between the slits S. To do.

[0047] As a result, the cutting water containing contamination that rotates together with the blade 10 during dicing of the workpiece W hits the shielding plate 16 and falls onto the workpiece without being strongly struck by the workpiece W. There is no adhesion.

The vacuum unit 12 includes a duct cover 13 that is a suction port, a duct hose 14, and an ejector 46 that is a sucking bow I means provided inside the dicing apparatus 1.

[0049] The duct cover 13 has a metal or oil-repellent cylindrical shape, and the bracket 1 is attached to the cover body 38 so that one opening portion faces the rotation direction A at the processing point B of the blade 10.

It is attached by 5. In the other opening of the duct cover 13, the duct hose 1

With 4 forces attached, the duct hose 14 is connected to the connection port V of the ejector 46.

[0050] The ejector 46 causes the compressed air used in the dicing device 1 to flow from the connection port I and discharge it from the connection port O, thereby generating a negative pressure at the connection port V, and the duct cover 13 and the duct. Aspirate the cutting fluid in the hose 14. The suctioned cutting fluid is discharged from the connection port O and discharged to the outside of the dicing machine 1.

[0051] As a result, the cutting water containing contaminants scattered in the rotational direction A from the machining point B during the dicing of the workpiece W is taken into the vacuum unit 12 from the opening of the duct cover 13 and is ejected by the ejector 46. It is discharged outside the dicing machine 1.

Next, the dicing method according to the present invention will be described. In the dicing apparatus 1, a cassette in which a plurality of workpieces W are stored is first placed on the transfer device (not shown) or manually on the load port 51. The workpiece W is taken out from the placed cassette and transported.

3 is placed on the work table 23.

[0053] The surface of the workpiece W placed on the workpiece table 23 is imaged by the imaging means 81.

, Position of the line to be diced on the workpiece W and the positional force between the blade 10 X, not shown The work table 23 can be adjusted and adjusted by the movement axes of Y and Θ.

[0054] When the alignment is completed and dicing is started, the spindle 22 starts rotating, the blade 10 rotates at a high speed, and cutting fluid is supplied from the cut nozzle 34, blade nozzle 35, and blade nozzle 39. While being supplied, the cleaning liquid is sprayed from the nozzle 40. In this state, the workpiece W is fed together with the workpiece table 23 by a moving shaft (not shown) in the X direction shown in FIG. 1, and the spindle 22 is lowered to the predetermined height in the vertical direction and dicing is performed. .

[0055] When dicing, contamination such as cutting waste is generated. The generated contamination is mixed with the cutting water, and part of the force on the workpiece W also flows down. The cutting water including the remaining contamination is scattered in the rotational direction Α of the blade 10 shown in FIG.

[0056] At this time, the cutting water containing the contaminants scattered in the rotation direction A of the blade 10 jumps into the duct cover 13 of the vacuum unit 12, is sucked by the ejector 46, passes through the duct hose 14, and the dicing apparatus 1 Will be discharged to the outside.

[0057] The cutting water including the contamination that rotates together with the blade 10 falls on the workpiece without being scattered outside the wheel cover 11 by the plate 44 attached to the cover body 38, or the shielding plate attached to the cover block 31. It is removed from the blade 10 by 16 and falls onto the workpiece W without being strongly struck against the workpiece W.

[0058] In addition, the cutting water containing contamination that has fallen on the workpiece W moves toward the duct cover 13 by the high-pressure washing water accelerated by the compressed air injected from the nozzle 40, or outside the workpiece W. Washed away.

[0059] As a result, the contamination generated by dicing and mixed with the cutting water is swept out of the work W without being strongly struck again to the work W that is scattered in the processing part 20 and becomes mist-like. It will not reattach to the workpiece W.

[0060] As described above, according to the dicing apparatus and the dicing method of the present invention, the cutting fluid force including contamination that is scattered by the blade 10 in the rotational direction is provided so as to be opposed to the scattering direction. It is forcibly discharged out of the apparatus by the suction means, and is removed from the blade before it comes into contact with the cutting fluid power work containing contamination that rotates with the blade 10 again. As a result, the contaminants are efficiently removed and scattered in the device. High quality dicing can be performed without contamination and re-adhering to the workpiece.

[0061] Although the dicing apparatus having two spindles opposed to each other has been described in the present embodiment, the present invention is not limited to this, and the dicing apparatus in which the spindles are arranged in parallel or only one spindle is used. It can be suitably used.

[0062] In the present embodiment, the vacuum unit 12 has a force attached to the wheel cover 11. The present invention is not limited to this, and the opening force of the duct cover 13 prevents contamination scattered by the rotation of the blade 10. If it is provided so as to be opposed to the direction of the contained cutting fluid, it can be suitably used even if it is attached at a position of deviation.

Claims

The scope of the claims

[1] A disk-shaped blade,

A spindle for rotating the blade;

A cover provided on the spindle and covering the blade;

A work table that holds a workpiece to be cut by the blade, a moving shaft that relatively moves the work table and the blade, and a cutting fluid is sprayed near a machining point where the workpiece and the blade are in contact with each other. A dicing apparatus comprising: a nozzle; and a suction means that is opposed to the rotation direction of the blade and that opens toward the processing point and is provided near the processing point.

[2] The dicing apparatus is provided with a plate-shaped shielding plate in which a slit wider than the thickness of the blade is formed so that the blade passes through the slit. The dicing apparatus according to 1.

[3] The dicing apparatus according to [1] or [2], wherein the suction means is an ejector that generates suction force when compressed air flows in.

[4] The cover is provided with a nozzle that ejects a fluid in which a liquid that cleans the work and a gas is mixed in a direction of rotation of the blade from an obliquely upper side with respect to the work. The dicing apparatus according to any one of claims 1, 2, and 3, wherein:

[5] The plate according to claim 1, wherein the cover is provided with a plate parallel to the blade with respect to a surface opposite to a surface on which the cover is attached to the spindle. 3. The dicing device according to item 1, wherein either force of 3 or 4.

[6] In the vicinity of a processing point of a workpiece to be cut by a rotating disk-shaped blade, there is provided a suction means that faces the rotation direction of the blade and is provided with a suction port toward the processing point. A dicing method characterized by cutting a workpiece with a force S that does not suck cutting water containing cutting powder scattered during cutting by the suction means.

[7] The suction means is an ejector that generates a suction force by flowing compressed air, and sucks the cutting water from the suction port by flowing air used in a dicing apparatus. The dicing method according to claim 6, wherein: A cover that covers the blade is provided at the tip of the spindle that rotates the blade, and the blade is opposed to the surface opposite to the surface on which the cover is attached to the spindle. A plate is provided in parallel with the workpiece, and a nozzle that ejects a fluid in which the workpiece is mixed with a liquid that cleans the workpiece in a rotation direction of the blade from an obliquely upward direction with respect to the workpiece, 7. The cutting water is retained near the contact point between the blade and the workpiece being cut, and the cutting fluid is caused to flow into the suction port by a fluid ejected from the nozzle. Item 8. The dicing method according to Item 7.