EP2879164A4 - Dicing device and dicing method - Google Patents
Dicing device and dicing methodInfo
- Publication number
- EP2879164A4 EP2879164A4 EP13803775.9A EP13803775A EP2879164A4 EP 2879164 A4 EP2879164 A4 EP 2879164A4 EP 13803775 A EP13803775 A EP 13803775A EP 2879164 A4 EP2879164 A4 EP 2879164A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- dicing
- dicing method
- dicing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012136060 | 2012-06-15 | ||
PCT/JP2013/066501 WO2013187510A1 (en) | 2012-06-15 | 2013-06-14 | Dicing device and dicing method |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2879164A1 EP2879164A1 (en) | 2015-06-03 |
EP2879164A4 true EP2879164A4 (en) | 2015-11-25 |
EP2879164B1 EP2879164B1 (en) | 2017-09-13 |
Family
ID=49758328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13803775.9A Not-in-force EP2879164B1 (en) | 2012-06-15 | 2013-06-14 | Dicing device and dicing method |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150099428A1 (en) |
EP (1) | EP2879164B1 (en) |
JP (2) | JP5748914B2 (en) |
KR (2) | KR102022754B1 (en) |
CN (1) | CN104364884B (en) |
WO (1) | WO2013187510A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6077799B2 (en) * | 2012-08-31 | 2017-02-08 | 三星ダイヤモンド工業株式会社 | Cutter wheel and manufacturing method thereof |
JP6287774B2 (en) * | 2014-11-19 | 2018-03-07 | 住友電気工業株式会社 | Method for manufacturing silicon carbide semiconductor device |
JP6600267B2 (en) * | 2016-03-15 | 2019-10-30 | 株式会社ディスコ | Workpiece cutting method |
US10707146B2 (en) * | 2016-04-21 | 2020-07-07 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing same, for releaved stress and high heat conductivity |
WO2018066508A1 (en) * | 2016-10-05 | 2018-04-12 | 日本電気硝子株式会社 | Method for producing glass resin laminate, and glass resin laminate |
KR102313832B1 (en) * | 2018-03-16 | 2021-10-15 | 아다만도 나미키 세이미츠 호오세키 가부시키가이샤 | Diamond crystal grinding methods and diamond crystals |
JP7009306B2 (en) * | 2018-05-21 | 2022-01-25 | 株式会社ディスコ | Cutting equipment |
CN113692332B (en) * | 2019-07-31 | 2024-06-11 | 马尼株式会社 | Diamond needle for dentistry |
JP2021040097A (en) * | 2019-09-05 | 2021-03-11 | 株式会社ディスコ | Cutting method of workpiece |
CN112318337A (en) * | 2019-12-20 | 2021-02-05 | 沈阳和研科技有限公司 | Method for cutting glass with warping deformation by using grinding wheel scribing machine |
US11348798B2 (en) * | 2020-02-07 | 2022-05-31 | Akoustis, Inc. | Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices |
JP7394712B2 (en) * | 2020-06-24 | 2023-12-08 | Towa株式会社 | Cutting device and method for manufacturing cut products |
TWI832179B (en) * | 2022-03-22 | 2024-02-11 | 盛新材料科技股份有限公司 | Wafer positioning fixture and wafer processing method using the same |
CN115026824A (en) * | 2022-06-16 | 2022-09-09 | 华北电力大学 | Grinding control method for wind wheel blade of on-site robot |
CN117300844B (en) * | 2023-11-28 | 2024-02-02 | 中铁工程装备集团(天津)有限公司 | Grinding equipment with circle runout detection function |
Citations (6)
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JPH05144937A (en) * | 1991-11-18 | 1993-06-11 | Fujitsu Miyagi Electron:Kk | Dicing blade |
JPH06151586A (en) * | 1992-11-12 | 1994-05-31 | Sony Corp | Method and device for dicing |
JP2003282490A (en) * | 2002-03-27 | 2003-10-03 | Hitachi Ltd | Semiconductor device and method for manufacturing the same |
WO2008004365A1 (en) * | 2006-07-07 | 2008-01-10 | Tokyo Seimitsu Co., Ltd. | Dicing apparatus and dicing method |
US20110132954A1 (en) * | 2008-06-05 | 2011-06-09 | Maoko Tomei | Scribing wheel and method for scribing brittle material substrate |
JP2012030992A (en) * | 2010-07-29 | 2012-02-16 | Mitsuboshi Diamond Industrial Co Ltd | Scribing wheel, scribing device, and scribing method |
Family Cites Families (61)
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US3156077A (en) * | 1963-02-06 | 1964-11-10 | Continental Machines | Diamond edge saw blade |
US3371452A (en) * | 1965-02-08 | 1968-03-05 | Christensen Diamond Prod Co | Diamond saw or milling blades |
US3574580A (en) * | 1968-11-08 | 1971-04-13 | Atomic Energy Commission | Process for producing sintered diamond compact and products |
US3912500A (en) * | 1972-12-27 | 1975-10-14 | Leonid Fedorovich Vereschagin | Process for producing diamond-metallic materials |
US4151686A (en) * | 1978-01-09 | 1979-05-01 | General Electric Company | Silicon carbide and silicon bonded polycrystalline diamond body and method of making it |
US4180048A (en) * | 1978-06-12 | 1979-12-25 | Regan Barrie F | Cutting wheel |
AU583299B1 (en) * | 1984-08-24 | 1989-04-27 | Australian National University, The | Diamond compacts and process for making same |
JPS61104045A (en) | 1984-10-26 | 1986-05-22 | Sumitomo Electric Ind Ltd | Diamond sintered body for tool and production thereof |
DE3583567D1 (en) * | 1984-09-08 | 1991-08-29 | Sumitomo Electric Industries | SINTERED DIAMOND TOOL BODY AND METHOD FOR PRODUCING IT. |
EP0308440B1 (en) * | 1987-03-23 | 1991-06-05 | The Australian National University | Diamond compacts |
JP3209818B2 (en) * | 1993-03-08 | 2001-09-17 | 株式会社東京精密 | Cutting blade mounting structure for dicing equipment |
JPH07276137A (en) | 1994-03-31 | 1995-10-24 | Osaka Diamond Ind Co Ltd | Tool for cutting and grinding |
US5479911A (en) * | 1994-05-13 | 1996-01-02 | Kulicke And Soffa Investments Inc | Diamond impregnated resinoid cutting blade |
US5888129A (en) * | 1996-05-15 | 1999-03-30 | Neff; Charles E. | Grinding wheel |
JP3610716B2 (en) * | 1997-01-23 | 2005-01-19 | トヨタ自動車株式会社 | Casting seal surface processing method |
US20040112359A1 (en) * | 1997-04-04 | 2004-06-17 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
EP1013379A4 (en) * | 1997-07-16 | 2007-05-09 | Ishizuka Res Inst Ltd | Diamond-containing stratified composite material and method of manufacturing the same |
US20040112360A1 (en) * | 1998-02-12 | 2004-06-17 | Boucher John N. | Substrate dicing method |
ES2216496T3 (en) * | 1998-07-31 | 2004-10-16 | Saint-Gobain Abrasives, Inc. | ROTATING CONDITIONING TOOL CONTAINING A WELDED DIAMOND LAYER. |
JP2001038636A (en) * | 1999-07-26 | 2001-02-13 | Kimiko Sueda | Thin blade of wheel cutter |
JP3308246B2 (en) | 1999-08-18 | 2002-07-29 | 株式会社リード | Diamond blade core metal for rare earth magnet cutting |
JP3892204B2 (en) | 2000-03-29 | 2007-03-14 | 株式会社リード | Rare earth magnet cutting blade and method for manufacturing the same |
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WO2002055264A1 (en) * | 2001-01-16 | 2002-07-18 | Nikon Corporation | Grinding stone pellet, grinding stone, and method of producing them, and method of producing optical elements using grinding stone and method of producing projection aligners |
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JP5357580B2 (en) * | 2009-03-09 | 2013-12-04 | 三星ダイヤモンド工業株式会社 | Grooving tool and method of grooving thin film solar cell using the same |
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US20110073094A1 (en) * | 2009-09-28 | 2011-03-31 | 3M Innovative Properties Company | Abrasive article with solid core and methods of making the same |
JP5534181B2 (en) * | 2010-03-12 | 2014-06-25 | 住友電気工業株式会社 | Diamond polycrystal |
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CN101870008B (en) * | 2010-06-11 | 2012-01-11 | 西安点石超硬材料发展有限公司 | Saw-type sintering metal base diamond saw blade for cutting QFN (Quad Flat Non-leaded) package substrate |
JP5195981B2 (en) * | 2010-10-26 | 2013-05-15 | 三星ダイヤモンド工業株式会社 | Scribe head and scribing device |
JP4852178B1 (en) * | 2011-04-26 | 2012-01-11 | 株式会社テクノホロン | Dicing machine |
WO2013027243A1 (en) * | 2011-08-24 | 2013-02-28 | 新日鉄マテリアルズ株式会社 | Beveling grindstone |
KR101252406B1 (en) * | 2011-09-07 | 2013-04-08 | 이화다이아몬드공업 주식회사 | Brazing bond type diamond tool with excellent machinability and method for manufacturing the same |
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-
2013
- 2013-06-14 JP JP2014521434A patent/JP5748914B2/en not_active Expired - Fee Related
- 2013-06-14 KR KR1020167003252A patent/KR102022754B1/en active IP Right Grant
- 2013-06-14 CN CN201380031514.7A patent/CN104364884B/en not_active Expired - Fee Related
- 2013-06-14 WO PCT/JP2013/066501 patent/WO2013187510A1/en active Application Filing
- 2013-06-14 KR KR20147034629A patent/KR20150004931A/en active Application Filing
- 2013-06-14 EP EP13803775.9A patent/EP2879164B1/en not_active Not-in-force
-
2014
- 2014-12-12 US US14/569,061 patent/US20150099428A1/en not_active Abandoned
-
2015
- 2015-05-11 JP JP2015096460A patent/JP5888827B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05144937A (en) * | 1991-11-18 | 1993-06-11 | Fujitsu Miyagi Electron:Kk | Dicing blade |
JPH06151586A (en) * | 1992-11-12 | 1994-05-31 | Sony Corp | Method and device for dicing |
JP2003282490A (en) * | 2002-03-27 | 2003-10-03 | Hitachi Ltd | Semiconductor device and method for manufacturing the same |
WO2008004365A1 (en) * | 2006-07-07 | 2008-01-10 | Tokyo Seimitsu Co., Ltd. | Dicing apparatus and dicing method |
US20110132954A1 (en) * | 2008-06-05 | 2011-06-09 | Maoko Tomei | Scribing wheel and method for scribing brittle material substrate |
JP2012030992A (en) * | 2010-07-29 | 2012-02-16 | Mitsuboshi Diamond Industrial Co Ltd | Scribing wheel, scribing device, and scribing method |
Non-Patent Citations (1)
Title |
---|
See also references of WO2013187510A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2879164A1 (en) | 2015-06-03 |
JP5748914B2 (en) | 2015-07-15 |
WO2013187510A1 (en) | 2013-12-19 |
CN104364884A (en) | 2015-02-18 |
KR20160021904A (en) | 2016-02-26 |
KR102022754B1 (en) | 2019-09-18 |
JPWO2013187510A1 (en) | 2016-02-08 |
JP5888827B2 (en) | 2016-03-22 |
CN104364884B (en) | 2017-06-23 |
JP2015164215A (en) | 2015-09-10 |
KR20150004931A (en) | 2015-01-13 |
US20150099428A1 (en) | 2015-04-09 |
EP2879164B1 (en) | 2017-09-13 |
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