EP2879164A4 - Dicing device and dicing method - Google Patents

Dicing device and dicing method

Info

Publication number
EP2879164A4
EP2879164A4 EP13803775.9A EP13803775A EP2879164A4 EP 2879164 A4 EP2879164 A4 EP 2879164A4 EP 13803775 A EP13803775 A EP 13803775A EP 2879164 A4 EP2879164 A4 EP 2879164A4
Authority
EP
European Patent Office
Prior art keywords
dicing
dicing method
dicing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13803775.9A
Other languages
German (de)
French (fr)
Other versions
EP2879164A1 (en
EP2879164B1 (en
Inventor
Junji Watanabe
Takashi Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of EP2879164A1 publication Critical patent/EP2879164A1/en
Publication of EP2879164A4 publication Critical patent/EP2879164A4/en
Application granted granted Critical
Publication of EP2879164B1 publication Critical patent/EP2879164B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP13803775.9A 2012-06-15 2013-06-14 Dicing device and dicing method Not-in-force EP2879164B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012136060 2012-06-15
PCT/JP2013/066501 WO2013187510A1 (en) 2012-06-15 2013-06-14 Dicing device and dicing method

Publications (3)

Publication Number Publication Date
EP2879164A1 EP2879164A1 (en) 2015-06-03
EP2879164A4 true EP2879164A4 (en) 2015-11-25
EP2879164B1 EP2879164B1 (en) 2017-09-13

Family

ID=49758328

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13803775.9A Not-in-force EP2879164B1 (en) 2012-06-15 2013-06-14 Dicing device and dicing method

Country Status (6)

Country Link
US (1) US20150099428A1 (en)
EP (1) EP2879164B1 (en)
JP (2) JP5748914B2 (en)
KR (2) KR102022754B1 (en)
CN (1) CN104364884B (en)
WO (1) WO2013187510A1 (en)

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JP6077799B2 (en) * 2012-08-31 2017-02-08 三星ダイヤモンド工業株式会社 Cutter wheel and manufacturing method thereof
JP6287774B2 (en) * 2014-11-19 2018-03-07 住友電気工業株式会社 Method for manufacturing silicon carbide semiconductor device
JP6600267B2 (en) * 2016-03-15 2019-10-30 株式会社ディスコ Workpiece cutting method
US10707146B2 (en) * 2016-04-21 2020-07-07 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing same, for releaved stress and high heat conductivity
WO2018066508A1 (en) * 2016-10-05 2018-04-12 日本電気硝子株式会社 Method for producing glass resin laminate, and glass resin laminate
KR102313832B1 (en) * 2018-03-16 2021-10-15 아다만도 나미키 세이미츠 호오세키 가부시키가이샤 Diamond crystal grinding methods and diamond crystals
JP7009306B2 (en) * 2018-05-21 2022-01-25 株式会社ディスコ Cutting equipment
CN113692332B (en) * 2019-07-31 2024-06-11 马尼株式会社 Diamond needle for dentistry
JP2021040097A (en) * 2019-09-05 2021-03-11 株式会社ディスコ Cutting method of workpiece
CN112318337A (en) * 2019-12-20 2021-02-05 沈阳和研科技有限公司 Method for cutting glass with warping deformation by using grinding wheel scribing machine
US11348798B2 (en) * 2020-02-07 2022-05-31 Akoustis, Inc. Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices
JP7394712B2 (en) * 2020-06-24 2023-12-08 Ｔｏｗａ株式会社 Cutting device and method for manufacturing cut products
TWI832179B (en) * 2022-03-22 2024-02-11 盛新材料科技股份有限公司 Wafer positioning fixture and wafer processing method using the same
CN115026824A (en) * 2022-06-16 2022-09-09 华北电力大学 Grinding control method for wind wheel blade of on-site robot
CN117300844B (en) * 2023-11-28 2024-02-02 中铁工程装备集团(天津)有限公司 Grinding equipment with circle runout detection function

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Title
See also references of WO2013187510A1 *

Also Published As

Publication number Publication date
EP2879164A1 (en) 2015-06-03
JP5748914B2 (en) 2015-07-15
WO2013187510A1 (en) 2013-12-19
CN104364884A (en) 2015-02-18
KR20160021904A (en) 2016-02-26
KR102022754B1 (en) 2019-09-18
JPWO2013187510A1 (en) 2016-02-08
JP5888827B2 (en) 2016-03-22
CN104364884B (en) 2017-06-23
JP2015164215A (en) 2015-09-10
KR20150004931A (en) 2015-01-13
US20150099428A1 (en) 2015-04-09
EP2879164B1 (en) 2017-09-13

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