EP2879164A4 - Dispositif et procédé de découpage en dés - Google Patents

Dispositif et procédé de découpage en dés

Info

Publication number
EP2879164A4
EP2879164A4 EP13803775.9A EP13803775A EP2879164A4 EP 2879164 A4 EP2879164 A4 EP 2879164A4 EP 13803775 A EP13803775 A EP 13803775A EP 2879164 A4 EP2879164 A4 EP 2879164A4
Authority
EP
European Patent Office
Prior art keywords
dicing
dicing method
dicing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13803775.9A
Other languages
German (de)
English (en)
Other versions
EP2879164A1 (fr
EP2879164B1 (fr
Inventor
Junji Watanabe
Takashi Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of EP2879164A1 publication Critical patent/EP2879164A1/fr
Publication of EP2879164A4 publication Critical patent/EP2879164A4/fr
Application granted granted Critical
Publication of EP2879164B1 publication Critical patent/EP2879164B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP13803775.9A 2012-06-15 2013-06-14 Dispositif et procédé de découpage en dés Not-in-force EP2879164B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012136060 2012-06-15
PCT/JP2013/066501 WO2013187510A1 (fr) 2012-06-15 2013-06-14 Dispositif et procédé de découpage en dés

Publications (3)

Publication Number Publication Date
EP2879164A1 EP2879164A1 (fr) 2015-06-03
EP2879164A4 true EP2879164A4 (fr) 2015-11-25
EP2879164B1 EP2879164B1 (fr) 2017-09-13

Family

ID=49758328

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13803775.9A Not-in-force EP2879164B1 (fr) 2012-06-15 2013-06-14 Dispositif et procédé de découpage en dés

Country Status (6)

Country Link
US (1) US20150099428A1 (fr)
EP (1) EP2879164B1 (fr)
JP (2) JP5748914B2 (fr)
KR (2) KR20150004931A (fr)
CN (1) CN104364884B (fr)
WO (1) WO2013187510A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6077799B2 (ja) * 2012-08-31 2017-02-08 三星ダイヤモンド工業株式会社 カッターホイール並びにその製造方法
JP6287774B2 (ja) * 2014-11-19 2018-03-07 住友電気工業株式会社 炭化珪素半導体装置の製造方法
JP6600267B2 (ja) * 2016-03-15 2019-10-30 株式会社ディスコ 被加工物の切削方法
JP6440903B2 (ja) * 2016-04-21 2018-12-19 三菱電機株式会社 半導体装置およびその製造方法
WO2018066508A1 (fr) * 2016-10-05 2018-04-12 日本電気硝子株式会社 Procédé de production de stratifié de résine de verre, et stratifié de résine de verre
CN110769975B (zh) * 2018-03-16 2022-04-08 安达满纳米奇精密宝石有限公司 金刚石晶体的研磨方法和金刚石晶体
JP7009306B2 (ja) * 2018-05-21 2022-01-25 株式会社ディスコ 切削装置
JP2021040097A (ja) * 2019-09-05 2021-03-11 株式会社ディスコ 被加工物の切削方法
CN112318337A (zh) * 2019-12-20 2021-02-05 沈阳和研科技有限公司 一种砂轮划片机切割有翘曲变形玻璃的方法
US11348798B2 (en) * 2020-02-07 2022-05-31 Akoustis, Inc. Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices
JP7394712B2 (ja) * 2020-06-24 2023-12-08 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
TWI832179B (zh) * 2022-03-22 2024-02-11 盛新材料科技股份有限公司 晶圓定位治具及使用其的晶圓加工方法
CN117300844B (zh) * 2023-11-28 2024-02-02 中铁工程装备集团(天津)有限公司 一种具有圆跳动检测功能的磨削设备

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Publication number Priority date Publication date Assignee Title
JPH05144937A (ja) * 1991-11-18 1993-06-11 Fujitsu Miyagi Electron:Kk ダイシングブレード
JPH06151586A (ja) * 1992-11-12 1994-05-31 Sony Corp ダイシング方法および装置
JP2003282490A (ja) * 2002-03-27 2003-10-03 Hitachi Ltd 半導体装置及びその製造方法
WO2008004365A1 (fr) * 2006-07-07 2008-01-10 Tokyo Seimitsu Co., Ltd. Appareil et procédé de découpage en dés
US20110132954A1 (en) * 2008-06-05 2011-06-09 Maoko Tomei Scribing wheel and method for scribing brittle material substrate
JP2012030992A (ja) * 2010-07-29 2012-02-16 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール、スクライブ装置、およびスクライブ方法

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Title
See also references of WO2013187510A1 *

Also Published As

Publication number Publication date
JP2015164215A (ja) 2015-09-10
CN104364884A (zh) 2015-02-18
JP5888827B2 (ja) 2016-03-22
EP2879164A1 (fr) 2015-06-03
KR102022754B1 (ko) 2019-09-18
KR20160021904A (ko) 2016-02-26
KR20150004931A (ko) 2015-01-13
JPWO2013187510A1 (ja) 2016-02-08
CN104364884B (zh) 2017-06-23
EP2879164B1 (fr) 2017-09-13
US20150099428A1 (en) 2015-04-09
WO2013187510A1 (fr) 2013-12-19
JP5748914B2 (ja) 2015-07-15

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