JP6600267B2 - Workpiece cutting method - Google Patents

Workpiece cutting method Download PDF

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Publication number
JP6600267B2
JP6600267B2 JP2016051222A JP2016051222A JP6600267B2 JP 6600267 B2 JP6600267 B2 JP 6600267B2 JP 2016051222 A JP2016051222 A JP 2016051222A JP 2016051222 A JP2016051222 A JP 2016051222A JP 6600267 B2 JP6600267 B2 JP 6600267B2
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cutting
dressing
cutting blade
chuck
workpiece
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JP2017168575A (en
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大吾 法積
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株式会社ディスコ
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Description

  The present invention relates to a method for cutting a workpiece.

  When cutting a plate-shaped workpiece such as a semiconductor wafer, a package substrate, a ceramic plate, or a glass plate, a cutting device is known that attaches a cutting blade to a spindle and cuts the workpiece held on a chuck table. ing. Cutting is performed by appropriately adjusting the machining feed rate and the spindle rotation speed in accordance with the characteristics of the workpiece and the cutting blade. In addition, the cutting blade is eccentric because the center of rotation of the spindle and the center of the cutting blade do not match at the beginning of mounting, and the cutting blade is forcibly consumed by dressing and the cutting blade is aligned and sharpened. . Thereafter, an operation of registering the position of the cutting blade in the indexing feed direction in the cutting device (hairline alignment) is performed on the basis of the cutting groove formed by dressing, and the workpiece is processed.

Japanese Patent No. 4559904 Japanese Patent No. 5096052

  In recent years, dressing boards dedicated to dressing have been developed, and dressing time can be greatly reduced. However, since the spindle rotation speed at the time of dressing is preset by the combination of the dressing board and the cutting blade, it may be significantly different from the spindle rotation speed at which the workpiece is processed. Here, it is known that the cutting blade warps in the thickness direction of the cutting blade as the number of spindle revolutions increases (Patent Documents 1 and 2). Thereby, there existed a problem that a cutting position shifted from the division | segmentation scheduled line of a workpiece, and the biased position was cut.

  The present invention has been made in view of the above problems, and its purpose is to align the cutting position even in a situation where the spindle rotational speed when dressing is different from the spindle rotational speed when processing a workpiece. An object of the present invention is to provide a workpiece cutting method that can be carried out with high accuracy.

  A chuck table for holding the workpiece, a cutting means for cutting the workpiece held on the chuck table with a cutting blade fixed to the tip of the spindle, and the chuck table and the cutting means in the axial direction of the spindle An imaging system for imaging a workpiece having an optical system in which a reference line for alignment of the cutting blade is formed in the X direction, and a moving means that relatively moves in the Y direction and the X direction orthogonal to the Y direction. And a control means for controlling each component. A cutting method for a workpiece using a cutting apparatus, wherein a dressing board held on the chuck table is preselected as a dressing condition. Cutting with a spindle speed of 1 and dressing the cutting blade, and before or after the dressing step, the workpiece is cut A groove forming step of forming an alignment groove by cutting one or more lines of the dressing board held on the chuck table with the cutting blade at a second spindle rotation speed selected in advance as a condition for performing the alignment, and the alignment A reference distance registration step for aligning the reference line with the groove for registration, and registering a distance between the positioning groove and the reference line; and after the reference distance registration step, holding the workpiece on the chuck table, A cutting position setting step for setting the position to be cut by correcting the registered distance in the Y direction by aligning the reference line with the planned division line set on the workpiece, and after the cutting position setting step, And a cutting step for cutting the workpiece along the predetermined division line at the second spindle rotation speed.

  In the cutting method, the cutting apparatus includes a first cutting means and a second cutting means, and the first spindle rotation speed and the second spindle rotation speed are determined by the first cutting means and the second cutting speed. It is preferable that each of the two cutting means is set.

  According to the present invention, when a workpiece is machined by forming an alignment groove on the dressing board at a spindle rotation speed for machining the workpiece, and performing alignment using the alignment groove. The influence of misalignment due to the warping of the cutting blade can be eliminated. Thereby, even in a situation where the spindle rotation speed when dressing is different from the spindle rotation speed when the workpiece is processed, the cutting position can be accurately aligned.

FIG. 1 is a perspective view showing a configuration example of a cutting apparatus that executes the cutting method according to the present embodiment. FIG. 2 is an enlarged view showing the first cutting means and the second cutting means in an enlarged manner. FIG. 3 is an example of a flowchart showing the cutting method according to the present embodiment. FIG. 4 is an enlarged view showing a state of the dressing board that has completed dressing in the dressing step. FIG. 5 is an enlarged view showing a state of cutting the alignment groove in the groove forming step. FIG. 6 is an enlarged view showing an enlarged reference line and alignment groove in the reference distance registration step. FIG. 7 is an enlarged view showing the cutting state of the processing target in the cutting step in an enlarged manner. FIG. 8 is an enlarged view showing the periphery of a chuck table of a cutting apparatus according to another embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

  A cutting method according to this embodiment will be described. FIG. 1 is a perspective view showing a configuration example of a cutting apparatus that executes the cutting method according to the present embodiment. FIG. 2 is an enlarged view showing the first cutting means and the second cutting means in an enlarged manner. FIG. 3 is an example of a flowchart showing the cutting method according to the present embodiment. FIG. 4 is an enlarged view showing the state of the dressing board that has completed dressing in the dressing step. FIG. 5 is an enlarged view showing a state of cutting the alignment groove in the groove forming step. FIG. 6 is an enlarged view showing an enlarged reference line and alignment groove in the reference distance registration step. FIG. 7 is an enlarged view showing the cutting state of the processing target in the cutting step in an enlarged manner.

  The workpiece cutting method of the present embodiment assumes a wafer 10 having silicon as a base material as a workpiece, but is not limited thereto. For example, the workpiece may be a disk-shaped semiconductor wafer or optical device wafer whose base material is sapphire, gallium or the like.

  In the cutting method according to the present embodiment, the workpiece is cut by the cutting device 1. The cutting apparatus 1 includes a stationary base 2, a chuck table mechanism 3 that holds a wafer 10 disposed on the stationary base 2, and a cutting mechanism 4 that cuts the wafer 10 held on the chuck table mechanism 3. And a dressing board 7 used for dressing the cutting blade, and a control means 8 for controlling the above-described components.

  The chuck table mechanism 3 includes two guide rails 31, 31, a moving base 32, a support member 33, a chuck table 34, a cover table 35, and a processing feed means 36.

  The two guide rails 31 are arranged on the stationary base 2 along the machining feed direction (X-axis direction) indicated by the arrow X. The moving base 32 is a table that is slidably disposed on the two guide rails 31, 31. The support member 33 is a cylindrical member disposed on the moving base 32. The support member 33 has a pulse motor (not shown) disposed therein.

  The chuck table 34 includes a chuck table main body 341, a suction chuck 342, and a clamp 343. The chuck table main body 341 is a table that is rotatably supported by a cylindrical support member 33. The chuck table main body 341 is rotated by a pulse motor (not shown) disposed in the cylindrical support member 33. The suction chuck 342 is disposed on the upper surface of the chuck table main body 341. The suction chuck 342 is a porous plate-like member formed of porous ceramics. The suction chuck 342 is connected to suction means (not shown). The suction chuck 342 sucks and holds the wafer 10 or the dressing board 7 placed on the upper surface by operating a suction means (not shown). As shown in FIG. 1, four clamps 343 are arranged around the chuck table main body 341. The clamp 343 holds an annular dicing frame (not shown) that supports the wafer 10. A bonding surface between the wafer 10 and a dicing frame (not shown) is bonded by a dicing tape (not shown).

  The cover table 35 is a table having an opening in the center portion. As shown in FIG. 1, the cover table 35 is fixed to the upper surface of a cylindrical support member 33 by inserting a chuck table 34 into an opening at a central portion. The processing feed means 36 is configured by a known ball screw mechanism, and moves the movable base 32 along the two guide rails 31 and 31 in the processing feed direction (X-axis direction).

  The cutting mechanism 4 includes a support base 41, a first base portion 42a and a second base portion 42b, a first index feeding means 43a and a second index feeding means 43b, a first suspension bracket 44a and a second suspension bracket 44a. The suspension bracket 44b, the first cutting means 45a and the second cutting means 45b, and the first cutting means 46a and the second cutting means 46b are provided.

  The support base 41 is a gate-type base disposed on the stationary base 2. The support base 41 is disposed so as to straddle the processing region 60 shown in FIG. Two guide rails 411 and 411 are provided on the side wall of the support base 41 in parallel along the index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the machining feed direction (X-axis direction).

  The first base portion 42a and the second base portion 42b are disposed so as to be slidable along the two guide rails 411 and 411 in the index feed direction (Y-axis direction). The first base portion 42a and the second base portion 42b are provided so that the two guide rails 421a, 421a and 421b, 421b are parallel to each other along the cutting feed direction (Z-axis direction) indicated by an arrow Z.

  The first index feeding means 43a and the second index feeding means 43b are disposed on the side wall of the support base 41 as shown in FIG. The first index feed means 43a and the second index feed means 43b are each configured by a well-known ball screw mechanism, and the first base portion 42a and the second base portion 42b are respectively provided with two guide rails 411 and 411. Along the index feed direction (Y-axis direction).

  The first suspension bracket 44a and the second suspension bracket 44b are disposed so as to be slidable in the cutting feed direction (Z-axis direction) along the guide rails 421a, 421a and 421b, 421b, respectively.

  As shown in FIG. 1, the first notch feeding means 45a and the second notch feeding means 45b are disposed on the first base portion 42a and the second base portion 42b, respectively. The first notch feed means 45a and the second notch feed means 45b are each configured by a well-known ball screw mechanism, and the first suspension bracket 44a and the second suspension bracket 44b are respectively connected to the guide rails 421a, 421a and It is moved along the cutting feed direction (Z-axis direction) along 421b and 421b.

  The first cutting means 46a and the second cutting means 46b include a first spindle housing 461a and a second spindle housing 461b, a first rotating spindle 462a and a second rotating spindle 462b, and a first cutting blade. 463a and a second cutting blade 463b, a first flange member 464a and a second flange member 464b, and a first imaging means 465a and a second imaging means 465b, respectively.

  The first spindle housing 461a and the second spindle housing 461b are containers for accommodating the first rotating spindle 462a and the second rotating spindle 462b, respectively. As shown in FIG. 1, the first spindle housing 461a and the second spindle housing 461b are arranged so as to be movable in the cutting direction (Z-axis direction) together with the first suspension bracket 44a and the second suspension bracket 44b. Is done.

  The first rotary spindle 462a and the second rotary spindle 462b are rotary shafts respectively connected to two drive sources (not shown). The two drive sources (not shown) are, for example, servo motors. Two drive sources (not shown) are respectively fixed in the first spindle housing 461a and the second spindle housing 461b. The first rotary spindle 462a and the second rotary spindle 462b are rotatably supported in the first spindle housing 461a and the second spindle housing 461b via a driving source (not shown).

  The first cutting blade 463a and the second cutting blade 463b are electroformed blades in which diamond abrasive grains are electrodeposited by nickel plating. As shown in FIG. 2, the first cutting blade 463a and the second cutting blade 463b are arranged to face each other. That is, the first cutting blade 463a and the second cutting blade 463b are arranged in a straight line so that the respective axis cores face the index feed direction (Y-axis direction). The first cutting blade 463a and the second cutting blade 463b rotate when two driving sources (not shown) rotate and drive the first rotating spindle 462a and the second rotating spindle 462b, respectively.

  The first cutting blade 463a and the second cutting blade 463b described above are different types of blades. For example, the first cutting blade 463a is a cutting blade having a thickness of about 20 μm, and the second cutting blade 463b is a metal pattern removing blade for testing having a thickness of about 40 μm.

  Note that the first cutting blade 463a and the second cutting blade 463b are not limited to electroformed blades. For example, a cutting blade using a metal bond and a resin bond may be used.

  The first flange member 464a and the second flange member 464b are two sets of flange members that respectively hold the first cutting blade 463a and the second cutting blade 463b. As shown in FIG. 2, the first cutting blade 463a and the first flange member 464a are attached to the tip of the first rotating spindle 462a. As shown in FIG. 2, the second cutting blade 463b and the second flange member 464b are attached to the tip of the second rotary spindle 462b.

  As shown in FIGS. 1 and 2, the first imaging unit 465a and the second imaging unit 465b are fixed to the side surfaces of the first spindle housing 461a and the second spindle housing 461b, respectively. The first imaging unit 465 a and the second imaging unit 465 b are optical system devices that image the dressing board 7 and the wafer 10. The optical system equipment is, for example, a microscope and a CCD camera. The first imaging unit 465a and the second imaging unit 465b are provided with reference lines 2La and 2Lb called hairlines at the center of the captured image, respectively. The first imaging unit 465a and the second imaging unit 465b are configured so that the first cutting blade 463a and the second cutting blade 463b and the reference lines 2La and 2Lb are in the cutting feed direction (X axis) when the cutting apparatus 1 is assembled. (Direction) and are adjusted so as to be located on the same line.

  The dressing board 7 is a plate-like member used for rounding and sharpening the first cutting blade 463a and the second cutting blade 463b. The dressing board 7 is composed of abrasive grains and a binding material that bonds the abrasive grains. The abrasive grains are, for example, diamond, CBN (cubic boron nitride), green carborundum, white alundum, and alundum. The binder is, for example, a vitrified bond, a metal bond, or a resin bond.

  The control unit 8 controls the above-described components constituting the cutting device 1 to perform cutting on the wafer 10. Here, for example, the control means 8 is mainly composed of an arithmetic processing unit constituted by a CPU or the like and a microprocessor (not shown) provided with a ROM, a RAM, etc., and a display means (not shown) for displaying the state of the machining operation, The operator is connected to an operating means (not shown) that is used when the operator registers information on the processing contents.

  In the cutting method according to the present embodiment, first, the operator inputs machining content information to an operating means (not shown), and registers machining content information in the control means 8. Information on the processing content includes, for example, the depth of cut into the workpiece and the processing feed speed, the first spindle rotation speed, and the second spindle rotation speed. Here, the first spindle rotational speed is a rotational speed suitable for dressing, and is a rotational speed determined by dressing conditions. Specifically, it is determined by the combination of the dressing board 7 and the first cutting blade 463a and the combination of the dressing board 7 and the second cutting blade 463b, respectively. That is, the first spindle rotation speed is set for each of the first cutting blade 463a and the second cutting blade 463b. The second spindle rotation speed is a rotation speed suitable for cutting, and is a rotation speed determined by cutting conditions. Specifically, it depends on the combination of the workpiece and the first cutting blade 463a and the combination of the workpiece and the second cutting blade 463b. That is, the second spindle rotation speed is set for each of the first cutting blade 463a and the second cutting blade 463b. Next, the operator places the dressing board 7 on the chuck table 34 waiting at the standby position by operating a transfer device (not shown). Here, the standby position is a position where the chuck table 34 is waiting for an instruction to start a machining operation by the operator. Thereafter, the operator sucks and holds the dressing board 7 placed on the chuck table 34 by operating a suction device (not shown). The control means 8 starts the machining operation when the operator gives an instruction to start the machining operation.

  When the cutting device 1 detects an instruction to start a machining operation from the operator, the cutting device 1 executes a dressing step (step ST1). The cutting apparatus 1 controls the machining feed means 36 to move the chuck table 34 from the standby position to the machining area 60. Here, the first cutting blade 463a and the second cutting blade 463b are opposite to the arrow X shown in FIG. 2 rather than the dressing board 7 when the chuck table 34 moved to the processing region 60 from the upper side in the vertical direction is viewed. Located in the direction. Next, the cutting apparatus 1 controls the first indexing feeding means 43a and the second indexing feeding means 43b to thereby control the dressing position of the dressing board 7 and the positions of the first cutting blade 463a and the second cutting blade 463b. Move so as to coincide with each other in the Y-axis direction. Next, the cutting device 1 controls the first cutting feed means 45a and the second cutting feed means 45b to cut and feed the first cutting blade 463a and the second cutting blade 463b to a predetermined cutting depth, respectively. Move in the direction (Z-axis direction). Next, the cutting apparatus 1 rotates the first cutting blade 463a and the second cutting blade 463b at a preset first spindle rotation speed, respectively. Next, the cutting device 1 controls the processing feed means 36 to process and feed the first cutting blade 463a and the second cutting blade 463b in the direction indicated by the arrow X (X-axis direction) in FIG. The board 7 is cut, and the first cutting blade 463a and the second cutting blade 463b are dressed, respectively.

  Next, the cutting device 1 executes a groove forming step (step ST2). The cutting apparatus 1 controls the first indexing feeding means 43a and the second indexing feeding means 43b, whereby the orientation of the alignment grooves 1La and 1Lb to be cut by the dressing board 7 and the first cutting blade 463a and The second cutting blade 463b moves so as to coincide with the direction of the Y-axis. Next, the cutting device 1 controls the first cutting feed means 45a and the second cutting feed means 45b to cut and feed the first cutting blade 463a and the second cutting blade 463b to a predetermined cutting depth, respectively. Move in the direction (Z-axis direction). Next, the cutting apparatus 1 rotates the first cutting blade 463a and the second cutting blade 463b at a preset second spindle rotation speed, respectively. Next, the cutting device 1 controls the processing feed means 36 to process and feed the first cutting blade 463a and the second cutting blade 463b in the X-axis direction, and to align the positioning grooves 1La and 1Lb on the dressing board 7. Each cut. The cutting device 1 repeats the above-described cutting operation, and cuts the plurality of alignment grooves 1La and 1Lb as shown in FIG. In the groove forming step (step ST2), it is not necessary to form the plurality of alignment grooves 1La and 1Lb as shown in FIG. 5, and the number of grooves may be cut by one line or more. In this embodiment, the groove forming step (step ST2) is performed after the dressing step (step ST1). However, the groove forming step (step ST2) may be performed before the dressing step (step ST1).

  Next, the cutting device 1 executes a reference distance registration step (step ST3). As shown in FIG. 6, the cutting device 1 aligns the reference lines 2La and 2Lb with the arbitrary alignment grooves 1La and 1Lb, respectively, thereby shifting the alignment grooves 1La and 1Lb from the reference lines 2La and 2Lb. Detect each. Next, the cutting device 1 determines the reference distance between the first cutting blade 463a and the second cutting blade 463b and the reference lines 2La and 2Lb according to the deviation between the alignment grooves 1La and 1Lb and the reference lines 2La and 2Lb. Correct each.

  Next, the cutting device 1 executes a cutting position setting step (step ST4). The cutting device 1 controls the processing feed means 36 to move the chuck table 34 from the processing region 60 to the initial position, stops the suction device (not shown), releases the suction holding of the dressing board 7, and transports (not shown). By operating the apparatus, the dressing board 7 and the wafer (workpiece) 10 placed on the chuck table 34 are exchanged. Next, the cutting device 1 operates the suction device (not shown) to suck and hold the wafer 10 on the chuck table 34, and moves the chuck table 34 to the processing region 60 by controlling the processing feeding means 36. Next, the cutting apparatus 1 adjusts the reference line 2La of the first imaging unit 465a to the street 101 formed on the wafer 10 by controlling the first indexing and feeding unit 43a. Next, the cutting apparatus 1 sets the position in the Y-axis direction in a state where the street 101 and the reference line 2La are combined as the cutting position of the first cutting blade 463a. Next, the cutting apparatus 1 adjusts the reference line 2 </ b> Lb of the second imaging unit 465 b to the street 101 formed on the wafer 10 by controlling the second index feeding unit 43 b. Next, the cutting device 1 sets the position in the Y-axis direction in a state where the street 101 and the reference line 2Lb are combined as the cutting position of the second cutting blade 463b. That is, in the cutting position setting step (step ST4), alignment between the street 101 to be cut and the reference lines 2La and 2Lb is executed. Here, since the cutting method in the present embodiment is a step cut, the cutting apparatus 1 sets the cutting position by aligning the reference lines 2La and 2Lb with the same street 101.

  Next, the cutting device 1 executes a cutting step (step ST5). The cutting apparatus 1 performs a cutting step to cut a plurality of streets 101 formed in a lattice shape on the surface of the wafer 10 as shown in FIG. A street 101 is a division planned line of the wafer 10. Devices 102 are formed in a plurality of regions partitioned by a plurality of streets 101. The device 102 is, for example, an IC or an LSI. Specifically, the cutting apparatus 1 moves the second cutting blade 463b to the cutting position set in the cutting position setting step (step ST4) by controlling the second index feeding means 43b. Next, the cutting apparatus 1 moves the second cutting blade 463b in the cutting feed direction (Z-axis direction) to a predetermined cutting depth by controlling the second cutting feed means 45b. Next, the cutting device 1 rotates the second cutting blade 463b at the second spindle rotation speed. Next, the cutting apparatus 1 cuts the street 101 by moving the chuck table 34 in the X-axis direction at a predetermined processing feed rate by controlling the processing feed means 36. Next, the cutting device 1 moves the second cutting blade 463b upward by a predetermined amount by controlling the second cutting feed means 45b, and controls the second indexing feeding means 43b to control the second cutting. The blade 463b is moved in the Y-axis direction by a distance corresponding to the street interval, and the second cutting blade 463b is moved by a predetermined amount in the direction opposite to the direction indicated by the arrow X shown in FIG. Let Next, the cutting device 1 moves the first cutting blade 463a to the cutting position set in the cutting position setting step (step ST4) by controlling the first index feeding means 43a. Next, the cutting device 1 controls the first cutting feed means 45a and the second cutting feed means 45b to cut and feed the first cutting blade 463a and the second cutting blade 463b to a predetermined cutting depth, respectively. Move in the direction (Z-axis direction). Next, the cutting device 1 rotates the first cutting blade 463a and the second cutting blade 463b, respectively, at the second spindle rotation speed. Next, the cutting device 1 cuts the wafer 10 by moving the chuck table 34 in the X-axis direction at a predetermined processing feed rate by controlling the processing feed means 36. Next, the cutting device 1 moves the first cutting blade 463a and the second cutting blade 463b upward by a predetermined amount by controlling the first cutting feed means 45a and the second cutting feed means 45b, respectively. Next, the cutting device 1 controls the first index feed means 43a and the second index feed means 43b to move the first cutting blade 463a and the second cutting blade 463b by a distance corresponding to the street interval. The first cutting blade 463a and the second cutting blade 463b are moved by a predetermined amount in the direction opposite to the direction indicated by the arrow X shown in FIG. 8 by moving in the Y-axis direction and controlling the machining feed means 36. The cutting apparatus 1 repeats the above-described cutting operation until the second cutting blade 463b finishes cutting the last street 101. The cutting device 1 ends the cutting operation of the second cutting blade 463b after the second cutting blade 463b cuts the last street 101. Next, the cutting device 1 moves the first cutting blade 463a upward by a predetermined amount by controlling the first cutting feed means 45a, and controls the first indexing feed means 43a to perform the first cutting. The blade 463a is moved in the Y-axis direction by a distance corresponding to the street interval, and by controlling the machining feed means 36, the first cutting blade 463a is moved by a predetermined amount in the direction opposite to the direction indicated by the arrow X shown in FIG. Let Next, the cutting apparatus 1 moves the first cutting blade 463a in the cutting feed direction (Z-axis direction) to a predetermined cutting depth by controlling the first cutting feed means 45a. Next, the cutting device 1 rotates the first cutting blade 463a at the second spindle rotation speed. Next, the cutting device 1 controls the machining feed means 36 to move the chuck table 34 in the X-axis direction at a predetermined machining feed speed to cut the last street 101. The cutting apparatus 1 complete | finishes a cutting step (step ST5), when cutting of all the streets 101 is completed.

  The cutting method according to the present embodiment includes a dressing step indicated by step ST1, a groove forming step indicated by step ST2, a reference distance registration step indicated by step ST3, and a cutting position indicated by step ST4. It includes a setting step and a cutting step shown in step ST5.

  In the cutting method according to the present embodiment, dressing is performed at the first spindle rotation speed that is a rotation speed suitable for sharpening in the dressing step (step ST1), and at the rotation speed at the time of cutting in the groove forming step (step ST2). The alignment grooves 1La and 1Lb are cut at a certain second spindle rotation speed, and alignment is executed with reference to the alignment grooves 1La and 1Lb in the reference distance registration step (step ST3). Accordingly, it is possible to remove the influence of the positional deviation due to the warping of the cutting blade caused by the difference in the spindle rotation speed, and it is possible to improve the alignment accuracy of the first cutting blade 463a and the second cutting blade 463b. . Here, in particular, in the step cut (in this embodiment), when the cutting position in the index feed direction is shifted, the first cutting blade protrudes from the groove formed by the second cutting blade, and the chip is chipped (chipped). Since it becomes easy to generate | occur | produce, an effect is high.

  Moreover, the cutting method according to the present embodiment executes a groove forming step (step ST2) after the dressing step (step ST1). As a result, the alignment grooves 1La and 1Lb can be cut in a state where the perfect circle alignment and the sharpening of the first cutting blade 463a and the second cutting blade 463b are completed, and for alignment by chipping or clogging. It can prevent that the cutting precision of groove | channel 1La and 1Lb falls.

  In the cutting method according to the present embodiment, the dressing step (step ST1) is executed before the groove forming step (step ST2). However, the dressing step (step ST1) is performed after the reference position registration step (step ST3). May be executed. Thus, the reference position is registered without being destroyed by the groove forming step (step ST2) in which the appropriate sharpening state of the cutting blade formed in the dressing step (step ST1) is processed at a rotational speed different from the rotational speed suitable for dressing. can do.

  In the cutting method according to the present embodiment, in the reference distance registration step (step ST3), the reference distance is corrected for any positioning groove 1La, 1Lb. It is preferable to correct the reference distance for the grooves 1La and 1Lb. This makes it possible to cut the alignment grooves 1La and 1Lb with a sufficiently dressed cutting blade, improve the cutting accuracy of the alignment grooves 1La and 1Lb, and accurately cut the position. By setting the reference lines 2La and 2Lb to the alignment grooves 1La and 1Lb, the reference distance setting accuracy can be further improved.

  In the cutting step (step ST5), the portion cut by the first cutting blade 463a is set as a step cut by the second cutting blade 463b again. However, the present invention is not limited to this. For example, the cutting method in the cutting step (step ST5) may be a single cut.

  Next, a cutting apparatus according to another embodiment will be described with reference to FIG. FIG. 8 is an enlarged view showing the periphery of a chuck table of a cutting apparatus according to another embodiment. Note that the cutting apparatus according to another embodiment includes a first dressing board 7a and a first dressing board chuck table 71a, a second dressing board 7b, and a second dressing board, instead of the above-described dressing board 7. The configuration is the same as that of the cutting apparatus 1 according to this embodiment except that the chuck table 71b is provided.

  The first dressing board 7a and the second dressing board 7b will be described with reference to FIG. The first dressing board 7a and the second dressing board 7b are plate-like members used for rounding out and sharpening the first cutting blade 463a and the second cutting blade 463b. The 1st dressing board 7a and the 2nd dressing board 7b are comprised from the binding material which couple | bonds an abrasive grain and this abrasive grain. The abrasive grains are, for example, diamond, CBN (cubic boron nitride), green carborundum, white alundum, and alundum. The binder is, for example, a vitrified bond, a metal bond, or a resin bond. The first dressing board 7a and the second dressing board 7b are placed on the first dressing board chuck table 71a and the second dressing board chuck table 71b, respectively.

  The first dressing board chuck table 71a and the second dressing board chuck table 71b are tables on which the first dressing board 7a and the second dressing board 7b are mounted, respectively. As shown in FIG. 8, the first dressing board chuck table 71a and the second dressing board chuck table 71b move in the processing feed direction (X-axis direction) together with the chuck table 34 at the corner of the upper surface of the cover table 35. It is possible to arrange. The first dressing board chuck table 71a and the second dressing board chuck table 71b are connected to suction means (not shown). The first dressing board chuck table 71a and the second dressing board chuck table 71b operate the suction means (not shown) to turn the first dressing board 7a and the second dressing board 7b into the first dressing board. The chuck table 71a and the second dressing board chuck table 71b are sucked and held respectively.

  When the cutting method of the present embodiment is executed using the cutting apparatus shown in FIG. 8, the cutting apparatus shown in FIG. 8 uses the first dressing board 7a and the second dressing board 7b in the dressing step (step ST1). In each of the cutting using the first cutting blade 463a and the second cutting blade 463b, and in the groove forming step (step ST2), the alignment groove 1La is formed on the first dressing board 7a and the second dressing board 7b. The cutting method is the same as that using the cutting apparatus 1 according to the present embodiment except that 1 Lb is cut.

  When performing the cutting method of this embodiment using the cutting device which concerns on other embodiment, the cutting device which concerns on other embodiment is 1st dressing board 7a and 2nd in a dressing step (step ST1). The dressing board 7b is cut using the first cutting blade 463a and the second cutting blade 463b, respectively, and is aligned with the first dressing board 7a and the second dressing board 7b in the groove forming step (step ST2). The grooves 1La and 1Lb are cut respectively. Thereby, even when the dressing board suitable for the sharpening of the first cutting blade 463a and the dressing board suitable for the sharpening of the second cutting blade 463b are different, it is possible to omit the replacement of the dressing board, and the dressing Can be shortened.

DESCRIPTION OF SYMBOLS 1 Cutting device 2 Static base 3 Chuck table mechanism 31 Guide rail 32 Moving base 33 Support member 34 Chuck table 341 Chuck table main body 342 Adsorption chuck 343 Clamp 35 Cover table 36 Work feed means 4 Cutting mechanism 41 Support base 411 Guide rail 42a First base portion 42b Second base portion 421a Guide rail 421b Guide rail 43a First index feed means 43b Second index feed means 44a First suspension bracket 44b Second suspension bracket 45a First cut feed means 45b First 2 cutting feed means 46a 1st cutting means 46b 2nd cutting means 461a 1st spindle housing 461b 2nd spindle housing 462a 1st rotating spindle 462b 2nd rotating spin 463a first cutting blade 463b second cutting blade 464a first flange member 464b second flange member 465a first imaging means 465b second imaging means 60 processing area 7 dressing board 7a first dressing board 7b Second dressing board 71a First dressing board chuck table 72b Second dressing board chuck table 8 Control means 10 Wafer 101 Street 102 Device 1La, 1Lb Alignment groove 2La, 2Lb Reference line

Claims (2)

  1. A chuck table for holding the workpiece, a cutting means for cutting the workpiece held on the chuck table by a cutting blade fixed to the tip of the spindle, and the chuck table and the cutting means in the axial direction of the spindle An imaging system for imaging a workpiece having an optical system in which a reference line for alignment of the cutting blade is formed in the X direction, and a moving means that relatively moves in the Y direction and the X direction orthogonal to the Y direction. A method of cutting a workpiece using a cutting device comprising: means and a control means for controlling each component;
    A dressing step of cutting the dressing board held on the chuck table at a first spindle rotation speed selected in advance as a dressing condition and dressing the cutting blade;
    Before or after the dressing step, one or more lines of the dressing board held on the chuck table are cut with the cutting blade at a second spindle rotational speed that is preselected as a condition for cutting the workpiece, and alignment is performed. A groove forming step for forming a groove for use;
    A reference distance registration step of aligning the reference line with the alignment groove and registering a distance between the alignment groove and the reference line;
    After the reference distance registration step, the workpiece is held on the chuck table, the reference line is aligned with the planned division line set on the workpiece, and the registered distance is corrected in the Y direction for cutting. A cutting position setting step for setting a position to be performed;
    After the cutting position setting step, a cutting step of cutting the workpiece along the planned dividing line at the second spindle rotation speed.
  2. The cutting apparatus includes a first cutting means and a second cutting means,
    The workpiece cutting method according to claim 1, wherein the first spindle rotation speed and the second spindle rotation speed are set in the first cutting means and the second cutting means, respectively.
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JP2016051222A JP6600267B2 (en) 2016-03-15 2016-03-15 Workpiece cutting method
TW106104793A TWI703025B (en) 2016-03-15 2017-02-14 Cutting method of processed objects
CN201710140304.1A CN107186891A (en) 2016-03-15 2017-03-10 The cutting process of machined object
KR1020170030446A KR20170107383A (en) 2016-03-15 2017-03-10 Workpiece cutting method

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JP4377702B2 (en) * 2004-01-08 2009-12-02 株式会社ディスコ Cutting groove measurement method
JP5134216B2 (en) * 2006-06-23 2013-01-30 株式会社ディスコ Wafer processing result management method
JP5128897B2 (en) * 2007-10-23 2013-01-23 株式会社ディスコ Wafer division method
JP5571331B2 (en) * 2009-07-07 2014-08-13 株式会社ディスコ Cutting equipment
JP5764031B2 (en) * 2011-10-06 2015-08-12 株式会社ディスコ Cutting equipment
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CN107186891A (en) 2017-09-22

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