CN108568915B - Cutting tool and mounting flange - Google Patents
Cutting tool and mounting flange Download PDFInfo
- Publication number
- CN108568915B CN108568915B CN201810178284.1A CN201810178284A CN108568915B CN 108568915 B CN108568915 B CN 108568915B CN 201810178284 A CN201810178284 A CN 201810178284A CN 108568915 B CN108568915 B CN 108568915B
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- cutting
- cutting tool
- cutting fluid
- mounting flange
- workpiece
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- 238000005520 cutting process Methods 0.000 title claims abstract description 249
- 239000002173 cutting fluid Substances 0.000 claims abstract description 137
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 238000004140 cleaning Methods 0.000 abstract description 22
- 239000007788 liquid Substances 0.000 abstract description 12
- 239000000356 contaminant Substances 0.000 description 13
- 238000002474 experimental method Methods 0.000 description 12
- 239000012530 fluid Substances 0.000 description 9
- 238000003754 machining Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 241001050985 Disco Species 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
Provided are a cutting tool and a mounting flange, which can save cleaning liquid for cleaning and improve the efficiency of cutting. The cutting tool is fixed to a tip of a spindle of a cutting device, and cuts a workpiece in a state where a cutting fluid is supplied thereto, and includes: a circular base having a wheel shaft portion formed on one surface side; and a cutting blade formed on an outer peripheral portion of a surface side of the circular base opposite to the one surface, wherein a cutting fluid returning portion is formed on the circular base along a circumferential direction. The mounting flange is configured to fix a cutting tool for cutting a workpiece in a state where the cutting fluid is supplied thereto, to a tip end of a spindle of the cutting device, and has a fixing nut for clamping and fixing the cutting tool together with a flange portion of a mounting flange main body, and the flange portion is formed with a cutting fluid returning portion along a circumferential direction on a back surface side of the support surface.
Description
Technical Field
The present invention relates to a cutting tool for cutting a workpiece in a state where a cutting fluid is supplied, and a mounting flange for fixing the cutting tool to a tip of a spindle.
Background
There is known a cutting apparatus for precisely cutting a workpiece such as a semiconductor wafer, a package substrate, a ceramic substrate, or a glass substrate with an annular cutting tool. In the cutting apparatus, the cutting tool is rotatably supported by the spindle. Then, the cutting tool is rotated by rotating the spindle, and the rotating cutting tool is caused to cut into the workpiece, thereby cutting the workpiece.
On the front surface of the workpiece, devices such as ICs and LSIs are formed in a plurality of regions defined by the planned dividing lines set in a grid pattern, for example. When the workpiece is cut along the planned dividing lines to divide the workpiece, a plurality of chips having devices (hereinafter, referred to as device chips) are formed.
In a cutting device used for machining a workpiece, a cutting fluid is supplied to a cutting tool when the cutting tool is caused to cut into the workpiece. The cutting tool performs cutting processing on the workpiece in a state where the cutting fluid is supplied.
In the cutting process of a workpiece, contaminants such as chips are generated, and when the contaminants adhere to the workpiece, various problems occur. For example, when contaminants adhere to a pad of a workpiece, poor soldering may occur. When the workpiece is an image sensor such as a CMOS sensor or a CCD sensor, if contaminants adhere to the sensor, a device failure may occur.
When the workpiece is dried after the cutting process, contaminants adhering to the workpiece during the cutting process are fixed, and it is difficult to remove the contaminants even after the cleaning. Therefore, a cutting apparatus has been proposed which supplies a cleaning liquid to a workpiece during cutting.
Patent document 1: japanese patent laid-open No. 2006-231474
Patent document 2: japanese laid-open patent publication No. 6-97278
However, in these cutting apparatuses, it is necessary to supply not only a cutting fluid for cutting a workpiece but also a cleaning fluid for cleaning the workpiece. Therefore, the following new problems arise: the amount of liquid supplied to the workpiece increases, and the processing cost increases.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a cutting tool and a mounting flange that suppress the amount of water used and prevent the sticking of contaminants.
According to one aspect of the present invention, there is provided a cutting tool fixed to a tip of a spindle of a cutting apparatus, for cutting a workpiece in a state where a cutting fluid is supplied thereto, the cutting tool including: a circular base having a fitting hole formed at the center thereof and a spindle portion formed on one surface side thereof; and a cutting blade formed on an outer peripheral portion of the circular base on a surface side opposite to the one surface, the circular base having a cutting fluid returning portion formed along a circumferential direction.
Further, according to another aspect of the present invention, there is provided a mounting flange for fixing a cutting tool, which cuts a workpiece in a state where a cutting fluid is supplied thereto, to a tip end of a spindle of a cutting apparatus, characterized in that the mounting flange has a mounting flange body and a fixing nut, wherein the mounting flange body has a hub portion and a flange portion, the hub portion is inserted into a fitting hole of the cutting tool, and a male screw formed at a front end thereof, the flange portion projecting in a radial direction from the boss portion and having a support surface for supporting the cutting tool, the fixing nut clamps and fixes the cutting tool together with the flange part, an internal thread screwed with the external thread of the hub part is formed on the inner circumference of the fixing nut, the flange portion has a cutting fluid returning portion formed along a circumferential direction on a back surface side of the support surface.
In the other aspect of the present invention, the cutting tool may be in a disk shape, the mounting flange may further include a front flange having a support surface that supports the cutting tool together with the mounting flange body, the fixing nut may clamp the cutting tool together with the flange portion via the front flange by fixing the front flange, and the cutting fluid returning portion may be formed in the front flange along a circumferential direction on a back surface side of the support surface.
While the cutting fluid is supplied to the cutting tool during the cutting process by the cutting tool, most of the supplied cutting fluid is scattered from the cutting edge of the cutting tool to the outside through the base or the mounting flange.
Therefore, in order to use the cutting fluid that is scattered to the outside for cleaning the workpiece, a cutting fluid returning portion is formed in the cutting insert and the mounting flange according to one embodiment of the present invention. The cutting fluid returning part is formed on a path for transmitting the cutting fluid supplied to the cutting tool to the outside, thereby preventing the cutting fluid reaching the cutting fluid returning part from being transmitted to the outside.
The cutting fluid reaching the cutting fluid returning section loses momentum and drops toward the workpiece. The cutting fluid falling on the processed object washes away the pollutants on the processed object, so that the cleaning fluid provided for cleaning the processed object can be saved. The workpiece can be cleaned using the cutting fluid scattered to the outside in the conventional structure, and therefore the efficiency of the cutting process is very good.
Thus, according to the present invention, a cutting tool and a mounting flange are provided that suppress the amount of water used and prevent sticking of contaminants.
Drawings
Fig. 1 is a perspective view schematically showing a cutting apparatus.
Fig. 2 is an exploded perspective view schematically showing the cutting unit.
Fig. 3 (a) is a side view schematically showing the cutting tool and the mounting flange, and fig. 3 (B) is a plan view schematically showing the flow of the cutting fluid in an enlarged manner.
Fig. 4 is an exploded perspective view schematically showing the cutting unit.
Fig. 5 (a) is a side view schematically showing the cutting tool and the mounting flange, and fig. 5 (B) is a plan view schematically showing the flow of the cutting fluid in an enlarged manner.
Fig. 6 is a side view schematically showing the cutting work.
Fig. 7 (a) is a side view schematically showing the cutting tool and the mounting flange, and fig. 7 (B) is a plan view schematically showing the flow of the cutting fluid in an enlarged manner.
Fig. 8 is a side view schematically showing the cutter cover.
Description of the reference symbols
1: a workpiece; 3: a frame; 5: a belt; 2: a cutting device; 4: a base station; 6: a holding table (holding unit); 6 a: a holding surface; 8. 8 a: a cutting unit; 10: an X-axis moving mechanism (moving means); 12: an X-axis guide rail; 14: an X-axis moving table; 16: an X-axis ball screw; 18: an X-axis pulse motor; 20: a support table; 22: a clamp; 24: a Y-axis moving mechanism (index feeding unit); 26: a Y-axis guide rail; 28: a Y-axis moving table; 28 a: a base; 28 b: a wall portion; 30: a Y-axis ball screw; 32: a Y-axis pulse motor; 34: a Z-axis moving mechanism; 36: a Z-axis guide rail; 38: a Z-axis moving table; 40: a Z-axis pulse motor; 42. 42a, 42b, 42 c: a cutting tool; 44: a cutter cover; 44 a: a cutting fluid supply nozzle; 44 b: a cutting fluid supply port; 46: a photographing device; 48a, 48 b: a round base station; 48 c: a fitting hole; 50: cutting edges; 52: a spindle housing; 54: a main shaft; 56a, 56b, 56 c: a mounting flange; 58a, 58b, 58 c: a mounting flange body; 60: fixing a nut; 62a, 62 c: a hub portion; 64a, 64b, 64 c: a flange portion; 66a, 66b, 66 c: a cutting fluid return stop section; 68: cutting fluid; 70a, 70 c: a main shaft mounting hole; 72: a bolt; 74: a front flange; 76: a protrusion.
Detailed Description
First, a cutting apparatus using the cutting insert and the mounting flange according to the present embodiment will be described with reference to fig. 1. Fig. 1 is a perspective view schematically showing an example of a cutting apparatus. As shown in fig. 1, the cutting apparatus 2 includes a base 4 that supports each component. A holding table (holding means) 6 is provided on the upper surface of the base 4, and a cutting means 8 is provided above the holding table 6.
An X-axis moving mechanism (moving means) 10 is provided below the holding table 6. The X-axis moving mechanism 10 includes a pair of X-axis guide rails 12 provided on the upper surface of the base 4 and parallel to the X-axis direction. An X-axis movement table 14 is slidably disposed on the X-axis guide rail 12.
A nut portion (not shown) is provided on the back surface side (lower surface side) of the X-axis moving table 14, and an X-axis ball screw 16 parallel to the X-axis guide rail 12 is screwed into the nut portion. An X-axis pulse motor 18 is connected to one end of the X-axis ball screw 16. When the X-axis ball screw 16 is rotated by the X-axis pulse motor 18, the X-axis moving table 14 moves in the X-axis direction along the X-axis guide rail 12.
A support table 20 is provided on the front side (upper surface side) of the X-axis moving table 14. A holding table 6 is disposed at the center of the support table 20. Four jigs 22 are provided around the holding table 6, and clamp and fix an annular frame (not shown) holding the workpiece from four sides.
The holding table 6 is coupled to a rotation mechanism (not shown) provided below the support table 20 and is rotatable about a rotation axis parallel to the Z axis. A porous member is disposed on the front surface of the holding table 6, and the porous member is connected to a suction source (not shown) through a suction passage (not shown) formed inside the holding table 6. The upper surface of the holding table is a holding surface 6a, and when negative pressure is applied from the suction source to the workpiece placed on the holding surface 6a, the workpiece is sucked and held on the holding table 6.
The object to be processed is, for example, a semiconductor wafer such as silicon or sapphire, or a substrate such as glass or quartz. On the front surface of the workpiece, devices such as ICs and LSIs are formed in a plurality of regions defined by the planned dividing lines set in a grid pattern, for example. Then, when the workpiece is cut along the planned dividing lines to divide the workpiece, the device chip is formed.
A Y-axis moving mechanism (index feeding unit) 24 for moving the cutting unit 8 in the index feeding direction (Y-axis direction) is provided adjacent to the X-axis moving mechanism 10. The Y-axis moving mechanism 24 includes a pair of Y-axis guide rails 26 provided on the upper surface of the base 4 and parallel to the Y-axis direction.
A Y-axis moving table 28 is slidably provided on the Y-axis guide rail 26. The Y-axis moving table 28 includes: a base 28a in contact with the Y-axis rail 26; and a wall portion 28b provided upright with respect to the base portion 28 a. A nut portion (not shown) is provided on the back surface side (lower surface side) of the base portion 28a of the Y-axis moving table 28, and a Y-axis ball screw 30 parallel to the Y-axis guide rail 26 is screwed into the nut portion.
A Y-axis pulse motor 32 is connected to one end of the Y-axis ball screw 30. When the Y-axis ball screw 30 is rotated by the Y-axis pulse motor 32, the Y-axis moving table 28 moves in the Y-axis direction along the Y-axis guide rail 26.
A Z-axis moving mechanism 34 for moving the tool unit 8 in the vertical direction (Z-axis direction) is provided on the wall portion 28b of the Y-axis moving table 28. The Z-axis moving mechanism 34 includes a pair of Z-axis guide rails 36 provided on the side surfaces of the wall portion 28b and parallel to the Z-axis direction.
A Z-axis moving table 38 is slidably provided on the Z-axis guide rail 36. A nut portion (not shown) is provided on the back surface side (wall portion 28b side) of the Z-axis moving table 38, and a Z-axis ball screw (not shown) parallel to the Z-axis guide rail 36 is screwed into the nut portion.
A Z-axis pulse motor 40 is connected to one end of the Z-axis ball screw. When the Z-axis ball screw is rotated by the Z-axis pulse motor 40, the Z-axis moving table 38 moves in the Z-axis direction along the Z-axis guide rail 36. A cutting unit 8 for cutting a workpiece is supported on the Z-axis moving table 38.
The cutting unit 8 has: a main shaft supported to be rotatable; and a cutting tool 42 rotated by the spindle. The cutting edge of the cutting insert 42 is formed by mixing abrasive grains such as diamond with a bonding material (binder) such as metal or resin. When the rotating cutting tool 42 is caused to cut into the workpiece held by the holding table 6, the workpiece can be cut.
The cutting unit 8 also has a tool cover 44 covering the cutting tool 42. The tool cover 44 will be described in detail with reference to fig. 6. Fig. 6 shows a side view of the cutting unit 8.
The tool cover 44 has: cutting fluid supply nozzles 44a adjacent to both side surfaces of the cutting tool 42 and formed with ejection ports facing the cutting tool 42; and cutting fluid ejection ports 44b adjacent in the outer circumferential direction of the cutting insert 42. The cutting fluid supply nozzle 44a and the cutting fluid discharge port 44b are connected to a cutting fluid supply source (not shown) via cutting fluid delivery tubes 44c and 44d, respectively. During cutting of the workpiece, the cutting fluid is supplied to the cutting tool 42 from the discharge port of the cutting fluid supply nozzle 44a and the cutting fluid discharge port 44 b. The cutting fluid is, for example, pure water.
Further, a spray nozzle (not shown) directed toward the workpiece is provided on the lower surface of the tool cover 44. During cutting of the workpiece, the cleaning liquid is discharged from the discharge nozzle toward the workpiece.
As shown in fig. 1, the cutting unit 8 includes an imaging device 46 at a position forward of the cutting tool 42 in a cutting direction (machining feed direction) in which the cutting process is performed. The imaging device 46 can image the front surface of the object to be machined, and the cutting tool 42 cuts the line to cut the object to be machined by using the imaging device 46 when adjusting the position of the cutting tool 42.
Next, the cutting unit will be described in detail. Fig. 2 is an exploded perspective view schematically showing an example of the cutting unit 8 a. In the cutting unit 8a shown in fig. 2, a wheel-type cutting tool 42a is mounted. The cutting tool 42a includes a circular abutment 48a and a cutting edge 50. The circular base 48a has a fitting hole 48c formed at the center thereof and a spindle portion formed on one surface side thereof. The cutting blade 50 is formed on the outer peripheral portion of the circular base 48a on the side opposite to the one surface.
The cutting unit 8a has a spindle housing 52. A main shaft 54 supported by an air bearing so as to be rotatable about the Y axis is housed in the main shaft housing 52. A screw hole is formed at the tip of the spindle 54, and is threaded in a tightening direction by rotating the spindle 54 in the rotation direction during cutting. A mounting flange 56a is attached to the front end of the main shaft 54.
The mounting flange 56a has: mounting flange body 58 a; and a fixing nut 60 that clamps and fixes the cutting insert 42a between the mounting flange main body 58a and the fixing nut. The mounting flange main body 58a has: a boss portion 62a inserted through the fitting hole 48c of the cutting insert 42 a; and a flange portion 64a projecting in the radial direction from the boss portion 62a, the flange portion 64a having a support surface for supporting the cutting tool 42 a. A male screw is formed at the front end of the boss portion 62 a. The fixing nut 60 has an internal thread formed on its inner periphery to be screwed with the external thread of the boss portion 62 a.
The boss portion 62a and the flange portion 64a are disposed so that their central axes overlap. That is, an axis connecting the centers of the two bottom surfaces of the cylindrical boss portion 62a and an axis connecting the centers of the two circular surfaces of the disc-shaped flange portion 64a are superposed on each other to form a straight line.
A spindle mounting hole 70a is formed inside the mounting flange 56 a. The spindle attachment hole 70a is formed in a shape corresponding to the tip of the spindle 54 such that the center axis coincides with the rotation center of the spindle 54 when the spindle 54 is attached to the spindle attachment hole 70 a. The main shaft attachment hole 70a has an opening on the hub portion 62a side, and a bolt 72 can be screwed into a screw hole at the tip end of the main shaft 54 inserted into the main shaft attachment hole 70a through the opening.
Fig. 3 (a) shows the cutting tool 42a attached to the spindle 54 using the attachment flange 56 a. Fig. 3 (a) is a side view schematically showing the cutting tool 42a and the mounting flange 56 a. In the mounting flange 56a of the present embodiment, a cutting fluid returning portion 66a is formed in the flange portion 64a along the circumferential direction on the back side of the support surface that supports the cutting insert 42 a. Further, the circular base 48a of the cutting insert 42a of the present embodiment is formed with a cutting fluid returning portion 66b along the circumferential direction.
The function of the cutting fluid returning sections 66a and 66B will be described with reference to fig. 3 (B). Fig. 3 (B) is an enlarged schematic plan view illustrating the flow of the cutting fluid supplied from the cutting fluid outlet 44B of the tool cover 44 to the cutting tool 42 a.
As shown in fig. 3 (B), a part of the supplied cutting fluid 68 reaches the flange portion 64a of the mounting flange 56a along the cutting tool 42a after being supplied to the cutting edge 50 of the cutting tool 42 a. Here, the flange portion 64a is formed with a cutting fluid returning portion 66 a. Therefore, the cutting fluid 68 is blocked by the cutting fluid blocking portion 66a, and therefore is less likely to be further transferred outward, and falls off without losing momentum.
As shown in fig. 3 (B), a part of the supplied cutting fluid 68 reaches the circular base 48a of the cutting tool 42a after being supplied to the cutting edge 50 of the cutting tool 42 a. Here, the circular base 48a is formed with a cutting fluid returning portion 66 b. Therefore, the cutting fluid 68 is blocked by the cutting fluid blocking portion 66a, and is not easily transferred to the outside, and falls off without losing momentum.
The cutting fluid 68 that has lost momentum and has fallen down reaches the workpiece held by the holding table 6. Then, the cutting fluid 68 washes the workpiece to wash away contaminants. Therefore, the cleaning liquid supplied to the workpiece for cleaning can be saved. Since the workpiece can be cleaned using the conventionally scattered cutting fluid, the efficiency of the cutting process is very good.
For example, if the cutting fluid returning part is not formed on the mounting flange and the cutting fluid returning part is not formed on the circular base of the cutting tool, the cutting fluid is scattered to the outside of the cutting unit without losing momentum. A conventional cutting tool and a mounting flange will be described with reference to fig. 7. Fig. 7 (a) is a side view schematically showing the cutting tool and the mounting flange, and fig. 7 (B) is a plan view schematically showing the flow of the cutting fluid in an enlarged manner.
The conventional cutting insert 42b and the conventional mounting flange 56b shown in fig. 7 (a) are not provided with a cutting fluid returning portion. Therefore, as shown in fig. 7 (B), a part of the cutting fluid 68 supplied from the cutting fluid discharge port 44B to the cutting insert 42B is supplied to the cutting edge 50 of the cutting insert 42B, and then is scattered to the outside along the cutting insert 42B, the mounting flange 56B, and the spindle 54. The other part of the cutting fluid 68 is scattered to the outside along the cutting tool 42b, the circular base 48b, and the fixing nut 60.
The cutting fluid scattered to the outside does not wash the workpiece and does not wash away contaminants. Therefore, when the conventional cutting tool 42b and the conventional mounting flange 56b are used, a large amount of cleaning liquid must be supplied to the workpiece in order to wash away contaminants generated during the cutting process. On the other hand, since the cutting tool of the present embodiment and the mounting flange of the present embodiment are provided with the cutting fluid returning part, and the workpiece can be cleaned using the conventionally scattered cutting fluid, the cleaning fluid can be saved, and the cutting efficiency is very good.
Another configuration example of the cutting insert and the mounting flange according to the present embodiment will be described with reference to fig. 4 and 5. Note that the same structure as the cutting unit 8a is not described. A disk-shaped cutting insert 42c having a fitting hole formed in the center thereof is attached to the cutting unit 8c shown in fig. 4 and 5. The cutting tool 42c is, for example, a washer-type or a kimberly-type cutting tool. The outer periphery of the cutting insert 42c serves as a cutting edge.
In the cutting unit 8c, a mounting flange 56c is attached to the tip of the spindle 54. The mounting flange 56c has: a mounting flange main body 58 c; a front flange 74 having a support surface for supporting the cutting insert 42c between the mounting flange main body 58 c; and a fixing nut 60 that fixes the front flange 74. The fixing nut 60 fixes the front flange 74, and supports the cutting tool 42c together with the flange portion 64c of the mounting flange main body 58c via the front flange 74.
Fig. 5 (a) shows the cutting tool 42c attached to the spindle 54 using the attachment flange 56 c. Fig. 5 (a) is a side view schematically showing the cutting tool 42c and the mounting flange 56 c. In the mounting flange 56c of the present embodiment, a cutting fluid returning portion 66c is formed in the front flange 74 along the circumferential direction on the back side of the support surface that supports the cutting insert 42 c.
The function of the cutting fluid returning section 66c will be described with reference to fig. 5 (B). Fig. 5 (B) is an enlarged and schematic plan view illustrating the flow of the cutting fluid 68 supplied from the cutting fluid outlet port 44B of the tool cover 44 to the cutting tool 42 c.
As shown in fig. 5 (B), a part of the supplied cutting fluid 68 reaches the front flange 74 of the mounting flange 56c after being supplied to the cutting tool 42 c. Here, the cutting fluid returning portion 66c is formed in the front flange 74. Therefore, the cutting fluid 68 is blocked by the cutting fluid blocking portion 66c, and therefore is less likely to be further transferred outward, and thus the cutting fluid loses momentum and drops down toward the workpiece, thereby cleaning the workpiece to remove contaminants. Therefore, the cleaning liquid supplied to the workpiece can be saved.
The cutting fluid returning parts 66a, 66b, and 66c formed in the cutting insert and the mounting flange according to the present embodiment are, for example, annular grooves having a depth of 2mm and a width of 2 mm. However, the cutting fluid returning sections 66a, 66b, and 66c are not limited thereto.
Next, the cutting of a workpiece using the cutting unit to which the cutting tool or the mounting flange of the present embodiment is mounted will be described. The cutting process is performed by the cutting device 2. This cutting method will be described with reference to fig. 6. Fig. 6 is a partial sectional view schematically illustrating the cutting method.
The object 1 to be processed is, for example, a disc-shaped semiconductor wafer bonded to a belt 5 stretched by a frame 3. First, the workpiece 1 is placed on the holding surface 6a of the holding table 6 via the belt 5, and the frame 5 is fixed by the jig 22. Next, the suction source inside the holding table 6 is operated to suck the workpiece 1 through the suction passage inside the holding table 6, thereby fixing the workpiece 1 to the holding table 6.
Next, the X-axis moving mechanism (moving means) 10 and the Y-axis moving mechanism (indexing unit) 24 are operated to position the cutting unit 8 at a predetermined position so that the cutting tool 42 is positioned above and outside one end of the line to cut of the object 1. Then, the rotation of the cutting insert 42 is started, and the cutting fluid is supplied to the cutting insert 42. The cutting fluid is supplied to the cutting tool 42 from the cutting fluid supply nozzle 44a and the cutting fluid ejection port 44 b.
Then, the cutting unit 8 is lowered to position the cutting tool 42 at a predetermined height position. Then, the X-axis moving mechanism of the cutting device 2 is operated to perform machining feed on the workpiece 1. When the rotating cutting tool 42 comes into contact with the workpiece 1, cutting is started.
At this time, the cutting fluid supplied from the cutting fluid discharge port 44b to the cutting tool 42 is transmitted to the cutting tool 42 and the mounting flange, but the cutting fluid reaching the cutting fluid returning portion formed on the circular base and the mounting flange of the cutting tool is returned to lose momentum. Then, the cutting fluid drops toward the workpiece 1, and washes away contaminants such as chips generated during the cutting of the workpiece 1. Therefore, the cleaning liquid for cleaning the workpiece 1 can be saved, and the efficiency of the cutting process can be improved.
Then, when the cutting process by the cutting tool 42 advances and the object 1 is divided along all the lines to be divided, for example, the respective device chips are formed.
In the cutting device using the cutting insert and the mounting flange of the present embodiment, a protrusion may be provided adjacent to the cutting fluid supply port 44b of the insert cover 44. The protruding portion is disposed before the portion where the cutting fluid discharged from the cutting fluid discharge port 44b reaches the cutting tool 42 in the rotational direction of the cutting tool 42. That is, the projections are adjacent to each other in the opposite direction of the rotation direction of the cutting tool 42 from the cutting fluid ejection port 44 b.
During the cutting process by the cutting tool 42, the cutting fluid is supplied from the cutting fluid ejection port 44b to the cutting tool 42. It is also desirable to appropriately supply the cutting fluid to a machining point where the cutting tool 42 contacts the workpiece.
However, a part of the cutting fluid supplied to the cutting insert 42 rotates to the outer periphery of the cutting insert 42 as the cutting insert 42 rotates. If the servo rotary fluid rotating in accordance with the cutting tool 42 exists in the outer peripheral portion of the cutting tool 42, the cutting fluid newly supplied from the cutting fluid discharge port 44b is blocked by the servo rotary fluid, and the cutting fluid cannot be supplied to the machining point as expected.
Therefore, the tool cover 44 is provided with a protruding portion at a position before the cutting tool 42 reaches the cutting tool 42 from the cutting fluid discharged from the cutting fluid discharge port 44b in the rotation direction. Fig. 8 shows a tool cover 44 having such a protrusion. Fig. 8 is a side view schematically showing the cutter cover 44 having the projection 76. As shown in fig. 8, for example, a projection 76 is provided adjacent to the cutting fluid supply port 44b of the tool cover 44.
Then, a part of the follower rotary fluid of the cutting tool 42 collides with the protrusion 76 and is separated from the cutting tool 42. That is, the protrusion 76 prevents further follow-up rotation of a part of the cutting fluid that rotates with the cutting insert 42.
When the amount of the follow-up rotation fluid of the cutting tool 42 can be reduced, the cutting fluid newly supplied from the cutting fluid ejection port 44b is less likely to be disturbed. Therefore, the cutting fluid can be appropriately supplied to the machining point, and the cutting fluid does not need to be supplied excessively. Therefore, the cutting apparatus 2 can further save the liquid used.
Examples
Next, an experiment for confirming the operation and effect of the cutting insert and the mounting flange according to one embodiment of the present invention will be described. In the present embodiment, the workpiece is cut by a cutting device having the cutting tool and the mounting flange, and the number of the deposits is measured by observing the cut workpiece.
The outline of the experiment will be described. The cutting device used in this experiment was "DFD 6362" manufactured by Disco, Inc., and the cutting tool attached to the cutting device was "ZH 05-SD2000-N1-110GF (HEGF 1010)" manufactured by Disco, Inc. A cutting fluid returning part is formed on a mounting flange for mounting the cutting tool and a circular base of the cutting tool.
The workpiece used in this experiment was an 8-inch diameter Si wafer with a thickness of 0.73 mm. In this experiment, a tape "D-650" manufactured by neiderian corporation was attached to the front side of the workpiece, and the workpiece was placed on the holding table of the cutting apparatus so that the front side of the workpiece was exposed to the rear side of the workpiece. Then, the workpiece is sucked and held on the holding table through the belt. In addition, a resin film is formed on the back side of the workpiece in order to facilitate measurement of the deposit on the workpiece.
Regarding the conditions of the cutting process, the rotation speed of the spindle was 40000rpm, the processing feed speed of the workpiece was 30mm/s, and the distance (tool height) between the lowest point of the cutting tool and the upper surface of the holding table was 0.07 mm. The index feed amount (index dimension) of the cutting insert was 5mm in a first direction and 5mm in a second direction perpendicular to the first direction.
The amount of cutting water supplied from the discharge port provided in the cutting fluid supply nozzle 44a (see fig. 1, 6, 8, etc.) was 1.5L/min, and the amount of cutting water supplied from the cutting fluid discharge port 44b (see fig. 6, 8, etc.) was 1.0L/min. The cleaning liquid is discharged to the workpiece from a discharge nozzle (not shown) provided on the lower surface of the tool cover. The amount of the washing solution was set to 1.0L/min.
Under these conditions, the workpiece was cut in a lattice pattern of 5mm × 5 mm. Each region divided by the cutting groove formed by the cutting process was regarded as one chip, and the number of deposits was measured in arbitrary 9 chips. For measurement of the deposit, a microscope "MF-UA 1020 THD" manufactured by Sanfeng corporation and a particle counter measurement software "FV-PIXELLENCE ENG/3310/STD" were used.
In each chip, the number of deposits having a size of 1 μm or more in a visual field of 200 times magnification observed with a microscope was measured at five positions, four corners and the center. Then, the average value of the number of attached matters measured in the total of 45 measurements was calculated. This experiment was designated as "example 1".
As shown in fig. 8, the workpiece is similarly cut by the cutting device to which the tool cover 44 having the protrusion 76 provided adjacent to the cutting fluid supply port 44b is attached, and the number of the deposits adhering to the workpiece is similarly measured. This experiment was designated as "example 2". In addition, in experiment "example 2", a mounting flange formed with a cutting fluid returning portion and a circular base of the cutting tool were also used.
Further, the cutting device having the tool cover 44 with the protrusion 76 provided adjacent to the cutting fluid supply port 44b was used to cut the workpiece so that the amounts of the cutting fluid and the cleaning fluid supplied were reduced to about 70% as described above, and the number of the deposits was measured. This experiment was designated as "example 3". In addition, in experiment "example 3", a circular base on which a mounting flange of a cutting fluid returning portion and the cutting tool were formed was also used.
For comparison, the number of deposits was measured similarly for a workpiece on which the cutting fluid returning portion was not formed on the circular base on which the flange and the cutting tool were mounted and which was subjected to the same cutting process without providing the protruding portion on the tool cover. This experiment was referred to as "comparative example".
The results of measurement of the attached matter will be described. In the comparative example, the average number of adhering substances was 418; in example 1, the average number of attached matter was 295; in example 2, the average number of attachments was 64; in example 3, the average number of deposits was 26.
When the results of the comparative example and the results of example 1 are compared, it is understood that the formation of the cutting fluid returning part in the mounting flange for mounting the cutting tool and the circular base of the cutting tool can significantly reduce the deposit on the workpiece. It is found that the effect of the cutting fluid on cleaning the workpiece is increased by forming the cutting fluid returning part.
When the results of example 1 and the results of example 2 are compared, it is understood that the attachment of the workpiece can be significantly reduced by providing the protruding portion 76 (see fig. 8) in the tool cover 44. The following teaching is given: by preventing the follow-up rotation of the follow-up rotation fluid on the outer periphery of the cutting tool by the protruding portion 76, the cutting fluid can be appropriately supplied to the workpiece, and the cutting chips and the like can be removed before the cutting chips and the like adhere to the workpiece.
When the results of the comparative example and the results of example 3 are compared, it is understood that, when the cutting fluid returning part is provided on the mounting flange and the circular base of the cutting tool and the protruding part 76 (see fig. 8) is provided on the tool cover 44, the amount of the supplied cutting fluid or the like is saved and the amount of the deposits is not increased.
It was confirmed by the above experiment that: when the cutting fluid is dropped onto the workpiece in one embodiment of the present invention, the workpiece is cleaned by the cutting fluid, and therefore, a liquid such as a cleaning liquid supplied to the workpiece can be saved.
The present invention is not limited to the above embodiments, and various modifications can be made. For example, in the above embodiment, the cutting fluid returning portions are formed on the circular base and the mounting flange of the cutting tool, but the cutting fluid returning portions may be formed along the outer peripheries of the fixing nut 60 and the spindle 54. Further, the cutting fluid returning portion may be formed only on one of the circular base and the mounting flange of the cutting tool.
In addition, the structure, method, and the like of the above embodiments may be modified and implemented as appropriate without departing from the scope of the object of the present invention.
Claims (3)
1. A cutting tool which is fixed to the tip of a spindle of a cutting device using a mounting flange having a flange portion with a support surface for supporting the cutting tool, and which cuts a workpiece in a state where a cutting fluid is supplied thereto,
a first cutting fluid returning portion formed in the flange portion along a circumferential direction on a back surface side of the support surface that supports the cutting tool;
the cutting tool comprises:
a circular base having a fitting hole formed at the center thereof, a wheel shaft portion formed on a first surface side, and a large diameter portion formed on a second surface side; and
a cutting blade formed on an outer peripheral portion of the large diameter portion on a second surface side of the circular base opposite to the first surface,
a second cutting fluid returning part is formed on the circular base at a position closer to the first surface side than the large diameter part along the circumferential direction,
the first cutting fluid return stopping portion and the second cutting fluid return stopping portion located on both sides of the cutting edge have different radial distances from the outer peripheral surface of the cutting edge in the radial direction of the cutting edge and different axial distances from the side surface of the cutting edge in the axial direction of the cutting edge.
2. A mounting flange for fixing a cutting tool, which cuts a workpiece in a state where a cutting fluid is supplied thereto, to a tip end of a spindle of a cutting apparatus,
the mounting flange has a mounting flange body, a front flange, and a retaining nut, wherein,
the mounting flange body has a boss portion inserted into a fitting hole of a cutting tool and having a male screw formed at a tip end thereof, and a flange portion projecting in a radial direction from the boss portion and having a first support surface for supporting the cutting tool,
the front flange has a second support surface that supports the cutting tool with the mounting flange body,
the fixing nut is fixed by fixing the front flange and clamping and fixing the cutting tool together with the flange part through the front flange, an internal thread screwed with the external thread of the hub part is formed on the inner circumference of the fixing nut,
a first cutting fluid returning portion is formed on the flange portion along the circumferential direction on the back side of the first supporting surface,
a second cutting fluid returning part is formed on the front flange along the circumferential direction on the back side of the second support surface,
the first and second cutting fluid return portions located on both sides of the cutting tool have different radial distances from the outer peripheral surface of the cutting tool in the radial direction of the cutting tool and different axial distances from the side surface of the cutting tool in the axial direction of the cutting tool.
3. The mounting flange of claim 2,
the cutting tool is disc-shaped.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017045019A JP6896327B2 (en) | 2017-03-09 | 2017-03-09 | Cutting blade, mount flange |
| JP2017-045019 | 2017-03-09 |
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| Publication Number | Publication Date |
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| CN108568915A CN108568915A (en) | 2018-09-25 |
| CN108568915B true CN108568915B (en) | 2021-12-21 |
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| CN201810178284.1A Active CN108568915B (en) | 2017-03-09 | 2018-03-05 | Cutting tool and mounting flange |
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| JP (1) | JP6896327B2 (en) |
| KR (1) | KR102394673B1 (en) |
| CN (1) | CN108568915B (en) |
| TW (1) | TWI760433B (en) |
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| JP2022120278A (en) | 2021-02-05 | 2022-08-18 | 株式会社ディスコ | Blade fixture and blade mounter |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201841713A (en) | 2018-12-01 |
| CN108568915A (en) | 2018-09-25 |
| JP2018148177A (en) | 2018-09-20 |
| TWI760433B (en) | 2022-04-11 |
| JP6896327B2 (en) | 2021-06-30 |
| KR20180103768A (en) | 2018-09-19 |
| KR102394673B1 (en) | 2022-05-09 |
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