JPH0697278A - Contaminant preventing dicing device - Google Patents

Abstract

PURPOSE:To provide a dicing device where cleaning water of high pressure is spouted out from the tip of a cleaning nozzle to surely remove contaminants from the surface of a wafer and also from the inside of a gouged groove. CONSTITUTION:A cleaning nozzle 2 facing down is provided to the center of one side of a wheel cover 1, and a cooling water nozzle 3 is mounted in front of the cleaning nozzle 2 as tilted. The cleaning nozzle 2 is set separate from the surface of a semiconductor wafer 5 fixed to a chuck table 4 by a height, H of 20mm. The feed pressure of cleaning water 6 spouted out from a cleaning nozzle is set to a pressure of 30 to 300kg/cm<2>. By this setup, as cleaning water of high pressure is spouted out from a cleaning nozzle arranged adjacent to the surface of the wafer 5, contaminants on the surface of a wafer are surely removed by flushing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing device which prevents contamination from adhering to a bonding pad or the like.

[0002]

2. Description of the Related Art Conventionally, in a dicing apparatus for cutting a work such as a semiconductor wafer, a cooling nozzle b for cooling a rotary blade a as shown in FIGS. 5 and 6, for example.
Is provided close to the lower part of the rotary blade a, sprays cooling water c at the time of cutting, and a cleaning nozzle d for cleaning the surface of the wafer slightly above the side part of the rotary blade a.
Is provided so that the cleaning water e is sprayed in a substantially fan shape so that contaminants such as chips are washed off from the surface of the wafer f.

[0003]

In the case of the above conventional example, the cooling water c has a water pressure of about 3 kg / cm ² and a flow rate of about 0.7 when cutting.
It is jetted from the cooling nozzle b at 5 l / min, and the washing water e is jetted from the washing nozzle d at a water pressure of about 3 kg / cm ² and a flow rate of about 1.5 l / min. As shown in FIG. 7, the phenomenon of adhesion of contamination A was observed on the entire surface of the wafer f, and as shown in FIG. 8, the phenomenon of contamination being raised from the kerf g and adhering to the surface B was observed. The present invention has been made to solve such conventional problems, and provides a dicing device capable of surely removing contaminants from the surface of a wafer and also capable of reliably removing contaminants inside a kerf. Is the subject.

[0004]

As a means for technically solving the above-mentioned problems, the present invention provides a dicing apparatus for cutting a work such as a semiconductor wafer, in which the blade cooling nozzle for cooling the blade. A cleaning nozzle for cleaning the wafer surface is mounted outside the wafer, and the tip of this cleaning nozzle is 20 m from the wafer surface.
m or less and the supply pressure of washing water is 30 kg
/ Cm ^{2 to} 300 kg / cm ² is set as the gist.

[0005]

[Operation] By injecting cleaning water with strong water pressure from the tip of the cleaning nozzle located close to the wafer surface, the contamination on the wafer surface can be surely washed away.
Contamination inside the kerf can also be expelled by the cooling water sprayed from the cooling nozzle.

[0006]

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 1 denotes a wheel cover provided in a dicing cutting part, and a cleaning nozzle 2 is provided downward at a central portion of one side surface thereof, and a cooling water nozzle 3 is obliquely attached to a front portion thereof. There is.

The tip of the cleaning nozzle 2 is a chuck.
Surface of semiconductor wafer 5 mounted and fixed on table 4
The height H from is set to 20 mm or less and
The supply pressure of the cleaning water 6 sprayed from the cleaning nozzle is 30 kg
/ Cm² ~ 300kg / cm ² Is set to.

The cooling water nozzle 3 is attached so as to be inclined such that an angle θ ₁ formed by the axial direction and the horizontal is 10 ° to 60 °, and the cooling water 7 jetted from the cooling water nozzle is attached. Radiation angle (opening angle) θ ₂ is 7 ° to 10 °
The flow rate is set to 0.5 l / min to 2.0 l / min.

Reference numeral 8 is a rotary blade, and a spindle 10 held in a spindle housing 9 as shown in FIG.
The wheel cover 1 is attached to the tip of the wheel cover 1 so that the upper half of the wheel cover 1 is covered.

The dicing apparatus according to the present invention is constructed as described above, and the semiconductor wafer 5 mounted and fixed on the chuck table 4 is diced by the rotary blade 8. During this cutting, the cooling water nozzle 3 to the cooling water 7 are used. And the cleaning water 2 is sprayed from the cleaning nozzle 2.

Cooling water 7 jetted from the cooling water nozzle 3
Is sprayed from the front of the rotary blade 8 toward the cutting portion so as to be evenly applied to both side surfaces thereof, so that the blade portion of the rotary blade can be cooled, and moreover it bounces vigorously along the cutting line, so It is possible to expel mixed contaminants that have entered the groove 5a.

On the other hand, the cleaning water 6 jetted vigorously from the cleaning nozzle 2 bounces off at the center of the surface of the semiconductor wafer 5 and flows rapidly toward the periphery, so that it is expelled from the contaminants and kerfs adhering to the surface. The contaminants and the like can be reliably washed off the surface of the semiconductor wafer 5.

When the semiconductor wafer after dicing is observed with a microscope, no contamination is observed over the entire surface of the semiconductor wafer 5 as shown in FIG. 3 and the vicinity of the kerf 5a is also shown as shown in FIG. It was clean, and there was no phenomenon of contamination rising and attaching to the surface as in the past.

[0014]

As described above, according to the present invention,
In the dicing machine, by injecting cleaning water with strong water pressure from the tip of the cleaning nozzle located near the surface of the wafer, the contamination on the wafer surface can be surely washed out, and the cutting water is sprayed from the cooling nozzle. It has excellent effects such as being able to drive out internal contamination.

[Brief description of drawings]

FIG. 1 is a front view of a main part of a dicing device according to the present invention.

FIG. 2 is a side view of the same.

FIG. 3 is a state diagram of a part of the surface of a semiconductor wafer as seen with a microscope after dicing.

FIG. 4 is a state diagram of the vicinity of a kerf as seen with a microscope.

FIG. 5 is a front view of a main part of a conventional example.

FIG. 6 is a partially cutaway side view of the same.

FIG. 7 is a state view of a part of the surface of a semiconductor wafer as observed with a microscope after dicing in a conventional example.

FIG. 8 is a state diagram of the vicinity of the kerf as seen with a microscope.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Wheel cover 2 ... Cleaning nozzle 3 ... Cooling water nozzle 4 ... Chuck table 5 ... Semiconductor wafer 5a ... Cut groove 6 ... Cleaning water 7 ... Cooling water
8 ... Rotating blade 9 ... Spindle housing 1
0 ... Spindle

Claims (1)

[Claims] 1. A dicing apparatus for cutting a work such as a semiconductor wafer, wherein the dicing apparatus is equipped with a cleaning nozzle for cleaning the wafer surface, in addition to a blade cooling nozzle for cooling the blade. The tip is set to 20 mm or less from the wafer surface, and the supply pressure of cleaning water is 30 kg / cm ^{2 to} 300 k.
A dicing device which prevents contamination from adhering, which is set to g / cm ² .