JPH10308366A - Exhaust duct of cutting device and dicing device provided with exhaust duct - Google Patents

Abstract

PROBLEM TO BE SOLVED: To utilize high-presure air as a negative pressure without providing a new exhaust device and to raise the exhaust efficiency of a cutting device by a method wherein a high-pressure air circulating path in the exhaust direction of the air is coupled with an exhaust path for exhausting an atomized cutting fluid in such a way that the circulating path is tilted relatively to the exhaust path. SOLUTION: An exhaust duct 10 is constituted of an exhaust path 11 communicating with an exhaust vent 31 in a dicing room 25 and a high-pressure air circulating path 12 coupled with this path 11 in such a way that the path 12 is tilted at a prescribed angle to the path 11. When a dicing is conducted in a semiconductor wafer 23 by a cutting means 28, a atomized cutting fluid mixed with cutting powder generated by the cutting is sucked in the path 11 through the vent 31 by a negative pressure P1 which is generated from an exhaust means 33. An exhaust pressure P2 from a spindle air exhaust part 13 and an exhaust pressure P3 from a sucked air exhaust part 14 are both fed to the point of the path 12. These exhaust pressure P2 and P3 are mixed with the negative pressure P1 to become a strong negative pressure and the suction force of the atomized cutting liquid in the vent 31 is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust duct for exhausting mist-like cutting fluid mixed with cutting powder, which is generated when a workpiece is cut in a cutting device.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust duct of a cutting device that uses a high-pressure air used and used in the cutting device to efficiently discharge mist-like cutting fluid.

[0002]

2. Description of the Related Art As a cutting device for cutting a workpiece, for example, there is a dicing device 40 for dicing a semiconductor wafer or the like shown in FIG. In the dicing apparatus 40, the semiconductor wafer 23 held on the frame 21 is placed on the chuck table 24, and is suction-held by the negative pressure generated by the negative pressure generating component 29 provided below the chuck table 24. .

After the alignment of the cutting position is performed, the chuck table 24 is provided with cutting means 28 including a rotary blade 27, and is supplied with a cutting liquid in a dicing room 25 covered with a transparent cover. Under
The street of the semiconductor wafer 23 is cut by the rotating blade 27, and dicing is performed.

[0004] When the semiconductor wafer 23 is diced in this manner, cutting powder is generated.
The dicing room 25 is filled with the mist-like cutting fluid.

The cutting powder generated and scattered by dicing adheres to each part in the dicing room 25 and contaminates the adhered part, and the mist-like cutting fluid impairs visibility from the outside. May adversely affect the cutting operation. Therefore, in order to avoid such an adverse effect, the inside of the dicing device 40 is usually used to discharge the mist-like cutting fluid mixed with the cutting powder to the outside through the exhaust port 31 provided in the dicing room 25. Exhaust duct is provided.

As an exhaust duct provided in the dicing apparatus 40, an exhaust duct 50 shown in FIG. 3 is well known as a conventional example. This exhaust duct 50 is used for the dicing device 40.
When viewed from the front side of the dicing room 25, it is disposed further from the exhaust port 31 provided on the rear side of the dicing room 25 to the rear side, and is connected to exhaust means 51 provided outside the dicing apparatus 40.

In the middle of this duct, a cutting means 2 is provided.
The spindle air discharge unit 52 for exhausting the used high-pressure air supplied to the air spindle 30 constituting the unit 8 and the used high-pressure air supplied to the negative pressure generating component 29 for sucking the chuck table 24 are exhausted. And a suction air discharge section 53 to be connected from the side of the hose. In this manner, the exhaust from the air spindle 30 and the exhaust from the negative pressure generating component 29 are
The gas is collected in the inside of the dicing device 40 by the exhaust means 51.

[0008]

However, since the spindle air discharge section 52 and the suction air discharge section 53 are both connected substantially perpendicularly to the side surface of the exhaust duct 50, the exhaust pressure P5 and the exhaust pressure P6 are reduced. This is one factor that causes a pressure loss of the negative pressure P4 in the exhaust duct 50 generated by the exhaust unit 51. As described above, when a loss occurs in the negative pressure in the exhaust duct, it becomes impossible to completely discharge the cutting powder and the mist-like cutting fluid generated during cutting to the outside.

Therefore, the exhaust duct of the conventional cutting device is
There is a problem to be solved in that the mist-like cutting fluid generated at the time of cutting the workpiece is efficiently exhausted without causing a loss in the negative pressure in the exhaust duct.

[0010]

As a specific means for solving the above-mentioned problems, the present invention is provided in a cutting apparatus for cutting a workpiece, and the workpiece is cut by the cutting means while supplying a cutting fluid. An exhaust duct of a cutting device for exhausting the cutting fluid atomized by the cutting from the cutting region, the exhaust passage including an exhaust port for exhausting the atomized cutting fluid, It is an object of the present invention to provide an exhaust duct of a cutting device including at least a high-pressure air circulation path which is connected to an exhaust path at an angle relative to the exhaust path and circulates high-pressure air used in the cutting apparatus in an exhaust direction.

As described above, since the high-pressure air circulation path is connected to the exhaust path at a relative inclination, the high-pressure air used and used in the cutting device is used as the negative pressure for exhaust. Can be.

Further, the present invention is a dicing apparatus in which a cutting apparatus dices a semiconductor wafer, wherein the dicing apparatus is provided with the exhaust duct, and is a high-pressure air discharged from at least an air spindle constituting a cutting means. And a dicing apparatus configured to circulate through a high-pressure air circulation path in the exhaust direction of the exhaust duct.

In the dicing apparatus, the high-pressure air discharged from the air spindle constituting the cutting means is caused to flow through the high-pressure air flow path in the exhaust direction of the exhaust duct, so that the high-pressure air discharged from the air spindle is negatively pressured. It can be used for exhausting mist-like cutting fluid generated at the time of dicing a semiconductor wafer.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail with reference to FIGS. Parts common to the conventional example will be described by assigning the same reference numerals to the conventional example for easy understanding.

The exhaust duct 10 shown in FIG. 1 is provided inside the dicing apparatus 20 and is a pipe for exhausting cutting powder and mist-like cutting fluid generated by dicing to the rear side of the apparatus. is there.

When the semiconductor wafer is diced by the dicing apparatus 20 shown in FIG. 2, the semiconductor wafer 23 held on the frame 21 via the holding tape 22 by a suitable transport means is placed on a chuck table 24. At this time, the semiconductor wafer 23 is suction-held by the negative pressure generated from the negative pressure generating component 29 provided below the chuck table 24.

When the semiconductor wafer 23 is positioned immediately below the alignment means 26 by the movement of the chuck table 24 in the X-axis direction, the semiconductor wafer 2
Image processing such as pattern matching for aligning a cutting line called a street for partitioning a semiconductor chip such as an IC formed on the surface of the third with a rotary blade 27 for cutting the street is performed by the alignment means 26. Alignment of the cutting position is performed.

After the above alignment is performed, the chuck table 24 further moves in the X-axis direction and enters the dicing room 25, where the cutting means 2 including the rotary blade 27
8, the cutting fluid is supplied and the rotating blade 2
7, the streets of the semiconductor wafer 23 are cut and dicing is performed.

As shown in FIG. 1, the chuck table 24 for sucking and holding the semiconductor wafer 23 is connected to a vacuum generating part 29, and the negative pressure generated by high-pressure air supplied to the vacuum generating part 29 The semiconductor wafer 23 is held by suction.

The cutting means 28 provided in the dicing room 25 includes an air spindle 30 serving as a rotating shaft of the rotating blade 27.

The exhaust duct 10 shown in FIG. 1 has an exhaust path 11 communicating with an exhaust port 31 provided in a dicing room 25, and a predetermined angle, for example, 15 to 4 with the exhaust path 11.
And a high-pressure air circulation path 12 connected at an angle of 5 degrees, and is formed in a substantially Y-shape as a whole,
The hose 32 is connected to a hose 32 and an exhaust unit 33 provided outside the dicing apparatus 20.

The spindle air discharge unit 13 is connected to the tip of the high-pressure air circulation path 12 to exhaust the used high-pressure air supplied to the air spindle 30. Further, the suction air discharge unit 14 is also connected to the distal end of the high-pressure air circulation path 12 in order to exhaust the used high-pressure air supplied to the vacuum generating component 29.

In the dicing apparatus 20 having such an exhaust duct 10, when the semiconductor wafer 23 is diced using the cutting means 28, the semiconductor wafer 23 is cut in the dicing room 25 by the negative pressure P 1 generated by the exhaust means 33. The mist-like cutting fluid mixed with the generated cutting powder is sucked from the exhaust port 31.

The exhaust pressure P2 output from the air spindle 30 via the spindle air discharge section 13 and the exhaust pressure P3 output from the vacuum generating part 29 via the suction air discharge section 14 are both high-pressure air flows. It is supplied to the tip of the path 12. In addition, the high-pressure air distribution path 12
Since the connection is made at an angle of 15 to 45 degrees with respect to the exhaust path 11, a negative pressure is generated by the exhaust pressure P <b> 2 and the exhaust pressure P <b> 3 of the high-pressure air circulation path 12, and Is mixed with the negative pressure P1 of the above. Therefore, the suction force of the mist cutting fluid at the exhaust port 31 also increases.

In this embodiment, the exhaust means 3
3 is connected, but even when the exhaust means 33 is not connected, the mist-like cutting fluid can be sucked by the negative pressure generated by the high-pressure air circulation path.

The sucked mist cutting fluid is supplied to the exhaust path 1
Due to the negative pressure P <b> 1 in the device 1, it moves in the direction of P <b> 1 and is discharged outside the dicing device 20.

As described above, by effectively utilizing the high-pressure air discharged from the air spindle 30 and the vacuum generating part 29 as a negative pressure, it is possible to add a special device without adding a special device.
The suction force at the exhaust port 31 is strengthened, and the mist-like cutting fluid can be efficiently exhausted.

[0028]

As described above, the exhaust duct of the cutting device according to the present invention has a high-pressure air used in the cutting device by connecting the high-pressure air circulation path to the exhaust path at an angle. Can be used as a negative pressure for exhaust, so that the exhaust efficiency can be improved without providing a new exhaust device.

Further, in the dicing apparatus according to the present invention, the high-pressure air discharged from the air spindle constituting the cutting means is circulated through the high-pressure air flow path in the exhaust direction of the exhaust duct, thereby being discharged from the air spindle. By using the high-pressure air as a negative pressure, the mist-like cutting fluid generated at the time of dicing the semiconductor wafer can be exhausted, so that the existing high-pressure air can be effectively used to improve the exhaust efficiency.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an example of an embodiment of a dicing apparatus provided with an exhaust duct of a cutting apparatus according to the present invention, as viewed from a side.

FIG. 2 is a perspective view showing an example of an embodiment of the dicing apparatus.

FIG. 3 is an explanatory view of a dicing apparatus provided with an exhaust duct of a conventional cutting apparatus as viewed from a side.

[Explanation of symbols]

10: Exhaust duct 11: Exhaust path 12: High-pressure air circulation path 13: Spindle air discharge part 14: Suction air discharge part 15: Connection part 20: Dicing device 21: Frame 22: Holding tape 23: Semiconductor wafer 24: Chuck table 2
5: dicing room 26: alignment means 27: rotating blade 28:
Cutting means 29: Vacuum generating part 30: Air spindle 31:
Exhaust port 32: Hose 33: Exhaust means 50: Exhaust duct 51: Exhaust means 52: Spindle air discharge part 53: Suction air discharge part

Claims (2)

[Claims] 1. A cutting device for cutting a workpiece,
An exhaust duct of a cutting device for exhausting a mist-like cutting fluid by cutting a workpiece by a cutting means while supplying a cutting fluid, from the cutting area, wherein the mist-like cutting fluid is provided. An exhaust path including an exhaust port for exhausting air, and at least a high-pressure air flow path that is connected to the exhaust path at an angle and that allows high-pressure air used in the cutting device to flow in the exhaust direction. Exhaust duct for cutting equipment. 2. A cutting device is a dicing device for dicing a semiconductor wafer, wherein the dicing device is provided with the exhaust duct according to claim 1, and is exhausted from at least an air spindle constituting a cutting means. A dicing apparatus configured to circulate high-pressure air in the exhaust direction of the exhaust duct via a high-pressure air circulation path.