JP2003234308A - Cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely and efficiently remove cutting water mixed with accumulated contaminations remained due to the cutting of an object to be worked such as a semiconductor wafer or the like while cutting water is supplied. <P>SOLUTION: When a cutting means 17 is used to cut an object to be worked held on a chuck table 15, a mixed fluid of cleaning water and air is jetted from a nozzle that is arranged crossing the moving route of the chuck table 15, thereby removing surely cutting water remained on the object. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a cutting device for cutting a workpiece.

[0002]

2. Description of the Related Art For example, when dicing a semiconductor wafer, as shown in FIG. 5, a semiconductor wafer W is held on a chuck table 15, cutting water is supplied from a cutting water nozzle 23 to a cutting location, and a cutting blade is used. Two
As the cutting means 17 descends while the 2 rotates at high speed, the cutting blade 22 cuts into the streets of the semiconductor wafer W for cutting. Then, by performing such cutting vertically and horizontally on all the streets, it is divided into individual semiconductor chips.

When cutting is performed in this manner, cutting chips (contamination) are generated, cutting water containing the contamination stays on the semiconductor wafer W, and the contamination adheres to the semiconductor wafer W. If the contamination remains attached, the quality of the semiconductor chips deteriorates and the yield also decreases. In addition, some contaminants are attached by static electricity, and it is difficult to remove them unless they are removed immediately.

Therefore, for example, as in the cutting device disclosed in Japanese Patent Laid-Open Nos. 4-240749 and 2000-306878, the cleaning water is jetted from the nozzle onto the surface of the semiconductor wafer to attach the contaminants. And, the cutting water is usually removed.

[0005]

However, since a large amount of cleaning water is required to remove contamination by jetting cleaning water, it is uneconomical and inefficient.

Further, when the size of the semiconductor wafer becomes large, the cleaning water ejected from the nozzle may not spread over the entire surface of the semiconductor wafer, so that the contamination at the position far from the nozzle cannot be completely eliminated. There are also problems.

Although it is possible to remove contamination accumulated on a large-sized semiconductor wafer by increasing the pressure of the sprayed cleaning water without increasing the amount of cleaning water used, the cleaning water can be removed. A pump or the like for increasing the pressure is required, and the piping needs to be changed to a high pressure type, which is uneconomical. Furthermore, when the washing water is at high pressure,
There is also a possibility that the nozzle that ejects the cleaning water may wear in a short period of time.

Thus, when cutting a workpiece such as a semiconductor wafer while supplying cutting water, all cutting water containing contamination can be removed reliably and efficiently by an economical method. There are challenges in doing so.

[0009]

As a concrete means for solving the above problems, the present invention provides a chuck table for holding a workpiece and a cutting for cutting the workpiece held by the chuck table in a cutting region. Means and a cutting feed means for driving the chuck table in the cutting direction, wherein the nozzle is arranged in a direction intersecting the movement path of the chuck table, and the cleaning water and the air are attached to the nozzle. The cleaning means is composed of a mixing section that mixes and a mixed fluid to generate a mixed fluid, a cleaning water supply section that supplies cleaning water to the mixing section, and an air supply section that supplies air to the mixing section. Provide a cutting device.

In this cutting device, the mixing parts are attached to both ends of the nozzle in the longitudinal direction, the nozzles are arranged in the cutting region, and the mixed fluid is jetted to the cut workpiece. Two nozzles are arranged facing each other on both sides of the cutting means, the mixed fluid is jetted to the work piece to be cut, the pressure of cleaning water is 0.2 MPa or more, and the pressure of air is 0. An additional requirement is that the pressure is 3 MPa or more.

In the thus constructed cutting device, the nozzles forming the cleaning means are arranged in a direction intersecting the movement path of the chuck table holding the workpiece.
By supplying cleaning water and air to the nozzle,
Since the cleaning water is assisted and ejected by the pressure of air, it is possible to reliably supply the cleaning water to the entire surface of the workpiece without using high-pressure water. Moreover, since the cleaning water becomes a mixed fluid and becomes mist, a sufficient cleaning power can be obtained even with a small amount of water.

Further, since the cleaning water is assisted by the air and is jetted vigorously, it is possible to remove the adhering contamination by the high impact force at the portion directly contacted with the misted cleaning water.

Further, since the pressures of the cleaning water and the air are relatively low, the nozzle is less likely to wear as compared with the case where high pressure water is used.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION As an example of an embodiment of the present invention, a cutting device 10 shown in FIG. 1 will be described. In addition,
Portions configured similarly to the conventional example will be described with the same reference numerals.

The cutting apparatus 10 shown in FIG. 1 includes a wafer cassette 11 in which a workpiece, for example, a semiconductor wafer W is stored.
A cassette mounting area 12 on which the semiconductor wafer W is loaded, a loading / unloading means 13 for loading / unloading the semiconductor wafer W from the wafer cassette 11 and loading / unloading the semiconductor wafer W into the wafer cassette 11, and a transporting means for transporting the semiconductor wafer W. 14
And the chuck table 15 for holding the semiconductor wafer W
An alignment means 16 for detecting streets where a cutting groove is to be formed, and a cutting means 17 for cutting streets.
And a cleaning means 18 for ejecting a mixed fluid for cleaning.

When a cutting groove is to be formed on the surface of the semiconductor wafer W by using this cutting device 10, the semiconductor wafer W is placed in the wafer cassette 11 in a state of being integrated with the frame F via the holding tape T. A plurality of them are stored, and are carried out from the wafer cassette 11 by the carry-in / carry-out means 13 and temporarily placed in the temporary storage area 13a. Then, after that, the carrier means 14 sucks the carrier means 14, and the carrier means 14 is rotated, so that the carrier means 14 is carried and placed on the chuck table 15, and suction-held.

Next, the chuck table 15 holding the semiconductor wafer W is positioned immediately below the alignment means 16 by moving in the + X direction. The alignment means 16 is provided with an image pickup means such as a CCD camera, and while the alignment means 16 moves in the Y-axis direction, it picks up an image of the surface of the semiconductor wafer W and picks up a key pattern image previously stored in a memory or the like. Streets to be cut are detected (aligned) by performing pattern matching processing with the image. When the street to be cut is detected, the chuck table 15 is further added.
Cutting area 1 in which is moved in the same direction and actual cutting is performed
Positioned at 9.

As shown in FIG. 2, in the cutting means 17, a spindle 20 arranged in the Y-axis direction is rotatably supported by a spindle housing 21, and a cutting blade 22 is attached to the tip of the spindle 20. Cage,
The cutting blade 22 rotates with the rotation of the spindle 20. Further, a pair of cutting water nozzles 23 are arranged so as to sandwich the cutting blade 22 from the front and back.

Although not shown, the alignment means 16 and the cutting means 17 of FIG. 1 are integrally formed, and at the same time when a street to be cut is detected, the street and the cutting blade 21 are moved in the Y-axis direction. Alignment is done.

The cutting means 17 is supported by the cutting feed means 30 so as to be movable in the Z-axis direction which is the cutting direction. Further, the cutting feed means 30 is moved by the indexing feed means 40 in the Y-axis direction which is the indexing direction. It is movably supported.

The cut feed means 30 is provided with the wall portion 3 to be erected.
1 and Z arranged on the side surface of the wall portion 31 in the Z-axis direction.
The elevating part 3 which supports the shaft guide rail 32 and the cutting means 17 and is slidably supported by the Z-axis guide rail 32.
3, a Z-axis ball screw (not shown) that is arranged in the Z-axis direction and is screwed into a nut (not shown) formed in the elevating part 33, and a Z-axis pulse motor 34 that rotationally drives the Z-axis ball screw. When the Z-axis pulse motor 34 is driven to rotate the Z-axis ball screw, the elevating part 33 moves up and down in the Z-axis direction, and the cutting means 17 moves up and down accordingly.

On the other hand, the indexing and feeding means 40 includes a Y-axis guide rail 41 arranged in the Y-axis direction and a Y-axis moving base integrally slidably supported by the Y-axis guide rail 41 and the wall portion 31. A base 42, a Y-axis ball screw 43 screwed into a nut portion (not shown) formed on the Y-axis moving base 42,
Y-axis pulse motor 4 that rotationally drives the Y-axis ball screw 43.
4, the Y-axis pulse motor 44 is driven to rotate the Y-axis ball screw 43, whereby the Y-axis moving base 40 moves in the Y-axis direction, and the cutting means 17 also moves in the same direction. Has become.

The chuck table 15 is a cutting feed means 5.
It is supported by 0 so as to be movable in the X-axis direction. The cutting feed means 50 includes an X-axis guide rail 51 arranged in the X-axis direction which is the cutting direction, an X-axis movement base 52 slidably supported by the X-axis guide rail 51, and an X-axis movement base. Stand 5
X-axis ball screw 53 that is screwed into a nut portion (not shown) formed in 2 and X that rotates and drives the X-axis ball screw 53.
An axis pulse motor 54 and a support base 55 fixed to the X-axis moving base 52 and rotatably supporting the chuck table 15.
And a bellows portion 56 that is fixed to both sides of the support base 55 and expands and contracts as the chuck table 15 moves.

When the X-axis ball screw 53 is driven by the X-axis pulse motor 54 to rotate, the X-axis moving base 52 moves in the X-axis direction, and the support base 55 expands and contracts the bellows portion 56 accordingly. By moving with it, the chuck table 15 moves in the X-axis direction.

FIG. 3 shows an example of the structure of the cleaning means 18. The cleaning means 18 is attached to one end of the nozzle 61 and a nozzle 61 having a plurality of ejection ports 60 in the longitudinal direction. The mixing unit 62, the cleaning water supply unit 63 that supplies cleaning water to the mixing unit 62, and the air supply unit 64 that supplies air to the mixing unit 63. The cleaning water supply unit 63 is provided with a valve 65. The cleaning water source 66 is connected, and the air supply unit 64 is connected to an air source 68 via a valve 67.

In the mixing section 62, the cleaning water supplied from the cleaning water source 66 via the valve 65 and the air supplied from the air source 68 via the valve 67 are mixed to generate a mist-like mixed fluid. To be done. Then, the mixed fluid is ejected from the plurality of ejection ports 60 by the pressure of the air.

As described above, the nozzle 61 having the plurality of ejection ports 60 is at a position where the cleaning water can be ejected onto the entire surface of the workpiece held on the chuck table 15, for example, as shown in FIGS. 1 and 2. In addition, the chuck table 15 is arranged at a position intersecting the movement path of the chuck table 15.

Continuing the description with reference to FIG. 2, when the semiconductor wafer W held by the chuck table 15 is positioned in the cutting region 19 after alignment, the chuck table 15 is further moved in the + X direction and the cutting blade is moved. The cutting means 17 descends under the drive of the cutting feed means 30 while rotating at a high speed, cutting into the street detected by the alignment and cutting the street. At this time, cutting water is supplied from the cutting water nozzle 23 to the contact portion between the cutting blade 22 and the semiconductor wafer W.

Then, the chuck table 15 reciprocates in the X-axis direction under the drive of the cutting feed means 50, and the cutting means 17 moves in the Y-axis direction at every street interval under the drive of the index feed means 40. While the cutting blade 22 cuts into each street, all the streets in the same direction are sequentially cut.

When the chuck table 15 is rotated 90 degrees and the same cutting as described above is performed, all streets are cut vertically and horizontally.

When the cutting water is supplied and the cutting is performed in this way, the cutting water containing the contamination generated by the cutting remains on the semiconductor wafer W. Therefore, the cutting water is removed by the cleaning means 18. .

Since the nozzle 61 constituting the cleaning means 18 is disposed so as to intersect with the movement path of the chuck table 15, the cleaning water is jetted from the nozzle 61 and the chuck table 15 is moved in the X-axis direction. By
The mist-like mixed fluid spreads over the entire surface of the semiconductor wafer W held on the chuck table 15, and the cutting water can be reliably removed.

In addition, the cleaning means 18 is provided with the mixing portion 64 for mixing the air and the cleaning water, and the cleaning water is jetted by being assisted by the pressure of the air, so that the cutting water mixed with the contamination is effectively used. Can be removed. For example, the pressure of the wash water can be 0.2 MPa or more and the pressure of the air can be 0.3 MPa or more, which is lower than that in the case of using high pressure water (for example, the pressure is 10 MPa) as in the related art. Therefore, the nozzle 61 is less likely to wear.

Further, when the nozzle 61 is arranged in the cutting region 19 as shown in the figure, the contamination generated by the cutting can be removed immediately after the cutting, so that the contamination adheres to the semiconductor wafer W by static electricity. Can be prevented.

The cutting water mixed with the contamination can be removed by not supplying the cleaning water to the cleaning water supply unit 63 but ejecting only the air from the ejection port 60.

Further, during cutting, only air is jetted out 60
If the air curtain is formed by ejecting the water from the cutting water, it is possible to prevent the cutting water from flowing out from the cutting area 19 to another area in the apparatus (for example, an area where alignment is performed).

The cleaning means may be constructed as shown in FIG. In the cleaning means 18a having the configuration shown in FIG. 4, the first mixing section 71 and the second mixing section 72 are attached to both ends of the nozzle 70 in which a plurality of ejection ports 69 are formed. Has a first cleaning water supply section 73 and a first air supply section 74, and a second mixing section 72 has a second cleaning water supply section 75 and a second air supply section 76 formed therein. .

The cleaning water source 7 is supplied to the first cleaning water supply section 73 and the second cleaning water supply section 75 via a valve 77.
8 is connected, and an air source 80 is connected to the second air supply source 74 and the second air supply source 75 via a valve 79.

From the washing water source 78 to the first washing water supply section 73
The washing water flowing into the nozzle 70 via the air source 80
Is assisted by the air flowing in from the first air supply unit 74. Similarly, the cleaning water flowing from the cleaning water source 78 into the nozzle 70 via the second cleaning water supply unit 75 is assisted by the air flowing from the air source 80 via the second air supply unit 76. Therefore, the nozzle 7
The cleaning water supplied from both ends of 0 in good balance and assisted is evenly ejected from all the ejection ports 69 toward the entire surface of the semiconductor wafer W, so that the cutting water mixed with contamination can be surely removed. it can.

In the present embodiment, the nozzle 6
Although the case where one unit is provided has been described as an example, two or more units may be provided. For example, when two nozzles are arranged at positions facing each other in the X-axis direction with the cutting means 17 interposed therebetween, the mixed fluid is ejected from each nozzle according to the position of the chuck table 15 to efficiently perform cutting. Water can be eliminated.

[0041]

As described above, in the cutting device according to the present invention, the nozzles forming the cleaning means are arranged in the direction intersecting the movement path of the chuck table holding the workpiece, and Since the cleaning water and the air are supplied, the cleaning water is assisted by the pressure of the air and spouts. Therefore, the cleaning water can be supplied to the entire surface of the workpiece without using the high-pressure water, and the cutting water mixed with the contamination can be removed. Moreover,
The cleaning water becomes a mixed fluid and becomes a mist, and a sufficient cleaning power can be obtained even with a small amount of water.

Further, since the cleaning water is assisted by the air and is jetted out vigorously, it is possible to surely remove the adhered contamination by the high impact force at the portion where the misted cleaning water directly contacts. .

Furthermore, since the pressures of the cleaning water and the air are relatively low, the nozzle is less likely to wear and the life can be extended as compared with the case where high pressure water is used.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a cutting device according to the present invention.

FIG. 2 is an enlarged perspective view showing a cutting region constituting the cutting device.

FIG. 3 is a cross-sectional view showing a first example of cleaning means that constitutes the cutting device.

FIG. 4 is a cross-sectional view showing a second example of cleaning means that constitutes the cutting device.

FIG. 5 is a perspective view showing how a semiconductor wafer is cut.

[Explanation of symbols]

10 ... Cutting device 11 ... Wafer cassette 12 ... Cassette mounting area 13 ... Carrying in / out means 14 ... Transporting means 15 ... Chuck table 16 ... Alignment means 17 ... Cutting means 18 ... Cleaning means 19 ... Cutting area 20 ... Spindle 21 ... Spindle housing 22 ... Cutting blade 23 ... Cutting water nozzle 30 ... Cutting feed means 31 ... Wall part 32 ... Z-axis guide rail 33 ... Lifting unit 34 ... Z-axis pulse motor 40 ... Indexing and feeding means 41 ... Y-axis guide rail 42 ... Y-axis moving base 43 ... Y-axis ball screw 44 ... Y-axis pulse motor 50 ... Cutting feed means 51 ... X-axis guide rail 52 ... X-axis moving base 53 ... X-axis ball screw 54 ... X-axis pulse motor 55 ... Support base 56 ... Bellows 60 ... Jet port 61 ... Nozzle 62 ... Mixing section 63 ... Washing water supply unit 64 ... Air supply unit 65 ... Valve 66 ... Washing water source 67 ... Valve 68 ... Air source 69 ... Jet outlet 70 ... Nozzle 71 ... 1st mixing part 72 ... 2nd mixing part 73 ... First wash water supply unit 74 ... First air supply unit 75 ... Second wash water supply section 76 ... Second air supply unit 77 ... Valve 78 ... Washing water source 79 ... Valve 80 ... Air source

Claims (5)

[Claims] 1. A chuck table for holding a work piece, a cutting means for cutting the work piece held by the chuck table in a cutting region, and a cutting feed means for driving the chuck table in a cutting direction. A cutting device comprising: a nozzle arranged in a direction intersecting a movement path of the chuck table; a mixing section mounted on the nozzle for mixing cleaning water and air to generate a mixed fluid; A cutting device provided with a cleaning means including a cleaning water supply unit for supplying cleaning water to the mixing unit and an air supply unit for supplying air to the mixing unit. 2. The cutting device according to claim 1, wherein the mixing section is attached to both ends of the nozzle in the longitudinal direction. 3. The cutting device according to claim 1, wherein the nozzle is arranged in the cutting region, and the mixed fluid is ejected to the cut work piece. 4. The cutting device according to claim 1, wherein two nozzles are provided so as to oppose each other on both sides of the cutting means, and the mixed fluid is ejected to the cut workpiece. 5. The cutting device according to claim 1, wherein the pressure of the cleaning water is 0.2 MPa or more, and the pressure of the air is 0.3 MPa or more.