JP2019188552A - Cutting device - Google Patents

Abstract

To efficiently discharge cutting waste liquid from a work-piece.SOLUTION: A cutting device, which is equipped with a holding table which holds a work-piece, and a cutting blade which cuts the work-piece held by the holding table, comprises: a blade cover which has a ceiling part and a side wall part hanging from the ceiling part, and is so provided as to cover a part of the cutting blade; cutting liquid supply means which supplies cutting liquid to the cutting blade; and waste liquid recovery means which is provided in an area where the cutting liquid supplied to the cutting blade splashes in association with rotation of the cutting blade, and recovers the cutting liquid together with partial gas around the cutting blade. The waste liquid recovery means includes: a gas-liquid separation part which separates the cutting liquid and the gas reaching the waste liquid recovery means; a liquid discharge passage which becomes a discharge route of the cutting liquid separated by the gas-liquid separation part; and a gas discharge passage which becomes a discharge route of the gas separated by the gas-liquid separation part. A suction source for liquid discharge is connected to one end of the liquid discharge passage which becomes a discharge destination of the cutting liquid.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a cutting apparatus that includes a holding table that holds a workpiece and a cutting blade that cuts the workpiece held by the holding table.

  In the manufacturing process of device chips, a plurality of intersecting cutting lines (streets) are set on the surface of a substrate such as a semiconductor wafer, a package substrate, a ceramic substrate, or a glass substrate, and a device is placed in each area defined by the cutting lines. Provided. When the substrate on which the device is provided is cut along a planned cutting line and divided, individual device chips are formed.

  For example, a cutting device including a cutting blade is used for cutting the substrate. The cutting apparatus includes a holding table that holds a workpiece such as a substrate, and a cutting unit that cuts the workpiece held on the holding table. The cutting unit is equipped with an annular cutting blade including a grindstone portion in which abrasive grains are embedded. When the cutting blade is rotated, the cutting blade is positioned at a predetermined height, and the holding table is moved in the horizontal direction toward the cutting blade, the workpiece is cut.

  When the workpiece is cut, cutting waste is generated and scattered from the workpiece. Also, heat is generated by friction between the cutting blade and the workpiece. Therefore, when cutting the workpiece with a cutting blade, a cutting fluid is supplied to the cutting blade and the workpiece in order to eliminate cutting waste and heat. However, cutting waste liquid containing cutting waste may not be discharged quickly, and cutting waste may adhere to the upper surface of the workpiece.

  In particular, when the workpiece is an image sensor such as a CCD (Charge Coupled Device) or C-MOS (Complementary Metal Oxide Semiconductor), the adhesion of the workpiece to the cutting waste is strong. Therefore, even if the workpiece is washed after the workpiece has been cut, the cutting waste cannot be removed sufficiently. In addition, in the case of the image pickup device, since the residue of cutting waste is directly connected to a device failure, the problem becomes particularly serious.

  Accordingly, a cutting apparatus has been developed in which a waste liquid recovery unit is disposed in the cutting unit, and the cutting liquid is immediately recovered by the waste liquid recovery unit (see Patent Document 1). The waste liquid recovery unit includes a drain path connected at one end to a waste liquid recovery port provided near the cutting blade. The waste liquid recovery port is provided in a direction in which the cutting waste liquid is scattered by the rotation of the cutting blade, and the cutting waste liquid is scattered and recovered to the waste liquid recovery port.

  Furthermore, a cutting apparatus including a waste liquid recovery unit having a suction source on the other end side of the drainage path has been developed (see Patent Document 2). In addition, in order to suppress scattering of cutting waste liquid from the cutting unit to the surroundings, a cutting apparatus including a cutting unit including a blade cover that covers the cutting blade has been developed (see Patent Document 3).

JP 2007-69280 A JP 2009-119569 A JP 2011-31374 A

  In a waste liquid recovery unit including a suction source, ambient air is taken in during suction by the suction source, and the suction capability of the suction source may be divided by the suction of the air, and the suction force acting on the cutting fluid may be reduced. When the suction force decreases, not only the cutting fluid can be sufficiently sucked, but also the cutting fluid that has entered the suction path may flow backward. When the cutting fluid flows backward, the cutting fluid containing cutting waste scatters on the surface of the workpiece, and the cutting waste may adhere to the workpiece.

  In order to compensate for the suction ability that is broken by the intake of air, it is conceivable to connect a suction source having a larger suction ability to the drainage channel, but a suction source with a high suction ability is expensive and has a large apparatus configuration. It becomes.

  This invention is made | formed in view of this problem, The place made into the objective is providing the cutting device which can discharge | emit cutting waste liquid from a workpiece efficiently, without enlarging an apparatus.

  According to one aspect of the present invention, there is provided a cutting device comprising a holding table that holds a workpiece, and a cutting blade that cuts the workpiece held by the holding table, the ceiling portion; A blade cover provided to cover a part of the cutting blade, a cutting fluid supply means for supplying a cutting fluid to the cutting blade, and a cutting blade A waste liquid collecting means disposed in a region where the supplied cutting liquid is scattered as the cutting blade rotates, and collecting the cutting liquid together with a part of the gas around the cutting blade, the waste liquid collecting means Is a gas-liquid separation part that separates the cutting liquid that reaches the waste liquid recovery means and the gas, a liquid discharge path that is a discharge path for the cutting liquid separated by the gas-liquid separation part, and It becomes the discharge route of the gas separated by the gas-liquid separation part Comprising a body discharge passage, the cutting device at one end of the liquid discharge passage becomes a discharge destination of the cutting fluid, characterized in that for discharging liquid suction source is connected is provided.

  Preferably, the gas-liquid separation unit includes an inflow restricting plate that prevents the cutting fluid that has reached the waste liquid collecting means from flowing into the gas discharge path. Preferably, in the gas discharge path, a gas discharge suction source is connected to one end of the gas discharge path.

  Further preferably, the blade cover has a bottom portion formed continuously from the side wall portion and facing the ceiling portion, and the bottom portion has a through hole communicating with the inside and outside of the blade cover, and the cutting blade is The tip projects out of the blade cover through the through hole.

  A cutting apparatus according to an aspect of the present invention includes a waste liquid collecting unit that collects cutting fluid supplied to a cutting blade, and the cutting fluid supplied to the cutting blade is scattered to the waste liquid collecting unit as the cutting blade rotates. To do. At this time, the cutting fluid takes in ambient air and reaches the waste liquid collecting means. Here, since the waste liquid recovery means includes a gas-liquid separation unit, the cutting fluid and the gas that reach the waste liquid recovery means are separated by the gas-liquid separation part.

  The waste liquid recovery means further includes a liquid discharge path serving as a cutting fluid discharge path and a gas discharge path serving as a gas discharge path. The cutting liquid is discharged from the liquid discharge path, and the gas is discharged from the gas discharge path. Is discharged. A suction source is connected to one end of the liquid discharge path that serves as a discharge path for the cutting fluid. However, since the gas hardly reaches the suction source and mainly the cutting fluid reaches, the suction source is caused by the suction of the gas. The loss of suction capacity is reduced.

  That is, since the waste liquid recovery means includes the gas-liquid separation unit and the gas discharge path, the efficiency of discharging the cutting fluid by the suction source connected to the liquid discharge path is increased. Therefore, the cutting fluid can be appropriately discharged from the workpiece without increasing the suction capability of the suction source.

  Therefore, the present invention provides a cutting apparatus that can efficiently discharge cutting waste liquid from the workpiece without increasing the size of the apparatus.

It is a perspective view which shows a cutting device typically. It is a perspective view which shows a blade cover, a gas discharge path, and a liquid discharge path typically. 3A is a sectional view schematically showing the blade cover, FIG. 3B is a plan view schematically showing the bottom surface of the blade cover, and FIG. 3C is a plan view showing the blade cover. FIG. 3D is a cross-sectional view schematically showing a blade cover. FIG. It is sectional drawing which shows typically an example of a waste liquid collection | recovery means. It is sectional drawing which shows typically another example of a waste-liquid collection | recovery means.

  Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. First, the cutting apparatus according to the present embodiment will be described with reference to FIG. FIG. 1 is a perspective view schematically showing a cutting device.

  The cutting device 2 includes a device base 4 that supports each component, and includes a holding table 14 that sucks and holds a workpiece on the upper surface of the device base 4, and a cutting unit 38 that cuts the workpiece. . A cassette support base 6 on which a cassette 8 capable of accommodating a plurality of workpieces is placed is disposed at one end of the front portion of the upper surface of the apparatus base 4. The cutting device 2 includes a carry-in / out mechanism (not shown), pulls out a workpiece to be cut from the cassette 8 and carries it onto the holding table 14. After the cutting is completed, the workpiece is loaded into the cassette 8. Store in.

  An opening 4 a is provided at a position adjacent to the cassette support base 6 on the upper surface of the apparatus base 4, and an X-axis moving table 10 and one end attached to the X-axis moving table 10 are installed inside the opening 4 a. A drip-proof cover 12 is provided. The X-axis movement table 10 is connected to an X-axis movement mechanism (not shown), and can be moved in the X-axis direction by the X-axis movement mechanism. A holding table 14 is disposed on the X-axis moving table 10, and the holding table 14 can be moved in the X-axis direction by moving the X-axis moving table 10.

  The holding table 14 has a porous member that is exposed upward, and an upper surface of the porous member serves as an adsorption surface of the holding table 14. The holding table 14 has a suction path with one end connected to a suction source (not shown) inside, and the other end of the suction path is connected to a porous member. When the workpiece is placed on the suction surface and the suction source is operated to suck the workpiece through the porous member, the workpiece is sucked and held on the holding table 14. The holding table 14 is rotatable around an axis along a direction perpendicular to the suction surface.

  At a position adjacent to the opening 4 a on the upper surface of the apparatus base 4, a cleaning unit 42 that cleans the workpiece after cutting is disposed is disposed. The cleaning unit 42 includes a cleaning table that holds a workpiece, and a nozzle (not shown) that supplies a cleaning liquid to the workpiece held on the cleaning table.

  At the rear part of the upper surface of the apparatus base 4, a gate-shaped support part 16 is provided so as to straddle the opening 4 a. A Y-axis moving mechanism 18 that moves the cutting unit 38 in the Y-axis direction is disposed on the front surface of the upper portion of the support portion 16.

  The Y-axis moving mechanism 18 includes a pair of Y-axis guide rails 20 that are parallel to the Y-axis direction, and a Y-axis moving plate 22 that is slidably attached to the Y-axis guide rails 20. Furthermore, a Y-axis ball screw 24 that is screwed into a nut portion (not shown) provided on the rear surface side of the Y-axis moving plate 22 and a Y-axis pulse motor 26 that rotates the Y-axis ball screw 24 are provided.

  A Z-axis moving mechanism 28 that moves the cutting unit 28 in the Z-axis direction is disposed on the front surface of the Y-axis moving plate 22. The Z-axis movement mechanism 28 includes a pair of Z-axis guide rails 30 that extend in the Z-axis direction, and a Z-axis movement plate 32 that is slidably attached to the Z-axis guide rails 30. Furthermore, an X-axis ball screw 34 that is screwed into a nut portion (not shown) provided on the back side (rear side) of the Z-axis moving plate 32, a Z-axis pulse motor 36 that rotates the Z-axis ball screw 34, Is provided.

  When the Y-axis ball motor 24 is rotated by the Y-axis pulse motor 26, the Y-axis moving plate 22 moves along the Y-axis guide rail 20 in the Y-axis direction. When the Z-axis ball screw 34 is rotated by the Z-axis pulse motor 36, the Z-axis moving plate 32 moves in the Z-axis direction along the Z-axis guide rail 30.

  A cutting unit 38 for cutting the workpiece and a camera unit 40 for photographing the surface of the workpiece are disposed at the lower part of the front surface of the Z-axis moving plate 32. The camera unit 40 sends an image obtained by photographing to a control unit (not shown) of the cutting device 2. The control unit controls each component of the cutting device 2 based on the image so that the workpiece is cut along the planned machining line.

  The cutting unit 38 includes a cutting blade 66 (see FIG. 4 and the like) for cutting a workpiece, and a blade cover 44 disposed so as to cover a part of the cutting blade 66. The cutting blade 66 includes, for example, a base 66a (see FIG. 4 and the like) made of aluminum having a through hole in the center and a grindstone portion 66b (see FIG. 4 and the like) disposed on the outer periphery of the base 66a. .

  The grindstone portion 66b includes abrasive grains such as diamond abrasive grains and a binding material that disperses and fixes the abrasive grains. When the cutting blade 66 is rotated around the through hole and the grindstone 66b is brought into contact with the workpiece, the workpiece is cut. When the workpiece is cut, cutting waste is generated from the workpiece and scattered around. Further, heat is generated by friction between the cutting blade 66 and the workpiece. Therefore, when cutting the workpiece with the cutting blade 66, a cutting fluid is supplied to the cutting blade 66 and the workpiece in order to eliminate cutting waste and heat.

  The workpiece to be cut by the cutting device 2 is, for example, a substrate made of a material such as silicon, SiC (silicon carbide), or other semiconductor, or a material such as sapphire, glass, quartz, or ceramic. Alternatively, the plate-like workpiece is a package substrate in which a device is covered with a resin.

  The workpiece is provided with a device such as an IC (Integrated Circuit) or an LSI (Large Scale Integration). Alternatively, the device is an image sensor such as a CCD (Charge Coupled Device) or a C-MOS (Complementary Metal Oxide Semiconductor). When the workpiece is cut by the cutting device 2 and divided for each device, a device chip can be formed.

  The cutting device 2 includes a cutting fluid supply means for supplying a cutting fluid such as pure water to the cutting blade 66 and the workpiece during cutting. The cutting fluid supply means includes, for example, a cutting fluid supply source 54 (see FIG. 2 and the like), a cutting fluid supply path 56 (see FIG. 3C and the like), and a cutting fluid supply port 58 (see FIG. 3C and the like). ), Etc. During cutting of the workpiece, the cutting fluid is supplied to the cutting blade 66 and the workpiece, and the generated cutting waste is taken in and removed by the cutting fluid, but the cutting fluid containing the cutting waste is quickly discharged. In some cases, cutting waste may adhere to the upper surface of the workpiece.

  In particular, when the workpiece is a substrate or the like provided with an image sensor such as a CCD or C-MOS, the adhesion force of the workpiece to the cutting waste is increased. Therefore, even if the workpiece is washed after the workpiece has been cut, the cutting waste cannot be removed sufficiently. In addition, in the case of the image pickup device, since the residue of cutting waste is directly connected to a device failure, the problem becomes particularly serious.

  Therefore, the cutting device 2 according to the present embodiment includes a blade cover 44 that covers a part of the cutting blade 66 and a waste liquid recovery that recovers the cutting liquid supplied to the workpiece in order to prevent the scattering of the cutting liquid. Means. The blade cover 44 will be described in detail with reference to FIGS.

  FIG. 2 is a perspective view schematically showing the blade cover 44, the gas discharge path 46, and the liquid discharge path 48. The gas discharge path 46 and the liquid discharge path 48 constitute a waste liquid collecting means 80. The blade cover 44 includes, for example, a cover 44a and a cover 44b that is paired with the cover 44a and covers the cutting blade 66. The cover 44a and the cover 44b are integrated so as to cover the cutting blade 66. Is incorporated into the cutting unit 38.

  The blade cover 44 incorporated in the cutting unit 38 includes, for example, a ceiling part 44c, a side wall part 44d hanging from the side end of the ceiling part 44c, a bottom part 44e facing the ceiling part 44c and extending from the lower end of the side wall part 44d. .

  For example, the cover 44b is provided with a cutting fluid introduction portion 52 that serves as a connection terminal to a cutting fluid supply source 54 that constitutes a cutting fluid supply means. The cutting fluid is supplied from the cutting fluid supply source 54 into the blade cover 44 through the cutting fluid introduction portion 52. A more detailed structure of the blade cover 44 will be described with reference to FIG.

  FIG. 3B is a plan view schematically showing the bottom surface of the blade cover 44, and FIG. 3C is a cross-sectional view schematically showing the blade cover 44. The cross-sectional view shown in FIG. 3C is a cross-sectional view when the blade cover 44 is cut along the line CC ′ in the plan view shown in FIG.

  As shown in FIG. 3C, a cutting fluid supply path 56 having one end connected to the cutting fluid introducing portion 52 is formed inside the cover 44b. The other end of the cutting fluid supply path 56 is connected to a cutting fluid supply port 58, and the cutting fluid is ejected from the cutting fluid supply port 58 to the workpiece. The cutting fluid supply path 56 also communicates with a cutting fluid supply port 58 on the cover 44a side.

  As shown in FIG. 3B, when the cover 44a and the cover 44b are integrated, a through hole 62 is formed in the bottom 44e of the blade cover 44, and a grindstone portion 68b of the cutting blade 66 (FIG. 3D). (See) protrudes downward through the through hole 62. The plurality of cutting fluid supply ports 58 are arranged in a row at the bottoms of the cover 44a and the cover 44b so as to sandwich the through hole 62 therebetween.

  FIG. 3A is a cross-sectional view schematically showing the blade cover 44. The cross-sectional view shown in FIG. 3A is a cross-sectional view when the blade cover 44 is cut along the line AA ′ in the plan view shown in FIG. As shown in FIG. 3A, a spindle insertion hole 60 through which the spindle 64 (see FIG. 3D) penetrates is formed inside the blade cover 44. In addition, a space for accommodating a cutting blade 66 attached to the tip of the spindle 64 is formed in the blade cover 44.

  FIG. 3D is a cross-sectional view schematically showing the blade cover 44. The cross-sectional view shown in FIG. 3D is a cross-sectional view when the blade cover 44 is cut along the line BB ′ in the plan view shown in FIG. In the cross-sectional view shown in FIG. 3D, the spindle 64 and the cutting blade 66 accommodated in the blade cover 44 are shown. A mount flange 64 a is disposed at the tip of the spindle 64.

  The cutting blade 66 includes an annular base 66a having a through hole (not shown) through which the spindle 64 penetrates in the center, and a grindstone portion 68b disposed on the outer periphery of the base 66a. A screw groove is formed at the tip of the spindle 64. The spindle 64 is inserted into the through hole of the annular base 66a, the annular base 66a is brought into contact with the mount flange 64a, and the nut 64b is tightened at the tip of the spindle 64, so that the cutting blade 66 is attached to the spindle 64. Can be fixed to the tip.

  A spindle motor (not shown) for rotating the spindle 64 is connected to the base end side of the spindle 64. When the spindle motor is rotated by operating the spindle motor, the cutting blade 66 is rotated.

  A suction opening 68 is formed on the bottom surface of the blade cover 44, and a discharge path 70 is formed inside the blade cover 44. One end of the discharge path 70 communicates with the suction opening 68, and a discharge port 72 to which a hose or the like is connected is formed at the other end of the discharge path 70. To the discharge port 72, for example, a waste liquid collecting unit including a gas-liquid separation unit 76, a liquid discharge path 48, and a gas discharge path 46 is connected. FIG. 4 is a cross-sectional view schematically showing an example of the waste liquid recovery means, and shows the state of discharge of the cutting liquid and gas during the cutting process.

  As shown in FIG. 4, a gas discharge path 46 is connected to the discharge port 72. An inflow restricting plate 76 a that protrudes from the bottom of the inner wall is disposed on the inner wall of the gas discharge path 46 as a gas-liquid separator 76. In addition, a through hole through which a hose-like liquid discharge path 48 having a diameter smaller than the diameter of the gas discharge path 46 passes is provided in the upper part of the gas discharge path 46, and the liquid discharged through the through hole is discharged. One end of the path 48 reaches a region upstream of the inflow regulating plate 76a in the suction direction.

  A gas discharge suction source 78 a is connected to the other end side of the gas discharge path 46, and a liquid discharge suction source 78 b is connected to the other end side of the liquid discharge path 48. When cutting the workpiece, the insides of the gas discharge path 46 and the liquid discharge path 48 are sucked by the suction sources 78a and 78b.

  The moving path of the cutting fluid when cutting the workpiece 1 will be described. When cutting the workpiece 1, the grindstone 66 b of the cutting blade 66 protruding from the through hole 62 of the blade cover 44 comes into contact with the workpiece. At this time, the cutting fluid 74 is discharged from the cutting fluid supply port 58, and the cutting fluid 74 reaches the machining point.

  When the workpiece 1 is cut by the cutting blade 66, cutting waste is generated from the workpiece 1 and the cutting waste is taken into the cutting fluid 74. The cutting fluid 74 in which the cutting waste is taken in is scattered as the cutting blade 66 rotates, and is sucked from the suction opening 68.

  A gas intake path 50 is formed on the bottom side of the blade cover 44 opposite to the discharge port 72, and air (gas) is taken in from the gas intake path 50 when the workpiece 1 is cut. The waste liquid collecting means 80 is disposed in a direction in which the cutting liquid 74 is scattered as the cutting blade 66 rotates. At the time of cutting the workpiece 1, the cutting fluid 74 scatters to the waste liquid collecting means 80 and the air reaches as the cutting blade 66 rotates.

  When the cutting liquid 74 reaches the gas-liquid separation unit 76, the movement of the cutting liquid 74 in the gas discharge path 46 is restricted by the gas-liquid separation unit 76, and the one end of the liquid discharge path 48 is immersed in the cutting liquid 74. The cutting fluid 74 is sucked from the one end of the liquid discharge path 48. On the other hand, the movement of the air (gas) is not restricted by the gas-liquid separator 76 and proceeds through the gas discharge path 46 as it is.

  That is, the gas-liquid separation unit 76 separates the cutting fluid 74 that has reached the waste liquid collection means 80 and air (gas), and supplies the cutting fluid 74 to the suction source 78 a connected to the other end of the gas discharge path 46. Suppresses the progression of Further, the progression of the gas to the suction source 78b connected to the other end of the liquid discharge path 48 is suppressed. Therefore, since the suction source 78b connected to the liquid discharge path 48 mainly sucks the cutting fluid 74, the suction capability cannot be divided into the suction of gas. Further, since the suction source 78a connected to the gas discharge path 46 mainly sucks the gas, the suction capability is not divided into the suction of the cutting fluid 74.

  As a suction mechanism for sucking a fluid such as gas or liquid, there are a mechanism suitable for sucking a gas, a mechanism suitable for sucking a liquid, and the like. When both a gas and a liquid are to be sucked with a single suction source, a large and expensive suction source must be prepared. On the other hand, since the cutting device 2 according to the present embodiment includes the gas-liquid separation unit 76, a suction source suitable for each suction target can be employed. Therefore, an increase in the price and an increase in size of the cutting device 2 can be suppressed.

  For example, as shown in FIG. 4, the gas-liquid separator 76 is an inflow restricting plate 76 a that protrudes from the bottom of the inner wall of the gas discharge path 46, but the cutting device according to the present embodiment is not limited to this. The gas-liquid separator 76 may be an inflow restricting plate protruding from the ceiling portion of the inner wall or an inflow restricting plate protruding from the inner wall of the liquid discharge path 48. Moreover, it may not be a plate-shaped member. FIG. 5 shows another example of the gas-liquid separator 76.

  FIG. 5 is a cross-sectional view schematically showing another example of the waste liquid recovery means 80. The cutting unit 38 shown in FIG. 5 includes a blade cover 44 that covers a part of the cutting blade 66, and a cutting blade 66 accommodated in the blade cover 44. In the cutting unit 38 shown in FIG. 5, the cutting blade 66 is not sealed by the blade cover 44.

  The blade cover 44 includes a cutting fluid introduction section 52 connected to a cutting fluid supply source (not shown), a cutting fluid supply path 56 with one end communicating with the cutting fluid introduction section 52, and the other end side of the cutting fluid supply path 56. And a cutting fluid supply port 58 disposed in the. The blade cover 44 further includes a cutting fluid supply nozzle 58 a that ejects the cutting fluid from the side to the cutting blade 66.

  When cutting the workpiece, the cutting fluid 74 is supplied to the cutting blade 66 and the workpiece from the cutting fluid supply port 58 and the cutting fluid supply nozzle 58a. When the workpiece is cut by rotating the cutting blade 66, cutting waste is generated from the workpiece, but the cutting waste is taken into the cutting fluid. The cutting fluid 74 scatters as the cutting blade 66 rotates. Waste liquid collecting means 80 is disposed in the direction in which the cutting fluid 74 is scattered.

  The waste liquid recovery means 80 includes a gas discharge path 46, a liquid discharge path 48, a gas / liquid separator 76, and a suction source 78 b connected to the liquid discharge path 48. The gas-liquid separation unit 76 includes a gas-liquid separation chamber 76b and an inflow restricting plate 76a protruding from the ceiling of the gas-liquid separation chamber 76b. The liquid discharge path 48 is connected to the side wall at the bottom of the gas-liquid separation chamber 76, and the gas discharge path 46 is connected to the ceiling of the gas-liquid separation chamber 76. The waste liquid recovery means 80 does not include a suction source for sucking gas, and an exhaust port 82 is provided at one end of the gas discharge path 46.

  When the cutting fluid 74 scatters to the waste fluid collecting means 80 by cutting the workpiece, the cutting fluid 74 collides with the inflow restricting plate 76a inside the gas-liquid separation chamber 76b, and the cutting fluid 74 reaches the bottom of the gas-liquid separation chamber 76b. Accumulate. The cutting fluid 74 accumulated at the bottom of the gas-liquid separation chamber 76 b is sucked by the suction source 78 b through the liquid discharge path 48. As the cutting blade 66 rotates, gas is also taken into the waste liquid collecting means 80. The gas is discharged to the outside from the exhaust port 82 through the gas discharge path 46.

  In this way, the inflow restricting plate 76a of the gas-liquid separator 76 prevents the cutting fluid 74 from entering the gas discharge path 46. Further, since the gas is appropriately discharged through the gas discharge path 46, mixing of the gas into the liquid discharge path 48 is suppressed, and the suction source 78b connected to the liquid discharge path 48 makes the cutting fluid 74 efficient. Can suck well.

  In the above embodiment, when a different suction source is provided for each of the gas discharge path 46 and the liquid discharge path 48, or when one of the gas discharge path 46 and the liquid discharge path 48 has a suction source. Although the case where it arrange | positions was demonstrated, the cutting device which concerns on 1 aspect of this invention is not limited to this. For example, a common suction source may be connected to the gas discharge path 46 and the liquid discharge path 48.

  In this case, an adjustment valve that adjusts the suction force is provided between the gas discharge path 46 and the suction source, or between the liquid discharge path 48 and the suction source, so that the cutting fluid that reaches the waste liquid collecting means 80 is less than the gas. It is preferable to be sucked at a high pressure.

  Further, the gas-liquid separation unit 76 of the waste liquid collecting means 80 does not need to completely separate the cutting fluid 74 from the air. For example, the atomized cutting fluid 74 passes through the gas discharge path 46 or the liquid discharge path 48. The air containing may be discharged. Even in this case, the air entering the liquid discharge path 48 can be reduced by the gas-liquid separation unit 76, so that a reduction in the suction capacity accompanying the suction of air in the suction source 78b connected to the liquid discharge path 48 is suppressed.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

DESCRIPTION OF SYMBOLS 1 Workpiece 2 Cutting apparatus 4 Apparatus base 4a Opening 6 Cassette support stand 8 Cassette 10 X-axis movement table 12 Dust-proof drip-proof cover 14 Holding table 16 Support part 18 Y-axis movement mechanism 20, 30 Guide rail 22, 32 Movement plate 24, 34 Ball screw 26, 36 Pulse motor 28 Z-axis moving mechanism 38 Cutting unit 40 Camera unit 42 Cleaning unit 44, 44a, 44b Cover 46 Gas discharge path 48 Liquid discharge path 50 Gas intake path 52 Cutting fluid introduction part 54 Cutting fluid supply 54 Source 56 Cutting fluid supply path 58 Cutting fluid supply port 58a Cutting fluid supply nozzle 60 Spindle insertion hole 62 Through hole 64 Spindle 64a Mount flange 64b Nut 66 Cutting blade 66a Base 66b Grinding wheel portion 66c Cutting blade rotation direction 68 Suction opening 70 Drain Road 72 outlet 74 the cutting fluid 76 gas-liquid separator 76a flows into the regulating plate 76b gas-liquid separating chamber 78a, 78b suction source 80 waste liquid collecting means 82 outlet

Claims (4)

A cutting device comprising: a holding table that holds a workpiece; and a cutting blade that cuts the workpiece held by the holding table;
A blade cover having a ceiling part and a side wall part hanging from the ceiling part, and arranged to cover a part of the cutting blade;
Cutting fluid supply means for supplying cutting fluid to the cutting blade;
A waste fluid recovery means disposed in a region where the cutting fluid supplied to the cutting blade is scattered as the cutting blade rotates and recovering the cutting fluid together with a part of the gas around the cutting blade;
The waste liquid recovery means includes
A gas-liquid separation unit that separates the cutting fluid reaching the waste liquid recovery means and the gas;
A liquid discharge path serving as a discharge path for the cutting fluid separated by the gas-liquid separation unit;
A gas discharge path serving as a discharge path for the gas separated by the gas-liquid separation unit,
A cutting apparatus, characterized in that a liquid discharge suction source is connected to one end of the liquid discharge path which is a discharge destination of the cutting liquid.   2. The cutting apparatus according to claim 1, wherein the gas-liquid separation unit includes an inflow restricting plate that prevents the cutting fluid reaching the waste liquid collecting unit from flowing into the gas discharge path.   The cutting apparatus according to claim 1 or 2, wherein the gas discharge path has a gas discharge suction source connected to one end of the gas discharge path. The blade cover has a bottom portion that is formed continuously from the side wall portion and faces the ceiling portion, and the bottom portion has a through hole that communicates with the inside and outside of the blade cover,
The cutting device according to any one of claims 1 to 3, wherein a tip of the cutting blade protrudes outside the blade cover through the through hole.