JP2024093530A - Processing Equipment - Google Patents

Abstract

To provide a processing device that can reduce the need for part replacement while still allowing exhaust to be discharged indoors.
[Solution] The processing device 1 is provided with an exhaust path 70, one end of which communicates with a processing chamber 60 and the other end of which communicates with an opening 4 opening to the outside of the processing device 1, and is provided with a fan 74 disposed in the exhaust path 70, and a separation unit 80 disposed between the fan 74 and the processing chamber 60 and separating processing debris 101 contained in the exhaust air. The separation unit 80 has a main body 81 having an inlet 831 formed at the upper end side through which the exhaust air flows and an outlet 841 formed at the lower end side, which rotates and circulates the exhaust air inside, and a cooling unit which cools the main body 81, and a gas outlet 832 formed at the upper end side of the main body 81 for discharging the exhaust air, and the gas discharged from the gas outlet 832 is discharged through the exhaust path 70 into a clean room 100 outside the processing device 1.
[Selected figure] Figure 2

Description

The present invention relates to a processing device.

In the manufacturing process of semiconductor devices, processing equipment such as grinding equipment, polishing equipment, and dicing equipment are installed indoors. Clean rooms are controlled to constant temperature and humidity, and the exhaust from the processing equipment installed in the clean room is exhausted outside the clean room through exhaust ducts.

However, when the air in the clean room is exhausted outside the clean room, new outside air must be taken into the clean room and its temperature regulated. For this reason, processing equipment has been proposed that is equipped with a high-performance filter and can exhaust processing exhaust air from the processing equipment into the clean room (see, for example, Patent Document 1).

JP 2012-149813 A

However, the processing device described in Patent Document 1 and other publications requires parts such as filters to be replaced at a certain frequency, so further improvements are needed.

The object of the present invention is to provide a processing device that can exhaust air indoors while minimizing the need to replace parts.

In order to solve the above-mentioned problems and achieve the object, the processing device of the present invention is a processing device that is arranged indoors and includes a holding unit that holds a workpiece, a processing unit that processes the workpiece held by the holding unit, and a processing chamber that houses the holding unit and the processing unit at least while the processing unit processes the workpiece held by the holding unit. The processing device is formed with an exhaust passage that is connected at one end to the processing chamber and at the other end to an opening that opens to the outside of the processing device, a fan arranged in the exhaust passage, and a fan that is arranged in the exhaust passage between the fan and the processing chamber and that flows from the processing chamber to the exhaust passage. and a separation unit that separates the machining chips contained in the exhaust gas discharged from the processing chamber. The separation unit has an inlet at the upper end through which the exhaust gas from the processing chamber flows and an outlet at the lower end, and has a main body that rotates the exhaust gas inside and separates and drops the machining chips contained in the exhaust gas by centrifugal force caused by the rotational flow, and discharges them from the outlet, and a cooling unit that cools the main body. The upper end side of the main body has a gas outlet that discharges the exhaust gas from which the machining chips have been separated, and the gas discharged from the gas outlet of the separation unit is discharged indoors outside the processing device through the exhaust path.

In the processing device, the cooling unit may have a Peltier element and be fixed to the main body.

The present invention has the advantage of being able to exhaust air indoors while minimizing the need to replace parts.

FIG. 1 is a perspective view illustrating an example of the configuration of a processing device according to a first embodiment. FIG. 2 is a vertical sectional view of a main portion of the processing apparatus shown in FIG. FIG. 3 is a perspective view showing a schematic external appearance of a separation unit of the processing apparatus shown in FIG. FIG. 4 is a perspective view that typically shows the inside of the separation unit shown in FIG. FIG. 5 is a cross-sectional view taken along line VV in FIG. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG.

The following describes in detail the form (embodiment) for carrying out the present invention with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. The components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Various omissions, substitutions, or modifications of the configuration can be made without departing from the spirit of the present invention.

[Embodiment 1]
A processing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of the processing apparatus according to the first embodiment. Fig. 2 is a vertical cross-sectional view of a main part of the processing apparatus shown in Fig. 1.

(Workpiece)
The processing device 1 shown in Fig. 1 according to the first embodiment is a cutting device that cuts (corresponding to processing) a workpiece 200. The workpiece 200 to be processed by the processing device 1 shown in Fig. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, which has a substrate made of silicon, gallium arsenide, SiC (silicon carbide), sapphire, or the like. The workpiece 200 has a plurality of planned division lines (not shown) formed in a lattice pattern on a surface 201, and a device (not shown) is formed in each area partitioned by the plurality of planned division lines.

The device may be, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), a MEMS (Micro Electro Mechanical Systems) or a memory (semiconductor memory device).

In the present invention, the workpiece 200 may be a so-called TAIKO (registered trademark) wafer in which the center is thinned and a thick portion is formed on the periphery. In the present invention, the workpiece 200 is not limited to a wafer, and may be any of various plate-shaped workpieces such as a rectangular resin package substrate having multiple devices sealed with resin, a ceramic substrate, or a glass substrate.

In the first embodiment, the workpiece 200 has an adhesive tape 206 attached to the back surface 202 behind the front surface 201, and is supported by the annular frame 205 via the adhesive tape 206. The workpiece 200 in the first embodiment is divided into individual devices along the planned division lines.

(Processing equipment)
The processing device 1 is a cutting device that holds a workpiece 200 in a holding unit 10 and cuts the workpiece 200 along a planned division line with a cutting blade 21 to divide the workpiece 200 into individual devices. The processing device 1 is disposed in a clean room 100 that is indoors. As shown in FIG. 1, the processing device 1 includes a holding unit 10 having a holding surface 11 that suction-holds the workpiece 200, a cutting unit 20 that cuts (corresponding to processing) the workpiece 200 held in the holding unit 10 by the cutting blade 21 along the planned division line, and an imaging unit 30 that images the workpiece 200 held in the holding unit 10.

The processing device 1 also includes a moving unit (not shown) that moves the holding unit 10 and the cutting unit 20 relative to each other. The moving unit includes at least a processing feed unit that processes and feeds the holding unit 10 in the X-axis direction parallel to the horizontal direction, an indexing feed unit that indexes and feeds the cutting unit 20 in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction, a cutting feed unit that cuts and feeds the cutting unit 20 in the Z-axis direction parallel to the vertical direction perpendicular to both the X-axis direction and the Y-axis direction, and a rotational movement unit that rotates the holding unit 10 around an axis parallel to the Z-axis direction.

The processing feed unit moves the holding unit 10 along the X-axis direction relative to the cutting unit 20 by moving the holding unit 10 and the rotational movement unit in the X-axis direction, which is the processing feed direction. The indexing feed unit moves the cutting unit 20 along the Y-axis direction, which is the indexing feed direction, thereby moving the cutting unit 20 and the holding unit 10 relatively along the Y-axis direction. The cutting feed unit moves the cutting unit 20 along the Z-axis direction, which is the cutting feed direction, thereby moving the cutting unit 20 and the holding unit 10 relatively along the Z-axis direction. The rotational movement unit is supported by the processing feed unit, supports the holding unit 10, and is arranged so as to be freely movable in the X-axis direction together with the holding unit 10.

The machining feed unit, the indexing feed unit and the cutting feed unit each include a well-known ball screw that is rotatable about its axis, a well-known motor that rotates the ball screw about its axis, and a well-known guide rail that supports the holding unit 10 or the cutting unit 20 so that it can move freely in the X-axis, Y-axis or Z-axis direction. The rotational movement unit includes a motor that rotates the holding unit 10 about its axis.

The holding unit 10 is disk-shaped, and the holding surface 11 that holds the workpiece 200 is formed from porous ceramics or the like. The holding unit 10 is movable in the X-axis direction by being moved between the processing area below the cutting unit 20 and the loading/unloading area spaced from below the cutting unit 20 where the workpiece 200 is loaded and unloaded, using a processing feed unit. The holding unit 10 is rotatable around an axis parallel to the Z-axis direction by a rotational movement unit.

The holding unit 10 is connected to a vacuum suction source (not shown) and sucks and holds the workpiece 200 placed on the holding surface 11 by being sucked by the vacuum suction source. In the first embodiment, the holding unit 10 sucks and holds the back surface 202 side of the workpiece 200 via an adhesive tape 206. In addition, as shown in FIG. 1, a plurality of clamping parts 12 that clamp the annular frame 205 are provided around the periphery of the holding unit 10.

The cutting unit 20 is a processing unit in which a cutting blade 21 is attached to a spindle 23 and performs cutting processing on a workpiece 200 held by the holding unit 10. The cutting unit 20 is provided so as to be movable in the Y-axis direction by an indexing feed unit relative to the workpiece 200 held by the holding unit 10, and is provided so as to be movable in the Z-axis direction by a cutting feed unit. The cutting unit 20 is capable of positioning the cutting blade 21 at any position on the holding surface 11 of the holding unit 10 by the indexing feed unit and the cutting feed unit.

The cutting unit 20 includes a cutting blade 21, a spindle housing 22 that is movable in the Y-axis and Z-axis directions by an indexing feed unit and a cutting feed unit, a spindle 23 that is rotatably mounted on the spindle housing 22 around its axis and has the cutting blade 21 attached to its tip, a spindle motor (not shown) that rotates the spindle 23 around its axis, and a cutting water supply nozzle 24 that supplies cutting water to the cutting blade 21.

The cutting blade 21 is an extremely thin cutting wheel having a roughly ring shape. In the first embodiment, the cutting blade 21 is a so-called hub blade that includes a circular base and a circular cutting blade that is disposed on the outer periphery of the base and cuts the workpiece 200. The cutting blade is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin, and is formed to a predetermined thickness. In the present invention, the cutting blade 21 may be a so-called washer blade that is composed only of a cutting blade.

The cutting blade 21 is fixed to the tip of the spindle 23, and the cutting blade 21 is rotated by the spindle motor around its axis.

A pair of cutting water supply nozzles 24 are provided, extending parallel to the X-axis direction and spaced apart from each other in the Y-axis direction. The cutting water supply nozzles 24 position the lower end of the cutting edge of the cutting blade 21 between each other, and supply cutting water to the lower end of the cutting edge of the cutting blade 21 during cutting.

The axes of the cutting blade 21 and spindle 23 of the cutting unit 20 are set parallel to the Y-axis direction.

The imaging unit 30 is disposed above the holding unit 10 which moves between the loading/unloading area and the processing area. The imaging unit 30 is equipped with an imaging element which images the area to be cut of the workpiece 200 held in the holding unit 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 images the workpiece 200 held in the holding unit 10, acquires an image, and outputs the acquired image to the control unit.

The processing device 1 also includes an X-axis position detection unit (not shown) for detecting the position of the holding unit 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a reading head. The Z-axis position detection unit detects the position of the cutting unit 20 in the Z-axis direction with motor pulses. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the X-axis position of the holding unit 10 and the Y-axis or Z-axis position of the axis of the spindle 23 and the cutting blade 21 of the cutting unit 20 to the control unit.

In addition, in the first embodiment, the positions in the X-axis direction, the Y-axis direction, and the Z-axis direction of the holding unit 10 and the cutting unit 20 of the processing device 1 are determined based on a predetermined reference position (not shown). In the first embodiment, the positions in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined by the distances in the X-axis direction, the Y-axis direction, and the Z-axis direction from the reference position. Also, in the first embodiment, the reference position in the Z-axis direction is located on the same plane as the holding surface 11.

The processing device 1 also includes a cassette elevator 32 on which a cassette 31 that contains multiple workpieces 200 before and after cutting is placed and which moves the cassette 31 in the Z-axis direction, a cleaning unit 33 that cleans the workpieces 200 after cutting, and a transport unit 50 that takes the workpieces 200 in and out of the cassette 31 and transports the workpieces 200 between the cassette 31, the holding unit 10, and the cleaning unit 33.

The cleaning unit 33 includes a spinner table 35 that holds the workpiece 200 by suction on the holding surface 34 and rotates around an axis parallel to the Z-axis direction, and a cleaning water supply nozzle (not shown) that supplies cleaning water to the workpiece 200 held by suction on the spinner table 35 that rotates around the axis.

The transport unit 50 transports the workpiece 200 inside the processing device 1, and includes a carry-in/out unit 51, a first transport unit 52, and a second transport unit 53. The carry-in/out unit 51 includes a pair of temporary placement rails 54 on which the workpiece 200 is temporarily placed, and an inlet/outlet unit 55 that carries the workpiece 200 before cutting out of the cassette 31 and temporarily places it on the pair of temporary placement rails 54, and carries the workpiece 200 after cutting temporarily placed on the pair of temporary placement rails 54 into the cassette 31. The inlet/outlet unit 55 clamps the end of the annular frame 205 to which the workpiece 200 is attached, and takes the workpiece 200 in and out of the cassette 31.

The first transport unit 52 suction-holds the workpiece 200 temporarily placed on the pair of temporary placement rails 54 and transports it to the holding unit 10 in the loading/unloading area. The first transport unit 52 also transports the cleaned workpiece 200 on the spinner table 35 onto the pair of temporary placement rails 54. The first transport unit 52 is connected to a vacuum suction source (not shown) and includes a suction holding section 56 that suction-holds the workpiece 200 temporarily placed on the pair of temporary placement rails 54 and the workpiece 200 on the spinner table 35 by being sucked by the vacuum suction source.

The second transport unit 53 transports the workpiece 200 after cutting on the holding unit 10 in the loading/unloading area to the spinner table 35 of the cleaning unit 33. The second transport unit 53 is connected to a vacuum suction source (not shown) and has a suction holding section 57 that suction-holds the workpiece 200 on the holding surface 11 of the holding unit 10 in the loading/unloading area by being sucked by the vacuum suction source.

As shown in FIG. 2, the processing device 1 also includes a processing chamber 60. The processing chamber 60 is installed on the device body 2 and houses the holding unit 10 and the cutting unit 20 while the cutting unit 20 performs cutting processing on at least the workpiece 200 held by the holding unit 10. In the first embodiment, the processing chamber 60 houses the holding unit 10 and the cutting unit 20 positioned in the processing area.

2, the processing chamber 60 is surrounded by a partition wall 61 erected from the main body 2, a number of side walls 62 connected to the outer surface of the main body 2, a partition wall (not shown) that separates the loading/unloading area from the processing area, and a ceiling wall 63 that is integrally connected to the upper end of one of the side walls 62. As shown in FIG. 2, the partition wall 61 has an exhaust port 64 formed therethrough.

As shown in FIG. 2, the processing apparatus 1 includes a first exhaust pipe 71, a second exhaust pipe 72, a third exhaust pipe 73, a fan 74, and a separation unit 80. The first exhaust pipe 71, the second exhaust pipe 72, and the third exhaust pipe 73 are formed in a tubular shape, and the inner space serves as an exhaust path 70. The exhaust path 70 is formed in the processing apparatus 1, and one end of the exhaust path 70 is connected to the processing chamber 60 and the other end is connected to an opening 4 that opens to the outside of the processing apparatus 1. That is, the processing apparatus 1 is formed with an exhaust path 70. The exhaust path 70 guides the exhaust gas from the processing chamber 60 to the outside of the processing apparatus 1, i.e., to the clean room 100.

The first exhaust pipe 71 has one end connected to the exhaust port 64 and extends linearly in the horizontal direction (in the Y-axis direction in the first embodiment). The other end of the first exhaust pipe 71 is connected to the inside of the separation unit 80. The second exhaust pipe 72 has one end connected to a gas exhaust port 832 provided at the upper end of the separation unit 80 and extends linearly in the horizontal direction (in the Y-axis direction parallel to the first exhaust pipe 71 in the first embodiment). The third exhaust pipe 73 has one end connected to the other end of the second exhaust pipe 72 and extends linearly in the horizontal direction (in the Y-axis direction parallel to the first exhaust pipe 71 and the second exhaust pipe 72 in the first embodiment). The third exhaust pipe 73 is connected to an opening 4 penetrating the outer wall 3 of the processing device 1.

The fan 74 is disposed in the exhaust path 70. In the first embodiment, the fan 74 is disposed in the second exhaust pipe 72 and above the gas exhaust port 832, and is rotated by the motor 75 about an axis parallel to the Z-axis direction. When the fan 74 is rotated about its axis by the motor 75, it draws gas (hereinafter referred to as exhaust) from the processing chamber 60 into the exhaust path 70 through the exhaust port 64, and discharges the exhaust gas into the processing chamber 60 through the opening 4.

The separation unit 80 is disposed between the fan 74 and the machining chamber 60 in the exhaust path 70, and separates the machining chips 101 contained in the exhaust air discharged from the machining chamber 60 to the exhaust path 70. The machining chips 101 are generated when the cutting blade 21 of the cutting unit 20 cuts the workpiece 200.

(Separation unit)
Next, the separation unit 80 will be described with reference to the drawings. Fig. 3 is a perspective view showing a typical appearance of the separation unit of the processing apparatus shown in Fig. 1. Fig. 4 is a perspective view showing a typical interior of the separation unit shown in Fig. 3. Fig. 5 is a cross-sectional view taken along line V-V in Fig. 3. Fig. 6 is a cross-sectional view taken along line VI-VI in Fig. 5.

As shown in Figures 3 and 4, the separation unit 80 includes a main body 81 and a cooling unit 82. The main body 81 includes a cylindrical portion 83 and a truncated cylindrical portion 84, and is arranged with its axis parallel to the Z-axis direction. An inlet 831 communicating with the other end of the first exhaust pipe 71 penetrates the outer circumferential surface of the cylindrical portion 83. The inlet 831 allows exhaust gas from the first exhaust pipe 71 to flow into the cylindrical portion 83, i.e., the separation unit 80. The upper opening of the cylindrical portion 83 is blocked by an upper wall 833 through which a gas exhaust port 832 penetrates.

The truncated cylindrical section 84 is formed in a cylindrical shape with a gradually decreasing diameter as it extends downward, with the larger diameter side continuing to the lower end of the cylindrical section 83, and an exhaust port 841 formed at the lower end. The main body 81 of the separation unit 80 has an inlet 831 penetrating the cylindrical section 83 and an exhaust port 841 formed at the lower end of the truncated cylindrical section 84, so that the inlet 831 through which exhaust gas from the processing chamber 60 flows in is formed at the upper end side, and the exhaust port 841 is formed at the lower end side. In addition, the upper opening of the cylindrical section 83 of the main body 81 is blocked by an upper wall 833 through which a gas exhaust port 832 penetrates, so that a gas exhaust port 832 for exhausting exhaust gas is formed at the upper end side.

As shown in Figs. 4 and 5, the main body 81 has a partition wall 834 and a liquid supply nozzle 835 arranged inside the cylindrical portion 83. The partition wall 61 faces the inlet 831 and extends in a direction gradually approaching the inner surface of the cylindrical portion 83 as it moves away from the inlet 831, and in the first embodiment, is formed in an arc-shaped cross section along the inner surface of the cylindrical portion 83. The partition wall 61 rotates the exhaust gas flowing in from the inlet 831 along the inner surface of the cylindrical portion 83, i.e., the main body 81, and rotates the exhaust gas around the axis of the cylindrical portion 83, i.e., the main body 81 (i.e., rotates and flows). The liquid supply nozzle 835 supplies liquid to the surface of the partition wall 834 facing the inlet 831 to prevent the processing debris from adhering to the partition wall 834, and discharges the processing debris 101 together with the liquid through the discharge port 841 to the outside of the separation unit 80.

The main body 81 has a partition wall 834 and a liquid supply nozzle 835 arranged inside the cylindrical section 83, so that the exhaust gas rotates around the axis inside the main body 81, and the centrifugal force caused by the rotational flow separates the machining chips 101 contained in the exhaust gas from the exhaust gas, causing them to fall and be discharged from the exhaust port 841.

The cooling unit 82 cools the main body 81. In the first embodiment, the cooling unit 82 has a Peltier element and is fixed to the outer surface of the truncated cylindrical portion 84 of the main body 81. Also, in the first embodiment, a plurality of cooling units 82 are fixed to the outer surface of the truncated cylindrical portion 84 of the main body 81 at intervals in the circumferential direction. The cooling units 82 cool the truncated cylindrical portion 84 of the main body 81 by applying a voltage from a power source (not shown), thereby cooling the inside of the truncated cylindrical portion 84, i.e., the inside of the main body 81.

In the processing device 1 according to the first embodiment, when the cutting unit 20 performs cutting processing while supplying cutting water to the workpiece 200 held by suction in the holding unit 10, the motor rotates the fan 74 around the axis. Then, exhaust gas containing gas, processing waste, and cutting water in mist form is generated in the processing chamber 60, and the exhaust gas flows into the main body 81 of the separation unit 80 through the exhaust port 64 and the inlet 831. The exhaust gas that flows into the main body 81 of the separation unit 80 collides with the partition wall 61 and rotates around the axis as shown by the arrows in Figures 5 and 6.

The exhaust air rotating and flowing inside the main body 81 is separated into gas, machining waste, and cutting water by the centrifugal force of the rotating flow, and is cooled by contacting the main body 81 cooled by the cooling unit 82, and the amount of saturated water vapor is reduced, liquefying and separating the machining waste that has become a mist. In this way, the exhaust air from which the machining waste and cutting water have been separated by the separation unit 80 is discharged from the gas exhaust port 832 to the exhaust path 70, and the gas discharged from the gas exhaust port 832 of the separation unit 80 is discharged through the exhaust path 70 and the opening 4 into the clean room 100 outside the processing device 1.

The control unit also controls each of the components of the processing device 1, causing the processing device 1 to perform processing operations on the workpiece 200. The control unit is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or RAM (random access memory), and an input/output interface device. The arithmetic processing device of the control unit performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the processing device 1 to each of the components of the processing device 1 via the input/output interface device.

The control unit is connected to a display unit consisting of a liquid crystal display device or the like that displays the status and images of the machining operation, an input unit that the operator uses to register machining conditions, and a notification unit that notifies the operator. The input unit is composed of a touch panel provided on the display unit. The notification unit notifies the operator by emitting at least one of sound and light.

The processing device 1 according to the first embodiment described above is provided with a separation unit 80 that is disposed between the fan 74 and the processing chamber 60 in the exhaust path 70 and separates the machining chips 101 contained in the exhaust air that flows from the processing chamber 60 to the exhaust path 70. The separation unit 80 has a main body 81 and a cooling unit 82 that cools the main body 81. The cooling unit 82 cools the inside of the main body 81, thereby reducing the amount of saturated water vapor inside the main body 81, liquefying the cutting water and the like that has become a mist in the exhaust air containing the machining chips 101 that has flowed into the main body 81, and discharging the liquefied cutting water and the like together with the machining chips 101.

For this reason, the processing device 1 discharges purified exhaust gas from the exhaust path 70 into the clean room 100 without providing a filter in the exhaust path 70. As a result, the processing device 1 has the effect of being able to reduce the need to replace parts such as filters while still being able to exhaust gas into the clean room 100.

The present invention is not limited to the above-described embodiment and modified examples. In other words, various modifications can be made without departing from the gist of the present invention. In the first embodiment, the processing device 1 is a cutting device that performs cutting processing on the workpiece 200, but it is not limited to a cutting device, and may be a grinding device that performs grinding processing on the workpiece 200, a polishing device that performs polishing processing on the workpiece 200, or a laser processing device that performs laser processing on the workpiece 200.

1 Processing device 4 Opening 10 Holding unit 20 Cutting unit (processing unit)
60 Processing chamber 70 Exhaust passage 74 Fan 80 Separation unit 81 Main body 82 Cooling unit 100 Clean room (indoor)
101 Processing waste 200 Workpiece 831 Inlet 832 Gas exhaust port 841 Exhaust port

Claims (2)

A processing device that is disposed indoors and includes a holding unit that holds a workpiece, a processing unit that processes the workpiece held by the holding unit, and a processing chamber that houses the holding unit and the processing unit at least while the processing unit processes the workpiece held by the holding unit,
The processing apparatus is provided with an exhaust passage having one end communicating with the processing chamber and the other end communicating with an opening portion opening to the outside of the processing apparatus;
A fan disposed in the exhaust path;
a separation unit disposed in the exhaust passage between the fan and the processing chamber and configured to separate processing debris contained in exhaust gas flowing from the processing chamber into the exhaust passage;
The separation unit comprises:
a main body having an inlet formed at an upper end thereof through which exhaust gas from the processing chamber flows and an outlet formed at a lower end thereof, the main body rotating the exhaust gas inside and separating and dropping machining waste contained in the exhaust gas by centrifugal force caused by the rotating flow, and discharging the waste gas from the outlet;
A cooling unit that cools the main body,
A gas exhaust port is formed on the upper end side of the main body to discharge exhaust gas from which processing debris has been separated, and the gas discharged from the gas exhaust port of the separation unit is discharged through the exhaust path into the room outside the processing apparatus. The processing device according to claim 1, wherein the cooling unit has a Peltier element and is fixed to the main body.