JP5800666B2 - Processing equipment - Google Patents

Description

  The present invention relates to a processing apparatus for processing a workpiece such as a semiconductor wafer, and more particularly to a processing apparatus including a fan and an exhaust path for exhausting an atmosphere in a processing chamber.

  In the semiconductor device manufacturing process, lattice-shaped division lines are set on the surface of a wafer made of a semiconductor material such as silicon or gallium arsenide, and devices such as ICs and LSIs are formed in each region partitioned by the division lines. .

  Such a wafer is divided into a large number of device chips by cutting along the scheduled dividing line after the back surface is ground and thinned to a predetermined thickness. The device chip thus obtained is packaged with resin or ceramics and mounted on various electric devices.

  As a device that divides a wafer, a cutting device that cuts a rotating cutting blade into a wafer along a planned dividing line is generally used, and a grinding wheel that rotates on the back surface of the wafer is used for grinding the back surface of the wafer. A grinding device for pressing and grinding is used.

  In a processing apparatus such as this type of cutting apparatus or grinding apparatus, a configuration in which a workpiece held by a chuck table is processed in a sealed processing chamber by a processing means such as a cutting blade or a grinding wheel.

  In the processing, the processing is performed while supplying the processing liquid to the processing point where the processing means contacts the workpiece. The machining fluid is supplied for the purpose of removing the machining waste generated by machining from the workpiece or cooling the machining point, and the machining fluid mixed with the machining waste is discharged out of the machining apparatus as waste liquid.

  On the other hand, the atmosphere in the processing chamber is exhausted outside the apparatus through a duct (exhaust passage), and a fan is provided in the middle of the duct to suck the atmosphere in the processing chamber into the duct and send it to the exhaust port. Some processing apparatuses include a duct and a fan (see, for example, Japanese Patent Laid-Open No. 2000-124165).

JP 2000-124165 A

  By the way, in the processing apparatus having such a configuration, when processing liquid (waste liquid) mixed with processing waste is mixed into the exhaust from the processing chamber, processing waste adheres to the fan, and the rotation of the fan is reduced or vibration is generated. As a result, the suction force may be reduced.

  Also, in the case of a machining device that circulates and uses the machining fluid circulation path (circulation line), the machining fluid is discharged from the circulation line when the machining fluid enters the exhaust from the machining chamber. Therefore, there is a problem that the machining fluid must be replenished frequently.

  The present invention has been made in view of the above points, and the object of the present invention is to separate the processing liquid (waste liquid) mixed in the exhaust from the processing chamber from the exhaust so that foreign matter adheres to the fan. The present invention provides a machining apparatus capable of reducing fear, reducing a suction force of a fan, and reducing the disappearance of the machining liquid when the machining liquid is circulated and used.

According to the present invention, a chuck table for holding a workpiece, a processing means for processing the workpiece held by the chuck table, and a processing liquid supply means for supplying a processing liquid to the processing means and the workpiece. A processing chamber that surrounds the chuck table, the processing means, and the processing fluid supply means, and an exhaust passage that exhausts the atmosphere in the processing chamber with one end communicating with the processing chamber and the other end communicating with a fan. And a separation device that is disposed in the exhaust passage between the processing chamber and the fan and separates waste liquid contained in the exhaust gas flowing into the exhaust passage from the processing chamber from the gas. The separation means further comprises a bottom portion having an intake port which is disposed at one end and communicates with the exhaust port of the processing chamber via an upstream exhaust passage , and a gas exhaust which communicates with the fan at the upper end portion. A rising part having an outlet, the bottom part and the rising part A J-shaped tubular body composed of a bent portion connecting the Ri portion, a waste liquid discharge port for discharging a waste liquid formed in the bottom portion of the J-shaped tubular body, the waste liquid which communicates with the waste liquid discharge port a discharge passage, seen including, when the fan is driven, the processing chamber atmosphere is evacuated through the J-shaped tubular body, the inner peripheral side of the bent portion when the exhaust gas passes through the bent portion The difference in speed between the outer peripheral side and the outer peripheral side causes a pressure difference to generate a rotationally rising air flow in the J-shaped cylindrical main body, and the exhaust is sucked into the fan through the gas discharge port, and the waste liquid contained in the exhaust Is separated from the exhaust by gravity and discharged from the waste liquid discharge port .

  Since the processing apparatus of the present invention includes a separation means for separating the waste liquid contained in the exhaust gas from the gas in the exhaust passage, it is possible to reduce the risk of processing dust adhering to the fan and to prevent a decrease in the suction power of the fan. When the machining fluid is circulated and used, the disappearance of the machining fluid can be reduced.

  Since the separating means of the present invention is composed of a cylindrical main body having a bottom portion, a rising portion and a bent portion connecting the bottom portion and the rising portion, the structure is simple and can be manufactured relatively easily and inexpensively.

Although exhaust gas flowing from the intake port flows in the rising portion through the bend portion, the pressure difference by the difference inner and the outer peripheral side speed of passing through the bent portion occurs inside the cylindrical main body A rotating updraft is generated. Exhaust This rotation updraft is discharged to the gas outlet, the waste liquid contained in the exhaust is efficiently separated from the exhaust by gravity, and is discharged from the waste liquid discharge port.

It is an external appearance perspective view of a cutting device. It is a longitudinal cross-sectional view of the principal part of a cutting device.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, an external perspective view of a cutting device (dicing device) 2 according to an embodiment of the present invention, which is a kind of processing device, is shown. On the front side of the cutting apparatus 2, an operation panel 4 is provided for an operator to input instructions to the apparatus such as machining conditions.

  The wafer W to be cut is attached to a dicing tape T that is an adhesive tape, and the outer peripheral edge of the dicing tape T is attached to an annular frame F. As a result, the wafer W is supported by the annular frame F via the dicing tape T, and a plurality of wafers (for example, 25 sheets) are accommodated in the wafer cassette 6. The wafer cassette 6 is placed on a cassette elevator 8 that can move up and down.

  Behind the wafer cassette 6, a loading / unloading means 10 for unloading the wafer W before cutting from the wafer cassette 6 and loading the wafer after cutting into the wafer cassette 6 is disposed. Between the wafer cassette 8 and the loading / unloading means 10, a temporary placement area 12, which is an area on which a wafer to be carried in / out, is temporarily placed, is provided. Positioning means 14 for positioning at a certain position is provided.

  In the vicinity of the temporary placement area 12, transport means 16 having a turning arm that sucks and transports the frame F integrated with the wafer W is disposed, and the wafer W carried to the temporary placement area 12 is It is sucked by the transport means 16 and transported onto the chuck table 18 and is sucked by the chuck table 18 and is held on the chuck table 18 by fixing the frame F by a plurality of clamps 19.

  The chuck table 18 is configured to be rotatable and reciprocally movable in the X-axis direction, and an alignment unit 20 that detects a street of the wafer W to be cut is located above the movement path of the chuck table 18 in the X-axis direction. It is arranged.

  The alignment unit 20 includes an imaging unit 22 that images the surface of the wafer W, and can detect a street to be cut by processing such as pattern matching based on an image acquired by imaging. The image acquired by the imaging unit 22 is displayed on a display monitor (not shown).

  On the left side of the alignment unit 20, a cutting unit 24 for cutting the wafer W held on the chuck table 18 is disposed. The cutting unit 24 is configured integrally with the alignment unit 20, and both move together in the Y-axis direction and the Z-axis direction.

  The cutting unit 24 is configured by attaching a cutting blade 28 to the tip of a rotatable spindle 26 and is movable in the Y-axis direction and the Z-axis direction. The cutting blade 28 is located on the extended line of the imaging unit 22 in the X-axis direction.

  The wafer W that has been subjected to the cutting process is transported to the spinner cleaning device 27 by the transport means 25, cleaned by the spinner cleaning device 27, and spin-dried.

  The above-described mechanism portion of the cutting device 2 is accommodated in the housing 30. The housing 30 includes a frame 32 and a transparent plate 34 formed from acrylic resin or the like attached to the frame 32.

  The operator can access the chuck table 18 by grasping the handle 36 and opening and closing the cover 37, and can access the cutting unit 24 by grasping the handle 38 and opening and closing the cover 39.

  Further, by grasping the handle 40 and opening and closing the cover 41, the wafer cassette 6 can be placed on the cassette elevator 8, or the wafer cassette 6 can be taken out from the cassette elevator 8.

  Referring to FIG. 2, a cross-sectional view of the main part of the cutting device 2 according to the embodiment of the present invention is shown. A processing chamber 31 is defined in the housing 30 of the cutting apparatus 2. A wafer W held on the chuck table 18 and a cutting unit 24 are accommodated in the processing chamber 31. Cutting fluid supply nozzles 29 are disposed on both sides of the cutting blade 28 of the cutting unit 24.

  A partition wall 42 is provided on the rear side (left side in FIG. 2) of the processing chamber 31, and an exhaust port 43 is formed in the partition wall 42. One end of an exhaust path (duct) 44 communicates with the exhaust port 43. The other end of the exhaust path 44 communicates with a fan 45 installed in the cutting apparatus 2, and an exhaust pipe 46 extending to the outside of the cutting apparatus 2 is connected to the other end side of the exhaust path 44.

  A separation means (separation unit) 48 for separating the exhaust gas into a gas and a liquid is disposed between the processing chamber 31 and the fan 45 in the middle of the exhaust path 44. Here, the exhaust passage 44 is divided into two parts between the processing chamber 31 and the separation means 48 and between the separation means 48 and the fan 45, the former being the upstream exhaust passage 44A and the latter being the downstream exhaust passage 44B. To do. The exhaust pipe 46 is connected to the end of the downstream exhaust path 44B.

  The separating means 48 includes a J-shaped cylindrical main body 50 having a bottom portion 50a, a rising portion 50b, and a bent portion 50c connecting the bottom portion 50a and the rising portion 50b. The J-shaped cylindrical main body 50 is connected to the upstream exhaust path 44A at one end of the bottom 50a. 52 is an annular connecting member having a sealing function.

The J-shaped cylindrical main body 50 forms an intake port 54 that communicates with the processing chamber 31 via the upstream exhaust passage 44A at one end of the bottom portion 50a, and a gas exhaust port 56 that communicates with the fan 45 at the upper end portion of the rising portion 50b. Configure. A waste liquid discharge port 58 for discharging the waste liquid is formed in the bottom 50 a, and a waste liquid discharge path 60 is connected to the waste liquid discharge port 58 .

  In the cutting apparatus 2 of the present embodiment, when the fan 45 is driven, the atmosphere in the processing chamber 31 is sucked into the upstream exhaust passage 44 </ b> A through the exhaust port 43 and constitutes the separation unit 48. It is introduced into the J-shaped cylindrical main body 50 from the 50 intake ports 54.

  Then, the gas passes through the bent portion 50 c and the rising portion 50 b of the J-shaped cylindrical main body 50, is discharged to the downstream exhaust passage 44 </ b> B through the gas discharge port 56, and is exhausted to the outside of the cutting device 2 through the exhaust pipe 46.

  In this manner, the atmosphere in the processing chamber 31 is exhausted, whereby the inside of the processing chamber 31 is maintained in a clean atmosphere. In the separation unit 48 through which the exhaust passes, when the exhaust passes through the bent portion 50c of the J-shaped cylindrical main body 50, a pressure difference is generated due to the difference in speed between the inner peripheral side and the outer peripheral side of the bent portion 50c. A rotating updraft is generated in the cylindrical main body 50. That is, in the J-shaped cylindrical main body 50, the exhaust gas rotates in a spiral shape and is then discharged to the downstream exhaust passage 44B through the upper gas discharge port 56.

  At the time of cutting the wafer W, cutting is performed by the cutting blade 28 while supplying the cutting fluid from the cutting fluid supply nozzle 29, and the cutting fluid is splashed up by the rotating cutting blade 28 and scattered in a mist form.

  This mist-like cutting fluid is a waste fluid, and in many cases, foreign matter such as machining scraps are mixed therein, and in a state of being mixed in the exhaust gas, the separation unit passes from the exhaust port 43 through the upstream exhaust passage 44A. It is introduced into the J-shaped cylindrical main body 50 through 48 intake ports 54.

  The exhaust gas containing the waste liquid introduced into the J-shaped cylindrical main body 50 has a pressure difference due to a difference in speed when passing through the bent portion 50c, and a swirl updraft is generated by this pressure difference. The waste liquid contained in the exhaust is efficiently separated from the exhaust by gravity, and is discharged from the waste liquid discharge port 58 to the waste liquid discharge path 60. On the other hand, the exhaust gas from which the waste liquid has been separated rides on a spiral rising airflow and is discharged from the gas discharge port 56 to the downstream exhaust path 44B.

  Thus, even if the atmosphere in the processing chamber 31 containing the mist-like waste liquid is exhausted, the exhaust is separated into gas and liquid by passing through the separation unit 48, and only the gas is discharged from the gas discharge port 56. The waste liquid containing foreign matter is discharged from the waste liquid discharge port 58.

  Accordingly, the mist-like waste liquid does not pass through the fan 45, and therefore, the possibility that foreign matters such as processing waste contained in the waste liquid adhere to the fan 45 is reduced. As a result, a reduction in the suction force of the fan 45 is prevented.

  When the machining device 2 is provided with a machining fluid circulation line and circulates the machining fluid, the waste fluid discharge port 58 of the J-shaped cylindrical main body 50 is connected to the circulation line via a filtration device. , Loss of the processing liquid can be reduced.

  In the embodiment described above, the example in which the fan 45 and the separating means 48 are disposed in the processing apparatus 2 has been described. However, an exhaust facility having a fan for exhausting the atmosphere in the processing chamber is provided in the factory where the processing apparatus is installed. In such a case, the separation means 48 may be provided in the exhaust equipment.

  In the above-described embodiment, the example in which the present invention is applied to the cutting apparatus has been described. However, the present invention is not limited to the cutting apparatus, and can be applied to various processing apparatuses such as a grinding apparatus, a polishing apparatus, and a cutting tool.

2 Cutting device 24 Cutting unit 28 Cutting blade 30 Housing 31 Processing chamber 44 Exhaust passage 45 Fan 46 Exhaust pipe 48 Separating means 50 J-shaped cylindrical main body 50a Bottom portion 50b Bending portion 50c Bending portion 54 Inlet port 56 Gas outlet port 58 Waste liquid discharge Exit

Claims (1)

A chuck table for holding a workpiece, a processing means for processing the workpiece held by the chuck table, a processing fluid supply means for supplying a processing fluid to the processing means and the workpiece, and the chuck table And a machining chamber that surrounds the machining means and the machining fluid supply means, and an exhaust passage that has one end communicating with the machining chamber and the other end communicating with a fan and exhausting the atmosphere in the machining chamber. A device,
Further comprising a separating means disposed in the exhaust path between the processing chamber and the fan and separating the waste liquid contained in the exhaust gas flowing into the exhaust path from the processing chamber from the gas;
The separating means includes a bottom portion having an intake port disposed at one end and communicating with the exhaust port of the processing chamber via an upstream exhaust passage, and a rising portion having a gas discharge port communicating with the fan at an upper end portion. A J-shaped cylindrical body composed of a bent portion connecting the bottom portion and the rising portion;
A waste liquid discharge port for discharging the waste liquid formed at the bottom of the J-shaped cylindrical body;
And waste liquid discharge passage communicating with the waste liquid discharge port, seen including,
When the fan is driven, the atmosphere in the processing chamber is exhausted through the J-shaped cylindrical main body, and when the exhaust passes through the bent portion, the velocity on the inner peripheral side and the outer peripheral side of the bent portion is increased. Due to the difference, a pressure difference is generated, and a rotationally rising air flow is generated in the J-shaped cylindrical main body. The exhaust is sucked into the fan through the gas discharge port, and the waste liquid contained in the exhaust is separated from the exhaust by gravity. And a processing apparatus which is discharged from the waste liquid discharge port .

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