JP5446027B2 - Dicing machine - Google Patents

Description

  The present invention relates to a dicing apparatus that divides a workpiece such as a wafer on which a semiconductor device or an electronic component is formed into individual chips.

  A dicing apparatus for cutting or grooving a workpiece such as a wafer on which a semiconductor device or an electronic component is formed includes at least a blade that is rotated at high speed by a spindle, a work table that holds the workpiece, and a work table and a blade. X, Y, Z, and θ movement axes that change the relative positions of the two. When machining a workpiece, cutting fluid for cooling and lubrication is supplied from the nozzle to a rotating blade or a machining point where the workpiece and the blade are in contact with each other. To be applied. In this processing, contaminants such as grinding scraps (referred to as contamination or contamination) are generated from the workpiece, and the contamination remaining on the workpiece becomes a serious problem of lowering the quality of the semiconductor device or electronic component.

  Usually, the dicing apparatus is provided with various cleaning liquid jet nozzles or cleaning apparatuses in order to remove the contaminants adhering to the workpiece. However, a part of the generated contamination is scattered with the cutting fluid by the rotation of the blade, becomes a mist and floats in the apparatus, or the cutting fluid containing contamination moves with the blade and comes into contact with the workpiece again, It was a cause of contaminating the workpiece.

For such problems, dicing equipped with an exhaust duct that efficiently raises the suction force by sending used high-pressure air to the exhaust duct that removes mist-like contamination and efficiently exhausts the mist-like contamination An apparatus has been proposed (see, for example, Patent Document 1).
JP-A-10-308366

  However, in the dicing device described in Patent Document 1, the suction port of the exhaust duct is opened from the front side to the rear side of the processing portion where dicing is performed as viewed from the front of the dicing device, so that the suction force is increased. Even if the amount of the mist-like contamination is increased, it is difficult to suck the cutting fluid containing the contamination scattered from the rotating blade. For this reason, there has been a problem that contamination that hits a wall or the like and does not form a mist and bounces directly adheres to the workpiece and contaminates the workpiece again.

  Further, mist-like contaminants that are not in the vicinity of the suction port take time to be sucked, and there is a problem that they fall on the workpiece before suction and contaminate the workpiece again. Further, since the blade rotates at a high speed, there is a problem that not only the contamination scattered in the rotation direction but also the cutting fluid containing the contamination rotates together with the blade and again strikes the blade and contaminates the workpiece.

  The present invention has been made with respect to such a problem, and provides a dicing apparatus and a dicing method that efficiently removes contamination generated during dicing and performs high-quality dicing that does not reattach to a workpiece. It is an object.

  In order to achieve the above object, the present invention provides a disk-shaped blade, a spindle that rotates the blade, a cover that is provided on the spindle and covers the blade, and is cut by the blade. A work table for holding the work to be performed, a moving shaft for relatively moving the work table and the blade, a cutting water nozzle for injecting a cutting fluid near a processing point where the work and the blade are in contact with each other, The blade is disposed in the vicinity of the blade with the inlet facing the direction of rotation at the machining point of the blade, and the cutting fluid after machining is sucked from the inlet by injecting fluid toward the nozzle. And suction means including one or more nozzles.

  According to the first aspect of the present invention, the dicing apparatus has a workpiece such as a wafer on which a semiconductor device or an electronic component held on a work table is formed and a blade rotating at high speed by a spindle in X, Y, Z, and θ directions. The work is cut or grooved while being moved relatively by each moving shaft and supplying cutting fluid by a cutting water nozzle. The blade is covered by a cover attached to the spindle. In the vicinity of the processing point where the workpiece and the blade come into contact, there is provided a suction means provided with one or more nozzles for sucking the processed cutting fluid from the introduction port by spraying the fluid toward the ejection port.

  At this time, the cutting fluid containing contaminants scattered in the rotation direction by the blade is scattered toward the nozzle inlet port directed in the direction opposite to the rotation direction at the processing point of the blade. As a result, the cutting fluid containing contamination is forcibly discharged by the suction means to a remote location or outside the device that does not affect the workpiece, and there is no contamination scattered inside the device, and there is no re-attachment of contamination to the workpiece. Dicing is possible.

  The invention of claim 2 is a disk-shaped blade, a spindle that rotates the blade, a cover that is provided on the spindle and covers the blade, a work table that holds a work to be cut by the blade, A moving shaft for relatively moving the work table and the blade, a cutting water nozzle for injecting a cutting fluid near a processing point where the work and the blade are in contact, and a rotational direction of the blade at the processing point A suction means having a plurality of nozzles arranged near the blade with the introduction port directed in the direction and sucking the processed cutting fluid from the introduction port by spraying the fluid toward the ejection port. The cover has a separation block in which a slit wider than the thickness of the blade is formed, and the blade passes through the slit. It is characterized in that it and provided so as to be positioned in the middle of plurality the nozzle was in earthenware pots.

  According to the second aspect of the present invention, the dicing apparatus uses a workpiece such as a wafer on which a semiconductor device or an electronic component formed on a work table is formed and a blade rotating at high speed by a spindle in X, Y, Z, and θ directions. The work is cut or grooved while being moved relatively by each moving shaft and supplying cutting fluid by a cutting water nozzle. The blade is covered by a cover attached to the spindle. In the vicinity of the processing point where the workpiece and the blade come into contact, there is provided a suction means provided with one or more nozzles for sucking the processed cutting fluid from the introduction port by spraying the fluid toward the ejection port.

  At this time, the cutting fluid containing contaminants scattered in the rotation direction by the blades is separated into cutting water containing contaminants and mist containing contaminants before and after the separation block.

  As a result, the cutting water containing contamination is sucked from the nozzle upstream of the separation block in the rotation direction, and the mist containing contamination is sucked from the nozzle downstream of the separation block in the rotation direction. The The cutting fluid and mist containing contaminants are forcibly discharged by a suction means to a remote location that does not affect the workpiece or outside the device, so that there is no contamination scattered inside the device, and there is no re-attachment of contaminants to the workpiece. Dicing can be performed.

  According to a third aspect of the present invention, in the second aspect of the present invention, the nozzle located on the upstream side in the rotational direction of the blade is formed so that the flow rate of the cutting water after processing is larger than the nozzle located on the downstream side. It is characterized by being. According to a fourth aspect of the present invention, in the third aspect of the present invention, the nozzle located on the upstream side in the rotation direction of the blade has a diameter of the flow path from the inlet to the outlet rather than the nozzle located on the downstream side. Is characterized by large.

  According to the third and fourth aspects of the invention, of the plurality of nozzles, the nozzle located on the upstream side in the blade rotation direction is a large-capacity type nozzle that has a large flow rate of suctioned cutting water. . As a method of increasing the flow rate, the diameter of the flow path from the inlet of the nozzle located on the upstream side to the jet outlet is formed larger than that of the nozzle located on the downstream side. As a result, the upstream nozzle can mainly suck a large amount of cutting water.

  According to a fifth aspect of the present invention, in the second aspect of the invention, the nozzle located on the downstream side in the rotational direction of the blade is formed to have a higher suction force than the nozzle located on the upstream side. It is a feature. Further, in the invention of claim 6 according to the invention of claim 5, the nozzle located on the downstream side in the rotation direction of the blade is a flow path from the inlet to the outlet of the fluid to be injected toward the outlet. The jet angle with respect to is characterized by being an acute angle with respect to the nozzle located on the upstream side.

  According to the fifth and sixth aspects of the present invention, among the plurality of nozzles, the nozzle located on the downstream side in the blade rotation direction is a high-pressure type nozzle having a high suction force. As a method of increasing the suction force, the jet angle with respect to the flow path from the inlet to the jet port of the fluid jetted toward the nozzle jet port located on the downstream side becomes sharper than the nozzle located on the upstream side. Yes. Thereby, the mist containing the contamination separated by the separation block is mainly sucked in the downstream nozzle.

  A seventh aspect of the present invention is the guide member according to the first or second aspect of the present invention, wherein the cutting fluid ejected from the ejection port flows in a predetermined direction on the ejection port side of the nozzle. It is characterized by being provided.

  According to the seventh aspect of the present invention, a guide member is provided on the nozzle outlet side for guiding the processed cutting fluid sprayed to a remote location or outside the apparatus without affecting the workpiece. As a result, the processed cutting fluid sucked from the inlet and sprayed from the outlet does not scatter into the apparatus, and contamination does not reattach to the workpiece.

  According to an eighth aspect of the present invention, in the first or second aspect of the present invention, the guide member has a suction port that opens toward the jet port at one end and extends from the suction port toward the discharge port. It is characterized by being a cylindrical member whose inside is inclined, or a partition located between the work table and the nozzle outlet.

  According to the invention of claim 8, the guide member is a cylindrical member whose inside is inclined so as to expand from the suction port that opens toward the nozzle outlet to the outlet, or between the work table and the nozzle outlet. It forms the shape of the partition located between and extending horizontally.

  Due to the shape expanded toward the discharge port, the cutting fluid does not return to the suction means, and the processed cutting fluid does not fall again onto the workpiece. In addition, since it is located between the work table and the nozzle outlet and extends horizontally in the horizontal direction, the processed cutting fluid sprayed from the outlet does not fall again onto the workpiece, and these do not cause re-adhesion. Quality dicing can be performed.

  According to a ninth aspect of the present invention, in the first or second aspect of the present invention, a block having an inclined surface directed in the same direction as the rotation direction of the blade is provided at a lower portion of the suction means. It is said.

  According to the ninth aspect of the present invention, the suction unit lower portion is provided with a block on which an inclined surface inclined at 0 ° or more and 90 ° or less in the same direction as the rotation direction is provided.

  As a result, the gap between the workpiece and the suction means is narrowed and it becomes difficult for the cutting water containing contaminants to flow before the suction means, and the suction efficiency is increased because the inclined surface makes it easier to be sucked by the suction means.

  According to a tenth aspect of the present invention, in the first or second aspect of the present invention, a block in which an injection port for injecting a fluid downward in a band shape or a fan shape is formed at the lower portion of the suction means. It is characterized by.

  According to the invention of claim 10, the lower portion of the suction means is provided with a block in which an injection port for injecting a fluid such as water in a band shape or a fan shape is formed downward toward the work table.

  As a result, the gap between the workpiece and the suction means is narrowed and the cutting water containing contamination is less likely to flow before the suction means, and the cutting water containing contamination is blocked by the fluid jetted in a belt shape, Since cutting water is easily sucked, suction efficiency is increased.

  According to an eleventh aspect of the present invention, in the invention according to the first or second aspect, the cover has a belt-like or fan-like shape near the processing point so as to face the rotation surface of the blade on both sides of the rotation surface of the blade. A suction assist nozzle for ejecting fluid is provided.

  According to the invention of claim 11, a fluid such as band-shaped or fan-shaped water is ejected from both sides of the blade to the vicinity of the processing point by the suction auxiliary nozzle. As a result, the cutting water containing contamination flows in the direction of the suction means without flowing to both sides in the blade rotation direction, and is easily sucked by the suction means.

  As described above, according to the dicing apparatus of the present invention, it is possible to efficiently remove the contamination generated during dicing and perform high-quality dicing that does not reattach to the workpiece.

  A preferred embodiment of a dicing apparatus according to the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a perspective view showing an external appearance of a dicing apparatus, FIG. 2 is a front view showing a configuration of a wheel cover, and FIG. 3 is a sectional view of a nozzle.

  The dicing apparatus 1 includes a load port 51 that transfers a cassette in which a plurality of workpieces W are stored with an external device, a transport unit 53 that has a suction portion 54 and transports the workpiece W to each part of the device, and a workpiece W. A work table 23 to be placed, a processing unit 20 for processing the workpiece W, and a spinner 52 for cleaning and drying the processed workpiece W are provided. The operation of each part of the dicing apparatus 1 is controlled by a controller 90 as control means.

  The processing unit 20 is provided with an imaging unit 81 that images the surface of the workpiece W in the vicinity thereof. The imaging unit 81 is disposed so as to be opposed to each other. Are provided with high frequency motor built-in type spindles 22, 22.

  Both of the spindles 22 are rotated at a high speed of 30,000 rpm to 80,000 rpm, and index feed in the Y direction and cut feed in the Z direction are independently performed by a moving shaft (not shown). Furthermore, the work table 23 on which the work W is sucked and placed is configured to be ground and fed in the X direction in the figure by a moving shaft (not shown), and the machining point B of the blade 10 that rotates at high speed by these operations. However, the workpiece W comes into contact with the workpiece W, and the workpiece W is diced in the X and Y directions.

  As the blade 10, an electrodeposition blade in which diamond abrasive grains or CBN abrasive grains are electrodeposited with nickel, a metal resin bond blade bonded with a resin mixed with metal powder, or the like is used. The dimensions of the blade 10 are variously selected depending on the processing contents. When dicing a normal semiconductor wafer as a workpiece, a blade having a diameter of about 50 mm and a thickness of about 30 μm is used.

  As shown in FIG. 2, the wheel cover 11 is attached to the spindle 22 so as to cover the blade 10 sandwiched between the flanges 36 and fixed to the rotating shaft 37 of the spindle 22 together with the flanges 36.

  The wheel cover 11 is provided with a cover main body 38 fixed to the spindle, a plate 44 for preventing cutting water scattering, a cover front portion 31 attached to the cover main body 38 from the front, and a side surface of the cover main body 38 via the manifold 12. A vacuum unit 13 as an attached suction means, a cut nozzle 34 for supplying cutting water mainly for the purpose of cleaning, and a pair of blade nozzles 35 and 39 for supplying cutting water mainly for cooling of the blade Composed.

  As shown in FIG. 3, nozzles 14 and 15 for sucking cutting water and mist-like contaminants generated when machining the workpiece W are attached to the manifold 12 that attaches the vacuum unit 13 to the cover body 38. It has been.

  As shown in FIG. 4, the nozzles 14 and 15 are formed with inlets 14B and 15B and jet outlets 14C and 15C on the left and right sides of the nozzle main bodies 14A and 15A, respectively, and jet nozzles 14C and 15C at an intermediate portion of the nozzle main bodies 14A and 15A. There are provided injection ports 14D and 15D formed in a circular shape or a slit shape for injecting a fluid such as air obliquely toward the surface.

  The nozzles 14 and 15 generate a negative pressure in the nozzles 14 and 15 by ejecting fluid from the ejection ports 14D and 15D, and suck the fluid from the introduction ports 14B and 15B to be discharged from the discharge ports 14C and 15C. As a result, the nozzles 14 and 15 suck the cutting water and mist-like contaminants from the wheel cover 11 with the fluid supplied from the joint 45 attached to the manifold 12 and discharge them to the cylindrical member 13A.

  At this time, the nozzle 15 located on the upstream side in the rotation direction A of the blade 10 has a larger diameter from the introduction port 15B to the jet port 15C than the nozzle 14 located on the downstream side, and sucks the processed cutting water. The flow rate is increased. Thereby, the upstream nozzle 15 can mainly suck a large amount of cutting water.

  In contrast, the nozzle 14 located on the downstream side is formed such that the angle of the injection port 14D with respect to the flow path from the introduction port 14B to the injection port 14C is more acute than that of the nozzle 15. Thereby, the ejection angle with respect to the flow path of the fluid ejected toward the ejection port 14 </ b> C becomes an acute angle than the nozzle 15, and the suction force becomes higher. Therefore, the downstream nozzle 14 can suck more mist including contamination.

  As shown in FIG. 2, the cylindrical member 13A is inclined so as to expand from the suction port side where the nozzles 14 and 15 are provided toward the discharge port on the opposite side, and a protruding portion 13B is provided on the periphery of the discharge port. It has been. As a result, the cutting water discharged from the nozzles 14 and 15 does not return to the suction port side again through the cylindrical member 13A, and when discharged, the cutting water rolls up at the protruding portion 13B and is negative pressure inside the cylindrical member 13A. To increase the effect of sucking cutting water.

  The manifold 12 is provided with a separation block 16 having a slit wider than the thickness of the blade 10 so as to be positioned between the nozzles 14 and 15 so that the blade 10 passes through the slit.

  When the blade 10 rotates in the direction of arrow A shown in FIG. 3 to process the workpiece W, the separation block 16 removes cutting fluid containing contamination that is generated at the processing point B and is wound up as the blade 10 rotates. Remove from blade 10 before contacting W again. The separated cutting water is mainly sucked from the nozzle 15 in front of the separation block 16 with respect to the rotation direction A of the blade 10, and the mist containing the remaining contamination from the nozzle 14 after the separation block 15. Contaminated contaminants are mainly sucked.

  Furthermore, a block 17 having an inclined surface formed in the same direction as the rotation direction A of the blade 10 is attached to the lower portion of the manifold 12. As shown in FIG. 5, the block 17 is formed with an inclined surface 17 </ b> A that is inclined at 0 degree or more and 90 degrees or less in the same direction as the rotation direction of the blade 10. The fluid is sprayed in a band shape toward the wafer W surface (in the direction of arrow C). Further, the interval p between the lower surface of the block 17 and the wafer W is slightly larger than the minimum value at which the workpiece W and the block 17 do not contact during processing (for example, 0.5 mm to 5 mm). Is attached.

  Thereby, the clearance gap between the workpiece | work W and the block 17 becomes narrow, it becomes difficult for the cutting water containing a contamination to flow ahead of the vacuum unit 13, and suction efficiency is improved. Further, the cutting water containing the contaminants is blocked by the fluid jetted in a band shape, and it is easy to rise up the inclined surface 17A and be sucked by the nozzles 14 and 15.

  Subsequently, the lower portion of the cover main body 38 and the cover front portion 31 is sucked to inject a fluid in a band shape near the processing point B so as to face the rotation surface of the blade 10 (in the direction of arrow E) as shown in FIG. Auxiliary nozzles 18, 18 are provided.

  As a result, a fluid wall is formed on both sides of the processing point B by a fluid such as pure water supplied from a supply means (not shown) and ejected in a strip shape from the suction auxiliary nozzles 18, 18. The cutting water containing the water flows in the direction of the vacuum unit 13 without flowing to both sides in the rotation direction A of the blade 10 and is easily sucked by the nozzles 14 and 15. The suction auxiliary nozzles 18 and 18 can be replaced by blade nozzles 35 and 39.

  Further, the cover front part 31 is provided with a plate 44 for preventing the scattering of cutting water, and closes the cover front part 31 so that the rotation surface of the blade 10 is hidden by 25% or more. Further, as shown in FIG. 3, the plate 44 and the cover front portion 31 are attached to the cover body 38 so as to be openable and closable with the shaft 19 as a rotation axis. Thereby, the cutting water generated at the processing point B and wound up with the rotation of the blade 10 does not scatter to the front side from the cover front part 31 and the suction efficiency at the nozzle 14 is improved, and the front part of the cover can be easily obtained. 31 can be opened and closed to facilitate replacement of the blade 10.

  With the dicing apparatus 1 including the wheel cover 11 having such a configuration, it is possible to efficiently remove the contamination generated during dicing and to perform high-quality dicing that does not reattach to the workpiece W.

  In the present invention, instead of the cylindrical member 13A, a partition wall 60 is provided between the work outlets 14C and 15C of the nozzles 14 and 15 and the work table 23 as in the wheel cover 11A shown in FIG. However, it can be suitably implemented. Thereby, the cutting water after processing including the contamination ejected from the ejection ports 14C and 15C does not fall on the partition wall 60 and again fall on the workpiece W, and there is no reattachment of the cutting fluid or the like containing contamination. High quality dicing can be performed.

  Next, the operation of the dicing apparatus according to the present invention will be described. In the dicing apparatus 1, a cassette storing a plurality of workpieces W is first placed on the load port 51 (not shown) or manually. The work W is taken out from the placed cassette and is placed on the work table 23 by the conveying means 53.

  The surface of the work W placed on the work table 23 is imaged by the image pickup means 81, and the position of the line to be diced on the work W and the position of the blade 10 are X, Y, and θ (not shown). The work table 23 is adjusted and adjusted by the movement axis.

  When the alignment is completed and dicing is started, the spindle 22 starts rotating, the blade 10 rotates at a high speed, cutting fluid is supplied from the cut nozzle 34 and the blade nozzles 35 and 39, and the block 17, Fluid is ejected from the suction auxiliary nozzles 18 and 18. In this state, the workpiece W is processed and fed in the X direction shown in FIG. 1 by a moving shaft (not shown) together with the workpiece table 23, and the spindle 22 is lowered to the predetermined height in the Z direction and dicing is performed.

  During dicing, contamination such as cutting waste is generated, and the generated contamination is mixed with cutting water and scattered in the rotation direction A of the blade 10 or rotates together with the blade 10.

  At this time, the cutting water including the contaminants scattered in the rotation direction A of the blade 10 is sucked by the nozzles 14 and 15 of the vacuum unit 13 and is not reattached to the outside of the dicing apparatus 1 or the workpiece W. It will be discharged.

  The cutting water including the contamination that rotates together with the blade 10 is removed from the blade 10 by the separation block 16 and is sucked by one of the nozzles 14 and 15 without being strongly struck against the workpiece W.

  Further, the cutting water on the workpiece W is blocked by the fluid ejected from the block 17 and the suction auxiliary nozzles 18, 18, and rolls up in the rotation direction A without flowing out around the processing part B, and is efficient by the nozzles 14, 15. Is aspirated.

  As a result, the contamination generated by dicing and mixed with the cutting water does not scatter into the processing unit 20 and does not drift, and is discharged from the workpiece W without being struck again by the workpiece W. It does not reattach to W.

  As described above, according to the dicing apparatus according to the present invention, the cutting fluid containing the contaminants scattered in the rotation direction by the blade 10 is forced by the suction means provided so as to face the scattering direction. Then, the cutting fluid that is discharged to the outside where the workpiece W is not affected or the contamination that rotates together with the blade 10 is removed from the blade before coming into contact with the workpiece again. As a result, the contamination is efficiently removed, there is no contamination scattered in the apparatus, and high-quality dicing can be performed without the contamination reattaching to the workpiece.

  In the present embodiment, the dicing apparatus having two spindles opposed to each other has been described. However, the present invention is not limited to this, and the dicing apparatus can be suitably used in a dicing apparatus in which spindles are arranged in parallel or only one spindle. Is possible.

  Further, in the present embodiment, the vacuum unit 13 is attached by the manifold 12, but the present invention is not limited to this, and the suction fluid of the vacuum unit 13 contains cutting fluid that is scattered by the rotation of the blade 10. As long as it is provided so as to face the direction, it can be suitably used regardless of where it is attached.

The perspective view which shows the external appearance of the dicing apparatus concerning this invention. The front view which shows the structure of a wheel cover. The front view which shows the structure of a wheel main body. Sectional drawing which shows the structure of a nozzle. Front sectional drawing which shows the structure of a block. Side surface sectional drawing which showed the structure of the suction auxiliary nozzle. The front view which shows the structure of the wheel cover by another embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Dicing apparatus, 10 ... Blade, 11 ... Wheel cover, 12 ... Manifold, 13 ... Vacuum unit (suction means), 13A ... Cylindrical member, 13B ... Projection part, 14, 15 ... Nozzle, 16 ... Separation block, 17 DESCRIPTION OF SYMBOLS Block, 18 ... Suction auxiliary nozzle, 20 ... Processing part, 22 ... Spindle, 23 ... Worktable, 31 ... Cover front part, 34 ... Cut nozzle, 35, 39 ... Blade nozzle, 36 ... Flange, 37 ... Rotating shaft, 38 ... Cover body, 44 ... Plate, 51 ... Load port, 52 ... Spinner, 53 ... Conveying means, 54 ... Suction part, 60 ... Partition wall, 81 ... Imaging means, 90 ... Controller, W ... Workpiece

Claims (9)

A disk-shaped blade,
A spindle for rotating the blade;
A cover provided on the spindle and covering the blade;
A work table for holding a work to be cut by the blade;
A movement axis for relatively moving the work table and the blade;
A cutting water nozzle that injects a cutting fluid near a processing point where the workpiece and the blade come into contact;
The blade is disposed in the vicinity of the blade with the inlet facing the direction of rotation at the machining point of the blade, and the cutting fluid after machining is sucked from the inlet by injecting fluid toward the nozzle. A suction means having a plurality of nozzles,
The cover is provided with a separation block in which a slit wider than the thickness of the blade is formed, so that the blade passes through the slit and is positioned in the middle of the plurality of nozzles provided. A dicing apparatus characterized by the above.   The said nozzle located in the upstream of the rotation direction of the said blade is formed so that the flow volume of the cutting water after a process may be larger than the said nozzle located in the downstream. Dicing equipment.   The dicing apparatus according to claim 2, wherein the nozzle located on the upstream side in the rotation direction of the blade has a larger diameter of the flow path from the inlet to the outlet than the nozzle located on the downstream side. The nozzle located on the downstream side in the rotational direction of the blade has a higher suction force than the nozzle located on the upstream side,
An ejection port for ejecting fluid toward the inside of the nozzle located on the downstream side in the rotation direction of the blade ;
An ejection port for ejecting fluid toward the inside of the nozzle located upstream in the rotational direction of the blade;
When the ejection angle of each ejection port is the angle with respect to the flow path from the fluid inlet to the ejection port of the nozzle,
An injection angle of an injection port capable of ejecting a fluid toward the inside of the nozzle located on the downstream side in the rotation direction of the blade ,
2. The dicing apparatus according to claim 1, wherein the dicing apparatus has an acute angle that is larger than an injection angle of an injection port capable of ejecting fluid toward the inside of the nozzle located upstream in the rotation direction of the blade . 2. The dicing apparatus according to claim 1, wherein a guide member is provided on the nozzle outlet side of the nozzle to flow the processed cutting fluid ejected from the nozzle in a predetermined direction. The guide member has a suction port that opens toward the jet port at one end, and has a cylindrical member whose inside is inclined so as to expand from the suction port toward the discharge port, or the jet port of the work table and the nozzle. The dicing apparatus according to claim 5, wherein the dicing apparatus is a partition located between them. 2. The dicing apparatus according to claim 1, wherein a block having an inclined surface directed in the same direction as the rotation direction of the blade is provided at a lower portion of the suction means. 2. The dicing apparatus according to claim 1, wherein a block in which an injection port for injecting a fluid downwardly in a band shape or a fan shape is formed at a lower portion of the suction means. The suction cover nozzle for ejecting fluid in a band shape or a fan shape to the vicinity of the processing point so as to face the rotation surface of the blade is provided on both sides of the rotation surface of the blade. 2. The dicing apparatus according to 1.

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