JP2020199561A - Substrate processing device - Google Patents

Substrate processing device Download PDF

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JP2020199561A
JP2020199561A JP2019106241A JP2019106241A JP2020199561A JP 2020199561 A JP2020199561 A JP 2020199561A JP 2019106241 A JP2019106241 A JP 2019106241A JP 2019106241 A JP2019106241 A JP 2019106241A JP 2020199561 A JP2020199561 A JP 2020199561A
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cover
panel
substrate processing
processing apparatus
spindle motor
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JP7304742B2 (en
JP2020199561A5 (en
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典彦 岡本
Norihiko Okamoto
典彦 岡本
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to CN202010475185.7A priority patent/CN112045518A/en
Priority to KR1020200067080A priority patent/KR20200140731A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/04—Protective covers for the grinding wheel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Abstract

To provide a technique that facilitates work for maintaining a substrate processing device.SOLUTION: A substrate processing device is provided that comprises: a rotary disk 50 to which a tool 4 for processing a substrate 2 is attached replaceably; a spindle motor which rotates the rotary disk; an elevating/lowering mechanism which elevates and lowers the rotary disk through the spindle motor; a panel 100 having an insertion port into which the rotary disk is inserted; and a first cover 110 which is placed on the panel and convers at least a portion of the insertion port. The first cover is placed in the panel during the time the rotary disk is elevated and lowered below a reference position, and the first cover moves up together with the rotary disk and separates from the panel when the rotary disk moves up beyond the reference position.SELECTED DRAWING: Figure 3

Description

本開示は、基板加工装置に関する。 The present disclosure relates to a substrate processing apparatus.

特許文献１に記載の研削装置のスピンドルユニットは、研削ホイールが装着されるマウントと、マウントを先端側に連結したスピンドル軸と、２つ割り構造のスピンドルカバーを備える。研削ホイールが昇降される時に、常にスピンドルカバーも昇降される。 The spindle unit of the grinding device described in Patent Document 1 includes a mount on which a grinding wheel is mounted, a spindle shaft having the mount connected to the tip side, and a spindle cover having a split structure. Whenever the grinding wheel is raised or lowered, so is the spindle cover.

特開２０１７−２２２００３号公報Japanese Unexamined Patent Publication No. 2017-22203

本開示の一態様は、基板加工装置のメンテナンス作業を易化できる、技術を提供する。 One aspect of the present disclosure provides a technique that can facilitate the maintenance work of the substrate processing apparatus.

本開示の一態様に係る基板加工装置は、
基板を加工する工具が交換可能に取り付けられる回転盤と、
前記回転盤を回転させるスピンドルモータと、
前記スピンドルモータを介して前記回転盤を昇降させる昇降機構と、
前記回転盤が挿入される挿入口を有するパネルと、
前記パネルに載置され、前記挿入口の少なくとも一部を覆う第１カバーと、を備え、
前記回転盤が基準位置よりも下方で昇降する間、前記第１カバーが前記パネルに載置され、
前記回転盤が前記基準位置を超えて上昇する時に、前記第１カバーが前記回転盤と共に上昇し前記パネルから離れる。 The substrate processing apparatus according to one aspect of the present disclosure is
A turntable on which the tools for processing the board can be exchanged,
A spindle motor that rotates the turntable and
An elevating mechanism that elevates and elevates the turntable via the spindle motor,
A panel having an insertion slot into which the turntable is inserted, and
A first cover that is mounted on the panel and covers at least a part of the insertion slot is provided.
The first cover is placed on the panel while the turntable moves up and down below the reference position.
When the turntable rises above the reference position, the first cover rises with the turntable and separates from the panel.

本開示の一態様によれば、基板加工装置のメンテナンス作業を易化できる。 According to one aspect of the present disclosure, the maintenance work of the substrate processing apparatus can be facilitated.

図１は、一実施形態に係る基板加工装置を示す平面図である。FIG. 1 is a plan view showing a substrate processing apparatus according to an embodiment. 図２は、一実施形態に係る加工ユニットを示す断面図である。FIG. 2 is a cross-sectional view showing a processing unit according to an embodiment. 図３は、図２の一部を拡大して示す断面図であって、回転盤の待機位置の一例を示す断面図である。FIG. 3 is an enlarged cross-sectional view showing a part of FIG. 2, and is a cross-sectional view showing an example of a standby position of a turntable. 図４は、回転盤の基準位置の一例を示す断面図である。FIG. 4 is a cross-sectional view showing an example of a reference position of the turntable. 図５は、回転盤のメンテナンス位置の一例を示す断面図である。FIG. 5 is a cross-sectional view showing an example of a maintenance position of the turntable. 図６は、図５に示す第１カバーを回転盤に対し持ち上げた状態の一例を示す断面図である。FIG. 6 is a cross-sectional view showing an example of a state in which the first cover shown in FIG. 5 is lifted with respect to the turntable. 図７は、図６に示す第１カバーをその持ち上げた位置で回転し、ガイド部の上端に降ろした状態の一例を示す断面図である。FIG. 7 is a cross-sectional view showing an example of a state in which the first cover shown in FIG. 6 is rotated at the lifted position and lowered to the upper end of the guide portion. 図８は、一実施形態に係る第１カバーを示す斜視図である。FIG. 8 is a perspective view showing the first cover according to the embodiment. 図９は、一実施形態に係る第２カバー、リフト部、およびガイド部を示す斜視図である。FIG. 9 is a perspective view showing the second cover, the lift portion, and the guide portion according to the embodiment. 図１０は、一実施形態に係るブロックを示す斜視図である。FIG. 10 is a perspective view showing a block according to an embodiment. 図１１は、一実施形態に係る第１カバーと、検知部材と、確認センサとの位置関係を示す側面図である。FIG. 11 is a side view showing the positional relationship between the first cover, the detection member, and the confirmation sensor according to the embodiment. 図１２は、一実施形態に係るパネルの基板加工時の状態を示す斜視図である。FIG. 12 is a perspective view showing a state of the panel according to the embodiment at the time of substrate processing. 図１３は、一実施形態に係るパネルのメンテナンス時の状態を示す斜視図である。FIG. 13 is a perspective view showing a state at the time of maintenance of the panel according to the embodiment.

以下、本開示の実施形態について図面を参照して説明する。なお、各図面において同一の又は対応する構成には同一の符号を付し、説明を省略することがある。本明細書において、Ｘ軸方向、Ｙ軸方向、Ｚ軸方向は互いに垂直な方向である。Ｘ軸方向およびＹ軸方向は水平方向、Ｚ軸方向は鉛直方向である。 Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding configurations may be designated by the same reference numerals and description thereof may be omitted. In the present specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The X-axis direction and the Y-axis direction are the horizontal direction, and the Z-axis direction is the vertical direction.

図１は、一実施形態に係る基板加工装置を示す平面図である。基板加工装置１０は、基板２を薄化する。基板２は、例えば、シリコンウェハなどの半導体基板である。基板加工装置１０は、回転テーブル２０と、４つの基板チャック３０Ａ、３０Ｂ、３０Ｃ、３０Ｄと、３つの加工ユニット４０Ａ、４０Ｂ、４０Ｃとを備える。なお、加工ユニット４０の数は、１つ以上であればよく、３つには限定されない。また、基板チャック３０の数は、加工ユニット４０の数よりも多ければよく、４つには限定されない。 FIG. 1 is a plan view showing a substrate processing apparatus according to an embodiment. The substrate processing apparatus 10 thins the substrate 2. The substrate 2 is, for example, a semiconductor substrate such as a silicon wafer. The substrate processing apparatus 10 includes a rotary table 20, four substrate chucks 30A, 30B, 30C, 30D, and three processing units 40A, 40B, 40C. The number of processing units 40 may be one or more, and is not limited to three. Further, the number of substrate chucks 30 may be larger than the number of processing units 40, and is not limited to four.

回転テーブル２０は、回転中心線Ｚ１を中心に回転させられる。回転テーブル２０の回転中心線Ｚ１は、例えば鉛直に配置される。回転テーブル２０の回転中心線Ｚ１の周りには、４つの基板チャック３０Ａ、３０Ｂ、３０Ｃ、３０Ｄが等間隔で配置される。４つの基板チャック３０Ａ、３０Ｂ、３０Ｃ、３０Ｄのそれぞれは、回転テーブル２０と共に回転し、搬入出位置Ａ０と、１次加工位置Ａ１と、２次加工位置Ａ２と、３次加工位置Ａ３と、搬入出位置Ａ０とにこの順番で移動する。 The rotary table 20 is rotated around the rotation center line Z1. The rotation center line Z1 of the rotary table 20 is arranged vertically, for example. Four substrate chucks 30A, 30B, 30C, and 30D are arranged at equal intervals around the rotation center line Z1 of the rotary table 20. Each of the four substrate chucks 30A, 30B, 30C, and 30D rotates together with the rotary table 20 to carry in / out position A0, primary machining position A1, secondary machining position A2, and tertiary machining position A3. It moves to the output position A0 in this order.

搬入出位置Ａ０は、基板２の搬入が行われる搬入位置と、基板２の搬出が行われる搬出位置とを兼ねる。基板２の搬入および基板２の搬出は、搬送ロボット３によって実行される。なお、本実施形態では搬入位置と搬出位置とは同じ位置であるが、搬入位置と搬出位置とは異なる位置であってもよい。 The carry-in / out position A0 serves both as a carry-in position where the board 2 is carried in and a carry-out position where the board 2 is carried out. The loading and unloading of the substrate 2 is executed by the transfer robot 3. In the present embodiment, the carry-in position and the carry-out position are the same positions, but the carry-in position and the carry-out position may be different positions.

搬送ロボット３が基板２を搬入すると、基板チャック３０が基板２を保持する。基板２の基板チャック３０との対向面（例えば基板２の下面）には、予め不図示の保護テープが貼合される。保護テープは、基板２の下面に予め形成されたデバイスを保護する。保護テープとしては、一般的なものが用いられ、例えば樹脂テープが用いられる。搬送ロボット３は、保護テープで保護された基板２を搬入出する。 When the transfer robot 3 carries in the substrate 2, the substrate chuck 30 holds the substrate 2. A protective tape (not shown) is previously attached to the surface of the substrate 2 facing the substrate chuck 30 (for example, the lower surface of the substrate 2). The protective tape protects the device previously formed on the lower surface of the substrate 2. As the protective tape, a general one is used, and for example, a resin tape is used. The transfer robot 3 carries in and out the substrate 2 protected by the protective tape.

１次加工位置Ａ１は、加工ユニット４０Ａによって基板２の１次加工が行われる位置である。１次加工は、例えば研削である。 The primary processing position A1 is a position where the primary processing of the substrate 2 is performed by the processing unit 40A. The primary processing is, for example, grinding.

２次加工位置Ａ２は、加工ユニット４０Ｂによって基板２の２次加工が行われる位置である。２次加工は、例えば研削である。２次加工で用いられる砥石の粒径は、１次加工で用いられる砥石の粒径よりも小さい。 The secondary processing position A2 is a position where the secondary processing of the substrate 2 is performed by the processing unit 40B. The secondary processing is, for example, grinding. The particle size of the grindstone used in the secondary processing is smaller than the particle size of the grindstone used in the primary processing.

３次加工位置Ａ３は、加工ユニット４０Ｃによって基板２の３次加工が行われる位置である。３次加工は、研削、研磨のいずれでもよい。３次加工で用いられる砥石の粒径は、２次加工で用いられる砥石の粒径よりも小さい。 The tertiary processing position A3 is a position where the processing unit 40C performs the tertiary processing of the substrate 2. The tertiary processing may be either grinding or polishing. The particle size of the grindstone used in the tertiary processing is smaller than the particle size of the grindstone used in the secondary processing.

４つの基板チャック３０Ａ、３０Ｂ、３０Ｃ、３０Ｄは、それぞれの回転中心線を中心に回転自在に、回転テーブル２０に取り付けられる。１次加工位置Ａ１、２次加工位置Ａ２および３次加工位置Ａ３において、基板チャック３０Ａ、３０Ｂ、３０Ｃ、３０Ｄはそれぞれの回転中心線を中心に回転する。 The four substrate chucks 30A, 30B, 30C, and 30D are rotatably attached to the rotary table 20 about their respective rotation center lines. At the primary processing position A1, the secondary processing position A2, and the tertiary processing position A3, the substrate chucks 30A, 30B, 30C, and 30D rotate about their respective rotation center lines.

図２は、一実施形態に係る加工ユニットを示す断面図である。加工ユニット４０は、基板２を加工する工具４が交換可能に取り付けられる回転盤５０と、回転盤５０を回転させるスピンドルモータ６０と、スピンドルモータ６０を介して回転盤５０を昇降させる昇降機構７０とを有する。 FIG. 2 is a cross-sectional view showing a processing unit according to an embodiment. The processing unit 40 includes a rotary disk 50 to which a tool 4 for processing the substrate 2 is replaceably attached, a spindle motor 60 for rotating the rotary disk 50, and an elevating mechanism 70 for raising and lowering the rotary disk 50 via the spindle motor 60. Has.

工具４は、例えば基板２を薄化する。例えば、工具４は、ドーナツ盤状の研削ホイール５と、研削ホイール５の下面に固定される砥石６とを含む。複数の砥石６が、研削ホイール５の下面の外縁に沿ってリング状に配列される。 The tool 4 thins, for example, the substrate 2. For example, the tool 4 includes a donut-shaped grinding wheel 5 and a grindstone 6 fixed to the lower surface of the grinding wheel 5. A plurality of grindstones 6 are arranged in a ring shape along the outer edge of the lower surface of the grinding wheel 5.

回転盤５０は、例えば回転盤５０の中心線と研削ホイール５の中心線とを合わせる芯出部５１を有する。研削ホイール５はその中心に嵌合穴５ａを有し、その嵌合穴５ａに芯出部５１が嵌合し、その結果、回転盤５０の中心線と研削ホイール５の中心線とが合わされる。 The turntable 50 has, for example, a centering portion 51 that aligns the center line of the turntable 50 with the center line of the grinding wheel 5. The grinding wheel 5 has a fitting hole 5a at its center, and the centering portion 51 is fitted into the fitting hole 5a, and as a result, the center line of the turntable 50 and the center line of the grinding wheel 5 are aligned. ..

回転盤５０は、芯出部５１よりも外側に張り出すリング状の工具取付部５２を有する。工具取付部５２は、工具４が交換可能に取り付けられるものである。工具取付部５２には、その周方向に間隔をおいて複数の貫通穴５３が形成される。 The turntable 50 has a ring-shaped tool mounting portion 52 that projects outward from the centering portion 51. The tool mounting portion 52 is for mounting the tool 4 so as to be replaceable. A plurality of through holes 53 are formed in the tool mounting portion 52 at intervals in the circumferential direction thereof.

貫通穴５３は、工具取付部５２を鉛直方向に貫通する。ボルト５４が、工具取付部５２の貫通穴５３に挿し通され、研削ホイール５の上面のねじ穴にねじ込まれる。ボルト５４を緩めれば、工具４の付け替えが可能である。 The through hole 53 penetrates the tool mounting portion 52 in the vertical direction. The bolt 54 is inserted into the through hole 53 of the tool mounting portion 52 and screwed into the screw hole on the upper surface of the grinding wheel 5. If the bolt 54 is loosened, the tool 4 can be replaced.

工具４の交換は、例えば砥石６の摩耗量が設定量を超えると実施される。工具４の交換は、定期的に実施されてもよい。 The tool 4 is replaced, for example, when the amount of wear of the grindstone 6 exceeds the set amount. The replacement of the tool 4 may be carried out periodically.

スピンドルモータ６０は、鉛直な回転軸を中心に回転盤５０を回転させることにより、工具４を回転させる。加工ユニット４０はホルダ６１を有し、ホルダ６１がスピンドルモータ６０を保持する。 The spindle motor 60 rotates the tool 4 by rotating the turntable 50 around a vertical rotation axis. The processing unit 40 has a holder 61, and the holder 61 holds the spindle motor 60.

ホルダ６１は、例えば、水平なホルダ底壁部６２と、ホルダ底壁部６２の外縁から上方に延びるホルダ筒状部６３とを有する。ホルダ底壁部６２の中央には貫通穴が形成され、その貫通穴にスピンドルモータ６０の一部が配置される。 The holder 61 has, for example, a horizontal holder bottom wall portion 62 and a holder tubular portion 63 extending upward from the outer edge of the holder bottom wall portion 62. A through hole is formed in the center of the holder bottom wall portion 62, and a part of the spindle motor 60 is arranged in the through hole.

スピンドルモータ６０は、その側面に凸状のリング部６０ａを有する。リング部６０ａは、ホルダ筒状部６３の内部に配置されてよい。リング部６０ａは、スピンドルモータ６０の回転中心線の鉛直度の調整に用いられる。 The spindle motor 60 has a convex ring portion 60a on its side surface. The ring portion 60a may be arranged inside the holder tubular portion 63. The ring portion 60a is used for adjusting the verticality of the rotation center line of the spindle motor 60.

加工ユニット４０は、スピンドルモータ６０の回転中心線の鉛直度を調整する鉛直度調整機構６５を有する。ホルダ６１は、鉛直度調整機構６５を介してスピンドルモータ６０を保持する。 The processing unit 40 has a verticality adjusting mechanism 65 that adjusts the verticality of the rotation center line of the spindle motor 60. The holder 61 holds the spindle motor 60 via the verticality adjusting mechanism 65.

鉛直度調整機構６５は、例えばリング部６０ａの異なる点の高さを調整する複数（例えば３つ）の高さ調整部６６を含む。複数の高さ調整部６６は、リング部６０ａの周方向に間隔をおいて配置され、リング部６０ａの複数点の高さを調整し、スピンドルモータ６０の回転中心線を鉛直にする。 The verticality adjusting mechanism 65 includes, for example, a plurality of (for example, three) height adjusting portions 66 for adjusting the heights of different points of the ring portion 60a. The plurality of height adjusting portions 66 are arranged at intervals in the circumferential direction of the ring portion 60a, adjust the heights of a plurality of points of the ring portion 60a, and make the rotation center line of the spindle motor 60 vertical.

昇降機構７０は、スピンドルモータ６０を介して回転盤５０を昇降させることにより、工具４を昇降させる。例えば、昇降機構７０は、鉛直なガイド７１と、ガイド７１に沿って移動するスライダ７２と、スライダ７２を移動させるモータ７３とを有する。 The elevating mechanism 70 raises and lowers the tool 4 by raising and lowering the rotating disk 50 via the spindle motor 60. For example, the elevating mechanism 70 has a vertical guide 71, a slider 72 that moves along the guide 71, and a motor 73 that moves the slider 72.

スライダ７２にはホルダ６１が固定され、ホルダ６１、スピンドルモータ６０および回転盤５０がスライダ７２と共に昇降する。 A holder 61 is fixed to the slider 72, and the holder 61, the spindle motor 60, and the turntable 50 move up and down together with the slider 72.

基板２を加工するには、先ず昇降機構７０が回転盤５０を待機位置（図２および図３参照）から下降させ、工具４を下降させる。工具４は、回転しながら下降し、回転する基板２の上面と接触し、基板２の上面全体を薄化する。基板２の薄化中、基板２の上面には、液供給ノズル（図１参照）８０によって水などの液が供給される。基板２の厚さが設定値に達すると、昇降機構７０は回転盤５０の下降を停止し、工具４の下降を停止する。その後、昇降機構７０は、回転盤５０を上昇させ、工具４を基板２から離間させる。工具４が基板２から離れると、スピンドルモータ６０が回転盤５０の回転を停止する。昇降機構７０は、回転盤５０を待機位置まで上昇させる。 To process the substrate 2, the elevating mechanism 70 first lowers the turntable 50 from the standby position (see FIGS. 2 and 3), and then lowers the tool 4. The tool 4 descends while rotating, comes into contact with the upper surface of the rotating substrate 2, and thins the entire upper surface of the substrate 2. During the thinning of the substrate 2, a liquid such as water is supplied to the upper surface of the substrate 2 by a liquid supply nozzle (see FIG. 1) 80. When the thickness of the substrate 2 reaches the set value, the elevating mechanism 70 stops the lowering of the turntable 50 and stops the lowering of the tool 4. After that, the elevating mechanism 70 raises the turntable 50 and separates the tool 4 from the substrate 2. When the tool 4 separates from the substrate 2, the spindle motor 60 stops the rotation of the turntable 50. The elevating mechanism 70 raises the turntable 50 to the standby position.

基板加工装置１０は図１に示すように制御部９０を有する。制御部９０は、例えばコンピュータであり、ＣＰＵ（Central Processing Unit）９１と、メモリなどの記憶媒体９２とを備える。記憶媒体９２には、基板加工装置１０において実行される各種の処理を制御するプログラムが格納される。制御部９０は、記憶媒体９２に記憶されたプログラムをＣＰＵ９１に実行させることにより、基板加工装置１０の動作を制御する。また、制御部９０は、入力インターフェース９３と、出力インターフェース９４とを備える。制御部９０は、入力インターフェース９３で外部からの信号を受信し、出力インターフェース９４で外部に信号を送信する。 The substrate processing apparatus 10 has a control unit 90 as shown in FIG. The control unit 90 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs that control various processes executed by the substrate processing apparatus 10. The control unit 90 controls the operation of the substrate processing apparatus 10 by causing the CPU 91 to execute the program stored in the storage medium 92. Further, the control unit 90 includes an input interface 93 and an output interface 94. The control unit 90 receives a signal from the outside through the input interface 93, and transmits the signal to the outside through the output interface 94.

上記プログラムは、例えばコンピュータによって読み取り可能な記憶媒体に記憶され、その記憶媒体から制御部９０の記憶媒体９２にインストールされる。コンピュータによって読み取り可能な記憶媒体としては、例えば、ハードディスク（ＨＤ）、フレキシブルディスク（ＦＤ）、コンパクトディスク（ＣＤ）、マグネットオプティカルデスク（ＭＯ）、メモリーカードなどが挙げられる。なお、プログラムは、インターネットを介してサーバからダウンロードされ、制御部９０の記憶媒体９２にインストールされてもよい。 The program is stored in, for example, a computer-readable storage medium, and is installed from the storage medium in the storage medium 92 of the control unit 90. Examples of the storage medium that can be read by a computer include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical desk (MO), and a memory card. The program may be downloaded from the server via the Internet and installed on the storage medium 92 of the control unit 90.

基板加工装置１０は、図３〜図５に示すように、基板チャック３０、回転盤５０、およびスピンドルモータ６０の他に、パネル１００と、第１カバー１１０と、リフト部１２０と、ガイド部１３０と、ブロック１４０と、第２カバー１７０とを有する。 As shown in FIGS. 3 to 5, the substrate processing apparatus 10 includes a panel 100, a first cover 110, a lift portion 120, and a guide portion 130 in addition to the substrate chuck 30, the turntable 50, and the spindle motor 60. And a block 140 and a second cover 170.

パネル１００は、その内部に、基板２の加工が実施される加工室１０１を形成する。加工室１０１には、基板チャック３０などが収容される。パネル１００は、液供給ノズル８０によって基板２に供給される液体、および基板２の加工によって生じる加工屑の飛散を抑制する。パネル１００は、例えば金属で形成されてよい。金属は、樹脂に比べて硬いので、耐久性に優れる。 The panel 100 forms a processing chamber 101 in which the processing of the substrate 2 is carried out. The substrate chuck 30 and the like are housed in the processing chamber 101. The panel 100 suppresses the scattering of the liquid supplied to the substrate 2 by the liquid supply nozzle 80 and the processing chips generated by the processing of the substrate 2. The panel 100 may be made of, for example, metal. Since metal is harder than resin, it has excellent durability.

パネル１００は、加工室１０１の上方を覆うパネル上面部１０２を有する。パネル上面部１０２は、水平に設置される。パネル上面部１０２には、回転盤５０が挿入される挿入口１０３が形成される。挿入口１０３の直径は、回転盤５０の直径よりも大きい。 The panel 100 has a panel upper surface portion 102 that covers the upper part of the processing chamber 101. The panel upper surface portion 102 is installed horizontally. An insertion port 103 into which the turntable 50 is inserted is formed in the upper surface portion 102 of the panel. The diameter of the insertion slot 103 is larger than the diameter of the turntable 50.

パネル１００は、挿入口１０３の開口縁から上方に立ち上がるリング状のパネル起立部１０４を有する。パネル起立部１０４は、液体および加工屑の水平方向への飛散を抑制する。 The panel 100 has a ring-shaped panel upright portion 104 that rises upward from the opening edge of the insertion port 103. The panel upright portion 104 suppresses the horizontal scattering of liquids and work chips.

第１カバー１１０は、パネル１００、より詳細にはパネル上面部１０２に載置され、挿入口１０３の少なくとも一部を覆うので、挿入口１０３の開口縁と回転盤５０との隙間から、液体や加工屑が飛散するのを抑制できる。例えば、第１カバー１１０は、パネル起立部１０４に沿って上昇する液体および加工屑を止める。 Since the first cover 110 is placed on the panel 100, more specifically on the upper surface portion 102 of the panel, and covers at least a part of the insertion port 103, liquid or liquid or liquid or liquid or It is possible to suppress the scattering of work chips. For example, the first cover 110 stops liquids and work debris rising along the panel erecting portion 104.

ところで、回転盤５０が図４に示す基準位置よりも下方で昇降する間、第１カバー１１０がパネル１００に載置される。基準位置は、第１カバー１１０が回転盤５０と共に上昇を開始する位置である。基準位置は、図５に示すメンテナンス位置よりも下方であって、図３に示す待機位置よりも上方である。メンテナンス位置は、工具４の取り付け、および取り外しが行われる位置である。待機位置は、基板２の加工開始前、および基板２の加工終了後に回転盤５０が待機する位置である。 By the way, the first cover 110 is placed on the panel 100 while the turntable 50 moves up and down below the reference position shown in FIG. The reference position is a position where the first cover 110 starts ascending together with the turntable 50. The reference position is below the maintenance position shown in FIG. 5 and above the standby position shown in FIG. The maintenance position is a position where the tool 4 is attached and detached. The standby position is a position where the rotary disk 50 stands by before the start of processing of the substrate 2 and after the processing of the substrate 2 is completed.

工具４が回転盤５０に取り付けられると、回転盤５０はメンテナンス位置から待機位置まで下降され、待機位置で停止する。待機位置は、工具４が基板２と接触する位置よりも上方の位置である。回転テーブル２０が回転し、加工ユニット３０の下方に新しい基板２が配置されると、回転盤５０は、待機位置から下降し、工具４を基板２に接触させ、基板２の加工を始める。基板２の厚さが設定値に達すると、回転盤５０が元の待機位置まで戻り、停止する。その後、再び、回転テーブル２０が回転し、加工ユニット３０の下方に新しい基板２が配置されると、回転盤５０が待機位置から下降し、工具４によって基板２を設定厚さに薄化し、続いて待機位置まで上昇する。 When the tool 4 is attached to the turntable 50, the turntable 50 is lowered from the maintenance position to the standby position and stops at the standby position. The standby position is a position above the position where the tool 4 comes into contact with the substrate 2. When the rotary table 20 rotates and a new substrate 2 is arranged below the machining unit 30, the rotary disc 50 descends from the standby position, brings the tool 4 into contact with the substrate 2, and starts machining the substrate 2. When the thickness of the substrate 2 reaches the set value, the rotating disk 50 returns to the original standby position and stops. After that, when the rotary table 20 rotates again and a new substrate 2 is arranged below the machining unit 30, the rotary disc 50 descends from the standby position, the substrate 2 is thinned to the set thickness by the tool 4, and so on. And rise to the standby position.

待機位置は基準位置よりも下方であるので、工具４が基板２に接触し基板２を削る間、第１カバー１１０がパネル１００に載置され続け、挿入口１０３の少なくとも一部を覆い続ける。従って、挿入口１０３の開口縁と回転盤５０との隙間から、液体や加工屑が飛散するのを抑制できる。 Since the standby position is below the reference position, the first cover 110 continues to be placed on the panel 100 and covers at least a part of the insertion slot 103 while the tool 4 contacts the substrate 2 and scrapes the substrate 2. Therefore, it is possible to suppress the scattering of liquids and processing debris from the gap between the opening edge of the insertion port 103 and the turntable 50.

砥石６が摩耗し砥石６の交換が必要になるなど、基板加工装置１０のメンテナンスが必要になると、回転盤５０が待機位置からメンテナンス位置まで上昇する。回転盤５０が待機位置から基準位置に上昇する間、第１カバー１１０がパネル１００に載置され続ける。回転盤５０が基準位置を超えて上昇する時に、第１カバー１１０が回転盤５０と共に上昇しパネル１００から離れる。回転盤５０がメンテナンス位置にある時、パネル１００と第１カバー１１０との間に隙間が生じる。 When maintenance of the substrate processing apparatus 10 is required, such as when the grindstone 6 is worn and the grindstone 6 needs to be replaced, the rotating disk 50 rises from the standby position to the maintenance position. The first cover 110 continues to be mounted on the panel 100 while the turntable 50 rises from the standby position to the reference position. When the turntable 50 rises beyond the reference position, the first cover 110 rises with the turntable 50 and separates from the panel 100. When the turntable 50 is in the maintenance position, a gap is created between the panel 100 and the first cover 110.

図６は、図５に示す第１カバーを回転盤に対し持ち上げた状態の一例を示す断面図である。上記の通り、図５に示すように、回転盤５０がメンテナンス位置にある時、パネル１００と第１カバー１１０との間に隙間が生じる。その隙間に作業者または作業ロボットが手を差し込み、図６に示すように回転盤５０に対して第１カバー１１０を持ち上げることができ、回転盤５０の工具取付部５２を露出できる。従って、工具４の付け替えを容易に実施でき、メンテナンス作業を易化できる。 FIG. 6 is a cross-sectional view showing an example of a state in which the first cover shown in FIG. 5 is lifted with respect to the turntable. As described above, as shown in FIG. 5, when the turntable 50 is in the maintenance position, a gap is formed between the panel 100 and the first cover 110. A worker or a working robot can insert a hand into the gap and lift the first cover 110 with respect to the turntable 50 as shown in FIG. 6, and the tool mounting portion 52 of the turntable 50 can be exposed. Therefore, the tool 4 can be easily replaced, and the maintenance work can be facilitated.

図７は、図６に示す第１カバーをその持ち上げた位置で回転し、後述するガイド部１３０の上端に降ろした状態の一例を示す断面図である。第１カバー１１０は、持ち上げた位置で回転させられ、ガイド部１３０の上端に載置される。ガイド部１３０によって、第１カバー１１０の落下を防止でき、回転盤５０の工具取付部５２が露出した状態を維持できる。作業者または作業ロボットの手が空くので、工具４の付け替えを容易に実施でき、メンテナンス作業を易化できる。 FIG. 7 is a cross-sectional view showing an example of a state in which the first cover shown in FIG. 6 is rotated at the lifted position and lowered to the upper end of the guide portion 130 described later. The first cover 110 is rotated in the lifted position and placed on the upper end of the guide portion 130. The guide portion 130 can prevent the first cover 110 from falling, and can maintain the exposed state of the tool mounting portion 52 of the turntable 50. Since the operator or the work robot is free, the tool 4 can be easily replaced and the maintenance work can be facilitated.

メンテナンス作業が終了すると、第１カバー１１０は図７の状態から図６の状態を経て図５の状態に戻される。その後、回転盤５０がメンテナンス位置から待機位置まで下降される。その途中、回転盤５０が基準位置よりも下降する時に、第１カバー１１０がパネル１００に再び載置される。 When the maintenance work is completed, the first cover 110 is returned from the state of FIG. 7 to the state of FIG. 6 through the state of FIG. After that, the turntable 50 is lowered from the maintenance position to the standby position. On the way, when the turntable 50 is lowered from the reference position, the first cover 110 is placed on the panel 100 again.

図８は、一実施形態に係る第１カバーを示す斜視図である。第１カバー１１０は、ドーナツ盤状の第１カバー天井部１１１と、第１カバー天井部１１１の外縁から下方に延びる第１カバー円筒部１１２とを有する。図３等に示すように、第１カバー天井部１１１の外径はパネル上面部１０２の挿入口１０３の直径よりも大きく、第１カバー天井部１１１の内径は回転盤５０の直径よりも小さい。 FIG. 8 is a perspective view showing the first cover according to the embodiment. The first cover 110 has a donut-shaped first cover ceiling portion 111 and a first cover cylindrical portion 112 extending downward from the outer edge of the first cover ceiling portion 111. As shown in FIG. 3 and the like, the outer diameter of the first cover ceiling portion 111 is larger than the diameter of the insertion port 103 of the panel upper surface portion 102, and the inner diameter of the first cover ceiling portion 111 is smaller than the diameter of the turntable 50.

第１カバー円筒部１１２は、パネル起立部１０４を取り囲む。液体および加工屑は、パネル起立部１０４に沿って上昇したとしても、第１カバー天井部１１１に当たると、向きを水平方向に変えることがある。第１カバー円筒部１１２は、パネル起立部１０４を取り囲むので、液体および加工屑の水平方向への飛散を抑制できる。 The first cover cylindrical portion 112 surrounds the panel upright portion 104. Even if the liquid and processing debris rise along the panel upright portion 104, they may turn horizontally when they hit the first cover ceiling portion 111. Since the first cover cylindrical portion 112 surrounds the panel upright portion 104, it is possible to suppress the horizontal scattering of liquids and work chips.

第１カバー１１０は、第１カバー円筒部１１２の下端から径方向外方に出っ張る第１カバーフランジ部１１３をさらに有してよい。第１カバーフランジ部１１３によって、第１カバー１１０をパネル上面部１０２に安定的に載置できる。 The first cover 110 may further have a first cover flange portion 113 protruding radially outward from the lower end of the first cover cylindrical portion 112. The first cover flange portion 113 allows the first cover 110 to be stably placed on the panel upper surface portion 102.

第１カバー１１０は、第１カバーフランジ部１１３とパネル上面部１０２との隙間をシールするリング状の第１カバーシール部１１４をさらに有してよい。第１カバーシール部１１４は、第１カバーフランジ部１１３の下面に貼り付けられ、第１カバーフランジ部１１３とパネル上面部１０２との隙間から液体および加工屑が漏れ出るのを抑制できる。 The first cover 110 may further include a ring-shaped first cover sealing portion 114 that seals a gap between the first cover flange portion 113 and the panel upper surface portion 102. The first cover seal portion 114 is attached to the lower surface of the first cover flange portion 113, and can prevent liquid and work debris from leaking from the gap between the first cover flange portion 113 and the panel upper surface portion 102.

第１カバーシール部１１４は、第１カバーフランジ部１１３よりも柔らかく、第１カバーフランジ部１１３とパネル上面部１０２との隙間の大きさのばらつきを吸収するように変形する。第１カバーシール部１１４は、例えば独立発泡樹脂または独立発泡ゴムなどで形成され、第１カバーフランジ部１１３の下面に貼り付けられる。 The first cover seal portion 114 is softer than the first cover flange portion 113, and is deformed so as to absorb variations in the size of the gap between the first cover flange portion 113 and the panel upper surface portion 102. The first cover seal portion 114 is formed of, for example, an independent foamed resin or an independent foamed rubber, and is attached to the lower surface of the first cover flange portion 113.

第１カバー１１０の少なくとも一部（例えば第１カバー天井部１１１、第１カバー円筒部１１２および第１カバーフランジ部１１３）は、樹脂で形成されてよい。樹脂は金属に比べて軽量性に優れるので、リフト部１２０にかかる荷重を低減できる。リフト部１２０は、第１カバー１１０をパネル１００から持ち上げるものである。 At least a part of the first cover 110 (for example, the ceiling portion 111 of the first cover, the cylindrical portion 112 of the first cover, and the flange portion 113 of the first cover) may be formed of resin. Since resin is superior in weight to metal, the load applied to the lift portion 120 can be reduced. The lift portion 120 lifts the first cover 110 from the panel 100.

リフト部１２０はスピンドルモータ６０に対して固定されるので、スピンドルモータ６０が昇降する間、常にリフト部１２０も昇降する。回転盤５０が基準位置を超えて上昇する時に、リフト部１２０が第１カバー１１０をパネル１００から持ち上げる。リフト部１２０によって、自動で第１カバー１１０をパネル１００から持ち上げることができる。 Since the lift unit 120 is fixed to the spindle motor 60, the lift unit 120 always moves up and down while the spindle motor 60 moves up and down. When the turntable 50 rises above the reference position, the lift portion 120 lifts the first cover 110 from the panel 100. The lift portion 120 can automatically lift the first cover 110 from the panel 100.

図９は、一実施形態に係る第２カバー、リフト部１２０、およびガイド部１３０を示す斜視図である。リフト部１２０は、スピンドルモータ６０の周方向に沿って間隔をおいて複数（例えば３つ）配置される。複数のリフト部１２０によって第１カバー１１０を安定的に持ち上げることができる。 FIG. 9 is a perspective view showing the second cover, the lift portion 120, and the guide portion 130 according to the embodiment. A plurality (for example, three) of lift portions 120 are arranged at intervals along the circumferential direction of the spindle motor 60. The first cover 110 can be stably lifted by the plurality of lift portions 120.

リフト部１２０は、下方に向かうほどスピンドルモータ６０の径方向外方に傾斜する傾斜面１２１を有し、第１カバー１１０を持ち上げる時、傾斜面１２１にて第１カバー１１０を支持する。さらに、第１カバー１１０を図６の状態から図５の状態まで誤って自然落下させてしまった時に、リフト部１２０にかかる衝撃を傾斜面１２１に沿って逃がすことができる。リフト部１２０にかかる荷重は、傾斜面１２１に対して垂直な方向の分力と、傾斜面１２１に対して平行な方向の分力とに分解されるからである。上記の通り、リフト部１２０にかかる衝撃を逃がすことができるので、リフト部１２０の破損を抑制できる。 The lift portion 120 has an inclined surface 121 that inclines outward in the radial direction of the spindle motor 60 toward the lower side, and when the first cover 110 is lifted, the inclined surface 121 supports the first cover 110. Further, when the first cover 110 is accidentally naturally dropped from the state of FIG. 6 to the state of FIG. 5, the impact applied to the lift portion 120 can be released along the inclined surface 121. This is because the load applied to the lift portion 120 is decomposed into a component force in the direction perpendicular to the inclined surface 121 and a component force in the direction parallel to the inclined surface 121. As described above, since the impact applied to the lift portion 120 can be released, damage to the lift portion 120 can be suppressed.

第１カバー天井部１１１の内周には、図８に示すようにリフト部１２０との干渉を避ける第１カバー切欠き１１５が形成される。上方視にて第１カバー切欠き１１５とリフト部１２０とが重なる位置にて、第１カバー１１０をスピンドルモータ６０に対して着脱できる。第１カバー１１０の取り付けでは、先ずスピンドルモータ６０の下方に第１カバー１１０を配置し、次に第１カバー１１０を上昇させ、スピンドルモータ６０に履かせる。一方、第１カバー１１０の取り外しでは、第１カバー１１０を下降させ、スピンドルモータ６０から脱がせる。 As shown in FIG. 8, a first cover notch 115 is formed on the inner circumference of the first cover ceiling portion 111 to avoid interference with the lift portion 120. The first cover 110 can be attached to and detached from the spindle motor 60 at a position where the first cover notch 115 and the lift portion 120 overlap each other when viewed upward. In the attachment of the first cover 110, the first cover 110 is first arranged below the spindle motor 60, then the first cover 110 is raised and put on the spindle motor 60. On the other hand, when removing the first cover 110, the first cover 110 is lowered and removed from the spindle motor 60.

図８に示すように、第１カバー切欠き１１５は、第１カバー天井部１１１の内周に沿って、不等間隔で複数配置される。例えば、３つの第１カバー切欠き１１５が、３つの間隔θ１、θ２、θ３で配置される。従って、３つのリフト部１２０も、３つの第１カバー切欠き１１５と同様に、３つの間隔θ１、θ２、θ３で配置される。θ１、θ２およびθ３は互いに異なる値であり、その合計値は３６０°である。 As shown in FIG. 8, a plurality of first cover notches 115 are arranged at unequal intervals along the inner circumference of the first cover ceiling portion 111. For example, the three first cover notches 115 are arranged at three intervals θ1, θ2, and θ3. Therefore, the three lift portions 120 are also arranged at the three intervals θ1, θ2, and θ3, similarly to the three first cover notches 115. θ1, θ2, and θ3 are different values from each other, and the total value thereof is 360 °.

第１カバー１１０の取り付け、および取り外しは、上記の通り、上方視にて第１カバー切欠き１１５とリフト部１２０とが重なる位置にて行われる。それゆえ、θ１、θ２およびθ３が互いに異なる値であれば、第１カバー１１０を誤って上下逆さに取り付けるのを防止でき、また、第１カバー１１０の周方向の一部（例えば、後述の検知部材１５０の取付部位）を所望の向きに向けることができる。 As described above, the first cover 110 is attached and detached at a position where the first cover notch 115 and the lift portion 120 overlap each other when viewed upward. Therefore, if θ1, θ2, and θ3 have different values, it is possible to prevent the first cover 110 from being accidentally attached upside down, and a part of the first cover 110 in the circumferential direction (for example, detection described later). The attachment portion of the member 150) can be oriented in a desired direction.

第１カバー１１０は、上下対称な構造ではなく、直感的にどの部位を上に向ければよいのか分かりやすいので、誤って上下逆さに取り付ける虞は少ない。それゆえ、３つの間隔θ１、θ２、θ３のうちの２つ（例えばθ１、θ２）が同じ値であって、残りの１つ（例えばθ３）が上記２つと異なる値であってもよい。この場合も、第１カバー１１０を誤って上下逆さに取り付けなければ、第１カバー１１０の周方向一部を所望の向きに向けることができる。 Since the first cover 110 does not have a vertically symmetrical structure and it is easy to intuitively understand which part should be turned upward, there is little possibility that the first cover 110 is accidentally attached upside down. Therefore, two of the three intervals θ1, θ2, and θ3 (for example, θ1, θ2) may have the same value, and the remaining one (for example, θ3) may have a value different from the above two. Also in this case, if the first cover 110 is not erroneously attached upside down, a part of the first cover 110 in the circumferential direction can be oriented in a desired direction.

従って、第１カバー切欠き１１５の数は２つ以上であればよく、少なくとも２つの間隔が異なればよい。但し、第１カバー切欠き１１５の数が３つ以上であって、且つ少なくとも３つの間隔が異なれば、第１カバー１１０を誤って上下逆さに取り付けるのを防止でき、且つ、第１カバー１１０の周方向の一部を所望の向きに向けることができる。 Therefore, the number of the first cover notches 115 may be two or more, and at least two intervals may be different. However, if the number of the first cover notches 115 is three or more and the intervals of at least three are different, it is possible to prevent the first cover 110 from being accidentally attached upside down, and the first cover 110 A part of the circumferential direction can be directed in the desired direction.

ところで、第１カバー天井部１１１に第１カバー切欠き１１５が形成されると、リフト部１２０が第１カバー天井部１１１に直接に接触できない。そこで、第１カバー天井部１１１には、ブロック１４０がボルト１４１などで取り付けられる。 By the way, when the first cover notch 115 is formed in the first cover ceiling portion 111, the lift portion 120 cannot directly contact the first cover ceiling portion 111. Therefore, the block 140 is attached to the ceiling portion 111 of the first cover with bolts 141 or the like.

ブロック１４０は、第１カバー天井部１１１の第１カバー切欠き１１５の少なくとも一部を塞ぐように、第１カバー天井部１１１に取り付けられる。ブロック１４０を介してリフト部１２０が第１カバー１１０を持ち上げることができる。また、ブロック１４０によって第１カバー切欠き１１５からの液体および加工屑の飛散を抑制できる。 The block 140 is attached to the first cover ceiling portion 111 so as to close at least a part of the first cover notch 115 of the first cover ceiling portion 111. The lift portion 120 can lift the first cover 110 via the block 140. In addition, the block 140 can suppress the scattering of liquid and work debris from the first cover notch 115.

図１０は、一実施形態に係るブロックを示す斜視図である。ブロック１４０は、リフト部１２０の傾斜面１２１に面接触する傾斜面１４２を有する。第１カバー１１０を図６の状態から図５の状態まで誤って自然落下させてしまった時に、ブロック１４０の傾斜面１４２とリフト部１２０の傾斜面１２１とが面接触するので、応力集中を抑制できる。 FIG. 10 is a perspective view showing a block according to an embodiment. The block 140 has an inclined surface 142 that comes into surface contact with the inclined surface 121 of the lift portion 120. When the first cover 110 is accidentally dropped from the state of FIG. 6 to the state of FIG. 5, the inclined surface 142 of the block 140 and the inclined surface 121 of the lift portion 120 come into surface contact with each other, so that stress concentration is suppressed. it can.

ガイド部１３０はリフト部１２０と同様にスピンドルモータ６０に対して固定されるので、スピンドルモータ６０が昇降する間、常にガイド部１３０も昇降する。ガイド部１３０は、リフト部１２０の上端から上方に直線状に延びる。リフト部１２０とガイド部１３０との組が、第１カバー天井部１１１の内周に沿って、間隔をおいて複数組配置される。 Since the guide portion 130 is fixed to the spindle motor 60 in the same manner as the lift portion 120, the guide portion 130 always moves up and down while the spindle motor 60 moves up and down. The guide portion 130 extends linearly upward from the upper end of the lift portion 120. A plurality of pairs of the lift portion 120 and the guide portion 130 are arranged at intervals along the inner circumference of the first cover ceiling portion 111.

ブロック１４０は、ガイド部１３０によって鉛直方向に案内されるガイド溝１４３を有する。ガイド溝１４３は、傾斜面１４２の上端から上方に延びており、上方視にてＵ字状に形成され、第１カバー天井部１１１の径方向内方に向けて開口する。 The block 140 has a guide groove 143 that is guided in the vertical direction by the guide portion 130. The guide groove 143 extends upward from the upper end of the inclined surface 142, is formed in a U shape when viewed upward, and opens inward in the radial direction of the first cover ceiling portion 111.

ガイド部１３０に、ブロック１４０のガイド溝１４３が嵌め込まれる。それゆえ、スピンドルモータ６０の周方向に第１カバー１１０が回転するのを制限できる。また、スピンドルモータ６０に対して第１カバー１１０を安定的に昇降できる。 The guide groove 143 of the block 140 is fitted into the guide portion 130. Therefore, it is possible to limit the rotation of the first cover 110 in the circumferential direction of the spindle motor 60. Further, the first cover 110 can be stably moved up and down with respect to the spindle motor 60.

図７に示すように、第１カバー天井部１１１は、その内周に、ガイド部１３０の上端に載置される載置部１１６を含む。載置部１１６は、第１カバー切欠き１１５とは周方向にずらして形成される。ガイド部１３０の上端は、第２カバーフランジ部１７２よりも下方に配置されており、第２カバーフランジ部１７２との間に隙間を形成する。 As shown in FIG. 7, the first cover ceiling portion 111 includes a mounting portion 116 mounted on the upper end of the guide portion 130 on the inner circumference thereof. The mounting portion 116 is formed so as to be displaced in the circumferential direction from the first cover notch 115. The upper end of the guide portion 130 is arranged below the second cover flange portion 172, and forms a gap between the guide portion 130 and the second cover flange portion 172.

その隙間にて第１カバー天井部１１１を図６の状態から図７の状態に回転させたうえで、第１カバー天井部１１１を降ろせば、第１カバー天井部１１１の載置部１１６をガイド部１３０の上端に載置できる。ガイド部１３０によって、第１カバー１１０の落下を防止でき、回転盤５０の工具取付部５２が露出した状態を維持できる。作業者または作業ロボットの手が空くので、工具４の付け替えを容易に実施でき、メンテナンス作業を易化できる。 If the first cover ceiling portion 111 is rotated from the state of FIG. 6 to the state of FIG. 7 in the gap and then the first cover ceiling portion 111 is lowered, the mounting portion 116 of the first cover ceiling portion 111 is guided. It can be placed on the upper end of the portion 130. The guide portion 130 can prevent the first cover 110 from falling, and can maintain the exposed state of the tool mounting portion 52 of the turntable 50. Since the operator or the work robot is free, the tool 4 can be easily replaced and the maintenance work can be facilitated.

メンテナンス作業が終了すると、上記の通り、第１カバー１１０は図７の状態から図６の状態を経て図５の状態に戻される。その後、回転盤５０がメンテナンス位置から待機位置まで下降される。その途中、回転盤５０が基準位置よりも下降する時に、第１カバー１１０がパネル１００に再び載置される。 When the maintenance work is completed, as described above, the first cover 110 is returned from the state of FIG. 7 to the state of FIG. 6 through the state of FIG. After that, the turntable 50 is lowered from the maintenance position to the standby position. On the way, when the turntable 50 is lowered from the reference position, the first cover 110 is placed on the panel 100 again.

第１カバー１１０を図７の状態から図６の状態を経て図５の状態に戻す間に、ブロック１４０のガイド溝１４３がガイド部１３０に嵌め込まれる。ガイド部１３０は、リフト部１２０と同様に、第１カバー天井部１１１の内周に沿って不等間隔で複数配置される。従って、第１カバー１１０の周方向の一部（例えば、後述の検知部材１５０の取付部位）を所望の向きに向けることができる。 While the first cover 110 is returned from the state of FIG. 7 through the state of FIG. 6 to the state of FIG. 5, the guide groove 143 of the block 140 is fitted into the guide portion 130. Similar to the lift portion 120, a plurality of guide portions 130 are arranged at unequal intervals along the inner circumference of the first cover ceiling portion 111. Therefore, a part of the first cover 110 in the circumferential direction (for example, a mounting portion of the detection member 150 described later) can be oriented in a desired direction.

図１１は、一実施形態に係る第１カバーと、検知部材と、確認センサとの位置関係を示す側面図である。図１１に示すように、基板加工装置１０は、検知部材１５０と、確認センサ１６０とを有する。検知部材１５０は、第１カバー１１０に対して固定される。例えば、検知部材１５０は、第１カバー円筒部１１２の周方向一部に取り付けられ、第１カバー円筒部１１２の外周から径方向外方に出っ張る。第１カバー１１０がパネル上面部１０２に載置されると、検知部材１５０が確認センサ１６０と向かい合う。検知部材１５０は、例えば板状であって、鉛直に配置される。 FIG. 11 is a side view showing the positional relationship between the first cover, the detection member, and the confirmation sensor according to the embodiment. As shown in FIG. 11, the substrate processing apparatus 10 includes a detection member 150 and a confirmation sensor 160. The detection member 150 is fixed to the first cover 110. For example, the detection member 150 is attached to a part of the first cover cylindrical portion 112 in the circumferential direction, and projects radially outward from the outer circumference of the first cover cylindrical portion 112. When the first cover 110 is placed on the upper surface portion 102 of the panel, the detection member 150 faces the confirmation sensor 160. The detection member 150 has, for example, a plate shape and is arranged vertically.

確認センサ１６０は、例えば検知部材１５０の存在を検知することで、第１カバー１１０がパネル１００に載置された状態であることを確認する。第１カバー１１０がパネル１００よりも上方に離れた状態であると、確認センサ１６０は検知部材１５０の存在を検知できない。確認センサ１６０は、例えば、非接触式の近接センサであるが、接触式のリミットスイッチであってもよい。確認センサ１６０は、その確認結果を制御部９０に送信する。 The confirmation sensor 160 confirms that the first cover 110 is mounted on the panel 100 by detecting, for example, the presence of the detection member 150. When the first cover 110 is separated from the panel 100, the confirmation sensor 160 cannot detect the presence of the detection member 150. The confirmation sensor 160 is, for example, a non-contact type proximity sensor, but may be a contact type limit switch. The confirmation sensor 160 transmits the confirmation result to the control unit 90.

第１カバー１１０がパネル１００に載置されていない場合、挿入口１０３の開口縁とスピンドルモータ６０との隙間から加工室１０１に、作業者または作業ロボットの手が差し込まれる恐れがある。制御部９０は、確認センサ１６０によって第１カバー１１０がパネル１００に載置された状態であることを確認するまで、スピンドルモータ６０の回転を禁止するので、作業者または作業ロボットの手が回転盤５０の回転に巻き込まれるのを防止できる。 If the first cover 110 is not mounted on the panel 100, the hand of a worker or a working robot may be inserted into the processing chamber 101 through the gap between the opening edge of the insertion port 103 and the spindle motor 60. The control unit 90 prohibits the rotation of the spindle motor 60 until the confirmation sensor 160 confirms that the first cover 110 is mounted on the panel 100, so that the operator or the hand of the working robot can use the rotating disk. It is possible to prevent being involved in 50 rotations.

図３等に示すように、第２カバー１７０は、第１カバー１１０の内側にてスピンドルモータ６０を取り囲む。第２カバー１７０は、スピンドルモータ６０に対して固定されるので、第１カバー１１０とは異なり、常にスピンドルモータ６０と共に昇降する。従って、スピンドルモータ６０への液体および加工屑の付着を抑制できる。 As shown in FIG. 3 and the like, the second cover 170 surrounds the spindle motor 60 inside the first cover 110. Since the second cover 170 is fixed to the spindle motor 60, unlike the first cover 110, the second cover 170 always moves up and down together with the spindle motor 60. Therefore, adhesion of liquid and work chips to the spindle motor 60 can be suppressed.

第２カバー１７０は、第１カバー１１０の内側にてスピンドルモータ６０を取り囲む第２カバー円筒部１７１を有する。第２カバー円筒部１７１の外径は第１カバー天井部１１１の内径よりも小さく、第２カバー円筒部１７１の内径はスピンドルモータ６０の外径よりも大きい。第２カバー円筒部１７１の外周には、リフト部１２０とガイド部１３０との組が、周方向に間隔をおいて複数組配置される。 The second cover 170 has a second cover cylindrical portion 171 that surrounds the spindle motor 60 inside the first cover 110. The outer diameter of the second cover cylindrical portion 171 is smaller than the inner diameter of the first cover ceiling portion 111, and the inner diameter of the second cover cylindrical portion 171 is larger than the outer diameter of the spindle motor 60. A plurality of pairs of the lift portion 120 and the guide portion 130 are arranged on the outer periphery of the second cover cylindrical portion 171 at intervals in the circumferential direction.

第２カバー１７０は、第２カバー円筒部１７１の上端から径方向外方に出っ張る第２カバーフランジ部１７２を有する。第２カバーフランジ部１７２は、例えばボルト１７３によってホルダ底壁部６２の下面に固定される。ボルト１７３は、第２カバーフランジ部１７２の貫通穴１７４に挿し通され、ホルダ底壁部６２の下面のねじ穴にねじ込まれる。 The second cover 170 has a second cover flange portion 172 that protrudes radially outward from the upper end of the second cover cylindrical portion 171. The second cover flange portion 172 is fixed to the lower surface of the holder bottom wall portion 62 by, for example, bolts 173. The bolt 173 is inserted into the through hole 174 of the second cover flange portion 172 and screwed into the screw hole on the lower surface of the holder bottom wall portion 62.

第２カバーフランジ部１７２の外縁には、鉛直度調整機構６５との干渉を避ける第２カバー切欠き１７５が形成される。第２カバー切欠き１７５の数および位置は、鉛直度調整機構６５の高さ調整部６６の数および位置と同じであってよい。第２カバー１７０がホルダ６１に取り付けられた状態のまま、作業者または作業ロボットが第２カバー切欠き１７５を介して高さ調整部６６を操作できる。 A second cover notch 175 is formed on the outer edge of the second cover flange portion 172 to avoid interference with the verticality adjusting mechanism 65. The number and position of the second cover notch 175 may be the same as the number and position of the height adjusting portion 66 of the verticality adjusting mechanism 65. With the second cover 170 attached to the holder 61, the operator or the working robot can operate the height adjusting unit 66 through the second cover notch 175.

第２カバー１７０は、図９に示すように第２カバー円筒部１７１の下端から径方向内方に出っ張る第２カバーリング部１７６を有する。第２カバーリング部１７６は、図３等に示すようにスピンドルモータ６０と回転盤５０の工具取付部５２との間に形成されるくぼみに挿入され、液体および加工屑の漏出経路を狭窄する。 As shown in FIG. 9, the second cover 170 has a second cover ring portion 176 that protrudes inward in the radial direction from the lower end of the second cover cylindrical portion 171. As shown in FIG. 3 and the like, the second covering portion 176 is inserted into a recess formed between the spindle motor 60 and the tool mounting portion 52 of the turntable 50, and narrows the leakage path of the liquid and work chips.

第２カバー１７０の少なくとも一部（本実施形態では全体）は、軽量性の観点から、樹脂で形成されてよい。 At least a part (the whole in this embodiment) of the second cover 170 may be made of resin from the viewpoint of light weight.

なお、第２カバー１７０は無くてもよく、その場合、リフト部１２０とガイド部１３０とはスピンドルモータ６０の外周に直接設けられてよい。リフト部１２０とガイド部１３０とは、スピンドルモータ６０に対して固定されればよく、スピンドルモータ６０と共に常に昇降すればよい。 The second cover 170 may not be provided, in which case the lift portion 120 and the guide portion 130 may be provided directly on the outer periphery of the spindle motor 60. The lift portion 120 and the guide portion 130 may be fixed to the spindle motor 60, and may always move up and down together with the spindle motor 60.

図１２および図１３において、第１カバー１１０の図示を省略する。パネル１００は、加工室１０１の上方を塞ぐパネル上面部１０２と、加工室１０１の側方を塞ぐパネル側面部１０５とを有する。 In FIGS. 12 and 13, the first cover 110 is not shown. The panel 100 has a panel upper surface portion 102 that closes the upper part of the processing chamber 101, and a panel side surface portion 105 that closes the side of the processing chamber 101.

パネル上面部１０２は、挿入口１０３の開口縁に沿って分割される上面固定部１０２ａと上面可動部１０２ｂとを含む。パネル上面部１０２が分割されるので、同様にパネル起立部１０４も分割される。パネル起立部１０４は、固定部１０４ａと可動部１０４ｂとを含む。 The panel upper surface portion 102 includes an upper surface fixing portion 102a and an upper surface movable portion 102b that are divided along the opening edge of the insertion port 103. Since the panel upper surface portion 102 is divided, the panel standing portion 104 is also divided in the same manner. The panel upright portion 104 includes a fixed portion 104a and a movable portion 104b.

パネル側面部１０５は、上面可動部１０２ｂに対して第１ヒンジ１０６で連結される側面可動部１０５ｂと、側面可動部１０５ｂに対して第２ヒンジ１０７で連結される側面固定部１０５ａとを有する。第１ヒンジ１０６の回転中心線と第２ヒンジ１０７の回転中心線とは、平行であって、いずれも水平である。 The panel side surface portion 105 has a side surface movable portion 105b connected to the upper surface movable portion 102b by a first hinge 106, and a side surface fixing portion 105a connected to the side surface movable portion 105b by a second hinge 107. The rotation center line of the first hinge 106 and the rotation center line of the second hinge 107 are parallel and both horizontal.

図１２に示すように、基板加工時には、上面可動部１０２ｂは上面固定部１０２ａと同一平面に配置され、且つ、側面可動部１０５ｂは側面固定部１０５ａと同一平面に配置される。この状態は、ロック機構１０８によってロックされる。側面可動部１０５ｂには開口窓が形成され、その開口窓は透明な部材１０９で塞がれる。透明な部材１０９を介して加工室１０１を視認できる。 As shown in FIG. 12, during substrate processing, the upper surface movable portion 102b is arranged on the same plane as the upper surface fixing portion 102a, and the side surface movable portion 105b is arranged on the same plane as the side surface fixing portion 105a. This state is locked by the lock mechanism 108. An opening window is formed in the side movable portion 105b, and the opening window is closed by a transparent member 109. The processing chamber 101 can be visually recognized through the transparent member 109.

一方、図１３に示すように、メンテナンス時には、ロック機構１０８のロックが解除され、側面可動部１０５ｂが加工室１０１の外側に開き、且つ、側面可動部１０５ｂと上面可動部１０２ｂとが折り畳まれる。その結果、加工室１０１の内部が開放される。 On the other hand, as shown in FIG. 13, at the time of maintenance, the lock mechanism 108 is unlocked, the side movable portion 105b opens to the outside of the processing chamber 101, and the side movable portion 105b and the upper surface movable portion 102b are folded. As a result, the inside of the processing chamber 101 is opened.

図１３に示すように、メンテナンス時に加工室１０１の内部を大きく開放でき、特に挿入口１０３の近傍を大きく開放できる。挿入口１０３は、上記の通り、回転盤５０が挿入されるものである。従って、回転盤５０の工具取付部５２に作業者または作業ロボットがアクセスしやすく、メンテナンス作業が容易である。 As shown in FIG. 13, the inside of the processing chamber 101 can be greatly opened during maintenance, and particularly the vicinity of the insertion port 103 can be greatly opened. As described above, the turntable 50 is inserted into the insertion port 103. Therefore, the tool mounting portion 52 of the turntable 50 can be easily accessed by a worker or a working robot, and maintenance work is easy.

以上、本開示に係る基板加工装置について説明したが、本開示は上記実施形態などに限定されない。特許請求の範囲に記載された範疇内において、各種の変更、修正、置換、付加、削除、および組み合わせが可能である。それらについても当然に本開示の技術的範囲に属する。 Although the substrate processing apparatus according to the present disclosure has been described above, the present disclosure is not limited to the above-described embodiment and the like. Within the scope of the claims, various changes, modifications, replacements, additions, deletions, and combinations are possible. These also naturally belong to the technical scope of the present disclosure.

基板２は、シリコンウェハには限定されない。基板２は、例えば、炭化珪素ウェハ、窒化ガリウムウェハ、酸化ガリウムウェハなどであってもよい。また、基板２は、ガラス基板であってもよい。 The substrate 2 is not limited to a silicon wafer. The substrate 2 may be, for example, a silicon carbide wafer, a gallium nitride wafer, a gallium oxide wafer, or the like. Further, the substrate 2 may be a glass substrate.

２ 基板
４ 工具
１０ 基板加工装置
５０ 回転盤
５２ 工具取付部
６０ スピンドルモータ
７０ 昇降機構
９０ 制御部
１００ パネル
１０１ 加工室
１０２ パネル上面部
１０３ 挿入口
１０４ パネル起立部
１１０ 第１カバー
１１１ 第１カバー天井部
１１２ 第１カバー円筒部
１１３ 第１カバーフランジ部
１１４ 第１カバーシール部
１１５ 第１カバー切欠き
１１６ 載置部
１２０ リフト部
１２１ 傾斜面
１３０ ガイド部
１４０ ブロック
１６０ 確認センサ
１７０ 第２カバー
１７１ 第２カバー円筒部
１７２ 第２カバーフランジ部
１７５ 第２カバー切欠き
１７６ 第２カバーリング部 2 Board 4 Tool 10 Board processing device 50 Turntable 52 Tool mounting part 60 Spindle motor 70 Elevating mechanism 90 Control part 100 Panel 101 Processing room 102 Panel upper surface part 103 Insertion port 104 Panel standing part 110 1st cover 111 1st cover Ceiling part 112 1st cover Cylindrical part 113 1st cover Flange part 114 1st cover Seal part 115 1st cover Notch 116 Mounting part 120 Lift part 121 Inclined surface 130 Guide part 140 Block 160 Confirmation sensor 170 2nd cover 171 2nd cover Cylindrical part 172 Second cover Flange part 175 Second cover notch 176 Second cover ring part

Claims (18)

基板を加工する工具が交換可能に取り付けられる回転盤と、
前記回転盤を回転させるスピンドルモータと、
前記スピンドルモータを介して前記回転盤を昇降させる昇降機構と、
前記回転盤が挿入される挿入口を有するパネルと、
前記パネルに載置され、前記挿入口の少なくとも一部を覆う第１カバーと、を備え、
前記回転盤が基準位置よりも下方で昇降する間、前記第１カバーが前記パネルに載置され、
前記回転盤が前記基準位置を超えて上昇する時に、前記第１カバーが前記回転盤と共に上昇し前記パネルから離れる、基板加工装置。 A turntable on which the tools for processing the board can be exchanged,
A spindle motor that rotates the turntable and
An elevating mechanism that elevates and elevates the turntable via the spindle motor,
A panel having an insertion slot into which the turntable is inserted, and
A first cover that is mounted on the panel and covers at least a part of the insertion slot is provided.
The first cover is placed on the panel while the turntable moves up and down below the reference position.
A substrate processing apparatus in which the first cover rises together with the turntable and separates from the panel when the turntable rises beyond the reference position. 前記スピンドルモータに対して固定され、前記回転盤が前記基準位置を超えて上昇する時に、前記第１カバーを前記パネルから持ち上げるリフト部を有する、請求項１に記載の基板加工装置。 The substrate processing apparatus according to claim 1, further comprising a lift portion that is fixed to the spindle motor and lifts the first cover from the panel when the rotating disk rises beyond the reference position. 前記リフト部は、下方に向うほど前記スピンドルモータの径方向外方に傾斜する傾斜面を有し、前記傾斜面にて前記第１カバーを支持する、請求項２に記載の基板加工装置。 The substrate processing apparatus according to claim 2, wherein the lift portion has an inclined surface that inclines outward in the radial direction of the spindle motor toward the lower side, and supports the first cover on the inclined surface. 前記第１カバーは、ドーナツ盤状の第１カバー天井部と、前記第１カバー天井部の外縁から下方に延びる第１カバー円筒部と、を有する、請求項２または３に記載の基板加工装置。 The substrate processing apparatus according to claim 2 or 3, wherein the first cover has a donut-shaped first cover ceiling portion and a first cover cylindrical portion extending downward from the outer edge of the first cover ceiling portion. .. 前記パネルは、前記挿入口が形成されるパネル上面部と、前記挿入口の開口縁から上方に立ち上がるリング状のパネル起立部と、を有し、
前記第１カバー円筒部が前記パネル起立部を取り囲む、請求項４に記載の基板加工装置。 The panel has a panel upper surface portion on which the insertion port is formed, and a ring-shaped panel upright portion that rises upward from the opening edge of the insertion port.
The substrate processing apparatus according to claim 4, wherein the first cover cylindrical portion surrounds the panel upright portion. 前記第１カバー天井部の内周には、前記リフト部との干渉を避ける第１カバー切欠きが形成される、請求項４または５に記載の基板加工装置。 The substrate processing apparatus according to claim 4 or 5, wherein a first cover notch is formed on the inner circumference of the first cover ceiling portion to avoid interference with the lift portion. 前記第１カバー切欠きは、前記第１カバー天井部の内周に沿って、不等間隔で複数配置される、請求項６に記載の基板加工装置。 The substrate processing apparatus according to claim 6, wherein a plurality of the first cover notches are arranged at unequal intervals along the inner circumference of the ceiling of the first cover. 前記第１カバー切欠きの少なくとも一部を塞ぐように、前記第１カバー天井部に取り付けられるブロックを有し、
前記リフト部は、前記ブロックを介して前記第１カバーを持ち上げる、請求項６または７に記載の基板加工装置。 It has a block attached to the ceiling of the first cover so as to close at least a part of the notch of the first cover.
The substrate processing apparatus according to claim 6 or 7, wherein the lift portion lifts the first cover via the block. 前記スピンドルモータに対して固定され、前記リフト部の上端から上方に直線状に延びるガイド部を有し、
前記ブロックは、前記ガイド部によって鉛直方向に案内されるガイド溝を有する、請求項８に記載の基板加工装置。 It has a guide portion that is fixed to the spindle motor and extends linearly upward from the upper end of the lift portion.
The substrate processing apparatus according to claim 8, wherein the block has a guide groove that is guided in the vertical direction by the guide portion. 前記第１カバー天井部は、その内周に、前記ガイド部の上端に載置される載置部を含む、請求項９に記載の基板加工装置。 The substrate processing apparatus according to claim 9, wherein the first cover ceiling portion includes a mounting portion mounted on the upper end of the guide portion on the inner circumference thereof. 前記第１カバーは、前記第１カバー円筒部の下端から径方向外方に出っ張る第１カバーフランジ部を有する、請求項４〜１０のいずれか１項に記載の基板加工装置。 The substrate processing apparatus according to any one of claims 4 to 10, wherein the first cover has a first cover flange portion protruding radially outward from the lower end of the first cover cylindrical portion. 前記第１カバーは、前記第１カバーフランジ部と前記パネルとの隙間をシールするリング状の第１カバーシール部を有する、請求項１１に記載の基板加工装置。 The substrate processing apparatus according to claim 11, wherein the first cover has a ring-shaped first cover sealing portion that seals a gap between the first cover flange portion and the panel. 前記第１カバーの内側にて前記スピンドルモータを取り囲み、前記スピンドルモータに対して固定される第２カバーを備え、
前記リフト部は、前記第２カバーに設けられる、請求項２〜１２のいずれか１項に記載の基板加工装置。 A second cover that surrounds the spindle motor inside the first cover and is fixed to the spindle motor is provided.
The substrate processing apparatus according to any one of claims 2 to 12, wherein the lift portion is provided on the second cover. 前記第２カバーは、前記第１カバーの内側にて前記スピンドルモータを取り囲む第２カバー円筒部を有し、
前記リフト部は、前記第２カバー円筒部の外周に設けられる、請求項１３に記載の基板加工装置。 The second cover has a second cover cylindrical portion that surrounds the spindle motor inside the first cover.
The substrate processing apparatus according to claim 13, wherein the lift portion is provided on the outer periphery of the second cover cylindrical portion. 前記スピンドルモータの回転中心線の鉛直度を調整する鉛直度調整機構と、
前記鉛直度調整機構を介して前記スピンドルモータを保持するホルダと、を備え、
前記第２カバーは、前記第２カバー円筒部の上端から径方向外方に出っ張る第２カバーフランジ部を有し、
前記第２カバーフランジ部が前記ホルダの下面に固定され、前記第２カバーフランジ部の外縁には前記鉛直度調整機構との干渉を避ける第２カバー切欠きが形成される、請求項１４に記載の基板加工装置。 A verticality adjustment mechanism that adjusts the verticality of the rotation center line of the spindle motor,
A holder for holding the spindle motor via the verticality adjusting mechanism.
The second cover has a second cover flange portion that protrudes radially outward from the upper end of the second cover cylindrical portion.
14. The second cover flange portion is fixed to the lower surface of the holder, and a second cover notch that avoids interference with the verticality adjusting mechanism is formed on the outer edge of the second cover flange portion, according to claim 14. Substrate processing equipment. 前記第２カバーは、前記第２カバー円筒部の下端から径方向内方に出っ張る第２カバーリング部を有し、
前記回転盤は、前記工具が取り付けられるリング状の工具取付部を有し、
前記第２カバーリング部は、前記スピンドルモータと前記工具取付部との間に形成されるくぼみに挿入される、請求項１４または１５記載の基板加工装置。 The second cover has a second covering portion that protrudes inward in the radial direction from the lower end of the cylindrical portion of the second cover.
The turntable has a ring-shaped tool mounting portion on which the tool is mounted.
The substrate processing apparatus according to claim 14 or 15, wherein the second covering portion is inserted into a recess formed between the spindle motor and the tool mounting portion. 前記第１カバーが前記パネルに載置された状態であることを確認する確認センサと、
前記確認センサによって前記第１カバーが前記パネルに載置された状態であることを確認するまで、前記スピンドルモータの回転を禁止する制御部と、を備える、請求項１〜１６のいずれか１項に記載の基板加工装置。 A confirmation sensor that confirms that the first cover is mounted on the panel, and
Any one of claims 1 to 16, comprising a control unit that prohibits rotation of the spindle motor until it is confirmed by the confirmation sensor that the first cover is mounted on the panel. The substrate processing apparatus described in 1. 前記パネルは、その内部に前記基板の加工が実施される加工室を形成するものであり、前記加工室の上方を塞ぐパネル上面部と、前記加工室の側方を塞ぐパネル側面部と、を有し、
前記パネル上面部は、前記挿入口の開口縁に沿って分割される上面固定部と上面可動部とを有し、
前記パネル側面部は、前記上面可動部に対して第１ヒンジで連結される側面可動部と、前記側面可動部に対して第２ヒンジで連結される側面固定部と、を有する、請求項１〜１７のいずれか１項に記載の基板加工装置。 The panel forms a processing chamber in which the substrate is processed, and has a panel upper surface portion that closes the upper part of the processing chamber and a panel side surface portion that closes the side of the processing chamber. Have and
The upper surface portion of the panel has an upper surface fixing portion and an upper surface movable portion divided along the opening edge of the insertion port.
The panel side surface portion has a side surface movable portion connected to the upper surface movable portion by a first hinge, and a side surface fixing portion connected to the side surface movable portion by a second hinge. The substrate processing apparatus according to any one of 17 to 17.
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