CN109382766A - Processing unit (plant) - Google Patents

Processing unit (plant) Download PDF

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Publication number
CN109382766A
CN109382766A CN201810884015.7A CN201810884015A CN109382766A CN 109382766 A CN109382766 A CN 109382766A CN 201810884015 A CN201810884015 A CN 201810884015A CN 109382766 A CN109382766 A CN 109382766A
Authority
CN
China
Prior art keywords
window
display unit
processing
machined object
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810884015.7A
Other languages
Chinese (zh)
Inventor
掛札将树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN109382766A publication Critical patent/CN109382766A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/07—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

Processing unit (plant) is provided, can suitably determine degree of adhesion of the processing bit to the wall for surrounding Processing Room.The processing unit (plant) includes: chuck table keeps the machined object of plate；Unit is processed, it includes main shafts, are equipped with machining tool in the front end of the main shaft, the machined object which keeps chuck table is ground or is ground；Processing Room is surrounded by wall, is stored to the front end of chuck table and main shaft；And dirty situation display unit, the processing bit generated by the grinding of machined object or grinding is shown to the degree of adhesion of wall, dirty situation display unit is included through window, by the component of visible light-transmissive is made, constitutes a part of wall；And color card display unit shows the relationship between the amount through the processing bit of window that is attached to and the color through window according to being overlapped with through window or being arranged with through the adjacent mode of window.

Description

Processing unit (plant)
Technical field
The present invention relates to the processing unit (plant)s processed for the machined object to plate.
Background technique
In order to make the device chip miniaturization, the lightweight that are assembled into electronic equipment etc., device core will be divided by increasing The chance that chip or package substrate before piece etc. are processed relatively thin.For example using following processing unit (plant) in the processing: should Processing unit (plant) has the main shaft (rotary shaft) for the grinding machining tools such as grinding tool or grinding pad installation.By making to revolve by main shaft The machining tool turned is contacted with machined objects such as chip or package substrates, and the machined object can be made thinning.
In addition, a large amount of processing bit can be generated when processing using processing unit (plant) as described above to machined object (dust) and disperse to surrounding.Therefore, it is proposed to following method: the main shaft of machining tool will be equipped with by being arranged on processing unit (plant) Front end covering cover, machined object is processed (for example, referring to patent document in the Processing Room surrounded by the cover 1).According to this method, generated processing bit will not disperse to the outside of cover.
Patent document 1: Japanese Unexamined Patent Publication 2004-1118 bulletin
When the cover for covering the front end of main shaft is arranged on processing unit (plant) as described above, processing bit can be attached to cover Inner wall and be gradually accumulated.Enter machining tool when the processing bit for the inner wall for being piled up in cover is fallen for some reason and be processed When gap between object, biggish damage can be caused to machined object.The inner wall progress that therefore, it is necessary to be in due course to cover It cleans.
But since the opportunity of the cleaning is, for example, to be determined according to experience of operator etc., so cleaning sometimes Frequency be required above and reduce the running rate of processing unit (plant).On the other hand, when the opportunity of cleaning too late when, processing bit from The inner wall of cover falls and enters the gap between machining tool and machined object, causes biggish damage to machined object.
Summary of the invention
The present invention be completed in view of the problem, it is intended that provide processing unit (plant), can to processing bit to The degree of adhesion for the wall that the Processing Room for being accommodated with the front end of main shaft surrounds suitably is determined.
According to one method of the present invention, processing unit (plant) is provided, chuck table is included, plate is processed Object is kept；Unit is processed, it includes main shafts, are equipped with machining tool in the front end of the main shaft, the machining tool is to this The machined object that chuck table is kept is ground or is ground；Processing Room is surrounded by wall, to the chucking work The front end of platform and the main shaft is stored；And dirty situation display unit, show because the machined object grinding or Grinding and generate processing bit to the degree of adhesion of the wall, which includes through window, by making visible light The component of transmission is made, and constitutes a part of the wall；And color card display unit, according to this through window it is Chong Die or with this It is arranged through the adjacent mode of window, the amount for being attached to the processing bit for penetrating window is shown and this penetrates the pass between the color of window System.
The processing unit (plant) of one embodiment of the present invention has dirty situation display unit, dirt situation display unit tool Have: through window, by the component of visible light-transmissive is made；And color card display unit, it shows and is attached to through window The amount of processing bit and through the relationship between the color of window, thus can by visual observation to through window and color card display unit into Row compares, to suitably determine degree of adhesion of the processing bit to the wall for surrounding Processing Room.
Detailed description of the invention
Fig. 1 is the perspective view for schematically showing the configuration example of grinding device.
Fig. 2 is the top view for schematically showing the configuration example of dirty situation display unit.
Label declaration
2: grinding device (processing unit (plant))；4: base station；4a, 4b: opening；6: supporting construction；8: transport unit；10a, 10b: Box；12: centering machine；14: moving in unit；16:X axis mobile work platform；18: dust-proof drip shield；20: chuck table；22:Z Axis mobile unit；24:Z axis rail；26:Z axis movable plate；28:Z axis ball-screw；30:Z axis pulse motor；32: grinding is single Member (processing unit)；34: main shaft shell；36: main shaft；38: mounting base；40: grinding pad (machining tool)；42: moving out unit； 44: cleaning unit；46: operation panel；52: cover；52a: wall；54: gas exhaust piping；56: attracting source；58: control switch；60: dirty Turbid situation display unit；62: penetrating window；64: color card display unit；64a: the 1 display unit；64b: the 2 display unit；64c: the 3 display units；64d: the 4 display unit；66: notes and commentary；11: machined object.
Specific embodiment
It is illustrated referring to embodiment of the attached drawing to one embodiment of the present invention.Fig. 1 is to schematically show this implementation The perspective view of the configuration example of the grinding device (processing unit (plant)) 2 of mode.As shown in Figure 1, grinding device 2 has to each component The base station 4 supported.The rear end of base station 4 is provided with the supporting construction 6 of wall-like.
Opening 4a is formed on front side of the upper surface of base station 4, configured with the machined object 11 to plate in opening 4a The transport unit 8 transported.Machined object 11 is, for example, chip discoid made of the materials such as silicon (Si).But quilt There is no limit for material, shape, construction, size of machining object 11 etc..For example, it is also possible to will by other semiconductors, ceramics, resin, Substrate made of the materials such as metal is as machined object 11.
Box 10a, 10b of storage machined object 11 are placed in the region of the side of opening 4a.In the area for being placed with box 10a The rear in domain is provided with centering machine 12.Centering machine 12 for example to by transport unit 8 from the box 10a machined object 11 transported The position at center is adjusted.
The rear of centering machine 12 be provided with to machined object 11 kept and make its rotate move in unit 14.? The rear for moving in unit 14 is formed with opening 4b.It is configured with X-axis moving table 16 in opening 4b, makes X-axis mobile working The X-axis mobile unit (not shown) and cover the dust-proof of X-axis mobile unit that platform 16 moves on X-direction (front-rear direction) Drip shield 18.
X-axis mobile unit has a pair of of the X-axis guide rail (not shown) parallel with X-direction, can slide in X-axis guide rail Dynamic mode is equipped with X-axis moving table 16.The lower face side of X-axis moving table 16 is provided with nut portions (not scheme Show), the X-axis ball-screw (not shown) parallel with X-axis guide rail is screwed togather with the nut portions.
The connection (not shown) of the one end and X-axis pulse motor of X-axis ball-screw.Make X-axis using X-axis pulse motor Ball-screw rotation, so that X-axis moving table 16 be made to move in the X-axis direction along X-axis guide rail.In X-axis moving table 16 upper surface is provided with the chuck table 20 for being attracted machined object 11, being kept.
The rotary driving sources such as chuck table 20 and motor connection (not shown), around big with Z-direction (vertical direction) Parallel rotary shaft is caused to be rotated.Also, chuck table 20 is removed by above-mentioned X-axis mobile unit for machined object 11 The carrying-in/carrying-out region in the front enter, moved out and for machined object 11 grind rear abrasive areas between move.
The upper surface of chuck table 20 becomes the retaining surface for being attracted machined object 11, being kept.Retaining surface warp It is connect by flow path (not shown) for being formed in the inside of chuck table 20 etc. with source (not shown) is attracted.It is moved to unit 14 It is moved to the negative pressure in attraction source of the machined object 11 of chuck table 20 by acting on retaining surface and is attracted, keeps.
Z axis mobile unit 22 is provided in the front surface of supporting construction 6.Z axis mobile unit 22 has flat with Z-direction Capable a pair of of Z axis guide rail 24 is equipped with Z axis movable plate 26 in the Z axis guide rail 24 in a manner of it can slide.It is mobile in Z axis The back-surface side (back side) of plate 26 is provided with nut portions (not shown), the Z axis ball-screw 28 parallel with Z axis guide rail 24 with should Nut portions screw togather.
The one end and Z axis pulse motor 30 of Z axis ball-screw 28 link.Z axis is rolled using Z axis pulse motor 30 Ballscrew 28 is rotated, so that Z axis movable plate 26 be made to move in the Z-axis direction along Z axis guide rail 24.
The grinding unit for grinding machined object 11 is provided in the front surface (front) of Z axis movable plate 26 (to add Work order member) 32.Grinding unit 32 has the main shaft shell 34 for the tubular for being fixed on Z axis movable plate 26.In main shaft shell 34 Portion is accommodated with the main shaft 36 as rotary shaft.
It is fixed with discoid mounting base 38 in the front end (lower end) of the main shaft 36 exposed from main shaft shell 34, at this The diameter grinding pad roughly the same with mounting base 38 (machining tool) 40 is installed on the lower surface of mounting base 38.In this embodiment party In formula, using the grinding pad 40 of dry grinding, the grinding pad 40 of the dry grinding does not use the lapping liquids such as slurry, but can also To use the grinding pad 40 of wet lapping.
The rotary driving sources such as the base end side (upper end side) of main shaft 36 and motor it is (not shown) connection, grinding pad 40 by from The rotary driving source transmitting power and rotated.Also, decline grinding unit 32 using above-mentioned Z axis mobile unit 22, from And grinding pad 40 is pushed against in the upper surface (surface to be polished) of the machined object 11 kept on chuck table 20.
The position adjacent with unit 14 is moved in be provided with to machined object 11 kept and make its rotate move out list Member 42.At the rear in the front for moving out unit 42 and the region for being placed with box 10b configured with cleaning unit 44, the cleaning unit 44 Machined object 11 after being ground is cleaned.
The machined object 11 cleaned by cleaning unit 44 is transported and be for example accommodated in box 10b by transport unit 8. The operation panel 46 of condition for inputting grinding etc. is provided in front of opening 4a.
When being ground using the grinding device 2 to machined object 11, make machined object 11 by chuck table 20 In the state of attracting, keeping, makes the mutually rotation of chuck table 20 and grinding pad 40 and push against grinding pad 40 in machined object 11 upper surface.Thereby, it is possible to grind to machined object 11.In addition, in the present embodiment, without using the grinding such as slurry Liquid, but lapping liquid also can be used.
As described above, when being ground using grinding pad 40 to machined object 11, dust is easy to chuck table 20 and grinding pad 40 around disperse.Therefore, it is provided with chuck table 20 and master in the grinding device of present embodiment 2 The cover 52 of front end (grinding pad 40) covering of axis 36.
The Processing Room (grinding chamber) for being ground to machined object 11 is formed by the cover 52.That is, Processing Room quilt The wall 52a for constituting cover 52 is surrounded.Also, the front end of chuck table 20 and main shaft 36 is stored in the Processing Room.Cover 52 Material, shape etc. are not particularly limited.It is, for example, possible to use the metals such as stainless steel or aluminium to form cover 52.
It is provided in a part of the wall 52a of cover 52 exhaust outlet (not shown), which will cover 52 inside and outside perforations.It should Exhaust outlet is connect with configuration in one end of the gas exhaust piping 54 of the outside of cover 52.Also, the other end and the attraction of gas exhaust piping 54 Source 56 connects.That is, exhaust outlet is connect via gas exhaust piping 54 with source 56 is attracted.
Attraction source 56 has the control switch 58 controlled the generation of attraction.By being carried out to the control switch 58 Operation, can make the attraction in attraction source 56 act on exhaust outlet.When grinding to machined object 11, make attraction source 56 Attraction acts on exhaust outlet and the outside that will process the indoor air comprising processing bit (dust) and be discharged to cover 52.
In the grinding device 2 constituted in this way, when grinding, generated processing bit remained in Processing Room, will not be to cover 52 Outside disperse.On the other hand, processing bit is attached to the face for constituting the inside of wall 52a of cover 52 and is gradually accumulated.When being piled up in When the processing bit of the wall 52a of cover 52 falls for some reason and enters the gap between grinding pad 40 and machined object 11, meeting Biggish damage is caused to machined object 11.
Therefore, in the grinding device of present embodiment 2, dirt is provided in a part of wall 52a for constituting cover 52 Situation display unit 60, the dirt situation display unit 60 show degree of adhesion dirt situation of the processing bit to wall 52a.Fig. 2 is Schematically show the top view of the configuration example of dirty situation display unit 60.As shown in Fig. 2, dirty situation display unit 60 has Have making made of the components such as the glass plate of visible light-transmissive through window 62.
This is embedded into the opening that will be penetrated through inside and outside cover 52 through window 62, constitutes a part of wall 52a.That is, in processing bit Adhere to and be piled up under the situation on the face of the inside of wall 52a, similarly adheres on the face through the inside of window 62, accumulates and have Processing bit.When processing bit attachment, being deposited on the face through the inside of window 62, reduced through the transmitance of window 62.Therefore, lead to Cross confirm this penetrate window 62 state, can to attachment from processing bit to wall 52a, accumulation be in which kind of degree.
It is being provided with color card display unit 64 with through the Chong Die position of window 62 or the position adjacent with window 62 is penetrated, it should Color card display unit 64 shows attachment, is piled up in the amount through the processing bit of window 62 and the color (transmitance) through window 62 Between relationship.Also, in the adjacent position of color card display unit 64, it is labeled with and adheres to, is piled up in adding through window 62 The corresponding notes and commentary 66 of the amount of work bits.But it is also possible to omit the notes and commentary 66.
Color card display unit 64 includes: the 1st display unit 64a, shows saturating with unattached, accumulation processing bit state Cross the corresponding color of color of window 62；And the 2nd display unit 64b, it shows and the state of slightly adhering to, accumulated processing bit Through the corresponding color of color of window 62.Also, color card display unit 64 also includes: the 3rd display unit 64c, show with it is attached , accumulated more processing bit state the corresponding color of the color through window 62；And the 4th display unit 64d, show with Adhere to, accumulated the corresponding color of the color through window 62 of the state of very more processing bits.
Also, in the adjacent bit of the 1st display unit 64a, the 2nd display unit 64b, the 3rd display unit 64c and the 4th display unit 64d It sets and is labeled with notes and commentary 66 respectively.For example, being labeled in the adjacent position of the 1st display unit 64a indicates it is not necessary to which what is cleaned is " good Notes and commentary 66 well ".Also, being labeled in the adjacent position of the 2nd display unit 64b indicates to be desired with " when in cleaning of cleaning The notes and commentary 66 of machine ".
In addition, being labeled with the notes and commentary for indicating to need " please cleaning as early as possible " for cleaning in the adjacent position of the 3rd display unit 64c 66.Also, being labeled in the adjacent position of the 4th display unit 64d indicates the probably processing bit because adhering to, being piled up in wall 52a And generate the notes and commentary 66 of " please the cleaning immediately " of unfavorable condition.
Then, confirm to the dirt situation display unit 60 is used processing bit be attached to the method for the degree of wall 52a into Row explanation.Firstly, operator is compared to through window 62 and color card display unit 64 by visual observation on arbitrary opportunity, Determine through window 62 color whether with the 1st display unit 64a, the 2nd display unit 64b, the 3rd display unit 64c and the 4th display unit Random color in 64d is close.
Thereby, it is possible to clear processing bits to the degree of adhesion of wall 52a.For example, in color and the 1st display unit through window 62 The color of 64a is in the case where, it is known that processing bit is almost unattached, is piled up in wall 52a.Also, such as through window 62 Color and the color of the 2nd display unit 64b are in the case where, it is known that a little processing bit attachment is piled up in wall 52a.
In turn, through window 62 color and the 3rd display unit 64c, the 4th display unit 64d color close in the case where, can Know more processing bit attachments, be piled up in wall 52a.Also, operator can be referring to being labeled in color card display unit 64 At the time of notes and commentary 66 of adjacent position etc. clean cover 52 to determine.
As described above, the grinding device (processing unit (plant)) 2 of present embodiment has dirty situation display unit 60, the dirt Turbid situation display unit 60 is included through window 62, by the component of visible light-transmissive is made；And color card display unit 64, it illustrates the relationships between the amount through the processing bit of window 62 that is attached to and the color through window 62, therefore, by visual observation It is compared to through window 62 and color card display unit 64, so as to suitably determine processing bit to the wall for surrounding Processing Room The degree of adhesion of 52a.
In addition, the record that present invention is not limited to the embodiments described above waits, is able to carry out various changes and implements.For example, In the above-described embodiment, the grinding device 2 ground to the machined object 11 of plate, but processing dress of the invention are illustrated Set the grinding attachment for being also possible to be ground to the machined object 11 of plate.In grinding attachment, for example, being fixed on main shaft Front end discoid mounting base on the grinding emery wheel (machining tool) of the grinding tool with grinding is installed.
Also, in the above-described embodiment, by show the 1st display unit 64a of 4 kinds of different conditions, the 2nd display unit 64b, 3rd display unit 64c and the 4th display unit 64d constitutes color card display unit 64, but color card display unit of the invention It can be made of the display unit for showing 2 kinds, 3 kinds or 5 kinds or more of different conditions.
As long as in addition, the construction of above embodiment, method etc. just can fit in the range of not departing from the object of the invention When change is implemented.

Claims (1)

1. a kind of processing unit (plant), which is characterized in that
The processing unit (plant) includes
Chuck table keeps the machined object of plate；
Unit is processed, it includes main shafts, are equipped with machining tool in the front end of the main shaft, the machining tool is to the chucking work The machined object that platform is kept is ground or is ground；
Processing Room is surrounded by wall, is stored to the front end of the chuck table and the main shaft；And dirty shape Condition display unit shows the degree of adhesion of the processing bit that generates by the grinding of the machined object or grinding to the wall,
The dirt situation display unit includes
A part of the wall is constituted by the component of visible light-transmissive is made through window；And
Color card display unit shows and is attached to according to being overlapped with this through window or being arranged with this through the adjacent mode of window This through window the processing bit amount and this through window color between relationship.
CN201810884015.7A 2017-08-10 2018-08-06 Processing unit (plant) Pending CN109382766A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017155243A JP2019034347A (en) 2017-08-10 2017-08-10 Processing device
JP2017-155243 2017-08-10

Publications (1)

Publication Number Publication Date
CN109382766A true CN109382766A (en) 2019-02-26

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Application Number Title Priority Date Filing Date
CN201810884015.7A Pending CN109382766A (en) 2017-08-10 2018-08-06 Processing unit (plant)

Country Status (6)

Country Link
US (1) US20190047116A1 (en)
JP (1) JP2019034347A (en)
KR (1) KR20190017671A (en)
CN (1) CN109382766A (en)
SG (1) SG10201806315WA (en)
TW (1) TW201910059A (en)

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CN112770619A (en) * 2021-01-05 2021-05-07 东莞市朝行天下通信科技有限公司 5G radio frequency front end assembling device and assembling method thereof

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