TW201910059A - Processing apparatus - Google Patents

Abstract

A processing apparatus includes a chuck table configured to hold a plate-shaped workpiece thereon, a processing unit including a spindle having an end portion at which a processing tool for grinding or polishing a workpiece held on the chuck table is to be mounted, a processing room surrounded by a wall and configured to accommodate the chuck table and the end portion of the spindle therein, and a dirty situation indication unit configured to indicate a degree of adhesion of processing waste, which is generated by grinding or polishing of the workpiece, to the wall. The dirty situation indication unit includes a transmission window made of a member that passes visible rays therethrough and configuring part of the wall, and a color sample indication unit indicative of a relationship between an amount of the processing waste adhering on the transmission window and a color of the transmission window.

Description

Processing device

The present invention relates to a processing apparatus for processing a sheet-like workpiece.

In order to reduce the size and weight of an element wafer incorporated in an electronic device or the like, the chance of thin processing such as a wafer or a package substrate before being divided into component wafers is increased. In this processing, for example, a processing device including a mandrel (rotary shaft) equipped with a processing tool such as a grinding stone or a polishing pad is used. The workpiece to be rotated by the mandrel is brought into contact with a workpiece such as a wafer or a package substrate, whereby the workpiece can be thinned.

However, when the workpiece is processed by the processing apparatus as described above, a large amount of machining debris (dust) is generated and scattered to the surroundings. For this reason, a method of providing a cover member covering the front end portion of the mandrel of the processing tool in the processing apparatus and processing the workpiece in the processing chamber surrounded by the cover member has been proposed (see, for example, Patent Document 1). With this method, there is no possibility that the machining debris is scattered to the outside of the cover member. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-1118

(The subject to be solved by the invention)

As described above, when the processing device is provided with the cover member covering the front end portion of the mandrel, the machining debris adheres to the inner wall of the cover member and gradually accumulates. The processing debris deposited on the inner wall of the cover member falls for some reason, and if it enters the gap between the processing tool and the workpiece, it causes a large damage to the workpiece. Therefore, it is necessary to clean the inner wall of the cover member at an appropriate timing.

However, the timing of the cleaning is determined based on, for example, the experience of the operator. Therefore, there is a case where the cleaning frequency is higher than necessary and the operating rate of the processing device is lowered. On the other hand, if the cleaning timing is slow, the machining debris falls from the inner wall of the cover member and enters the gap between the processing tool and the workpiece, which causes a large damage to the workpiece.

The present invention has been made in view of the above problems, and an object thereof is to provide a processing apparatus capable of appropriately determining the extent to which machining debris adheres to a wall of a processing chamber that surrounds a front end portion of a housing mandrel. (means to solve the problem)

According to an aspect of the invention, there is provided a processing apparatus comprising: a suction cup platform for holding a plate-shaped workpiece; and a processing for grinding or grinding the workpiece to be held by the suction cup platform at the front end portion; a processing unit for a mandrel of the tool; a processing chamber for accommodating the suction cup platform and the front end portion of the mandrel and surrounded by the wall; and a degree of attachment of machining debris to the wall due to grinding or grinding of the workpiece a dirty condition display unit having a transmissive window formed by a member that transmits visible light and constituting a part of the wall; and a superimposed window or a transmissive window A color sample display portion that relates the amount of the machining chips attached to the transmission window to the color of the transmission window. (Effect of the invention)

A processing apparatus according to an aspect of the present invention includes: a transmission window formed of a member that transmits visible light; and a stain display unit that displays a relationship between an amount of machining debris adhering to the transmission window and a color of the transmission window Since the stain condition display means is used, by visually comparing the transmission window and the color sample display portion, it is possible to appropriately determine the extent to which the machining debris adheres to the wall surrounding the processing chamber.

Embodiments of an aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing a configuration example of a polishing apparatus (processing apparatus) 2 of the present embodiment. As shown in Fig. 1, the polishing apparatus 2 is provided with a base 4 that supports each component. A wall-shaped support structure 6 is provided at the rear end of the base 4.

An opening 4a is formed in the upper front side of the base 4, and a transport unit 8 that transports the plate-shaped workpiece 11 is disposed in the opening 4a. The workpiece 11 is, for example, a disk-shaped wafer made of a material such as bismuth (Si). However, the material, shape, structure, size, and the like of the workpiece 11 are not limited. For example, a substrate made of a material such as another semiconductor, ceramic, resin, or metal may be formed as the workpiece 11.

The cassettes 10a and 10b that accommodate the workpiece 11 are placed in the area on the side of the opening 4a. A centering mechanism 12 is provided behind the area in which the cassette 10a is placed. The centering mechanism 12 adjusts, for example, the center position of the workpiece 11 conveyed by the cassette unit 10a by the transport unit 8.

A loading unit 14 that holds the workpiece 11 and rotates is provided behind the centering mechanism 12. An opening 4b is formed in the rear of the loading unit 14. In the opening 4b, an X-axis moving stage 16 and an X-axis moving unit (not shown) that moves the X-axis moving stage 16 in the X-axis direction (front-rear direction) and a dust-proof drip-proof covering the X-axis moving unit are disposed. Cover member 18.

The X-axis moving unit includes a pair of X-axis guide rails (not shown) that are parallel to the X-axis direction, and the X-axis moving stage 16 is slidably attached to the X-axis guide rail. A nut portion (not shown) is provided on the lower surface side of the X-axis moving platform 16, and an X-axis ball screw (not shown) parallel to the X-axis guide is screwed into the nut portion.

An X-axis pulse motor (not shown) is coupled to one end of the X-axis ball screw. The X-axis ball screw is rotated by the X-axis pulse motor, whereby the X-axis moving platform 16 is moved in the X-axis direction along the X-axis guide. A suction cup platform 20 that sucks and holds the workpiece 11 is provided on the upper surface of the X-axis moving platform 16.

The chuck table 20 is coupled to a rotary drive source (not shown) such as a motor, and rotates about a rotation axis that is approximately parallel to the Z-axis direction (vertical direction). In addition, the suction cup platform 20 is moved between the loading/unloading area in front of the workpiece 11 to be carried in and out, and the polishing area behind the workpiece 11 by the X-axis moving unit.

The upper surface of the suction cup platform 20 is formed to attract and hold the holding surface of the workpiece 11. The holding surface is connected to a suction source (not shown) through a flow path (not shown) formed inside the suction cup table 20. The workpiece 11 carried into the suction cup platform 20 by the loading unit 14 is sucked and held by the negative pressure of the suction source acting on the holding surface.

A Z-axis moving unit 22 is provided in front of the support structure 6. The Z-axis moving unit 22 includes a pair of Z-axis guide rails 24 that are parallel to the Z-axis direction, and a Z-axis moving plate 26 is slidably attached to the Z-axis guide rails 24. A nut portion (not shown) is provided on the rear side (back side) of the Z-axis moving plate 26, and a Z-axis ball screw 28 parallel to the Z-axis guide 24 is screwed into the nut portion.

A Z-axis pulse motor 30 is coupled to one end of the Z-axis ball screw 28. The Z-axis ball screw 28 is rotated by the Z-axis pulse motor 30, whereby the Z-axis moving plate 26 is moved in the Z-axis direction along the Z-axis guide 24.

A polishing unit (processing unit) 32 that polishes the workpiece 11 is provided on the front surface (surface) of the Z-axis moving plate 26. The polishing unit 32 is provided with a cylindrical mandrel cover 34 that is fixed to the Z-axis moving plate 26 . A mandrel 36 serving as a rotating shaft is housed inside the mandrel sleeve 34.

A disk-shaped holder 38 is fixed to a front end portion (lower end portion) of the mandrel 36 exposed by the mandrel sleeve 34, and a polishing pad having a diameter equal to that of the holder 38 is attached to the lower surface of the holder 38 (machining) Tool) 40. In the present embodiment, the polishing pad 40 for dry polishing in which a polishing liquid such as a slurry is not used is used, but the polishing pad 40 for wet polishing may be used.

A rotary drive source (not shown) such as a motor is coupled to the proximal end side (upper end side) of the mandrel 36, and the polishing pad 40 is rotated by a force transmitted from the rotational drive source. Further, the polishing unit 32 is lowered by the Z-axis moving unit 22, whereby the polishing pad 40 is pushed against the upper surface (the surface to be polished) of the workpiece 11 held by the chuck table 20.

A carry-out unit 42 that holds the workpiece 11 and swings is provided at a position adjacent to the loading unit 14. A cleaning unit 44 that cleans the workpiece 11 after polishing is disposed in front of the carry-out unit 42 and behind the area on which the cassette 10b is placed.

The workpiece 11 washed by the cleaning unit 44 is transported by the transport unit 8 and stored in, for example, the cassette 10b. An operation panel 46 for inputting polishing conditions or the like is provided in front of the opening 4a.

When the workpiece 11 is polished by the polishing apparatus 2, the suction pad table 20 and the polishing pad 40 are rotated relative to each other while the workpiece 11 is sucked and held by the chuck table 20, and the polishing pad 40 is pushed against the processed object. Above the object 11. Thereby, the workpiece 11 can be ground. However, in the present embodiment, the polishing liquid such as a slurry is not used, but a polishing liquid may be used.

As described above, when the workpiece 11 is polished by the polishing pad 40, the dust is easily scattered to the periphery of the chuck table 20 or the polishing pad 40. Therefore, the polishing apparatus 2 of the present embodiment is provided with a lid member 52 that covers the tip end portion (polishing pad 40) of the chuck table 20 or the mandrel 36.

A processing chamber (grinding chamber) for grinding the workpiece 11 is formed by the lid member 52. That is, the processing chamber is surrounded by the wall 52a constituting the cover member 52. Further, a suction cup stage 20 or a front end portion of the mandrel 36 is housed in the processing chamber. The material, shape, and the like of the cover member 52 are not particularly limited. For example, a metal such as stainless steel or aluminum may be used to form the cover member 52.

An exhaust port (not shown) that penetrates the inside and the outside of the lid member 52 is provided in a part of the wall 52a of the lid member 52. One end of the exhaust duct 54 disposed outside the cover member 52 is connected to the exhaust port. Further, a suction source 56 is connected to the other end of the exhaust duct 54. That is, the suction source 56 is connected to the exhaust port through the exhaust duct 54.

The suction source 56 has a control switch 58 that controls the occurrence of attractive force. By operating the control switch 58, the suction force of the suction source 56 can be applied to the exhaust port. When the workpiece 11 is polished, the suction force of the suction source 56 is applied to the exhaust port, and the air containing the machining waste (dust) in the processing chamber is discharged to the outside of the lid member 52.

In the polishing apparatus 2 constructed as described above, the machining debris generated during the grinding stays in the processing chamber without scattering to the outside of the cover member 52. On the other hand, on the inner surface of the wall 52a constituting the lid member 52, the machining debris adheres and gradually accumulates. The machining debris deposited on the wall 52a of the cover member 52 is dropped for some reason, and if it enters the gap between the polishing pad 40 and the workpiece 11, the workpiece 11 is greatly damaged.

Therefore, in the polishing apparatus 2 of the present embodiment, the dirt condition display unit 60 indicating the extent to which the machining debris adheres to the wall 52a is provided in a part of the wall 52a constituting the lid member 52. FIG. 2 is a plan view showing a configuration example of the dirty state display unit 60 in a mode. As shown in FIG. 2, the dirty condition display unit 60 has a transmission window 62 formed of a member such as a glass plate that transmits visible light.

The transmission window 62 is fitted into an opening that penetrates the inside and the outside of the lid member 52 to constitute a part of the wall 52a. In other words, in the case where the machining debris adheres to and is deposited on the inner surface of the wall 52a, the machining debris adheres to and accumulates on the inner surface of the transmission window 62. When the machining chips adhere to and accumulate on the inner surface of the transmission window 62, the transmittance of the transmission window 62 is lowered. Therefore, by confirming the state of the transmission window 62, it is possible to determine the extent to which the machining debris adheres and deposits on the wall 52a.

A color sample display indicating the relationship between the amount of machining chips attached to the transmission window 62 and the color (transmittance) of the transmission window 62 is provided at a position overlapping the transmission window 62 or at a position adjacent to the transmission window 62. Department 64. Further, an annotation 66 corresponding to the amount of machining debris deposited and deposited in the transmission window 62 is attached to the adjacent portion of the color sample display portion 64. However, this annotation 66 can also be omitted.

The color sample display unit 64 includes a first display portion 64a indicating a color corresponding to the color of the transmission window 62 in a state in which the processing debris is not adhered, and a transmission window indicating a state in which the processing debris is slightly adhered and accumulated. The second display portion 64b of the color corresponding to the color of 62. In addition, the third display portion 64c indicating a color corresponding to the color of the transmission window 62 in a state in which a large amount of machining debris is adhered or deposited, and a transmission window 62 indicating a state in which a large amount of machining debris is adhered and deposited is included. The fourth display portion 64d of the color corresponding to the color.

Next, an annotation 66 is attached to each of the first display portion 64a, the second display portion 64b, the third display portion 64c, and the fourth display portion 64d. For example, an annotation 66 indicating "OK" that does not require cleaning is attached to the vicinity of the first display portion 64a. Further, an annotation 66 indicating "cleaning time" for which cleaning is desired is attached to the second display portion 64b.

Further, an annotation 66 indicating "cleaning as soon as possible" to be cleaned is attached to the third display portion 64c. Next, in the vicinity of the fourth display portion 64d, an annotation 66 indicating "immediate cleaning" which is likely to cause a defect due to the machining debris deposited or deposited on the wall 52a is attached.

Next, the use of the soiling condition display unit 60 will be described to confirm that the machining debris adheres to the wall 52a. First, the operator visually compares the transmission window 62 and the color sample display unit 64 at an arbitrary timing, and determines that the color of the transmission window 62 approaches the first display unit 64a, the second display unit 64b, the third display unit 64c, and the fourth display. Which color of the part 64d.

Thereby, it is clear that the machining chips adhere to the wall 52a. For example, when the color of the transmission window 62 is close to the color of the first display portion 64a, it is understood that the machining debris is hardly adhered to and deposited on the wall 52a. Further, for example, when the color of the transmission window 62 is close to the color of the second display portion 64b, it is understood that some micro-machining chips adhere to and deposit on the wall 52a.

Further, when the color of the transmission window 62 approaches the color of the third display portion 64c or the fourth display portion 64d, it is understood that a large amount of machining debris adheres to and deposits on the wall 52a. Next, the operator can determine the timing of cleaning the cover member 52 by referring to the annotation 66 or the like attached to the color sample display portion 64.

As described above, the polishing apparatus (processing apparatus) 2 of the present embodiment includes the transmission window 62 having a member that transmits visible light, and the amount of machining debris attached to the transmission window 62 and the transmission window 62. Since the stain display unit 60 of the color sample display unit 64 of the color relationship is visually compared with the color sample display unit 64, it is possible to appropriately determine the degree to which the machining debris adheres to the wall 52a surrounding the processing chamber.

However, the present invention is not limited to the above-described embodiments and the like, and can be implemented in various modifications. For example, in the above-described embodiment, the polishing apparatus 2 for polishing the plate-shaped workpiece 11 will be described. However, the processing apparatus of the present invention may be a grinding apparatus for grinding the sheet-like workpiece 11. In the grinding device, for example, a grinding wheel (machining tool) including a grinding stone for grinding is attached to a disk-shaped holder fixed to the front end portion of the mandrel.

In the above-described embodiment, the color display unit 64 is configured by the first display unit 64a, the second display unit 64b, the third display unit 64c, and the fourth display unit 64d in four different states. The color sample display unit of the present invention may be configured by a display unit that displays two types, three types, or five or more different states.

The structures, methods, and the like of the other embodiments described above can be appropriately modified without departing from the scope of the invention.

2‧‧‧grinding device (processing device)

4‧‧‧Abutment

4a, 4b‧‧‧ openings

6‧‧‧Support structure

8‧‧‧Transport unit

10a, 10b‧‧‧匣 box

11‧‧‧Processed objects

12‧‧‧Centering

14‧‧‧ Moving into the unit

16‧‧‧X-axis mobile platform

18‧‧‧Dust-proof drip cover

20‧‧‧Sucker platform

22‧‧‧Z-axis mobile unit

24‧‧‧Z-axis guide

26‧‧‧Z-axis moving board

28‧‧‧Z-axis ball screw

30‧‧‧Z-axis pulse motor

32‧‧‧grinding unit (processing unit)

34‧‧‧Heart sleeve

36‧‧‧ mandrel

38‧‧‧ 座座

40‧‧‧ polishing pad (processing tool)

42‧‧‧ Moving out of the unit

44‧‧‧cleaning unit

46‧‧‧Operator panel

52‧‧‧Cleaning pieces

52a‧‧‧ wall

54‧‧‧Exhaust duct

56‧‧‧Attraction source

58‧‧‧Control switch

60‧‧‧Dirty status display unit

62‧‧‧through the window

64‧‧‧Color sample display

64a‧‧‧1st display

64b‧‧‧2nd display

64c‧‧‧3rd display

64d‧‧‧4th display

66‧‧‧Notes

Fig. 1 is a perspective view showing a configuration example of a polishing apparatus in a mode. Fig. 2 is a plan view showing a configuration example of a dirty state display unit in a mode.

Claims (1)

A processing apparatus comprising: a suction cup platform that holds a plate-shaped workpiece; and a mandrel that includes a processing tool that grinds or grinds the workpiece to be held on the suction cup platform at a front end portion a machining unit; a processing chamber for accommodating the suction cup platform and the front end portion of the spindle and surrounded by the wall; and a display indicating that the machining debris adhered to the wall due to grinding or polishing of the workpiece The unit of dirty state display unit includes: a transmissive window formed by a member that transmits visible light and constituting a part of the wall; and a window that overlaps with the transmissive window or is adjacent to the transmissive window, and indicates that the transmissive window is attached to the transmissive window A color sample display portion for the relationship between the amount of the machining waste and the color of the transmission window.