CN101811273A - Work piece processing method and Work treatment installation - Google Patents
Work piece processing method and Work treatment installation Download PDFInfo
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- CN101811273A CN101811273A CN201010113661A CN201010113661A CN101811273A CN 101811273 A CN101811273 A CN 101811273A CN 201010113661 A CN201010113661 A CN 201010113661A CN 201010113661 A CN201010113661 A CN 201010113661A CN 101811273 A CN101811273 A CN 101811273A
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- 238000003672 processing method Methods 0.000 title claims abstract description 20
- 238000009434 installation Methods 0.000 title claims abstract description 18
- 238000000227 grinding Methods 0.000 claims abstract description 238
- 238000003754 machining Methods 0.000 claims abstract description 30
- 238000005498 polishing Methods 0.000 claims abstract description 30
- 238000012423 maintenance Methods 0.000 claims description 44
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000002245 particle Substances 0.000 description 15
- 238000005520 cutting process Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 gallium nitride compound Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
- B24B19/028—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements for microgrooves or oil spots
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
The present invention relates to a kind of Work piece processing method and Work treatment installation.When plate workpiece being carried out grinding, even, also can suppress the face that is ground and produce the situation of breaking the plate workpiece grinding being become under the thinner situation in the mode of the rib that forms ring-type.Utilize first machining cell to implement grinding in the mode that forms circular-arc first polishing scratch (21), relative therewith, utilize second machining cell to implement grinding, can prevent from same direction, to form continuously the intensity reduction of the face that is ground that causes thus owing to first polishing scratch and second polishing scratch in the mode that forms circular-arc second polishing scratch (23) that intersects with first polishing scratch (21).
Description
Technical field
The present invention relates to plate workpiece is carried out grinding to form the Work piece processing method and the Work treatment installation of the rib of ring-type in the outer edge.
Background technology
In semiconductor devices manufacturing process, on the surface of the semiconductor wafer of circular plate shape roughly, mark off a plurality of zones by being the preset lines of cutting apart that is called as spacing track that clathrate arranges, and in the zone that this marks off integrated circuit), LSI (Large ScaleIntegration: device such as large scale integrated circuit) formation IC (Integrated Circuit:.Then, come the zone that is formed with device is cut apart by cutting off semiconductor wafer, thereby produce semiconductor chip one by one along spacing track.In addition, about on the surface of sapphire substrate, being laminated with the optical device wafer of gallium nitride compound semiconductor etc., also be divided into optical device such as light emitting diode, laser diode one by one, and extensively be used in electronic equipment by cutting off along spacing track.
Divided as described above wafer is before cutting off along spacing track, by grinding being carried out at the back side or etching forms predetermined thickness.In recent years, for lightweight, the miniaturization that reaches electronic equipment, require the thickness of wafer is formed below the 50 μ m.
But, when the thickness of wafer forms 50 μ m when following, the problem that then exists processing such as conveyance damaged easily, wafer to become difficult.
In order to solve such problem, proposed such wafer processing method: grinding is carried out in the zone corresponding with device area to chip back surface, the thickness of device area is formed predetermined thickness, and the periphery remaining area that stays chip back surface forms the rib of ring-type, can easily carry out the conveyance etc. of the wafer after the attenuation thus and handle (for example, with reference to patent documentation 1).
Patent documentation 1: TOHKEMY 2007-19461 communique
According to patent documentation 1, even the thickness of wafer is formed below the 50 μ m also not cracky, it is easy that processing such as conveyance become.In addition, in the grinding of reality, roughly grind successively by the grinding grinding tool that uses abrasive particle to vary in size and to cut the grinding that processing and fine ginding are processed these two stages, come wafer is processed rib with the formation ring-type.But, the grinding by carrying out like this two stages successively with the central portion of wafer around grinding when becoming thinner, exist the face that is ground of wafer to produce the situation of breaking.
Summary of the invention
The present invention finishes in view of foregoing, its purpose is to provide a kind of such Work piece processing method and Work treatment installation: plate workpiece is being carried out grinding when forming the rib of ring-type, even under the situation that plate workpiece grinding one-tenth is thinner, also can suppress the face that is ground and produce the situation of breaking.
Arrive purpose in order to address the above problem, the Work piece processing method that Work piece processing method involved in the present invention is to use processing unit (plant) that plate workpiece is processed, above-mentioned plate workpiece has device area that is formed with device and the above-mentioned processing unit (plant) of remaining area that surrounds this device area and comprises in face side: holding unit, it has maintenance face, and this maintenance face keeps above-mentioned plate workpiece and is that the center is driven in rotation with the rotating shaft; First machining cell, it has the first grinding grinding tool and first main shaft part, the above-mentioned first grinding grinding tool has and opposed first grinding face of above-mentioned maintenance face, and it can be the rotation of first rotating shaft with the vertical axis perpendicular to above-mentioned first grinding face that above-mentioned first main shaft part is supported to the above-mentioned first grinding grinding tool; And second machining cell, it has the second grinding grinding tool and second main shaft part, the above-mentioned second grinding grinding tool has and opposed second grinding face of above-mentioned maintenance face, it can be the rotation of second rotating shaft with the vertical axis perpendicular to above-mentioned second grinding face that above-mentioned second main shaft part is supported to the above-mentioned second grinding grinding tool, above-mentioned Work piece processing method is characterised in that, this Work piece processing method comprises following operation: keep operation, in this keeps operation, the above-mentioned face side of above-mentioned plate workpiece is remained in above-mentioned maintenance face; First manufacturing procedure, in this first manufacturing procedure, with respect to the rear side that remains on the above-mentioned plate workpiece on the above-mentioned maintenance face, above-mentioned first grinding face is positioned to make the center of the outer peripheral edges of the above-mentioned first grinding grinding tool by the inboard and above-mentioned plate workpiece in the zone corresponding with above-mentioned remaining area, and implement grinding, thereby make the above-mentioned back side corresponding of above-mentioned plate workpiece form concavity portion with above-mentioned device area in the mode that forms the first circular-arc polishing scratch; And second manufacturing procedure, in this second manufacturing procedure, with respect to remaining on the above-mentioned maintenance face and implementing the above-mentioned rear side of the above-mentioned plate workpiece of above-mentioned first manufacturing procedure, the outer peripheral edges that above-mentioned second grinding face are positioned to make the above-mentioned second grinding grinding tool are by the center of the inboard and above-mentioned plate workpiece of above-mentioned concavity portion, and to form and the mode of the second circular-arc polishing scratch that above-mentioned first polishing scratch intersects is implemented grinding.
In addition, Work treatment installation involved in the present invention is characterised in that above-mentioned Work treatment installation comprises: holding unit, and it has maintenance face, and this maintenance face keeps plate workpiece and is that the center is driven in rotation with the rotating shaft; First machining cell, it has the first grinding grinding tool and first main shaft part, the above-mentioned first grinding grinding tool has and opposed first grinding face of above-mentioned maintenance face, it can be the rotation of first rotating shaft with the vertical axis perpendicular to above-mentioned first grinding face that above-mentioned first main shaft part is supported to the above-mentioned first grinding grinding tool, and above-mentioned first rotating shaft tilts a little with respect to above-mentioned rotating shaft; Second machining cell, it has the second grinding grinding tool and second main shaft part, the above-mentioned second grinding grinding tool has and opposed second grinding face of above-mentioned maintenance face, it can be the rotation of second rotating shaft with the vertical axis perpendicular to above-mentioned second grinding face that above-mentioned second main shaft part is supported to the above-mentioned second grinding grinding tool, and the direction that above-mentioned second rotating shaft is opposite with above-mentioned first rotating shaft with respect to above-mentioned axial rotary tilts a little; And control module, it is controlled as described below: with respect to having device area and remaining area in face side and remaining on the rear side of the above-mentioned plate workpiece on the above-mentioned maintenance face, above-mentioned first grinding face is positioned to make the center of the outer peripheral edges of the above-mentioned first grinding grinding tool by the inboard and above-mentioned plate workpiece in the zone corresponding with above-mentioned remaining area, and enforcement grinding, and, with respect to remaining on the above-mentioned maintenance face and implementing the rear side of the above-mentioned plate workpiece of above-mentioned grinding, second grinding face is positioned to make the center of the outer peripheral edges of the above-mentioned second grinding grinding tool by the inboard and above-mentioned plate workpiece in the zone corresponding with above-mentioned remaining area, and enforcement grinding, form the rib of ring-type thus in the rear side corresponding with above-mentioned remaining area, wherein, above-mentioned device area is the zone that is formed with device, and above-mentioned remaining area is the zone that surrounds above-mentioned device area.
According to Work piece processing method involved in the present invention and Work treatment installation, utilize first machining cell to implement grinding in the mode that forms the first circular-arc polishing scratch, relative therewith, utilize second machining cell to implement grinding in the mode that forms the second circular-arc polishing scratch that intersects with first polishing scratch, so can prevent the intensity that forms the face that is ground that causes owing to first polishing scratch and second polishing scratch on same direction continuously reduces, thus, when plate workpiece being carried out grinding in the mode of the rib that forms ring-type, even under the situation that plate workpiece grinding one-tenth is thinner, also have and to suppress to be ground the effect that the face generation is broken.
Description of drawings
Fig. 1 is the stereogram of the structure example of the expression Work treatment installation that is used to implement the related Work piece processing method of embodiments of the present invention.
Fig. 2-the 1st, the skeleton diagram of the heeling condition of expression first rotating shaft.
Fig. 2-the 2nd, the skeleton diagram of the heeling condition of expression second rotating shaft.
Fig. 3-the 1st, the stereogram of the face side of expression plate workpiece.
Fig. 3-the 2nd, the stereogram of the rear side of expression plate workpiece.
Fig. 4 is the figure of the positioning states in expression first manufacturing procedure.
Fig. 5 is the figure of the state in the process of representing in first manufacturing procedure.
Fig. 6 is the figure of the state after expression is processed by first manufacturing procedure.
Fig. 7 is the figure of the positioning states in expression second manufacturing procedure.
Fig. 8 is the figure of the state in the process of representing in second manufacturing procedure.
Fig. 9 is the figure of the state after expression is processed by second manufacturing procedure.
Label declaration
1: Work treatment installation; 3: the first machining cells; 3a: first grinding face; 3b: the first grinding grinding tool; 3c: first main shaft part; 4: the second machining cells; 4a: second grinding face; 4b: the second grinding grinding tool; 4c: second main shaft part; 6: holding unit; 6s: maintenance face; 14: control module; 21: the first polishing scratch; 23: the second polishing scratch; W: plate workpiece; Wa: surface; Wb: the back side; W1: device area; W2: remaining area; W3: concavity portion; W4: rib; φ 0: rotating shaft; 1: the first rotating shaft of φ; 2: the second rotating shafts of φ.
The specific embodiment
Below, with reference to accompanying drawing, to describing as the Work piece processing method and the Work treatment installation that are used to implement mode of the present invention.Fig. 1 is the stereogram of the structure example of the expression Work treatment installation that is used to implement the related Work piece processing method of present embodiment, Fig. 2-the 1st, the skeleton diagram of the heeling condition of expression first rotating shaft, Fig. 2-the 2nd, the skeleton diagram of the heeling condition of expression second rotating shaft.The Work treatment installation 1 of present embodiment is used for that as described below grinding is carried out in the zone corresponding with device area at the back side of plate workpiece the thickness of device area is formed predetermined thickness, and the periphery remaining area that stays the back side of plate workpiece forms the rib of ring-type.The Work treatment installation 1 of present embodiment for example mainly comprises: housing 2; First machining cell 3; Second machining cell 4; Be arranged on for example three holding units 6 on the rotary table 5; Box 7,8; Position alignment unit 9; Conveyance unit 10; Take out of unit 11; Cleaning unit 12; Take out of and move into unit 13; And control module 14.
Rotary table 5 is arranged on the disc-shaped part of the upper surface of housing 2, and this rotary table 5 is provided with in the mode that can rotate in horizontal plane, and is in due course and is driven in rotation.On this rotary table 5, equally spaced be equipped with for example three holding units 6 with for example phase angle of 120 degree.These holding units 6 are the chuck table structures that possess vacuum chuck at upper surface, thereby 6 pairs of mountings of holding unit are carried out vacuum suction maintenance plate workpiece W in the plate workpiece W that keeps face 6s, and above-mentioned maintenance face 6s forms flat condition.When carrying out grinding, by not shown rotary drive mechanism, these holding units 6 are that the center is driven in rotation in horizontal plane with the rotating shaft φ 0 perpendicular to maintenance face 6s.By the rotation of rotary table 5, such holding unit 6 move into take out of position of readiness A, and first machining cell, 3 opposed corase grind cut position B and and second machining cell, 4 opposed fine ginding position C between relatively move.
In addition, first, second sliding part 3d, the 4d of first, second machining cell 3,4 is arranged to respectively and can carries out vertical feed by vertical feed unit 15,16, and constitutes and can make first, second grinding grinding tool 3b, 4b carry out grinding and feeding with respect to the upper surface of the plate workpiece W on the holding unit 6.These vertical feed unit 15,16 are installed on the moveable block 17,18 of the upper surface that is arranged at housing 2. Moveable block 17,18 is arranged to movable with respect to housing 2 by not shown travel mechanism so that first, second grinding grinding tool 3b, 4b with respect to be positioned at holding unit 6 that corase grind cuts position B or fine ginding position C the radial direction of rotary table 5 enterprising advance retire moving.
Box the 7, the 8th has the plate workpiece collector of a plurality of slits.A box 7 is taken in the plate workpiece W before the grinding, and another box 8 is taken in the plate workpiece W after the grinding.In addition,, be not particularly limited, can list for example semiconductor wafer such as silicon wafer or GaAs, pottery, glass, sapphire (Al as plate workpiece W
2O
3) the such ductile material of inorganic material substrate, plate-shape metal or the resin of class or even require the various rapidoprints of micron order flatness (TTV (Total Thickness Variation: general thickness is poor): with the face that is ground of plate workpiece is the poor of the maximum of the height measured of datum level and minimum of a value) to the face of inferior micron order in whole of plate workpiece on thickness direction.
In addition, position alignment unit 9 is to be used for interim mounting to carry out the workbench that the center is aimed at from the plate workpiece W of box 7 taking-ups and to it.Moving into unit 10 is made of the carrying arm that has sucker and driven by rotation in horizontal plane, move into unit 10 and be used to adsorb maintenance and carried out plate workpiece W position alignment, before the grinding, and this plate workpiece W moved into to being positioned at move on the holding unit 6 of taking out of position of readiness A by position alignment unit 9.Taking out of unit 11 is made of the carrying arm that has sucker and driven by rotation in horizontal plane, take out of unit 11 and be used to adsorb and be held in place in moving on the holding unit 6 of taking out of position of readiness A plate workpiece W that keep, after the grinding, and this plate workpiece W is taken out of to cleaning unit 12.In addition, taking out of and moving into unit 13 for example is the mechanical pick-up arm with U font manipulator 13a, takes out of to move into unit 13 and adsorb by U font manipulator 13a and keep plate workpiece W and carry out conveyance.Specifically, take out of and move into unit 13 the plate workpiece W before the grinding is taken out of to position alignment unit 9 from box 7, and the plate workpiece W after the grinding is moved into to box 8 from cleaning unit 12.Plate workpiece W after 12 pairs of grindings of cleaning unit cleans, and will be attached to the contaminant removal such as abrasive dust of the machined surface of grinding.
In addition, control module 14 is made of microcomputer, and control module 14 is the parts of action that are used for controlling the each several part of Work treatment installation 1 for plate workpiece W is implemented the grinding of expection.
In such Work treatment installation 1, be positioned at holding unit 6 that corase grind cuts position B and the first grinding grinding tool 3b all under the situation of counterclockwise rotating, the first rotating shaft φ 1 of first machining cell 3 sets for shown in Fig. 2-1: tilt a little with respect to the rotating shaft φ 0 vertical with the maintenance face 6s of holding unit 6, its tilt quantity is first inclined angle alpha.
In addition, at the holding unit 6 that is positioned at fine ginding position C and the second grinding grinding tool 4b all under right handed situation, the second rotating shaft φ 2 of second machining cell 4 sets for shown in Fig. 2-2: tilt a little with respect to the rotating shaft φ 0 vertical with the maintenance face 6s of holding unit 6, its tilt quantity is second angle of inclination beta.That is, with respect to rotating shaft φ 0, the second rotating shaft φ 2 and the first rotating shaft φ, 1 inclined in opposite directions.In addition, second angle of inclination beta is set the angle littler than first inclined angle alpha for.In addition, these first, second inclined angle alpha, β are the interior minute angles of scope that for example is set in 0～0.5 degree, but represent with the angle of exaggeration on accompanying drawing.
Next, the plate workpiece W as the grinding object is in the present embodiment described.Fig. 3-the 1st, the stereogram of the face side of expression plate workpiece W, Fig. 3-the 2nd, the stereogram of the rear side of expression plate workpiece W.About in the present embodiment as the plate workpiece W of grinding object, on whole of surperficial Wa side, be formed with a plurality of devices that demarcated in length and breadth, the zone (zone of representing with the site in Fig. 3-1) that wherein has for the effective device of commercialization is device area W1, and the exterior lateral area of surrounding this device area W1 is remaining area W2.
In the present embodiment, carry out grinding in the following manner: the back side Wb corresponding with device area W1 of such plate workpiece W carried out grinding as being ground the zone from back side Wb side, thereby form the rib of ring-type at the back side Wb corresponding with remaining area W2.For this reason, the first grinding grinding tool 3b of present embodiment and the second grinding grinding tool 4b form the diameter of most peripheral of its rotational trajectory greater than the radius of device area W1 and less than the diameter of device area W1.
Below, with reference to Fig. 4～Fig. 9, the processing method of the plate workpiece W of the present embodiment carried out under the control of control module 14 is described.
(maintenance operation)
At first, plate workpiece W before the grinding utilized to take out of move into unit 13 and take out from box 7, after utilizing position alignment unit 9 to carry out the center aligning, utilize conveyance unit 10 to keep this plate workpiece W, and it is moved into to being positioned on the maintenance face 6s that moves into the holding unit 6 of taking out of position of readiness A adsorb maintenance from top absorption.At this moment, the conduct of the plate workpiece W back side Wb side that is ground face becomes upper surface.
(first manufacturing procedure)
Then, move into the holding unit 6 of taking out of position of readiness A and be positioned to roughly grind and cut the position by making rotary table 5 rotation 120 degree, will being positioned at.Then, the maintenance face 6s that maintains plate workpiece W is counterclockwise rotated for middle mind-set with rotating shaft φ 0, and the first grinding grinding tool 3b that makes first machining cell 3 is to rotation counterclockwise, from the back side Wb side of plate workpiece W the central portion grinding become concavity.At first, by making moveable block 17 advance and retreat, as shown in Figure 4, the first grinding face 3a is positioned to the outer peripheral edges of the first grinding grinding tool 3b by the inboard (the boundary portion between device area W1 and the remaining area W2) in the zone corresponding and the center W0 of plate workpiece W with remaining area W2.Then, as shown in Figure 5, utilize the first grinding grinding tool 3b that vertical feed unit 15 makes at a high speed rotation to descend and carry out grinding and feeding with respect to the back side Wb of plate workpiece W, thus, as shown in Figure 6, implement grinding in the mode that forms the first circular-arc polishing scratch 21, the back side Wb corresponding with device area W1 of plate workpiece W becomes the W3 of concavity portion.
Herein, in grinding shown in Figure 5, because the first rotating shaft φ 1 of the first grinding grinding tool 3b is with respect to rotating shaft φ 0 inclination first inclined angle alpha of holding unit 6, so in the first grinding face 3a, become with lower half in the front of site STA representation among the figure and contact with plate workpiece W and embody the part of ablation, higher half in back floated from plate workpiece W, and the part till therefore from the center W0 of plate workpiece W to the inboard in the zone corresponding with remaining area W2 is ground to concave slightly.Label 22 expression concave portions, this concave portion 22 carries out the back side Wb that grinding is formed at plate workpiece W by utilize the first grinding grinding tool 3b that tilts low early and high afterly.Polishing scratch under this situation becomes the first circular-arc polishing scratch 21 shown in Figure 6.
In the first such manufacturing procedure, when utilizing the first grinding grinding tool 3b to carry out grinding, since the first rotating shaft φ 1 with respect to first inclined angle alpha of rotating shaft φ 0 set for particle diameter than abrasive particle big than wide-angle, the abrasive particle that comes off from the first grinding grinding tool 3b is difficult between engaging-in first grinding grinding tool 3b and the concave portion 22, even, also be difficult for producing cut in concave portion 22 so produced the abrasive particle that comes off.On the other hand, because the first rotating shaft φ 1 is bigger with respect to first inclined angle alpha of rotating shaft φ 0, so shown in Fig. 6 (b), flatness (TTV) variation in the face.
(second manufacturing procedure)
Then, roughly grind the holding unit 6 of cutting position B and be positioned the fine ginding position by making rotary table 5 rotation 120 degree, will being positioned at.Then, make and maintain the maintenance face 6s that corase grind cuts finished plate workpiece W and be middle mind-set clockwise direction rotation with rotating shaft φ 0, and the second grinding grinding tool 4b of second machining cell 4 is rotated to clockwise direction, from the back side Wb side of plate workpiece W with central portion (W3 of concavity portion) further fine ginding be processed into concavity.At first, by making moveable block 18 advance and retreat, as shown in Figure 7, the second grinding face 4a is positioned to the outer peripheral edges of the second grinding grinding tool 4b by the inboard (the boundary portion between device area W1 and the remaining area W2) in the zone corresponding and the center W0 of plate workpiece W with remaining area W2.Then, as shown in Figure 8, utilize the second grinding grinding tool 4b that vertical feed unit 16 makes at a high speed rotation to descend and carry out grinding and feeding, thus with respect to the back side Wb of plate workpiece W, as shown in Figure 9, implement grinding in the mode that forms the second circular-arc polishing scratch 23.Like this, the remaining area W2 ground of reserving plate workpiece W from the back side Wb side of plate workpiece W carries out grinding, and the manufacturing procedure that forms the rib W4 of W3 of concavity portion that obtains by grinding and the ring-type of surrounding the W3 of this concavity portion in the back side of plate workpiece W Wb side finishes.This rib W4 becomes in machining and finishes the retaining part that unit maintenance such as 11 grades is taken out of in the back.
Herein, in grinding shown in Figure 8, because the second rotating shaft φ 2 of the second grinding grinding tool 4b is with respect to rotating shaft φ 0 inclination second angle of inclination beta of holding unit 6, so in the second grinding face 4a, become with lower half of site STA representation among the figure and contact with plate workpiece W and embody the part of ablation, higher half then floated from plate workpiece W, and the part till therefore from the center W0 of plate workpiece W to the inboard in the zone corresponding with remaining area W2 is ground to concave slightly.Label 24 expression concave portions, this concave portion 24 by utilize the second grinding grinding tool 4b that tilts low early and high afterly carry out grinding be formed at plate workpiece W back side Wb.
Polishing scratch under this situation second circular-arc polishing scratch 23 that intersects with first polishing scratch 21 that becomes shown in Figure 9.Promptly, because it is opposite with the first inclined angle alpha direction of the first rotating shaft φ 1 that second angle of inclination beta of the second rotating shaft φ 2 is set for, so add second polishing scratch 23 that forms man-hour and cut first polishing scratch 21 that forms by corase grind and intersect utilizing the second grinding face 4a to carry out fine ginding.Thus, shown in the dotted line in Fig. 9 (a), can be eliminating first polishing scratch 21 by fine ginding when, prevent that the intensity that forms the face that is ground that causes owing to first polishing scratch and second polishing scratch on same direction continuously from reducing.Thus, when plate workpiece W being carried out grinding, even, also can suppress the face that is ground and produce the situation of breaking plate workpiece W grinding being become under the thinner situation in the mode of the rib W4 that forms ring-type.
In addition, in the second such manufacturing procedure, though the second rotating shaft φ 2 is littler than first inclined angle alpha with respect to second angle of inclination beta of rotating shaft φ 0, the particle diameter of abrasive particle is also little, thereby is difficult for causing the engaging-in of abrasive particle.In addition, about having used the fine ginding processing of the second grinding grinding tool 4b that fine ginding uses, not as first manufacturing procedure, to make abrasive particle bump machined surface and utilize this bump plate workpiece to be removed the processing of processing, but so that abrasive particle is main processing to being ground the ductility pattern that face excludes as cutter, therefore even because the abrasive particle that comes off causes engaging-inly, also can substantially ignore influence by the cut of the abrasive particle generation that comes off.On the other hand, because the second rotating shaft φ 2 is littler than first inclined angle alpha with respect to second angle of inclination beta of rotating shaft φ 0, so shown in Fig. 9 (b), can in face, carry out fine finishining under flatness (TTV) good state.
Thus, according to present embodiment, process these two stages when plate workpiece W is carried out grinding when cutting processing and fine ginding by corase grind, can suppress the generation of the cut that causes by the abrasive particle that comes off, and can keep the flatness of the face of being ground in the mode of the rib W4 that forms ring-type.
In addition, the present invention is not limited to above-mentioned embodiment, as long as in the scope that does not break away from purport of the present invention, can carry out various distortion.For example, in the present embodiment, rotating shaft φ 0 with respect to holding unit 6, make first, second rotating shaft φ 1, the φ 2 of first, second grinding grinding tool 3b, 4b tilt a little first, second inclined angle alpha, β, but as long as relative tilt also can be that the rotating shaft φ 0 of holding unit 6 is tilted.But, freely set under the situation of inclination at the rotating shaft φ 0 with holding unit 6, the situation that exists supporting force to weaken is so preferably the rotating shaft φ 0 with holding unit 6 is fixing under the state perpendicular to maintenance face 6s.
In addition, in corase grind was cut, the direction of rotation of the holding unit 6 and the first grinding grinding tool 3b was counterclockwise, but also can rotate to clockwise direction.Similarly, in fine finishining, the direction of rotation of the holding unit 6 and the second grinding grinding tool 4b is a clockwise direction, but also can be to rotation counterclockwise.
Claims (2)
1. Work piece processing method, the Work piece processing method that this Work piece processing method is to use processing unit (plant) that plate workpiece is processed, above-mentioned plate workpiece has device area that is formed with device and the remaining area that surrounds this device area in face side, and above-mentioned processing unit (plant) comprises:
Holding unit, it has maintenance face, and this maintenance face keeps above-mentioned plate workpiece and is that the center is driven in rotation with the rotating shaft;
First machining cell, it has the first grinding grinding tool and first main shaft part, the above-mentioned first grinding grinding tool has and opposed first grinding face of above-mentioned maintenance face, and it can be the rotation of first rotating shaft with the vertical axis perpendicular to above-mentioned first grinding face that above-mentioned first main shaft part is supported to the above-mentioned first grinding grinding tool; And
Second machining cell, it has the second grinding grinding tool and second main shaft part, the above-mentioned second grinding grinding tool has and opposed second grinding face of above-mentioned maintenance face, it can be the rotation of second rotating shaft with the vertical axis perpendicular to above-mentioned second grinding face that above-mentioned second main shaft part is supported to the above-mentioned second grinding grinding tool
Above-mentioned Work piece processing method is characterised in that this Work piece processing method comprises following operation:
Keep operation, keep in operation, the above-mentioned face side of above-mentioned plate workpiece is remained in above-mentioned maintenance face at this;
First manufacturing procedure, in this first manufacturing procedure, with respect to the rear side that remains on the above-mentioned plate workpiece on the above-mentioned maintenance face, above-mentioned first grinding face is positioned to make the center of the outer peripheral edges of the above-mentioned first grinding grinding tool by the inboard and above-mentioned plate workpiece in the zone corresponding with above-mentioned remaining area, and implement grinding, thereby make the above-mentioned back side corresponding of above-mentioned plate workpiece form concavity portion with above-mentioned device area in the mode that forms the first circular-arc polishing scratch; And
Second manufacturing procedure, in this second manufacturing procedure, with respect to remaining on the above-mentioned maintenance face and implementing the above-mentioned rear side of the above-mentioned plate workpiece of above-mentioned first manufacturing procedure, the outer peripheral edges that above-mentioned second grinding face are positioned to make the above-mentioned second grinding grinding tool are by the inboard of above-mentioned concavity portion and the center of above-mentioned plate workpiece, and to form and the mode of the second circular-arc polishing scratch that above-mentioned first polishing scratch intersects is implemented grinding.
2. a Work treatment installation is characterized in that,
Above-mentioned Work treatment installation comprises:
Holding unit, it has maintenance face, and this maintenance face keeps plate workpiece and is that the center is driven in rotation with the rotating shaft;
First machining cell, it has the first grinding grinding tool and first main shaft part, the above-mentioned first grinding grinding tool has and opposed first grinding face of above-mentioned maintenance face, it can be the rotation of first rotating shaft with the vertical axis perpendicular to above-mentioned first grinding face that above-mentioned first main shaft part is supported to the above-mentioned first grinding grinding tool, and above-mentioned first rotating shaft tilts a little with respect to above-mentioned rotating shaft;
Second machining cell, it has the second grinding grinding tool and second main shaft part, the above-mentioned second grinding grinding tool has and opposed second grinding face of above-mentioned maintenance face, it can be the rotation of second rotating shaft with the vertical axis perpendicular to above-mentioned second grinding face that above-mentioned second main shaft part is supported to the above-mentioned second grinding grinding tool, and the direction that above-mentioned second rotating shaft is opposite with above-mentioned first rotating shaft with respect to above-mentioned axial rotary tilts a little; And
Control module, it is controlled as described below: with respect to having device area and remaining area in face side and remaining on the rear side of the above-mentioned plate workpiece on the above-mentioned maintenance face, above-mentioned first grinding face is positioned to make the center of the outer peripheral edges of the above-mentioned first grinding grinding tool by the inboard and above-mentioned plate workpiece in the zone corresponding with above-mentioned remaining area, and enforcement grinding, and, with respect to remaining on the above-mentioned maintenance face and implementing the rear side of the above-mentioned plate workpiece of above-mentioned grinding, second grinding face is positioned to make the center of the outer peripheral edges of the above-mentioned second grinding grinding tool by the inboard and above-mentioned plate workpiece in the zone corresponding with above-mentioned remaining area, and enforcement grinding, form the rib of ring-type thus in the rear side corresponding with above-mentioned remaining area, wherein, above-mentioned device area is the zone that is formed with device, and above-mentioned remaining area is the zone that surrounds above-mentioned device area.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2009-043185 | 2009-02-25 | ||
| JP2009043185A JP2010194680A (en) | 2009-02-25 | 2009-02-25 | Method and apparatus for machining workpiece |
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| CN101811273A true CN101811273A (en) | 2010-08-25 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111283548A (en) * | 2018-12-07 | 2020-06-16 | 株式会社迪思科 | Method for machining disc-shaped workpiece |
| CN112008595A (en) * | 2020-09-02 | 2020-12-01 | 珠海市中芯集成电路有限公司 | Wafer grinding device and grinding method |
| CN115066314A (en) * | 2020-02-17 | 2022-09-16 | 东京毅力科创株式会社 | Machining method and machining device |
| CN115816218A (en) * | 2022-12-14 | 2023-03-21 | 西安奕斯伟材料科技有限公司 | Apparatus and method for silicon wafer edge polishing |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6166122B2 (en) * | 2013-08-14 | 2017-07-19 | 株式会社ディスコ | Chuck table |
| CN113211250A (en) * | 2020-02-06 | 2021-08-06 | 皇家大师研磨机公司 | Trocar grinding machine |
| JP7391476B2 (en) | 2020-03-17 | 2023-12-05 | 株式会社ディスコ | Grinding method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070020887A1 (en) * | 2005-07-25 | 2007-01-25 | Kazuma Sekiya | Processing method and grinding apparatus of wafer |
| US20070264912A1 (en) * | 2006-05-12 | 2007-11-15 | Disco Corporation | Wafer processing method |
| JP2008060470A (en) * | 2006-09-01 | 2008-03-13 | Disco Abrasive Syst Ltd | Working method for wafer |
| CN101161411A (en) * | 2006-10-11 | 2008-04-16 | 株式会社迪思科 | Wafer grinding method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4154067B2 (en) * | 1999-04-06 | 2008-09-24 | 株式会社ディスコ | Grinding equipment |
| JP2006294855A (en) * | 2005-04-11 | 2006-10-26 | Matsushita Electric Ind Co Ltd | Method and device for back grinding semiconductor wafer |
| JP5390740B2 (en) | 2005-04-27 | 2014-01-15 | 株式会社ディスコ | Wafer processing method |
| JP5254539B2 (en) * | 2006-08-09 | 2013-08-07 | 株式会社ディスコ | Wafer grinding equipment |
-
2009
- 2009-02-25 JP JP2009043185A patent/JP2010194680A/en active Pending
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2010
- 2010-02-05 CN CN201010113661A patent/CN101811273A/en active Pending
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070020887A1 (en) * | 2005-07-25 | 2007-01-25 | Kazuma Sekiya | Processing method and grinding apparatus of wafer |
| US20070264912A1 (en) * | 2006-05-12 | 2007-11-15 | Disco Corporation | Wafer processing method |
| JP2008060470A (en) * | 2006-09-01 | 2008-03-13 | Disco Abrasive Syst Ltd | Working method for wafer |
| CN101161411A (en) * | 2006-10-11 | 2008-04-16 | 株式会社迪思科 | Wafer grinding method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111283548A (en) * | 2018-12-07 | 2020-06-16 | 株式会社迪思科 | Method for machining disc-shaped workpiece |
| CN115066314A (en) * | 2020-02-17 | 2022-09-16 | 东京毅力科创株式会社 | Machining method and machining device |
| CN112008595A (en) * | 2020-09-02 | 2020-12-01 | 珠海市中芯集成电路有限公司 | Wafer grinding device and grinding method |
| CN115816218A (en) * | 2022-12-14 | 2023-03-21 | 西安奕斯伟材料科技有限公司 | Apparatus and method for silicon wafer edge polishing |
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| DE102010008975A1 (en) | 2010-08-26 |
| JP2010194680A (en) | 2010-09-09 |
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