JP2004243422A - Circumference grinding united wheel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To dispense with replacement work for wheels even in the case of manufacturing wafers different in chamfering shapes to eliminate replacement loss, and to improve chamfering accuracy by preventing sludge from entering a metal bonded grinding wheel and a resin bonded grinding wheel. <P>SOLUTION: This circumference grinding united wheel 118 is used in a wafer chamfering device, and two truing grooves 152a, 152b are different in shapes. In the circumference grinding wheel 118, a metal bonded grinding wheel 36 and a resin bonded grinding wheel 38 are united in one body. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wafer chamfering apparatus and an outer peripheral grinding wheel for grinding an outer periphery of a thin plate member such as a semiconductor wafer, and more particularly to a shape of a truing groove for shaping a dresser plate.
[0002]
[Prior art]
A general method of manufacturing a mirror wafer used as a raw material wafer for manufacturing a semiconductor device will be described. First, a semiconductor ingot is grown by a Czochralski method (CZ method), a floating zone melting method (FZ method), or the like. Since the grown single crystal ingot has a distorted outer shape (warp), the outer periphery of the semiconductor ingot is then ground by a cylindrical grinder or the like in an outer shape grinding step to adjust the outer shape of the semiconductor ingot. This is sliced by a wire saw or the like in a slicing step and processed into a disk-shaped wafer having a thickness of about 500 to 1000 μm.
[0003]
The wafer sliced by the wire saw or the like has a sharp edge at a right angle and a sharp edge. If the peripheral edge of the wafer is sharp as described above, the peripheral edge of the wafer may be chipped due to chipping or the like during the transfer of the wafer or during the grinding / polishing process. Therefore, chamfering is performed on the peripheral portion of the wafer in the chamfering step.
[0004]
After that, flattening is performed by surface grinding, and after primary and secondary polishing through an etching process, the wafer surface is subjected to epitaxial growth processing to obtain a mirror-finished wafer.
[0005]
In the above-described chamfering step, a wafer chamfering device for grinding the outer periphery of the wafer is used. A conventionally used wafer chamfering apparatus will be described below with reference to FIGS. 16 is a plan view showing a part of the wafer chamfering apparatus 210, FIG. 17 is a front view of the wafer chamfering apparatus 210, FIG. 18A is a longitudinal sectional view of the outer peripheral grinding wheel 218, and FIG. 19 is a longitudinal sectional view of an outer peripheral grinding wheel in which separately formed metal bond grindstones 236 and resin bond grindstones 238 are coaxially stacked and arranged.
[0006]
The wafer chamfering device 210 performs rough grinding and fine grinding of chamfering on the outer periphery of the wafer. In the wafer chamfering device 210, as shown in FIG. 18A, a metal bond grindstone 236 in which diamond abrasive grains are bonded to a metal is provided on the outer periphery of a substantially cylindrical outer peripheral grinding wheel 218. A plurality of rough grinding grooves 254 for chamfering are provided in an annular shape on the outer peripheral surface of the metal bond grindstone 236. The outer periphery of the wafer is rough-chamfered by rotating the outer periphery grinding wheel 218 and pressing the outer periphery of the wafer against the rough grinding groove 254.
[0007]
On the other hand, as shown in FIG. 18B, a resin bond grindstone 238 in which diamond abrasive grains are bonded by a synthetic resin is provided on the outer periphery of the substantially cylindrical precision grinding wheel 266. A plurality of fine grinding grooves 256 for chamfering are provided in an annular shape on the outer peripheral surface of the resin bond grindstone 238. The fine grinding of the chamfer on the outer periphery of the wafer is performed by rotating the fine grinding wheel 266 and pressing the outer periphery of the wafer into the fine grinding groove 256. The width of the opening of the rough grinding groove 254 and the fine grinding groove 256 is wider than the thickness of the wafer, and becomes narrower toward the axis, and the width of the innermost part is narrower than the thickness of the wafer.
[0008]
Since the resin bond grindstone 238 uses a synthetic resin as a binder, the abrasive grain holding force is weak and the groove shape of the fine grinding groove 256 is easily broken, so it is necessary to appropriately modify the shape. Therefore, the shape of the fine grinding groove 256 is shaped and sharpened by truing the fine grinding groove 256 using the dresser plate 250 (truer) having a shape complementary to the shape required for the fine grinding groove 256. . More specifically, the outer periphery of the dresser plate 250 is finely ground as shown in FIG. 18B while the dresser plate 250 is held by suction on the wafer chuck 224 and the fine grinding wheel 266 and the dresser plate 250 are rotated. Truing is performed by pressing the fine grinding groove 256 of the polishing wheel 266.
[0009]
On the other hand, the dresser plate 250 also needs to be regularly shaped. Therefore, as shown in FIG. 18A, the truing groove 252 having a shape complementary to the shape required for the dresser plate 250 and the outer periphery of the dresser plate 250 are rotated in a state where the dresser plate 250 is rotated. , The outer periphery of the dresser plate 250 is shaped.
[0010]
That is, as shown in FIG. 18A, the shape of the truing groove 252 is transferred to the dresser plate 250, and subsequently, as shown in FIG. 18B, the shape of the dresser plate 250 is transferred to the fine grinding groove 256. I do. Thus, the shape of the truing groove 252 is transferred to the fine grinding groove 256 via the dresser plate 250.
[0011]
The truing groove 252 and the coarse grinding groove 254 are formed on the same metal bond grindstone 236. For example, as shown in FIG. 18A, the first groove 252a and the second groove 252b of the outer peripheral grinding wheel 218 are formed. The truing groove 252 is used, and the third to ninth grooves 254a to 254g are used as coarse grinding grooves 254. Here, the first groove, the second groove,... Mean that the order of the grooves counted from the lower side of the outer periphery of the metal bond grindstone 236 is the first, second,.
[0012]
If the metal bond grindstone 236 and the resin bond grindstone 238 are configured as separate devices, the size of the device is increased. A wafer chamfering device has been proposed.
[0013]
[Problems to be solved by the invention]
However, for example, as shown in FIG. 5, the angle of the chamfer is 22 °, the radius of curvature of the chamfered surface is 260 μm, a case of manufacturing a 22 × 260R wafer, and the case of manufacturing a chamfered shape of a 22 × 300R wafer. In this case, the shape of the rough grinding groove 254 is common, but the shape of the fine grinding groove 256 for performing finish grinding must be different.
[0014]
That is, in the rough grinding, only the 22 ° portion of the wafer 1 shown in FIG. 5 is chamfered, so that a case of manufacturing a 22 × 260R wafer and a case of manufacturing a 22 × 300R chamfered wafer are required. The shape of the rough grinding groove 254 is common. However, since the precision grinding is to shape the portions 260R and 300R shown in FIG. 5, when manufacturing a wafer having a chamfered shape of 22 × 260R, the shape of the fine grinding groove 256 needs to be 22 × 260R. Therefore, when manufacturing a wafer having a chamfered shape of 22 × 300R, the shape of the fine grinding groove 256 needs to be 22 × 300R. Therefore, the shape of the dresser plate 250 for shaping the fine grinding groove 256 and the shape of the truing groove 252 for shaping the dresser plate 250 must be changed according to the chamfered shape of the wafer to be manufactured.
[0015]
Therefore, an outer peripheral grinding wheel 218 having a truing groove for manufacturing a wafer of 22 × 260R and an outer peripheral grinding wheel 218 having a truing groove for producing a wafer of 22 × 300R are separately prepared, and the outer peripheral grinding wheel 218 is formed according to the chamfered shape of the wafer to be manufactured. The grinding wheel 218 had been replaced.
[0016]
However, the apparatus stops during the replacement of the outer peripheral grinding wheel 218, and a replacement loss occurs. As shown in FIG. 17, when exchanging the outer peripheral grinding wheel 218, the wafer chamfering device 210 must lift the arm 228 and exchange the outer peripheral grinding wheel 218 located thereunder. When the arm 228 is fixed again, the position of the arm 228 is slightly shifted, so that the position of the fine grinding wheel 266 supported by the arm 228 is also slightly shifted. For this reason, the precision of wafer grinding by the fine grinding wheel 266 supported by the arm 228 is deteriorated, and it is necessary to adjust the position again.
[0017]
When the separately formed metal bond grindstone 236 and the resin bond grindstone 238 are coaxially stacked and arranged, as shown in FIG. (Machining debris) enters and the chamfering accuracy deteriorates. In addition, the use of two foils causes variations in surface width due to attachment. Further, since two foils are stored separately, two storage locations are required.
[0018]
The invention according to the present application has been made in order to solve the above problems, and the purpose thereof is to eliminate the need for foil replacement work even when manufacturing wafers having different chamfered shapes. An object of the present invention is to provide an outer peripheral grinding wheel capable of stabilizing the quality of a chamfered wafer without an exchange loss.
Another object of the present invention is to provide an outer peripheral grinding wheel having good chamfering accuracy without sludge between a metal bond grindstone and a resin bond grindstone.
[0019]
[Means for Solving the Problems]
In order to achieve the above object, a first invention according to the present application is directed to a wafer chuck for holding a wafer, a first wheel-type grindstone, and a method in which the wafer chuck is moved relative to the first wheel-type grindstone. Moving means for moving the first wheel-type grindstone, an annular grinding groove provided on the outer circumference of the first wheel-type grindstone, and an outer circumference of a second wheel-type grindstone for shaping a dresser plate for shaping the grinding groove. A plurality of truing grooves, the peripheral edge portion of the wafer detachably held by the rotating wafer chuck, relatively approaching the rotating first wheel-type grindstone, the grinding groove In a wafer chamfering machine that chamfers to a predetermined shape by pressing
A wafer chamfering apparatus, wherein one of the plurality of truing grooves has a different shape from the other one.
[0020]
Further, the second invention according to the present application is characterized in that the annular grinding groove provided on the outer periphery of the first wheel-type grindstone is a grinding groove for precision grinding. It is a wafer chamfering apparatus of description.
[0021]
Further, the third invention according to the present application is characterized in that the first wheel-type grindstone is a resin-bonded grindstone and the second wheel-type grindstone is a metal-bonded grindstone. It is a wafer chamfering apparatus according to the invention.
[0022]
Further, a fourth invention according to the present application is any one of the first to third inventions, wherein the first wheel-type grindstone and the second wheel-type grindstone are combined. 2. The wafer chamfering apparatus according to item 1.
[0023]
Further, the fifth invention according to the present application is directed to any one of the first to fourth inventions, wherein a grinding groove for rough grinding is provided on an outer periphery of the second wheel-type grindstone. It is a wafer chamfering apparatus of description.
[0024]
A sixth invention according to the present application is the first to fifth inventions, wherein the shape of the truing groove is substantially complementary to a chamfered shape required for a wafer to be manufactured. The wafer chamfering apparatus according to any one of the above.
[0025]
Further, a seventh invention according to the present application is a step of pressing the outer periphery of the rotating dresser plate against any one of a plurality of truing grooves provided in the rotating wheel-type grindstone to shape the dresser plate, Pressing the outer periphery of the rotating shaped dresser plate against a grinding groove for chamfering a wafer provided on the outer periphery of the same or another foil type grinding wheel as the rotating wheel type grinding wheel, and shaping the grinding groove; , Including a grinding groove shaping method,
The plurality of truing grooves do not have the same shape, and the step of shaping the dresser plate is performed by one truing groove selected according to the chamfered shape of a wafer to be manufactured. .
[0026]
An eighth invention according to the present application is the grinding method according to the seventh invention, wherein the selected one truing groove has a shape substantially complementary to a chamfered shape of the wafer to be manufactured. This is a groove shaping method.
[0027]
In a ninth aspect of the present invention, a peripheral portion of a wafer detachably held by a rotating wafer chuck is pressed against a grinding groove by relatively approaching the rotating first wheel-type grindstone. A method of chamfering a wafer into a predetermined shape by pressing the outer periphery of a rotating dresser plate relatively close to any one of a plurality of truing grooves provided on a rotating second wheel-type grindstone. A step of shaping the dresser plate; and pressing the outer periphery of the rotating dresser plate relatively close to the grinding groove provided on the outer periphery of the rotating first wheel-type grindstone by pressing the predetermined. Shaping the grinding groove into a shape.
One of the plurality of truing grooves has a groove shape different from the other one, and the step of shaping the dresser plate is performed by one truing groove selected according to a chamfered shape of a wafer to be manufactured. Wafer chamfering method.
[0028]
Further, a tenth invention according to the present application is the ninth invention according to the ninth invention, wherein the grinding groove provided on the outer periphery of the first wheel-type grindstone is a grinding groove for fine grinding. This is a wafer chamfering method.
[0029]
An eleventh invention according to the present application is the ninth or tenth aspect, wherein the first wheel-type grindstone is a resin-bonded grindstone, and the second wheel-type grindstone is a metal-bonded grindstone. It is a wafer chamfering method according to the invention of the first aspect.
[0030]
Further, a twelfth invention according to the present application is any one of the ninth to eleventh inventions, wherein the first wheel-type grindstone and the second wheel-type grindstone are combined. 2. The wafer chamfering method according to 1.
[0031]
Further, a thirteenth invention according to the present application is any one of the ninth to twelfth inventions, wherein a grinding groove for rough grinding is provided on an outer periphery of the second wheel-type grindstone. 2. The wafer chamfering method according to 1.
[0032]
Further, a fourteenth invention according to the present application is the method according to any of the ninth to thirteenth inventions, wherein the selected one truing groove has a shape substantially complementary to a chamfered shape of the wafer to be manufactured. The wafer chamfering method according to any one of the first to third aspects.
[0033]
A fifteenth invention according to the present application relates to a wafer chuck for holding a wafer, a foil-type metal bond grindstone provided with a rough grinding groove on the outer circumference, and a foil type metal wafer provided with a fine grinding groove on the outer circumference. And a moving means for moving the wafer chuck relatively to the metal bond grindstone or the resin bond grindstone, and a peripheral edge of a wafer detachably held by the rotating wafer chuck. In a wafer chamfering device that presses and chamfers a predetermined shape by relatively approaching the rough grinding groove or the fine grinding groove provided on the rotating metal bond grindstone or the resin bond grindstone,
A wafer chamfering apparatus, wherein the metal bond grindstone and the resin bond grindstone are integrally formed.
[0034]
BEST MODE FOR CARRYING OUT THE INVENTION
[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
1 is a partial plan view of a wafer chamfering apparatus 10 according to a first embodiment of the present invention as viewed from above, FIG. 2 is a front view of the wafer chamfering apparatus 10, FIG. 3 is a right side view of the wafer chamfering apparatus 10, 4A is a longitudinal sectional view of the outer peripheral grinding wheel 18, FIG. 4B is a bottom view of the outer peripheral grinding wheel 18, FIG. 4C is a longitudinal sectional view of the fine grinding wheel 66, and FIG. 6 (a) and 6 (b) are longitudinal sectional views of modified examples 18a and 18b of the outer peripheral grinding wheel, and FIG. 7 (a) is a plan view of an X-axis moving mechanism 70 of the wafer holding device 22. 7 (b) is a plan view of the Y-axis moving mechanism 80, FIG. 7 (c) is a front view of the Z-axis moving mechanism 90, FIG. 8 is a longitudinal sectional view of the wafer chuck 24, and FIGS. Right side of wafer chamfering apparatus 10 for explaining the shaping process of plate 50 FIG, 11 is a right side view of the precise grinding apparatus 30 for describing a shaping process of fine grinding groove 56.
[0035]
First, the overall configuration of the wafer chamfering device 10 will be briefly described, and then each device will be described in detail. As shown in FIG. 2, a bracket 14 is erected on a horizontally installed base 12, and a wheel rotation drive motor 16 is fixed to the bracket 14 with the rotation axis directed vertically upward. An outer peripheral grinding wheel 18 is mounted on an output shaft of the wheel rotation driving motor 16. At a position facing the grinding device 20 configured as described above, a wafer holding device 22 is erected on the base 12 as shown in FIG. A wafer chuck 24 is provided above the wafer holding device 22.
[0036]
As shown in FIG. 2, a frame 26 that covers the grinding device 20, the wafer holding device 22, and the like is fixed to the base 12, and an arm 28 is rotatably supported on an upper portion thereof. The fine grinding device 30 is fixed to the arm 28. As described above, the wafer chamfering device 10 in the present embodiment mainly includes the grinding device 20, the wafer holding device 22, and the fine grinding device 30.
[0037]
Next, the configuration of the grinding device 20 will be described in more detail. The grinding device 20 of the present embodiment mainly includes a bracket 14, a wheel rotation driving motor 16, an outer peripheral grinding wheel 18 provided on an upper portion of an output shaft of the wheel rotation driving motor 16, and a wheel rotation driving motor 16 A stopper 34 is provided at the uppermost portion of the output shaft for connecting the output shaft to the outer peripheral grinding wheel 18, and a stopper 32 provided on the lower surface of the outer peripheral grinding wheel 18 and fitted to the stopper 34.
[0038]
As shown in FIG. 2, the bracket 14 is vertically erected on the base 12 installed horizontally. The wheel rotation drive motor 16 is fixed to the bracket 14 with the output shaft directed vertically upward. As shown in FIG. 4B, a stopper 32 is provided at the center of the lower surface of the outer peripheral grinding wheel 18 having a substantially cylindrical shape. By fitting the stopper 32 with a stopper 34 fixed to the output shaft of the wheel rotation driving motor 16, the outer peripheral grinding wheel 18 is mounted on the wheel rotation driving motor 16 and is rotatable.
[0039]
As shown in FIG. 4A, a metal bond grindstone 36 is provided on the outer periphery of the outer peripheral grinding wheel 18. On the outer periphery of the metal bond grindstone 36, two truing grooves 52 for grinding the dresser plate 50 and seven coarse grinding grooves 54 for coarsely grinding the wafer are formed horizontally and annularly. The truing groove 52 and the rough grinding groove 54 are formed in parallel, and the truing groove 52 is provided in the first groove 52a and the second groove 52b counted from the lower side of the outer periphery of the outer peripheral grinding wheel 18.
[0040]
The shape of the first groove 52a is 22 × 260R, and the shape of the second groove 52b is 22 × 300R. Here, 22 × 260R indicates a chamfered shape or a shape of a grinding groove required for a wafer. As shown in FIG. 5, the angle of the chamfer (groove) is 22 °, and the radius of curvature of the chamfered surface (groove) is shown. Is 260 μm. As shown in FIG. 4A, the rough grinding grooves 54 are provided in the third to ninth grooves 54a to 54g counted from the lower side of the outer periphery of the outer peripheral grinding wheel 18. The rough grinding groove 54 has a groove shape for chamfering the outer peripheral portion of the wafer at 22 °.
[0041]
In the present embodiment, the rough grinding grooves 54 are provided with seven grooves in consideration of the life of the rough grinding grooves 54, but any number of rough grinding grooves 54 may be provided. Also, not all of the rough grinding grooves 54 need to have the same shape, but may have different shapes. The truing grooves 52 are formed by a 600th grindstone, and the rough grinding grooves 54 are formed by an 800th grindstone. Here, the count represents the size of the diamond abrasive grains, and the larger the count, the finer the grains.
[0042]
Further, in the present embodiment, the outer peripheral grinding wheel 18 has a cylindrical shape, but is not limited thereto and may have another shape. For example, a substantially cylindrical outer peripheral grinding wheel 18a having a trapezoidal cross section shown in FIG. 6A or a drum-shaped outer peripheral grinding wheel 18b shown in FIG. 6B may be used.
[0043]
Next, the configuration of the fine grinding device 30 will be described. As shown in FIG. 1, a bearing portion 58 is provided at an upper end portion of the frame 26. The arm 28 has a substantially T-shaped shaft portion 60 at the rear end 28a, and the shaft portion 60 and the bearing portion 58 are fitted. With this configuration, the arm 28 is rotatably supported by the frame 26. As shown in FIGS. 1 and 2, an arm support 62 is erected on the base 12, and an arm support for mounting the tip 28 b of the arm 28 on the top of the arm support 62. 64 are provided.
[0044]
A screw hole is provided on the upper surface of the arm support 64. A through-hole penetrating from the upper surface to the lower surface is provided in the distal end portion 28 b of the arm 28. The through hole is arranged so as to be straight with the screw hole when the tip end portion 28b of the arm 28 is placed on the arm support portion 64. With this configuration, as shown in FIG. 1, the distal end portion 28b of the arm 28 is placed on the arm support portion 64, and the thumb screw is screwed into the screw hole through the through hole, so that the arm 28 is horizontally moved. Can be fixed to
[0045]
As shown in FIG. 2, a wheel rotation driving motor 44 is supported on the arm 28 with its output shaft inclined at 5 ° to 10 ° with respect to the arm 28. However, the output shaft of the wheel rotation drive motor 44 does not necessarily need to be inclined, and may be supported at right angles to the arm 28. A fine grinding wheel 66 is mounted on the output shaft, and is rotated by driving a wheel rotation driving motor 44.
[0046]
As shown in FIG. 4 (c), the fine grinding wheel 66 has a resin bond grindstone 38 provided on the outer periphery thereof. The resin bond grindstone 38 has two fine grinding grooves for fine grinding the wafer. 56 is formed perpendicularly to the rotation axis and in an annular shape. The shapes of the fine grinding grooves 56 are both 22 × 260R. However, when manufacturing a wafer having a 22 × 300R chamfered shape, the fine grinding groove 56 is shaped into a 22 × 300R groove shape by a dresser plate 50 described later.
[0047]
Thus, the fine grinding groove 56 is shaped into a shape complementary to the finished chamfer dimension required for the wafer. The precision grinding wheel 66 thus configured is capable of chamfering the outer peripheral portion of the wafer 1 by pressing the fine grinding groove 56 against the outer peripheral portion of the wafer while rotating at a high speed. Note that the fine grinding groove 56 is formed by a grinding stone of 3000th.
[0048]
Next, the wafer holding device 22 will be described. As shown in FIG. 3, the wafer holding device 22 mainly includes a wafer moving mechanism and a wafer chuck 24.
[0049]
First, the wafer moving mechanism will be described with reference to FIGS. 3 and 7A. As shown in FIG. 3, the wafer holding device 22 is erected on a base 12 installed horizontally. An X-axis moving mechanism 70 (horizontal direction) shown in FIG. 7A is provided above the base 12. An X-axis movement motor 71 is fixed to the base 12 with its rotation axis arranged in the horizontal direction. The X-axis moving motor 71 is coupled to a male screw 73 for a screw feed mechanism by a coupling 72 on the extension of the rotation axis. The distal end of the male screw 73 is fitted on the inner peripheral wall of a ball bearing 78 fixed to the base 12 and is supported so as to be able to rotate smoothly with respect to the base 12. Then, the male screw 73 is rotated on the spot by the rotation of the X-axis moving motor 71.
[0050]
A female screw 74 is fitted into the male screw 73. An X-axis plate 75 is fixed to the upper surface of the female screw 74. Since the female screw 74 is fixed to the X-axis plate 75 so as not to rotate, the X-axis plate 75 moves horizontally together with the female screw 74 by the rotation of the male screw 73. Further, on the lower surface of the X-axis plate 75, two concave dovetail grooves 76 serving as guides for the horizontal movement operation are provided in parallel with the male screw 73, and two bases provided in the base 12 in parallel with the male screw 73 are provided. It is fitted on the convex guide rail 77. Then, the X-axis plate 75 is guided by the guide rail 77, and is screwed in a horizontal direction by this screw feed mechanism in a stable state. Hereinafter, the direction in which the X-axis plate 75 moves is referred to as the X-axis.
[0051]
A Y-axis moving mechanism 80 (horizontal direction) shown in FIG. 7B is provided above the X-axis plate 75. The Y-axis moving motor 81 is fixed to the X-axis plate 75 in a state where its rotation axis is arranged in the horizontal direction and at right angles to the X-axis direction. The Y-axis moving motor 81 is coupled with a male screw 83 for a screw feed mechanism by a coupling 82 on the extension of the rotation axis. The distal end of the male screw 83 is fitted on the inner peripheral wall of a ball bearing 88 fixed to the X-axis plate 75, and is supported so as to be able to rotate smoothly with respect to the X-axis plate 75. Then, the male screw 73 is rotated on the spot by the rotation of the Y-axis moving motor 81.
[0052]
A female screw 84 is fitted to the male screw 83. A Y-axis plate 85 is fixed to the upper surface of the female screw 84. Since the female screw 84 is non-rotatably fixed to the Y-axis plate 85, the Y-axis plate 85 moves horizontally together with the female screw 84 by the rotation of the male screw 83. On the lower surface of the Y-axis plate 85, two concave dovetails 86 are provided in parallel with the male screw 83 to serve as guides for the horizontal movement operation. Two X-axis plates 75 are provided in parallel with the male screw 83. Is fitted to the convex guide rail 87. Then, the Y-axis plate 85 is guided by the guide rail 87 and is screwed in a horizontal direction by this screw feed mechanism in a stable state. Hereinafter, the direction in which the Y-axis plate 85 moves is referred to as the Y-axis.
In the present embodiment, the X-axis guide rail 77 and the Y-axis guide rail 87 are arranged so as to be orthogonal to each other.
[0053]
As shown in FIG. 3, a frame 99 is erected vertically above the Y-axis plate 85 installed horizontally. The frame 99 is provided with a Z-axis moving mechanism 90 (vertical direction) shown in FIGS. 3 and 7C. The Z-axis movement motor 91 is fixed to the frame 99 with its rotation axis arranged vertically upward. As shown in FIG. 7C, the Z-axis moving motor 91 is coupled to a male screw 93 for a screw feed mechanism by a coupling 92 on the extension of the rotation axis. The upper end of the male screw 93 is fitted on the inner peripheral wall of a ball bearing 98 fixed to the frame 99, and is supported so as to be able to rotate smoothly with respect to the frame 99. The male screw 93 is rotated on the spot by the rotation of the Z-axis moving motor 91.
[0054]
A female screw 94 that is non-rotatably fixed to the Z-axis plate 95 is fitted into the male screw 93, and the female screw 94 moves vertically by the rotation of the male screw 93. Since the female screw 94 is fixed to the Z-axis plate 95, the Z-axis plate 95 moves in the vertical direction together with the female screw 94 by the rotation of the male screw 93.
[0055]
The Z-axis plate 95 is provided with two concave dovetails 96 serving as guides at the time of the vertical movement operation, in parallel with the male screw 93, and two convex-shaped grooves provided in the frame 99 in parallel with the male screw 93. It is fitted on the guide rail 97. Then, the Z-axis plate 95 is guided by the guide rail 97, and is screwed in the vertical direction by this screw feed mechanism in a stable state. Hereinafter, the direction in which the Z-axis plate 95 moves is referred to as the Z-axis.
[0056]
Further, as shown in FIG. 3, a bracket 100 is fixed to the Z-axis plate 95, and the bracket 100 is provided with a rotation drive motor 102 (θ axis) for driving the wafer chuck 24 to rotate. The rotation axis of the rotation drive motor 102 (θ axis) is disposed vertically upward, and its upper end is connected to a shaft 104 provided below the center axis of the wafer chuck 24. The wafer chuck 24 vacuum-adsorbs the wafer 1 or the dresser plate 50 on its upper surface, and horizontally rotates together with the shaft 104 by the rotation of the rotation drive motor 102 (θ axis). Note that the rotation axis (θ axis) is provided in parallel with the Z axis.
[0057]
The wheel rotation drive motor 16, the X-axis movement motor 71, the Y-axis movement motor 81, the Z-axis movement motor 91, and the rotation drive motor 102 (θ axis) are provided in a control unit provided in the apparatus or separately from the apparatus. It is connected to the. The control unit controls the rotation of the wheel rotation driving motor 16 to control the rotation speed of the outer peripheral grinding wheel 18. Further, the position of the wafer chuck 24 is arbitrarily controlled by controlling the rotation of the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91. Furthermore, the rotation speed of the wafer chuck 24 is controlled by controlling the rotation of the rotation drive motor 102 (θ axis).
[0058]
The control unit may be provided in the apparatus, or may be a control apparatus such as a personal computer provided separately from the apparatus. In addition, by connecting the control unit to the display, the vertical state of the wafer chuck 24 and the like and horizontal movement / rotational movement information are graphically or numerically displayed on the display, and the operator can work while checking the display. May be performed, or may be automatically controlled by a program or the like.
[0059]
With this configuration, the wafer chuck 24 can advance and retreat in the direction of the grinding device 20. In addition, the position can be moved in the vertical direction. As a result, the wafer 1 and the like can be pressed into the arbitrary grooves 54 for rough grinding and the grooves 56 for fine grinding. In the present embodiment, the moving mechanism is configured so that the position of the wafer chuck 24 can be arbitrarily controlled in the X-axis direction, the Y-axis direction, and the Z-axis direction. May be arbitrarily controlled. Further, the moving mechanism may be configured such that all positions of the wafer chuck 24, the outer peripheral grinding wheel 18, and the fine grinding wheel 66 can be arbitrarily controlled.
[0060]
Next, the wafer chuck 24 will be briefly described with reference to FIG. The wafer chuck 24 includes a disc-shaped porous ceramic plate 40 having air permeability, and a dense ceramic pedestal 41 surrounding the outer periphery and the bottom. An exhaust hole 42 penetrating the dense ceramic pedestal 41 from the upper surface to the lower surface is formed at the bottom of the dense ceramic pedestal 41, and the lower end opening of the exhaust hole 42 is connected to the vacuum pump 43. As a result, the wafer chuck 24 vacuum-adsorbs the wafer 1 to be chamfered and rotates on the spot by driving the rotation drive motor 102 (θ axis). Similarly, the dresser plate 50 is vacuum-adsorbed and rotated on the spot.
[0061]
Next, a case of manufacturing a wafer having a 22 × 260R chamfered shape using the wafer chamfering apparatus 10 configured as described above will be described with reference to FIGS. 3 and 8 to 11. The working process of the present embodiment mainly includes a rough grinding process for chamfering a wafer and a fine grinding process for chamfering a wafer. In addition, work steps for manufacturing wafers having chamfered shapes of 22 × 300R, which are different types, mainly include a rough grinding step for wafer chamfering and a fine grinding step for wafer chamfering. However, when changing the type of the wafer to be manufactured, the work process requires a process of shaping the dresser plate 50 and a process of shaping the fine grinding groove 56. The step of shaping the dresser plate 50 and the step of shaping the fine grinding groove 56 are appropriately performed even when the dresser plate 50 and the fine grinding groove 56 are out of shape.
[0062]
First, a rough grinding step for chamfering a wafer will be described. The control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91 to move the wafer chuck 24 to a predetermined wafer receiving position. Next, alignment is performed by a wafer transfer device (not shown) so that the plane center of the wafer 1 and the rotation center of the wafer chuck 24 coincide with each other, and the wafer 1 is mounted on the wafer chuck 24. 3 and 8 are views showing a state where the wafer 1 is mounted on the wafer chuck 24. FIG.
[0063]
Thereafter, when the vacuum pump 43 sucks air, the air in the porous ceramic plate 40 having air permeability is discharged to the outside through the exhaust holes 42, and the pressure in the porous ceramic plate 40 becomes negative. As a result, the wafer 1 is vacuum-sucked at the portion in contact with the porous ceramic plate 40, and the vacuum is sealed by the dense ceramic pedestal 41.
[0064]
After the wafer 1 is vacuum-sucked to the wafer chuck 24, the control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91, as shown in FIG. The sucked wafer 1 is moved and arranged at a position facing the same plane having the same height as the rough grinding groove 54. Thereafter, the rotation drive motor 102 (θ axis) and the wheel rotation drive motor 16 are driven to rotate the wafer 1 together with the wafer chuck 24 at a low speed at a predetermined rotation speed, and the outer peripheral grinding wheel 18 is rotated at a high speed at a predetermined rotation speed. In this embodiment, the rotation speed of the wafer 1 is set to 0.05 rpm to 2 rpm, and the rotation speed of the outer peripheral grinding wheel 18 is set to 1000 rpm to 5000 rpm.
[0065]
Next, as shown in FIG. 3, the X-axis movement motor 71 is driven by the control unit to feed and move the wafer chuck 24 toward the outer peripheral grinding wheel 18. The feed speed of the wafer chuck 24 is reduced immediately before the outer peripheral grinding wheel 18, and is sent at a slow speed immediately before the outer peripheral grinding wheel 18. As a result, the wafer chuck 24 moves a predetermined distance, and the peripheral portion of the wafer 1 rotating at a low speed contacts the rough grinding groove 54 rotating at a high speed.
[0066]
After a predetermined amount of cut feed, the movement of the wafer chuck 24 in the X-axis direction is stopped at that position. When the wafer 1 is rotated at a low speed on the spot, the peripheral edge of the wafer 1 is roughly ground by a predetermined processing amount by the rough grinding groove 54 that rotates at a high speed, and is processed into a predetermined chamfered shape. By rotating the wafer 1 at a low speed in this manner, the outer peripheral grinding wheel 18 can perform chamfering over the entire circumference of the wafer 1.
[0067]
After the peripheral portion of the wafer 1 is chamfered by a predetermined amount, the control unit drives the X-axis moving motor 71 to feed and move the wafer chuck 24 in a direction away from the outer peripheral grinding wheel 18. After the wafer chuck 24 is separated from the outer peripheral grinding wheel 18 by a predetermined amount, the rotation drive motor 102 (θ-axis) and the wheel rotational drive motor 16 are stopped, and the rotation of the wafer 1 and the outer peripheral grinding wheel 18 is stopped. During the operation of the wafer chamfering apparatus 10, the outer peripheral grinding wheel 18 may be continuously rotated without stopping the wheel rotation driving motor 16. Thus, the rough grinding step of wafer chamfering is completed.
[0068]
Next, the fine grinding step for wafer chamfering will be described. After the rough grinding step of wafer chamfering is completed, the control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91 to provide the wafer 1 and the fine grinding wheel 66 on the outer periphery. The wafer 1 is moved and arranged at a position where the fine grinding grooves 56 face each other on the same plane at the same height. The fine grinding groove 56 is formed in advance in a 22 × 260R groove shape.
[0069]
Thereafter, the rotation drive motor 102 (θ-axis) and the wheel rotation drive motor 44 are driven to rotate the wafer 1 at a low speed at a predetermined rotation speed, and to rotate the fine grinding wheel 66 at a high speed at a predetermined rotation speed. Next, the X-axis moving motor 71 is driven by the control unit to feed and move the wafer chuck 24 toward the fine grinding wheel 66. The feed speed of the wafer chuck 24 is reduced immediately before the fine grinding wheel 66, and is sent at a slow speed immediately before the fine grinding wheel 66. As a result, the wafer chuck 24 moves a predetermined distance, and the peripheral edge of the wafer 1 rotating at a low speed contacts the fine grinding groove 56 rotating at a high speed.
[0070]
After a predetermined amount of cut feed, the movement of the wafer chuck 24 in the X-axis direction is stopped at that position. By rotating the wafer 1 at a low speed in that case, the peripheral edge of the wafer 1 is precisely ground by a predetermined processing amount by the high-speed rotating fine grinding groove 56 and is processed into a predetermined chamfered shape. By rotating the wafer 1 at a low speed in this manner, the fine grinding wheel 66 can perform the fine grinding of the chamfering processing over the entire circumference of the wafer 1.
[0071]
After the peripheral portion of the wafer 1 is chamfered by a predetermined amount, the control unit drives the X-axis moving motor 71 to feed and move the wafer chuck 24 in a direction away from the fine grinding wheel 66. After the wafer chuck 24 is separated from the fine grinding wheel 66 by a predetermined amount, the rotation drive motor 102 (θ-axis) and the wheel rotation drive motor 44 are stopped, and the rotation of the wafer 1 and the fine grinding wheel 66 is stopped. During the operation of the wafer chamfering device 10, the fine grinding wheel 66 may be continuously rotated without stopping the wheel rotation driving motor 44. With the above, the fine grinding step of wafer chamfering is completed.
[0072]
The cross-sectional shape of the peripheral portion of the wafer processed by the above-described fine grinding step is substantially equal to the cross-sectional shape of the fine grinding groove 56, and is more rounded than in the rough grinding. After the fine grinding process, the control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91 to move the wafer chuck 24 to the wafer receiving position. Thereafter, the vacuum pump 43 is stopped and air is supplied to the porous ceramic plate 40. As a result, the suction of the wafer 1 is released, the wafer 1 is removed from the wafer chuck 24 by a transfer device (not shown), and transferred to the next step. Thus, the wafer manufacturing process of the 22 × 260R chamfered shape is completed.
[0073]
A case in which wafers having a chamfered shape of 22 × 300R are continuously manufactured by the wafer chamfering apparatus 10 will be described. As described above, since the groove shape of the fine grinding groove 56 is 22 × 260R, the wafer 1 cannot be precisely ground to a chamfered shape of 22 × 300R. Therefore, it is necessary to shape the fine grinding groove 56 into a 22 × 300R groove shape by the dresser plate 50. The fine grinding groove 56 is shaped by a dresser plate 50 having a chamfered shape of 22 × 300R.
[0074]
Although the dresser plate 50 may be prepared in advance with a chamfered shape of 22 × 300R, a case where the dresser plate 50 shaped into a 22 × 300R chamfered shape by the truing groove 52 will be described below. The working process of this embodiment mainly includes a shaping process of the dresser plate 50, a shaping process of the fine grinding groove 56, and a wafer chamfering process.
[0075]
First, the shaping process of the dresser plate 50 will be described with reference to FIGS. When the operator instructs the controller to shape the dresser plate 50 and the fine grinding groove 56, a transfer device (not shown) transfers the dresser plate 50 and places it on the wafer chuck 24. At this time, alignment is performed so that the center of the plane of the dresser plate 50 and the center of rotation of the output shaft of the rotary drive motor 102 (θ axis) coincide with each other.
[0076]
Thereafter, when the vacuum pump 43 sucks air, the air in the porous ceramic plate 40 having air permeability is discharged to the outside through the exhaust holes 42, and the pressure in the porous ceramic plate 40 becomes negative. As a result, the dresser plate 50 is vacuum-adsorbed at the portion in contact with the porous ceramic plate 40, and the dense ceramic pedestal 41 seals the vacuum.
[0077]
After vacuum-adsorbing the dresser plate 50 to the wafer chuck 24, the control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91, and as shown in FIG. The placed dresser plate 50 is moved and arranged at a position facing the same plane having the same height as the second groove 52b of the truing groove. As described above, the shape of the first groove 52a is 22 × 260R, and the shape of the second groove 52b is 22 × 300R. This position is defined as an initial position.
[0078]
Thereafter, the rotation drive motor 102 (θ axis) and the wheel rotation drive motor 16 are driven to rotate the dresser plate 50 at low speed and rotate the outer peripheral grinding wheel 18 at high speed. Next, the X-axis moving motor 71 is driven to feed and move the wafer chuck 24 in the direction of the arrow toward the outer peripheral grinding wheel 18 as shown in FIG. The feed speed of the wafer chuck 24 is reduced immediately before the outer peripheral grinding wheel 18, and is sent at a slow speed immediately before the outer peripheral grinding wheel 18. As a result, the wafer chuck 24 moves a predetermined distance, and the peripheral edge of the dresser plate 50 that rotates at a low speed contacts the second groove 52b that rotates at a high speed.
[0079]
After a predetermined amount of cut feed, the movement of the wafer chuck 24 in the X-axis direction is stopped at that position. As shown in FIG. 10B, when the dresser plate 50 rotates at a low speed on the spot, the peripheral edge of the dresser plate 50 is processed into a predetermined chamfered shape by the truing grooves 52 that rotate at a high speed.
[0080]
After the peripheral portion of the dresser plate 50 is chamfered by a predetermined amount, the X-axis moving motor 71 is driven to feed and move the wafer chuck 24 in the direction of the arrow away from the outer peripheral grinding wheel 18 as shown in FIG. . After the wafer chuck 24 moves to the initial position, the rotation drive motor 102 (θ-axis) and the wheel rotation drive motor 16 are stopped, and the rotation of the dresser plate 50 and the outer peripheral grinding wheel 18 is stopped. Thus, the step of shaping the dresser plate 50 is completed.
[0081]
Next, the shaping process of the fine grinding groove 56 will be described with reference to FIG. After the wafer chuck 24 has been moved to the initial position, the control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91, and as shown in FIG. It is moved and arranged at a position where it faces the same groove at the same height with the same groove 56.
[0082]
Then, the rotation drive motor 102 (θ-axis) and the wheel rotation drive motor 44 are rotated to rotate the dresser plate 50 shaped into 22 × 300R and the fine grinding wheel 66. Next, the X-axis moving motor 71 is driven to feed and move the wafer chuck 24 toward the fine grinding wheel 66 as shown in FIG. The feed speed of the wafer chuck 24 is reduced immediately before the fine grinding wheel 66, and is sent at a slow speed immediately before the fine grinding wheel 66.
[0083]
As a result, the wafer chuck 24 moves a predetermined distance, and the peripheral edge of the rotating dresser plate 50 comes into contact with the rotating fine grinding groove 56, and is further cut and fed by a predetermined amount. After a predetermined amount of cut feed, the movement of the wafer chuck 24 in the X-axis direction is stopped at that position. As shown in FIG. 11B, by rotating the dresser plate 50 on the spot, the fine grinding groove 56 is processed into 22 × 300R. This is called truing.
[0084]
As described above, by forming the fine grinding groove 56 by performing truing after attaching the fine grinding wheel 66 to the wheel rotation driving motor 44, the following effects are obtained. That is, even if the center of the fine-grinding wheel 66 and the center of the output shaft of the wheel rotation driving motor 44 are not accurately aligned, the fine-grinding groove 56 shaped by truing becomes a perfect circle, and its center is Coincides exactly with the center of the output shaft of the wheel rotation drive motor 44. Therefore, during the rotation of the fine-grinding foil 66, the fine-grinding groove 56 does not swing to the outer periphery, and the wafer 1 can be chamfered precisely.
[0085]
After the fine grinding groove 56 is processed by a predetermined amount, as shown in FIG. 11C, the X-axis moving motor 71 is driven to move the wafer chuck 24 in the direction of the arrow away from the fine grinding wheel 66. . Then, the rotation drive motor 102 (θ axis) and the wheel rotation drive motor 44 are stopped, and the rotation of the dresser plate 50 and the fine grinding wheel 66 is stopped. Thus, the fine grinding groove shaping step is completed. By repeating the above-described fine grinding groove shaping step, a plurality of fine grinding grooves 56 can be formed.
[0086]
After the rotation of the dresser plate 50 is stopped, the vacuum pump 43 is stopped and air is supplied to the porous ceramic plate 40 to release the suction of the dresser plate 50, and the dresser plate 50 is moved to the wafer chuck 24 by a transfer device (not shown). Remove from.
[0087]
In the present embodiment, a case has been described in which truing is performed on the fine grinding wheel 66 in which the fine grinding groove 56 is formed in advance, but the fine grinding wheel 66 in which the fine grinding groove 56 is not formed. Truing may be performed to form the fine grinding groove 56. In this case, the precision grinding wheel 66 on which the precision grinding groove 56 is not formed is mounted on the wheel rotation driving motor 44, and the same process as described above is performed to form the precision grinding groove 56 with the dresser plate 50. I do. That is, the dresser plate 50 and the fine grinding wheel 66 are rotated, and the outer periphery of the dresser plate 50 is pressed against the outer periphery of the fine grinding wheel 66 to form the fine grinding groove 56. As described above, the groove shape of the truing groove 52 is transferred to the fine grinding groove 56.
[0088]
After the above-described step of shaping the fine grinding groove 56, a wafer chamfering step is performed. The 22 × 300R wafer chamfering step is performed in the same manner as the 22 × 260R wafer chamfering step. That is, after the wafer 1 is vacuum-sucked to the wafer chuck 24, the peripheral portion of the wafer 1 rotating at a low speed is pressed against the rough grinding groove 54 rotating at a high speed, and a rough grinding step of the wafer 1 is performed. Thereafter, the peripheral edge of the wafer 1 is pressed into the fine grinding groove 56 formed into a 22 × 300R groove shape, and the fine grinding step of the wafer 1 is performed. After the fine grinding step, the wafer 1 is removed from the wafer chuck 24 by a transfer device (not shown) and transferred to the next step. Thus, a wafer having a chamfered shape of 22 × 300R can be manufactured.
[0089]
By transferring the shapes of the first groove 52a and the second groove 52b of the truing groove 52 to the fine grinding groove 56, a wafer having a 22 × 300R chamfer shape and a wafer having a 22 × 260R chamfer shape can be formed. It can be manufactured without replacing the outer peripheral grinding wheel 18.
[0090]
[Second embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS. 6C and 6D and FIGS. In this embodiment, as described below, in the first embodiment, the outer peripheral grinding united wheel 118, the notch rough grinding wheel 106, the notch precise grinding wheel 107, and the notch outer peripheral wheel 108 are used. Since the configuration is the same, and the configuration of the wafer holding device 22 and the like is the same, the detailed description of the same portions is omitted by using the reference numerals of the first embodiment, Only the combined wheel 118, the notch rough grinding wheel 106, the notch precise grinding wheel 107, and the notch outer peripheral wheel 108 will be described.
[0091]
FIG. 12 is a partial plan view of the wafer chamfering apparatus 110 according to the second embodiment of the present invention as viewed from above, FIG. 13 is a front view of the wafer chamfering apparatus 110, and FIG. 14 (b) is a bottom view of the outer peripheral grinding united wheel 118, FIG. 14 (c) is a plan view of the outer peripheral grinding united wheel 118, FIG. 14 (d) is a longitudinal sectional view of the notch outer peripheral wheel 108, FIGS. 15A and 15B are plan views of a wafer chamfering device 110 for explaining a process of chamfering a wafer with an orientation flat, and FIGS. 15C and 15D are chamfering processes of a notched wafer. 6 (c) and 6 (d) are longitudinal sectional views of modified examples 118a and 118b of the outer peripheral grinding united foil.
[0092]
First, the overall configuration of the wafer chamfering device 110 will be briefly described, and then each device will be described in detail. As shown in FIG. 13, a bracket 14 is erected on the base 12, and a wheel rotation driving motor 16 is fixed to the bracket 14 with the rotation axis directed vertically upward. An outer peripheral grinding united wheel 118 is mounted on the output shaft of the wheel rotation drive motor 16. A wafer holding device 22 is erected on the base 12 at a position facing the grinding device 20 configured as described above.
[0093]
A wafer chuck 24 is fixed above the wafer holding device 22. A frame 26 covering the grinding device 20, the wafer holding device 22, and the like is fixed to the base 12, and an arm 28 is rotatably supported on an upper portion thereof. A notched wafer grinding device 150 is fixed to the arm 28. As described above, the wafer chamfering device 110 in the present embodiment mainly includes the wafer holding device 22, the grinding device 20, and the notched wafer grinding device 150.
[0094]
Next, the configuration of the grinding device 20 will be described. The grinding device 20 according to the present embodiment mainly includes a bracket 14, a wheel rotation driving motor 16, an outer peripheral grinding united wheel 118 provided above the output shaft of the wheel rotation driving motor 16, and a wheel rotation driving motor. A stopper 34 provided on the uppermost portion of the output shaft for connecting the output shaft 16 and the outer peripheral grinding united wheel 118 and a stopper 32 provided on the lower surface of the outer peripheral grinding united wheel 118 and fitted to the stopper 34. Become.
[0095]
As shown in FIG. 13, the bracket 14 is vertically erected on the base 12 installed horizontally. The wheel rotation drive motor 16 is fixed to the bracket 14 with the output shaft directed vertically upward. As shown in FIG. 14B, a stopper 32 is provided at the center of the lower surface of the outer peripheral grinding united wheel 118 having a substantially cylindrical shape. By fitting the stopper 32 with the stopper 34 provided on the output shaft, the outer peripheral grinding united wheel 118 is mounted on the wheel rotation driving motor 16 to be rotatable.
[0096]
As shown in FIG. 14A, the outer peripheral grinding united wheel 118 has a metal bond grindstone 36 and a resin bond grindstone 38 arranged coaxially and integrally formed. Here, an example of a method of uniting the metal bond grindstone 36 and the resin bond grindstone 38 will be described with reference to FIGS. 14 (a) and 14 (c).
[0097]
Eight screw holes are formed concentrically at equal intervals on the upper surface of the metal bond grindstone 36. Eight through holes penetrating from the upper surface to the lower surface are formed concentrically at equal intervals in the resin bond grindstone 38 so as to correspond to the screw holes. Then, the through-hole and the screw hole are aligned so as to be in a straight line, and the resin bond grindstone 38 is placed on the upper surface of the metal bond grindstone 36. After that, the washer 162 is arranged on the upper surface of the through hole, and the bolt 160 is inserted from the upper surface through the washer 162 and the through hole to fit the screw hole. Thereby, the resin bond grindstone 38 and the metal bond grindstone 36 can be fixed.
[0098]
Alternatively, the upper surface of the metal bond grindstone 36 and the lower surface of the resin bond grindstone 38 may be fixed with an adhesive, and the cylindrical metal bond grindstone 36 is fixed to the lower part of the outer periphery of the substantially cylindrical foil body, and the outer periphery of the foil body is fixed. The resin-bonded grindstone 38 may be fixed on the upper portion to form the outer peripheral grinding united wheel 118. Note that the vertical positional relationship between the metal bond grindstone 36 and the resin bond grindstone 38 may be reversed.
[0099]
As shown in FIG. 14A, two truing grooves 152 for grinding the dresser plate 50 and four rough grinding grooves 154 for rough grinding the wafer are provided on the outer periphery of the metal bond grindstone 36. Are formed horizontally and annularly. The truing groove 152 and the rough grinding groove 154 are formed in parallel, and the truing groove 152 is provided in the first groove 152a and the second groove 152b counted from the lower side of the outer periphery of the metal bond grindstone 36. The shape of the first groove 152a is 22 × 300R (for a wafer with a notch), and the shape of the second groove 152b is 22 × 300R (for a wafer with an orientation flat).
[0100]
The rough grinding groove 154 is provided in the third to sixth grooves counted from the lower side of the outer periphery of the metal bond grindstone 36. The rough grinding groove 154 has a groove shape for chamfering the outer peripheral portion of the wafer at 22 °. The number of the rough grinding grooves 154 may be any number. Further, not all the rough grinding grooves 154 need to have the same shape, and may have different shapes.
[0101]
A resin bond grindstone 38 is arranged above the metal bond grindstone 36. On the outer periphery of the resin bond grindstone 38, two fine grinding grooves 156 for fine grinding a wafer with an orientation flat are formed horizontally and annularly. The fine grinding groove 156, the coarse grinding groove 154, and the truing groove 152 are formed in parallel, and the fine grinding groove 156 is the seventh groove and the eighth groove counted from the lower side of the outer peripheral grinding combined wheel 118. Is provided. The shapes of the seventh and eighth grooves of the fine grinding groove 156 are both 22 × 300R (for a wafer with an orientation flat). The precision grinding groove 156 is trued by the dresser plate 50 every time the shape of the precision grinding groove 156 is out of shape.
[0102]
The outer peripheral grinding united wheel 118 configured as described above is fixed at a fixed position, and rotates at high speed around the central axis at that position. Then, the outer peripheral portion of the wafer 1 can be chamfered by pressing the rough grinding groove 154 and the fine grinding groove 156 against the outer peripheral portion of the wafer 1 while rotating at a high speed. The truing groove 152 is formed by a 600th grindstone, the rough grinding groove 154 is formed by a 800th grindstone, and the fine grinding groove 156 is formed by a 3000th grindstone.
[0103]
In the present embodiment, the outer peripheral grinding united wheel 118 has a cylindrical shape. However, the present invention is not limited to this. For example, it may be a substantially cylindrical outer grinding wheel 118a having a trapezoidal cross section as shown in FIG. 6C, or a drum-shaped outer grinding wheel 118b shown in FIG. 6D.
[0104]
Next, the configuration of the notched wafer grinding device 150 will be described. As shown in FIGS. 12 and 13, the arm 28 is rotatably supported by the frame 26 as in the first embodiment. The arm 28 is fixed horizontally by the frame 26 and the arm support 64.
[0105]
The arm 28 has wheel rotation driving motors 140 and 142 whose output shafts are supported at right angles to the arm 28. Further, a wheel rotation drive motor 144 is supported on the arm 28 with its output shaft inclined at 5 ° to 10 ° with respect to the arm 28. However, the wheel rotation driving motor 144 does not necessarily need to be inclined, and the wheel rotation driving motor 144 may be supported so that the output shaft thereof is perpendicular to the arm 28.
[0106]
A notch rough grinding wheel 106, a notch fine grinding wheel 107, and a notch peripheral wheel 108 are mounted on the output shafts of the wheel rotation driving motors 140, 142, 144, respectively. It rotates by driving. The notch rough grinding wheel 106 and the notch precise grinding wheel 107 are thick, small-diameter drum-shaped grinding wheels for chamfering the notch portion of the wafer. As shown in FIG. 14D, the notch outer peripheral foil 108 is provided with a resin bond grindstone 38 on the outer peripheral portion thereof, and the resin bond grindstone 38 has two notch outer peripherals for precisely grinding a notched wafer. The precision grinding groove 158 is formed horizontally and annularly.
[0107]
Next, a case of manufacturing a wafer with an orientation flat having a chamfered shape of 22 × 300R by using the wafer chamfering apparatus 110 configured as described above will be described with reference to FIG. The working process of the present embodiment mainly includes a dressing process of the dresser plate 50, a shaping process of the fine grinding groove 156, and a wafer chamfering process. A dresser plate 50 having a chamfered shape of 22 × 300R (for a wafer with an orientation flat) may be prepared in advance, but in the following, a chamfered shape of 22 × 300R (for a wafer with an orientation flat) by a truing groove 152 will be described. The case where the dresser plate 50 shaped as described above is used will be described. The step of shaping the dresser plate 50 and the step of shaping the fine grinding groove 156 are appropriately performed even when the dresser plate 50 and the fine grinding groove 156 are out of shape.
[0108]
First, the process of shaping the dresser plate 50 will be briefly described. In the same manner as in the first embodiment, the dresser plate 50 is placed on the wafer chuck 24 and vacuum-adsorbed. Then, the dresser plate 50 placed on the wafer chuck 24 is moved and arranged at a position facing the same plane having the same height as the second groove 152b of the truing groove 152. As described above, the shape of the first groove 152a is 22 × 300R (for notch outer periphery grinding), and the shape of the second groove 152b is 22 × 300R (for a wafer with an orientation flat).
[0109]
Thereafter, the peripheral edge of the dresser plate 50 rotated at a low speed is pressed against the second groove 152b rotated at a high speed to process the peripheral edge of the dresser plate 50 into a 22 × 300R (for a wafer with an orientation flat) chamfer. Thus, the step of shaping the dresser plate 50 is completed.
[0110]
Next, the shaping process of the fine grinding groove 156 will be briefly described. After the dressing process of the dresser plate 50 is completed, the Z-axis movement motor 91 is driven by the control unit, and the dresser plate 50 and the fine grinding groove 156 are moved and arranged at a position where they face each other on the same plane at the same height. Thereafter, the dresser plate 50 and the outer peripheral grinding united wheel 118 are rotated, and the peripheral portion of the dresser plate 50 is pressed against the fine grinding groove 156, and the fine grinding groove 156 is formed into a groove of 22 × 300R (for a wafer with an orientation flat). Shape it into a shape.
[0111]
After the fine grinding groove 156 is shaped into a predetermined groove shape, the control unit drives the X-axis moving motor 71 to feed and move the wafer chuck 24 in a direction away from the outer peripheral grinding united wheel 118. After the wafer chuck 24 is separated from the outer peripheral grinding united wheel 118 by a predetermined amount, the rotation drive motor 102 is stopped, and the rotation of the dresser plate 50 is stopped. Thus, the fine grinding groove shaping step is completed. By repeating the above-described fine grinding groove shaping step, a plurality of fine grinding grooves 156 can be formed.
[0112]
After the rotation of the dresser plate 50 is stopped, the vacuum pump 43 is stopped and air is supplied to the porous ceramic plate 40 to release the suction of the dresser plate 50, and the dresser plate 50 is moved to the wafer chuck 24 by a transfer device (not shown). Remove from. In this embodiment, a case has been described in which truing is performed on the outer peripheral grinding united foil 118 in which the fine grinding grooves 156 have been formed in advance, but the fine grinding grooves 156 are formed in the same manner as in the first embodiment. It is also possible to form a fine grinding groove 156 by performing truing on the outer peripheral grinding united wheel 118 on which is not formed.
[0113]
Next, the wafer chamfering step will be described. Since the wafer chamfering process in the present embodiment includes a wafer rough grinding process and a fine grinding process, the wafer rough grinding process and the fine grinding process will be described below. However, since the fine grinding step is performed in the same manner as the rough grinding step, the rough grinding step will be described as an example, and the fine grinding step will be briefly described.
[0114]
The control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91 to move the wafer chuck 24 to a predetermined wafer receiving position. Next, alignment is performed by a wafer transfer device (not shown) so that the plane center of the wafer 1 and the rotation center of the wafer chuck 24 coincide with each other, and the wafer 1 is mounted on the wafer chuck 24. Thereafter, when the vacuum pump 43 sucks air, the air in the porous ceramic plate 40 having air permeability is discharged to the outside through the exhaust holes 42, and the pressure in the porous ceramic plate 40 becomes negative. As a result, the wafer 1 is vacuum-sucked at the portion in contact with the porous ceramic plate 40, and the vacuum is sealed by the dense ceramic pedestal 41.
[0115]
After vacuum chucking the wafer 1 on the wafer chuck 24, the control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91 to roughly move the wafer 1 placed on the wafer chuck 24. It is moved to the same height as the grinding groove 154. Next, the X-axis moving motor 71 and the Y-axis moving motor 81 are driven, and the wafer chuck is moved so that the end 114a of the orientation flat portion 114 comes into contact with the rough grinding groove 154 as shown in FIG. 24 is moved in the direction of the arrow toward the outer peripheral grinding united wheel 118 and moved.
[0116]
The feed speed of the wafer chuck 24 is reduced immediately before the outer peripheral grinding united wheel 118, and is sent at a slow speed immediately before the outer peripheral united wheel 118. As a result, the wafer chuck 24 moves a predetermined distance, and the end portion 114a of the orientation flat portion 114 comes into contact with the high-speed rotating rough grinding groove 154, and is further cut and fed by a predetermined amount. After a predetermined amount of cut feed, the movement of the wafer chuck 24 in the direction of the arrow is stopped at that position.
[0117]
Then, by driving the Y-axis moving motor 81, the wafer chuck 24 is moved in the direction of the arrow along the orientation flat portion 114 as shown in FIG. Thus, the orientation flat portion 114 is roughly ground by a predetermined processing amount by the high-speed rotating rough grinding groove 154, and is processed into a predetermined chamfered shape. When the rough grinding groove 154 reaches the other end 114b of the orientation flat portion 114, the control unit stops the Y-axis moving motor 81 and drives the rotary drive motor 102 (θ-axis) to rotate the wafer chuck 24. At low speed on the spot.
[0118]
By rotating the wafer 1 at a low speed in this manner, the outer peripheral grinding united foil 118 can be chamfered over the entire circumference of the circumferential portion 114c of the wafer 1. When the rough grinding groove 154 reaches the end 114a of the orientation flat part 114, the control unit stops the rotation drive motor 102 (θ axis). As described above, rough grinding can be performed over the entire outer peripheral portion of the wafer with the orientation flat.
[0119]
After the outer peripheral portion of the wafer 1 is chamfered, the control unit drives the X-axis moving motor 71 to feed and move the wafer chuck 24 in a direction away from the outer peripheral grinding united wheel 118. After the wafer chuck 24 is separated from the outer peripheral grinding united wheel 118 by a predetermined amount, the wheel rotation drive motor 16 is stopped, and the rotation of the outer peripheral grinding united wheel 118 is stopped. Thus, the rough grinding step of the wafer 1 is completed.
[0120]
Next, the fine grinding step of the wafer will be briefly described. The fine grinding step of the present embodiment is almost the same as the coarse grinding step, and differs only in that the fine grinding is performed using the fine grinding groove 156 instead of the coarse grinding groove 154. After the rough grinding step, the Z-axis moving motor 91 is driven by the control unit to move the wafer 1 to the same height as the fine grinding grooves 156. Thereafter, the orientation flat portion 114, the end portions 114a and 114b, and the circumferential portion 114c are precisely ground in the same manner as in the rough grinding process, and the entire outer peripheral portion of the wafer 1 is precisely ground. After the fine grinding step, the wafer 1 is removed from the wafer chuck 24 by a transfer device (not shown) and transferred to the next step. Thus, the manufacturing process of the wafer with the orientation flat having the 22 × 300R chamfered shape is completed.
[0121]
A case where a notched wafer having a 22 × 300R chamfered shape is manufactured by the wafer chamfering device 110 will be described. This manufacturing process mainly includes a shaping process of the dresser plate 50, a shaping process of the notch peripheral fine grinding groove 158, and a wafer chamfering process. The dresser plate 50 may have a chamfered shape of 22 × 300R (for notch outer periphery grinding) in advance, but in the following, it is shaped into a 22 × 300R (for notch outer periphery grinding) chamfering shape by the truing groove 152. The case where the dresser plate 50 is used will be described. The step of shaping the dresser plate 50 and the step of shaping the notch outer peripheral precision grinding groove 158 are appropriately performed even when the dresser plate 50 and the notch outer peripheral precision grinding groove 158 are out of shape.
[0122]
First, the process of shaping the dresser plate 50 will be briefly described. The dresser plate 50 is placed on the wafer chuck 24 and vacuum-sucked in the same manner as in the manufacturing process of the wafer with the orientation flat. Then, the dresser plate 50 placed on the wafer chuck 24 is moved and arranged at a position facing the same plane having the same height as the first groove 152a of the truing groove 152. Thereafter, the peripheral edge of the dresser plate 50 rotated at a low speed is pressed against the truing groove 152 rotated at a high speed, and the peripheral edge of the dresser plate 50 is processed into a chamfered shape of 22 × 300R (for notch outer peripheral grinding). Thus, the step of shaping the dresser plate 50 is completed.
[0123]
Next, a process of shaping the notch outer peripheral precision grinding groove 158 will be briefly described. After the shaping process of the dresser plate 50 is completed, the control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91, and the dresser plate 50 and the notch outer peripheral fine grinding groove 158 are formed. Are moved and arranged at positions facing each other on the same plane at the same height. Thereafter, the dresser plate 50 and the notch outer peripheral wheel 108 are rotated, and the peripheral edge of the dresser plate 50 is pressed against the notch outer peripheral fine grinding groove 158, and the notch outer peripheral fine grinding groove 158 is set to 22 × 300R (notch outer peripheral). (For grinding). As described above, the notch outer peripheral precision grinding groove shaping step is completed. By repeating the above-described notch outer peripheral fine grinding groove step, a plurality of notch outer peripheral fine grinding grooves 158 can be formed.
[0124]
After the rotation of the dresser plate 50 is stopped, the vacuum pump 43 is stopped and air is supplied to the porous ceramic plate 40 to release the suction of the dresser plate 50, and the dresser plate 50 is moved to the wafer chuck 24 by a transfer device (not shown). Remove from. In the present embodiment, a case has been described in which truing is performed on the notch outer peripheral foil 108 in which the notch outer peripheral fine grinding groove 158 has been formed in advance, but the notch outer peripheral fine grinding groove 158 is formed. Truing may be performed on the notch outer peripheral foil 108 to form the notch outer peripheral precision grinding groove 158.
[0125]
Next, the wafer chamfering step will be described. The wafer chamfering process in the present embodiment mainly includes a rough grinding process and a fine grinding process for the wafer circumferential portion 112c, and a rough grinding process and a fine grinding process for the notch portion 112. First, a rough grinding step and a fine grinding step of the wafer circumferential portion 112c will be described. However, since the fine grinding step is performed in the same manner as the rough grinding step, the rough grinding step will be described as an example, and the fine grinding step will be briefly described.
[0126]
The control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91 to move the wafer chuck 24 to a predetermined wafer receiving position. Next, alignment is performed by a wafer transfer device (not shown) so that the plane center of the wafer 1 and the rotation center of the output shaft coincide with each other, and the wafer 1 is mounted on the wafer chuck 24. Thereafter, when the vacuum pump 43 sucks air, the air in the porous ceramic plate 40 having air permeability is discharged to the outside through the exhaust holes 42, and the pressure in the porous ceramic plate 40 becomes negative. As a result, the wafer 1 is vacuum-sucked at the portion in contact with the porous ceramic plate 40, and the vacuum is sealed by the dense ceramic pedestal 41.
[0127]
After the wafer 1 is vacuum-sucked on the wafer chuck 24, the control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, the Z-axis movement motor 91, and the rotation drive motor 102 (θ-axis), and FIG. As shown in (c), the wafer 1 placed on the wafer chuck 24 is moved to a position at the same height as the coarse grinding groove 154 and the end 112a of the circumferential portion and the coarse grinding groove 154 face each other. Let it. Next, the X-axis moving motor 71 is driven, and the wafer chuck 24 is fed and moved in the direction of the arrow toward the outer peripheral grinding united wheel 118 such that the end 112a of the circumferential portion comes into contact with the rough grinding groove 154. The feed speed of the wafer chuck 24 is reduced immediately before the outer peripheral grinding united wheel 118, and is sent at a slow speed immediately before the outer peripheral united wheel 118.
[0128]
As a result, the wafer chuck 24 moves a predetermined distance, and the end portion 112a of the circumferential portion 112c comes into contact with the high-speed rotating rough grinding groove 154, and is further cut and fed by a predetermined amount. After a predetermined amount of cut feed, the movement of the wafer chuck 24 in the direction of the arrow is stopped at that position, and the rotation drive motor 102 (θ-axis) is driven to move the wafer chuck 24 as shown in FIG. At low speed in the direction of the arrow. When the rough grinding groove 154 reaches the end 112b of the circumferential portion 112c due to the rotation of the wafer 1, the control unit stops the rotation drive motor 102 (θ axis). By rotating the wafer 1 at a low speed in this manner, the outer peripheral grinding united wheel 118 can perform chamfering over the entire circumference of the circumferential portion 112c of the wafer 1.
[0129]
After the outer peripheral portion of the wafer 1 is chamfered, the control unit drives the X-axis moving motor 71 to feed and move the wafer chuck 24 in a direction away from the outer peripheral grinding united wheel 118. After the wafer chuck 24 is separated from the outer peripheral grinding united wheel 118 by a predetermined amount, the wheel rotation drive motor 16 is stopped, and the rotation of the outer peripheral grinding united wheel 118 is stopped. Thus, the rough grinding step of the wafer circumferential portion 112c is completed.
[0130]
Next, the fine grinding step of the wafer circumferential portion 112c will be briefly described. The fine grinding step of the present embodiment is almost the same as the coarse grinding step, and the fine grinding is performed using the notch peripheral fine grinding groove 158 of the notch peripheral foil 108 instead of the coarse grinding groove 154. Only differ. After the rough grinding step, the control unit drives the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91, and moves the wafer 1 to the same height as the notch peripheral fine grinding groove 158. Let it. Thereafter, the circumferential portion 112c of the wafer 1 is precisely ground in the same manner as in the rough grinding process, and the entire outer peripheral portion of the wafer 1 is finely ground. Thus, the fine grinding step of the wafer circumferential portion 112c is completed.
[0131]
Next, the rough grinding step and the fine grinding step of the notch portion 112 will be briefly described. First, a rough grinding step of the notch portion 112 will be described. After the fine grinding step of the wafer circumference 112c is completed and the rotation of the wafer 1 is stopped, the X-axis movement motor 71, the Y-axis movement motor 81, the Z-axis movement motor 91, and the rotation drive motor 102 (θ-axis) ) Is driven, and the wafer 1 placed on the wafer chuck 24 is moved and arranged at a position facing the same plane at the same height as the notch rough grinding wheel 106. At this time, the end portion 112a of the notch portion 112 and the notch rough grinding wheel 106 are positioned so as to face each other.
[0132]
Thereafter, the wheel rotation driving motor 140 is rotated, and the notch rough grinding wheel 106 is rotated at a high speed at a predetermined rotation speed. Next, the X-axis movement motor 71 is driven by the control unit, and the wafer chuck 24 is fed and moved toward the notch rough grinding wheel 106. The feed speed of the wafer chuck 24 is reduced immediately before the end portion 112a and the notch rough grinding wheel 106 come into contact with each other, and the wafer chuck 24 is sent at a slow speed. As a result, the wafer chuck 24 moves a predetermined distance, and the end portion 112a comes into contact with the notch rough grinding wheel 106 rotating at a high speed.
[0133]
Then, the X-axis movement motor 71 and the Y-axis movement motor 81 are controlled to feed and move the wafer chuck 24 along the shape of the notch 112. As a result, the notch rough grinding wheel 106 relatively moves along the shape of the notch 112, and a predetermined amount of chamfering can be performed over the entire area of the notch 112. After the chamfering rough grinding is performed over the entire area of the notch 112, the control unit drives the X-axis moving motor 71 to feed and move the wafer chuck 24 in a direction away from the notch rough grinding wheel 106.
[0134]
After the wafer chuck 24 is separated from the notch rough grinding wheel 106 by a predetermined amount, the wheel rotation driving motor 140 is stopped, and the rotation of the notch rough grinding wheel 106 is stopped. During the operation of the wafer chamfering device 110, the notch rough grinding wheel 106 may be continuously rotated without stopping the wheel rotation driving motor 140. Thus, the rough grinding step of the notch portion 112 is completed.
[0135]
Next, the fine grinding process of the notch portion 112 will be briefly described. The fine grinding step of the notch 112 is performed in substantially the same manner as the rough grinding step of the notch 112. After the rough grinding process of the notch portion 112 is completed, the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91 are driven by the control unit, and the wafer 1 is the same as the notch precision grinding wheel 107. It is moved and arranged at a position facing the same plane of height. Thereafter, the notch precision grinding wheel 107 is rotated at a predetermined rotation speed at a high speed by the wheel rotation driving motor 142.
[0136]
Next, similarly to the rough grinding step, the X-axis movement motor 71 and the Y-axis movement motor 81 are controlled to feed and move the wafer chuck 24 along the shape of the notch 112. Thus, a predetermined amount of chamfering is performed over the entire area of the notch 112. After the chamfering of the notch 112 is completed, the wafer chuck 24 is fed and moved away from the notch precision grinding wheel 107.
[0137]
After the wafer chuck 24 is separated from the notch precision grinding wheel 107 by a predetermined amount, the wheel rotation driving motor 142 is stopped, and the rotation of the notch precision grinding wheel 107 is stopped. During the operation of the wafer chamfering device 110, the notch precise grinding wheel 107 may be continuously rotated without stopping the wheel rotation driving motor 142. Thus, the fine grinding step of the notch portion 112 is completed.
[0138]
After the fine grinding step of the notch 112 is completed, the X-axis movement motor 71, the Y-axis movement motor 81, and the Z-axis movement motor 91 are driven by the control unit to move the wafer chuck 24 to the wafer receiving position. Thereafter, the vacuum pump 43 is stopped and air is supplied to the porous ceramic plate 40. As a result, the suction of the wafer 1 is released, the wafer 1 is removed from the wafer chuck 24 by a transfer device (not shown), and transferred to the next step. Thus, the manufacturing process of the notched wafer having the 22 × 300R chamfered shape is completed.
[0139]
The rough grinding step of the notch part 112 may be performed after the rough grinding step of the wafer circumferential part 112c, and either of the wafer circumferential part 112c and the notch part 112 may be roughly ground. Similarly, the fine grinding process of the notch portion 112 may be performed after the fine grinding process of the wafer circumferential portion 112c.
[0140]
By transferring the shape of the first groove 152a of the truing groove 152 to the notch peripheral fine grinding groove 158 and the shape of the second groove 152b to the fine grinding groove 156 in this manner, the 22 × 300R chamfered notch is formed. And a wafer with an orientation flat having a 22 × 300R chamfered shape can be manufactured without replacing the outer peripheral grinding united foil 118.
[0141]
That is, conventionally, the shape of the truing groove of the grinding wheel for the notched wafer is only one type of 22 × 300R (for the outer periphery of the notched wafer). The shape of the truing groove of the grinding wheel for the wafer with the orientation flat was only one type of 22 × 300R (for the wafer with the orientation flat). For this reason, when the grinding wheel for a notched wafer is mounted, the shape of the fine grinding groove cannot be trued to 22 × 300R (for a wafer with an orientation flat), and the grinding for a wafer with an orientation flat cannot be performed. When the foil was mounted, the shape of the notch peripheral fine grinding groove could not be trued to 22 × 300R (for the notched wafer peripheral).
[0142]
Therefore, when manufacturing a 22 × 300R chamfered notched wafer, replace it with a grinding wheel for a notched wafer, and when manufacturing a 22 × 300R chamfered wafer with an orientation flat, use a grinding wheel for an orientation flat wafer. Had to be replaced.
[0143]
However, as shown in the second embodiment, since the outer peripheral grinding united foil 118 has two truing grooves 152 having different shapes, even when manufacturing wafers having different chamfered shapes, the outer peripheral grinding united foil 118 is used. No longer need to be replaced.
[0144]
In the first and second embodiments described above, two truing grooves are provided, but the number of truing grooves is not limited to two, and three or more truing grooves each having a different shape are provided. May be. When three or more truing grooves are provided, it is not necessary that all the groove shapes are different from each other, and some of the truing grooves may have the same shape.
[0145]
The truing grooves need not be arranged adjacent to each other, but may be provided separately in another wheel. Further, the truing grooves need not be provided on the same wheel periphery as the rough grinding grooves, and may be provided on another wheel.
[0146]
As shown in the second embodiment, the fine grinding grooves to be trued may be provided on a plurality of wheels. Further, in the first and second embodiments, the case where the dresser plate is attracted to the wafer chuck has been described, but the dresser plate and its rotation driving device may be provided as separate devices.
[0147]
Regarding the material and size of the wafer to be chamfered, there is no limitation in practicing the present invention, and silicon wafers of currently manufactured diameter, semiconductor wafers such as GaAs, GaP, InP, etc. can be manufactured in the future as well. The present invention can be applied to a very large wafer. Further, the application of the present invention is not limited to the chamfering apparatus for various semiconductor substrates, and it is needless to say that the present invention can be applied to a chamfering apparatus for a thin plate such as a liquid crystal glass substrate.
[0148]
As described above, the present invention is not limited to the above-described embodiment, and various applications and modifications can be made within the scope of the invention with respect to the shape and number of truing grooves, workpieces, and the like. It is possible.
[0149]
[Implementation data]
The effects of the case where the wafer is manufactured by the conventional wafer chamfering apparatus and the case where the wafer is manufactured by the wafer chamfering apparatus of the present invention will be specifically described below. First, a case where a wafer is manufactured by the conventional wafer chamfering apparatus 210 and a case where a wafer is manufactured by the wafer chamfering apparatus 110 of the first embodiment will be compared.
[0150]
When the wafer is manufactured by the conventional wafer chamfering device 210, the outer peripheral grinding wheel 218 having the truing groove 152 for manufacturing the wafer of 22 × 260R and the outer peripheral grinding wheel 218 having the truing groove 152 for manufacturing the wafer of 22 × 300R are They were prepared separately and exchanged according to the type of wafer to be manufactured. The time required for this exchange is as follows.
[0151]
The time required for changing to a 22 × 260R foil is 3 hours / time and the number of times of changing is 6 times / month, so the time required for changing to a 22 × 260R foil is 18 hours / month. Also, the time required for changing to a 22 × 300R foil is 3 hours / time, and the number of times of replacement is 6 times / month, so the time required for changing to a 22 × 300R foil is 18 hours / month. . Therefore, the exchange loss is 18 hours / month + 18 hours / month = 36 hours / month.
[0152]
On the other hand, when the wafer is manufactured by the wafer chamfering apparatus 110 according to the first embodiment of the present invention, the exchange loss does not occur, and the exchange time can be reduced by 36 hours / month.
[0153]
Next, a case where a wafer is manufactured by the conventional wafer chamfering apparatus and a case where a wafer is manufactured by the wafer chamfering apparatus 110 of the second embodiment will be compared. When a wafer is manufactured by a conventional wafer chamfering apparatus, a wafer foil with an orientation flat and a notch foil are separately prepared and exchanged according to the type of wafer to be manufactured. The time required for this exchange is as follows.
[0154]
The time required to replace the wafer foil with an orientation flat is 3.5 hours / time and the number of replacement times is 4 times / month, so the time required to replace the foil for an orientation flat wafer is 14 hours. / Month. Also, the time required to replace the notch foil is 3 hours / time and the number of times of replacement is 4 times / month, so the time required to replace the notch foil is 12 hours / month. Therefore, the exchange loss is 14 hours / month + 12 hours / month, which is 26 hours / month.
[0155]
On the other hand, when the wafer is manufactured by the wafer chamfering apparatus 110 according to the second embodiment of the present invention, the above-described exchange loss does not occur, and the exchange time can be reduced by 26 hours / month. These are merely examples, and a greater effect can be obtained in accordance with the frequency of changing the type of wafer to be manufactured.
[0156]
【The invention's effect】
According to the wafer chamfering device of the present invention, by combining truing grooves having different groove shapes with the foil, it is not necessary to change the foil when changing the type of the wafer to be manufactured, and it is possible to eliminate the loss of the foil change. Conventionally, two truing grooves having the same shape are provided in consideration of the life of the truing grooves. However, there is no history of using two truing grooves in the conventional wafer chamfering apparatus, and the life of the truing grooves is sufficiently long. . Therefore, if there is one truing groove, there is no problem in production, and the number of processed wafers per one outer peripheral grinding wheel of the wafer chamfering device of the present invention is not inferior to that of the conventional wafer chamfering device.
[0157]
Further, the wafer chamfering device must lift the arm when exchanging the foil, and exchange the foil located thereunder. When the arm is fixed again, the position of the arm is slightly shifted, so that the position of the foil supported by the arm is also slightly shifted. For this reason, the accuracy of wafer grinding by the foil supported by the arm deteriorates, and it is necessary to perform the adjustment again. Eliminating the need to replace the foil is very useful in that this adjustment is unnecessary and the grinding accuracy of the wafer can be improved.
[0158]
In addition, since the metal bond wheel and the resin bond wheel are integrally formed coaxially, the size of the device can be reduced, and at the same time, no sludge enters between the metal bond wheel and the resin bond wheel, and the chamfering is performed. Accuracy can be kept good. In addition, by combining the metal bond whetstone and the resin bond whetstone and using them as one foil, there is no variation in the surface width due to attachment, and only one storage place is required.
[Brief description of the drawings]
FIG. 1 is a plan view of a wafer chamfering apparatus 10 according to a first embodiment of the present invention as viewed from above.
FIG. 2 is a front view of the wafer chamfering apparatus 10 according to the first embodiment of the present invention.
FIG. 3 is a right side view of the wafer chamfering apparatus 10 according to the first embodiment of the present invention.
4 (a) is a longitudinal sectional view of an outer peripheral grinding wheel 18, FIG. 4 (b) is a bottom view of the outer peripheral grinding wheel 18, and FIG. 4 (c) is a longitudinal sectional view of a fine grinding wheel 66. .
FIG. 5 is a longitudinal sectional view of a chamfered wafer.
6 (a) and 6 (b) are longitudinal sectional views of modified examples 18a and 18b of the outer peripheral grinding wheel according to the first embodiment of the present invention, and FIGS. 6 (c) and 6 (d). () Is a vertical sectional view of modified examples 118a and 118b of the outer peripheral grinding united foil according to the second embodiment of the present invention.
FIG. 7 is a view for explaining a moving mechanism of the wafer holding device 22.
FIG. 8 is a longitudinal sectional view of the wafer chuck 24 of the present invention.
FIG. 9 is a right side view of the wafer chamfering apparatus 10 for explaining a step of shaping the dresser plate 50.
FIG. 10 is a right side view of the wafer chamfering apparatus 10 for explaining a step of shaping the dresser plate 50.
FIG. 11 is a right side view of the fine grinding apparatus 30 for explaining a fine grinding step of a wafer.
FIG. 12 is a plan view of a wafer chamfering apparatus 110 according to a second embodiment of the present invention as viewed from above.
FIG. 13 is a front view of a wafer chamfering apparatus 110 according to a second embodiment of the present invention.
14 (a) is a longitudinal sectional view of the outer peripheral grinding united foil 118, FIG. 14 (b) is a bottom view of the outer peripheral grinding united wheel 118, FIG. 14 (c) is a plan view of the outer peripheral grinding united wheel 118, FIG. 14D is a longitudinal sectional view of the notch outer peripheral foil 108.
15 (a) and 15 (b) are plan views of a wafer chamfering apparatus 110 for explaining a chamfering step of a wafer with an orientation flat, and FIGS. 15 (c) and 15 (d) are notched. FIG. 3 is a plan view of the wafer chamfering apparatus 110 for explaining a wafer chamfering step.
FIG. 16 is a plan view of a conventional wafer chamfering apparatus 210 as viewed from above.
FIG. 17 is a front view of a conventional wafer chamfering device 210.
18 (a) is a longitudinal sectional view of a conventional peripheral grinding wheel 218, and FIG. 18 (b) is a longitudinal sectional view of a conventional fine grinding wheel 266.
FIG. 19 is a longitudinal cross-sectional view of an outer peripheral grinding wheel in which metal bond grindstones 236 and resin bond grindstones 238 formed separately are coaxially superposed and arranged.
[Explanation of symbols]
1 ... Wafer
10. Wafer chamfering device
12 ... Base
14… Bracket
16. Wheel rotation drive motor
18 ... Peripheral grinding wheel
20 ... Grinding device
22 ... Wafer holding device
24 ... Wafer chuck
26… Frame
28 arm 28a rear end 28b front end
30 ... Fine grinding device
32 ... Stopper
34 ... Stopper
36 ... Metal bond whetstone
38… Resin bond whetstone
40 ... porous ceramic plate
41 ... dense ceramic pedestal
42 ... Exhaust hole
43… Vacuum pump
44 ... Foil rotation drive motor
50 ... Dresser plate
52: Truing groove 52a: First groove 52b: Second groove
54 ... rough grinding groove 54a ... third groove 54b ... fourth groove 54c ... fifth groove 54d ... sixth groove 54e ... seventh groove 54f ... eighth groove 54g ... ninth groove
56: fine grinding groove 56a: first groove 56b: second groove
58 ... Bearing part
60 ... Shaft
62 ... arm support
64 ... arm support
66 ... Foil for fine grinding
70 X-axis moving mechanism
71 ... X-axis movement motor
72… Coupling
73 ... male screw
74 ... female screw
75 ... X-axis plate
76… Dovetail
77… Guide rail
78 ... Ball bearing
80 ... Y-axis moving mechanism
81 ... Y-axis moving motor
82… Coupling
83 ... male screw
84 female screw
85 ... Y-axis plate
86 ... Dovetail groove
87… Guide rail
88… Ball bearing
90 ... Z-axis moving mechanism
91 ... Z-axis movement motor
92… Coupling
93 ... male screw
94 ... female screw
95 ... Z-axis plate
96 ... Dovetail groove
97… Guide rail
98 ... Ball bearing
99 ... frame
100 ... bracket
102 ... Rotary drive motor
104 ... shaft
106 ... Foil for notch rough grinding
107: Notch precision grinding wheel
108 ... peripheral foil for notch
110 ... Wafer chamfering device
112: Notch 112a: End 112b: End 112c: Circumference
114: orientation flat portion 114a: end portion 114b: end portion
114c: circumference
118 ... Ground foil
140 ... wheel rotation drive motor
142 ... wheel rotation drive motor
144: Wheel rotation drive motor
150 ... notch wafer grinding machine
152: Truing groove 152a: First groove 152b: Second groove
154: rough grinding groove
156: Groove for fine grinding
158: Groove for precision grinding for notch periphery
160… bolt
162 ... Washer
210: Wafer chamfering device
212 ... Sludge
218: Peripheral grinding wheel
224 ... wafer chuck
228 ... arm
236 ... Metal bond whetstone
238… Resin bond whetstone
250 ... dresser plate
252: Truing groove 252a: First groove 252b: Second groove
254: rough grinding groove 254a: third groove 254b ... fourth groove 254c ... fifth groove 254d ... sixth groove 254e ... seventh groove 254f ... eighth groove 254g ... ninth groove
256 ... grooves for fine grinding
266: Fine grinding wheel.

Claims (15)

A wafer chuck for holding a wafer,
A first wheel-type grinding wheel;
Moving means for moving the wafer chuck relative to the first wheel-type grindstone;
An annular grinding groove provided on the outer periphery of the first wheel-type grindstone;
A plurality of truing grooves provided on the outer periphery of a second wheel-type grindstone for shaping a dresser plate for shaping the grinding grooves,
And pressing the peripheral edge of the wafer detachably held by the rotating wafer chuck relatively close to the rotating first wheel-type grindstone against the grinding groove to chamfer a predetermined shape. Wafer chamfering equipment,
A wafer chamfering apparatus, wherein one of the plurality of truing grooves has a different shape from the other one. The wafer chamfering apparatus according to claim 1, wherein the annular grinding groove provided on the outer periphery of the first wheel-type grindstone is a grinding groove for fine grinding. The wafer chamfering apparatus according to claim 1, wherein the first wheel-type grindstone is a resin-bonded grindstone, and the second foil-type grindstone is a metal-bonded grindstone. The wafer chamfering apparatus according to any one of claims 1 to 3, wherein the first wheel-type grindstone and the second wheel-type grindstone are combined. 5. The wafer chamfering device according to claim 1, wherein a grinding groove for rough grinding is provided on an outer periphery of the second wheel-type grindstone. 6. The wafer chamfering apparatus according to claim 1, wherein the shape of the truing groove is substantially complementary to a chamfering shape required for a wafer to be manufactured. Pressing the outer periphery of the rotating dresser plate against any one of a plurality of truing grooves provided on the rotating wheel-type grindstone, and shaping the dresser plate;
Pressing the outer periphery of the rotating shaped dresser plate against a grinding groove for chamfering a wafer provided on the outer periphery of the same or another foil type grinding wheel as the rotating wheel type grinding wheel, and shaping the grinding groove; ,
In the grinding groove shaping method including
The plurality of truing grooves are not the same shape as each other,
The method of shaping a dressing plate, wherein the step of shaping the dresser plate is performed by using one truing groove selected according to a chamfered shape of a wafer to be manufactured. The grinding groove shaping method according to claim 7, wherein the selected one truing groove has a shape substantially complementary to a chamfered shape of the wafer to be manufactured. A wafer chamfering method for chamfering a predetermined shape by pressing a peripheral edge of a wafer detachably held on a rotating wafer chuck to a grinding groove by relatively approaching the rotating first wheel-type grindstone, ,
Pressing the outer periphery of the rotating dresser plate by relatively approaching any one of a plurality of truing grooves provided in the rotating second wheel-type grindstone to shape the dresser plate;
A step of shaping the grinding groove into a predetermined shape by pressing the grinding groove provided on the outer periphery of the rotating first wheel-type grindstone by relatively approaching the outer periphery of the rotating dresser plate, Wherein one groove shape of the plurality of truing grooves is different from the other one groove shape;
The method of chamfering a wafer, wherein the step of shaping the dresser plate is performed by using one truing groove selected according to a chamfered shape of a wafer to be manufactured. 10. The wafer chamfering method according to claim 9, wherein the grinding groove provided on the outer periphery of the first wheel-type grindstone is a grinding groove for fine grinding. 11. The wafer chamfering method according to claim 9, wherein the first wheel-type grindstone is a resin-bonded grindstone, and the second foil-type grindstone is a metal-bonded grindstone. The wafer chamfering method according to any one of claims 9 to 11, wherein the first wheel-type grindstone and the second wheel-type grindstone are combined. The wafer chamfering method according to any one of claims 9 to 12, wherein a grinding groove for rough grinding is provided on an outer periphery of the second wheel-type grindstone. 14. The wafer chamfering method according to claim 9, wherein the selected one truing groove has a shape substantially complementary to a chamfered shape of the wafer to be manufactured. A wafer chuck for holding a wafer,
A foil-type metal bond whetstone with a rough grinding groove on the outer circumference,
A foil type resin bond whetstone with a fine grinding groove on the outer circumference,
Moving means for moving the wafer chuck relative to the metal bond grindstone or the resin bond grindstone,
Having a peripheral portion of the wafer detachably held on the rotating wafer chuck, the rough grinding groove or the fine grinding groove provided on the rotating metal bond grindstone or the resin bond grindstone. In a wafer chamfering device that chamfers to a predetermined shape by pressing by relatively approaching,
A wafer chamfering apparatus, wherein the metal bond grindstone and the resin bond grindstone are integrally formed.

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