JPS6420958A - Chamfering device - Google Patents

Chamfering device

Info

Publication number
JPS6420958A
JPS6420958A JP17676587A JP17676587A JPS6420958A JP S6420958 A JPS6420958 A JP S6420958A JP 17676587 A JP17676587 A JP 17676587A JP 17676587 A JP17676587 A JP 17676587A JP S6420958 A JPS6420958 A JP S6420958A
Authority
JP
Japan
Prior art keywords
sections
chamfering
periphery
chipping
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17676587A
Other languages
Japanese (ja)
Other versions
JP2623251B2 (en
Inventor
Takashi Miyatani
Nobuyasu Kunihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Original Assignee
Toshiba Ceramics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Ceramics Co Ltd filed Critical Toshiba Ceramics Co Ltd
Priority to JP62176765A priority Critical patent/JP2623251B2/en
Publication of JPS6420958A publication Critical patent/JPS6420958A/en
Application granted granted Critical
Publication of JP2623251B2 publication Critical patent/JP2623251B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To increase the edge angle of corner sections, suppress the occurrence of chipping, and remove the chipping having occurred by chamfering corner sections before polishing the periphery and performing the additional chamfering on the cross section between the chamfering sections and the end faces. CONSTITUTION:When the corner sections 23, 23 of a work material 20 are brought into contact with the polishing faces 12B, 12B of a polishing groove 12 and polished, chamfering sections 21A, 21A start to be formed, the edge angle, i.e., angle theta1, of the cross section between the chamfering sections 21A, 21A and the periphery is set sufficiently large, thus the occurrence of chipping at the cross section between the chamfering sections and the periphery when the periphery is polished can be thoroughly suppressed. After the periphery 21 and the corner sections 23, 23 of the material 20 is polished by the desired quantity, the material 20 is separated from the polishing groove 12 and brought into contact with the polishing faces 13B, 13B of a polishing groove 13 and polished, other chamfering sections 21B, 21B are formed, the chipping generated at the cross section between the chamfering sections 21A, 21A and the end faces 22, 22 can be removed, and the chipping can be removed because angles theta3, theta4 are larger than 90 deg. and larger than theta5.
JP62176765A 1987-07-15 1987-07-15 Chamfering equipment Expired - Fee Related JP2623251B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62176765A JP2623251B2 (en) 1987-07-15 1987-07-15 Chamfering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62176765A JP2623251B2 (en) 1987-07-15 1987-07-15 Chamfering equipment

Publications (2)

Publication Number Publication Date
JPS6420958A true JPS6420958A (en) 1989-01-24
JP2623251B2 JP2623251B2 (en) 1997-06-25

Family

ID=16019426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62176765A Expired - Fee Related JP2623251B2 (en) 1987-07-15 1987-07-15 Chamfering equipment

Country Status (1)

Country Link
JP (1) JP2623251B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5727990A (en) * 1994-06-17 1998-03-17 Shin-Etsu Handotai Co., Ltd. Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus
US5738563A (en) * 1995-03-07 1998-04-14 Kao Corporation Substrate chamfering machine
WO2001091968A1 (en) * 2000-05-30 2001-12-06 Memc Electronic Materials, Inc. Method and apparatus for multiple chamfering of a wafer
US6565421B1 (en) * 1999-09-01 2003-05-20 Lg Philips Lcd Co., Ltd. Apparatus and method of grinding liquid crystal cell
EP1312817A2 (en) 2001-11-15 2003-05-21 Nissan Motor Co., Ltd. Rotary member and production process
EP1312818A2 (en) 2001-11-15 2003-05-21 Nissan Motor Company, Limited Rolling bearing
JP2004243422A (en) * 2003-02-12 2004-09-02 Komatsu Electronic Metals Co Ltd Circumference grinding united wheel
JP2007306000A (en) * 2006-05-11 2007-11-22 Siltronic Ag Manufacturing method for semiconductor wafer equipped with odd-shaped edge
CN103394982A (en) * 2013-08-20 2013-11-20 中国电子科技集团公司第四十六研究所 Chamfering grinding wheel for machining silicon single crystal wafer for thick-layer epitaxy, and chamfering method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784739U (en) * 1980-11-13 1982-05-25
JPS58100432A (en) * 1981-12-11 1983-06-15 Hitachi Ltd Bevelling process of wafer
JPS60232874A (en) * 1984-04-27 1985-11-19 Honda Motor Co Ltd Total shape grinding tool

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784739U (en) * 1980-11-13 1982-05-25
JPS58100432A (en) * 1981-12-11 1983-06-15 Hitachi Ltd Bevelling process of wafer
JPS60232874A (en) * 1984-04-27 1985-11-19 Honda Motor Co Ltd Total shape grinding tool

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5727990A (en) * 1994-06-17 1998-03-17 Shin-Etsu Handotai Co., Ltd. Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus
US5738563A (en) * 1995-03-07 1998-04-14 Kao Corporation Substrate chamfering machine
US6565421B1 (en) * 1999-09-01 2003-05-20 Lg Philips Lcd Co., Ltd. Apparatus and method of grinding liquid crystal cell
WO2001091968A1 (en) * 2000-05-30 2001-12-06 Memc Electronic Materials, Inc. Method and apparatus for multiple chamfering of a wafer
EP1312817A2 (en) 2001-11-15 2003-05-21 Nissan Motor Co., Ltd. Rotary member and production process
EP1312818A2 (en) 2001-11-15 2003-05-21 Nissan Motor Company, Limited Rolling bearing
JP2004243422A (en) * 2003-02-12 2004-09-02 Komatsu Electronic Metals Co Ltd Circumference grinding united wheel
JP2007306000A (en) * 2006-05-11 2007-11-22 Siltronic Ag Manufacturing method for semiconductor wafer equipped with odd-shaped edge
CN103394982A (en) * 2013-08-20 2013-11-20 中国电子科技集团公司第四十六研究所 Chamfering grinding wheel for machining silicon single crystal wafer for thick-layer epitaxy, and chamfering method
CN103394982B (en) * 2013-08-20 2015-07-29 中国电子科技集团公司第四十六研究所 A kind ofly process the chamfering abrasive wheel and chamfering method that adopt silicon single crystal flake outside thick-layer

Also Published As

Publication number Publication date
JP2623251B2 (en) 1997-06-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees