CN102343443A - Processing apparatus having cutter - Google Patents
Processing apparatus having cutter Download PDFInfo
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- CN102343443A CN102343443A CN2011102040620A CN201110204062A CN102343443A CN 102343443 A CN102343443 A CN 102343443A CN 2011102040620 A CN2011102040620 A CN 2011102040620A CN 201110204062 A CN201110204062 A CN 201110204062A CN 102343443 A CN102343443 A CN 102343443A
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- cutter
- turning
- machined object
- chuck table
- chuck
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- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 10
- 239000007921 spray Substances 0.000 claims abstract description 4
- 239000012809 cooling fluid Substances 0.000 claims description 30
- 238000003754 machining Methods 0.000 claims description 27
- 238000012423 maintenance Methods 0.000 claims description 14
- 239000000110 cooling liquid Substances 0.000 abstract 3
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 43
- 241000196324 Embryophyta Species 0.000 description 26
- 238000004140 cleaning Methods 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000014509 gene expression Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Milling Processes (AREA)
- Milling, Broaching, Filing, Reaming, And Others (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Turning (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Provided is a processing apparatus having a cutter, capable of generating no detect upon the turning surface of the to-be-processed object, inhibiting the thermal expansion of the chuck working bench, and preventing the turning crumbs form being attached to to-be-processed object. The processing apparatus comprises: a chuck working bench having a keeping surface, a turning member of the cutter for turning the to-be-processed object, and a chuck working bench moving mechanism which, in the processing area where the to-be-processed object is processed via the turning member, makes the chuck working bench move in a horizontal plane parallel to the keeping surface along the processing feeding direction. The turning member comprises a rotary main shaft, a cutter installing member installed at the lower end of the rotary main shaft, and a cutter arranged at a position eccentric from the rotary axle center of the cutter installing part. The processing apparatus comprises a cooling liquid feeding mechanism having a nozzle, with the nozzle spraying cooling liquid upon the turning surface of the to-be-processed object which is kept upon the chuck working bench movable within the processing area. The nozzle sprays the cooling liquid from the upstream within processing area along the rotating direction of the cutter to the downstream side.
Description
Technical field
The present invention relates to have the processing unit (plant) of cutter, said cutter is used for the turning machined object.
Background technology
Through cutter sweep etc., the semiconductor wafer that will be formed with a plurality of semiconductor chips is divided into semiconductor chip one by one, said cutting apart and semiconductor chip be widely used in electrical equipments such as mobile phone and PC.
In recent years; For make electrical equipment can miniaturization, lightweight; Develop the semiconductor chip of flip-chip by name and drop into practical; Said flip-chip constitutes: on the electrode of semiconductor chip, form the projection (バ Application プ) of 50 microns to 100 microns overshooting shape, and with this projection be formed on the electrode that assembles on the substrate and directly engage.In addition, also develop following technology and drop into practical: be called as be set up in parallel on the substrate of mediplate or range upon range of a plurality of semiconductor chip to realize miniaturization.
Yet above-mentioned each technology forms the projection (electrode) of a plurality of overshooting shapes for the surface at the substrate of semiconductor chip etc. and via the electrode of this overshooting shape substrate is engaged with each other, and must make the height of projection (electrode) of overshooting shape consistent.Consistent for the height of the projection (electrode) that makes this overshooting shape, generally adopt grinding.But if grinding projection (electrode) then can produce following problems: at projection (electrode) is to be had by gold etc. under the situation that the metal of stickiness forms to produce burr, and these burr and adjacent projection short circuit.
In addition; As the technology that on the surface of the substrate of semiconductor chip etc., forms the projection (electrode) of a plurality of overshooting shapes; There is following column-like projection block forming method: make an end heating and melting of leads such as gold and form sphere; Use ultrasonic wave that this sphere hot pressing is received on the electrode of semiconductor chip subsequently in the lump, and make the head fracture of sphere.Therefore the projection (electrode) that forms through this column-like projection block forming method is difficult to grind, so warmed-up plate is pressed on projection so that the height unanimity of projection making the palpus that produces needle-like when rupture by the head of the sphere of thermo-compressed.
Yet if warmed-up plate is pressed on projection so that the height of projection is consistent, the head that can produce projection is when being crushed and adjacent projection problem of short-circuit.Therefore, in order to eliminate the problems referred to above, be provided with the unnecessary operation of the terminal part that is used to remove projection.
In order to eliminate the problems referred to above, a kind of processing unit (plant) has been proposed, said processing unit (plant) is through cutter turning and remove the terminal part at the outstanding a plurality of electrodes that form in the surface of plate object.Processing unit (plant) with said cutter possesses: chuck table, said chuck table have the maintenance face that keeps machined object; Turning member with cutter, said cutter are used for turning and are maintained at the machined object on the said chuck table; Processing feed mechanism, said processing feed mechanism make said chuck table relatively move along the processing direction of feed in the horizontal plane parallel with said maintenance face with said turning member; The incision feed mechanism; Said incision feed mechanism makes said turning member relatively move in the incision direction of feed vertical with said maintenance face; And, the cutter that the turning member possesses rotary main shaft, is installed in the cutter installing component of said rotary main shaft lower end and is installed in the position eccentric with respect to axis of rotation of said cutter installing component.
Patent documentation 1: TOHKEMY 2005-327838 communique
Yet there is following problem in above-mentioned patent documentation 1 disclosed processing unit (plant): the cooling adding tool setting in man-hour tool is insufficient, on the turning surface of machined object, produce damaged, thereby the quality of machined object is descended.
In addition, also have following problem: add man-hour cutter and machined object between frictional heat cause on chuck table producing slight thermal expansion, thereby reduce the machining accuracy of machined object.
In addition, also have following problem: the trickle turning through the turning machined object produces is considered to be worth doing because be attached to machined object by the fricative static between cutter and the machined object, thereby causes the quality of machined object to descend.
Summary of the invention
The present invention accomplishes just in view of the above fact; Its major technology problem is to provide a kind of processing unit (plant) with cutter; Said processing unit (plant) does not produce damaged on the turning surface of machined object; Can suppress the thermal expansion of chuck table, and can prevent that the turning bits are attached to machined object.
In order to solve above-mentioned major technique problem, the invention provides a kind of processing unit (plant) with cutter, said processing unit (plant) possesses: chuck table, said chuck table have the maintenance face that keeps machined object; Turning member with cutter, said cutter are used for turning and are held the machined object in said chuck table; And chuck workbench moving arrangement; Said chuck workbench moving arrangement makes said chuck table in the horizontal plane parallel with said maintenance face, move along the processing direction of feed in the machining area that machined object is carried out turning through said turning member; And; The cutter that said turning member possesses rotary main shaft, is installed in the cutter installing component of said rotary main shaft lower end and is installed in the position eccentric with respect to axis of rotation of said cutter installing component; Said processing unit (plant) is characterised in that; Said processing unit (plant) possesses the cooling fluid supply member with nozzle; Said nozzle is to the turning surface ejection cooling fluid that is held the machined object on the said chuck table that in said machining area, moves, and the upstream side of said nozzle direction of rotation from said machining area, said cutter side downstream sprays cooling fluid.
Processing unit (plant) of the present invention constitutes: possess the cooling fluid supply member with nozzle; Wherein said nozzle is to the turning surface ejection cooling fluid that is held the machined object on the chuck table that in machining area, moves; And the upstream side of said nozzle direction of rotation from machining area, cutter side ejection downstream cooling fluid; Therefore cooling fluid is fed on the grinding face and cutter of machined object; Cutter is cooled off fully thus, thereby on the turning surface of machined object, can not produce damaged.In addition because the turning surface of machined object also is cooled, so chuck table can not be heated, thereby can prevent because the reduction of the machining accuracy that causes of chuck table thermal expansion.In addition, because the side ejection downstream of the upstream side of cooling fluid direction of rotation from the machining area of cutter, cutter is non-cohesive on turning surface so trickle turning bits are rinsed out by the turning surface from machined object.In addition, because the side ejection downstream of the upstream side of cooling fluid direction of rotation from the machining area of cutter, cutter so the resistance of the water that cutter bears alleviates, therefore can not produce little vibration on cutter.In addition, carry out wet type processing,, can prevent that therefore the turning bits are attached on the machined object so be difficult to produce static owing to supply with cooling fluid to the machining area of cutter.
Description of drawings
Fig. 1 is the stereogram of the processing unit (plant) that possesses cutter of formation according to the present invention.
Fig. 2 is mounted in the stereogram of the turning unit on the processing unit (plant) shown in Figure 1.
Fig. 3 is that expression is installed in chuck table mechanism and the stereogram of chuck workbench moving arrangement on the processing unit (plant) with cutter shown in Figure 1.
Fig. 4 is expression from the cooling fluid of the nozzle ejection that is installed in the cooling fluid supply member on the processing unit (plant) shown in Figure 1 and is used for carrying out the key diagram of the relation between the cutter of turning to remaining on machined object on the chuck table.
Fig. 5 is as the vertical view of the semiconductor wafer of machined object and major part enlarged drawing.
Fig. 6 is the key diagram of the turning operation of being undertaken by the processing unit (plant) with cutter shown in Figure 1.
Fig. 7 is the state of turning has been carried out in expression to the projection (electrode) that is formed at semiconductor chip through the processing unit (plant) with a cutter shown in Figure 1 key diagram.
Label declaration
2: device case; 3: the grinding unit; 31: mobile foundation; 32: main axle unit; 321: the main shaft housing; 322: rotary main shaft; 323: servomotor; 324: the instrument installing component; 33: cutter; 331: cutter body; 332: cutting edge; 4: turning unit feed mechanism; 44: pulse motor; 5: chuck table mechanism; 51: supporting base; 52: chuck table; 53: servomotor; 54: cover; 56: chuck workbench moving arrangement; 57,58: corrugated member; 6: the cooling fluid supply member; 61: nozzle; 11: the first boxes; 12: the second boxes; 13: the interim placement member of machined object; 14: cleaning element; 15: machined object conveyance member; 16: machined object is moved into member; 17: machined object is taken out of member; 10: semiconductor wafer; 110: semiconductor chip; 120: projection (electrode); 130: battery lead plate.
The specific embodiment
Below, with reference to accompanying drawing the preferred implementation of the processing unit (plant) with cutter of formation according to the present invention is carried out detailed explanation.
Fig. 1 representes the stereogram of the processing unit (plant) that possesses cutter of formation according to the present invention.
Processing unit (plant) in the illustrated embodiment possesses whole device case with label 2 expressions.Device case 2 have elongated extension rectangular shape main part 21 and be arranged on the rearward end (upper right side among Fig. 1) of said main part 21 and the upstanding wall 22 that extends to the top.At the front surface of upstanding wall 22, be provided with the pair of guide rails 221,221 of extending to above-below direction.On this pair of guide rails 221,221, so that the turning unit 3 as the turning member can be installed in the mode that above-below direction moves.
Turning unit 3 possesses mobile foundation 31 and the main axle unit 32 that is installed on said mobile foundation 31.Be provided with a pair of shank 311,311 that extends to above-below direction in the back surperficial both sides of mobile foundation 31; Be formed with at this a pair of shank 311,311 and be directed groove 312,312, the said groove 312,312 that is directed slidably engages with above-mentioned pair of guide rails 221,221.Front surface slidably being installed in the mobile foundation 31 on the pair of guide rails 221,221 that is arranged at upstanding wall 22 like this is equipped with support unit 313, at this support unit 313 main axle unit 32 is installed.
At this,, the construct for handling of cutter 33 with respect to cutter installing component 324 described with reference to Fig. 2.
On cutter installing component 324; Part at the peripheral part eccentric with respect to axis of rotation is provided with the cutter installing hole 324a that connects above-below direction, and is provided with the internal thread hole 324b that arrives cutter installing hole 324a from the outer peripheral face corresponding with this cutter installing hole 324a.Cutter 33 is inserted among the cutter installing hole 324a of cutter installing component 324 of such formation, and fastening bolt 35 is screwed together in internal thread hole 324b and tightens, cutter 33 is installed on cutter installing component 324 with mode removably thus.In addition, in the illustrated embodiment, the cutter 33 that is adopted is by constituting with the lower part: cutter body 331, and it is bar-shaped that it utilizes tool steel such as superhard alloy to form, and the cross section is a rectangle; And cutting edge 332, it is arranged on the terminal part of said cutter body 331, and is formed by diamond etc.Constitute like this, be installed in the cutter 33 on the cutter installing component 324, through the rotation of above-mentioned rotary main shaft 322 with after rotate in the parallel face of the maintenance face of maintenance machined object of the chuck table stated.
Return Fig. 1 and proceed explanation; Processing unit (plant) in the illustrated embodiment has turning unit feed mechanism 4, said turning unit feed mechanism 4 make above-mentioned turning unit 3 along above-mentioned pair of guide rails 221,221 above-below direction (with after the vertical direction of maintenance face of the chuck table stated) move.This turning unit feed mechanism 4 possesses front side that is provided in upstanding wall 22 and the external thread rod 41 that extends to above-below direction.The upper end of this external thread rod 41 and bottom through be installed on the upstanding wall 22 shaft supporting part 42 and 43 and by with can free rotation mode supporting.On the shaft supporting part 42 of upside, be equipped with pulse motor 44, the output shaft of this pulse motor 44 and external thread rod 41 transmissions binding as the drive source that is used to drive external thread rod 41 rotations.Also be formed with from the rearward outstanding linking part (not shown) of the central portion of its width on the back surface of mobile foundation 31, be formed with the perforation internal thread hole that extends to above-below direction at this linking part, above-mentioned external thread rod 41 screws togather with this internal thread hole.Therefore, if pulse motor 44 is just changeing, then mobile foundation 31 and the turning unit 3 that is installed on mobile foundation 31 descend and promptly advance; If pulse motor 44 counter-rotating, then mobile foundation 31 and the turning unit 3 that is installed on mobile foundation 31 rise and promptly retreat.
Proceed explanation with reference to Fig. 1 and Fig. 3, on the main part 21 of housing 2 latter half of, be formed with the operations portion 211 that shape is roughly rectangle, be equipped with chuck table mechanism 5 in this operations portion 211.As shown in Figure 3, chuck table mechanism 5 comprises supporting base 51 and is equipped on the chuck table 52 of this supporting base 51.Supporting base 51 carries with the mode that can be free to slide to be put on pair of guide rails 23,23; Said pair of guide rails 23,23 is that the direction shown in arrow 23a and the 23b is extended at above-mentioned operations portion's 211 upper edge fore-and-aft directions (direction vertical with the front surface of upstanding wall 22); And said supporting base 51 through after the chuck workbench moving arrangement 56 stated between 24 (positions among Fig. 3 shown in the solid line), zone and machining area 25 (position among Fig. 3 shown in the double dot dash line) are moved into/taken out of to machined object shown in Figure 1, move, said machining area 25 is relative with the cutter 33 of the above-mentioned main axle unit 32 of formation.
Above-mentioned chuck table 52 comprises: chuck table main body 521, and it is cylindric that it utilizes stainless steel and other metal materials to form; And absorption chuck 522, it is equipped on the upper surface of said chuck table main body 521.Absorption chuck 522 is made up of the suitable porous material of for example porous ceramics and so on, and is connected with not shown attraction member.Therefore, be communicated to not shown attraction member with selectable mode, come attracting maintenance as the machined object on the maintenance face of upper surface carrying to put through adsorbing chuck 522.In addition, illustrated chuck table mechanism 5 has with the cover 54 that can set with the modes that supporting base 51 moves jointly, and said cover 54 has the chuck table 52 of confession to be run through the hole of insertion and cover above-mentioned supporting base 51 etc.
Proceed explanation with reference to Fig. 3; Processing unit (plant) in the illustrated embodiment possesses chuck workbench moving arrangement 56, this chuck workbench moving arrangement 56 make above-mentioned chuck table mechanism 5 along pair of guide rails 23 to shown in arrow 23a and the 23b direction move.Chuck workbench moving arrangement 56 possesses: be provided in pair of guide rails 23, external thread rod 561 between 23, that extend abreast with guide rail 23,23; And the servomotor 562 that drives these external thread rod 561 rotations.External thread rod 561 screws togather with the screw 511 that is arranged at above-mentioned supporting base 51, and can free rotation mode supporting, said shaft supporting part 563 is mounted to and links pair of guide rails 23,23 terminal part of this external thread rod 561 through shaft supporting part 563 quilts.The cardinal extremity transmission of the driving shaft of servomotor 562 and external thread rod 561 links.Therefore, if servomotor 562 is just changeing, then supporting base 51 is that chuck table mechanism 5 moves to the direction shown in the arrow 23a; If servomotor 562 counter-rotatings, then supporting base 51 is that chuck table mechanism 5 moves to the direction shown in the arrow 23b.The chuck table mechanism 5 that moves to the direction shown in arrow 23a and the 23b like this is positioned among Fig. 3 the machined object shown in the solid line with selectable mode and moves into/take out of the machining area shown in zone and the double dot dash line.In addition, in the preset range of chuck workbench moving arrangement 56 in machining area on the direction shown in arrow 23a, the 23b, promptly move back and forth abreast with the maintenance face of upper surface as absorption chuck 522.
Return Fig. 1 and proceed explanation; Both sides at the moving direction of the cover 54 that constitutes above-mentioned chuck table mechanism 5; Setting up shape of cross section is the corrugated member 57 and 58 of inverse groove shape, and said corrugated member 57 and 58 covers above-mentioned pair of guide rails 23,23, external thread rod 561 and servomotor 562 etc. Corrugated member 57 and 58 can be formed by the suitable material of for example canvas and so on.The front end of corrugated member 57 is fixed on the front surface wall of operations portion 211, and the rear end of corrugated member 57 is fixed on the front end face of the cover 54 of chuck table mechanism 5.The front end of corrugated member 58 is fixed on the rear end face of the cover 54 of chuck table mechanism 5, and the rear end of corrugated member 58 is fixed on the front surface of the upstanding wall 22 of device case 2.When chuck table mechanism 5 when the direction shown in the arrow 23a moves, corrugated member 57 is upheld and corrugated member 58 is shunk; When chuck table mechanism 5 when the direction shown in the arrow 23b moves, corrugated member 57 is shunk and corrugated member 58 is upheld.
Proceed explanation with reference to Fig. 1; The processing unit (plant) with cutter in the illustrated embodiment possesses cooling fluid supply member 6, and said cooling fluid supply member 6 is to the turning surface ejection cooling fluid that remains in the machined object on the chuck table 52 that machining area 25 moves.This cooling fluid supply member 6 is equipped on the side of the mobile route of the chuck table 52 that moves at machining area 25; And has a nozzle 61; Said nozzle 61 (for example has ejiction opening that turning surface to machined object sprays laminal cooling fluid; Horizontal 50 millimeters vertical openings of 1 millimeter), wherein said machined object is held in the chuck table that moves at machining area 25 52.As shown in Figure 4, this nozzle 61 is adapted to the upstream side side ejection downstream cooling fluid of the direction of rotation shown in the arrow 33a of the cutter 33 from machining area, and this point ten minutes is important.In addition, cooling fluid supply member 6 is supplied with pure water as cooling fluid.
Proceed explanation based on Fig. 1, on the first half of the main part 21 of device case 2, be provided with first box carry put regional 11a, second box carries and puts regional 12a, the interim put area 13a of machined object and clean regional 14a.Carry at first box and to put regional 11a and carry first box 11 of machined object that is equipped with before accommodating processing, carry at second box and put second box 12 that regional 12a carries the machined object that is equipped with after accommodating processing.Be equipped with the interim placement member 13 of machined object at the interim put area 13a of above-mentioned machined object, the interim placement member of said machined object 13 is interim to be placed from carrying the machined object before the processing that first box 11 that places first box to carry to put regional 11a takes out of.In addition, in cleaning regional 14a, be equipped with the cleaning element 14 that is used to clean the machined object after the processing.
Carry at above-mentioned first box and to put regional 11a and second box and carry to put and be equipped with machined object conveyance member 15 between the regional 12a; The machined objects that this machined object conveyance member 15 will be accommodated in before the processing of carrying in first box 11 place first box to carry to put regional 11a take out of the interim placement member 13 of machined object, and will utilize machined object conveyance after the processing that cleaning element 14 cleaned to second box 12 that year places second box to carry to put regional 12a.Move into/take out of at the interim put area 13a of above-mentioned machined object and the machined object of moving into, take out of machined object and dispose machined object between the zone 24 and move into member 16, this machined object is moved into member 16 will carry machined object conveyance before the processing that places the interim placement member 13 of machined object to the chuck table 52 of the chuck table mechanism 5 that is positioned machined object and moves into/take out of zone 24.Move into/take out of between zone 24 and the cleaning part 14a at the above-mentioned machined object of moving into, take out of machined object and be equipped with machined object and take out of member 17, this machined object is taken out of member 17 will carry the machined object conveyance of putting after the processing that is positioned machined object and moves into/take out of on the chuck table 52 in zone 24 to cleaning element 14.
The preceding machined object of processing that is contained in above-mentioned first box 11 is made up of the semiconductor wafer that is formed with a plurality of semiconductor chips 110 10 shown in Fig. 5 (a) with being clathrate on the surface.On the surface of a plurality of semiconductor chips 110 that are formed at semiconductor wafer 10, be formed with a plurality of column-like projection blocks (electrode) 120 respectively.This column-like projection block (electrode) 120 for example shown in Fig. 5 (b) through with the gold thread heating and melting and be installed on the battery lead plate 130 that constitutes by for example aluminium etc. and form, wherein said battery lead plate 130 is formed at semiconductor chip 110.A plurality of projections (electrode) 120 that forms like this becomes the residual state that the palpus 121 of needle-like is arranged shown in Fig. 5 (b), and it is highly uneven.
The processing unit (plant) with cutter in the illustrated embodiment constitutes as stated, below mainly with reference to Fig. 1 its work is described.
Be housed in first box 11, as the semiconductor wafer 10 of the machined object before the processing through machined object conveyance member 15 knee-action and advance and retreat action and by conveyance, and carried and placed the interim placement member 13 of machined object.Carrying revolution action that the semiconductor wafer 10 place the interim placement member 13 of machined object carries out behind the centrally aligned moving into member 16 through machined object is here carried and is put on the chuck table 52 of the chuck table mechanism 5 that is positioned machined object and moves into/take out of zone 24.Carry to put to be attracted through not shown attraction member and remain on the chuck table 52 at the semiconductor wafer on the chuck table 52 10.
After semiconductor wafer 10 is attracted to remain on the chuck table 52; Make chuck workbench moving arrangement 56 (with reference to Fig. 3) work; Chuck table mechanism 5 is moved to the direction shown in the arrow 23a, thereby the chuck table 52 that will maintain semiconductor wafer 10 is positioned machining area 25.After the chuck table 52 that will maintain semiconductor wafer 10 like this is positioned machining area 25; Implement the turning operation, a plurality of column-like projection blocks (electrode) 120 that said turning operation forms the surface at the semiconductor chip that is arranged at semiconductor wafer 10 110 carry out turning so that it is highly consistent.
At first, 322 rotations of driven in rotation main shaft, thus make the rotary speed rotation of direction shown in the arrow 33a of cutter installing component 324 in Fig. 6 that cutter 33 is installed with for example 6000rpm.Subsequently, turning unit 3 is descended, the cutting into position that cutter 33 is positioned to be scheduled to.Next; Be under twenties microns the situation, the chuck table 52 that maintains semiconductor wafer 10 to be moved shown in arrow 23a with the for example feed speed of 2 mm/second to right-hand from the position shown in the solid line Fig. 6 at the turning width of the cutting edge 332 of for example cutter 33.Consequently, utilizing the cutting edge 332 of the cutter 33 that is accompanied by the rotation of rotary main shaft 322 and rotates, is pruned in the upper end of a plurality of column-like projection blocks (electrode) 120 that form on the surface of the semiconductor chip that is arranged at semiconductor wafer 10 110.Subsequently; Shown in the double dot dash line among Fig. 6; The center that remains in the semiconductor wafer 10 of chuck table 52 moves to the center of cutter installing component 324; Thus, a plurality of column-like projection blocks (electrode) 120 that form on the surface of the semiconductor chip that is arranged at semiconductor wafer 10 110 all are removed its terminal part through turning as illustrated in fig. 7, thereby make highly consistent (turning operation).
In above-mentioned turning operation, make 6 work of cooling fluid supply member, from the upstream side side ejection downstream cooling fluid of the direction of rotation shown in from the machining area of cutter 33, cutter 33 the as illustrated in fig. 4 arrow 33a of nozzle 61.In addition, the supply of cooling fluid is set to 2 liters of per minutes in the illustrated embodiment.Consequently, because supply with cooling fluid to the turning surface and the cutter 33 of semiconductor wafer 10, thus the cooling fully of cutter 33 quilts, thus on the turning surface of semiconductor wafer 10, can not produce damaged.In addition because the turning surface of semiconductor wafer 10 also is cooled, so chuck table 52 can not be heated, thereby can prevent because the reduction of the machining accuracy that causes of chuck table 52 thermal expansions.In addition, because the side ejection downstream of the upstream side of the direction of rotation shown in the cooling fluid arrow 33a from the machining area of cutter 33, cutter 33 is non-cohesive on turning surface so trickle turning bits are rinsed out by the turning surface from semiconductor wafer 10.In addition; In the illustrated embodiment; Because the side ejection downstream of the upstream side of the direction of rotation shown in the cooling fluid arrow 33a from the machining area of cutter 33, cutter 33 so the resistance of the water that cutter 33 bears alleviates, therefore can not produce little vibration on cutter 33.
After the turning operation that a plurality of projections (electrode) 120 aforesaid, that the surface of the semiconductor chip 110 that is being arranged at semiconductor wafer 10 is formed carry out finishes, turning unit 3 is risen and stop the rotation of chuck table 52.Next, the direction shown in the arrow 23b of chuck table 52 in Fig. 1 is moved move into/take out of zone 24, and remove being kept on the chuck table 52 by the attraction of the manufactured semiconductor wafer 10 of turning so that it is positioned machined object.Subsequently, the semiconductor wafer 10 of having removed the attraction maintenance is taken out of member 17 through machined object and take out of also conveyance to cleaning element 14.To here be cleaned by the semiconductor wafer 10 of conveyance to cleaning element 14.Take in to the precalculated position of second box 12 through machined object conveyance member 15 utilizing the semiconductor wafer 10 after cleaning element 14 cleans.
Claims (1)
1. processing unit (plant) with cutter, said processing unit (plant) possesses: chuck table, said chuck table have the maintenance face that keeps machined object; Turning member with cutter, said cutter are used for turning and are held the machined object in said chuck table; And chuck workbench moving arrangement; Said chuck workbench moving arrangement makes said chuck table in the horizontal plane parallel with said maintenance face, move along the processing direction of feed in the machining area that machined object is carried out turning through said turning member; And; Said turning member possesses rotary main shaft; Be installed in the cutter installing component of said rotary main shaft lower end; And the cutter that is installed in the position eccentric of said cutter installing component with respect to axis of rotation; Said processing unit (plant) is characterised in that
Said processing unit (plant) possesses the cooling fluid supply member with nozzle, and said nozzle sprays cooling fluid to the turning surface that is held the machined object on the said chuck table that in said machining area, moves,
The upstream side of said nozzle direction of rotation from said machining area, said cutter side ejection downstream cooling fluid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010165699A JP2012024885A (en) | 2010-07-23 | 2010-07-23 | Working device with cutting tool |
| JP2010-165699 | 2010-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102343443A true CN102343443A (en) | 2012-02-08 |
Family
ID=45542719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102040620A Pending CN102343443A (en) | 2010-07-23 | 2011-07-20 | Processing apparatus having cutter |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2012024885A (en) |
| KR (1) | KR20120010194A (en) |
| CN (1) | CN102343443A (en) |
| TW (1) | TW201209902A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481459B (en) * | 2012-07-20 | 2015-04-21 | Hon Hai Prec Ind Co Ltd | Workpiece having a non-revolution curved surface |
| CN105023870A (en) * | 2014-04-25 | 2015-11-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Wafer positioning mechanism |
| CN109382766A (en) * | 2017-08-10 | 2019-02-26 | 株式会社迪思科 | Processing unit (plant) |
| CN109560015A (en) * | 2017-09-27 | 2019-04-02 | 东和株式会社 | Processing unit (plant) |
| CN114178780A (en) * | 2020-09-15 | 2022-03-15 | 三菱重工压缩机有限公司 | Method for manufacturing machine room |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5881480B2 (en) * | 2012-03-07 | 2016-03-09 | 株式会社ディスコ | Tool cutting method |
| JP5945182B2 (en) * | 2012-07-23 | 2016-07-05 | 株式会社ディスコ | Tool for cutting tools |
| JP5921373B2 (en) * | 2012-07-27 | 2016-05-24 | 株式会社ディスコ | Tool for cutting tools |
| JP6403601B2 (en) * | 2015-02-16 | 2018-10-10 | 株式会社ディスコ | Processing equipment |
| CN108817504A (en) * | 2018-07-13 | 2018-11-16 | 芜湖若科自动化科技有限公司 | It is a kind of convenient for cooling aluminium section bar cutter device |
| JP7519759B2 (en) * | 2019-02-25 | 2024-07-22 | 株式会社ディスコ | Processing method |
| TW202126408A (en) | 2020-01-02 | 2021-07-16 | 財團法人工業技術研究院 | Burr trimming device |
| CN114985806B (en) * | 2022-08-01 | 2022-10-28 | 江苏伦肯智能科技有限公司 | Unloading washs milling machine of integration |
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- 2011-07-20 CN CN2011102040620A patent/CN102343443A/en active Pending
- 2011-07-21 KR KR1020110072600A patent/KR20120010194A/en not_active Application Discontinuation
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| JPH0425309A (en) * | 1990-05-18 | 1992-01-29 | Genichi Sato | Cutting method and device therefore |
| CN1491773A (en) * | 1996-02-15 | 2004-04-28 | 株式会社泽塔平和 | Device for separating and recovering cooling liquid in cutting machine tool and grinder |
| JP2000094267A (en) * | 1998-09-21 | 2000-04-04 | Enshu Ltd | Machining system in nitrogen gas atmosphere |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481459B (en) * | 2012-07-20 | 2015-04-21 | Hon Hai Prec Ind Co Ltd | Workpiece having a non-revolution curved surface |
| CN105023870A (en) * | 2014-04-25 | 2015-11-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Wafer positioning mechanism |
| CN105023870B (en) * | 2014-04-25 | 2017-12-01 | 中国科学院苏州纳米技术与纳米仿生研究所 | Wafer orientation mechanism |
| CN109382766A (en) * | 2017-08-10 | 2019-02-26 | 株式会社迪思科 | Processing unit (plant) |
| CN109560015A (en) * | 2017-09-27 | 2019-04-02 | 东和株式会社 | Processing unit (plant) |
| CN109560015B (en) * | 2017-09-27 | 2023-06-02 | 东和株式会社 | Processing device |
| CN114178780A (en) * | 2020-09-15 | 2022-03-15 | 三菱重工压缩机有限公司 | Method for manufacturing machine room |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120010194A (en) | 2012-02-02 |
| JP2012024885A (en) | 2012-02-09 |
| TW201209902A (en) | 2012-03-01 |
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Application publication date: 20120208 |