201209902 六、發明說明： L 明戶斤屬^^ j 技術領域 本發明係有關於一種具有用以旋削被加工物之切削工 具之加工裝置。 背景技術 業已形成複數個半導體晶片之半導體晶圓係藉由切塊 裝置專而分割成各個半導體晶片’且該業經分割之半導體 晶片係廣泛地運用在行動電話或個人電腦等之電子儀器。 近年來，為了可作成電子儀器之輕量化、小型化，開 發一種稱作倒裝晶片之半導體晶片並供實用，其係作成於 半導體晶片之電極形成5〇μιη至ι〇0μπι之突起狀凸塊，並將 該凸塊直接接合於業已形成於安裝基板之電極。又，亦開 發以下技術並實用化’ gp :於被稱作中介層之基板上同時 地設置或積層複數半導體晶片而達成小型化者。 然而，前述各技術係於半導體晶片等之基板之表面形 成複數個突起狀之凸塊（電極），並透過該突之電極接合 基板彼此’因此’必須使突起狀凸塊（電極）之高度一致。為 了 m起狀凸塊（電極)之高度__致，—般會運用研磨。然 而’右研磨凸塊(電極），則在凸塊(電極)鋪由金等有黏性 之金屬來形成時會產生毛邊，並有該毛邊與鄰接之凸塊(電 極)短路之問題。 又，於半導體晶片等之基板之表面形成複數個突起狀 201209902 凸塊（電極)之技術係包括以下柱形凸塊形歧，即：將金等 之金屬線之前端加熱熔融而形成球體後，將該球體進行超 音波併用熱壓接於半導體晶片之電極，並截斷球體之頭 部。藉由純形凸卿成法卿成的凸塊（電^在_業經 熱壓接之球體之頭部時會產生針狀鬚，因此，研磨困難， 並作成將業經加熱之板材抵壓於凸塊而使凸塊之高度一致。 然而，若將業經加熱之板材抵壓於凸塊而使凸塊之高 度-致，則會有在壓潰凸塊之頭部時與鄰接之凸塊短路之 問題。故，為了解決前述問題， 之額外步驟。 設置有除去凸塊之前端部 為了解決前述問題’目前揭示有一種加工裝置，且該 加工裝置係藉由切·具，旋削、除去複數個於板狀物之 表面突出而形成的電極之前端部。該具有切削工具之加工 裝置係具備：失頭台，係具有保持被加卫物之保持面者； 旋削機構，係具有用以旋削業已保持於該失頭台上之被加 工物之切削工具者；加X進給機構，係、使該夾頭台與該旋 削機構在與該保持面呈平行之水平面内朝加工進給方向相 對移動者；及切入進給機構，係使該旋削機構相對於該保 持面朝垂直之切入進給方向移動者；又，旋削機構係具備： 旋轉心軸；切削工具裝設構件，係裝設於該旋轉心軸下端 者；及切削工具，係於該切削工具裝設構件上裝設在自旋 轉軸芯偏芯之位置者(例如參照專利文獻1)。 先行技術文獻 專利文獻 ⑧ 4 201209902 〔專利文獻1〕日本專利公開公報特開2005-327838號 公報 【發明内容】 發明概要 發明欲解決之課題 又，前述專利文獻1中所揭示之加工裝置於加工時的切 削工具之冷卻不足，且於被加工物之旋削面產生馨痕而有 被加工物之品質降低之問題。 又，藉由加工時的切削工具與被加工物之摩擦熱，於 夾頭台會產生些微之熱膨脹而有被加工物之加工精度降低 之問題。 再者，起因於藉由切削工具與被加工物之摩擦所產生 的靜電，藉由被加工物之旋削而生成的微細旋削屑係附著 於被加工物，並有使品質降低之問題。 本發明係有鑑於前述情形，其主要之技術課題在提供 一種具有切削工具之加工裝置，且該具有切削工具之加工 裝置不會在被加工物之旋削面產生馨痕，並可抑制夾頭台 之熱膨脹，同時可防止旋削屑附著於被加工物。 用以欲解決課題之手段 為了解決前述主要之技術課題，若藉由本發明，則可 提供一種具有切削工具之加工裝置，且該具有切削工具之 加工裝置係具備：夾頭台，係具有保持被加工物之保持面 者；旋削機構，係具有用以旋削業已保持於該夾頭台上之 被加工物的切削工具者；及夾頭台移動機構，係於藉由該 201209902 旋削機構旋削被加工物之加工領域中，使該夾頭台在與該 保持面呈平行之水平面内朝加工進給方向移動者；又，該 旋削機構係具備：旋轉心軸；切削工具裝設構件，係裝設 於該旋轉心軸下端者；及切削工具，係於該切削工具裝設 構件上裝設在自旋轉軸芯偏芯之位置者；並且，該具有切 削工具之加工裝置具備冷卻水供給機構，且該冷卻水供給 機構係具有喷出喷嘴，而該喷出喷嘴係向業已保持於在該 加工領域中移動的該夾頭台上之被加工物之旋削面喷出冷 卻水，且該喷出喷嘴係自該加工領域中的該切削工具之旋 轉方向上游側，朝下游側喷出冷卻水。 發明效果 由於依據本發明之加工裝置係構成為具備冷卻水供給 機構，且該冷卻水供給機構係具有喷出喷嘴，而該喷出喷 嘴係向業已保持於在加工領域中移動的夾頭台上之被加工 物之旋削面喷出冷卻水，且該喷出喷嘴係自加工領域中的 切削工具之旋轉方向上游側，朝下游側喷出冷卻水，因此， 冷卻水係供給至被加工物之研磨面及切削工具，故，切削 工具可充分地冷卻，且不會在被加工物之旋削面產生鑿 痕。又，由於亦可冷卻被加工物之旋削面，因此，夾頭台 不會被加熱，且可防止因夾頭台熱膨脹而產生的加工精度 之降低。再者，由於冷卻水係自利用切削工具之加工領域 中的切削工具之旋轉方向上游側朝下游側喷出，因此，微 細之旋削屑係自被加工物之旋削面洗去，且不會附著於旋 削面。又，由於冷卻水係自利用切削工具之加工領域中的 ⑧ 6 201209902 切削工具之旋轉方向上游側朝下游側喷出，因此，可減輕 賦予切削工具之水之阻力，故，於切削工具不會產生微振 動。再者，由於冷卻水係供給至利用切削工具之加工領域， 並進行濕式加工，因此，不易產生靜電，故，可防止旋削 屑附著於被加工物。 圖式簡單說明 第1圖係依據本發明所構成具有切削工具之加工裝置 之立體圖。 第2圖係裝備於第1圖所示之加工裝置的旋削單元之立 體圖。 第3圖係顯示裝備於第1圖所示具有切削工具之加工裝 置的夾頭台機構及夾頭台移動機構之透視圖。 第4圖係顯示喷出自裝備於第1圖所示之加工裝置的冷 卻水供給機構之喷出喷嘴的冷卻水與用以旋削業已保持於 夾頭台上之被加工物的切削工具之關係說明圖。 第5(a)、5(b)圖係作為被加工物的半導體晶圓之平面圖 及主要部分放大圖。 第6圖係利用第1圖所示具有切削工具之加工裝置的旋 削步驟說明圖。 第7圖係顯示藉由第1圖所示具有切削工具之加工裝置 旋削業已形成於半導體晶片之凸塊（電極）的狀態之說明圖。 C實施方式;1 用以實施發明之形態 以下，參照附圖，詳細地說明依據本發明所構成具有 201209902 切削刀之加工裝置之較佳實施形態。 第1圖係顯示依據本發明所構成具有切削工具之加工 裝置之立體圖。 於圖示之實施形態中的加工裝置係具備全體以編號2 來表不之裝置外殼。裝置外殼2係具有：主部21，係細長地 延展且呈長方體形狀者 ;及直立壁22，係設置於該主部21 之後端部（於第1圖中右上端），並朝上方延伸者。於直立壁 22之前面設置有一對朝上下方向延伸之導軌221、221，且 於對導軌22卜221上，作為旋削機構的旋削單元3係裝 設成可朝上下方向移動。 旋削單元3係具備移動基台31及裝設於該移動基台31 之G轴單元3 2。移動基台31係於後面兩側設置一對朝上下 方向延伸之腳部311、311，且於該一對腳部311、311形成 與前述一對導軌221、221卡合成可滑動之被導引溝312、 312。於依此裝設在一對設置於直立壁22之導執22卜221上 且可滑動的移動基台31之前面，裝設有支持構件313，且於 該支持構件313安裝心軸單元32。 心軸單元32係具備：心軸外殼321，係裝設於支持構件 313者；旋轉心軸322，係配設於該心軸外殼321且可自由旋 轉者；及伺服馬達323，係作為用以旋轉驅動該旋轉心軸322 之驅動源者。旋轉心軸322之下端部係越過心軸外殼321之 下端而朝下方突出，且於其下端設置有圓板形狀之切削工 具裝設構件324。另，於切削工具裝設構件324上，切削工 具33係裝設成可裝卸。 ⑧ 8 201209902 在此，參照第2圖，說明切削工具33於切削工具裝設構 件324上之裝卸構造。 於切削工具裝設構件324上，在自旋轉軸芯偏芯之外周 部之一部分，設置朝上下方向貫通之切削刀安裝孔32知， 同時自與該切削刀安襄孔324a對應之外周面，設置通達士刀 削刀安裝孔324a之内螺紋孔324b。於依此所構成的切削工 具裝設構件324之切削刀安裝孔324a插入切削工具33，並將 緊締螺栓35螺合於内螺紋孔32仆而緊締，藉此，切削工具 33係裝設於切削工具裝設構件324上且可裝卸。另，於圖示 之實施形態中，切削工具33係使用藉由以下所構成者，即. 切削刀本體331，係藉由超硬合金等之工具鋼形成為棒狀且 截面呈矩形者；及切刀332’係藉由設置於該切削刀本體33ι 之前端部之鑽石等所形成者。依此所構成且裝設於切削工 具裝設構件3 24之切削工具3 3係藉由使前述旋轉心軸3 22旋 轉，而在與後述夾頭台保持被加工物之保持面呈平行之面 内旋轉。 回到第1圖繼續說明，於圖示之實施形態中的加工裝置 係/、有％肖]單元進給機構4 ,且該旋削單元進給機構4係使 刖述鉍肖I單元3沿著前述一對導軌22丨、221朝上下方向（與 後述央頭台之保持面呈垂直之方向）移動。該旋削單元進給 機構4係具備外觀桿彳丨，且該外螺紋桿*丨係配設於直立壁 22之刖側’並朝上下方向延伸。該外螺紋桿μ係其上端部 及下端β藉&業已安裝於直立壁22之轴承構件42及43支持 為可自由旋轉。於上側之軸承構件42配設有脈衝馬達44， 9 201209902 且該脈衝馬達44係作為用 源，又，麵恢 :=:r㈣形成自其寬度：= 出之連結部（未圖示），且於該連結部形成朝上下方向延伸之 貫通内軌孔，並㈣述㈣紋桿41螺合於勒螺紋孔。 故，右脈衝馬達44正轉’則移動基台Η及裝設於移動基台 31之U早703會下降’即’前進，若脈衝馬達44逆轉，則 移動基台31及裝設於軸基㈣讀料元3會上升，即， 後退。 參照第1及3圖繼續說明，於外殼2之主部21之後半部 上，形成略呈矩形狀之加工作業部211，且於該加工作業部 2U配設有夾頭台機構5。如第3圖所示，夾頭台機構5係包 含有支持基台51及配設於該支持基台51之夹頭找。支持 基台51係載置於-對在前述加王作#部211上朝屬於前後 方向（與直立壁22之前面呈垂直之方向）的箭頭記號仏及 23b所不之方向延展的導軌23、23上，且可自由滑動並藉 由後述夾頭台移動機構56，於第丨圖所示之被加 工物搬入· 搬出領域24(第3圖中以實線所示之位置），以及與構成前述 〜軸單元32之切削工具33相對向之加工領域25(第3圖中以 2點鏈線所示之位置）間移動。 則述夾頭台52係由以下所構成，即：夾頭台本體521， 係藉由不鏽鋼等之金屬材形成為圓柱狀者 ，·及吸附夾頭 522係配設於該夾頭台本體521之上面者。吸附夾頭522係 由像是多孔質陶瓷般適當之多孔性材料所構成，並與未圖 201209902 示之吸引機構連通。故，藉由使吸附夾頭522選擇性地與未 圖示之吸引機構連通，吸引保持業已載置於屬於上面的保 持面上之被加工物。另，圖示之夾頭台機構5係具有外罩構 件54，且該外罩構件54係具有插通夾頭台52之孔，並覆蓋 前述支持基台51等，且配設成可與支持基台51 一同移動。 參照第3圖繼續說明，於圖示之實施形態中的加工裝置 係具備夾頭台移動機構56，且該夾頭台移動機構56係使前 述夾頭台機構5沿著一對導執2 3朝箭頭記號2 3 a及2 3 b所示 之方向移動。夾頭台移動機構56係具備：外螺紋桿561，係 配設於一對導軌23、23間，並與導軌23、23呈平行地延伸 者；及伺服馬達562，係旋轉驅動該外螺紋桿561者。外螺 紋桿561係與設置於前述支持基台51之螺紋孔5丨1螺合，且 其前端部係藉由業已安裝成連結一對導軌23、23之軸承構 件563支持為可自由旋轉。伺服馬達562係其驅動軸與外螺 紋桿561之基端傳動連結。故，若伺服馬達562正轉，則支 持基台51，即，夾頭台機構5會朝箭頭記號23&所示之方向 移動，若伺服馬達562逆轉，則支持基台5卜即，夾頭台機 構5會朝箭頭記號23b所示之方向移動。依此朝箭頭記號^ 及23b所示之方向移動的夾頭台機構5係選擇性地定位在第 3圖中以實線所示之被加工物搬入.搬出領域，以及以2點 ::所示之加工領域…夹頭台移動機構56係於加工領 5中，在預定範圍朝箭頭記號23a&23b所示之方向，艮 〇屬於吸附夾頭522之上面的保持面呈平行地往復動作 回到第旧繼續說明’於構成前述夹頭台機斯之外罩 201209902 構件54之移動方向兩側，附設有橫截面形狀呈倒槽形狀且 覆蓋前述一對導轨23、23或外螺紋桿561及伺服馬達562等 之風箱機構57及58。風箱機構57及58可由像是帆布般適當 之材料來形成。風箱機構57之前端係固定於加工作業部211 之前面壁，後端則固定於夾頭台機構5之外罩構件54之前端 面。風箱機構58之前端係固定於夾頭台機構5之外罩構件54 之後端面，後端則固定於裝置外殼2之直立壁22之前面。冑 夾頭台機構5朝箭頭記號23a所示之方向移動時，風箱機構 57會伸張且風箱機構58會收縮，當夾頭台機構5朝箭頭記號 23b所示之方向移動時，風箱機構57會收縮且風箱機構58會 伸張》 參照第1圖繼續說明，於圖示之實施形態中具有切削工 具之加工裝置係具備冷卻水供給機構6 ’且該冷卻水供給機 構6係於業已保持於在加工領域25中移動的夾頭台52上之 被加工物之旋削面噴出冷卻水。該冷卻水供給機構6係配設 於在加工領域25中移動的炎頭台52之移動路徑之側邊，並 具有喷出噴嘴61，且該喷出喷嘴61係具有於業已保持於在 加工領域25中移動的夾頭台52上之被加工物之旋削面喷出 薄板狀冷卻水之噴出口（例如橫寬為50mm且縱寬為1 mm之 開口）。如第4圖所示，重要的是該喷出喷嘴61係配設成自 加工領域中的切削工具33以箭頭記號33a所示之旋轉方向 上游側朝下游側嘴出冷卻水。另，冷卻水供給機構6係供給 純水作為冷卻水。 根據第1圖繼續說明，於裝置外殼2之主部21之刖半部 12 ⑧ 201209902 上’設置有第1卡匣載置領域lla、第2卡匣載置領域12a、 被加工物暫置領域13 a及洗淨領域14a。收納加工前之被加 工物的第1卡匣11係載置於第1卡匣載置領域lla，收納加工 後之被加工物的第2卡匣12則載置於第2卡匣載置領域 12a。於前述被加工物暫置領域13a配設有被加工物暫置機 構13，且該被加工物暫置機構13係暫置業已自載置於第1卡 匣載置領域lla之第1卡匣11搬出的加工前之被加工物。 又’於洗淨領域14a配設有洗淨機構14，且該洗淨機構14係 洗淨加工後之被加工物。 於前述第1卡匣載置領域lla與第2卡匣載置領域12a間 配設有被加工物搬送機構15 ’且該被加工物搬送機構μ係 將收納於被載置在第1卡匣載置領域lla之第1卡内的 加工前之被加工物，搬出至被加工物暫置機構13，同時將 業已藉由洗淨機構14洗淨的加工後之被加工物，搬送至被 載置於第2卡匣載置領域12a之第2卡匣12。於前述被加工物 暫置領域13a與被加工物之被加工物搬入.搬出領域24間配 設有被加工物搬入機構16，且該被加工物搬入機構16係將 載置於被加工物暫置機構13的加工前之被加工物，搬送至 業已定位在被加工物搬入.搬出領域24的夾頭台機構5之失 頭台52上。於前述被加工物之被加工物搬入.搬出領域24 與洗淨部14a間配設有被加工物搬出機構17,且該被加工物 搬出機構17係將載置於業已定位在被加工物搬入.搬出領 域24之夾頭台52上的加工後之被加工物，搬送至洗淨機構14。 如第5(a)圖所示’收納於前述第1卡匣u的加工前之被 13 201209902 加工物係由複數個半導體晶片110於表面形成為格子狀之 半導體晶圓10所構成。於複數個業已形成於半導體晶圓10 的半導體晶片110之表面分別形成複數個柱形凸塊（電 極）120。舉例言之，如第5(b)圖所示，該柱形凸塊（電極）120 係將金線加熱熔融而裝設於業已形成於半導體晶片11 〇且 由例如鋁等所構成的電極板130上。如第5(b)圖所示，依此 作成而形成的複數個柱形凸塊（電極）120會構成殘留有針狀 鬚121之狀態，同時其高度具有誤差。 收納有如前述被加工物之第1卡匣11係載置於裝置外 殼2之第1卡匣載置領域lla。又’若搬出所有收納於被載置 在第1卡匣載置領域11a之第1卡匣11的加工前之被加工 物，則取代空卡匣11，收納有複數個加工前之被加工物的 新卡匣11係藉由手動而載置於第1卡匣載置領域Ua。另一 方面，若預定數之加工後之被加工物搬入至被載置於穿置 外殼2之第2卡匣載置領域12a的第2卡匣12，則藉由手動搬 出前述第2卡匣12,並載置新的空第2卡匣12。 於圖示之實施形態中具有切削工具之加工裝置係忙吁 述來構成’以下，主要參照第1圖，說明其作動。 收納於第1卡匣11作為加工前之被加工物的半導體曰 圓ίο係藉由被加工物搬送機構15之上下動作及 00 搬送，並載置於被加工物暫置機構13。載置於被加 來 置機構13的半導體晶圓1 〇係在此進行定心德， ㈢由被加工 物搬 物搬入機構16之旋繞動作，載置於被定位在被力 入 栽置 於失頭 搬出領域24的夾頭台機構5之夾頭台52上 14 201209902 台52上的半導體晶圓10係藉由未圖示之吸引機構，吸引保 持於夾頭台52上。 若業已將半導體晶圓10吸引保持於夾頭台52上，則使 夾頭台移動機構5 6 (參照第3圖）作動而將夾頭台機構5朝箭 頭記號23a所示之方向移動，並將保持有半導體晶圓1〇之失 頭台52定位在加工領域25。若依此作成而將保持有半導體 晶圓10之夾頭台52定位在加工領域25，則實施以下旋削步 驟，即：將複數個業已形成於被設置在半導體晶圓1〇之半導 體晶片110表面的柱形凸塊(電極）120旋削而使高度一致者。 首先，將旋轉心軸322旋轉驅動，並藉由例如6000l>pm 之旋轉速度’使業已安裝切削工具33之切削工具裝設構件 324朝第6圖中以箭頭記號33a所示之方向旋轉。又，使旋削 單元3下降’並將切削工具33定位在預定之切入位置。其 次’在例如切削工具33之切刃332之旋削寬度為20幾μιη 時，將保持有半導體晶圓1〇之夾頭台52自第6圖中以實線所 不之位置如前頭5己5虎23a所不般朝右方以例如2mm/秒之進 給速度移動。其結果，藉由伴隨著旋轉心軸322之旋轉而旋 轉的切削工具33之切刃332，削去複數個業已形成於被設置 在半導體晶圓10之半導體晶片110表面的柱形凸塊（電 極）120之上端部。又，如第6圖中以2點鏈線所示，藉由使 業已保持於夾頭台5 2上之半導體晶圓1 〇之中心移動至切削 工具裝設構件324之中心位置，如第7圖所示，複數個業已 形成於被設置在半導體晶圓10之半導體晶片11〇表面的柱 形凸塊（電極）120全部會藉由旋削而除去其前端部，且高度 15 201209902 會一致(旋削步驟）。 於前述旋削步驟中，使冷卻水供給機構6作動，I自嗔 出喷嘴61，如第4圖所示般自利用切削工具33之加工領威中 的切削工具33以箭頭記號33a所示之旋轉方向上游側’朝下 游側喷出冷卻水。另，於圖示之實施形態中，冷卻水之供 給量係設定為1分鐘為2公升。其結果，由於冷卻水係供給 至半導體晶圓1〇之旋削面及切削工具33，因此，切削工具 33可充分地冷卻’且不會在半導體晶圓1〇之旋削面產生鑿 痕。又，由於亦可冷卻半導體晶圓10之旋削面，因此，夾 頭台52不會被加熱，且可防止因夾頭台52熱膨脹而產生的 加工精度之降低。再者，由於冷卻水係自利用切削工具33 之加工領域中的切削工具33以箭頭記號33a所示之旋轉方 向上游側朝下游側喷出，因此，微細之旋削屑係自半導體 晶圓10之旋削面洗去，且不會附著於旋削面。另，於圖示 之實施形態中，由於冷卻水係自利用切削工具33之加工領 域中的切削工具33以箭頭記號33a所示之旋轉方向上游側 朝下游側喷出’因此，可減輕賦予切削工具33之水之阻力， 故，於切削工具33不會產生微振動。 如前所述’若結束複數個業已形成於被設置在半導體 晶圓10之半導體晶片110表面的凸塊（電極）120之旋削步 驟，則使旋削單元3上升，並停止夾頭台52之旋轉。其次， 將夾頭台52朝第1圖中以箭頭記號23b所示之方向移動而定 位在被加工物搬入·搬出領域24，並解除夾頭台52上業經 旋削加工的半導體晶圓1〇之吸引保持。又，業已解除吸引 ⑧ 16 201209902 保持的半導體晶圓10係藉由被加工物搬出機構17搬出，並 搬送至洗淨機構14。業已搬送至洗淨機構14的半導體晶圓 10係在此洗淨。業已藉由洗淨機構14洗淨的半導體晶圓1〇 係藉由被加工物搬送機構15，收納於第2卡匣12之預定位置。 I：圖式簡單說明3 第1圖係依據本發明所構成具有切削工具之加工裝置 之立體圖。 第2圖係裝備於第1圖所示之加工裝置的旋削單元之立 體圖。 第3圖係顯示裝備於第1圖所示具有切削工具之加工裝 置的夾頭台機構及夾頭台移動機構之透視圖。 第4圖係顯示喷出自裝備於第1圖所示之加工裝置的冷 卻水供給機構之喷出喷嘴的冷卻水與用以旋削業已保持於 夾頭台上之被加工物的切削工具之關係說明圖。 第5(a)、5(b)圖係作為被加工物的半導體晶圓之平面圖 及主要部分放大圖。 第6圖係利用第1圖所示具有切削工具之加工裝置的旋 削步驟說明圖。 第7圖係顯示藉由第1圖所示具有切削工具·之加工裝置 方疋削業已形成於半導體晶片之凸塊（電極）的狀態之說明圖。 【主要元件符號說明】 2…裝置外殼 5…夾頭台機構 3…旋削單元 6…冷卻水供給機構 4…旋削單元進給機構 1〇…半導體晶圓 17 201209902 11…第1卡匣 11a...第1卡匣載置領域 12.. .第2卡匣 12a.··第2卡匣載置領域 13.. .被加工物暫置機構 13a...被加工物暫置領域 14.. .洗淨機構 14a...洗淨領域 15.. .被加工物搬送機構 16…被加工物搬入機構 17.. .被加工物搬出機構 21.. .主部 22.. .直立壁 23，221...導軌 23a，23b，33a...箭頭記號 24.. .被加工物搬入·搬出領域 25.. .加工領域 31.. .移動基台 32…心軸單元 33…切削工具 35.. .緊締螺栓 41，561…外螺紋桿 42，43，563...軸承構件 44.. .脈衝馬達 51.. .支持基台 52.. .夾頭台 54.. .外罩構件 56.. .夾頭台移動機構 57，58...風箱機構 61.. .喷出喷嘴 110.. .半導體晶片 120…柱形凸塊(電極） 121…鬚 130.. .電極板 211.. .加工作業部 311.. .腳部 312.. .被導引溝 313.. .支持構件 321…心軸外殼 322.. .旋轉心軸 323，562…伺服馬達 324…切削工具裝設構件 324a...切削刀安裝孔 324b...内螺紋孔 331.. .切削刀本體 332.. .切刃 511.. .螺紋孔 521.. .夾頭台本體 18 201209902 522…吸附夾頭201209902 VI. Description of the Invention: L. The present invention relates to a processing apparatus having a cutting tool for turning a workpiece. Background Art A semiconductor wafer in which a plurality of semiconductor wafers have been formed is divided into individual semiconductor wafers by a dicing device, and the divided semiconductor wafers are widely used in electronic devices such as mobile phones and personal computers. In recent years, in order to reduce the weight and size of electronic devices, a semiconductor wafer called a flip chip has been developed and used for forming bumps of 5 〇 μη to 〇 〇 0 μπι in the electrodes of semiconductor wafers. And bonding the bump directly to the electrode that has been formed on the mounting substrate. Further, the following techniques have been developed and put into practical use: 'gp: A plurality of semiconductor wafers are simultaneously provided or laminated on a substrate called an interposer to achieve miniaturization. However, each of the above techniques forms a plurality of protruding bumps (electrodes) on the surface of a substrate such as a semiconductor wafer, and the electrodes are bonded to each other through the protruding electrodes. Therefore, the height of the protruding bumps (electrodes) must be made uniform. . In order to make the height of the m-shaped bump (electrode) __, the grinding is generally used. However, the 'right-grinding bump (electrode) causes burrs when the bump (electrode) is formed of a viscous metal such as gold, and has a problem that the burr is short-circuited with the adjacent bump (electrode). Further, the technique of forming a plurality of protrusion-shaped 201209902 bumps (electrodes) on the surface of a substrate such as a semiconductor wafer includes the following column-shaped bump shape, that is, after the front end of the metal wire such as gold is heated and melted to form a sphere, The sphere is ultrasonically and thermocompression bonded to the electrode of the semiconductor wafer, and the head of the sphere is cut. The bump formed by the pure shape of the convex qing cheng cheng qing qing gong (the electric ^ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The height of the bumps is uniform by the block. However, if the heated plate is pressed against the bump and the height of the bump is made, there is a short circuit with the adjacent bump when the head of the bump is crushed. Problem. Therefore, in order to solve the aforementioned problems, an additional step is provided. The front portion is provided to remove the bumps in order to solve the aforementioned problem. A processing device is currently disclosed, and the processing device is rotated, removed, and removed by a cutter. The front end of the electrode formed by the surface of the plate protrudes. The processing device with the cutting tool has: a head rest, which has a holding surface for holding the object to be reinforced; the turning mechanism is provided for the purpose of turning a cutting tool for the workpiece on the headrest; an X feeding mechanism for causing the chuck table and the turning mechanism to move relative to the machining feed direction in a horizontal plane parallel to the holding surface ; and cut in The mechanism is configured to move the turning mechanism relative to the holding surface in a vertical cutting feed direction; and the turning mechanism includes: a rotating mandrel; and a cutting tool mounting member attached to the lower end of the rotating mandrel And the cutting tool is attached to the cutting tool mounting member at the position of the eccentric core of the self-rotating shaft core (see, for example, Patent Document 1). PRIOR ART DOCUMENT Patent Document 8 4 201209902 [Patent Document 1] Japanese Patent Publication SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION The problem of the quality of the workpiece is reduced by the scent of the smear. Moreover, the frictional heat of the cutting tool and the workpiece during machining causes slight thermal expansion on the chuck table, and the machining accuracy of the workpiece is lowered. Furthermore, due to the static electricity generated by the friction between the cutting tool and the workpiece, the fine turning debris generated by the turning of the workpiece is generated. The present invention is directed to a processing apparatus having a cutting tool, and the processing apparatus having the cutting tool is not processed, in view of the foregoing circumstances. The turning surface of the object produces a scented mark, and the thermal expansion of the chuck table can be suppressed, and the turning dust can be prevented from adhering to the workpiece. The means for solving the problem is to solve the above-mentioned main technical problems, and by the present invention, Provided is a processing apparatus having a cutting tool, wherein the processing apparatus having the cutting tool comprises: a chuck table having a holding surface for holding a workpiece; and a turning mechanism having a cutting mechanism for holding the chuck table a cutting tool for the workpiece to be processed; and a chuck moving mechanism for rotating the workpiece by the 201209902 turning mechanism, so that the chuck table faces in a horizontal plane parallel to the holding surface The machining direction is moved; and the rotation mechanism is provided with: a rotating mandrel; and a cutting tool mounting member is mounted on the rotation a lower end of the mandrel; and a cutting tool attached to the cutting tool mounting member at a position of the eccentric core of the self-rotating shaft; and the processing device having the cutting tool is provided with a cooling water supply mechanism, and the cooling water The supply mechanism has a discharge nozzle that discharges cooling water to a rotary surface of the workpiece that has been held on the chuck table that moves in the processing field, and the discharge nozzle is from the nozzle On the upstream side in the rotation direction of the cutting tool in the machining field, cooling water is sprayed toward the downstream side. Advantageous Effects of Invention The processing apparatus according to the present invention is configured to include a cooling water supply mechanism having a discharge nozzle that is held on a chuck table that is moved in a processing field. Cooling water is ejected from the revolving surface of the workpiece, and the ejecting nozzle ejects cooling water toward the downstream side from the upstream side in the rotation direction of the cutting tool in the processing field, so that the cooling water is supplied to the workpiece. Since the grinding surface and the cutting tool are used, the cutting tool can be sufficiently cooled without causing a chisel on the turned surface of the workpiece. Further, since the turned surface of the workpiece can be cooled, the chuck table is not heated, and the processing accuracy due to thermal expansion of the chuck table can be prevented from being lowered. In addition, since the cooling water is ejected from the upstream side in the rotation direction of the cutting tool in the processing field of the cutting tool toward the downstream side, the fine spiral shavings are washed away from the turning surface of the workpiece and are not attached. On the turning surface. In addition, since the cooling water is ejected from the upstream side in the rotation direction of the cutting tool of the cutting tool in the field of the cutting tool, the water resistance to the cutting tool can be reduced, so that the cutting tool does not Produces microvibration. Further, since the cooling water is supplied to the processing field by the cutting tool and wet-processed, static electricity is less likely to be generated, so that it is possible to prevent the turning dust from adhering to the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a processing apparatus having a cutting tool constructed in accordance with the present invention. Fig. 2 is a perspective view of a turning unit equipped in the processing apparatus shown in Fig. 1. Fig. 3 is a perspective view showing a chuck mechanism and a chuck moving mechanism equipped with a processing apparatus having a cutting tool shown in Fig. 1. Fig. 4 is a view showing the relationship between the cooling water sprayed from the discharge nozzle of the cooling water supply mechanism of the processing apparatus shown in Fig. 1 and the cutting tool for turning the workpiece which has been held on the chuck table. Illustrating. Figs. 5(a) and 5(b) are plan views and main part enlarged views of a semiconductor wafer as a workpiece. Fig. 6 is an explanatory view showing a turning step of the processing apparatus having the cutting tool shown in Fig. 1. Fig. 7 is an explanatory view showing a state in which a projection (electrode) which has been formed on a semiconductor wafer by a processing apparatus having a cutting tool shown in Fig. 1 is turned. C. Embodiments 1 for carrying out the invention Hereinafter, a preferred embodiment of a processing apparatus having a 201209902 cutter according to the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a processing apparatus having a cutting tool constructed in accordance with the present invention. The processing apparatus in the embodiment shown in the drawings is provided with a device casing which is denoted by the whole number 2. The device casing 2 has a main portion 21 that is elongated and elongated in a rectangular parallelepiped shape, and an upright wall 22 that is disposed at an end portion of the main portion 21 (upper right end in FIG. 1) and extends upward. . A pair of guide rails 221 and 221 extending in the up-and-down direction are provided on the front surface of the upright wall 22, and the turning unit 3 as a turning mechanism is mounted on the guide rail 22 221 so as to be movable in the vertical direction. The turning unit 3 includes a moving base 31 and a G-axis unit 32 that is mounted on the moving base 31. The moving base 31 is provided with a pair of leg portions 311 and 311 extending in the up-and-down direction on the rear sides, and the pair of leg portions 311 and 311 are formed to be slidably guided with the pair of guide rails 221 and 221 Grooves 312, 312. A support member 313 is attached to the front surface of the pair of movable bases 31 which are slidably disposed on the guides 22b of the upright wall 22, and the spindle unit 32 is attached to the support member 313. The spindle unit 32 includes a spindle housing 321 that is attached to the support member 313, a rotary spindle 322 that is rotatably disposed in the spindle housing 321, and a servo motor 323 that serves as a The drive source of the rotary mandrel 322 is rotationally driven. The lower end portion of the rotating mandrel 322 protrudes downward beyond the lower end of the mandrel housing 321, and is provided with a disk-shaped cutting tool mounting member 324 at the lower end thereof. Further, on the cutting tool mounting member 324, the cutting tool 33 is attached to be detachable. 8 8 201209902 Here, the attachment and detachment structure of the cutting tool 33 on the cutting tool mounting member 324 will be described with reference to Fig. 2 . In the cutting tool mounting member 324, a cutter inserting hole 32 penetrating in the vertical direction is provided in a part of the outer peripheral portion of the eccentric core of the self-rotating shaft core, and at the same time, a peripheral surface corresponding to the cutter boring hole 324a is provided. The internally threaded hole 324b of the accessor blade mounting hole 324a is provided. The cutter attachment hole 324a of the cutting tool mounting member 324 configured as described above is inserted into the cutting tool 33, and the tightening bolt 35 is screwed to the female screw hole 32 to be tightened, whereby the cutting tool 33 is attached to the cutting tool. The tool mounting member 324 is detachable. In addition, in the embodiment shown in the drawings, the cutting tool body 331 is formed by a tool steel such as a cemented carbide, and has a rectangular cross section; The cutter 332' is formed by a diamond or the like provided at the end portion of the cutter body 33i. The cutting tool 3 3 configured to be mounted on the cutting tool mounting member 324 rotates the rotating mandrel 32 to maintain a parallel surface with respect to the holding surface of the workpiece to be described later. Rotate inside. Returning to Fig. 1, the processing device in the embodiment shown in the figure will be described, and the unit feed mechanism 4 will be provided with the unit feed mechanism 4, and the rotary unit feed mechanism 4 will be described as follows. The pair of guide rails 22A and 221 are moved in the vertical direction (the direction perpendicular to the holding surface of the headstock to be described later). The turning unit feed mechanism 4 is provided with an appearance rod 彳丨, and the externally threaded rod * is disposed on the side of the upright wall 22 and extends in the vertical direction. The externally threaded rod μ is supported by the upper end portion and the lower end β of the bearing members 42 and 43 which have been mounted on the upright wall 22 so as to be freely rotatable. The upper bearing member 42 is provided with a pulse motor 44, 9 201209902, and the pulse motor 44 is used as a source, and the surface is restored: =: r (four) is formed from its width: = the connection portion (not shown), and The connecting portion is formed with a through-hole hole extending in the vertical direction, and (4) the (four) threaded rod 41 is screwed to the threaded hole. Therefore, the right pulse motor 44 rotates forward', and the moving base Η and the U 703 installed on the moving base 31 will descend 'ie' forward. If the pulse motor 44 is reversed, the moving base 31 and the shaft base are mounted. (4) Reading material 3 will rise, that is, back. Referring to Figs. 1 and 3, a processing operation portion 211 having a substantially rectangular shape is formed on the rear half of the main portion 21 of the outer casing 2, and a chuck stage mechanism 5 is disposed in the processing operation portion 2U. As shown in Fig. 3, the chuck mechanism 5 includes a support base 51 and a chuck disposed on the support base 51. The support base 51 is placed on the guide rail 23 which is extended in the direction of the arrow mark 仏 and 23b which are in the front-rear direction (the direction perpendicular to the front surface of the upright wall 22) 23, and can be freely slid, and by the chuck moving mechanism 56, which will be described later, the workpiece loading/unloading area 24 (the position shown by the solid line in FIG. 3) shown in FIG. The cutting tool 33 of the to-axis unit 32 moves relative to the machining field 25 (the position shown by the two-dot chain line in Fig. 3). The chuck table 52 is configured such that the chuck body 521 is formed of a metal material such as stainless steel and has a cylindrical shape, and the suction chuck 522 is disposed on the chuck body 521. The above. The chuck 13 is made of a porous material such as a porous ceramic, and is in communication with a suction mechanism not shown in Fig. 201209902. Therefore, the suction chuck 522 is selectively brought into communication with a suction mechanism (not shown) to suck and hold the workpiece to be placed on the holding surface belonging to the upper surface. In addition, the illustrated chuck mechanism 5 has a cover member 54, and the cover member 54 has a hole that is inserted into the chuck base 52, covers the support base 51, and the like, and is configured to be coupled to the support base. 51 Move together. Referring to Fig. 3, the processing apparatus according to the illustrated embodiment includes a chuck stage moving mechanism 56, and the chuck stage moving mechanism 56 causes the chuck stage mechanism 5 to follow a pair of guides 2 3 Move in the direction indicated by the arrow marks 2 3 a and 2 3 b. The chuck moving mechanism 56 includes an externally threaded rod 561 disposed between the pair of guide rails 23 and 23 and extending in parallel with the guide rails 23 and 23, and a servo motor 562 that rotationally drives the externally threaded rod 561. The outer threaded rod 561 is screwed to the screw hole 5丨1 provided in the support base 51, and the front end portion thereof is rotatably supported by the bearing member 563 which is attached to the pair of guide rails 23 and 23. The servo motor 562 has its drive shaft coupled to the base end of the outer threaded rod 561. Therefore, if the servo motor 562 rotates forward, the base 51 is supported, that is, the chuck mechanism 5 moves in the direction indicated by the arrow mark 23 & if the servo motor 562 is reversed, the base 5 is supported, that is, the chuck The stage mechanism 5 moves in the direction indicated by the arrow mark 23b. The chuck mechanism 5 that moves in the direction indicated by the arrow marks ^ and 23b is selectively positioned to move in and out of the object shown by the solid line in Fig. 3, and at 2 o'clock: In the processing field, the chuck moving mechanism 56 is attached to the processing collar 5, and the holding surface on the upper surface of the adsorption chuck 522 is reciprocated in parallel in the direction indicated by the arrow marks 23a & 23b in a predetermined range. To the continuation of the description, 'the two sides of the moving direction of the member 54 that constitutes the aforementioned collet table cover 201209902 are attached, and the cross-sectional shape is inverted and covers the pair of guide rails 23, 23 or the externally threaded rod 561 and Bellows mechanisms 57 and 58 such as servo motor 562. The bellows mechanisms 57 and 58 can be formed of a material suitable as a canvas. The front end of the bellows mechanism 57 is fixed to the front wall of the processing work unit 211, and the rear end is fixed to the front end surface of the cover member 54 outside the cover stage mechanism 5. The front end of the bellows mechanism 58 is fixed to the rear end surface of the cover member 54 outside the cover member 54, and the rear end is fixed to the front surface of the upright wall 22 of the device casing 2. When the collet chuck mechanism 5 moves in the direction indicated by the arrow mark 23a, the bellows mechanism 57 is stretched and the bellows mechanism 58 is contracted, and when the collet table mechanism 5 is moved in the direction indicated by the arrow mark 23b, the bellows The mechanism 57 is contracted and the bellows mechanism 58 is stretched. Referring to Fig. 1, the processing device having the cutting tool in the illustrated embodiment is provided with a cooling water supply mechanism 6' and the cooling water supply mechanism 6 is already The cooling water is sprayed from the turned surface of the workpiece held on the chuck table 52 moving in the processing area 25. The cooling water supply mechanism 6 is disposed on the side of the movement path of the headboard 52 that moves in the processing area 25, and has a discharge nozzle 61 that has been maintained in the field of processing. The spiral-shaped cooling water discharge port (for example, an opening having a width of 50 mm and a vertical width of 1 mm) is ejected from the turned surface of the workpiece on the chuck table 52 that is moved in the middle. As shown in Fig. 4, it is important that the discharge nozzle 61 is disposed such that the cutting tool 33 in the machining field discharges the cooling water toward the downstream side in the rotation direction indicated by the arrow mark 33a. Further, the cooling water supply mechanism 6 supplies pure water as cooling water. In the first half of the main body 21 of the device casing 2, 12 8 201209902, the first cassette mounting area 11a, the second cassette mounting area 12a, and the workpiece temporary field are provided. 13 a and wash area 14a. The first cassette 11 for storing the workpiece before processing is placed in the first cassette mounting area 11a, and the second cassette 12 for storing the processed object is placed in the second cassette mounting area. 12a. The workpiece temporary placement mechanism 13 is disposed in the workpiece temporary storage area 13a, and the workpiece temporary placement mechanism 13 is temporarily placed in the first cassette of the first cassette mounting area 11a. 11 The processed object before processing. Further, a cleaning mechanism 14 is disposed in the cleaning area 14a, and the cleaning mechanism 14 is a processed object after washing. The workpiece transport mechanism 15' is disposed between the first cassette mounting area 11a and the second cassette mounting area 12a, and the workpiece transport mechanism μ is stored in the first cassette. The workpiece before processing in the first card of the mounting field 11a is carried out to the workpiece temporary setting mechanism 13, and the processed workpiece that has been washed by the cleaning mechanism 14 is transported to the loaded object. The second cassette 12 is placed in the second cassette mounting area 12a. The workpiece holding area 13a and the workpiece to be processed are carried in. The workpiece loading mechanism 16 is disposed in the loading area 24, and the workpiece loading mechanism 16 is placed on the workpiece. The workpiece before processing of the mechanism 13 is transported to the head stand 52 of the chuck mechanism 5 that has been positioned in the loading/unloading area 24 of the workpiece. The workpiece to be processed is carried in. The workpiece unloading mechanism 17 is disposed between the unloading area 24 and the cleaning unit 14a, and the workpiece carrying mechanism 17 is placed in the workpiece. The processed workpiece on the chuck table 52 of the loading area 24 is transported to the cleaning mechanism 14. As shown in Fig. 5(a), the processed material is stored in the first cassette 13u. 13 201209902 The processed material is composed of a plurality of semiconductor wafers 110 which are formed in a lattice-like semiconductor wafer 10 on the surface. A plurality of stud bumps (electrodes) 120 are formed on a plurality of surfaces of the semiconductor wafer 110 which have been formed on the semiconductor wafer 10, respectively. For example, as shown in Fig. 5(b), the stud bump (electrode) 120 is formed by heating and melting a gold wire to an electrode plate which has been formed on the semiconductor wafer 11 and is made of, for example, aluminum. 130. As shown in Fig. 5(b), the plurality of stud bumps (electrodes) 120 formed in this manner constitute a state in which the needle whiskers 121 remain, and the height thereof has an error. The first cassette 11 in which the workpiece is stored is placed in the first cassette mounting area 11a of the apparatus casing 2. In addition, when all the workpieces before processing which are placed in the first cassette 11 of the first cassette mounting area 11a are removed, the empty cassette 11 is accommodated, and a plurality of workpieces before processing are stored. The new cassette 11 is manually placed in the first cassette mounting area Ua. On the other hand, when a predetermined number of processed workpieces are carried into the second cassette 12 placed in the second cassette mounting area 12a of the housing case 2, the second cassette is manually removed. 12, and placed a new empty 2nd card 12. The processing apparatus having the cutting tool in the embodiment shown in the drawings is hereinafter referred to as 'the following', and the operation will be described mainly with reference to Fig. 1 . The semiconductor 收纳 收纳 收纳 收纳 收纳 收纳 收纳 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰The semiconductor wafer 1 placed on the added mechanism 13 is centered here, and (3) the winding operation by the workpiece carrying mechanism 16 is placed in the position where the force is placed in the plant. The chuck wafer 52 of the chuck stage mechanism 5 of the head loading and unloading field 24 is on the semiconductor wafer 10 of the 2012 09902 table 52, and is sucked and held by the chuck table 52 by a suction mechanism (not shown). When the semiconductor wafer 10 is sucked and held by the chuck table 52, the chuck stage moving mechanism 56 (see FIG. 3) is actuated to move the chuck stage mechanism 5 in the direction indicated by the arrow mark 23a. The lost stage 52 holding the semiconductor wafer 1 is positioned in the processing field 25. If the chuck table 52 holding the semiconductor wafer 10 is positioned in the processing field 25 as described above, the following turning step is performed, that is, a plurality of layers have been formed on the surface of the semiconductor wafer 110 disposed on the semiconductor wafer 1 The stud bumps (electrodes) 120 are turned to make the height uniform. First, the rotary mandrel 322 is rotationally driven, and the cutting tool mounting member 324 on which the cutting tool 33 has been mounted is rotated in the direction indicated by the arrow mark 33a in Fig. 6 by, for example, a rotational speed of 6000 l > pm. Further, the turning unit 3 is lowered' and the cutting tool 33 is positioned at a predetermined cutting position. Next, when, for example, the cutting width of the cutting edge 332 of the cutting tool 33 is 20 μm, the chuck table 52 holding the semiconductor wafer 1 is not in the position of the solid line from the sixth drawing. The tiger 23a does not move to the right at a feed speed of, for example, 2 mm/sec. As a result, a plurality of stud bumps (electrodes) which have been formed on the surface of the semiconductor wafer 110 provided on the semiconductor wafer 10 are removed by the cutting edge 332 of the cutting tool 33 which rotates with the rotation of the rotating mandrel 322. ) 120 above the end. Further, as shown by the two-dot chain line in Fig. 6, by moving the center of the semiconductor wafer 1 保持 which has been held on the chuck table 52 to the center of the cutting tool mounting member 324, as in the seventh As shown in the figure, a plurality of stud bumps (electrodes) 120 which have been formed on the surface of the semiconductor wafer 11 of the semiconductor wafer 10 are all removed by turning, and the height 15 201209902 is uniform (turning step). In the above-described turning step, the cooling water supply mechanism 6 is actuated, and the nozzle 61 is automatically ejected, and as shown in Fig. 4, the cutting tool 33 in the processing of the cutting tool 33 is rotated by the arrow mark 33a. Cooling water is sprayed toward the downstream side of the upstream side of the direction. Further, in the embodiment shown in the drawing, the supply amount of the cooling water is set to 2 liters per minute. As a result, since the cooling water is supplied to the turning surface of the semiconductor wafer 1 and the cutting tool 33, the cutting tool 33 can be sufficiently cooled' without causing a chisel on the spiral surface of the semiconductor wafer 1 . Further, since the spiral surface of the semiconductor wafer 10 can be cooled, the chuck table 52 is not heated, and the processing accuracy due to thermal expansion of the chuck table 52 can be prevented from being lowered. In addition, since the cooling water is ejected from the upstream side of the cutting tool 33 in the processing field of the cutting tool 33 in the rotation direction indicated by the arrow mark 33a toward the downstream side, the fine spiral shavings are from the semiconductor wafer 10 The turning surface is washed away and does not adhere to the turning surface. In the embodiment shown in the drawings, the cooling water is discharged from the cutting tool 33 in the machining field of the cutting tool 33 toward the downstream side in the rotation direction indicated by the arrow mark 33a. The resistance of the water of the tool 33 does not cause microvibration in the cutting tool 33. As described above, if a plurality of turning steps of the bumps (electrodes) 120 which are formed on the surface of the semiconductor wafer 110 of the semiconductor wafer 10 are completed, the turning unit 3 is raised, and the rotation of the chuck table 52 is stopped. . Then, the chuck table 52 is moved in the direction indicated by the arrow mark 23b in the first drawing, and is positioned in the workpiece loading/unloading area 24, and the semiconductor wafer which has been subjected to the turning processing on the chuck table 52 is released. Attractive to keep. Further, the semiconductor wafer 10 held by the workpiece removal mechanism 17 is carried out and transported to the cleaning mechanism 14. The semiconductor wafer 10 that has been transferred to the cleaning mechanism 14 is washed here. The semiconductor wafer 1 that has been cleaned by the cleaning mechanism 14 is stored in the predetermined position of the second cassette 12 by the workpiece transport mechanism 15. I: BRIEF DESCRIPTION OF THE DRAWINGS 3 Fig. 1 is a perspective view of a processing apparatus having a cutting tool constructed in accordance with the present invention. Fig. 2 is a perspective view of a turning unit equipped in the processing apparatus shown in Fig. 1. Fig. 3 is a perspective view showing a chuck mechanism and a chuck moving mechanism equipped with a processing apparatus having a cutting tool shown in Fig. 1. Fig. 4 is a view showing the relationship between the cooling water sprayed from the discharge nozzle of the cooling water supply mechanism of the processing apparatus shown in Fig. 1 and the cutting tool for turning the workpiece which has been held on the chuck table. Illustrating. Figs. 5(a) and 5(b) are plan views and main part enlarged views of a semiconductor wafer as a workpiece. Fig. 6 is an explanatory view showing a turning step of the processing apparatus having the cutting tool shown in Fig. 1. Fig. 7 is an explanatory view showing a state in which a bump (electrode) which has been formed on a semiconductor wafer is formed by a processing apparatus having a cutting tool shown in Fig. 1. [Description of main component symbols] 2...Device housing 5...Clamping mechanism 3...Rotary unit 6...Cooling water supply mechanism 4...Rotary unit feeding mechanism 1...Semiconductor wafer 17 201209902 11...1st cassette 11a.. .1st cassette mounting field 12: 2nd cassette 12a. · 2nd cassette mounting area 13.. Workpiece temporary setting mechanism 13a... The workpiece is temporarily placed in the field 14: Cleaning mechanism 14a...washing area 15: workpiece conveying mechanism 16... workpiece loading mechanism 17: workpiece conveying mechanism 21. Main part 22: erect wall 23, 221... guide rails 23a, 23b, 33a... arrow marks 24: workpiece loading/unloading field 25. processing area 31.. moving base 32... mandrel unit 33... cutting tool 35. .. bolts 41,561... external threaded rods 42, 43, 563... bearing members 44.. pulse motor 51.. support base 52.. chuck table 54.. cover member 56.. Clamping table moving mechanism 57, 58... bellows mechanism 61.. ejection nozzle 110.. semiconductor wafer 120... stud bump (electrode) 121... whisker 130.. electrode plate 211.. Machining work unit 311.. foot 312.. is guided 313.. Support member 321... Mandrel housing 322.. Rotating mandrel 323, 562... Servo motor 324... Cutting tool mounting member 324a... Cutter mounting hole 324b... Internal threaded hole 331.. Cutter body 332.. Cutting edge 511.. Threaded hole 521.. Chuck table body 18 201209902 522...Adsorption chuck