JP5945182B2 - Tool for cutting tools - Google Patents

Description

  The present invention relates to a cutting tool for cutting a workpiece with a cutting blade by rotating a cutting wheel having a cutting blade.

  For example, in the semiconductor device manufacturing process, a semiconductor wafer made of silicon or a compound semiconductor formed with a large number of devices is cut and divided along a predetermined division line that is a boundary between devices, thereby dividing the semiconductor into individual pieces. Getting a device. Semiconductor devices manufactured in this way are widely used in various electronic devices such as mobile phones and personal computers. In recent years, in order to make this type of electronic devices smaller and lighter, semiconductor devices are stacked. Laminated devices that can be configured have been developed.

  A laminated device is formed by forming bump-like electrodes called bumps on the surface of a semiconductor device, embedding the bumps with an underfill material made of epoxy resin, etc., and then cutting the bumps together with the underfill material by cutting. The bump is exposed on the surface of the underfill material. In order to cut bumps and resin in this way, a cutting tool of a type that uses a cutting blade to cut a bump with a cutting blade by rotating a cutting wheel having a cutting blade with respect to a workpiece held on a holding table is used. (See Patent Documents 1 and 2).

JP 2010-005721 A JP 2009-043931 A

  When cutting a resin or metal with the cutting tool as described above, if the resin or metal has viscosity or if viscosity is generated due to heat generated during processing, processing scraps are generated in the form of threads. There are many cases. Such thread-like machining waste may be deposited on equipment such as a cutting fluid supply nozzle and piping disposed around the holding table. And the accumulated processing waste eventually dropped from nozzles, pipes, etc., and flowed to the drainage line in a large amount at a time, possibly clogging the drainage line.

  The present invention has been made in view of the above circumstances, and its main problem is to provide a cutting tool capable of reducing the possibility that a large amount of processing waste flows into the drainage line at once and clogs the drainage line. There is to do.

The present invention relates to a cutting tool for cutting a workpiece held by a holding table having a holding surface for holding the workpiece and the holding table arranged on the holding table. A cutting tool that includes a cutting tool having a cutting tool and a spindle on which the cutting tool wheel is rotatably mounted, and a cutting tool that relatively moves the cutting tool wheel in a cutting direction that is close to and away from the holding surface of the holding table. In a machining feed direction orthogonal to the cutting direction, a machining feed means for moving the holding table relative to the cutting tool so as to be able to move away from and close to the cutting tool, and surrounding the holding table and the cutting wheel. e Bei and swarf scattering prevention wall for preventing scattering of debris, and the feeding means, the workpiece held by the holding table The holding table is positioned at a machining position to be cut by the light cutting means and a retreat position, and is moved so as to be able to approach and separate from the cutting tool means. A cutting fluid that is disposed at a position that surrounds the holding table and the bite wheel when positioned on the cutting wheel, and supplies cutting fluid to the workpiece held by the holding table at least on the machining dust scattering prevention wall A spout is formed .

  According to the present invention, machining waste generated by cutting is prevented from being scattered by the machining waste scattering prevention wall. Even if thread-like processing waste is generated by cutting resin or metal, the thread-like processing waste is prevented from being scattered by the processing waste scattering prevention wall, such as nozzles or pipes for cutting fluid supply around the holding table. Accumulation is prevented. Accordingly, it is possible to reduce the possibility that a large amount of thread-like processing waste flows into the drainage line at once and clogs the drainage line.

  According to the present invention, there is an effect that a cutting tool that can reduce a possibility that a large amount of processing waste flows into the drainage line at once and clogs the drainage line is provided.

BRIEF DESCRIPTION OF THE DRAWINGS (a) Perspective view of the workpiece which concerns on one Embodiment of this invention, (b) Side view, (c) It is sectional drawing which shows the detail of a protective tape. 1 is an overall perspective view of a cutting tool according to an embodiment of the present invention. It is a top view which shows the cutting operation with respect to the to-be-processed object of the cutting tool of one Embodiment, Comprising: (a) The state immediately before cutting, (b) It is showing during cutting. It is a side view which shows the cutting operation with respect to the to-be-processed object by the cutting tool of one Embodiment, Comprising: (a) The state immediately before cutting, (b) It is showing during cutting. It is a top view which shows the processing dust scattering prevention wall with which the cutting tool of one Embodiment was equipped. It is a top view which shows other embodiment of the processing waste scattering prevention wall. It is sectional drawing which shows other embodiment of the processing waste scattering prevention wall. It is sectional drawing which shows other embodiment of the processing waste scattering prevention wall.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[1] Workpiece FIGS. 1A and 1B show a workpiece 1 according to an embodiment. The workpiece 1 is obtained by attaching a protective tape 3 to a surface 2 a of a disk-shaped substrate 2. The substrate 2 is, for example, a semiconductor wafer on which a large number of devices are formed on the surface 2a, and the protective tape 3 is attached to the surface 2a in order to protect the surface 2a. In this state, the workpiece 1 is thinned by grinding the back surface 2b of the substrate 2, for example. For the grinding of the back surface 2b, means such that the surface of the base material 3a of the protective tape 3 is adsorbed to the holding surface such as a holding table, and the exposed back surface 2b is ground by a grinding means.

  The protective tape 3 is an adhesive tape having a thickness of about 50 to 300 μm, and as shown in FIG. 1 (c), an adhesive layer 3b is formed on one surface of the substrate 3a. The base material 3a is formed from a resin having relatively rigidity such as vinyl chloride, polyolefin, polyethylene terephthalate, and the adhesive layer 3b is made of a rubber or acrylic material.

  This embodiment is a cutting tool for cutting and flattening the entire surface of the substrate 3a in the protective tape 3 of the workpiece 1, and FIG. 2 shows the entire apparatus. As a reason for flattening the surface of the base material 3a, for example, when grinding the back surface 2b of the substrate 2 as described above, by flattening the surface of the base material 3a adsorbed to the holding surface, This is because the ground back surface 3 has high flatness.

[2] Tool Cutting Device (a) Basic Configuration Hereinafter, the basic configuration of the tool cutting device 10 of one embodiment shown in FIG. 2 will be described.
In FIG. 2, reference numeral 11 denotes a device base. A wall 12 is erected at one end in the longitudinal direction of the device base 11 (the end on the right back side in FIG. 2). In FIG. 2, the longitudinal direction, the width direction, and the vertical direction of the apparatus base 11 are set as a Y direction, an X direction, and a Z direction, respectively.

  On the apparatus base 11, a recess 13 for cutting fluid recovery is formed on the side of the wall 12 from an approximately middle portion in the longitudinal direction. A movable base (processing feed means) 14 is provided in the recess 13. Accordingly, a vacuum chuck disk-shaped holding table 20 is provided so as to be movable in the Y direction. The moving table 14 reciprocates along the Y direction by a moving mechanism (not shown) disposed in the apparatus table 11.

  The moving path of the moving table 14 is covered with bellows-like covers 15 and 16 provided on both sides of the moving table 14 in the moving direction. The covers 15 and 16 expand and contract with the movement of the movable table 14, and the covers 15 and 16 prevent the processing waste from falling onto the movement path.

  The holding table 20 is supported by the movable table 14 in a fixed state. The holding table 20 has a circular horizontal holding surface 21 formed of a porous body. The holding surface 21 is brought into a negative pressure state by operation of a suction mechanism (not shown), and the workpiece 1 is placed on the holding surface 21 and sucked and held by a negative pressure action. The holding table 20 is positioned at a predetermined processing position when the movable table 14 moves to the wall 12 side. A cutting tool 30 is disposed above the processing position.

  The cutting tool means 30 is provided on the front surface of the wall portion 12 of the apparatus base 11 so as to be movable up and down in the Z direction by the cutting feed means 40. The cutting feed means 40 is screwed into the pair of left and right guide rails 41 fixed to the front surface of the wall portion 12 and extending in the Z direction, a lifting slider 42 supported slidably on the guide rail 41, and the lifting slider 42. The ball screw 43 and the motor 44 that rotate the ball screw 43 forward and backward are configured to raise and lower the elevating slider 42 along the guide rail 41 by the rotation of the ball screw 43.

  The cutting tool 30 includes a cylindrical housing 31 whose axial direction extends in the Z direction, a spindle 32 coaxially and rotatably supported in the housing 31, a servo motor 33 that rotationally drives the spindle 32, a spindle A disc-shaped bite wheel 35 having a cutting edge 34 for cutting the workpiece 1 is provided so as to face the holding table 20 by being coaxially fixed to the lower end of 32. The cutting blade 34 is made of diamond or the like capable of cutting the base material 3a made of the resin in the protective tape 3 of the workpiece 1, and is disposed below the outer peripheral portion of the bite wheel 35 as shown in FIGS. It is attached to the state protruding.

  In the cutting tool 30, the housing 31 is fixed to the lifting slider 42 of the cutting feed means 40 via the holder 39, and moves in the vertical direction (cutting direction) together with the lifting slider 42. The holding table 20 is moved close to and away from the holding surface 21. When the spindle 32 is rotationally driven by the servo motor 33, the bite wheel 35 is rotated, and the cutting blade 34 is turned accordingly. The holding table 20 is moved by the moving table 14 so as to be close to and away from the cutting tool 30 in the horizontal direction. The moving direction (Y direction) of the holding table 20 is orthogonal to the cutting direction (Z direction) of the cutting tool 30. As shown in FIG. 3, the turning trajectory of the cutting edge 34, that is, the cutting area by the bite wheel 35, is larger than the outer diameter of the workpiece 1.

  The moving end where the moving base 14 moves away from the machining position in the direction away from the wall portion 12 is the retracted position, and the workpiece 1 held on the holding table 20 is moved by the moving base 14 by the cutting tool. The machining position below 30 and the retracted position can be reciprocated. In other words, the workpiece 1 held on the holding table 20 is moved with respect to the cutting tool 30 so as to be able to approach and separate along the Y direction.

  As shown in FIG. 2, a supply / recovery area 17 for the workpiece 1 is provided in front of the recess 13 of the apparatus base 11. In the center of the supply / recovery area 17, a two-bar link type pickup robot 50 is installed. Around the pickup robot 50, the cassette 51 and positioning means are counterclockwise as viewed from above. 52, a carry-in means 53, a carry-out means 54, a spinner type cleaning device 55, and a cassette 56 are respectively arranged.

  The cassette 51, the positioning means 52, and the carry-in means 53 are systems that carry the workpiece 1 into the holding table 20, and the carry-out means 54, the cleaning means 55, and the cassette 56 hold the workpiece 1 after cutting. It is a system to carry out from 20. Although the two cassettes 51 and 56 have the same structure, they are referred to as a carry-in cassette 51 and a carry-out cassette 56 according to applications. These cassettes 51 and 56 are configured to accommodate and transport a plurality of workpieces 1 in a stacked state, and are set at predetermined positions on the apparatus base 11. Both the carrying-in means 53 and the carrying-out means 54 have the same structure, and suction pads 53b and 54b for sucking the upper surface of the workpiece 1 by negative pressure action are attached to the tips of the horizontal swivel arms 53a and 54a, respectively. It is.

(B) Basic Operation Next, an operation of cutting the resin base material 3a on the protective tape 3 of the workpiece 1 by the cutting tool 10 will be described.

  One workpiece 1 is taken out from the loading cassette 51 by the pickup robot 50, and the workpiece 1 is placed on the positioning means 52 by the pickup robot 50 with the protective tape 3 facing upward. The workpiece 1 is positioned at a predetermined transfer start position on the positioning means 52, and then the workpiece 1 is held by the suction pad 53b of the carry-in means 53, and is moved to the retracted position in advance by turning the horizontal turning arm 53a. The rear surface 2b of the substrate 2 is placed on the holding surface 21 of the holding table 20 that is positioned.

  The workpiece 1 is adsorbed and held on the holding surface 21 of the holding table 20 by a negative pressure action, and the moving base 14 moves to the wall 12 side and is sent to the processing position. In this case, the workpiece 1 is sent to a position that fits within the cutting area of the bite wheel 35 as shown in FIG. Then, the cutting tool 30 that rotates the cutting tool wheel 35 is lowered by the cutting and feeding means 40 until the cutting blade 34 reaches a height at which the base material 3a of the protective tape 3 is cut to a predetermined thickness. Subsequently, machining feed is performed to move the movable table 14 in the direction of the retracted position of the workpiece 1.

  As the workpiece 1 is processed and fed, the surface of the base material 3a of the protective tape 3 is cut by the cutting blade 34 that rotates. When the workpiece 1 leaves the cutting area of the bite wheel 35, the entire surface of the base material 3a is cut and formed flat. During cutting, a cutting fluid is supplied to the workpiece 1 as will be described later. When the base material 3a is cut, machining waste is generated. The machining waste is mixed with the cutting fluid and flows down to the recess 13, and flows through the recess 13 from the machining waste discharge port 18 formed at the corner of the recess 13. Discharged.

  When the entire surface of the base material 3a of the protective tape 3 is cut flat, the holding table 20 is moved to the retracted position, and the adsorption of the workpiece 1 to the holding surface 21 is released. Is transferred into the cleaning means 55. The workpiece 1 is washed with water and dried in the cleaning means 55, and then transferred and accommodated in the carry-out cassette 56 by the pickup robot 50.

  The above is a cycle in which the surface of the base material 3a of the protective tape 3 is cut flat on one workpiece 11 and then washed and collected. This cycle is repeated. When all the workpieces 1 in the carry-in cassette 51 have been processed, the workpiece 1 is moved to the next step together with the carry-out cassette 56.

  The above is the basic configuration and operation of the cutting tool 10 according to one embodiment. Next, one Embodiment of the processing dust scattering prevention wall which concerns on this invention with which the said apparatus 10 comprises is described.

[3] Workpiece Spattering Prevention Wall (a) Structure of Workpiece Spatter Prevention Wall As shown in FIG. 2, on the wall 12 side of the recess 13 of the apparatus base 11, a base on the protective tape 3 of the workpiece 1 is provided. A processing waste scattering prevention wall (hereinafter abbreviated as a prevention wall) 60 is provided which is assembled in a rectangular frame shape to prevent scattering of resin processing waste generated by cutting the material 3a. The prevention wall 60 surrounds the holding table 20 and the bite wheel 35 of the bite cutting means 30 that is cutting the base material 3a when the movable table 14 moves and the holding table 20 is positioned at the processing position. Arranged in position.

  As shown in FIG. 5, the prevention wall 60 connects the pair of side plates 61 that cover the sides (X direction side) of the holding table 20 and the bite wheel 35, and both ends of the side plates 61 in the Y direction, respectively. 20 and an end plate 62 that covers the front side and the rear side (both sides in the Y direction) of the bite wheel 35. Each side plate 61 is in contact with the bottom surface of the recess 13 and supported so as to face each other. As shown in FIG. 5, there is a gap 63 between the side plate 61, the moving table 14 and the covers 15 and 16. The end plate 62 is fixed to the upper portion of the side plate 61, whereby the prevention wall 60 is formed in a rectangular frame shape. Below the end plate 62, a space through which the movable table 14 supporting the holding table 20 and the covers 15 and 16 can pass is provided. The prevention wall 60 is detachably mounted on the bottom surface of the recess 13.

  As shown in FIG. 5, a cutting fluid ejection port 611 is formed in one of the two side plates 61, and the distal end portion of the cutting fluid supply nozzle 71 extending from the recess 13 is formed in this cutting fluid ejection port 611. Has been inserted. Further, a suction port 612 is formed in the other side plate 61, and a duct 74 connected to a suction source 73 that sucks air is connected to the suction port 612 through a duct box 72.

(B) Action of prevention wall and effects accompanying it As described above, when the base material 3a of the protective tape 3 is cut by the cutting tool 30, the cutting liquid is sent to the cutting liquid supply nozzle 71, and the cutting liquid Cutting fluid is ejected from the ejection port 611 to the cutting point. The cutting fluid is supplied for cooling a cutting point, reducing friction, or cleaning machining waste. During the cutting process, the suction source 73 is operated, and the dust in the prevention wall 60 is sucked into the duct 74 from the suction port 612 through the duct box 72. The cutting fluid supplied to the workpiece 1 includes the processing waste of the base material 3a and flows down into the recess 13 in the prevention wall 60, and passes through the gap 63 between the side plate 61, the movable table 14, and the covers 15,16. Then, it flows out of the prevention wall 60 and flows into the machining waste discharge port 18.

  Now, in this apparatus 10, the processing waste generated during cutting hits the inner surface of the prevention wall 60 and is prevented from scattering. Here, also when the base material 3 a of the protective tape 3 is cut and thread-like processing waste is generated, the thread-like processing waste is prevented from being scattered by the prevention wall 60. For this reason, it is prevented that such thread-like processing waste accumulates on the cutting fluid supply nozzle 71 around the holding table 20 and other pipes (not shown).

  Conventionally, there has been a problem that thread-like machining waste accumulates and a large amount of thread-like machining waste flows into a drainage line (here, a path of cutting waste liquid reaching the machining waste discharge port 18 of the recess 13) and clogs. However, in the present embodiment, the scattering of the processing waste is prevented by the prevention wall 60, and the processing waste hitting the prevention wall 60 sequentially falls into the recess 13 and smoothly enters the recess 13 without accumulating. It flows and reaches the processing waste outlet 18. Therefore, the possibility that a large amount of thread-like processing waste flows into the drainage line at a time and clogs the drainage line is reduced.

  The prevention wall 60 is disposed at a position surrounding the holding table 20 and the bite wheel 35 when the holding table 20 holding the workpiece 1 is positioned at the processing position. Prevention of dust scattering is made accurately. In addition, when the processing waste remains in the prevention wall 60 without flowing into the drain line, the operation of removing the prevention wall 60 and removing the processing waste may be performed as necessary.

(C) Other Embodiments of Preventing Wall FIGS. 6 to 8 show another embodiment of the preventing wall based on the preventing wall 60 of the above embodiment.
The prevention wall 60 shown in FIG. 6 forms the corner | angular part 601 between the side plate 61 and the end plate 62 in R shape. In this case, as compared with the case where the corner is a right angle as in the above-described embodiment, it is easier to remove the processing waste adhering to the inner surface of the R-shaped corner 601 and the inner surface of the prevention wall 60 can be easily cleaned. Can be obtained.

  The prevention wall 60 shown in FIG. 7 is supported with the side plate 61 tilted inward, that is, the holding table 20 side. In some cases, machining scraps may adhere to the inner surface of the side plate 61. However, if tilted inward in this way, the processing scraps are easily peeled off from the inner surface of the side plate 61, so that the processing scraps adhere to the inner surface of the side plate 61. Can be reduced. Note that not only the side plate 61 but also the end plate 62 may be tilted inward.

  The prevention wall 60 shown in FIG. 7 has a cleaning water pipe 64 disposed at the upper end of the inner surface of the side plate 61 tilted inward, and the inner surface of the side plate 61 is cleaned with cleaning water supplied downward from the cleaning water pipe 64. It becomes the form to wash. According to this, adhesion of the processing waste to the side plate 61 can be prevented by supplying the cleaning water constantly or intermittently. In this case, it is better not to allow the cleaning water to flow to the cutting fluid outlet 611 so as not to hinder the ejection of the cutting fluid. The suction port 612 is open to the lower end of the side plate 61, and the air in the prevention wall 60 flows into the duct box 72 from the suction port 612 (FIG. 8: A is the flow of the air).

  DESCRIPTION OF SYMBOLS 1 ... Workpiece, 10 ... Tool cutting device, 14 ... Moving table (work feed means), 20 ... Holding table, 21 ... Holding surface, 30 ... Tool cutting means, 32 ... Spindle, 34 ... Cutting blade, 35 ... Tool Wheels, 40 ... cutting feed means, 60 ... debris scattering prevention wall, 611 ... cutting fluid ejection port.

Claims (1)

A cutting tool,
A holding table having a holding surface for holding a workpiece;
A bite cutting means including a bite wheel provided facing the holding table and having a cutting blade for cutting a workpiece held by the holding table, and a spindle on which the bite wheel is rotatably mounted;
A cutting feed means for relatively moving the bite wheel in a cutting direction approaching and separating from the holding surface of the holding table;
In a machining feed direction orthogonal to the cutting direction, a machining feed means for moving the holding table relative to the cutting tool means so as to be close to and away from the cutting tool;
Bei example and a processing refuse scattering prevention wall for preventing scattering of processing refuse to surround the byte wheel and the holding table,
The machining feed means positions the holding table at a machining position where the workpiece held by the holding table is cut by the cutting tool and a retreat position, and is capable of approaching and separating from the cutting tool. Move
The machining dust scattering prevention wall is disposed at a position surrounding the holding table and the bite wheel when the holding table is positioned at the machining position, and the machining dust scattering prevention wall includes at least the holding table. A cutting tool jetting device for forming a cutting fluid supply port for supplying a cutting fluid to a workpiece held by the cutting tool.

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