JP6357861B2 - Polishing apparatus and polishing method - Google Patents

Polishing apparatus and polishing method Download PDF

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JP6357861B2
JP6357861B2 JP2014100095A JP2014100095A JP6357861B2 JP 6357861 B2 JP6357861 B2 JP 6357861B2 JP 2014100095 A JP2014100095 A JP 2014100095A JP 2014100095 A JP2014100095 A JP 2014100095A JP 6357861 B2 JP6357861 B2 JP 6357861B2
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polishing
arm
slurry
end side
head
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JP2015217441A (en
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林 武彦
武彦 林
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富士通セミコンダクター株式会社
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Description

  The present invention relates to a polishing apparatus and a polishing method.

In recent years, copper (Cu), which has higher electromigration resistance than aluminum (Al), has been used in place of conventional aluminum (Al) wiring to meet the demand for higher integration of semiconductor devices. It was. When copper (Cu) is used as a wiring material, it is formed as a buried wiring layer by using a CMP (Chemical Mechanical Polishing) method.

  Also, since polishing is used in various planarization processes, the conventional polishing process will be described with reference to FIGS. 11 and 12. FIG. 11 is a schematic plan view of a main part of a conventional polishing apparatus. A polishing table 51 is provided with a plurality of platens 54 (which will be described here) and a load cup 60 that are rotatable. A polishing pad 55 is placed on each of them. Further, four polishing heads 53 are attached to the distal end portion of the support arm 52 so as to be rotatable and slidable.

  In the polishing table 51, a conditioner 56 and a slurry nozzle 59 are arranged for each platen 54, and the conditioner 56 includes a conditioner head 57 and a rotating arm 58 that rotatably operates the conditioner head 57. In addition, a wafer supply device 61 that supplies a wafer 62 to the polishing head 53 is provided at one corner of the polishing table 51 (see, for example, Patent Document 1).

  Each polishing head 53 has a retainer ring (not shown) that holds the wafer 62 on the inner periphery, and the wafer 62 is sucked into the polishing head 53 by expansion and contraction inside the head housing. Alternatively, a membrane that presses toward the polishing pad 55 is incorporated. The wafer 62 supplied from the wafer supply device 61 is mounted on the polishing head 53 on the load cup 60, and the support arm 52 is rotated 90 ° to be positioned on the polishing pad 55.

  In the CMP process, the polishing pad is clogged with polishing residues and the like, causing a reduction in polishing speed or a reduction in polishing accuracy. Therefore, conditioning is performed periodically using a conditioner 56. In conditioning, the polishing pad 55 is sharpened by a conditioner head 57 having a diamond disk.

  In the polishing step, as shown in FIG. 12A, the wafer 62 mounted on the polishing head 53 is pressed against the polishing pad 55, and the polishing head 53 and the platen 54 are rotated while supplying the slurry 63 from the slurry nozzle. And polishing. At this time, the slurry 63 scatters with the rotation of the polishing head 53 and the polishing pad 55, and the slurry splash 64 adheres to the ceiling portion of the support arm 52.

  As shown in FIG. 12B, while the polishing step is repeated for 1 to 2 hours, the adhered slurry droplets 64 are dried to become a dry slurry 65. The dried slurry 65 is in a state where white paint is sprayed.

JP 2001-257187 A

  Since the above-described dry slurry 65 falls during polishing and contacts the wafer to generate scratch marks, the circumstances will be described with reference to FIG. FIG. 13 shows a series of steps subsequent to FIG. As shown in FIG. 13C, the dried slurry 65 dried during polishing is peeled off by mechanical vibration during polishing or collision of the splashed slurry droplets 64 and falls into the apparatus.

  As shown in FIG. 13D, the dry slurry 65 dropped on the polishing pad 55 comes into contact with the wafer 62 as it rotates and causes scratch marks on the wafer 62.

  Accordingly, an object of the polishing apparatus and the polishing method is to prevent the splashed slurry droplets from adhering to the apparatus and drying.

From one aspect disclosed, a polishing table, a rotatable platen provided on the polishing table, a polishing pad fixed on the platen, and a member to be polished are fixed and pressed against the polishing pad for polishing. a polishing head for an arm for supporting the polishing head oscillating capable, the support portion for supporting the polishing head of said arm, a mechanism is bowl-shaped shield covering the upper and side surfaces of the polishing head, the Yes, and the bowl-shaped shield, said polishing head is in when placed in position for polishing, the rear end side with respect to the arm of the shield has a shape that is contained in the polishing pad in top view A polishing apparatus is provided.
Further, from one disclosed aspect, a polishing table, a rotatable platen provided on the polishing table, a polishing pad fixed on the platen, and a member to be polished are fixed and pressed against the polishing pad. A polishing head for polishing, an arm for slidably supporting the polishing head, and a mechanism that is a hook-shaped shield covering the upper surface and side surfaces of the polishing head on a support portion for supporting the polishing head of the arm. The hook-shaped shield has a plurality of spiral grooves cut on the inner surface facing the polishing head, and the lower ends of the grooves are the arms at the bottom of the hook-shaped shield. A polishing apparatus is provided that is spaced apart from one right and left end side to the other right and left end side.

Furthermore , from another viewpoint to be disclosed, in the step of rotating and polishing a polishing head that is supported by an arm so as to be slidable and presses a polishing head to which a member to be polished is fixed, a slurry that scatters with the rotation is transferred to the arm. Polishing, characterized in that the rear end side of the substrate is shielded by a mechanism that is a bowl-shaped shield enclosed in the polishing pad in a top view, and the shielded slurry is dropped onto the polishing pad while polishing. A method is provided.
Further, according to another aspect of the disclosure, in the step of rotating and polishing by pressing a polishing head fixedly supported by an arm and pressing a polishing head fixed to a polishing pad, the slurry that is scattered with the rotation is A plurality of spiral grooves are cut on the inner surface facing the polishing head, and the lower ends of the grooves are the rear end side of the hem of the skirt, from one left and right end side to the other left and right end side. There is provided a polishing method characterized by being shielded by a mechanism which is a cage-like shield that is separated while crossing, and polishing while dropping the shielded slurry onto the polishing pad.

  According to the disclosed polishing apparatus and polishing method, it is possible to prevent scattered slurry droplets from adhering to the apparatus and drying, thereby reducing the generation of scratch marks on the wafer. Become.

It is composition explanatory drawing of the polish device of an embodiment of the invention. It is explanatory drawing to the middle of the grinding | polishing process of embodiment of this invention. It is explanatory drawing after FIG. 2 of the grinding | polishing process of embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. It is explanatory drawing of the guard plate used for the grinding | polishing apparatus of Example 1 of this invention. It is explanatory drawing of the guard plate used for the grinding | polishing apparatus of Example 2 of this invention. It is explanatory drawing of the guard plate used for the grinding | polishing apparatus of Example 3 of this invention. It is explanatory drawing of the guard plate used for the grinding | polishing apparatus of Example 4 of this invention. It is explanatory drawing of the helical groove | channel provided in the guard board of Example 4 of this invention. It is explanatory drawing of the guard board used for the grinding | polishing apparatus of Example 5 of this invention. It is a schematic principal part top view of the conventional grinding | polishing apparatus. It is explanatory drawing to the middle of the conventional grinding | polishing process. It is explanatory drawing after FIG. 12 of the conventional grinding | polishing process.

  Here, with reference to FIG. 1 thru | or FIG. 3, the grinding | polishing apparatus of embodiment of this invention and the grinding | polishing process using this grinding | polishing apparatus are demonstrated. FIG. 1 is a configuration explanatory view of a polishing apparatus according to an embodiment of the present invention, FIG. 1 (a) is a schematic plan view of a main part, and FIG. is there. As shown in FIG. 1A, the polishing apparatus includes a polishing table 1, a rotatable platen 4 provided on the polishing table 1, and a polishing pad 5 fixed on the platen 4. Further, the polishing head 5 includes a polishing head 3 that fixes and polishes a member 12 to be polished, and an arm 2 that supports the polishing head 3 in a swingable manner. In the polishing apparatus of the present invention, the support portion that supports the polishing head 3 of the arm 2 covers the upper surface and the side surface of the polishing head 3, and the inner surface does not have a horizontal portion with respect to the main plane of the polishing table 1. A mechanism 6 is provided. When this shielding mechanism 6 is attached to the arm 2, it is desirable that it is detachably attached using a screw or a fitting mechanism.

The shielding mechanism 6 may be provided as a shielding plate that is provided on the front, rear, left, and right sides of the polishing head 3 and has a protruding structure on the inner surface facing the polishing head 3. Protruding structure provided in the shielding plate in this case may be a ridge-like protrusion structure extending in a direction crossing the horizontal direction, or the protruding structure provided on shielding蔽板, extend horizontally Alternatively, a quadrangular pyramidal projecting structure or a hemispherical projecting structure divided by a groove extending in a direction intersecting the horizontal direction may be used. By providing such a protrusion-like structure, slurry droplets adhering to the inner surface of the shielding plate are collected and formed into slurry droplets, and the slurry droplets are dropped without drying, and a part of the slurry droplets on the polishing pad 5 And can be reused as a part of the slurry.

  Further, the shielding mechanism 6 may be a bowl-shaped shielding body in which a spiral groove is cut on the inner surface facing the polishing head 3. It is desirable that the rear end side of the arm of the bowl-shaped shield does not protrude from the polishing pad 5, whereby slurry droplets collected by the slurry droplets adhering to the inner surface of the shielding plate are collected and dropped into the polishing pad. 5 can be dropped and reused. In addition, by providing the lower end (dropping port) of the spiral groove only on the front end side and the left and right end sides with respect to the arm 2 of the bottom of the bowl-shaped shield, the slurry droplet is dropped only on the polishing pad 5. Can do. Further, such a hook-shaped shield may be provided as a concave structure formed integrally with the arm 2 in the vicinity of the support portion that supports the polishing head 3 of the arm 2.

  The inner surface of the shielding mechanism 6 facing the polishing head 3 is preferably coated with a water-repellent substance such as a fluororesin, whereby the dripping of slurry can be further promoted. In addition, although the raw material of the shielding mechanism 6 is arbitrary, generally a metal or a plastic is used.

  Further, the polishing table 1 is provided with a conditioner head 7 that is rotatably operated by a rotary arm 8 for each platen 4 and a slurry nozzle 9 that supplies slurry. A polishing member supply device 11 that supplies a member to be polished 12 to the polishing head 3 is provided at one corner of the polishing table 1, and the member to be polished 12 is mounted on the polishing head 3 on the load cup 10. The member to be polished 12 is typically a semiconductor wafer such as a Si wafer.

  Next, with reference to FIG. 2 thru | or FIG. 3, the grinding | polishing process of embodiment of this invention is demonstrated. As shown in FIG. 2A, the member to be polished 12 mounted on the polishing head 3 is pressed against the polishing pad 5, and the polishing head 3 and the platen 4 are rotated while supplying the slurry 13 from the slurry nozzle. Polish. At this time, the slurry 13 scatters with the rotation of the polishing head 3 and the polishing pad 5, but the scattered slurry droplets 14 adhere to the inner surface of the shielding mechanism 6 and do not adhere to the ceiling portion of the arm 2.

  As shown in FIG. 12B, when polishing is continued, the slurry droplets 14 attached to the inner surface of the shielding mechanism 6 gather and become slurry droplets 15 that descend along the inner surface of the shielding mechanism 6, and finally. Falls into the device without drying. The slurry droplets 15 dropped on the polishing pad 5 are reused as a part of the slurry 13 as they are.

  Next, as shown in FIG. 3C, after the polished member is removed on the load cup 10 after the polishing, pure water is sprayed from the shower mechanism 16 as a shower 17 to clean and shield the shielding mechanism 6. The slurry droplet 15 adhering to the inner surface of the mechanism 6 is washed away. FIG. 3D is a cross-sectional view showing a state after cleaning, and shows a state in which the slurry is completely removed from the inner surface of the shielding mechanism 6.

  Thus, in the embodiment of the present invention, since the shielding mechanism 6 is provided so as to surround the polishing head 3, slurry splashes do not adhere to the ceiling of the arm 2 and are not dried. Moreover, since the inner surface of the shielding mechanism 6 does not have a horizontal portion with respect to the main plane of the polishing table 1, the slurry splash adhering to the inner surface of the shielding mechanism 6 effectively falls without drying while adhering. Will fall into the device.

  Therefore, the slurry splash does not dry and the dry slurry does not fall, so that no scratch marks are generated on the member 12 to be polished. Further, some or all of the dropped slurry droplets fall on the polishing pad 5 and are reused as the slurry, so that the utilization efficiency of the slurry is improved.

  Next, with reference to FIG.4 and FIG.5, the grinding | polishing apparatus of Example 1 of this invention is demonstrated. FIGS. 4A and 4B are configuration explanatory views of the polishing apparatus according to the first embodiment of the present invention. FIG. 4A is a schematic plan view of a main part, and FIG. 4B is a cross-sectional view of a main part showing a polishing state. . Since the polishing process is as described in the embodiment, only the polishing apparatus will be described. As shown in FIG. 4A, in the polishing apparatus, three polishing platens 24 and a load cup 33 are provided on a polishing table 21, and a polishing pad 25 is placed on each platen 24. Further, four polishing heads 23 are attached to the distal end portion of the support arm 22 so as to be rotatable and swingable.

  Guard plates 26 and 27 that cover the upper surface and the side surface of the polishing head 23 are attached to a support portion that supports the polishing head 23 of the support arm 22 with fixing screws 28. The inclination angle θ of the guard plates 26 and 27 at this time is 45 ° to 90 °, and here, θ = 50 °.

  The polishing table 21 is provided with a conditioner 29 and a slurry nozzle 32 for each platen 24, and the conditioner 29 includes a conditioner head 30 and a rotating arm 31 that freely rotates the conditioner head 30. In addition, a wafer supply device 34 that supplies a wafer 35 to the polishing head 23 is provided at one corner of the polishing table 21.

  FIG. 5 is an explanatory view of a guard plate used in the polishing apparatus according to the first embodiment of the present invention, FIG. 5 (a) is a top view showing a state of attachment of the guard plate, and FIG. It is a perspective view. FIG. 5C is a cross-sectional view taken along the alternate long and short dash line connecting BB ′ in FIG. As shown in FIG. 5A, a guard plate 26 is provided so as to cover the front and rear of the axis of the support arm 22 of the polishing head 23, and a guard plate 27 is provided so as to cover the left and right surfaces. The guard plates 26 and 27 are formed by processing plastic and coating the inner surface with Teflon (registered trademark).

When a 12-inch wafer is targeted, for example, the guard plate 26 has a width w 1 of 35 cm to 50 cm and a protruding length l 1 of 10 cm to 15 cm, where w 1 = 40 cm, Let l 1 = 15 cm. Moreover, the width w 2 of the guard plate 27 is 40 cm to 60 cm, and here, w 2 = 50 cm.

  Further, as shown in FIG. 5B, the guard plate 26 (27) is provided with a triangular hook-shaped protrusion 36. As shown in FIG. 5C, the height h of the triangular hook-shaped projections 36 is 5 mm to 50 mm, the pitch p is 5 mm to 50 mm, and the overall thickness d of the guard plate 26 (27) is 10 mm. ~ 50 mm. Here, d = 20 mm, h = 10 mm, and p = 12 mm.

  As described above, in the polishing apparatus according to the first embodiment of the present invention, the guard plates 26 and 27 provided with the triangular hook-shaped protrusions 36 surround the front, rear, left and right of the polishing head 23, so that they adhere to the guard plates 26 and 27. The slurry splashes descend along the triangular hook-shaped protrusion 36 and fall into the apparatus. Therefore, the slurry splashes are dried and the dry slurry does not fall, so that no scratch marks are generated on the wafer 35 due to the dry slurry. In addition, since some of the dropped slurry droplets fall on the polishing pad 25 and are reused as the slurry, the utilization efficiency of the slurry is also improved.

  Next, the polishing apparatus according to the second embodiment of the present invention will be described with reference to FIG. 6. Since the polishing apparatus is the same as the polishing apparatus according to the first embodiment except for the guard plate structure, only the guard plate structure will be described. To do. FIG. 6 is an explanatory diagram of a guard plate used in the polishing apparatus according to the second embodiment of the present invention, FIG. 6 (a) is a top view showing a guard plate attached state, and FIG. 6 (b) is a diagram of the guard plate. It is a top view which shows an inner surface. 6C is a cross-sectional view taken along the alternate long and short dash line connecting BB ′ in FIG. 6B, and FIG. 6D is the alternate long and two short dashes line connecting CC ′ in FIG. 6B. FIG. As shown in FIG. 6A, a guard plate 37 is provided so as to cover the front and rear of the axis of the support arm 22 of the polishing head 23, and a guard plate 38 is provided so as to cover the left and right surfaces. The guard plates 37 and 38 are formed by processing plastic, and the inner surfaces thereof are formed by coating with Teflon (registered trademark). In addition, the attachment angle of the guard plates 37 and 38 is 45 ° to 90 °, and is 50 ° here.

When a 12-inch wafer is targeted, for example, the guard plate 37 has a width w 1 of 35 cm to 50 cm and a protruding length l 1 of 10 cm to 15 cm, where w 1 = 40 cm, Let l 1 = 15 cm. The width w 2 of the guard plate 38 is 40Cm~60cm, here, and w2 = 50 cm.

Further, as shown in FIG. 6B, the guard plate 37 (38) is provided with a quadrangular pyramidal projection 39. As shown in FIGS. 6C and 6D, the height h of the triangular hook-shaped protrusion 39 is 5 mm to 50 mm, the pitches p 1 and p 2 are 5 mm to 50 mm, and the guard plate 37 ( The total thickness d of 38) is between 10 mm and 50 mm. Here, d = 20 mm, h = 10 mm, and p 1 = p 2 = 12 mm.

  Thus, in the polishing apparatus of Example 2 of the present invention, the guard plates 37, 38 provided with the quadrangular pyramidal protrusions 39 surround the front, rear, left, and right of the polishing head 23, so that they adhere to the guard plates 37, 38. The slurry splashes fall into the apparatus along the tip of the quadrangular pyramidal protrusion 39. Therefore, the slurry splashes are dried and the dry slurry does not fall, so that no scratch marks are generated on the wafer 35 due to the dry slurry. In addition, since some of the dropped slurry droplets fall on the polishing pad 25 and are reused as the slurry, the utilization efficiency of the slurry is also improved.

  Next, a polishing apparatus according to a third embodiment of the present invention will be described with reference to FIG. 7. Since the polishing apparatus is the same as the polishing apparatus according to the first embodiment except for the structure of the guard plate, only the structure of the guard plate will be described. To do. FIG. 7 is an explanatory view of a guard plate used in the polishing apparatus according to the third embodiment of the present invention, FIG. 7 (a) is a top view showing a state of attachment of the guard plate, and FIG. 7 (b) is a view of the guard plate. It is a top view which shows an inner surface. 7C is a cross-sectional view taken along the alternate long and short dash line connecting BB ′ in FIG. 7B, and FIG. 7D is the alternate long and short dash line connecting CC ′ in FIG. FIG. As shown in FIG. 7A, a guard plate 40 is provided so as to cover the front and rear of the axis of the support arm 22 of the polishing head 23, and a guard plate 41 is provided so as to cover the left and right surfaces. The guard plates 40 and 41 are formed by processing plastic, and the inner surfaces thereof are formed by coating with Teflon (registered trademark). In addition, the attachment angle of the guard plates 40 and 41 is 45 ° to 90 °, and is 50 ° here.

When a 12-inch wafer is targeted, for example, the guard plate 40 has a width w 1 of 35 cm to 50 cm and a protruding length l 1 of 10 cm to 15 cm, where w 1 = 40 cm, Let l 1 = 15 cm. The width w 2 of the guard plate 41 is 40Cm~60cm, here, and w2 = 50 cm.

Moreover, as shown in FIG.7 (b), the hemispherical protrusion 42 is provided in the guard board 40 (41). As shown in FIGS. 7C and 7D, the height h of the hemispherical protrusion 42 is 5 mm to 50 mm, the pitches p 1 and p 2 are 5 mm to 50 mm, and the guard plate 40 (41 ) Overall thickness d is 10 mm to 50 mm. Here, d = 20 mm, h = 10 mm, and p 1 = p 2 = 12 mm.

  As described above, in the polishing apparatus according to the third embodiment of the present invention, the guard plates 40 and 41 provided with the hemispherical protrusions 42 surround the front, rear, left and right of the polishing head 23, so that the slurry adhered to the guard plates 40 and 41. The splash falls along the tip of the hemispherical protrusion 42 into the apparatus. Therefore, the slurry splashes are dried and the dry slurry does not fall, so that no scratch marks are generated on the wafer 35 due to the dry slurry. In addition, since some of the dropped slurry droplets fall on the polishing pad 25 and are reused as the slurry, the utilization efficiency of the slurry is also improved.

  Next, a polishing apparatus according to a fourth embodiment of the present invention will be described with reference to FIGS. 8 and 9, but the structure of the guard plate is the same as the polishing apparatus according to the first embodiment except for the structure of the guard plate. I will explain only. FIG. 8 is an explanatory view of a guard plate used in the polishing apparatus according to the fourth embodiment of the present invention, FIG. 8 (a) is a top view showing a state of attachment of the guard plate, and FIG. 8 (b) is a view of the guard plate. It is a see-through | perspective side view which shows an attachment state. As shown in FIGS. 8A and 8B, a bowl-shaped guard plate 43 surrounding the periphery of the polishing head 23 is attached to the support arm 22 with a fixing screw 44. A plurality of spiral grooves are provided on the inner surface of the guard plate 43. In addition, the attachment angle of the guard plate 43 is 45 ° to 90 °, and is 50 ° here.

  FIG. 9A is an explanatory diagram of a spiral groove provided on the inner surface of the guard plate of the fourth embodiment. Here, four grooves 45 are shown for simplicity of illustration, but in practice, 1 to 20 are provided. The width of the spiral groove 45 is 5 mm to 50 mm, and is 15 mm here.

  Thus, in the polishing apparatus of Example 4 of the present invention, since the periphery of the polishing head 23 is surrounded by the bowl-shaped guard plate 43 having the spiral groove 45 on the inner surface, it adheres to the guard plate 43. The slurry splashes descend along the spiral groove 45 and fall into the apparatus from the dripping port 46. Therefore, the slurry splashes are dried and the dry slurry does not fall, so that no scratch marks are generated on the wafer 35 due to the dry slurry. In addition, since some of the dropped slurry droplets fall on the polishing pad 25 and are reused as the slurry, the utilization efficiency of the slurry is also improved.

  FIG. 9B is an explanatory view of a modified example of the spiral groove. In this case, the dropping port 48 of the spiral groove 47 is not positioned on the rear end side of the axis of the support arm 22. The shape of each spiral groove 47 is sequentially changed.

  Thus, since the groove 47 is formed so that the dripping port 48 of the spiral groove 47 is not located on the rear end side of the axis of the support arm 22, it drops along the spiral groove 47 and drops. All the slurry droplets that fall from the mouth 48 fall on the polishing pad 25. Therefore, the dispersed slurry can be efficiently recovered and used again for polishing.

  Next, the polishing apparatus according to the fifth embodiment of the present invention will be described with reference to FIG. 10. Since the polishing apparatus is the same as the polishing apparatus according to the first embodiment except for the guard plate structure, only the guard plate structure will be described. To do. FIG. 10 is an explanatory view of a guard plate used in the polishing apparatus of Example 5 of the present invention, FIG. 10 (a) is a top view showing a state of attachment of the guard plate, and FIG. 10 (b) is a view of the guard plate. It is a see-through | perspective side view which shows an attachment state. As shown in FIGS. 10A and 10B, a bowl-shaped guard plate 49 surrounding the periphery of the polishing head 23 is attached to the support arm 22 with a fixing screw 44.

  The shape of the guard plate 49 is an asymmetrical bowl shape before and after the axis of the support arm 22, and does not protrude from the polishing pad on the rear end side along the axis of the support arm 22. Shape. A plurality of spiral grooves are provided on the inner surface of the guard plate 49. In addition, the attachment angle of the guard plate 49 is 45 ° to 90 °, and is 50 ° here.

  Thus, in the polishing apparatus according to the fifth embodiment of the present invention, on the rear end side along the axis of the support arm 22, the asymmetrical guard plate 49 that does not protrude from the polishing pad is used to surround the polishing head 23. All of the slurry drops fall on the polishing pad 25. Therefore, the dispersed slurry can be efficiently recovered and used again for polishing.

Here, the following supplementary notes are attached to the embodiments of the present invention including Examples 1 to 5.
(Appendix 1) A polishing head, a rotatable platen provided on the polishing table, a polishing pad fixed on the platen, and a polishing head that fixes and polishes a member to be polished and presses against the polishing pad And an arm that slidably supports the polishing head, and a support part that supports the polishing head of the arm covers an upper surface and a side surface of the polishing head, and an inner surface does not have a horizontal part. A polishing apparatus comprising:
(Appendix 2) The polishing according to appendix 1, wherein the mechanism is a shielding plate provided on four sides of the polishing head, front, rear, left and right, and provided with a protruding structure on the inner surface facing the polishing head. apparatus.
(Supplementary note 3) The polishing apparatus according to supplementary note 2, wherein the protrusion-like structure provided on the shielding plate is a hook-like protrusion structure extending in a direction intersecting the horizontal direction.
(Supplementary Note 4) protruding structure provided on the shield plate, that the pyramidal protrusion-like structures which are divided by a groove extending in a direction intersecting the horizontal direction grooves extending in a horizontal direction The polishing apparatus according to Supplementary Note 2, which is characterized.
(Supplementary Note 5) The polishing apparatus according to Supplementary Note 2, wherein the protruding structure provided on the shielding plate is a hemispherical protruding structure.
(Supplementary note 6) The polishing apparatus according to supplementary note 1, wherein the mechanism is a hook-shaped shield having a spiral groove formed on an inner surface facing the polishing head.
(Supplementary note 7) The polishing apparatus according to supplementary note 6, wherein the hook-shaped shield has a shape such that a rear end side of the shield with respect to the arm does not protrude from the polishing pad.
(Supplementary note 8) The polishing apparatus according to supplementary note 7, wherein a lower end of the spiral groove is provided only on a front end side and a left and right end side with respect to the arm of the bottom of the bowl-shaped shield.
(Appendix 9) The polishing apparatus according to appendix 7 or appendix 8, wherein the mechanism is a concave structure formed integrally with the arm provided in the vicinity of a support portion for supporting the polishing head of the arm. .
(Supplementary note 10) The polishing apparatus according to any one of supplementary notes 1 to 9, wherein an inner surface of the mechanism facing the polishing head is coated with a water-repellent substance.
(Supplementary Note 11) In the step of rotating and polishing the polishing head with the polishing member fixed to the polishing pad, the slurry scattered by the rotation is shielded by a mechanism, and the shielded slurry is dropped onto the polishing pad. Polishing method characterized by polishing while.
(Supplementary note 12) The polishing method according to supplementary note 11, wherein the shielding slurry is polished without dripping the slurry outside the polishing pad.
(Additional remark 13) Every time polishing of one member to be polished is completed, the mechanism is cleaned with the member to be polished removed and the polishing head positioned on the load cup. 14. The polishing method according to appendix 11 or appendix 12, which is characterized.

DESCRIPTION OF SYMBOLS 1 Polishing stand 2 Arm 3 Polishing head 4 Platen 5 Polishing pad 6 Shielding mechanism 7 Conditioner head 8 Rotating arm 9 Slurry nozzle 10 Load cup 11 Polishing member supply device 12 Polishing member 13 Slurry 14 Slurry splash 15 Slurry droplet 16 Shower mechanism 17 Shower 21, 51 Polishing table 22, 52 Support arm 23, 53 Polishing head 24, 54 Platen 25, 55 Polishing pad 26, 27 Guard plate 28 Fixing screw 29, 56 Conditioner 30, 57 Conditioner head 31, 58 Rotating arms 32, 59 Slurry nozzles 33, 60 Load cups 34, 61 Wafer supply devices 35, 62 Wafer 36 Triangular hook-shaped projections 37, 38 Guard plate 39 Square pyramidal projections 40, 41 Guard plate 42 Hemispherical projection 43 Guard plate 44 Fixing screws 45, 4 Grooves 46 and 48 dropping inlet 49 guard plate 63 slurry 64 slurry splash 65 dried slurry

Claims (7)

  1. A polishing table;
    A rotatable platen provided on the polishing table;
    A polishing pad fixed on the platen;
    A polishing head for fixing a member to be polished and pressing and polishing the polishing pad;
    An arm that slidably supports the polishing head ;
    A mechanism that is a hook-shaped shield covering the upper surface and the side surface of the polishing head on the support portion of the arm that supports the polishing head ;
    I have a,
    When the polishing head is disposed at a position where polishing is performed, the hook-shaped shield has a shape in which a rear end side of the shield with respect to the arm is included in the polishing pad in a top view. Polishing equipment.
  2. The hook-shaped shield has a plurality of spiral grooves formed on the inner surface facing the polishing head,
    The lower ends of the plurality of grooves are on the rear end side with respect to the arm of the bottom of the bowl-shaped shield, and are spaced apart from one left and right end side to the other left and right end side. The polishing apparatus according to claim 1.
  3. A polishing table;
    A rotatable platen provided on the polishing table;
    A polishing pad fixed on the platen;
    A polishing head for fixing a member to be polished and pressing and polishing the polishing pad;
    An arm that slidably supports the polishing head;
    Cover the upper and side surfaces of the polishing head on the support portion of the arm that supports the polishing head.
    A mechanism that is a bowl-shaped shield;
    Have
    The hook-shaped shield has a plurality of spiral grooves formed on the inner surface facing the polishing head,
    The lower ends of the plurality of grooves are on the rear end side with respect to the arm of the bottom of the bowl-shaped shield, and are spaced apart from one left and right end side to the other left and right end side. Polishing equipment.
  4. The polishing apparatus according to any one of claims 1 to 3, wherein the hook-shaped shield has a recessed structure formed integrally with the arm.
  5. In the process of rotating and polishing by pressing a polishing head supported by an arm so as to be swingable and fixing a member to be polished against a polishing pad,
    The slurry that splashes with the rotation is shielded by a mechanism that is a bowl-shaped shield having a shape in which the rear end side with respect to the arm is included in the polishing pad in a top view, and the shielded slurry is dropped onto the polishing pad. Polishing method characterized by polishing while.
  6. The hook-shaped shield has a plurality of spiral grooves formed on the inner surface facing the polishing head,
    The lower ends of the plurality of grooves are on the rear end side with respect to the arm of the bottom of the bowl-shaped shield, and are spaced apart from one left and right end side to the other left and right end side. The polishing method according to claim 5.
  7. In the process of rotating and polishing by pressing a polishing head supported by an arm so as to be swingable and fixing a member to be polished against a polishing pad,
    A plurality of spiral grooves are formed on the inner surface of the slurry facing the polishing head, and the lower ends of the grooves are on the rear end side with respect to the arm at the bottom of the slurry. Polishing characterized in that it is shielded by a mechanism that is a bowl-shaped shield that is spaced from the end side to the other left and right end sides, and polishing is performed while dripping the shielded slurry onto the polishing pad. Method.
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JP3733973B2 (en) * 1993-12-14 2006-01-11 株式会社東芝 Polishing device
JPH10209102A (en) * 1997-01-17 1998-08-07 Dainippon Screen Mfg Co Ltd Substrate processor
JP3231659B2 (en) * 1997-04-28 2001-11-26 日本電気株式会社 Automatic polishing equipment
JP2001053040A (en) * 1999-08-09 2001-02-23 Matsushita Electric Ind Co Ltd Polishing device and method
JP2001277114A (en) * 2000-03-30 2001-10-09 Rodel Nitta Co Sheet and cover for preventing splashing of slurry in polishing machine
JP2002204771A (en) * 2001-01-11 2002-07-23 Harman Kikaku:Kk Dishwasher
JP2011111082A (en) * 2009-11-27 2011-06-09 Toyota Motor Corp Roof structure for vehicle
JP5932330B2 (en) * 2011-12-28 2016-06-08 株式会社荏原製作所 Liquid splash prevention cup and substrate processing apparatus provided with the cup
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