JP6295139B2 - Cutting equipment - Google Patents

Description

  The present invention relates to a cutting apparatus.

  In order to flatten the bumps (electrodes) formed on the surface of the workpiece, such as a plate-like wafer, and the protective tape attached to the back of the workpiece, it is applied to the bumps and protective tape with a cutting device called a surface planar. On the other hand, a technique for performing a cutting flattening process is known (for example, see Patent Documents 1 and 2).

JP 2005-327838 A JP2013-21017A

  In such cutting flattening processing, flatness (TTV: Total Thickness Variation) of the surface flattened by cutting is required. As a result of extensive research by the inventor, the temperature of the loading / unloading area for loading / unloading the workpiece onto / from the chuck table, the temperature of the chuck table holding the workpiece, and the workpiece held on the chuck table It has been found that the chuck table is slightly deformed during machining due to the different temperatures of the machining areas where the cutting means for performing the flattening process are arranged, and the flatness deteriorates due to the deformation.

  This invention is made | formed in view of the above, Comprising: It aims at providing the cutting device which can suppress the deterioration of the flatness of a workpiece.

  In order to solve the above-described problems and achieve the object, the present invention provides a chuck table having a holding surface for holding a workpiece and a cutting tool while supplying cutting fluid to the workpiece held on the chuck table. A cutting apparatus comprising: a cutting means for cutting; a moving-in / out area for loading and unloading the workpiece on the chuck table; and a moving means for moving the chuck table to a machining area for machining the workpiece by the cutting means, The processing area is partitioned from the loading / unloading area by a partition with an opening that allows movement of the chuck table, and the chuck table is disposed at a position lower than the holding surface, surrounding the main body portion and the main body portion. A water storage tank comprising a bottom portion and a levee wall that surrounds the main body portion from the bottom portion and has an upper end height equal to or lower than the holding surface, and is a temperature adjusted to the temperature of the processing region. Adjusting liquid is stored in the water storage tank, a chuck table for reciprocating the processing region and the loading and unloading area of the temperature difference is equal to or to prevent the deformation due to temperature change.

  In the above cutting apparatus, it is preferable that a temperature adjusting liquid supply means for supplying the temperature adjusting liquid from above toward the holding surface of the chuck table is disposed in the carry-in / out area.

  According to the present invention, the temperature adjustment liquid adjusted to the temperature of the processing region is stored in the water storage tank surrounding the main body of the chuck table, thereby reciprocating between the processing region having a temperature difference and the loading / unloading region. Prevents the chuck table from deforming due to temperature changes. Therefore, according to this invention, there exists an effect that the deterioration of the flatness of a workpiece can be suppressed.

FIG. 1 is a perspective view illustrating a configuration example of a cutting apparatus according to an embodiment. FIG. 2 is a cross-sectional view in the carry-in / out area and the machining area of the cutting apparatus according to the embodiment. FIG. 3 is a plan view in the carry-in / out area and the machining area of the cutting apparatus according to the embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment
FIG. 1 is a perspective view illustrating a configuration example of a cutting apparatus according to an embodiment. FIG. 2 is a cross-sectional view in the carry-in / out area and the machining area of the cutting apparatus according to the embodiment. FIG. 3 is a plan view in the carry-in / out area and the machining area of the cutting apparatus according to the embodiment.

  A cutting apparatus 1 shown in FIG. 1 is a processing apparatus that performs a cutting flattening process for cutting and flattening a surface Wa of a workpiece W. As shown in FIG. 1, the cutting apparatus 1 includes a cassette 10, a conveying unit 20, a centering unit 30, a chuck table 40, a cutting unit 50, a moving unit 60, and a cleaning / drying unit 70. It is configured to include.

  Here, the workpiece W is, for example, a semiconductor wafer having bumps (electrodes) formed on the surface Wa, a semiconductor wafer having a surface protective tape attached to the surface Wa, or an LED (Light Emitting) formed on the surface Wa. Diode) is an optical device wafer or the like whose phosphor is covered with a phosphor. That is, in the workpiece W, the bumps (electrodes) formed on the surface Wa, the surface protection tape attached to the surface Wa, or the phosphor covering the LED elements formed on the surface Wa are caused by the cutting device 1. Cutting flattened. The workpiece W is formed in a disc shape.

  The cassette 10 accommodates a plurality of workpieces W at intervals in the vertical direction. In this embodiment, two cassettes 10 are detachably disposed on the apparatus main body 2 with a holding hand 21 (to be described later) of the conveying means 20 interposed therebetween, and one of the two cassettes 10 has a flat cutting surface. A workpiece W before machining is accommodated, and the other cassette 12 accommodates the workpiece W after cutting flattening.

  The conveyance means 20 conveys the workpiece W. The conveying means 20 carries out the workpiece W from one cassette 11 and conveys it to the centering means 30, and takes out the workpiece W from the cleaning / drying means 70 and carries it into the other cassette 12. A carry-in chuck 22 for taking out the workpiece W from the centering means 30 and conveying it to the chuck table 40; and a carry-out chuck 23 for taking out the workpiece W from the chuck table 40 and conveying it to the cleaning / drying means 70. ing. The carry-in chuck 22 carries the workpiece W into the chuck table 40 in the carry-in / out area LA shown in FIGS. 2 and 3. The unloading chuck 23 unloads the workpiece W from the chuck table 40 in the unloading / loading area LA.

  The center aligning means 30 makes the center of the workpiece W and the center of the chuck table 40 coincide with each other by bringing a plurality of pins arranged at intervals in the circumferential direction into contact with the periphery of the workpiece W. To align with.

  As shown in FIG. 2, the chuck table 40 includes a main body 41 and a water storage tank 42. The chuck table 40 reciprocates between the processing area PA and the loading / unloading area LA by the moving means 60 shown in FIG.

  The main body 41 is made of, for example, stainless steel or the like, and is formed in a disk shape whose vertical thickness is smaller than the diameter. The main body 41 is configured by a vertical upper end of a large number of upright pins, and includes a holding surface 41a for holding the workpiece W and a temperature adjusting liquid supply path 41b to which the temperature adjusting liquid S is supplied. Have. That is, the chuck table 40 has a holding surface 41 a that holds the workpiece W. The many pins constituting the holding surface 41a are formed, for example, by applying nickel plating or the like to copper, stainless steel, aluminum alloy, or the like. The temperature adjustment liquid supply path 41 b is formed in the main body 41 and communicates with the water temperature adjustment apparatus 102 that adjusts the temperature of pure water or the like supplied from the water source 100 via the temperature adjustment liquid supply path 103. . The temperature adjusting liquid supply path 41b is supplied with the temperature adjusting liquid S whose temperature has been adjusted by the water temperature adjusting device 102. The temperature adjustment liquid supply path 41 b discharges the temperature adjustment liquid S to the water storage tank 42. The water temperature adjusting device 102 detects the temperature of the processing area PA detected by, for example, a temperature sensor so that the temperature of the temperature adjusting liquid S discharged from the temperature adjusting liquid supply path 41b to the water storage tank 42 becomes the temperature of the processing area PA. Based on the above, the temperature of pure water or the like supplied from the water source 100 is adjusted.

  The water storage tank 42 surrounds the main body 41 when viewed in the vertical direction, and surrounds the main body 41 from the bottom 42a disposed at a position lower than the holding surface 41a in the vertical direction and from the bottom 42a when viewed in the vertical direction. And an embankment wall 42b whose upper end height is equal to or less than the holding surface 41a in the vertical direction. As shown in FIGS. 2 to 3, the bottom 42 a is formed in a quadrangular shape extending horizontally from the lower side surface of the main body 41 in the vertical direction, and the levee wall 42 b is perpendicular to the four sides of the bottom 42 a. Is formed in a square shape. For this reason, the temperature adjustment liquid S discharged from the temperature adjustment liquid supply path 41b is stored by the bottom part 42a connected to the main body part 41 and the dike wall 42b and the dike wall 42b standing upright from the main body part 41. A water storage tank 42 is formed.

  Further, in the water storage tank 42, even when the amount of the temperature adjusting liquid S stored is rippled due to the influence of the cutting waste or the rotating cutting tool 51 during the cutting flattening process, the temperature adjusting liquid S is applied to the cutting tool 51. It is preferable that the liquid amount does not adhere. In the present embodiment, as shown in FIGS. 2 to 3, in the vertical direction, the position of the upper end of the dike wall 42b is set to the same position as the holding surface 41a, and the drain port formed at the upper end of the dike wall 42b. 42c is formed at a position lower than the holding surface 41a. For this reason, the amount of the temperature adjusting liquid S stored in the water storage tank 42 is lower than the holding surface 41a in the vertical direction. In the present embodiment, the drain port 42c is formed so that, for example, about 95% of the height from the bottom 42a of the main body 41 to the holding surface 41a is immersed in the temperature adjusting liquid S in the vertical direction. The drain port 42c is formed on the side opposite to the opening 81a of the processing chamber 80 in the processing area PA, and drains the temperature adjusting liquid S to the side opposite to the opening 81a of the processing chamber 80.

  The cutting means 50 is for cutting with the cutting tool 51 while supplying the cutting fluid C to the workpiece W held on the chuck table 40. As shown in FIG. 1, the cutting means 50 includes a cutting tool 51, a spindle 52, a housing 53, a motor 54, and an up-and-down moving means 55. The cutting tool 51 is, for example, a diamond cutting tool whose tip (vertical lower end) is formed with an acute angle. The spindle 52 is supported by a housing 53 so as to be rotatable around a vertical rotation axis, and is driven to rotate by a motor 54 constituted by a servo motor or the like. The spindle 52 detachably mounts the cutting tool 51 in parallel with the rotation axis direction via the cutting tool 52a. The housing 53 is supported by an elevating base 56 that is moved up and down in the vertical direction by the elevating and moving means 55. The raising / lowering moving means 55 is provided on the support base 3 erected from the apparatus main body 2 in the vertical direction. The elevating / lowering means 55 includes, for example, a pulse motor and a ball screw, and moves the elevating base 56 relative to the apparatus main body 2 in the vertical direction.

  The cutting means 50 is disposed in the processing chamber 80. Here, the processing chamber 80 is formed by a plurality of partition walls 81 surrounding the cutting means 50. The machining chamber 80 is provided with a cutting fluid nozzle 82 that ejects a cutting fluid C such as pure water toward the cutting tool 51, and a suction duct 83 that has a suction port 83a that sucks the cutting fluid C and cutting waste. ing. The cutting fluid nozzle 82 and the suction duct 83 are arranged to face each other with the cutting means 50 interposed therebetween in the vertical direction, and are arranged in a direction orthogonal to the moving direction of the chuck table 40 moved by the moving means 60. . The cutting fluid C sprayed from the cutting fluid nozzle 82 prevents the temperature of the chuck table 40 and the processing area PA from being lowered by the vaporization heat generated by being sucked by the suction duct 83, and the chuck table 40 and the processing area PA. It is preferable that the temperature of the temperature adjustment liquid S is, for example, about several degrees C. higher than the temperature of the temperature adjustment liquid S.

  Of the plurality of partition walls 81 constituting the processing chamber 80, an opening 81a is formed at the lower end in the vertical direction of the partition wall 81 opposite to the support base 3. The opening 81 a is set to a size that prevents mist such as the cutting fluid C sprayed from the cutting fluid nozzle 82 from leaking out of the processing chamber 80, for example. The opening 81a is wider than the water storage tank 42 in the direction in which the cutting fluid nozzle 82 and the suction duct 83 are opposed, and is opened to above the holding surface 41a of the chuck table 40 in the vertical direction. That is, the opening 81a allows the chuck table 40 to move.

  Further, as shown in FIGS. 2 to 3, a machining area PA in which the workpiece W is machined by the cutting means 50 is set in the machining chamber 80. In the present embodiment, as shown in FIG. 3, when viewed in the vertical direction, the region includes the cutting means 50, the cutting fluid nozzle 82, and the suction duct 83, and the workpiece W is cut and flattened by the cutting tool 51. An area where the processing can be performed is set as a processing area PA. The processing area PA is partitioned from the loading / unloading area LA by a partition wall 81 (a partition wall 81 on the side opposite to the support base 3) having an opening 81a that allows the chuck table 40 to move. Further, the processing area PA is at a lower temperature (for example, a temperature lower by about 4 ° C.) than the carry-in / out area LA because the air in the processing chamber 80 is sucked by the suction duct 83. That is, in the cutting apparatus 1, the chuck table 40 reciprocates between the machining area PA and the carry-in / out area LA having a temperature difference.

  The moving means 60 moves the chuck table 40 to a carry-in / out area LA where the workpiece W is carried into and out of the chuck table 40 and a machining area PA where the workpiece W is machined by the cutting means 50. The moving means 60 includes, for example, a pulse motor, a ball screw, and the like. As shown in FIG. 1, the moving base 61 that supports the chuck table 40 is moved relative to the apparatus main body 2 in the horizontal direction. Let The moving means 60 moves the chuck table 40 to the loading / unloading position LP as shown in FIG. The moving means 60 has a bellows 62 connected to each of the end portions on the support base 3 side and the conveying means 20 side in the moving direction of the chuck table 40, and the cutting fluid C and the temperature adjusting fluid S are supplied to the main body of the apparatus. 2 is waterproof so as not to enter. The cutting fluid C and the temperature adjusting fluid S are received by a flange member (not shown) provided below the bellows 62 in the vertical direction and then discharged out of the apparatus main body 2.

  Here, the carry-in / out area LA is set outside the processing chamber 80. In the present embodiment, as shown in FIG. 3, the region including the temperature adjusting liquid supply means 90 and the loading / unloading position LP as viewed in the vertical direction, the workpiece W is placed on the chuck table by the loading chuck 22 and the unloading chuck 23. An area that can be carried into and out of 40 is set as a carry-in / out area LA. That is, the temperature adjustment liquid supply means 90 is disposed in the carry-in / out area LA. The loading / unloading position LP is a position where the workpiece W is loaded into the chuck table 40 by the loading chuck 22 and is a position where the workpiece W is unloaded from the chuck table 40 by the loading chuck 23. The temperature adjustment liquid supply means 90 supplies the temperature adjustment liquid S, the temperature of which is adjusted to the temperature of the processing area PA, toward the holding surface 41a of the chuck table 40 from above. The temperature adjusting liquid supply means 90 is positioned upright in the vertical direction of the two column portions 91 that are erected from the apparatus main body 2 and are opposed to each other with the chuck table 40 interposed therebetween, and the holding surface 41 a of the chuck table 40. The nozzle part 92 connected with the upper ends of the perpendicular direction of the two pillar parts 91 is provided. The injection amount of the temperature adjusting liquid S injected from the nozzle portion 92 is preferably an injection amount that can suppress the generation of mist and can bring the temperature of the chuck table 40 close to the temperature of the processing area PA. Further, it is preferable that the mist of the temperature adjusting liquid S sprayed from the nozzle portion 92 is sucked into the processing chamber 80, that is, the processing area PA from the opening 81a.

  The cleaning / drying means 70 cleans the workpiece W, which has been subjected to the flattening process, by spraying pure water or the like toward the workpiece W while rotating the workpiece W at a high speed by a spinner table. Etc. are sprayed toward the workpiece W and dried.

  Next, the basic operation of the cutting apparatus 1 configured as described above will be described. In the cutting apparatus 1 according to the present embodiment, the temperature adjustment liquid S that has been temperature adjusted in advance to the temperature of the processing area PA is stored in the water storage tank 42 before an instruction to execute the cutting flattening process is made. The temperature is adjusted so that the temperature of the table 40 becomes the temperature of the processing area PA.

  The cutting device 1 takes out the workpiece W accommodated in one cassette 11 and performs centering based on an instruction input for performing cutting flattening by an operator, and then carries in / out the carry-in / out area LA. Carry into the chuck table 40 at the position LP. Here, in the cutting apparatus 1, the workpiece W is carried into the chuck table 40 in the carry-in / out area LA, which is relatively higher in temperature than the machining area PA.

  The cutting apparatus 1 moves the chuck table 40 that holds the workpiece W on the holding surface 41a from the carry-in / out area LA to the machining area PA while spraying the temperature adjusting liquid S from the nozzle portion 92 of the temperature adjusting liquid supply means 90. Move. Here, in the cutting apparatus 1, the temperature adjustment liquid S is injected from the temperature adjustment liquid supply unit 90 toward the chuck table 40 that holds the workpiece W, and the temperature adjustment liquid S is not injected from the temperature adjustment liquid supply unit 90. In a shorter time than the case, the temperatures of the workpiece W and the chuck table 40 are brought close to the temperature of the machining area PA. In the cutting apparatus 1, the movement of the chuck table 40 is temporarily stopped at a position where the chuck table 40 does not overlap the cutting means 50 when viewed in the vertical direction.

  The cutting apparatus 1 moves the cutting means 50 relative to the apparatus main body 2 in the vertical direction based on the cutting amount (cutting amount) set by an operator, for example, and rotates the spindle 52 at high speed (for example, several thousand) rpm). Further, the cutting apparatus 1 stops spraying the temperature adjusting liquid S from the temperature adjusting liquid supply means 90 toward the chuck table 40, and directs the chuck table 40 toward the support base 3 to a predetermined feed rate ( For example, it is moved at several mm / second). Here, in the cutting device 1, the cutting flattening process is performed on the workpiece W with the set cutting amount. In the cutting device 1, the temperature adjusting liquid S adjusted to the temperature of the processing area PA is stored in the water storage tank 42, the temperature of the chuck table 40 is maintained at the temperature of the processing area PA, and the temperature of the chuck table 40 changes. Is prevented from being deformed.

  The cutting device 1 unloads the workpiece W from the chuck table 40 at the loading / unloading position LP in the loading / unloading area LA after the cutting flattening process, and stores the cleaned and dried workpiece W in the other cassette 12. .

  As described above, according to the cutting device 1 according to the embodiment, the temperature adjustment liquid S adjusted in temperature to the temperature of the processing area PA is stored, and the height in the vertical direction from the bottom 42a of the main body 41 to the holding surface 41a is stored. Since about 95% of the thickness is immersed in the temperature adjusting liquid S, even if the chuck table 40 is moved from the loading / unloading area LA having a temperature difference of several degrees to the processing area PA, the machining area PA and the loading / unloading area The temperature change of the chuck table 40 due to the temperature difference from LA can be suppressed. That is, according to the cutting device 1 according to the embodiment, the chuck table 40 can be prevented from being deformed due to a temperature change during the cutting flattening process. Therefore, according to the cutting device 1 which concerns on embodiment, there exists an effect that the deterioration of the flatness (Total Thickness Variation: TTV) of the workpiece W can be suppressed.

  Further, according to the cutting apparatus 1 according to the embodiment, when the chuck table 40 moves from the carry-in / out area LA to the machining area PA, the temperature adjusting liquid is supplied from the temperature adjusting liquid supply means 90 disposed in the carry-in / out area LA. Since S is sprayed toward the chuck table 40, the temperature of the workpiece W held on the chuck table 40 and the holding surface 41a can be brought close to the temperature of the processing area PA in a short time.

  Next, the inventor of the present invention confirmed the effect of the present invention by experiments. The results are shown in Table 1.

  In the experiment, both of the products 1 and 2 of the present invention and Comparative Examples 1 to 4 were measured using the cutting device 1 at a room temperature (that is, the temperature of the carry-in / out area LA) of 23 ° C., the rotation speed of the spindle 52 of 6000 rpm, A semiconductor wafer having bumps (electrodes) formed on the surface Wa at a feed rate of 2 mm / sec was used as a workpiece W, and the bumps were subjected to cutting flattening. In the experiment, the temperature of the processing area PA was 19 ° C. in both the products 1 and 2 of the present invention and the comparative examples 1 to 4.

  In the products 1 and 2 of the present invention, the amount of the temperature adjusting liquid S stored in the water storage tank 42 is full. In the product 1 of the present invention, the water temperature of the temperature adjusting solution S was 20 ° C., and in the product 2 of the present invention, the water temperature of the temperature adjusting solution S was 19 ° C. On the other hand, in Comparative Example 1, the amount of the temperature adjusting liquid S stored in the water storage tank 42 was set to zero (none). Moreover, in the comparative example 2, the water quantity of the temperature adjustment liquid S stored by the water storage tank 42 was made into the middle, and the water temperature of the temperature adjustment liquid S was 23 degreeC same as room temperature. Further, in Comparative Example 3, the amount of the temperature adjustment liquid S stored in the water storage tank 42 was full, and the temperature of the temperature adjustment liquid S was 23 ° C., the same as the room temperature. Moreover, in the comparative example 4, the water quantity of the temperature adjustment liquid S stored in the water storage tank 42 was made into the middle, and the water temperature of the temperature adjustment liquid S was 20 degreeC. Note that the amount of water at which the temperature adjustment liquid S is full is the amount of water in which about 95% of the height from the bottom 42a of the main body 41 to the holding surface 41a is immersed in the temperature adjustment liquid S in the vertical direction. Further, the amount of water in which the temperature adjusting liquid S is intermediate is the amount of water in which about 50% of the height from the bottom 42a of the main body 41 to the holding surface 41a is immersed in the temperature adjusting liquid S in the vertical direction.

  Further, in the experiment, a case where the TTV of the bump subjected to the cutting flattening processing is 1 μm or less is indicated by “◯”, and a case where the bump TTV exceeds 1 μm is indicated by “X”.

  According to the result of Table 1, since the comparative example 1 does not have the temperature adjustment liquid S stored in the water storage tank 42, the chuck table 40 that moves from the carry-in / out area LA having a temperature difference of 4 ° C. to the processing area PA is provided. It became clear that it was deformed by temperature change. Further, according to the results of Table 1, in Comparative Example 2 and Comparative Example 3, the temperature adjustment liquid S having the same temperature as the room temperature was stored in the water tank 42, but the water temperature of the temperature adjustment liquid S was the same as the room temperature. Since it was 0 ° C., it became clear that the chuck table 40 was deformed due to a temperature change in the processing area PA having a temperature 4 ° C. lower than the carry-in / out area LA. Moreover, according to the result of Table 1, since the temperature adjustment liquid S of the temperature of 20 degreeC was stored in the water storage tank 42 in the comparative example 4, since the amount of water of the temperature adjustment liquid S was intermediate | middle, it is a carrying in / out area | region. In LA, it became clear that the temperature of the chuck table 40 was not sufficiently brought close to the temperature of the processing area PA, and the chuck table 40 was deformed due to a temperature change. That is, according to the result of Table 1, it became clear that Comparative Examples 1-4 cannot suppress the deterioration of the flatness of the workpiece W.

  On the other hand, according to the results of Table 1, in the product 1 of the present invention, the temperature adjustment liquid S of 20 ° C. close to the temperature of the processing area PA is stored in the water storage tank 42 with full water. It has been clarified that the deformation of the chuck table 40 due to a temperature change can be suppressed in the processing area PA at a temperature lower by 4 ° C. Further, according to the results in Table 1, the product 2 of the present invention has the same temperature as the processing area PA and the temperature adjustment liquid S of 19 ° C. is stored in the water storage tank 42 with full water. It has been clarified that the chuck table 40 can be prevented from being deformed by a temperature change. That is, according to the result of Table 1, it became clear that this invention products 1 and 2 can suppress the deterioration of the flatness of the workpiece W.

  In the above embodiment, the water storage tank 42 is formed in a quadrangular shape as viewed in the vertical direction, but the temperature adjusting liquid S can be stored in the water storage tank 42, and the temperature of the main body 41 of the chuck table 40 is adjusted. As long as it can be immersed in the liquid S, it may be, for example, a circular shape or a polygonal shape as viewed in the vertical direction.

  In the above embodiment, the temperature adjustment liquid supply means 90 is disposed in the carry-in / out area LA. However, the chuck table 40 is deformed by a temperature change by the temperature adjustment liquid S stored in the water storage tank 42. Can be suppressed, the temperature adjustment liquid supply means 90 may not be disposed in the carry-in / out area LA. Further, the supply of the temperature adjustment liquid S from the temperature adjustment liquid supply means 90 may be continued during the cutting flattening process.

  In the above-described embodiment, the workpiece W is a semiconductor wafer, an optical device wafer, or the like. For example, various electronic devices such as an inorganic material substrate, a ductile resin material substrate, a ceramic substrate, a glass plate, and a liquid crystal display driver are used. Various processing materials such as parts may be used.

DESCRIPTION OF SYMBOLS 1 Cutting device 40 Chuck table 41 Main-body part 41a Holding surface 42 Water storage tank 42a Bottom part 42b Embankment wall 50 Cutting means 51 Bit 60 Moving means 81 Bulkhead 81a Opening 90 Temperature control liquid supply means C Cutting liquid LA Carry-in / out area PA Processing area S Temperature Adjustment liquid W Workpiece

Claims (2)

A chuck table having a holding surface for holding a workpiece, cutting means for cutting with a cutting tool while supplying a cutting fluid to the workpiece held on the chuck table, and loading and unloading the workpiece on the chuck table A cutting device comprising a carry-in / out region and a moving means for moving the chuck table to a processing region where the workpiece is processed by the cutting means;
The processing area is
Partitioned from the loading / unloading area by a partition wall having an opening allowing movement of the chuck table;
The chuck table is
A main body having the holding surface;
A bottom portion that surrounds the main body portion and is disposed at a position lower than the holding surface, and a levee wall that stands and surrounds the main body portion from the bottom portion and has a height at the upper end equal to or lower than the holding surface. A water tank,
Cutting in which the temperature adjustment liquid adjusted to the temperature of the processing region is stored in the water storage tank, and the chuck table that reciprocates between the processing region having a temperature difference and the carry-in / out region is prevented from being deformed by a temperature change. apparatus.   The cutting apparatus according to claim 1, wherein a temperature adjusting liquid supply means for supplying the temperature adjusting liquid from above toward the holding surface of the chuck table is disposed in the carry-in / out area.

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