TWI805897B - Processing device - Google Patents

Processing device Download PDF

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TWI805897B
TWI805897B TW109104999A TW109104999A TWI805897B TW I805897 B TWI805897 B TW I805897B TW 109104999 A TW109104999 A TW 109104999A TW 109104999 A TW109104999 A TW 109104999A TW I805897 B TWI805897 B TW I805897B
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cassette
processing
wafer
workpiece
processing device
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TW109104999A
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TW202031411A (en
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山中聡
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日商迪思科股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

[課題]縮短加工裝置之待機時間。[解決手段]在容納於第一卡匣51之所有晶圓W的加工結束前，例如第一卡匣51內的晶圓W殘存數量為預定數量以下時，或從第一卡匣51取出特定晶圓W後，早期通知設定部31使顯示燈60根據正在加工之晶圓W的位置而通知預定訊號。亦即，可在所有晶圓W的加工結束前，例如將對所有晶圓W的加工即將結束的資訊通知操作者。藉此，操作者可根據藉由顯示燈60所通知的訊號而進行作業。藉此，操作者可縮短研削裝置1之待機時間。[Problem] Shorten the standby time of processing equipment. [Solution] Before the processing of all the wafers W stored in the first cassette 51 is completed, for example, when the remaining number of wafers W in the first cassette 51 is less than a predetermined number, or a specific wafer W is taken out from the first cassette 51. After the wafer W is processed, the early notification setting unit 31 makes the display lamp 60 notify a predetermined signal according to the position of the wafer W being processed. That is, before the processing of all the wafers W is completed, for example, the operator can be notified that the processing of all the wafers W is about to be completed. Thereby, the operator can perform work according to the signal notified by the display lamp 60 . Thereby, the operator can shorten the standby time of the grinding device 1 .

Description

加工裝置Processing device

本發明是關於一種加工裝置。The invention relates to a processing device.

在以加工工具加工保持於卡盤台之被加工物的加工裝置中，已有具備通知設備的加工裝置。通知設備是用於將加工裝置之運行狀態及其變化通知正在遠離加工裝置處工作的操作者的設備，例如有信號塔或蜂鳴器。Among processing devices that process a workpiece held on a chuck table with a processing tool, there is a processing device provided with a notification device. The notification device is a device for notifying the operating status of the processing device and its changes to the operator who is working away from the processing device, such as a signal tower or a buzzer.

通知設備以預先設定的內容運作（參照專利文獻1及2）。例如為信號塔的情形，在加工裝置正常運作時是點亮綠色光源，在加工正常結束後閃爍綠色光源。又，為蜂鳴器的情形，例如在加工正常結束後鳴響起斷續音。 [習知技術文獻] [專利文獻]The notification device operates with preset content (see Patent Documents 1 and 2). For example, in the case of a signal tower, the green light source is turned on when the processing device is operating normally, and the green light source is blinking after the processing is completed normally. In addition, in the case of a buzzer, for example, an intermittent sound is sounded after processing is normally completed. [Prior art literature] [Patent Document]

[專利文獻1]日本特開2009－043950號公報 [專利文獻2]日本特開2012－089853號公報[Patent Document 1] Japanese Unexamined Patent Publication No. 2009-043950 [Patent Document 2] Japanese Unexamined Patent Publication No. 2012-089853

[發明所欲解決的課題] 如上述的加工裝置，為了在運行狀態變化時使通知設備運作，具備已預先規定運行狀態及通知設備的運作內容之設定表。[Problems to be Solved by the Invention] In order to operate the notification device when the operation state changes, the above-mentioned processing device is provided with a setting table in which the operation state and the operation content of the notification device are predetermined.

但如上述，在以往的加工裝置中是在運行狀態改變時，將表示其狀態的訊號通知操作者。例如在結束被加工物的加工時，將表示加工結束的訊號通知操作者。因此，在這種情況下，在從加工結束後到操作者準備接著要加工的被加工物為止之間，加工裝置會產生待機時間。However, as mentioned above, in the conventional processing equipment, when the operating state changes, a signal indicating the state is notified to the operator. For example, when the processing of the workpiece is finished, the operator is notified of a signal indicating the completion of processing. Therefore, in this case, the processing apparatus takes a standby time until the operator prepares the workpiece to be processed next after the processing is completed.

本發明之目的為縮短加工裝置的待機時間。The object of the present invention is to shorten the standby time of processing equipment.

[解決課題的技術手段] 本發明的加工裝置（本加工裝置）具備：卡匣台，用於載置具有多個容納被加工物之層架的卡匣；機械手臂，具有保持部及升降軸，並由該卡匣取出被加工物，該保持部保持容納於載置在該卡匣台之該卡匣中的被加工物，該升降軸使該保持部在該層架的排列方向升降；卡盤台，保持由該卡匣取出之該被加工物；加工手段，藉由加工工具加工保持於該卡盤台之該被加工物；及通知設備，將表示加工裝置之運行狀態的訊號通知操作者； 其中，該加工裝置具備早期通知設定部，在容納於該卡匣之所有被加工物之加工結束前，使該通知設備通知預定訊號。[Technical means to solve the problem] The processing device (this processing device) of the present invention includes: a cassette table for placing a cassette having a plurality of shelves for accommodating objects to be processed; For the workpiece, the holding part holds the workpiece placed in the cassette of the cassette table, and the lifting shaft lifts the holding part in the arrangement direction of the shelf; the chuck table is held by the The processed object taken out of the cassette; the processing means, which processes the processed object held on the chuck table by the processing tool; and the notification device, which notifies the operator of the signal indicating the operating status of the processing device; Wherein, the processing device is provided with an early notification setting unit, which causes the notification device to notify a predetermined signal before the processing of all the workpieces stored in the cassette is completed.

本加工裝置可進一步具備辨識部，在已取出容納於該卡匣之被加工物時，辨識該卡匣中的被加工物之殘存數量是否為預定數量以下。在此情況下，該早期通知設定部在已藉由該辨識部辨識出該殘存數量為預定數量以下時，可使該通知設備通知對應於被取出之被加工物在該加工裝置內的位置之訊號。The processing device may further include an identification unit configured to identify whether or not the remaining number of workpieces in the cassette is less than or equal to a predetermined number when the workpieces stored in the cassette have been taken out. In this case, the early notification setting unit may cause the notification device to notify the position corresponding to the position of the processed object taken out in the processing device when the recognition unit has recognized that the remaining quantity is less than a predetermined quantity. signal.

又，本加工裝置可進一步具備設定部，將容納於該卡匣之至少一個被加工物設定作為特定被加工物。在此情況下，該早期通知設定部可使該通知設備通知對應於該特定被加工物在該加工裝置內的位置之訊號。Moreover, this processing apparatus may further comprise the setting part which sets at least one to-be-processed object accommodated in the said cassette as a specific to-be-processed object. In this case, the early notification setting unit may cause the notification device to notify a signal corresponding to the position of the specific workpiece within the processing device.

[發明功效] 本加工裝置中，早期通知設定部在容納於卡匣之所有被加工物的加工結束前，例如卡匣內之被加工物的殘存數量變成預定數量以下時，或由卡匣取出特定被加工物後，根據正進行加工之被加工物其在本加工裝置內的位置，而使通知設備通知預定訊號。亦即，在本加工裝置中，可在對所有被加工物之加工結束前，將例如對所有被加工物之加工即將結束的資訊通知操作者。[Efficacy of the invention] In this processing device, the early notification setting unit takes out a specific workpiece from the cassette when, for example, the number of remaining workpieces in the cassette becomes less than a predetermined amount before the processing of all the workpieces stored in the cassette is completed. Afterwards, according to the position of the workpiece being processed in the processing device, the notification device is notified of a predetermined signal. That is, in this processing device, before the processing of all the workpieces is completed, the operator can be notified that the processing of all the workpieces is about to be completed, for example.

因此，在本加工裝置中，操作者可根據藉由通知設備所通知的訊號而順利地進行作業，例如可準備容納有接著要加工之被加工物的新卡匣。藉此，操作者可縮短本加工裝置的待機時間。Therefore, in this processing device, the operator can smoothly carry out the operation according to the signal notified by the notification device, for example, can prepare a new cassette containing the workpiece to be processed next. Thereby, the operator can shorten the standby time of this processing apparatus.

圖1所示的本實施方式之研削裝置1是構成為針對被加工物之一例的晶圓W，以全自動實施包含搬入處理、研削加工、清洗處理及搬出處理之一連串的作業。The grinding apparatus 1 of this embodiment shown in FIG. 1 is configured to fully automatically perform a series of operations including carrying-in processing, grinding processing, cleaning processing, and carrying-out processing for a wafer W as an example of a workpiece.

如圖1所示，晶圓W例如為圓形半導體晶圓。在圖1中，朝向下方的晶圓W之正面Wa保持多個元件，並藉由黏貼有未圖示之保護膠膜而被保護。晶圓W之背面Wb為實施研削加工的被加工面。As shown in FIG. 1 , the wafer W is, for example, a circular semiconductor wafer. In FIG. 1 , the front surface Wa of the wafer W facing downward holds a plurality of components, and is protected by affixing a protective film (not shown). The back surface Wb of the wafer W is a surface to be processed for grinding.

研削裝置1具備：大致呈矩形之第一裝置基座11；第二裝置基座12，連結於第一裝置基座11的後方（＋Y方向側）；往上方延伸之柱體13；以及框體14，覆蓋第一裝置基座11及第二裝置基座12。The grinding device 1 includes: a substantially rectangular first device base 11; a second device base 12 connected to the rear (+Y direction side) of the first device base 11; a column 13 extending upward; and a frame 14 , covering the first device base 11 and the second device base 12 .

在第一裝置基座11之正面側（－Y方向側）設置有第一卡匣台151及第二卡匣台152。於第一卡匣台151載置容納有加工前的晶圓W之第一卡匣51。於第二卡匣台152載置容納有加工後的晶圓W之第二卡匣52。The first cassette stand 151 and the second cassette stand 152 are provided on the front side (the −Y direction side) of the first device base 11 . The first cassette 51 containing the unprocessed wafer W is placed on the first cassette table 151 . The second cassette 52 containing the processed wafer W is placed on the second cassette table 152 .

第一卡匣51及第二卡匣52的內部具備容納晶圓W之多個層架，各層架各容納有一片晶圓W。第一卡匣51及第二卡匣52彼此具有相同之構成。Inside the first cassette 51 and the second cassette 52 are provided a plurality of shelves for accommodating wafers W, each of which holds a wafer W. The first cassette 51 and the second cassette 52 have the same configuration as each other.

圖2中由＋Y方向視角表示第一卡匣51。如圖2所示，第一卡匣51具有朝向＋Y方向之開口511。又，第一卡匣51於其內部在Z軸方向隔開預定間隔以具備多個層架513。層架513形成於第一卡匣51之側壁512的內面。層架513由其中央區域切開成圓形或矩形之平板所構成。因此，各層架513可在支撐晶圓W之外周區域的狀態下容納晶圓W。 如上述，第一卡匣51可藉由多個層架513在大致水平的狀態下容納多片晶圓W。In FIG. 2 , the first cassette 51 is shown from the perspective of +Y direction. As shown in FIG. 2 , the first cassette 51 has an opening 511 facing the +Y direction. In addition, the first cassette 51 is provided with a plurality of shelves 513 at predetermined intervals in the Z-axis direction. The shelf 513 is formed on the inner surface of the side wall 512 of the first cassette 51 . The shelf 513 is formed by a flat plate whose central area is cut into a circle or a rectangle. Therefore, each shelf 513 can accommodate the wafer W while supporting the outer peripheral region of the wafer W. As shown in FIG. As mentioned above, the first cassette 51 can accommodate a plurality of wafers W in a substantially horizontal state through the plurality of shelves 513 .

又，如圖1所示，在第一卡匣51之開口511的＋Y方向側配設有機械手臂55。 如圖3所示，機械手臂55具有：保持部551，用於保持晶圓W；及驅動部553，驅動保持部551。 保持部551的正面與未圖示之吸引源連通，並可吸附保持晶圓W。Moreover, as shown in FIG. 1 , a robot arm 55 is disposed on the +Y direction side of the opening 511 of the first cassette 51 . As shown in FIG. 3 , the robot arm 55 has: a holding unit 551 for holding the wafer W; and a driving unit 553 for driving the holding unit 551 . The front surface of the holding portion 551 communicates with an unillustrated suction source, and can hold the wafer W by suction.

驅動部553控制（調整）保持部551的位置。詳細而言，驅動部553具備Z軸方向移動機構561及水平移動機構563。 Z軸方向移動機構561作為使保持部551沿著Z軸方向上下移動的升降軸而發揮作用。亦即，Z軸方向移動機構561使保持部551與水平移動機構563一起在Z軸方向，亦即沿著層架513之排列方向而升降。The drive unit 553 controls (adjusts) the position of the holding unit 551 . Specifically, the driving unit 553 includes a Z-axis direction movement mechanism 561 and a horizontal movement mechanism 563 . The Z-axis direction movement mechanism 561 functions as a lift shaft for moving the holding portion 551 up and down in the Z-axis direction. That is, the Z-axis moving mechanism 561 moves the holding part 551 together with the horizontal moving mechanism 563 in the Z-axis direction, that is, along the arrangement direction of the shelves 513 .

水平移動機構563使保持部551在水平方向上移動。如圖3所示，水平移動機構563例如具有：外殼570，支撐保持部551；第一回旋手段571，使外殼570在水平方向上回旋；第一臂572，支撐第一回旋手段571；第二回旋手段573，使第一臂572在水平方向上回旋；第二臂574，支撐第二回旋手段573；及第三回旋手段575，使第二臂574在水平方向上回旋。The horizontal movement mechanism 563 moves the holding part 551 in the horizontal direction. As shown in Figure 3, the horizontal movement mechanism 563 has, for example: a housing 570, which supports the holding part 551; a first swivel means 571, which swivels the housing 570 in the horizontal direction; a first arm 572, which supports the first swivel means 571; The turning means 573 makes the first arm 572 turn in the horizontal direction; the second arm 574 supports the second turning means 573; and the third turning means 575 makes the second arm 574 turn in the horizontal direction.

在具有如上述構成之機械手臂55中，藉由驅動部553控制保持部551的位置，藉此保持容納於第一卡匣51之層架513上的加工前之晶圓W，再從第一卡匣51取出並載置於暫置區域153a（參照圖1）。又，機械手臂55使用保持部551及驅動部553將加工後的晶圓W搬入至第二卡匣52之層架513。In the robot arm 55 having the above-mentioned structure, the position of the holding part 551 is controlled by the driving part 553, thereby holding the unprocessed wafer W contained on the shelf 513 of the first cassette 51, and then from the first The cassette 51 is taken out and placed on the temporary storage area 153a (see FIG. 1 ). In addition, the robot arm 55 carries the processed wafer W into the shelf 513 of the second cassette 52 using the holding unit 551 and the driving unit 553 .

如圖1所示，在設置於鄰接機械手臂55之位置的暫置區域153a配設有對位手段153b。對位手段153b使用縮徑的對位銷使載置於暫置區域153a之晶圓W對位（中心校正）於預定位置。As shown in FIG. 1 , an alignment means 153 b is disposed in a temporary storage area 153 a adjacent to the robot arm 55 . The alignment means 153b aligns (centers) the wafer W placed on the provisional area 153a at a predetermined position using alignment pins having a reduced diameter.

於鄰接暫置區域153a之位置設置有搬入機構41。搬入機構41吸附保持已對位的晶圓W，並將其搬送至定位於搬入搬出區域A內之卡盤台30。The carrying-in mechanism 41 is provided in the position adjacent to the temporary storage area 153a. The carry-in mechanism 41 absorbs and holds the aligned wafer W, and transfers it to the chuck table 30 positioned in the carry-in/unload area A.

卡盤台30相當於保持手段的一例。卡盤台30設置在配設於第二裝置基座12上之俯視為圓形的旋轉台17中。旋轉台17具有：隔板18，以平分旋轉台17之方式而設置；及卡盤台30，在隔板18的兩側各設置一個。The chuck table 30 corresponds to an example of holding means. The chuck table 30 is provided on the rotary table 17 which is circular in plan view and arranged on the second device base 12 . The turntable 17 has: partitions 18 provided to bisect the turntable 17 ; and chuck tables 30 provided on both sides of the partition 18 one by one.

旋轉台17可繞著Z軸方向的軸心轉動。藉由旋轉台17轉動而使兩個卡盤台30公轉。藉此，各卡盤台30可分別從搬入搬出區域A往研削區域B移動，及從研削區域B往搬入搬出區域A移動。The rotary table 17 is rotatable around an axis in the Z-axis direction. The two chuck tables 30 are caused to revolve by the rotation of the rotary table 17 . Thereby, each chuck table 30 can move from the loading/unloading area A to the grinding area B, and can move from the grinding area B to the loading/unloading area A, respectively.

卡盤台30可在旋轉台17上繞著Z軸方向的軸心旋轉（自轉）。又，卡盤台30具備吸附晶圓W之保持面300。保持面300與未圖示之吸引源連通，並吸附保持晶圓W。The chuck table 30 is rotatable (self-rotating) around an axis in the Z-axis direction on the rotary table 17 . In addition, the chuck table 30 has a holding surface 300 on which the wafer W is sucked. The holding surface 300 communicates with a suction source (not shown), and holds the wafer W by suction.

在第二裝置基座12上之後方（＋Y方向側）立設有柱體13。在柱體13的前表面設置有：研削手段7，研削晶圓W；及研削進給手段2，使研削手段7在研削進給方向之Z軸方向上移動。On the rear side (+Y direction side) of the second device base 12 , a pillar body 13 is erected. The front surface of the cylinder 13 is provided with: a grinding means 7 for grinding the wafer W; and a grinding feeding means 2 for moving the grinding means 7 in the Z-axis direction of the grinding feeding direction.

研削進給手段2具備：與Z軸方向平行之一對Z軸導軌21；Z軸移動台23，在該Z軸導軌21上滑動；與Z軸導軌21平行之Z軸滾珠螺桿20；Z軸伺服馬達22；及支架24，裝設於Z軸移動台23的前表面（正面）。支架24保持研削手段7。The grinding feed means 2 has: a pair of Z-axis guide rails 21 parallel to the Z-axis direction; a Z-axis moving table 23 sliding on the Z-axis guide rails 21; a Z-axis ball screw 20 parallel to the Z-axis guide rails 21; The servo motor 22 ; and the bracket 24 are installed on the front surface (front side) of the Z-axis moving table 23 . The holder 24 holds the grinding means 7 .

Z軸移動台23為可滑動地設置於Z軸導軌21。未圖示之螺帽部固定於Z軸移動台23的後表面側（背面側）。於該螺帽部螺合有Z軸滾珠螺桿20。Z軸伺服馬達22連結於Z軸滾珠螺桿20的一端部。The Z-axis moving platform 23 is slidably disposed on the Z-axis guide rail 21 . A nut portion (not shown) is fixed to the rear surface side (back surface side) of the Z-axis moving table 23 . The Z-axis ball screw 20 is screwed to the nut portion. The Z-axis servo motor 22 is connected to one end of the Z-axis ball screw 20 .

研削進給手段2中，Z軸伺服馬達22藉由使Z軸滾珠螺桿20旋轉，而使Z軸移動台23沿著Z軸導軌21在Z軸方向上移動。藉此，裝設於Z軸移動台23之支架24、及保持於支架24上之研削手段7也會與Z軸移動台23一起在Z軸方向上移動。In the grinding feeding means 2 , the Z-axis servo motor 22 rotates the Z-axis ball screw 20 to move the Z-axis moving table 23 in the Z-axis direction along the Z-axis guide rail 21 . Thereby, the bracket 24 installed on the Z-axis moving table 23 and the grinding means 7 held on the bracket 24 also move in the Z-axis direction together with the Z-axis moving table 23 .

研削手段7相當於加工手段的一例。研削手段7具備：主軸外殼71，固定於支架24；主軸70，可旋轉地保持於主軸外殼71中；輪安裝件73，裝設於主軸70下端；及研削輪74，被輪安裝件73所支撐。The grinding means 7 corresponds to an example of the processing means. The grinding means 7 has: a main shaft housing 71 fixed to the bracket 24; a main shaft 70 rotatably held in the main shaft housing 71; a wheel mounting part 73 mounted on the lower end of the main shaft 70; and a grinding wheel 74 held by the wheel mounting part 73. support.

主軸外殼71以在Z軸方向上延伸之方式保持於支架24。主軸70以與卡盤台30之保持面300正交的方式在Z軸方向上延伸，並為可旋轉地被支撐於主軸外殼71。The spindle housing 71 is held by the holder 24 so as to extend in the Z-axis direction. The spindle 70 extends in the Z-axis direction so as to be perpendicular to the holding surface 300 of the chuck table 30 , and is rotatably supported by the spindle housing 71 .

主軸70之上端連結有馬達等旋轉驅動源（未圖示）。藉由該旋轉驅動源，主軸70繞著於Z軸方向上延伸之旋轉軸心而旋轉。A rotational drive source (not shown) such as a motor is connected to the upper end of the main shaft 70 . By this rotational drive source, the main shaft 70 rotates around a rotational axis extending in the Z-axis direction.

輪安裝件73形成為圓盤狀，並固定於主軸70的下端（前端）。輪安裝件73支撐研削輪74。研削輪74為加工工具的一例，以具有與輪安裝件73大致相同直徑之方式而形成。研削輪74包含以不鏽鋼等金屬材料所形成之圓環狀的輪基台（環狀基台）740。在輪基台740的下表面固定有環繞全周且環狀地配置之多個研削磨石741。研削磨石741研削保持於卡盤台30之晶圓W。The wheel attachment 73 is formed in a disk shape, and is fixed to the lower end (front end) of the main shaft 70 . The wheel mount 73 supports a grinding wheel 74 . The grinding wheel 74 is an example of a machining tool, and is formed to have substantially the same diameter as the wheel attachment 73 . The grinding wheel 74 includes an annular wheel base (annular base) 740 formed of a metal material such as stainless steel. On the lower surface of the wheel base 740, a plurality of grinding stones 741 are fixed around the entire circumference and arranged in a ring shape. The grinding stone 741 grinds the wafer W held on the chuck table 30 .

研削後之晶圓W藉由搬出機構42而搬出。搬出機構42吸附保持載置於卡盤台30之研削加工後的晶圓W，再由卡盤台30搬出並搬送至單片式旋轉清洗單元26的旋轉台27。The ground wafer W is carried out by the carry-out mechanism 42 . The unloading mechanism 42 absorbs and holds the ground wafer W placed on the chuck table 30 , and then unloads from the chuck table 30 and transports it to the rotary table 27 of the single-wafer rotary cleaning unit 26 .

旋轉清洗單元26具備：旋轉台27，藉由連通至未圖示之吸引源的保持面而吸附保持晶圓W；及各種噴嘴（未圖示），朝向旋轉台27噴射清洗水及乾燥氣體。The spin cleaning unit 26 includes: a spin table 27 for sucking and holding the wafer W through a holding surface connected to an unshown suction source; and various nozzles (not shown) for spraying cleaning water and drying gas toward the spin table 27 .

在旋轉清洗單元26中，已保持晶圓W之旋轉台27下降至第一裝置基座11內。接著，在第一裝置基座11內朝向晶圓W之背面Wb噴射清洗水，並旋轉清洗背面Wb。其後，對晶圓W吹附乾燥氣體以乾燥晶圓W。In the spin cleaning unit 26 , the spin table 27 holding the wafer W is lowered into the first device base 11 . Next, cleaning water is sprayed toward the back surface Wb of the wafer W in the first device susceptor 11 , and the back surface Wb is rotated and cleaned. Thereafter, the wafer W is blown with drying gas to dry the wafer W.

藉由旋轉清洗單元26而清洗完畢之晶圓W藉由機械手臂55而搬入至第二卡匣52。The wafer W cleaned by the rotating cleaning unit 26 is carried into the second cassette 52 by the robot arm 55 .

又，在框體14的上表面具備顯示燈（信號塔）60，用於將運行狀況通知操作者。該顯示燈60相當於通知設備的一例。顯示燈60將表示研削裝置1之運行狀態的光及／或聲音訊號通知操作者。 顯示燈60具備顯示（亮燈）紅色光之紅色顯示部60R、顯示黃色光之黃色顯示部60Y及顯示綠色光之綠色顯示部60G。又，顯示燈60具有用於鳴響警報音之蜂鳴器60B。顯示燈60構成為使用紅、黃及綠之三色光以及警報音而生成訊號，並顯示給操作者看。In addition, a display lamp (signal tower) 60 is provided on the upper surface of the housing 14 for notifying the operator of the operation status. This display lamp 60 corresponds to an example of a notification device. The display lamp 60 notifies the operator of the operating state of the grinding device 1 with a light and/or sound signal. The indicator lamp 60 includes a red display portion 60R that displays (lights up) red light, a yellow display portion 60Y that displays yellow light, and a green display portion 60G that displays green light. In addition, the display lamp 60 has a buzzer 60B for sounding an alarm sound. The display lamp 60 is configured to generate a signal using red, yellow and green lights and an alarm sound, and display it to the operator.

在框體14中的－Y側的側面設置有觸控面板40。觸控面板40顯示研削裝置1之加工狀況，及由研削裝置1對被加工物進行加工之相關加工條件等各種資訊。又，觸控面板40也使用於輸入加工條件等各種資訊。如上述，觸控面板40用作為輸入資訊之輸入手段，同時也用作為顯示所輸入的資訊之顯示手段。A touch panel 40 is provided on the −Y side surface of the housing 14 . The touch panel 40 displays various information such as the processing status of the grinding device 1 and related processing conditions for processing the workpiece by the grinding device 1 . In addition, the touch panel 40 is also used to input various information such as processing conditions. As described above, the touch panel 40 is used as an input means for inputting information, and is also used as a display means for displaying the inputted information.

又，研削裝置1於框體14內部具備控制研削裝置1之各構成要件的控制部3。控制部3控制上述的研削裝置1之各構成要件，並對晶圓W進行操作者所期望的加工。 又，控制部3具備早期通知設定部31、辨識部32及設定部33。Moreover, the grinding device 1 includes a control unit 3 for controlling each component of the grinding device 1 inside the housing 14 . The control unit 3 controls each component of the grinding apparatus 1 described above, and performs processing on the wafer W desired by the operator. Furthermore, the control unit 3 includes an early notification setting unit 31 , a recognition unit 32 , and a setting unit 33 .

早期通知設定部31設定由顯示燈60向操作者通知（顯示）之訊號的產生時機及訊號的種類。例如，早期通知設定部31在容納於第一卡匣51之所有晶圓W的加工結束前，使顯示燈60通知預定訊號。 接著，早期通知設定部31藉由與辨識部32或設定部33之任一者組合使用，而實施兩種種類的訊號設定處理。The early notification setting unit 31 sets the generation timing and the type of the signal to be notified (displayed) to the operator by the indicator light 60 . For example, the early notification setting unit 31 causes the display lamp 60 to notify a predetermined signal before the processing of all the wafers W stored in the first cassette 51 is completed. Next, the early notification setting unit 31 implements two types of signal setting processing by being used in combination with either the recognition unit 32 or the setting unit 33 .

首先說明將早期通知設定部31與辨識部32組合使用的情形。 在研削裝置1中的加工處理中，控制部3為了對晶圓W實施搬入處理、研削加工、清洗處理及搬出處理，首先使用機械手臂55從第一卡匣51取出晶圓W，並載置於暫置區域153a。First, a case where the early notification setting unit 31 and the recognition unit 32 are used in combination will be described. In the processing in the grinding apparatus 1, the control unit 3 first uses the robot arm 55 to take out the wafer W from the first cassette 51 and place it on the in the staging area 153a.

在此，控制部3在從第一卡匣51取出晶圓W時，控制圖3所示的機械手臂55之驅動部553，由開口511將保持部551插入至圖2所示第一卡匣51的最下側之層架513的下方。接著，控制部3使保持部551成為與吸引源連通之狀態。又，控制部3藉由驅動部553之Z軸方向移動機構561而將保持部551往上方提升至保持部551接觸層架513上的晶圓W為止。藉此，藉由保持部551吸附保持第一卡匣51內之晶圓W中位於最下方之晶圓W。Here, when the control unit 3 takes out the wafer W from the first cassette 51, it controls the drive unit 553 of the robotic arm 55 shown in FIG. 3 to insert the holding unit 551 into the first cassette shown in FIG. 51 below the layer shelf 513 on the lowermost side. Next, the control unit 3 makes the holding unit 551 communicate with the suction source. In addition, the control unit 3 lifts the holding unit 551 upwards until the holding unit 551 contacts the wafer W on the shelf 513 by the Z-axis direction moving mechanism 561 of the driving unit 553 . In this way, the lowermost wafer W among the wafers W in the first cassette 51 is sucked and held by the holding portion 551 .

如此，控制部3藉由機械手臂55之保持部551將第一卡匣51中的晶圓W從位於最下方者起依序取出。 此時，辨識部32辨識容納於第一卡匣51之晶圓W的殘存數量是否為預定數量以下。本實施方式所示的例子中，使該預定數量為0。亦即，辨識部32辨識是否已由第一卡匣51取出所有晶圓W，亦即是否已取出最後的晶圓W。In this way, the control unit 3 takes out the wafers W in the first cassette 51 sequentially from the lowest one through the holding unit 551 of the robot arm 55 . At this time, the identification unit 32 identifies whether or not the remaining number of wafers W stored in the first cassette 51 is less than or equal to a predetermined number. In the example shown in this embodiment, the predetermined number is set to zero. That is, the identification part 32 identifies whether all the wafers W have been taken out from the first cassette 51 , that is, whether the last wafer W has been taken out.

具體而言，辨識部32是根據與吸引源連通之保持部551正面之壓力值（真空值）的變化，檢測保持部551已吸附第一卡匣51內之晶圓W。進一步，辨識部32根據吸附晶圓W時的保持部551之Z軸方向的高度，檢測吸附保持於保持部551之晶圓W是被保持在第一卡匣51中的哪一個層架513。Specifically, the identification part 32 detects that the holding part 551 has sucked the wafer W in the first cassette 51 according to the change of the pressure value (vacuum value) on the front side of the holding part 551 communicated with the suction source. Further, the identifying unit 32 detects which shelf 513 in the first cassette 51 the wafer W sucked and held by the holding unit 551 is held on based on the height of the holding unit 551 in the Z-axis direction when the wafer W is sucked.

接著，辨識部32在檢測出吸附保持於保持部551之晶圓W為保持於第一卡匣51中的最上層的層架513之晶圓W時，辨識為已取出最後的晶圓W。Next, when the recognition unit 32 detects that the wafer W sucked and held by the holding unit 551 is the wafer W held on the uppermost shelf 513 in the first cassette 51 , it recognizes that the last wafer W has been taken out.

在已藉由辨識部32辨識到第一卡匣51中的晶圓W之殘存數量為預定數量以下時，控制部3之早期通知設定部31使顯示燈60通知對應於被取出之晶圓W在研削裝置1內的位置之訊號。本實施方式所示之例子中，早期通知設定部31使顯示燈60通知對應於最後之晶圓W在研削裝置1內的位置之訊號。When the identification unit 32 has identified that the remaining number of wafers W in the first cassette 51 is less than a predetermined number, the early notification setting unit 31 of the control unit 3 makes the display lamp 60 notify the wafer W corresponding to the taken-out wafer W. Signaling of the position within the grinding device 1 . In the example shown in this embodiment, the early notification setting unit 31 makes the display lamp 60 notify a signal corresponding to the position of the last wafer W in the grinding apparatus 1 .

圖4表示藉由顯示燈60通知的訊號與通知時期的對應關係，亦即表示顯示燈60之顯示方式的一例。如圖4所示，通知時期為對應於最後之晶圓W在研削裝置1內的位置。FIG. 4 shows the correspondence between the signal notified by the indicator lamp 60 and the notification period, that is, an example of the display form of the indicator lamp 60 . As shown in FIG. 4 , the notification period corresponds to the position of the last wafer W in the grinding apparatus 1 .

在圖4所示的例子中，在以機械手臂55由第一卡匣51取出最後之晶圓W時，早期通知設定部31使顯示燈60之紅色顯示部60R及綠色顯示部60G熄燈並停止蜂鳴器60B，而使黃色顯示部60Y閃爍。In the example shown in FIG. 4, when the last wafer W is taken out from the first cassette 51 by the robot arm 55, the early notification setting part 31 turns off the red display part 60R and the green display part 60G of the indicator light 60 and stops. The buzzer 60B is activated, and the yellow display part 60Y is blinked.

又，早期通知設定部31在最後之晶圓W被搬入於卡盤台30時，使紅色顯示部60R及黃色顯示部60Y閃爍，並使綠色顯示部60G熄燈且停止蜂鳴器60B。最後之晶圓W已被搬入並載置於卡盤台30的情況，例如可根據卡盤台30之保持面300的壓力值（真空值）的變化來進行檢測。Also, early notification setting unit 31 blinks red display unit 60R and yellow display unit 60Y, turns off green display unit 60G, and stops buzzer 60B when the last wafer W is loaded onto chuck table 30 . The fact that the last wafer W has been carried in and placed on the chuck table 30 can be detected by, for example, a change in the pressure value (vacuum value) of the holding surface 300 of the chuck table 30 .

又，在最後之晶圓W被搬入至旋轉台27時，早期通知設定部31使紅色顯示部60R、黃色顯示部60Y及綠色顯示部60G閃爍，並停止蜂鳴器60B。最後之晶圓W已被搬入並載置於旋轉台27的情況，例如可根據旋轉台27之保持面的壓力值的變化來進行檢測。Also, when the last wafer W is loaded into the turntable 27, the early notification setting unit 31 blinks the red display unit 60R, the yellow display unit 60Y, and the green display unit 60G, and stops the buzzer 60B. The fact that the last wafer W has been carried in and placed on the turntable 27 can be detected by, for example, a change in the pressure value of the holding surface of the turntable 27 .

接著，在機械手臂55已保持住旋轉台27上的最後之晶圓W時，早期通知設定部31使黃色顯示部60Y亮燈且使綠色顯示部60G閃爍，並使紅色顯示部60R熄燈且停止蜂鳴器60B。Next, when the robot arm 55 has held the last wafer W on the turntable 27, the early notification setting unit 31 turns on the yellow display unit 60Y, blinks the green display unit 60G, and turns off the red display unit 60R to stop. Buzzer 60B.

最後，在機械手臂55將最後之晶圓W容納於第二卡匣52內時，亦即加工結束時，早期通知設定部31使綠色顯示部60G閃爍，並由蜂鳴器60B發出斷續警報音，且使紅色顯示部60R及黃色顯示部60Y熄燈。由機械手臂55進行的保持最後之晶圓W及將其容納至第二卡匣52的情況，根據機械手臂55之保持部551中正面之壓力值的變化來進行檢測。Finally, when the robot arm 55 accommodates the last wafer W in the second cassette 52, that is, when the processing ends, the early notification setting part 31 makes the green display part 60G blink, and an intermittent alarm is issued by the buzzer 60B. sound, and turn off the red display part 60R and the yellow display part 60Y. The state of holding the last wafer W by the robot arm 55 and accommodating it into the second cassette 52 is detected based on the change of the pressure value at the front side of the holding portion 551 of the robot arm 55 .

接著說明將早期通知設定部31與設定部33組合使用的情形。在此情況下，設定部33將容納於第一卡匣51之至少一片晶圓W設定作為特定晶圓。本實施方式的例子中，設定部33將第一卡匣51中最上層之晶圓W，亦即上述的最後之晶圓W設定作為特定晶圓。特定晶圓相當於特定被加工物的一例。Next, a case where the early notification setting unit 31 and the setting unit 33 are used in combination will be described. In this case, the setting unit 33 sets at least one wafer W accommodated in the first cassette 51 as a specific wafer. In the example of this embodiment, the setting unit 33 sets the uppermost wafer W in the first cassette 51 , that is, the above-mentioned last wafer W, as the specific wafer. A specific wafer corresponds to an example of a specific workpiece.

又，也會有最後之晶圓W不在第一卡匣51最上層的情況。亦即，未於第一卡匣51之所有層中容納晶圓W時，將容納於第一卡匣51之晶圓W中位於最上方之晶圓W設定作為特定被加工物。Also, there may be a case where the last wafer W is not on the uppermost layer of the first cassette 51 . That is, when the wafers W are not accommodated in all the layers of the first cassette 51, the uppermost wafer W among the wafers W accommodated in the first cassette 51 is set as the specific workpiece.

又，特定被加工物可不為位於第一卡匣51之最上方的晶圓W，也可為從上方起第二片晶圓。例如在將從上方起第二片晶圓設定作為特定被加工物時，在機械手臂55之保持部551保持晶圓W前，需要先辨識從上方起的第二片晶圓W。 又，設定特定被加工物之設定部33可設定為以下方式：藉由機械手臂55之保持部551中正面的壓力值的變化及保持部551在Z軸方向的位置，而辨識保持於保持部551之晶圓W為由第一卡匣51搬出之最後之晶圓W。In addition, the specific workpiece may not be the uppermost wafer W located in the first cassette 51, but may be the second wafer from above. For example, when the second wafer W from above is set as a specific workpiece, it is necessary to recognize the second wafer W from above before the holding portion 551 of the robot arm 55 holds the wafer W. In addition, the setting part 33 for setting a specific workpiece can be set in the following manner: through the change of the pressure value on the front side of the holding part 551 of the robot arm 55 and the position of the holding part 551 in the Z-axis direction, it can be identified and held in the holding part The wafer W at 551 is the last wafer W carried out from the first cassette 51 .

接著，藉由控制部3之控制而對多片晶圓W進行加工，且在辨識到機械手臂55之保持部551已吸附保持最後之晶圓W時，早期通知設定部31將使顯示燈60通知對應於藉由設定部33所設定之特定晶圓（亦即最後之晶圓W）在研削裝置1內的位置之訊號。Then, a plurality of wafers W are processed under the control of the control unit 3, and when it is recognized that the holding unit 551 of the robot arm 55 has sucked and held the last wafer W, the early notification setting unit 31 will turn on the display lamp 60 The signal corresponding to the position of the specific wafer (that is, the last wafer W) in the grinding apparatus 1 set by the setting unit 33 is notified.

在此，例如設定部33可根據吸附保持晶圓W時之保持部551的Z軸方向之高度，而辨識已由第一卡匣51取出最後之晶圓W並傳遞該資訊至早期通知設定部31，也可由早期通知設定部31直接辨識。 又，由早期通知設定部31進行來自顯示燈60之通知訊號的控制是如圖4所示。Here, for example, the setting unit 33 can recognize that the last wafer W has been taken out from the first cassette 51 according to the height of the holding unit 551 in the Z-axis direction when the wafer W is sucked and held, and transmit this information to the early notification setting unit. 31, and can also be directly recognized by the early notification setting unit 31. Moreover, the control of the notification signal from the display lamp 60 by the early notification setting unit 31 is as shown in FIG. 4 .

如上述，本實施方式中，早期通知設定部31在容納於第一卡匣51之所有晶圓W的加工結束前，例如在第一卡匣51內的晶圓W殘存數量為預定數量以下時，或在從第一卡匣51取出特定晶圓W後，如圖4所示，根據正在加工之晶圓W在研削裝置1內的位置，而使顯示燈60通知預定訊號。亦即，在本實施方式中，能在對所有晶圓W之加工結束前，例如將對所有晶圓W之加工即將結束的資訊通知操作者。As described above, in this embodiment, the early notification setting unit 31 is configured before the processing of all the wafers W stored in the first cassette 51 is completed, for example, when the remaining number of wafers W in the first cassette 51 is less than a predetermined number. , or after a specific wafer W is taken out from the first cassette 51, as shown in FIG. That is, in the present embodiment, before the processing of all wafers W is completed, for example, the operator can be notified that the processing of all wafers W is about to be completed.

因此，在本實施方式中，操作者可根據藉由顯示燈60所通知的訊號而順利進行作業，例如可準備容納有接著應要加工之晶圓W的新的第一卡匣51。藉此，操作者可縮短研削裝置1之待機時間。Therefore, in this embodiment, the operator can smoothly carry out the work according to the signal notified by the display lamp 60 , for example, can prepare a new first cassette 51 containing the wafer W to be processed next. Thereby, the operator can shorten the standby time of the grinding device 1 .

相對於此，如圖5所示，在以往加工裝置僅根據加工之待機及結束，還有根據錯誤的產生來通知訊號，難以試圖縮短加工裝置之待機時間。On the other hand, as shown in FIG. 5 , in the conventional processing device, a signal is notified only according to the standby and completion of processing, and also according to the occurrence of an error, and it is difficult to shorten the standby time of the processing device.

又，在本實施方式中，在辨識部32檢測到吸附保持於機械手臂55之保持部551上的晶圓W為保持於第一卡匣51中的最上層之層架513的晶圓W時，辨識為已取出最後之晶圓W。但也會有並非在第一卡匣51內的所有層架513都容納有晶圓W的情況，例如會有最上層是空的情況。在此情況下，辨識部32在檢測到即使機械手臂55之保持部551移動至最上層也未有吸附保持晶圓W的情況時，會將之前保持的晶圓W辨識為最後之晶圓W。In addition, in this embodiment, when the identification unit 32 detects that the wafer W held by suction on the holding unit 551 of the robot arm 55 is the wafer W held on the uppermost shelf 513 in the first cassette 51 , it is recognized that the last wafer W has been taken out. However, there may also be a situation that not all shelves 513 in the first cassette 51 contain wafers W, for example, the uppermost shelf may be empty. In this case, when the recognition unit 32 detects that the wafer W has not been sucked and held even though the holding unit 551 of the robot arm 55 has moved to the uppermost layer, it recognizes the previously held wafer W as the last wafer W .

又，在本實施方式中，辨識部32會辨識是否已由第一卡匣51取出最後之晶圓W，且根據此，早期通知設定部31會控制顯示燈60並顯示訊號。但並不限於前述方式，辨識部32可辨識第一卡匣51的殘存數量是否已成為0以外之預定數量，且根據此，早期通知設定部31會控制顯示燈60並顯示訊號。辨識部32可如上述般，由保持晶圓W時的保持部551之高度位置辨識晶圓W的殘存數量。In addition, in this embodiment, the identifying unit 32 will identify whether the last wafer W has been taken out from the first cassette 51, and based on this, the early notification setting unit 31 will control the display lamp 60 and display a signal. But not limited to the aforementioned method, the identification part 32 can identify whether the remaining number of the first cassette 51 has become a predetermined number other than 0, and according to this, the early notification setting part 31 will control the display lamp 60 and display a signal. The identifying unit 32 can identify the remaining number of wafers W from the height position of the holding unit 551 when holding the wafer W as described above.

再者，也會有第一卡匣51具有可檢測晶圓W的殘存數量之感測器的情況。在此情況，辨識部32可根據第一卡匣51之感測器的檢測結果來辨識晶圓W的殘存數量。或者，研削裝置1可具備從開口511拍攝第一卡匣51內部之相機。在此情況，辨識部32可根據由相機所拍攝到的影像來辨識晶圓W的殘存數量。 又，設定部33或早期通知設定部31可藉由上述第一卡匣51之感測器或相機而辨識是否已由第一卡匣51取出特定晶圓。Furthermore, there may be a case where the first cassette 51 has a sensor capable of detecting the remaining number of wafers W. As shown in FIG. In this case, the identifying unit 32 can identify the remaining number of wafers W according to the detection result of the sensor of the first cassette 51 . Alternatively, the lapping device 1 may include a camera that takes pictures of the inside of the first cassette 51 from the opening 511 . In this case, the identifying unit 32 can identify the remaining number of wafers W based on the image captured by the camera. In addition, the setting unit 33 or the early notification setting unit 31 can recognize whether a specific wafer has been taken out from the first cassette 51 through the sensor or camera of the first cassette 51 .

又，顯示燈60具有蜂鳴器60B，作為用於鳴響警報音之裝置。取而代之，顯示燈60也可具備響鈴等蜂鳴器以外之警報音產生裝置。In addition, the display lamp 60 has a buzzer 60B as means for sounding an alarm sound. Instead, the indicator light 60 may be provided with an alarm sound generating device other than a buzzer such as a bell.

又，在本實施方式中，早期通知設定部31控制顯示燈60並使其通知訊號。取而代之，控制部3也可根據早期通知設定部31所設定的訊號的產生時機及訊號的種類而控制顯示燈60並通知訊號。Also, in the present embodiment, the early notification setting unit 31 controls the display lamp 60 to notify a signal. Alternatively, the control unit 3 may also control the display lamp 60 and notify the signal according to the generation timing of the signal and the type of the signal set by the early notification setting unit 31 .

又，在本實施方式中，在研削裝置1產生異常時，控制部3或早期通知設定部31可根據預先設定之通知設定而控制顯示燈60並輸出錯誤訊號。例如在產生異常時，控制部3可使紅色顯示部60R亮燈，並藉由蜂鳴器60B連續地鳴響警報音。Furthermore, in this embodiment, when the grinding device 1 is abnormal, the control unit 3 or the early notification setting unit 31 can control the display lamp 60 and output an error signal according to the preset notification setting. For example, when an abnormality occurs, the control unit 3 may light the red display unit 60R and continuously sound an alarm sound through the buzzer 60B.

1:研削裝置 W:晶圓 11:第一裝置基座 12:第二裝置基座 13:柱體 14:框體 2:研削進給手段 7:研削手段 74:研削輪 17:旋轉台 30:卡盤台 300:保持面 26:旋轉清洗單元 27:旋轉台 3:控制部 31:早期通知設定部 32:辨識部 33:設定部 40:觸控面板 51:第一卡匣 52:第二卡匣 511:開口 513:層架 151:第一卡匣台 152:第二卡匣台 55:機械手臂 551:保持部 553:驅動部 561:Z軸方向移動機構 563:水平移動機構 60:顯示燈 60B:蜂鳴器 60G:綠色顯示部 60R:紅色顯示部 60Y:黃色顯示部1: Grinding device W: Wafer 11: The first device base 12:Second device base 13: Cylinder 14: frame 2: Grinding feed means 7: Grinding means 74: Grinding wheel 17:Rotary table 30: chuck table 300: keep the surface 26:Rotary cleaning unit 27:Rotary table 3: Control Department 31:Early notification setting department 32: Identification Department 33: Setting department 40: Touch panel 51: The first cassette 52:Second cassette 511: opening 513: shelf 151: The first cassette station 152:Second cassette station 55: Mechanical arm 551: maintenance department 553: drive unit 561: Z-axis direction movement mechanism 563: horizontal movement mechanism 60: Display light 60B: Buzzer 60G: Green display part 60R: Red display part 60Y: Yellow display part

圖1為表示研削裝置之構成的立體圖。 圖2為第一卡匣的前視圖。 圖3為表示機械手臂之構成的立體圖。 圖4為表示研削裝置中的顯示燈之顯示方式的說明圖。 圖5為表示以往的加工裝置中的顯示燈之顯示方式的說明圖。Fig. 1 is a perspective view showing the configuration of a grinding device. Figure 2 is a front view of the first cassette. Fig. 3 is a perspective view showing the structure of a robot arm. Fig. 4 is an explanatory view showing a display mode of an indicator lamp in the grinding device. Fig. 5 is an explanatory diagram showing a display form of an indicator lamp in a conventional processing device.

1:研削裝置 1: Grinding device

2:研削進給手段 2: Grinding feed means

3:控制部 3: Control Department

7:研削手段 7: Grinding means

11:第一裝置基座 11: The first device base

12:第二裝置基座 12:Second device base

13:柱體 13: Cylinder

14:框體 14: frame

17:旋轉台 17:Rotary table

18:隔板 18: Partition

20:Z軸滾珠螺桿 20: Z-axis ball screw

21:Z軸導軌 21: Z-axis guide rail

22:Z軸伺服馬達 22: Z axis servo motor

23:Z軸移動台 23:Z-axis moving stage

24:支架 24: Bracket

26:旋轉清洗單元 26:Rotary cleaning unit

27:旋轉台 27:Rotary table

30:卡盤台 30: chuck table

31:早期通知設定部 31:Early notification setting department

32:辨識部 32: Identification department

33:設定部 33: Setting department

40:觸控面板 40: Touch panel

41:搬入機構 41: Moving into an institution

42:搬出機構 42: Move out of the institution

55:機械手臂 55: Mechanical arm

60:顯示燈 60: Display light

60B:蜂鳴器 60B: Buzzer

60G:綠色顯示部 60G: Green display part

60R:紅色顯示部 60R: Red display part

60Y:黃色顯示部 60Y: Yellow display part

70:主軸 70:Spindle

71:主軸外殼 71: Spindle housing

73:輪安裝件 73: Wheel mounting parts

74:研削輪 74: Grinding wheel

151:第一卡匣台 151: The first cassette station

51:第一卡匣 51: The first cassette

152:第二卡匣台 152:Second cassette station

52:第二卡匣 52:Second cassette

153a:暫置區域 153a: Temporary area

153b:對位手段 153b: Counterpoint means

300:保持面 300: keep the surface

740:輪基台 740: wheel abutment

741:研削磨石 741: grinding stone

A:搬入搬出區域 A: Moving in and out area

B:研削區域 B: Grinding area

W:晶圓 W: Wafer

Wa:正面 Wa: front

Wb:背面 Wb: back

Claims (2)

一種加工裝置，具備：卡匣台，用於載置具有多個容納被加工物之層架的卡匣；機械手臂，具有保持部及升降軸，並由該卡匣取出被加工物，該保持部保持容納於載置在該卡匣台之該卡匣中的被加工物，該升降軸使該保持部在該層架的排列方向升降；卡盤台，保持由該卡匣取出之該被加工物；加工手段，藉由加工工具加工保持於該卡盤台之該被加工物；及通知設備，將表示加工裝置之運行狀態的訊號通知操作者；其中，該加工裝置進一步具備：早期通知設定部，在容納於該卡匣之所有被加工物之加工結束前，使該通知設備通知預定訊號；以及辨識部，在已取出容納於該卡匣之被加工物時，辨識該卡匣中的被加工物之殘存數量是否為預定數量以下；該早期通知設定部在已藉由該辨識部辨識出該殘存數量為預定數量以下時，使該通知設備通知對應於被取出之被加工物在該加工裝置內的位置之訊號。 A processing device comprising: a cassette table for placing a cassette having a plurality of shelves for accommodating workpieces; The part holds the workpiece contained in the cassette placed on the cassette table, and the lifting shaft lifts the holding part in the arrangement direction of the shelf; the chuck table holds the workpiece taken out of the cassette A processed object; a processing means for processing the processed object held on the chuck table by a processing tool; and a notification device for notifying the operator of a signal indicating the operating state of the processing device; wherein the processing device further includes: early notification The setting part causes the notification device to notify a predetermined signal before the processing of all the workpieces accommodated in the cassette is completed; and the identification part recognizes that the workpiece contained in the cassette is whether the remaining amount of the processed object is below the predetermined amount; the early notification setting unit, when it has been identified by the identifying portion that the remaining amount is below the predetermined amount, causes the notification device to notify that the processed object corresponding to the A signal of the position within the processing device. 一種加工裝置，具備：卡匣台，用於載置具有多個容納被加工物之層架的卡匣；機械手臂，具有保持部及升降軸，並由該卡匣取出被加工物，該保持部保持容納於載置在該卡匣台之該卡匣中的被加工物，該升降軸使該保持部在該層架的排列方向升降；卡盤台，保持由該卡匣取出之該被加工物；加工手段，藉由加工工具加工保持於該卡盤台之該被加工物；及通知設備，將表示加工裝置之運行狀態的訊號通知操作者；其中，該加工裝置進一步具備：早期通知設定部，在容納於該卡匣之所有被加工物之加工結束前，使該通知設備通知預定訊號；以及設定部，將容納於該卡匣之至少一個被加工物設定作為特定被加工物；該早期通知設定部使該通知設備通知對應於該特定被加工物在該加工裝置內的位置之訊號。 A processing device comprising: a cassette table for placing a cassette having a plurality of shelves for accommodating workpieces; The part holds the workpiece contained in the cassette placed on the cassette table, and the lifting shaft lifts the holding part in the arrangement direction of the shelf; the chuck table holds the workpiece taken out of the cassette A processed object; a processing means for processing the processed object held on the chuck table by a processing tool; and a notification device for notifying the operator of a signal indicating the operating state of the processing device; wherein the processing device further includes: early notification a setting section that causes the notification device to notify a predetermined signal before processing of all workpieces accommodated in the cassette is completed; and a setting section that sets at least one workpiece accommodated in the cassette as a specific workpiece; The early notification setting unit causes the notification device to notify a signal corresponding to the position of the specific workpiece within the processing device.
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Publication number Priority date Publication date Assignee Title
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176715A (en) * 1997-12-08 1999-07-02 Toshiba Microelectronics Corp Processing state display device and processing state display system
TW200916248A (en) * 2007-10-01 2009-04-16 Olympus Corp Adjusting apparatus, laser processing apparatus, adjusting method and adjusting program
TW201005574A (en) * 2008-06-13 2010-02-01 Electro Scient Ind Inc Automatic recipe management for laser processing a work piece
JP2015138856A (en) * 2014-01-22 2015-07-30 株式会社ディスコ Cutting device
US20160346956A1 (en) * 2015-05-26 2016-12-01 Disco Corporation Processing system
TW201709131A (en) * 2015-08-25 2017-03-01 Disco Corp Management method of processing device capable of extending the operation of processing device
CN107186336A (en) * 2016-03-09 2017-09-22 住友重机械工业株式会社 Laser processing device
TW201902613A (en) * 2017-06-01 2019-01-16 日商迪思科股份有限公司 Processing device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150331A (en) 1997-12-30 2000-05-30 Samsung Electronics Co Ltd Alarm device for semiconductor manufacturing equipment
CN2697610Y (en) * 2004-04-20 2005-05-04 石永辉 Material container with automatic quantity display and data transmission
JP4951516B2 (en) 2005-09-26 2012-06-13 株式会社日立国際電気 Substrate processing equipment
JP2009043950A (en) 2007-08-09 2009-02-26 Panasonic Corp Apparatus for manufacturing semiconductor
CN103886440B (en) * 2012-12-20 2017-06-27 上海华虹宏力半导体制造有限公司 The distribution system and distribution method of a kind of wafer
JP6360762B2 (en) * 2014-09-26 2018-07-18 株式会社ディスコ Processing equipment
CN107144087A (en) * 2017-05-11 2017-09-08 海尔优家智能科技（北京）有限公司 A kind of intelligent article management method, equipment and storage medium
CN107908123A (en) * 2017-11-14 2018-04-13 英业达科技有限公司 A kind of handling of goods and materials device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176715A (en) * 1997-12-08 1999-07-02 Toshiba Microelectronics Corp Processing state display device and processing state display system
TW200916248A (en) * 2007-10-01 2009-04-16 Olympus Corp Adjusting apparatus, laser processing apparatus, adjusting method and adjusting program
TW201005574A (en) * 2008-06-13 2010-02-01 Electro Scient Ind Inc Automatic recipe management for laser processing a work piece
JP2015138856A (en) * 2014-01-22 2015-07-30 株式会社ディスコ Cutting device
US20160346956A1 (en) * 2015-05-26 2016-12-01 Disco Corporation Processing system
TW201709131A (en) * 2015-08-25 2017-03-01 Disco Corp Management method of processing device capable of extending the operation of processing device
CN107186336A (en) * 2016-03-09 2017-09-22 住友重机械工业株式会社 Laser processing device
TW201902613A (en) * 2017-06-01 2019-01-16 日商迪思科股份有限公司 Processing device

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