200916248 九、發明說明： t 明戶斤屬^:冬好冷貝^^】 發明領域 本發明係有關於一種調整業經以空間調變元件空間調 5 變之光之照射的技術。 C先前技 . 發明背景 迄今，使用藉對被加工物照射雷射光，而將被加工物 加工之雷射加工裝置。加工有文字或圖畫之描繪、曝光、 10 基板之製程之修復(修補；repair)等種類。又，基板有液晶 顯示器（LCD ; Liquid Crystal Display)或電漿平面顯示器 (PDP: Plasma Display Panel)等之平面面板顯示器（FpD: Flat Panel Display)、半導體晶圓（wafer)、層積印刷基板 (multilayer printed circuit board)等種類。 15 此種雷射加工裝置設有以所指定之位置、方向、形狀 照射雷射光之機構。迄今，使用狹縫等作為該機構。近年 來，亦使用微小鏡子排列成陣列狀之DMD(Digital Micromi ' rror Device)等之空間調變元件作為該機構。空間調變元件 • 亦稱為空間光調變器（SLM : spatial light modulator)。 2〇 而結果，有所指定之位置、方向、形狀與實際照射雷 射光之位置、方向、形狀不同之情形。這是由於在雷射光 源至被加工物之光程上，存在複數個光學零件，受到該等 光學零件之應變、安裝位置之偏移、安裝方向之偏移等之 影響之故。 200916248 射光之為使所才曰定之位置、方向、形狀與實際照射雷 以=位置、方向、形狀—致’需進行校準(calibration)， 糊整雷射光照射之方式。 此外，「姑進 开,。用於包含「調整」之意思之情 心’而以下，「护唯 · 口要 "J則以不包含「調整」者來說明。又， 以下树觀制，「練」㈣餘據鮮之結果之調 於專利文獻1〜3記載有調整雷射光之照射之習知技術。 專利文獻1記載之雷射加工裝置係求出作為照射雷射 1〇光束之對象之加工圖形之影像上的座標位置與照射雷射光 束之點之影像上之座標位置’算出兩者之位置偏移量。將 位置偏移量換算成用以移動平台之修正量，使平台移動， 以調整成加工圖形之位置與雷射光束之照射位置一致。 然而，專利文獻i僅記載X方向或γ方向之位置偏移之 15調整’關於旋轉偏移、放大或縮小之標度轉換、形狀之變 形並無記載。 在專利文獻2之標本觀察系統中，考慮某種旋轉偏移或 變形。此系統為於顯微鏡安襄雷射掃晦裝置及影像取得裳 置之結構。在此系統中，從以影像取得裝置取得之影像測 20量以雷射置照射之雷射光之照射位置。然後，依顯 示以此測量而得之照射位置與對雷射掃描裝置指示之雷射 光照射之照射指示位置之差異的資訊，進行校正及調整。 在此系統中，考慮照射位置及照射指示位置之差里之4 個主要因素’採取因應主要因素之調整方法。舉例言之， 200916248 之各光學系統之光軸之位置 射光偏向之偏向用鏡之偏向 衫像取得裝置及t射掃晦裝置 偏移或旋轉偏移係崎正使雷 動作之控制來補償。 之焦點位w/揭不在⑽雷射加工機中，使YAG雷射光 方^，、私作件之φ射加卫點對齊之教導方法。在此 方向恭，進行YAGf射光之光軸方向之ζ方向之校準、與Ζ α垂直之X方向及Υ方向之校準。 ζ方向之校準錢用在相對於Ζ軸傾斜之方向，昭射至 =件(爾kpl㈣上’在工作件上’視為耗平狀線之 、:用狹縫先。從雷射加工頭之z方向之動作與拍攝工作件 =像之狹縫光之γ座標之關係取得2方向之資料。依該資 料’進行肋使YAG雷射光之缝位於1件表蚊Z方向 之才父準。 15 ™向之校準係、於進行2方向之修正後進行。具體言 5之，雷射加工頭移動至工具座標系（χγζ座標系）之原點，僅 照射1發(Shot)雷射光’拍攝以該照射形成之珠子㈣㈣ 跡，取得所獲得之影像之珠子痕跡之座標。同樣地，雷射 力二工頭亦依序移動至玉具(tGd)座標系之位⑽軸上之錄 定義點與位於Y軸上之γ軸定義點，進行雷射光之照射、拍 20 攝、座標之取得。 從該等3點之工具座標系之座標與影像座標系之像素 (Pixel)座標系之座標，求出從工具座標系至像素座標系之轉 換矩陣。該轉換矩陣表示並進移動與旋轉移動之組合。 以該轉換矩陣之轉換之逆轉換，將以像素座標系表示 7 200916248 之檢測點之座標轉換成工具座標系。算出工具座標系之修 正量，雷射加工頭於X-Y方向移動修正量之量。 【專利文獻1】日本專利公開公報平6-277864號 【專利文獻2】曰本專利公開公報2004-109565號 5 【專利文獻3】日本專利公開公報2000-263273號 【發明内容】 發明揭示 發明要解決之課題 上述專利文獻1〜3皆記載未將照射之雷射光空間調變 10 時之校準及調整之方法。藉由空間調變元件之光之照射之 校準及調整至今為止仍多為以人工手動作業來進行。 用以解決課題之手段 根據本發明之一個態樣，提供根據指定之輸入圖形， 調整業經以空間調變元件空間調變之光對對象物之照射之 15 調整裝置。前述調整裝置包含有讀入部、算出部及調整部， 該讀入部係讀入拍攝照射業經以前述空間調變元件空間調 變之光之前述對象物之影像；該算出部係算出將前述輸入 圖形轉換成在前述影像上對應於前述輸入圖形而產生之輸 出圖形之轉換參數者；該調整部係當使用校準圖形作為前 20 述輸入圖形時，依前述算出部算出之前述轉換參數，調整 根據所指定之照射圖形之對前述對象物之光的照射者。 根據本發明另一態樣，提供一種雷射加工裝置。前述 雷射加工裝置包含有將從雷射光源射出之雷射光引導至對 象物上之光學系統；設置於從前述雷射光源至前述對象物 200916248 之光程上，將入射光進行空間調變之空間調變元件；及前 述調整裝置。該雷射加工裝置使用前述雷射光作為根據前 述照射圖形對前述對象物照射之光，且以前述調整裝置調 整前述雷射光對前述對象物之照射，以加工前述對象物。 5 根據本發明又另一態樣，提供電腦執行用以實現前述 調整裝置之方法及使電腦具有作為前述調整裝置之功能之 程式。前述程式儲存於電腦可讀取之記憶媒體而提供。 在上述任一態樣中，皆依所算出之前述轉換參數，調 整對前述對象物之光之照射。因而，所指定之前述照射圖 10 形與實際照射之前述光之圖形之差較未調整時減低。 發明效果 根據本發明，由於依轉換參數，自動地調整業經以空 間調變元件空間調變之光之照射，故可實現更正確之照射。 又，根據本發明，由於從1個校準圖形，算出轉換參數， 15 故用以取得轉換參數之光之照射進行1次即足夠，不需如習 知般，反覆進行照射及構造物之機械性移動。因而，根據 本發明，可有效率地進行校準，調整光之照射。 I：實施方式3 用以實施發明之最佳形態 20 以下，參照圖式，就本發明之實施形態詳細說明。在 顯示不同之實施形態之複數圖式中，相互對應之構成要件 標不相同標號5而省略說明。 以下，首先說明第1實施形態，之後，說明將第1實施 形態變形之第2〜第8實施形態。第1〜第8實施形態皆為將本 9 200916248 發明應用於調整雷射加工裝置之雷射光之照射之例。接 著，說明第9實施形態作為將本發明應用於調整投影機之光 之照射之例，最後，說明其他變形例。 第1圖係顯示第1實施形態之雷射加工裝置之結構之模 5式圖。第2〜第8實施形態亦使用與第1圖相同之結構之雷射 加工裝置。 第1圖之雷射加工裝置100係以從雷射振盪器103射出 之雷射光，將載置於平台101上之被加工物102加工之裝 置。雷射加工裝置100對被加工物102進行熔融、切斷、圖 10晝或文字等之印相、曝光或電路圖形之修復(修補）等任何一 種加工。此外’以下為簡單說明’平台101之上面假設為相 對於鉛直方向垂直。 被加工物102可為FPD基板、半導體晶圓、層積印刷基 板等’亦可為其他一般之試樣。 15 從雷射振盪器丨〇3射出之雷射光穿透半反射鏡1〇4，在 鏡子105反射，入射至DMD106。 DMD106為微小鏡子排列成二維陣列之空間調變元 件。微小鏡子之傾斜角至少可切換成2種。以下分別將傾斜 角為第1、第2角度時之微小鏡子之狀態稱為「開啟狀態」 20及「關閉狀態」。 DMD106依後述控制部113之指示， 獨立切換各微小鏡 子之傾斜角、亦即各微小鏡子之狀態。對DMD106之指示以 將顯不疋否要照射雷射光之二值資料排列成二維狀之資料 表示，從控制部113發送。 10 200916248 以從鏡子10 5入射至D M D10 6之入射光在開啟狀態之微 小鏡反射時，反射光之方向形成鉛直方向之狀態，配置雷 射振盪器103、半反射鏡1〇4、鏡子1〇5及DMD106。在開啟 狀態之微小鏡子反射之雷射光之到達被加工物丨〇 2表面之 5光程上配置具有半反射鏡107、成像透鏡108、半反射鏡 1〇9、物鏡11〇之投影光學系統。在開啟狀態之微小鏡子反 射之雷射光藉由投影光學系統，投影、亦即照射至被加工 物102之表面。投影光學系統構造成被加工物102之表面與 DMD106為共軛之位置。 0 關閉狀態之微小鏡子之傾斜角與開啟狀態時不同。是 故’從鏡子105入射至DMD106之入射光在關閉狀態之微小 鏡’反射至與至半反射鏡107之方向不同之方向，而不照射 至被加工物1〇2上。在第1圖中，關閉狀態之微小鏡子之反 射光之光程以虛線箭號表示。 5 因而’藉將各微小鏡子控制在開啟狀態或關閉狀態， 可控制雷射光是否照射至對應於各微小鏡子之被加工物 102之位置。即，藉使用DMD106，可以任意之位置、方向、 形狀’將雷射光照射至被加工物102上。 雷射加工裝置100更包含有LED(Light Emitting Diod 0 e ;發光二極體）光源116。從LED光源116照射之光（以下稱 為1 LED光」）在半反射鏡104反射，入射至鏡子105。 在此’雷射振盪器103、半反射鏡104、LED光源116配 置成透過半反射鏡104之雷射光與在半反射鏡104反射之 LED光之光軸—致。因而，在半反射鏡104反射後之LED光 11 200916248 之光程與雷射光之光程相同，LED光亦照射至被加工物 102。 在本實施形態中，為調整藉由DMD106之雷射光之照 射，進行校準，LED光用於校準。 5 又，雷射加工裝置1〇〇包含有照明用光源111、cCD(Ch arge Coupled Device;電荷耦合元件）照相機112。當拍攝 需要照明光時’照明用光源111之照明光在半反射鏡丨09反 射，藉由物鏡110 ’照射至被加工物102之表面。此外，亦 可使用 CMOS(Complementary Metal-Oxide Semiconducto 10 r ;互補型金屬氧化物半導體）照相機等拍攝裝置。 雷射光、LED光及照明光之在被加工物1〇2表面之反射 光皆藉由具有物鏡11〇、半反射鏡109、成像透鏡1〇8、半反 射鏡107之光學系統，入射至CCD照相機112之光電轉換元 件。藉此，CCD照相機112拍攝被加工物102之表面。 15 在本實施形態中，使用可以CCD照相機112拍攝反射光 之波長之雷射光、LED光及照明光。因而，使用DMD106， 在照射雷射光或LED光之狀態下’ CCD照相機112拍攝被加 工物102時，於所拍攝之影像顯現照射至被加工物102上之 雷射光或LED光之圖形。 20 若雷射加工裝置1〇〇完全不具變形或偏移’於影像顯現 之圖形應與DMD106所指定之圖形之位置、方向（角度）、形 狀皆一致。然而，實際上，有2個圖形不一致之情形。該不 一致即為校準之對象。 雷射加工裝置100更包含有控制部113、操作部114及顯 12 200916248 示器115。 控制部113控制雷射加工裝置100全體。操作部114以鍵 盤或指向裝置等輸入機器實現。從操作部114輸入之指示傳 送至控制部113。 5 又，顯示器115根據控制部113之指示，顯示影像或文 字等。顯示器115亦可即時顯示CCD照相機112所拍攝之被 加工物102之影像。以下，亦有將CCD照相機112拍攝，控 制部u讀入之影像稱為「實況(live)影像」之情形。 對控制部113之輸入為操作部114之指示及來自ccD照 10相機112之影像資料。以控制部113控制者為平台1〇1、雷射 振盪器103、DMD106、顯示器115、LED光源116。 又，控制部113可為通用之電腦，亦可為專用之控制裝 置。控制部113之功能亦可以硬體、軟體、韌體或該等之組 合之任一者實現。 15 舉例 5 之’亦可以具有CPU(Central Processing Unit)、 R〇M(Read Only Memory)等非依電性記憶體、工作區 (working area)使用之RAM(Radom Access Memory)、硬碟裝 置等外部記憶裝置、與外部機器之連接介面，將該等以匯 流排相互連接之PC(Personal Computer)等電腦實現控制部 20 113。 此時’平台ΗΠ、雷射振盪器l〇3、DMD106、顯示器115、 LED光源116以各自之連接介面與此電腦連接。cpu藉將儲 存於硬碟裝置或電腦可讀取之可攜式記憶媒體等之程式载 入(load)至RAM執行’而實現控制部113之功能。 13 200916248 接著，使用被加工物102為基板，雷射加工裝置1〇〇為 對基板表面之缺陷照射雷射光，以修復缺陷之雷射修復舉 置之具體例，說明第1實施形態之雷射加工裝置1〇〇之動作 概要。 5 如第1圖所示，雷射加工裝置1〇〇包含有具有成像遷鏡 108及物鏡110之顯微鏡。是故，CCD照相機112可藉由顯微 鏡，拍攝被加工物102上之細微電路圖案或細微缺陷。所拍 攝之影像即時顯示於顯示器115。 將在被加工物102表面，存在缺陷之區域稱為「缺陷區 10域」，將顯示於顯示器115之影像中，拍攝有缺陷區域之區 域稱為「缺陷顯示區域」。雷射修復裝置藉對缺陷區域照射 雷射光，而修復基板。舉例言之，灰塵或不必要之光阻雖 為缺陷，但由於可知、射雷射光，使其蒸發，故為可修復之 缺陷。此種缺陷即為雷射修補裝置之修復對象。 15 為防止藉對無缺陷之區域照射雷射光，而損壞正常形 成之電路圖形，照射雷射光之區域必須準確地與缺陷區域 一致。因此，要求校準及調整。 舉例言之，操作員藉由操作部114，選擇、亦即指定缺 陷顯示區域。所指定之缺陷顯示區域為顯示缺陷區域之、 20形。藉控制部113對DMD106指定此圖形，可進行已進行「 缺陷區域照射雷射光，對缺陷區域以外之區域不照射雷射 光」之控制的照射。換言之，對對應於缺陷顯示區域所人 之像素之DMD106之微小鏡子指示開啟狀態，對其他之微3 鏡子指示關閉狀態，可對缺陷區域照射雷射光，修復缺陷 200916248 對其他之區域不照射雷射光。 若雷射加工裝置100完全無變形或偏移時，對應於缺陷 顯不區域所含之像素之DMD106之微小鏡子為對應於該微 小鏡子之被加工物1〇2上之位置照射雷射光，應呈開啟狀 5悲。對應於缺陷區域所不包含之像素之微小鏡子為不對對 應於該微小鏡子之被加工物102上之位置照射雷射光，應呈 關閉狀態。 然而，實際上有雷射加工裝置有變形或偏移之情形。 是’進行校準。然後，雷射光依校準之結果予以調整，照 10射至作為基板之被加工物1〇2上。藉此，可以準確地與基板 上之缺陷區域一致之圖形照射雷射光。即，為雷射修復裝 置之雷射加工裝置1〇〇不但不致以雷射光損傷正常之部 份’並且可修復基板之缺陷。 接著’就控制部113之詳細内容作說明。 15 第2圖係顯示第1實施形態之控制部113之功能之功能 方塊圖。 控制部113具有從CCD照相機112讀入影像之讀入部 201、進行校準之算出部202、依校準之結果，調整光之照 射之調整部203、控制DMD106之空間調變控制部204、控制 20 平台101之平台控制部205、選擇雷射振盪器1〇3或LED光源 116其中一者作為光源之選擇部206。將本發明之調整裝置 在第1實施形態中實現者係讀入部201、算出部202、調整部 203。 讀入部2 01從C C D照相機112讀入拍攝被加工物1 〇 2之 15 200916248 影像。舉例言之，當以PC實現控制部113時，亦可以安裝於 PC之影像擷取板實現讀入部2〇1。 讀入部201讀入之影像之種類依實現形態而異，在任— 實施形態讀入部201皆需讀入之影像為進行根據校準圖形 5 之照射時之被加工物102之影像。 校準圖形係對DMD106指示之輸入圖形之一種。在以下 之說明中’「輸入圖形」係表示對DMD106之指示之圖形， 為將照射光之區域(area)以對各微小鏡子之「開啟」或「關 閉」之指示表示之圖形。依校準用或雷射光之加工用之目 10的，具體指定作為輸入圖形之圖形不同。 拍攝根據一些輸入圖形照射光之被加工物丨〇 2之影像 上產生對應於該輸入圖形之圖形。以下，將影像上產生之 圖形稱為「輸出圖形」。 輸出圖形係「已照射光」或「未照射光」之二值，為 15表示影像上各點之圖形。輸入圖形之「開啟」及「關閉」 之指示分別對應於輸出圖形之「已照射光」之狀態及「未 照射光」之狀態。 然而，一般因存在於雷射加工裝置100之變形或偏移 等，輸入圖形與輸出圖形不同。舉例言之，校準圖形係用 20於扠準之基準圖形，輸出圖形與基準圖形不同。 即，當將輸入圖形視為基準時，輸出圖形偏移基準位 置，或從基準角度旋轉，形狀放大、縮小抑或變形。 是故，算出部202算出將輸入圖形轉換成輪出圖形之轉 、多數在以下之各貫施形態中，校準係指轉換參數之算 16 200916248 出。由於轉換參數之具體例依實施形態而不同，故詳細内 容後述。 算出部202將於使用校準圖形作為輸入圖形時算出之 轉換參數输出至調整部203。此外，算出部202讀取儲存於 5 圖中未示之記憶裝置之預定校準圖形，利用於轉換參數之 算出，亦可於每次校準時，作成校準圖形。 調整部203依轉換參數，調整根據從控制部113之外部 指定之照射圖形之雷射光照射。為調整而控制之對象依實 施形態而異，在第1實施形態中，調整部203調整從操作部 10 114提供之照射圖形。 當以PC實現控制部113時，算出部202及調整部203亦可 以將程式載入至RAM而執行之CPU來實現。又，預先將校 準圖形儲存於記憶裝置時’該記憶裝置亦可為pC所具有之 RAM或硬碟裝置等。 15 空間調變控制部204接收要對DMD106指示之輸入圖 形’依該輸入圖形，進行使DMD106之各微小鏡子呈開啟狀 態或關閉狀態之控制。結果，從雷射振盪器1〇3或LED光源 116照射之光經DMD106空間調變，而照射至被加工物102 上。 空間調變控制部204在校準用之LED光之照射中，從算 出部202 ’接收校準圖形作為輸入圖形。在加工用雷射光之 照射中，空間調變控制部204從調整部203接收業經以調整 部203調整之輪入圖形。 平台控制部205控制平台un，以使構成光學系統之第} 17 200916248 圖之各構成要件與平台101之相對位置變化。在其他實施形 態中，亦吁不使平台101移動，而使光學系統移動，使相對 位置變化。 舉例言之，當雷射加工裝置100為雷射修復裝置時，從 5缺陷檢查裝置對雷射加工裝置100預先通知要修復之缺陷 之概略位置。然後，平台控制部205控制平台101，使其移 動，以使被通知之被加工物102上之位置進入雷射光之照射 範圍，進入CCD照相機112之拍攝範圍。 之後’ CCDfe相機112拍攝被加工物1〇2，讀入部201讀 10入所拍攝之影像，顯示器115顯示該影像。操作員依顯示於 顯示器115之影像，從操作部114指示要照射雷射光而修復 之圖形、亦即缺陷顯示區域。又，亦可以與從良好成品之 被加工物而得之影像之比較之習知技術，抽出缺陷顯示區 域。 選擇部206選擇雷射振盪器103及LED光源116其中任 者作為光源，將所選擇之一方之光源開啟，未選擇之一 方之光源關閉。具體言之，選擇部206於校準時，進行將雷 射振盪器103關閉，將LED光源116開啟之控制，加工時， 進行將雷射振盪器103開啟，將LED光源116關閉之控制。 又，亦有逛擇部206進行將兩者之光源皆關閉之控制之情 形。 當以pc實現控制部113時，空間調變控制部2〇4、平台 控制部205及選擇部2G6皆可以將程式載入至厌歲執行之 CpU、外部裝置與Pc之連接介面來實現。 18 200916248 接著，參照第3圖，就校準之對象作說明。 第3圖係例示因存在於雷射加工裝置1〇〇之偏移或變形 引起之照射圖形之變形、亦即輸入圖形至輸出圖形之變形 者。 5 為方便說明，以下將以CCD照相機112拍攝之影像之橫 向之座標轴稱為X軸，縱向之座標軸稱為y軸。影像大小為 任意，在本實施形態中，x方向為640像素，y方向為48〇像 素。又，將此大小記載為「640x480像素」。影像内之各像 素之位置以X座標與y座標之組合(x，y)表示。第3圖之照射圖 10形310之左上角及右下角之座標分別為（0,0)及(639,479)。 第3圖之照射圖形31 〇係對以C C D照相機112拍攝之影 像表示要於該影像之哪個部份照射雷射光之圖形。因而， 照射圖形31内之位置亦可以X座標與y座標之組合(x，y)表 示，照射圖形310之大小為與以CCD照相機112拍攝之影像 15 相同之640x480像素。 在此，當將照射雷射光以白色顯示，未照射以黑色顯 示時，如第3圖所示，照射圖形310可以白黑二值影像表示。 在第3圖之例中’照射圖形31〇表示應於位於影像之中心 部’與X軸平行之粗線及與y軸平行之粗線交叉之白色十字 2〇形狀及背景由黑色構成’相當於白色十字形狀之被加工物 102上之部份照射雷射光。 在本實施形態中，照射圖形310如以下進行，從操作部 114指示。首先，在照明用光源1U之照明光所作之照明下， 以未照射雷射光、也未照射LED光之狀態，CCD照相機in 19 200916248 拍攝被加工物。然後，控制部113之讀入部201讀入所拍攝 之影像’輪出至顯示器115。 之後’操作員觀看輸出至顯示器1丨5之影像，從操作部 114指示要照射雷射光之範圍。該指示藉由連接操作部114 5及控制部U3之介面，以640x480像素大小之照射圖形310 之資料之形式，提供至控制部113。 在另—實施形態中，亦可從其他裝置將照射圖形31〇之 資料傳送至控制部113。舉例言之，當雷射加工裝置1〇〇為 FPD基板等之雷射修復裝置時，亦可從缺陷檢查裝置將照 10射BH31G之I料傳送至控制部Η]。或者，雷射修復裝置 亦可具有衫像辨識部，影像辨識部依影像辨識處理，辨識 缺fe之开v狀，生成顯不所辨識之形狀之照射圖形HQ之資 料’輸出至控制部113。 不响為何者’皆將照射圖形31〇之資料提供給控制部 15 113如此—來’控制部113從照射圖形灿生成用以對 DMD106^不各微小鏡子之開啟及關閉之d廳轉送用資料 320。麵轉送用資料320係表示輸入圖形之資料，轉送（亦 即發送）至DMD106。 20 在DMD106,微小鏡子排列成二維陣列狀，可將微小鏡 之位置以u座標與v座標之組合(u，v)表示。又，以下為簡單 »兄月〇像内之像素之座標(x，y)與微小鏡之座標(u,v)為 具有X = U，y=V之關係者。由於只要將微小鏡子適當配置， 適當訂^座標系之原點，此__立， 之一般性未喪失。 20 200916248 在此’與照射圖形310之圖同樣地，當令照射光以白色 表示’未照射以黑色表示時，DMD轉送用資料320亦可以白 黑二值影像表示。換言之，可將DMD轉送用資料以以顯示 微小鏡子呈開啟狀態之白色或微小鏡呈關閉狀態之黑色表 5 示位置Ο,ν)之點的白黑二值影像來表示。 在本實施形態中，假設於DMD排列800x600個微小 鏡。即’微小鏡子之個數多於CCD照相機112拍攝之影像之 像素數。是故，顯示DMD轉送用資料320之影像為以黑色邊 緣包圍顯示照射圖形310之影像周圍之影像。有此種邊緣之 10 理由後述。 即，顯示照射圖形310之影像位置(x，y)之顏色（白或黑） 與顯示DMD轉送用資料320之影像之u = x,v = y之位置(u，v) 之顏色相等。當位置(u，v)位在u< 〇、、v< 0或480gv 之範圍時，顯示DMD轉送用資料320之影像之位置(u,v)之顏 15 色為黑色。 此外，在第3圖中，DVD轉換用資料320具有白色矩形 框線，此框線為方便說明，係表示相當於照射圖形31〇之 640x480像素之範圍，並非表示白色框線上之微小鏡子呈開 啟狀怨者。又，在本實施形態中，在DMD轉送用資料320 20中，在白色框線上方之邊緣與下方之邊緣之寬度相等，右 邊之邊緣與左邊之邊緣之寬度亦相等。惟，邊緣之寬度可 依實施形態適當訂定。 依照射圖形31 〇與DMD轉送用資料32〇間之上述關係， 控制部113從照射圖形3丨〇之資料生成D M D轉送用資料 21 200916248 320 °如上述，要生成DMD轉送用資料320，控制部113僅於 恥射圖形31 〇周圍追加黑色邊緣即可。 控制部113内之空間調變控制部204藉將DMD轉送用資 料320輸出至DMDl〇6 ’可對800x600個微小鏡子給予開啟 5或關閉之指示。 在此’假設不進行根據校準之調整，而是依所給予之 DMD轉送用資料32〇, DMD1〇6之微小鏡子呈開啟狀態或關 閉狀態，雷射光從雷射振盪器1〇3射出。 此時，一般照射至被加工物1〇2上之雷射光之圖形與所 10期之舨射圖形310不同。這是由於雷射加工裝置丨〇〇之光學 系統及/或拍攝系統有偏移或變形之故。 舉例言之，鏡子或透鏡可能變形，或者雷射加工裝置 100之各構成要件之安裝位置偏移，抑或有安裝角度偏移， 從原本之角度旋轉而安裝之零件。 15 第3圖之貫況影像330即係如此當與所期之照射圖形 310不同之圖形照射至被加工物1〇2上時，以ccd照相機ιΐ2 拍攝之影像之例。因而，實況影像33〇上之位置亦可以叮座 標系表示，實況影像33〇之大小為640x480像素。 在第3圖之實況影像33〇中，實際照射雷射光之部份以 20白色顯示，未照射之部份以黑色顯示。將實況影像33〇與照 射圖形310比較時，白色十字形於又轴之正向移動，進—步， 逆時鐘旋轉15度。從照射圖形31〇至實況影像33〇之變形實 際上不僅包含平行移動(位移)及旋轉，亦包含放大、縮小、 亦即標度轉換或剪應變等形狀之變形。 22 200916248 因而’為防止此種變形，進行校準，依校準之結果， 需調整雷射光之照射。在本實施形態中，將因存在於雷射 加工裝置_之偏移或變形引起之上述照射圖形之變形視 為種轉換之結果，將該轉換以數學模式化。 接者，就以校準取得顯示該以數學模式化之轉換之參 數依所取得之參婁丈，調整之處理作說明。 10 在第3圖中，DMD轉送用資料32〇除了邊緣以外’與照 。是故，照射圖義事實上可為對DMD106 心疋之輸入圖形。實況影像33〇係將對應於該輸入圖形，未 :任何_整而接收變化之雷射光照射至被加卫物ι〇2上 時’於影像產生之輸出圖形。因而，從照射圖形3H)至影像 隻形可視為從上述輸入圖形至上述輸出圖形之轉換。 在本實施形態中’採用此轉換為以轉換矩陣了表示之仿 射(affine)轉換之數學模式。即，轉換矩陣τ之各要件為應在 15校準中算出之轉換參數。 如上述，輸入圖形及輸出圖形皆可以xy座標系表示， 又’由於平常u=x，j_v = y，故即使⑽座標系與巧座標系 視為相同，轉換參數之算出亦無問題。即，本實施形態之 數學模式係「與DMD轉送用資料32〇之座標(u，v)相等之照射 20圖形310之座標系以顯示仿射轉換之轉換矩陣T，轉換成實 況影像330之座標(X，，y，）」者。 此數學模式以算式表示時，即如式（1)。 ίχ,=α'χ+^+^ \y，= a2x + b2y + (1) 23 200916248 5 10 15 在此’轉換矩陣T定義為式(2)之3x3矩陣D(2) 顯示從輸入圖形至 T. ax dl 0^2 0 0 1 如此一來，可以式（3)之矩陣運算 輸出圖形之轉換。 br ’X、 y 二 b2 d2 y UJ .0 0 U lu (3) 在此，轉換矩陣Τ之第3列之要件山及七表示平行移動 之量。在轉換矩陣τ中’將要件ai、bi、a2、b2構成之部份 視為2X2矩陣時，此2x2矩陣從仿射轉換之定義為正規，表 示合成旋轉、放大、縮小及剪應應之變形。此亦可從下式 (4)〜(12)理解。 即，任意之正規之2x2矩陣S可分解成如式(4)。 s ~ 'a b、 a - c、 a2+c2 lc d) a J n ad-be V a2+c2, (4) 又’ 一般表示旋轉之矩陣X以式（5)表示，表示放大、 备百小之矩陣Y以式（6)表示，表示剪應變之矩陣z以式（乃表BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for adjusting illumination of light that is spatially modulated by a spatially modulated component. BACKGROUND OF THE INVENTION Heretofore, a laser processing apparatus that processes a workpiece by irradiating laser light with a workpiece is used. Processing such as drawing or exposure of text or drawings, repair of 10 substrates (repair; repair), etc. Further, the substrate includes a flat panel display (FpD: Flat Panel Display) such as a liquid crystal display (LCD) or a plasma display panel (PDP: Plasma Display Panel), a semiconductor wafer (wafer), and a laminated printed circuit board ( Multilayer printed circuit board). 15 Such a laser processing apparatus is provided with a mechanism for illuminating laser light at a specified position, direction and shape. Heretofore, a slit or the like has been used as the mechanism. In recent years, a spatial modulation element such as a DMD (Digital Micromi'rr Device) in which arrays of mirrors are arranged in an array has been used as the mechanism. Space Modulation Element • Also known as the spatial light modulator (SLM). 2〇 As a result, the specified position, direction, and shape are different from the actual position, direction, and shape of the irradiated laser light. This is because there are a plurality of optical components in the optical path from the laser light source to the workpiece, which are affected by the strain of the optical components, the displacement of the mounting position, the offset of the mounting direction, and the like. 200916248 The way to shoot light is to determine the position, direction, shape and actual illumination of the lightning. = position, direction, shape - the need to calibrate, paste the laser light. In addition, "After the opening, it is used to include the meaning of "adjustment"" and below, "Protect only" and "J" are not included in the "adjustment". In addition, in the following tree view, "training" (4) The results of the remaining data are disclosed in Patent Documents 1 to 3, and conventional techniques for adjusting the irradiation of laser light are described. The laser processing apparatus described in Patent Document 1 calculates the positional deviation between the coordinate position on the image of the processing pattern that is the target of the laser beam and the point at which the laser beam is irradiated, and calculates the positional deviation between the two. Transfer amount. The position offset is converted into a correction amount for moving the platform, and the platform is moved to adjust the position of the processed pattern to coincide with the irradiation position of the laser beam. However, Patent Document i only describes the adjustment of the positional shift in the X direction or the γ direction. The scale conversion with respect to the rotation shift, enlargement or reduction, and the shape change are not described. In the specimen observation system of Patent Document 2, a certain rotational shift or deformation is considered. This system is designed to capture the broom and image of the microscope. In this system, the irradiation position of the laser beam irradiated with the laser light is measured from the image obtained by the image acquisition device. Then, correction and adjustment are performed by displaying information on the difference between the irradiation position obtained by the measurement and the irradiation instruction position of the laser light irradiation indicated by the laser scanning device. In this system, the four main factors in the difference between the irradiation position and the irradiation indication position are taken as the adjustment method for the main factor. For example, the position of the optical axis of each optical system of 200916248 is biased toward the deflection of the lens by the lens. The image acquisition device and the twilight broom are offset or rotated and the rotation is controlled by the control of the lightning action. The focus position w/ expose is not in the (10) laser processing machine, so that the YAG laser light, ^, the private part of the φ shot plus guard point alignment teaching method. In this direction, the alignment of the YAGf beam direction in the direction of the optical axis and the alignment of the X direction and the Υ direction perpendicular to Ζα are performed. The calibration direction of the ζ direction is used in the direction of tilting with respect to the Ζ axis, and the illuminating to the part (the kpl (four) on the 'work piece' is regarded as the flat line of the line: first with the slit. From the laser processing head The action in the z direction and the photographing work piece = the relationship between the gamma coordinates of the slit light and the γ coordinates of the slit light. According to the data, the rib is used to make the YAG laser light slit in the direction of one Z. The TM calibration system is performed after the correction in the two directions. Specifically, the laser processing head moves to the origin of the tool coordinate system (χγζ coordinate system), and only one shot (Shot) laser light is irradiated. The beads (4) and (4) traces formed by the irradiation obtain the coordinates of the beads traces of the obtained image. Similarly, the laser force foreman also moves to the position and position of the position on the (10) axis of the jade (tGd) coordinate system. The γ-axis on the Y-axis defines the point, and the laser light is irradiated, the camera is taken for 20 shots, and the coordinates are obtained. The coordinates of the coordinate system of the three-point tool coordinate system and the coordinates of the Pixel coordinate system of the image coordinate system are obtained. The conversion matrix from the tool coordinate system to the pixel coordinate system. The conversion matrix The combination of the parallel movement and the rotation movement. The inverse transformation of the conversion matrix converts the coordinates of the detection point of the pixel coordinate system 7 200916248 into a tool coordinate system. The correction amount of the tool coordinate system is calculated, and the laser processing head is The amount of the correction amount is shifted in the XY direction. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION The above-mentioned Patent Documents 1 to 3 each describe a method of calibrating and adjusting a space in which the irradiated laser light is spatially modulated by 10. The calibration of the light irradiation by the spatial modulation element and The adjustment has hitherto been mostly performed by manual manual work. Means for Solving the Problem According to an aspect of the present invention, it is provided to adjust a light-to-object object that is spatially modulated by a spatially modulated component according to a specified input pattern. Illumination 15 adjustment device. The adjustment device includes a reading unit, a calculation unit, and an adjustment unit, and the reading unit reads the photographing unit. The image of the object that is spatially modulated by the spatial modulation element; the calculation unit calculates a conversion parameter that converts the input pattern into an output pattern generated corresponding to the input pattern on the image; When the adjustment pattern is used as the input pattern of the first 20, the adjustment unit adjusts the illuminator of the light of the object according to the specified illumination pattern in accordance with the conversion parameter calculated by the calculation unit. According to another aspect of the present invention. Provided is a laser processing apparatus comprising: an optical system for guiding laser light emitted from a laser light source onto an object; and disposed on an optical path from the laser light source to the object 200916248, a spatial modulation element that spatially modulates incident light; and the aforementioned adjustment device. In the laser processing apparatus, the laser light is used as the light to be irradiated onto the object according to the irradiation pattern, and the irradiation device adjusts the irradiation of the object by the laser beam to process the object. According to still another aspect of the present invention, a computer is provided which executes a method for implementing the aforementioned adjusting device and a computer having a function as the aforementioned adjusting device. The aforementioned program is stored in a computer readable memory medium. In any of the above aspects, the illumination of the object is adjusted according to the calculated conversion parameters. Therefore, the difference between the specified illumination pattern 10 and the pattern of the light actually irradiated is reduced as compared with the unadjusted. EFFECT OF THE INVENTION According to the present invention, since the illumination of the light modulated by the space modulation element is automatically adjusted in accordance with the conversion parameter, more accurate illumination can be realized. Further, according to the present invention, since the conversion parameter is calculated from one calibration pattern, it is sufficient that the irradiation of the light for obtaining the conversion parameter is performed once, and it is not necessary to perform the irradiation and the mechanical properties of the structure as is conventional. mobile. Therefore, according to the present invention, the calibration can be performed efficiently, and the irradiation of light can be adjusted. I: Embodiment 3 Best Mode for Carrying Out the Invention 20 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the plural figures showing different embodiments, the constituent elements corresponding to each other are not denoted by the same reference numerals, and the description is omitted. Hereinafter, the first embodiment will be described first, and then the second to eighth embodiments in which the first embodiment is modified will be described. Each of the first to eighth embodiments is an example in which the invention of the present invention is applied to the irradiation of the laser light of the laser processing apparatus. Next, a ninth embodiment will be described as an example in which the present invention is applied to the illumination of the projector to adjust the light. Finally, other modifications will be described. Fig. 1 is a view showing a mode of the structure of the laser processing apparatus of the first embodiment. In the second to eighth embodiments, a laser processing apparatus having the same configuration as that of Fig. 1 is also used. The laser processing apparatus 100 of Fig. 1 is a device for processing a workpiece 102 placed on a stage 101 by laser light emitted from a laser oscillator 103. The laser processing apparatus 100 fuses or cuts the workpiece 102, prints the image or the like, and repairs or repairs the circuit pattern (repair). Further, 'the following is a brief description' The upper surface of the platform 101 is assumed to be perpendicular to the vertical direction. The workpiece 102 may be an FPD substrate, a semiconductor wafer, a laminated printed substrate, or the like, and may be other general samples. 15 The laser light emitted from the laser oscillator 丨〇3 penetrates the half mirror 1〇4, is reflected by the mirror 105, and is incident on the DMD 106. The DMD 106 is a spatially modulated element in which small mirrors are arranged in a two-dimensional array. The tilt angle of the tiny mirror can be switched to at least two. Hereinafter, the state of the minute mirror when the inclination angle is the first and second angles is referred to as "open state" 20 and "closed state", respectively. The DMD 106 independently switches the tilt angle of each of the micromirrors, that is, the state of each of the minute mirrors, as instructed by the control unit 113, which will be described later. The instruction to the DMD 106 is indicated by a data indicating that the binary data to be irradiated with the laser light is arranged in two dimensions, and is transmitted from the control unit 113. 10 200916248 When the incident light incident from the mirror 105 to the DM D10 6 is reflected by the micromirror in the on state, the direction of the reflected light forms a vertical direction, and the laser oscillator 103, the half mirror 1〇4, and the mirror 1 are disposed. 〇5 and DMD106. The projection optical system having the half mirror 107, the imaging lens 108, the half mirror 1〇9, and the objective lens 11 is disposed on the surface of the workpiece 丨〇 2 in the open state of the laser beam. The laser light reflected by the tiny mirror in the open state is projected, that is, irradiated onto the surface of the workpiece 102 by the projection optical system. The projection optical system is constructed such that the surface of the workpiece 102 is conjugate with the DMD 106. 0 The tilt angle of the tiny mirror in the off state is different from the on state. Therefore, the incident mirror light incident on the DMD 106 from the mirror 105 is reflected in a direction different from the direction to the half mirror 107, and is not irradiated onto the workpiece 1〇2. In Fig. 1, the optical path of the reflected light of the small mirror in the closed state is indicated by a dotted arrow. 5 Thus, by controlling each of the minute mirrors in the open state or the closed state, it is possible to control whether or not the laser light is irradiated to the position of the workpiece 102 corresponding to each of the minute mirrors. That is, by using the DMD 106, laser light can be irradiated onto the workpiece 102 at any position, direction, and shape. The laser processing apparatus 100 further includes an LED (Light Emitting Diode 0 e) light source 116. Light emitted from the LED light source 116 (hereinafter referred to as "1 LED light") is reflected by the half mirror 104 and is incident on the mirror 105. Here, the laser oscillator 103, the half mirror 104, and the LED light source 116 are arranged such that the laser light transmitted through the half mirror 104 is aligned with the optical axis of the LED light reflected by the half mirror 104. Therefore, the optical path of the LED light 11 200916248 reflected by the half mirror 104 is the same as the optical path of the laser light, and the LED light is also irradiated to the workpiece 102. In the present embodiment, in order to adjust the irradiation of the laser light by the DMD 106, the calibration is performed, and the LED light is used for calibration. Further, the laser processing apparatus 1 includes an illumination light source 111 and a cCD (Charge Coupled Device) camera 112. When the illumination is required for illumination, the illumination light of the illumination source 111 is reflected by the half mirror 丨09, and is irradiated onto the surface of the workpiece 102 by the objective lens 110'. Further, an imaging device such as a CMOS (Complementary Metal-Oxide Semiconductor 10 r; Complementary Metal Oxide Semiconductor) camera can also be used. The reflected light of the laser light, the LED light, and the illumination light on the surface of the workpiece 1 2 is incident on the CCD by an optical system having an objective lens 11 〇, a half mirror 109, an imaging lens 1 〇 8 , and a half mirror 107 . Photoelectric conversion element of camera 112. Thereby, the CCD camera 112 captures the surface of the workpiece 102. In the present embodiment, laser light, LED light, and illumination light which can capture the wavelength of the reflected light by the CCD camera 112 are used. Therefore, when the CCD camera 112 photographs the object to be processed 102 by using the DMD 106, the CCD camera 112 visualizes the image of the laser light or the LED light that is irradiated onto the workpiece 102. 20 If the laser processing device 1〇〇 is completely free of distortion or offset, the image appearing in the image should be consistent with the position, direction (angle) and shape of the graphic specified by the DMD106. However, in reality, there are two cases where the graphics are inconsistent. This inconsistency is the subject of calibration. The laser processing apparatus 100 further includes a control unit 113, an operation unit 114, and a display unit 115. The control unit 113 controls the entire laser processing apparatus 100. The operation unit 114 is realized by an input device such as a keyboard or a pointing device. The instruction input from the operation unit 114 is transmitted to the control unit 113. Further, the display 115 displays an image, a text, and the like in accordance with an instruction from the control unit 113. The display 115 can also instantly display an image of the workpiece 102 captured by the CCD camera 112. Hereinafter, the image captured by the CCD camera 112 and read by the control unit u may be referred to as a "live" image. The input to the control unit 113 is an instruction from the operation unit 114 and image data from the ccD camera 112. The controller 113 is controlled by the control unit 113 as a platform 1, a laser oscillator 103, a DMD 106, a display 115, and an LED light source 116. Further, the control unit 113 may be a general-purpose computer or a dedicated control device. The function of the control unit 113 can also be implemented by any of a combination of hardware, software, firmware, or the like. 15 Example 5' may have a non-electrical memory such as a CPU (Central Processing Unit) or R〇M (Read Only Memory), a RAM (Radom Access Memory) used in a working area, a hard disk device, or the like. The external memory device and the connection interface with the external device realize the control unit 20 113 on a computer such as a PC (Personal Computer) in which the bus bars are connected to each other. At this time, the platform ΗΠ, the laser oscillator 〇3, the DMD 106, the display 115, and the LED light source 116 are connected to the computer through their respective connection interfaces. The CPU implements the function of the control unit 113 by loading a program stored in the hard disk device or the computer-readable portable memory medium into the RAM. 13 200916248 Next, using the workpiece 102 as a substrate, the laser processing apparatus 1 is a laser for irradiating a defect on the surface of the substrate with a laser beam to repair the defect, and a laser repairing method of the first embodiment will be described. Outline of the operation of the processing device 1〇〇. 5 As shown in Fig. 1, the laser processing apparatus 1A includes a microscope having an imaging mirror 108 and an objective lens 110. Therefore, the CCD camera 112 can take a fine circuit pattern or fine defects on the workpiece 102 by means of a microscope. The captured image is instantly displayed on the display 115. The area where the defect is present on the surface of the workpiece 102 is referred to as "defect area 10 field", and is displayed on the image of the display 115, and the area where the defective area is photographed is referred to as "defect display area". The laser repairing device repairs the substrate by irradiating the defective area with laser light. For example, dust or unnecessary light resistance is a defect, but it is a repairable defect because it can be known to emit light and evaporate it. This defect is the object of repair of the laser repair device. 15 In order to prevent the exposure of the non-defective area to the laser light and damage the circuit pattern formed normally, the area irradiated with the laser light must be exactly the same as the defect area. Therefore, calibration and adjustment are required. For example, the operator selects, that is, specifies a defective display area by the operation unit 114. The specified defect display area is a 20-shaped display defect area. The borrowing control unit 113 assigns this pattern to the DMD 106, and can perform irradiation for controlling the "the defective region irradiates the laser light and the region other than the defective region is not irradiated with the laser light". In other words, the tiny mirror of the DMD 106 corresponding to the pixel of the defect display area indicates the on state, and the other micro 3 mirrors indicate the off state, and the defect area can be irradiated with the laser light, and the defect 200916248 is not irradiated to the other area. . If the laser processing apparatus 100 is completely free from distortion or offset, the micro mirror corresponding to the DMD 106 of the pixel included in the defect display area illuminates the laser light at a position corresponding to the workpiece 1 〇 2 of the micro mirror. It is open and 5 sad. The minute mirror corresponding to the pixel not included in the defective area should be in a closed state so that the laser light is not irradiated to the position on the workpiece 102 corresponding to the minute mirror. However, there are actually cases where the laser processing apparatus is deformed or offset. Yes ' to perform calibration. Then, the laser light is adjusted according to the result of the calibration, and is irradiated onto the workpiece 1 2 as a substrate. Thereby, it is possible to illuminate the laser light with a pattern which coincides with the defect area on the substrate accurately. That is, the laser processing apparatus 1 for the laser repairing apparatus does not damage the normal portion by the laser light and can repair the defects of the substrate. Next, the details of the control unit 113 will be described. 15 Fig. 2 is a block diagram showing the function of the function of the control unit 113 of the first embodiment. The control unit 113 includes a reading unit 201 for reading an image from the CCD camera 112, a calculation unit 202 for performing calibration, an adjustment unit 203 for adjusting the irradiation of light, a spatial modulation control unit 204 for controlling the DMD 106, and a control unit 20. The platform control unit 205 of the platform 101 selects one of the laser oscillators 1〇3 or the LED light sources 116 as the light source selection unit 206. In the first embodiment, the adjustment device of the present invention is implemented by the reading unit 201, the calculation unit 202, and the adjustment unit 203. The reading unit 2 01 reads in the image of the workpiece 1 〇 2 15 200916248 from the C C D camera 112. For example, when the control unit 113 is implemented by a PC, the image capturing unit attached to the PC can also implement the reading unit 2〇1. The type of image read by the reading unit 201 varies depending on the implementation, and the image to be read by the reading unit 201 is an image of the workpiece 102 when the illumination pattern 5 is irradiated. The calibration graphic is one of the input patterns indicated by the DMD 106. In the following description, "input graphic" is a graphic indicating an indication of the DMD 106, and is a pattern indicating an area of the irradiation light in an indication of "on" or "off" of each of the minute mirrors. For the purpose of processing for calibration or laser light, the pattern specified as the input pattern is different. A picture corresponding to the input pattern is generated on the image of the object to be processed 丨〇 2 which is irradiated with light according to some input patterns. Hereinafter, the image generated on the image is referred to as an "output graphic". The output graphic is the binary value of "irradiated light" or "unirradiated light", and 15 indicates the pattern of each point on the image. The indications of "on" and "off" of the input graphic correspond to the state of "illuminated light" and the state of "unirradiated light" of the output graphic, respectively. However, the input pattern is generally different from the output pattern due to deformation or offset existing in the laser processing apparatus 100. For example, the calibration graphic is based on a cross-referenced reference pattern, and the output graphic is different from the reference pattern. That is, when the input pattern is regarded as a reference, the pattern is shifted to the reference position, or rotated from the reference angle, and the shape is enlarged, reduced, or deformed. Therefore, the calculation unit 202 calculates the conversion of the input pattern into the round-out pattern, and in most of the following modes, the calibration refers to the conversion parameter calculation 16 200916248. Since specific examples of the conversion parameters differ depending on the embodiment, the details will be described later. The calculation unit 202 outputs the conversion parameters calculated when the calibration pattern is used as the input pattern to the adjustment unit 203. Further, the calculation unit 202 reads a predetermined calibration pattern stored in a memory device not shown in Fig. 5 and uses the calculation of the conversion parameters to create a calibration pattern for each calibration. The adjustment unit 203 adjusts the laser irradiation according to the illumination pattern designated from the outside of the control unit 113 in accordance with the conversion parameters. The object to be controlled for adjustment differs depending on the embodiment. In the first embodiment, the adjustment unit 203 adjusts the illumination pattern supplied from the operation unit 10114. When the control unit 113 is implemented by the PC, the calculation unit 202 and the adjustment unit 203 can be realized by a CPU that executes a program by loading the program into the RAM. Further, when the calibration pattern is stored in advance in the memory device, the memory device may be a RAM or a hard disk device included in the pC. The spatial modulation control unit 204 receives the input pattern to be instructed by the DMD 106, and controls the micromirrors of the DMD 106 to be turned on or off depending on the input pattern. As a result, the light irradiated from the laser oscillator 1〇3 or the LED light source 116 is spatially modulated by the DMD 106 to be irradiated onto the workpiece 102. The spatial modulation control unit 204 receives the calibration pattern from the calculation unit 202' as an input pattern in the illumination of the LED light for calibration. In the irradiation of the processing laser light, the spatial modulation control unit 204 receives the wheeling pattern adjusted by the adjustment unit 203 from the adjustment unit 203. The platform control unit 205 controls the platform un to change the relative positions of the constituent elements constituting the optical system and the platform 101. In other implementations, the platform 101 is also urged not to move, but the optical system is moved to change the relative position. For example, when the laser processing apparatus 100 is a laser repairing apparatus, the laser processing apparatus 100 is notified in advance from the 5 defect inspection apparatus of the approximate position of the defect to be repaired. Then, the platform control unit 205 controls the stage 101 to move so that the notified position on the workpiece 102 enters the irradiation range of the laser light and enters the imaging range of the CCD camera 112. Thereafter, the CCDfe camera 112 captures the workpiece 1〇2, and the reading unit 201 reads the captured image, and the display 115 displays the image. The operator instructs the image to be irradiated with the laser light, i.e., the defect display area, from the operation unit 114 in accordance with the image displayed on the display 115. Further, it is also possible to extract the defect display area from a conventional technique of comparing images obtained from a good finished product. The selection unit 206 selects either of the laser oscillator 103 and the LED light source 116 as a light source to turn on the selected one of the light sources, and the light source that is not selected is turned off. Specifically, the selection unit 206 performs control for turning off the laser oscillator 103 when the laser oscillator 103 is turned off during calibration, and performs control for turning on the laser oscillator 103 and turning off the LED light source 116 during processing. Further, there is also a situation in which the walking unit 206 performs control for turning off both of the light sources. When the control unit 113 is implemented by the PC, the spatial modulation control unit 2〇4, the platform control unit 205, and the selection unit 2G6 can be implemented by loading the program into the connection interface of the CpU, the external device, and the Pc. 18 200916248 Next, with reference to Fig. 3, the object of calibration will be described. Fig. 3 is a view showing deformation of an illumination pattern due to an offset or deformation of the laser processing apparatus 1 , that is, a deformation of an input pattern to an output pattern. 5 For convenience of explanation, the coordinate axis of the horizontal direction of the image captured by the CCD camera 112 will be referred to as an X-axis, and the coordinate axis of the vertical direction will be referred to as a y-axis. The image size is arbitrary. In the present embodiment, the x direction is 640 pixels, and the y direction is 48 pixels. Also, this size is described as "640x480 pixels". The position of each pixel in the image is represented by a combination of x and y coordinates (x, y). The illumination diagram of Fig. 3 The coordinates of the upper left corner and the lower right corner of the 10 shape 310 are (0, 0) and (639, 479), respectively. The illumination pattern 31 of Fig. 3 shows the image of the image taken by the C C D camera 112 indicating which portion of the image is to be irradiated with the laser light. Therefore, the position in the illumination pattern 31 can also be expressed by a combination of x coordinates and y coordinates (x, y), and the size of the illumination pattern 310 is 640 x 480 pixels which is the same as the image 15 taken by the CCD camera 112. Here, when the irradiation laser light is displayed in white and the non-irradiation is displayed in black, as shown in Fig. 3, the illumination pattern 310 can be represented by a white-black binary image. In the example of Fig. 3, the 'irradiation pattern 31' indicates that the white cross 2' shape and the background intersecting the thick line parallel to the X-axis and the thick line parallel to the y-axis at the center portion of the image are composed of black' A portion of the workpiece 102 on the white cross shape illuminates the laser light. In the present embodiment, the irradiation pattern 310 is performed as follows, and is instructed from the operation unit 114. First, under illumination by the illumination light of the illumination light source 1U, the CCD camera in 19 200916248 photographs the workpiece in a state where the laser light is not irradiated or the LED light is not irradiated. Then, the reading unit 201 of the control unit 113 reads the captured image ’ to the display 115. Thereafter, the operator views the image output to the display 1丨5, and instructs the operation unit 114 to irradiate the range of the laser light. The instruction is supplied to the control unit 113 in the form of data of the illumination pattern 310 of 640 x 480 pixels by the interface connecting the operation unit 114 5 and the control unit U3. In another embodiment, the data of the illumination pattern 31 can be transmitted from the other device to the control unit 113. For example, when the laser processing apparatus 1 is a laser repairing apparatus such as an FPD substrate, the material of the BH31G can be transferred from the defect inspection apparatus to the control unit. Alternatively, the laser repairing device may have a shirt image recognizing portion, and the image recognizing portion may recognize the unopened v shape and generate a material of the unilluminated shape of the illumination pattern HQ to the control unit 113. The reason why the person does not sound is to provide the information of the illumination pattern 31 to the control unit 15 113. Thus, the control unit 113 generates a data for the transfer of the hall from the illumination pattern to open and close the DMD 106^ not the small mirrors. 320. The face transfer data 320 indicates the data of the input graphic and is transferred (i.e., transmitted) to the DMD 106. 20 In the DMD 106, the micro mirrors are arranged in a two-dimensional array, and the position of the micro mirror can be represented by a combination (u, v) of the u coordinate and the v coordinate. In addition, the following is a simple » The coordinates of the pixel (x, y) in the image of the brother and the image of the micromirror (u, v) are those with X = U, y = V. Since the micro mirror is properly configured and the origin of the coordinate system is properly set, the generality of this __ is not lost. 20 200916248 Here, as in the case of the illumination pattern 310, when the illumination light is indicated by white. When the non-irradiation is indicated by black, the DMD transfer data 320 can also be represented by a white-black binary image. In other words, the DMD transfer data can be represented by a black and white binary image showing the position of the position Ο, ν) in a black table in which the white or micro mirror in which the micro mirror is turned on is displayed. In the present embodiment, it is assumed that 800 x 600 micromirrors are arranged in the DMD. That is, the number of tiny mirrors is larger than the number of pixels of the image captured by the CCD camera 112. Therefore, the image of the DMD transfer data 320 is displayed as an image surrounding the image showing the illumination pattern 310 surrounded by a black border. There are 10 reasons for this kind of edge. That is, the color (white or black) of the image position (x, y) of the display illumination pattern 310 is equal to the color of the position (u, v) of u = x, v = y of the image for displaying the DMD transfer data 320. When the position (u, v) is in the range of u < 〇, v < 0 or 480 gv, the color 15 of the position (u, v) of the image showing the DMD transfer data 320 is black. In addition, in FIG. 3, the DVD conversion material 320 has a white rectangular frame line, which is a description of a range of 640 x 480 pixels corresponding to the illumination pattern 31, which is not a small mirror on the white frame line. Resentful. Further, in the present embodiment, in the DMD transfer material 320 20, the width of the edge above the white frame line and the edge of the lower side are equal, and the width of the edge on the right side and the edge on the left side are also equal. However, the width of the edge can be appropriately determined depending on the embodiment. In accordance with the above relationship between the illumination pattern 31 and the DMD transfer data 32, the control unit 113 generates the DMD transfer data 21 from the data of the illumination pattern 3, 200916248 320 ° as described above, to generate the DMD transfer data 320, and the control unit 113 Only add a black edge around the shame graphic 31 〇. The spatial modulation control unit 204 in the control unit 113 outputs an indication of turning on or off the 800x600 micro mirrors by outputting the DMD transfer data 320 to the DMDs 〇6'. Here, it is assumed that the adjustment according to the calibration is not performed, but according to the given DMD transfer data 32, the micro mirror of DMD1〇6 is turned on or off, and the laser light is emitted from the laser oscillator 1〇3. At this time, the pattern of the laser light which is generally irradiated onto the workpiece 1〇2 is different from the projection pattern 310 of the tenth stage. This is due to the offset or deformation of the optical system and/or the imaging system of the laser processing unit. For example, the mirror or the lens may be deformed, or the mounting positions of the constituent elements of the laser processing apparatus 100 may be offset, or the mounting angle may be offset from the original angle. The image 330 of Fig. 3 is an example of an image taken by the ccd camera ι 2 when the pattern different from the intended illumination pattern 310 is irradiated onto the workpiece 1〇2. Therefore, the position on the live image 33 can also be represented by the coordinate system, and the size of the live image 33 is 640 x 480 pixels. In the live image 33 of Fig. 3, the portion actually irradiating the laser light is displayed in 20 white, and the unirradiated portion is displayed in black. When the live image 33 is compared with the illumination pattern 310, the white cross is moved in the forward direction of the axis, and the clock is rotated 15 degrees counterclockwise. The deformation from the illumination pattern 31 〇 to the live image 33 实 actually includes not only parallel movement (displacement) and rotation, but also deformation of the shape such as enlargement, reduction, that is, scale conversion or shear strain. 22 200916248 Therefore, in order to prevent such deformation, calibration is performed, and the irradiation of the laser light needs to be adjusted according to the result of the calibration. In the present embodiment, the deformation of the above-described illumination pattern due to the deflection or deformation of the laser processing apparatus is regarded as a result of the type conversion, and the conversion is mathematically modeled. In the case of the calibration, the parameters obtained by the mathematical mode conversion are displayed in accordance with the obtained parameters, and the adjustment process is explained. 10 In Fig. 3, the DMD transfer data 32 is excluded from the edge. Therefore, the illumination image can actually be the input graphic for the heart of the DMD106. The live image 33 will correspond to the input pattern, and the output image generated by the image will be received when the laser light that receives the change is irradiated onto the object ι 2 . Thus, the transition from the illumination pattern 3H) to the image shape can be regarded as the transition from the input pattern to the output pattern. In the present embodiment, this conversion is used as a mathematical mode of affine conversion represented by a conversion matrix. That is, each element of the conversion matrix τ is a conversion parameter that should be calculated in the 15 calibration. As described above, both the input pattern and the output pattern can be represented by the xy coordinate system, and since the usual u = x, j_v = y, even if the (10) coordinate system and the coordinate system are regarded as the same, the calculation of the conversion parameters is not problematic. That is, the mathematical mode of the present embodiment is "the coordinate of the illumination 20 pattern 310 equal to the coordinates (u, v) of the DMD transfer data 32" to display the conversion matrix T of the affine transformation, and is converted into the coordinates of the live image 330. (X,, y,)". When this mathematical mode is expressed by an equation, it is as in equation (1). χ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, T. ax dl 0^2 0 0 1 In this way, the matrix of the equation (3) can be used to convert the output pattern. Br ’X, y 2 b2 d2 y UJ .0 0 U lu (3) Here, the element of the third column of the transformation matrix 及 and seven represent the amount of parallel movement. In the transformation matrix τ, when the part formed by the elements ai, bi, a2, and b2 is regarded as a 2×2 matrix, the 2x2 matrix is defined as a normal from the affine transformation, indicating the transformation of the synthetic rotation, enlargement, reduction, and shearing. . This can also be understood from the following formulas (4) to (12). That is, any regular 2x2 matrix S can be decomposed into the equation (4). s ~ 'ab, a - c, a2+c2 lc d) a J n ad-be V a2+c2, (4) and 'general representation of the matrix X of rotation is represented by the formula (5), indicating amplification, preparation for a small The matrix Y is represented by the formula (6), and represents the matrix z of the shear strain.
X (c〇s0 -sin0、 、sin0 cos^ y a 0、 Y = v〇 β, (6) Λ Z = i 、〇 γ 1, ⑺ 24 (5) 200916248 在此，α、/3、r分別以式（8)、（9)、（10)表示，0只 要滿足式（11)及（12)，矩陣S即滿足式（13)。 a = ^a2 +c2 ⑻ 八 ad — be (9) V«2 +c2 ab + cd a2 +c2 r = (ίο) cos(9-—p a (11) sin Θ =.......,......° (12) S = XYZ (13) 10 即，藉算出轉換矩陣τ，可進行將平行移動、旋轉、放 大、縮小及剪應變納入考慮之校準。是故，接著，就算出 轉換矩陣T之方法作說明。 一般，3點a、b、c以仿射轉換映射成點a’、b’、c’時， 表示此仿射轉換之轉換矩陣T可從點a、b、c之座標及點a’、 15 b’、c’之座標如以下進行而算出。 首先，在xy座標系中，點a之座標以由（xa,ya)Ti列向量 表示，點b之座標以由（xb,yb)T構成之列向量表示，點c之座 標以由（xc,yc)T構成之列向量表示，點a’之座標以由（xa’,ya’)T 構成之列向量表示，點b’之座標以由（xb’,yb’)T構成之列向量 20 表示，點c’之座標以由（xe’,ye’)T構成之列向量表示。在此， 25 200916248 上述上標文字之「T」表示轉置。如此一來，使用點a、b、 c及點a’、b’、c’之座標，將以下述式（14)表示之矩陣P與以 下述式（15)表示之矩陣Q定義。 xb 〜、 P = yb λ (14) l· 1 U V V V、 Q = ya' λ' 尺， (15) 1 κ 在此，從式（3)，3點a、b、c與3點a’、b’、c’之關係可 如下述式（16)表示。 TP=Q (16) 當適當選擇3點a、b、c之位置時，矩陣P為正規，逆矩 10 陣P_1存在。是故，從兩邊之右邊乘上逆矩陣Γ1，可獲得式 (17)° T=QP-1 (17) 是故，算出部202可從式（17)算出轉換矩陣T。即，訂 定矩陣P為正規之適當位置之3點a、b、c，而可得知該3點 15 以轉換矩陣T映射之點a’、b’、c’之位置時，可算出轉換矩 陣T。在本實施形態中，為得知點a’、b’、c’之位置，可進 行根據校準圖形之LED光之照射。 第4圖係顯示校準圖形之例。於第4圖顯示3個校準圖形 之例，該等皆為將定位成矩陣P為正規之3點a、b、c表現成 20 可相互區別之圖形。 校準圖形可於每次校準時，由算出部202生成，亦可預 先生成，記憶於記憶裝置。 26 200916248 由於校準圖形為對DMD106之輸入圖形之一種，故與第 3圖同樣地’可以顯示開啟狀態之白色與顯示關閉狀態之黑 色之一值影像表示。又，如在第3圖中所說明，在本實施形 悲中’由於uv座標系視為與xy座標系相同，故於第4圖顯示 5 X軸及y轴。 於校準圖形340配置直徑不同之3個圓（circle)，3點可以 直徑之不同來區別。即，直徑最小之圓之中心為點a，直徑 第2小之圓之中心為點b，直徑最大之圓之中心為點c。由^ 直徑互異之圓面積亦互異，故可易以影像處理相互區 10 識。 τ 、 M J 。即，長， 形之重心為點a，菱形之重心為點b，三角形之重心為點^ 在校準圖形342,使用由2個線段構成之圖形，區^ 15 20 點。在校準圖形342，與丫軸平行之線段之 _ ^ , 鳊點為點a，j W為點b 又，與x軸平行之線段之未 之端點為點c。在此，當令線段ab與和x轴平L μ接觸' 觸點為點w時，訂定點a、b、c之位置 仃之線段之4 離aw及點b與點bw之距離bw互異。 ’〇點w之s 當然亦可利用第4圖例示以外之校準圖 在由3邊長度不同之三角形構成之圖形，可依3邊+。之 區別3個頂點，故可利用作為校準圖形。亦 長度， 相互區別之4點之圖形，僅將#中 用表現了〒 而言之，當採用轉換矩陣T表示仿射轉準1 要可相互區別3點’校準圖形為何種形狀之圖形；^ 27 200916248 然後’當CCD照相機丨12拍攝根據校準圖形照射光之被 加工物1〇2時’如上述，獲得包含以轉換矩陣τ變形之輪出 圖开y之和像。要算出轉換矩陣τ，需從此輸出圖形辨識點 a’、b’、c’之位置。 5 在此，由於轉換矩陣T之變形之原因為潛藏於雷射加工 裝置100之偏移或變形，故轉換矩陣τ之變形之程度不致非 常大。因而，為了即使圖形務微變形，仍可保持「可區別3 點」之性質之狀態，藉使用提高「3點a、b、c之區別容易 度之程度」之校準圖形’而可在輸出圖形中，相互區別辨 10 識點a’、b’、C’。 舉例言之，在校準圖形34〇之例中，當3個圓之直徑不 同時，可區別3點a、b、c。惟，該區別之容易度程度依3個 圓之直徑之比而異。 若3個直徑之值相近時，3個圓可能映射成幾乎無法以 15轉換矩陣T區別之3個_(或圓）。‘然而，當3個直經之值大 為不同時，3個圓在以轉換矩陣τ變形之輸出圖形中，面積 大為不同，而映射成易區別之3個_(或圓）。因而，可區 域3點a b c即可將3個擴圓（或圓）之重心辨識作為3 點a，、b，、c，。 20 即，在校準圖形340之例中，·π 3個圓之直徑越不同，3點 a、b、c區別之容易程度越高。a p、、住η…，μ山 在％c準圖形340中，何種程 度之3個圓之直徑不同時，在輪出廟 ___ 利出圖形，可區別3點a，、b，、 c’依實施形態而異。是故’亦可進行預備之實驗，訂定3個 圓之直徑。 28 200916248 在校準圖形341中，三角形與四角形在輸出圖形亦易區 別。舉例言之，當長方形2邊之長度大為不同，或長方形與 菱形之面積大為不同時，在輸出圖形，便保持「可區別3點」 之性質。因而，在輸出圖形，可將3個圖形之各重心辨識作 5 為 3點 a’、b’、c’。 在校準圖形342中，2個距離aw與bw大為不同，而可在 輸出圖形’保持「可區別3點」之性質，而可相互區別辨識 3 點 a’、b，、c，。 接著，參照第5圖，就使用此種校準圖形，算出轉換矩 10 陣T之處理作說明。 第5圖係顯示作為第丨實施形態之轉換參數之轉換矩陣 T之算出裎式之流程圖。 在步驟S101 ’算出部202作成第4圖所示之校準圖形， 將之輸出至空間調變控制部204。或者，算出部202亦可在 15步驟S101讀取預先儲存於記憶裝置之校準圖形。 校準圖形係對D M D1 〇 6指定作為輸入圖形者，可以二值 影像表現。是故，在第5圖，將步驟S101表現為「DMD影 像作成」。 接著’在步驟S102 ’算出部202從校準圖形之資料取得 20 3點a、b、c之座標。 舉例言之’當為第4圖之校準圖形34〇時，算出部2〇2以 影像辨識處理，從校準圖形辨識3個「白色」之圓，分別算 出取得所辨識之3個圓中心（即重心）之座標。該等3個座標為 點a ' b、c之座標。 29 200916248 然後，在步驟S103，選擇部206選擇LED光源116作為 光源。空間調變控制部204控制DMD106，以根據校準圖形， 切換微小鏡子之開啟狀態及關閉狀態。藉此’從LED光源 116射出之LED光根據校準圖形空間調變，藉由DMD106， 5 投影至被加工物102之表面（即照射）。 接著，在步驟S104, CCD照相機112拍攝被加工物102， 讀入部201從CCD照相機112讀入（亦即擷取（capture))所拍 攝之影像之資料。於此影像存在對應於校準圖形之輸出圖 形。 10 在下個步驟S105，算出部202從讀入部201所讀入之輪 出圖形，如以下進行，取得3點a’、b’、c’。 在本實施形態中’讀入部201所讀入之影像為灰階影 像。當然在其他之實施形態中’亦可使用拍攝彩色影像之 CCD照相機112 ’此時亦與下述同樣地，算出部202取得3點 15 a，、b’、c’之座標。 异出部202首先將讀入部2〇 1讀入之影像轉換成白黑二 值影像。此二值化依各像素之亮度值與閾值之比較進行。 在已轉換之白黑二值影像中，白色區域為照射LED光之區 域部份，黑色區域為未照射LED光之區域。算出部2〇2使用 已轉換之白黑二值影像，進行以下之處理。 舉例言之，使用第4圖之校準圖形34〇時，算出部2〇2以 影像辨識處理，辨識與圓形或橢圓相近之形狀之存在及位 置。結果，辨識3個形狀。在校準圖形34〇之例中，依3個圓 之面積小之順序，分別對應於點&、b、c。因而，算出部2〇2 30 200916248 具出所辨識之3個形狀之面積，依該面積小之順序，使形狀 分別對應於點a’ ' b，、c，。再者，算出部2〇2算出所辨識之3 個形狀之各重心座標，取得該等3個座標作為3點a，、b，、c， 之座標。 5 使用其他之校準圖形時亦同樣地，算出部202在步驟 S105從表不輸出圖形之白黑二值影像取得3點&，、b，、c，之 座標。 接著，在步驟S106，算出部202依上述式（17)，算出轉 換矩陣T。在此，矩陣q從在步驟sl〇5取得之3點a，、b，、c， 10之座標以式（15)定義，矩陣p從在步驟sl〇2取得之3點&、b、 c之座標以式（14)定義。 又，如式（16)所說明，在本實施形態中，由於矩陣卩為 正規，故算出部202可在步驟5106算出逆矩陣p-i。逆矩陣 之計算方法已知有各種方法，可採用任何方法。 15 算出部202將如此進行而作成之轉換矩陣T之資料儲存 於第2圖未顯示之RAM或硬碟等記憶裝置。 最後，在步驟S107，算出部202從轉換矩陣τ算出為其 逆矩陣之逆轉換矩陣τ，（ = τ-ι)。逆轉換矩陣τ，為表示作為 轉換參數之轉換矩陣Τ之轉換之逆轉換的逆轉換參數。算出 2〇部202亦將逆轉換矩陣τ，之資料儲存於記憶裝置。 以上，第5圖之處理、亦即校準結束。校準結束後，進 行進行了根據逆轉換矩陣Τ，之調整之雷射振盪器丨〇 3之雷 射光之照射。此外，由於逆轉換矩陣Τ，從轉換矩陣τ算出， 故應注意根據逆轉換矩陣Τ，之調整亦間接地為根據轉換矩 31 200916248 陣τ之調整。 第6圖係說明第1實施形態之調整方法者。 第6圖之照射圖形310與DMD轉換用資料320與第3圖相 同。又，第6圖係使用與第3圖相同之轉換矩陣Τ來說明者。 在第1實施形態中，第2圖之算出部202將已算出而已儲 存於記憶裝置之轉換矩陣Τ及逆轉換矩陣Τ，輸出至調整部 203。 又，調整部203從操作部114接收照射圖形310，生成 DMD轉送用資料320。調整部203進一步以逆轉換矩陣Τ’轉 10換DMD轉送用資料320，生成DMD轉送用資料321，將之輸 出至空間調變控制部204。 然後’空間調變控制部204將DMD轉送用資料321指定 作為對DMD106之輸入圊形，控制DMD106。即，調整部203 具有藉由空間調變控制部204,對DMD106指定DMD轉送用 15 資料321作為輸入圖形之功能。 在第6圖所示之例中，與第3圖同樣地，轉換矩陣τ表示 合成X軸之正向之移動與逆時鐘約15度之旋轉的轉換。因 而，在第6圖中，以逆轉換矩陣τ’轉換之DMD轉送用資料321 係使DMD轉送用資料32〇之圖形順時鐘旋轉約丨5度，移動至 20 X軸之負向之圖形。 在此，當第2圖之選擇部2〇6選擇雷射振盪器103作為光 源時，從雷射振盪器103射出雷射光。該雷射光藉由指定 DMD轉送用資料321作為輸入圖形之DMD1〇6，照射至被加 工物102上。在本實施形態中，在此，CCD照相機112拍攝 32 200916248 被加工物102，調整部2G3從CCD照相機112讀人影像。如此 進行而讀入之影像為第6圖之實況影像331。 如第6圖所示，於實況影像331顯現之輸出圖形係由於 逆轉換矩陣T，之變形及轉換矩陣τ之變形抵銷，而與照射圖 5形310相等之圖形。此外，「實況影像331上之輸出圖形與照 射圖形310相等」正碟地係指「當忽略式(3)之數學模式與實 際產生之轉換之差異等之誤差時，便相等」之意思。在以 下之說明中，只要未特別限制，便在此意思使用「相等」 一詞。 10 貫況影像331之輸出圖形與照射圖形310相等係指藉調 整部203所作之調整，以應於應加工之位置加工之形狀正碟 地照射雷射光，將該正確之照射作為實況影像331而拍攝。 此外，比較DMD轉換用資料32〇及321可知，逆轉換矩 陣T之轉換之結果，顯示微小鏡應呈開啟狀態之白色部份 15 有在 DMD 資料 321 中，超出 u<0、64〇$u、v<0 或 48〇$v 之範圍之可能性。因此，在本實施形態中，使用具有多於 表示照射圖形310之影像之像素數(例如64〇 x 84〇像素）之(例 如800x600個）微小鏡子的DMD106。此時，如第3圖或第6 圖所示’表示對DMD106指定之輸入圖形之DMD轉送用資 20料320之影像係以黑色（亦即表示未照射光)邊緣包圍表示照 射圖形310之影像周圍之影像。 在此’轉換矩陣T係表示存在於雷射加工裝置1〇〇之變 形或偏移之影響者。此種變形或偏移係在雷射加工裝置1〇〇 之規格上容許之範圍内者。因而，轉換矩陣T之變形之程度 33 200916248 並非相當大者。即，不需相當大之邊緣。亦可估計實驗上 必要之邊緣之量，依所估計之邊緣之量，訂定DMD106所需 之微小鏡子之個數。 接著，參照第7圖〜第11圖，就第2實施形態及第3實施 5形態作說明。在第2實施形態及第3實施形態中，調整取得 轉換參數後之雷射光之照射之調整方法、亦即調整部2〇3之 動作與第1實施形態不同。由於抵銷以轉換參數表示之轉換 之調整方法有許多’故宜依實施形態，採用適當之調整方 法。 ίο 第7圖係說明從輸入圖形至輸出圖形之轉換之例作為 說明第2實施形態及第3實施形態之調整方法之前提者。第7 圖之内容與第3圖類似，為方便說明，圖式顯示之方式在第 3圖及第7圖不同。 此外，在第2實施形態及第3實施形態中，如第8圖及第 15 10圖所示，控制部113之結構與第1實施形態之第2圖之結構 一部份不同，關於第7圖，則無與第2圖不同之影響。 第7圖之影像300係在僅照明用光源111之照明光照射 載置於平台101之被加工物102之狀態下’ CCD照相機112拍 攝之影像。在第7圖之例中，於被加工物1〇2上存在3條直線 20 狀電路圖形。 以讀入部201讀入影像300，輸出至顯示器115時，操作 員藉由操作部114，指定加工之對象範圍。所指定之範圍為 影像300之網點矩形範圍。 空間調變控制部204接收來自操作部114之指定，依該 34 200916248 $疋生成如射圖形3H。表示照射圖形叩之影像在影像 上心疋之矩形範圍為白色，其他為黑色影像。對應於照 射圖形311，對DMD舰指定之輸入圖形省略圖式，可以僅 、’’:、色邊、緣包圍之影像表示照射圖形3U之肖圍。空間調變 U P204亦生成對應於照射圖形阳之對画謂6之輸入 圖形。 右依對應於照射圖形311之輸入圖形之指示，業經以D MD106工間調變之雷射光照射至被加卫物脱上，cCD照相 機112拍攝被加工物1〇2時，獲得實況影像说。在第頂之 1〇例中在只況影像332實際照射雷射光之範圍為網點矩形範 圍’與對影像3GG紋之要加工之範圍不同。 比較影像300及實況影像332,電路圖形之位置、方向、 开y狀相同。然而，可看出以與以影像細指定，對觀D⑽ 提1、之輪人圖形不同之圖形’照射雷射光。從此輸入圖形 15至輸出圖形之轉換以轉換矩陣T表示外，在第3圖及第7圖， 使用相同之「T」文字，而轉換矩陣τ之各要件之具體之值 在第3圖及第7圖不同。在第7圖中，為簡單說明，顯示轉換 矩陣T表示以實況影像332之中心附近為中心之逆時鐘約3〇 度之旋轉之情形。 20 在以上，參照第7圖說明之前提下，接著，參照第8圖 及第9圖，就第2實施形態作說明。 第8圖係顯示第2實施形態之控制部113之功能之功能 方塊圖。與顯示第丨實施形態之第2圖比較，第8圖在控制部 n3具有讀入部2〇1、算出部202、調整部203、空間調變控 35 200916248 制部204、平台控制部2〇5、選擇部206之點與第2圖相同。 在第8圖中與第2圖不同者為以箭號顯示之資料及/或 控制之流程。即，在第1實施形態及第2實施形態中，由於 調整方法不同’故朝向調整部2G3之箭號與從調整部2〇3射 5出之箭號在第2圖及第8圖不同。第8圖之箭號之意思從參照 第9圖’在以下說明之調整方法應可明白。 第9圖係說明第2實施形態之調整方法者。 藉第8圖所示之平台控制部205控制平台101之動作，雷 射加工裝置1〇〇之光學系統與平台1〇1之相對位置變化。可 10制平台101之動作之種類可依實施形態不同，在第2實施形 態中’平台控制部205控制以下種類之平台101之動作。 (a) 鉛直方向之移動 (b) 在與錯直軸呈水平之平面内之平行移動 (c) 在與錯直軸呈水平之平面内之旋轉 15 (d)改變平台1〇1之上面與鉛直轴構成之角之動作 即’在第2實施形態中，可進行該等種類之動作之圖中 未示之驅動馬達及/或致動器（actuator)安農於平台ιοί。平 台控制部205控制驅動馬達及/或致動器而使平台101動作。 此外’在第2實施形態中’依需要’以停止器（stopper) 20 等將被加工物102固定於平台101上，即使平台1〇1因上述(d) 之動作傾斜，被加工物102亦不致滑落。 在此種結構中，算出部202將已算出，儲存於記憶裝置 之轉換矩陣T之資料輸出至調整部203。調整部203依轉換矩 陣T，對平台控制部205指示使平台101動作之控制。平台控 36 200916248 制部205依來自調整部203之指示’使平台1〇1動作。此控制 之結果，雷射加工裝置100之光學系統與被加工物1〇2之相 對位置亦隨轉換矩陣T變化。 在此時間點，為方便說明，CCD照相機112係拍攝被加 5工物102者。如此一來，如第9圖所示，拍攝與以轉換矩陣τ 將衫像300變形之影像相專之影像3〇 1。在第9圖中，從與於 影像300及301映照之被加工物1〇2上之電路圖形之比較，可 目視辨認轉換矩陣T之變形。 另一方面，與第7圖說明者同樣地，依影像3〇〇，指定 10如射圖形311。然後，依所指定之照射圖形311，空間調變 控制部204對DMD106指定輸入圖形。然後，選擇部206選擇 雷射振盪器103作為光源。 如此一來，從雷射振盪器1〇3照射之雷射光受到以轉換 矩陣τ表示之偏移或變形之影響，照射至被加工物1〇2上。 15惟，與第7圖不同，在第2實施形態中，如影像301所示，在 照射雷射光之時間點，被加工物1〇2自身亦呈進行對應於轉 換矩陣T之動作後之狀態。如此，由於照射之光與被加工物 102皆呈受到相同之轉換矩陣τ之影響之狀態，故抵銷轉換 矩陣T之影響。即，調整之結果，可於所指定之區域正確地 2〇 照射雷射光。 此在第9圖中如以下所顯示。在照射雷射光之狀態下， CCD照相機Π2拍攝被加工物1〇2之實況影像333中，實際照 射雷射光之範圍以網點顯示。又，比較影像3〇〇及實況影像 333，3條電路圖形之線之方向或映照於影像之部份不同， 37 200916248 而3條包路圖形之線及網點之區域之相對關係相同。即，對 所才曰疋之所期區域正確地照射雷射光。 從以上說明可知，在第2實施形態中，可省略第5圖之 步驟S107之處理。 5 料，根據轉換矩陣T使平台如動作所需之控制參數 之值可以實驗決定，亦可從雷射加工裝置1GG之規格等計 算。 舉例言之，關於上述(a)之動作，亦可使平台1〇1沿鉛直 ι軸上或下移動1mm時，以CCD照相機112拍攝之影像之放大 率或縮小率之值預先以實驗調查。調整部亦可從轉換矩 陣T所包含之放大或縮小之要件，依預先調查之值算出錯直 方向之移動量’將所算出之移動量作為平台1〇1之控制參 數，輪出至平台控制部205。關於上述(b)〜(d)之動作 ，亦同 樣地，調整部203可取得控制參數之值。 又’從上述說明可知，第2實施形態之調整方法適合進 行平台101之移動之機構的機械精確度高之情形。 接著，參照第10圖及第1丨圖，說明第3實施形態之調整 方法。在第3實施形態中，調整部2〇3以影像處理進行調整。 第10圖係顯示第3實施形態之控制部113之功能之功能 〇方塊圖。與顯示第1實施形態之第2圖比較，第10圖在控制 4 113具有讀入部201、算出部2〇2、調整部2〇3、空間調變 控制部204、平台控制部205、選擇部2〇6之點與第2圖相同。 在第10圖中，與第2圖不同者為以箭號顯示之資料及/ 或控制之流程。即，在第1實施形態與第3實施形態中，由 38 200916248 於調整方法不同，故朝向調整部203之箭號及從調整部203 射出之箭號在第2圖及第10圖不同。 又，於第2圖，為指定照射圖形，有表示從CCD照相機 112讀入之影像輸出至顯示器115之從讀入部201至顯示器 5 115之箭號，在第10圖則無箭號。如以下所述，在第3實施 形態中，這是由於從照射圖形之指定之階段進行調整之 故。其他之箭號之意思亦應可從參照第11圖，在以下說明 之調整方法明白。 第11圖係說明第3實施形態之調整方法者。 10 在第11圖中，影像302係CCD照相機112拍攝，讀入部 201從CCD照相機112讀入之影像。與第7圖及第10圖之影像 300相同之3條電路圖形之線亦映照於影像302。 在第3實施形態之調整中，首先，算出部202將已算出， 儲存於記憶裝置之逆轉換矩陣Τ’之資料輸出至調整部20 15 3。然後，調整部203進行以逆轉換矩陣Τ’將影像302變形， 生成影像303之影像處理，將影像303輸出至顯示器115。 與第7圖同樣地，在第11圖中，轉換矩陣Τ表示逆時鐘 約30度之旋轉。因而，在影像303，3條電路圖形之線與影 像302比較，順時鐘傾斜約30度。 20 操作員觀看顯示於顯示器115之影像303，藉由操作部 114，指定要照射雷射光之區域。在第il圖之影像304，所 指定之區域以網點顯示。空間調變控制部204接收來自操作 部114之指定，依該指定，生成照射圖形312。照射圖形312 對應於影像304之網點區域。 39 200916248 空間調變控制部204進-步依照射圖形3i2，生成對 DMD106心定之輸人圖形。空間調變控制部綱對丽謂6 指定輸入圖形。又，選擇部篇選擇雷射振㈣贈作為光 源。 5 ㈣來射振盪器1G3照射之H射光受到以轉換 矩陣丁表示之偏移或變形之影響，照射至被加工物102上。 惟，依以逆轉換矩陣T，變形之影像3〇4為基準而指定之照射 圖形312，照射雷射光，該照射受到轉換矩陣了之影響時， 逆轉換矩陣T，之影響與轉換矩陣τ之影響抵銷。即，調整之 10結果，可對所指定之所期區域正確地照射雷射光。 此在第11®中如以下所顯示。在照射雷射光之狀態 下，CCD照相機112拍攝被加工物1〇2之影像334中，實際照 射雷射光之範圍以網點顯示。又，比較影像3〇4及實況影像 334，3條電路圖形之線之方向映照於影像之部份不同，而3 15條電路圖形之線及網點之區域之相對關係相同。即，對所 指定之所期區域正確地照射雷射光。 以上’關於第2及第3實施形態，以轉換矩陣τ顯示比較 單純之變形之情形為例而說明，轉換矩陣Τ之變形亦可為包 含平行移動、旋轉、剪應變、放大及縮小全部之複雜變形。 20 接著，就第4〜第6實施形態作說明。第4〜第6實施形態 從輸入圖形至輪出圖形之轉換之數學模式與第1實施形態 不同’除了控制部113之動作依數學模式之不同而異外，其 餘與第1實施形態相同。採用哪個數學模式為佳端賴實際之 雷射加工裝置100之變形或偏移之特性或程度。 200916248 在第4實施形態中，採用僅考慮平行移動(位移)及旋轉 之數學模式。第4實施形態之校準圖形可以可相互區別之2 點a、b表示即可。舉例吕之，在第4實施形態中，可使用由 直徑不同之2個圓構成之圖形取代第4圖之校準圖形34〇。 與第1實施形態同樣地，點a之座標以由（Xa，ya)T構成之 列向量表示，點b之座標以由（Xb，yb)T構成之列向量表示，點 a’之座標以由（xa’，ya’)T構成之列向量表示，點b，之座標以由 (Xb’，yb’)T構成之列向量表示。在第4實施形態中，算出部2〇2 從該等4個座標算出X方向之平行移動之量： di=xa’-xa (18) y方向之平行移動量： d2=ya’-ya (19) 旋轉之量： 0 =tan_1 {(yb’-ya’）/(Xb，-xa，）}_ tan1 {(yb-ya)/(xb-xa)} (20) 之3個轉換參數。該等轉換參數與第丨實施形態同樣 地，可以式(2)之轉換矩陣T之形式表示。即， =cos θ (21) bi=-sin Θ (22) a2= =sin θ (23) b2= =cos θ (24) 及式(2)代入即可。如此進行’算出部2〇2算出轉換矩陣丁後 之雷射加工裝置刚之動作與第丨實施形態相同。 在第5實施形態中’採用僅考慮平行移動(位移）之數學 41 200916248 模式。第5實施形態之校準圖形僅以丨點表示即可。舉例言 之，在第5實施形態中，可使用由丨個圓構成之圖形取代第4 圖之校準圖形340。 與第1實施形態同樣地，點a之座標以由（Xa，^)T構成之 5列向量表示，點a，之座標以由（xa，，ya，)T構成之列向量表示之 在第5實施形態中’算出部202從該等2個座標，與第々^施 形態同樣地，以式（18)及（19)，算出x方向之平行移動只: 山及y方向之平行移動之量4之2個轉換參數，等轉換 與第1實施形態同樣地，亦可以式(2)之轉換矩陣τ之形= 10示。即，將 ν式表 1 (25) Βι=0 (26) Α2=0 (27) Βι=1 (28) 15 及式(2)代入即可。如此進行，算出部202算出轉換行τ 後之雷射加工裝置100之動作與第丨實施形態相同。 在弟6實施形悲中，採用虛擬仿射轉換作為數學模式。 在虛擬仿射轉換，除了在仿射轉換考慮之平行四邊形變形 (剪應變）外，亦考慮梯形變形。在第6實施形態中，使用表 20示可相互區別之4點a、b、c、d之校準圖形。舉例言之，在 第6實施形態中，可使用由直徑相互不同之4個圓構成之圖 形取代第4圖之校準圖形34〇。 與第1實施形態同樣地，點a之座標以由（xa，ya)T構成之 列向量表示，點b之座標以由（Xb，yb)T構成之列向量表示，點 42 200916248 c之座標以由（Xe，ye)T構成之列向量表示，點a,之座標以由 (Xa’’ya’)T之列向量表示’點b’之座標以由（Xb’，yb’)T構成之列 向量表示’點c，之座標以由（Xc，，ye，)T構成之列向量表示。同 樣地，點d之座標以由（Xd，yd)T構成之列向量表* ,點^之座 5標以由（Xd’，yd’)T構成之列向量表示。 虛擬仿射轉換以式(29)模式化。 ί x'=aix + bly + clxy + d1 \^'= a2x+b2y + c2xy + d2 (29) 轉換矩陣T如式(30)般定義。 ΓX (c〇s0 - sin0, sin0 cos^ ya 0, Y = v〇β, (6) Λ Z = i , 〇 γ 1, (7) 24 (5) 200916248 Here, α, /3, r are respectively Equations (8), (9), and (10) indicate that the matrix S satisfies the equation (13) as long as the equations (11) and (12) are satisfied. a = ^a2 + c2 (8) eight ad — be (9) V «2 +c2 ab + cd a2 +c2 r = (ίο) cos(9--pa (11) sin Θ =.......,...° (12) S = XYZ (13 10) By calculating the conversion matrix τ, it is possible to perform calibration in which parallel movement, rotation, amplification, reduction, and shear strain are taken into consideration. Therefore, a method of calculating the conversion matrix T will be described. Generally, 3 points a, b, c when affine transformation is mapped to points a', b', c', indicating that the transformation matrix T of the affine transformation can be from the coordinates of points a, b, c and points a', 15 b', c' The coordinates are calculated as follows. First, in the xy coordinate system, the coordinates of the point a are represented by a (xa, ya) Ti column vector, and the coordinates of the point b are represented by a column vector composed of (xb, yb) T, The coordinates of point c are represented by a column vector consisting of (xc, yc)T, and the coordinates of point a' are constructed by (xa', ya')T The column vector indicates that the coordinates of the point b' are represented by a column vector 20 composed of (xb', yb') T, and the coordinates of the point c' are represented by a column vector composed of (xe', ye') T. , 25 200916248 The above-mentioned superscript "T" indicates transposition. Thus, using the coordinates of points a, b, c and points a', b', c', the matrix P represented by the following formula (14) It is defined by a matrix Q represented by the following formula (15): xb 〜, P = yb λ (14) l· 1 UVVV, Q = ya' λ' ruler, (15) 1 κ Here, from equation (3), The relationship between the three points a, b, c and the three points a', b', c' can be expressed by the following formula (16): TP = Q (16) When the positions of the three points a, b, and c are appropriately selected, the matrix P is normal, and the inverse moment 10 array P_1 exists. Therefore, by multiplying the inverse matrix Γ1 from the right side of both sides, the equation (17) ° T=QP-1 (17) is obtained, and the calculation unit 202 can obtain the equation (17). The conversion matrix T is calculated. That is, the predetermined matrix P is the normal points 3, a, b, and c, and it can be known that the points 3', b', and c' are mapped by the conversion matrix T. At the position, the conversion matrix T can be calculated. In the present embodiment, Known points a ', b', c 'of the position, the LED light is irradiated into the line of the calibration pattern in accordance with. Figure 4 shows an example of a calibration pattern. In Fig. 4, an example of three calibration patterns is shown, which are three patterns in which the matrix P is normal, and a, b, and c are expressed as 20 mutually distinguishable patterns. The calibration pattern can be generated by the calculation unit 202 at each calibration, or can be generated in advance and memorized in the memory device. 26 200916248 Since the calibration pattern is one of the input patterns to the DMD 106, it can display the black one-value image representation of the white state of the on state and the display off state as in the third figure. Further, as described in Fig. 3, in the present embodiment, since the uv coordinate system is regarded as the same as the xy coordinate system, the 5th X axis and the y axis are shown in Fig. 4. Three circles having different diameters are arranged in the calibration pattern 340, and the three points can be distinguished by the difference in diameter. That is, the center of the circle having the smallest diameter is the point a, the center of the circle having the second smallest diameter is the point b, and the center of the circle having the largest diameter is the point c. The area of the circle with different diameters is also different, so it is easy to use image processing to identify each other. τ, M J . That is, the long, center of gravity is point a, the center of gravity of the diamond is point b, and the center of gravity of the triangle is point ^ In the calibration pattern 342, a pattern composed of two line segments is used, and the area is 15 15 points. In the calibration pattern 342, _ ^ of the line segment parallel to the 丫 axis, point a is point a, j W is point b, and the end point of the line segment parallel to the x axis is point c. Here, when the line segment ab is in contact with the x-axis flat L?, the contact point is the point w, the position of the fixed point a, b, c is 4, and the distance bw between the point b and the point bw is different. 〇 w w s s of course, can also use the calibration chart other than the illustration in Figure 4 in the shape of a triangle with three sides of different length, can be based on 3 sides +. It distinguishes three vertices and can be used as a calibration pattern. Also the length, the difference between the four points of the figure, only the use of # in the 〒 而言 当 , , , , # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # 27 200916248 Then 'when the CCD camera 丨 12 photographs the workpiece 1 〇 2 that illuminates the light according to the calibration pattern', as described above, the sum image including the wheel y of the transformation matrix τ is obtained. To calculate the conversion matrix τ, the position of the points a', b', c' needs to be recognized from the output pattern. 5 Here, since the deformation of the conversion matrix T is caused by the offset or deformation of the laser processing apparatus 100, the degree of deformation of the conversion matrix τ is not so large. Therefore, in order to maintain the state of "distinguishable three points" even if the graphics are slightly deformed, the output pattern can be used by using the calibration pattern of "the degree of ease of distinction between 3 points a, b, and c". In the middle, distinguish between the points a', b', C'. For example, in the example of the calibration pattern 34, when the diameters of the three circles are different, three points a, b, and c can be distinguished. However, the ease of the difference varies depending on the ratio of the diameters of the three circles. If the values of the three diameters are similar, the three circles may be mapped into three _ (or circles) that are hardly distinguishable by the 15 conversion matrix T. ‘However, when the values of the three straight passes are greatly different, the three circles are different in the output pattern deformed by the transformation matrix τ, and are mapped into three _ (or circles) that are easily distinguishable. Therefore, the center of gravity of the three roundings (or circles) can be recognized as three points a, b, and c, at a point a b c . That is, in the example of the calibration pattern 340, the smaller the diameter of the ?3 circles, the higher the ease of the difference between the three points a, b, and c. Ap, live η..., μ mountain in the %c quasi-pattern 340, to what extent the diameter of the three circles is different, in the round out of the temple ___ profit out the graph, can distinguish 3 points a, b, c 'Depending on the implementation. Therefore, it is also possible to carry out preliminary experiments and set the diameter of three circles. 28 200916248 In the calibration graph 341, triangles and quads are also easily distinguished in the output graph. For example, when the lengths of the two sides of the rectangle are greatly different, or the area of the rectangle and the diamond are greatly different, the output pattern is maintained to have a "distinguishable three points" property. Therefore, in the output pattern, the centers of gravity of the three figures can be identified as 5 points a', b', c'. In the calibration pattern 342, the two distances aw and bw are significantly different, and the output pattern 'can maintain the "distinguishable three points" property, and the three points a', b, and c can be distinguished from each other. Next, referring to Fig. 5, a description will be given of a process of calculating the conversion moment 10 array T using such a calibration pattern. Fig. 5 is a flow chart showing the calculation formula of the conversion matrix T as the conversion parameter of the second embodiment. In step S101', the calculation unit 202 creates a calibration pattern shown in Fig. 4 and outputs it to the spatial modulation control unit 204. Alternatively, the calculation unit 202 may read the calibration pattern stored in advance in the memory device in step S101. The calibration graphic is assigned to D M D1 〇 6 as an input graphic and can be expressed as a binary image. Therefore, in Fig. 5, step S101 is expressed as "DMD image creation". Next, the calculation unit 202 obtains the coordinates of the points 3a, a, and c from the data of the calibration pattern in the step S102. For example, when the calibration pattern 34 of FIG. 4 is used, the calculation unit 2〇2 performs image recognition processing, recognizes three “white” circles from the calibration pattern, and calculates and obtains the identified three circle centers (ie, The center of gravity). These three coordinates are the coordinates of points a ' b, c. 29 200916248 Then, in step S103, the selection unit 206 selects the LED light source 116 as a light source. The spatial modulation control unit 204 controls the DMD 106 to switch the on state and the off state of the minute mirror in accordance with the calibration pattern. Thereby, the LED light emitted from the LED light source 116 is spatially modulated according to the calibration pattern, and is projected onto the surface (i.e., illumination) of the workpiece 102 by the DMDs 106, 5. Next, in step S104, the CCD camera 112 captures the workpiece 102, and the reading unit 201 reads (i.e., captures) the image of the captured image from the CCD camera 112. There is an output graphic corresponding to the calibration pattern for this image. In the next step S105, the calculation pattern read by the calculation unit 202 from the reading unit 201 is performed as follows, and three points a', b', and c' are acquired. In the present embodiment, the image read by the reading unit 201 is a gray scale image. Of course, in other embodiments, the CCD camera 112 that takes a color image can also be used. In this case, the calculation unit 202 acquires the coordinates of 3 points 15 a, b', and c' in the same manner as described below. The output unit 202 first converts the image read by the reading unit 2〇 1 into a white-black binary image. This binarization is performed by comparing the luminance values of the respective pixels with the threshold. In the converted white-black binary image, the white area is the area that illuminates the LED light, and the black area is the area where the LED light is not illuminated. The calculation unit 2〇2 performs the following processing using the converted white-black binary image. For example, when the calibration pattern 34 of Fig. 4 is used, the calculation unit 2〇2 recognizes the existence and position of a shape similar to a circle or an ellipse by image recognition processing. As a result, three shapes are recognized. In the example of the calibration pattern 34, the order of the three circles is small, corresponding to the points &, b, c, respectively. Therefore, the calculation unit 2〇2 30 200916248 has the area of the three recognized shapes, and the shapes correspond to the points a' to b, c, respectively, in the order of the small area. Further, the calculation unit 2〇2 calculates the centroid coordinates of the three recognized shapes, and obtains the coordinates of the three coordinates as the three points a, b, and c. When the other calibration patterns are used, the calculation unit 202 obtains the coordinates of 3 points &, b, and c from the white-black binary image indicating the output of the pattern in step S105. Next, in step S106, the calculation unit 202 calculates the conversion matrix T based on the above equation (17). Here, the matrix q is defined by the equation (15) from the coordinates of the three points a, b, c, 10 obtained at the step s1 , 5, and the matrix p is obtained from the point 3 & b in step s1 〇 2 The coordinates of c are defined by equation (14). Further, as described in the equation (16), in the present embodiment, since the matrix 卩 is normal, the calculation unit 202 can calculate the inverse matrix p-i in step 5106. There are various methods for calculating the inverse matrix, and any method can be employed. The calculation unit 202 stores the data of the conversion matrix T thus created in a memory device such as a RAM or a hard disk not shown in Fig. 2 . Finally, in step S107, the calculation unit 202 calculates the inverse transformation matrix τ, which is the inverse matrix, from the transformation matrix τ, (= τ-ι). The inverse transformation matrix τ is an inverse transformation parameter representing the inverse transformation of the transformation of the transformation matrix 作为 as a transformation parameter. It is calculated that the second portion 202 also stores the inverse transformation matrix τ, and the data is stored in the memory device. Above, the processing of Fig. 5, that is, the calibration is completed. After the calibration is completed, the laser irradiation of the laser oscillator 丨〇 3 adjusted according to the inverse conversion matrix 进行 is performed. In addition, since the inverse transformation matrix Τ is calculated from the transformation matrix τ, it should be noted that the adjustment according to the inverse transformation matrix 亦 is also indirectly adjusted according to the transformation moment 31 200916248 array τ. Fig. 6 is a view showing the method of adjusting the first embodiment. The illumination pattern 310 and the DMD conversion data 320 of Fig. 6 are the same as those of Fig. 3. Further, Fig. 6 is a description using the same conversion matrix 第 as in Fig. 3. In the first embodiment, the calculation unit 202 of Fig. 2 outputs the converted matrix Τ and the inverse conversion matrix 已 which have been calculated and stored in the memory device, to the adjustment unit 203. Moreover, the adjustment unit 203 receives the illumination pattern 310 from the operation unit 114, and generates the DMD transfer material 320. The adjustment unit 203 further converts the DMD transfer data 320 by the inverse conversion matrix Τ', generates the DMD transfer data 321, and outputs it to the spatial modulation control unit 204. Then, the spatial modulation control unit 204 designates the DMD transfer data 321 as an input profile to the DMD 106, and controls the DMD 106. In other words, the adjustment unit 203 has a function of specifying the DMD transfer 15 data 321 as an input pattern to the DMD 106 by the spatial modulation control unit 204. In the example shown in Fig. 6, as in Fig. 3, the conversion matrix τ represents the conversion of the movement of the positive X-axis and the rotation of the inverse clock by about 15 degrees. Therefore, in Fig. 6, the DMD transfer data 321 converted by the inverse conversion matrix τ' causes the pattern of the DMD transfer data 32 to be rotated clockwise by about 5 degrees to move to the negative X-axis pattern of the X-axis. Here, when the selection unit 2〇6 of Fig. 2 selects the laser oscillator 103 as a light source, the laser beam is emitted from the laser oscillator 103. The laser light is irradiated onto the object to be processed 102 by designating the DMD transfer data 321 as the input pattern DMD1 〇6. In the present embodiment, the CCD camera 112 photographs 32 200916248 workpiece 102, and the adjustment unit 2G3 reads a human image from the CCD camera 112. The image read in as such is the live image 331 of Fig. 6. As shown in Fig. 6, the output image appearing in the live image 331 is offset by the deformation of the inverse conversion matrix T and the deformation of the conversion matrix τ, and is equal to the pattern illuminating the pattern 310. Further, the "output pattern on the live image 331 is equal to the illumination pattern 310". The original dish means "when the error of the difference between the mathematical mode of the equation (3) and the actual conversion is equal). In the following description, the term "equal" is used herein unless otherwise specified. The output pattern of the continuous image 331 is equal to the illumination pattern 310. The adjustment by the adjustment unit 203 refers to the irradiation of the laser light in a shape that is processed at a position to be processed, and the correct illumination is used as the live image 331. Shooting. In addition, comparing the DMD conversion data 32〇 and 321, it can be seen that the result of the conversion of the inverse conversion matrix T indicates that the white portion 15 in which the micromirror should be turned on is present in the DMD data 321, exceeding u<0, 64〇$u The possibility of a range of v<0 or 48〇$v. Therefore, in the present embodiment, the DMD 106 having a smaller number of pixels (e.g., 800 x 600 pixels) indicating the number of pixels of the image of the illumination pattern 310 (e.g., 64 600 x 84 〇 pixels) is used. At this time, as shown in FIG. 3 or FIG. 6 , the image indicating the DMD transfer resource 20 of the input pattern designated by the DMD 106 is surrounded by the edge of the black (that is, the unilluminated light) image indicating the illumination pattern 310. The image around. Here, the 'conversion matrix T' indicates the influence of the deformation or offset existing in the laser processing apparatus 1〇〇. Such deformation or offset is within the range allowed by the specifications of the laser processing apparatus 1A. Thus, the degree of deformation of the transformation matrix T 33 200916248 is not quite large. That is, there is no need for a considerable margin. It is also possible to estimate the amount of edges necessary for the experiment and to determine the number of tiny mirrors required for the DMD 106 based on the estimated edge. Next, the second embodiment and the third embodiment 5 will be described with reference to Figs. 7 to 11 . In the second embodiment and the third embodiment, the adjustment method of the irradiation of the laser light after the conversion parameter is adjusted, that is, the operation of the adjustment unit 2〇3 is different from that of the first embodiment. Since there are many adjustment methods for offsetting the conversion represented by the conversion parameters, it is appropriate to adopt an appropriate adjustment method depending on the embodiment. Fig. 7 is a view for explaining an example of conversion from an input pattern to an output pattern as a method for explaining the adjustment methods of the second embodiment and the third embodiment. The contents of Fig. 7 are similar to those of Fig. 3. For convenience of explanation, the manner in which the drawings are displayed differs between Fig. 3 and Fig. 7. Further, in the second embodiment and the third embodiment, as shown in Figs. 8 and 1510, the configuration of the control unit 113 is different from that of the second embodiment of the first embodiment. Figure, there is no difference from Figure 2. The image 300 of Fig. 7 is an image captured by the CCD camera 112 in a state where only the illumination light of the illumination light source 111 illuminates the workpiece 102 placed on the stage 101. In the example of Fig. 7, there are three linear 20-shaped circuit patterns on the workpiece 1〇2. When the image reading unit 201 reads the image 300 and outputs it to the display 115, the operator specifies the processing target range by the operation unit 114. The specified range is the dot rectangle of the image 300. The spatial modulation control unit 204 receives the designation from the operation unit 114, and generates an image 3H according to the 34 200916248 $疋. The image indicating the illumination pattern is white on the image, and the other is black. Corresponding to the illumination pattern 311, the input pattern specified by the DMD ship is omitted, and the image surrounded by only the image of the illumination pattern 3U can be displayed only by the image of the edge of the image. The spatial modulation U P204 also generates an input pattern corresponding to the image 6 of the illumination pattern. Right, according to the indication of the input pattern corresponding to the illumination pattern 311, the laser light modulated by the D MD 106 is irradiated to the object to be affixed, and the cCD camera 112 captures the workpiece 1 〇 2 to obtain a live image. In the first example of the first example, the range in which the image 332 actually illuminates the laser light is the range of the dot rectangle ’ is different from the range to be processed for the image 3GG. Comparing the image 300 with the live image 332, the position, direction, and opening y of the circuit pattern are the same. However, it can be seen that the laser light is irradiated with a pattern which is specified by the image and is different from the figure of the person in the view D(10). From the input pattern 15 to the output pattern, the conversion matrix T is used. In the third and seventh figures, the same "T" character is used, and the specific values of the elements of the conversion matrix τ are in FIG. 3 and 7 is different. In Fig. 7, for the sake of simplicity, the display conversion matrix T represents a rotation of about 3 degrees from the vicinity of the center of the live image 332. 20 In the above, the description will be made with reference to Fig. 7, and the second embodiment will be described with reference to Figs. 8 and 9. Fig. 8 is a functional block diagram showing the function of the control unit 113 of the second embodiment. In comparison with the second diagram showing the second embodiment, the eighth diagram has a reading unit 2〇1, a calculation unit 202, an adjustment unit 203, a spatial modulation control unit 35, a system unit 204, and a platform control unit 2 in the control unit n3. 5. The point of the selection unit 206 is the same as that of the second figure. The difference between Fig. 8 and Fig. 2 is the flow of data and/or control displayed by arrows. In other words, in the first embodiment and the second embodiment, since the adjustment method is different, the arrow that faces the adjustment unit 2G3 and the arrow that is emitted from the adjustment unit 2〇3 are different from the second and eighth figures. The meaning of the arrow of Fig. 8 is to be understood from the reference to Fig. 9'. Fig. 9 is a view showing the method of adjusting the second embodiment. The platform control unit 205 shown in Fig. 8 controls the operation of the stage 101, and the relative position of the optical system of the laser processing apparatus 1 to the stage 1〇1 changes. The type of operation of the tenth platform 101 can be different depending on the embodiment. In the second embodiment, the platform control unit 205 controls the operation of the following types of platforms 101. (a) Movement in the vertical direction (b) Parallel movement in a plane horizontal to the wrong axis (c) Rotation in a plane horizontal to the wrong axis 15 (d) Changing the top of the platform 1〇1 In the second embodiment, a drive motor and/or an actuator (not shown) that can perform these types of operations can be used in the platform ιοί. The platform control unit 205 controls the drive motor and/or the actuator to operate the stage 101. Further, in the second embodiment, the workpiece 102 is fixed to the stage 101 by a stopper 20 or the like as needed, and even if the stage 1〇1 is tilted by the operation of the above (d), the workpiece 102 is also processed. Do not slip. In such a configuration, the calculation unit 202 outputs the data calculated and stored in the conversion matrix T of the memory device to the adjustment unit 203. The adjustment unit 203 instructs the platform control unit 205 to control the operation of the platform 101 in accordance with the conversion matrix T. Platform Control 36 200916248 The system 205 operates the platform 1〇1 in accordance with the instruction from the adjustment unit 203. As a result of this control, the relative position of the optical system of the laser processing apparatus 100 and the workpiece 1〇2 also varies with the conversion matrix T. At this point of time, for convenience of explanation, the CCD camera 112 photographs the person who is added with the work 102. In this way, as shown in Fig. 9, an image 3 〇 1 which is specific to the image in which the shirt image 300 is deformed by the conversion matrix τ is taken. In Fig. 9, the deformation of the conversion matrix T can be visually recognized from the comparison with the circuit pattern on the workpiece 1〇2 reflected by the images 300 and 301. On the other hand, in the same manner as the one described in the seventh drawing, the image 10 is designated as the image 311. Then, the spatial modulation control unit 204 specifies an input pattern to the DMD 106 in accordance with the designated illumination pattern 311. Then, the selection unit 206 selects the laser oscillator 103 as a light source. As a result, the laser light irradiated from the laser oscillator 1〇3 is irradiated onto the workpiece 1〇2 by the influence of the shift or deformation indicated by the conversion matrix τ. In the second embodiment, as shown in the video 301, when the laser light is irradiated, the workpiece 1〇2 itself is also in a state corresponding to the operation of the conversion matrix T. . Thus, since both the irradiated light and the workpiece 102 are subjected to the same influence of the conversion matrix τ, the influence of the conversion matrix T is offset. That is, as a result of the adjustment, the laser light can be irradiated correctly in the designated area. This is shown below in Figure 9. In the state where the laser light is irradiated, the CCD camera 2 captures the live image 333 of the workpiece 1 2, and the range of the actual laser light is displayed as a halftone dot. Moreover, comparing the image 3 and the live image 333, the direction of the lines of the three circuit patterns or the portions of the image are different, 37 200916248 and the relative relationship between the lines of the three road graphics and the area of the dots is the same. That is, the laser beam is properly irradiated to the desired area. As apparent from the above description, in the second embodiment, the processing of step S107 of Fig. 5 can be omitted. 5, according to the conversion matrix T, the value of the control parameters required for the platform to operate can be determined experimentally, or can be calculated from the specifications of the laser processing device 1GG. For example, in the above operation (a), when the stage 1〇1 is moved 1 mm up or down along the vertical axis, the value of the magnification or reduction ratio of the image captured by the CCD camera 112 may be experimentally investigated in advance. The adjustment unit may also calculate the movement amount of the error in the straight direction according to the value of the pre-investigation from the condition of enlargement or reduction included in the conversion matrix T. The calculated movement amount is used as the control parameter of the platform 1〇1, and is rotated to the platform control. Part 205. Similarly to the above operations (b) to (d), the adjustment unit 203 can obtain the value of the control parameter. Further, as apparent from the above description, the adjustment method of the second embodiment is suitable for a case where the mechanical accuracy of the mechanism for moving the stage 101 is high. Next, an adjustment method of the third embodiment will be described with reference to Fig. 10 and Fig. 1 . In the third embodiment, the adjustment unit 2〇3 is adjusted by image processing. Fig. 10 is a block diagram showing the function of the function of the control unit 113 of the third embodiment. Compared with the second diagram showing the first embodiment, the tenth diagram has a read unit 201, a calculation unit 2〇2, an adjustment unit 2〇3, a spatial modulation control unit 204, a platform control unit 205, and a selection in the control 4113. The point of the part 2〇6 is the same as that of the second figure. In Fig. 10, the difference from Fig. 2 is the flow of data and/or control displayed by arrows. In other words, in the first embodiment and the third embodiment, since the adjustment method is different from 38 200916248, the arrow directed to the adjustment unit 203 and the arrow emitted from the adjustment unit 203 are different in the second and tenth views. Further, in Fig. 2, in order to designate an illumination pattern, an arrow indicating that the image read from the CCD camera 112 is output to the display 115 from the reading unit 201 to the display 5 115 is shown, and there is no arrow in the tenth figure. As described below, in the third embodiment, this is because the adjustment is made from the stage of designation of the illumination pattern. The meaning of the other arrows should also be understood from the adjustment method described below with reference to Figure 11. Fig. 11 is a view showing the method of adjusting the third embodiment. In Fig. 11, the image 302 is taken by the CCD camera 112, and the image read by the reading unit 201 is read from the CCD camera 112. The lines of the three circuit patterns identical to the images 300 of Figs. 7 and 10 are also reflected in the image 302. In the adjustment of the third embodiment, first, the calculation unit 202 outputs the data calculated and stored in the inverse conversion matrix Τ' of the memory device to the adjustment unit 20 15 3 . Then, the adjustment unit 203 performs image processing for deforming the image 302 by the inverse conversion matrix Τ' to generate the image 303, and outputs the image 303 to the display 115. Similarly to Fig. 7, in Fig. 11, the conversion matrix Τ indicates the rotation of the inverse clock by about 30 degrees. Thus, in the image 303, the lines of the three circuit patterns are compared with the image 302, and are tilted by about 30 degrees clockwise. 20 The operator views the image 303 displayed on the display 115, and the operation portion 114 specifies the area where the laser light is to be irradiated. In the image 304 of the il image, the designated area is displayed as a dot. The spatial modulation control unit 204 receives the designation from the operation unit 114, and generates an illumination pattern 312 in accordance with the designation. The illumination pattern 312 corresponds to the dot area of the image 304. 39 200916248 The spatial modulation control unit 204 proceeds to the illumination pattern 3i2 to generate an input pattern that is determined by the DMD 106. The space modulation control department outlines the input graphic. In addition, the selection section selects the laser vibration (4) as a light source. 5 (4) The H-light emitted from the incident oscillator 1G3 is irradiated onto the workpiece 102 by the influence of the offset or deformation indicated by the conversion matrix. However, depending on the inverse conversion matrix T and the illumination pattern 312 specified by the deformed image 3〇4, the laser beam is irradiated, and when the illumination is affected by the transformation matrix, the influence of the inverse transformation matrix T and the transformation matrix τ are The impact is offset. That is, as a result of the adjustment, the laser beam can be properly irradiated to the designated area. This is shown below in Section 11®. In the state where the laser light is irradiated, the CCD camera 112 photographs the image 334 of the workpiece 1 2, and the range of the actual laser light is actually displayed as a halftone dot. Moreover, comparing the image 3〇4 and the live image 334, the direction of the lines of the three circuit patterns is different from that of the image, and the relative relationship between the lines of the 3 15 circuit patterns and the area of the dots is the same. That is, the laser beam is properly irradiated to the designated area. In the above, regarding the second and third embodiments, the case where the transformation matrix τ shows a relatively simple deformation is described as an example, and the deformation of the transformation matrix 亦可 may include the complexity of parallel movement, rotation, shear strain, amplification, and reduction. Deformation. 20 Next, the fourth to sixth embodiments will be described. The fourth to sixth embodiments are different from the first embodiment in the mathematical mode of the conversion from the input pattern to the wheeled pattern. The operation of the control unit 113 is the same as that of the first embodiment except that the operation of the control unit 113 differs depending on the mathematical mode. Which mathematical mode is employed is the characteristic or degree of deformation or offset of the actual laser processing apparatus 100. In the fourth embodiment, a mathematical mode in which only parallel movement (displacement) and rotation are considered is employed. The calibration pattern of the fourth embodiment may be represented by two points a and b which are different from each other. For example, in the fourth embodiment, a pattern composed of two circles having different diameters may be used instead of the calibration pattern 34 of Fig. 4. Similarly to the first embodiment, the coordinates of the point a are represented by a column vector composed of (Xa, ya) T, and the coordinates of the point b are represented by a column vector composed of (Xb, yb) T, and the coordinates of the point a' are A column vector composed of (xa', ya') T indicates that the coordinates of point b are represented by a column vector composed of (Xb', yb') T. In the fourth embodiment, the calculation unit 2〇2 calculates the amount of parallel movement in the X direction from the four coordinates: di=xa'-xa (18) Parallel movement amount in the y direction: d2=ya'-ya ( 19) The amount of rotation: 0 = tan_1 {(yb'-ya') / (Xb, -xa,)}_ tan1 {(yb-ya)/(xb-xa)} (20) 3 conversion parameters. These conversion parameters can be expressed in the form of the conversion matrix T of the equation (2) as in the third embodiment. That is, =cos θ (21) bi=-sin Θ (22) a2= =sin θ (23) b2= =cos θ (24) and equation (2) can be substituted. In this way, the operation of the laser processing apparatus after the calculation unit 2〇2 calculates the conversion matrix is the same as that of the third embodiment. In the fifth embodiment, a mathematical 41 200916248 mode in which only parallel movement (displacement) is considered is employed. The calibration pattern of the fifth embodiment may be represented by only a defect. For example, in the fifth embodiment, the calibration pattern 340 of Fig. 4 can be replaced with a pattern composed of a circle. Similarly to the first embodiment, the coordinates of the point a are represented by five column vectors composed of (Xa, ^) T, and the coordinates of the point a are represented by column vectors composed of (xa, ya,) T. In the embodiment, the calculation unit 202 calculates the parallel movement in the x direction from the two coordinates, in the same manner as the third embodiment, in the equations (18) and (19): the parallel movement of the mountain and the y direction. The conversion parameters of the amount 4 are the same as in the first embodiment, and the shape of the transformation matrix τ of the equation (2) may be shown as 10. That is, ν type table 1 (25) Βι=0 (26) Α2=0 (27) Βι=1 (28) 15 and formula (2) can be substituted. In this way, the operation of the laser processing apparatus 100 after the calculation unit 202 calculates the conversion line τ is the same as that of the third embodiment. In the implementation of the sorrow of the younger brother, virtual affine transformation is used as the mathematical mode. In virtual affine transformation, trapezoidal deformation is also considered in addition to parallelogram deformation (shear strain) considered in affine transformation. In the sixth embodiment, a calibration pattern of four points a, b, c, and d which can be distinguished from each other is shown in Table 20. For example, in the sixth embodiment, the pattern formed by four circles having different diameters may be used instead of the calibration pattern 34 of Fig. 4. Similarly to the first embodiment, the coordinates of the point a are represented by a column vector composed of (xa, ya)T, and the coordinates of the point b are represented by a column vector composed of (Xb, yb) T, and the coordinates of the point 42 200916248 c Expressed by a column vector consisting of (Xe, ye)T, the coordinates of point a, the coordinates of 'point b' represented by the vector of (Xa''ya') T are composed of (Xb', yb')T The column vector represents 'point c, and the coordinates are represented by a column vector composed of (Xc, ye,) T. Similarly, the coordinates of the point d are represented by a column vector table * of (Xd, yd) T, and the square of the dot is indicated by a column vector composed of (Xd', yd') T. The virtual affine transformation is modeled by equation (29). ί x'=aix + bly + clxy + d1 \^'= a2x+b2y + c2xy + d2 (29) The transformation matrix T is defined as in equation (30). Γ
rfl 7^- ο 1 clc2l ο 61 62 ο ο αι α2 ο ο /._V (3 10 又’舁第1實施形態同樣地，使用點a、b、C、d及點a，、 b、c d之座彳示，可如式（31)及(32)般，定義矩陣p及q。Rfl 7^- ο 1 clc2l ο 61 62 ο ο αι α2 ο ο /._V (3 10 'In the same manner as in the first embodiment, points a, b, C, d and points a, b, cd are used. The block diagram shows that the matrices p and q can be defined as in equations (31) and (32).
Xa Xb Xd ya yb y〇 xaya xbyb xcy〇 xdyd .1111 P: (31)Xa Xb Xd ya yb y〇 xaya xbyb xcy〇 xdyd .1111 P: (31)
Xa V V V λ' yb' y〇 y/ xaya xbyb xcycXa V V V λ' yb' y〇 y/ xaya xbyb xcyc
Q (32) 在此’從式（29)，可以下述式（33)表示4點&、b、c、d 15 及4點a’、b’、c’、d’之關係。 TP=Q (33) 當適當選擇4點a、b、c、d之位置時，矩陣p為正規， 43 200916248 存在逆矩睁p-1，故可從式(33)得到式(34)。 T=Qpl (34) 是故’算出部202從式(34)算出轉換矩陣τ。又，算出 部2〇2從轉換矩陣T算出逆轉換矩陣丁，。 5 此外，如在第卜第6實施形態所說明，輸入圖形至輸出 圖形之轉換之數學模式有各種。在上述，說明了以校準圖 形表示算出所採用之數學模式之轉換參數最低限度所需之 個數之點之例。 然而，使用表示更多點之校準圖形亦無妨。舉例言之， 1〇與第1〜第3實施形態同樣地，數學模式係使仿射轉換作用 日守亦可使用表不m$4之可相互區別之m點之校準圖形。 此日守，關於ISiSm之各1 ’如式般設置，算出部以最小 二乘方法，算出式(2)之轉換矩陣丁之要件之恥、、、dl、^、 b2、d2之值亦可。 15 (xi,,yi,,l)T-T(xi3yi5l)T (35) 此外，在此，以一/係顯示圖形所表示之第i點之座標 之歹〗向量，（Xi’，yi )係表不第1點之輪出圖形之座標之列向 量。 2〇 接著’參照第12圖及第13圖，就第7實施形態作說明。 20根據第7實施形態，即使被加工物102之表面有㈣，校準 之精確度亦不致惡化。 〜般，於被加工物102之表面有立體之三維形狀、亦即 凹凸時，有校準之精碟度降低之情形。這是由於對應於校 準圖形之輸出圖形之形狀有因凹凸之影響或表面材料之反 44 200916248 射率等之影響而變形之可能性。 舉例言之’使用第4圖之校準圖形34〇時，偶有表示點a 之圓之輪廓橫穿過被加工物102上之凹凸部份之情形。此 時，在輸出圖形，表示點a之形狀變形。 5 因而’算出部202算出作為對應於點a之點a，之位置之座 標為該變形形狀之重心之座標，明顯地包含誤差。亦有誤 差之量為數像素之情形。此時，由於轉換矩陣τ依包含誤差 之座標算出，故校準之精確度降低。結果，難以以高精確 度調整。 10 舉例έ之，被加工物102為FPD基板或層積印刷基板等 呀，於被加工物102上形成三維形狀之電路圖形。電路圖形 成為使照射校準圖形時之形狀變形之障礙物。因而，有依 照射圖形之位置，校準之精確度降低之情形。 為避免此問題，以良好精確度進行校準，亦可於校準 15使用未形成電路圖形之基板或未形成電路圖形之基板外緣 部之空白區域。惟，詳細内容後述之，亦有要求使用實際 之被加工物102之加工對象之區域，進行校準之情形。根據 第7實施形態，此時，亦可防止校準之精確度降低。 第12圖係在第7實施形態中照射校準圖形時，拍攝之影 20像之例。第12圖之影像306係於為被加工物1〇2之基板4〇1上 照射校準圖形時，CCD照相機112所拍攝之影像。於影像3〇6 映照形成於基板401上之三維形狀電路圖形4〇2、構成對應 於校準圖形之輸出圖形之圓4〇3、404、405。在影像306， 由於圓403、404、405皆未與電路圖形402重疊，故形狀不 45 200916248 致大幅變形。 、「,皮加工物102之表φ ’若將相對凹凸小之平垣部份稱 =、景部」時，在基板401中，未形成有電路圖形術之 部份為背景部。藉控制部113進行控制，以使圖形照射至背 豕和即使被加工物1〇2之表面有凹凸，亦可防止 確度降低。 猜 第13圖係說明第7實施形態之控制部113之功能之功能 方塊圖。第13圖在追加了作成部2〇7之點與第2圖不同。作 成部207作成校準圖形，以避開凹凸，以使光照射至被加工 1〇物102之背景部。因此，在第7實施形態中，執行預備之校 準及預備之調整。以下，將在預備之校準中指定作為輸入 圖形之圖形稱為「預備校準圖形」。 以下，-面與第i實施形態比較，一面就第7實施形態 之雷射加工裝置100之動作作說明。 15 首先，作成部207選擇適當之3點K，作成可相互區別 點a〜c之形狀之預備校準圖形。在此，將點^之座標分別 以由(xa，ya)T、（xb，yb)T、（Xc，yc)T構成之列向量表*。然後， 執行使用此預備校準圖形之預備校準。 即，選擇部206選擇LED光源116作為光源、，作成部2〇7 2〇將預備校準圖形輸出至空間調變控制部204，空間調變控制 部204對DMD1〇6指定預備校準圖形作為輪人。藉此， 進行根據預備校準圖形之LED光之照射。 然後，CCD照相機112拍攝照射有LED光之被加工物 102，讀入部201讀入影像。 46 200916248 算出部202在對應於預備校準圖形，於影像上產生之輸 出圖形上，算出分別對應於點a、b、c之點a，、b，、c，之座 標。算出之座標分別以由（\、，)丁、（知，％，广、（〜，乂，)丁之 列向量表示。規定預備校準圖形之3點a、b、c之座標從作 成部207輸出至算出部2〇2。 在此’以在第1實施形態算出轉換矩陣T相同之方法， 异出部 202 依（xa,xb)T、（Xb，yb)T、（xc，yc)T 及（xa,,xb’)T、 (xb ’yb )、（xc’，yc’)T，算出轉換矩陣Τι。又，算出部202將 轉換矩陣乃輸出至作成部207。 作成部207异出轉換矩陣乃之逆轉換矩陣T]，=Ti-i。或 者，算出部202亦可算出逆轉換矩陣τ]，，將之輸出至作成 部 207。 以上之處理為預備之校準。在預備之校準中 ，如上述， 15 20 因被加工物102上之凹凸之影響，亦包含算出無法減之程 度之誤差之點a、b’、e，之座標、轉換矩陣I及逆轉換矩陣 1之以$ &於轉換矩陣T1亦並未與最終應取得之轉 換矩陣差距太大，故對用於預備之調整十分有效。 接著僅以照明用光源111照明，CCD照相機112即可 拍攝在未麟雷射HLED光之狀態之被加玉㈣2。讀入 .R0U人所拍攝之影像（以下稱為「背景檢则影像」）， 作成部207使用背景檢測用影像，進行背景檢測處理。 背厅丄測處理係在背景檢測用影像中，檢測映照被加 工物1〇2上一之背景部之區域(以下稱為「背景區域」）之處理。 舉例言之，作成部加對背景用影像加上模糊慮鏡，取 47 200916248 得消除了映照於背景檢測用影像之被加工物1〇2上之凹凸 (例如電路圖形）之影像的背景影像。然後，作成部2〇7依各 像素’算出背景檢測用影像之像素值與背景影像之像素值 之差分。 在者景區域’差分之絕對值小，而在被加工物1〇2上之 =凸之區域（以下稱為「非背景區域」），差分之絕對值則大。 疋故，作成部2074檢測差分之絕對值小於預先訂定之閾值 之區域作為背景區域。 10 15 20 要檢測背景區域，除了使用上述之方法外，亦可利用 邊檢測或特徵點選取等各種影像處理方法。 再者，作成部選擇所檢測之背景區域之適當之3點dl、 e卜Π。將3點(Π、el、打之座標分別以由（Xdi，ydi)T^ (χ^)Ύ 及Ofi，yfi)T構成之列向量表示。 +此外’在此，3點(Π、6、fl宜選擇背景區域中位於距 離非背景區域遠之位置之點。這是由於易作成光不照射至 被加工物102上之凹凸之校準圖形之故。 作成部2G7接著使用逆轉換矩陣Τι，，分別轉制、^、 fl之座標。將以已轉換之座標表示之3點稱為d、e、f。在第 1實施形態中’從調整部203以逆轉換矩陣T，轉換第6圖之 DMD轉达用貧料32〇 ’獲得dmd轉送用資料321之處理之 比，應可理解使用逆轉換矩陣Tl，，獲得3點d、e、f之座样 之處理為預備之調整。 A示 作成°P2〇7依以預備調整而得之3點d、e、f之座標 成可相互區別3點d、e、f之校準圖形，將之輸出至算出部 48 200916248 202。將3點d、e、f分別以由（Xd，yd)T、（Xe，ye)T、（Xf,yf)T構成 之列表示。圖形為表示該等3個座標之圖形。 此外’第7實施形態之校準圖形依檢測出之背景區域， 設定成實際照射光之範圍儘可能包含在背景部，亦即光儘 5 可能不照射至背景部以外。 舉例言之，如第4圖之校準圖形340般，以相互不同之 直徑之3個圓表示3點d、e、f時，當使用不必要大小之直徑 之圓時，有光照射至被加工物1〇2上之三維形狀之情形。 即’在拍攝該狀態之被加工物1〇2之影像時，有實際照 10射光之範圍與非背景區域重疊之情形。是故，當採用由相 互不同之直徑之3個圓構成之校準圖形，作成部207宜依背 景區域之形狀及位置 ，訂定3個圓之直徑。 餘用第4圖之校準圖形341或342或者其他種類之校準 ®形時’同樣地，作成部207作成校準圖形，以儘可能使實 15際照射光之範圍包含在背景部。 舉例言之，作成部207亦可作成顯示3點dl、el、Π之 暫定圖形，依暫定圖形，作成校準圖形。 舉例言之’作成部207作成暫定圖形’以使顯示照射光 之部份完全包含在背景區域内。又，暫定圖形以作成部 20 207，訂定形狀及位置，以使顯示照射光之部份距離非背景 座域之距離儘可能在閾值以上。 如上述，轉換矩陣Τι或逆轉換矩陣IV可能包含誤差， 但亦並非與最終應取得之轉換矩陣相差太大。是故，若閾 值之值適當，將以逆轉換矩陣TV轉換暫定圖形而得之圖形 49 200916248 是故，將以逆貫際上可期待僅對背景部照射光。 準圖形來使用為適當。=換暫定圖形而得之圖形作為校 田適§之閾值可以實驗求得。 又’亦有暫定圖形之报 此時，當以圓之重巧 未在校準圖形保持之情形。 之⑽声_十表不點dl時’在校準圖形，點d以非圓 之开>狀表不，亦有從出 情形。惟，若為以二出點d之座標產生障礙之 段之交點表娜，!^=點表刪^似條短線 10 15 20 即使暫定圖形之形狀未针^ W^fl之圖形’ 在权準圖形保持，亦無問題。 作成部207為儘可能僅於背景部昭射光， 而使用逆轉換矩陣T，， ’、、、耵尤 IU 依责不區域所屬之3點dl、el、fl， 作成以3點h嘴義之校«形。作餘準圖形後之處 理、亦即校準及調整與第1實施形態相同。 即，選擇部206選擇LED光源116作為光源，空間調變 控制部2G4依校準目形’㈣麵⑽，藉此，led光根據 校準圖形，照射至被加工物1〇2。然後，CCD照相機ιΐ2拍 攝照射LED光之被加工物102，讀入部2〇1讀入影像。 當照射如上述作成之校準圖形時，如第12圖所示，在 讀入之影像中，可期待照射光之部份包含在背景區域。即， 如上述作成之校準圖形可期待防止校準之精確度降低。 异出部202從於所讀入之影像上對應於校準圖形產生 之輸出圖形’算出分別對應於點d、e、f之3點d，、e，、f，之 座才示(Xd ,y<i )、（xe’，ye )、（xf,、yf，)T。進—步，算出部202 從點d、e、f之坐標及點d’、e’、f，之座標，與第丨實施形態 50 200916248 同樣地，算出轉換矩陣I及為其逆矩陣之逆轉換矩陣 丁2 -Τ 。藉轉換矩陣丁2及逆轉換矩陣几，之算出，校準結束。 之後，使用逆轉換矩陣’調整部203進行與第1實施 形態相同之調整。 5 而在上述第1〜第7實施形態，於校準使用與加工用雷射 光不同之LED光。其理由係因校準用之光之照射，不對被 加工物102造成影響之故。 因而’可使雷射光微弱至即使照射，被加工物1〇2亦不 致受影響之程度，只要雷射光為CCD照相機112可拍攝之波 1〇長之光’在其他實施形態，亦可將雷射光用於校準。此時， 在第1圖中’便不需要LED光源116及半反射鏡104。 然而’因雷射光或被加工物1〇2之性質，亦有無法於校 準使用雷射光或者不適合於校準使用雷射光之情形。 是故，對用於校準之光與用於加工之光為來自不同光 15源之不同光之影響加以考察，其實在上述第1〜第7實施形態 有不提及之前提，在該前提未成立時，便有更精密地進行 校準之餘裕。 該未提及之前提係在第1圖中’雷射光穿透半反射鏡 1〇4 ’入射至鏡子1〇5時之雷射光之光軸與LED光在半反射 20鏡104反射，入射至鏡子105時之LED光之光軸一致之假 設。或者，即使兩者未完全一致，僅為可忽略而無問題之 程度之偏移的假設。 然而，此未提及之假設並不一定於平常成立。是故， 在苐8實施形態中，當此假設未成立時’在第1圖中，因由 51 200916248 雷射振盪器103、半反射鏡104、鏡子i〇5、LED光源116構 成之光源光學系統，輸出圖形承受之變形亦為校準之對 象’而可使校準更精密化。 第Η圖係說明第8實施形態之控制部丨丨3之功能之功能 塊圖。第14圖在追加了第2算出部208之點與第2圖不同。第 2算出部208進行與LED光及雷射光之光軸之偏移相關之校 準。 在第8實施形態，採用如以下之數學模式。 .從在選擇LED光源U6作為光源之狀態之輸入圖形 10至輸出圖形之轉換為仿射轉換。 •此轉換以式(2)之轉換矩陣τ表示。 •在選擇LED統116料光源之狀,態下，對應於某輸 入圖形之第1輸出圖形與在選擇雷射振盪器1〇3作為光源之 狀態下，對應於相同輪入圖形之第2輸出圖形有偏移。此偏 15移亦以仿射轉換模式化。 •表示第1及第2輪出圖形之偏移之偏移參數以與轉換 矩陣T相同之形式之式(36)顯示之轉換矩朴表現令韌 輸出圖形以轉換矩陣R轉換成第2輸出圖形。 卜Μ •虽皆為進行任何調整時，在輸人圖形中，位於座 (x’y)之點於選擇雷射振心1_為光源時，在輸出 形，移至麵(0，，)、2個練之_ 52 20 200916248 ，x，、 X y =R y =RT ,1 1 , 依以上之數學模式，在苐8貫施形態中，進行取得轉換 矩陣T及逆轉換矩陣Τ’之第1校準、取得轉換矩陣R及逆轉換 矩陣R’zR·1之第2校準、使用逆轉換矩陣Τ，及逆轉換矩陣R， 5 之調整。 取得轉換矩陣T及逆轉換矩陣Τ’之第1校準與第1實施 形態完全相同。 取得轉換矩陣R及逆轉換矩陣R’=R-1之第2校準如以下 進行。首先，第2算出部208選擇適當之3點a、b、c，作成 10可相互區別3點a、b、c之校準圖形。此校準圖形亦可與第* 圖之例相同。以下，為將第2校準之校準圖形與第丨校準之 校準圖形區別，而稱為「測試圖形」。 3點a、b、c之座標別以由（Xa,Xb)T、（Xb，y(〇T、（Xe5ye)1_ 成之列向量表示。 15 第2算出部208將測試圖形輸出空間調變控制部2〇4。然 後，在將與加工對象之被加工物102相同之試樣載置於平台 101之狀態下，以空間調變控制部204控制DMD106，進行^ 據測試_^LED光之照射及輯光之照射。光源之切換 以選擇部206進行。此外，照射之順序為任意。 2〇 31擇部2〇6選擇哪光源叫作為光源' 對試樣昭射 LED光時，CCD照相機112拍攝試樣，讀人部肌讀入所拍 攝之影像。在對應於賴圖形，而於影像產生之輪出圖形， 將對應於點a、b、C之點稱為a，、b，、c，，將該等3如，、b，、 53 200916248 C’之座標分別以由（Xa，，Xb，)T、（Xb，，yb，)T、（Xc，,yc’)、成之列 向量表示。 又’選擇部206選擇雷射振盪器103作為光源，對雷射 光照射試樣時，CCD照相機112拍攝試樣，讀入部201讀入 5所拍攝之影像。在對應於測試圖形，而於影像產生之輸出 圖形，將對應於點a、b、c之點稱為a”、b”、c”，將該等3 點3”、b”、c”之座標分別以由（xa，，,xb，，)T、（Xb，，，yb，，)T、（xc，，,yc，，)T 構成之列向量表示。 以在第1實施形態中，算出部202從矩陣P及矩陣Q算出 10轉換矩陣T相同之方法，第2算出部208依式（37)，從3點a，、 b’、c’之座標及3點a”、b”、c”之座標算出轉換矩陣R。進— 步’第2算出部208從轉換矩陣R算出逆轉換矩陣R，。藉以 上’第2校準結束。 第8實施形態之調整係與第1實施形態同樣地，調整部 15 203轉換DMD轉換用資料，空間調變控制部204使用該經轉 換之DMD轉送用資料作為輸入圖形，控制DMD106來實現。 调整部203在第1貫施形態，進行使用逆轉換矩陣τ，之 轉換，在第8實施形態，進行使用為逆轉換矩陣丁，與逆轉換 矩陣R，之積之矩陣(T，R，)之轉換。藉此轉換，對所期之部份 20 正確地照射雷射光而加工可如以下進行而了解。 與第1實施形態同樣地，從操作部114以操作員指定之 照射圖形中，座標(xpl，ypl)τ之點p包含在應照射光之部份。 调整部203之s周整之結果’在空間調變控制部2〇4對dmd 106 指示之輸入圖形中，點ρ移至以式（38)表示之座標(Xp2 y 2)τ。 54 200916248 (xp2，yp2，l)T=R，(Xpl,ypl,l)T (38) 在此，選擇雷射振盡器103作為光源時，令對應於輸入 圖形之座標（Xp2,yp2)T之輸出圖形上之點之座標為㈧糾 τ。如此一來，可從式(37)及式(38)導出式(39)。 5 (Χρ3，Υρ3，1)Q (32) Here, from the equation (29), the relationship between four points &, b, c, d 15 and four points a', b', c', and d' can be expressed by the following equation (33). TP=Q (33) When the positions of the four points a, b, c, and d are appropriately selected, the matrix p is normal, and 43 200916248 has the inverse moment 睁p-1, so the equation (34) can be obtained from the equation (33). T = Qpl (34) Therefore, the calculation unit 202 calculates the conversion matrix τ from the equation (34). Further, the calculation unit 2〇2 calculates the inverse conversion matrix D from the conversion matrix T. Further, as explained in the sixth embodiment, there are various mathematical modes for converting the input pattern to the output pattern. In the above, an example in which the number of the minimum required conversion parameters of the mathematical mode to be used is calculated in the calibration pattern is described. However, it is fine to use a calibration pattern that indicates more points. For example, in the same manner as in the first to third embodiments, the mathematical mode is such that the affine conversion action can also use a calibration pattern of m points which are different from each other and which are different from each other. This day, the ISiSm 1' is set as in the formula, and the calculation unit calculates the shame, dl, ^, b2, d2 values of the conversion matrix of the equation (2) by the least square method. . 15 (xi,, yi,, l) TT(xi3yi5l)T (35) In addition, here, the 歹 向量 vector of the coordinates of the i-th point represented by the one-line display, (Xi', yi) is a table The vector of the coordinates of the graph is not rounded out of the first point. 2〇 Next, the seventh embodiment will be described with reference to FIGS. 12 and 13. According to the seventh embodiment, even if the surface of the workpiece 102 has (4), the accuracy of the calibration is not deteriorated. In the case where the surface of the workpiece 102 has a three-dimensional shape, that is, a concave-convex shape, the degree of calibration of the finished disc is lowered. This is because the shape of the output pattern corresponding to the calibration pattern is likely to be deformed by the influence of the unevenness or the influence of the surface material. For example, when the calibration pattern 34 of Fig. 4 is used, there is occasionally a case where the outline of the circle indicating the point a traverses the uneven portion on the workpiece 102. At this time, in the output graph, the shape of the point a is deformed. 5 Therefore, the calculation unit 202 calculates the coordinates of the position of the position corresponding to the point a corresponding to the point a, which is the coordinate of the center of gravity of the deformed shape, and obviously includes an error. There are also cases where the amount of error is a few pixels. At this time, since the conversion matrix τ is calculated based on the coordinates including the error, the accuracy of the calibration is lowered. As a result, it is difficult to adjust with high precision. For example, the workpiece 102 is an FPD substrate, a laminated printed substrate, or the like, and a three-dimensional circuit pattern is formed on the workpiece 102. The circuit pattern is an obstacle that deforms the shape when the calibration pattern is illuminated. Therefore, there is a case where the accuracy of the calibration is lowered depending on the position of the illumination pattern. To avoid this problem, calibration with good accuracy can also be used to calibrate 15 the blank area of the substrate without the circuit pattern or the outer edge of the substrate where the circuit pattern is not formed. However, as will be described later in detail, it is also required to perform calibration using the region of the object to be processed of the actual workpiece 102. According to the seventh embodiment, at this time, the accuracy of the calibration can be prevented from being lowered. Fig. 12 is a view showing an example of a captured image 20 when the calibration pattern is irradiated in the seventh embodiment. The image 306 of Fig. 12 is an image taken by the CCD camera 112 when the calibration pattern is applied to the substrate 4〇1 of the workpiece 1〇2. The three-dimensional shape circuit pattern 4〇2 formed on the substrate 401 is formed on the image 3〇6, and the circles 4〇3, 404, and 405 corresponding to the output pattern of the calibration pattern are formed. In the image 306, since none of the circles 403, 404, and 405 overlaps the circuit pattern 402, the shape is not greatly deformed. When the surface φ of the skin processed material 102 is referred to as a "view portion" with respect to a flat portion having a small unevenness, a portion where the circuit pattern is not formed in the substrate 401 is a background portion. The control unit 113 controls the image so that the pattern is irradiated to the back surface and even if the surface of the workpiece 1 2 has irregularities, the degree of deterioration can be prevented. Fig. 13 is a block diagram showing the function of the function of the control unit 113 of the seventh embodiment. Fig. 13 is different from Fig. 2 in that the creation unit 2〇7 is added. The forming portion 207 creates a calibration pattern to avoid the unevenness so that the light is irradiated onto the background portion of the workpiece 102 to be processed. Therefore, in the seventh embodiment, the preparatory calibration and the preparatory adjustment are performed. Hereinafter, a graphic designated as an input pattern in the preliminary calibration is referred to as a "pre-calibration pattern". Hereinafter, the operation of the laser processing apparatus 100 according to the seventh embodiment will be described in comparison with the first embodiment. First, the preparation unit 207 selects an appropriate three points K to create a preliminary calibration pattern which can distinguish the shapes of the points a to c. Here, the coordinates of the point ^ are respectively a column vector table * composed of (xa, ya)T, (xb, yb)T, and (Xc, yc)T. Then, perform a preliminary calibration using this preliminary calibration pattern. That is, the selection unit 206 selects the LED light source 116 as the light source, and the preparation unit 2〇7 2〇 outputs the preliminary calibration pattern to the spatial modulation control unit 204, and the spatial modulation control unit 204 specifies the preliminary calibration pattern as the wheel person for the DMD1〇6. . Thereby, the illumination of the LED light according to the preliminary calibration pattern is performed. Then, the CCD camera 112 captures the workpiece 102 irradiated with the LED light, and the reading unit 201 reads the image. 46 200916248 The calculation unit 202 calculates the coordinates of the points a, b, and c corresponding to the points a, b, and c, respectively, on the output pattern generated on the image corresponding to the preliminary calibration pattern. The coordinates calculated are represented by a vector of (\,,), (known, %, wide, (~, 乂,), and the coordinates of the three points a, b, and c of the preliminary calibration pattern are specified from the preparation unit 207. It is output to the calculation unit 2〇2. Here, in the method of calculating the conversion matrix T in the first embodiment, the dissimilar unit 202 depends on (xa, xb)T, (Xb, yb)T, and (xc, yc)T. And (xa, xb')T, (xb 'yb), (xc', yc')T, and the conversion matrix is calculated. Further, the calculation unit 202 outputs the conversion matrix to the creation unit 207. The creation unit 207 is different. The conversion matrix is the inverse transformation matrix T], = Ti-i. Alternatively, the calculation unit 202 may calculate the inverse transformation matrix τ] and output it to the preparation unit 207. The above processing is a preliminary calibration. In the above, as a result of the unevenness on the workpiece 102, the points a, b', and e, which are the errors that cannot be reduced, include the coordinates, the transformation matrix I, and the inverse transformation matrix 1 of $ & The conversion matrix T1 is not too different from the conversion matrix that should be obtained in the end, so it is very effective for the adjustment used for preparation. When the light source 111 is used for illumination, the CCD camera 112 can capture the image of the unmanned laser HLED light, and the image captured by the R0U person (hereinafter referred to as "background check image") is created. 207. The background detection processing is performed using the background detection image. The background detection processing detects the area of the background portion (hereinafter referred to as "background area") that reflects the upper surface of the workpiece 1〇2 in the background detection image. For example, the creation part plus the background image plus the blur lens, take 47 200916248 to eliminate the background of the image of the irregularities (such as circuit graphics) on the object 1 〇 2 of the image for background detection. Then, the processing unit 2〇7 calculates the difference between the pixel value of the background detection image and the pixel value of the background image for each pixel. The absolute value of the difference in the scene area is small, and is on the workpiece 1〇2. The area of the convexity (hereinafter referred to as the "non-background area") has a large absolute value of the difference. Therefore, the creation unit 2074 detects that the absolute value of the difference is smaller than the predetermined threshold value as the background area. In order to detect the background area, in addition to the above method, various image processing methods such as edge detection or feature point selection may be used. Further, the preparation unit selects the appropriate three points dl and e Π of the detected background area. 3 points (Π, el, and hit coordinates are represented by column vectors consisting of (Xdi, ydi) T^ (χ^)Ύ and Ofi, yfi) T. + In addition, here, 3 points (Π, 6, It is preferable to select a point in the background region which is located far from the non-background region, which is because the calibration pattern which is easy to be made to shine without being irradiated onto the unevenness on the workpiece 102. The creating unit 2G7 then uses the inverse conversion matrix Τι to convert the coordinates of the ^, fl, respectively. The three points represented by the converted coordinates are called d, e, and f. In the first embodiment, the ratio of the process of obtaining the dmd transfer data 321 by the inverse conversion matrix T from the adjustment unit 203 to the DMD transfer poor material 32〇' in Fig. 6 is understood to be the use of the inverse conversion matrix T1. , the process of obtaining the seat of the three points d, e, and f is a preliminary adjustment. A is shown in Fig. 2, and the coordinates of the three points d, e, and f which are prepared by the preliminary adjustment are marked as a calibration pattern which can distinguish three points d, e, and f from each other, and is output to the calculation unit 48 200916248 202. The three points d, e, and f are represented by columns consisting of (Xd, yd)T, (Xe, ye)T, and (Xf, yf)T, respectively. The graphic is a graphic representing the three coordinates. Further, the calibration pattern of the seventh embodiment is set such that the range of the actual illumination light is included in the background portion as much as possible, that is, the light may not be irradiated to the background portion as much as possible. For example, as shown in the calibration pattern 340 of FIG. 4, when three points d, e, and f are represented by three circles having mutually different diameters, when a circle having an unnecessary diameter is used, light is irradiated to be processed. The case of the three-dimensional shape on the object 1〇2. That is, when the image of the workpiece 1 〇 2 in this state is captured, there is a case where the range of the actual illuminating light overlaps with the non-background area. Therefore, when a calibration pattern composed of three circles having mutually different diameters is used, the forming portion 207 should define the diameter of three circles in accordance with the shape and position of the background region. When the calibration pattern 341 or 342 of Fig. 4 or another type of calibration pattern is used, the preparation unit 207 creates a calibration pattern so that the range of the actual illumination light is included in the background portion as much as possible. For example, the creating unit 207 can also create a tentative pattern for displaying three points dl, el, and ,, and create a calibration pattern according to the tentative pattern. For example, the creating portion 207 creates a tentative pattern 'so that the portion displaying the illumination light is completely contained in the background area. Further, the provisional pattern is formed in the portion 20 207 to define the shape and position such that the distance of the portion of the illumination light from the non-background area is as high as possible above the threshold. As mentioned above, the conversion matrix Τι or the inverse transformation matrix IV may contain errors, but it is not too different from the conversion matrix that should ultimately be obtained. Therefore, if the value of the threshold is appropriate, the pattern obtained by converting the tentative pattern by the inverse conversion matrix TV is used. Therefore, it is expected that only the background portion can be irradiated with light in the reverse direction. The quasi-graphics are used as appropriate. = The graph obtained by changing the tentative pattern can be experimentally obtained as the threshold of the school's §. Also, there is a tentative graphic report. At this time, when the weight of the circle is not maintained in the calibration pattern. The (10) sound _ ten table does not point dl when 'in the calibration pattern, the point d is not open, the shape is not, there is also a situation. However, if it is the intersection point of the section that produces the obstacle with the coordinates of the second point d, !^=point table deletes the short line 10 15 20 even if the shape of the tentative figure is not pinned ^W^fl's figure' The graphics are maintained and there is no problem. The composition unit 207 uses the inverse conversion matrix T as much as possible, and uses the inverse conversion matrix T, and the three points dl, el, and fl that the IU IU does not belong to, and the three points are created. "shape. The post-processing, that is, the calibration and adjustment are the same as in the first embodiment. In other words, the selection unit 206 selects the LED light source 116 as the light source, and the spatial modulation control unit 2G4 aligns the target (4) plane (10), whereby the led light is irradiated to the workpiece 1〇2 according to the calibration pattern. Then, the CCD camera ΐ2 photographs the workpiece 102 that illuminates the LED light, and the reading unit 2〇1 reads the image. When the calibration pattern prepared as described above is irradiated, as shown in Fig. 12, in the read image, it is expected that the portion of the illumination light is included in the background region. That is, the calibration pattern created as described above can be expected to prevent the accuracy of the calibration from being lowered. The different output unit 202 calculates the three points d, e, and f corresponding to the points d, e, and f from the output pattern generated on the read image corresponding to the calibration pattern (Xd, y<;i ), (xe', ye ), (xf, yf,) T. Further, the calculation unit 202 calculates the transformation matrix I and the inverse of its inverse matrix in the same manner as the second embodiment 50 200916248 from the coordinates of the points d, e, and f and the coordinates of the points d', e', and f. Conversion matrix D2 - Τ. By the conversion matrix D2 and the inverse transformation matrix, the calibration is completed. Thereafter, the same adjustment as in the first embodiment is performed using the inverse conversion matrix 'adjustment unit 203. In the above-described first to seventh embodiments, the LED light different from the processing laser light is used for calibration. The reason for this is that the irradiation of the light for calibration does not affect the workpiece 102. Therefore, 'the laser light can be made weak to the extent that the workpiece 1〇2 is not affected even if it is irradiated, as long as the laser light is a light that can be captured by the CCD camera 112. In other embodiments, the lightning can also be used. The light is used for calibration. At this time, in the first drawing, the LED light source 116 and the half mirror 104 are not required. However, due to the nature of the laser or the object being processed, there is also a situation in which it is impossible to calibrate the use of laser light or to calibrate the use of laser light. Therefore, the influence of the light used for calibration and the light used for processing on the different lights from different sources of light 15 is examined. In fact, the first to seventh embodiments are not mentioned before, and the premise is not When it was established, there was a margin for more precise calibration. It is not mentioned that the optical axis of the laser light and the LED light are reflected by the half-reflection 20 mirror 104 when the 'laser light penetrating half mirror 1〇4' is incident on the mirror 1〇5 in FIG. The assumption that the optical axis of the LED light is the same at the mirror 105. Or, even if the two are not completely consistent, it is only an assumption that the degree of deviation can be ignored without problems. However, the assumptions not mentioned here are not necessarily established. Therefore, in the 苐8 embodiment, when this assumption is not satisfied, 'in the first figure, the light source optical system composed of the 51 200916248 laser oscillator 103, the half mirror 104, the mirror i〇5, and the LED light source 116 The deformation of the output graphic is also the object of calibration' and the calibration can be more refined. The figure is a functional block diagram illustrating the function of the control unit 第3 of the eighth embodiment. The fourteenth figure differs from the second figure in that the second calculation unit 208 is added. The second calculating unit 208 performs calibration relating to the shift of the optical axes of the LED light and the laser light. In the eighth embodiment, the following mathematical mode is employed. The conversion from the input pattern 10 to the output pattern in the state in which the LED light source U6 is selected as the light source is converted into affine transformation. • This conversion is represented by the transformation matrix τ of equation (2). • In the state in which the LED system 116 light source is selected, the first output pattern corresponding to an input pattern and the second output corresponding to the same wheeled pattern in the state in which the laser oscillator 1〇3 is selected as the light source are selected. The graphic has an offset. This partial shift is also modeled by affine transformation. • The offset parameter indicating the offset of the first and second rounds of the pattern is converted to the second output pattern by the conversion matrix R by the conversion matrix representation of the equation (36) in the same form as the conversion matrix T. . Μ Μ • Although all adjustments are made, in the input graph, the point at the seat (x'y) is selected when the laser center 1_ is the light source, and the output shape is moved to the face (0,,). 2 practice _ 52 20 200916248 , x,, X y = R y = RT , 1 1 , according to the above mathematical mode, in the 苐8 implementation form, the transformation matrix T and the inverse transformation matrix Τ' The first calibration acquires the second calibration of the transformation matrix R and the inverse transformation matrix R'zR·1, the inverse transformation matrix Τ, and the inverse transformation matrix R, 5 are adjusted. The first calibration for obtaining the conversion matrix T and the inverse transformation matrix Τ' is completely the same as that of the first embodiment. The second calibration for obtaining the conversion matrix R and the inverse conversion matrix R' = R-1 is performed as follows. First, the second calculating unit 208 selects the appropriate three points a, b, and c, and creates a calibration pattern in which three points a, b, and c can be distinguished from each other. This calibration pattern can also be the same as the example in the figure *. Hereinafter, in order to distinguish the calibration pattern of the second calibration from the calibration pattern of the second calibration, it is called "test pattern". The coordinates of the three points a, b, and c are represented by (Xa, Xb)T, (Xb, y(〇T, (Xe5ye)1_). The second calculation unit 208 modulates the test pattern output space. The control unit 2〇4. Then, the sample similar to the workpiece 102 to be processed is placed on the stage 101, and the spatial modulation control unit 204 controls the DMD 106 to perform the test. Irradiation and illumination of the light. The switching of the light source is performed by the selection unit 206. The order of the illumination is arbitrary. 2〇31Selection 2〇6Select which light source is called the light source' When the sample is illuminated by the LED light, the CCD camera 112. Take a sample and read the image taken by the human body. In the image corresponding to the Lai pattern, the image corresponding to the points a, b, and C is called a, b, c. , such as 3, , b,, 53 200916248 C' coordinates are respectively composed of (Xa,,Xb,)T, (Xb,,yb,)T, (Xc,,yc') Further, the 'selection unit 206 selects the laser oscillator 103 as a light source, and when the laser beam is irradiated to the sample, the CCD camera 112 takes a sample, and the reading unit 201 reads 5 shots. The image corresponding to the test pattern, and the output image of the image, the points corresponding to points a, b, and c are called a", b", c", and the 3 points 3", b" The coordinates of "c" are represented by column vectors consisting of (xa,,, xb,,) T, (Xb,,, yb,,) T, (xc,,, yc,,) T, respectively. In the embodiment, the calculation unit 202 calculates the same method of converting the transformation matrix T from the matrix P and the matrix Q, and the second calculation unit 208 derives coordinates from the three points a, b, and c' and three points a according to the equation (37). The coordinates of ", b", and c" are used to calculate the transformation matrix R. The second calculation unit 208 calculates the inverse transformation matrix R from the transformation matrix R. The second calibration is completed. The adjustment of the eighth embodiment is In the first embodiment, the adjustment unit 15 203 converts the DMD conversion data, and the spatial modulation control unit 204 uses the converted DMD transfer data as an input pattern to control the DMD 106. The adjustment unit 203 is in the first embodiment. The conversion using the inverse transformation matrix τ is performed, and in the eighth embodiment, the product used as the inverse transformation matrix D and the inverse transformation matrix R is used. The conversion of the matrix (T, R,), by which the laser beam is correctly irradiated to the desired portion 20, can be processed as follows. As in the first embodiment, the operator is operated from the operation unit 114. In the designated illumination pattern, the point p of the coordinate (xpl, ypl) τ is included in the portion to be irradiated with light. The result of the s circumference of the adjustment unit 203 is the input of the indication to the dmd 106 in the spatial modulation control unit 2〇4. In the graph, the point ρ is moved to the coordinate (Xp2 y 2) τ represented by the equation (38). 54 200916248 (xp2, yp2, l) T = R, (Xpl, ypl, l) T (38) Here, when the laser oscillating device 103 is selected as the light source, the coordinates corresponding to the input pattern (Xp2, yp2) are made. The coordinates of the point on the output graph of T are (8) Correction τ. In this way, the equation (39) can be derived from the equations (37) and (38). 5 (Χρ3,Υρ3,1)
=RT(xP2，yp2,i)T=RT(xP2,yp2,i)T
=RTT’R’ (Xpl,ypl，i)T =(xPi，yP!，i)T (39) 即’調整部203所作之調整之結果，應照射雷射光時， 在照射圖形指定之座標與顯示實際照射雷射光之位置之輸 出圖形上之座標-致，雷射光正確地照射至所期之位置。 接著，就第9實施形態作說明ι9實施形態係將本發 明應用於使用空間調變元件之投影機之例。以DMD等空間 調變元件將投影用光源之光空間調變，將文字、記號、圖 I5晝、影像專才又影至牆壁或螢幕之投影機（照明光學系統）中， 調整光之投影可適用本發明。 因存在於光學系統或螢幕之偏移或變形之影響，光未 以所指定之开^狀投影至所指定之位置，而在投影之影像， 產生移動、旋轉、放大、縮小、變形等。是故，在第9實施 2〇形態中，上述投影機具有拍攝螢幕之拍攝部、控制部。拍 攝部為CCD照相機。控制部具有與第2圖之讀入部2〇1、算 出部202、調整部203、空間調變控制部204相同之功能。 根據此種結構之投影器，與上述各實施形態同樣地， 可進行進行校準，依校準之結果調整之投影。此外，由於 55 200916248 弟9實把形態係以投影機為對象，在上述使用「投影」一詞， 而在本說明書中，第9實施形態之「投影」係與第丨〜第8實 施形態之「照射」相同之意思。 此外，本發明不限於上述實施形態，各進行各種變形。 5 以下說明數個例子。 雷射加工裝置100之物理結構不限於第丨圖例示者。舉 例言之，亦可使用利用液晶之穿透型空間調變元件取代反 射型空間調變元件之DMD106。即，只要為要調整而照射之 第1光與用以取得調整必須之資料之第2光皆以空間調變元 10件空間調變，照射至被加工物102上，可拍攝被加工物1〇2 之結構，雷射加工裝置100之具體結構依實施形態而異即 可。又’第1光及第2光可不同，亦可相同。 又，在第2圖所示之各部中，僅空間調變控制部204、 平台控制部205、選擇部206封裝於第1圖之雷射加工裝置 15 之控制部U3内，第2圖之讀入部201、算出部202、調整 部203亦可以雷射加工裝置1 〇〇之外部之電腦實現。 調整方法亦不限於上述例示。舉例言之，在第2實施形 態中，依來自調整部203之指示，平台控制部2〇5進行使平 台ιοί動作之調整。在另一實施形態，藉改變DMD1〇6之位 20 置或角度而非平台101，進行調整亦可。 即，於DMD106安裝用於改變角度或位置之致動器，採 用將第2圖之結構變形成空間調變控制部2〇4除了進行輪入 圖形之指定外，亦進行致動器之控制之結構。此時，調整 部203亦可依逆轉換矩陣T，，對空間調變控制部2〇4指示， 56 200916248 以使DMD106動作，進行調整。藉DMD1〇6之動作，雷射光 之位置平行移動（位移），或以某點為中心旋轉移動，照射之 區域大小或形狀改變。 上述所示之複數貫施形態，只要不相互矛盾，可任意 組合。舉例言之，可如以下，組合3個以上之實施形態。 .在作成避免被加工物1〇2上之凹凸之校準圖形之第7 實施形態中， .追加與雷射紋LED之光軸之偏移皆為校準之對象 之第8實施形態類似之第2算出部， .採用第6實施形態之仿射轉換作為數學模式， •在該數學模式下，叫第8實施㈣類似之方法，第 2算出部以考慮雷射缺咖光之料之偏移之 轉換矩陣R及逆轉換矩陣R，， 15 20 •缝邵观與第3實施形態同樣地，使用以指定照射 圖形之影像變形，進行婦，轉驢對”調變控制部 2〇4提供之DMD轉送用資料。 又，進行校準之時間依實施形態而不同。因此，在上 2貫施形態之說”，除了進行校準後，進行調整之順 序外，未特別提到校準之時間。 以第1實施形態之例來說明’首次使用雷射加工裝置 _寸，僅進m次校準，之後，之後，平常依相同之逆轉 、矩陣τ，’調整雷射光之照射亦可义者，為因應雷射加 工裝置10G之經時變化，㈣期進行校準亦可。 又，亦可對1個被加工物102進行1次校準。當缺以雷射 57 200916248 加工袭置100將1個被加工物102之複數處加工時，對加工之 各對象處進行校準亦可。 舉例言之，當被加工物102為大型FPD基板，平台101 為使用氣動腳輪之浮式平台時，有被加工物102彎曲之情 5 形。此時，因彎曲之影響，隨著加工之對象處在FPD基板 上之哪個位置，被加工物102與雷射加工裝置100之光學系 統(物鏡110)之距離不同。 被加工物102與光學系統之距離之變動為些微，依距離 之變動，藉由DMD106照射之光之放大率或偏移之大小改 10變。是故，要求亦考慮此種些微變動之影響之高精確度調 整時’亦可對加工之各對象處進行校準。 又’照射校準圖形之被加工物102上之區域與照射因加 工而調整之照射圖形之被加工物1〇2上之區域之關係亦依 實施形態有各種情形。 15 以被加工物1〇2為基板之情形為例來說明。首先，僅1 次或定期進行校準時，宜使用與加工對象之基板相同種之 任何基板，進行校準。 對1片基板進行1次校準時，若基板之端部有邊緣，亦 可將該邊緣用於校準。即，控制部113亦可控制雷射加工裝 置100 ’以使平台10〗移動至對邊緣照射LED光之位置後， 進行杈準，之後，進行依校準之結果調整之雷射光之照射。 或者，對1片基板進行1次或複數次校準時，控制部亦 可控制雷射加工裝置100,使平台1〇1移動至對加工之對象 處照射雷射光之位置後，進行校準。此時，為不致使被加 58 200916248 工物102因校準受到影響，宜於校準使用與加工用雷射光 不同之LED光或減弱輸出之雷射光。 除了上述之外，本發明可變形成各種例子來實施。舉 例言之，第5圖之流程圖所示之處理之程序可變更成多種例 5 子。 舉例言之，步驟S102之處理、步驟si〇3〜步驟S105之處 理可獨立地同步進行。是故，進行步驟S102之處理，可同 時執行步驟S103〜步驟S105之處理，亦可以步驟sl〇3、 S104、S105、S102之順序執行處理。 又，在複數次校準中，亦可使用相同之丨個校準圖形。 此時，算出部202在第1次之校準之步驟81〇1，作成校準圖 形時，亦可將該校準圖形儲存於記憶裝置。在第2次之後之 校準之步驟S1(M，算出部202亦可從記憶裝置，讀取校準圖 形。 15 X，校準®形係依預先訂定之3‘如、b、e之座標作成 者。因而，亦可不在步驟S102重新取得3點a、b、C2座標， 而可賓略步驟S102。即，算出部2〇2作成校準圖形時，亦配 合3點a、b、c之座標，緒存於記憶裝置，在步驟讓從 記憶裝置讀取3點之座標。 20 x，如第2實施形態般，在調整未利用逆轉換矩陣T， 之實施形態中，不需要最後之步驟Si〇7。 以上，就各種實施形態作了說明，概觀上述實施形態 共通之效果’如以下。 使用面贈6等之空間調變元件，根據任何之校準圖 59 200916248 形，可將光照射至被加工物102上。即，以1個校準圖形表 示複數點之位置，可一次有效地進行校準。 又，不需因校準，反覆進行光學系統或平台101之機械 移動及光之照射。是故，可排除用以使光學系統之物理配 5 置機械性移動之致動器之動作所包含之誤差之影響，進行 校準。 由於校準圖形之形狀為任意，故易依用於校準之被加 工物102之性質，取得適當形狀之校準圖形。在此，「被加 工物102之性質」係三維形狀或材質等各種性質。又，為取 10 得適當形狀之校準圖形，可從預先作成之複數個校準圖形 中選擇適當之校準圖形，亦可當場作成適當之校準圖形。 舉例言之，如第7實施形態所說明，於要根據校準某圖 形，照射光之被加工物102上之區域有使校準圖形之形狀變 形之立體結構物時，不使用該校準圖形較佳。此時，宜使 15 用避開結構物，照射光之其他校準圖形。 如第7實施形態般，即使事先未給予任何資訊，作成部 207亦可當場依CCD照相機112所拍攝之影像，作成適當形 狀之校準圖形，以避開被加工物102上之立體結構物。 又，亦可將第7實施形態變形成僅於必要時，進行預備 20 之校準，而非平常進行預備之校準。舉例言之，亦可在執 行校準中，算出部202檢測視為因被加工物102表面上之凹 凸引起之輸出圖形之變形，僅於檢測出變形時，依第7實施 形態，設定校準圖形。 或者，在第7實施形態以外之實施形態，算出部202亦 60 200916248 可事先取得被加工物102之設計資料等資訊，從設計資料選 取背景部之範圍，生成對背景部照射光之圖形。不論為何 者，由於校準圖形為任意，故作成部207或算出部207亦易 找出適當之校準圖形。 5 又，當從光反射率不同之複數物質作成被加工物1〇2 時’亦可取得適當之校準圖形，加以利用，以避開在該等 複數物質中使用光反射率低之物質之區域，來照射光。如 第7實施般’以影像為基礎或以設計資料為基礎時，易取得 適當之校準圖形。 10 如此’使用有降低校準之精確度之可能性之被加工物 102 ’進行校準時，易取得對應被加工物102之性質之適當 才父準圖形，加以利用，故可謀求校準之精確度之提高。 又’在記載於專利文獻1〜3之習知技術中，有限定校準 之對象’不考慮旋轉、變形或標度轉換之情形。而在本發 15明之上述實施形態中，可依要求之校準之精確度、校準之 對象之裝置(例如雷射加工裝置100)之特性，根據適當選擇 之數學模式，進行校準。 這是由於校準圖形為任意，故可採用較習知多之數學 模式之故。因而，當採用更精密之數學模式時，可考慮各 20種要素，進行精確度更高之調整。 此外，校準用數學模式亦可為上述例示之外者。舉例 吕之’亦可採用承受到因區域而異之變形之數學模式。即， 將CCD照相機112所拍攝之影像分割成複數個區域，對各區 域’算出部2〇2算出轉換矩陣τ及逆轉換矩陣τ，，調整部2〇3 61 200916248 依各區域不同之逆轉換矩陣τ’，進行調整。 I：圖式簡單說明3 第1圖係顯示第1實施形態之雷射加工裝置結構之模式 圖。 5 第2圖係顯示第1實施形態之控制部之功能之功能方塊 圖。 第3圖係例示因存在於雷射加工裝置之偏移或變形引 起之照射圖形之變形者。 第4圖係顯示校準圖形之例者。 10 第5圖係顯示第1實施形態之轉換參數之算出程序之流 程圖。 第6圖係說明第1實施形態之調整方法者。 第7圖係說明輸入圖形至輸出圖形之轉換者。 第8圖係顯示第2實施形態之控制部功能之功能方塊 15 圖。 第9圖係說明第2實施形態之調整方法者。 第10圖係顯示第3實施形態之控制部功能之功能方塊 圖。 第11圖係說明第3實施形態之調整方法者。 20 第12圖係在第7實施形態中，照射校準圖形時之影像之 例。 第13圖係顯示第7實施形態之控制部之功能之功能方 塊圖。 第14圖係顯示第8實施形態之控制部之功能之功能方 62 200916248 塊圖。 【主要元件符號說明】 100…雷射加工裝置 101.. .平台 102.. .被加工物 103.. .雷射振盪器 104.. .半反射鏡 105.. .鏡子 106.. .DMD 107.·.半反射鏡 108.. .成像透鏡 109…半反射鏡 110.. .物鏡 111.. .照明用光源 112.. .CCD照相機 113.. .控制部 114.. .操作部 115.. .顯示器 116.. . LED 光源 201.. .讀入部 202.. .算出部 203.. .調整部 204.. .空間調變控制部 205.. .平台控制部 206.. .選擇部 207.. .作成部 300.. .影像 301.. .影像 302…影像 303.. .影像 304.. .影像 306.. .影像 310.. .照射圖形 311.. .照射圖形 312.. .照射圖形 320.. .DMD轉送用資料 321.. .DMD轉送用資料 330.. .實況影像 331.. .實況影像 332.. .實況影像 333.. .實況影像 334.. .實況影像 340.. .校準圖形 341.. .校準圖形 342.. .校準圖形 401.. .基板 63 200916248 402...電路圖形 C’··.點 403...圓 d’ _ · _ 點 404...圓 dl...點 405…圓 e...點 S101...步驟 el...點 S102...步驟 f".點 S103.··步驟 fl...點 S104...步驟 W".點 S105...步驟 P...矩陣 S106...步驟 P4...逆矩陣 S107...步驟 Q…矩陣 a...點 T...轉換矩陣 b···點 Τ’…逆轉換矩陣 C".點 X...方向 d···點 y...方向 a，·.·點 U...方向 b’·..點 V...方向 64=RTT'R' (Xpl,ypl,i)T =(xPi,yP!,i)T (39) That is, the result of the adjustment made by the adjustment unit 203, when the laser light is to be irradiated, the coordinates specified in the illumination pattern are The coordinates on the output pattern showing the position at which the laser light is actually illuminated are displayed, and the laser light is correctly illuminated to the desired position. Next, a description will be given of a ninth embodiment. An embodiment of the present invention is applied to a projector using a spatial modulation element. The spatial modulation component of the DMD is used to modulate the light space of the projection light source, and the text, the symbol, the image I5, and the image expertise are imaged into a wall or screen projector (illumination optical system), and the light projection can be adjusted. The present invention is applicable. Due to the influence of the offset or deformation of the optical system or the screen, the light is not projected to the designated position by the specified opening, but the projected image is moved, rotated, enlarged, reduced, deformed, and the like. Therefore, in the ninth embodiment, the projector includes an imaging unit that captures a screen and a control unit. The shooting unit is a CCD camera. The control unit has the same function as the reading unit 2〇1, the calculation unit 202, the adjustment unit 203, and the spatial modulation control unit 204 of Fig. 2 . According to the projector having such a configuration, similarly to the above-described respective embodiments, it is possible to perform calibration and adjust the projection according to the result of the calibration. In addition, since the term "projection" is used for the projector in the form of the projector, the "projection" of the ninth embodiment and the "projection" of the ninth embodiment are used in the present invention. "Irrigation" has the same meaning. Further, the present invention is not limited to the above embodiment, and various modifications are possible. 5 The following describes several examples. The physical structure of the laser processing apparatus 100 is not limited to the illustrated example. For example, it is also possible to use a transmissive spatial modulation element using a liquid crystal instead of the DMD 106 of the reflective spatial modulation element. In other words, as long as the first light to be adjusted and the second light for obtaining the necessary information for adjustment are spatially modulated by the spatial modulation element 10, and irradiated onto the workpiece 102, the workpiece 1 can be imaged. The structure of the 〇2, the specific structure of the laser processing apparatus 100 may vary depending on the embodiment. Further, the first light and the second light may be different or the same. Further, in each of the units shown in Fig. 2, only the spatial modulation control unit 204, the platform control unit 205, and the selection unit 206 are packaged in the control unit U3 of the laser processing apparatus 15 of Fig. 1, and the reading of Fig. 2 is performed. The entrance unit 201, the calculation unit 202, and the adjustment unit 203 can also be realized by a computer external to the laser processing apparatus 1. The adjustment method is also not limited to the above illustration. For example, in the second embodiment, the platform control unit 2〇5 performs adjustment for the operation of the platform ιοί according to an instruction from the adjustment unit 203. In another embodiment, the adjustment may be made by changing the position or angle of the DMD1〇6 instead of the platform 101. That is, the actuator for changing the angle or position is mounted on the DMD 106, and the structure of the second diagram is transformed into the spatial modulation control unit 2〇4, in addition to the designation of the wheel-in pattern, the actuator is also controlled. structure. At this time, the adjustment unit 203 may also instruct the spatial modulation control unit 2〇4 according to the inverse conversion matrix T, and control the DMD 106 to perform the adjustment. By the action of DMD1〇6, the position of the laser light moves in parallel (displacement), or rotates around a certain point, and the size or shape of the illuminated area changes. The plural embodiments shown above may be arbitrarily combined as long as they do not contradict each other. For example, three or more embodiments may be combined as follows. In the seventh embodiment in which the calibration pattern for avoiding the unevenness on the workpiece 1 2 is formed, the second embodiment in which the offset from the optical axis of the laser LED is added is the second embodiment similar to the eighth embodiment. The calculation unit uses the affine transformation of the sixth embodiment as the mathematical mode, and the mathematical calculation mode is called the eighth method (fourth), and the second calculation unit considers the offset of the laser-deficient material. The conversion matrix R and the inverse transformation matrix R, 15 20 • In the same manner as in the third embodiment, the image is deformed by the specified illumination pattern, and the DMD provided by the modulation control unit 2〇4 is performed. Further, the time for performing the calibration differs depending on the embodiment. Therefore, in the above description, the calibration time is not specifically mentioned except for the order of adjustment after calibration. In the example of the first embodiment, the first use of the laser processing apparatus _ inch is performed only after m calibrations, and then, after the same reversal, the matrix τ, and the adjustment of the irradiation of the laser light can be used. In accordance with the change of the time of the laser processing apparatus 10G, the calibration may be performed in the (fourth) period. Further, one workpiece 102 can be calibrated once. In the absence of a laser 57 200916248 When the processing tool 100 processes a plurality of workpieces 102, it is also possible to calibrate each object to be processed. For example, when the workpiece 102 is a large FPD substrate and the platform 101 is a floating platform using pneumatic casters, the workpiece 102 is bent. At this time, the distance between the workpiece 102 and the optical system (objective lens 110) of the laser processing apparatus 100 is different depending on which position the processing object is on the FPD substrate due to the influence of the bending. The variation of the distance between the workpiece 102 and the optical system is slight, and the magnification or offset of the light irradiated by the DMD 106 is changed according to the variation of the distance. Therefore, it is required to also calibrate each object to be processed when considering the high precision adjustment of the effects of such slight variations. Further, the relationship between the area on the workpiece 102 that illuminates the calibration pattern and the area on the workpiece 1 2 on which the irradiation pattern adjusted by the processing is irradiated is also various depending on the embodiment. 15 The case where the workpiece 1〇2 is used as a substrate will be described as an example. First, when calibrating is performed only once or periodically, it is advisable to use any substrate of the same type as the substrate to be processed for calibration. When one substrate is calibrated once, if the end of the substrate has an edge, the edge can also be used for calibration. That is, the control unit 113 can also control the laser processing apparatus 100' to move the stage 10 to the position where the LED light is irradiated to the edge, and then perform the illumination, and then irradiate the laser light adjusted according to the result of the calibration. Alternatively, when one or more substrates are calibrated, the control unit may control the laser processing apparatus 100 to move the stage 1〇1 to a position where the laser beam is irradiated to the object to be processed, and then calibrate. At this time, in order not to be added 58 200916248 The work object 102 is affected by the calibration, and it is preferable to calibrate the laser light which is different from the processing laser light or the output laser light. In addition to the above, the present invention may be embodied in various examples. For example, the procedure of the processing shown in the flowchart of Fig. 5 can be changed into a plurality of examples. For example, the processing of step S102 and the steps of step si3 to step S105 can be performed independently and independently. Therefore, the processing of step S102 is performed, and the processing of steps S103 to S105 may be performed at the same time, or the processing may be performed in the order of steps sl3, S104, S105, and S102. Also, the same calibration pattern can be used in multiple calibrations. At this time, when the calculation unit 202 creates the calibration pattern in the first calibration step 81〇1, the calculation unit 202 may store the calibration pattern in the memory device. In step S1 of the calibration after the second time (M, the calculation unit 202 can also read the calibration pattern from the memory device. 15 X, the calibration® shape is based on the coordinates of the predetermined 3', b, and e. Therefore, the three points a, b, and C2 coordinates may not be reacquired in step S102, but the step S102 may be performed. That is, when the calculation unit 2〇2 creates the calibration pattern, the coordinates of the three points a, b, and c are also matched. In the memory device, the coordinates of the three points are read from the memory device in steps. 20 x, as in the second embodiment, in the embodiment in which the inverse conversion matrix T is not used, the final step is not required. In the above, various embodiments have been described, and the effects common to the above embodiments are as follows. The spatial modulation element of the surface 6 is used, and the light can be irradiated to the workpiece according to any calibration pattern 59 200916248. 102. That is, the position of the complex point is represented by one calibration pattern, and the calibration can be performed efficiently at one time. Moreover, the mechanical movement of the optical system or the platform 101 and the irradiation of the light are not required to be repeated due to the calibration. Used to make the optical system The calibration is performed by the influence of the error included in the action of the mechanically movable actuator. Since the shape of the calibration pattern is arbitrary, it is easy to obtain a calibration pattern of an appropriate shape depending on the nature of the workpiece 102 used for calibration. Here, the "properties of the workpiece 102" are various properties such as a three-dimensional shape or a material. Further, in order to obtain a calibration pattern having an appropriate shape, an appropriate calibration pattern can be selected from a plurality of calibration patterns prepared in advance. An appropriate calibration pattern can be formed on the spot. For example, as described in the seventh embodiment, when a three-dimensional structure in which the shape of the calibration pattern is deformed in the region on the workpiece 102 to be irradiated with light is calibrated according to the calibration pattern, It is preferable not to use the calibration pattern. In this case, it is preferable to use the other calibration pattern to avoid the structure and to illuminate the light. As in the seventh embodiment, the composition unit 207 can also be on the spot according to the CCD camera, even if no information is given beforehand. The image captured by 112 is formed into a calibration pattern of an appropriate shape to avoid the three-dimensional structure on the workpiece 102. Further, the seventh embodiment may be modified. The calibration of the preliminary 20 is performed only when necessary, instead of the preliminary calibration. For example, in the calibration, the calculation unit 202 may detect the output pattern which is considered to be due to the unevenness on the surface of the workpiece 102. In the case of the deformation, the calibration pattern is set according to the seventh embodiment. Alternatively, in the embodiment other than the seventh embodiment, the calculation unit 202 may obtain information such as the design information of the workpiece 102 in advance. The range of the background portion is selected from the design data to generate a pattern for illuminating the background portion. In any case, since the calibration pattern is arbitrary, the preparation unit 207 or the calculation unit 207 can easily find an appropriate calibration pattern. When a plurality of substances having different light reflectances are formed into a workpiece 1 〇 2, an appropriate calibration pattern can be obtained and used to avoid the use of a region of a substance having a low light reflectance in the plurality of substances to illuminate the light. When the image is based on the design or based on the design data, it is easy to obtain an appropriate calibration pattern. 10 When the calibration is performed using the workpiece 102' having the possibility of reducing the accuracy of the calibration, it is easy to obtain an appropriate parent pattern corresponding to the nature of the workpiece 102, and the use can be utilized, so that the accuracy of the calibration can be achieved. improve. Further, in the conventional techniques described in Patent Documents 1 to 3, there is a case where the object of the calibration is limited irrespective of the rotation, the deformation, or the scale conversion. In the above embodiment of the present invention, the accuracy of the calibration and the characteristics of the device to be calibrated (e.g., the laser processing apparatus 100) can be calibrated according to an appropriately selected mathematical mode. This is because the calibration pattern is arbitrary, so that a more conventional mathematical mode can be used. Therefore, when using a more sophisticated mathematical model, 20 elements can be considered for more precise adjustment. In addition, the mathematical mode for calibration may be other than the above examples. For example, Lu Zhi' can also adopt a mathematical model that can withstand deformations that vary from region to region. In other words, the image captured by the CCD camera 112 is divided into a plurality of regions, and the conversion matrix τ and the inverse transformation matrix τ are calculated for each region 'calculation unit 2〇2, and the adjustment unit 2〇3 61 200916248 is inversely converted according to each region. The matrix τ' is adjusted. I: BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing the structure of a laser processing apparatus according to a first embodiment. 5 Fig. 2 is a functional block diagram showing the function of the control unit of the first embodiment. Fig. 3 is a diagram showing the deformation of the illumination pattern caused by the deflection or deformation of the laser processing apparatus. Figure 4 shows an example of a calibration pattern. Fig. 5 is a flow chart showing a procedure for calculating the conversion parameters of the first embodiment. Fig. 6 is a view showing the method of adjusting the first embodiment. Figure 7 illustrates the converter of the input graphic to the output graphic. Fig. 8 is a functional block diagram showing the function of the control unit of the second embodiment. Fig. 9 is a view showing the method of adjusting the second embodiment. Fig. 10 is a functional block diagram showing the function of the control unit in the third embodiment. Fig. 11 is a view showing the method of adjusting the third embodiment. 20 Fig. 12 is an example of an image when a calibration pattern is irradiated in the seventh embodiment. Fig. 13 is a functional block diagram showing the function of the control unit of the seventh embodiment. Fig. 14 is a functional diagram showing the function of the control unit of the eighth embodiment. 62 200916248 Block diagram. [Major component symbol description] 100... Laser processing device 101.. Platform 102.. Processed object 103.. Laser oscillator 104.. Half mirror 105.. . Mirror 106.. .DMD 107 .. half mirror 108.. imaging lens 109... half mirror 110.. objective lens 111.. illumination source 112.. CCD camera 113.. control unit 114.. operation unit 115.. Display 116.. LED light source 201.. Reading unit 202.. Calculation unit 203.. Adjustment unit 204.. Spatial modulation control unit 205.. Platform control unit 206.. Selection unit 207 .. .Creating part 300.. . Image 301.. Image 302... Image 303.. Image 304.. Image 306.. Image 310.. . Illumination graphic 311.. Graphics 320.. .DMD Transfer Data 321.. .DMD Transfer Data 330.. .Live Image 331.. Live Image 332.. .Live Image 333.. .Live Image 334.. .Live Image 340.. Calibration pattern 341.. calibration pattern 342.. calibration pattern 401.. substrate 63 200916248 402... circuit pattern C'··. point 403... circle d' _ · _ point 404... circle Dl...point 405...circle e...point S101...step el...point S102...step f".point S103.··step fl...point S104...step W".point S105...step P...matrix S106...step P4...inverse matrix S107...step Q ...matrix a...point T...conversion matrix b···point Τ'...inverse transformation matrix C".point X...direction d···point y...direction a,···point U ...direction b'·..point V...direction 64