TWI422452B - Adjustment device, laser processing device, adjustment method and adjustment program - Google Patents

Description

Adjustment device, laser processing device, adjustment method and adjustment program Field of invention

The present invention relates to a technique for adjusting the illumination of light that is spatially modulated by a spatially modulated component.

Background of the invention

Heretofore, a laser processing apparatus that processes a workpiece by irradiating laser light with a workpiece is used. Processing such as drawing or exposure of text or drawings, repair of substrates (repair; repair), etc. Further, the substrate includes a flat panel display (FPD: Flat Panel Display) such as a liquid crystal display (LCD) or a plasma display panel (PDP: Plasma Display Panel), a semiconductor wafer (wafer), and a laminated printed circuit board ( Multilayer printed circuit board).

Such a laser processing apparatus is provided with a mechanism for irradiating laser light at a specified position, direction, and shape. Heretofore, a slit or the like has been used as the mechanism. In recent years, a spatial modulation element such as a DMD (Digital Micromirror Device) in which arrays of micromirrors are arranged in an array has been used as the mechanism. The spatial modulation component is also called a spatial light modulator (SLM).

As a result, there are cases where the specified position, direction, and shape are different from the position, direction, and shape of the actual irradiated laser light. This is because there are a plurality of optical components in the optical path from the laser light source to the workpiece, which are affected by the strain of the optical components, the displacement of the mounting position, the offset of the mounting direction, and the like.

Therefore, in order to make the specified position, direction, and shape coincide with the position, direction, and shape of the actual irradiated laser light, calibration is required to adjust the manner of laser light irradiation.

In addition, the term "calibration" is also used to include the meaning of "adjustment". Hereinafter, "calibration" is described as not including "adjustment". Further, as long as the following is not particularly limited, "adjustment" means adjustment according to the result of the calibration.

Patent Documents 1 to 3 describe conventional techniques for adjusting irradiation of laser light.

The laser processing apparatus described in Patent Document 1 calculates the coordinate position on the image on the image of the processing pattern that is the target of the laser beam and the point on which the laser beam is irradiated, and calculates the positional shift between the two. . The position offset is converted into a correction amount for moving the platform, and the platform is moved to adjust the position of the processing pattern to coincide with the irradiation position of the laser beam.

However, Patent Document 1 only describes the adjustment of the positional shift in the X direction or the Y direction, and the scale conversion and the deformation of the shape regarding the rotational shift, enlargement or reduction are not described.

In the specimen observation system of Patent Document 2, a certain rotational shift or deformation is considered. This system is a structure in which a laser scanning device and an image capturing device are mounted on a microscope. In this system, the irradiation position of the laser light irradiated by the laser scanning device is measured from the image obtained by the image capturing device. Then, correction and adjustment are performed by displaying information on the difference between the irradiation position obtained by the measurement and the irradiation instruction position of the laser light irradiation indicated by the laser scanning device.

In this system, considering the four main factors of the difference between the irradiation position and the irradiation indication position, the adjustment method of the main factor is adopted. For example, The positional deviation or rotational offset of the optical axes of the optical systems of the image acquisition device and the laser scanning device is compensated by the control for correcting the deflection operation of the deflection lens for deflecting the laser light.

Patent Document 3 discloses a teaching method for aligning a focus position of YAG laser light with a laser processing point of a workpiece in a YAG laser processing machine. In this method, calibration of the Z direction of the optical axis direction of the YAG laser light and alignment of the X direction and the Y direction perpendicular to the Z direction are performed.

The calibration in the Z direction is performed by illuminating the workpiece in a direction inclined with respect to the Z axis, and the slit light for measurement on the workpiece is regarded as a line parallel to the X axis. The Z direction information is obtained from the relationship between the action of the laser processing head in the Z direction and the Y coordinate of the slit light of the image of the working workpiece. Based on this information, calibration is performed to align the focus of the YAG laser light in the Z direction of the surface of the workpiece.

The calibration in the X-Y direction is performed after the correction in the Z direction. Specifically, the laser processing head moves to the origin of the tool coordinate system (XYZ coordinate system), and only one shot of the laser light is irradiated, and the bead marks formed by the irradiation are taken to obtain the obtained image. The coordinates of the beads. Similarly, the laser processing head is also sequentially moved to the X-axis defined point on the X-axis of the tool coordinate system and the Y-axis defined point on the Y-axis to perform laser irradiation, shooting, and coordinate acquisition. .

The conversion matrix from the tool coordinate system to the pixel coordinate system is obtained from the coordinates of the coordinate coordinates of the three-point tool coordinate system and the pixel coordinate system of the image coordinate system. The transformation matrix represents a combination of parallel movement and rotational movement.

The inverse transformation of the transformation of the transformation matrix will be represented by the pixel coordinate system The coordinates of the detected points are converted into tool coordinate systems. Calculate the correction amount of the tool coordinate system, and the amount of correction of the laser machining head in the X-Y direction.

[Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 6-277864

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-109565

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2000-263273

Invention

Each of Patent Documents 1 to 3 describes a method of calibrating and adjusting when the laser light to be irradiated is spatially modulated. The calibration and adjustment of the illumination of the light by the spatial modulation element has so far been carried out manually.

According to an aspect of the present invention, there is provided an apparatus for adjusting illumination of an object by spatially modulated light modulated by a spatially modulated component in accordance with a specified input pattern. The adjustment device includes a reading unit, a calculation unit, and an adjustment unit that reads an image of the object that is irradiated with light that is spatially modulated by the spatial modulation element; the calculation unit calculates the Converting the input pattern into a conversion parameter of the output pattern generated corresponding to the input pattern on the image; and when the calibration pattern is used as the input pattern, the adjustment unit adjusts the conversion parameter calculated by the calculation unit The illuminator of the specified object's illumination of the object.

According to another aspect of the present invention, a laser processing apparatus is provided. The laser processing apparatus includes an optical system that guides laser light emitted from a laser light source onto an object; and is disposed from the laser light source to the object a spatial modulation element that spatially modulates incident light on the optical path; and the aforementioned adjustment device. In the laser processing apparatus, the laser beam is used as the light that is irradiated onto the object based on the illumination pattern, and the adjustment device adjusts the irradiation of the object by the laser light to process the object.

According to still another aspect of the present invention, a computer is provided to execute a method for implementing the aforementioned adjustment device and a program for causing a computer to function as the aforementioned adjustment device. The aforementioned program is stored in a computer readable memory medium.

In any of the above aspects, the illumination of the object is adjusted according to the calculated conversion parameter. Therefore, the difference between the specified illumination pattern and the pattern of the light actually irradiated is reduced when it is not adjusted.

According to the present invention, since the illumination of the light modulated by the spatial modulation element is automatically adjusted according to the conversion parameter, more accurate illumination can be achieved.

Further, according to the present invention, since the conversion parameter is calculated from one calibration pattern, it is sufficient that the irradiation of the light for obtaining the conversion parameter is performed once, and the irradiation and the mechanical movement of the structure are not required to be repeated as is conventional. . Thus, according to the present invention, the calibration can be performed efficiently and the illumination of the light can be adjusted.

The best form for implementing the invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the plural figures showing different embodiments, the constituent elements that correspond to each other are denoted by the same reference numerals, and the description is omitted.

Hereinafter, the first embodiment will be described first, and then the second to eighth embodiments in which the first embodiment is modified will be described. The first to eighth embodiments are all The invention is applied to an example of adjusting the illumination of laser light from a laser processing apparatus. Next, a ninth embodiment will be described as an example in which the present invention is applied to light irradiation for adjusting a projector, and finally, another modification will be described.

Fig. 1 is a schematic view showing the configuration of a laser processing apparatus according to a first embodiment. In the second to eighth embodiments, a laser processing apparatus having the same configuration as that of Fig. 1 is also used.

The laser processing apparatus 100 of Fig. 1 is a device for processing a workpiece 102 placed on a stage 101 with laser light emitted from a laser oscillator 103. The laser processing apparatus 100 performs processing such as melting, cutting, printing of a picture or a character, and the like, repairing or repairing a circuit pattern (repair). Further, the following is a brief description, and the upper surface of the stage 101 is assumed to be perpendicular to the vertical direction.

The workpiece 102 may be an FPD substrate, a semiconductor wafer, a laminated printed substrate, or the like, or may be other general samples.

The laser light emitted from the laser oscillator 103 passes through the half mirror 104, is reflected by the mirror 105, and is incident on the DMD 106.

The DMD 106 is a spatial modulation element in which small mirrors are arranged in a two-dimensional array. The tilt angle of the tiny mirror can be switched to at least two. Hereinafter, the state of the minute mirror when the inclination angle is the first and second angles is referred to as "open state" and "closed state", respectively.

The DMD 106 independently switches the tilt angle of each of the minute mirrors, that is, the state of each of the minute mirrors, as instructed by the control unit 113 to be described later. The instruction to the DMD 106 is indicated by a data indicating that the binary data indicating whether or not the laser light is to be irradiated is arranged in two dimensions, and is transmitted from the control unit 113.

When the incident light incident on the DMD 106 from the mirror 105 is reflected by the micromirror in the on state, the direction of the reflected light forms a vertical direction, and the laser oscillator 103, the half mirror 104, the mirror 105, and the DMD 106 are disposed. A projection optical system having a half mirror 107, an imaging lens 108, a half mirror 109, and an objective lens 110 is disposed on an optical path of the laser light reflected by the minute mirror in an open state to reach the surface of the workpiece 102. The laser light reflected by the tiny mirror in the open state is projected, that is, irradiated onto the surface of the workpiece 102 by the projection optical system. The projection optical system is configured such that the surface of the workpiece 102 is conjugate with the DMD 106.

The tilt angle of the tiny mirror in the closed state is different from that in the open state. Therefore, the micro mirror incident on the mirror 105 from the incident light of the DMD 106 in the closed state is reflected in a direction different from the direction to the half mirror 107 without being irradiated onto the workpiece 102. In Fig. 1, the optical path of the reflected light of the tiny mirror in the closed state is indicated by a dotted arrow.

Therefore, by controlling each of the minute mirrors in the on state or the off state, it is possible to control whether or not the laser light is irradiated to the position of the workpiece 102 corresponding to each of the minute mirrors. That is, by using the DMD 106, laser light can be irradiated onto the workpiece 102 at any position, direction, and shape.

The laser processing apparatus 100 further includes an LED (Light Emitting Diode) light source 116. Light emitted from the LED light source 116 (hereinafter referred to as "LED light") is reflected by the half mirror 104 and is incident on the mirror 105.

Here, the laser oscillator 103, the half mirror 104, and the LED light source 16 are arranged such that the laser light transmitted through the half mirror 104 coincides with the optical axis of the LED light reflected by the half mirror 104. Thus, the LED light reflected by the half mirror 104 The optical path is the same as the optical path of the laser light, and the LED light is also irradiated to the workpiece 102.

In the present embodiment, the calibration is performed to adjust the irradiation of the laser light by the DMD 106, and the LED light is used for calibration.

Further, the laser processing apparatus 100 includes an illumination light source 111 and a CCD (Charge Coupled Device) camera 112. When the illumination light is required for imaging, the illumination light of the illumination light source 111 is reflected by the half mirror 109, and is irradiated onto the surface of the workpiece 102 by the objective lens 110. Further, an imaging device such as a CMOS (Complementary Metal-Oxide Semiconductor) camera can also be used.

The reflected light of the laser light, the LED light, and the illumination light on the surface of the workpiece 102 is photoelectrically incident on the CCD camera 112 by the optical system having the objective lens 110, the half mirror 109, the imaging lens 108, and the half mirror 107. element. Thereby, the CCD camera 112 captures the surface of the workpiece 102.

In the present embodiment, laser light, LED light, and illumination light that can capture the wavelength of the reflected light by the CCD camera 112 are used. Therefore, when the DMD 106 is irradiated with the laser beam or the LED light, when the CCD camera 112 captures the workpiece 102, the image of the laser beam or the LED light that is irradiated onto the workpiece 102 appears on the captured image.

If the laser processing apparatus 100 is completely free of deformation or offset, the image appearing in the image should be consistent with the position, direction (angle), and shape of the pattern specified by the DMD 106. However, in reality, there are two cases where the graphics are inconsistent. This inconsistency is the subject of calibration.

The laser processing apparatus 100 further includes a control unit 113, an operation unit 114, and a display unit. Display 115.

The control unit 113 controls the entire laser processing apparatus 100. The operation unit 114 is realized by an input device such as a keyboard or a pointing device. The instruction input from the operation unit 114 is transmitted to the control unit 113.

Further, the display 115 displays an image, a character, or the like in accordance with an instruction from the control unit 113. The display 115 can also instantly display an image of the workpiece 102 captured by the CCD camera 112. Hereinafter, the image captured by the CCD camera 112 and read by the control unit 13 may be referred to as a "live" image.

The input to the control unit 113 is an instruction of the operation unit 114 and image data from the CCD camera 112. The controller of the control unit 113 is the platform 101, the laser oscillator 103, the DMD 106, the display 115, and the LED light source 116.

Further, the control unit 113 may be a general-purpose computer or a dedicated control device. The function of the control unit 113 can also be implemented by any of hardware, software, firmware, or a combination of these.

For example, an external memory device such as a non-electrical memory such as a CPU (Central Processing Unit) or a ROM (Read Only Memory), a RAM (Radom Access Memory) used in a working area, or a hard disk device may be provided. The control unit 113 is realized by a computer such as a PC (Personal Computer) connected to the bus bar by a connection interface with an external device.

At this time, the platform 101, the laser oscillator 103, the DMD 106, the display 115, and the LED light source 116 are connected to the computer through their respective connection interfaces. The CPU implements the function of the control unit 113 by loading a program stored in a hard disk device or a computer-readable portable memory medium into the RAM for execution.

Next, the workpiece 102 is used as a substrate, and the laser processing apparatus 100 is a laser irradiation apparatus 100 for irradiating a defect on the surface of the substrate to repair a defect. The laser processing apparatus 100 according to the first embodiment will be described. summary.

As shown in FIG. 1, the laser processing apparatus 100 includes a microscope having an imaging lens 108 and an objective lens 110. Therefore, the CCD camera 112 can take a fine circuit pattern or fine defects on the workpiece 102 by means of a microscope. The captured image is instantly displayed on the display 115.

A region where the defect is present on the surface of the workpiece 102 is referred to as a "defect region", and is displayed on the image of the display 115, and a region where the defective region is photographed is referred to as a "defect display region". The laser repairing device repairs the substrate by irradiating the defective area with laser light. For example, dust or unnecessary light resistance is a defect, but it is a repairable defect because it can illuminate the laser light and evaporate it. This defect is the object of repair of the laser repair device.

In order to prevent the laser light from being irradiated to the non-defective area and damage the normally formed circuit pattern, the area irradiated with the laser light must be exactly coincident with the defect area. Therefore, calibration and adjustment are required.

For example, the operator selects, that is, specifies the defect display area by the operation unit 114. The specified defect display area is a graphic showing the defective area. By the control unit 113 assigning this pattern to the DMD 106, it is possible to perform irradiation for controlling "the laser beam is irradiated to the defective region and the laser light is not irradiated to the region other than the defective region". In other words, the micro mirror corresponding to the DMD 106 of the pixel included in the defect display area indicates the on state, and the other micro mirror indicates the off state, and the defect area can be irradiated with the laser light to repair the defect. No other areas of the laser are exposed to laser light.

If the laser processing apparatus 100 is completely free from distortion or offset, the micro mirror corresponding to the DMD 106 of the pixel included in the defect display area is irradiated with the laser light corresponding to the position on the workpiece 102 of the micro mirror, and should be turned on. . The minute mirror corresponding to the pixel not included in the defective area should be in a closed state so that the laser light is not irradiated to the position on the workpiece 102 corresponding to the minute mirror.

However, there are actually cases where the laser processing apparatus is deformed or offset. Yes, perform calibration. Then, the laser light is adjusted according to the result of the calibration, and is irradiated onto the workpiece 102 as a substrate. Thereby, the laser light can be irradiated with a pattern that coincides with the defect area on the substrate accurately. That is, the laser processing apparatus 100 for the laser repairing apparatus not only does not damage the normal portion by the laser light, but also repairs the defects of the substrate.

Next, the details of the control unit 113 will be described.

Fig. 2 is a functional block diagram showing the function of the control unit 113 of the first embodiment.

The control unit 113 includes a reading unit 201 that reads an image from the CCD camera 112, a calculation unit 202 that performs calibration, an adjustment unit 203 that adjusts the irradiation of light, a spatial modulation control unit 204 that controls the DMD 106, and a control platform. The platform control unit 205 of 101 selects one of the laser oscillator 103 or the LED light source 116 as the light source selection unit 206. In the first embodiment, the adjustment device of the present invention is implemented by the reading unit 201, the calculation unit 202, and the adjustment unit 203.

The reading unit 201 reads in the imaged object 102 from the CCD camera 112. image. For example, when the control unit 113 is implemented by a PC, the image capturing unit installed in the PC can also implement the reading unit 201.

The type of image read by the reading unit 201 varies depending on the implementation. In any of the embodiments, the image to be read by the reading unit 201 is an image of the workpiece 102 when the illumination is performed according to the calibration pattern.

The calibration graphic is one of the input patterns indicated by the DMD 106. In the following description, the "input graphic" is a graphic indicating the indication to the DMD 106, and is a graphic indicating an area in which the light is irradiated with an indication of "on" or "off" of each of the minute mirrors. For the purpose of processing for calibration or laser light, the pattern specified as the input pattern is specified.

A picture corresponding to the input pattern is generated on the image of the workpiece 102 that is irradiated with light according to some input patterns. Hereinafter, the image generated on the image is referred to as an "output graphic".

The output graphic is a binary image of "irradiated light" or "unirradiated light" and is a graphic representing points on the image. The indications of "on" and "off" of the input graphic correspond to the state of "illuminated light" and the state of "unirradiated light" of the output graphic, respectively.

However, the input pattern is generally different from the output pattern due to deformation or offset existing in the laser processing apparatus 100. For example, the calibration graphic is used for the calibration of the reference graphic, and the output graphic is different from the reference graphic.

That is, when the input pattern is regarded as a reference, the output pattern is shifted to the reference position, or rotated from the reference angle, and the shape is enlarged, reduced, or deformed.

Therefore, the calculation unit 202 calculates a conversion parameter for converting the input pattern into an output pattern. In the following embodiments, the calibration refers to the calculation of the conversion parameters. Out. Since specific examples of the conversion parameters differ depending on the embodiment, the details will be described later.

The calculation unit 202 outputs the conversion parameters calculated when the calibration pattern is used as the input pattern to the adjustment unit 203. Further, the calculation unit 202 reads a predetermined calibration pattern stored in a memory device (not shown), and uses the calculation of the conversion parameter to create a calibration pattern for each calibration.

The adjustment unit 203 adjusts the laser irradiation according to the illumination pattern specified from the outside of the control unit 113 in accordance with the conversion parameter. The object to be controlled for adjustment varies depending on the embodiment. In the first embodiment, the adjustment unit 203 adjusts the illumination pattern supplied from the operation unit 114.

When the control unit 113 is implemented by the PC, the calculation unit 202 and the adjustment unit 203 can also be realized by loading the program into the RAM and executing the CPU. Further, when the calibration pattern is stored in advance in the memory device, the memory device may be a RAM or a hard disk device or the like included in the PC.

The spatial modulation control unit 204 receives the input pattern to be instructed to the DMD 106, and controls the micro mirrors of the DMD 106 to be turned on or off depending on the input pattern. As a result, the light irradiated from the laser oscillator 103 or the LED light source 116 is spatially modulated by the DMD 106 to be irradiated onto the workpiece 102.

The spatial modulation control unit 204 receives the calibration pattern as an input pattern from the calculation unit 202 during the illumination of the LED light for calibration. In the irradiation of the processing laser light, the spatial modulation control unit 204 receives the input pattern adjusted by the adjustment unit 203 from the adjustment unit 203.

The platform control unit 205 controls the platform 101 so that the first part constituting the optical system The relative positions of the constituent elements of the figure and the platform 101 vary. In other embodiments, the optical system may be moved to change the relative position without moving the platform 101.

For example, when the laser processing apparatus 100 is a laser repairing apparatus, the laser processing apparatus 100 is notified in advance from the defect inspection apparatus of the approximate position of the defect to be repaired. Then, the platform control unit 205 controls the stage 101 to move so that the notified position on the workpiece 102 enters the irradiation range of the laser light and enters the imaging range of the CCD camera 112.

Thereafter, the CCD camera 112 captures the workpiece 102, the reading unit 201 reads the captured image, and the display 115 displays the image. The operator instructs the image to be irradiated with the laser light, that is, the defect display area, from the operation unit 114 in accordance with the image displayed on the display 115. Further, the defect display area can be extracted by a conventional technique of comparing images obtained from a good finished product.

The selection unit 206 selects one of the laser oscillator 103 and the LED light source 116 as a light source, and turns on the selected one of the light sources, and the light source that is not selected is turned off. Specifically, the selection unit 206 performs control for turning off the laser oscillator 103 when the laser oscillator 103 is turned off during calibration, and performs control for turning on the laser oscillator 103 and turning off the LED light source 116 during processing. Further, the selection unit 206 also performs control for turning off both of the light sources.

When the control unit 113 is implemented by the PC, the spatial modulation control unit 204, the platform control unit 205, and the selection unit 206 can be implemented by loading the program into the connection interface of the CPU, the external device, and the PC executed by the RAM.

Next, referring to Fig. 3, the object of calibration will be described.

Fig. 3 illustrates a deformation of an illumination pattern caused by an offset or deformation of the laser processing apparatus 100, that is, a deformation of an input pattern to an output pattern.

For convenience of explanation, the coordinate axis of the horizontal direction of the image captured by the CCD camera 112 will be referred to as an x-axis, and the coordinate axis of the vertical direction will be referred to as a y-axis. The image size is arbitrary. In the present embodiment, the x direction is 640 pixels, and the y direction is 480 pixels. Also, this size is described as "640 × 480 pixels". The position of each pixel in the image is represented by a combination of x and y coordinates (x, y). The coordinates of the upper left corner and the lower right corner of the illumination pattern 310 of Fig. 3 are (0, 0) and (639, 479), respectively.

The illumination pattern 310 of Fig. 3 indicates which portion of the image is to be irradiated with the laser light to the image captured by the CCD camera 112. Therefore, the position in the illumination pattern 31 can also be represented by a combination of x coordinates and y coordinates (x, y), and the size of the illumination pattern 310 is 640 × 480 pixels which is the same as the image captured by the CCD camera 112.

Here, when the irradiation laser light is displayed in white and the non-irradiation is displayed in black, as shown in FIG. 3, the illumination pattern 310 can be represented by a white-black binary image. In the example of Fig. 3, the illumination pattern 310 indicates that the white cross shape and the background intersecting the thick line parallel to the x-axis and the thick line parallel to the y-axis, which are located at the center of the image, are composed of black, which is equivalent to a white cross. A portion of the shaped workpiece 102 illuminates the laser light.

In the present embodiment, the irradiation pattern 310 is performed as follows, and is instructed from the operation unit 114. First, under the illumination of the illumination light of the illumination source 111, the CCD camera 112 is in a state where the laser light is not irradiated or the LED light is not irradiated. Shoot the processed object. Then, the reading unit 201 of the control unit 113 reads the captured image and outputs it to the display 115.

Thereafter, the operator views the image output to the display 115, and instructs the operation unit 114 to irradiate the range of the laser light. The instruction is supplied to the control unit 113 in the form of the data of the illumination pattern 310 of 640 × 480 pixels by the interface connecting the operation unit 114 and the control unit 113.

In another embodiment, the data of the illumination pattern 310 may be transmitted from the other device to the control unit 113. For example, when the laser processing apparatus 100 is a laser repair apparatus such as an FPD board, the data of the illumination pattern 310 may be transmitted from the defect inspection apparatus to the control unit 113. Alternatively, the laser repairing apparatus may further include an image recognition unit that recognizes the shape of the defect by image recognition processing, generates data of the illumination pattern 310 that displays the recognized shape, and outputs the data to the control unit 113.

In any case, the information of the illumination pattern 310 is supplied to the control unit 113. In this way, the control unit 113 generates the DMD transfer material 320 for instructing the DMD 106 to turn on and off the respective micro mirrors from the illumination pattern 310. The DMD transfer data 320 indicates the data of the input graphic and is transferred (i.e., transmitted) to the DMD 106.

In the DMD 106, the minute mirrors are arranged in a two-dimensional array, and the position of the micromirrors can be represented by a combination (u, v) of the u coordinate and the v coordinate. In the following, for the sake of simplicity, the coordinates (x, y) of the pixels in the image and the coordinates (u, v) of the micro mirror are such that x = u, y = v. Since the relationship between the uv coordinate system and the origin of the uv coordinate system is properly set as appropriate, the generality of the following description is not lost.

Here, similarly to the map of the illumination pattern 310, when the illumination light is indicated by white and the non-irradiation is indicated by black, the DMD transfer data 320 can also be represented by a white-black binary image. In other words, the DMD transfer data can be represented by a white-black binary image indicating the point at which the white or micro mirror in which the micro mirror is turned on is in the black state indicating the position (u, v).

In the present embodiment, it is assumed that 800 x 600 micromirrors are arranged in the DMD. That is, the number of minute mirrors is larger than the number of pixels of the image captured by the CCD camera 112. Therefore, the image showing the DMD transfer data 320 is an image surrounding the image showing the illumination pattern 310 surrounded by a black edge. The reason for such an edge is described later.

That is, the color (white or black) of the image position (x, y) of the display illumination pattern 310 is equal to the color of the position (u, v) of u=x, v=y of the image of the DMD transfer data 320. When the position (u, v) is in the range of u < 0, 640 ≦ u, v < 0 or 480 ≦ v, the position (u, v) of the image showing the DMD transfer data 320 is black.

In addition, in FIG. 3, the DVD conversion material 320 has a white rectangular frame line, which is a description of the range of 640×480 pixels corresponding to the illumination pattern 310 for convenience of explanation, and does not indicate that the micro-mirror on the white frame line is present. Turn on the status. Further, in the present embodiment, in the DMD transfer material 320, the width of the edge above the white frame line is equal to the width of the lower edge, and the width of the edge on the right side and the edge on the left side are also equal. However, the width of the edge can be appropriately determined according to the embodiment.

Based on the above relationship between the illumination pattern 310 and the DMD transfer data 320, the control unit 113 generates DMD transfer data from the data of the illumination pattern 310. 320. As described above, in order to generate the DMD transfer material 320, the control unit 113 may add a black edge only around the illumination pattern 310.

The spatial modulation control unit 204 in the control unit 113 outputs an instruction to turn on or off the 800×600 micro mirrors by outputting the DMD transfer data 320 to the DMD 106.

Here, it is assumed that the adjustment according to the calibration is not performed, but according to the given DMD transfer data 320, the minute mirror of the DMD 106 is turned on or off, and the laser light is emitted from the laser oscillator 103.

At this time, the pattern of the laser light that is generally irradiated onto the workpiece 102 is different from the expected illumination pattern 310. This is due to the offset or deformation of the optical system and/or the imaging system of the laser processing apparatus 100.

For example, the mirror or the lens may be deformed, or the mounting positions of the constituent elements of the laser processing apparatus 100 may be offset, or the mounting angle may be offset from the original angle.

The live image 330 of FIG. 3 is an example of an image taken by the CCD camera 112 when a pattern different from the intended illumination pattern 310 is irradiated onto the workpiece 102. Therefore, the position on the live image 330 can also be represented by an xy coordinate system, and the size of the live image 330 is 640×480 pixels.

In the live image 330 of Fig. 3, the portion actually irradiating the laser light is displayed in white, and the unirradiated portion is displayed in black. When the live image 330 is compared with the illumination pattern 310, the white cross is moved in the forward direction of the x-axis, and further rotated counterclockwise by 15 degrees. The deformation from the illumination pattern 310 to the live image 330 actually includes not only parallel movement (displacement) and rotation, but also deformation of the shape such as enlargement, reduction, that is, scale conversion or shear strain.

Therefore, in order to prevent such deformation, calibration is performed, and the irradiation of the laser light needs to be adjusted according to the result of the calibration. In the present embodiment, the deformation of the above-described illumination pattern due to the offset or deformation of the laser processing apparatus 100 is regarded as a result of conversion, and the conversion is mathematically modeled.

Next, the parameters for displaying the mathematically converted conversion are obtained by calibration, and the processing of the adjustment is performed according to the obtained parameters.

In Fig. 3, the DMD transfer material 320 is the same as the illumination pattern 310 except for the edge. Thus, the illumination pattern 310 can in fact be an input graphic assigned to the DMD 106. The live image 330 is an output pattern generated by the image when the received laser light is irradiated onto the workpiece 102 without any adjustment corresponding to the input pattern. Thus, the deformation from the illumination pattern 310 to the image 330 can be considered as a transition from the input pattern to the output pattern.

In the present embodiment, this conversion is employed as a mathematical mode of affine conversion represented by the conversion matrix T. That is, each element of the conversion matrix T is a conversion parameter that should be calculated in the calibration.

As described above, both the input pattern and the output pattern can be represented by the xy coordinate system. Further, since u=x and v=y are normal, even if the uv coordinate system and the xy coordinate system are regarded as the same, the calculation of the conversion parameters is not problematic. That is, in the mathematical mode of the present embodiment, the coordinates of the illumination pattern 310 equal to the coordinates (u, v) of the DMD transfer data 320 are converted to the coordinates of the live image 330 by displaying the conversion matrix T of the affine transformation. ',y')".

When this mathematical mode is expressed by an equation, it is as in equation (1).

Here, the conversion matrix T is defined as a 3×3 matrix of the formula (2).

In this way, the matrix operation of equation (3) can be used to display the conversion from the input graphic to the output graphic.

Here, the requirements d ₁ and d ₂ of the third column of the conversion matrix T indicate the amount of parallel movement. When the transformation matrix T, the elements _{a 1, b 1, a 2} , b 2 constituting part of the 2 × 2 matrix considered, the 2 × 2 matrix of the affine transformation defined as normal, showing the synthesis of rotation, magnification, , shrink and cut should be deformed. This can also be understood from the following formulas (4) to (12).

That is, an arbitrary regular 2×2 matrix S can be decomposed into the equation (4).

Further, the matrix X indicating the rotation is generally represented by the formula (5), the matrix Y indicating the enlargement and reduction is represented by the formula (6), and the matrix Z indicating the shear strain is represented by the formula (7).

Here, α, β, and γ are represented by the formulas (8), (9), and (10), respectively, and θ satisfies the formula (11) as long as the θ satisfies the formulas (11) and (12).

S=XYZ (13)

That is, by calculating the conversion matrix T, it is possible to perform calibration in which parallel movement, rotation, enlargement, reduction, and shear strain are taken into consideration. Therefore, the method of calculating the conversion matrix T will be described.

Generally, when three points a, b, and c are mapped to points a', b', and c' by affine transformation, the conversion matrix T of the affine transformation can be derived from the coordinates of points a, b, and c and point a', The coordinates of b' and c' are calculated as follows.

First, in the xy coordinate system, the coordinates of point a are represented by _a vector of (x _a , y _a ) ^T , and the coordinates of point b are represented by a column vector composed of (x _b , y _b ) ^T , point c The coordinates are represented by a column vector consisting of (x _c , y _c ) ^T , the coordinates of point a' are represented by a column vector consisting of (x _a ', y _a ') ^T , and the coordinates of point b' are represented by (x _b ', y _b ') ^T constitutes a column vector indicating that the coordinates of point c' are represented by a column vector consisting of (x _c ', y _c ') T. Here, the "T" of the above superscript character indicates transposition. In this way, the matrix P represented by the following formula (14) and the matrix Q represented by the following formula (15) are defined using the coordinates of the points a, b, c and the points a', b', and c'.

Here, the relationship between the formula (3), the three points a, b, c and the three points a', b', and c' can be expressed by the following formula (16).

TP=Q (16)

When properly selected three points a, when b, c of the position, the matrix P is normal, the presence of an inverse matrix P ^-1. Therefore, by multiplying the inverse matrix P ^-1 from the right side of both sides, the equation (17) can be obtained.

T=QP ^-1 (17)

Therefore, the calculation unit 202 can calculate the conversion matrix T from the equation (17). That is, the predetermined matrix P is the three points a, b, and c at the appropriate positions of the normal, and it can be understood that the conversion matrix can be calculated when the positions of the points a', b', and c' mapped by the conversion matrix T are calculated. T. In the present embodiment, in order to know the positions of the points a', b', and c', the illumination of the LED light according to the calibration pattern can be performed.

Figure 4 shows an example of a calibration pattern. In the fourth figure, an example of three calibration patterns is shown, which are three points a, b, and c which are positioned such that the matrix P is normal, which can be distinguished from each other.

The calibration pattern can be generated by the calculation unit 202 at each calibration, or can be generated in advance and memorized in the memory device.

Since the calibration pattern is one of the input patterns to the DMD 106, as in the third figure, the binary image representation of the white in the on state and the black in the off state can be displayed. Further, as described in Fig. 3, in the present embodiment, since the uv coordinate system is regarded as the same as the xy coordinate system, the x-axis and the y-axis are displayed in Fig. 4 .

Three circles having different diameters are arranged in the calibration pattern 340, and the three points can be distinguished by the difference in diameter. That is, the center of the circle having the smallest diameter is the point a, the center of the circle having the second smallest diameter is the point b, and the center of the circle having the largest diameter is the point c. Since the circular areas of different diameters are also different, it can be easily distinguished by image processing.

In the calibration pattern 341, three points are distinguished by the shape. That is, the center of gravity of the rectangle is point a, the center of gravity of the diamond is point b, and the center of gravity of the triangle is point c.

In the calibration pattern 342, a pattern composed of two line segments is used, and three points are distinguished. In the calibration pattern 342, one end of the line segment parallel to the y-axis is point a, and the other end point is point b. Further, the end point of the line segment parallel to the x-axis which is not in contact with the line segment ab is the point c. Here, when the contact point of the line segment ab and the line segment parallel to the x-axis is the point w, the positions of the points a, b, and c are set so that the distance a of the point a from the point w and the distance bw between the point b and the point bw Different from each other.

Of course, it is also possible to use a calibration pattern other than the illustration in Fig. 4. For example, in a figure composed of triangles having different lengths of three sides, three vertices can be distinguished according to the length of three sides, so that it can be utilized as a calibration pattern. It is also possible to use a pattern showing four points that are distinguishable from each other, and only a specific one of them is used for calibration. In summary, when the conversion matrix T is used to represent the mathematical mode of the affine transformation, as long as the three points can be distinguished from each other, the shape of the calibration pattern can be any shape.

Then, when the CCD camera 112 photographs the workpiece 102 that irradiates light according to the calibration pattern, as described above, an image including the output pattern deformed by the conversion matrix T is obtained. To calculate the conversion matrix T, the position of the points a', b', c' needs to be recognized from the output pattern.

Here, since the deformation of the conversion matrix T is caused by the offset or deformation of the laser processing apparatus 100, the degree of deformation of the conversion matrix T is not so large. Therefore, in order to maintain a state of "distinguishable three points" even if the figure is slightly deformed, by using a calibration pattern that improves the degree of "three points a, b, c difference ease", it can be in the output graphic. , distinguishing points a', b', c' from each other.

For example, in the example of the calibration pattern 340, when the diameters of the three circles are different, three points a, b, and c can be distinguished. However, the ease of the difference varies depending on the ratio of the diameters of the three circles.

If the values of the three diameters are similar, the three circles may be mapped into three ellipses (or circles) that are hardly distinguishable by the transformation matrix T. However, when the values of the three diameters are greatly different, the three circles are different in area in the output pattern deformed by the conversion matrix T, and are mapped into three ellipticals (or circles) which are easily distinguishable. Therefore, the area 3 points a', b', c'. That is, the center of gravity of the three ellipse (or circle) can be recognized as three points a', b', c'.

That is, in the example of the calibration pattern 340, the more different the diameters of the three circles, the easier the difference between the three points a, b, and c. In the calibration pattern 340, when the diameters of the three circles are different, the three points a', b', and c' can be distinguished from each other depending on the embodiment. Therefore, preliminary experiments can also be carried out to set the diameter of three circles.

In the calibration pattern 341, the triangle and the quad are also easily distinguishable in the output pattern. For example, when the lengths of the two sides of the rectangle are different, or the area of the rectangle and the diamond are greatly different, the output of the figure maintains the "distinguishable three points" property. Therefore, in the output pattern, the centers of gravity of the three figures can be recognized as three points a', b', c'.

In the calibration pattern 342, the two distances aw and bw are greatly different, and the output pattern can maintain the "distinguishable three points" property, and the three points a', b', c' can be distinguished from each other.

Next, referring to Fig. 5, a description will be given of a process of calculating the conversion matrix T using such a calibration pattern.

Fig. 5 is a flow chart showing a calculation program of the conversion matrix T as the conversion parameter of the first embodiment.

In step S101, the calculation unit 202 creates a calibration pattern shown in Fig. 4 and outputs it to the spatial modulation control unit 204. Alternatively, the calculation unit 202 may read the calibration pattern stored in advance in the memory device in step S101.

The calibration graphic is assigned to the DMD 106 as an input graphic and can be represented by a binary image. Therefore, in the fifth drawing, step S101 is expressed as "DMD image creation".

Next, in step S102, the calculation unit 202 acquires the coordinates of the three points a, b, and c from the data of the calibration pattern.

For example, when it is the calibration pattern 340 of FIG. 4, the calculation unit 202 recognizes three "white" circles from the calibration pattern by image recognition processing, and calculates and obtains the recognized three circle centers (ie, the center of gravity). coordinate. The three coordinates are the coordinates of points a, b, and c.

Then, in step S103, the selection unit 206 selects the LED light source 116 as a light source. The spatial modulation control unit 204 controls the DMD 106 to switch the on state and the off state of the minute mirror in accordance with the calibration pattern. Thereby, the LED light emitted from the LED light source 116 is spatially modulated according to the calibration pattern, and is projected onto the surface of the workpiece 102 (ie, irradiated) by the DMD 106.

Next, in step S104, the CCD camera 112 captures the workpiece 102, and the reading unit 201 reads (i.e., captures) the image of the captured image from the CCD camera 112. There is an output graphic corresponding to the calibration pattern for this image.

In the next step S105, the output pattern read by the calculation unit 202 from the reading unit 201 is obtained as follows, and three points a', b', and c' are acquired.

In the present embodiment, the image read by the reading unit 201 is a grayscale image. Of course, in other embodiments, the CCD camera 112 for capturing a color image may be used. In this case, the calculation unit 202 acquires the coordinates of the three points a', b', and c' in the same manner as described below.

The calculation unit 202 first converts the image read by the reading unit 201 into a white-black binary image. This binarization is performed by comparing the luminance values of the respective pixels with the threshold. In the converted white-black binary image, the white area is the area that illuminates the LED light, and the black area is the area that does not illuminate the LED light. The calculation unit 202 performs the following processing using the converted white-black binary image.

For example, when the calibration pattern 340 of FIG. 4 is used, the calculation unit 202 recognizes the presence and position of a shape similar to a circle or an ellipse by image recognition processing. As a result, three shapes are recognized. In the example of the calibration pattern 340, the points a, b, and c correspond to the order in which the areas of the three circles are small. Therefore, the calculation unit 202 The area of the three identified shapes is calculated, and the shapes correspond to the points a', b', and c', respectively, in the order of the small area. Further, the calculation unit 202 calculates the centroid coordinates of the three recognized shapes, and acquires the three coordinates as the coordinates of the three points a', b', and c'.

Similarly, when the other calibration pattern is used, the calculation unit 202 acquires the coordinates of the three points a', b', and c' from the white-black binary image indicating the output pattern in step S105.

Next, in step S106, the calculation unit 202 calculates the conversion matrix T based on the above equation (17). Here, the matrix Q is defined by the equation (15) from the coordinates of the three points a', b', and c' obtained in step S105, and the matrix P is derived from the coordinates of the three points a, b, and c obtained in step S102. 14) Definition.

Further, as described in the formula (16), in the present embodiment, since the matrix P is regular, the calculation unit 202 can calculate the inverse matrix P ^-1 in step S106. There are various methods for calculating the inverse matrix, and any method can be employed.

The calculation unit 202 stores the data of the conversion matrix T thus created in the memory device such as a RAM or a hard disk not shown in FIG.

Finally, in step S107, the calculation unit 202 calculates the inverse transformation matrix T' (= T ^-1 ) whose inverse matrix is from the conversion matrix T. The inverse conversion matrix T' is an inverse conversion parameter indicating the inverse conversion of the conversion of the conversion matrix T as a conversion parameter. The calculation unit 202 also stores the data of the inverse conversion matrix T' in the memory device.

Above, the processing of Fig. 5, that is, the calibration is completed. After the end of the calibration, the irradiation of the laser light of the laser oscillator 103 which is adjusted according to the inverse conversion matrix T' is performed. Further, since the inverse conversion matrix T' is calculated from the conversion matrix T, it should be noted that the adjustment according to the inverse conversion matrix T' is also indirectly based on the conversion moment. Adjustment of the array T.

Fig. 6 is a view showing the method of adjusting the first embodiment.

The illumination pattern 310 and the DMD conversion data 320 of Fig. 6 are the same as those of Fig. 3. Further, Fig. 6 is a description using the same conversion matrix T as that of Fig. 3.

In the first embodiment, the calculation unit 202 of Fig. 2 outputs the conversion matrix T and the inverse conversion matrix T' which have been calculated and stored in the memory device to the adjustment unit 203.

Moreover, the adjustment unit 203 receives the illumination pattern 310 from the operation unit 114, and generates the DMD transfer material 320. The adjustment unit 203 further converts the DMD transfer data 320 by the inverse conversion matrix T', generates the DMD transfer data 321, and outputs it to the spatial modulation control unit 204.

Then, the spatial modulation control unit 204 designates the DMD transfer data 321 as an input pattern to the DMD 106, and controls the DMD 106. In other words, the adjustment unit 203 has a function of designating the DMD transfer data 321 as an input pattern to the DMD 106 by the spatial modulation control unit 204.

In the example shown in Fig. 6, as in Fig. 3, the conversion matrix T represents the conversion of the movement of the positive X-axis and the rotation of the inverse clock by about 15 degrees. Therefore, in Fig. 6, the DMD transfer data 321 converted by the inverse conversion matrix T' rotates the pattern of the DMD transfer material 320 by about 15 degrees clockwise and moves to the negative direction of the x-axis.

Here, when the selection unit 206 of FIG. 2 selects the laser oscillator 103 as a light source, the laser beam is emitted from the laser oscillator 103. This laser light is irradiated onto the workpiece 102 by designating the DMD transfer data 321 as the DMD 106 of the input pattern. In the present embodiment, here, the CCD camera 112 shoots The workpiece 102 and the adjustment unit 203 read in the image from the CCD camera 112. The image read in as such is the live image 331 of FIG.

As shown in Fig. 6, the output image appearing in the live image 331 is a pattern equal to the illumination pattern 310 due to the deformation of the inverse conversion matrix T' and the deformation of the transformation matrix T. Further, the "output pattern on the live image 331 is equal to the illumination pattern 310" correctly means "when the error of the difference between the mathematical mode of the equation (3) and the actually generated conversion is equal). In the following description, the term "equal" is used herein unless otherwise specified.

The output pattern of the live image 331 is equal to the illumination pattern 310. The adjustment by the adjustment unit 203 is performed to accurately irradiate the laser light in a shape to be processed at the position to be processed, and the correct illumination is taken as the live image 331.

In addition, comparing the DMD conversion data 320 and 321, it can be seen that the result of the conversion of the inverse conversion matrix T' indicates that the white portion of the micromirror should be turned on in the DMD data 321, exceeding u<0, 640≦u, v. The possibility of a range of <0 or 480≦v. Therefore, in the present embodiment, the DMD 106 having more than the number of pixels (for example, 640 × 640 pixels) indicating the number of pixels of the illumination pattern 310 (for example, 800 × 600 pixels) is used. At this time, as shown in FIG. 3 or FIG. 6, the image of the DMD transfer data 320 indicating the input pattern designated by the DMD 106 is surrounded by the edge of the image indicating the illumination pattern 310 in black (that is, the light is not irradiated). image.

Here, the conversion matrix T indicates the influence of the deformation or offset existing in the laser processing apparatus 100. Such deformation or offset is within the tolerances of the specifications of the laser processing apparatus 100. Thus, the degree of deformation of the transformation matrix T Not quite big. That is, there is no need for a considerable margin. It is also possible to estimate the amount of edges necessary for the experiment and to determine the number of tiny mirrors required for DMD 06 based on the estimated edge.

Next, the second embodiment and the third embodiment will be described with reference to Figs. 7 to 11 . In the second embodiment and the third embodiment, the adjustment method of the irradiation of the laser light after the conversion parameter is adjusted, that is, the operation of the adjustment unit 203 is different from that of the first embodiment. Since there are many adjustment methods for the conversion indicated by the conversion parameter, it is preferable to adopt an appropriate adjustment method according to the embodiment.

Fig. 7 is a view for explaining an example of conversion from an input pattern to an output pattern as a method for explaining the adjustment methods of the second embodiment and the third embodiment. The contents of Fig. 7 are similar to those of Fig. 3. For convenience of explanation, the manner in which the drawings are displayed differs between Fig. 3 and Fig. 7.

Further, in the second embodiment and the third embodiment, as shown in Figs. 8 and 10, the configuration of the control unit 113 is different from the configuration of the second embodiment of the first embodiment. , there is no difference from the second picture.

The image 300 of FIG. 7 is an image captured by the CCD camera 12 in a state where only the illumination light of the illumination light source 111 illuminates the workpiece 102 placed on the stage 101. In the example of Fig. 7, three linear circuit patterns exist on the workpiece 102.

When the image reading unit 201 reads the image 300 and outputs it to the display 115, the operator specifies the processing target range by the operation unit 114. The specified range is the dot rectangle of the image 300.

The spatial modulation control unit 204 receives the designation from the operation unit 114, and accordingly Specify, generate an illumination pattern 311. The image indicating the illumination pattern 311 is white on the image 300 and the other is a black image. Corresponding to the illumination pattern 311, the pattern of the input pattern designated by the DMD 106 is omitted, and the image surrounded by the black edge may represent the periphery of the illumination pattern 311. The spatial modulation control unit 204 also generates an input pattern corresponding to the pair of DMDs 106 of the illumination pattern 311.

When the laser beam spatially modulated by the DMD 106 is irradiated onto the workpiece 102 in accordance with the instruction of the input pattern corresponding to the illumination pattern 311, the CCD camera 112 captures the workpiece 102, and the live image 332 is obtained. In the example of Fig. 7, the range in which the live image 332 actually illuminates the laser light is a rectangular range of dots, which is different from the range to be processed for the image 300.

Comparing the image 300 with the live image 332, the position, direction, and shape of the circuit pattern are the same. However, it can be seen that the laser light is illuminated with a pattern that is different from the input pattern provided by the image 300 and provided to the DMD 106. From the input pattern to the output pattern, the conversion matrix T is used. In Figures 3 and 7, the same "T" text is used, and the specific values of the elements of the conversion matrix T are in Figures 3 and 7. The picture is different. In Fig. 7, for the sake of simplicity, the display conversion matrix T represents a rotation of about 30 degrees from the vicinity of the center of the live image 332.

The above description will be made with reference to Fig. 7, and the second embodiment will be described with reference to Figs. 8 and 9.

Fig. 8 is a functional block diagram showing the function of the control unit 113 of the second embodiment. Compared with the second diagram showing the first embodiment, the eighth diagram has a reading unit 201, a calculation unit 202, an adjustment unit 203, and a spatial modulation control in the control unit 113. The points of the system 204, the platform control unit 205, and the selection unit 206 are the same as those of the second drawing.

The difference between Fig. 8 and Fig. 2 is the flow of data and/or control displayed by arrows. In other words, in the first embodiment and the second embodiment, since the adjustment method is different, the arrow directed to the adjustment unit 203 and the arrow emitted from the adjustment unit 203 are different in FIGS. 2 and 8 . The meaning of the arrow of Fig. 8 is from the reference to Fig. 9, and the adjustment method described below should be understood.

Fig. 9 is a view showing the method of adjusting the second embodiment.

The platform control unit 205 shown in Fig. 8 controls the operation of the stage 101, and the relative position of the optical system of the laser processing apparatus 100 and the stage 101 changes. The type of operation of the executable platform 101 can be different depending on the embodiment. In the second embodiment, the platform control unit 205 controls the operation of the platform 101 of the following types.

(a) movement in the vertical direction (b) parallel movement in a plane horizontal to the vertical axis (c) rotation in a plane horizontal to the vertical axis (d) changing the angle between the upper surface of the platform 101 and the vertical axis Action

In other words, in the second embodiment, a drive motor and/or an actuator (not shown) that can perform these types of operations are attached to the stage 101. The platform control unit 205 controls the drive motor and/or the actuator to operate the stage 101.

Further, in the second embodiment, the workpiece 102 is fixed to the stage 101 by a stopper or the like as needed, and even if the stage 101 is tilted by the operation of the above (d), the workpiece 102 does not slip.

In such a configuration, the calculation unit 202 outputs the calculated data stored in the conversion matrix T of the memory device to the adjustment unit 203. The adjustment unit 203 instructs the platform control unit 205 to control the operation of the platform 101 in accordance with the conversion matrix T. Platform control The system 205 operates the platform 101 in accordance with an instruction from the adjustment unit 203. As a result of this control, the relative position of the optical system of the laser processing apparatus 100 to the workpiece 102 also varies with the conversion matrix T.

At this point of time, the CCD camera 112 captures the workpiece 102 for convenience of explanation. As a result, as shown in FIG. 9, an image 301 equal to the image in which the image 300 is deformed by the conversion matrix T is taken. In Fig. 9, the deformation of the conversion matrix T can be visually recognized from the comparison with the circuit pattern on the workpiece 102 reflected by the images 300 and 301.

On the other hand, similarly to the description of Fig. 7, the illumination pattern 311 is designated in accordance with the image 300. Then, the spatial modulation control unit 204 specifies an input pattern to the DMD 106 in accordance with the specified illumination pattern 311. Then, the selection unit 206 selects the laser oscillator 103 as a light source.

As a result, the laser light irradiated from the laser oscillator 103 is irradiated onto the workpiece 102 by the influence of the offset or deformation indicated by the conversion matrix T. However, unlike the seventh embodiment, in the second embodiment, as shown by the video 301, the workpiece 102 itself is in a state corresponding to the operation of the conversion matrix T at the time of irradiating the laser light. In this way, since both the irradiated light and the workpiece 102 are subjected to the same influence of the conversion matrix T, the influence of the conversion matrix T is offset. That is, as a result of the adjustment, the laser light can be properly irradiated in the designated area.

This is shown below in Figure 9. In a state where the laser light is irradiated, the CCD camera 112 photographs the live image 333 of the workpiece 102, and the range in which the laser light is actually irradiated is displayed as a halftone dot. Moreover, comparing the image 300 and the live image 333, the direction of the lines of the three circuit patterns or the portions of the image that are reflected in the image are different. The relative relationship between the lines of the three circuit patterns and the area of the dots is the same. That is, the laser beam is properly irradiated to the designated area.

As apparent from the above description, in the second embodiment, the processing of step S107 of Fig. 5 can be omitted.

Further, the value of the control parameter required to operate the platform 101 according to the conversion matrix T can be experimentally determined, and can also be calculated from the specifications of the laser processing apparatus 100 or the like.

For example, regarding the operation of the above (a), when the stage 101 is moved 1 mm up or down along the vertical axis, the value of the magnification or reduction ratio of the image captured by the CCD camera 112 may be experimentally investigated in advance. The adjustment unit 203 may calculate the amount of movement in the vertical direction from the value of the pre-investigation based on the value of the enlargement or reduction included in the conversion matrix T, and output the calculated movement amount as the control parameter of the platform 101 to the platform control unit 205. Similarly to the above operations (b) to (d), the adjustment unit 203 can obtain the value of the control parameter.

Further, as apparent from the above description, the adjustment method of the second embodiment is suitable for a case where the mechanical accuracy of the mechanism for moving the stage 101 is high.

Next, an adjustment method of the third embodiment will be described with reference to Figs. 10 and 11 . In the third embodiment, the adjustment unit 203 performs adjustment by image processing.

Fig. 10 is a functional block diagram showing the function of the control unit 113 of the third embodiment. Compared with the second diagram showing the first embodiment, the tenth diagram has the control unit 113 having the reading unit 201, the calculation unit 202, the adjustment unit 203, the spatial modulation control unit 204, the platform control unit 205, and the selection unit 206. Same as Figure 2.

In Fig. 10, the difference from Fig. 2 is the flow of data and/or control displayed by arrows. That is, in the first embodiment and the third embodiment, Since the adjustment method is different, the arrow toward the adjustment unit 203 and the arrow emitted from the adjustment unit 203 are different in FIGS. 2 and 10 .

Further, in Fig. 2, in order to designate an illumination pattern, an arrow indicating that the video read from the CCD camera 112 is output to the display 115 from the reading unit 201 to the display 115 is shown, and there is no arrow in the tenth figure. As described below, in the third embodiment, this is because the adjustment is made at the stage of designation of the illumination pattern. The meaning of the other arrows should also be understood from the adjustment method described below with reference to Figure 11.

Fig. 11 is a view showing the method of adjusting the third embodiment.

In Fig. 11, the image 302 is captured by the CCD camera 112, and the image read by the reading unit 201 from the CCD camera 112. The lines of the three circuit patterns identical to the image 300 of FIGS. 7 and 10 are also reflected in the image 302.

In the adjustment of the third embodiment, first, the calculation unit 202 outputs the calculated data stored in the inverse conversion matrix T' of the memory device to the adjustment unit 203. Then, the adjustment unit 203 performs image processing for deforming the image 302 by the inverse conversion matrix T' to generate the image 303, and outputs the image 303 to the display 115.

Similarly to Fig. 7, in Fig. 11, the conversion matrix T represents a rotation of about 30 degrees against the clock. Thus, in the image 303, the lines of the three circuit patterns are compared with the image 302, and are tilted by about 30 degrees clockwise.

The operator views the image 303 displayed on the display 115, and the operation portion 114 specifies the area where the laser light is to be irradiated. In the image 304 of Fig. 11, the designated area is displayed as a halftone dot. The spatial modulation control unit 204 receives the designation from the operation unit 114, and generates an illumination pattern 312 according to the designation. The illumination pattern 312 corresponds to the dot area of the image 304.

The spatial modulation control unit 204 further generates an input pattern designated for the DMD 106 in accordance with the illumination pattern 312. The spatial modulation control unit 204 specifies an input pattern to the DMD 106. Further, the selection unit 206 selects the laser oscillator 103 as a light source.

As a result, the laser light irradiated from the laser oscillator 103 is irradiated onto the workpiece 102 by the influence of the offset or deformation indicated by the conversion matrix T. However, the illumination pattern 312, which is based on the image 304 of the inverse transformation matrix T' deformation, is irradiated with laser light. When the illumination is affected by the transformation matrix T, the influence of the inverse transformation matrix T' and the influence of the transformation matrix T are offset. pin. That is, as a result of the adjustment, the laser beam can be properly irradiated to the designated region.

This is shown in the following figure in Fig. 11. In a state where the laser light is irradiated, the CCD camera 112 photographs the image 334 of the workpiece 102, and the range in which the laser light is actually irradiated is displayed as a halftone dot. Moreover, comparing the image 304 and the live image 334, the direction of the lines of the three circuit patterns is different from that of the image, and the relative relationship between the lines of the three circuit patterns and the area of the dots is the same. That is, the laser beam is properly irradiated to the designated area.

As described above, in the second and third embodiments, the case where the transformation matrix T is displayed as a relatively simple deformation is described as an example, and the deformation of the transformation matrix T may be complicated by including parallel movement, rotation, shear strain, amplification, and reduction. Deformation.

Next, the fourth to sixth embodiments will be described. The mathematical mode of the transition from the input pattern to the output pattern in the fourth to sixth embodiments is different from that in the first embodiment except that the operation of the control unit 113 differs depending on the mathematical mode. Which mathematical mode is employed is a characteristic or degree of deformation or offset of the actual laser processing apparatus 100.

In the fourth embodiment, a mathematical mode in which only parallel movement (displacement) and rotation are considered is employed. The calibration pattern of the fourth embodiment may be represented by two points a and b which are different from each other. For example, in the fourth embodiment, the pattern formed by two circles having different diameters may be used instead of the calibration pattern 340 of Fig. 4.

Similarly to the first embodiment, the coordinates of the point a are represented by _a column vector composed of (x _a , y _a ) ^T , and the coordinates of the point b are represented by a column vector composed of (x _b , y _b ) ^T , point a The 'coordinate' is represented by _a column vector composed of (x _a ', y _a ') ^T , and the coordinates of the point b' are represented by a column vector composed of (x _b ', y _b ') ^T . In the fourth embodiment, the calculation unit 202 calculates the amount of parallel movement in the x direction from the four coordinates: d ₁ = x _a '-x _a (18)

Parallel movement amount in the y direction: d ₂ = y _a '-y _a (19)

The amount of rotation: θ=tan ^-1 {(y _b '-y _a ')/(x _b '-x _a ')}-tan ^-1 {(y _b -y _a )/(x _b -x _a ) } (20)

3 conversion parameters. Similarly to the first embodiment, these conversion parameters can be expressed in the form of the conversion matrix T of the equation (2). That is, a ₁ = cos θ (21) b ₁ = - sin θ (22) a ₂ = sin θ (23) b ₂ = cos θ (24) and equation (2) may be substituted. In this way, the operation of the laser processing apparatus 100 after the calculation unit 202 calculates the conversion matrix T is the same as that of the first embodiment.

In the fifth embodiment, mathematics considering only parallel movement (displacement) is employed. mode. The calibration pattern of the fifth embodiment may be represented by only one dot. For example, in the fifth embodiment, the calibration pattern 340 of Fig. 4 can be replaced with a pattern composed of one circle.

Similarly to the first embodiment, the coordinates of the point a are represented by _a column vector composed of (x _a , y _a ) ^T , and the coordinates of the point a' are represented by a column vector composed of (x _a ', y _a ') ^T . In the fifth embodiment, the calculation unit 202 calculates the parallel movement amount d ₁ and the y direction parallel in the x direction from the two coordinates, similarly to the fourth embodiment, by the equations (18) and (19). Two conversion parameters of the amount of movement d ₂ . These conversion parameters can also be expressed in the form of the conversion matrix T of the equation (2) as in the first embodiment. That is, A ₁ =1 (25) B ₁ =0 (26) A ₂ =0 (27) B ₁ =1 (28)

And formula (2) can be substituted. In this way, the operation of the laser processing apparatus 100 after the calculation unit 202 calculates the conversion line T is the same as that of the first embodiment.

In the sixth embodiment, virtual affine transformation is employed as the mathematical mode. In virtual affine transformation, trapezoidal deformation is also considered in addition to parallelogram deformation (shear strain) considered in affine transformation. In the sixth embodiment, a calibration pattern indicating four points a, b, c, and d which can be distinguished from each other is used. For example, in the sixth embodiment, the calibration pattern 340 of Fig. 4 can be replaced with a pattern composed of four circles having different diameters.

Similarly to the first embodiment, the coordinates of the point a are represented by _a column vector composed of (x _a , y _a ) ^T , and the coordinates of the point b are represented by a column vector composed of (x _b , y _b ) ^T , point c The coordinates are represented by a column vector consisting of (x _c , y _c ) ^T , the coordinates of point a' are represented by a vector of (x _a ', y _a ') ^T , and the coordinates of point b' are represented by (x _b ', y _b ') T constitutes a column vector indicating that the coordinates of point c' are represented by a column vector consisting of (x _c ', y _c ') ^T . Similarly, the coordinates of the point d are represented by a column vector composed of (x _d , y _d ) ^T , and the coordinates of the point d′ are represented by a column vector composed of (x _d ', y _d ') ^T .

The virtual affine transformation is modeled by equation (29).

The conversion matrix T is defined as in the equation (30).

Further, similarly to the first embodiment, the coordinates of the points a, b, c, d and the points a', b', c', and d' can be used to define the matrix P as in the equations (31) and (32). And Q.

Here, from the equation (29), the relationship between the four points a, b, c, d and the four points a', b', c', and d' can be expressed by the following formula (33).

TP=Q (33)

When the positions of the four points a, b, c, and d are appropriately selected, the matrix P is regular, and the inverse matrix P ^-1 exists, so that the equation (34) can be obtained from the equation (33).

T=QP ^-1 (34)

Therefore, the calculation unit 202 calculates the conversion matrix T from the equation (34). Further, the calculation unit 202 calculates the inverse transformation matrix T' from the conversion matrix T.

Further, as described in the first to sixth embodiments, there are various mathematical modes for converting the input pattern to the output pattern. In the above, an example has been described in which the number of points necessary for calculating the minimum conversion parameter of the mathematical mode to be used is represented by a calibration pattern.

However, it is fine to use a calibration pattern that indicates more points. For example, similarly to the first to third embodiments, in the mathematical mode, when the affine transformation is performed, a calibration pattern indicating m points which are mutually distinguishable from each other may be used. In this case, each i of 1≦i≦m is provided as in the equation (35), and the calculation unit calculates a ₁ , b ₁ , and d ₁ of the requirements of the conversion matrix T of the equation (2) by the least square method. The values of a ₂ , b ₂ , and d _{2 are} also acceptable.

(x _i ',y _i ',1) ^T =T(x _i ,y _i ,1) ^T (35)

Further, here, (x _i , y _i ) ^T is a column vector indicating the coordinates of the i-th point indicated by the graph, and (x _i ', y _i ') ^T is a coordinate column representing the output pattern of the i-th point. vector.

Next, a seventh embodiment will be described with reference to Figs. 12 and 13. According to the seventh embodiment, even if the surface of the workpiece 102 has irregularities, the accuracy of the calibration is not deteriorated.

Generally, when the surface of the workpiece 102 has a three-dimensional shape, that is, a concavity and convexity, the accuracy of the calibration is lowered. This is because the shape of the output pattern corresponding to the calibration pattern is affected by the unevenness or the inverse of the surface material. The possibility of deformation due to the influence of the rate of radiation.

For example, when the calibration pattern 340 of FIG. 4 is used, there is occasionally a case where the outline of the circle of the point a traverses the uneven portion on the workpiece 102. At this time, in the output graph, the shape of the point a is deformed.

Therefore, the calculation unit 202 calculates the coordinates of the center of gravity of the deformed shape, which is the position corresponding to the point a' of the point a, and obviously includes an error. There are also cases where the amount of error is a few pixels. At this time, since the conversion matrix T is calculated based on the coordinates including the error, the accuracy of the calibration is lowered. As a result, it is difficult to adjust with high precision.

For example, when the workpiece 102 is an FPD substrate or a laminated printed substrate, a circuit pattern having a three-dimensional shape is formed on the workpiece 102. The circuit pattern becomes an obstacle that deforms the shape when the calibration pattern is illuminated. Therefore, there is a case where the accuracy of the calibration is lowered depending on the position of the illumination pattern.

In order to avoid this problem, the calibration is performed with good precision, and it is also possible to calibrate the blank area of the substrate outer edge portion of the substrate on which the circuit pattern is not formed or the circuit pattern is not formed. However, as will be described later in detail, it is also required to perform calibration using the area of the object to be processed of the actual workpiece 102. According to the seventh embodiment, at this time, the accuracy of the calibration can be prevented from being lowered.

Fig. 12 is an example of an image captured when a calibration pattern is irradiated in the seventh embodiment. The image 306 of FIG. 12 is an image captured by the CCD camera 112 when the calibration pattern is illuminated on the substrate 401 of the workpiece 102. The three-dimensional shape circuit pattern 402 formed on the substrate 401 is reflected on the image 306, and the circles 403, 404, and 405 constituting the output pattern corresponding to the calibration pattern are formed. In the image 306, since none of the circles 403, 404, and 405 overlaps with the circuit pattern 402, the shape is not Great deformation.

When the flat portion having a small unevenness is referred to as a "background portion" on the surface of the workpiece 102, a portion where the circuit pattern 402 is not formed in the substrate 401 is a background portion. The control unit 113 controls the image to be irradiated to the background portion, and even if the surface of the workpiece 102 has irregularities, the accuracy of the calibration can be prevented from being lowered.

Fig. 13 is a functional block diagram showing the function of the control unit 113 of the seventh embodiment. Fig. 13 is different from Fig. 2 in that the creation unit 207 is added. The forming unit 207 creates a calibration pattern to avoid the unevenness so that the light is irradiated onto the background portion of the workpiece 102. Therefore, in the seventh embodiment, the preparatory calibration and the preparatory adjustment are performed. Hereinafter, a pattern designated as an input pattern in the preliminary calibration is referred to as a "pre-calibration pattern".

Hereinafter, the operation of the laser processing apparatus 100 according to the seventh embodiment will be described in comparison with the first embodiment.

First, the preparation unit 207 selects the appropriate three points a to c to create a preliminary calibration pattern that can distinguish the shapes of the points a to c. Here, the coordinates of the points a to c are respectively represented by column vectors composed of (x _a , y _a ) ^T , (x _b , y _b ) ^T , and (x _c , y _c ) ^T . Then, perform a preliminary calibration using this preliminary calibration pattern.

That is, the selection unit 206 selects the LED light source 116 as the light source, and the preparation unit 207 outputs the preliminary calibration pattern to the spatial modulation control unit 204, and the spatial modulation control unit 204 specifies the preliminary calibration pattern as the input pattern for the DMD 106. Thereby, the irradiation of the LED light according to the preliminary calibration pattern is performed.

Then, the CCD camera 112 captures the workpiece 102 irradiated with the LED light, and the reading unit 201 reads the image.

The calculation unit 202 calculates the coordinates corresponding to the points a', b', and c' of the points a, b, and c, respectively, on the output pattern generated on the image corresponding to the preliminary calibration pattern. The calculated coordinates are represented by _a column vector of (x _a ', x _b ') ^T , (x _b ', y _b ') ^T , (x _c ', y _c ') ^T , respectively. The coordinates of the three points a, b, and c of the preliminary calibration pattern are output from the preparation unit 207 to the calculation unit 202.

Here, in the method of calculating the conversion matrix T in the first embodiment, the calculation unit 202 depends on (x _a , x _b ) ^T , ( x _b , y _b ) ^T , ( x _c , y _c ) ^T and (x) ^. _a ', x _b ') ^T , (x _b ', y _b ') ^T , (x _c ', y _c ') ^T , and the transformation matrix T _{1 is} calculated. Further, the calculation unit 202 outputs the conversion matrix T ₁ to the creation unit 207.

Transform matrix generating unit 207 calculates an inverse of _a transformation matrix T T ₁ '= T ₁ ^-1. Alternatively, the calculation unit 202 may calculate the inverse conversion matrix T ₁ ' and output it to the creation unit 207.

The above processing is a preliminary calibration. In the calibration preparation of in, as described above, due to the influence by unevenness of on the workpiece 102, also includes point error of the calculated can not ignore the extent of a ', b', c 'of the coordinates transformation matrix T ₁ and inverse transformation matrix The situation of T ₁ '. However, since the conversion matrix T1 is not too different from the conversion matrix that should be finally obtained, it is very effective for the adjustment for preparation.

Then, only the illumination light source 111 is illuminated, and the CCD camera 112 can image the workpiece 102 in a state where the laser light or the LED light is not irradiated. The reading unit 201 reads the captured image (hereinafter referred to as "background detection image"), and the creation unit 207 performs background detection processing using the background detection image.

The background detection processing detects the area of the background portion (hereinafter referred to as "background area") on the workpiece 102 in the background detection image.

For example, the creating unit 207 adds a blur filter to the background image, and takes It is possible to eliminate the background image of the image of the unevenness (for example, circuit pattern) on the workpiece 102 of the image for background detection. Then, the creating unit 207 calculates the difference between the pixel value of the background detection image and the pixel value of the background image for each pixel.

In the background region, the absolute value of the difference is small, and in the region of the unevenness on the workpiece 102 (hereinafter referred to as "non-background region"), the absolute value of the difference is large. Therefore, the creating unit 2074 detects that the absolute value of the difference is smaller than the predetermined threshold value as the background area.

In order to detect the background area, in addition to the above method, various image processing methods such as edge detection or feature point selection can be used.

Furthermore, the preparation unit selects the appropriate three points d1, e1, and f1 of the detected background area. The coordinates of the three points d1, e1, and f1 are respectively represented by column vectors composed of (x _d1 , y _d1 ) ^T , (x _e1 , y _e1 ) ^{T ,} and (x _f1 , y _f1 ) ^T .

Further, here, the three points d1, e1, and f1 should select a point in the background area that is located far from the non-background area. This is because the calibration pattern in which the light is not irradiated onto the unevenness on the workpiece 102 is easily formed.

The constructing unit 207 then converts the coordinates of d1, e1, and f1 using the inverse transform matrix T ₁ ', respectively. The three points represented by the converted coordinates are called d, e, and f. In the first embodiment, the adjustment unit 203 converts the DMD transfer data 320 of Fig. 6 by the inverse conversion matrix T' to obtain the analogy of the processing of the DMD transfer data 321, and it is understood that the inverse conversion matrix T ₁ ' is used. The process of obtaining the coordinates of the three points d, e, and f is a preliminary adjustment.

The preparation unit 207 creates a calibration pattern that can distinguish three points d, e, and f from each other by the coordinates of the three points d, e, and f which are prepared for adjustment, and outputs the calibration pattern to the calculation unit 202. The three points d, e, and f are represented by columns consisting of (x _d , y _d ) ^T , (x _e , y _e ) ^T , and (x _f , y _f ) ^T , respectively. The graphic is a graphic representing the three coordinates.

Further, in the calibration pattern of the seventh embodiment, the range of the actual illumination light is set to be included in the background portion as much as possible, that is, the light is not irradiated to the outside of the background portion as much as possible.

For example, as shown in the calibration pattern 340 of FIG. 4, when three points d, e, and f are represented by three circles having mutually different diameters, when a circle having an unnecessary diameter is used, light is irradiated to be processed. The situation of the three-dimensional shape on the object 102.

That is, when the image of the workpiece 102 in this state is captured, there is a case where the range of the actual illumination light overlaps with the non-background area. Therefore, when a calibration pattern composed of three circles having mutually different diameters is used, the forming portion 207 should set the diameters of the three circles in accordance with the shape and position of the background region.

When the calibration pattern 341 or 342 of FIG. 4 or another type of calibration pattern is used, the preparation unit 207 similarly creates a calibration pattern so that the range of the actual illumination light is included in the background portion as much as possible.

For example, the creating unit 207 can also create a tentative pattern for displaying the three points d1, e1, and f1, and create a calibration pattern according to the tentative pattern.

For example, the creating unit 207 creates a tentative pattern such that the portion displaying the illumination light is completely contained in the background area. Further, the tentative pattern is formed in the forming portion 207 to define the shape and position such that the distance from the non-background region where the illumination light is displayed is as large as possible above the threshold.

As mentioned above, the conversion matrix T ₁ or the inverse transformation matrix T ₁ ' may contain errors, but it is not too different from the conversion matrix that should ultimately be obtained. Therefore, when the value of the threshold value is appropriate, when the pattern obtained by converting the tentative pattern by the inverse conversion matrix T ₁ ' is used as an input pattern, it is actually expected that only the background portion is irradiated with light. Therefore, it is appropriate to use a pattern obtained by converting the tentative pattern by the inverse conversion matrix T ₁ ' as a calibration pattern. Appropriate thresholds can be experimentally determined.

Also, there is a case where the shape of the tentative pattern is not maintained in the calibration pattern. At this time, when the point d1 is indicated by the center of gravity of the circle, the point d is represented by a non-circular shape in the calibration pattern, and there is a case where the coordinate of the point d is calculated from the output pattern. However, if the point d1 is represented by a midpoint of one short line segment, the point e1 is represented by the intersection of two short line segments, and the point f1 is represented by the intersection of three short line segments, even if the shape of the tentative figure is not maintained in the calibration pattern. There is no problem.

In any case, the preparation unit 207 uses the inverse conversion matrix T ₁ ' to illuminate the background portion as much as possible, and defines the three points d1, e1, and f1 to which the background region belongs, and defines the three points d, e, and f. Calibrate the graph. The processing after the calibration pattern is created, that is, the calibration and adjustment are the same as in the first embodiment.

That is, the selection unit 206 selects the LED light source 116 as the light source, and the spatial modulation control unit 204 controls the DMD 106 in accordance with the calibration pattern, whereby the LED light is irradiated to the workpiece 102 in accordance with the calibration pattern. Then, the CCD camera 112 captures the workpiece 102 that irradiates the LED light, and the reading unit 201 reads the image.

When the calibration pattern created as described above is irradiated, as shown in Fig. 12, in the read image, it is expected that the portion of the illumination light is included in the background region. That is, the calibration pattern created as described above can be expected to prevent the accuracy of the calibration from being lowered.

The calculation unit 202 calculates the coordinates (x _d ', y _d corresponding to the three points d', e', and f' of the points d, e, and f, respectively, from the output pattern generated on the read image corresponding to the calibration pattern. ') ^T , (x _e ', y _e ') ^T , (x _f ', y _f ') ^T . Further, the calculation unit 202 calculates the transformation matrix T ₂ and the inverse transformation matrix T for its inverse matrix, from the coordinates of the points d, e, and f and the coordinates of the points d', e', and f', as in the first embodiment. ₂ '=T ₂ ^-1 . ₂ by the conversion matrix T is calculated, and an inverse transformation matrix T ₂ ', the end of calibration.

Thereafter, using the inverse conversion matrix T ₂ ', the adjustment unit 203 performs the same adjustment as in the first embodiment.

In the first to seventh embodiments described above, the LED light different from the processing laser light is used for calibration. The reason for this is that the irradiation of the light for calibration does not affect the workpiece 102.

Therefore, the laser light can be made weak so that the workpiece 102 is not affected even if it is irradiated, and as long as the laser light is light of a wavelength that can be captured by the CCD camera 112, in other embodiments, the laser light can be used for calibration. At this time, in the first figure, the LED light source 116 and the half mirror 104 are not required.

However, due to the nature of the laser light or the workpiece 102, there is also a case where it is impossible to calibrate the use of laser light or is not suitable for calibration using laser light.

Therefore, the influence of the light used for calibration and the light used for processing on different lights from different light sources is examined. In fact, the first to seventh embodiments are not mentioned before, and when the premise is not established. There is a margin for more precise calibration.

It is not mentioned before that in the first diagram, the laser light penetrates the half mirror 104, the optical axis of the laser light incident on the mirror 105 and the LED light are reflected by the half mirror 104, and the LED is incident on the mirror 105. The assumption that the optical axis of light is consistent. Or, even if the two are not completely consistent, it is only an assumption that the degree of deviation can be ignored without problems.

However, the assumptions not mentioned here are not necessarily established. Therefore, in the eighth embodiment, when this assumption is not established, in the first figure, The light source optical system formed by the laser oscillator 103, the half mirror 104, the mirror 105, and the LED light source 116, the deformation of the output pattern is also the object of calibration, and the calibration can be more refined.

Fig. 14 is a functional block diagram showing the function of the control unit 113 of the eighth embodiment. The fourteenth figure differs from the second figure in that the second calculation unit 208 is added. The second calculation unit 208 performs calibration relating to the shift of the optical axes of the LED light and the laser light.

In the eighth embodiment, the following mathematical mode is employed.

‧ Conversion from the input pattern to the output pattern in the state in which the LED light source 116 is selected as the light source is converted to affine transformation.

‧ This conversion is represented by the transformation matrix T of equation (2).

In the state in which the LED light source 116 is selected as the light source, the second output pattern corresponding to the same input pattern is shifted in the state corresponding to the first output pattern of the input pattern and the state in which the laser oscillator 103 is selected as the light source. This offset is also patterned in affine transformation.

‧ The offset parameter indicating the offset of the first and second output patterns is represented by the conversion matrix R shown by the equation (36) in the same form as the conversion matrix T. That is, the first output pattern is converted into the second output pattern by the conversion matrix R.

‧When any adjustment is made, in the input graph, when the coordinates (x, y) ^{T are at} the point of selecting the laser oscillator 103 as the light source, the output pattern is shifted to the coordinates (x", y") ^T . The relationship between these two coordinates is equation (37).

According to the mathematical mode described above, in the eighth embodiment, the first calibration for obtaining the transformation matrix T and the inverse transformation matrix T', the second calibration for obtaining the transformation matrix R and the inverse transformation matrix R'=R ^-1 , and the use inverse are performed. Adjustment of the transformation matrix T' and the inverse transformation matrix R'.

The first calibration for obtaining the conversion matrix T and the inverse conversion matrix T' is completely the same as that of the first embodiment.

The second calibration for obtaining the conversion matrix R and the inverse transformation matrix R'=R ^-1 is performed as follows. First, the second calculating unit 208 selects the appropriate three points a, b, and c, and creates a calibration pattern that can distinguish three points a, b, and c from each other. This calibration pattern can also be the same as in the example of Fig. 4. Hereinafter, in order to distinguish the calibration pattern of the second calibration from the calibration pattern of the first calibration, it is referred to as a "test pattern".

The coordinates of the three points a, b, and c are represented by _a column vector composed of (x _a , x _b ) ^T , (x _b , y _b ) ^T , (x _c , y _c ) ^T .

The second calculation unit 208 outputs the test pattern to the spatial modulation control unit 204. Then, the sample similar to the workpiece 102 to be processed is placed on the stage 101, and the spatial modulation control unit 204 controls the DMD 106 to perform irradiation of LED light and laser light according to the test pattern. The switching of the light source is performed by the selection unit 206. In addition, the order of irradiation is arbitrary.

The selection unit 206 selects the LED light source 116 as a light source, and when the sample is irradiated with the LED light, the CCD camera 112 captures the sample, and the reading unit 201 reads the captured image. In the output pattern corresponding to the test pattern and generated by the image, the points corresponding to the points a, b, and c are referred to as a', b', c', and the three points a', b', c' are The coordinates are represented by column vectors consisting of (x _a ', x _b ') ^T , (x _b ', y _b ') ^T , and (x _c ', y _c ') ^T , respectively.

Further, the selection unit 206 selects the laser oscillator 103 as a light source, and when the laser beam is irradiated to the sample, the CCD camera 112 captures the sample, and the reading unit 201 reads the captured image. In the output pattern corresponding to the test pattern and generated by the image, the points corresponding to the points a, b, and c are referred to as a", b", c", and the three points a", b", c" are The coordinates are represented by column vectors consisting of (x _a ′, x _b ”) ^T , (x _b ′, y _b ”) ^T , (x _c ′, y _c ”) ^T , respectively.

In the first embodiment, the calculation unit 202 calculates the same conversion matrix T from the matrix P and the matrix Q, and the second calculation unit 208 derives coordinates from the three points a', b', and c' according to the equation (37). The coordinates of the three points a", b", and c" are used to calculate the conversion matrix R. Further, the second calculation unit 208 calculates the inverse conversion matrix R' from the conversion matrix R. By the above, the second calibration is completed.

In the adjustment of the eighth embodiment, similarly to the first embodiment, the adjustment unit 203 converts the DMD conversion data, and the spatial modulation control unit 204 uses the converted DMD transfer data as an input pattern to control the DMD 106.

In the first embodiment, the adjustment unit 203 performs conversion using the inverse conversion matrix T'. In the eighth embodiment, the matrix (T'R') which uses the product of the inverse conversion matrix T' and the inverse conversion matrix R' is used. Conversion. By this conversion, the correct irradiation of the desired portion of the laser light can be carried out as follows.

Similarly to the first embodiment, the point p of the coordinates (x _p1 , y _p1 ) ^T from the operation unit 114 in the illumination pattern designated by the operator is included in the portion to be irradiated with light. As a result of the adjustment by the adjustment unit 203, the point p is shifted to the coordinate (x _p2 , y _p2 ) ^T represented by the equation (38) in the input pattern instructed by the spatial modulation control unit 204 to the DMD 106.

_{(x p2, y p2, 1} ) T = R '(x p1, y p1, 1) T (38)

Here, when the laser oscillator 103 is selected as the light source, the coordinates of the points on the output pattern corresponding to the coordinates (x _p2 , y _p2 ) ^T of the input pattern are (x _p3 , y _p3 ) ^T . In this way, the equation (39) can be derived from the equations (37) and (38).

(x _p3 , y _p3 , 1) ^T =RT(x _p2 ,y _p2 ,1) ^T =RTT'R'(x _p1 ,y _p1 ,1) ^T =(x _p1 ,y _p1 ,1) ^T (39 )

That is, as a result of the adjustment by the adjustment unit 203, when the laser beam is irradiated, the coordinates of the coordinates designated by the illumination pattern coincide with the coordinates on the output pattern indicating the position at which the laser light is actually irradiated, and the laser light is correctly irradiated to the desired position.

Next, a ninth embodiment will be described. The ninth embodiment is an example in which the present invention is applied to a projector using a spatial modulation element. The present invention can be applied to a projector in which a light source for projection is spatially modulated by a spatial modulation element such as a DMD, and a character, a symbol, a picture, an image, or the like is projected onto a wall or a screen projector (illumination optical system) to adjust the projection of the light.

Due to the influence of the offset or deformation of the optical system or the screen, the light is not projected to the designated position in the specified shape, and the projected image is moved, rotated, enlarged, reduced, deformed, and the like. Therefore, in the ninth embodiment, the projector includes an imaging unit that captures a screen and a control unit. The imaging unit is a CCD camera. The control unit has the same function as the reading unit 201, the calculation unit 202, the adjustment unit 203, and the spatial modulation control unit 204 of Fig. 2 .

According to the projector having such a configuration, similarly to the above-described respective embodiments, it is possible to perform calibration and adjust the projection according to the result of the calibration. In addition, due to In the ninth embodiment, the term "projection" is used for the projector, and in the present specification, the "projection" of the ninth embodiment is the same as the "irradiation" of the first to eighth embodiments. .

Further, the present invention is not limited to the above embodiment, and various modifications are possible. A few examples are described below.

The physical structure of the laser processing apparatus 100 is not limited to the one illustrated in the first drawing. For example, it is also possible to use a transmissive spatial modulation element using a liquid crystal instead of the DMD 106 of the reflective spatial modulation element. In other words, the first light that is to be adjusted and the second light to be used for obtaining the adjustment are spatially modulated by the spatial modulation element, and are irradiated onto the workpiece 102 to capture the structure of the workpiece 102. The specific structure of the laser processing apparatus 100 may be different depending on the embodiment. Further, the first light and the second light may be different or may be the same.

Further, in each of the units shown in Fig. 2, only the spatial modulation control unit 204, the platform control unit 205, and the selection unit 206 are packaged in the control unit 113 of the laser processing apparatus 100 of Fig. 1, and the second picture is read. The entrance unit 201, the calculation unit 202, and the adjustment unit 203 can also be realized by a computer external to the laser processing apparatus 100.

The adjustment method is also not limited to the above illustration. For example, in the second embodiment, the platform control unit 205 performs adjustment for operating the platform 101 in response to an instruction from the adjustment unit 203. In another embodiment, the adjustment may be made by changing the position or angle of the DMD 106 instead of the platform 101.

That is, the actuator for changing the angle or position is attached to the DMD 106, and the configuration of the second diagram is changed to the spatial modulation control unit 204. In addition to the designation of the input pattern, the actuator is also controlled. At this time, the adjustment unit 203 can also instruct the spatial modulation control unit 204 in accordance with the inverse conversion matrix T'. In order to operate the DMD 106, the adjustment is made. By the action of the DMD 106, the position of the laser light moves in parallel (displacement), or rotates around a certain point, and the size or shape of the illuminated area changes.

The plural embodiments described above may be arbitrarily combined as long as they do not contradict each other. For example, three or more embodiments may be combined as follows.

. In the seventh embodiment in which the calibration pattern for avoiding the unevenness on the workpiece 102 is formed, The second calculation unit similar to the eighth embodiment, which is the object of calibration, is added to the offset between the laser light and the optical axis of the LED. The affine transformation of the sixth embodiment is adopted as the mathematical mode. In the mathematical mode, the second calculating unit 208 calculates a conversion matrix R and an inverse conversion matrix R' for taking into account the shift of the optical axes of the laser light and the LED light in a manner similar to that of the eighth embodiment. Similarly to the third embodiment, the adjustment unit 203 performs adjustment using the image distortion of the designated illumination pattern instead of adjusting the DMD transfer data supplied to the spatial modulation control unit 204.

Moreover, the time for performing calibration varies depending on the embodiment. Therefore, in the description of each of the above embodiments, the timing of the adjustment is not particularly mentioned except for the order in which the adjustment is performed after the calibration.

As an example of the first embodiment, when the laser processing apparatus 100 is used for the first time, only one calibration is performed, and thereafter, the irradiation of the laser light may be adjusted by the same inverse conversion matrix T'. Alternatively, the calibration may be performed periodically in response to changes in the time of the laser processing apparatus 100.

Further, one workpiece 102 can be calibrated once. Of course with a laser When the processing apparatus 100 processes a plurality of workpieces 102, it is also possible to calibrate each of the processed objects.

For example, when the workpiece 102 is a large FPD substrate and the platform 101 is a floating platform using pneumatic casters, the workpiece 102 is bent. At this time, the distance between the workpiece 102 and the optical system (objective lens 110) of the laser processing apparatus 100 is different depending on the position of the object to be processed on the FPD substrate due to the influence of the bending.

The variation of the distance between the workpiece 102 and the optical system is slight, and the magnitude of the magnification or offset of the light irradiated by the DMD 106 changes depending on the distance. Therefore, it is also required to calibrate each object to be processed when the high precision adjustment of the influence of such slight variations is also considered.

Further, the relationship between the region on the workpiece 102 that illuminates the calibration pattern and the region on the workpiece 102 that irradiates the illumination pattern adjusted by the processing may be various depending on the embodiment.

The case where the workpiece 102 is a substrate will be described as an example. First, when performing calibration only once or periodically, it is preferable to perform calibration using any substrate of the same kind as the substrate to be processed.

When one substrate is calibrated once, if the end of the substrate has an edge, the edge can also be used for calibration. That is, the control unit 113 may also control the laser processing apparatus 100 to move the stage 101 to a position where the edge of the LED light is irradiated, and then perform calibration, and then irradiate the laser light adjusted according to the result of the calibration.

Alternatively, when one or more substrates are calibrated once, the control unit may control the laser processing apparatus 100 to move the stage 101 to a position where the laser beam is irradiated to the object to be processed, and then calibrate. At this time, in order not to be added The work object 102 is affected by the calibration, and it is suitable to calibrate the use of the LED light different from the processing laser light or to reduce the output of the laser light.

In addition to the above, the present invention may be embodied in various examples. For example, the procedure of the processing shown in the flowchart of FIG. 5 can be changed into various examples.

For example, the processing of step S102 and the processing of steps S103 to S105 can be performed independently and independently. Therefore, the processing of step S102 may be performed, and the processing of steps S103 to S105 may be performed simultaneously, or the processing may be performed in the order of steps S103, S104, S105, and S102.

Also, the same calibration pattern can be used in multiple calibrations. At this time, the calculation unit 202 may store the calibration pattern in the memory device when the calibration pattern is created in step S101 of the first calibration. In step S101 of the calibration after the second time, the calculation unit 202 can also read the calibration pattern from the memory device.

Moreover, the calibration pattern is created by the coordinates of the three points a, b, and c which are predetermined. Therefore, the coordinates of the three points a, b, and c may not be reacquired in step S102, and step S102 may be omitted. In other words, when the calculation unit 202 creates the calibration pattern, it also stores the coordinates of the three points a, b, and c in the memory device, and reads the coordinates of the three points from the memory device in step S106.

Further, as in the second embodiment, in the embodiment in which the inverse conversion matrix T is not used, the final step S107 is not required.

The various embodiments have been described above, and the effects common to the above embodiments are as follows.

Use a spatial modulation component such as DMD106, according to any calibration chart The light is irradiated onto the workpiece 102. That is, the position of the complex point is represented by one calibration pattern, and the calibration can be performed efficiently at one time.

Moreover, it is not necessary to perform mechanical movement and illumination of the optical system or the platform 101 by calibration. Therefore, calibration can be performed by eliminating the influence of errors included in the operation of the actuator for mechanically moving the physical configuration of the optical system.

Since the shape of the calibration pattern is arbitrary, it is easy to obtain a calibration pattern of an appropriate shape depending on the nature of the workpiece 102 used for calibration. Here, the "properties of the workpiece 102" are various properties such as a three-dimensional shape or a material. Moreover, in order to obtain a calibration pattern of an appropriate shape, an appropriate calibration pattern may be selected from a plurality of calibration patterns prepared in advance, or an appropriate calibration pattern may be created on the spot.

For example, as described in the seventh embodiment, when the three-dimensional structure in which the shape of the calibration pattern is deformed in the region on the workpiece 102 to be irradiated with light is calibrated, it is preferable not to use the calibration pattern. At this time, it is preferable to use other calibration patterns that illuminate the structure and illuminate the light.

As in the seventh embodiment, even if no information is given in advance, the creating unit 207 can create a calibration pattern of an appropriate shape on the spot according to the image captured by the CCD camera 112 to avoid the three-dimensional structure on the workpiece 102.

Further, the seventh embodiment may be modified to perform preliminary calibration only when necessary, instead of performing preliminary calibration. For example, in the calibration, the calculation unit 202 may detect the deformation of the output pattern which is considered to be due to the unevenness on the surface of the workpiece 102, and set the calibration pattern according to the seventh embodiment only when the deformation is detected.

Alternatively, in the embodiment other than the seventh embodiment, the calculation unit 202 also The design information of the workpiece 102 can be obtained in advance, and the range of the background portion can be selected from the design data to generate a pattern of the illumination light to the background portion. In any case, since the calibration pattern is arbitrary, the preparation unit 207 or the calculation unit 207 can easily find an appropriate calibration pattern.

Further, when a plurality of substances having different light reflectances are formed into the workpiece 102, an appropriate calibration pattern can be obtained and used to avoid the use of a region having a low light reflectance in the plurality of substances. Light. As in the seventh embodiment, it is easy to obtain an appropriate calibration pattern based on image or based on design data.

As described above, when the workpiece 102 having the possibility of reducing the accuracy of the calibration is used for calibration, an appropriate calibration pattern corresponding to the property of the workpiece 102 is easily obtained and used, so that the accuracy of the calibration can be improved.

Further, in the conventional techniques described in Patent Documents 1 to 3, there is a limit to calibration, and rotation, deformation, or scale conversion are not considered. In the above-described embodiment of the present invention, the calibration can be performed according to the accuracy of the required calibration and the characteristics of the device to be calibrated (for example, the laser processing apparatus 100) according to an appropriately selected mathematical mode.

This is because the calibration pattern is arbitrary, so that a more complicated mathematical mode can be employed. Therefore, when using a more sophisticated mathematical model, various factors can be considered to make more precise adjustments.

In addition, the mathematical mode for calibration may be other than the above examples. For example, it is also possible to adopt a mathematical mode that is subject to deformation depending on the region. In other words, the image captured by the CCD camera 112 is divided into a plurality of regions, and the calculation unit 202 calculates the conversion matrix T and the inverse transformation matrix T' for each region, and the adjustment unit 203 The adjustment is made according to the inverse transformation matrix T' of each region.

100‧‧‧ Laser processing equipment

101‧‧‧ platform

102‧‧‧Processed objects

103‧‧‧Laser oscillator

104‧‧‧Half mirror

105‧‧‧Mirror

106‧‧‧DMD

107‧‧‧Half mirror

108‧‧‧ imaging lens

109‧‧‧Half mirror

110‧‧‧ objective lens

111‧‧‧Light source for illumination

112‧‧‧CCD camera

113‧‧‧Control Department

114‧‧‧Operation Department

115‧‧‧ display

116‧‧‧LED light source

201‧‧‧Reading Department

202‧‧‧ Calculation Department

203‧‧‧Adjustment Department

204‧‧‧Space Modulation Control Department

205‧‧‧ Platform Control Department

206‧‧‧Selection Department

207‧‧‧Make a part

300‧‧‧ images

301‧‧‧ images

302‧‧‧Image

303‧‧‧ images

304‧‧‧ images

306‧‧‧Image

310‧‧‧ Illumination graphics

311‧‧‧ illumination graphics

312‧‧‧ Illumination graphics

320‧‧‧DMD transfer information

321‧‧‧DMD transfer information

330‧‧‧Live image

331‧‧‧ live video

332‧‧‧Live image

333‧‧‧ live video

334‧‧‧ live image

340‧‧‧ calibration graphics

341‧‧‧ calibration graphics

342‧‧‧ calibration graphics

401‧‧‧Substrate

402‧‧‧ circuit graphics

403‧‧‧ round

404‧‧‧ Round

405‧‧‧ round

S101‧‧‧Steps

S102‧‧‧Steps

S103‧‧‧Steps

S104‧‧‧Steps

S105‧‧‧Steps

S106‧‧‧Steps

S107‧‧‧Steps

A‧‧‧ points

B‧‧‧ points

C‧‧‧ points

D‧‧‧ points

A’‧‧‧

B’‧‧‧ points

C’‧‧‧

D’‧‧‧

D1‧‧‧ points

E‧‧‧

E1‧‧‧ points

F‧‧‧ points

F1‧‧‧ points

W‧‧‧ points

P‧‧‧Matrix

P ^-1 ‧‧‧ inverse matrix

Q‧‧‧Matrix

T‧‧‧ conversion matrix

T’‧‧‧ inverse transformation matrix

X‧‧‧ directions

Y‧‧‧ direction

U‧‧‧direction

V‧‧‧ direction

Fig. 1 is a schematic view showing the structure of a laser processing apparatus according to a first embodiment.

Fig. 2 is a functional block diagram showing the function of the control unit of the first embodiment.

Fig. 3 illustrates a deformation of an illumination pattern caused by an offset or deformation of the laser processing apparatus.

Figure 4 shows an example of a calibration pattern.

Fig. 5 is a flow chart showing a procedure for calculating the conversion parameters of the first embodiment.

Fig. 6 is a view showing the method of adjusting the first embodiment.

Figure 7 illustrates the converter of the input graphic to the output graphic.

Fig. 8 is a functional block diagram showing the function of the control unit in the second embodiment.

Fig. 9 is a view showing the method of adjusting the second embodiment.

Fig. 10 is a functional block diagram showing the function of the control unit in the third embodiment.

Fig. 11 is a view showing the method of adjusting the third embodiment.

Fig. 12 is an example of an image when a calibration pattern is irradiated in the seventh embodiment.

Fig. 13 is a functional block diagram showing the function of the control unit of the seventh embodiment.

Figure 14 is a functional view showing the function of the control unit of the eighth embodiment. Block diagram.

100‧‧‧ Laser processing equipment

101‧‧‧ platform

102‧‧‧Processed objects

103‧‧‧Laser oscillator

104‧‧‧Half mirror

105‧‧‧Mirror

106‧‧‧DMD

107‧‧‧Half mirror

108‧‧‧ imaging lens

109‧‧‧Half mirror

110‧‧‧ objective lens

111‧‧‧Light source for illumination

112‧‧‧CCD camera

113‧‧‧Control Department

114‧‧‧Operation Department

115‧‧‧ display

116‧‧‧LED light source

Claims (13)

An adjusting device is configured to adjust, according to a specified input pattern, a person who has been spatially modulated by a spatially modulated component to illuminate an object, including: a reading portion, which is read into the photographing and illuminating the spatial modulation component space. a method of converting the image of the object to be modulated; and calculating a conversion parameter for converting the input pattern into an output pattern corresponding to the input pattern on the image; and adjusting the portion using calibration When the pattern is the input pattern, the illuminator for the light of the object according to the specified illumination pattern is adjusted in accordance with the conversion parameter calculated by the calculation unit. The adjusting device of claim 1, wherein the foregoing conversion parameters are represented by a matrix. The adjusting device according to claim 1, wherein the adjusting unit calculates an inverse conversion parameter indicating an inverse conversion of the conversion of the conversion parameter, and performs adjustment according to the inverse conversion parameter. The adjustment device of claim 3, wherein the adjustment unit adjusts by using the second illumination pattern that converts the illumination pattern by the inverse conversion parameter as the input pattern. The adjustment device of claim 3, wherein the adjustment unit converts and captures the first image of the object by the inverse conversion parameter, acquires a second image, and provides the second image as a representation to specify the illumination pattern The position is used to adjust the image. For example, the adjusting device of claim 3, wherein the aforementioned adjustment unit is The inverse conversion parameter adjusts at least one of a position and a direction of the spatial modulation element. The adjusting device according to claim 1, wherein the adjusting unit adjusts at least one of a position and a direction of the object according to the conversion parameter. The adjusting device according to claim 1, wherein the adjusting device further includes: a creating unit configured to create the calibration pattern according to information on the surface of the object when the calibration pattern is designated as the input pattern Light is irradiated to the background portion of the surface of the object. The adjustment device of claim 8, wherein the preparation unit specifies a preliminary calibration pattern as the input pattern, and the calculation unit calculates the second conversion parameter and calculates an inverse conversion indicating the conversion indicated by the second conversion parameter. a second inverse conversion parameter, wherein a background region for capturing the background portion is detected in a background detection image for capturing the object, and the second inverse conversion parameter is used to create the calibration pattern according to the background region The aforementioned background portion is illuminated. The adjusting device according to claim 1, wherein the adjusting device further includes: a selecting unit that selects one of the first light source and the second light source to emit one of the first light source and the second light source When the light is incident on the spatial modulation element; and the second calculation unit specifies the test pattern as the input pattern, the table is calculated based on whether the first light source and the second light source are selected. An offset parameter indicating an offset of the output pattern; wherein the selection unit selects the first light source as a light source that emits light according to the pattern, and in the state in which the second light source is selected, the adjustment unit converts according to the foregoing Both the parameter and the offset parameter are adjusted to illuminate the light according to the illumination pattern of the object from the second light source. A laser processing apparatus includes: an optical system that guides laser light emitted from a laser light source to an object; and a spatial modulation component that is disposed on an optical path from the laser light source to the object And adjusting the incident light space; and the above-mentioned adjusting device of the first application of the patent scope; the laser processing device uses the laser light as the light irradiated to the object according to the illumination pattern according to the first item of the patent application scope, And adjusting the irradiation of the object by the laser light by the adjustment device to process the object. An adjustment method is performed by a computer reading and shooting, according to a specified calibration pattern, and illuminating an image of an object that is spatially modulated by the spatial modulation component, and then calculating the calibration pattern to correspond to the image on the image The conversion parameters of the pattern generated by the calibration pattern are adjusted, and then the illumination of the light of the object according to the specified illumination pattern is adjusted according to the conversion parameter. A computer readable memory medium storing an adjustment program that causes the computer to perform the following steps: Reading the image according to the specified calibration pattern, illuminating the image of the object that is spatially modulated by the spatial modulation element; and calculating the pattern generated by converting the calibration pattern to the calibration image corresponding to the calibration pattern The conversion parameter; and adjusting the illumination of the light of the object according to the specified illumination pattern according to the conversion parameter.