CN114289858B

CN114289858B - Debugging and monitoring method, device, equipment and computer readable storage medium

Info

Publication number: CN114289858B
Application number: CN202111367930.7A
Authority: CN
Inventors: 黎延垠; 温正新; 吴迪
Original assignee: Fulian Yuzhan Technology Shenzhen Co Ltd
Current assignee: Fulian Yuzhan Technology Shenzhen Co Ltd
Priority date: 2021-11-18
Filing date: 2021-11-18
Publication date: 2023-07-07
Anticipated expiration: 2041-11-18
Also published as: CN114289858A

Abstract

The application provides a debugging and monitoring method for a laser system. The debugging and monitoring method comprises the following steps: performing a first debug to cause the camera assembly to complete the debug; executing second debugging to enable the vibrating mirror assembly to finish debugging; executing third debugging to complete the debugging of the focal length of the laser source; controlling the laser source to execute first machining; acquiring a first laser parameter of a first process; and judging whether the first laser parameter exceeds a laser threshold value so as to realize monitoring of the laser system. By the debugging and monitoring method, the laser system can be monitored in real time, defective products formed by processing the laser system can be found in time, the production yield of the processing of the laser system can be improved, and the production cost can be reduced. The application also provides a debugging and monitoring device, equipment and a computer readable storage medium for the laser system.

Description

Debugging and monitoring method, device, equipment and computer readable storage medium

Technical Field

The present disclosure relates to the field of laser processing technologies, and in particular, to a method, an apparatus, a device, and a computer readable storage medium for debugging and monitoring a laser system.

Background

The laser processing belongs to non-contact processing, has the advantages of high efficiency, high precision, high stability, low loss and the like, and is widely applied to the processing fields of cutting, welding, marking, drilling and the like. Before the laser system is used, the focal lengths of a camera component, a galvanometer component and a laser source in the laser system need to be adjusted. The currently adopted debugging mode is to manually complete the debugging of the galvanometer assembly, then debug the camera assembly by taking the debugging result of the galvanometer assembly as a reference, and then debug the focal length of the laser source.

However, the debugging precision of the camera assembly is affected by the debugging precision of the galvanometer assembly, and in the debugging process of the galvanometer assembly, the time required by manual measurement by adopting a ruler is long, the precision is low and deviation exists, so that the debugging errors of the galvanometer assembly and the camera assembly are large; and once the focus of camera subassembly, galvanometer subassembly and laser source is debugging and is accomplished, the facula that laser source formed does not have the monitoring measure in the course of working of laser system, can't adjust laser system in real time, and when staff found the defective products, laser system had processed more defective products, leads to production yield to reduce, increases manufacturing cost.

Disclosure of Invention

In view of the foregoing, it is necessary to provide a method, an apparatus, a device and a computer readable storage medium for debugging and monitoring a laser system, so as to realize debugging and real-time monitoring of the laser system, improve the production yield and reduce the production cost.

A first aspect of the present application provides a commissioning and monitoring method for a laser system comprising a laser source, a camera assembly, a galvanometer assembly, a processing platform, and a focal length adjustment assembly for adjusting a focal length of the laser source, the commissioning and monitoring method comprising: performing a first debug to cause the camera assembly to complete the debug; ending the execution of the first debug; after the first debugging is finished, executing a second debugging to enable the vibrating mirror assembly to finish debugging; ending the execution of the second debug; after the second debugging is finished, executing a third debugging to complete the debugging of the focal length of the laser source; the performing a third debug, comprising: transmitting a first adjustment parameter to the focal length adjustment assembly; controlling the laser source to form a plurality of first debugging patterns on a test medium in cooperation with the movement of the focal length adjusting assembly, wherein the plurality of first debugging patterns are distributed at different test positions of the test medium; judging that a first characteristic of the first debugging pattern accords with a preset focal length threshold; determining a second adjustment parameter based on the first characteristic conforming to the preset focal length threshold; transmitting the second adjustment parameter to the focal length adjustment assembly; controlling the laser source to form a plurality of second debugging patterns on the test medium in cooperation with the movement of the focal length adjusting assembly, wherein the second debugging patterns are distributed at different test positions of the test medium; judging that a second characteristic of the second debugging pattern accords with the preset focal length threshold; determining a focal length of the laser source based on the second characteristic conforming to the preset focal length threshold; ending the execution of the third debug; after the third debugging is finished, controlling the laser source to execute first processing; acquiring a first laser parameter of the first processing; and judging whether the first laser parameter exceeds a laser threshold value so as to realize monitoring of the laser system.

In this way, the debugging and monitoring method for the laser system is implemented by first executing the first debugging to complete the debugging of the coordinates of the camera component; then executing second debugging to complete debugging of the coordinates of the vibrating mirror assembly; then executing third debugging to complete the debugging of the focal length of the laser source; by executing the first debugging and the second debugging in sequence, the influence on the debugging precision of the camera component caused by deviation of the vibrating mirror component in the debugging process is avoided, and the debugging precision of the camera component is improved; and judging whether the first laser parameter exceeds a laser threshold value by acquiring the first laser parameter of the laser source for executing the first processing so as to realize the monitoring of the laser system. By the debugging and monitoring method, the laser system can be monitored in real time, defective products formed by processing the laser system can be found in time, the production yield of the processing of the laser system can be improved, and the production cost can be reduced.

A second aspect of the present application provides a commissioning and monitoring device for a laser system comprising a laser source, a camera assembly, a galvanometer assembly, a processing platform, and a focal length adjustment assembly for adjusting a focal length of the laser source, the commissioning and monitoring device comprising: the first debugging module is used for executing first debugging so as to enable the camera assembly to complete debugging; the second debugging module is used for executing second debugging so as to enable the vibrating mirror assembly to complete debugging; the third debugging module is used for executing third debugging so as to complete the debugging of the focal length of the laser source; the processing module is used for controlling the laser source to execute first processing; the first acquisition module is used for acquiring the first laser parameters of the first processing; and the first judging module is used for judging whether the first laser parameter exceeds a laser threshold value so as to realize the monitoring of the laser system.

Thus, the first debugging is executed through the first debugging module so that the coordinates of the camera component are debugged; then executing second debugging through a second debugging module so as to complete debugging of the coordinates of the vibrating mirror assembly; then executing third debugging through a third debugging module so as to complete the debugging of the focal length of the laser source; by executing the first debugging and the second debugging in sequence, the influence on the debugging precision of the camera component caused by deviation of the vibrating mirror component in the debugging process is avoided, and the debugging precision of the camera component is improved; and acquiring a first laser parameter of the laser source for executing first processing through the first acquisition module and the first judgment module, and judging whether the first laser parameter exceeds a laser threshold value or not so as to realize the monitoring of the laser system. Through above-mentioned debugging and monitoring device, can carry out real-time supervision to laser system, in time discover laser system processing and form the defective products, be favorable to improving laser system processing's production yield, reduction in production cost.

A third aspect of the present application provides a commissioning and monitoring device for a laser system, comprising: a processor, a memory, and a debugging and monitoring program for the laser system stored on the memory and executable on the processor, the debugging and monitoring program configured to implement the steps of the debugging and monitoring method as described above.

Thus, the debugging and monitoring apparatus for a laser system can debug and monitor the laser system by performing the debugging and monitoring method for a laser system as described above. Performing first debugging to enable the coordinates of the camera component to finish debugging; then executing second debugging to complete debugging of the coordinates of the vibrating mirror assembly; then executing third debugging to complete the debugging of the focal length of the laser source; by executing the first debugging and the second debugging in sequence, the influence on the debugging precision of the camera component caused by deviation of the vibrating mirror component in the debugging process is avoided, and the debugging precision of the camera component is improved; and judging whether the first laser parameter exceeds a laser threshold value by acquiring the first laser parameter of the laser source for executing the first processing so as to realize the monitoring of the laser system. By the debugging and monitoring method, the laser system can be monitored in real time, defective products formed by processing the laser system can be found in time, the production yield of the processing of the laser system can be improved, and the production cost can be reduced.

A fourth aspect of the present application provides a computer-readable storage medium having stored thereon a debugging and monitoring program for a laser system, which when executed by a processor implements the debugging and monitoring method as described above.

As such, the computer readable storage medium, by performing the debugging and monitoring method for the laser system as described above, can debug and monitor the laser system. Performing first debugging to enable the coordinates of the camera component to finish debugging; then executing second debugging to complete debugging of the coordinates of the vibrating mirror assembly; then executing third debugging to complete the debugging of the focal length of the laser source; by executing the first debugging and the second debugging in sequence, the influence on the debugging precision of the camera component caused by deviation of the vibrating mirror component in the debugging process is avoided, and the debugging precision of the camera component is improved; and judging whether the first laser parameter exceeds a laser threshold value by acquiring the first laser parameter of the laser source for executing the first processing so as to realize the monitoring of the laser system. By the debugging and monitoring method, the laser system can be monitored in real time, defective products formed by processing the laser system can be found in time, the production yield of the processing of the laser system can be improved, and the production cost can be reduced.

Drawings

FIG. 1 is a flow diagram of a method of debugging and monitoring in accordance with some embodiments of the present application.

Fig. 2 is a method flow diagram of some embodiments of S600 shown in fig. 1.

Fig. 3 is a method flow diagram of yet other embodiments of S600 shown in fig. 1.

Fig. 4 is a method flow diagram of yet other embodiments of S600 shown in fig. 1.

Fig. 5 is a method flow diagram of some embodiments of S10 shown in fig. 1.

Fig. 6 is a method flow diagram of some embodiments of S22 shown in fig. 5.

Fig. 7 is a method flow diagram of some embodiments of S100 shown in fig. 1.

Fig. 8 is a method flow diagram of some embodiments of S200 shown in fig. 1.

Fig. 9 is a method flow diagram of some embodiments of S300 shown in fig. 1.

Fig. 10 is a method flow diagram of some embodiments of S40 shown in fig. 1.

FIG. 11 is a hardware architecture diagram of a debug and monitor device in accordance with some embodiments of the present application.

Fig. 12 is a functional block diagram of a debugging and monitoring apparatus according to some embodiments of the present application.

FIG. 13 is a functional block diagram of some embodiments of the first debug module shown in FIG. 12.

FIG. 14 is a functional block diagram of some embodiments of the second debug module shown in FIG. 12.

FIG. 15 is a functional block diagram of some embodiments of the third debug module shown in FIG. 12.

FIG. 16 is a functional block diagram of some embodiments of the laser parameter selection module shown in FIG. 12.

FIG. 17 is a functional block diagram of some embodiments of the fourth debug module shown in FIG. 12.

Description of the main reference signs

Debugging and monitoring device 700

Communication interface 702

Processor 704

Memory 706

Communication bus 708

Debugging and monitoring program 710

Debugging and monitoring apparatus 800

First debug module 802

First transmitting module 8021

First forming module 8022

Grabbing module 8023

First calculation module 8024

First authentication module 8025

First ending module 8026

Second debug module 804

Second forming module 8041

Second calculation module 8042

Second judging module 8043

Second authentication module 8044

Second ending module 8045

First compensation module 8046

Third debug module 806

Second transmitting module 8061

Third forming module 8062

Third judging module 8063

First determination module 8064

Third ending module 8065

Machining module 808

First acquisition module 810

First judgment module 812

First execution module 814

Laser parameter selection module 816

Second acquisition module 8161

Analysis module 8162

Fourth judging module 8163

Second execution module 8164

Adjustment module 8165

Fourth debug module 818

Third acquisition module 8181

Second determination module 8182

Capture module 8183

Second compensation module 8184

Detailed Description

In order that the objects, features and advantages of the present application may be more clearly understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, the described embodiments are merely some, rather than all, of the embodiments of the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present application provide a commissioning and monitoring method for a laser system including a laser source, a camera assembly, a galvanometer assembly, a processing platform, and a focus adjustment assembly for adjusting a focus of the laser source, the commissioning and monitoring method comprising: executing a first debug to cause the camera assembly to complete the debug; ending the execution of the first debug; after the first debugging is finished, executing a second debugging to enable the vibrating mirror assembly to finish debugging; ending the execution of the second debug; after the second debugging is finished, executing a third debugging to complete the debugging of the focal length of the laser source; the performing a third debug, comprising: transmitting a first adjustment parameter to the focal length adjustment assembly; controlling the laser source to form a plurality of first debugging patterns on a test medium in coordination with the movement of the focal length adjusting assembly, wherein the plurality of first debugging patterns are distributed at different test positions of the test medium; judging that a first characteristic of the first debugging pattern accords with a preset focal length threshold; determining a second adjustment parameter based on the first characteristic conforming to the preset focal length threshold; transmitting the second adjustment parameter to the focal length adjustment assembly; controlling the laser source to form a plurality of second debugging patterns on the test medium in coordination with the movement of the focal length adjusting assembly, wherein the second debugging patterns are distributed at different test positions of the test medium; judging that a second characteristic of the second debugging pattern accords with the preset focal length threshold; determining a focal length of the laser source based on the second characteristic conforming to the preset focal length threshold; ending the execution of the third debug; after the third debugging is finished, controlling the laser source to execute the first processing; acquiring a first laser parameter of the first processing; and judging whether the first laser parameter exceeds a laser threshold value so as to realize monitoring of the laser system.

Some embodiments of the present application also provide a tuning and monitoring device for a laser system including a laser source, a camera assembly, a galvanometer assembly, a processing platform, and a focal length adjustment assembly for adjusting a focal length of the laser source, the tuning and monitoring device comprising: the first debugging module is used for executing first debugging so as to enable the camera component to complete debugging; the second debugging module is used for executing second debugging so as to enable the vibrating mirror assembly to finish debugging; the third debugging module is used for executing third debugging so as to complete the debugging of the focal length of the laser source; the processing module is used for controlling the laser source to execute first processing; the first acquisition module is used for acquiring first laser parameters of the first processing; and the first judging module is used for judging whether the first laser parameter exceeds a laser threshold value so as to realize the monitoring of the laser system.

Some embodiments of the present application also provide a commissioning and monitoring device for a laser system, comprising: a processor, a memory, and a debugging and monitoring program for the laser system stored on the memory and executable on the processor, the debugging and monitoring program configured to implement the steps of the debugging and monitoring method as described above.

Some embodiments of the present application also provide a computer readable storage medium having stored thereon a debugging and monitoring program for a laser system, which when executed by a processor implements the debugging and monitoring method as described above.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.

In the related art, a laser system includes a laser source, a camera assembly, a galvanometer assembly, a processing platform, and a focal length adjustment assembly for adjusting a focal length of the laser source. The laser source is used for emitting laser to perform laser processing such as welding, marking and the like on a workpiece to be processed. The camera component is used for obtaining processing parameters, positioning processing position information of the workpiece according to the processing parameters, sending the processing position information of the workpiece to the laser control system, and the laser control system controls the galvanometer component to change a light path of laser so that a focus of the laser can be used for carrying out laser processing on the workpiece to be processed at the processing position of the workpiece to be processed. In some processing, the vibrating mirror assembly controls the laser focus to move in a small range, and when a workpiece to be processed needs to be moved in a large range, the laser control system controls the processing platform to move according to processing position information fed back by the camera assembly, so that laser processing of the large-size workpiece is realized. The focal length adjusting assembly is used for adjusting the focal length of the laser source, and illustratively comprises a voice coil motor, and the focal length of the laser source is adjusted by adjusting the relative positions of the lens sheets through which laser passes, so that the laser emitted by the laser source is focused to concentrate energy and perform laser processing on a workpiece to be processed.

The debugging and monitoring method is used for debugging focal lengths of the camera component, the galvanometer component and the laser source in the laser system and monitoring the laser system in real time. For a laser system needing to be debugged and monitored, the debugging and monitoring functions provided by the debugging and monitoring method can be directly integrated on the laser system, or a client for realizing the debugging and monitoring method can be installed. For another example, the debugging and monitoring method provided by the application can also be operated on the laser system in the form of a software development kit (SDK, software Development Kit), an interface for debugging and monitoring functions is provided in the form of an SDK, and a processor or other devices can realize the debugging and monitoring functions through the provided interface.

Referring to fig. 1, some embodiments of the present application provide a method for debugging and monitoring a laser system. The debugging and monitoring method comprises the following steps.

S100, executing first debugging.

Specifically, the first debugging is executed, so that the camera component finishes debugging before the galvanometer component, and the problem that the error is generated in the debugging process of the galvanometer component to influence the debugging precision of the camera component when the galvanometer component is debugged before the camera component is debugged is avoided.

After step S100 is performed, the following step S200 is performed.

S200, executing second debugging.

Specifically, in the case where the camera assembly has been already debugged, the debugging and monitoring method completes the debugging by performing the second debugging so that the galvanometer assembly is completed.

After step S200 is performed, the following step S300 is performed.

S300, executing third debugging.

Specifically, in the case where the camera assembly and the galvanometer assembly have been already debugged, the debugging is completed by performing the third debugging so that the focal length of the laser source is completed.

After executing step S300, the debugging and monitoring method executes the following steps S400 to S600.

And S400, controlling the laser source to execute first machining.

Specifically, after step S100-step S300 are executed, the focal lengths of the camera component, the galvanometer component and the laser source of the laser system are already debugged, and the laser system meets the processing conditions. The first process may be a laser process such as welding, marking, etc. The present application is described with reference to marking, and the first process is also understood to be marking a workpiece to form a pattern.

S500, acquiring a first laser parameter of the first machining.

Specifically, a first laser parameter of a pattern formed by a first process is acquired. The first laser parameters include a first laser spot location, a first laser focal length location, and a first power value. The first laser spot position and the first laser focal length position can be obtained by a camera component, and the first power value can be obtained by a power device and other components in the laser system.

S600, judging whether the first laser parameter exceeds a laser threshold value so as to realize monitoring of the laser system.

Specifically, the first laser parameter is compared with the laser threshold value to judge whether the first laser parameter exceeds the laser threshold value, so that the laser system after debugging is monitored.

Thus, through the steps S100-S600, the focal lengths of the camera component, the galvanometer component and the laser source are sequentially debugged, so that debugging errors caused by debugging the galvanometer component first and then the camera component are avoided; by judging whether the first laser parameter exceeds the laser threshold value or not, the monitoring of the laser system is realized, the debugging and monitoring automation of the laser system are realized, defective products formed by processing the laser system can be found in time, the production yield of processing of the laser system is improved, and the production cost is reduced.

In some embodiments, in order to ensure that the pattern processed by the laser has better quality when the focal lengths of the camera component, the galvanometer component and the laser source are adjusted, the adjustment precision of the laser system is improved, and the adjustment and monitoring method may further execute step S10 before executing step S100.

S10, performing laser parameter selection.

Specifically, the laser parameters of the laser source are selected by executing the step of selecting the laser parameters, so that the pattern processed by the laser is ensured to have better quality. Wherein the laser parameters include at least one of marking speed, marking power, and filling pitch.

It will be appreciated that the laser system may also verify the laser light emitted by the laser source before starting to select the laser parameters of the laser source. If the result is verified as being acceptable, step S10 may also be optionally not performed. Thus, step S10 may be omitted. If the result is not qualified, step S10 may be optionally performed to ensure that the pattern processed by the laser has better quality, and ensure the adjustment accuracy of the focal lengths of the camera component, the galvanometer component and the laser source.

In some embodiments, after step S300 is performed, step S40 may be performed first, and then steps S400-S600 may be performed, so as to ensure the debugging accuracy of the laser system.

S40, executing fourth debugging.

Specifically, the fourth debugging is performed to complete the debugging of the exposure parameters of the camera assembly, so that the camera assembly can better capture the characteristics of the pattern formed by the laser, and the debugging precision of the focal length of the laser source of the laser system is guaranteed.

It will be appreciated that in other embodiments, step S40 may also be performed after step S10, after step S100 or after step S200 to ensure the debugging accuracy of the laser system. The laser system may also verify the exposure parameters of the camera assembly before starting to perform the fourth debug. If the result is verified as being acceptable, step S40 may also be optionally not performed. Thus, step S40 may be omitted. If the result is not qualified, step S40 may be optionally performed to ensure the debugging accuracy of the laser system.

Referring to fig. 2 together, in some embodiments, step S600 may specifically include the following steps S602-S606.

S602, judging whether the first laser spot position exceeds a spot position threshold.

In particular, the laser spot position may reflect whether the galvanometer assembly of the laser system is offset. If the first laser spot position is judged to exceed the spot position threshold value, the vibrating mirror assembly of the laser system is shifted, the vibrating mirror assembly is required to be debugged again, and after the vibrating mirror assembly is debugged again, the focal length of the laser source is also changed, namely the focal length of the laser source is required to be debugged again. If yes, step S200 is executed, and a second debugging is executed, so that the galvanometer assembly completes a new debugging; and executing step S300, and executing a third debugging to enable the focal length of the laser source to finish new debugging. If the judgment result in the step S602 is no, it indicates that the galvanometer component of the laser system is not offset, and repeated debugging of the laser system is not required. That is, if the determination result in step S602 is no, step S400 is executed to control the laser source to execute the first processing.

S604: and judging whether the focal length position of the first laser exceeds a focal length position threshold value.

In particular, the laser focal length position may reflect whether the focal length of the laser source of the laser system is shifted. If the first laser focal length position is judged to exceed the focal length position threshold value, the focal length of the laser source of the laser system is indicated to be shifted, and the focal length of the laser source needs to be debugged again. That is, if the determination result of step S604 is yes, step S300 is executed, and a third debug is executed to complete a new debug of the focal length of the laser source. If the determination result in step S604 is no, it indicates that the focal length of the laser source of the laser system is not shifted, and repeated adjustment of the focal length of the laser source of the laser system is not required. That is, if the determination result in step S604 is no, step S400 is executed to control the laser source to execute the first processing.

It will be appreciated that step S602 and step S604 may be performed separately or simultaneously. When the step S602 and the step S604 are performed simultaneously, if the determination results of the step S602 and the step S604 are both yes, the step S602 is performed to determine that the determination result of the step S602 is yes because the step S602 is higher than the step S604, that is, the step S200 and the step S300 are performed to re-debug the galvanometer component of the laser system and the focal length of the laser source. If the determination result of step S602 is yes, the determination result of step S604 is no, and step S200 and step S300 are executed. If the determination result of step S602 is no, the determination result of step S604 is yes, and step S300 is executed. If the determination results of step S602 and step S604 are both negative, step S400 is performed.

S606: it is determined whether the first power value exceeds a power threshold.

Specifically, the power value may reflect whether the power of the laser source of the laser system is too high or too low, which may affect the processing of the laser system. If the first power value exceeds the power threshold, the power of the laser source is too high or too low, and an operator is required to check the laser system. If the judgment result of step S606 is yes, step S608 is executed, and an early warning command is executed. The early warning instruction can be an instruction for reminding an operator such as sound and light, an image and the like, can also be an instruction for stopping and the like, and can be specifically set according to actual conditions. If the result of the determination in step S606 is negative, step S400 is performed.

Thus, through the steps S602-S608, the laser system is monitored in real time, the laser system can be debugged in real time according to the real-time monitoring result, the production yield of the laser system processing is improved, and the production cost is reduced.

It will be appreciated that after the step S500 is performed, the debugging and monitoring method may perform any of the steps S602-S606, and specifically may correspond to the first laser spot position, the first laser focal length position, and the first power value according to the first laser parameter. Step S602 to step S606 may be performed simultaneously or sequentially.

It should be noted that, fig. 2 further includes step S500, and for convenience of describing some embodiments of step S600, step S600 does not include step S500.

Referring to fig. 3, in some embodiments, after the debugging and monitoring method re-debugs the laser system through steps S602-S608, step S600 may further specifically include the following steps S610-S616.

And S610, controlling the laser source to execute the second processing.

Specifically, through any one of step S602 to step S608, after the focal length of the galvanometer component of the laser system and the laser source is debugged again, the laser source is controlled again to execute the second processing. It is also understood that the laser processing of the laser system is continued to be monitored after the focal length of the galvanometer assembly and the laser source of the laser system are re-adjusted.

S612, obtaining a second laser parameter of the second processing.

Specifically, a second laser parameter of the pattern formed by the new second process is acquired by a camera component or the like of the laser system. The second laser parameters include a second laser spot location, a second laser focal length location, and a second power value. It should be noted that the second laser parameters should be identical to the first laser parameters.

S614, judging whether the second laser spot position exceeds a spot position threshold.

Specifically, it is substantially similar to step S602. If the determination of step S614 is yes, step S200 and step S300 are performed. If the result of the determination of step S614 is negative, step S610 is performed.

S616, judging whether the second laser focal length position exceeds a focal length position threshold.

Specifically, it is substantially similar to step S604. If the determination of step S616 is yes, step S300 is performed. If the result of the determination in step S616 is negative, step S610 is performed.

It will be appreciated that step S614 and step S616 may be performed separately or simultaneously.

S618, judging whether the second power value exceeds the power threshold.

Specifically, it is substantially similar to step S618. If the determination at step S618 is yes, step S608 is executed. If the result of the determination in step S618 is negative, step S610 is performed.

Thus, through the steps S610-S618, the verification and the real-time monitoring of the laser system are realized, the laser system can be debugged again in real time according to the real-time monitoring result, the production yield of the laser system processing is improved, and the production cost is reduced.

Referring to fig. 4, in some embodiments, after the debugging and monitoring method debugs the laser system through steps S610-S618, step S600 may further specifically include the following steps S620-S628.

S620, controlling the laser source to perform the third process.

Specifically, through any one of step S610 to step S618, after the focal length of the galvanometer component of the laser system and the laser source is debugged again, the laser source is controlled again to execute the third processing. It can also be understood that the laser processing of the laser system is continuously monitored after the third adjustment of the focal length of the galvanometer component and the laser source of the laser system.

S622, a third laser parameter for a third process is acquired.

Specifically, a third laser parameter of the pattern formed by the new third process is acquired by a camera component or the like of the laser system. The third laser parameters include a third laser spot location, a third laser focal length location, and a third power value. It should be noted that the third laser parameter should be identical to both the second laser parameter and the first laser parameter.

S624, judging whether the third laser spot position exceeds a spot position threshold.

S626, it is determined whether the third laser focal length position exceeds the focal length position threshold.

S628, it is determined whether the third power value exceeds the power threshold.

Specifically, the steps are similar to steps S602-S606 and steps S614-S618, except that in this embodiment, when any one of the steps S614-S618 is yes, step S608 is executed to alert the operator that there may be a major problem with the processing system, and the operator needs to check.

Referring to fig. 5, step S10 may specifically include the following steps S12 to S22.

S12, acquiring laser marking parameters, and controlling a laser source to perform first marking on a test medium to form a first marking pattern.

Specifically, the laser system controls the laser source to perform first marking on the test medium according to the set laser marking parameters so as to form a first marking pattern. The laser marking parameters comprise at least one of marking speed, marking power and filling spacing. The laser marking parameters in this embodiment include the marking speed.

It will be appreciated that in other embodiments, the laser marking parameters may include marking speed and marking power, or the laser marking parameters may include marking speed and filling pitch, or the laser marking parameters may include marking speed, marking power and filling pitch, or the laser marking parameters may include marking power, or the laser marking parameters may include filling pitch. It should be noted that when the laser marking parameters include at least two of a marking speed, a marking power and a filling pitch, the laser marking parameters may be initially selected according to experience, so that a pattern formed by marking is within a reasonable range, and a large deviation caused by increasing a selected time and arbitrarily selecting parameters is avoided.

S14, controlling the camera component to acquire first marking parameters of the first marking pattern.

In particular, the first marking parameter may be at least one of sharpness and gray scale, both of which are capable of reflecting the quality of the first marking pattern, in particular, sharpness represents an indicator of the sharpness of the pattern or the sharpness of the edges of the image; the gray scale represents an index of the shade of the pattern black. The camera component evaluates the first marking pattern using the first marking parameter after acquiring the first marking parameter. In this embodiment, the first scaling parameter comprises sharpness.

It will be appreciated that in other embodiments, the first scaling parameter may also comprise a gray scale, or the first scaling parameter may also comprise sharpness and gray scale.

S16, analyzing the first marking parameter and the target marking parameter to obtain a first difference value.

Specifically, the obtained first marking parameter is analyzed and compared with the target parameter to obtain a first difference value. That is, in this embodiment, the target parameter is target sharpness, and the first difference is a first sharpness difference.

S18, judging that the first difference value exceeds the parameter threshold.

Specifically, the obtained first difference value is compared with the parameter threshold value, and if it is determined that the first difference value exceeds the parameter threshold value, that is, the first sharpness difference value exceeds the parameter threshold value, step S22 is performed.

And S20, judging that the first difference value does not exceed the parameter threshold value, and ending the laser parameter selection.

Specifically, if the obtained first difference value does not exceed the parameter threshold value, the first marking pattern meets the requirements, the laser marking parameters meet the requirements, and the laser parameter selection is finished.

It should be noted that, the target parameter and the parameter threshold are values selected according to the test medium and the laser parameter, and under the target parameter, the display effect of the pattern is better, so that the camera can clearly grasp the boundary of the pattern, thereby improving the positioning precision of the camera and further improving the calibration precision.

S22, executing a parameter adjustment step.

Referring to fig. 6, step S22 may specifically include the following steps S24-S32.

S24, adjusting laser marking parameters, and controlling a laser source to perform second marking on the test medium to form a second marking pattern.

Specifically, the laser marking parameters are adjusted, and the laser source uses the adjusted parameters to perform second marking on the test medium to form a second marking pattern. For example, the marking speed of the laser source is adjusted, and the test medium is subjected to second marking by using the laser source with the adjusted marking speed.

S26, controlling the camera component to acquire second marking parameters of the second marking pattern.

Specifically, a second marking parameter of the second marking pattern, i.e. a second sharpness parameter of the second marking pattern, is obtained by the camera assembly.

S28, analyzing the second marking parameters and the target marking parameters to obtain a second difference value.

Specifically, the obtained second marking parameter is analyzed and compared with the target marking parameter to obtain a second difference value, namely a second sharpness difference value.

S30, if the second difference value exceeds the parameter threshold value, repeating the second marking until the second difference value does not exceed the parameter threshold value.

Specifically, when the second difference value is judged to exceed the parameter threshold value, repeating the second marking until the second difference value does not exceed the parameter threshold value, namely continuously adjusting the marking speed of the laser source until the second difference value acquired by the camera does not exceed the parameter threshold value, wherein at the moment, the laser marking parameters meet the requirements.

S32, judging that the second difference value does not exceed the parameter threshold value, and ending the laser parameter selection.

Specifically, if the obtained second difference value does not exceed the parameter threshold value, the second marking pattern meets the requirements, the adjusted laser marking parameters meet the requirements, and the laser parameter selection is finished.

It will be appreciated that in other embodiments, the laser marking parameters may include marking speed and marking power. The laser marking parameters may be selected as follows: the marking speed of the laser is selected, that is, the marking speed of the laser is performed in steps S12-S22 and steps S24-S32. After the marking speed of the laser is selected, the marking power of the laser is selected, that is, the marking power of the laser is subjected to steps S12 to S22 and steps S24 to S32. In this manner, laser marking parameters may be selected. Of course, the above-described selected sequence of marking speed and marking power may be varied.

It will be appreciated that in other embodiments, the laser marking parameters may include marking speed, marking power, and fill spacing. The laser marking parameters may be selected as follows: the marking speed of the laser is selected, that is, the marking speed of the laser is performed in steps S12-S22 and steps S24-S32. After the marking speed of the laser is selected, the marking power of the laser is selected, that is, the marking power of the laser is executed in steps S12-S22 and S24-S32. After the marking speed and marking power of the laser are selected, the filling pitch of the laser is selected, that is, steps S12 to S22 and steps S24 to S32 are performed on the filling pitch of the laser. In this manner, laser marking parameters may be selected. Of course, the above-described selected sequence of marking speed, marking power, and filling pitch may vary.

Referring to fig. 7, step S100 may specifically include the following steps S102-S114.

S102, transmitting a motion parameter to the processing platform.

Specifically, the processing platform is used for placing the workpiece to be marked. In this embodiment, a test medium may be placed on the processing platform. After the processing platform receives the motion parameters, the processing platform can drive the test medium to move together according to the motion information/track carried by the motion parameters, so that the motion distance of the test medium can be obtained. Physical coordinate information can be generated when the processing platform moves, and the physical coordinate information can reflect the information of the movement of the processing platform and the test medium. The workpiece to be marked is positioned on a processing platform, and the processing platform moves to drive the workpiece to be marked to move so as to mark patterns with specific shapes and specific intervals on the workpiece to be marked in cooperation with laser.

It should be noted that the test medium may be a material capable of being marked with a pattern, such as paper or sheet metal, and the test medium may be in a sheet or block shape, which is not limited herein.

S104, sending a galvanometer marking parameter to the galvanometer assembly.

Specifically, the galvanometer component can be fixed at a specific position after receiving the galvanometer marking parameters, and can swing according to a preset angle, so that the light path of laser cannot change after passing through the galvanometer component, or the laser propagates according to the preset light path after passing through the galvanometer component. Galvanometer marking parameters are understood to be parameters that cause the galvanometer assembly to be fixed in a particular position that causes the servo motor of the galvanometer assembly to move a particular angle, or to be fixed at a particular angle.

In some embodiments, the center of the vibrating mirror is marked, so that distortion errors of the vibrating mirror assembly can be prevented from affecting the calibration of the camera assembly, and the accuracy of the calibration of the camera assembly is improved.

S106, controlling the galvanometer component to form a third debugging pattern and a fourth debugging pattern on a test medium in cooperation with the movement of the processing platform, and obtaining physical coordinate information of a third feature of the third debugging pattern and physical coordinate information of a fourth feature of the fourth debugging pattern based on the physical coordinate information of the processing platform.

Specifically, after passing through the galvanometer assembly, the laser marks on the test medium through the movement of the processing platform. For example, at a first time, the processing platform is positioned at a first position, and the laser is marked at the first position on the test medium after passing through the galvanometer assembly to form a third debugging pattern; and at a second time, the processing platform moves to a second position according to the motion parameters, and the laser marks at the second position on the test medium after passing through the galvanometer assembly to form a fourth debugging pattern. The third debug pattern and the fourth debug pattern may be the same pattern, the third debug pattern having third features, the fourth debug pattern having fourth features, the third features and the fourth features being the same features. In this embodiment, the third debug pattern and the fourth debug pattern are both cross-shaped, and the third feature and the fourth feature are both center points of the cross-shape.

It will be appreciated that in other embodiments, the third debug pattern and the fourth debug pattern may be circular, regular polygon or other shapes, and the third feature and the fourth feature may be the center point of the pattern, or may be special feature information such as intersection points on the pattern.

And acquiring physical coordinate information of the third feature and physical coordinate information of the fourth feature based on the physical coordinate information of the processing platform and the predicted motion parameters, wherein the physical coordinate information of the third feature and the physical coordinate information of the fourth feature are coordinates based on the physical coordinate information of the processing platform.

S108, controlling the camera component to capture the third feature and the fourth feature, and acquiring pixel coordinate information of the third feature and pixel coordinate information of the fourth feature.

Specifically, a third debug pattern and a fourth debug pattern are acquired through a camera component, and the camera component grabs third features and fourth features according to the third debug pattern and the fourth debug pattern. The camera component has pixel coordinate information, the pixel coordinate information of the camera component can be understood as basic coordinates of the camera component, and after the camera component obtains the third feature and the fourth feature, the pixel coordinate information is formed in the camera component based on the pixel coordinate information of the camera component, that is, the pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature are formed. Note that the pixel coordinate information is not equivalent to the physical coordinate information.

S110, calculating the conversion relation between the pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature and the physical coordinate information of the third feature and the physical coordinate information of the fourth feature, so that the coordinate information of the camera component after the pixel coordinate information is converted through the conversion relation is consistent with the physical coordinate information of the processing platform.

Specifically, according to the acquired pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature, and the physical coordinate information of the third feature and the physical coordinate information of the fourth feature, a conversion relation between the pixel coordinate information and the physical coordinate information is obtained through calculation. In this way, the pixel coordinate information of the camera component is converted by the conversion relation, and the coordinate information is consistent with the physical coordinate information of the processing platform.

It should be noted that, the first debugging is to calibrate the camera component, and because the physical coordinate information of the processing platform can reflect the real distance information, the calibration of the camera component is based on the physical coordinate information of the processing platform. Therefore, the accurate pixel coordinate information of the camera component can be obtained through the physical coordinate information and the conversion relation, and the debugging of the camera component is completed.

S114, ending the first debugging.

Specifically, after calibration of the camera assembly is completed, the first debugging is ended. In this way, debugging of the camera assembly is achieved.

In some embodiments, performing the first commissioning further comprises a process of verifying the commissioned camera assembly, i.e. after step S110, performing the first commissioning further comprises step S112.

S112, executing first verification debugging.

Specifically, the first verification debugging is substantially similar to the flow of step S102-step S110, and the motion parameters may be used continuously, or new verification motion parameters may be used. In this embodiment, the first verification debug may form a verification physical coordinate information, and when the difference between the verification physical coordinate information and the actual physical coordinate information is set to be within an error range, the verification physical coordinate information is considered to be consistent with the actual physical coordinate information. For example, the error range is less than or equal to 0.05% of the percentage difference, which is the difference between the verified physical coordinate information and the actual physical coordinate information divided by the average value of the verified physical coordinate information and the actual physical coordinate information, and the percentage difference is displayed in the form of percentage. Thus, whether the verified physical coordinate information is consistent with the actual physical coordinate information can be intuitively judged through the data.

Referring to fig. 8, step S200 may specifically include the following steps S202-S210.

S202, controlling the vibrated mirror assembly to form a fifth debugging pattern and a sixth debugging pattern on a test medium.

Specifically, under the condition that the camera component is calibrated, a parameter is sent to the vibrating mirror component, and the vibrating mirror component forms a fifth debugging pattern and a sixth debugging pattern on the test medium according to the parameter, wherein the fifth debugging pattern and the sixth debugging pattern are cross-shaped. When the galvanometer assembly is controlled to form the fifth debug pattern and the sixth debug pattern, the galvanometer assembly also forms galvanometer coordinate information of the fifth debug pattern and galvanometer coordinate information of the sixth debug pattern.

It is understood that the fifth debug pattern and the sixth debug pattern may also be circular, regular polygon or other shaped patterns.

S204, controlling the camera component to capture the fifth feature of the fifth debugging pattern and the sixth feature of the sixth debugging pattern, obtaining pixel coordinate information of the fifth feature and pixel coordinate information of the sixth feature, and calculating physical coordinate information of the fifth feature and physical coordinate information of the sixth feature according to the conversion relation.

Specifically, a fifth debugging pattern and a sixth debugging pattern are obtained through the camera component, the camera component grabs a fifth feature and a sixth feature according to the fifth debugging pattern and the sixth debugging pattern, and pixel coordinate information is formed in the camera component based on pixel coordinate information of the camera component after the camera component obtains the fifth feature and the sixth feature, namely the pixel coordinate information of the fifth feature and the pixel coordinate information of the sixth feature are formed. And converts the pixel coordinate information of the fifth feature and the pixel coordinate information of the sixth feature into physical coordinate information of the fifth feature and physical coordinate information of the sixth feature according to the conversion relationship acquired in step S100. The galvanometer coordinate information of the fifth debug pattern and the galvanometer coordinate information of the sixth debug pattern are the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature.

S206, judging whether the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature are consistent with the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature.

Specifically, the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature obtained by the conversion relationship are compared with the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature.

In this embodiment, the percentage difference between the physical coordinate information and the galvanometer coordinate information is set to be less than or equal to 0.05%, so that it can be considered whether the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature are consistent with the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature.

And S208, if not, compensating the galvanometer assembly so that the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature are consistent with the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature.

Specifically, if the comparison result is inconsistent, the galvanometer assembly is compensated so that the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature are consistent with the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature. The process of compensating the galvanometer assembly is approximately a step of forming the "conversion relation" in the step S100, so that the coordinate information of the galvanometer assembly is consistent with the coordinate information of the camera assembly or the processing platform after the conversion.

If the comparison result is consistent, the galvanometer assembly does not need to be compensated, and step S212 can be executed.

Step S212, the execution of the second debug is ended.

Specifically, after the calibration of the galvanometer assembly is completed, the second debugging is ended. Thus, the debugging of the vibrating mirror assembly is realized.

In some embodiments, performing the second debug further includes a process of verifying the debugged galvanometer assembly, i.e., after step S208, performing the first debug further includes step S210.

S210, executing second verification debugging.

Specifically, the second validation debugging is substantially similar to the flow of step S202-step S208.

Referring to fig. 9, step S300 may specifically include the following steps S302-S318.

S302, a first adjustment parameter is sent to the focal length adjustment assembly.

In particular, the focus adjustment assembly may include a voice coil motor that moves the lenses. The first adjustment parameters can be understood as parameters of the voice coil motor driving each lens to move, and the first adjustment parameters can be obtained according to experience or experiment. The focal length of the laser emitted by the laser source is changed through the movement of each lens, so that the quality of the laser marking is different. Illustratively, the first adjustment parameter may be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, i.e. the distance each time the focal length adjustment assembly moves the lenses is 0.1mm. It should be apparent that this is merely illustrative of embodiments of the present application and is not intended to be limiting of embodiments of the present application.

S304, controlling the laser source to cooperate with the movement of the focal length adjusting assembly to form a plurality of first debugging patterns on a test medium, wherein the plurality of first debugging patterns are distributed at different test positions of the test medium.

Specifically, the laser source emits laser to match with the movement of the focal length adjusting assembly, a plurality of first debugging patterns are formed on the test medium, and the plurality of first debugging patterns are distributed at different test positions of the test medium. The first debug patterns are exemplified by lines, 9 first debug patterns are arranged on the test medium at intervals. In this way, the camera assembly is facilitated to clearly acquire images of the plurality of first debug patterns to analyze the acquired images.

S306, judging that the first characteristic of a first debugging pattern accords with a preset focal length threshold.

Specifically, first features of each first debug pattern are respectively acquired through the camera component, and the first features comprise at least one of line thickness, burning area and burning edge size of the first debug patterns. The present embodiment is described taking the first feature as an example of line thickness, and it is obvious that this is not a limitation of the embodiments of the present application. And selecting one of the 9 first features with the thinnest line, for example, the fifth line as the thinnest line, according to the acquired plurality of first features.

S308, determining a second adjustment parameter based on the first characteristic meeting a preset focal length threshold.

Specifically, based on the fact that the fifth line is the finest, that is, the fifth line meets the preset focal length threshold, the second adjustment parameters are determined to be 0.46mm, 0.47mm, 0.48mm, 0.49mm, 0.5mm, 0.51mm, 0.52mm, 0.53mm and 0.54mm, that is, the second adjustment parameters float up and down based on 0.5 mm.

S310, sending a second adjustment parameter to the focal length adjustment assembly.

S312, controlling the laser source to cooperate with the movement of the focal length adjusting assembly to form a plurality of second debugging patterns on the test medium, wherein the second debugging patterns are distributed at different test positions of the test medium.

S314, judging that the second characteristic of a second debugging pattern accords with a preset focal length threshold.

S316, determining the focal length of the laser source based on the second characteristic meeting a preset focal length threshold.

Specifically, the flow of step S310 to step S316 is substantially similar to the flow of step S302 to step S308, and the second feature should be the same as the first feature. Therefore, the first adjusting parameter is used for determining the second adjusting parameter which accords with the preset focal length threshold, and the second adjusting parameter is used for determining the focal length of the laser source, so that the adjustment accuracy of the focal length of the laser source is improved.

S318, ending the execution of the third debugging.

Referring to fig. 10, step S40 may specifically include the following steps S42-S60.

S42, controlling the camera component to carry out first shooting debugging and obtaining a plurality of corresponding seventh debugging patterns according to the preset first exposure parameters.

Specifically, the first exposure parameter includes a gain value and an exposure value. The present embodiment is described taking the example that the first exposure parameter includes the gain value as an example, and it is obvious that this is not a limitation of the embodiments of the present application. The first exposure parameters are 1EV, 2EV, 3EV, 4EV, 5EV, 6EV, 7EV, 8EV and 9EV, namely the camera component respectively performs first shooting debugging under the exposure parameters and acquires corresponding 9 seventh debugging patterns.

S44, determining that a seventh feature of a seventh debug pattern meets a preset exposure threshold.

Specifically, the seventh feature may be a target feature profile of the seventh debug pattern, and the target feature may be a feature such as a solder joint, a stud to be soldered, or the like. And selecting one seventh feature with the target feature profile most conforming to a preset exposure threshold from the 9 acquired seventh features. It is also understood that the target feature profile is the clearest one that meets the preset exposure threshold.

S46, determining a second exposure parameter based on the seventh feature meeting a preset exposure threshold.

Specifically, a second exposure parameter is determined based on the seventh feature meeting a preset exposure threshold. Illustratively, the seventh debug pattern and the seventh feature corresponding to the first exposure parameter 5EV conform to a preset exposure threshold, and the second exposure parameter is determined to be 4.5EV, 4.6EV, 4.7EV, 4.8EV, 4.9EV, 5EV, 5.1EV, 5.2EV, 5.3EV, 5.4EV, 5.5EV according to the exposure parameter 5EV.

S48, controlling the camera component to carry out second shooting debugging and obtaining a plurality of corresponding eighth debugging patterns according to the second exposure parameters.

S50, determining that an eighth feature of an eighth debug pattern accords with a preset exposure threshold.

S52, determining a target exposure parameter based on the eighth feature meeting a preset exposure threshold.

Specifically, the flow of step S48 to step S52 is substantially similar to the flow of step S42 to step S46. In this manner, target exposure parameters of the camera assembly are determined.

S54, capturing target characteristics in the shot object based on the target exposure parameters.

Specifically, based on the target exposure parameters, target features in the eighth debug pattern corresponding to the target exposure parameters are captured.

S56, determining whether the target feature is consistent with the preset exposure feature.

Specifically, the acquired target feature is compared with a preset exposure feature. The preset exposure characteristic may be understood as a pre-stored target characteristic.

If the result of step S56 is no, step S58 is performed to compensate the camera assembly so that the target feature is consistent with the preset exposure feature.

Specifically, if the target feature is consistent with the preset exposure feature, compensation of the camera assembly is required. For example, if the gray scale of the target feature is smaller than the preset exposure feature, the exposure value of the camera assembly is increased correspondingly according to the gray scale difference between the target feature and the preset exposure feature, so as to compensate the camera assembly.

If yes in step S56, step S60 is executed to end the fourth debug. Thus, the fourth debugging is performed so that the exposure parameters of the camera assembly are completely debugged.

It will be appreciated that in other embodiments, when the exposure parameters include an exposure value and a gain value, the step of determining the target exposure parameter may be: a target exposure parameter of the exposure value of the camera assembly is first determined, i.e. steps S42-S52 are performed on the exposure value of the camera assembly. After determining the target exposure parameter of the exposure value of the camera assembly, steps S42-S52 are performed on the target exposure parameter of the gain value of the camera assembly. In this manner, a determination may be made of the target exposure parameters of the camera assembly. Of course, the order of determination of the target exposure parameters of the camera assembly described above may be changed.

Fig. 1 to 10 describe in detail the debugging and monitoring method of the present application. According to the debugging and monitoring method, first, the first debugging is executed, so that the coordinates of the camera component are debugged; then executing second debugging to complete debugging of the coordinates of the vibrating mirror assembly; then executing third debugging to complete the debugging of the focal length of the laser source; then executing fourth debugging to complete the debugging of the exposure parameters of the camera component; before the first debugging is performed, the laser parameters are also selected so that the pattern processed by the laser source has better quality. By executing the first debugging and the second debugging in sequence, the influence on the debugging precision of the camera component caused by deviation of the vibrating mirror component in the debugging process is avoided, and the debugging precision of the camera component is improved; judging whether the first laser parameter exceeds a laser threshold value by acquiring the first laser parameter of the laser source for executing the first processing so as to realize real-time monitoring of a laser system; the laser system can be monitored in real time, the focal lengths of the vibrating mirror assembly and the camera assembly of the laser system can be debugged in real time, defective products formed by processing the laser system can be found in time, the laser system can be debugged on line in time, the production yield of processing the laser system can be improved, and the production cost can be reduced.

The hardware architecture of the debug and monitor device 700 that implements the debug and monitor functions is described below in conjunction with fig. 11. It should be noted that the foregoing description is for illustrative purposes only, and is not limited to this configuration within the scope of the present application.

Referring to fig. 11, fig. 11 is a hardware architecture diagram of a debugging and monitoring device 700 according to some embodiments of the present application. The debugging and monitoring device 700 is used for debugging focal lengths of a camera component, a galvanometer component and a laser source in a laser system, and for monitoring and debugging the laser system in real time. The debug and monitor device 700 includes a communication interface 702, a processor 704, a memory 706, and a communication bus 708. The communication interface 702 and the memory 706 are coupled to the processor 704 by a communication bus 708.

The communication interface 702 is configured to receive and transmit data information, which may be transmitted by the processor 704 to the communication interface 702 or may be transmitted by other input devices to the communication interface 702. Communication interface 702 is also used to couple various portions of the laser system for transmitting information between the various portions.

The processor 704 may be a central processing unit (CPU, central Processing Unit), and may include other general purpose processors, digital signal processors (DSP, digital Signal Processor), application specific integrated circuits (ASIC, application Specific Intergrated Circuit), field programmable gate arrays (FPGA, field-Programmable Gate Array) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. The general purpose processor may be a microprocessor or the general purpose processor may be any conventional processor or the like, and the processor 704 is the control center of the laser system, with various interfaces and lines connecting the various parts of the overall laser system.

Memory 706 is used to store various types of data in the laser system, such as various databases, program codes, and the like. In this embodiment, the Memory may include, but is not limited to, read-Only Memory (ROM), random-access Memory 706 (RAM, random Access Memory), programmable Read-Only Memory (PROM, programmable Read-Only Memory), erasable programmable Read-Only Memory (EPROM, erasable Programmable Read-Only Memory), electronically erasable rewritable Read-Only Memory (EEPROM), compact disc Read-Only Memory (CD-ROM, compact Disc Read-Only Memory) or other optical disc Memory, magnetic disk Memory, tape Memory, or any other medium that can be used to carry or store data that is readable by a computer.

Stored in the memory 706 is a debug and monitor program 710 for a laser system, the debug and monitor program 710 being configured to implement the steps of the debug and monitor method for a laser system as described above.

Illustratively, the debug and monitor 710 may be partitioned into one or more modules/units that are stored in the memory 706 and executed by the processor 704 to implement the debug and monitor functions of the present application. One or more of the modules/units may be a series of computer program instruction segments capable of performing particular functions to describe the execution of the debug and monitor program 710 in the debug and monitor device 700.

The debugging and monitoring apparatus 700 for a laser system of the present application can debug and monitor the laser system by performing the debugging and monitoring method for a laser system as described above. Performing first debugging to enable the coordinates of the camera component to finish debugging; then executing second debugging to complete debugging of the coordinates of the vibrating mirror assembly; then executing third debugging to complete the debugging of the focal length of the laser source; then executing fourth debugging to complete the debugging of the exposure parameters of the camera component; before the first debugging is performed, the laser parameters are also selected so that the pattern processed by the laser source has better quality. By executing the first debugging and the second debugging in sequence, the influence on the debugging precision of the camera component caused by deviation of the vibrating mirror component in the debugging process is avoided, and the debugging precision of the camera component is improved; judging whether the first laser parameter exceeds a laser threshold value by acquiring the first laser parameter of the laser source for executing the first processing so as to realize real-time monitoring of a laser system; the laser system can be monitored in real time, the focal lengths of the vibrating mirror assembly and the camera assembly of the laser system can be debugged in real time, defective products formed by processing the laser system can be found in time, the laser system can be debugged on line in time, the production yield of processing the laser system can be improved, and the production cost can be reduced.

Referring to fig. 12, fig. 12 is a functional block diagram of a device 800 for debugging and monitoring a laser system according to some embodiments of the present application. The device 800 can be applied to a laser system to debug and monitor the focal length of a camera component, a galvanometer component and a laser source in the laser system, and also can debug laser parameters and exposure parameters of the camera.

In some embodiments, the debugging and monitoring apparatus 800 may comprise a plurality of functional modules consisting of program code segments. Program code for each program segment in the debugging and monitoring apparatus 800 may be stored in one or more memories 706 and executed by the corresponding at least one processor 704 to implement the debugging and monitoring functions for the laser system.

Referring to fig. 12, in some embodiments, the debugging and monitoring apparatus 800 may be divided into a plurality of functional modules according to the functions performed by the debugging and monitoring apparatus, where each functional module is used to perform each step in the corresponding implementation of fig. 1 to 10, so as to implement the debugging and monitoring functions of the laser system debugging and monitoring apparatus 800. In this embodiment, the functional modules of the debugging and monitoring apparatus 800 include a first debugging module 802, a second debugging module 804, a third debugging module 806, a processing module 808, a first obtaining module 810, a first judging module 812, and a first executing module 814.

The first debug module 802 is configured to perform a first debug to cause the camera assembly to complete the debug.

The second debug module 804 is configured to perform a second debug to complete the debug of the galvanometer assembly.

The third debug module 806 is configured to perform a third debug to complete the debug of the focal length of the laser source.

The processing module 808 is configured to control the laser source to perform a first process.

The first acquisition module 810 is configured to acquire a first laser parameter of a first process.

The first determining module 812 is configured to determine whether the first laser parameter exceeds a laser threshold value, so as to monitor the laser system.

In some embodiments, the first determination module 812 is further configured to determine whether the first laser spot location exceeds a spot location threshold.

The first determining module 812 is further configured to determine whether the focal length position of the first laser exceeds a focal length position threshold.

The first determining module 812 is further configured to determine whether the first power value exceeds a power threshold.

The first execution module 814 is configured to repeatedly execute the second debugging when the first laser spot position exceeds the spot position threshold, so that the galvanometer assembly completes new debugging, and repeatedly execute the third debugging, so that the focal length of the laser source completes new debugging.

The first execution module 814 is further configured to repeatedly execute the third commissioning when it is determined that the first laser focal distance position exceeds the focal distance position threshold, so that the focal distance of the laser source completes a new commissioning.

The first execution module 814 is further configured to repeatedly execute the second debugging when the first laser spot position is determined to exceed the spot position threshold and when the first laser focal distance position is determined to exceed the focal distance position threshold, so that the galvanometer assembly completes new debugging, and repeatedly execute the third debugging, so that the focal distance of the laser source completes new debugging.

The first execution module 814 is further configured to execute an early warning instruction when the first power value exceeds the power threshold.

In some embodiments, the processing module 808 is configured to control the laser source to perform a second process.

The first acquisition module 810 is also configured to acquire a second laser parameter for a second process.

The first determining module 812 is further configured to determine whether the second laser spot position exceeds a spot position threshold.

The first determining module 812 is further configured to determine whether the focal length position of the second laser exceeds a focal length position threshold.

The first determining module 812 is further configured to determine whether the second power value exceeds a power threshold.

The first execution module 814 is further configured to repeatedly execute the second debugging when the second laser spot position is determined to exceed the spot position threshold, so that the galvanometer assembly completes new debugging, and repeatedly execute the third debugging, so that the focal length of the laser source completes new debugging.

The first execution module 814 is further configured to repeatedly execute the third commissioning when the second laser focal distance position is determined to exceed the focal distance position threshold, so that the focal distance of the laser source is completed with a new commissioning.

The first execution module 814 is further configured to repeatedly execute the second debugging when the second laser spot position is determined to exceed the spot position threshold and when the second laser focal distance position is determined to exceed the focal distance position threshold, so that the galvanometer assembly completes new debugging, and repeatedly execute the third debugging, so that the focal distance of the laser source completes new debugging.

The first execution module 814 is further configured to execute the early warning instruction when the second power value exceeds the power threshold.

In some embodiments, the processing module 808 is further configured to control the laser source to perform a third process.

The first acquisition module 810 is also configured to acquire a third laser parameter for a third process.

The first determining module 812 is further configured to determine whether the third laser spot position exceeds a spot position threshold.

The first determining module 812 is further configured to determine whether the focal length position of the third laser exceeds a focal length position threshold.

The first determining module 812 is further configured to determine whether the third power value exceeds a power threshold.

The first execution module 814 is further configured to execute the early warning instruction when at least one of determining that the third laser spot position exceeds the spot position threshold, determining that the third laser focal length position exceeds the focal length position threshold, and determining that the third power value exceeds the power threshold occurs.

In some embodiments, the commissioning and monitoring device 800 further includes a laser parameter selection module 816 and a fourth commissioning module 818.

The laser parameter selection module 816 is configured to perform laser parameter selection to select laser parameters of the laser source.

The fourth debug module 818 is configured to perform a fourth debug to complete the debug of the exposure parameters of the camera assembly.

Referring to fig. 13, in some embodiments, the first debug module 802 may include a first send module 8021, a first form module 8022, a grab module 8023, a first calculate module 8024, a first verify module 8025, and a first end module 8026.

The first sending module 8021 is configured to send a motion parameter to the processing platform.

The first transmitting module 8021 is further configured to transmit a galvanometer marking parameter to the galvanometer assembly.

The first forming module 8022 is configured to control the galvanometer assembly to form a third debug pattern and a fourth debug pattern in a test medium in coordination with the movement of the processing platform, and obtain physical coordinate information of a third feature of the third debug pattern and physical coordinate information of a fourth feature of the fourth debug pattern based on physical coordinate information of the processing platform.

The capturing module 8023 is configured to control the camera assembly to capture the third feature and the fourth feature, and obtain pixel coordinate information of the third feature and pixel coordinate information of the fourth feature.

The first calculating module 8024 is configured to calculate a conversion relationship between the pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature, and the physical coordinate information of the third feature and the physical coordinate information of the fourth feature, so that the coordinate information of the camera component after the pixel coordinate information is converted by the conversion relationship is consistent with the physical coordinate information of the processing platform.

The first verification module 8025 is configured to perform a first verification debugging, and is configured to verify a conversion relationship acquired by the camera assembly.

The first ending module 8026 is configured to end the first debug.

Referring to fig. 14, in some embodiments, the second debugging module 804 may include a second forming module 8041, a second calculating module 8042, a second judging module 8043, a second verifying module 8044, a second ending module 8045, and a first compensating module 8046.

The second forming module 8041 is configured to control the galvanometer assembly to form a fifth debug pattern and a sixth debug pattern on a test medium.

The second calculating module 8042 is configured to control the camera assembly to capture a fifth feature of the fifth debug pattern and a sixth feature of the sixth debug pattern, obtain pixel coordinate information of the fifth feature and pixel coordinate information of the sixth feature, and calculate physical coordinate information of the fifth feature and physical coordinate information of the sixth feature according to the conversion relationship.

The second determining module 8043 is configured to determine whether the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature are consistent with the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature.

If the judgment result of the second judgment module 8043 is no, the first compensation module 8046 is configured to compensate the galvanometer assembly, so that the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature are consistent with the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature.

If the determination result of the second determination module 8043 is yes, the second ending module 8045 is configured to end the second debug.

The second verification module 8044 is configured to perform a second verification debug, and is configured to verify the compensated galvanometer assembly.

Referring to fig. 15, in some embodiments, the third debugging module 806 may include a second sending module 8061, a third forming module 8062, a third judging module 8063, a first determining module 8064, and a third ending module 8065.

The second transmitting module 8061 is configured to transmit the first adjustment parameter to the focal length adjustment assembly.

The third forming module 8062 is configured to control the laser source to cooperate with the movement of the focal length adjustment assembly to form a plurality of first debug patterns on a test medium, where the plurality of first debug patterns are distributed at different test positions of the test medium.

The third determining module 8063 is configured to determine that a first feature of a first debug pattern meets a preset focus threshold.

The first determining module 8064 is configured to determine a second adjustment parameter based on the first characteristic meeting a preset focal length threshold.

The second transmitting module 8061 is further configured to transmit the second adjustment parameter to the focal length adjustment assembly.

The third forming module 8062 is further configured to control the laser source to form a plurality of second debug patterns on the test medium in coordination with the movement of the focal length adjustment assembly, where the plurality of second debug patterns are distributed at different test positions of the test medium.

The third determining module 8063 is further configured to determine that a second feature of a second debug pattern meets a preset focus threshold.

The first determining module 8064 is further configured to determine a focal length of the laser source based on the second characteristic meeting a preset focal length threshold.

The third ending module 8065 is configured to end performing the third debug.

Referring to fig. 16, in some embodiments, the laser parameter selection module 816 may include a second acquisition module 8161, an analysis module 8162, a fourth determination module 8163, a second execution module 8164, and an adjustment module 8165.

The second obtaining module 8161 is configured to obtain laser marking parameters, and control the laser source to perform a first marking on a test medium to form a first marking pattern.

The second obtaining module 8161 is further configured to control the camera assembly to obtain a first marking parameter of the first marking pattern.

The analysis module 8162 is configured to analyze the first marking parameter and the target marking parameter to obtain a first difference value.

The fourth judging module 8163 is configured to judge that the first difference exceeds the parameter threshold.

The second execution module 8164 is configured to execute a parameter adjustment step.

The adjusting module 8165 is configured to adjust laser marking parameters, and control the laser source to perform a second marking on the test medium to form a second marking pattern.

The second obtaining module 8161 is further configured to control the camera assembly to obtain a second marking parameter of a second marking pattern.

The analysis module 8162 is further configured to analyze the second marking parameter and the target marking parameter to obtain a second difference value.

The fourth judging module 8163 is further configured to judge that the second difference exceeds the parameter threshold, and repeat the second marking until the second difference does not exceed the parameter threshold.

Referring to fig. 17, in some embodiments, the fourth debug module 818 may include a third capture module 8181, a second determination module 8182, a capture module 8183, and a second compensation module 8184.

The third obtaining module 8181 is configured to control the camera assembly to perform a first shooting adjustment and obtain a corresponding plurality of seventh adjustment patterns according to a preset first exposure parameter.

The second determining module 8182 is configured to determine that a seventh feature of a seventh debug pattern meets a preset exposure threshold.

The second determining module 8182 is further configured to determine a second exposure parameter based on the seventh feature meeting a preset exposure threshold.

The third obtaining module 8181 is further configured to control the camera assembly to perform a second shooting adjustment and obtain a plurality of corresponding eighth adjustment patterns according to the second exposure parameter.

The second determining module 8182 is further configured to determine that an eighth feature of an eighth debug pattern meets a preset exposure threshold.

The second determining module 8182 is further configured to determine a target exposure parameter based on the eighth feature meeting a preset exposure threshold.

The capture module 8183 is configured to capture target features in a subject based on target exposure parameters.

The second determining module 8182 is further configured to determine whether the target feature is consistent with the preset exposure feature.

If the second determining module 8182 determines that the target feature and the preset exposure feature are negative, the second compensating module 8184 is configured to compensate the camera assembly so as to make the target feature coincide with the preset exposure feature.

A computer-readable storage medium is also provided in some embodiments of the present application. A computer readable storage medium has stored thereon a debugging and monitoring program 710 for a laser system, the debugging and monitoring program 710, when executed by the processor 704, implementing the debugging and monitoring method as described above.

Thus, the debugging and monitoring program 710 in the computer readable storage medium can debug and monitor the laser system by being executed by the processor 704 to implement the debugging and monitoring methods as described above. Performing first debugging to enable the coordinates of the camera component to finish debugging; then executing second debugging to complete debugging of the coordinates of the vibrating mirror assembly; then executing third debugging to complete the debugging of the focal length of the laser source; then executing fourth debugging to complete the debugging of the exposure parameters of the camera component; before the first debugging is performed, the laser parameters are also selected so that the pattern processed by the laser source has better quality. By executing the first debugging and the second debugging in sequence, the influence on the debugging precision of the camera component caused by deviation of the vibrating mirror component in the debugging process is avoided, and the debugging precision of the camera component is improved; judging whether the first laser parameter exceeds a laser threshold value by acquiring the first laser parameter of the laser source for executing the first processing so as to realize real-time monitoring of a laser system; the laser system can be monitored in real time, the focal lengths of the vibrating mirror assembly and the camera assembly of the laser system can be debugged in real time, defective products formed by processing the laser system can be found in time, the laser system can be debugged on line in time, the production yield of processing the laser system can be improved, and the production cost can be reduced.

It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Finally, it should be noted that the above embodiments are merely for illustrating the technical solution of the present application and not for limiting, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A commissioning and monitoring method for a laser system comprising a laser source, a camera assembly, a galvanometer assembly, a processing platform, and a focal length adjustment assembly for adjusting a focal length of the laser source, the commissioning and monitoring method comprising:

Performing a first debug to cause the camera assembly to complete the debug;

ending the execution of the first debug;

after the first debugging is finished, executing a second debugging to enable the vibrating mirror assembly to finish debugging;

ending the execution of the second debug;

after the second debugging is finished, executing a third debugging to complete the debugging of the focal length of the laser source;

the performing a third debug, comprising:

transmitting a first adjustment parameter to the focal length adjustment assembly;

controlling the laser source to form a plurality of first debugging patterns on a test medium in cooperation with the movement of the focal length adjusting assembly, wherein the plurality of first debugging patterns are distributed at different test positions of the test medium;

judging that a first characteristic of the first debugging pattern accords with a preset focal length threshold;

determining a second adjustment parameter based on the first characteristic conforming to the preset focal length threshold;

transmitting the second adjustment parameter to the focal length adjustment assembly;

controlling the laser source to form a plurality of second debugging patterns on the test medium in cooperation with the movement of the focal length adjusting assembly, wherein the second debugging patterns are distributed at different test positions of the test medium;

Judging that a second characteristic of the second debugging pattern accords with the preset focal length threshold;

determining a focal length of the laser source based on the second characteristic conforming to the preset focal length threshold;

ending the execution of the third debug;

after the third debugging is finished, controlling the laser source to execute first processing;

acquiring a first laser parameter of the first processing;

and judging whether the first laser parameter exceeds a laser threshold value so as to realize monitoring of the laser system.

2. The debugging and monitoring method of claim 1, wherein,

the step of performing a first debug includes:

transmitting a motion parameter to the processing platform;

transmitting a galvanometer marking parameter to the galvanometer assembly;

controlling the galvanometer component to form a third debugging pattern and a fourth debugging pattern in a test medium in cooperation with the movement of the processing platform, and obtaining physical coordinate information of a third feature of the third debugging pattern and physical coordinate information of a fourth feature of the fourth debugging pattern based on the physical coordinate information of the processing platform;

controlling the camera component to capture the third feature and the fourth feature, and acquiring pixel coordinate information of the third feature and pixel coordinate information of the fourth feature;

And calculating the conversion relation between the pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature and the physical coordinate information of the third feature and the physical coordinate information of the fourth feature, so that the coordinate information of the camera component after the pixel coordinate information is converted through the conversion relation is consistent with the physical coordinate information of the processing platform.

3. The debugging and monitoring method of claim 2, wherein,

the step of performing the second debug includes:

controlling the galvanometer component to form a fifth debugging pattern and a sixth debugging pattern on a test medium;

controlling the camera component to capture a fifth feature of the fifth debugging pattern and a sixth feature of the sixth debugging pattern, obtaining pixel coordinate information of the fifth feature and pixel coordinate information of the sixth feature, and calculating physical coordinate information of the fifth feature and physical coordinate information of the sixth feature according to the conversion relation;

judging whether the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature are consistent with the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature;

If not, compensating the galvanometer assembly so that the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature are consistent with the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature.

4. The debugging and monitoring method of claim 3, wherein,

the first laser parameters comprise a first laser spot position, a first laser focal length position and a first power value, and the laser threshold comprises a spot position threshold, a focal length position threshold and a power threshold;

the step of judging whether the first laser parameter exceeds a laser threshold value to realize monitoring of the laser system comprises the following steps:

judging whether the first laser spot position exceeds the spot position threshold value;

judging whether the first laser focal length position exceeds the focal length position threshold value;

judging whether the first power value exceeds the power threshold value or not;

when the first laser spot position is judged to exceed the spot position threshold value, repeatedly executing the second debugging to enable the galvanometer assembly to complete new debugging, and repeatedly executing the third debugging to enable the focal length of the laser source to complete new debugging;

When the first laser focal distance position is judged to exceed the focal distance position threshold value, repeating the third debugging so as to complete new debugging of the focal distance of the laser source;

when the first laser spot position is judged to exceed the spot position threshold value and when the first laser focal distance position is judged to exceed the focal distance position threshold value, repeatedly executing the second debugging to enable the galvanometer assembly to complete new debugging, and repeatedly executing the third debugging to enable the focal distance of the laser source to complete new debugging;

and executing an early warning instruction when the first power value exceeds the power threshold.

5. The debugging and monitoring method of claim 4, wherein,

the step of judging whether the first laser parameter exceeds a laser threshold value to realize monitoring of the laser system further comprises:

controlling the laser source to execute second processing;

acquiring a second laser parameter of the second processing, wherein the second laser parameter comprises a second laser spot position, a second laser focal length position and a second power value;

judging whether the second laser spot position exceeds the spot position threshold value;

judging whether the second laser focal length position exceeds the focal length position threshold value;

Judging whether the second power value exceeds the power threshold value;

when the second laser spot position is judged to exceed the spot position threshold value, repeatedly executing the second debugging to enable the galvanometer assembly to complete new debugging, and repeatedly executing the third debugging to enable the focal length of the laser source to complete new debugging;

when judging that the second laser focal distance position exceeds the focal distance position threshold, repeatedly executing the third debugging to enable the focal distance of the laser source to finish new debugging;

when the second laser spot position is judged to exceed the spot position threshold value and when the second laser focal distance position is judged to exceed the focal distance position threshold value, repeatedly executing the second debugging to enable the galvanometer assembly to complete new debugging, and repeatedly executing the third debugging to enable the focal distance of the laser source to complete new debugging;

and executing the early warning instruction when the second power value exceeds the power threshold.

6. The debugging and monitoring method of claim 5, wherein,

Controlling the laser source to execute third processing;

acquiring a third laser parameter of the third processing, wherein the third laser parameter comprises a third laser spot position, a third laser focal length position and a third power value;

judging whether the third laser spot position exceeds the spot position threshold;

judging whether the third laser focal length position exceeds the focal length position threshold value;

judging whether the third power value exceeds the power threshold value;

and executing the early warning instruction when at least one of judging that the third laser spot position exceeds the spot position threshold, judging that the third laser focal distance position exceeds the focal distance position threshold and judging that the third power value exceeds the power threshold occurs.

7. The debugging and monitoring method of claim 3, wherein,

after the step of calculating the conversion relation between the pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature and the physical coordinate information of the third feature and the physical coordinate information of the fourth feature, the step of executing the first debug further includes:

executing first verification debugging for verifying the conversion relation acquired by the camera component;

After the step of compensating the galvanometer assembly to make the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature coincide with the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature, the step of executing the second debug further includes:

and executing second verification and debugging for verifying the compensated galvanometer assembly.

8. The debugging and monitoring method of claim 1, wherein,

the first feature comprises at least one of a line thickness, a firing area, and a firing edge size of the first debug pattern;

the second feature includes at least one of a line thickness, a firing area, and a firing edge size of the second debug pattern.

9. The debugging and monitoring method of claim 1, wherein,

after the third debugging is finished, the debugging and monitoring method further comprises the following steps:

executing fourth debugging to complete debugging of the exposure parameters of the camera assembly;

the performing a fourth debug, comprising:

according to a preset first exposure parameter, controlling the camera component to carry out first shooting debugging and obtaining a plurality of corresponding seventh debugging patterns;

Determining that a seventh feature of the seventh debug pattern meets a preset exposure threshold;

determining a second exposure parameter based on the seventh feature conforming to the preset exposure threshold;

controlling the camera component to carry out second shooting debugging and obtaining a plurality of corresponding eighth debugging patterns according to the second exposure parameters;

determining that an eighth feature of the eighth debug pattern meets the preset exposure threshold;

determining a target exposure parameter based on the eighth feature conforming to the preset exposure threshold;

capturing target characteristics in a photographed object based on the target exposure parameters;

determining whether the target feature is consistent with a preset exposure feature;

if not, compensating the camera component so as to enable the target characteristic to be consistent with the preset exposure characteristic.

10. The debugging and monitoring method of claim 9, wherein,

the first exposure parameter includes a gain value and an exposure value, and the second exposure parameter includes a gain value and an exposure value.

11. The debugging and monitoring method of claim 1, wherein,

before the step of performing the first debugging, the debugging and monitoring method further comprises:

performing laser parameter selection to select laser parameters of the laser source;

The performing laser parameter selection includes:

obtaining laser marking parameters, and controlling the laser source to perform first marking on a test medium to form a first marking pattern;

controlling the camera component to acquire first marking parameters of the first marking pattern;

analyzing the first marking parameter and the target marking parameter to obtain a first difference value;

judging that the first difference value exceeds a parameter threshold;

an execution parameter adjustment step, the execution parameter adjustment step including:

adjusting the laser marking parameters, and controlling the laser source to perform second marking on the test medium to form a second marking pattern;

controlling the camera component to acquire second marking parameters of the second marking pattern;

analyzing the second marking parameters and the target marking parameters to obtain a second difference value;

if the second difference value exceeds the parameter threshold value, repeating the second marking until the second difference value does not exceed the parameter threshold value;

the laser marking parameters include at least one of marking speed, marking power, and filling pitch.

12. A tuning and monitoring device for a laser system, the laser system comprising a laser source, a camera assembly, a galvanometer assembly, a processing platform, and a focal length adjustment assembly for adjusting a focal length of the laser source, the tuning and monitoring device comprising:

The first debugging module is used for executing first debugging so as to enable the camera assembly to complete debugging;

the second debugging module is used for executing second debugging so as to enable the vibrating mirror assembly to complete debugging;

the third debugging module is used for executing third debugging so as to complete the debugging of the focal length of the laser source;

the processing module is used for controlling the laser source to execute first processing;

the first acquisition module is used for acquiring the first laser parameters of the first processing;

and the first judging module is used for judging whether the first laser parameter exceeds a laser threshold value so as to realize the monitoring of the laser system.

13. The debugging and monitoring apparatus of claim 12,

the debugging and monitoring device further comprises:

and the fourth debugging module is used for executing fourth debugging so as to complete the debugging of the exposure parameters of the camera component.

14. The debugging and monitoring apparatus of claim 12,

the debugging and monitoring device further comprises:

and the laser parameter selection module is used for executing laser parameter selection so as to select the laser parameters of the laser source.

15. A commissioning and monitoring device for a laser system, comprising:

a processor, a memory and a debugging and monitoring program for the laser system stored on the memory and executable on the processor, the debugging and monitoring program being configured to implement the steps of the debugging and monitoring method of any of claims 1-11.

16. A computer readable storage medium having stored thereon a debugging and monitoring program for a laser system, which when executed by a processor implements the debugging and monitoring method of any of claims 1-11.